JP2012151384A - Injection device, pattern formation device, injection method, and pattern formation method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a pattern formation technique by which a pattern can be formed on a substrate by injecting a high-viscosity material.SOLUTION: The method comprises the steps of: stacking, on a surface of a transparent base material 41, a pressure generating member 42 which generates a pressure when heated; gluing a nozzle plate 45 having injection holes 46 provided therein to the pressure generating member from above; charging a metal paste 43 which is a material to be injected into the injection holes 46; and heating a portion of the pressure generating member 42 partially corresponding to the injection holes 46 by switching ON and OFF of laser irradiation while moving a laser irradiation part 60 relatively to a substrate W. The portion of the pressure generating member 42 heated by laser irradiation produces a pressure wave owing to a rapid cubical expansion resulting from the sublimation of camphor. The metal paste 43 charged in the injection holes 46 is injected toward the substrate W by means of the pressure thus produced, and thus a pattern of the metal paste 43 is formed on a surface of the substrate W.

Description

  The present invention relates to an injection apparatus and method for injecting a material to be injected toward an object, and a pattern forming apparatus and method for forming a pattern on a substrate by the injected material to be injected.

  Conventionally, as a method of forming metal wiring (electrical wiring) on a substrate such as a semiconductor wafer or a glass substrate for a flat panel display (FPD), a pattern is formed by forming a photoresist film (photosensitive resin film) on the substrate. A so-called photolithography technique has been widely used in which exposure and development processes are performed and a metal layer serving as a wiring material such as copper is formed in that state (for example, Patent Document 1).

  Further, in recent years, development of metal wiring formation using an ink jet technique in which a predetermined wiring pattern is formed by discharging droplets containing metal from an ink jet nozzle has been promoted (for example, Patent Document 2).

JP 2001-135168 A JP-A-2005-93702

  However, when metal wiring is formed using photolithography technology, it takes a long time for processing because it requires many steps such as photoresist coating, exposure, development, etching, and metal layer deposition. It becomes. In addition, since these processes are performed by dedicated processing units, a large number of processing units are required, which increases the cost required for wiring formation.

  On the other hand, when metal wiring is formed using an ink jet technique, a droplet containing metal has a low viscosity (usually 0.01 Pa · s (Pascal second) or less), so that it wets and spreads on the substrate after landing. As a result, it was difficult to form a fine wiring pattern. In order to solve this problem, a method of performing hydrophilic treatment (or water repellency treatment) along the circuit pattern on the substrate to suppress the wetting and spreading of the droplets can be considered. Therefore, it has not been put into practical use.

  For this reason, Patent Document 2 discloses a technique in which a region where liquid droplets are to be deposited is surrounded by a convex bank, and droplets containing metal are ejected from the inkjet nozzles to the enclosed region to prevent wetting and spreading. Has been proposed. However, even if such a technique is adopted, the same problem as described above arises because the photolithography technique is used for the formation of the bank.

  In addition, since highly viscous liquid droplets cannot be ejected from the ink jet nozzle, multiple coatings are required particularly when a thick electric wiring is formed, and the processing time is further increased.

  In order to solve these problems, if a higher viscosity material (for example, metal paste) can be discharged directly, thick wiring can be achieved while suppressing wetting and spreading. Did not exist.

  The present invention has been made in view of the above problems, and an injection apparatus and method capable of injecting a high-viscosity material as an injection target toward an object, and a substrate by injecting a high-viscosity material An object of the present invention is to provide a pattern forming apparatus and method capable of forming a pattern thereon.

  In order to solve the above-mentioned problems, an invention according to claim 1 is directed to an injection device comprising: a supporting means for supporting a base material having a pressure generating member that generates pressure when heated; An injection plate having a plurality of injection holes, which are provided in contact with each other and loaded with an injection target material, and the pressure generating member are heated to generate pressure due to volume expansion in the pressure generating member. Heating means for injecting the material to be injected loaded into the injection hole toward an object disposed opposite to the injection plate.

  In the invention of claim 2, the injection device is provided in contact with the support means for supporting the base material and the surface of the base material, and the inside is heated in the order from the base material in order to reduce the pressure. An injection plate having a plurality of injection holes loaded with a pressure generating member and a material to be injected, and heating the pressure generating member, thereby generating pressure due to volume expansion in the pressure generating member. And heating means for injecting the material to be injected loaded in the injection hole toward an object disposed opposite to the injection plate.

  According to a third aspect of the present invention, in the injection apparatus according to the first or second aspect of the present invention, the plurality of injection holes are provided in a lattice shape on the injection plate.

  According to a fourth aspect of the present invention, in the injection apparatus according to the third aspect of the invention, the heating means heats a pressure generating member corresponding to a part of the plurality of injection holes.

  Further, the invention of claim 5 is provided in the injection device, in contact with the pressure generating member, supporting means for supporting a base material on which a pressure generating member that generates pressure when heated is laminated, An injection plate having a pattern hole of a predetermined shape loaded with a material to be injected therein and the pressure generating member are heated, thereby generating pressure due to volume expansion in the pressure generating member and being loaded into the pattern hole. Heating means for injecting the injected material toward an object disposed opposite to the injection plate.

  In the invention of claim 6, the injection device is provided in contact with the support means for supporting the base material and the surface of the base material, and the inside is heated in the order from the base material in order to reduce the pressure. An injection plate having a pattern hole of a predetermined shape loaded with a generated pressure generating member and a material to be injected, and heating the pressure generating member, thereby generating pressure due to volume expansion in the pressure generating member. And heating means for injecting the material to be injected loaded in the hole toward the target object arranged opposite to the injection plate.

  According to a seventh aspect of the present invention, in the injection apparatus according to any one of the first to sixth aspects, a gap is provided between the material to be injected and the pressure generating member.

  The invention according to claim 8 is the injection apparatus according to any one of claims 1 to 7, wherein the heating means heats the pressure generating member by irradiating light from the back surface of the substrate. Including a light irradiating means, wherein the substrate is transparent to the light irradiated from the light irradiating means.

  According to a ninth aspect of the present invention, in the injection apparatus according to the eighth aspect of the invention, the pressure generating member heats the pressure generating member by absorbing light emitted from the light irradiating means and generating heat. A light absorbing material is included.

  According to a tenth aspect of the present invention, in the injection apparatus according to any one of the first to seventh aspects, the heating means includes a heater for heating the pressure generating member.

  The invention according to claim 11 is the injection apparatus according to any one of claims 1 to 7, wherein the heating means includes an energization heating means for energizing the pressure generating member to generate heat. And

  According to a twelfth aspect of the present invention, in the injection apparatus according to any one of the first to eleventh aspects, the pressure generating member includes a camphor that causes volume expansion by sublimation when heated. And

  The invention of claim 13 is the injection apparatus according to any one of claims 1 to 12, wherein the material to be injected is a high-viscosity material having a viscosity of 0.1 Pa · s to 1000 Pa · s. It is characterized by including.

  According to a fourteenth aspect of the present invention, a pattern forming apparatus includes: the injection apparatus according to any one of the first to thirteenth aspects of the present invention; and a substrate holding unit that holds the substrate at a position facing the injection plate. And a pattern is formed on the substrate by the injection material injected from the injection device.

  In the invention of claim 15, a pressure generating member that generates pressure by being heated on the surface of the base material is laminated in the injection method, and an injection plate having a plurality of injection holes is brought into contact with the pressure generating member. A contacting step, a loading step of loading the material to be injected into the plurality of injection holes of the injection plate, and heating the pressure generating member to generate a pressure due to volume expansion in the pressure generating member. And a heating step of injecting the material to be injected loaded in the plurality of injection holes toward the object disposed opposite to the injection plate.

  According to a sixteenth aspect of the present invention, in the injection method, a first loading step of loading a pressure generating member that generates pressure when heated into a plurality of injection holes provided in the injection plate; and the pressure generating member A contact step of bringing a base material into contact with the injection plate loaded with a second loading step of loading a material to be injected from a side opposite to the base material into the plurality of injection holes of the injection plate; By heating the pressure generating member, a pressure due to volume expansion is generated in the pressure generating member, and an injection material loaded in the plurality of injection holes is injected toward an object disposed opposite to the injection plate. And a heating step.

  According to a seventeenth aspect of the present invention, in the injection method according to the fifteenth or sixteenth aspect of the present invention, the plurality of injection holes are provided in a lattice shape on the injection plate.

  According to an eighteenth aspect of the present invention, in the injection method according to the seventeenth aspect of the present invention, in the heating step, a pressure generating member corresponding to a part of the plurality of injection holes is heated.

  In the invention of claim 19, a pressure generating member that generates pressure when heated on the surface of the base material is laminated to the injection method, and an injection plate having a pattern hole of a predetermined shape is applied to the pressure generating member. A contact step for contacting, a loading step for loading an injection material into the pattern hole of the injection plate, and heating the pressure generating member to generate pressure due to volume expansion in the pressure generating member. And a heating step of injecting the material to be injected loaded in the hole toward an object disposed opposite to the injection plate.

  According to a twentieth aspect of the present invention, in the injection method, a first loading step of loading a pressure generating member that generates pressure when heated into a pattern hole of a predetermined shape provided in the injection plate, and the pressure generation A contact step of bringing a base material into contact with the injection plate loaded with a member; a second loading step of loading an injection material into the pattern hole of the injection plate from the side opposite to the base material; A heating step of causing the pressure generating member to generate a pressure due to volume expansion and injecting an injection target material loaded in the pattern hole toward an object disposed opposite to the injection plate by heating the pressure generating member. And.

  According to a twenty-first aspect of the present invention, in the injection method according to any of the fifteenth to twentieth aspects, a gap is provided between the material to be injected and the pressure generating member.

  The invention according to claim 22 is the injection method according to any one of claims 15 to 21, wherein the heating step irradiates light from the back surface of the base material to heat the pressure generating member. Including a step, wherein the substrate is transparent to the light.

  The invention according to claim 23 is the injection method according to the invention according to claim 22, wherein the pressure generating member absorbs the light irradiated from the back surface of the base material and generates heat to thereby generate the pressure generating member. It includes a light absorbing material to be heated.

  According to a twenty-fourth aspect of the present invention, in the injection method according to any of the fifteenth to twenty-third aspects, the pressure generating member includes a camphor that causes volume expansion by sublimation when heated. And

  The invention of claim 25 is the injection method according to any one of claims 15 to 24, wherein the material to be injected is a high-viscosity material having a viscosity of 0.1 Pa · s to 1000 Pa · s. It is characterized by including.

  According to a twenty-sixth aspect of the present invention, a pattern forming method includes the injection method according to any one of the fifteenth to twenty-fifth aspects of the present invention, and a substrate placement step of placing a substrate at a position facing the injection plate. And a pattern is formed on the substrate by the injection material injected from the injection plate.

  According to the first to thirteenth aspects of the present invention, by heating the pressure generating member, the pressure generating member is caused to generate a pressure due to volume expansion, and the injection target material loaded in the plurality of injection holes or pattern holes is provided. Since the injection is performed toward the target object arranged opposite to the injection plate, the target material can be injected toward the target object even if it is a highly viscous material.

  In particular, according to the invention of claim 7, since the gap is provided between the material to be injected and the pressure generating member, it is possible to prevent the pressure generating member from adhering to the injected material to be a contamination source. it can.

  According to the invention of claim 14, by heating the pressure generating member, a pressure due to volume expansion is generated in the pressure generating member so that the injection target material loaded in the plurality of injection holes or pattern holes faces the injection plate. In order to inject toward the target object, a high-viscosity material can be injected to form a pattern on the substrate.

  According to the fifteenth to twenty-fifth aspects of the present invention, the pressure generating member is heated to generate a pressure due to volume expansion in the pressure generating member, and the injection target material loaded in the plurality of injection holes or pattern holes is provided. Since the injection is performed toward the target object arranged opposite to the injection plate, the target material can be injected toward the target object even if it is a highly viscous material.

  In particular, according to the invention of claim 21, since the gap is provided between the material to be injected and the pressure generating member, it is possible to prevent the pressure generating member from adhering to the injected material to be a contamination source. it can.

  According to the invention of claim 26, by heating the pressure generating member, a pressure due to volume expansion is generated in the pressure generating member so that the injection target material loaded in the plurality of injection holes or pattern holes faces the injection plate. In order to inject toward the target object, a high-viscosity material can be injected to form a pattern on the substrate.

It is a perspective view which shows schematic structure of the pattern formation apparatus which concerns on this invention. It is a front view of the pattern formation apparatus of FIG. It is the top view which looked at the layered product of a 1st embodiment from the upper surface. It is sectional drawing which shows the AA cut surface of the laminated body of FIG. It is a block diagram which shows the structure of a control part. It is a flowchart which shows the process sequence of the pattern formation in 1st Embodiment. It is a figure explaining the formation procedure of the laminated body of 1st Embodiment. It is a figure explaining the formation procedure of the laminated body of 1st Embodiment. It is a figure explaining a mode that a pressure generating member is heated and an injection target material is injected. It is sectional drawing of the laminated body of 2nd Embodiment. It is a flowchart which shows the process sequence of the pattern formation in 2nd Embodiment. It is a figure explaining the formation procedure of the laminated body of 2nd Embodiment. It is a figure explaining the formation procedure of the laminated body of 2nd Embodiment. It is a figure explaining a mode that a to-be-injected material is inject | emitted in 2nd Embodiment. It is a perspective view which shows schematic structure of the pattern formation apparatus of 3rd Embodiment. It is a front view of the pattern formation apparatus of 3rd Embodiment. It is the top view which looked at the laminated body of 3rd Embodiment from the upper surface. It is sectional drawing which shows the structure of the laminated body of 5th Embodiment. It is a figure which shows typically the structure of the laminated body of 6th Embodiment. It is a figure which shows the other example of the heating means of a pressure generation member.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

<First Embodiment>
FIG. 1 is a perspective view showing a schematic configuration of a pattern forming apparatus 1 according to the present invention. FIG. 2 is a front view of the pattern forming apparatus 1 of FIG. In addition, in FIG. 1 and each subsequent figure, in order to clarify those directional relationships, an XYZ orthogonal coordinate system in which the Z direction is the vertical direction and the XY plane is the horizontal plane is appropriately attached. Further, in FIG. 1 and the subsequent drawings, the dimensions and numbers of the respective parts are exaggerated or simplified as necessary for easy understanding.

  The pattern forming apparatus 1 is an apparatus for forming a metal wiring pattern on a substrate W by injecting a highly viscous metal paste toward the substrate W. The pattern forming apparatus 1 includes a stage 10 that holds a substrate W, a stage moving mechanism 20 that moves the stage 10 along the X direction, and an injection device 5 that injects a metal paste toward the substrate W held on the stage 10. And comprising. The injection device 5 includes a support transport mechanism 50 that transports while supporting a laminate S formed by laminating a pressure generating member on the surface of a base material and further adhering a nozzle plate thereon, and a laser on the pressure generating member. And a laser beam irradiation unit 60 that heats by irradiation with light. Further, the pattern forming apparatus 1 includes a control unit 3 that controls each of the above-described units including the injection device 5 to execute a pattern forming process.

  The stage 10 is provided above the injection device 5 and holds the substrate W on the lower surface thereof. The injection device 5 injects a metal paste toward the substrate W held on the lower surface of the stage 10. As a mechanism for holding the substrate W on the lower surface of the stage 10, for example, a clamp mechanism that mechanically holds an edge portion of the substrate W or an adsorption mechanism that vacuum-sucks the back surface of the substrate W (both not shown) is provided on the stage 10. It should be prepared.

  In the pattern forming apparatus 1 of the first embodiment, the substrate W to be subjected to pattern formation is a semiconductor wafer, a glass substrate for a flat panel display including a liquid crystal display device (LCD) or a plasma display device (PDP), a resin or Various known substrates that are the targets for forming electrical wiring, such as ceramic printed boards, can be used. The shape of the substrate W is not particularly limited, and may be circular like a semiconductor wafer or rectangular like a glass substrate. The substrate W is held on the lower surface of the stage 10 with the surface facing downward. In this specification, the surface of the substrate W is a surface on which pattern formation is performed, and the back surface is a surface on the opposite side.

  The stage moving mechanism 20 is configured by attaching a motor 22, a ball screw 23 and a guide shaft 24 to the lower side of a fixed base 21. The ball screw 23 and the guide shaft 24 are extended along the X direction. The ball screw 23 is connected to the rotation shaft of the motor 22 and is rotated by the motor 22. The slide block 12 fixed to the upper side of the stage 10 is screwed to the ball screw 23 and is slidably fitted to the guide shaft 24. When the motor 22 rotates the ball screw 23, the stage 10 is guided along the guide shaft 24 together with the slide block 12 screwed to the ball screw 23, and moves smoothly along the X direction.

  The injection device 5 is provided below the stage 10 and injects a metal paste upward. The injection device 5 includes a support conveyance mechanism 50 and a laser beam irradiation unit 60. The support conveyance mechanism 50 includes a main driving roller 51 and a driven roller 52. The main driving roller 51 and the driven roller 52 are provided in parallel with each other at a predetermined interval so that the rotation axis is along the Y direction. The maximum height positions of the peripheral surfaces of the main driving roller 51 and the driven roller 52 are the same. A driving motor (not shown) is connected to at least the main driving roller 51 of the two rollers. The driving motor 51 causes the main driving roller 51 to rotate clockwise about the rotation axis along the Y direction as viewed from the upper surface of the paper surface of FIG. One driven roller 52 is rotatable about a rotation axis along the Y direction. The driven roller 52 may be provided with a separate driving motor, or the driven roller 52 may be rotated in conjunction with the main driving roller 51 by a link mechanism or the like.

  A sheet-like laminate S is stretched between the two rollers 51 and 52. FIG. 3 is a plan view of the stacked body S according to the first embodiment as viewed from above. FIG. 4 is a cross-sectional view showing an AA cut surface of the laminate S of FIG. The laminated body S of the first embodiment forms a layer of the pressure generating member 42 that generates pressure by being heated on the surface of the transparent base material 41, and a plurality of injections are formed on the layer of the pressure generating member 42. The nozzle plate 45 having the holes 46 formed therein is in contact therewith. A metal paste 43 is loaded in each of the plurality of injection holes 46. As the base material 41, a resin film that is flexible and transparent to the laser light emitted from the laser light irradiation unit 60 is used. For example, a polyimide film can be used.

Further, the pressure generating member 42 includes a sublimable material that undergoes volume expansion by sublimation when heated, and as such a sublimable material, for example, camphor (camphor: C ₁₀ H ₁₆ O) is used. be able to. The camphor has a sublimation property that undergoes a phase transition from a solid to a gas without passing through a liquid. When heated, the camphor quickly vaporizes and expands in volume by 600 to 1000 times. The pressure generating member 42 includes glycerin (C ₃ H ₅ (OH) ₃ ) and carbon powder in addition to camphor as a sublimable material. The thickness of the layer of the pressure generating member 42 formed on the surface of the base material 41 is not particularly limited, but is about 10 μm in this embodiment.

  The nozzle plate 45 is an injection plate in which a plurality of injection holes 46 are formed in a sheet-like member configured using a resin film (in this embodiment, a polyimide film similar to the base material 41). A plurality of injection holes 46 are formed in a lattice shape (more precisely, a square lattice shape) in a sheet-like polyimide film, thereby forming a nozzle plate 45. In the first embodiment, the shape of the injection holes 46 is a circle having a hole diameter of 50 μm, and the interval (arrangement pitch) between the adjacent injection holes 46 is 100 μm. Further, the thickness of the nozzle plate 45 is set to several tens of μm. Note that the shape, size, and arrangement interval of the injection holes 46 of the first embodiment are merely examples, and these are not particularly limited, and may be appropriately set according to the accuracy (resolution) required for pattern formation. Can be. If the interval between the plurality of injection holes 46 is shortened and the arrangement density is increased, a highly accurate pattern can be formed. Conversely, if the interval between the holes is increased and the arrangement density is lowered, the pattern formation accuracy is not lowered. I do not get.

  Such a nozzle plate 45 is bonded onto the layer of the pressure generating member 42, and the metal paste 43 is loaded into the plurality of injection holes 46 of the nozzle plate 45. The metal paste 43 is a high-viscosity material in which metal particles as a main component are pasted with an organic solvent or the like. A metal paste 43 containing appropriate metal particles can be selected according to the type of metal wiring to be formed on the substrate W. For example, when a copper wiring is formed on the substrate W, a copper paste can be used, and when an aluminum wiring is formed, an aluminum paste can be used. The viscosity of the metal paste 43 as a high-viscosity material is 0.1 Pa · s (Pascal second) or more and 1000 Pa · s or less.

  The thickness of the metal paste 43 loaded in the injection hole 46 is about 10 μm, and a gap 47 is formed between the loaded metal paste 43 and the pressure generating member 42. That is, the nozzle plate 45 is bonded onto the layer of the pressure generating member 42, and the lower end opening of the injection hole 46 is closed by the pressure generating member 42. On the other hand, the metal paste 43 is not loaded at the lower end of the injection hole 46, and a gap 47 is formed between the metal paste 43 and the pressure generating member 42. For this reason, in the laminated body S, the metal paste 43 and the pressure generation member 42 are non-contact.

  As shown in FIG. 4, the laminate S includes a pressure generating member 42 between a base material 41 formed of a polyimide film having flexibility and a nozzle plate 45 formed of a polyimide film. Is sandwiched between layers so that it can be freely deformed. For this reason, the laminated body S spanned between the two rollers 51 and 52 is deformed along the cylindrical surface of each roller. When the main driving roller 51 rotates in a state where the laminate S is stretched, a weak tension acts on the laminate S between the rollers 51 and 52, and the laminate S is stretched along the XY plane (horizontal plane). It becomes a state. Further, when the main driving roller 51 rotates, the laminated body S moves and deforms with it, and the driven roller 52 also rotates. Specifically, the laminated body S on the upstream side of the driven roller 52 is raised, the laminated body S on the downstream side of the main driving roller 51 is lowered, and the laminated body S between the rollers 51 and 52 is along the X direction. Move.

  The substrate W is held by the stage 10 immediately above the stacked body S stretched along the horizontal plane between the rollers 51 and 52, that is, at a position facing the nozzle plate 45 of the stretched stacked body S. The pattern forming apparatus 1 is configured such that the distance between the stacked body S stretched between the rollers 51 and 52 and the surface of the substrate W held on the stage 10 is several hundred μm.

  Returning to FIGS. 1 and 2, a laser beam irradiation unit 60 is provided below the stacked body S stretched along the horizontal plane between the rollers 51 and 52. The laser light irradiation unit 60 includes a laser light source 61. In addition, an emission hole 62 is formed on the upper surface of the laser beam irradiation unit 60. The laser light output from the laser light source 61 is emitted upward (in the (+ Z) direction) from the emission hole 62 in the vertical direction.

  The laser beam irradiation unit 60 is reciprocated along the Y direction by the laser beam scanning mechanism 65. The laser beam scanning mechanism 65 includes a motor 68, a ball screw 66, and a guide shaft 67. The ball screw 66 and the guide shaft 67 are extended along the Y direction. The ball screw 66 is connected to the rotation shaft of the motor 68 and is rotated by the motor 68. The laser beam irradiation unit 60 is screwed to the ball screw 66 and is slidably fitted to the guide shaft 67. For this reason, when the motor 68 rotates the ball screw 66, the laser light irradiation unit 60 screwed to the motor is guided by the guide shaft 67 and moves smoothly along the Y direction.

  The laser beam irradiation unit 60 is provided below the laminate S between the rollers 51 and 52, and the laser light emitted upward from the laser beam irradiation unit 60 is applied to the laminate S from the back surface of the base material 41. Irradiated. Since the substrate 41 is transparent, the irradiated laser light passes through the substrate 41 and is absorbed by the pressure generating member 42. As a result, the pressure generating member 42 is heated by the laser light irradiation from the laser light irradiation unit 60.

  The control unit 3 controls the various operation mechanisms provided in the pattern forming apparatus 1. FIG. 5 is a block diagram illustrating a configuration of the control unit 3. The configuration of the control unit 3 as hardware is the same as that of a general computer. That is, the control unit 3 stores a CPU 31 that performs various arithmetic processes, a ROM 32 that is a read-only memory that stores basic programs, a RAM 33 that is a readable and writable memory that stores various information, and control programs and data. The magnetic disk 34 to be placed is connected to a bus line 39.

  The bus line 39 includes a stage moving mechanism 20 that moves the substrate W held on the stage 10 along the X direction, a support transport mechanism 50 that moves the substrate S along the X direction while supporting the stacked body S, and a laser beam. A laser beam scanning mechanism 65 that scans the irradiation unit 60 along the Y direction, a laser beam irradiation unit 60 that irradiates and heats the pressure generating member 42 of the stacked body S, and the like are electrically connected. . The CPU 31 of the control unit 3 executes a control program stored on the magnetic disk 34 to control each of these operation mechanisms to form a metal wiring having a predetermined pattern on the substrate W.

  Further, the display unit 35 and the input unit 36 are electrically connected to the bus line 39. The display unit 35 is configured by using, for example, a liquid crystal display and displays various information such as processing results and recipe contents. The input unit 36 is configured using, for example, a keyboard, a mouse, and the like, and receives input of commands, parameters, and the like. The operator of the apparatus can input commands and parameters from the input unit 36 while confirming the contents displayed on the display unit 35. The display unit 35 and the input unit 36 may be integrated to form a touch panel.

  The pattern forming apparatus 1 includes a position sensor for detecting the positions of the substrate W, the stacked body S, and the laser beam irradiation unit 60 (all of which are not shown), in addition to the above-described main configuration. As the position sensor, an optical sensor that directly detects the position of the substrate W or the like, an encoder that detects from the rotation amount of the motor, or the like can be used. Further, the pattern forming apparatus 1 includes a feed mechanism that sends out the unprocessed stacked body S and a recovery mechanism that recovers the used stacked body S. Further, the pattern forming apparatus 1 may be provided with a mechanism for adjusting the ambient atmosphere around the substrate W and the stacked body S.

  Next, a processing procedure for forming a metal wiring pattern on the substrate W will be described. FIG. 6 is a flowchart showing a pattern forming processing procedure. Prior to the processing in the pattern forming apparatus 1, the stacked body S is formed (steps S11 to S13). First, the procedure for forming the laminate S will be described with reference to FIGS.

  In step S11, a long sheet-like (band-like) base material 41 as shown in FIG. 7A is prepared, and a pressure generating member 42 is laminated on the surface. In the first embodiment, a polyimide film is used as the base material 41. The layer of the pressure generating member 42 is formed with a uniform thickness on the entire surface of the substrate 41 formed by processing a transparent polyimide film into a long sheet. The pressure generating member 42 before being formed as a layer is a slurry formed by mixing camphor and carbon powder, which are sublimable materials, with glycerin, and can be applied to the surface of the substrate 41 by a coating method. Is possible.

  As such a coating method, various known methods can be used. In the first embodiment, the pressure generating member 42 is applied to the surface of the substrate 41 by a doctor blade method as shown in FIG. It is applied. In the doctor blade method, the slurry of the pressure generating member 42 is supplied to the surface of the base material 41 from the nozzle 71 and the slurry is leveled by the doctor blade 72 to form a layer of the pressure generating member 42 having a uniform thickness. It is the coating method to form. That is, the nozzle 71 that continuously discharges the slurry of the pressure generating member 42 is moved relative to the base material 41 in the direction of the arrow AR7. As the nozzle 71, for example, a slit nozzle having a slit-like discharge port extending along the width direction of the base material 41 may be used.

  A doctor blade 72 is attached to the nozzle 71. The doctor blade 72 is attached to the rear end side of the discharge port in the traveling direction of the nozzle 71 (direction of the arrow AR7). The doctor blade 72 is attached to the nozzle 71 so that the lower end thereof is accurately spaced from the surface of the base material 41 by a predetermined distance. The doctor blade 72 moves the upper end of the base material 41 along the direction of the arrow AR7 while the lower end of the doctor blade 72 is in contact with the slurry of the pressure generating member 42, so that the upper surface of the slurry is flattened and the thickness thereof is uniform. It is said.

  After the slurry of the pressure generating member 42 is uniformly applied to the surface of the base material 41, a drying process is performed, so that a thickness of about 10 μm is formed on the entire surface of the base material 41 as shown in FIG. The layer of the pressure generating member 42 is formed with a uniform thickness. In addition, as a coating method for laminating the pressure generating member 42 on the surface of the base material 41, any coating method can be used as long as it can be applied to the surface of the base material 41 with a uniform thickness. In addition to the doctor blade method, A bar coat method or the like may be used.

  Next, as shown in FIG. 8A, a nozzle plate 45 having a plurality of injection holes 46 is bonded onto the layer of the pressure generating member 42 formed on the surface of the substrate 41 (see FIG. 8A). Step S12). As an adhesive for this purpose, for example, a synthetic rubber adhesive may be used. The plurality of injection holes 46 of the nozzle plate 45 may be formed in a lattice shape by irradiating an excimer laser on a polyimide film, for example. As shown in FIG. 8B, the nozzle plate 45 is bonded so that the layer of the pressure generating member 42 is sandwiched between the nozzle plate 45 having the plurality of injection holes 46 and the base material 41. The laminated body S thus formed is formed.

  And as shown in FIG.8 (c), the metal paste 43 as a to-be-injected material is loaded into the some injection hole 46 of the nozzle plate 45 (step S13). The metal paste 43 is a high-viscosity material containing metal particles, and can be loaded into the plurality of injection holes 46 by a coating method in the same manner as the pressure generating member 42 described above. As a coating method for loading the metal paste 43 into the injection hole 46, various known methods can be used. In the first embodiment, a doctor blade method is used. That is, the nozzle 71 that continuously discharges the metal paste 43 is moved relative to the nozzle plate 45 in the direction of the arrow AR8. The doctor blade 72 is attached to the nozzle 71 so that the lower end thereof is in contact with the upper surface of the nozzle plate 45. While supplying the metal paste 43 from the nozzle 71, the doctor blade 72 moves relatively along the direction of the arrow AR8 while bringing its lower end into contact with the upper surface of the nozzle plate 45, whereby the metal paste 43 is placed in the plurality of injection holes 46. While being pushed in, the metal paste 43 is scraped off by the doctor blade 72 in a region other than the injection hole 46. In this way, the metal paste 43 is loaded into the plurality of injection holes 46 of the nozzle plate 45. It should be noted that the metal paste 43 may remain slightly in a region other than the injection hole 46 on the upper surface of the nozzle plate 45.

  By the way, when the metal paste 43 is loaded into the injection hole 46, the lower opening of the injection hole 46 is closed by the pressure generating member 42. For this reason, when the highly viscous metal paste 43 is pushed in from the upper opening of the injection hole 46, the air remaining in the injection hole 46 is confined between the metal paste 43 and the pressure generating member 42 as it is. It becomes. As a result, the metal paste 43 does not enter the bottom of the injection hole 46 due to residual air, and a gap 47 is formed between the loaded metal paste 43 and the pressure generating member 42.

  The laminated body S formed in this way is bridged over the main driving roller 51 and the driven roller 52 (step S14). The laminated body S is set so that the nozzle plate 45 faces upward between the rollers 51 and 52. Therefore, between the rollers 51 and 52, the forming direction of the plurality of injection holes 46 faces the vertical direction.

  Subsequently, the substrate W to be processed is held on the lower surface of the stage 10 (step S15). The substrate W is held on the stage 10 at a position facing the nozzle plate 45 of the stacked body S between the rollers 51 and 52 with the surface on which pattern formation is performed facing downward. That is, the substrate W is disposed above the stacked body S so as to face the stacked body S.

  Then, the stage moving mechanism 20 and the laser beam scanning mechanism 65 are respectively controlled by the control unit 3 so that the relative positional relationship between the substrate W and the laser beam irradiation unit 60 becomes the initial position for pattern formation. The light irradiation unit 60 is moved. Specifically, the X-direction adjustment of the relative positional relationship is performed by the stage moving mechanism 20 moving the substrate W, and the Y-direction adjustment is performed by the laser light scanning mechanism 65 moving the laser light irradiation unit 60. Done. Further, the stacked body S is also moved to the initial position by the support conveyance mechanism 50. In addition, the space | interval of the laminated body S between both the rollers 51 and 52 and the surface of the board | substrate W shall be several 100 micrometers.

  After the initial arrangement of the substrate W, the laser beam irradiation unit 60, and the stacked body S is completed, the control unit 3 starts controlling the laser beam irradiation by the laser beam irradiation unit 60 (step S16). At the same time, the control unit 3 starts relative movement of the laser beam irradiation unit 60 (step S17). Specifically, the control unit 3 controls the laser beam scanning mechanism 65 to scan the laser beam irradiation unit 60 in the Y direction while stopping the substrate W and the stacked body S.

  Data on the pattern of the metal wiring to be formed on the substrate W is stored in advance in the storage unit (RAM 33 or magnetic disk 34) of the control unit 3. The control unit 3 performs on / off control of the laser light source 61 while scanning the laser light irradiation unit 60 in the Y direction according to the stored pattern data. That is, when the laser beam irradiation unit 60 is scanning along the Y direction at a predetermined X direction position on the substrate W, the control is performed when the laser beam irradiation unit 60 reaches the Y direction position to be patterned. The unit 3 emits laser light from the laser light source 61. Note that the pattern data is created so that the laser light source 61 is turned on when the laser light irradiation unit 60 is located immediately below the injection hole 46 of the nozzle plate 45. Therefore, when the laser beam irradiation unit 60 reaches just below the region where the injection hole 46 of the nozzle plate 45 does not exist, the laser beam irradiation from the laser light source 61 is stopped.

  Laser light emitted upward from the laser light source 61 of the laser light irradiation unit 60 in the vertical direction is incident from the back side of the laminate S. Since the base material 41 constituting the lowermost layer of the laminate S is transparent, the laser light emitted from the laser light irradiation unit 60 passes through the base material 41 and reaches the pressure generating member 42 and is absorbed. As a result, a rapid temperature rise occurs in the region of the pressure generating member 42 that has been irradiated with the laser beam. That is, the laser beam irradiation unit 60 irradiates the laser beam from the back surface of the base material 41 to heat the pressure generating member 42 located immediately below a part of the plurality of injection holes 46. Thereby, the laser beam irradiation area | region of the pressure generation member 42 is heated to 150 degreeC or more in a short time. The size of the laser light irradiation region is not particularly limited, and may be a circle having a diameter of about 50 μm, for example, the same as the diameter of the injection hole 46.

  FIG. 9 is a view for explaining a state in which the pressure generating member 42 is heated and the metal paste 43 as the injection target material is injected. When laser light is irradiated to the pressure generating member 42 corresponding to a part of the plurality of injection holes 46 through the base material 41 from the laser light irradiation unit 60, the pressure generating member 42 absorbs the laser light. The temperature is raised to 150 ° C. or higher in a short time. In particular, since the pressure generating member 42 contains black carbon powder, the temperature is increased by efficiently absorbing laser light.

  When the temperature of the pressure generating member 42 rises, the camphor, which is a sublimable material contained in the pressure generating member 42, rapidly vaporizes and expands in volume by 600 to 1000 times. As a result, as shown in FIG. 9A, a pressure wave is generated in a part of the pressure generating member 42 heated by laser light irradiation due to a rapid volume expansion resulting from sublimation of camphor. Then, the pressure wave generated suddenly increases the pressure in the gap 47 in the injection hole 46 located immediately above the laser light irradiation region, and is loaded into the injection hole 46 as shown in FIG. 9B. The metal paste 43 is ejected upward, that is, toward the substrate W arranged to face the nozzle plate 45.

  As described above, in the first embodiment, the laser beam irradiation unit 60 irradiates the laser beam from the back surface of the base material 41 of the multilayer body S and corresponds to a part of the plurality of injection holes 46. Is heated to generate pressure due to rapid volume expansion in the pressure generating member 42. The pressure causes the metal paste 43, which is an injection target material, loaded in the injection hole 46 located immediately above the pressure generating member 42 to be injected toward the substrate W held on the stage 10. Since the pressure generated by rapid volume expansion when heating the camphor that is a sublimable material is used, even the metal paste 43 that is a high-viscosity material of 0.1 Pa · s to 1000 Pa · s is used for the substrate W. Can be injected towards In addition, camphor does not generate harmful gases and pollutants when sublimated.

  The metal paste 43 injected upward reaches the surface of the substrate W and adheres to the surface of the substrate W at that position. In this way, the metal paste 43 for forming the metal wiring is supplied to the substrate W. The metal paste 43 is attached from the lower side of the substrate W. However, since the metal paste 43 is a high-viscosity material having a viscosity of 0.1 Pa · s to 1000 Pa · s, the liquid that drops again on the laminate S. There is no risk of sagging, and wetting and spreading along the surface of the substrate W is prevented.

  The injection process for performing on / off control of the laser light source 61 while scanning the laser light irradiation unit 60 in the Y direction is performed until the laser light irradiation unit 60 reaches the scanning end position. Then, when the laser beam irradiation unit 60 reaches the scanning end position, the processing for one line at the predetermined position in the X direction on the substrate W is completed. When the processing for one line is completed, the substrate W and the stacked body S are stepped along the X direction. That is, the control unit 3 controls the stage moving mechanism 20 to move the substrate W by a predetermined distance along the X direction. As a result, the laser beam irradiation unit 60 moves relative to the substrate W in the X direction, and the laser beam irradiation unit 60 can be scanned at a new position in the X direction on the substrate W. Moreover, the control part 3 controls the support conveyance mechanism 50, and moves the laminated body S only a predetermined distance along the X direction. Thereby, the laser beam irradiation unit 60 also moves relative to the stacked body S in the X direction. The reason for this is that if the stacked body S is not moved in the X direction, the laser beam may be irradiated again to the exit hole 46 of the stacked body S that has already been used by irradiating the laser light. Because there is.

  After the step feeding of the substrate W and the stacked body S is completed, the control unit 3 performs on / off control of the laser light source 61 while scanning the laser light irradiation unit 60 in the Y direction again. Thereafter, the same procedure as above is repeated until the pattern forming process is completed. As a result, the control unit 3 heats a part of the pressure generating member 42 by irradiating the laminate S with the laser beam from the laser beam irradiation unit 60 in accordance with the pattern data stored in the storage unit in advance. Then, the metal paste 43 is injected upward from the nozzle plate 45 and adheres to the surface of the substrate W to form a metal wiring pattern.

  As described above, in the first embodiment, first, the pressure generating member 42 that generates pressure by being heated on the surface of the transparent base material 41 is laminated, and a plurality of layers are formed on the layer of the pressure generating member 42. The nozzle plate 45 provided with the injection hole 46 is adhered. A plurality of injection holes 46 of the nozzle plate 45 are loaded with a metal paste 43 as an injection material to form a laminate S. At this time, a gap 47 is formed between the loaded metal paste 43 and the pressure generating member 42.

  Next, the formed laminate S and the substrate W to be processed are arranged to face each other. Then, while the laser light irradiation unit 60 moves relative to the substrate W, the laser light irradiation from the laser light irradiation unit 60 is turned on and off so that the laser light irradiation position in the pressure generating member 42 draws a predetermined pattern. The control unit 3 controls the laser beam scanning mechanism 65, the stage moving mechanism 20, and the laser beam irradiation unit 60. In this way, the pressure generating member 42 corresponding to some of the plurality of injection holes 46 is heated by irradiating the laser beam along a predetermined pattern from the back surface of the base material 41 of the laminate S, and the pressure generating member 42 is heated. A metal paste 43, which is an injection target material loaded in the plurality of injection holes 46 of the nozzle plate 45, is generated toward the substrate W by generating pressure due to volume expansion, and a pattern of the metal paste 43 is formed on the surface of the substrate W. ing.

  The injection device 5 of the first embodiment heats the pressure generating member 42 including the camphor that rapidly expands when the temperature rises by laser light irradiation, and causes the pressure generating member 42 to generate pressure due to the rapid volume expansion, The metal paste 43 that is the material to be injected loaded in the injection hole 46 is injected toward the substrate W using the pressure. Since the pressure generated by rapid volume expansion when heating the camphor that is a sublimable material is used, even the metal paste 43 that is a high-viscosity material of 0.1 Pa · s to 1000 Pa · s is used for the substrate W. Can be injected towards

  In addition, since the pattern forming apparatus 1 uses the injection apparatus 5 to generate a pressure due to volume expansion on the pressure generating member 42 and injects the metal paste 43 as an injection target material, 0.1 Pa · s to 1000 Pa · s. A pattern can be formed on the substrate W by injecting the metal paste 43 which is a high-viscosity material.

  In particular, the pattern forming apparatus 1 according to the first embodiment turns the laser light irradiation unit 60 on and off while moving the laser light irradiation unit 60 relative to the substrate W based on predetermined pattern data. The pressure generating member 42 corresponding to a part of the plurality of injection holes 46 is heated by irradiating a laser beam along a predetermined pattern from the back surface of the base material 41. Since the pressure due to volume expansion is generated in the laser light irradiation region of the pressure generating member 42 and the metal paste 43 that is an injection target loaded in the plurality of injection holes 46 is ejected toward the substrate W, the substrate W The metal paste 43 can be adhered accurately along a predetermined pattern.

  Further, since the injection device 5 injects the metal paste 43 from the injection holes 46 provided in the nozzle plate 45 along the vertical direction, the metal paste 43 can be accurately injected upward in the vertical direction. .

  Moreover, since the space | gap 47 is formed between the loaded metal paste 43 and the pressure generation member 42, both are not contacting. For this reason, it can be prevented that the pressure generating member 42 adheres to the injected metal paste 43 and becomes a contamination source of the substrate W.

  Further, since the high-viscosity metal paste 43 is directly injected and supplied to the substrate W, the number of steps required for pattern formation is small, and the processing time can be shortened. As a result, an increase in processing cost required for pattern formation on the substrate W can be suppressed.

  In the pattern forming apparatus 1, since the high-viscosity metal paste 43 can be directly supplied to the substrate W, so-called wet spreading does not occur. Further, even when a thick electric wiring is formed on the substrate W, the wiring can be formed only by injecting the high-viscosity metal paste 43 once, and the time required for processing can be shortened.

  Furthermore, in the pattern forming apparatus 1 of the first embodiment, the injection device 5 is provided below the substrate W held on the stage 10, and the metal paste 43 is injected upward. For this reason, since the mist or the like of the metal paste 43 generated at the time of dropping falls on the lower laminated body S, it is possible to prevent such mist from adhering to the substrate W and becoming a contamination source.

  Further, since the pressure generating member 42 contains black carbon powder, the sublimation material contained in the pressure generating member 42 is generated by efficiently absorbing the laser light emitted from the laser light irradiation unit 60 and generating heat. Can effectively heat the camphor. The camphor, which is a sublimable material contained in the pressure generating member 42, easily transmits light. In other words, it is difficult to absorb light, so it is difficult to directly heat the camphor itself with light. In addition, since glycerin contained in the pressure generating member 42 also easily transmits light, that is, does not easily absorb light, it is difficult to heat glycerin by light irradiation. Therefore, the camphor is heated by including black particles such as carbon powder in the pressure generating member 42 and absorbing the black particles so that the black particles absorb light and generate heat. is there.

Second Embodiment
Next, a second embodiment of the present invention will be described. The second embodiment is different from the first embodiment in the structure and forming procedure of the stacked body S. A plan view of the laminated body S of the second embodiment viewed from the top is the same as FIG. FIG. 10 is a cross-sectional view of the stacked body S of the second embodiment. In FIG. 10 and subsequent figures, the same reference numerals are assigned to the same elements as those in the first embodiment.

  The laminate S of the second embodiment is configured by directly abutting the nozzle plate 45 on the surface of the transparent substrate 41. A plurality of injection holes 46 are formed in the nozzle plate 45, and each of the plurality of injection holes 46 is loaded with a pressure generating member 42 and a metal paste 43 that generate pressure when heated. The materials of the base material 41, the pressure generating member 42, the metal paste 43, and the nozzle plate 45 are the same as those in the first embodiment. The nozzle plate 45 has a plurality of injection holes 46 formed in a lattice shape. The shape, size, and arrangement interval of the plurality of injection holes 46 are the same as in the first embodiment.

  In the second embodiment, a nozzle plate 45 having a plurality of injection holes 46 is bonded to the surface of the base material 41, and the pressure generating member 42 and the material to be injected are arranged inside the plurality of injection holes 46 in order from the base material 41. The metal paste 43 is loaded. Further, a gap 47 is formed between the loaded metal paste 43 and the pressure generating member 42. That is, the lower end opening of the injection hole 46 is closed by being loaded with the pressure generating member 42, and the upper end opening is closed by being loaded with the metal paste 43, and a gap 47 is formed therebetween. For this reason, in the laminated body S, the metal paste 43 and the pressure generation member 42 are non-contact.

  Since the laminate S of the second embodiment is also a laminate of the base material 41 and the nozzle plate 45 formed of a polyimide film having flexibility, it can be deformed. Therefore, the stacked body S can be supported and transported by the support transport mechanism 50 having the two rollers 51 and 52. The configurations of the remaining injection device 5 and pattern forming device 1 are the same as those in the first embodiment.

  FIG. 11 is a flowchart illustrating a pattern formation processing procedure according to the second embodiment. The difference from the first embodiment shown in FIG. 6 is the procedure for forming the laminate S from step S21 to step S24. A procedure for forming the laminate S of the second embodiment will be described with reference to FIGS. 12 and 13.

  First, for example, a polyimide film is irradiated with an excimer laser to form a plurality of injection holes 46 in a lattice shape, thereby preparing a nozzle plate 45 as shown in FIG. Then, as shown in FIG. 12B, the pressure generating member 42 is loaded into the plurality of injection holes 46 of the nozzle plate 45 (first loading step of step S21). The pressure generating member 42 when loading the injection hole 46 in the second embodiment is also a slurry that is produced by mixing camphor and carbon powder with glycerin, but in step S11 of the first embodiment, the base material is used. The slurry of the pressure generating member 42 applied to the surface of 41 is diluted about 10 times with a solvent, and its viscosity is low.

  The slurry of the pressure generating member 42 of the second embodiment is also loaded into the plurality of injection holes 46 by a coating method. As a coating method for loading the slurry of the pressure generating member 42 into the injection hole 46, various known methods can be used, but in the second embodiment, a doctor blade method is used. That is, the nozzle 71 that continuously discharges the slurry of the pressure generating member 42 is moved relative to the nozzle plate 45 in the direction of the arrow AR12. The doctor blade 72 is attached to the nozzle 71 so that the lower end thereof is in contact with the upper surface of the nozzle plate 45. While supplying the slurry of the pressure generating member 42 from the nozzle 71, the doctor blade 72 moves relative to the direction of the arrow AR12 while bringing its lower end into contact with the upper surface of the nozzle plate 45, whereby pressure is applied to the plurality of injection holes 46. While the slurry of the generating member 42 is pushed in, the slurry is scraped off by the doctor blade 72 in a region other than the injection hole 46. In this way, the pressure generating member 42 is loaded into the plurality of injection holes 46 of the nozzle plate 45.

  In the second embodiment, the slurry of the pressure generating member 42 is loaded in a state where the lower end opening of the injection hole 46 is opened, and the viscosity of the slurry is lower than that of the first embodiment. It is discharged outside when the slurry is loaded. As a result, as shown in FIG. 12B, the slurry of the pressure generating member 42 is loaded (that is, filled) so as to fill the entire injection hole 46.

  Next, as shown in FIG. 12C, the substrate 41 is bonded to the lower surface of the nozzle plate 45 in which the slurry of the pressure generating member 42 is loaded in the plurality of injection holes 46 (step S22). As an adhesive for this purpose, for example, a synthetic rubber adhesive may be used. By laminating the base material 41, as shown in FIG. 13A, the nozzle plate 45 having a plurality of injection holes 46 loaded with the slurry of the pressure generating member 42 and the base material 41 are laminated. A body S is formed.

  After the base material 41 is bonded, the process proceeds to step S23, where the solvent component is volatilized and the volume is reduced by drying the slurry of the pressure generating member 42, and the lower end of the injection hole 46 (the base material 41 is bonded). The layer of the pressure generating member 42 is formed at the end of the formed side. As a result, as shown in FIG. 13B, the nozzle plate 45 having a plurality of injection holes 46 in which the layer of the pressure generating member 42 is formed at the lower end and the base material 41 are laminated.

  And as shown in FIG.13 (c), the metal paste 43 as an injection material is loaded into the some injection hole 46 of the nozzle plate 45 from the opposite side to the base material 41 (2nd loading process of step S24). ). The loading process of the metal paste 43 to the plurality of injection holes 46 is the same as in the first embodiment, and is performed using a doctor blade method as a coating method. That is, the nozzle 71 that continuously discharges the metal paste 43 is moved relative to the nozzle plate 45 in the direction of the arrow AR13. The doctor blade 72 is attached to the nozzle 71 so that the lower end thereof is in contact with the upper surface of the nozzle plate 45. While the metal paste 43 is being supplied from the nozzle 71, the doctor blade 72 is relatively moved along the direction of the arrow AR13 while the lower end thereof is in contact with the upper surface of the nozzle plate 45, whereby the metal paste 43 is placed in the plurality of injection holes 46. While being pushed in, the metal paste 43 is scraped off by the doctor blade 72 in a region other than the injection hole 46. In this way, the metal paste 43 is loaded into the plurality of injection holes 46 of the nozzle plate 45.

  Similarly to the first embodiment, the high-viscosity metal paste 43 is pushed in from the upper opening (that is, from the side opposite to the base material 41) with the lower opening of the injection hole 46 closed by the pressure generating member 42. As a result, the air remaining inside the injection hole 46 is confined between the metal paste 43 and the pressure generating member 42 as it is. As a result, the metal paste 43 does not enter the interior of the injection hole 46 due to residual air, and a gap 47 is formed between the loaded metal paste 43 and the pressure generating member 42.

  The subsequent processing from step S25 to step S28 is the same as the processing from step S14 to step S17 shown in FIG. 6 of the first embodiment. That is, the laminate S formed as described above is bridged between the main driving roller 51 and the driven roller 52 (step S25), and the substrate W to be processed is placed on the lower surface of the stage 10 so as to face the nozzle plate 45. It is held (step S26). And the control part 3 starts control of the laser beam irradiation by the laser beam irradiation part 60 (step S27), and also starts the relative movement of the laser beam irradiation part 60 (step S28). The control unit 3 performs on / off control of the laser light source 61 while relatively moving the laser light irradiation unit 60 according to the pattern data stored in advance in the storage unit.

  FIG. 14 is a diagram illustrating a state in which the metal paste 43, which is an injection target material, is injected in the second embodiment. When the laser beam is irradiated to the pressure generating member 42 that has passed through the base material 41 from the laser beam irradiation unit 60 and is loaded in the injection hole 46, the pressure generating member 42 absorbs the laser beam in a short time. The temperature is raised to 150 ° C. or higher. When the temperature of the pressure generating member 42 rises, the camphor, which is a sublimable material contained in the pressure generating member 42, rapidly vaporizes and expands in volume by 600 to 1000 times. As a result, as shown in FIG. 14A, the pressure generating member 42 heated by laser light irradiation generates a pressure wave due to rapid volume expansion resulting from sublimation of camphor. Then, the pressure wave suddenly increases the pressure of the gap 47 in the injection hole 46 in which the pressure generating member 42 is loaded, and the pressure hole is loaded into the injection hole 46 as shown in FIG. The metal paste 43 is injected upward, that is, toward the substrate W arranged opposite to the nozzle plate 45.

  As described above, in the second embodiment, the laser beam irradiation unit 60 irradiates the laser beam from the back surface of the base material 41 of the laminate S and heats the pressure generating member 42 loaded in the injection hole 46. The pressure generating member 42 is caused to generate pressure due to rapid volume expansion. The pressure causes the metal paste 43, which is the material to be injected, loaded in the same injection hole 46 as the pressure generating member 42 to be injected toward the substrate W held on the stage 10. Since the pressure generated by rapid volume expansion when heating the camphor that is a sublimable material is used, even the metal paste 43 that is a high-viscosity material of 0.1 Pa · s to 1000 Pa · s is used for the substrate W. Can be injected towards

  The metal paste 43 injected upward reaches the surface of the substrate W and adheres to the surface of the substrate W at that position. In this way, the metal paste 43 for forming the metal wiring is supplied to the substrate W. The relative movement of the laser light irradiation unit 60 and the on / off control of the laser light source 61 are the same as in the first embodiment. Accordingly, the control unit 3 generates the pressure loaded in a part of the plurality of injection holes 46 by irradiating the laminate S with the laser beam from the laser beam irradiation unit 60 in accordance with the pattern data stored in the storage unit in advance. The member 42 is heated, and the metal paste 43 is ejected upward from the nozzle plate 45 along the pattern and adheres to the surface of the substrate W to form a metal wiring pattern.

  As described above, in the second embodiment, first, the pressure generating member 42 is loaded into the plurality of injection holes 46 of the nozzle plate 45, and the transparent base material 41 is bonded to the nozzle plate 45. A plurality of injection holes 46 of the nozzle plate 45 are loaded with a metal paste 43 as an injection material to form a laminate S. In each of the plurality of injection holes 46, the pressure generating member 42 and the metal paste 43 are loaded in order from the base material 41, and a gap 47 is formed between them.

  Next, the formed laminate S and the substrate W to be processed are arranged to face each other. Then, while the laser beam irradiation unit 60 moves relative to the substrate W, the laser beam irradiation from the laser beam irradiation unit 60 is turned on and off so that the laser beam irradiation position in the stacked body S draws a predetermined pattern. The unit 3 controls the laser beam scanning mechanism 65, the stage moving mechanism 20, and the laser beam irradiation unit 60. In this way, the pressure generating member 42 loaded in a part of the plurality of injection holes 46 is heated by irradiating the laser beam along a predetermined pattern from the back surface of the substrate 41 of the laminate S, and the pressure generating member 42 is heated. A pressure due to volume expansion is generated and a metal paste 43 as an injection material loaded in the same injection hole 46 is injected toward the substrate W, and a pattern of the metal paste 43 is formed on the surface of the substrate W.

  The injection device 5 of the second embodiment also heats the pressure generating member 42 including the camphor that rapidly expands in volume when the temperature rises, by causing the pressure generating member 42 to generate pressure due to the rapid volume expansion, The metal paste 43 that is the material to be injected loaded in the injection hole 46 is injected toward the substrate W using the pressure. Since the pressure generated by rapid volume expansion when heating the camphor that is a sublimable material is used, even the metal paste 43 that is a high-viscosity material of 0.1 Pa · s to 1000 Pa · s is used for the substrate W. Can be injected towards

  In addition, since the pattern forming apparatus 1 according to the second embodiment uses the injection apparatus 5 to generate pressure due to volume expansion on the pressure generating member 42 and injects the metal paste 43 as the injection target material, 0.1 Pa · A pattern can be formed on the substrate W by injecting a metal paste 43 that is a high-viscosity material of s to 1000 Pa · s. In addition to this, the pattern forming apparatus 1 of the second embodiment can achieve the same effects as those of the first embodiment.

<Third Embodiment>
Next, a third embodiment of the present invention will be described. In the first embodiment, the nozzle plate 45 is provided with a plurality of injection holes 46 in a grid pattern, but in the third embodiment, the nozzle plate 45 is provided with a pattern hole 146 that is previously patterned in a predetermined shape. . FIG. 15 is a perspective view showing a schematic configuration of the pattern forming apparatus 1a of the third embodiment. FIG. 16 is a front view of the pattern forming apparatus 1a of the third embodiment.

  The stage 10 that holds the substrate W and the stage moving mechanism 20 that moves the stage 10 are exactly the same as in the first embodiment. The laser beam irradiation unit 60 and the laser beam scanning mechanism 65 of the injection device 5 are the same as those in the first embodiment. The third embodiment differs from the first embodiment in that the pattern plate 146 is provided in the nozzle plate 45 of the laminate S instead of the plurality of injection holes 46, and the nozzle plate 45 is configured. This is a support conveyance mechanism 150 that supports and conveys the stacked body S. The support transport mechanism 50 of the first embodiment employs a roller transport system that transports the flexible laminate S by two rollers, but the support transport mechanism 150 of the third embodiment places the stack S on the stage. It adopts a stage conveyance system that supports and conveys to the surface.

  The stage moving mechanism 20 is also based on the stage conveying system, and the support conveying mechanism 150 of the third embodiment has a configuration similar to the stage moving mechanism 20. That is, the support conveyance mechanism 150 is configured by screwing the stage 151 into the ball screw 153 connected to the rotation shaft of the motor 152. When the motor 152 rotates the ball screw 153, the stage 151 screwed to it moves along the X direction. As with the stage moving mechanism 20, a guide shaft that guides the stage 151 along the X direction may be provided.

  The stage 151 of the support transport mechanism 150 is configured in an annular shape, and holds the peripheral edge of the stacked body S so that the substrate W and the stacked body S are arranged to face each other. Since the inside of the annular portion of the stage 151 is hollow, the stage 151 does not become an obstacle to laser light irradiation. When the stage 151 is formed of a material transparent to laser light (for example, quartz glass), the entire surface of the stacked body S may be placed and held on the plate-like stage 151. good.

  FIG. 17 is a plan view of the stacked body S of the third embodiment as viewed from above. The cross-sectional structure of the stacked body S of the third embodiment is substantially the same as that of the first embodiment shown in FIG. 4 except that the pattern hole 146 is used instead of the plurality of injection holes 46. That is, the layered product S of the third embodiment forms a layer of the pressure generating member 42 that generates pressure by being heated on the surface of the transparent substrate 41, and a pattern is formed on the layer of the pressure generating member 42. The nozzle plate 45 in which the hole 146 is formed is in contact with the nozzle plate 45. The metal paste 43 is loaded into the pattern hole 146 of the nozzle plate 45.

  In the first embodiment, since the laminate S needs to be bent along the two rollers 51 and 52, a resin film is used as the base material 41. However, in the third embodiment, the laminate S is not flexible. Since it is unnecessary, the base material 41 may be any material that is transparent to the laser light emitted from the laser light irradiation unit 60, and for example, a glass substrate or the like can be used. Further, since the nozzle plate 45 does not need flexibility, for example, a metal plate can be used. The pressure generating member 42 and the metal paste 43 are exactly the same as in the first embodiment.

  The remaining configuration of the pattern forming apparatus 1a of the third embodiment is the same as that of the first embodiment. Further, the pattern formation processing procedure in the third embodiment is the same as that in the first embodiment (FIG. 6). However, in the third embodiment, as a coating method for forming the layer of the pressure generating member 42, a spin coating method is used in which the slurry of the pressure generating member 42 is supplied to the rotating substrate 41 to form a layer having a uniform thickness. You may do it.

  Further, the nozzle plate 45 of the third embodiment is formed by drilling a pattern hole 146 having a predetermined shape in a metal plate by a technique such as photolithography or laser processing. The shape of the pattern hole 146 is the same as the shape of the pattern to be formed on the substrate W to be processed. The nozzle plate 45 having the pattern hole 146 is brought into contact with the layer of the pressure generating member 42 formed on the surface of the base material 41, and the metal paste 43 as the injection target material is loaded into the pattern hole 146. The

  In addition, the control unit 3 controls the laser light irradiation while moving the laser light irradiation unit 60 relative to the first embodiment. However, in the third embodiment, on / off control of the laser light source 61 is not necessarily performed. There is no need, and laser light from the laser light source 61 may be continuously irradiated. Even if it does in this way, when the laser beam irradiation part 60 permeate | transmits the base material 41 and a laser beam is irradiated to the pressure generating member 42, the pressure generating member 42 will absorb a laser beam and will be 150 in a short time. The temperature is raised to more than 0 ° C. to generate pressure due to rapid volume expansion. Then, the metal paste 43 that is the material to be injected loaded into the pattern hole 146 is injected toward the substrate W held on the stage 10 by the pressure. In the third embodiment, the metal paste 43 is ejected along the shape of the pattern hole 146 regardless of the pattern of the laser beam irradiation, so that the laser beam is continuously irradiated from the relatively moving laser beam irradiation unit 60. Even so, the metal wiring pattern can be formed on the surface of the substrate W along the shape of the pattern hole 146.

  Thus, in the third embodiment, first, the pressure generating member 42 that generates pressure by being heated on the surface of the transparent base material 41 is laminated, and a predetermined shape is formed on the layer of the pressure generating member 42. The nozzle plate 45 provided with the pattern hole 146 is in contact. And the laminated body S is formed by charging the pattern hole 146 of the nozzle plate 45 with the metal paste 43 as the material to be injected. A gap 47 is formed between the loaded metal paste 43 and the pressure generating member 42.

  Next, the formed laminate S and the substrate W to be processed are arranged to face each other. Then, the laser light irradiation unit 60 irradiates the pressure generating member 42 with laser light from the back surface of the base material 41 of the stacked body S while moving relative to the substrate W. At this time, laser light may be continuously emitted from the laser light irradiation unit 60. In this way, the laser beam is irradiated from the back surface of the base material 41 of the laminate S to heat the pressure generating member 42 corresponding to the pattern hole 146, and a pressure due to volume expansion is generated in the pressure generating member 42, so The metal paste 43 that is the material to be injected loaded in the hole 146 is injected toward the substrate W, and a pattern of the metal paste 43 is formed on the surface of the substrate W.

  Therefore, similarly to the first embodiment, the pattern forming apparatus 1 according to the third embodiment uses the injection device 5 to generate a pressure due to volume expansion on the pressure generating member 42 and injects the metal paste 43 as an injection target material. Therefore, a pattern can be formed on the substrate W by injecting the metal paste 43 which is a high viscosity material of 0.1 Pa · s to 1000 Pa · s.

  In the pattern forming apparatus 1 according to the third embodiment, since the laminate S is configured using the nozzle plate 45 in which the pattern holes 146 having a predetermined shape are formed in advance, the pattern holes are formed regardless of the pattern of laser light irradiation. The metal paste 43 is injected along the shape of 146. For this reason, even if the laser beam is continuously irradiated from the relatively moving laser beam irradiation unit 60, the metal paste 43 is ejected in a shape along the pattern hole 146, and the pattern of the metal wiring is formed on the substrate W in the shape. Formation can be performed. Therefore, the control unit 3 does not necessarily have to hold pattern data, and laser light irradiation control is easy.

  Such a pattern forming apparatus 1a of the third embodiment is suitable when the shape of the pattern to be formed on the substrate W is fixed. However, when it is desired to freely change the pattern formed on the substrate W, the pattern forming apparatus 1 of the first and second embodiments is more suitable.

  Further, if a metal plate is used as the nozzle plate 45, it is desirable to collect and reuse the used nozzle plate 45. Specifically, a mechanism for collecting the used nozzle plate 45, a mechanism for cleaning the collected nozzle plate 45, a mechanism for loading the metal paste 43 into the laminate S including the nozzle plate 45 after cleaning, and the like. What is necessary is just to attach to the pattern formation apparatus 1.

  The remaining effects produced by the pattern forming apparatus 1a of the third embodiment are the same as those of the first embodiment.

<Fourth embodiment>
Next, a fourth embodiment of the present invention will be described. In the fourth embodiment, instead of the plurality of injection holes 46 of the second embodiment, pattern holes 146 that are patterned in a predetermined shape in the same manner as the third embodiment are provided in the nozzle plate 45. The fourth embodiment is the same as the third embodiment except for the structure and formation procedure of the stacked body S.

  The cross-sectional structure of the laminated body S of the fourth embodiment is substantially the same as that of the second embodiment shown in FIG. 10 except that a pattern hole 146 is used instead of the plurality of injection holes 46. That is, the laminate S of the fourth embodiment is configured by directly contacting the nozzle plate 45 with the surface of the transparent base material 41. The nozzle plate 45 is provided with a pattern hole 146 having a predetermined shape, and the pattern hole 146 is loaded with a pressure generating member 42 and a metal paste 43 that generate pressure when heated.

  The formation procedure of the laminated body S of 4th Embodiment is the same as 2nd Embodiment. That is, the pressure generating member 42 is loaded into the pattern hole 146 having a predetermined shape of the nozzle plate 45, and the transparent base material 41 is bonded to the nozzle plate 45. And the laminated body S is formed by charging the pattern hole 146 of the nozzle plate 45 with the metal paste 43 as the material to be injected. In the pattern hole 146 of the nozzle plate 45, the pressure generating member 42 and the metal paste 43 are loaded in order from the base material 41, and a gap 47 is formed between them.

  At the time of pattern formation, the formed laminate S and the substrate W to be processed are arranged to face each other. Then, the laser light irradiation unit 60 irradiates the pressure generating member 42 with laser light from the back surface of the base material 41 of the stacked body S while moving relative to the substrate W. At this time, laser light may be continuously emitted from the laser light irradiation unit 60. In this way, the pressure generating member 42 loaded in the pattern hole 146 is heated by irradiating the laser beam from the back surface of the base material 41 of the laminate S, and a pressure due to volume expansion is generated in the pressure generating member 42 to The metal paste 43, which is the material to be injected, loaded in the pattern hole 146 is injected toward the substrate W, and the pattern of the metal paste 43 is formed on the surface of the substrate W.

  As in the first embodiment, the pattern forming apparatus according to the fourth embodiment uses the injection device 5 to generate pressure due to volume expansion on the pressure generating member 42 to inject the metal paste 43 as the injection target material. A pattern can be formed on the substrate W by injecting a metal paste 43 which is a high viscosity material of 0.1 Pa · s to 1000 Pa · s. The remaining effects produced by the pattern forming apparatus 1 of the fourth embodiment are the same as those of the first embodiment.

<Fifth Embodiment>
Next, a fifth embodiment of the present invention will be described. In the first to fourth embodiments, the pressure generating member 42 is heated by laser light irradiation from the laser light irradiation unit 60. In the fifth embodiment, the pressure generating member 42 is heated by a heater. Yes.

  FIG. 18 is a cross-sectional view showing the structure of the multilayer body S of the fifth embodiment. In 5th Embodiment, the some heater 160 which comprises the injection apparatus 5 is attached to the laminated body S similar to 1st Embodiment. Specifically, a heater 160 is attached to the lower surface of the base material 41 in each of the layers S immediately below the plurality of injection holes 46.

  Each of the plurality of heaters 160 receives power supply and generates heat, and heats the pressure generating member 42 located immediately above the heater 160 via the base material 41. That is, each heater 160 is a heating unit that heats a part of the pressure generating member 42. The plurality of heaters 160 are individually supplied with power under the control of the control unit 3. Accordingly, the control unit 3 controls the power supply to a part of the plurality of heaters 160 and heats the pressure generating member 42 along the pattern formed by the part of the heaters 160 so as to reduce the volume. Pressure due to expansion can be generated.

  In the fifth embodiment, the surface of the base material 41 is heated to form a layer of a pressure generating member 42 that generates pressure, and a nozzle plate 45 having a plurality of injection holes 46 formed thereon is bonded. Thus, the laminate S is configured. A metal paste 43 is loaded in each of the plurality of injection holes 46, and a gap 47 is formed between the loaded metal paste 43 and the pressure generating member 42. The base material 41 of the fifth embodiment does not need to be transparent, but is preferably formed of a material having high thermal conductivity in order to smoothly conduct the heat of the heater 160 to the pressure generating member 42, for example, ceramics. Alternatively, it may be formed using metal. About the pressure generating member 42 and the metal paste 43, the thing similar to 1st Embodiment can be used. However, in the case of heating with the heater 160 as in the fifth embodiment, it is not necessary to mix black carbon powder that functions as a light absorber with the pressure generating member 42.

  A plurality of heaters 160 are attached to the lower surface of the laminated body S (the lower surface of the base material 41) in a lattice shape. Since the plurality of heaters 160 are provided in a one-to-one correspondence with the plurality of injection holes 46, the lattice shape formed by the plurality of heaters 160 is the lattice shape formed by the plurality of injection holes 46 (see FIG. 3). It is the same.

  When performing the pattern forming process, the stacked body S provided with a plurality of heaters 160 and the substrate W are arranged to face each other. In the fifth embodiment, the laminate S and the substrate W provided with the plurality of heaters 160 are held in place without moving. Then, the control unit 3 controls the power supply to a part of the plurality of heaters 160 along the pattern data stored in advance in the storage unit, and a part of the pressure generating member 42 along the pattern. Is rapidly heated to expand its volume. As a result, a pressure due to volume expansion is generated in a part of the pressure generating member 42 according to the pattern, and the metal paste 43 as the injection target material loaded in the injection hole 46 positioned immediately above the heater 160 to which power is supplied is formed on the substrate W. The pattern of the metal paste 43 is formed on the surface of the substrate W. Note that power may be supplied simultaneously to the plurality of heaters 160 corresponding to the pattern, or power may be supplied sequentially to generate heat.

  Thus, in the fifth embodiment, there is no need to relatively move the plurality of heaters 160 serving as heating means and the substrate W, and it is sufficient that the stage 10 holds the substrate W at a fixed position. 20 is not necessarily a necessary component. Similarly, there is no need to relatively move the stacked body S provided with a plurality of heaters 160 and the substrate W, and the support and transport mechanism 50 is not an essential element. However, in order to perform alignment (alignment) between the stacked body S and the substrate W before the pattern formation process, it is preferable to provide the stage moving mechanism 20 and / or the support transport mechanism 50.

  In the fifth embodiment, a part of the pressure generating member 42 is heated by a part of the plurality of heaters 160 and suddenly volume-expands to generate pressure, and the metal paste 43 loaded in the injection hole 46 by the pressure. Has been injected. Therefore, similarly to the first to fourth embodiments, a pattern can be formed on the substrate W by injecting the metal paste 43 which is a high viscosity material of 0.1 Pa · s to 1000 Pa · s.

<Sixth Embodiment>
Next, a sixth embodiment of the present invention will be described. In the fifth embodiment, the pressure generating member 42 is heated by the heater attached to the laminate S. However, in the sixth embodiment, the pressure generating member 42 itself is directly energized and heated.

  FIG. 19 is a diagram schematically illustrating the structure of the stacked body S of the sixth embodiment. In 6th Embodiment, it replaced with the some heater 160 of 5th Embodiment, and the some electrode 260 which comprises the injection apparatus 5 is provided in the laminated body S. FIG. Specifically, as illustrated in FIG. 19, an electrode 260 including a pair of an anode 260 a and a cathode 260 b is erected on the upper surface of the base material 41 of the stacked body S. The height of the electrode 260 (the distance from the upper surface of the base material 41 to the upper end of the electrode 260) is preferably smaller than the thickness of the layer of the pressure generating member 42. The anode 260a and the cathode 260b are electrically connected to the positive electrode and the negative electrode of the power source 261, respectively.

  The pressure generating member 42 contains carbon powder. This carbon powder increases the absorption efficiency of laser light in the first to fourth embodiments, but functions as an additive that generates heat when energized in the sixth embodiment. By including the carbon powder, the pressure generating member 42 becomes a resistance heating element that generates heat when energized. For this reason, when a voltage is applied to each of the plurality of electrodes 260, the pressure generating member 42 between the anode 260a and the cathode 260b constituting the electrode 260 generates heat by energization. That is, the individual electrodes 260 and the power source 261 are energization heating means for energizing and heating a part of the pressure generating member 42.

  Similar to the fifth embodiment, the stacked body S is provided with a plurality of electrodes 260 in a grid pattern. Since the plurality of electrodes 260 are provided in a one-to-one correspondence with the plurality of injection holes 46, the lattice shape formed by the plurality of electrodes 260 is the lattice shape formed by the plurality of injection holes 46 (see FIG. 3). It is the same.

  A voltage is individually applied from the power source 261 to the plurality of electrodes 260 under the control of the control unit 3. As a technique for realizing this, a switch (not shown) provided between each of the plurality of electrodes 260 and the power source 261 may be opened and closed by the control unit 3, or each of the plurality of electrodes 260 may be individually provided. The control unit 3 may control the on / off of the provided power supply 261 itself. Thereby, the control unit 3 controls the voltage to be applied to a part of the plurality of electrodes 260 and heats the pressure generating member 42 along the pattern formed by the part of the electrodes 260. Pressure due to volume expansion can be generated.

  In the sixth embodiment, the surface of the base material 41 to which the plurality of electrodes 260 are attached is heated to form a layer of the pressure generating member 42 that generates pressure, and a plurality of injection holes 46 are formed thereon. The laminated body S is configured by adhering the nozzle plate 45 thus formed. A metal paste 43 is loaded in each of the plurality of injection holes 46, and a gap 47 is formed between the loaded metal paste 43 and the pressure generating member 42. The pressure generating member 42 contains carbon powder. The base material 41 of the sixth embodiment does not need to be transparent, but needs to be formed of an insulating material in order to prevent a short circuit. For example, the base material 41 is preferably formed using ceramics or resin. The metal paste 43 is the same as in the first embodiment.

  When performing a pattern formation process, the laminated body S in which the some electrode 260 was installed, and the board | substrate W are arrange | positioned facing each other. In the sixth embodiment, the stacked body S on which the plurality of electrodes 260 are installed and the substrate W are both held in place without moving. And the control part 3 is controlled so that a voltage is applied to some of the several electrodes 260 along the pattern data previously stored in the memory | storage part, and a part of pressure generation member 42 is followed along the pattern. Is expanded by energization heating. As a result, a pressure due to volume expansion is generated in a part of the pressure generating member 42 according to the pattern, and the metal paste 43 which is an injection material loaded in the injection hole 46 positioned immediately above the energized electrode 260 is directed toward the substrate W. The pattern of the metal paste 43 is formed on the surface of the substrate W. A voltage may be applied simultaneously to the plurality of electrodes 260 corresponding to the pattern, or the voltages may be applied sequentially.

  Also in the sixth embodiment, it is not necessary to relatively move the plurality of electrodes 260 serving as the heating means and the substrate W, and it is sufficient that the stage 10 holds the substrate W at a fixed position. Therefore, the stage moving mechanism 20 is not necessarily required. It is not an essential component. Similarly, there is no need to relatively move the stacked body S on which the plurality of electrodes 260 are installed and the substrate W, and the support / transport mechanism 50 is not an essential element. However, in order to perform alignment (alignment) between the stacked body S and the substrate W before the pattern formation process, it is preferable to provide the stage moving mechanism 20 and / or the support transport mechanism 50.

  In the sixth embodiment, a part of the pressure generating member 42 is energized and heated by a part of the plurality of electrodes 260 to rapidly expand the volume and generate a pressure, and the metal paste loaded in the injection hole 46 by the pressure. 43 is being ejected. Therefore, similarly to the first to fifth embodiments, the metal paste 43 which is a high viscosity material of 0.1 Pa · s to 1000 Pa · s can be injected to form a pattern on the substrate W.

<Modification>
While the embodiments of the present invention have been described above, the present invention can be modified in various ways other than those described above without departing from the spirit of the present invention. For example, in the fourth embodiment, the laser beam is scanned on the back surface of the stacked body S (that is, the pressure generating member 42 loaded in the pattern hole 146 is sequentially heated). All of the pressure generating members 42 loaded in the pattern holes 146 may be heated together.

  As such a batch heating method, for example, microwave heating can be used as shown in FIG. In the same figure, the structure of the laminated body S is the same as that of 4th Embodiment. That is, the laminate S is configured by directly contacting the nozzle plate 45 with the surface of the base material 41. A pattern hole 146 having a predetermined shape is formed in the nozzle plate 45, and the pressure generating member 42 and the metal paste 43 are loaded into the pattern hole 146 in order from the base material 41. Further, a gap 47 is formed between the pressure generating member 42 and the metal paste 43.

  The microwave heating unit 360 is provided below the stacked body S, and irradiates the stacked body S with microwaves having a predetermined frequency. The microwave heating unit 360 simultaneously irradiates the entire back surface of the multilayer body S with microwaves. The irradiated microwave passes through the base material 41 of the laminate S and heats the pressure generating member 42 loaded in the pattern hole 146. At this time, since the microwaves are simultaneously irradiated on the entire surface of the laminate S, all of the pressure generating members 42 loaded in the pattern holes 146 are heated together. That is, the microwave heating unit 360 is a heating unit that collectively heats the entire pressure generating member 42.

  When performing the pattern forming process on the substrate W in the configuration of FIG. 20, the stacked body S and the substrate W are arranged to face each other. At this time, the stacked body S and the substrate W are both held in place without moving. Then, when the control unit 3 irradiates the microwave from the microwave heating unit 360 at a predetermined timing, the pressure generating members 42 loaded in the pattern holes 146 are collectively heated and volume-expanded. As a result, the metal paste 43, which is the material to be injected, loaded into the pattern hole 146 by the pressure generated by the volume expansion of the pressure generating member 42 is injected toward the substrate W, and the pattern of the metal paste 43 is formed on the surface of the substrate W. Is done.

  Even in this case, the pressure generating member 42 loaded in the pattern hole 146 of the nozzle plate 45 is collectively heated, thereby generating a pressure due to volume expansion in the pressure generating member 42, and the metal paste 43 as the injection target material. Therefore, a pattern can be formed on the substrate W by injecting the metal paste 43 which is a high viscosity material of 0.1 Pa · s to 1000 Pa · s. In addition, since the pressure generating member 42 is heated at once and the metal paste 43 loaded in the pattern hole 146 is simultaneously ejected, the pattern can be formed on the substrate W in a very short time.

  In the configuration of FIG. 20, a flash lamp that irradiates a flash of high energy in a short light emission time may be used as a heating unit that collectively heats the entire pressure generating member 42 instead of the microwave heating unit 360.

  In each of the above embodiments, the pressure generating member 42 is provided with a camphor as a sublimable material so as to provide a pressure generating function. However, the pressure generating member 42 is provided with a pressure generating function by using another sublimable material. You may make it provide. For example, the pressure generating member 42 may include dry ice as a sublimable material. Even when other sublimable materials are used, volume expansion occurs due to sublimation when heated, so that the same processing as in the above embodiments can be performed.

  Further, the pressure generating member 42 is not limited to one including a sublimable material, and may be any member that generates pressure by heating. For example, the pressure generating member 42 may be composed of explosives. Further, a gas storage material may be used as the pressure generating member 42.

  In each of the above embodiments, carbon powder is included in the pressure generating member 42 in order to increase the absorption efficiency of laser light. However, the present invention is not limited to this, and includes black particles other than carbon powder. You may make it. In short, the pressure generating member 42 may include a material that easily absorbs light, in other words, a material that hardly reflects or transmits light. If the sublimation material itself is a material that easily absorbs light, for example, a black sublimation material, black particles such as carbon powder may not be included in the pressure generating member 42.

  In the first to fourth embodiments, the substrate W is moved in the X direction and the laser light irradiation unit 60 is moved in the Y direction. However, the relative movement is not limited to this. Various configurations can be employed in which the laser light irradiation unit 60 is moved relative to the substrate W held on the stage 10 in the X direction and the Y direction. For example, the substrate W may be held at a fixed position without being moved, and only the laser light irradiation unit 60 may be moved in the X direction and the Y direction.

  Further, the laser beam irradiation unit 60 may be configured as a multi-laser beam irradiation unit that emits a plurality of laser beams arranged in a line along the X direction. The pitch of the plurality of laser beams is the same as the installation interval of the plurality of injection holes 46. In the case of such a configuration, the pattern formation processing by scanning the laser beam irradiation unit 60 in the Y direction is performed simultaneously for a plurality of lines, so that the processing time required for pattern formation can be shortened.

  In the first to fourth embodiments, the pressure generating member 42 is heated by irradiating laser light. However, the pressure generating member 42 is not limited to laser light irradiation, and the pressure generating member 42 is heated by other light irradiation. You may make it do. For example, a lamp may be used as the light source, and the light from the lamp may be collected and irradiated to the pressure generating member 42, or the light from the light emitting diode (LED) may be irradiated to the pressure generating member 42 and heated. You may make it do.

  In each of the above embodiments, the metal paste 43 is injected from the injection device 5 toward the upper substrate W. However, the vertical relationship between the injection device 5 and the stage 10 is reversed, and the injection device 5 The metal paste 43 may be injected toward the lower substrate W.

  Further, instead of the metal paste 43, an adhesive (for example, an epoxy resin adhesive) having a viscosity of 0.1 Pa · s or more and 1000 Pa · s or less may be used as an injection target material. The adhesive can be injected by pressure caused by the volume expansion of the heated pressure generating member 42 and can be applied to a minute region such as a joint between the sensor and the semiconductor element. According to the technique according to the present invention, it is possible to apply a necessary amount of an expensive adhesive to such a minute region, and it is possible to suppress wasteful use of the adhesive.

  Further, instead of the metal paste 43, metal particles may be injected. Specifically, in the first to sixth embodiments, instead of the metal paste 43, a high-viscosity material in which a plurality of metal particles are dispersed is loaded into the injection hole 46 (or the pattern hole 146). The material and particle size of the metal particles are not particularly limited, and may be metal powder. Further, the high viscosity material has a viscosity of 0.1 Pa · s to 1000 Pa · s, and for example, an adhesive can be used. When performing a pattern formation process, the laminated body S and the board | substrate W with which the high-viscosity material containing many metal particles was loaded in the some injection hole 46 are arrange | positioned facing each other. When the pressure generating member 42 is heated along a predetermined pattern, a pressure due to volume expansion is generated, and a high-viscosity material including metal particles as an injection target material is injected. The injected high viscosity material adheres to the surface of the substrate W, and a pattern of metal particles is formed on the surface. Instead of dispersing the metal particles in the high-viscosity material, the metal particles may be directly dispersed on the layer of the pressure generating member 42 and injected from the injection hole 46.

  Furthermore, the metal paste 43 may be injected from the injection device 5 according to the present invention into a pattern connected to the inner lead of the semiconductor element, and the outer lead may be formed by the metal paste 43. That is, wire bonding of a semiconductor device can be performed using the technique according to the present invention.

  The present invention can be suitably applied to a technique for forming various electric wiring patterns on a substrate, and is particularly suitable for performing pattern formation using a high-viscosity material. The present invention can also be suitably applied to application of an adhesive to a fine region and wire bonding of a semiconductor device.

DESCRIPTION OF SYMBOLS 1,1a Pattern formation apparatus 3 Control part 5 Injection apparatus 10 Stage 20 Stage moving mechanism 41 Base material 42 Pressure generating member 43 Metal paste 45 Nozzle plate 46 Injection hole 50,150 Support conveyance mechanism 60 Laser beam irradiation part 65 Laser beam scanning mechanism 146 Pattern hole 160 Heater 260 Electrode 360 Microwave heating part S Laminate W Substrate

Claims (26)

A supporting means for supporting a base material on which a pressure generating member that generates pressure when heated is laminated;
An injection plate provided in contact with the pressure generating member and having a plurality of injection holes in which an injection target material is loaded;
By heating the pressure generating member, a pressure due to volume expansion is generated in the pressure generating member, and an injection material loaded in the plurality of injection holes is injected toward an object disposed opposite to the injection plate. Heating means,
An injection apparatus comprising: A support means for supporting the substrate;
An injection plate that is provided in contact with the surface of the base material and has a plurality of injection holes in which a pressure generating member that generates pressure by being heated in the order from the base material and an injection target material are loaded. When,
By heating the pressure generating member, a pressure due to volume expansion is generated in the pressure generating member, and an injection material loaded in the plurality of injection holes is injected toward an object disposed opposite to the injection plate. Heating means,
An injection apparatus comprising: In the injection device according to claim 1 or 2,
The injection apparatus, wherein the plurality of injection holes are provided in a lattice pattern on the injection plate. The injection device according to claim 3,
The said heating means heats the pressure generation member corresponding to some of these injection holes, The injection apparatus characterized by the above-mentioned. A supporting means for supporting a base material on which a pressure generating member that generates pressure when heated is laminated;
An injection plate provided in contact with the pressure generating member and having a pattern hole of a predetermined shape in which an injection target material is loaded;
Heating by causing the pressure generating member to generate a pressure due to volume expansion and injecting the injection target material loaded in the pattern hole toward an object disposed opposite to the injection plate by heating the pressure generating member. Means,
An injection apparatus comprising: A support means for supporting the substrate;
Injection having a pattern hole of a predetermined shape that is provided in contact with the surface of the base material and in which a pressure generating member that generates pressure by being heated in order from the base material and an injection target material are loaded. The board,
Heating by causing the pressure generating member to generate a pressure due to volume expansion and injecting the injection target material loaded in the pattern hole toward an object disposed opposite to the injection plate by heating the pressure generating member. Means,
An injection apparatus comprising: The injection apparatus according to any one of claims 1 to 6,
An injection apparatus comprising a gap between the material to be injected and the pressure generating member. The injection apparatus according to any one of claims 1 to 7,
The heating means includes light irradiation means for heating the pressure generating member by irradiating light from the back surface of the base material,
The injection apparatus according to claim 1, wherein the base material is transparent to light irradiated from the light irradiation means. The injection device according to claim 8,
The injection device according to claim 1, wherein the pressure generating member includes a light absorbing material that heats the pressure generating member by absorbing light emitted from the light irradiation unit and generating heat. The injection apparatus according to any one of claims 1 to 7,
2. The injection apparatus according to claim 1, wherein the heating means includes a heater for heating the pressure generating member. The injection apparatus according to any one of claims 1 to 7,
2. The injection apparatus according to claim 1, wherein the heating means includes an energization heating means for energizing the pressure generating member to generate heat. The injection device according to any one of claims 1 to 11,
The injection apparatus according to claim 1, wherein the pressure generating member includes a camphor that causes volume expansion by sublimation when heated. The injection device according to any one of claims 1 to 12,
The said injection material contains the highly viscous material whose viscosity is 0.1 Pa.s or more and 1000 Pa.s or less, The injection apparatus characterized by the above-mentioned. An injection device according to any one of claims 1 to 13,
Substrate holding means for holding the substrate at a position facing the injection plate;
With
A pattern forming apparatus, wherein a pattern is formed on a substrate by an injection material injected from the injection apparatus. A contact step of laminating a pressure generating member that generates pressure by being heated on the surface of the substrate, and abutting an injection plate having a plurality of injection holes on the pressure generating member;
A loading step of loading a material to be injected into the plurality of injection holes of the injection plate;
By heating the pressure generating member, a pressure due to volume expansion is generated in the pressure generating member, and an injection material loaded in the plurality of injection holes is injected toward an object disposed opposite to the injection plate. Heating process
An injection method comprising: A first loading step of loading a plurality of injection holes provided in the injection plate with a pressure generating member that generates pressure when heated;
A contact step of bringing a base material into contact with the injection plate loaded with the pressure generating member;
A second loading step of loading the material to be injected into the plurality of injection holes of the injection plate from the side opposite to the base material;
By heating the pressure generating member, a pressure due to volume expansion is generated in the pressure generating member, and an injection material loaded in the plurality of injection holes is injected toward an object disposed opposite to the injection plate. Heating process
An injection method comprising: The injection method according to claim 15 or claim 16,
The injection method, wherein the plurality of injection holes are provided in a lattice pattern on the injection plate. The injection method according to claim 17,
In the heating step, the pressure generating member corresponding to a part of the plurality of injection holes is heated. A contact step of laminating a pressure generating member that generates pressure by being heated on the surface of the substrate, and abutting an injection plate having a pattern hole of a predetermined shape on the pressure generating member;
A loading step of loading a material to be injected into the pattern hole of the injection plate;
Heating by causing the pressure generating member to generate a pressure due to volume expansion by injecting the pressure generating member and injecting the material to be injected loaded in the pattern hole toward an object disposed opposite to the injection plate. Process,
An injection method comprising: A first loading step of loading a pressure generating member that generates pressure when heated into a pattern hole of a predetermined shape provided in the injection plate;
A contact step of bringing a base material into contact with the injection plate loaded with the pressure generating member;
A second loading step of loading the material to be injected into the pattern hole of the injection plate from the side opposite to the substrate;
Heating by causing the pressure generating member to generate a pressure due to volume expansion by injecting the pressure generating member and injecting the material to be injected loaded in the pattern hole toward an object disposed opposite to the injection plate. Process,
An injection method comprising: The injection method according to any one of claims 15 to 20,
An injection method comprising providing a gap between the material to be injected and the pressure generating member. The injection method according to any one of claims 15 to 21,
The heating step includes a step of heating the pressure generating member by irradiating light from the back surface of the base material,
The injection method, wherein the substrate is transparent to the light. The injection method according to claim 22,
The injection method, wherein the pressure generating member includes a light absorbing material that heats the pressure generating member by absorbing the light irradiated from the back surface of the base material and generating heat. The injection method according to any one of claims 15 to 23,
The injection method according to claim 1, wherein the pressure generating member includes a camphor that causes volume expansion by sublimation when heated. The injection method according to any one of claims 15 to 24,
The said injection material contains the high viscosity material whose viscosity is 0.1 Pa.s or more and 1000 Pa.s or less, The injection method characterized by the above-mentioned. An injection method according to any one of claims 15 to 25;
A substrate disposing step of disposing a substrate at a position facing the injection plate;
With
A pattern forming method, wherein a pattern is formed on a substrate by an injection material injected from the injection plate.

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