JP2012138262A - Substrate mounting structure, substrate manufacturing method, and electronic apparatus of press-fit connector - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate mounting structure, a substrate manufacturing method, and an electronic apparatus of a press-fit connector which allow the press-fit connector to be press-fitted into a through hole without impairing reliability for connection.SOLUTION: A substrate mounting structure is used for mounting a component having a lead part on a multilayer substrate and has first substrate having a first through hole for press-fitting the component, a second substrate forming the multiplayer substrate with the first substrate, and an adhesive layer bonding the first substrate to the second substrate. A surface of the multilayer substrate is coated by a low fluidic resin, and the lead part of the component is pressed into the low fluidic resin. Consequently, the pressed lead part of the component is press-fitted into the first through hole through a hole formed in the low fluidic resin.

Description

  The present invention relates to a printed circuit board having high-density mounting, and more particularly to a structure for mounting a press-fit connector on a printed circuit board having a non-through hole, a substrate manufacturing method, and an electronic device having the structure.

  In recent years, there has been an increasing demand for miniaturization, weight reduction, and multi-functionality including mobile devices, and in order to realize these requirements, high-density mounting of printed circuit boards has been remarkably advanced. For high-density mounting, there are component miniaturization and narrow mounting, but in particular, mounting both front and back sides at the same position has become an important technology. Regarding the front and back double-sided mounting technology, the following method has been reported as a method for producing a printed circuit board using a non-through hole.

  In Patent Document 1, a through-through hole is formed in each of a copper-clad laminate that forms a front surface and a copper-clad laminate that forms a back surface before bonding and laminating them. In order to prevent the plating solution applied at the time of forming each laminated board from entering the through through hole, after bonding each laminated board on the front and back, a polyimide film or a heat-resistant resin film is attached to the outer layer surface of each laminated board, The front and back laminates are laminated by thermocompression bonding through a prepreg having low resin flowability. Thereafter, the polyimide film and heat-resistant resin film covering the non-through hole are removed by end milling or laser processing, and the lead-in press-fitted parts (hereinafter referred to as a press-fit connector) are inserted into the non-through hole after the removal. ) Is mounted from both the front and back sides of the laminate.

Japanese Patent Laid-Open No. 2003-23258

  Front-and-back double-sided mounting technology is an important technology for high-density mounting, and in particular, a press-fit connector mounting method is important. The connector has a larger component outer size than that of a mounted component such as a chip component, various lead pitches, and a large number of leads. When a press-fit connector is mounted on a laminated board, many through-through holes are formed on the back surface thereof, so that it is difficult to mount other components on the back surface of the laminated board on which the connector is mounted. However, in order to reduce the size of the printed circuit board, it is necessary to effectively utilize the space on the back surface of the laminated board on which connectors having a large component size are mounted.

  In patent document 1, when the member which covers the non-through-hole through-hole opening part is a polyimide film, there exists a process removed by laser processing to the same magnitude | size as a through-hole diameter. Further, when the member is a heat-resistant resin film, there is a process of removing an excess part by an end mill and finally removing the film, and these processes are extremely complicated in any case.

  Furthermore, since the method disclosed in Patent Document 1 is a manufacturing method that removes all the film covering the opening of the non-through-through hole, the film is formed at the height of the opening of the non-through-through hole and the through-through hole. There is a large step due to the presence or absence of the thickness. In such a state, when press-fit connectors are press-fit into both non-through holes and through-holes, the press-fit connectors are not parallel, making it difficult to press-fit, and connector leads into non-through holes. There is a problem that reliability of connection is impaired, such as failure to reach. In addition, since the entire press-fit connector has a structure, the arrangement of the through-holes is long, and there is a limitation in high-density mounting. Thus, in the prior art, there is a problem that it is not easy to press-fit the press-fit connector into the through hole without impairing the reliability of connection.

  The present invention has been made in view of the above, and a board-mount structure of a press-fit connector capable of easily press-fitting a press-fit connector into a through hole without impairing reliability of connection, a board manufacturing method, And an electronic device.

  In order to solve the above-described problems and achieve the object, a board mounting structure of a press-fit connector according to the present invention is a board mounting structure for mounting a component having a lead portion on a multilayer substrate, and the component A first substrate having a first through hole for press-fitting, a second substrate forming the multilayer substrate by the first substrate, the first substrate and the second substrate, A surface of the multilayer substrate is covered with a low-fluidity resin, and a lead portion of the component is pressed into the low-fluidity resin to form the low-fluidity resin. The lead part of the component is press-fitted into the first through hole through a hole.

  The present invention also provides a board mounting structure for mounting a component having a lead portion on a multilayer substrate, the first through hole for press-fitting the component, and the first through hole opening. A first substrate whose portion is covered with a conductive member, a second substrate that forms the multilayer substrate with the first substrate, and an adhesive that bonds the first substrate and the second substrate together The multilayer substrate has a plating layer on the surface, and the press-fitted portion of the conductive member and the plating layer by the lead portion of the component is smaller than the diameter of the first through hole. A hole having a small diameter is formed, and the lead portion of the component is pushed into the conductive member and the plating layer, whereby the first through hole is formed through the hole formed in the conductive member and the plating layer. The lead part of the component is pressed It is the, characterized in that.

  The present invention also provides a method for manufacturing a substrate having a substrate mounting structure for the press-fit connector, and an electronic device having the structure.

  According to the present invention, it is possible to provide a board mounting structure of a press fit connector, a board manufacturing method, and an electronic device capable of easily press-fitting the press fit connector into a through hole without impairing reliability of connection. .

It is sectional drawing which shows the manufacturing process of the printed circuit board in this Embodiment (before low-fluidity resin sticking). It is sectional drawing which shows the manufacturing process of the printed circuit board in this Embodiment (after low-fluidity resin sticking). It is sectional drawing which shows the manufacturing process of the printed circuit board in this Embodiment (after upper and lower board | substrate adhesion | attachment by a low fluidity | liquidity prepreg). It is sectional drawing which shows the manufacturing process of the printed circuit board in this Embodiment (after an up-and-down board | substrate plating process). It is sectional drawing which shows the manufacturing process of the printed circuit board in this Embodiment (after pattern baking). It is sectional drawing which shows the manufacturing process of the printed circuit board in this Embodiment (after an etching). It is a figure which shows a mode that the lead | read | reed of a press fit connector is press-fitted in the printed circuit board in this Embodiment (before press-fitting). It is a figure which shows a mode that the lead | read | reed of a press fit connector is press-fitted in the printed circuit board in this Embodiment (after press-fitting). It is sectional drawing which shows an image when the press fit connector is mounted in the single side | surface of the printed circuit board in this Embodiment. It is sectional drawing which shows an image when a press fit connector is mounted in the front and back both surfaces of the printed circuit board in this Embodiment. In other embodiment, it is sectional drawing which shows a mode that a small diameter hole is drilled in a printed circuit board with a drill in the step before press-fit connector press-fitting. It is explanatory drawing of the connector press-fit method to a through hole without a hole. It is sectional drawing which shows the manufacturing process of the printed circuit board in other embodiment (before electroconductive paste sticking). It is sectional drawing which shows the manufacturing process of the printed circuit board in other embodiment (after electrically conductive paste sticking). It is sectional drawing which shows the manufacturing process of the printed circuit board in other embodiment (after upper and lower board | substrate adhesion | attachment by a low fluidity | liquidity prepreg). It is sectional drawing which shows the manufacturing process of the printed circuit board in other embodiment (after an up-and-down board plating process). It is sectional drawing which shows the manufacturing process of the printed circuit board in other embodiment (after pattern baking). It is sectional drawing which shows the manufacturing process of the printed circuit board in other embodiment (after an etching). In other embodiment, it is sectional drawing which shows a mode that a small diameter hole is drilled in a printed circuit board with a drill in the step before press-fit connector press-fitting. It is a figure which shows a mode that the lead | read | reed of a press fit connector is press-fit in the small diameter hole of the printed circuit board in other embodiment (after press-fit). It is sectional drawing which shows an image when the press fit connector is mounted in the single side | surface of the printed circuit board in other embodiment. It is sectional drawing which shows an image when the press fit connector is mounted in the front and back both surfaces of the printed circuit board in other embodiment. It is a perspective view which shows the component mounting form of the electronic device by this Embodiment. It is a press-fit connector press-fitting part perspective view of the electronic device by this Embodiment.

  As a first embodiment, referring to FIGS. 1A to 2D, a structure for mounting a press-fit connector on a printed circuit board having a non-through hole using the low-fluidity resin according to the present invention and a press-fit connector are mounted. A printed circuit board manufacturing method and an electronic apparatus having a printed circuit board on which a press-fit connector is mounted will be described.

  As shown in FIG. 1A, first, two substrates of an upper substrate 10A and a lower substrate 10B in a multilayer printed circuit board are prepared. A through-through hole 12 (for example, φ0.5 finished diameter with a φ0.55 drill) is formed in the upper substrate 10A, and outer layer patterns 11A and 14 and an outer layer pattern 11B of the lower substrate 10B are formed in the upper substrate 10A. In order to prevent damage due to friction or the like during press-fit connector press-fitting, plating 13 is applied to the through-through holes 12 formed in the upper substrate 10A. And, as shown in FIG. 1B, it has fluidity so that a solvent such as a plating solution or an etching solution for forming a through-through hole after adhering to the upper and lower substrates does not enter the through-through hole 12, and contains a glass cloth. Low flowable resin 15 (nominal thickness of 0.05 mm) is attached to the surface of the upper substrate 10A to cover the opening of the through-through hole 12. Thereafter, as shown in FIG. 1C, similarly to the low-fluidity resin 15, the upper substrate 10 </ b> A and the lower substrate 10 </ b> B are bonded using the low-fluidity prepreg 16 having fluidity that does not enter the through-through hole 12. Glue. Then, as shown in FIG. 1D, after bonding the upper substrate 10A and the lower substrate 10B, a through-through hole 17 penetrating both the upper substrate 10A and the lower substrate 10B is formed, and the entire multilayer printed circuit board is formed. A process of applying plating 18 is performed so as to cover the surface.

  Thereafter, as shown in FIG. 2A, the outer layer dry film is attached to the multilayer printed circuit board in which the upper substrate 10A and the lower substrate 10B are bonded, and the pattern is baked through the through-hole land portions 19A and the outer layer pattern 19B. . Then, as shown in FIG. 2B, the multilayer printed board is etched to form patterns of the through through hole 20 and the outer layer pattern 21. At this time, the surface of the upper substrate 10 </ b> A of the multilayer printed board is in a state in which only a step d <b> 1 generated between the low-fluidity resin 15 and the plating 18 remaining around the through-through hole 20 occurs.

  Then, as shown in FIG. 2C, by press-fitting the lead of the press-fit connector 24, a hole is made in the low fluidity resin 15 covering the opening of the non-through hole 22, and as shown in FIG. The press-fit connector 24 is press-fitted into the non-through-through hole 22 while expanding the hole. Here, as described above, the low-fluidity resin 15 uses a thin resin without glass cloth so that the lead of the press-fit connector 24 can be easily broken. It is possible and it is not necessary to make a hole beforehand.

  Here, a method for positioning the connector press-fitting position when there is no hole in the through-hole opening will be described with reference to FIG. A press-fit connector press-fitting device having an optical image recognition function is used for press-fitting the connector. As shown in FIG. 6, when the press-fit connector 70 is mounted on the substrate 74, the connector press-fitting position is determined by reading the center portion from the outer dimension of the target mark 72. After that, by accurately recognizing the tip of the connector lead 71 and the through hole 73 of the substrate, accurate positioning is performed and press-fitting is performed. Since the positions of the lead tip 71 and the through hole 73 are optically recognized and press-fitted and positioned as described above, when the lead 71 of the connector is press-fitted into the non-through-hole 22 of the multilayer printed board in the present embodiment. Even when there is no hole in the opening of the through hole 73, the positioning can be performed accurately and accurately.

  Thus, since the through-through hole is formed and the press-fit connector 24 is press-fitted after bonding the upper and lower substrates 10A and 10B, the press-fitting can be performed without performing a complicated process. Further, the through hole height between the non-through hole 22 and the through hole 20 is a difference in the plating thickness for the through hole 20, and for example, only a step of 0.05 mm or less occurs. Therefore, even if the connector connection method is to press-fit both the non-through-through hole 22 and the through-through hole 20 into the multilayer printed circuit board, the surface is slightly seen from the whole board on which these connectors are mounted. Only a small step is generated, and the connector can be mounted while maintaining parallelism. For example, even when one connector is connected to the non-through hole 22 and another connector is connected to the through hole 20, there is only a step corresponding to the plating thickness between them. . Therefore, the press-fit connector can be easily press-fitted into the through hole without impairing the reliability of connection.

  FIG. 3 is a cross-sectional view when a press-fit connector 24 is mounted on a multilayer printed board having a non-through hole produced by the manufacturing method described with reference to FIGS. 1A to 2D. As shown in FIG. 3, not only the outer layer pattern 21 but also various components other than the connector can be freely mounted on the back surface of the multilayer printed board (the front surface of the lower substrate 10B). For example, the present invention can be applied to any electronic device having a multilayer printed board on which such a press-fit connector 24 is mounted, such as a PC (Personal Computer) or a server device.

  As a second embodiment, a substrate mounting structure of a press-fit connector according to the present invention, a substrate manufacturing method, and an electronic device on which the press-fit connector is mounted will be described with reference to FIG. The manufacturing method of the multilayer printed board having the non-through-holes in the second embodiment is the same as the manufacturing method in the case of the first embodiment, but unlike the case shown in FIG. 1A, the upper substrate 30A and the lower substrate 30B. Through-holes are formed in each of the two substrates before bonding.

  As shown in FIG. 4, the positions of the respective through-holes formed at this time do not have to be on the same grid, can be handled according to the lead pitch of the connector to be used, and the press-fit positions are freely arranged. Is possible. After the upper substrate 30A and the lower substrate 30B are bonded using the low-fluidity prepreg 31, a through-through hole 32 is formed. Then, as in the case of the first embodiment 1, the low fluidity resins 35A and 35B covering the non-through-through holes 34A and 34B are punched by the pressure input of the leads of the press-fit connectors 33A and 33B, Press-fit while spreading.

  In this way, by forming through-through holes in both the upper and lower substrates 30A and 30B before bonding, press-fit connectors 33A and 33B with different lead pitches can be freely arranged on both the front and back surfaces of the multilayer printed board. Is possible. In addition, it is possible to drill out by a back drill into each of the through through hole and the non-through through hole in order to improve electrical characteristics.

  As a third embodiment, in a board mounting structure of a press fit connector according to the present invention, a board manufacturing method, and an electronic apparatus on which the press fit connector is mounted, the positioning of the connector is simplified and the press-fit position accuracy is improved. Therefore, a process of making a hole with a small diameter drill in the low fluidity resin covering the non-through hole will be described with reference to FIG. In the first embodiment, as shown in FIG. 2C, the low-fluidity resin 15 covering the non-penetrating through-hole is formed with a lead of the press-fit connector 24. However, in some cases, such as the strength of the multilayer printed circuit board is small, there is a case where it is necessary to press-fit the press-fit connector 24 with a smaller pressure input. Therefore, in the present embodiment, as shown in FIG. 5, before the press-fit connector 24 is press-fitted, an opening is made by drilling with a drill 23 having a diameter smaller than the actual through-hole diameter 22. . For example, with respect to the finished diameter of φ0.5 mm of the non-through hole 22, a drill diameter of φ0.3 mm is set in consideration of positional accuracy.

  Thus, by making a hole with the small diameter drill 23, the press-fit connector 24 can be press-fitted with a smaller pressure input, and the ease of press-fitting of the connector can be improved. Moreover, since a hole is drilled with a drill 23 having a diameter smaller than the diameter of the through hole 22, it is possible to ensure electrical connection without damaging the plating in the through hole. Here, not only the drill 23 but also the above-described small-diameter drilling may be performed by a pin-attached jig simulating an insect pin or a press-fit connector. Similarly to the case of the second embodiment shown in FIG. 4, through through holes are formed in both of the two substrates before bonding, and a hole is drilled with a small-diameter drill before connector press-fitting as described above. Thus, it is possible to mount press-fit connectors with different lead pitches on both the front and back surfaces of the multilayer printed board in a free arrangement.

  As a fourth embodiment, a substrate mounting structure of a press-fit connector according to the present invention, a substrate manufacturing method, and an electronic device on which the press-fit connector is mounted will be described with reference to FIGS. 7A to 8D. As shown in FIG. 7A, two substrates of an upper substrate 40A and a lower substrate 40B in a multilayer printed circuit board are prepared, and through through holes 42 are formed in the upper substrate 40A, and patterns 41A and 41B are formed on the outer layer surfaces of the respective substrates. Form. Thereafter, in FIG. 7B, a conductive paste 44 is printed on the opening of the through-hole 42 so that the through-hole forming plating solution or the etching solution after bonding the upper and lower substrates does not enter the through-hole. The opening is covered by curing the conductive paste 44 by heating or UV irradiation. Then, as shown in FIG. 7C, the upper substrate 40A and the lower substrate 40B are bonded using a low-fluidity prepreg 45 that does not enter the through hole 42. As shown in FIG. 46 is formed, and a process of applying plating 47-1 is performed.

  Thereafter, as shown in FIG. 8A, the outer layer dry film is stuck and exposed to light, thereby pattern-baking the through-hole land portion 48A and the outer layer pattern 48B. As shown in FIG. 8B, etching is performed to form a pattern of the through through hole 49 and the outer layer patterns 50A and 50B. Then, as shown in FIG. 8C, a hole is made in the conductive paste 44 and the copper plating 47 covering the opening of the non-through-hole 52 using a drill 51 having a diameter smaller than the through-hole diameter.

  Then, as shown in FIG. 8D, the lead of the press-fit connector 53 is fitted into the small-diameter hole and press-fitted into the non-through hole 52 so as to spread. The through hole height between the non-through hole 52 and the through hole 49 is the difference in the thickness (d2) of the conductive paste 44 around the hole covering the opening of the non-through hole 52. Only a few steps are generated. Therefore, even in the connector connection method in which both the non-through-through hole 52 and the through-through hole 49 are press-fitted into the multilayer printed board, the entire board on which these connectors are mounted is the same as in the first embodiment. In view of this, only a slight step is generated on the surface, and the connector can be mounted while maintaining the parallelism. For example, even when one connector is connected to the non-through hole 52 and another connector is connected to the through hole 49, there is only a step corresponding to the thickness of the conductive paste 44 between them. It does not occur. Therefore, the press-fit connector can be easily press-fitted into the through hole without impairing the reliability of connection.

  FIG. 9 is a cross-sectional view when a press-fit connector 53 is mounted on a multilayer printed board having a non-through hole formed by the manufacturing method described with reference to FIGS. 7A to 8D. As shown in FIG. 9, since the material covering the non-through hole is conductive paste and copper plating, it is possible to ensure electrical connection in the lead and the through hole when the lead of the connector is spread and press-fitted, Connection reliability can be improved. Further, not only the outer layer pattern 50B but also components other than the connector can be freely mounted on the back surface of the back surface of the multilayer printed board (the surface of the lower substrate 40B). As in the case of the first embodiment, the present invention can be applied to any electronic device having a multilayer printed board on which such a press-fit connector 53 is mounted, such as a PC (Personal Computer) or a server device.

  As a fifth embodiment, a board mounting structure of a press fit connector according to the present invention, a board manufacturing method, and an electronic device on which the press fit connector is mounted will be described with reference to FIG. The method of manufacturing the multilayer printed board having the non-through-hole in the fifth embodiment is the same as that of the fourth embodiment. However, unlike the case shown in FIG. 7A, the upper substrate 60A and the lower substrate 60B are bonded. Through-holes are formed in both of the previous two substrates.

  As shown in FIG. 10, the position of each through-hole formed at this time does not need to be on the same grid, can correspond to the lead pitch of the connector to be used, and the press-fitting position is freely arranged. Is possible. After the upper substrate 60 </ b> A and the lower substrate 60 </ b> B are bonded using the low fluidity prepreg 61, the through through hole 62 is formed. Then, a hole is made with a small diameter drill in the conductive paste and copper plating covering the non-through-through holes 64A and 64B, and press-fit connectors 63A and 63B are press-fitted.

  Thus, by forming through-through holes in both the upper and lower substrates 60A and 60B before bonding, the press-fit connectors 63A and 63B having different lead pitches can be freely arranged on both the front and back surfaces of the multilayer printed board. Is possible. In addition, it is possible to drill out by a back drill into each of the through through hole and the non-through through hole in order to improve electrical characteristics.

  By using the method as shown in each of the above-described embodiments, for example, as shown in FIG. 11, a backboard 80 having a multilayer printed circuit board is installed in the center, and modules such as a blade 81 and a switch are provided on both sides thereof. When the component 82 is mounted, as shown in FIG. 12, by arranging the blade connector 91 and the switch connector 92 so as to overlap each other, it is possible to realize double-sided mounting on the board surface of the connector. As a result, not only the printed circuit board but also the entire product can be downsized.

  As described above, according to each of the above-described embodiments, there is no complicated manufacturing process, and the level difference between the non-through hole and the through hole is suppressed to a minimum (for example, 0.05 mm or less) and easily press-fit. It is possible to press-fit the connector, and it is possible to improve the mounting density and the design flexibility associated therewith.

10A, 10B, 30A, 30B, 40A, 40B, 60A, 60B Laminated plate 11A, 11B, 41A, 41B SA outer layer pattern
12, 17, 20, 32, 42, 46, 49, 62 Through hole 13, 18, 47 Through hole plating 14A, 14B, 21, 50A, 50B Outer layer pattern 15, 35A, 35B Low fluidity resin 16, 31, 45 61 Low flow prepreg 19A, 19B, 48A, 48B Outer layer dry film 23, 51 Small diameter drill 22, 34A, 34B, 52, 64A, 64B Non-through hole 24, 33A, 33B, 53, 63A, 63B, 70 Press Fit connector 44 Conductive paste 71 Press-fit connector lead part 72 Press-fit connector press-fit target mark 73 Press-fit connector press-fit through hole 80, 90 Backboard 81, 93 Blade 82, 94 Module parts such as switch 91 For blade Less-fit connector press-fit position 92 switch module parts for press-fit connector press-fit position of such.

Claims (11)

A board mounting structure for mounting a component having a lead part on a multilayer board,
A first substrate having a first through hole for press-fitting the component;
A second substrate forming the multilayer substrate with the first substrate;
An adhesive layer that bonds the first substrate and the second substrate;
The surface of the multilayer substrate is covered with a low-fluidity resin, and the lead portion of the component is pushed into the low-fluidity resin so that the first through hole is inserted into the first through-hole. The lead part of the part is press-fitted,
A board mounting structure characterized by that. A plated layer is applied to a hole on the first substrate side of the multilayer through hole formed through the multilayer substrate, and the surface of the first substrate is formed of the low-fluidity resin and the plated layer. The step is caused only by
The board mounting structure according to claim 1, wherein: The second substrate has a second through hole for press-fitting the component,
The lead portion of the component is press-fitted into the first through hole or the second through hole through the hole portion formed in the low flow resin by pushing the lead portion of the component into the low flow resin. The
The substrate mounting structure according to claim 1 or 2, wherein A hole portion having a diameter smaller than the diameter of the first through hole or the second through hole is formed in the press-fitting portion of the low-fluidity resin by the lead portion of the component.
The board mounting structure according to claim 3, wherein: A board mounting structure for mounting a component having a lead part on a multilayer board,
A first substrate having a first through-hole for press-fitting the component, wherein the first through-hole opening is covered with a conductive member;
A second substrate forming the multilayer substrate with the first substrate;
An adhesive layer that bonds the first substrate and the second substrate;
The multilayer substrate has a plating layer on the surface, and a hole portion having a diameter smaller than the diameter of the first through hole is formed in the press-fitted portion of the conductive member and the plating layer by the lead portion of the component. When the lead part of the component is pushed into the conductive member and the plating layer, the lead part of the component is press-fitted into the first through hole through the hole formed in the conductive member and the plating layer. To be
A board mounting structure characterized by that. The plating layer is laminated on the conductive member, and a step is generated only between the conductive member and the vicinity of the hole and the surface of the first substrate other than the vicinity of the hole.
The board mounting structure according to claim 7, wherein: The second substrate has a second through hole for press-fitting the component,
When the lead portion of the component is pushed into the conductive member and the plating layer, the component passes through the hole formed in the conductive member and the plating layer and enters the first through hole or the second through hole. The lead part is press-fitted,
The board mounting structure according to claim 5 or 6, wherein A hole having a diameter smaller than the diameter of the first through hole or the second through hole is formed in the press-fitted portion of the conductive member and the plating layer by the lead portion of the component.
The board mounting structure according to claim 7, wherein:   An electronic device comprising a substrate having the substrate mounting structure according to claim 1. A board manufacturing method for manufacturing a board having a board mounting structure for mounting a component having a lead portion on a multilayer board,
Forming a first through hole in the first substrate for press-fitting the component;
Bonding the first substrate in which the first through-hole is formed and the second substrate forming the multilayer substrate by the first substrate to form the multilayer substrate;
Covering the surface of the multilayer substrate with a low-fluidity resin;
A substrate manufacturing method comprising: A board manufacturing method for manufacturing a board having a board mounting structure for mounting a component having a lead portion on a multilayer board,
Forming a first through hole in the first substrate for press-fitting the component;
Covering the conductive member over the opening of the first through hole;
Bonding the first substrate covered with the conductive member and the second substrate forming the multilayer substrate by the first substrate to form the multilayer substrate;
Applying a plating layer to the surface of the multilayer substrate;
Forming a hole having a diameter smaller than the diameter of the first through-hole in the opening of the first through-hole covered with the conductive member;
A substrate manufacturing method comprising:

Images