JP2012088139A - Device and method for inspecting defect of coating film - Google Patents

Device and method for inspecting defect of coating film Download PDF

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JP2012088139A
JP2012088139A JP2010234372A JP2010234372A JP2012088139A JP 2012088139 A JP2012088139 A JP 2012088139A JP 2010234372 A JP2010234372 A JP 2010234372A JP 2010234372 A JP2010234372 A JP 2010234372A JP 2012088139 A JP2012088139 A JP 2012088139A
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Shinichi Egawa
慎一 江川
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Toppan Inc
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Abstract

PROBLEM TO BE SOLVED: To provide a device and method for easily discriminating and determining film thickness unevenness in a conveyance direction of a slit die at coating with coating film from a conveyance pseudo unevenness generated during measurement conveyance of the film thickness unevenness inspection device in a manufacturing step of a color filter to be used for a color filter for liquid crystal or for a display of organic EL or the like.SOLUTION: The device and method are used for inspecting defects in the coating film formed on a transparent substrate 8. The transparent substrate 8 is photographed while a photographing sensor camera 9 and a transmission illumination light source 10 are slid in the direction perpendicular to the conveyance direction of the transparent substrate 8. The obtained image data are subject to image correction process by rectangle processing so as to easily discriminate a pseudo conveyance unevenness generated in the conveyance direction of the transparent substrate 8. Thus the device and method have an advantage of accurate inspection of the film thickness unevenness and density unevenness.

Description

本発明は塗工膜の厚みムラ、色ムラ、濃度ムラ、ごみ欠陥や白抜け欠陥などの検査方法に関する。   The present invention relates to a method for inspecting coating film thickness unevenness, color unevenness, density unevenness, dust defects, white spot defects, and the like.

近年液晶用カラーフィルターや有機ＥＬなどのディスプレイには、透明な基板上に膜や層をコーティングした部材が使われている。例えばカラーフィルターの製造の場合、ガラス基板上にレジストコートしてフォトマスクを利用して露光後、現像してカラーフィルターパターンを形成するリソグラフィー方式が多用されている。この方式を用いてブラックマトリックス層（ＢＭ）を形成し、同様に赤画像層（１Ｒ）、緑画像層（１Ｇ）、青画像層（１Ｂ）を形成する。その後、透明電極層（ＩＴＯ）、フォトスペーサー（ＰＳ）、アドバンストスーパービュー（ＡＳＶ）を形成してカラーフィルター（図１）を製造している。   In recent years, liquid crystal color filters, organic EL displays, and the like have been used members that are coated with a film or layer on a transparent substrate. For example, in the case of manufacturing a color filter, a lithography method is often used in which a glass substrate is resist-coated, exposed using a photomask, and then developed to form a color filter pattern. Using this method, a black matrix layer (BM) is formed, and a red image layer (1R), a green image layer (1G), and a blue image layer (1B) are similarly formed. Thereafter, a transparent electrode layer (ITO), a photo spacer (PS), and an advanced super view (ASV) are formed to manufacture a color filter (FIG. 1).

これらの層は、スピンコートやスリットダイコート法などで基板上に設けられるが、これらの塗膜には、各種のムラなどの欠陥が発生しており、品質管理のため、欠陥検査が必要となる。これらの従来の検査方法としては、主に２方式あり、光干渉式の膜厚計法や（図１）の白色照明による透過照明下１１でラインセンサーカメラ９により撮像し、得られた画像２３に対して色膜の膜厚のムラを検査する方法（特許文献１）が試みられている。   These layers are provided on the substrate by spin coating or slit die coating, etc., but these coatings have defects such as various irregularities, and defect inspection is necessary for quality control. . As these conventional inspection methods, there are mainly two methods, and an image 23 obtained by imaging with the line sensor camera 9 under the light interference type film thickness measurement method or the transmitted illumination 11 with the white illumination (FIG. 1). On the other hand, a method (Patent Document 1) for inspecting unevenness of the film thickness of the color film has been attempted.

しかしながら、前者には、測定点での膜厚測定は可能だが、広い範囲の中で、測定点以外のムラを見逃してしまう問題がある。   However, the former can measure the film thickness at the measurement point, but has a problem of overlooking a non-measurement point in a wide range.

後者には、透過照明光源１０とセンサーカメラ９の光路の間（光源もしくはセンサーカメラのどちらか）に異物などが付着すると、透明基板８の搬送方向５に搬送ムラ７（擬似ムラ）が発生し、パソコンモニター上２３に搬送ムラ７と膜厚ムラ６が混在し（図２）、目的とする膜厚ムラ６と搬送ムラ７の区別が困難（図３）となってしまうという問題があった。   In the latter case, when foreign matter or the like adheres between the light path of the transmitted illumination light source 10 and the sensor camera 9 (either the light source or the sensor camera), the transport unevenness 7 (pseudo unevenness) occurs in the transport direction 5 of the transparent substrate 8. In addition, there is a problem that conveyance unevenness 7 and film thickness unevenness 6 coexist on the PC monitor 23 (FIG. 2), and it becomes difficult to distinguish between the target film thickness unevenness 6 and the conveyance unevenness 7 (FIG. 3). .

特開２００４−２１９１０８号JP 2004-219108 A

本発明は従来技術の課題を解決するためになされたものであり、透明基板の搬送方向に発生している搬送ムラ（擬似ムラ）を容易に、膜厚ムラと区別、判別することができる塗工膜の欠陥検査及び検査方法を提供することを目的とする。   The present invention has been made to solve the problems of the prior art, and is a coating that can easily distinguish and discriminate transport unevenness (pseudo unevenness) occurring in the transport direction of a transparent substrate from film thickness unevenness. It aims at providing the defect inspection and inspection method of a film.

第一の発明は、透明基板８に製膜された塗工膜の欠陥を検査する装置（図４、図５）であって、撮像用センサーカメラ９と、撮像用センサーカメラ９に向け照射する透過照明光源１０と、透明基板８を載置し、搬送する機能を有するコンベア装置１１とを具備し、透明基板８は撮像用センサーカメラ９と透過照明光源１０との間を搬送され、撮像用センサーカメラ９は搬送方向５と垂直方向１２に複数並設され、搬送方向５と垂直方向１２にスライドできる機能を有することを特徴とする検査装置である。   1st invention is an apparatus (FIG. 4, FIG. 5) which test | inspects the defect of the coating film formed in the transparent substrate 8, Comprising: It irradiates toward the imaging sensor camera 9 and the imaging sensor camera 9 A transparent illumination light source 10 and a conveyor device 11 having a function of placing and transporting the transparent substrate 8 are provided, and the transparent substrate 8 is transported between the imaging sensor camera 9 and the transmitted illumination light source 10 for imaging. A plurality of sensor cameras 9 are juxtaposed in the transport direction 5 and the vertical direction 12 and have a function of sliding in the transport direction 5 and the vertical direction 12.

第二の発明は、透明基板８に製膜された塗工膜の欠陥を検査する方法であって、透明基板８をコンベア装置１１に載置し、搬送し、透過照明光源１０から、透明基板８を介し、搬送方向５と垂直方向１２に複数並設した撮像用センサーカメラ９に向け照射し、撮像用センサーカメラ９を搬送方向５と垂直方向１２にスライドし透明基板８を撮像して検査用画像データを得ることを特徴とする検査方法である。   The second invention is a method for inspecting a defect of a coating film formed on the transparent substrate 8. The transparent substrate 8 is placed on the conveyor device 11, transported, and transmitted from the transmissive illumination light source 10 to the transparent substrate. 8, the imaging sensor cameras 9 arranged in parallel in the transport direction 5 and the vertical direction 12 are irradiated, and the imaging sensor camera 9 is slid in the transport direction 5 and the vertical direction 12 to image the transparent substrate 8 and inspect. This is an inspection method characterized in that image data is obtained.

第三の発明は、搬送された透明基板８を、複数の撮像用センサーカメラ９をスライドして撮像して得られた画像データを、短形処理により画像補正処理する手段を有することを特徴とする第一の発明に記載の検査装置（図７）である。   The third invention is characterized in that it has means for performing image correction processing by short-form processing on image data obtained by imaging the conveyed transparent substrate 8 by sliding a plurality of imaging sensor cameras 9. It is an inspection device (Drawing 7) as described in the 1st invention.

第四の発明は、検査用画像データを、短形処理により画像補正処理することを特徴とする第二の発明に記載の検査方法である。   According to a fourth aspect of the invention, there is provided the inspection method according to the second aspect of the invention, wherein the image data for inspection is subjected to an image correction process by a short shape process.

本発明は、透明基板８に製膜されたの塗工膜の欠陥を検査する装置（図４、図５及び図７）、方法であって、撮像用センサーカメラ９と透過照明光源１０を透明基板８の搬送方向５と垂直方向１２にスライトさせながら透明基板８を撮像し、その画像データを短形処理により画像補正処理（図６及び図１１）することによって、透明基板８の搬送方向５に発生する疑似搬送ムラ７を容易に判別でき、目的とする膜の厚みムラ６や濃度ムラ６を的確に検査できる長所を有するものである。   The present invention is an apparatus (FIGS. 4, 5, and 7) and a method for inspecting defects in a coating film formed on a transparent substrate 8, wherein the imaging sensor camera 9 and the transmitted illumination light source 10 are transparent. The transparent substrate 8 is imaged while being slit in the vertical direction 12 with respect to the transport direction 5 of the substrate 8, and the image data is subjected to image correction processing (FIG. 6 and FIG. 11) by short-form processing. Therefore, it is possible to easily determine the pseudo-transport unevenness 7 occurring in the film, and to accurately inspect the target film thickness unevenness 6 and density unevenness 6.

従来の代表的なカラーフィルタの構成略図。1 is a schematic diagram of a conventional representative color filter. 従来の膜厚ムラ検査装置の概略斜視図。The schematic perspective view of the conventional film thickness nonuniformity inspection apparatus. 従来の膜厚ムラ検査装置の透過照明下でラインセンサーカメラにより撮像し、得られた画像に混在する搬送ムラと膜厚ムラの模式図。The schematic diagram of the conveyance nonuniformity and film thickness nonuniformity which are imaged with the line sensor camera under the transmitted illumination of the conventional film thickness nonuniformity inspection apparatus, and are mixed in the obtained image. 第一の発明に係る装置を上から観た模式図。The schematic diagram which looked at the apparatus which concerns on 1st invention from the top. 第一の発明に係る装置を横から観た模式図。The schematic diagram which looked at the apparatus which concerns on 1st invention from the side. 本発明に係るムラ欠陥検査機の動作フロー図Operation flow diagram of mura defect inspection machine according to the present invention 第三の発明に係る透明基板撮像時の装置の動作模式図。The operation | movement schematic diagram of the apparatus at the time of the transparent substrate imaging which concerns on 3rd invention. 第三の発明に係る透明基板撮像時の撮像画像の模式図。長方形の透明基板を撮像すると画面上では透明基板は平行四辺形の画像となる。The schematic diagram of the picked-up image at the time of the transparent substrate imaging based on 3rd invention. When a rectangular transparent substrate is imaged, the transparent substrate becomes a parallelogram image on the screen. 第三の発明に係る撮像画像の短形処理の補正前の模式図。The schematic diagram before correction | amendment of the short process of the captured image which concerns on 3rd invention. 第三の発明に係る撮像画像の短形処理の補正後の模式図。The schematic diagram after correction | amendment of the short process of the captured image which concerns on 3rd invention. 補正矩形処理に関する関係式の説明図。Explanatory drawing of the relational expression regarding a correction | amendment rectangle process.

本発明による透明基板８の搬送方向５に発生する疑似搬送ムラ７を容易に判別でき、目的とする膜の厚みムラ６や濃度ムラ６を的確に検査できる方法の実施の形態を説明する。   An embodiment of a method according to the present invention that can easily identify the pseudo-transport unevenness 7 that occurs in the transport direction 5 of the transparent substrate 8 and can accurately inspect the target film thickness unevenness 6 and density unevenness 6 will be described.

（図４）は、第一の発明に係る装置を上から観た模式図であり、塗工膜の欠陥を検査する装置であって、撮像用センサーカメラ９と透過照明光源１０および透明基板８を載置し、搬送できるコンベア装置１１を具備し、撮像用センサーカメラ９と透過照明光源１０を同期させて作動、可動するようになっており、透明基板８の搬送方向５と垂直方向１２にスライトさせながら透明基板８を撮像できるようになっている検査装置である。   (FIG. 4) is a schematic view of the apparatus according to the first aspect of the present invention as viewed from above, and is an apparatus for inspecting defects in the coating film, and includes an imaging sensor camera 9, a transmission illumination light source 10, and a transparent substrate 8. The imaging device camera 9 and the transmitted illumination light source 10 are operated and moved in synchronization with each other in the transport direction 5 and the vertical direction 12 of the transparent substrate 8. This is an inspection apparatus that can capture an image of the transparent substrate 8 while being slit.

（図５）は、第一の発明に係る装置を横から観た模式図であり、塗工膜の欠陥を検査する装置であって、透明基板８を載置し、搬送できるコンベア装置１１が、撮像用センサーカメラ９と透過照明光源１０の可動、移動方向とは垂直方向１２に透明基板８をスライト搬送できるようになっており、同時に透明基板８を撮像できる検査装置である。   (FIG. 5) is a schematic view of the apparatus according to the first aspect of the present invention as viewed from the side, and is an apparatus for inspecting a coating film for defects, and a conveyor apparatus 11 on which a transparent substrate 8 can be placed and conveyed. The imaging sensor camera 9 and the transmitted illumination light source 10 are movable and moved in a direction perpendicular to the transparent substrate 8 so that the transparent substrate 8 can be transported in a slanted manner.

（図６）は、本発明に係るムラ欠陥検査機の動作フロー図である。
（１）段階は、センサーカメラをスライドさせながらの画像撮像であり、透明基板を搬送方向に移動しつつ、センサーカメラを搬送方向と垂直方向に移動させながら撮像を行う。
（２）段階は、撮像画像の基板端またはカラーフィルターパターンのエッジの検出であり、（１）の撮像画像について、複数箇所のエッジを検出する（ｎ番目を使用）。
（３）段階は、（２）で検出したエッジより１次の傾き補正関数（式）を求める。
（４）段階は、撮像画像の矩形処理であり、（３）の補正式を用いて（１）の撮像画像を補正する。
（５）段階は、ムラ、欠陥検出処理であり、（４）で得られた補正画像に対してムラ、欠陥の検出処理を行う。
（６）段階は、搬送ムラと膜厚ムラの判別であり、（５）で検出されたムラ、欠陥について判別を行う。 FIG. 6 is an operation flow diagram of the mura defect inspection machine according to the present invention.
In step (1), image capturing is performed while the sensor camera is slid. Imaging is performed while moving the transparent substrate in the transport direction and moving the sensor camera in a direction perpendicular to the transport direction.
Step (2) is detection of the substrate edge of the captured image or the edge of the color filter pattern. In the captured image of (1), a plurality of edges are detected (the nth is used).
In step (3), a linear inclination correction function (formula) is obtained from the edge detected in step (2).
Step (4) is rectangular processing of the captured image, and the captured image of (1) is corrected using the correction formula of (3).
Step (5) is unevenness / defect detection processing, and unevenness / defect detection processing is performed on the corrected image obtained in (4).
Step (6) is determination of conveyance unevenness and film thickness unevenness, and the unevenness and defects detected in (5) are determined.

（図７）は、第三の発明に係る透明基板撮像時の装置の動作模式図であり、透明基板８の搬送方向５とは垂直方向１２に、センサーカメラ９と透過照明光源１０を同期させながら位置関係を変えずに長方形の透明基板８を撮像するが、撮像した画像は（図８）のように画面上の透明基板８は平行四辺形の画像が得られる。   (FIG. 7) is an operation schematic diagram of the apparatus at the time of imaging a transparent substrate according to the third invention. The sensor camera 9 and the transmitted illumination light source 10 are synchronized in a direction 12 perpendicular to the transport direction 5 of the transparent substrate 8. However, the rectangular transparent substrate 8 is imaged without changing the positional relationship, but the captured image is a parallelogram image as shown in FIG.

（図９）は、本発明における補正処理前の撮像画面で、透過照明光源１０とセンサーカメラ９の光路の間（光源もしくはセンサーカメラのどちらか）に異物などが付着した場合に透明基板８の搬送方向５に沿って、搬送ムラ７が発生し、膜厚ムラ６と搬送ムラ７が撮像画面上で混在している。   (FIG. 9) is an imaging screen before correction processing in the present invention, and when a foreign object or the like adheres between the light paths of the transmitted illumination light source 10 and the sensor camera 9 (either the light source or the sensor camera), A transport unevenness 7 occurs along the transport direction 5, and the film thickness unevenness 6 and the transport unevenness 7 are mixed on the imaging screen.

この場合は長方形の補正前の撮像画面の中に、搬送ムラ７は画面の長辺と平行に細い帯状の白抜け状で写っている、一方、長方形であった透明基板８の膜厚ムラ６は長方形画面の対角線方向に平行四辺形の形に成って写っている。搬送ムラ７は、透過照明光源１０、センサーカメラ９及び異物の位置関係が変わらないため、補正処理前の撮像画面では、試料基板８の搬送方向５に一直線に写つり出される。   In this case, the conveyance unevenness 7 appears in a thin strip-like white outline parallel to the long side of the screen in the rectangular imaging screen before correction, while the film thickness unevenness 6 of the rectangular transparent substrate 8. Is shown in the shape of a parallelogram in the diagonal direction of the rectangular screen. The transport unevenness 7 is projected in a straight line in the transport direction 5 of the sample substrate 8 on the imaging screen before the correction process because the positional relationship among the transmitted illumination light source 10, the sensor camera 9, and the foreign matter does not change.

（図１０）は、本発明における補正後の撮像画面であって、補正前に長方形であった撮像画面は、補正後は右にずれた平行四辺形の画面となった。補正前に長方形画面の長辺と平行に細い帯状の白抜け状であった搬送ムラ７は、補正後は平行四辺形の画面の長辺と平行に細い短冊が階段状に繋がって白抜け状で写っている、一方、補正前の長方形画面の対角線方向に平行四辺形の形に成って写っていた透明基板８の膜厚ムラ６は、補正後は平行四辺形の画面の上短辺と下短辺に垂直方向に長方形の形に写っている。   (FIG. 10) is an image screen after correction in the present invention, and the image screen that was rectangular before correction became a parallelogram screen shifted to the right after correction. The conveyance unevenness 7 which was a strip-shaped white outline parallel to the long side of the rectangular screen before correction was corrected, and the thin strip parallel to the long side of the parallelogram screen was connected in a staircase shape after correction. On the other hand, the film thickness unevenness 6 of the transparent substrate 8 that is shown in the shape of a parallelogram in the diagonal direction of the rectangular screen before correction is the upper short side of the parallelogram screen after correction. It is reflected in a rectangular shape perpendicular to the lower short side.

（図１１）は、補正前の撮像画面で平行四辺形であった透明基板８を補正後には、長方形にした矩形補正処理に関する関係式の説明図である。   FIG. 11 is an explanatory diagram of a relational expression related to a rectangular correction process in which the transparent substrate 8 that has been a parallelogram on the imaging screen before correction is made into a rectangle after correction.

本発明における透明基板８を（図７）のように搬送方向に移動しつつ、センサーカメラ９と透過照明光源１０を同期させ、お互いの位置関係を変えずに移動させ、かつ透明基板の搬送方向５とは垂直方向１２に移動させながら透明基板８を撮像する。長方形の透明基板８を撮像した画像は（図８）のように平行四辺形となる。   While moving the transparent substrate 8 in the present invention in the transport direction as shown in FIG. 7, the sensor camera 9 and the transmitted illumination light source 10 are synchronized and moved without changing their positional relationship, and the transport direction of the transparent substrate 5, the transparent substrate 8 is imaged while being moved in the vertical direction 12. An image obtained by imaging the rectangular transparent substrate 8 is a parallelogram as shown in FIG.

本発明における撮像画面（図９）から透明基板８の端またはカラーフイルターパターンのエッジを検出し、１次の傾き補正関数を求めて撮像画像の矩形補正処理を行う（図１１）。   The edge of the transparent substrate 8 or the edge of the color filter pattern is detected from the imaging screen (FIG. 9) in the present invention, and a rectangular correction process of the captured image is performed by obtaining a first-order inclination correction function (FIG. 11).

本発明における撮像画像の矩形補正処理で得られた補正処理後の画像（図１０）よりムラ、欠陥の検出処理判別を行う。補正処理後の平行四辺形の画像中の平行四辺形の長辺と平行に細い短冊が階段状に繋がって白抜け状で写っているのが搬送ムラ７であり、補正処理後の平行四辺形の画像中の平行四辺形の上短辺と下短辺に垂直方向に長方形の形に写っているのが試料基板８の膜厚ムラ６である。   From the image after the correction processing (FIG. 10) obtained by the rectangular correction processing of the captured image in the present invention, the unevenness and defect detection processing determination is performed. A thin strip parallel to the long side of the parallelogram in the image of the parallelogram after the correction processing is connected in a staircase pattern and is reflected in a white spot, which is the conveyance unevenness 7, and the parallelogram after the correction processing The film thickness unevenness 6 of the sample substrate 8 is shown in a rectangular shape perpendicular to the upper short side and the lower short side of the parallelogram in FIG.

本発明における撮像後の矩形補正処理方法は以下のとおりである。
（１）透明基板８の搬送方向５をＹ軸、搬送方向５に垂直な方向１２をＸ軸とする。撮像画像の左側から右側方向に輪郭エッジを検出する。複数のＹ軸の座標（Ｙ１、Ｙ２、Ｙ３、Ｙ４、Ｙ５、 、 、）についてＸ軸方向にエッジの検出処理を行い得られたエッジ（Ｘ１‘、Ｘ２‘、Ｘ３‘、Ｘ４‘、Ｘ５‘、 、 、）とする。
（２）エッジ座標（Ｘ１‘、Ｙ１）（Ｘ２‘、Ｙ２）（Ｘ３‘、Ｙ３）（Ｘ４‘、Ｙ４）（Ｘ５‘、Ｙ５）、 、 、より１次近似式Ｙ＝ａＸ＋ｂを求める。
（３）撮像画像の補正前の座標を（ｘ、ｙ）とし、平行四辺形から矩形への補正後の座標を（ｘ‘、ｙ‘）とするとｘ‘＝ｘ−ｙ／ａ、ｙ‘＝ｙの関係式が得られる。
（４）（３）で求めた式を用いて撮像画像の矩形補正処理を行う。 The rectangular correction processing method after imaging in the present invention is as follows.
(1) The transport direction 5 of the transparent substrate 8 is the Y axis, and the direction 12 perpendicular to the transport direction 5 is the X axis. A contour edge is detected from the left side to the right side of the captured image. Edges (X1 ′ , X2 ′ , X3 ′ , X4 ′ , X5 ′ ) obtained by performing edge detection processing in the X-axis direction for a plurality of Y-axis coordinates (Y1, Y2, Y3, Y4, Y5,. ,,,).
(2) First-order approximate expression Y = aX + b is obtained from edge coordinates (X1 ′ , Y1) (X2 ′ , Y2) (X3 ′ , Y3) (X4 ′ , Y4) (X5 ′ , Y5),.
(3) If the coordinates before correction of the captured image are (x, y) and the coordinates after correction from the parallelogram to the rectangle are (x ′ , y ′ ), x ′ = xy / a, y ′. = Y is obtained.
(4) A rectangular correction process of the captured image is performed using the formula obtained in (3).

１Ｒ Ｒ画素、１Ｇ Ｇ画素、１Ｂ Ｂ画素、１ＢＭ ブラックマトリックス
２ ＩＴＯ
３ ＰＳ
４ ＡＳＶ
５ 搬送方向
６ 膜厚ムラ
７ 搬送ムラ
８ 透明基板
９ ラインセンサーカメラ
１０ 透過照明光源
１１ 搬送コロ式コンベアー
１２ カメラと光源を同期させ透明基板搬送方向に対し垂直方向にスライド
１３ 余白部分
２１ 補正前の撮像画像の透明基板のエッジ部
２２ 補正前の撮像画像の透明基板のカラーフィルターのパターンのエッジ部
２３ パソコン、モニター
２４ 補色フィルター 1R R pixel, 1G G pixel, 1B B pixel, 1BM black matrix 2 ITO
3 PS
4 ASV
5 Transport direction 6 Film thickness unevenness 7 Transport unevenness 8 Transparent substrate 9 Line sensor camera 10 Transmitted illumination light source 11 Transport roller conveyor 12 Synchronized camera and light source, slide in the direction perpendicular to the transparent substrate transport direction 13 Margin portion 21 Before correction Edge portion 22 of transparent substrate of captured image Edge portion 23 of color filter pattern of transparent substrate of captured image before correction 23 Personal computer, monitor 24 Complementary color filter

Claims (4)

透明基板に製膜された塗工膜の欠陥を検査する装置であって、撮像用センサーカメラと、撮像用センサーカメラに向け照射する透過照明光源と、透明基板を載置し、搬送する機能を有するコンベア装置とを具備し、透明基板は撮像用センサーカメラと透過照明光源との間を搬送され、撮像用センサーカメラは搬送方向と垂直方向に複数並設され、搬送方向と垂直方向にスライドできる機能を有することを特徴とする検査装置。 An apparatus for inspecting defects in a coating film formed on a transparent substrate, having an imaging sensor camera, a transmission illumination light source for irradiating the imaging sensor camera, and a function of placing and transporting the transparent substrate A transparent substrate is transported between the imaging sensor camera and the transmitted illumination light source, and a plurality of imaging sensor cameras are arranged in parallel with the transport direction, and can slide in the transport direction and the vertical direction. Inspection apparatus characterized by having a function. 透明基板に製膜された塗工膜の欠陥を検査する方法であって、透明基板をコンベア装置に載置し、搬送し、透過照明光源から、透明基板を介し、搬送方向と垂直方向に複数並設した撮像用センサーカメラに向け照射し、撮像用センサーカメラを搬送方向と垂直方向にスライドし透明基板を撮像して検査用画像データを得ることを特徴とする検査方法。 A method for inspecting defects in a coating film formed on a transparent substrate, wherein the transparent substrate is placed on a conveyor device and transported, and a plurality of transmission illumination light sources are transmitted in a direction perpendicular to the transport direction through the transparent substrate. An inspection method comprising: irradiating an image sensor camera arranged side by side, sliding the image sensor camera in a direction perpendicular to a conveyance direction, and imaging a transparent substrate to obtain image data for inspection. 搬送された透明基板を、複数の撮像用センサーカメラをスライドして撮像して得られた画像データを、短形処理により画像補正処理する手段を有することを特徴とする請求項１に記載の検査装置。 The inspection according to claim 1, further comprising means for performing image correction processing by image processing on image data obtained by sliding a plurality of imaging sensor cameras on the transported transparent substrate. apparatus. 検査用画像データを、短形処理により画像補正処理することを特徴とする請求項２に記載の検査方法。 The inspection method according to claim 2, wherein the image data for inspection is subjected to image correction processing by short-form processing.
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