JP2011240053A - Endoscope and method for manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a small, lightweight, accurate and reliable endoscope.SOLUTION: The endoscope includes a function unit composed of a light source unit 22, an imaging unit 23, a control unit 26 for controlling the light source unit 22 or imaging unit 23, and a power feeding unit 50 for feeding power to at least one of the light source unit 22, the imaging unit 23 and the control unit 26; an outer container 130 housing the function unit; and a wiring unit formed on an inner wall 130i of the outer container 130 to mutually connect at least two of the light source unit 22, the imaging unit 23, the control unit 26 and the power feeding unit 50. The wiring unit 60 includes a wiring pattern formed on the inner surface of the outer container.

Description

  The present invention relates to an endoscope and a manufacturing method thereof.

In recent years, development of endoscopes, particularly capsule endoscopes, has been underway. Since the capsule endoscope can be swallowed like a tablet, unlike the conventional type in which a tube is inserted, the inside of the digestive organ can be observed while suppressing the burden on the patient. The capsule endoscope is equipped with an imaging device such as a CCD (solid-state imaging device) or CMOS sensor, an imaging mechanism using a micro lens, and a wireless transmission mechanism, and the inside of the digestive organ of a swallowed patient can be observed on an external monitor. It is comprised as follows (patent document 1). This capsule endoscope advances through the body due to peristalsis of the stomach and intestines, and is discharged outside the body after 8 hours. Therefore, although the burden on the patient is reduced compared to the conventional case, it must be a foreign body. Therefore, in order to reduce the number of times of use as much as possible, it is possible to perform all necessary processes in these 8 hours by increasing the functionality. Various developments are underway. In particular, the addition of a wireless power feeding system and a mechanism for releasing a chemical solution to an affected area is also required.
Under such circumstances, from the viewpoint of reducing the burden on the patient, it is desired to reduce the size and weight.

  By the way, various researches have been made on mounting an image sensor so as to be suitable for mounting on various electronic devices. Under these circumstances, the mounting substrate of the image sensor is replaced with MID (Molded Interconnect Device: injection molded circuit component), and by combining the mechanical function as a mechanical component and the electrical function as a wiring circuit substrate, In addition to downsizing, research is being conducted to streamline the assembly of equipment and increase the precision of parts.

  Further, the present applicant has proposed MICTEC (Microscopic Integrated Processing Technology) as a composite processing technology that combines elemental technologies such as molding technology, metalizing technology, laser processing technology, and cutting technology with bear chip mounting in mind. .

JP 2004-066555 A

In the conventional capsule endoscope as shown in Patent Document 1, as shown in FIG. 21, a light source 1022, a sensor substrate 1023, a control substrate 1020, and a communication substrate 1031 are connected to each other with solder balls in an exterior container 1000. is doing. In this case, each substrate is heated while being fixed with a jig or the like to melt and connect the solder balls. In addition, a dedicated jig for fixing the substrate is required for repair.
When the substrate module is inserted into the capsule, a clearance is always required, but the substrate module needs to be fixed after adjusting the optical axis by the clearance.
Although interconnection using a flexible substrate is used instead of solder balls, it is difficult to ensure connection reliability due to vibration and impact.

  In addition, in the case of an ultra-small camera module in which an image sensor chip is flip-chip mounted, it is necessary to improve the flatness and parallelism of the image sensor chip mounting surface to the limit level.

  In particular, in modules used inside the body, such as endoscopes, further miniaturization is desired. In particular, the relationship between the image sensor chip, the optical filter, and the lens block is a slight misalignment or direction. The positional accuracy is extremely important because the displacement leads to a significant decrease in the accuracy of the image and the positional information.

  The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an endoscope that is small and lightweight, highly accurate, and highly reliable.

  Therefore, the endoscope of the present invention includes a light source unit, an imaging unit, a control unit that controls the light source unit or the imaging unit, and a power supply unit that supplies power to at least one of the light source unit, the imaging unit, and the control unit. And an external container that houses the functional part, and a wiring part that is formed on the inner wall of the external container and interconnects at least two of the light source part, the imaging part, the control part, and the power feeding part. It is a mirror, and a wiring part consists of a wiring pattern formed in the inner surface of an exterior container, It is characterized by the above-mentioned.

  Further, according to the present invention, in the endoscope, the outer container is configured by a plurality of divided portions that are divided so that the inner wall is exposed, and the divided portions are in contact with each other at a joint surface to constitute an airtight structure. Features.

  In the endoscope according to the present invention, the outer container has a locking portion that locks at least one of the light source unit, the imaging unit, the control unit, and the power feeding unit on the inner wall, and the wiring pattern is the locking unit. And the electrical connection is made at the same time as the mechanical connection at the locking portion.

  According to the present invention, in the endoscope described above, a first semi-cylindrical portion having a semi-cylindrical outer peripheral portion and constituting a part of the outer container, and an engagement provided on the inner wall of the first semi-cylindrical portion. Locked to one of the locking portions and locked to the other one of the first circuit board constituting the imaging portion and the locking portion provided on the inner wall of the first half-cylinder portion to constitute the power feeding portion The battery has a second half-cylinder part that constitutes the outer container together with the first half-cylinder part so as to surround the first circuit board and the power feeding part.

  Further, the present invention provides the endoscope, wherein the outer container is configured by a cylindrical body that forms a convex portion whose end face continuously and smoothly protrudes from the side surface, and the imaging unit includes a cylindrical body whose imaging surface is the outer container. The image pickup surface is arranged on a surface perpendicular to the rotation axis of the image pickup device.

  According to the present invention, in the endoscope, the first substrate constituting the imaging unit is integrally formed so as to extend from the inner wall of the first half-cylinder part.

  Moreover, the present invention is characterized in that, in the endoscope, the second half-cylinder portion has a wiring pattern on an inner wall.

  According to the present invention, in the endoscope, the second circuit board constituting the control unit is provided, and the second circuit board is formed on a wiring pattern provided on the inner wall of the first or second half cylinder part. The engaging portion is electrically connected to the first substrate through the wiring portion, and is electrically connected to the first substrate.

  According to the present invention, in the endoscope described above, a conductor pattern constituting an antenna portion is disposed on the inner wall of the exterior container.

  Further, the present invention is characterized in that in the endoscope described above, the power feeding portion is connected to one end of the outer container by a connector and is detachably connected.

  Further, the present invention provides a light source unit, an imaging unit, and a control unit, including a step of forming an outer casing made of an insulating molded body having a wiring portion made of a wiring pattern on an inner surface, and a wiring portion formed on the inner wall of the outer casing. And at least one of a light source unit, an imaging unit, a control unit for controlling the light source unit or the imaging unit, and a light source unit, an imaging unit, and a control unit, so that at least two of the power feeding units are interconnected. Including a step of mounting a functional unit configured of a power supply unit for supplying power to the battery and a step of sealing the outer container.

  Further, the present invention provides the method for manufacturing an endoscope, wherein the step of forming the outer container includes a step of forming an insulating divided molded body so as to form a plurality of divided portions so that the inner wall is exposed, and a molding Forming a wiring pattern on the inner wall of the body and forming a wiring portion, and forming the divided portion after mounting the functional portion so that at least one of the functional portions is electrically and mechanically connected to the inner wall Joining the bodies so as to abut against each other at the joining surface to form an airtight structure.

  Further, the present invention is the above endoscope manufacturing method, wherein the step of forming the outer container includes a plurality of divided portions, at least one of which is continuously formed from the inner wall via the support bar. Forming an insulating divided molded body so as to include one circuit board, forming a wiring pattern by forming a wiring pattern on an inner wall of the divided molded body, and a first circuit board on which the wiring section is formed Bending the support bar and standing the first circuit board so as to be perpendicular to the inner wall, wherein the functional unit is electrically and mechanically connected to the inner wall. After the mounting, a step of joining the divided molded bodies constituting the divided portions to come into contact with each other at the joining surfaces to form an airtight structure is included.

  According to the above configuration, since the wiring pattern is directly formed on the inner wall of the outer container and the outer container is directly used as a substrate, it is possible to reduce the size and weight. In addition, since the assembly workability is good and the number of connecting portions is small, highly accurate positioning is possible and a highly reliable endoscope can be provided.

(A) And (b) is a partially broken exploded perspective view for demonstrating the outline | summary of the capsule endoscope of Embodiment 1 of this invention. 1 is an external view of a capsule endoscope according to a first embodiment of the present invention. Sectional drawing of the principal part of the circuit board of the capsule endoscope according to the first embodiment of the present invention. (A) And (b) is a principal part enlarged view explaining the mounting process of the circuit board of the capsule endoscope of Embodiment 1 of this invention. (A) And (b) is a figure which shows the formation process of the wiring pattern to the circuit board of the capsule type endoscope of Embodiment 1 of this invention, (c) is BB sectional drawing of (b). (A) thru | or (c) is a figure which shows the formation process of the wiring pattern to the circuit board of the capsule endoscope of Embodiment 1 of this invention. The partially broken disassembled perspective view which shows the capsule type endoscope of Embodiment 2 of this invention The principal part perspective view which shows the capsule type endoscope of Embodiment 2 of this invention The principal part enlarged view which shows the light source part of the capsule type endoscope of Embodiment 2 of this invention The partially broken disassembled perspective view which shows the capsule type endoscope of Embodiment 3 of this invention The figure which shows the wiring part formation process of the capsule type endoscope of Embodiment 3 of this invention Manufacturing process diagram of capsule endoscope according to embodiment 3 of the present invention The partially broken disassembled perspective view which shows the capsule type endoscope of Embodiment 4 of this invention The partially broken disassembled perspective view which shows the capsule type endoscope of Embodiment 5 of this invention The partially broken disassembled perspective view which shows the capsule type endoscope of Embodiment 6 of this invention Overall perspective view showing a capsule endoscope according to a seventh embodiment of the present invention. Sectional drawing which shows the capsule type endoscope of Embodiment 7 of this invention Explanatory drawing which shows the assembly state of the capsule type endoscope of Embodiment 7 of this invention Sectional drawing which shows the modification of the imaging part of the capsule endoscope of this invention The partially broken perspective view which shows the modification of the capsule type endoscope of this invention Sectional drawing which shows the capsule type endoscope of a prior art example

  A capsule endoscope as an embodiment of the present invention will be described below with reference to the drawings.

(Embodiment 1)
The capsule endoscope 100 is directly wired on the inner surface of the outer container 130 as shown in FIGS. 1A and 1B and FIG. A pattern is formed, and an exterior container is used as a circuit board to reduce the size and weight.
The capsule endoscope 100 is characterized in that a wiring part 60 for interconnection between functional parts such as an imaging part is composed of a first wiring pattern 61 formed on the inner wall of the outer container 130. . That is, the capsule endoscope 100 includes an LED light emitting element as a light source unit 22 that irradiates an imaging region, an imaging unit 23 that includes a CCD imaging device, a light source unit or a control unit 26 that drives and controls the imaging unit, and a light source. A functional unit including a button battery 51 as a secondary battery for supplying power to the unit 22, the imaging unit 23, and the control unit 26 and a power supply unit 50 including electrode terminals 52a and 52b, and a functional unit are accommodated. An exterior container 130 and a wiring unit 60 formed on the inner wall of the exterior container 130 and interconnecting at least two of the light source unit 22, the imaging unit 23, the control unit 26, and the power feeding unit 50 are provided. FIG. 1A is an exploded perspective view, and FIG. 1B is a diagram showing a state in which the first circuit board is mounted in the assembly process. The first circuit board 20 and the wiring part 60 formed on the inner wall of the outer container 130 electrically connect the power feeding part 50 and the first circuit board 20 constituting the functional part other than the power feeding part 50. It is connected. A wiring pattern constituting the antenna unit 30 is formed on the inner wall of the outer container 130.

  The outer container 130 has a front lens composed of first and second half-cylinder portions 130a and 130b, each of which is divided into two semi-cylindrical bodies so that the inner wall 130i is exposed, and a translucent acrylic resin. 400, and the first and second half-cylinder portions 130a and 130b and the front lens 400 abut on each other at the joint surface 130S to form an airtight structure.

  As shown in FIG. 2, the capsule endoscope is configured by a cylindrical body having a convex portion whose end face continuously and smoothly protrudes from the side surface. It arrange | positions so that it may have the imaging surface 23P on a surface perpendicular | vertical with respect to the rotating shaft O of the cylindrical body of the container 130. FIG.

Moreover, the inner wall 130i of the 1st half cylinder part 130a is comprised by the flat wall surface 130H and the vertical wall surface 130V perpendicular | vertical to this flat wall surface 130H among the exterior containers. The flat wall surface 130 </ b> H has a locking groove as a locking portion 132 that locks the first circuit board 20 on which the light source unit 22, the imaging unit 23, and the control unit 26 are mounted. In addition, the electrode terminals 52a and 52b constituting the power feeding unit 50 are also locked to the locking portion 132 provided on the inner wall 130i. A button battery 51 is mounted between the electrode terminals 52a and 52b. The locking part 132 is configured by a groove formed in a flat wall surface 130H that is one of the inner walls of the first half-cylinder part 130a.
In each of these locking portions 132, the wiring pattern constituting the wiring portion 60 extends to the locking portion 132, and the locking portion 132 is configured to be electrically connected simultaneously with mechanical connection (described later). ).

  Further, the functional part constitutes the first circuit board 20 and is made of an acrylic resin and has an imaging region on the insulating substrate 21 having the through opening H as shown in the cross-sectional explanatory view of FIG. 4 LED light-emitting element chips, an image pickup part 23 constituted by a CCD image pickup element chip, and a control circuit IC as a control part 26 for driving and controlling the light source part or the image pickup part are mounted as the light source part 22 for irradiating the light source. Configured.

  The power supply to the light source unit 22, the imaging unit 23, and the control unit 26 is supplied from the button battery 51 through the electrode terminals 52 a and 52 b, and the wiring unit 60 including the wiring pattern provided on the vertical wall surface 130 </ b> V and the locking unit 132. The first circuit board 20 is connected via a wiring pattern (not shown) of the first circuit board 20 via the first circuit board 20. Reference numeral 40 denotes a lens unit.

  The image pickup unit 23 is connected to the CCD image pickup device chip 231 flip-chip connected to the first surface 21A side of the substrate 21 via the bumps 231S so as to close the through opening H, and the image pickup surface of the CCD image pickup device chip 231. Oppositely, a translucent member 232 is provided on the second surface 21B side of the substrate 21. The CCD image sensor chip 231 includes a photoelectric conversion unit formed on the surface of a silicon substrate and a charge transfer unit connected to the photoelectric conversion unit. Further, the IR filter as the translucent member 232 is formed of a glass substrate and is bonded via an adhesive resin. Also, a second wiring pattern 236 is formed on the substrate 21 constituting the first circuit board 20 so as to be connected to the wiring section 60. The second wiring pattern 236 is used to supply power to the CCD image pickup device chip 231 and the first circuit board. 1 is connected to a control IC 261 mounted on one surface 21A. The control IC 261 is a DSP (digital signal processor) that electrically corrects the output signal to correct the resolution, color tone, shading, etc. of the camera in addition to the one that controls the drive of the CCD image sensor chip 231. Is installed. Furthermore, in addition to the control IC 261, a communication IC 262 is also mounted, and a signal corrected by a DSP or the like is output as a radio signal. This is received by an external receiver and displayed on a display (not shown).

  In addition, the lens unit 40 is configured such that a guide shaft (not shown) is supported by a lens unit support 42 by an actuator using an electromagnetic element, a piezoresistive element, a polymer element (artificial muscle) or the like built in the first circuit board 20. As the lens slides, the lens 41 of the lens unit moves along the optical axis so that the distance from the CCD image sensor chip can be adjusted. Reference numeral 43 denotes a stop, and the stop amount of the stop 43 is also controlled by the control IC 261.

Next, the connection with the locking portion 132 of the first circuit board 20 will be described.
On one side surface 20S of the first circuit board 20, as shown in FIG. 4A, a groove portion 211 and a second wiring pattern 236 formed along the groove portion 211 are formed. As shown in FIG. 4B, the one side surface 20S of the first circuit board 20 is brought into contact with a locking portion 132 made of a groove disposed in the first half-cylinder portion 130a of the outer container 130. Bonding with a conductive adhesive 24. As described above, the first wiring pattern 61 constituting the wiring unit 60 extends in the engaging portion 132, and electrical connection between the first wiring pattern 61 and the second wiring pattern 236 is performed. Realize. In addition, the first circuit board 20 is inserted into the groove portion constituting the locking portion 132 and joined with an adhesive, whereby mechanical connection is realized simultaneously with electrical connection. Further, positioning becomes easy, and a reliable and strong connection is achieved on the inner wall of the outer container.

  The groove portion 211 and the second wiring pattern of the first circuit board 20 are formed as follows. First, as shown in FIG. 5A, a hole h0 is formed in the substrate 21 so as to show an end of the insulating substrate 21 constituting the first circuit board 20, and then a laser beam is irradiated. The substrate surface in the irradiation region is activated to form an activation region 236R. Then, it is immersed in a plating bath, and as shown in FIGS. 5B and 5C, a second wiring pattern 236 made of a plating layer is formed so as to include the inside of the hole h0. Then, dicing is performed along the dicing line including the hole h0 as indicated by XX. As a result, as shown in FIG. 4A, a wiring board having a groove covered with the second wiring pattern 236 at the end can be obtained. Here, the second wiring pattern is also formed on the first surface and the second surface of the substrate. FIG. 5C is a cross-sectional view taken along the line BB in FIG.

In manufacturing, first, a second wiring pattern 236 is formed on an insulating substrate 21 having a through opening and a hole, and then diced to prepare a substrate.
Thereafter, the image pickup element chip 231, a translucent member, a control IC, and the like are mounted to form the first circuit board 20.
Then, the solder 62 is dipped on the first wiring pattern 61 of the locking portion provided on the inner wall of the first half-cylinder portion 130 a of the outer container 130, and the side surface that is the terminal forming surface of the first circuit board 20. The end portions of 20S and the terminal portions 52a and 52b constituting the power feeding portion 50 are mounted, heated, and solder reflowed.
Then, as shown in FIG. 1, the first and second half-cylinder portions and the lens 400 are combined, and the heater wire 900 formed on the joining surface of the first and second half-cylinder portions is energized and heated. Then, the bonding surface is fused.

  As described above, according to the present embodiment, since the interconnection of the functional units is realized by the wiring unit 60 formed on the inner wall of the outer container 130, the wiring length can be minimized and fixed wiring can be achieved. Therefore, displacement and breakage due to vibration can be prevented. In addition, since the positions of the components such as the lens module and the imaging unit are positioned and mounted with high accuracy with respect to the outer container 130 made of MID, assembly with extremely high accuracy is possible.

  Since the first circuit board 20 and the power feeding unit 50 are directly mounted on the inner wall of the outer container 130, not only can the number of components be reduced, but also there are few adhesion points and a margin is not necessary. As a result, the number of assembly steps can be reduced. Moreover, mounting is easy and size reduction is realizable. Moreover, since unnecessary members can be reduced, the weight can be reduced.

Furthermore, since the capsule constituting the outer container 130 plays a role of fixing the first circuit board 20, a jig for fixing the board at the mounting step or during repair is not necessary.
The interconnection between the imaging unit 23 and the power supply unit 50 is realized by the wiring unit 60 formed on the inner wall of the outer container, and unnecessary bending of an FPC (flexible wiring board) or a metal terminal is unnecessary. Therefore, the reliability of the mounting part is improved.

  In addition, since it is used in the body, it is obliged to use a member with a high medical grade, but the design is easy because the number of parts is small and the number of bonded parts is small.

  Furthermore, since the first wiring pattern 61 is formed so as to oppose the opening direction of the division part of the outer container, connection is easy and pattern formation is also easy.

Further, since the outer container is composed of a cylindrical body that constitutes a convex portion whose end face continuously and smoothly protrudes from the side surface, the outer container can not only smoothly move inside the body but can also be formed by resin molding. Therefore, a desired shape can be easily obtained.
Further, since the imaging unit is arranged so that the imaging surface has the imaging surface 23P on a surface perpendicular to the rotation axis O of the cylindrical body constituting the outer container, the imaging unit is efficiently placed in front of the capsule endoscope. In addition to being able to capture images, it is easy to align the optical axes.

  In addition, a wiring pattern may be formed on the inner wall of the second half cylinder part joined to the first half cylinder part. The wiring area can be increased. By using the antenna pattern, the entire inner wall of the outer container can be used as the antenna unit 30, and high sensitivity can be achieved.

  Further, the antenna unit 30 or the wiring unit 60 may constitute an embedded wiring in the outer container as well as the inner wall of the outer container. In particular, the antenna unit 30 can be formed in a coil shape so as to go around the inner wall of the outer casing through a through hole in the outer casing.

Here, the CCD image pickup device chip 231 constituting the image pickup unit 23 is a CCD chip, but a so-called system-on-chip (SOC) type in which a circuit of a DSP function is arranged around the sensor portion of the CCD image pickup device chip 231. A solid-state image sensor may be used.
This makes it possible to further reduce the size.

  As described above, the first circuit board (substrate 20) on which the CCD image pickup device chip is mounted can be manufactured and used by selecting a resin having a thermal expansion coefficient close to that of the silicon chip constituting the CCD image pickup device. Even in an environmental change such as a temperature cycle at the time, it is possible to suppress the generation of stress to the joint portion and to suppress the generation of chip cracks.

In addition, since power can be supplied to the actuator through the first circuit board 20, a wiring length can be shortened, a small electrical loss, a small camera module with excellent appearance can be provided. It becomes possible.
By implementing the present invention, it is effective for miniaturization of the solid-state imaging device.

  In addition, as a translucent member, you may use what formed the filter film | membrane or the antireflection film in the translucent board | substrate, without being limited to IR filter. Thus, when the light transmitting substrate is provided with a filter function or an antireflection function, the optical characteristics can be further improved.

  In the present embodiment, the first circuit board is a resin substrate, but a ceramic substrate may be used. When the ceramic substrate is used, the chip components can be embedded in the three-dimensional wiring substrate by stacking and firing while mounting the chip components such as the processing circuit when the ceramic green sheets are stacked. Further, in this case, since the circuit portion has a multilayer structure, the degree of freedom in circuit design is improved, and circuit arrangement that is resistant to noise and circuit routing when changing the design are facilitated.

  Further, it is also possible to embed and form a wiring pattern for the exterior container itself to form an antenna portion. Alternatively, it is possible to form the outer container in a mold with the chip parts mounted on the lead frame and lead the lead to the inner wall of the outer container.

In forming the wiring pattern on the first and second semi-cylindrical parts constituting the outer container, for example, the following method can be used.
1) Injection molding As shown in FIG. 6A, the first and second semi-cylindrical portions 130a and 130b are formed by injection molding. Various materials can be used as the material, and PBT, a mixture of PET, and the like are applicable.
2) Activation by laser irradiation As shown in the enlarged cross-sectional view of the main part in FIG. 6B, the wiring pattern forming region of the inner wall 130i of the first and second semi-cylindrical parts is irradiated with a laser beam, and the physicochemical reaction Thus, the activation region 61R is formed. This activated region 61R becomes a nucleus of a copper plating layer or the like.
3) Plating As shown in the enlarged cross-sectional view of the main part in FIG. 6C, a plating layer such as copper is formed in the activation region 61R by plating to form the wiring pattern 61. This activated region acts as a catalyst for plating, and a desired film thickness can be selectively obtained. The film thickness at this time is about 3 to 5 μm. In addition to copper, Ni, Au, Sn, Sn / Pb, Ag, Ag / Pd, and the like can be formed.
4) Annealing treatment The formed wiring pattern is annealed.
In this way, a highly accurate pattern can be formed.

In forming the circuit pattern on the first and second semi-cylindrical parts constituting the outer container, for example, the following method can be used.
1) After the first and second semi-cylindrical portions are formed by injection molding, the surface is subjected to a plasma treatment to roughen the surface to give fine irregularities.
2) A thin metal film is provided on the entire surface of the first and second semi-cylindrical portions as a base layer. The formation of the underlayer is realized by performing sputtering on the surface of the resin substrate constituting the first and second semicylindrical portions. In addition to sputtering, electroless plating can be performed after applying a catalyst, or CVD or PVD can be used to form the film by any method. In addition, the material for the underlayer includes Cu, Ni, Pd, Cr, Ag, and the like. When forming by performing sputtering, a thin underlayer is formed. The underlayer can also be formed by forming a plating catalyst or a plating catalyst compound on the inner walls of the first and second semicylindrical portions.
3) Laser irradiation The inner walls of the first and second semi-cylindrical portions are irradiated with electromagnetic waves such as laser to remove the thin base layer of the irradiated portions. For example, the base layer in the boundary region with the circuit portion of the non-circuit portion is removed.
4) Plating After irradiating the boundary region with a laser, a plating layer such as copper is deposited on the base layer of the circuit portion by electroplating.
5) Removal of underlying layer The underlying layer exposed on the surface is removed by soft etching to form a wiring pattern.
In this way, the wiring part 60 or the antenna part 30 with high accuracy and high reliability can be easily formed.
In addition, the second wiring pattern is formed on the first circuit board by screen printing, but sputtering and plating may be similarly used for the first circuit board.

  In addition, when a multilayer ceramic substrate is used as the ceramic substrate instead of the resin substrate as the substrate constituting the first and second semicylindrical portions, it can be performed simultaneously with firing using a green sheet.

  In this way, the positional accuracy of the optical components such as lenses and the wiring pattern on the exterior container and the first circuit board is dramatically improved, so that the image quality is improved, the optical axis is not adjusted during assembly, etc. Benefits can be gained.

  Note that the formation of the wiring pattern on the exterior container and the first circuit board is not limited to the above method, and a ceramic substrate containing a metal is used, and the substrate surface on which the wiring pattern is to be formed is irradiated with laser. By exposing this metal, performing selective plating on this metal, and further performing an annealing process, the method of forming a wiring pattern can be appropriately changed. In order to obtain a high-accuracy pattern, it is desirable that this annealing process be performed by two-stage heat treatment of low temperature heating and high temperature heating.

Moreover, in the said embodiment, although the resin-made solid board | substrate formed by injection molding was used as an exterior container, a ceramic substrate may be used and the laminated substrate using a green sheet may be used. Here, for example, it is made of ceramic dielectric material LTCC (Low Temperature Co-fired Ceramics) that can be sintered at a low temperature of 1000 ° C. or lower, and has a low resistivity on a green sheet having a thickness of 10 μm to 200 μm. An insulating layer provided with an internal conductor layer by printing a conductive paste such as Ag or Cu to form a predetermined pattern, using a plurality of green sheets as an insulating layer, and appropriately laminating and sintering. (Dielectric layer). As these dielectric materials, for example, Al, Si, Sr as main components, Ti, Bi, Cu, Mn, Na, K as subcomponents, Al, Si, Sr as main components, Ca, Pb A material containing Na, K as a multicomponent, a material containing Al, Mg, Si, Gd, or a material containing Al, Si, Zr, Mg is applicable. Here, a material having a dielectric constant of about 5 to 15 is used. In addition to the ceramic dielectric material, it is also possible to use a resin multilayer substrate or a multilayer substrate made of a composite material obtained by mixing a resin and ceramic dielectric powder. In addition, the ceramic substrate is made of HTCC (High Temperature Co-fired Ceramics) technology, the dielectric material is mainly Al ₂ O ₃ , and the transmission line is made of tungsten or the like as the internal conductor layer. You may comprise as a metal conductor which can be sintered at high temperature, such as molybdenum.

  Moreover, it is not limited to a green sheet, but can be applied to other ceramics. When a resin substrate such as an epoxy resin, a polyimide resin, a polyester resin, or a polyethylene terephthalate resin is used, a laminated substrate using a prepreg, etc. It is also applicable to.

  In addition to the acrylic resin, a transparent resin such as polycarbonate resin or ABS can be used as the front lens.

(Embodiment 2)
In the above-described embodiment, all of the functional units are mounted on the first circuit board 20 except for the power feeding unit. However, a second circuit board or a plurality of circuit boards may be added.
Next, as a second embodiment of the present invention, an example using second and third circuit boards and three circuit boards will be described.
This capsule endoscope 101 is directly wired to the inner surface of the outer container 130 in this embodiment as shown in a partially broken exploded perspective view and an enlarged view of a main part for explaining the outline in FIGS. It is the same as the capsule endoscope 100 of the first embodiment in that a pattern is formed and an outer container is used as a circuit board, and the size and weight are reduced. Although FIG. 8 is mentioned later, it is an enlarged view of a circuit board latching | locking part.

  In the capsule endoscope 101, as shown in an enlarged view of a main part of the light source unit in FIG. 9, the LED light emitting element as the light source unit 22 that irradiates the imaging region constitutes an outer container in a bare chip state. It is mounted on the first wiring pattern 161 provided on the inner wall of the half cylinder portion 130a using solder 162. In addition, an image pickup unit 23 composed of an image pickup element constituted by a CCD camera is mounted on one circuit board 120 together with a control circuit (not shown). In this configuration, the LED light emitting element 122 is mounted in a bare chip state in the concave portion 123 formed in the inner wall 130i of the first half-cylinder portion 130a and filled with the sealing resin 124, whereby the outer container 130 emits LED light. The element 122 is directly mounted.

  The lens unit 40 includes a lens, a lens folder, and an actuator that drives them with an electrical signal, and constitutes a second circuit board 140 as a lens module board. In this second substrate, the lens folder may be formed of MID to form a coil on the outer peripheral portion and drive the lens as an actuator.

  Furthermore, the RF module 31 and the antenna unit 30 that constitute the communication unit are mounted on the third circuit board 110, and the first to third circuit boards are provided on the inner wall of the outer container. To achieve electrical and mechanical connections.

  As in the first embodiment, the power feeding unit 50 is composed of the button battery 51 and the electrode terminals 52a and 52b. Similarly, the button battery 51 is supported by the electrode terminals 52a and 52b neglected by the locking part 132. Yes.

  Then, the first wiring pattern 161 provided on the inner wall of the first half-cylinder part 130a constituting the outer container, the light source part 22, the second circuit board 140 constituting the lens module, and the first part constituting the imaging part. Circuit boards 120 are interconnected.

  Also in the present embodiment, the outer container 130 includes the first and second half-cylinder portions 130a and 130b that are divided into two semi-cylindrical bodies so that the inner wall 130i is exposed, and a translucent resin. The first and second half-cylinder portions 130a and 130b and the front lens 400 are in contact with each other at the joint surface 130S to form an airtight structure.

  The external appearance is the same as that shown in FIG. 2, and this capsule endoscope is composed of a cylindrical body that forms a convex part whose end face protrudes smoothly from the side surface. The imaging surface is arranged so as to have the imaging surface 23P on a surface perpendicular to the rotation axis O of the cylindrical body of the outer container 130.

  Further, the locking groove 132V as the locking portion 132 for locking the first to third circuit boards is provided in the horizontal portion of the inner wall, that is, the flat wall surface 130H, as shown in the enlarged view of the main portion in FIG. It is formed in a region surrounded by the convex portion 133 and is configured to be wide on the opening side. According to this configuration, when the circuit board is mounted on the locking portion, the circuit board can be locked securely and easily inserted.

  Also in the present embodiment, the first wiring pattern 161 constituting the wiring portion extends to the locking portion 132 in these locking portions 132, and electrical connection is made simultaneously with mechanical connection in the locking portion 132. It is configured as follows.

According to the present embodiment, as in the capsule endoscope of the first embodiment, since the functional units are interconnected via the wiring unit, the reliable and highly reliable, small and reliable It is possible to provide a high capsule endoscope.
Note that the number of circuit boards is three, and the workability of mounting on the exterior container is lowered, but mounting and replacement of the first to third circuit boards is easy. In the third circuit board 110 constituting the communication unit, since the antenna unit 30 and the RF module 31 are mounted on the same substrate, the wiring length can be reduced and noise can be reduced.

  Further, the number of circuit boards may be increased. In this case, the locking portions 132 are added so as to correspond to the number of circuit boards.

(Embodiment 3)
In the first embodiment, all of the functional parts are mounted on the first circuit board 20 except for the power feeding part, and the first circuit is provided via the locking part 132 formed on the inner wall 130i of the outer container 130. Although the substrate 20 is mounted on the inner wall of the outer container 130, the present embodiment is characterized in that the substrate 21 constituting the first circuit board 20 is formed on the inner wall 130i of the outer container 130 by integral molding.

  That is, in the present embodiment, as shown in FIGS. 10 and 11, the functional portion corresponding to the first circuit board 20 is continuously connected to the inner wall 130 i of the exterior container via the support bar 135 as a connecting portion. The first circuit board portion 136 is formed in the first circuit board portion 136. Also in this configuration, the member mounted is the same as the member mounted on the circuit board 20 of the first embodiment.

  Others are formed in the same manner as in the first embodiment. The capsule endoscope forms first and second half-cylinder portions 130 a and 130 b as divided molded bodies constituting the outer container 130. The outer container is formed by injection molding so that the first circuit board portion 136 is continuously formed from the inner wall of one of the first and second half-cylinder portions 130a and 130b via the support bar 135. To do. Then, a second wiring pattern 236 is formed on the first circuit board portion 136 to constitute a wiring portion (FIG. 11). Thereafter, the support bar 135 is bent and the first circuit board portion 136 is erected to obtain the endoscope shown in FIG.

Next, the manufacturing process will be described in detail.
A mold is prepared, and first and second half-cylinder portions 130 a and 130 b are formed as divided molded bodies constituting the outer container 130. At this time, the first circuit board part 136 is continuously formed from the inner wall of one of the first and second half-cylinder parts 130a and 130b via the support bar 135 (FIG. 12A).
And in this state, the pattern which comprises the 1st wiring pattern 161 and the antenna part 30 is formed through sputtering method and plating method (FIG.12 (b)). Although not shown here, the wiring pattern 161 is continuously formed on the first circuit board portion 136 as the second wiring pattern 236 from the inner wall of the first half-cylinder portion 130 a via the support bar 135.

Then, after the translucent member 232 is mounted, the first circuit board part 136 on which the wiring part is formed stands up so that the support bar is bent and the first circuit board part 136 is perpendicular to the inner wall. (Fig. 12 (c)). At this time, a locking portion that locks the first circuit board portion 136 may be formed on the inner wall of the first half-cylinder portion 130a.
Thereafter, the support bar is filled with solder or a conductive adhesive to supplement the electrical and mechanical connections.

Subsequently, the image sensor chip 123 is mounted, and the control IC 261 and the like are mounted as in the first embodiment.
Then, the power feeding unit is attached and joined together with the second half-cylinder unit and the front lens 400 to obtain a capsule endoscope as in the first embodiment.

  According to this method, the first circuit board is integrally formed with the outer container to form the first circuit board portion, and the wiring pattern is formed simultaneously with the formation of the inner wall of the outer container as it is. Can be formed. Further, since the translucent member is mounted on the inner wall, a supporting jig is not required.

(Embodiment 4)
In the first to third embodiments, the power supply unit 50 including the button battery has been described. However, in the present embodiment, as shown in FIG. 13, a magnetic device configured to perform power supply by non-contact power supply. A power receiving side coil 53 made of a body pattern is formed by printed wiring, and power is supplied through a power feeding side coil (not shown) provided outside. Further, in the present embodiment, the first circuit board portion 146 is integrally formed along the axis O of the outer container, and the imaging element chip 123 is mounted on the first circuit board portion 146, and the imaging surface is this It is formed to be in a direction parallel to the central axis O. Reference numeral 236 denotes an LED light emitting element.

  Other parts are the same as those in the first to third embodiments, and the LED light emitting element 22 as the light source unit 22 that irradiates the imaging region, the imaging unit 23 including the CCD imaging device, and the light source unit or the imaging unit are driven and controlled. The control unit 26 is housed in the outer container 130, the wiring unit 60 is formed on the inner wall of the outer container 130, and at least two of the light source unit 22, the imaging unit 23, the control unit 26, and the power supply unit 50 are mutually connected. Connecting. The wiring portion 60 is composed of a first wiring pattern formed on the inner wall of the outer container 130.

According to this configuration, the endoscope does not require the button battery 51, and only the power receiving side coil 53 is required. Therefore, the endoscope can be reduced in size.
In addition, it is possible to obtain a reliable image output using the side surface direction of the endoscope as the imaging surface.

(Embodiment 5)
In the fourth embodiment, the first circuit board portion 146S is integrally formed along the axis O of the outer container, and the imaging surface is formed in a direction parallel to the central axis O. In this embodiment, as shown in FIG. 14, the first circuit board portion 146S is integrally formed in the direction perpendicular to the axis O of the outer container, and the image sensor chip 231 is mounted on the first circuit board portion 146S. The imaging surface is formed in a direction perpendicular to the central axis O. Reference numeral 121 denotes an LED light emitting element.

  The other parts are the same as in the fourth embodiment, and drive control of the LED light emitting element 121 as the light source part 22 that irradiates the imaging area, the imaging part 23 including the CCD imaging element 231, and the light source part or the imaging part is performed. The control unit 26 is housed in the outer container 130, the wiring unit 60 is formed on the inner wall of the outer container 130, and at least two of the light source unit 22, the imaging unit 23, the control unit 26, and the power supply unit 50 are mutually connected. Connecting. The wiring portion 60 is composed of a first wiring pattern formed on the inner wall of the outer container 130.

Also with this configuration, since the first circuit board is integrally formed with the exterior container, the step of mounting the first circuit board is not required, the positional accuracy is improved, and the mounting workability is improved.
In addition, it is possible to obtain a reliable image output with the front of the endoscope as the imaging surface.

(Embodiment 6)
As shown in FIG. 15, the endoscope according to the present embodiment is configured to be connected to an external display (not shown) via a cable 702, and via a socket 137 formed in the main body 102. A connector can be connected. That is, the adapter 700 having the plug 701 configured to be connectable to the socket 137 of the main body 102 is provided, and the other end of the adapter 700 is led out of the body through the cable 702. In addition, the main body 102 is provided with a power receiving coil that enables non-contact power feeding as in the fourth embodiment, and performs both contact power feeding from the outside via a cable and non-contact power feeding via the power receiving coil. Configured for use.
Also here, a first circuit board (not shown) is accommodated in an outer container 130 formed as a two-part body of the first and second half-cylinder portions 130a and 130b. And a wiring part (not shown) is formed in the inner wall of the exterior container 130, and a light source part, an imaging part, a control part, and a power feeding part are interconnected. This wiring portion (not shown) is composed of a first wiring pattern (not shown) formed on the inner wall of the exterior container 130.
Since the functional units other than the power feeding unit are formed in the same manner as in the first embodiment, description thereof is omitted here.

  According to this configuration, contactless power feeding can be used when further miniaturization is required. Moreover, when non-contact electric power feeding is difficult to use, it can be used as a safety device.

(Embodiment 7)
In the first to sixth embodiments, the exterior container 130 is divided into two parallel to the axis. However, in the present embodiment, as shown in FIGS. 16 and 17, the exterior container is a hemispherical exterior. It is characterized by comprising a container body 630 and an auxiliary function unit 650 connected to the container body 630 by a connector. FIG. 18 is an explanatory diagram showing an assembled state of the capsule endoscope according to the seventh embodiment of the present invention.
In this embodiment, FIG. 16 is an overall perspective view, and FIG. 17 is a cross-sectional view of a main body for explaining the outline. The hemispherical outer container body 630 is composed of a ceramic substrate as a three-dimensional circuit board, and is configured to project the intermediate support 630T inward from the inner wall at an intermediate position of the cylindrical body, and is joined to the top surface. And a lid portion 630F made of a translucent resin. An imaging element chip 231 is mounted on the first surface TA of the intermediate support portion 630T, an IR filter 232 is mounted on the second surface TB, and the lens unit 40 is mounted on the outer side of the inner wall of the exterior container body 630. Has been. The lens unit 40 includes a lens 41 and a diaphragm 43. The exterior container main body 630 is formed of a multilayer ceramic having an insulating layer and a wiring layer, and has an intermediate support portion 630T that protrudes toward the central opening H. The functional parts are interconnected and fixed via the wiring part 636 formed on the inner wall of the outer container body part, so that the imaging part and the outer container body part can be aligned and fixed. On the front surface, the light source unit 22 composed of an LED light emitting element is directly mounted on the exterior container main body 630. The auxiliary function unit 650 is connected to the outer container body 630 by a connector, and a power feeding unit and a communication unit are mounted. Reference numeral 137 denotes a connector wiring.

  In the present embodiment, as shown in FIG. 16, a wiring part is provided directly on the inner wall of the three-dimensional circuit board constituting the exterior container main body part, and a CCD image pickup device chip 231 and the like are mounted. As shown in the cross-sectional view of FIG. 17, the exterior container body 630 constitutes a mounting substrate, is composed of a cylindrical body having an intermediate support portion 630T having an opening H at the center, and has a translucent surface on the front surface. A front lid portion 630F1 made of acrylic resin is attached. Then, the CCD image sensor chip 231 disposed on the first surface TA of the intermediate support portion 630T so as to close the opening H, and the second surface TB of the intermediate support portion 630T so as to close the opening H. The IR filter 232 is disposed opposite to each other. Further, a chip component such as a processing circuit may be formed of a ceramic laminated substrate and embedded in a three-dimensional circuit substrate constituting the outer container main body 630.

  A second wiring pattern 236 is also formed on the intermediate support portion 630T so as to be connected to the wiring portion, and is connected to a power supply to the CCD image pickup device chip 231 and a control IC 261 mounted on the first surface TA. Yes. The control IC 261 is a DSP (digital signal processor) that electrically corrects the output signal to correct the resolution, color tone, shading, etc. of the camera in addition to the one that controls the drive of the CCD image sensor chip 231. Is installed. In addition to the control IC 261, the communication IC 262 is also mounted on the first surface TA of the intermediate support portion, and outputs a signal corrected by a DSP or the like as a radio signal. This is received by an external receiver and displayed on a display (not shown).

  That is, the intermediate support portion 630T serves as the first circuit board in the first embodiment, and the CCD image pickup device chip 231 and the IR filter 232 are mounted from the first and second surfaces, respectively. Yes.

When assembling, first, the outer container body 630 is formed by stacking green sheets. Then, the CCD image pickup device chip 231, the control IC 261, the communication IC 262, and the like are mounted from the first surface TA side of the intermediate support portion 630T. Thereafter, the IR filter 232 and the lens unit 40 are mounted from the second surface TB side of the intermediate support portion 630T. Finally, the lid 630F is joined. This joining is performed in an airtight manner by fusion as in the first embodiment. The lid portion is made of a translucent acrylic resin and constitutes a front lens.
Then, as shown in FIG. 16, the auxiliary function unit 650 is connected to a connector to form a cable-type endoscope.

  As shown in FIG. 18, instead of the auxiliary function unit 650, a back cover unit 630F2 with a button battery 651 mounted is connected to the outer container body unit 630 via an electrode terminal 652, and fused. Thus, the joint surfaces can be hermetically joined to form a capsule endoscope.

  Further, instead of the auxiliary function unit 650, if a non-contact power supply coil and a communication unit including an antenna unit and a communication IC are connected by a connector, it can be used as a capsule endoscope.

  Also in the present embodiment, as in the first embodiment, the lens unit 40 includes an electromagnetic element, a piezoresistive element, a polymer element (artificial muscle), etc. (not shown) built in the first resin substrate. When the support portion of the lens unit slides on the guide shaft by the actuator using the lens, the lens of the lens unit moves along the optical axis, and the distance from the CCD image pickup device chip 231 can be adjusted.

  Note that the imaging unit can be changed as appropriate. For example, as shown in FIG. 19, the CCD imaging device chip 231 is arranged on one side of the first circuit board 20. May be. Here, the support part 42S is installed on the first circuit board 20, and the lens unit 40 is installed so as to be movable (by an actuator not shown) with respect to the support part 42S.

According to the present embodiment, since the size can be further reduced as compared with the capsule endoscope of the first embodiment, and the three-dimensional circuit board constituting the mounting board itself constitutes the outer container, In addition to being highly accurate and capable of suppressing displacement, it is extremely lightweight and can be miniaturized.
Also in this embodiment, it is desirable to coat the entire outer container with a high medical grade coating agent.

In the above embodiment, the case where the element chip is mounted on the inner wall of the exterior container has been described. However, an electronic component package may be used instead of the element chip.
Although the adhesive member is solder here, it is needless to say that the adhesive member is not limited to solder but can be applied to a conductive adhesive such as silver paste or an insulating adhesive.

  Moreover, in this Embodiment, you may form an antenna part using a multilayer wiring in a cylindrical exterior container main-body part.

Furthermore, as shown in FIG. 20, a wiring pattern constituting the antenna unit 30 is continuously formed so as to go around the inner wall 130i of the first and second half-cylinder parts 130a and 130b constituting the outer container 130. Also good. In this case, the concave portion 32t and the convex portion 32v are formed so as to include the formation position of the antenna portion 30 on the joint surface of the first and second half-cylinder portions 130a and 130b. As a result, when the first and second half-cylinder portions 130a and 130b come into contact with each other at the joint surface 130S, the pattern of the antenna portion 30 formed along the concave portions 32t and the convex portions 32v is engaged, so that To form an antenna. This antenna is preferably formed on the entire inner wall surface of the outer container. Further, the antenna unit 30 formed of the meander pattern formed in the first to sixth embodiments may be interconnected, or may be used as another antenna.
Needless to say, this configuration can be applied to any of the first to sixth embodiments.

  Note that the first wiring pattern formed on the inner wall of the outer packaging device is configured to face the opening direction of the division part of the outer container, thereby facilitating the formation of the wiring pattern and increasing the pattern accuracy. Can measure.

  In addition, the exterior container is formed of a cylindrical body that forms a convex portion whose end surface continuously and smoothly protrudes from the side surface, and the imaging unit has an imaging surface on a surface perpendicular to the rotation axis of the cylindrical body of the exterior container. By locating with an imaging surface, the front surface of the endoscope can be irradiated.

  In addition, the exterior container is configured by a cylindrical body that forms a convex portion whose end surface continuously and smoothly protrudes from the side surface, and the imaging unit has a surface on which the imaging surface is parallel to the rotation axis of the cylindrical body of the exterior container. By being arranged so as to have an imaging surface, it is easy to image the side surface of the endoscope.

  In addition, by providing an element mounting portion on the inner wall of the exterior container and mounting a bare chip on this element mounting portion, an endoscope having a lighter weight and better mounting workability can be obtained.

  In addition, the number of components can be reduced by mounting the light source unit on the first substrate on which the imaging unit is mounted.

  In addition, by arranging a conductor pattern constituting the antenna portion on the inner wall of the exterior container, the antenna area can be increased and the sensitivity of the communication function can be increased.

  In addition, a secondary battery is used as the power feeding unit, and the endoscope is locked to the locking portion so that electrical connection and mechanical connection are made to the inner wall of the outer container. Obtainable.

  Further, the power feeding unit is a coil made of a wiring pattern formed on the inner wall of the exterior container, a coil prepared separately, or a dielectric, and forms a non-contact power feeding unit using electromagnetic induction or electromagnetic field resonance. It may be. In this case, a wiring pattern corresponding to the antenna unit 30 shown in FIG. 20 may be formed at various locations on the inner wall and used as a coil or an antenna unit. Thereby, a small-sized endoscope that can be easily controlled from the outside can be obtained.

  In addition, the first circuit board is a cylindrical body having an intermediate support portion having an opening at the center, the imaging element mounting region formed on the first surface of the intermediate support portion, and the second of the intermediate support portion. A translucent member mounting region formed on the surface of the lens, and having a support unit that supports the lens unit at a position corresponding to the opening, so that the outer container does not have a two-part structure, and has a cylindrical shape. It is possible to achieve a significant reduction in weight and size by mounting the device directly on the exterior container.

  Moreover, the exterior container may be comprised with the resin molding. Thereby, shaping | molding is easy and the freedom degree of a shape can be raised.

  Moreover, the exterior container may be comprised with the ceramic molded body. Thereby, flatness is high and reliability can be improved with a stable shape. The medical grade is also high.

20 First circuit board 21 Substrate 22 Light source unit 23 Imaging unit 26 Control unit 30 Antenna 31 RF module 40 Lens unit 42S Support unit 50 Power supply unit 51 Button battery 52a, 52b Electrode terminal 60 Wiring unit 61, 161 First wiring pattern 100, 101 Capsule endoscope 102 Main body part 130 Exterior container 130a First half cylinder part 130b Second half cylinder part 130i Inner wall 130S Joint surface 136 First circuit board part 137 Socket H Opening part TA First surface TB Second surface 231 CCD image pickup device chip 232 IR filter 236 Second wiring pattern 261 Control IC
262 Communication IC
400 Front lens 630 Exterior container body 630T Intermediate support 630F1 Front cover 650 Auxiliary function 630F2 Back cover 651 Button battery 652 Electrode terminal 700 Adapter 701 Plug 702 Cable 900 Heater wire

Claims (12)

A light source unit;
An imaging unit;
A control unit for controlling the light source unit or the imaging unit;
A functional unit configured with a power supply unit for supplying power to at least one of the light source unit, the imaging unit, and the control unit;
An outer container for storing the functional unit;
An endoscope comprising: a wiring unit that interconnects at least two of the light source unit, the imaging unit, the control unit, and the power feeding unit,
The endoscope which the said wiring part consists of a wiring pattern formed in the inner surface of the said exterior container. The endoscope according to claim 1, wherein
The outer container is composed of a plurality of divided portions so that the inner wall is exposed,
An endoscope in which the divided portions are in contact with each other at a joint surface to constitute an airtight structure. The endoscope according to claim 1 or 2, wherein
The outer container has a locking portion that locks at least one of the light source unit, the imaging unit, the control unit, and the power feeding unit on the inner wall,
An endoscope in which the wiring pattern extends to the locking portion, and electrical connection is made simultaneously with mechanical connection at the locking portion. The endoscope according to any one of claims 1 to 3,
A first semi-cylindrical part having a semi-cylindrical outer peripheral part and constituting a part of the outer container;
A first circuit board that is locked to one of the locking portions provided on the inner wall of the first half-cylinder portion and constitutes the imaging unit;
A battery that is locked to the other one of the locking portions provided on the inner wall of the first half-cylinder portion and constitutes the power feeding portion;
An endoscope having a first half-cylinder part and a second half-cylinder part constituting the outer casing so as to surround the first circuit board and the power feeding part. The endoscope according to claim 4, wherein
An endoscope formed integrally with the first substrate constituting the imaging unit so as to extend from an inner wall of the first half-cylinder part. The endoscope according to claim 4 or 5, wherein
The second half tube portion is an endoscope having a wiring pattern on an inner wall. The endoscope according to any one of claims 4 to 6,
A second circuit board constituting the control unit;
The second circuit board is locked by a locking portion electrically connected to a wiring pattern provided on the inner wall of the first or second half-cylinder portion, and the first circuit board is connected to the first circuit board via the wiring portion. An endoscope electrically connected to one substrate. The endoscope according to any one of claims 1 to 7,
An endoscope in which a conductor pattern constituting an antenna portion is disposed on an inner wall of the exterior container. The endoscope according to claim 1, wherein
An endoscope in which the power feeding unit is connected to one end of the outer container by a connector and is detachably connected. An endoscope manufacturing method according to any one of claims 1 to 9,
Forming an exterior container made of an insulating molded body having a wiring portion made of a wiring pattern on the inner surface;
In the wiring unit, at least two of the light source unit, the imaging unit, the control unit, and the power feeding unit are interconnected,
In the outer container,
A light source unit;
An imaging unit;
A control unit for controlling the light source unit or the imaging unit;
Mounting a functional unit including a power supply unit for supplying power to at least one of the light source unit, the imaging unit, and the control unit;
A method of manufacturing an endoscope including a step of sealing the exterior container. An endoscope manufacturing method according to claim 10,
Forming the outer packaging,
Forming an insulating divided molded body so as to form a plurality of divided portions so that the inner wall is exposed;
Forming a wiring pattern on the inner wall of the molded body to form a wiring portion,
After mounting the functional unit such that at least one of the functional units is electrically and mechanically connected to the inner wall,
A method of manufacturing an endoscope including the step of abutting each other on the joining surface so as to form an airtight structure. An endoscope manufacturing method according to claim 10,
Forming the outer packaging,
Forming a plurality of divided parts, and forming an insulating divided molded body so that at least one of them includes a first circuit board continuously formed from an inner wall via a support bar;
Forming a wiring pattern by forming a wiring pattern on the inner wall of the divided molded body; and
Bending the support bar of the first circuit board on which the wiring portion is formed, and allowing the first circuit board to stand upright with respect to the inner wall;
Including
After mounting the functional unit such that at least one of the functional units is electrically and mechanically connected to the inner wall,
A method of manufacturing an endoscope, including a step of bringing the divided molded bodies constituting the divided portion into contact with each other at a bonding surface so as to form an airtight structure.

Images