JP2011227752A - Plastic cap and non-contact ic label - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a technique capable of surely destructing a communication function included in a non-contact IC label itself when a cap is opened for drinking in order to prevent illegal re-paste in a non-contact IC label to be pasted to a cap of a bottle.SOLUTION: A plastic cap including an RFID function comprises: a cap body; a rotatable middle cap; and a non-contact IC label. In the non-contact IC label, a surface on which an IC chip is mounted is stuck to the outside of a top surface of the cap body through an adhesive layer. The top surface of the cap body has an opening into which the IC chip can be inserted, and the rotatable middle cap has a projection capable of disconnecting electrical connection with the IC chip when the projection part is abutted on the IC chip due to the rotation of the cap body in an opening direction.

Description

The present invention relates to a plastic cap that includes an optical change device that exhibits an optical visual effect and that can send and receive data to and from an external data reader without contact.

  Conventionally, non-contact IC labels having an IC chip and an antenna are used for merchandise management in retail stores, rental stores, and the like. In this method, a non-contact IC label is attached to a product to be managed, and data stored in an IC chip is read and written by a dedicated data read / write device, and product entry / exit management, inventory management, lending management, and the like are performed. Since the IC chip is provided, not only the product code but also a wealth of information such as arrival date and person in charge can be recorded and managed together with the product.

  As non-contact IC labels become widespread, optical variable devices (hereinafter referred to as “OVD”) are combined with non-contact IC labels. OVD is a general term for holograms and diffraction gratings that can express stereoscopic images and special decorative images using light interference, and multilayer thin films that change color depending on the viewing angle by stacking thin films with different optical characteristics. Since these OVDs give a unique impression such as a three-dimensional image and a color change, they have an excellent decorative effect, and are used for general printed materials such as various packaging materials, picture books, catalogs and the like. OVD is used as an anti-counterfeiting means because it requires advanced manufacturing technology, and is also used for credit cards, securities, certificates and the like in the same sense.

By combining the data read / write function of the above-mentioned non-contact IC label with the anti-counterfeiting function and decoration effect of OVD, a label having a higher level of anti-counterfeiting effect, or a combination of anti-counterfeiting effect or decoration effect and product management function There is an advantage that it can be configured. As an example, a non-contact type data transmitter / receiver has been proposed in which a part of a metal thin film subjected to hologram processing is removed by etching, laser irradiation, or the like, and the remaining conductive metal portion is an antenna pattern (for example, Patent Document 1). reference).

  Further, a patterned metal thin film subjected to hologram processing, and an antenna layer (cum connection layer) connected to the IC chip via an insulating layer on the metal thin film are provided, and the antenna layer (cum connection layer) There has been proposed a non-contact IC label in which a metal thin film is electrically connected by capacitive coupling so that the antenna layer and the metal thin film work together as one antenna to enable good communication (for example, Patent Document 2). reference)

  At present, many counterfeits of high-class liquor are on the market, and as a measure against counterfeiting, a method such as attaching a non-contact IC label with the above-mentioned OVD to a bottle (bottle) tamper-evident cap is considered. However, the conventional non-contact IC label is easily peeled off from the cap by reducing the adhesive strength of the adhesive layer by heating or dissolving the adhesive layer using an organic solvent, etc. There was a problem of being replaced.

  Specifically, empty bottles with caps after drinking are sold at a reasonable price and circulated to the counterfeit organization, where the genuine non-contact IC label is peeled off and the tamper evidence is attached to the undestructed counterfeit cap. And reused. In this case, since the genuine non-contact IC label is attached to the counterfeit product, even if the authenticity of the IC chip is determined by an external non-contact reader, it is determined to be genuine.

JP 2002-42088 A WO2008 / 038672 Publication

  The present invention has been made in view of the above circumstances, and in a non-contact IC label of the type to be affixed to a bottle cap, in order to prevent unauthorized replacement, the cap is opened at the time of drinking, and a non-contact IC The purpose is to provide a technology for reliably destroying the communication function of the label itself.

In order to achieve the above object, an invention according to claim 1 is a plastic cap comprising a cap body, a rotating inner lid inside the top plate of the cap body, and a non-contact IC label outside the top plate of the cap body. And
A screw thread is formed on the inner peripheral wall portion of the cap body so as to be screwable, a concave portion or a convex portion is formed at the center portion inside the top plate, and the top plate is penetrated around the top plate. An opening is provided,
The non-contact IC label is provided so that an IC chip protrudes from the surface, and the IC chip is provided so as to fit into the opening,
A convex part or a concave part that fits with the concave part or the convex part at the center part of the surface that contacts the inner side of the top plate of the cap body, and a projecting part on the outer peripheral part are formed on the rotating inner lid,
The protrusion moves through the opening by rotation of the rotating lid with respect to the cap body through the opening, and the tip of the protruding portion comes into contact with the IC chip and peels off by rotation of the rotating lid. A plastic cap characterized by being provided at a position.

  According to a second aspect of the present invention, there is provided a functional layer, a patterned first conductive layer, a mask layer located on the conductive layer, a concealing layer, and the first layer on one surface of the substrate. A patterned second conductive layer that capacitively couples to the conductive layer, an IC chip that is electrically connected across the second conductive layer, and a patterned adhesive layer. 2. The concealing layer is formed in order, and the concealing layer is formed so that the second conductive layer and the IC chip are not visible when viewed from the other surface of the base material. Non-contact IC label.

  According to the non-contact IC label and the plastic cap of the present invention, the non-contact IC label is a non-contact IC label that is attached to the bottle cap to prevent unauthorized replacement. It is possible to provide a non-contact IC label and a plastic cap that reliably destroy the communication function of the label itself.

It is a top view of the cap main body of this invention. It is a top view of a rotation inside lid. It is an external appearance top view of the non-contact IC label of this invention. FIG. 4 is a top perspective view of FIG. 3. It is a cross-sectional enlarged view of the broken line A of FIG. It is a top view of the state where the non-contact IC label was stuck on the cap body. It is sectional drawing of the broken line B of FIG. It is image sectional drawing (at the time of closure) of the pin movement hole of FIG. FIG. 7 is an image sectional view of the pin moving hole in FIG. 6 (when opened).

  1 to 8 for a non-contact IC label (hereinafter simply referred to as “IC label”) and a plastic cap body (hereinafter simply referred to as “cap body”) which are examples of embodiments of the present invention. To explain.

FIG. 1 is a top view of a cap body 1 of the present invention.
The cap body 1 is provided with a pin moving hole 2 penetrating the cap body 1 at the position shown in FIG. FIG. 2 is a top view of a circular rotating inner lid 3 that is pushed into the cap body 1. A projecting central shaft 3 b is provided at the center, and an IC chip to be described later is peeled near the outer periphery. For this purpose, a peeling pin 3a is provided.

FIG. 3 is an external top view of the IC label 4 of the present invention, and FIG. 4 is a perspective view thereof.
FIG. 5 is an enlarged cross-sectional view of broken line A in FIG.

The IC label 4 has a circular shape that matches the shape of the upper surface of the cap body 1, and the IC label 4 will be described below.
The label substrate 5 is made of a transparent resin or the like that allows the functional layer 11 and the conductive layer 10 to be visually recognized. Specifically, for example, a transparent sheet-like material made of a resin such as polyethylene terephthalate (PET), polyvinyl chloride (PVC), acrylonitrile, butadiene, styrene copolymer synthetic resin (ABS) or the like is preferably used. be able to. Note that the label base 5 may not necessarily be colorless as long as the lower functional layer 11 and the conductive layer 10 are visible, and may be formed of a colored material having transparency.

  A functional layer 11 that functions as an OVD is formed on the surface of the label substrate 5 that faces the conductive layer 10. The functional layer 11 is a relief type or volume type hologram in which a three-dimensional image is expressed or a color changes depending on the viewing angle, a diffraction grating image in which a plurality of types of diffraction gratings are arranged as pixels, a ceramic or metal material that causes a color shift These thin film laminates are appropriately selected and formed by a known method. Among these, in consideration of mass productivity and cost, a relief hologram (diffraction grating) or a multilayer thin film type is preferable.

  The conductive layer 10 is formed as a deposited film by depositing a metal such as aluminum on the functional layer 11. The conductive layer 10 can be formed in a desired shape by covering it with a mask layer (also serving as an insulating layer) 9 made of polyamideimide or the like and applying a demetalization process to remove unnecessary portions.

The conductive layer 10 is capacitively connected to the IC chip 6 through the connection layer 7 to enable non-contact communication as an antenna of the IC chip 6 and functions as a reflective layer. Increase visual effects. In particular, when the functional layer 11 is a relief hologram, a diffraction grating, or the like, these diffraction effects are enhanced, and there is an effect that a hologram image and a diffraction grating image can be recognized more clearly.

  When the IC label 4 is viewed from above (on a plan view) on the lower surface of the mask layer (also serving as an insulating layer) 9 and the lower surface of the functional layer 11, the connection layer 7, the IC chip 6 and the auxiliary antenna 8 described later are visible under visible light. A concealing layer 12 is provided to make it invisible.

  The concealing layer 12 is made of a non-conductive material so that the conductive layer 10 and the connection layer 7, which will be described later, and the conductive layer 10 and the auxiliary antenna 8 can be capacitively coupled. In this embodiment, the concealing layer 12 is formed by printing non-conductive ink.

The masking layer 12 uses printing ink or the like that makes the IC chip 6, the connection layer 7, and the auxiliary antenna 8 invisible in plan view. For example, it may reflect visible light of a predetermined wavelength to exhibit a specific color, or may be black that absorbs visible light of all wavelengths. Further, visible light having all wavelengths may be reflected.

The concealing layer 12 may be formed so as to cover at least the IC chip 6, the connection layer 7 and the auxiliary antenna 8, but may be formed on the entire surface. By forming it on the entire surface, it is preferable that the entire region not provided with conductivity can be concealed by the concealing layer 12 when viewed from the substrate side, and the position of the IC chip becomes more difficult to understand.

The connection layer 7 and the auxiliary antenna 8 are formed in a shape as shown in FIG. 4, for example, by printing on the lower surface of the concealment layer 12 using a conductive paste such as silver paste ink by a known method.

The IC chip 6 is made of silicon single crystal or the like, and bumps (not shown) are heat-pressed and bonded using an anisotropic conductive adhesive or the like to be electrically connected to the connection layer 7 and mounted. The conductive layer 10 and the connection layer 7 are formed of a broken-line circle C shown in FIG. 5 using an insulating mask layer (cum insulating layer) 9 and a non-conductive ink concealing layer 12 interposed therebetween as dielectrics. It is electrically connected by capacitive coupling in the range, and the IC chip 6 can perform radio wave type non-contact data communication with an external reader. The frequencies used for communication between the IC chip 6 and an external reader are a microwave band (2.45 GHz) and a UHF wave band (840 to 960 MHz).

As the IC chip 6, one with different identification information (unique ID, hereinafter referred to as “UID”) may be used. The UID is made up of, for example, numbers, English letters, symbols, or a combination thereof, and the corresponding UID is stored in the memory of each IC chip. When such an IC chip is used, traceability of the IC chip (or an IC label with the IC chip) can be ensured by reading and using the UID.

  A patterned adhesive layer 13 is provided below the concealing layer 12 including the connection layer 7 and the auxiliary antenna 8, and is adhered to the upper surface of the cap body 1 by the adhesive force.

  In the IC label 4 configured as described above, the functional layer 11 is formed on one surface of the label base 5, the metal vapor deposition film is formed on the functional layer 11, and the mask layer (also insulating layer) 9 is used. Then, the conductive layer 10 is formed in a desired shape, and further, the concealing layer 12, the connection layer 7 and the auxiliary antenna 8 are provided in this order by printing, the IC chip 6 is mounted on the connection layer 7, and finally the adhesive layer 13 can be produced. For the masking layer 12, the connection layer 7 and the auxiliary antenna 8, for example, the masking layer 12 is first printed by a multi-color screen printing machine, then the connection layer 7 and the auxiliary antenna 8 are printed, and a drying process is performed immediately after the printing. Can be formed efficiently.

FIG. 6 is a top view of the cap body 1 with the IC label 4 attached thereto, and the IC chip 6 of the IC label 4 is attached so as to enter the center of the pin moving hole 2.
FIG. 7 is a cross-sectional view showing the engagement state with the bottle 19 at the broken line B in FIG. 6, so that the peeling pin 3 a of the rotating inner lid 3 enters the pin moving hole 2 as shown in the figure, The rotating lid 3 is fitted inside the cap body 1. Further, a projecting central shaft 3b at the center of the rotating inner lid 3 and a bearing portion 1a provided inside the cap body 1 are engaged as shown in the figure. The rotating lid 3 must be reliably rotated in the cap body 1 for the reason described later, so that its outer shape is made slightly smaller than the inner diameter of the cap body 1. Note that the caps of FIGS. 7 to 9 are drawn with the tamper evidence function omitted.

8 and 9 are image cross-sectional views of the pin moving hole 2 of FIG. 6 as viewed from the right direction of FIG.
Below, the initial capping process of the cap main body 1 after the contents are filled in the bottle 19 is demonstrated.
In the initial closing, the position of the peeling pin 3a in the pin moving hole 2 is assumed to be at the position shown in FIG. 8, and the cap body 1 and the rotating inner lid 3 both rotate clockwise and rotate downward. When the inner lid 3 touches the spout of the bottle 19, the rotating inner lid 3 generates a frictional force to stop its rotation due to the frictional resistance with the bottle 19. Since 3 a hits the end of the pin moving hole 2, the rotating lid 3 is closed to the closing position while rotating together with the cap body 1. In the meantime, since the central shaft 3b enters the bearing portion 1a, the rotating lid 3 is placed at the center when viewed from the cap body 1.

Next, opening of the cap body 1 during drinking will be described.
The position of the peeling pin 3a in the pin moving hole 2 in the closed state is the position shown in FIG. 8, and the plug is opened by rotating the cap body 1 counterclockwise. In this state, since the rotating lid 3 and the bottle 19 are still in a state of high frictional resistance, the rotating lid 3 stays within the cap body 1 and only the cap body 1 rotates. When viewed relatively, the bottle 19 and the rotating lid 3 appear to rotate. As described above, since the central shaft 3b of the rotating inner lid 3 is in the bearing portion 1a, a rotating shaft is formed, and the rotating inner lid 3 rotates without shaking. As a result, as shown in FIG. 9, the peeling pin 3 a moves in the left direction in the pin moving hole 2, and the IC chip 6 is peeled from the IC label 4 by this movement.

  By setting the peeling force at this time to be larger than the adhesive strength between the IC label 4 and the IC chip, the IC chip 6 is surely peeled from the IC label 4.

  From the above, in the cap body 1 to which the IC label 4 of the present invention is attached, the IC chip 6 mounted on the IC label 4 is peeled off by simply opening the cap for drinking after purchase. The communication function can be disabled. Since the IC label 4 is a local peeling of only the IC chip 6, the OVD function (conductive layer 10, functional layer 11) provided in the IC label 4 is hardly damaged. The communication function as an IC label can be disabled without being known to the drinker.

  Since the IC chip 6 mounted on the IC label 4 is peeled off and the communication function is disabled, the appearance of the IC label is a genuine product but the communication function is disabled. Even if it is used, in authenticity determination using a non-contact reader, it is determined to be a counterfeit product, and the mechanism of the present invention can be said to be an excellent anti-counterfeit measure.

Next, the characteristics and performance of the antenna will be described.
FIG. 4 is a diagram showing the antenna portion of the connection layer 7 and the auxiliary antenna 8 in the IC label by broken lines. The conductive layer 10, the connection layer 7, and the auxiliary antenna 8 all function as an IC label antenna. An IC chip 6 is mounted on the connection layer 7, and an impedance matching circuit that matches the impedance on the antenna side and the internal impedance on the IC chip side is formed as a slit pattern in the vicinity of the IC chip 6. Further, the connection layer 7 is an arc-shaped antenna as shown in FIG. 4 and includes a connection pad 14 for capacitive coupling with the conductive layer 10, and is electrostatic in the range of the wavy circle C shown in FIG. The connection pad 14 and the conductive layer 10 are electrically connected by capacitive coupling.

The arc-shaped auxiliary antenna 8 is electrically connected to the connection pad 15 and the conductive layer 10 by capacitive coupling in the range of the wavy circle D shown in FIG. 5, and acts as an auxiliary antenna for the conductive layer 10. It is provided to improve the antenna gain of the IC label.

The antenna shown in FIG. 4 is a modified dipole antenna obtained by modifying a general half-wave dipole antenna. As with conventional hologram labels, in order to maximize the optical effects such as stereoscopic images, special decorative images, and color changes that are characteristic of holograms, a certain area is required on a surface that is not chipped or cut. The expression part which has is required and the antenna designed in order to obtain this expression part is a deformation | transformation dipole antenna shown in FIG.

Although the performance of the modified dipole antenna shown in FIG. 4 is simulated by an electromagnetic simulator (HFSS manufactured by Ansoft), the antenna gain of the standard half-wave dipole antenna is 2.14 dBi. The antenna had a 2.45 GHz specification, a label diameter of 25 mm, and an antenna gain of about 1.1 dBi. Since the antenna portion of the connection layer 7 is folded back on both sides, it is considered that the overall radiation efficiency is lowered and the antenna gain is lowered. In the simulation, the adherend model (corresponding to the cap body) was 2 mm thick and the relative dielectric constant ε _s was 3.2.

This IC label does not require long-distance reading communication distance performance like an RFID tag used in logistics or the like. Since the communication distance that can be read in close proximity with a handy reader is sufficient, there is no problem even with the performance of the antenna gain of about 1.1 dBi described above, and the wavelength shortening effect is achieved by the dielectric constant of the plastic cap as the adherend. In the verification experiment, a good communication distance is obtained.

  In addition, this invention is not limited to said embodiment, According to the content and the objective of an IC label and a cap, the structure, material, etc. can be optimized suitably.

1 Cap body
1a Bearing part 2 Pin movement hole
3 rotating inner lid
3a peeling pin 3b central axis 4 IC label 5 label substrate 6 IC chip
7 Antenna layer (also connecting layer)
8 Auxiliary antenna 9 Mask layer (also insulating layer)
DESCRIPTION OF SYMBOLS 10 Conductive layer 11 Functional layer 12 Hiding layer 13 Adhesive layer 14 Connection pad 15 Connection pad 19 Bottle A Section B Section C Capacitive coupling D Capacitive coupling

Claims (2)

A plastic cap provided with a cap body, a rotating inner lid inside the top plate of the cap body, and a non-contact IC label outside the top plate of the cap body,
A screw thread is formed on the inner peripheral wall portion of the cap body so as to be screwable, a concave portion or a convex portion is formed at the center portion inside the top plate, and the top plate is penetrated around the top plate. An opening is provided,
The non-contact IC label is provided so that an IC chip protrudes from the surface, and the IC chip is provided so as to fit into the opening,
A convex part or a concave part that fits with the concave part or the convex part at the center part of the surface that contacts the inner side of the top plate of the cap body, and a projecting part on the outer peripheral part are formed on the rotating inner lid,
The protrusion moves through the opening by rotation of the rotating lid with respect to the cap body through the opening, and the tip of the protruding portion comes into contact with the IC chip and peels off by rotation of the rotating lid. A plastic cap characterized by being provided in a position. A functional layer, a patterned first conductive layer, a mask layer located on the conductive layer, a concealment layer, and the first conductive layer are capacitively coupled to one surface of the substrate. A patterned second conductive layer, an IC chip electrically connected across the second conductive layer, and a patterned adhesive layer are laminated in this order, The contactless IC label according to claim 1, wherein the concealing layer is formed so that the second conductive layer and the IC chip are not visible when viewed from the other side.

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