JP2011219568A - Adhesion apparatus, adhesion method and method for manufacturing droplet ejection head - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an adhesion apparatus and an adhesion method which use an adhesive having adhesive power developed by mixing a plurality of functional liquids and reliably and uniformly mix the functional liquids, thereby adhering adhesion objects to each other with predetermined adhesive power.SOLUTION: The adhesion apparatus 600 includes a film deposition means 610, an ultrasonic wave applying means 620, a pressing means 630, and a placing means 640. A droplet ejection head 1 may be used as the film deposition means 610. A liquid base resin 611 and a liquid curing agent 612 constituting a two-pack curing adhesive are introduced respectively into reservoirs 100a and 100b of the droplet ejection head 1. It is enough if the ultrasonic wave applying means 620 is composed of an ultrasonic irradiation unit 621 with an ultrasonic oscillation element. The ultrasonic irradiation unit 621 applies ultrasonic waves toward the direction of a bonding stage 641 constituting the placing means 640.

Description

   The present invention relates to a bonding apparatus for bonding members together, a bonding method, and a method for manufacturing a droplet discharge head to which this bonding method is applied.

   Conventionally, when a member to be bonded such as an IC (integrated circuit) or a flexible substrate is bonded to a mounting surface of a substrate, for example, an anisotropic conductive paste (ACP) or an insulating resin (NCP: Non Conductive Polymer) It was common to use a thermosetting adhesive consisting of In such a thermosetting adhesive, when a heat of 100 to 250 ° C. is applied for several seconds to several minutes, a cross-linking reaction of the constituent components of the adhesive is started and an adhesive force is developed.

   However, such a thermosetting adhesive cannot be used for joining parts having low heat resistance such as a heat resistant temperature of less than 100 ° C. For this reason, when a component having low heat resistance is bonded to a substrate, for example, an adhesive made of an ultraviolet curable resin is generally used. However, such an adhesive made of an ultraviolet curable resin has a problem that it is difficult to cure unless the substrate and the member to be bonded are made of a transparent member that transmits ultraviolet rays. It was.

   For this reason, a bonding method using a two-component mixed curing type adhesive that can be bonded in a normal temperature environment and has few limitations on the material to be bonded is also known. This two-component mixed curing type adhesive exhibits adhesiveness by mixing a curing agent with a main agent, and adheres objects to be bonded within a predetermined curing time (for example, Patent Document 1, 2).

JP-A-10-296167 JP 2009-664758 A

   However, since the two-component mixed curing type adhesive as described above needs to complete the bonding process within a predetermined time after mixing the curing agent with the main agent, the procedure of the bonding process is restricted, and the process management is limited. There was a problem of becoming difficult. Further, as shown in Patent Documents 1 and 2, the main agent and the curing agent are thinly applied to the object to be bonded using an ink jet printer or a spray gun, and in the method of bonding, the main agent and the curing agent are bonded to the bonding target. There was a problem that a predetermined adhesive force could not be obtained without mixing.

Some aspects according to the present invention have been made in view of the above circumstances, and by using an adhesive that exhibits an adhesive force by mixing a plurality of functional liquids, each functional liquid can be reliably and An object of the present invention is to provide a bonding apparatus and a bonding method capable of uniformly mixing and bonding the objects to be bonded with a predetermined bonding force.
In addition, a flexible substrate on which an integrated circuit that drives a droplet discharge head is formed using an adhesive that exhibits an adhesive force by mixing a plurality of functional liquids, and an electrode of a piezoelectric element with a predetermined adhesive strength. An object of the present invention is to provide a method for manufacturing a strongly bonded droplet discharge head.

In order to solve the above problems, some aspects of the present invention provide the following bonding apparatus, bonding method, and manufacturing method of a droplet discharge head.
That is, the bonding apparatus of the present invention comprises a film forming means for forming a main component layer and a curing agent layer constituting a two-component curable adhesive adjacent to or overlapping each other between a first member and a second member. And applying ultrasonic waves to the main material layer and the curing agent layer to mix them, and pressing the ultrasonic wave application means for forming the adhesive layer, the first member and the second member, and the adhesive layer And a pressing means for adhering to each other.

   According to the bonding apparatus of the present invention, the main agent layer and the curing agent layer are formed adjacent to each other or stacked on the first member to be bonded, and then the main agent layer and the curing agent layer are ultrasonically applied. Can be mixed uniformly to form an adhesive layer. As a result, the main agent layer and the curing agent layer can be mixed reliably and uniformly, and an adhesive layer capable of exhibiting excellent adhesive ability can be obtained, and the first member and the second member can be firmly bonded. It becomes possible to adhere to.

   In addition, since the mixing of the main agent layer and the curing agent layer is performed by ultrasonic application means, the main agent layer and the curing agent are matched with the timing of starting the pressing step for bonding the first member and the second member. The layers can be mixed. For this reason, adhesion with the 1st member and the 2nd member can be performed at arbitrary timings, and process management of an adhesion process can be made easy.

   Furthermore, according to the bonding apparatus and the bonding method of the present invention, the adhesive layer is formed by mixing the main agent layer and the curing agent layer by the ultrasonic wave application means. Therefore, the first member and the second member to be bonded Even if the heat resistant temperature is less than 100 ° C., for example, the first member and the second member can be bonded in a normal temperature environment without causing thermal damage. As a result, even a member having low heat resistance can be securely and firmly bonded.

   The film forming unit and the ultrasonic wave applying unit may be formed integrally. Thereby, the structure of the bonding apparatus can be further simplified, and the bonding apparatus can be reduced in size and weight.

   The pressing unit and the ultrasonic wave applying unit may be formed integrally. As a result, mixing and pressing (adhesion) of the main agent layer and the curing agent layer can be performed almost simultaneously. Therefore, the main agent layer and the curing agent layer are combined with materials having high reactivity, that is, a high curing rate. Also, the first member and the second member can be securely bonded. Moreover, the process time of the whole adhesion | attachment process can be shortened by forming the adhesive bond layer with a quick cure rate.

   The ultrasonic wave application means may apply ultrasonic waves to the first member and / or the second member integrally. As a result, mixing and pressing (adhesion) of the main agent layer and the curing agent layer can be performed almost simultaneously. Therefore, the main agent layer and the curing agent layer are combined with materials having high reactivity, that is, a high curing rate. Also, the first member and the second member can be securely bonded.

   The adhesion method of the present invention includes a film forming step in which a main component layer and a curing agent layer constituting a two-component curable adhesive are formed adjacent to each other or stacked between a first member and a second member; Applying ultrasonic waves to the main agent layer and the hardener layer, mixing the main agent layer and the hardener layer to form an adhesive layer, and pressing the first member and the second member together, And a pressing step for adhering via the adhesive layer.

   According to the bonding method of the present invention, the main agent layer and the curing agent layer are formed adjacent to each other or overlapped in the film forming step on the first member to be bonded, and then the main agent layer and the curing agent layer are formed. Since the adhesive layer is formed by uniformly mixing by ultrasonic vibration in the mixing step, an adhesive layer that can exhibit excellent adhesive ability can be obtained, and the first member and the second member can be firmly bonded. Is possible.

   The mixing step and the pressing step may be performed at substantially the same timing. As a result, mixing and pressing (adhesion) of the main agent layer and the curing agent layer can be performed almost simultaneously. Therefore, the main agent layer and the curing agent layer are combined with materials having high reactivity, that is, a high curing rate. Also, the first member and the second member can be securely bonded.

   The method for manufacturing a droplet discharge head according to the present invention is characterized in that the flexible substrate on which an integrated circuit for driving the droplet discharge head is formed and the electrode of the piezoelectric element are connected by the bonding method described above.

It is an external appearance perspective view which shows an example of the droplet discharge head provided with the flexible substrate mounting structure of this invention. It is the perspective view which looked at the droplet discharge head from the lower side. FIG. 2 is a cross-sectional view taken along line AA in FIG. 1. It is the figure which looked at the flexible substrate from the lower surface side. It is a schematic block diagram explaining the adhesion | attachment apparatus and adhesion method of this invention. It is a schematic block diagram explaining the bonding apparatus and bonding method of other embodiment of this invention. It is a schematic block diagram explaining the bonding apparatus and bonding method of other embodiment of this invention. It is a schematic block diagram explaining the bonding apparatus and bonding method of other embodiment of this invention.

   Hereinafter, an embodiment of a bonding apparatus, a bonding method, and a method for manufacturing a droplet discharge head according to the present invention will be described with reference to the drawings. The present embodiment is specifically described for better understanding of the gist of the invention, and does not limit the invention unless otherwise specified. In addition, in the drawings used in the following description, in order to make the features of the present invention easier to understand, there is a case where a main part is shown in an enlarged manner for convenience, and the dimensional ratio of each component is the same as the actual one. Not necessarily.

First, an outline of a droplet discharge head that performs bonding by the bonding method of the present invention will be described with reference to FIGS.
1 is an external perspective view showing an embodiment of a droplet discharge head, FIG. 2 is a partially broken view of the perspective view of the droplet discharge head as viewed from below, and FIG. 3 is a cross-sectional view taken along the line AA in FIG. FIG. 4 is a view of the flexible substrate as viewed from the lower surface side.

   The droplet discharge head 1 discharges droplets of functional liquid (for example, ink), and is connected to a nozzle substrate 16 having a nozzle opening 15 from which droplets are discharged, and an upper surface of the nozzle substrate 16. A flow path forming substrate 10 that forms a flow path through which a droplet flows, a vibration plate 400 that is connected to the upper surface of the flow path forming substrate 10 and is displaced by driving of the piezoelectric element 300, and an upper surface of the vibration plate 400. The reservoir forming substrate 20 for forming the reservoir 100, the flexible flexible substrate 500 provided on the upper surface side of the reservoir forming substrate 20, and the lower surface 500A of the flexible substrate 500 are driven to drive the piezoelectric element 300. Drive circuit unit 200 (IC driver) 200 for mounting and the lower surface 500A of the flexible substrate 500, and electrically connecting the drive circuit unit 200 and the piezoelectric element 300 to each other. Conductive part (conductive pattern, the wiring pattern) and a 510. The conductive pattern 510 is a wiring pattern made of a conductive material such as Cu (copper), for example, and has a thickness of several μm.

   The operation of the droplet discharge head 1 is controlled by an external controller CT. The pressure generation chamber 12 in which the functional liquid before being discharged from the nozzle opening 15 is disposed is formed by a space surrounded by the flow path forming substrate 10, the nozzle substrate 16, and the vibration plate 400. . A reservoir 100 that preliminarily holds the functional liquid before being supplied to the pressure generating chamber 12 is formed by a space surrounded by the reservoir forming substrate 20 and the flow path forming substrate 10.

   The lower surface side of the flow path forming substrate 10 is open, and the nozzle substrate 16 is connected to the lower surface of the flow path forming substrate 10 so as to cover the opening. The lower surface of the flow path forming substrate 10 and the nozzle substrate 16 are fixed via, for example, an adhesive or a heat welding film. The nozzle substrate 16 is provided with a nozzle opening 15 for discharging droplets.

   As shown in FIG. 2, a plurality of nozzle openings 15 are provided in the nozzle substrate 16. Specifically, the nozzle substrate 16 includes a first nozzle opening group 15A, a second nozzle opening group 15B, and a third nozzle opening group 15C that are configured by a plurality of nozzle openings 15 provided side by side in the Y-axis direction. , And the fourth nozzle opening group 15D. The first nozzle opening group 15A and the second nozzle opening group 15B are disposed so as to face each other in the X-axis direction. The third nozzle opening group 15C is provided on the + Y side of the first nozzle opening group 15A, and the fourth nozzle opening group 15D is provided on the + Y side of the second nozzle opening group 15B. The third nozzle opening group 15C and the fourth nozzle opening group 15D are arranged so as to face each other in the X-axis direction.

   In FIG. 2, each of the nozzle opening groups 15 </ b> A to 15 </ b> D is illustrated as being configured by six nozzle openings 15, but actually, for example, configured by about 720 nozzle openings 15. Has been.

   A plurality of partition walls 11 are formed inside the flow path forming substrate 10. The flow path forming substrate 10 is formed of silicon, and the plurality of partition walls 11 are formed by anisotropically etching a silicon single crystal substrate that is a base material of the flow path forming substrate 10. A plurality of pressure generating chambers 12 are formed by a space surrounded by the flow path forming substrate 10 having the plurality of partition walls 11, the nozzle substrate 16, and the diaphragm 400. A plurality of pressure generating chambers 12 are formed so as to correspond to the plurality of nozzle openings 15. That is, a plurality of pressure generation chambers 12 are provided side by side in the Y-axis direction so as to correspond to the plurality of nozzle openings 15 constituting each of the first to fourth nozzle opening groups 15A to 15D.

   A plurality of pressure generating chambers 12A corresponding to the first nozzle opening group 15A constitutes a first pressure generating chamber group 12A, and a plurality of pressure generating chambers 12 corresponding to the second nozzle opening group 15B are formed. Constitutes a second pressure generation chamber group 12B, and a plurality of pressure generation chambers 12 corresponding to the third nozzle opening group 15C constitutes a third pressure generation chamber group 12C, corresponding to the fourth nozzle opening group 15D. Thus, a fourth pressure generation chamber group 12D is configured by the plurality of pressure generation chambers 12 formed. The first pressure generation chamber group 12A and the second pressure generation chamber group 12B are arranged to face each other in the X-axis direction, and a partition wall 10K is formed between them. Similarly, a partition 10K is also formed between the third pressure generation chamber group 12C and the fourth pressure generation chamber group 12D, and they are arranged so as to face each other in the X-axis direction. The flow path forming substrate 10 including the partition walls 10K may be formed of, for example, a silicon single crystal.

   Of the plurality of pressure generating chambers 12 forming the first pressure generating chamber group 12A, the end on the −X side is closed by the partition wall 10K described above, but the end on the + X side is gathered so as to be connected to each other. And is connected to the reservoir 100. The reservoir 100 is introduced from the functional liquid introduction port 25 and temporarily holds the functional liquid before being supplied to the pressure generating chamber 12, and is formed on the reservoir forming substrate 20 so as to extend in the Y-axis direction. The reservoir portion 21 is formed on the flow path forming substrate 10 so as to extend in the Y-axis direction, and the communication portion 13 that connects the reservoir portion 21 and each of the pressure generating chambers 12 is provided. That is, the reservoir 100 is a functional liquid holding chamber (ink chamber) common to the plurality of pressure generating chambers 12 constituting the first pressure generating chamber group 12A. The functional liquid introduced from the functional liquid introduction port 25 flows into the reservoir 100 via the introduction path 26, and is supplied to each of the plurality of pressure generation chambers 12 constituting the first pressure generation chamber group 12A via the supply path 14. The

   A reservoir 100 similar to that described above is also connected to each of the pressure generation chambers 12 constituting each of the second, third, and fourth pressure generation chamber groups 12B, 12C, and 12D.

   The diaphragm 400 disposed between the flow path forming substrate 10 and the reservoir forming substrate 20 is provided on the elastic film 50 so as to cover the upper surface of the flow path forming substrate 10 and on the upper surface of the elastic film 50. And a lower electrode film 60. The elastic film 50 is made of, for example, silicon dioxide having a thickness of about 1 to 2 μm. The lower electrode film 60 is made of, for example, a metal having a thickness of about 0.2 μm. In the present embodiment, the lower electrode film 60 is a common electrode for the plurality of piezoelectric elements 300.

   The piezoelectric element 300 for displacing the diaphragm 400 includes a piezoelectric film 70 provided on the upper surface of the lower electrode film 60 and an upper electrode film (electrode) 80 provided on the upper surface of the piezoelectric film 70. ing. The piezoelectric film 70 has a thickness of about 1 μm, for example, and the upper electrode film 80 has a thickness of about 0.1 μm, for example.

   The concept of the piezoelectric element 300 may include the lower electrode film 60 in addition to the piezoelectric film 70 and the upper electrode film (electrode) 80. That is, the lower electrode film 60 in the present embodiment has both the function as the piezoelectric element 300 and the function as the diaphragm 400. In this embodiment, the elastic film 50 and the lower electrode film 60 function as the diaphragm 400. However, the elastic film 50 may be omitted, and the lower electrode film 60 may also serve as the elastic film (50). .

   A plurality of piezoelectric films 70 and upper electrode films 80, that is, piezoelectric elements 300 are provided so as to correspond to the plurality of nozzle openings 15 and the pressure generation chambers 12, respectively. That is, the piezoelectric element 300 including the piezoelectric film 70 and the upper electrode film 80 is provided for each nozzle opening 15 (for each pressure generation chamber 12). As described above, the lower electrode film 60 functions as a common electrode for the plurality of piezoelectric elements 300, and the upper electrode film 80 functions as an individual electrode for the plurality of piezoelectric elements 300.

   In addition, the first piezoelectric element group 300A is configured by a plurality of piezoelectric elements 300 provided side by side in the Y-axis direction so as to correspond to each of the nozzle openings 15 constituting the first nozzle opening group 15A. A second piezoelectric element group 300B is configured by a plurality of piezoelectric elements 300 provided in a line in the Y-axis direction so as to correspond to each of the nozzle openings 15 constituting the two-nozzle opening group 15B. The first piezoelectric element group 300A and the second piezoelectric element group 300B are arranged to face each other in the X-axis direction.

   Similarly, the third and fourth piezoelectric elements are provided by a plurality of piezoelectric elements 300 arranged in the Y-axis direction so as to correspond to the respective nozzle openings 15 constituting the third and fourth nozzle opening groups 15C and 15D. The groups 300C and 300D are configured, and the third and fourth piezoelectric element groups 300C and 300D are arranged so as to face each other in the X-axis direction (note that the third and fourth piezoelectric element groups 300C, 300D is formed on the back side of the sheet of FIG. 3 and is not shown).

   A compliance substrate 30 having a sealing film 31 and a fixing plate 32 is bonded to the reservoir forming substrate 20. The sealing film 31 is made of a material having low rigidity and flexibility (for example, a polyphenylene sulfide film having a thickness of about 6 μm), and the upper part of the reservoir portion 21 is sealed by the sealing film 31. The fixing plate 32 is made of a hard material such as metal (for example, stainless steel having a thickness of about 30 μm). In the fixed plate 32, the region corresponding to the reservoir 100 is an opening 33 that is completely removed in the thickness direction, so that the upper portion of the reservoir 100 is formed only by the flexible sealing film 31. The flexible portion 22 is sealed and can be deformed by a change in internal pressure.

   Normally, when the functional liquid is supplied to the reservoir 100 from the functional liquid inlet 25, a pressure change occurs in the reservoir 100 due to, for example, the flow of the functional liquid when the piezoelectric element 300 is driven or the ambient heat. However, as described above, since the upper portion of the reservoir 100 is sealed only by the sealing film 31 to form the flexible portion 22, the flexible portion 22 is bent and deformed to absorb the pressure change. Therefore, the inside of the reservoir 100 is always maintained at a constant pressure. The other parts are held at a sufficient strength by the fixing plate 32.

   A functional liquid introduction port 25 for supplying a functional liquid to the reservoir 100 is formed on the compliance substrate 30 outside the reservoir 100, and the functional liquid introduction port 25 and the reservoir 100 are formed on the reservoir forming substrate 20. There is provided an introduction path 26 that communicates with the side wall.

   A groove 700 extending in the Y-axis direction is formed in the central portion of the reservoir forming substrate 20 in the X-axis direction. By the groove portion 700, the reservoir forming substrate 20 is divided into a first sealing portion 20A for sealing the first piezoelectric element group 300A provided corresponding to the first pressure generating chamber group 12A, and a second pressure generating chamber group 12B. The second piezoelectric element group 300B provided correspondingly is divided into a second sealing portion 20B for sealing (see FIG. 3). Similarly, the groove portion 700 corresponds to the third sealing portion 20C for sealing the third piezoelectric element group 300C provided corresponding to the third pressure generation chamber group 12C and the fourth pressure generation chamber group 12D. It is divided into a fourth sealing portion 20D that seals the provided fourth piezoelectric element group 300D (note that the third and fourth sealing portions 20C and 20D are formed on the back side of FIG. 3). (Not shown). And in the groove part 700, a part of flow-path formation board | substrate 10 (partition 10K) is exposed.

   That is, in the reservoir forming substrate 20, a region facing the piezoelectric element 300 is provided with the piezoelectric element holding portion 24 that can seal the space while ensuring a space that does not hinder the movement of the piezoelectric element 300. ing. The piezoelectric element holding part 24 is formed in each of the first to fourth sealing parts 20A to 20D, and has a size covering the first to fourth piezoelectric element groups 300A to 300D. Of the piezoelectric elements 300, at least the piezoelectric film 70 is sealed in the piezoelectric element holding portion 24.

   As described above, the reservoir forming substrate 20 functions as a sealing member for sealing the piezoelectric element 300 by blocking the piezoelectric element 300 from the external environment. By sealing the piezoelectric element 300 with the reservoir forming substrate 20, destruction of the piezoelectric element 300 due to an external environment such as moisture is prevented. Further, in the present embodiment, the inside of the piezoelectric element holding unit 24 is only sealed, but for example, by making the space in the piezoelectric element holding unit 24 vacuum or a nitrogen or argon atmosphere or the like, The inside of the piezoelectric element holding portion 24 can be held at a low humidity, and destruction of the piezoelectric element 300 can be further reliably prevented.

   The reservoir forming substrate 20 is a rigid body, and as the material for forming the reservoir forming substrate 20, for example, a material substantially the same as the coefficient of thermal expansion of the flow path forming substrate 10 such as glass or ceramic material is used. Preferably, in the present embodiment, a silicon single crystal substrate made of the same material as the flow path forming substrate 10 is used.

   As shown in FIG. 3, in the piezoelectric element 300 sealed by the piezoelectric element holding part 24 of the first sealing part 20A, the end portion on the −X side of the upper electrode film 80 is the first sealing part 20A. The groove portion 700 is disposed on the flow path forming substrate 10. As shown in FIG. 3, in the case where a part of the lower electrode film 60 is disposed on the flow path forming substrate 10 in the groove portion 700, an electrical connection between the upper electrode film 80 and the lower electrode film 60 is performed. An insulating film 600 for preventing connection is provided between the upper electrode film 80 and the lower electrode film 60.

   Similarly, in the piezoelectric element 300 sealed by the piezoelectric element holding part 24 of the second sealing part 20B, the + X side end of the upper electrode film 80 extends to the outside of the second sealing part 20B. The groove 700 is disposed on the flow path forming substrate 10. Similarly, although not shown, among the piezoelectric elements 300 sealed by the third and fourth sealing portions 20C and 20D, a part of the upper electrode film 80 is formed by the third and fourth sealing portions 20C. , 20D, and is disposed on the flow path forming substrate 10 in the groove portion 700 provided between the third and fourth sealing portions 20C, 20D.

   The drive circuit unit 200 for driving the piezoelectric element 300 includes, for example, a circuit board or a semiconductor integrated circuit (IC) including a drive circuit, and is connected to the lower surface 500 </ b> A of the flexible substrate 500. The piezoelectric element 300 is driven by the drive circuit unit 200. The flexible substrate 500 has flexibility, and is made of an insulating film member made of polyimide, for example. A conductive wiring pattern (conductive portion) 510 made of a conductive material such as copper is provided on the lower surface 500A of the flexible substrate 500 by a printing method or a method such as plating or etching.

   As shown in FIG. 4, a drive circuit unit 200 is provided in a predetermined region of the lower surface 500 </ b> A of the flexible substrate 500. The drive circuit unit 200 is flip-chip mounted on the lower surface 500 </ b> A of the flexible substrate 500 and connected to a part of the wiring pattern 510. A plurality (four) of drive circuit units 200 are provided according to the first to fourth nozzle opening groups 15A to 15D. Each of the first to fourth drive circuit units 200A to 200D provided according to the first to fourth nozzle opening groups 15A to 15D is flip-chip mounted on the flexible substrate 500, and then the flexible substrate is made of the resin 201. 500 is fixed.

   An opening 520 is formed in part of the flexible substrate 500. Specifically, the opening 520 is in a region between the first drive circuit unit 200A and the second drive circuit unit 200B and a region between the third drive circuit unit 200C and the fourth drive circuit unit 200D. It is formed so as to extend in the Y-axis direction.

   A resin (resin material: molding material) 202 is disposed between the flexible substrate 500 and the reservoir forming substrate 20, and the flexible substrate 500 and the reservoir forming substrate 20 are fixed by resin molding using the resin 202. Yes. Further, the resin 202 is also disposed inside the groove portion 700, and a connection portion (adhesion portion) between the terminal portion 512 and the piezoelectric element 300 (upper electrode film 80) is resin-molded.

   As shown in FIG. 4, notches 521 are formed at both ends in the Y-axis direction of the opening 520. The cutout portion 521 allows a part of the flexible substrate 500 (the edge region) 530 facing the opening 520 to be bent (bend) inside the opening 520.

   The edge region 530 is a region between the drive circuit units 200A to 200D and the opening 520, and the edge portion 530E of the edge region 530 that faces the opening 520 is substantially linear along the Y-axis direction. Is formed. That is, in the present embodiment, the edge region 530 is a rectangular region whose longitudinal direction is the Y-axis direction, and is bent so that the edge portion 530E rotates about the Y-axis (θY direction). ing.

   Of the lower surface 500 </ b> A of the flexible substrate 500, a terminal portion 512 constituting a part of the wiring pattern 510 is formed in the edge region 530 in the opening 520. In the first edge region 530A between the first drive circuit unit 200A and the opening 520, a plurality of terminal units 512 that are electrically connected to the first drive circuit unit 200A via the wiring pattern 510 are formed. .

   The plurality of terminal portions 512 provided in the first edge region 530A are connected to each of the plurality of piezoelectric elements 300 (upper electrode film 80) constituting the first piezoelectric element group 300A. A plurality of (for example, 720) elements are arranged in the Y-axis direction so as to correspond to the plurality of piezoelectric elements 300 constituting the group 300A, and constitute the first terminal group 512A. Therefore, when the terminal portion 512 and the piezoelectric element 300 are connected, the drive circuit portion 200 and the piezoelectric element 300 are electrically connected via the wiring pattern 510 including the terminal portion 512.

   Similarly, in the second edge region 530B between the second drive circuit unit 200B and the opening 520, a plurality (in the Y-axis direction (corresponding to the plurality of piezoelectric elements 300 constituting the second piezoelectric element group 300B) ( For example, 720) a second terminal group 512B including terminal portions 512 provided side by side is provided. The first edge region 530A and the second edge region 530B are disposed so as to face each other in the X-axis direction, and the first terminal group formed in each of the first and second edge regions 530A and 530B. The 512A and the second terminal group 512B are also configured to face each other in the X-axis direction.

   Similarly, in the third edge region 530C between the third drive circuit unit 200C and the opening 520, a plurality of elements in the Y-axis direction correspond to the plurality of piezoelectric elements 300 constituting the third piezoelectric element group 300C. A third terminal group 512C including terminal portions 512 provided in parallel (for example, 720) is provided, and the fourth edge region 530D between the fourth drive circuit portion 200D and the opening 520 includes a fourth terminal region 512C. A fourth terminal group 512D including a plurality of (for example, 720) terminal portions 512 arranged in the Y-axis direction so as to correspond to the plurality of piezoelectric elements 300 constituting the piezoelectric element group 300D is provided. The third edge region 530C and the fourth edge region 530D are arranged so as to face each other in the X-axis direction.

   When ejecting droplets of functional liquid from the droplet ejection head 1 having such a configuration, the external controller CT drives an external functional liquid supply device (not shown) connected to the functional liquid inlet 25. The functional liquid sent out from the external functional liquid supply device fills the internal flow path of the droplet discharge head 1 from the functional liquid introduction port 25 to the reservoir 100 until reaching the nozzle opening 15. Further, the external controller CT sends drive power and a command signal to the drive circuit unit 200 and the like via an external signal input unit 580 provided on the flexible substrate 500.

   A wiring pattern 510 is provided on the lower surface 500 </ b> A of the flexible substrate 500, and a command signal or the like from the external signal input unit 580 is sent to the drive circuit unit 200 via the wiring pattern 510. Based on a command from the external controller CT, the drive circuit unit 200 is interposed between the lower electrode film 60 and the upper electrode film 80 corresponding to the pressure generation chamber 12 via the wiring pattern 510 including the terminal unit 512. A voltage is applied to displace the elastic film 50, the lower electrode film 60, and the piezoelectric film 70, thereby increasing the pressure in each pressure generating chamber 12 and ejecting droplets from the nozzle openings 15.

Next, as an example of the bonding apparatus and bonding method of the present invention, the terminal portion 512 of the flexible substrate 500 constituting the droplet discharge head 1 and the electrode (upper electrode film) 80 of the piezoelectric element 300 are bonded. The bonding apparatus and bonding method will be described in detail.
FIG. 5 is a schematic configuration diagram illustrating the bonding apparatus and the bonding method of the present invention.
The bonding apparatus 600 includes a film forming unit 610, an ultrasonic wave applying unit 620, a pressing unit 630, and a mounting unit 640. As the film forming unit 610, for example, the above-described droplet discharge head 1 may be used. The liquid main agent 611 and the curing agent 612 constituting the two-component curable adhesive are respectively introduced into the reservoirs 100a and 100b of the droplet discharge head 1.

The ultrasonic wave application means 620 only needs to be composed of an ultrasonic wave irradiation unit 621 provided with an ultrasonic oscillation element. The ultrasonic irradiation unit 621 irradiates ultrasonic waves toward the direction of the bonding stage 641 constituting the mounting unit 640.
The pressing unit 630 includes a pressing member 631 made of a hard metal plate and the like, and a vertical movement device 632 that moves the pressing member 631 up and down so as to be close to the bonding stage 641.

   The mounting means 640 only needs to include one or a plurality of bonding stages 641 that move in the housing 601 of the bonding apparatus 600 from the inlet 602 toward the outlet 603. Such an adhesion stage 641 has a first member (for example, an electrode (upper electrode film) of the piezoelectric element 300 in an assembly intermediate of a droplet discharge head) 650 as one member to be adhered mounted on one surface (upper surface). In the placed state, they move while being temporarily stopped at positions facing the film forming means 610, the ultrasonic wave applying means 620, and the pressing means 630, respectively. On the other hand, in the pressing means 630, a second member (for example, a flexible substrate) 660 that is bonded to the first member 650 is supplied.

   The bonding method of the present invention using the above bonding apparatus will be described. When bonding is performed by the bonding method of the present invention, for example, the first member 650 that is one member to be bonded is placed on the bonding stage 641 by using the bonding apparatus 600 shown in FIG. Then, the bonding stage 641 on which the first member 650 is placed first moves to a position facing the film forming unit 610.

   In the film forming unit 610, the main agent 611 and the curing agent 612 are discharged from the droplet discharge head 1 toward the one surface 650 a of the first member 650 by a predetermined amount. The main agent 611 and the curing agent 612 may be discharged to areas adjacent to each other on one surface 650a. As a result, the main agent layer 611a and the curing agent layer 612a are formed adjacent to each other on one surface 650a serving as an adhesive surface of the first member 650 (film formation step).

   The main agent layer 611a and the curing agent layer 612a are formed adjacent to each other. For example, the main agent layer 611 and the curing agent layer 612a are discharged to the same region, and the main agent layer 611a and the curing agent layer 612a It is also preferable to form such that they overlap each other.

By mixing the main agent 611 and the curing agent 612 with each other, a chemical reaction starts between the main agent 611 and the curing agent 612. When a predetermined time elapses, the main agent 611 and the curing agent 612 react. The resulting combination is fully cured.
Examples of preferred combinations of the main agent 611 and the curing agent 612 are listed below.

[Main agent: Epoxy resin]
(Amine-based curing agent)
・ Aliphatic amine ・ Aromatic amine ・ Imidazole (thiol-based curing agent)
・ Liquid polymercaptan ・ Polysulfide (cationic curing agent (polymerization initiator))
Lewis acid (BF ₃ , ZnCl ₂ , SuCl ₄ , FeCl ₃ , AlCl ₃ )
・ Sulphonium salt [Main agent: Acrylate resin]
・ Organic peroxide (polymerization initiator)
[Main agent: Urethane resin]
・ Polyol, isocyanate [Main agent: Silicone resin]
・ Platinum catalyst (polymerization initiation catalyst)

   An example of such a main agent 611 and a curing agent 612 can be ejected from the droplet ejection head 1 by being dissolved and dispersed in a solvent even if it is solid at room temperature.

As described above, the main agent 611 and the curing agent 612 are discharged onto the one surface 650a by the film forming unit 610, and the first member 650 on which the main agent layer 611a and the curing agent layer 612a are formed is placed on the one surface 650a. Next, the stage 641 moves to a position facing the ultrasonic wave application unit 620.
Then, the ultrasonic wave US is irradiated with a predetermined output from the ultrasonic wave irradiation unit 621 constituting the ultrasonic wave application unit 620 toward at least the region where the main agent layer 611a and the hardener layer 612a of the first member 650 are formed. Is done.

   When an ultrasonic wave is applied to the main agent layer 611a and the hardener layer 612a, ultrasonic vibration is generated, and the main agent layer 611a and the hardener layer 612a formed adjacent to each other or overlap each other are caused by this ultrasonic vibration. The adhesive layer 613 made of a mixture of the main agent 611 and the curing agent 612 is formed by uniformly mixing (mixing step).

   The adhesive layer 613 in which the main agent layer 611a and the curing agent layer 612a are mixed in the mixing process starts a curing reaction, for example, a crosslinking reaction or a polymerization reaction, immediately after mixing, and is cured when a predetermined time elapses. Thus, the adhesive stage 641 on which the first member 650 having the adhesive layer 613 formed on the one surface 650a is quickly moved to a position facing the next pressing means 630 before the adhesive layer 613 is completely cured. To do.

   At a position facing the pressing unit 630, a second member (for example, a flexible substrate) 660 is supplied between the pressing member 631 constituting the pressing unit 630 and the first member 650, and this second member ( For example, the terminal portion (bonding region) of the flexible substrate 660 faces the bonding layer 613.

   Then, the pressing member 631 is pushed down by the vertical movement device 632, and the second member 660 is pressed against the first member 650 through the adhesive layer 613 before curing (adhesion process). When the chemical reaction of the adhesive layer 613 is completed and completely cured, the first member 650 and the second member 660 are firmly bonded by the cured adhesive layer 613.

   In order for the adhesive layer 613 to be cured in time with such an adhesion process, it is preferable to appropriately adjust the concentration and amount of the curing agent 612 and the time required from the mixing process to the adhesion process in advance.

As described above, according to the bonding apparatus and bonding method of the present invention, the main agent layer 611a and the curing agent layer 612a are formed adjacent to each other or stacked on the first member 650 to be bonded. 611a and the curing agent layer 612a were uniformly mixed by the ultrasonic wave application unit 620 to form the adhesive layer 613.
Thereby, the main agent layer 611a and the curing agent layer 612a can be reliably and uniformly mixed, and the adhesive layer 613 capable of exhibiting excellent adhesive ability can be formed. The member 660 can be firmly bonded.

   Further, since the mixing of the main agent layer 611a and the curing agent layer 612a is performed by the ultrasonic wave application unit 620, in accordance with the timing of starting the pressing step for bonding the first member 650 and the second member 660, The main agent layer 611a and the curing agent layer 612a can be mixed. For this reason, the first member 650 and the second member 660 can be bonded at an arbitrary timing, and the process management of the bonding process can be facilitated.

   Furthermore, according to the bonding apparatus and bonding method of the present invention, the main agent layer 611a and the curing agent layer 612a are mixed by the ultrasonic wave application means 620 to form the bonding layer 613. Therefore, the first member 650 to be bonded is used. Even if the heat-resistant temperature of the second member 660 is less than 100 ° C., for example, the first member 650 and the second member 660 can be bonded in a normal temperature environment without causing thermal damage. As a result, even a member having low heat resistance can be securely and firmly bonded.

In addition to the above-described embodiment, it is also preferable that the film forming unit and the ultrasonic wave applying unit are integrally formed, for example.
FIG. 6 is a schematic configuration diagram illustrating another bonding apparatus and bonding method of the present invention.
In the bonding apparatus 800 of this embodiment, a film forming and mixing unit 810 in which a film forming unit and an ultrasonic wave applying unit are integrated, and a pressing member 820 constituting the pressing unit are formed. The film formation / mixing unit 810 includes, for example, a film formation unit (film formation unit) 811 including a droplet discharge head and an ultrasonic application unit (ultrasonic application unit) 812.

   In the bonding apparatus 800 having such a configuration, the first member 650 to be bonded is formed on the surface of the first member 650 from the film forming unit (film forming unit) 811 at a position facing the film forming and mixing unit 810. The main agent layer 611a and the curing agent layer 612a are formed adjacent to each other or stacked. Then, the film formation / mixing unit 810 is scanned in the horizontal direction while the first member 650 is facing the film formation / mixing unit 810, and this time, from the ultrasonic application unit (ultrasonic application irradiation means) 812 to the main agent layer 611a. The ultrasonic wave US is applied toward the curing agent layer 612a. As a result, the main agent layer 611a and the curing agent layer 612a are uniformly mixed by ultrasonic vibration, and the adhesive layer 613 is formed.

   As described above, the adhesive layer 613 is formed by mixing the main agent layer 611a and the hardener layer 612a from the formation of the main agent layer 611a and the hardener layer 612a to the first member 650 by the film forming and mixing unit 810. Do until formation. Thereafter, the first member 650 on which the adhesive layer 613 is formed is moved to a position facing the pressing member 820, and the second member 660 is overlaid on the adhesive layer 613 where the curing reaction (crosslinking reaction or polymerization reaction) has started. . Then, the second member 660 is pressed against the first member 650 by the pressing member 820 via the adhesive layer 613 before curing (adhesion process). When the chemical reaction of the adhesive layer 613 is completed and completely cured, the first member 650 and the second member 660 are firmly bonded by the cured adhesive layer 613.

   According to the embodiment described above, by using the film forming and mixing unit 810 in which the film forming unit and the ultrasonic wave applying unit are integrated, the structure of the bonding apparatus is further simplified, and the bonding apparatus is reduced in size and weight. Can be realized.

In the bonding apparatus of the present invention, it is also preferable that, for example, the pressing means and the ultrasonic wave application means are integrally formed.
FIG. 7 is a schematic configuration diagram illustrating another bonding apparatus and bonding method of the present invention.
The bonding apparatus 900 according to this embodiment includes a film forming unit including the droplet discharge head 1 and a pressing and mixing unit 910 in which the pressing unit and the ultrasonic wave applying unit are integrated. The pressing / mixing unit 910 may be any unit as long as an ultrasonic irradiation unit (ultrasonic application unit) 930 is incorporated in a pressing member (pressing unit) 920, for example.

   In the bonding apparatus 900 having such a configuration, the main agent layer 611a and the curing agent layer 612a are formed adjacent to each other or overlapped by the droplet discharge head 1 on one surface of the first member 650 to be bonded. Then, after the first member 650 is pressed and moved to a position facing the mixing unit 910, the second member 660 is overlaid on the main agent layer 611a and the curing agent layer 612a. Then, simultaneously with pressing the pressing member (pressing means) 920 against the second member 660, the ultrasonic irradiation unit 930 incorporated in the pressing member 920 is operated.

   Accordingly, the ultrasonic wave US is applied to the main agent layer 611a and the hardener layer 612a from the pressing member 920 via the second member 660, and the main agent layer 611a and the hardener layer 612a are mixed to form the adhesive layer 613. It is formed. At the same time, the first member 650 and the second member 660 are firmly bonded via the formed adhesive layer 613.

   According to such an embodiment, since mixing and pressing (adhesion) of the main agent layer 611a and the curing agent layer 612a can be performed almost simultaneously, the main agent layer 611a and the curing agent layer 612a are highly reactive, that is, cured. Even if materials having a high speed are combined, the first member 650 and the second member 660 can be securely bonded. Moreover, the process time of the whole adhesion | attachment process can be shortened by forming the adhesive bond layer 613 with a quick cure rate.

FIG. 8 is a schematic configuration diagram illustrating another bonding apparatus and bonding method of the present invention.
The bonding apparatus 950 of this embodiment includes a film forming unit including the droplet discharge head 1, a pressing unit including the pressing member 970, and an adhesive stage 641 on which the first member 650 is placed at the position where the pressing unit is formed. And an ultrasonic wave irradiation unit (ultrasonic wave application means) 980 disposed in the lower part of the screen.

   In the bonding apparatus 950 having such a configuration, the main agent layer 611a and the curing agent layer 612a are formed adjacent to each other or overlapped by the droplet discharge head 1 on one surface of the first member 650 to be bonded. And after the 1st member 650 moves to the position which faces the press member 970, the 2nd member 660 is accumulated on the main ingredient layer 611a and the hardening | curing agent layer 612a. Then, simultaneously with pressing the pressing member (pressing means) 970 against the second member 660, the ultrasonic irradiation unit (ultrasonic applying means) 980 is operated.

   As a result, ultrasonic waves are applied to the main agent layer 611a and the curing agent layer 612a from the ultrasonic irradiation unit 980 disposed below the bonding stage 641 through the bonding stage 641. Then, the main agent layer 611a and the curing agent layer 612a are mixed by ultrasonic vibration to form the adhesive layer 613. At the same time, the first member 650 and the second member 660 are firmly bonded through the adhesive layer 613 formed by mixing.

   Even in such an embodiment, mixing and pressing (adhesion) of the main agent layer 611a and the curing agent layer 612a can be performed almost simultaneously, so that the main agent layer 611a and the curing agent layer 612a are highly reactive, that is, Even if materials having a high curing rate are combined, the first member 650 and the second member 660 can be securely bonded. Moreover, the process time of the whole adhesion | attachment process can be shortened by forming the adhesive bond layer 613 with a quick cure rate.

   In each of the above-described embodiments, the main component of the two-component curable adhesive that forms the main agent layer and the curing agent that forms the hardener layer are each exemplified as one type. However, the present invention is not limited to this, and a total of three or more types including a main agent composed of a plurality of types of resins or a curing agent composed of a plurality of types of polymerization initiators and catalysts, etc. The main agent and the curing agent may be composed of the adhesive material, and these may be mixed by ultrasonic vibration to form the adhesive layer.

DESCRIPTION OF SYMBOLS 1 ... Droplet discharge head, 500 ... Flexible substrate, 512 ... Terminal part, 600 ... Adhesion apparatus, 610 ... Film-forming means, 611 ... Main agent, 612 ... Hardener, 611a ... Main agent layer, 612a ... Hardener layer, 613 ... Adhesive layer, 620 ... ultrasonic wave applying means, 630 ... pressing means.

Claims (7)

A film forming means for forming a main agent layer and a curing agent layer constituting a two-component curable adhesive adjacent to or overlapping each other between the first member and the second member;
Ultrasonic application means for applying an ultrasonic wave to the main agent layer and the curing agent layer and mixing them to form an adhesive layer;
A pressing unit that presses the first member and the second member together and bonds the first member and the second member via the adhesive layer;
A bonding apparatus comprising at least:    The bonding apparatus according to claim 1, wherein the film forming unit and the ultrasonic wave applying unit are integrally formed.    The bonding apparatus according to claim 1, wherein the pressing unit and the ultrasonic wave application unit are integrally formed.    The bonding apparatus according to claim 1, wherein the ultrasonic wave application unit applies ultrasonic waves to the first member and / or the second member integrally. A film forming step of forming a main agent layer and a curing agent layer constituting the two-component curable adhesive adjacent to each other or overlapping each other between the first member and the second member;
A mixing step of applying an ultrasonic wave to the main agent layer and the curing agent layer, and mixing the main agent layer and the curing agent layer to form an adhesive layer;
A pressing step in which the first member and the second member are pressed against each other and bonded through the adhesive layer;
A bonding method characterized by comprising at least    The bonding method according to claim 5, wherein the mixing step and the pressing step are performed at substantially the same timing. A method of manufacturing a droplet discharge head, comprising: connecting a flexible substrate on which an integrated circuit for driving the droplet discharge head is formed and an electrode of a piezoelectric element using the bonding method according to claim 5. .

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