JP2012088339A - Elastomer particle having conductive surface, pressure sensor having the particle, method of manufacturing the sensor, and sensor system having the sensor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a sensor and a sensor system which are usable to measure pressure to a body part.SOLUTION: Elastomer particles (1 to 1'') each have a body part (2) of nonconductive elastomer having conductive surfaces (4a, 4b, and 6). Disclosed are pressure sensor elements (20 to 20'', 30 to 30''') having such elastomer particles and sensor clusters (50'' to 50, 70) including such sensor elements. Also, disclosed are pressure sensor elements (40 to 40). The pressure sensor elements include resistive elements (44 to 44'') which provide conduction paths, first electrodes (42a, 42a-1 to 42a-6) connected to the resistive elements, and second electrodes (42b, 42b') spaced apart from the first electrodes in a stationary state, and the second electrodes are arrayed to come into contact with the first electrodes or resistive elements when the pressure sensor elements are applied with pressure.

Description

  The present disclosure relates to pressure sensors and systems comprising such sensors. In particular, the present disclosure is directed to sensors and sensor systems that can be used to measure pressure on a body part.

  Accordingly, the present disclosure relates to particles that can form parts of a sensor element, a sensor system, a cluster of sensor elements, and a device that measures pressure on a body part.

(Conventional technology)
There are many applications where it may be desirable to measure pressure on a body part. As a non-limiting example, it may be desirable to measure pressure on a body part in connection with pressurization treatment of the body part. Pressurization therapy includes many, including deep vein thrombosis (DVT), vascular disorders, cardiovascular disorders, edema, heart disease (treated by counterpulsation), lymphedema, burns, wounds, and embolism It can be used for the treatment and / or prevention of illness, but is not limited thereto.

  Several devices for pressure treatment are disclosed in the art, for example, Patent Document 1, US Patent Application Publication No. 2004/0073146, Patent Document 2, Patent Document 3, Patent Document 4, Patent Document 5, Patent Document 6, It is known from Patent Document 7, Patent Document 8, Patent Document 9, and Patent Document 10.

  However, currently available systems for measuring pressure on body parts suffer from a number of drawbacks. The main problems with existing measurement systems are mechanical property mismatch (body / device impedance mismatch and resulting interface stress deformation), sensitivity (often too high), static impedance (often almost infinite Large), non-linearity, low repeatability (cycle-to-cycle, and insertion-to-insertion), creep, hysteresis, and bending, sensitivity to temperature, pressure and humidity.

  In general, existing sensors have very good accuracy (which is good) and work well in high pressures in the plane, mechanically separated spaces between well-characterized surfaces. Such spaces and surfaces are not available in the case of devices that measure pressure on body parts.

  U.S. Patent No. 6,057,031 discloses a variable resistance material comprising an elastomeric polyvinyl chloride body having a particulate filler selected from the group consisting of precipitated manganese dioxide and microphone carbon particles.

  Patent Document 12 discloses a variable resistance element that is gradually folded, for example, having an elastic cellular structure of an elastomer foam. Examples given include silicone rubber, natural rubber, latex, and urethane rubber. The device further comprises a conductive coating provided on the inside of the cell in the structure. Examples of coating materials are carbon (graphitized, partially graphitized, carbon black), silver, gold, copper, tungsten, aluminum, and other metals.

  Patent document 13 discloses a conductor sensitive to pressure and a method of manufacturing the conductor. The conductor comprises an insulating elastomer having conductive magnetic particles diffused within the insulating elastomer.

  U.S. Pat. No. 6,057,051 discloses a resistor sensitive to film pressure and a sensor sensitive to pressure. The film comprises conductive particles such as a binder, spherical elastomer particles, and carbon black. Examples of conductive particles include graphite, carbon black, tin oxide doped with indium, and the like. Examples of the elastic organic filler include a silicon polymer, an acrylic polymer, a styrene polymer, a urethane polymer, and the like. An example of a spherical elastomer particle comprises nylon particles. The binder can be silicon rubber, polyurethane resin, epoxy resin, phenol resin, or polyester resin.

  Patent document 15 comprises a conductive filler material selected from the group consisting of metallic elements and alloys in powder form mixed with non-conductive elastomers, conductive elements of such elements or alloys and mixtures thereof. A polymer composition is disclosed.

  The sensor described above is of the conductive elastomer type and constitutes a composite of an elastomer matrix and a filler of conductive particles. When such composites are actually used, strain-related damage easily occurs, and as such, creep, hysteresis and electrical aging are all significantly increased. At such high loading levels to derive a finite quiescent impedance, the viscoelastic properties of the composites are dramatically reduced and their usefulness as “pressure sensors” is greatly reduced.

  U.S. Patent No. 6,057,831 discloses a variable area type pressure sensor as prior art to the patented invention, in which a conduction path between first and second coplanar electrodes is on the sensor. Is variable in response to pressure applied to the. It will be appreciated that this type of sensor does not provide a smooth resistance versus load curve.

US Patent Application Publication No. 2004/0073146 US Patent Application Publication No. 2002/0173735 US Pat. No. 6,494,852 US Pat. No. 5,997,465 US Pat. No. 6,123,681 US Pat. No. 6,198,204 Specification EP 1324403 Specification US Patent Application Publication No. 2004/0167375 International Publication No. 2004/093763 Pamphlet US Patent Application Publication No. 2005/0043657 US Pat. No. 2,951,817 US Pat. No. 3,629,774 US Pat. No. 4,292,261 US Pat. No. 6,388,556 US Pat. No. 6,291,568

  Such sensors do not provide the desired accuracy required in measuring pressure on the body part.

  Accordingly, there is a need for improvement in sensors that measure pressure on body parts.

(Overview)
Accordingly, it is a general object of the present disclosure to provide a sensor or sensors that overcome or at least mitigate the problems associated with prior art sensors.

  It is an object to provide a sensor or sensors that are sufficiently accurate and sufficiently accurate to measure the pressure at the interface.

  It is also an object to provide a suitable sensor or sensors for measuring the pressure at a specific contact pressure applied to a human or animal body part.

  It is also an object to provide a sensor or sensors that can be manufactured at a sufficiently low cost.

  The invention is defined by the appended independent claims. Embodiments are set forth in the dependent claims and in the following description and drawings.

  According to a first aspect, there is provided an elastomer particle comprising a non-conductive elastomer body having a conductive surface. The conducting surface is organized so that the overall mechanical properties of the particles are controlled by the elastomeric body of the particles while the electrical properties are controlled by the conducting surface.

  Such elastomer particles may be suitable for use in a pressure sensor element, i.e. it is small enough and suitable for inclusion of a plurality of such elastomer particles in a matrix to provide a composite material. It is possible that its conduction characteristics are likely to change in response to mechanical deformation of the sensor element.

  Thus, such particles are utilized to form composite materials that have pressure sensitive electrical properties and reduced creep, hysteresis and / or electrical aging compared to prior art composite materials. Can be done.

  According to a second aspect, there is provided a pressure sensor element comprising a plurality of particles having at least a conductive surface, the particles being arranged as at least one particle layer on a non-conductive elastomer portion.

  Such a pressure sensor element can be used to form a composite of particles and matrix material at that location.

  As noted above, the particles can be elastomeric particles. Alternatively, the particles can be non-elastomeric.

  According to a third aspect, there is provided a composite material comprising particles having a first elastic modulus and a conductive surface and an elastomeric matrix material having a second elastic modulus, wherein the first elastic modulus is Unlike the second elastic modulus, the particles are elastomeric.

  Such composite materials can be used to form pressure sensor elements. In particular, such soft conducting particle composites better manage damage, electrical impedance and strain sensitivity within the composite by improving the interface between the conducting particles and the matrix, and stress within the matrix. Can be used for In addition, hysteresis and strain-related damage in the composite is reduced, and finite static impedance allows alignment, composition volume ratio and fabrication conditions (solvent during curing, pressure, temperature profile, etc.) Can be set during production. Also, pressure sensitivity can be determined primarily by the equivalent hardness and structure of sensors made from composites with respect to geometry, field orientation, electrode placement, and the like.

  According to a fourth aspect there is provided a printable compound for forming a composite material as described above, said compound comprising a composition or a plurality of compositions for forming said particle and matrix material. Prepare.

  Such printable compounds can be applied in a desired pattern to form part of a composite material according to the third aspect.

  According to a fifth aspect, a pressure sensor element comprising the composite material as described above is provided.

  According to a sixth aspect, a sensor system is provided, the sensor system comprising at least one sensor element as described above and means for receiving a sensor signal from the sensor element.

  According to a seventh aspect, a pressure sensor element is provided. The pressure sensor element includes a resistive element that provides a conduction path, a first electrode connected to the resistive element, and a second electrode spaced from the first electrode in a stationary state And the second electrode is arranged to contact the first electrode or the resistive element when the pressure sensor element is under pressure.

  Such sensor elements may have improved mechanical response, aging characteristics, dead zone to EMI, and the ability to be used for in-line calibration of a pressurized system. Such pressure sensor elements are used individually or in combination with a plurality of sensors or sensor clusters according to other aspects to provide accurate pressure values and / or for calibration purposes. Can be used.

  According to an eighth aspect, a sensor system is provided, the sensor system comprising at least one pressure sensor element as described above and means for receiving a sensor signal from the sensor element.

  According to a ninth aspect, a sensor cluster comprising at least three sensor elements is provided. The sensor cluster is connected in series with at least one sensor element or group of sensor elements connected in parallel with another sensor element or group of sensor elements, and at least connected in series with another sensor element or group of sensor elements. A sensor element or group of sensor elements. The cluster can be an organized set of small sensory elements and electrical traces.

  Such sensor clusters can be used to provide an average pressure value over a region based on multiple sensor elements without processing the values from each individual sensor element. The sensor cluster also provides a means of measuring pressure with a sensor that is thinner than a sensor of equivalent size in the prior art. It also provides a means of measuring the characteristics of the pressure applied over the entire cluster in a fast, simple and economical way. Clusters also reduce sensitivity to bending, thereby improving sensor performance on non-planar or non-uniform surfaces.

  Such a sensor cluster may also comprise sensor elements forming a circuit, the simplified equivalent circuit comprising substantially polygonal network elements.

  An order N polygonal network element is a network of N + 1 distinct nodes, one of which may be referred to as a “primary node” and N may be referred to as “subnodes”. Each subnode is connected to the main node by a circuit element and is connected to two other subnodes by the circuit element.

  “Substantially polygonal network element” is understood not to be in a range that greatly reduces the effectiveness of the polygonal network element, although circuit elements may be omitted or added from the complete polygonal network element. As a non-limiting example, one or several circuit elements may be omitted compared to a full polygon network element, or one or several circuit elements compared to a full polygon network element. Can be added.

  According to a tenth aspect, a sensor system is provided, the sensor system comprising at least one sensor cluster as described above and means for receiving a sensor signal from the sensor element.

  A sensor system according to the eleventh aspect is provided, the sensor system comprising: at least one first pressure sensor element according to either or both of the second or fifth aspects; At least one second pressure sensor element according to an aspect.

  Such a sensor system can be used to measure pressure on a body part.

  A device for measuring pressure on a body part according to the eleventh aspect is provided, the device comprising a sensor system as described above.

  A method for manufacturing a sensor element according to the twelfth aspect is provided. The method provides a substrate, dispensing a primer in a first desired pattern on the substrate, and dispensing particles having a conductive surface in at least the desired pattern. Is included.

  A method for manufacturing a sensor element according to the thirteenth aspect is provided. The method includes providing a substrate, dispensing the compound according to the fourth aspect in a desired pattern on the substrate, and solidifying the compound, thereby forming a composite material. Enabling.

  A method for manufacturing a sensor element according to the fourteenth aspect is provided. The method includes providing a first substrate, providing a resistive element on the substrate by a first patterning operation, and applying a first electrode on the substrate by a second patterning operation. Providing, a spacer element on the substrate, and a second substrate comprising the second electrode such that the spacer element is between the first electrode and the second electrode Providing.
  For example, the present invention provides the following items.
(Item 1)
Elastomer particles (1, 1 ′, 1 ″) comprising a non-conductive elastomer body (2) having a conductive surface (4a, 4b, 6).
(Item 2)
The elastomer particles according to item 1, wherein the conductive surface is provided as a conductive surface layer (6) on the elastomer body (2).
(Item 3)
3. Elastomeric particles according to item 2, wherein the conductive surface layer (4a, 4b, 6) at least partially, preferably completely covers the particles.
(Item 4)
4. The elastomer particle according to item 2 or item 3, further comprising a primer (3) applied between the elastomer main body (2) and the conductive surface layer (4a, 4b, 6).
(Item 5)
The said conductive surface layer (4a, 4b, 6) is an elastomer particle as described in any one of the items 2 to 4 provided with conductive particle (7a, 7b).
(Item 6)
6. Elastomeric particles according to item 5, wherein the conductive surface layer (4a, 4b, 6) comprises at least two layers (4a, 4b) of conductive particles (7a, 7b).
(Item 7)
Elastomeric particles according to item 5 or item 6, wherein the conductive particles (7a, 7b) are applied by self-assembly.
(Item 8)
Elastomer particles according to item 6 or item 7, further comprising a binder (5) for bonding the first layer (4a) of the layer of conductive particles to the second layer (4b) of the layer of conductive particles. .
(Item 9)
The elastomer particle according to any one of items 2 to 8, wherein the conductive surface layer is formed as a coating (6) on the elastomer body (2).
(Item 10)
The elastomer particles according to any one of Items 2 to 9, wherein the conductive surface layer (4a, 4b, 6) has a thickness of less than 100 nm.
(Item 11)
The elastomer particles according to any one of items 1 to 10, wherein the size of the elastomer particles (1, 1 ′, 1 ″) is 0.1 to 100 μm, preferably 1 to 10 μm.
(Item 12)
Item 12. The elastomeric particle of any one of Items 1 through 11, wherein the elastomeric particle has an elastic modulus (E1) of less than about 20 GPa, less than 15 GPa, less than 10 GPa, less than 5 GPa, or less than 4 GPa.
(Item 13)
The elastomer particles according to any one of items 1 to 12, wherein the elastomer particles have an elastic modulus (E1) of greater than 0.00001 GPa, greater than 0.0001 GPa, greater than 0.001 GPa, or greater than 0.01 GPa. particle.
(Item 14)
A pressure sensor element (20, 20 ', 20'') comprising a plurality of particles (1, 1 ′, 1 ″, 7a, 7b) having at least a conductive surface, wherein the particles are non-conductive elastomeric parts Pressure sensor elements arranged as at least one particle layer on (23, 23 ′, 23 ″).
(Item 15)
Item 15. The pressure sensor element according to item 14, wherein the primer layer (3) is arranged between the non-conductive elastomer part (23, 23 ', 23 ") and the particle layer.
(Item 16)
The particles (1, 1 ′, 1 ″, 7a, 7b) are arranged as a first sublayer and a second sublayer, and a binder (5) is between the first sublayer and the second sublayer. Item 16. The pressure sensor element according to Item 14 or Item 15, which is arranged in (1).
(Item 17)
Item 17. The pressure sensor element according to any one of items 14 to 16, wherein a second non-conductive elastomer portion (25) is arranged on top of the particle layer.
(Item 18)
18. A pressure sensor element according to item 17, wherein the non-conductive elastomeric part (23, 23 ′, 23 ″, 25) presents a different elastic modulus.
(Item 19)
Any one of items 14-18, further comprising an insulating layer (26) arranged to substantially encapsulate the non-conductive elastomeric portion (23, 23 ', 23'', 25). The pressure sensor element according to item.
(Item 20)
The pressure sensor element according to any one of items 14 to 19, wherein the particles (1, 1 ′, 1 ″) are described in any one of items 1 to 13.
(Item 21)
21. The pressure sensor element according to any one of items 14 to 20, wherein the particles (7a, 7b) are substantially non-elastomeric.
(Item 22)
A composite material (10) comprising:
Particles having a first elastic modulus (E1) and a conductive surface (1, 1 ′, 1 ″);
An elastomeric matrix (11) material having a second elastic modulus (E2);
With
The first elastic modulus (E1) is different from the second elastic modulus (E2),
The particles (1, 1 ′, 1 ″) are elastomeric,
Composite material.
(Item 23)
23. A composite material according to item 22, wherein the particles are coated with a conductive material (6, 7a, 7b).
(Item 24)
23. A composite material according to item 22, wherein the surface portion (6) of the elastomeric body (2) of the particles is modified to be conductive.
(Item 25)
25. The composite material according to any one of items 22 to 24, wherein the first elastic modulus (E1) is less than about 30 GPa.
(Item 26)
26. The composite material according to any one of items 22 to 25, further comprising at least one of a binding agent and a blending agent.
(Item 27)
27. A composite material according to any one of items 22 to 26, wherein the particles (1, 1 ′, 1 ″) are substantially randomly dispersed within the matrix (11).
(Item 28)
28. A composite material according to any one of items 22 to 27, wherein the particles (1, 1 ′, 1 ″) are aligned.
(Item 29)
The composite material according to any one of Items 22 to 28, wherein the first elastic modulus (E1) is higher than the second elastic modulus (E2).
(Item 30)
30. The composite material according to any one of items 22 to 29, wherein the first elastic modulus (E1) is less than about 20 GPa, less than 15 GPa, less than 10 GPa, less than 5 GPa, or less than 4 GPa.
(Item 31)
31. The composite material according to any one of items 22 to 30, wherein the second elastic modulus (E2) is less than about 5 GPa, less than 4 GPa, less than 3 GPa, less than 1 GPa, or less than 0.1 GPa.
(Item 32)
32. The composite according to any one of items 22 to 31, wherein the first elastic modulus (E1) is greater than 0.00001 GPa, greater than 0.0001 GPa, greater than 0.001 GPa, or greater than 0.01 GPa. material.
(Item 33)
33. The composite according to any one of items 22 to 32, wherein the second elastic modulus (E2) is greater than 0.00001 GPa, greater than 0.0001 GPa, greater than 0.001 GPa, or greater than 0.01 GPa. material.
(Item 34)
34. The composite material according to any one of items 22 to 33, wherein a ratio (E1 / E2) between the first elastic modulus and the second elastic modulus is 1 or more or about 500,000 or less.
(Item 35)
35. The composite material according to item 34, wherein the ratio (E1 / E2) is more than 1, more than 2, more than 5, more than 10, more than 50, more than 100, more than 500, or more than 1000.
(Item 36)
36. The composite material according to item 34 or item 35, wherein the ratio (E1 / E2) is less than 100,000, less than 50,000, less than 10,000, less than 5000, less than 1000, or less than 500.
(Item 37)
The composite material according to any one of Items 22 to 28, wherein the second elastic modulus (E2) is higher than the first elastic modulus (E1).
(Item 38)
38. The composite material of item 37, wherein the second elastic modulus (E2) is less than about 20 GPa, less than 15 GPa, less than 10 GPa, less than 5 GPa, or less than 4 GPa.
(Item 39)
39. The composite material of item 37 or item 38, wherein the first elastic modulus (E1) is less than about 5 GPa, less than 4 GPa, less than 3 GPa, less than 1 GPa, or less than 0.1 GPa.
(Item 40)
40. The composite according to any one of items 37 to 39, wherein the second elastic modulus (E2) is greater than 0.00001 GPa, greater than 0.0001 GPa, greater than 0.001 GPa, or greater than 0.01 GPa. material.
(Item 41)
The composite according to any one of Items 37 to 40, wherein the first elastic modulus (E1) is greater than 0.00001 GPa, greater than 0.0001 GPa, greater than 0.001 GPa, or greater than 0.01 GPa. material.
(Item 42)
42. The composite material according to any one of items 37 to 41, wherein a ratio (E2 / E1) between the second elastic modulus and the first elastic modulus is 1 or more or about 500,000 or less.
(Item 43)
43. The composite material according to Item 42, wherein the ratio (E2 / E1) is more than 1, more than 2, more than 5, more than 10, more than 50, more than 100, more than 500, or more than 1000.
(Item 44)
44. The composite material according to item 42 or item 43, wherein the ratio (E2 / E1) is less than 100000, less than 50000, less than 10,000, less than 5000, less than 1000, or less than 500.
(Item 45)
45. A composite material according to any one of items 22 to 44, wherein the matrix (11) is foamed.
(Item 46)
A printable compound for forming a composite material (10) according to any one of items 22 to 45, wherein the particles (1, 1 ', 1'') and a matrix material ( A compound comprising a composition or a plurality of compositions for forming 11).
(Item 47)
A pressure sensor element (30, 30 ′, 30 ″, 30 ′ ″) comprising the composite material (33, 33 ′) according to any one of items 22 to 46.
(Item 48)
48. The pressure sensor element of item 47, further comprising a first electrode and a second electrode (32a, 32b) spaced apart from each other and in contact with the composite material (33, 33 ′).
(Item 49)
49. Pressure sensor element according to item 48, further comprising a substrate (31) on which the electrodes (32a, 32b) are arranged.
(Item 50)
50. A pressure sensor element according to item 49, wherein the electrodes (32a, 32b) are arranged substantially on the same plane on the substrate (31).
(Item 51)
51. Pressure according to any one of items 48 to 50, further comprising a non-conductive elastomer portion (35) extending between the first electrode and the second electrode (32a, 32b). Sensor element.
(Item 52)
52. Pressure sensor element according to item 51, wherein the non-conductive elastomer portion (35) presents a thickness that is greater than the thickness of at least one of the first electrode and the second electrode (32a, 32b). .
(Item 53)
53. The pressure sensor element according to any one of items 48 to 52, further comprising a third electrode (32c) in contact with the composite material (33, 33 ′).
(Item 54)
Item 53, wherein the third electrode (32c) is spaced apart from the first electrode and the second electrode (32a, 32b) in a direction perpendicular to the plane of the substrate (31). The pressure sensor element described.
(Item 55)
55. Pressure according to any one of items 47 to 54, further comprising an insulating layer (34, 34a, 34b) arranged to substantially encapsulate the composite material (33, 33 ′). Sensor element.
(Item 56)
56. A pressure sensor element according to any one of items 47 to 55, wherein the composite material is arranged in a recess (36) in the substrate (31).
(Item 57)
57. Pressure sensor element according to item 56, wherein the recess (36) is a through hole.
(Item 58)
58. Pressure sensor element according to item 56 or item 57, wherein the first electrode and the second electrode (32a, 32b) are positioned at the edge portion of the recess (36).
(Item 59)
59. Pressure sensor element according to any one of items 49 to 58, wherein the substrate (31) is substantially planar and flexible.
(Item 60)
Item 60. The pressure sensor element according to Item 59, wherein the substrate (31) is a polymer film, cloth or foam.
(Item 61)
Item 61. The pressure sensor element of item 59 or item 60, further comprising a first insulating coating (34a) provided on a first surface of the substrate (31) and at least partially encapsulating the composite material. .
(Item 62)
62. A pressure sensor element according to item 61, further comprising a second insulating coating (34b) provided on the second surface of the substrate (31) and at least partially encapsulating the composite material.
(Item 63)
63. At least one sensor element (30, 30 ′, 30 ″, 30 ′ ″) according to any one of items 47 to 62 and means for receiving a sensor signal from the sensor element (100 And a sensor system.
(Item 64)
Pressure sensor elements (40, 40 ′, 40 ″, 40 ′ ″, 40 ^IV , 40 ^V , 40 ^VI , 40 ^VII ) And
Resistive elements (44, 44 ′, 44 ″, 44 ′ ″, 44) that provide conduction paths ^IV 44a, 44b),
A first electrode (42a, 42a-1, 42a-2, 42a-3, 42a-4, 42a-5, 42a-6) connected to the resistive element;
A second electrode (42b, 42b ′) spaced from the first electrode in a stationary state;
With
The second electrode is arranged to contact the first electrode or the resistive element when the pressure sensor element is under pressure;
Pressure sensor element.
(Item 65)
The first electrode includes a plurality of first electrode elements (42a-1, 42a-2, 42a-3, 42a-4, 42a-5, and 42a-6), and the plurality of first electrodes Each of the elements is connected to the resistive element (44, 44 ′, 44 ″, 44 ′ ″, 44) at a respective position along the conduction path. ^IV 44a, 44b),
The second electrode (42b, 42b ′) is arranged to contact a number of the first electrode elements when the pressure sensor element receives pressure, the number indicating the pressure, 64. A pressure sensor element according to 64.
(Item 66)
A connection for an external network (43a, 43b, 43a ′, 43b ′, 43a ″, 43b ″, 43a ′ ″, 43b ′ ″) at each end portion of the conduction path; Item 66. The pressure sensor element according to Item 64 or Item 65.
(Item 67)
The first electrodes (42a, 42a-1, 42a-2, 42a-3, 42a-4, 42a-5, 42a-6) are connected to the resistive elements (44, 44 ′, 44 ″, 44 ′). '', 44 ^IV The pressure sensor element according to any one of Items 64 to 66, which has a lower resistance than the resistances of 44a, 44b).
(Item 68)
68. A pressure sensor element according to item 67, wherein the absolute value of the ratio between the overall resistance of the resistive element and the overall resistance of the first electrode is 10 or more.
(Item 69)
The second electrodes (42b, 42b ′) are connected to the resistive elements (44, 44 ′, 44 ″, 44 ′ ″, 44 ^IV 69. The pressure sensor element according to any one of Items 64 to 68, having a resistance lower than that of 44a, 44b).
(Item 70)
70. The pressure sensor element according to item 69, wherein an absolute value of a ratio between an overall resistance of the resistive element and an overall resistance of the second electrode is 10 or more.
(Item 71)
The first electrode and the second electrode (42a, 42a-1, 42a-2, 42a-3, 42a-4, 42a-5, 42a-6, 42b, 42b ′) are substantially responsive to pressure. Item 71. The pressure sensor element according to any one of items 64 to 70, wherein the pressure sensor device is made from a material having a non-conductive property.
(Item 72)
The first electrodes (42a, 42a-1, 42a-2, 42a-3, 42a-4, 42a-5, 42a-6) are arranged such that when the pressure sensor element receives the excited pressure, 72. The pressure sensor element according to any one of items 64 to 71, arranged in direct contact with the second electrode (42b, 42b ′).
(Item 73)
At least one of the first electrode and the second electrode (42a, 42a-1, 42a-2, 42a-3, 42a-4, 42a-5, 42a-6, 42b, 42b ′) 72. Pressure sensor element according to any one of items 64 to 71, wherein the wear protection layer (301) is provided at least in part.
(Item 74)
74. The pressure sensor element according to any one of items 64-73, further comprising a spacer element (45) that provides a space between the first electrode and the second electrode.
(Item 75)
The pressure sensor element according to any one of items 64 to 74, wherein the space is vented so that the air pressure in the space is equal to the ambient air pressure.
(Item 76)
The pressure sensor element according to any one of items 64 to 75, wherein the first electrode is provided on a first substrate (41).
(Item 77)
77. A pressure sensor element according to item 76, wherein the first substrate (41) is made of a flexible material.
(Item 78)
82. A pressure sensor element according to any one of items 64 to 77, wherein the second electrode is provided on a second substrate (47).
(Item 79)
79. Pressure sensor element according to item 78, wherein the second substrate (47) is made of a flexible material.
(Item 80)
80. A pressure sensor element according to any one of items 76 to 79, wherein the first substrate and the second substrate (41, 47) are substantially parallel to each other.
(Item 81)
The pressure sensor element according to any one of Items 65 to 80, wherein the plurality of first electrode elements (42a-1, 42a-2, 42a-3, 42a-4, 42a-5). 42a-6) have a first portion having a first spacing between the first electrode elements and a second spacing different from the first spacing between the first electrode elements. A pressure sensor element comprising a second part.
(Item 82)
The first electrode elements (42a-1, 42a-2, 42a-3, 42a-4, 42a-5, 42a-6) include at least a pair of separate electrode elements different from each other in length and / or width. The pressure sensor element according to any one of items 65 to 81, which is provided.
(Item 83)
And further comprising a second resistive element (44b) providing a second conduction path and a plurality of further first electrode elements, each of the plurality of further first electrode elements comprising the second conduction element. 83. The pressure sensor element according to any one of items 65 to 82, connected to the second resistive element at a respective position along the path.
(Item 84)
84. A pressure sensor element according to item 83, wherein the second resistive element is arranged on the same substrate as the first resistive element.
(Item 85)
The plurality of further first electrode elements includes a first portion having a first spacing between the second electrode elements and a first portion different from the first spacing between the further first electrode elements. 85. The pressure sensor element according to item 83 or item 84, comprising a second portion having two intervals.
(Item 86)
86. The pressure sensor according to any one of items 83 to 85, wherein the further first electrode comprises at least a pair of separate electrode elements that differ from each other in length and / or width.
(Item 87)
87. A pressure sensor element according to any one of items 64-86, wherein the resistive element (44 ', 44'') presents a varying cross section.
(Item 88)
88. A pressure sensor according to any one of items 64-87, wherein the resistive element extends along a substantially straight line (44, 44 ', 44'', 44a, 44b). element.
(Item 89)
The pressure sensor element according to any one of items 64 to 87, wherein the resistive element (44 ''') is bent.
(Item 90)
90. Pressure sensor element according to any one of items 64 to 89, further comprising an insulating layer (49a, 49b) arranged to encapsulate the sensor element.
(Item 91)
91. The pressure sensor element according to item 90, wherein the ratio between the thickness of the insulating layer and the thickness (S) of the sensor body is at least 10, at least 15, or at least 20.
(Item 92)
92. The pressure sensor element according to item 90 or item 91, wherein the characteristic length (L) of the pressure sensor element is substantially the same as the thickness (T) of the entire sensor element.
(Item 93)
The pressure sensor element according to any one of items 76 to 92, wherein the first substrate and / or the second substrate comprises a biaxially oriented film.
(Item 94)
The resistive elements (44, 44 ′, 44 ″, 44 ′ ″, 44 ^IV , 44a, 44b) according to any one of items 64 to 93, wherein the pressure sensor elements are arranged substantially outside the sensitive region (48).
(Item 95)
95. A sensor system comprising at least one pressure sensor element according to any one of items 64 to 94 and means (100) for receiving a sensor signal from the sensor element.
(Item 96)
Sensor cluster (50 ″, 50 ′ ″, 50) comprising at least three sensor elements (20, 20 ′, 20 ″, 30, 30 ′, 30 ″, 30 ′ ″, 53) ^IV , 50 ^V , 50 ^VI 70), wherein the sensor cluster is
At least one sensor element or group of sensor elements connected in parallel with another sensor element or group of sensor elements;
At least one sensor element or group of sensor elements connected in series with another sensor element or group of sensor elements;
Comprising a sensor cluster.
(Item 97)
97. The sensor cluster of item 96, wherein the cluster comprises sensor elements forming a circuit, and the simplified equivalent circuit of the circuit comprises a substantially polygonal network element.
(Item 98)
98. A sensor cluster according to item 97, wherein the polygon network element presets a surface (F3) to be omitted.
(Item 99)
99. Sensor cluster according to item 97 or 98, wherein the polygonal network element presents a shared face (F3).
(Item 100)
The sensor cluster according to any one of items 97 to 99, wherein the polygonal network element presents a tapped surface (F2).
(Item 101)
101. The sensor cluster of any one of items 96 to 100, wherein the sensor cluster comprises at least one Wheatstone bridge.
(Item 102)
102. The sensor cluster according to any one of items 96-101, wherein the sensor cluster comprises at least one 2x2 grid.
(Item 103)
105. The sensor element according to any one of items 96 to 102, wherein the sensor element presents a substantially non-linear relationship between the impedance of the sensor element and a variable detected by the sensor being placed. Sensor cluster.
(Item 104)
114. The sensor cluster according to any one of items 96 to 103, wherein the sensor element (53) is according to any one of items 14 to 21 and / or items 47 to 62.
(Item 105)
The sensor cluster comprises a plurality of mutually isolated conductive regions (52, 52a, 52d), each of which is separated from each other by two, three or four body parts (53) of the composite material. 105. The sensor cluster of any one of items 96 to 104, arranged to contact a discrete region of the conductive region.
(Item 106)
The first connection (51a, 51b) for the external network is connected to the first region of the conduction region, and the second connection for the external network is connected to the second region of the conduction region. 106. The sensor cluster according to item 105, which is connected.
(Item 107)
110. The sensor cluster of item 106, wherein a third connection (51c, 51d) for an external network is connected to a third region of the conduction region.
(Item 108)
105. The sensor cluster according to any one of items 96-104, wherein the sensor cluster comprises two connections (51a, 51b) for external circuitry.
(Item 109)
The sensor cluster comprises first, second and third mutually separated conductive traces (52a, 52, 52b);
At least two mutually separated composite bodies (53) are connected in parallel between the first conductive trace and the second conductive trace (52a, 52);
105. Sensor cluster according to item 104, wherein at least one further composite body (53) is connected between the second and third conductive traces (52, 52b).
(Item 110)
The first connection (51a) for the external network is connected to the first conductive trace (52a), and the second connection (51b) for the external network is connected to the third conductive trace ( 52. The sensor cluster of item 109, connected to 52b).
(Item 111)
111. A sensor cluster according to item 109 or item 110, wherein a third connection (52c, 52d) for external circuitry is connected to the second conductive trace (52).
(Item 112)
112. The sensor cluster of any one of items 96-111, wherein the sensor cluster comprises only two connections to an external network.
(Item 113)
114. The sensor cluster according to any one of items 96 to 103, wherein the sensor element is in accordance with any one of items 64 to 94.
(Item 114)
120. At least one sensor cluster (50 ″, 50 ′ ″, 50) according to any one of items 96 to 113 ^IV , 50 ^V , 50 ^VI 70) and means (100) for receiving sensor signals from the sensor cluster.
(Item 115)
63. At least one first pressure sensor element (20, 20 ′, 20 ″, 30, 30 ′, 30 ″ according to any one of items 14 to 21 and / or items 47 to 62. , 30 ′ ″) and at least one second pressure sensor element (40, 40 ′, 40 ″, 40 ′ ″, 40) according to any one of items 64 to 94 ^IV , 40 ^V , 40 ^VI , 40 ^VII And a sensor system.
(Item 116)
The pressure sensor elements (20, 20 ′, 20 ″, 30, 30 ′, 30 ″, 30 ′ ″; 40, 40 ′, 40 ″, 40 ′ ″, 40 ^IV , 40 ^V , 40 ^VI , 40 ^VII 118. The sensor system of item 115, further comprising means (100) for receiving a sensor signal from).
(Item 117)
The first pressure sensor element (20, 20 ′, 20 ″, 30, 30 ′, 30 ″, 30 ′ ″) is any one of items 96 to 113 in combination with the item 104. Sensor clusters (50 ″, 50 ′ ″, 50 ^IV , 50 ^V , 50 ^VI , 70). The sensor system according to item 115 or item 116.
(Item 118)
The second pressure sensor elements (40, 40 ′, 40 ″, 40 ′ ″, 40 ^IV , 40 ^V , 40 ^VI , 40 ^VII ) Is a sensor cluster (50 ″, 50 ′ ″, 50) according to any one of items 96 to 113 in combination with item 113. ^IV , 50 ^V , 50 ^VI , 70). The sensor system according to any one of Items 115 to 117.
(Item 119)
119. A device for measuring a contact pressure applied on a body part, comprising the sensor system according to any one of items 115 to 118.
(Item 120)
120. The device of item 119, wherein the first pressure sensor element and the second pressure sensor element are enclosed in a common capsule (26, 34, 49a, 49b).
(Item 121)
A carrier member (61, 61 ′), and the first pressure sensor element (20, 20 ′, 20 ″, 30, 30 ′, 30 ″, 30 ′ ″) on the carrier member; , Second pressure sensor elements (40, 40 ′, 40 ″, 40 ′ ″, 40 ^IV , 40 ^V , 40 ^VI , 40 ^VII 120) The device according to item 119 or item 120, wherein:
(Item 122)
122. The device according to item 121, wherein at least one of the first pressure sensor element and the second pressure sensor element is formed directly on the carrier member (61, 61 ').
(Item 123)
123. A device according to item 121 or item 122, wherein the carrier member (61, 61 ') is sized and adapted to at least partially surround the body part (60).
(Item 124)
124. A device according to any one of items 121 to 123, wherein the carrier member (61, 61 ') is made from a flexible material.
(Item 125)
The plurality of the first pressure sensor elements or the second pressure sensor elements and / or the sensor clusters are any one of items 121 to 124 distributed in a two-dimensional region of the carrier member (61). The device according to item.
(Item 126)
The plurality of first pressure sensor elements and / or sensor clusters are any one of items 121 to 125 distributed along a substantially straight line (64) on the carrier member (61). The device according to item.
(Item 127)
Conductive means (66) for connecting the first pressure sensor element or the second pressure sensor element to an external network is integrated with the carrier member (61, 61 ′). The device according to any one of the above.
(Item 128)
128. A device according to any one of items 119 to 127, further comprising means (200) for pressure treatment of the body part.
(Item 129)
129. Item 128 in connection with any one of items 119-127, wherein the carrier member (61, 61 ') and the pressurizing means (20) are arranged as a layer of the device. Devices.
(Item 130)
128. The device of item 128, related to any one of items 119 to 127, wherein the carrier member (61, 61 ') is integrated with the pressurizing means.
(Item 131)
A method for manufacturing a pressure sensor element, comprising:
Providing a substrate;
Dispensing a primer in a first desired pattern on the substrate;
Dispensing particles having a conductive surface in at least the desired pattern;
Including the method.
(Item 132)
134. The method of item 131, further comprising dispensing a binder in a second desired pattern on the substrate and dispensing particles having the further conductive surface.
(Item 133)
134. The method of item 131 or item 132, wherein the particles having a conductive surface are described in any one of items 1 to 13.
(Item 134)
135. The method of item 131 or item 132, wherein the particles having a conductive surface are substantially non-elastomeric.
(Item 135)
135. The method of any one of items 131-134, further comprising providing a portion of a first elastomeric material on the substrate.
(Item 136)
140. The method of item 135, wherein the first elastomeric material is provided on the substrate prior to dispensing of the primer.
(Item 137)
139. A method according to any one of items 131-136, wherein a portion of the second elastomeric material is provided on the substrate.
(Item 138)
140. The method of item 137, wherein the second elastomeric material is provided after dispensing of the particles.
(Item 139)
139. The method of any one of items 131 to 138, further comprising patterning a conductor on the substrate for contacting the electrode.
(Item 140)
140. A method according to any one of items 131 to 139, further comprising encapsulating the pressure sensor element.
(Item 141)
A method for manufacturing a pressure sensor element, comprising:
Providing a substrate;
Dispensing the compound of item 46 in a desired pattern on the substrate;
Allowing the compound to harden, thereby forming the composite material;
Including the method.
(Item 142)
142. The method of item 141, further comprising providing at least one electrode in contact with the composite material.
(Item 143)
143. The method of item 142, wherein the electrode is provided on the substrate prior to dispensing of the compound.
(Item 144)
143. The method of item 142, wherein the electrode is provided on the substrate following dispensing of the compound.
(Item 145)
145. The method of any one of items 141-144, further comprising patterning a conductor on the substrate for contacting the electrode.
(Item 146)
146. The method of any one of items 141-145, further comprising providing a primer on the substrate prior to dispensing the compound.
(Item 147)
148. The method of any one of items 141 to 146, further comprising encapsulating the pressure sensor element.
(Item 148)
A method for manufacturing a pressure sensor element, comprising:
Providing a first substrate;
Providing a resistive element on the substrate by a first patterning operation;
Providing a first electrode on the substrate by a second patterning operation;
Providing a spacer element on the substrate;
Providing a second substrate comprising a second electrode such that the spacer element is between the first electrode and the second electrode;
Including the method.
(Item 149)
Providing a first electrode includes providing a plurality of first electrode elements, each of the first electrode elements at a position along a conductive path provided by the resistive element. 149. A method according to item 148, comprising providing in contact with.
(Item 150)
150. The method of item 148 or item 149, further comprising encapsulating the pressure sensor element.

1a-1b are schematic cross-sectional views of various embodiments of particles according to the present disclosure. Figures 2a-2b are schematic cross-sectional views of further embodiments of particles according to the present disclosure. FIG. 3 is a schematic diagram of a compound according to the present disclosure. FIG. 4 is a schematic cross-sectional view of a sensor element according to a first type of embodiment of the present disclosure. FIG. 5 is a schematic cross-sectional view of a sensor element according to a first type of embodiment of the present disclosure. 6a and 6b are schematic cross-sectional views of sensor elements according to a first type of embodiment of the present disclosure. FIG. 7 is a schematic cross-sectional view of a sensor element according to a first type of embodiment of the present disclosure. FIG. 8 is a schematic cross-sectional view of a sensor element according to a first type of embodiment of the present disclosure. FIG. 9 is a schematic cross-sectional view of a sensor element according to a first type of embodiment of the present disclosure. FIG. 10 is a schematic cross-sectional view of a sensor element according to a first type of embodiment of the present disclosure. FIGS. 11-14 are schematic views of layers forming part of a sensor element according to a second type of embodiment of the present disclosure. FIGS. 11-14 are schematic views of layers forming part of a sensor element according to a second type of embodiment of the present disclosure. FIGS. 11-14 are schematic views of layers forming part of a sensor element according to a second type of embodiment of the present disclosure. FIGS. 11-14 are schematic views of layers forming part of a sensor element according to a second type of embodiment of the present disclosure. 15 and 16 are cross-sectional views of the sensor element of FIGS. 15 and 16 are cross-sectional views of the sensor element of FIGS. 17 to 18 are diagrams illustrating the behavior of the sensor element of FIGS. 11 to 16. 17 to 18 are diagrams illustrating the behavior of the sensor element of FIGS. 11 to 16. Figures 19a-19b illustrate an alternative embodiment of the sensor element of Figures 11-16. FIG. 19c is not described. 20-22 illustrate still further embodiments of the sensor elements of FIGS. 11-16. 20-22 illustrate still further embodiments of the sensor elements of FIGS. 11-16. 20-22 illustrate still further embodiments of the sensor elements of FIGS. 11-16. 20-22 illustrate still further embodiments of the sensor elements of FIGS. 11-16. 20-22 illustrate still further embodiments of the sensor elements of FIGS. 11-16. Figures 23a-23b illustrate a general connection scheme for a pair of sensor elements. 24-26 illustrate connection schemes for multiple sensor elements. 24-26 illustrate connection schemes for multiple sensor elements. 24-26 illustrate connection schemes for multiple sensor elements. FIG. 27 is a diagram illustrating the behavior of the connection scheme of FIGS. Figures 28-33 illustrate equivalent circuits of further connection schemes. Figures 28-33 illustrate equivalent circuits of further connection schemes. Figures 28-33 illustrate equivalent circuits of further connection schemes. Figures 28-33 illustrate equivalent circuits of further connection schemes. Figures 28-33 illustrate equivalent circuits of further connection schemes. Figures 28-33 illustrate equivalent circuits of further connection schemes. 34-36 schematically illustrate a device for measuring pressure on a body part. 34-36 schematically illustrate a device for measuring pressure on a body part. 34-36 schematically illustrate a device for measuring pressure on a body part. FIG. 37 schematically illustrates sensor clusters that form parts of a sensor system.

(Description of Embodiment)
With reference to FIGS. 1 a-2 b, elastomeric particles 1, 1 ′, 1 ″ according to a first aspect will now be described. Such elastomer particles 1, 1 ′, 1 ″ comprise an elastomer body 2 and conductive surface layers 4 a, 4 b, 6. Conductive surface layers 4a, 4b, 6 may be a plurality of conductive particles 7a, 7b, deposition of conductive material 6 (eg, metal or conductive polymer), or change the conductive properties of the surface of elastomer body 2 (eg, And interpenetrating polymer networks with the conductive polymer composition). In the case of the conductive particles 7 a and 7 b, they can be attached to the elastomer body 2 by the primer 3. One or more additional conductive layers 4b are provided (as shown in FIGS. 1a and 2a) and can be preferably attached to the previous layer 4a by a binder 5.

  The size of the elastomer particles 1, 1 ′, 1 ″ may be in the range of 0.1 to 250 μm, more preferably in the range of 1 to 10 μm. The elastomeric particles can have a regular or irregular shape. By way of non-limiting example, the elastomer particles can be rod-shaped, elliptical, spherical, platelet-shaped, small-grained, fibrous, porous shell-shaped, scaffolding, and the like. The elastomer particles can be hollow or solid. In general, spherical elastomer particles can be made by emulsion or suspension polymerization. Other shapes can be produced by other breakdown processes such as, for example, cryogenic pulverization or grinding.

  Another method for producing such elastomer particles is via seed polymerization, which is described, for example, in JP 58-106554 and JP 63-191818. Yet another method of producing such elastomer particles is via emulsion polymerization with the additional condition of making larger, crosslinked elastomer particles, for example, US Pat. No. 6,914,100. , JP-A-63-191805, JP-A-4-323213, and JP-A-10-310603. The polymerization process can be of any type including radical, polyaddition, or polycondensation reactions.

  Elastomeric particles can be cross-linked to ensure proper mechanical properties. It is noted that the above references indicate the creation of particles that are cross-linked.

  In practical cases, it may be convenient to purchase elastomer particles having no conductive surface from various suppliers in wet or dry form. Examples include Dow Corning, Shin Etsu Chemical, and Rohm and Haas for small particles and several chemical suppliers for larger particles. Of course, it is also possible to purchase pellets that will be atomized or atomized. For example, commercially available thermoplastic elastomer pellets can be heated and spray dried to make smaller particles, or alternatively micronized at cryogenic temperatures to produce the same .

  The elastomer body 2 and / or the matrix 11 may include, as non-limiting examples, silicone elastomers, polyurethanes, polybutadienes (especially high cis polybutadiene), natural rubber, polyisoprene, ethylene propylene diene, heat, as discussed below. Plastic elastomers, split block copolymers, and the like can be provided. In particular, silicone elastomers have very good compression set, creep and temperature stability and can be formulated with very good fatigue properties, while polyurethanes and polybutadienes have very good mechanical properties (low Hysteresis, high elasticity, long fatigue life, etc.). Chain-extending PU elastomers with amide chain extenders are particularly useful and have very good mechanical properties of temperature / frequency stability.

Examples of suitable materials include van der Schuur, M, Noordover B, Gaymans RJ, 2006, “Polyurethane elastomers with a chain extenders of uniform.
length ", Polymer, 47: 1091-1100.

  There are also biocompatible materials with very good elasticity, such as elastin and resilin. Elvin CM, Carr AG, Huson MG, Maxwell JM, Pearson RD, Vuocolo T, Liyou NE, Wong DC, Merritt DJ, Dixon NE. 2005. “Synthesis and properties of cross linked recombinant pro-resiliin”, Nature. 437 (7061): 999-1002.

  In general, the elastomer body 2 and the matrix 11 can be made from the same family of elastomers having varying degrees of cross-linking or filler to achieve a change in hardness. An example of a system that is easy to use is Crosslink Technology Inc. Three component, variable mixing ratio polyurethane systems (disclosed in US 2006/0058456), or their CLC systems. Examples of the cured filler material include quartz, silica, mica, carbon black and the like. These materials are particularly suitable for use as fillers in silicon systems.

  For conductive layers 4a, 4b, 6, a range of materials can be used, including metal or metal oxide conductive species, carbon and its structures, conductive polymers, and the like. Combinations of these materials can also be used.

  If alignment is desired, the conductive layers 4a, 4b can comprise materials from the known paramagnetic, superparamagnetic, or ferromagnetic group.

  In one embodiment, the particles 1, 1 ′, 1 ″ produce a layer-by-layer self-assembly (LbL-SA) approach, or stronger interlayer coupling than LbL-SA. Can be constructed by a layer-by-layer covalent self-assembly (LbL-CSA) approach. In this case, the conductive material (eg, metal, metal oxide, semiconductive or organic) forming the conductive layers 4a, 4b is generally nanoparticles 7a, 7b, and useful examples include , Nanoparticles (including core shell particles) such as gold, silver, platinum, palladium, copper, nickel, aluminum, chromium. In particular, gold nanoparticles are easy to manufacture and can be stored in a stable arrangement prior to the deposition process.

  As an alternative, the conductive layers 4a, 4b, 6 can be provided by electroless plating. It is a well-known method in which a seed layer (catalyst) such as palladium is applied to the particles, and additional conductive material is deposited on the surface of the elastomer particles via metal salt reduction. Such methods are described in Mallory GO, Hajdu JB, “Electronic plating: Fundamentals and applications”, American Electroplaters and Surface Finishers Society, 19; In such cases, primer 3 can be applied prior to deposition of the conductive layer.

  The elastomer particles may expand somewhat during application of the conductive layers 4a, 4b, 6 regardless of what type of application technique is selected, so that when the elastomer particles are dried, the surface is microscopic. Presents a texture. Furthermore, the particles become more suitable for undergoing strain when their surface becomes wrinkled rather than smooth. This is because when it is smooth and too thick, the conductive layer can interfere with the mechanical properties of the particles and can also crack, thereby losing the conductive properties of the layer.

  As another option, the conducting polymer can be electrochemically deposited on the surface of the elastomer body 2. For example, a thin conductive polymer layer can be deposited using oxidation at that location to produce an essentially conductive layer on the elastomeric particles. Such techniques are described in US Pat. No. 5,240,644, US Pat. No. 6,899,829, Gregory RV, Kimbrell WC, Kuhn HH, Synthetic Metals, 28 (1989), pg 823, And Hansen TS, West K, Hassager O, Larsen NB, Synthetic Metals, 156 (2006), pg 1203.

  In the case of a layer produced with LbL-SA or LbL-CSA, the conductivity of the layer is tightly packed, arranged in layers on the surface of the elastomeric particles 1, 1 ′, 1 ″ with quantum tunneling. In combination with physical contact between the conductive nanoparticles 7a, 7b. This tight knit structure minimizes the impact on the mechanical properties of the elastomer particles 1, 1 ', 1 ". This arrangement also allows the elastomer particles to maintain surface conductivity even when the entire structure of the composite is distorted.

  The fluid environment in which the conductive particles 7a, 7b are built must be compatible with the elastomer particles so that they are not damaged during the assembly process, and an excessively laborious intermediate cleaning and / or drying step. It can be easily transferred from one layered environment to the next without it. As mentioned above, optimization of the fluid environment can cause advantageous expansion of the elastomer particles during the deposition of the conductive layer.

  LbL-CSA or LbL-SA can also be used to form a monolayer that becomes a seed layer on the elastomeric particles, after which additional conductive material is electrochemically deposited, for example, by electroless plating.

  Examples of methods for depositing conductive nanoparticles 7a, 7b on a surface by self-assembly include, for example, US Patent Application Publication No. 2005/0064204, US Patent No. 6,025,202, US Patent No. 6,624,886, US Pat. No. 6,242,264, US Pat. No. 6,458,327, US Pat. No. 6,592,945.

  As disclosed in U.S. Patent Application Publication No. 2005/0064204 and U.S. Patent No. 6,458,327, the process of creating a plurality of conductive layers on a surface is accomplished through repeated deposition steps. .

  Still other options for forming the conductive layers 4a, 4b, 6 include physical vapor deposition processes, variations of which are known, including vacuum evaporation, sputtering and chemical vapor deposition. Deposition via such a method is considered simple except that the elastomer particles may need to be mixed continuously to ensure proper coverage of the thin conductive material.

  The thickness of the conductive layers 4a, 4b, 6 should be as thin as possible so as not to increase the overall mechanical rigidity of the final particles. This is particularly important when using a method of forming a continuous layer on the elastomeric particles.

  Preferably, the thickness of the conductive layer can be less than 10% of the diameter of the elastomer particles. Further, the thickness can be less than 5%, less than 1%, or less than 0.1% of the diameter of the elastomer particles.

  In other words, the thickness may preferably be less than 500 nm, more preferably less than 100 nm or less than 50 nm.

  For sensor-type embodiments, the layers on the elastomer body 2 are collectively 0.1 to 100 kΩ / □ total static sheet resistance, more preferably 1 to 10 kΩ / □ sheet. Should have resistance.

  For electrical interconnection applications, the layer on the elastomer body 2 has a total static sheet resistance of less than 10 Ω / □, more preferably less than 1 Ω / □, most preferably 0.1 Ω / □. Should have less than.

  A primer 3 on the surface of the elastomer body 2 initiates a deposition process on the surface of the elastomer body, improves the bond between the elastomer body and the first conductive layer, and / or is completed into a matrix material. Selected to improve the binding of the formed particles. Primer 3 is generally selected from known organosilanes and organosiloxanes, with the examples provided below.

Organosilane compounds are compounds having alkyl and alkoxide groups in one molecule such as hexyltrimethoxysilane, octyltrimethoxysilane, chicopentiltrimethoxysilane and tichohexyltrimethoxysilane; one molecule such as vinyltrimethoxysilane Organosilane compounds having vinyl and alkoxide groups therein; (N, N-dimethylaminopropyl) trimethoxysilane, (N, N-diethylaminopropyl) trimethoxysilane, aminopropyltrimethoxysilane, N- (6-aminohexyl) N), N, N, organosilane compounds having amino and alkoxide groups in one molecule such as aminopropyltrimethoxysilane and (aminoethylaminomethyl) -phenethyltrimethoxysilane; A compound having an ammonium and alkoxide group in one molecule such as trimethylammoniopropyltrimethoxysilane; a heterocyclic aromatic compound ring and an alkoxide group in one molecule such as 2- (trimethoxysilylethyl) pyridine Organosilane compounds having; fluoroalkyl and alkoxide groups in one molecule such as (3,3,3-trifluoropropyl) trimethoxysilane and (decafluoro-1,1,2,2-tetrahydrooctyl) triethoxysilane An organosilane compound having a polyethylene glycol and an alkoxide group in one molecule such as N- (triethoxysilylpropyl) -O-polyethylene oxide-urethane; 3-thiocyanate ester propylt Organosilane compounds having thiocyanate and alkoxide groups in one molecule such as ethoxysilane; organosilane compounds having ether and alkoxide groups in one molecule such as 3-methoxypropyltrimethoxysilane; 3-mercaptopropyltri Organosilane compounds having thiol and alkoxide groups in one molecule such as methoxysilane; Organosilanes having halogen atoms and alkoxide groups in one molecule such as 3-iodopropyltrimethoxysilane and 3-bromopropyltrimethoxysilane Compound; Organosilane compound having epoxy and alkoxide groups in one molecule such as 5,5-epoxyhexyl-triethoxysilane; 2- [3- (triethoxysilyl) -propyl] An organosilane compound having a sulfide and an alkoxide group in one molecule such as tetrasulfide; an organosilane compound having a hydroxyl, amino and alkoxide group such as di (2-hydroxyethyl) -3-amino-propyltriethoxysilane; An organosilane compound having a group derived by hydrolysis of an amino group and an alkoxide group in one molecule, such as propylsilanetriol;
An organosilane compound having an alkyl group and a chlorine atom in one molecule, such as octyltrichlorosilane, cyclotetramethylenedichlorosilane, (cyclohexylmethyl) trichlorosilane, cyclohexyltrichlorosilane, and tert-butyltrichlorosilane; (decafluoro-1 , 1,2,2-tetrahydrooctyl) trichlorosilane and (3,3,3-trifluoropropyl) trichlorosilane, etc., organosilane compounds having a fluoroalkyl group and a chlorine atom in one molecule; 2- [2- (Trichlorosilyl) -ethyl] an organosilane compound having a heterocyclic aromatic ring and a chlorine atom in one molecule such as pyridine; and an aromatic ring and a chlorine atom in one molecule such as phenethyltrichlorosilane Including that organosilane compounds. For example, see US Patent Application Publication No. 2005/0064204.

  Organosiloxane compounds are generally methyltrimethoxysilane, vinyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-methacryloxypropyltrimethoxysilane, dimethyldimethoxysilane, trimethylmethoxysilane, trimethylethoxysilane, tetramethoxy. Silanes and alkoxysilanes such as tetraethoxysilane; silanol-endblock dimethylsiloxane oligomer, silanol-endblock dimethylsiloxane / methylvinylsiloxane co-oligomer, silanol-endblock methylvinylsiloxane oligomer, silanol-endblock methyl Phenylsiloxane oligomers, 1,3,5,7-tetramethylcyclotetrasiloxane, and 1,3,3 , 7,9-Pentamethylcyclopentasiloxane and other siloxane oligomers; trimethylsiloxy-endblock polydimethylsiloxane, trimethylsiloxy-endblock dimethylsiloxane / methylvinylsiloxane copolymer ranging from low viscosity liquid to gum , Trimethylsiloxy-endblock type dimethylsiloxane / methylphenylsiloxane copolymer, trimethylsiloxy-endblock type polymethylhydrogensiloxane, trimethylsiloxy-endblock type dimethylsiloxane / methylhydrogensiloxane copolymer, silanol-endblock type Polydimethylsiloxane, Silanol-endblock dimethylsiloxane / methylvinylsiloxane copolymer, Silanol-endblock dimethylsilane Xylene / methylphenylsiloxane copolymer, silanol-endblock polymethylhydrogen siloxane, silanol-endblock dimethylsiloxane / methylhydrogensiloxane copolymer, dimethylvinylsiloxy-endblock polydimethylsiloxane, dimethylvinylsiloxy Endblock dimethylsiloxane / methylvinylsiloxane copolymer, dimethylvinylsiloxy-endblock dimethylsiloxane / methylphenylsiloxane copolymer, dimethylhydrogensiloxy-endblock polymethylhydrogensiloxane, and dimethylhydrogensiloxy-endblock Polyorganosiloxanes including, but not limited to, type dimethylsiloxane / methylhydrogensiloxane copolymers; sub. 3SiO. sub. 1/2 and SiO. sub. Resin composed of 4/2 units, RSiO. sub. A silicone resin composed of 3/2 units; sub. 2SiO. sub. 2/2 and RSiO. sub. A resin composed of 3/2 units; sub. 2SiO. sub. 2/2, RSiO. sub. 3/2, and SiO. sub. Including silicon resin including but not limited to resin composed of 4/2 units. For example, see US Pat. No. 7,074,849.

  Additional organosilanes with functional groups include the following hydrolyzable groups including epoxy, amino, ketimino, vinyl, methacryloxy, acryloxy, mercapto, polysulfide, isocyanato, styryl, and chloro, methoxy, and ethoxy functional groups . For a similar list, see the Shin Etsu Chemical silane binding agent brochure.

  In practice, specific agents are generally selected based on literature references and simple adhesion tests. In general, the binding agent is selected such that the binding agent has an organic functional group that matches the reactivity of the polymer surface in question.

  Known examples include aminopropyltriethoxysilane or mercaptopropyltrimethoxy as disclosed in US 2005/0064204 or US Pat. No. 6,458,327 for glass substrates. Although containing silane (depending on the base material to be bonded), the groups can be selected for the appropriate elastomeric material in question.

  In particular, there are also exclusively commercially available primers available from companies such as Dow Corning, Shin Etsu Chemical, Nusil.

  The bind layer 5 is used to bond subsequently deposited conductive layers together. Examples of binders for LbL-SA include hydroxy groups, amino groups, carboxyl groups, carboxylic anhydride groups, mercapto groups, hydrosilicon groups, as described in US Patent Application Publication No. 2005/0064204. And materials containing two functional groups, such as combinations thereof, can be used. The selected material should have at least one functional group that can be covalently or non-covalently bound to the desired molecule, such as a nanoparticle or elastomer.

  Another name for these materials, including one or more amino groups, thiol groups, is a ligand, as disclosed in US Pat. No. 6,458,327, mercaptoalkylsilanes, aminoalkylsilanes, dithiols. Selected from the group comprising mercaptoalkanes, diaminoalkanes, hydroxyalkanes, carboxyalkanes, dihydroxyalkanes, and dicarboxyalkanes.

  As an example for polyurethane / gold nanocomposites, mercaptoethanol can be used as a binding agent.

  As an example for a polysiloxane / silver nanocomposite, polysiloxane may be used as a binder. In particular, poly (dimethyl-co.methylhydrido-co-3-cyanopropyl, methyl) siloxane. The same polysiloxanes used for the composite elastomeric material can be used directly (without primer) as a binder to reduce the overall number of materials in the composite.

  As an example for making a plurality of gold nanoparticle layers, 2-mercaptoethanol or 2-mercaptoethylamine may be used. See U.S. Patent Application Publication No. 2005/0064204.

  As disclosed in US Pat. No. 6,458,327, another example for making multiple layers of gold nanoparticles with dodecylamine stabilizing ligands is mercaptoalkylsilane, aminoalkyl Silanes, dimercaptoalkanes, diaminoalkanes, or polyfunctionalized polymers.

  Referring to FIGS. 4-6b, the above elastomeric particles having a conductive surface can be used to provide a pressure sensor element.

  FIG. 4 schematically illustrates a first embodiment of the pressure sensor element 20. The drawing is enlarged and the vertical direction V is greatly exaggerated. The measurement side is indicated by reference numeral 310. The sensor element 20 is based on a substrate 21, and a pair of electrodes 22a and 22b are arranged on the substrate. The electrodes can be coplanar, but need not be so. The electrodes 22a, 22b may be provided by patterning the conductive material on the substrate / first elastomer portion in any known manner. A first non-conductive elastomer portion 23 is arranged between the electrodes. The first elastomer portion 23 may cover the opposing edge portions of the electrodes 22a, 22b, and the first elastomer portion 23 may have a maximum thickness that is greater than that of the electrodes. The thickness of the first elastomeric portion 23 can become progressively thinner or otherwise decrease towards its edge.

  One or more conductive layers 24 may be arranged on the first elastomer portion 23. Such a conductive layer may comprise elastomer particles as described above, which are arranged in a matrix comprising a primer and / or binder as described above. The conductive layer 24 is in contact with the electrodes 22a and 22b. In particular, a primer 3 such as described above may be used between the first elastomer portion 23 and the first conductive layer 24, and the binder 5 such as described above may comprise a first conductive layer 4a and a further conductive layer 4b. Can be used between.

  In the second non-conductive elastomer portion 25, the conductive layer 24 is surrounded by the first elastomer portion 23 and the second elastomer portion 25, and only the edge portion of the conductive layer 24 is exposed to the electrodes 22a and 22b. As such, it can be arranged on top of the conductive layer 24. Another primer or binder may be used between the conductive layer 24 and the second elastomer portion 25. The elastomer parts 23, 25 may be formed from any of the materials described above with respect to the elastomer body 2.

  Sensor elements including elastomeric portions 23, 25, electrodes and conductive layer 24 may be enclosed within an insulating coating 26 that may be non-conductive. The insulating coating 26 can be made from an elastomeric material and can optionally be foamed.

  In one embodiment, the elastomeric portions 23, 25 are made from elastomeric materials having different elastic moduli. In another embodiment, the elastomeric portions 23, 25 are made from an elastomeric material having substantially the same elastic modulus.

  When the sensor element 20 receives pressure (typically pressurization in the vertical direction V), the relative position of the particles present in the conductive layer 24 changes, thereby measuring across the electrodes 22a, 22b. Change the impedance of the sensor element.

  The sensor element 20 can be made according to the following.

  A substrate 21 with electrodes 22a, 22b is prepared and possibly cleaned. Such a substrate can be, for example, a cloth or a polymer film. A primer can be applied to the surface on which the first elastomer layer 23 is deposited. A first elastomer layer 23 having a first hardness is deposited. A primer layer can then be deposited with a primer as described above. A conductive layer 24 is deposited to crosslink the electrodes 22a, 22b and extend out past the first elastomer 23. The binder layer 5 as described above can be arranged between the conductive layers 24. Another primer can be used to coat the conductive layer 24. A second elastomer layer 25 having a second hardness is deposited. The second elastomer layer 25 can also function as a mechanical insulating layer. Optionally, an insulating coating 26 is deposited and optionally foamed. This insulating coating 26 may also function as a stress filtering layer to smooth the contact stress applied to the sensor element in the vicinity of the first elastomer layer 24 and the second elastomer layer 25.

  FIG. 5 illustrates an alternative embodiment of the sensor element 20 ′, where a first elastomer 23 ′ is dispensed onto the substrate 21 prior to formation of the conductive layer 24 and the electrodes 22a ′, 22b ′. Is done. Conductive layer 24 and / or electrodes 22a ', 22b' can be dispensed, printed, jetted, and patterned on the substrate and first elastomer 23 ', for example.

  FIG. 6a illustrates another alternative embodiment of the sensor element 20 ", where a first elastomer 23" is molded onto the substrate. Subsequently, the conductive layer 24 is formed, and then the electrodes 22a "and 22b" are printed.

  With reference to FIG. 6b, details are illustrated on how the conductive layer 24 may be formed. In one embodiment, the conductive layer 24 comprises one or more layers of the elastomer particles 1, 1 ', 1 "described above with reference to Figures la-2b. Conductive layer 24 according to this embodiment can be generated by applying primer 3 in the desired pattern in which conductive layer 24 is formed. Thereafter, conductive particles 1, 1 ', 1 "are applied to form the first conductive layer 4a. A binder 5 can then be applied in the desired pattern, after which further conductive particles 1, 1 ', 1' 'can be applied to form the second conductive layer 4b. This method can be used to provide any conductive layer of the embodiment illustrated in FIGS. 4-6b.

  In another embodiment, the conductive layer 24 of FIGS. 4-6b may be formed by any of the methods described with respect to the conductive surfaces of the elastomer particles 1, 1 ', 1' 'of FIGS. La-2b. Accordingly, the conductive layer 24 can be formed using the primer 3 and / or the binder 5 as described with reference to FIGS. 1a-2b, thereby allowing one of the non-elastomeric conductive particles 7a, 7b or Two or more layers 4a, 4b are provided. The technique disclosed in US 2005/0064204 (A1) can be used to provide a conductive layer.

  Alternatively, it is noted that the conductive layer 24 may be formed by patterning the compounds that form the composite material described below, possibly after deposition of the primer.

  FIG. 3 schematically illustrates a composite material 10 comprising elastomer particles 1, 1 ′, 1 ″ and a matrix material 11 as described above.

  The elastomer particles 1, 1 ', 1 "described above can thus be used to provide a composite material 10, which can then be used to form a pressure sensor element. Such a composite material can be formed by mixing elastomeric particles with the matrix material 11, which can also be an elastomeric material.

  In practice, the matrix material can be substantially the same as the elastomeric body 2 of the particles, but has a different hardness or elastic modulus. Examples of suitable matrix materials are thus described above with respect to the elastomer particles 2.

  By using composites with soft elastomer particles 1, 1 ′, 1 ″, improving and managing the interface between the matrix and the stress in the matrix, strain-related damage in the composite It is possible to better manage the static electrical impedance and the distortion sensitivity of the electrical impedance.

  Thus, the composite material comprises soft particles 1, 1 ′, 1 ″ (actually an elastomer) of a first elastic modulus, the soft particles having their surface rendered conductive (as described above) and composite The second elastic modulus binder material (actually an elastomer) is mixed in the structure of the object. The composite material may also include binding agents, compatibilizing agents, other particulates, and the like to fine tune the final composite properties.

  The binding agent or compatibilizing agent can be selected from known organosilanes and organosiloxanes having the examples described above.

  Interfacial stress and strain-related damage can be minimized when the first elastic modulus and the second elastic modulus are selected to be substantially equal to each other. Such an arrangement produces a composite with low mechanical hysteresis and low impedance strain sensitivity, while further improving the cycle life of the composite and improving the linearity of the composite's strain-to-impedance relationship. To do.

  The finite quiescent impedance can be set during fabrication via alignment, composition volume ratio, and fabrication conditions (solvent during curing, pressure, temperature profile, etc.).

  Pressure sensitivity can be determined primarily by the equivalent elastic modulus, the strain versus impedance relationship of the composite, and the structure of the sensor (geometry, field orientation, electrode placement, etc.) made from the composite.

  Strain sensitivity can be increased in a controlled manner by changing the ratio between the first elastic modulus and the second elastic modulus.

  Soft elastomer particles 1, 1 ', 1 "can be randomly mixed with matrix-forming material (and other particles) or used in conjunction with selective alignment (see below).

  The alignment can be used to further influence the strain sensitivity of the composite's electrical impedance, as discussed further below.

  The mechanical properties of the overall system are mainly determined by the mechanical properties of the components of the composition (particles, matrix, and the difference between them), the mixing ratio, the alignment configuration, and the bond between the particles and the matrix. Related to strength.

  The pressure sensitivity of the electrical impedance is then a function of the strain sensitivity and the mechanical properties of the composite.

  A mixture or compound 10 (see FIG. 3) comprising elastomeric particles 1, 1 ′, 1 ″ and matrix-forming material 11 may be provided. The compound can be in the form of a paste. The matrix-forming material may be able to cure or harden into any of the materials described above, as appropriate for elastomer body 2 or matrix 11 or similar / equivalent materials. Such compounds can be printed or deposited, for example, to provide a sensor element as illustrated in FIGS. 4-10, and can then be cured or hardened. Curing can be easily performed in any manner known to those skilled in the art, such as by effects such as radiation.

  In composites generally arranged by randomly dispersed soft elastomer particles, the volume percentage of coated particles in the matrix for the randomly dispersed particle system is generally in the range of 10% to 75% by volume. is there. This is consistent with the volume percentage of prior art sensory materials.

  In the case of alignment, as will be described below, the required volume percentage of particles generally can be reduced by a factor of 10 to 100 times. This further helps the mechanical properties of the resulting composite. This is because the reduced amount of interface further reduces the mechanical hysteresis during use.

  With reference to FIGS. 7-10, the description will now focus on sensor elements using composite materials as described above.

  FIG. 7 schematically illustrates a first embodiment of the sensor element 30. There, a substrate 31 is provided with electrodes 32a, 32b. A conductive composite 33 as described above is then provided on the substrate and in contact with the electrodes. Optionally, an insulating coating 34, such as the insulating coating described with respect to FIGS. 4-6b, may be provided to encapsulate the sensor element 30.

  FIG. 8 schematically illustrates a second embodiment of the sensor element 30 '. The sensor element 30 'is provided with a second substrate 31a similar to that of FIG. 7, but having a third electrode 32c. The second substrate may be spaced from the first substrate and arranged “floatingly” within the composite material 33. The second substrate 31a with its associated electrodes can be produced in the same way as the first substrate 31. The third electrode 32c facilitates selective alignment within the composite material 33 during fabrication, increases the electrical impedance of the sensor element 30, and is more appropriate within the composite material 33 from which impedance measurements can be obtained. Providing a suitable area, selectively distributing applied stress across the composite material 33, providing a means for measuring the pressure gradient applied to the sensor element 30, or electrically sensing the sensor element 30 from the environment. Or can be used to protect.

  FIG. 9 schematically illustrates a third embodiment of the sensor element 30 ″. There, a non-conductive elastomer portion 35 is provided between the electrodes 32a and 32b in a manner similar to that of FIG. 4 or FIG. 5, for example, to reduce stress concentration around the edges of the electrodes. Reduce, control stress in the composite material 33 ′, isolate stress concentration and field concentration in the composite material 33 ′ during fabrication of the sensor element 30 ″, and / or selectively in the composite material 33 ′ Make alignment easy. The elastomer portion 35 may be further foamed to change the hardness and Poisson's ratio of this portion of the sensor element 30 ''. This further provides a means to control the pressure sensitivity of the sensor element 30 ''.

  Further, in FIG. 9, the portion of the composite material 33 ′ extending between the electrodes 32a, 32b further controls the sensitivity of the electrical impedance to the applied pressure of the composite material 33 ′ and the mechanical properties of the composite material 33 ′. It can be structured to be narrower, for example, in order to locally change the characteristic.

  In the embodiment of FIG. 9, a third electrode having a substrate as described with reference to FIG. 8 may be included.

  FIG. 10 schematically illustrates a fourth embodiment of the sensor element 30 ″ ″. The sensor elements 30 ″ ″ are arranged in the through holes 36 of the substrate 31. Such a substrate can be, for example, a cloth or a polymer film. The composite material 33 ″ may be arranged symmetrically with respect to the substrate 31. The electrodes 32a ', 32b' can be provided by wires embedded in or arranged on the substrate 31 or as conductive strands provided in the fabric. The electrodes 32a ', 32b' can also be provided by patterning a conductive material on the substrate in any known manner. In the latter case, the wire leading to the electrode can be provided with an insulating coating, which is removed to expose the conductive portion, thereby providing electrodes 32a ', 32b'. Such removal can be accomplished, for example, by etching, solvent, mechanical removal, and the like. This embodiment is particularly suitable for creating very thin sensor systems.

  In this embodiment, insulating coatings 34a, 34b may be provided on both sides of the substrate 31, such as to encapsulate sensor elements.

  In the embodiment of FIG. 10, a third electrode can be provided regardless of whether it has an associated substrate as described with respect to FIG.

  In the embodiment of FIGS. 7-10, the composite material can optionally be foamed in a manner known per se.

  The manufacturing process for providing the sensor elements of FIGS. 7-10 includes providing a suitable substrate material, providing electrodes on the substrate, for example by a patterning process, (elastomer particles and matrix material). Depositing the mixture forming the composite material (optionally) and optionally providing field application fixtures to provide the necessary fields (AC, DC, ramp up, hold, ramp down) for alignment In the curing process, curing the matrix material (eg, by applying UV light, heating, etc.), removing any alignment fields, optionally curing the matrix material later, Removing any remaining alignment fields if not removed early. . Optionally, a conductive bridge between the sensor and external electronics can be provided, for example, by printing, lithographic patterning, and the like.

  It will be appreciated that there are many electrode and magnet arrangements for alignment and mechanical layout that can be optimized for this type of sensor.

  It is noted that for the embodiments described with reference to FIGS. 4-10, the electrode can be a conductive compound, a metal, or a conductive organic material. Application methods include PVD, CVD, electrochemical methods, ink jet methods, printing, etc., followed by any necessary sintering or drying steps.

  The substrate material that provides the substrate of the embodiments disclosed with reference to FIGS. 4-10 is a film (preferably a biaxially oriented polymer film comprising polyethylene terephthalate, polyethylene naphthalate, In addition, polymer films including polycarbonate, polyamide, polyimide, nylon, polyethersulfone, aromatic fluorine-containing polyarylate, etc.), cloth (both woven and non-woven), felt, perforated film and foam (PU foam) Etc.).

  As described above, in the embodiment illustrated with reference to FIGS. 4-10, it is possible to selectively align the composite elastomeric particles between the electrodes during fabrication, and that Often desirable. The motivation to do so includes reducing the volume content of particulates within the conductive elastomer composite. This process can improve two important aspects of sensor characteristics. It improves (i) the hysteresis due to the presence of fewer interfaces that form stress concentrations throughout the composite, and (ii) the elastomer particles are localized only to the area of the sensor where they are needed Is that it can be done. In addition, the alignment allows the monitoring and control of the sensor's quiescent impedance during fabrication and aging (after fabrication), thereby increasing yield and tighter control of the final characteristics of the sensor. .

  In the same respect, alignment may allow individual sensors within a cluster or garment to be adjusted to be similar to each other within each final product. It can also provide flexibility in that some sensors in the garment are calibrated to work for various applications with different static impedances.

  For example, it may be possible to provide a composite in which all sensor elements are tuned to have a static impedance of 10 k ohms under test conditions suitable for the application.

  As another example, some sensor elements can be adjusted to move more like switches with high sensitivity (to determine clothing status, eg, clothes, undressing) while others ( Maintain low sensitivity (to make accurate measurements) during treatment.

  The alignment described above can be most easily performed using B-field, E-field, or a combination thereof during fabrication of the sensor element.

  Of course, to use the B field, the particles should have a reasonably high magnetic permeability so that the particles can move through the composite when applied with an external field.

  The E-field system works for any particle type. If a continuous chain of particles is formed between the electrodes, it may be desirable that an AC field be used and the applied frequency be sufficiently high so that the field does not break down. Field collapse is generally not good. This is because it prevents surrounding particles from forming chains within the sensor composite. That is, without control of the E-field decay, only a really very fragile single connection between the electrodes is obtained.

  For E-field systems, it is also possible to use a soft barrier layer around the elastomer particles, thereby making the breakdown effect less dramatic. That is, as the particles are chained together, the impedance drops more gradually, so field breakdown does not occur suddenly, as can occur with a fully conducting filler. Such a barrier layer can be formed by a primer layer applied to the outer surface of the particles prior to mixing the particles with the matrix. For some matrix material and conductive layer combinations, such barrier layers are naturally formed, such as in the case of silicon matrix and nickel conductive layers.

  For both types of fields it is possible to stir in place using a rotating field. This can be useful for slowly guiding the particles into position without creating a strong single chain, and is generally more than just a situation where one field element is applied between the required electrodes. Resulting in the formation of more particles along the desired path.

  Although the electrodes that provide the field can be the sensor electrodes themselves, they can also be separate electrodes provided in a manufacturing fixture or mold.

  A combination of fields can be useful. This is because the presence of one field can significantly reduce the requirements for the other field. For example, a permanent magnet may establish a B field near the sensor element electrode, thereby causing particles to begin moving toward the electrode due to the presence of the B field. The E-field applied to the electrode can then be used to finish the alignment process with a much lower voltage requirement, eg, dropping the voltage requirement by a factor of 10-100 times.

  Passive structures can also be printed on the sensor to guide particle tracing and further assist in the alignment process. For example, a printed elastomeric layer between electrodes having different hardnesses from a blend of conductive elastomers so that when the E-field is applied to the electrode, the particles are aligned primarily from the center of the electrode rather than the edge. Can be printed. This prevents juxtaposition of field concentrations between the test E field and the stress field in the sensor during operation, thus improving repeatability in the sensor element. An example of such an elastomer is shown in FIG.

  With reference to FIGS. 11-22, another type of sensor element 40 will now be described. This type of sensor element can be used by itself or in combination with the sensor elements 20, 30 described above.

Sensor elements 40, 40 ′, 40 ″, 40 ′ ″, 40 ^IV , 40 ^V , 40 ^VI , 40 ^VII, and related embodiments as described below, are: It is advantageous as a sensor element in that it has improved aging characteristics, EMI dead zones, and the ability to be used for in-line calibration of pressurization systems.

  This type of sensor can be most fundamentally characterized as an array of contact switches with switching levels defined by pressure.

  Referring to FIGS. 11 to 16, the sensor element 40 has patterned metal electrodes 43a, 43b, 42a-1, 42a-2, 42a-3, 42a-4, 42a-5, 42a-6. A first substrate 41, a spacer 45, and a second substrate 47 having a patterned metal electrode 42b, the first electrodes being separated from each other by a distance S, are electrode elements 42a-1, 42a. -2, 42a-3, 42a-4, 42a-5, 42a-6. The resistive element 44 that forms the conduction path includes the resistive elements 44 at different portions along the conduction path in which the electrode elements 42a-1, 42a-2, 42a-3, 42a-4, 42a-5, and 42a-6. Are arranged on the first substrate 41 so as to be in contact with each other. Connector electrodes 43a, 43b are provided and are generally spaced apart in spaced portions of the resistive element 44 at the end portion of the conduction path.

  The second substrate 47 is arranged substantially parallel to the first substrate 41 and is spaced from the first substrate 41 by spacers 45. On the 2nd board | substrate 47, the 2nd electrode 42b exists, the 2nd electrode 42b is arrange | positioned at intervals from the 1st electrode 42a, and faces the 1st electrode 42a. The second electrode 42b can be formed as a continuous sheet, the range of which is valid for the first electrodes 42a-1, 42a-2, 42a-3, 42a-4, 42a-5, 42a-6. Substantially match the entire range.

  The spacer 45 forms a cavity 48 between the first substrate 41 and the second substrate 47. This cavity can be vented to equalize the pressure inside and outside the sensor element.

  The cavity 48 need not be rectangular or circular in shape. The cavity 48 can be formed into many shapes including rectangular, circular, elliptical, dumbbell-like shapes, polygons, and slight variations thereof. Although a circle is useful for minimizing stress at the edge of the cavity 48, a rectangle is easily patterned by standard manufacturing processes.

  In one embodiment, the resistive elements are arranged outside or adjacent to the cavity. Thus, the resistive element need not be in contact with the movable part (s) of the electrode (s), reducing its wear and tear.

  When the sensor element 40 receives pressure, the first substrate 41 and the second substrate 47 are pushed toward each other, whereby the first electrodes 42a-1, 42a-2, 42a-3, 42a-. 4, 42 a-5, 42 a-6 and the second electrode 42 b are pushed again toward each other, whereby the first electrodes 42 a-1, 42 a-2, 42 a-3, 42 a-4, 42 a-5 42a-6 and a region of contact between the second electrode 42b. As more pressure is applied, the area of contact increases continuously. As the area of contact increases, more of the first electrode elements 42a-1, 42a-2, 42a-3, 42a-4, 42a-5, 42a-6 are "shorted out" by the second electrode 42b. , Thereby providing a shunt path that passes through the conduction path provided by resistive element 44. Accordingly, the impedance of the sensor element 40 decreases stepwise as a function of the applied pressure. This is illustrated in FIG. 17, which illustrates the behavior of an embodiment having a number of first electrode elements 42a-1, 42a-2, 42a-3, 42a-4, 42a-5, 42a-6. The numerous first electrode elements are in continuous contact with the second electrode 42b to short the resistive element 44 so as to reduce the overall impedance of the sensor 40.

  The elements of the first electrodes 42a-1, 42a-2, 42a-3, 42a-4, 42a-5, 42a-6 are patterned so that they are shorted at the appropriate pressure level. For example, for applications where the patient has received 10 mmHg ± 3 mmHg for a period of time followed by 50 mmHg ± 5 mmHg and the applied total pressure should not exceed 70 mmHg, the trace is shorted Can be arranged to occur at 7 mmHg, 13 mmHg, 45 mmHg, 55 mmHg, and 70 mmHg. As another alternative, the traces are arranged so that the short circuit occurs at 10 mmHg, 50 mmHg, and 70 mmHg.

  Accordingly, the discontinuity of the relationship between the pressure and the impedance of the pressure sensor element 40 is that of the first electrode elements 42a-1, 42a-2, 42a-3, 42a-4, 42a-5, 42a-6. The number, their size, relative position with respect to each other and within the cavity 48, the thickness of the spacer 45, the mechanical properties of the first substrate 41 and the second substrate 47, and the overall cavity 48. And can be determined by the dimensions. In embodiments having multiple first electrode elements, the sensor element 40 more closely approximates the analog relationship between the impedance of the conduction path and the applied pressure.

  Resistive element 44 may be formed as a patterned resistive trace (eg, by printing, vacuum evaporation, thermal transfer printing, etc.) or as an array of individual elements. This resistive element can be arranged outside the flexible part of the sensor element 40. Resistive element 44 can be most easily provided by printing with traditional resistive inks or pastes. The resistive element 44 is generally encapsulated or covered by the spacer layer 45 so that it is not subjected to significant pressure effects during typical operation, so that the resistance of the resistive element 44 is reduced during operation. There is no significant change. Hard and well-characterized inks and pastes can be used for the resistive element 44 to ensure that proper properties are maintained during use. Furthermore, due to the discontinuous nature of the pressure-impedance relationship for such sensors, a gentle change in the resistance of the resistive element 44 is easily achieved over the lifetime of the sensor element 40 without degrading performance. May be acceptable.

  The aspect in which the elements of the first electrodes 42a-1, 42a-2, 42a-3, 42a-4, 42a-5, 42a-6 are connected to the resistive element 44 is a series connection, a parallel connection, or any of them. It can be a combination of The greatest advantage of connectability is that it can be used to optimally shape the pressure-impedance relationship of the sensor element 40.

  Furthermore, if the resistive element 44 is made from several separate resistive elements, these resistive elements need not be equal to each other. For example, in the above case, the resistance change for a shunt at 7 mmHg can be significantly smaller than the resistance change at 13 mmHg to most clearly define the output resistance around the desired operating point. This can be useful when the device operates in a very bad electromagnetic environment.

The sensor elements 40, 40 ′, 40 ″, 40 ′ ″, 40 ^IV , 40 ^V , 40 ^VI , and 40 ^VII are structurally normal materials such as biaxially oriented films and pure materials. Made from a layer of metal, carbon or metal oxide that can be deposited thinly (no ink based on particulates etc. is needed). The spacer can be attached directly to the adjacent membrane, for example, by welding, without using pressure sensitive adhesives or other creep-prone materials. This means that creep and other undesirable mechanical effects are among the flexible components of the sensor elements 40, 40 ', 40 ", 40'", 40 ^IV , 40 ^V , 40 ^VI , 40 ^VII . Guaranteed to be minimized.

  The substrates 41, 47 may be in the form of a biaxially oriented film of engineering polymer. Biaxially oriented polymer films such as polyethylene terephthalate and polyethylene naphthalate and polymer films containing polycarbonate, polyamide, polyimide, nylon, polyethersulfone, and aromatic fluorine-containing polyarylate are mainly used. obtain. The thickness of the membrane is generally less than 25 microns, preferably less than 10 microns, and most preferably 2-5 microns.

  The electrodes 42a-1, 42a-2, 42a-3, 42a-4, 42a-5, 42a-6, 42b, 43a, 43b are formed on the substrates 41, 47 using physical or chemical vapor deposition techniques. It can be formed by patterning. Typical conductive materials for the electrodes can be silver, gold, copper, aluminum, titanium, chromium, nickel, and the like. Alternatively, the electrode can be provided by a conductive film and patterned using electroless plating, electrochemical deposition, LbL self-assembly, and other techniques known in the art. This can be advantageous if the electrode is at least partly composed of several layers. In order to improve adhesion to the substrates 41 and 47, the base layer can be a fusion layer of Cr, Ti, NiCr, etc., the second layer can be a highly conductive layer, and the upper layer can be a protective layer. possible.

  A thin overcoat layer 301 can be deposited to protect one or both electrodes from damage due to repeated contact during operation. One example of a suitable material for the overcoat layer is graphite and another is chromium or a chromium alloy. Such a top layer can be applied via PVD, CVD, electrochemical or self-assembly methods.

  The electrodes can preferably be patterned using lithographic techniques to ensure that smooth lines are patterned and finely spaced on the substrates 41, 47.

The performance of the sensor elements 40, 40 ′, 40 ″, 40 ′ ″, 40 ^IV , 40 ^V , 40 ^VI , 40 ^VII by maintaining the electrode thickness below 1 μm, more preferably below 500 nm. It is desirable that the effect of the mechanical properties of the electrodes on be minimized.

  Alternatively, if the electrode is placed on a substrate that bends little, a thin film type ink can be used to provide the electrode. Such films can be patterned using printing techniques such as inkjet, pad, and offset printing, among others.

  Nanoparticulate conductive ink can be utilized for this layer. In order to improve the mechanical strength of the ink, the conductive ink can be sintered after deposition. Low temperature sintering of nanoinks deposits conductors on films with high temperature resistance such as fluorene polyarylate, polycarbonate, polyethersulfone, polyimide or thermally stable biaxially oriented PET or PEN films Only appropriate when.

  Another suitable alternative that is known per se may be to apply an abrasion-resistant layer of LbL self-assembly to the electrode.

  The spacer 45 should be selected to present low creep and good bonding to the substrates 41, 47. For example, the spacer 45 can be a biaxially oriented film that is laminated with an adjacent substrate. Such lamination should be performed with the thinnest layer of adhesive possible (preferably a thermosetting adhesive). This is because the presence of adhesive can adversely affect creep. Many films are commercially available with a suitable adhesive surface layer.

  The spacer 45 can also be provided in the form of a patterned printed layer of curable epoxy resin, high performance polyurethane resin, or alternative, which can be further cured to form the spacer 45 as an adjacent substrate 41, 47 can be used both for bonding to each other. In this case, attention must be given to the creeping of the spacer 45 during use, and a reinforced resin system can be used to further improve the mechanical properties of the spacer 45.

  The spacer may include both an expansion of the cavity 48 (air reservoir) in the sensor and a vent 46 or a series of vents that equalize the pressure between the sensory element and the surrounding environment.

  The external connection to the sensor element 40 may be provided in the form of a printed silver trace or the like. Alternatively, it may be advantageous to use electrode patterning techniques everywhere, i.e. for both electrodes and external connections. The thickness of the trace away from the sensing area can be increased by masking the sensor area and using electrochemical techniques to add the conductor thickness to the trace from the sensor element to the electronics.

The open-reel technology is suitable for mass production of sensor elements 40, 40 ′, 40 ″, 40 ′ ″, 40 ^IV , 40 ^V , 40 ^VI , 40 ^VII .

Insulating material 49a, 49b can be provided, for example, in the form of a foamed polymer, which can generally be very soft due to small pores. The insulating material 49a, 49b is thin and smooth with the surrounding surface without interfering with the function of the sensor elements 40, 40 ′, 40 ″, 40 ′ ″, 40 ^IV , 40 ^V , 40 ^VI , 40 ^VII In order to provide a smooth interface, it should be significantly softer than the substrate material 41, 47.

  FIG. 18 illustrates the behavior of an embodiment in which the electrodes 42a-1, 42a-2, 42a-3, 42a-4, 42a-5, 42a-6, 42b are made from a low conductivity material, ie a resistive material. . Such resistive materials can be provided from, for example, nickel chromium, tantalum, tantalum nitride, chromium, titanium, silicon chromium, cermet, carbon. Such materials can be deposited by evaporation, sputtering, cvd, and the like.

  By using such materials for the electrodes, a range similar to the resistance of the resistive element 44 on the electrodes 42a-1, 42a-2, 42a-3, 42a-4, 42a-5, 42a-6, 42b. Sheet resistance can be produced.

  In addition, thin film inks can also be used. This is because they are significantly thin so as not to adversely affect the mechanical properties of the flexible substrates 41, 47 material. In general, ink loaded with silver fulfills this purpose. Other inks based on particles of the above materials can also be used to achieve a specific sheet resistance or improve the mechanical strength of the contact interface between the membranes. The equivalent sheet resistance of electrode 42b can also be adjusted by patterning the deposited electrode material.

  Furthermore, the sheet resistance can be modified using a thin film layered with nanoparticles such as can be produced using LbL-CSA or LbL-SA.

Figures 19a-19c illustrate an alternative embodiment of resistive element 44 and connectors 43a, 43b. Such an embodiment is useful for adjusting the pressure-to-impedance response of the sensor elements 40, 40 ′, 40 ″, 40 ′ ″, 40 ^IV , 40 ^V , 40 ^VI , 40 ^VII .

  In particular, those embodiments are useful for controlling the height of the various discontinuities shown in FIGS.

  In FIG. 19a, resistive element 44 is formed as a substantially rectangular elongated structure, while connectors 43a ', 43b' are arranged at respective ends of the resistive element.

  In FIG. 19b, the resistive element 44 'presents an elongated concave varying width and / or thickness, while connectors 43a', 43b 'are arranged at the respective ends of the resistive element. More generally, the resistive element 44 'is shaped in a continuous manner along the conduction path without having a discontinuity in width.

  In FIG. 19c, the resistive element 44 '' has a varying width and / or thickness including a wider end portion and a wider central portion (separated separately by each narrower middle portion). Presents Further, in general, the width of the resistive element 44 '' is adjusted along the conductive path in a stepped manner to adjust the height of the discontinuous step in the pressure-impedance response of the sensor element 40 '' '. Can be changed. This form of adjusting the resistive element 44 "is a simple way to adjust the sensor response to identify critical pressure transitions when used in harsh environments with significant EMI.

20a and 20b illustrate embodiments of electrode configurations. There, an increase in the contact area between the first electrodes 42a-1, 42a-2 and the second electrode 42b ′ causes a gradient of the pressure-impedance relationship of the sensor element 40 ^IV around the point P1. change. Such an embodiment may be provided by using a low conductivity electrode. The effect may be achieved by reducing the gap spacing between the two elements at several points along the first electrode elements 42a-1, 42a-2 and / or their lengths with varying widths. . This can be useful for increasing the sensitivity of the sensor to pressures within a certain range. This means that sensor elements 40, 40 ′, 40 ″, 40 ′ ″, 40 ^IV , at higher pressure levels where it is very important to stay below the maximum pressure limit while performing therapy. It may be particularly useful for adjusting the sensitivity of 40 ^V , 40 ^VI , 40 ^VII .

  FIG. 20b illustrates the behavior of such an embodiment. The slope of the pressure versus impedance curve is discontinuous at point P1.

Figures 21a-21b illustrate another embodiment of an electrode configuration. There, an increase in the contact area between the first electrode elements 42a-1, 42a-2, 42a-3 and the second electrode 42b '' also introduces discontinuities around the point P2. on the other hand, changing the slope of the pressure vs. impedance relationship of the sensor element 40 ^V at the periphery of the point P2. In this embodiment, the length of the elements 42a-1, 42a-2, 42a-3 does not extend over the entire sensor area. Then, by increasing the applied pressure, when the contact region between the first electrode 42a and the second electrode 42b expands, the element comes into contact more or less.

  This causes both changes in sensitivity similar to the example of FIGS. 20a-20b, but creates a discontinuity jump at point P2 of contact with the shorter element. This point can then be more easily used as a pressure calibration point for the sensory array.

FIG. 22a illustrates another embodiment of sensor element 40 ^VI . There, the resistive element 44 '''providing a conductive path is substantially circular and the first electrodes 42a-1, 42a-2, 42a-3, 42a-4, 42a-5, 42a. of -6,42a-7,42a-8 "fingers" is, in the radial direction from the resistive element, and extends substantially toward the center portion of the sensor element ^{40 VI.}

Connectors 43a '' and 43b '' are arranged at the respective ends of the resistive element 44 '''. The first electrode elements 42a-1, 42a-2, 42a-3, 42a-4, 42a-5, 42a-6, 42a-7, 42a-8 may present various lengths, and the spacer 45a , Can be provided as a ring around sensor element 40 ^VII . The second electrode 42b ′ is similar to the second electrode described with reference to FIGS. 11-16, and the first electrode elements 42a-1, 42a-2, 42a-3, 42a-4, 42a−. 5, 42a-6, 42a-7, 42a-8.

The sensor element 40 ^VI is advantageous in that its circular configuration allows for uniform stress in the spacer 45a, thereby providing the sensor element 40 ^VI with improved fatigue life.

FIG. 22b illustrates another embodiment of sensor element 40 ^VII comprising a pair of resistive elements 44a, 44b, each forming a respective conduction path. The resistive elements 44a, 44b have respective connectors 43a ′ ″, 43b ′ ″, which are also illustrated so that the resistive elements 44a, 44b are connected in parallel, as illustrated. Can be interconnected. A number of first electrode elements 42a are connected to the first resistive element 44a at respective positions along the conduction path of the first resistive element 44a. Similarly, a number of first electrode elements 42a are connected to the second resistive element 44b at respective positions along the conduction path of the second resistive element 44b. Thus, the first electrode element 42a extends from the respective resistive element 44a, 44b to the active area of the sensor, which can generally coincide with the cavity of the sensor element 40 ^VII . The cavity is defined by the patterned shape of the spacer 45a. In this example, the cavity is defined by a spacer 45a with a circular hole as shown in FIG. 22b.

  Special ventilation and air reservoirs are not shown in FIG. 22b, but can be added as described above.

  Although the first electrode elements of this embodiment may present various lengths to one another, it is not necessary to do so.

  This embodiment increases the maximum possible switch level available from the sensor without significantly increasing the size of the sensor. This embodiment also adds flexibility by optimizing the pressure vs. impedance response of the sensor element.

  In FIGS. 11-13, 16 and 22a-22b, a specific length L, a specific width W, and an overall sensor thickness T (including insulating layers 49a, 49b) are shown. Moreover, in FIG. 16, the thickness S of the sensor main body is shown.

  In general, the thickness R of the sensor body should be very small, preferably less than 50 μm, more preferably less than 25 μm or less than 20 μm. The total thickness T of the sensor is preferably less than 1.5 mm, more preferably less than 1 mm, more preferably less than 0.5 mm or less than 0.2 mm. The ratio between L and / or W and T can be about 1.

  Referring to FIGS. 4-10, the same ratio applies between the length / width and thickness of the sensory region, and between the thickness of the sensor body and the thickness of the insulating layer.

  It is a requirement that the electrode elements be arranged as lines in the array (as shown in FIGS. 11-14, 19a-19c, or 22b) or radial spokes (as shown in FIG. 22a) Absent. A useful sensor is achieved by providing a sensor element comprising a first electrode element having a rectangular, straight, elliptical, circular, spiral, or new shape as well as a slight deformation thereof. It is absolutely possible.

  It is also possible to combine shaped electrode elements and cavities differently to suit the specific needs of a given application.

  One example that may be particularly useful is a combination of rectangular shaped (easily patterned) electrode elements in a grid-like form with circular shaped cavities (minimized edge stress). Such a circular shaped cavity can be easily provided by the perforated film spacer 45. An example of this configuration is illustrated in FIG. 22b.

  The description now focuses on a scheme for connecting and arranging the sensor elements described above. In particular, these schemes address the problem of changes in pressure within the measuring device. The contact pressure between the surfaces can vary widely over a short distance between the two surfaces in contact, often in a periodic manner. Such changes occur due to the random nature of the contact mechanism and the texture of the material at the contact interface. These changes are further accentuated when light pressure is applied between the textured surfaces (eg, a layer of fabric pressed against the body). In these cases, pressure is transmitted primarily through the apex at the interface between the surfaces during initial contact and tends to settle as the interface material creeps under continued contact pressure.

  If the sensor system properly measures the contact pressure between the two surfaces, it should preferably be able to cope with these inevitable situations of the contact mechanism.

  The geometric problem of measuring typical stress between two surfaces uses a significantly thicker insulating layer between the sensor element in question and the surface to mitigate pressure changes in the vicinity of the pressure sensor. Can be alleviated. This task is not easy to accomplish when measuring the pressure applied to the body part. This is because an overly thick insulating layer makes the device uncomfortable for the patient and bending makes it unrealistic to utilize such a layer. Instead, the sensor element should be significantly smaller so that the thin insulating layer is suitable for averaging microscopic stress changes that are in the immediate vicinity of a single sensor element. Unfortunately, the randomness of the contact mechanism prevents a single sensor from restoring the overall characteristics of stress between the contact surfaces.

  One way to deal with this problem is to provide a large number of small sensors and analyze the signal from each of the sensors to provide useful results. The useful result may be an estimate of the average pressure over the area of the sensor array. However, this requires a large number of sensors to be individually connected to the processing unit. The processing unit also needs sufficient processing power to perform analysis from such a large number of sensors and under realistic operating conditions with associated cost, power, and time constraints. is there.

  This task is further complicated in that the pressure sensor element is inherently non-linear. Therefore, the processing unit converts an array of individually calibrated look-up tables or configurable algorithms to convert the sensor signals into “pressure estimates” and to further analyze the results mathematically under real-time conditions. I need. Since sensor elements also age over time, a method is needed to update the look-up table in the processing unit.

  Instead, the present disclosure is useful directly from a group of pressure sensor elements, regardless of sensor non-linearity, and in real-time manner, without requiring multiple routed traces or heavy computer processing requirements A connectivity scheme that naturally recovers sensitive pressure-related information.

  Such pressure-related information includes, but is not limited to, mean pressure, pressure gradient vector, pressure gradient magnitude, and higher order spatial derivatives of pressure applied to a cluster or part of a cluster. It is not limited.

  For clarity, FIGS. 23a and 23b illustrate a general connection scheme for a pair of two-port sensor elements. A two-port sensor element is simply a sensor element having two electrodes. FIG. 8 shows a sensor element 30 'having three or more electrodes.

  FIG. 23a illustrates a pair 50 of sensor elements 53a, 53b, which can be connected to an external circuit via a first conductor 52a and a second conductor 52c, and the third conductor 52b Are interconnected in a serial manner. External connections are provided at 51a and 51b.

  FIG. 23b illustrates a pair 50 ′ of sensor elements 53a, 53b, which can be connected to an external circuit via a first conductor 52a and a second conductor 52d and are connected in a parallel manner. Connected. External connections are provided at 51a and 51b.

A solution to the problem of recovering pressure-related information across the surface area is to provide a cluster of sensor elements 50 ″, 50 ′ ″, 50 ^IV , 50 ^V , 50 ^VI . The cluster of sensor elements are interconnected in such a way as to provide a minimum of external connections, ideally only two, so that an impedance value representing the desired pressure related information is obtained between these two Provided during external connection. The cluster should include at least one sensor element connected in series with one or more other sensor elements and at least one sensor element connected in parallel with one or more additional sensor elements.

  FIG. 24 schematically illustrates an example of a cluster of sensor elements 50 ″. The cluster is provided as an nXm array of sensor elements 53, a first electrode 52a providing a first external connection 51a, a last electrode 52d providing a second external connection 51b, and a plurality of sensor elements 53. Each column of n sensor elements 53 includes a plurality of commonly arranged interiors along a conduction path between the first electrode 52a and the last electrode 52d. Connected by electrode 52. The internal electrodes of the cluster are generally arranged to connect a small group of sensor elements 53 in adjacent rows to each other. Accordingly, the internal electrode 52 can extend vertically in FIG. 24 to contact two or more of the sensor elements 53. The connection is established so that the required pressure related information can be obtained from the external connections 51a, 51b. For clusters with only two external connections, this pressure related information most commonly represents the average pressure applied to the cluster.

  In order to achieve an indication of the average pressure applied to the cluster, the connections in the cluster should preferably include at least one polygonal network element. Details are described below with more detailed examples.

  The sensor elements included in the cluster need not have the same characteristics, nor do they simply have to be connected to two electrodes. It is also not necessary that all locations within a cluster be occupied by either sensor elements or electrode elements (eg, a cluster may include areas without sensor elements or electrodes).

  FIG. 25 illustrates another embodiment of a cluster 50 ″ ″ where the sensor element 53 is in contact with three or four different electrodes 52, thus providing more complex connectivity. A sensor element with more than two electrodes can separate the pressure gradient internally and thus produces a higher effective resolution than a sensor element with only two electrodes. Such sensor elements can also reduce sensitivity to temperature and humidity fluctuations when properly connected in a cluster.

FIG. 26 illustrates another embodiment of cluster 50 ^IV , where four sensor elements 53 ′, 53 ″ are in contact with two electrodes, respectively, and external connectors 51a, 51b, 51c. , 51d. A cluster with more than two external connections can separate higher order pressure related information from the cluster, such as the magnitude and direction of the pressure gradient, and higher order spatial derivatives of pressure across the cluster. Is possible. Such an arrangement also provides reasonable compensation for changes in sensor characteristics due to aging and temperature-humidity variations.

The embodiment illustrated by cluster 50 ^IV is particularly useful when sensor element 53 ′ and sensor element 53 ″ are provided with different pressure sensitivities. In this case, when a voltage is applied across the external connectors 51c, 51d, the differential voltage between the electrodes 51a, 51b represents the average pressure applied to the cluster 50 ^IV .

FIG. 27 shows a signal P _par from a sensor cluster comprising only sensor elements connected in parallel, a signal P _ser from a sensor cluster comprising only sensor elements connected in series, and sensor elements connected in series. The combined signal P _comp from the cluster with both sensor elements connected in parallel is combined with the maximum measured pressure P _max , the minimum measured pressure P _min , and the actual average pressure P _avg over the entire region. Is schematically illustrated in the context of having Optimally connected clusters generates an estimated pressure P _comp considerably with small variations than the variation of the total applied pressure, the pressure estimated value P _comp is around the value of the average pressure applied P _avg It is shown to have a value with a center. The overall relationship represented by P _ser and P _par cannot achieve a similar correlation.

Figure 28 illustrates another embodiment of a cluster 50 ^V with both the connected sensor element in parallel to the sensor elements connected in series. This embodiment is a specific example of a 4 × 4 cluster. Cluster 50 ^V in this example includes a first axis of symmetry A1 and the second axis of symmetry A2. The cluster also comprises a four-sided polygonal network of sensory elements. This polygon connection is clarified in further detail by FIGS. 29-30.

  FIG. 29 illustrates an equivalent circuit diagram of the embodiment of FIG. 28, with a pair of sensor elements 50 connected in series and a pair 50 ′ of sensor elements connected in parallel by a box drawn in dots. Illustrated.

FIG. 30 illustrates a simplified equivalent circuit diagram of the embodiment of FIG. A simplified equivalent circuit diagram is achieved by merging all (purely) serially connected pairs and parallel connected pairs into equivalent circuit elements. Such a process is continued until there are no remaining purely serial or parallel connected pairs that are further simplified. A simplified equivalent circuit is described in Cluster 50 ^V by March RH, “Polygons of resisters and convergence series”, American Journal of Physics, 61 (10), 1993, pg. It is clearly shown that it is electrically equivalent to a polygonal network element as described in 900. The surface F1 and the surface F2 having an internal connection are exemplified. In this case, the cluster 50 ^V comprises a single quadrilateral polygonal network element, where the two faces F1 have one impedance element while the other two faces have internal connections. Surface F2 or “tapped surface”.

Impedance of the cluster 50 ^V as the external connection 51a, is measured between the 51b represent the average pressure applied to the cluster 50 ^V.

FIG. 31 illustrates a further embodiment of a cluster 50 ^{VI comprising} both sensor elements connected in series and sensor elements connected in parallel. This embodiment is another specific example of a 4 × 4 cluster. This embodiment comprises a first set of external connections 51c, 51d and a second set of external connections 51a, 51b, which can be used to obtain further information about the pressure distribution inside the cluster. . For example, a second set of such external connections is the first in terms of the macroscopic derivative of the pressure distribution applied to the sensor cluster, whether the pressure is lower or higher in any quadrant of the cluster. It can be used to determine whether primary information can be obtained. Cluster 50 ^VI is electrically equivalent to the connection of two triangular polygonal network elements having a shared face F3. This equivalence is further clarified by FIGS.

  FIG. 32 illustrates an equivalent circuit diagram of the embodiment of FIG. 31, illustrating a pair 50 of sensor elements connected in series and a pair 50 'of sensor elements connected in parallel.

FIG. 33 illustrates a simplified equivalent circuit diagram of the embodiment of FIG. Equivalent circuit indicates that the equivalent circuit for cluster 50 ^VI comprises a group of polygonal network elements. The face F1 and the shared face F3 are exemplified. In this case, cluster 50 ^VI comprises a connection of two triangular polygonal network elements having a shared face, where face F1 has a single impedance element while shared face F3 has The impedance element is omitted.

Impedance of the cluster ^{50 VI} as first set 51c of the external connection is measured between the 51d represents the average pressure applied to the cluster ^{50 VI.} Alternatively, if a voltage is applied across the first set 51c, 51d of external connections, the voltage and voltage difference measured between the second set of external connections is applied to the cluster 50 ^VI. Represents the pressure gradient.

  In the above cluster, the overall impedance of the cluster can be further adjusted to achieve a value that is most suitable for external electronics. To achieve this goal, the optimal connectivity is a combination of series and parallel connections with more series or more parallel weights depending on the desired overall impedance of the cluster.

  Since FIGS. 23-33 depict the connections in a schematic fashion, it is understood that connectivity does not affect the actual geometric layout of the clusters. It is not a requirement that the clusters be formed in a rectangular array of sensor elements. Furthermore, it is possible that the sensor elements are printed on two sides of the substrate and have connectivity between them forming a cluster.

  The connectivity of sensor elements distributed over a large area can be equivalent to the connectivity of sensor elements in a tightly packed array, and sensor elements arranged in a grid are randomly arranged across the area It is also understood that the connectivity can be equal to the element.

  It is not a requirement that the sensor element be connected only to adjacent electrodes. The higher order connectivity achievable by multi-layer connections is advantageous for some applications such as measuring transient pressure events (eg pressure waves) with associated spatial non-uniformity across the cluster It is.

  It is further understood that many physical connectivity within the cluster can lead to representing the same simplified equivalent circuit. As an example, the simplified equivalent circuit of FIG. 33 may represent a cluster of ten sensor elements 53 connected exactly as shown in FIG.

It is further understood that each sensor element 53 in a cluster may represent an equally nested cluster. As an example, a sensor element 53 ′ as shown in FIG. 26 may actually represent a cluster having two external connections, such as cluster 50 ^VI , while a sensor element 53 ″ as shown in FIG. It may represent different clusters having two external connections, such as the cluster 50 ^V.

  The principle of clustering sensors is mainly useful for analog sensors and the like as described with reference to FIGS. 4 to 10, as illustrated with reference to FIGS.

  In one embodiment, the sensor system includes a plurality of sensor elements of the type described with reference to FIGS. 4-10 and the type described with reference to any one of FIGS. It may include clusters with one or more sensors.

  A cluster 70 comprising a plurality of sensor elements 40 as described with reference to FIGS. 11-22 is shown when the pressure-impedance behavior of the cluster 70 is measured between the external connections 51a, 51b. Can be arranged as indicated by 17. Similar behavior can be obtained from clusters with different sensor elements, as shown in the following two examples.

  In the first example, a cluster 70 of five sensor elements 40, as described with reference to FIGS. 11-22, has each sensor element simply having two first electrodes 42a in series with each other. Connected. The size of the cavities 48, the positioning of the first electrode elements 42a with respect to the cavities 48, and / or the spacing S between the first electrode elements 42a may cause the sensor elements to have a corresponding switching pressure P1, P2, P3, P4 or P5. Individually adjusted for each sensor as provided.

  In the second example, the cluster 70 comprises two sensor elements 40, one sensor element having three first electrode elements 42a, as described with reference to FIGS. A second sensor element having a first electrode element 42a, wherein the sensor element 40 is connected in series, the size of the cavity 48, the positioning of the first electrode element 42a relative to the cavity 48, and / or The spacing S between the first electrode elements 42a is such that each sensor element provides a switching pressure P1 and P2 and a second sensor element provides switching pressures P3, P4 and P5. Individually adjusted.

  In another embodiment, the sensor system refers to a first cluster of a plurality of sensor elements of the type described with reference to FIGS. 4-10 and any one of FIGS. And a second cluster of sensors of the type described above.

  In particular, the second cluster may comprise a sensor having a resistive electrode, for example as discussed with reference to FIG.

  Sensor clusters and / or systems may be enclosed in a common enclosure, such as the enclosure designated by reference numeral 26, 34, 49a or 49b.

  Individual sensor elements, sensor clusters or sensor systems can be connected to a measuring device to measure pressure.

  With reference to FIGS. 34-36, a sensor element, sensor cluster or sensor system may be used to measure pressure on the body part 60, which is illustrated by the lower leg in FIGS. 34-36. . The plurality of sensor devices 62, 62 ′, 62 ″ are each in the form of sensor elements, sensor clusters or sensor systems, and may be in the form of a flexible sheet to accommodate the body part where the measurements are made. 61, 61 'can be distributed. The sensor device 62 is connected via a conductor device 66 (cable, wire, conductive trace, etc.) to a central point 63 (where a connector can be provided that connects to external equipment or the electronics itself can be provided). obtain. The carriers 61, 61 ′ can thus be substrates (see reference numerals 21, 31, 41, 47) on which the sensor elements are arranged.

  The sensor devices 62 may be distributed over the area of the carrier 61 as illustrated in FIG. Alternatively or as a complement, it is along a sensor device 62 'or substantially a line as illustrated in FIG.

  Alternatively, the sensor device 62 "can be distributed throughout the carrier 61 '. The carrier 61 'is provided with interconnect buses 65a, 65b, 65c, for example, at the edge of the carrier 61 (65a, 65c) and / or along the length of the carrier 61 (65b).

  The carrier can be in the form of a flexible sheet of garment or film and can optionally be breathable. The carrier 61 may form a substrate as illustrated in FIGS. In order to form a measuring device for measuring the pressure on the body part, the carrier 61 with sensors can be a part of a laminated structure and has one or more pressure smoothing layers arranged on one or both sides of the carrier 61. May be included. The smoothing layer can be closely laminated or printed on either side of the carrier 61 so that the stress at the interface between the sensor element and its surroundings is sufficiently smooth before reaching the surface of the sensing element. obtain.

  Such a smoothing layer may be in the form of a microcellular foam structure. In other embodiments, the smoothing layer can be a printed rubber layer, a laminated nonwoven fabric, and the like.

  The mechanical properties, thickness ratio between the smoothing layer and the lateral sensor module, and dimensions are selected to ensure that the pressure is effectively smoothed as it reaches the sensor element surface obtain. The total thickness of the sensor and the smoothing layer should preferably be less than 1.5 mm, more preferably less than 1.0 mm, even more preferably less than 0.5 mm, and most preferably less than 0.2 mm; The sensor element should therefore be very thin to accommodate a sufficiently thick smoothing layer in the small amount of space provided. The smoothing layer may preferably be selected to be 5 to 10 times the thickness of the sensor element.

  In order for the smoothing layer to be effective, it is also desirable that the length, width or diameter of the sensing area of the sensor element is approximately the same as the overall sensor thickness and the thickness of the smoothing layer.

  The carrier 61 can be included in a device for pressurized treatment of a body part. Thus, the device may comprise an additional layer 200 (FIG. 37) housing actuator or the like to provide a pressurized movement.

  As an example, layer 200 may form an inflatable bladder part and is used to provide pressure to a body part in a manner known per se.

  In yet another embodiment, the substrate 21, 31, 41, 61, 61 'on which the sensor elements are arranged may be the wall of such a bladder, i.e. the substrate may be integrated with the bladder wall.

  In other embodiments, the pressurizing device may include, by way of non-limiting example, US Patent Application Publication No. 2004/0073146 (A1), US Patent Application Publication No. 2002/0173735 (A1), European Patent Application No. No. 1 324 403 (A1), US Pat. No. 5,997,465, WO 2004/093763 (A1), US Patent Application Publication No. 2005/0043657 (A1), US Patent No. 6,123,681, U.S. Pat. No. 6,494,852 (B1), U.S. Pat. No. 6,198,204 (B1), or U.S. Patent Application Publication No. 2004/0167375 A1) may be any one or combination type described in the specification.

Referring to FIG. 37, details of the carrier 61 are illustrated. A sensor device 62 is provided on the carrier 61 and is connected to the measuring device 100 via a conductor device 66. The sensor device comprises at least one, preferably one or more, first type pressure sensor elements 20, 30 or a cluster 50 of such pressure sensor elements as described with reference to FIGS. ″, 50 ′ ″, 50 ^IV , 50 ^V , 50 ^VI and at least one second type of pressure sensor element 40 or cluster 70 thereof as described with reference to FIGS. With.

In one embodiment, the sensor device 62 includes a plurality of sensor elements of a first type (sensor clusters 50 ″, 50 ′ ″, 50 ^IV , 50 ^V as described with reference to FIGS. 24-33). , 50 ^VI ), and optionally one or more second type sensor elements.

  In another embodiment, the sensor device 62 may also comprise a plurality of sensor elements of a second type, the plurality of sensor elements being arranged as a sensor cluster as described with reference to FIGS. Is done.

  The sensor elements can be arranged in a common capsule 26, 34, 49a, 49b.

As shown, the sensors and sensor systems described herein are between a body part and a pressurizing device, between two body parts, a body part, and a handle (e.g. With some external devices such as surgical tools, floors (eg when arranged in / on a shoe), etc. It can be used to measure the contact pressure between.

Claims (1)

Invention described in the specification.

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