JP2012134397A - Optical device module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enhance reliability and productivity of an optical device module where an optical device element is mounted on a glass material.SOLUTION: A lightweight, thin and compact optical device module exhibiting excellent optical noise resistance against such as light entering from the back of a mounting substrate can be obtained by fitting at least a part of an optical device element in a recess having a shape larger than that of the optical device element and a depth larger than the thickness of the optical element. Consequently, preparation after mounting is not required substantially, and the manufacturing process can be simplified significantly.

Description

  The present invention relates to a structure of an optical device module in which an optical device element is mounted on a package.

  Conventionally, an optical device module having a structure in which a transparent member is directly attached is composed of an optical device element in which a plurality of protruding electrodes are formed around an effective light receiving region, and an optical glass plate on which an electrode pattern is formed. . Then, in the center of the electrode pattern forming surface of the optical glass plate, the peripheral region except the effective light receiving region of the optical device element is bonded via a bonding material, and one end of the electrode pattern is electrically connected to the protruding electrode. Yes. Note that a configuration in which the other end side of the wiring pattern is an external connection electrode is disclosed (for example, see Patent Document 1).

Japanese Patent Laid-Open No. Sho 63-242072

  However, in such a configuration of the conventional optical device module, the protruding electrode for joining one end of the electrode pattern of the optical glass plate and the electrode on the optical device element by the flip chip method is formed on the electrode on the optical device element. Is formed.

  For this reason, in the structure of the conventional optical device module, the through-opening is formed in the wiring board to which the optical device element is connected. When an optical device element is connected to this wiring board, wiring cannot be provided on the back surface of the wiring board, which hinders high density of the optical device module. Furthermore, the optical device element is still bonded to the wiring board, so that light enters from the back of the through-opening and impairs the optical characteristics, so that the inside of the through-opening is filled with a light-shielding resin from the back of the wiring board. However, it has a problem that the number of parts increases and the cost reduction is hindered.

  An object of the present invention is to solve such a conventional problem and to provide an optical device module which is excellent in manufacturing yield and optical characteristics, is lightweight, is thin and small.

  In order to solve the above-described conventional problems, an optical device of the present invention has an optical device element in which a light receiving region or a light emitting region and a protruding electrode are provided on an optical function surface, and a larger area than the optical device element. A transparent member on which an electrode electrically connected to the optical device element and an external connection electrode are formed, and the optical functional surface of the optical device element and the electrode forming surface of the transparent member The protruding electrode and the electrode are metal-bonded to each other and are electrically connected to each other.

  An optical device module of the present invention includes the optical device element and a transparent member that mounts the optical device element, and includes a mounting substrate that stores the optical device element. A recess having a shape larger than that of the optical device element for accommodating the optical device element and having a depth larger than the thickness of the optical element, a first substrate terminal disposed around the recess, and the first Board wiring for electrically connecting the substrate terminal and the second substrate terminal at the bottom of the recess are provided on the highest surface of the recess and the lowest surface of the bottom of the recess, and the optical device is provided in the recess. At least a part of the element is accommodated, and the first substrate terminal and the second substrate terminal are disposed at positions facing the external connection electrodes and through the through electrode 35. Consisting configuration that is part connection electrode electrically joined.

  With such a configuration, it is possible to realize an optical device module that is lightweight, thin, small, and excellent in resistance to optical noise due to light incident from the back surface of the mounting substrate. As a result, almost no preparation after installation is required, and the manufacturing process can be greatly simplified.

  INDUSTRIAL APPLICABILITY The optical device module of the present invention has a great effect that an optical device module that is lightweight, thin, small, and excellent in optical characteristics and quality can be realized at low cost.

It is sectional drawing shown typically for demonstrating the optical device module concerning the 1st Embodiment of this invention. It is the top view shown typically for demonstrating the mounting board | substrate 3 which is a structural member of the optical device module concerning the 2nd Embodiment of this invention. It is sectional drawing shown typically for demonstrating the mounting board | substrate 3 which is a structural member of the optical device module concerning the 2nd Embodiment of this invention.

  The best mode for carrying out the present invention will be described below with reference to the drawings. In the embodiment, a so-called optical device or optical device module will be described. An optical device or an optical device module is a light receiving electronic component including an illuminance sensor or a light emitting electronic component including an LED.

  In these drawings, the thickness, length, etc. of each constituent member are drawn differently from the actual thickness, length, etc. in the drawing. In addition, the number of electrodes and terminals of each component is different from the actual number and is easy to show. Furthermore, the material of each constituent member is not limited to the material described below.

(First embodiment)
FIG. 1 is a cross-sectional view of an optical device module 100 according to an embodiment of the present invention. The optical device module 100 according to the present embodiment includes an optical device element 2 and a transparent substrate 1 for mounting the optical device element, and includes a mounting substrate 3 for storing the optical device element 2. The mounting substrate has a recess 4 having a shape larger than that of the optical device element and a depth greater than the thickness of the optical device element, a first substrate terminal 31 disposed around the recess 4, and the first A substrate wiring 32 for electrically connecting one substrate terminal and the second substrate terminal 33 provided at the bottom of the recess 4 is provided on the highest surface of the recess 4 and the lowest surface of the bottom of the recess 4. At least a part of the optical device element is accommodated in the recess. An external connection electrode 34 is disposed on the surface opposite to the surface on which the first substrate terminal 31 and the second substrate terminal 33 are disposed. The first substrate terminal 31 and the external connection terminal 34, and the second substrate terminal 32 and the external connection terminal 34 are electrically connected through the through electrode 35.

  A plurality of through electrodes 35 are formed on the mounting substrate 3. In addition, the first substrate terminal 31 existing at one end of the through electrode 35 formed around the recess 4 is a position corresponding to the connection electrode 11 provided on the transparent member 1 of the optical device module 100. Is arranged. The substrate wiring 32 that electrically connects the first substrate terminal 31 and the second substrate terminal 33 provided at the bottom of the recess 4 is formed by applying a nano metal paste by inkjet. Further, the substrate wiring 32 may be formed by sputtering or vapor deposition.

  The mounting substrate 3 may be made of any material selected from, for example, glass epoxy resin, aramid nonwoven fabric, polyimide resin, various ceramics, glass, and a metal plate having an insulating coating on the surface.

  The optical device module 100 of the present embodiment can be manufactured as follows. In other words, the optical device element reaches a position where the connection electrode 11 of the optical device module 100 contacts the first substrate terminal 31 formed on the mounting substrate 3 in the recess 4 on one surface of the base material constituting the mounting substrate 3. 2 is inserted. In this state, the connection electrode 11 of the transparent member 1 and the first substrate terminal 31 of the mounting substrate 3 are aligned. And both are heated and pressurized to perform electrical bonding and mechanical bonding. The bonding between the two can also be performed by conductive adhesive (including anisotropy), solder and AuSn alloy connection, connection by nano silver paste, shrink connection by non-conductive adhesive, or anodic bonding.

  The transparent member 1 is soda glass, hard glass, quartz, alumina glass, epoxy resin, acrylic resin, polyimide resin, etc., and is transparent to at least visible light and is based on the mounting substrate 3. By using a material having the same level of linear expansion coefficient as that of the material, it is possible to manufacture a module that is strong against environmental tests.

  In addition, the connecting electrode 11 is obtained by applying a nano metal paste directly to the transparent member 1 but is formed by printing a conductive paste or by vapor deposition or plating, and is usually used as a wiring material for a circuit board or the like. If it is, it can be used without restriction. For example, a single component such as silver, copper, nickel, gold, chromium, or aluminum, or a laminated configuration thereof can be used.

  A semiconductor element (not shown) for controlling the illuminance sensor can also be mounted on the bottom of the recess 4. A manufacturing method will be described below. A semiconductor element for controlling the illuminance sensor is mounted in advance on a mounting substrate having a recess having a depth and a bottom area in consideration of the size of the semiconductor element for controlling the illuminance sensor. Thereafter, an illuminance sensor having a control function can be manufactured by electrically connecting to the transparent member 1 in the same manner as in the first embodiment.

(Second Embodiment)
FIG. 2 is a top view of the mounting substrate 3 which is a constituent member of the optical device module according to the embodiment of the present invention. FIG. 3 is a cross-sectional view of the mounting substrate 3 which is a constituent member of the optical device module according to the embodiment of the present invention. The mounting substrate 3 includes an inclined path 5 that is gentler than the recess inclination angle on at least one inner surface of the recess 4, and the highest portion of the inclined path 5 is the same height as the highest portion of the mounting substrate surface having the recess 4. And the lowest part of the said slope 5 is formed in the same height as the inner bottom part of the said recessed part. The substrate wiring that electrically connects the first substrate terminal disposed around the recess, the second substrate terminal disposed at the bottom of the recess, and the connection electrode of the transparent member is made of a nano metal. Wired with paste.

  In the optical device module, the first substrate terminal 31 disposed around the recess, the second substrate terminal 33 disposed at the bottom of the recess, and the connection electrode of the transparent member are electrically connected. By providing the inclined path 5 for wiring the substrate wiring to be connected by drawing the nano metal paste by inkjet, the substrate wiring 32 can be stably formed from the steep surface inside the concave portion 4.

  The highest portion of the ramp 5 is the same height as the highest portion of the mounting substrate surface having the recess 4, and the lowest portion of the ramp 5 is the same height as the inner bottom portion of the recess. By providing a horizontal portion that is not inclined on either one or both of the lowest portions, the accuracy of drawing the nano metal paste is improved by ink jetting, whereby a highly reliable terminal shape can be formed as a connection terminal.

  The mounting board 3 having the recess 4 formed by providing the ramp 5 is characterized, and other parts are the same as those of the first embodiment. About the material of the transparent base material 4 used for this transparent member 2, the same thing as the transparent base material 4 of 1st Embodiment can be used.

  The mounting substrate 3 may be made of any material selected from, for example, glass epoxy resin, aramid nonwoven fabric, polyimide resin, various ceramics, glass, and a metal plate having an insulating coating on the surface.

  In the above description of the embodiment, the manufacturing method in the case of one optical device module has been described. However, a plurality of optical device modules can be manufactured at a time. Explained below, the plurality of optical device elements 2 are bonded to the transparent member at a predetermined interval.

  Next, a plurality of the recesses 4 are formed on the mounting substrate at predetermined intervals. Next, the same electrical connection as in the first embodiment is performed so that at least a part of the optical device element is accommodated in each of the plurality of recesses. Next, a plurality of optical device modules are divided and manufactured using a cutting machine. With the above configuration, a lightweight, thin and small optical device module can be easily manufactured with a high yield.

DESCRIPTION OF SYMBOLS 1 Transparent member 11 Connection electrode 2 Optical device element 3 Mounting board 31 1st board terminal 32 Board wiring 33 2nd board terminal 34 External connection electrode 35 Through-electrode 4 Concave part 5 Ramp 100 Optical device module

Claims (6)

An optical device element in which the light receiving region and the protruding electrode or the light emitting region and the protruding electrode are provided on the optical function surface;
A transparent member having a larger area than the optical device element, and having a connection electrode and an electrode facing the optical functional surface and electrically connected to the protruding electrode by metal bonding;
An optical device module configured to store the optical device element and to be mounted electrically connected to the optical device element. The mounting substrate is
A recess for housing the optical device element;
A first substrate terminal disposed around the recess;
A second substrate terminal disposed at the bottom of the recess;
An external connection electrode disposed on a surface opposite to the surface on which the first substrate terminal and the second substrate terminal are disposed;
A board wiring for electrically connecting the first board terminal and the second board terminal;
The optical device module according to claim 1, wherein the first substrate terminal and the second substrate terminal are electrically connected to the external connection electrode through a through electrode.   The optical device module according to claim 2, wherein the substrate wiring is wired with a nano metal paste. The mounting board includes an inclined path having an angle smaller than the concave inclination angle on at least one of the inner side surfaces of the concave part,
The highest part of the slope is the same height as the highest part of the mounting substrate surface, and the lowest part of the slope is the same height as the inner bottom part of the recess. The optical device module described.   5. The optical device module according to claim 4, wherein the substrate wiring is formed by drawing a nano metal paste by ink jet on the slope.   The optical device module according to claim 4, wherein the highest part or the lowest part of the ramp has a horizontal part that is not inclined.

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