JP2011187481A - Processing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a processing device reducing load exerted on an operator when arranging a plurality of devices abreast in a factory or the like by reducing the width dimension on the one surface side at the sacrifice of the depth dimension orthogonal to one side surface with an operation unit disposed. <P>SOLUTION: The device includes a casing frame 2 with an operation panel 15 disposed on one surface, and a moving mechanism relatively moving a holding table 5 holding a work piece W and a processing mechanism 4 in the casing frame 2 in a crosswise direction almost parallel with one side surface of the casing frame 2 and in a longitudinal direction almost orthogonal to it. The processing mechanism 4 is configured that a processing head 51 processing the work piece W and an imaging unit 52 imaging the work piece W are disposed to array a part A1 processed by the processing head 51 and a part A2 imaged by the imaging unit 52 in the longitudinal direction. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a processing apparatus that processes a workpiece such as a semiconductor wafer, and more particularly to a processing apparatus that is arranged side by side in a factory or the like to constitute a production line for the workpiece.

  In the semiconductor device manufacturing process, division lines (streets) are formed in a lattice pattern on the surface of a workpiece such as a semiconductor wafer, and circuits such as ICs and LSIs are formed in regions partitioned by the division lines. Then, the workpiece is divided into individual semiconductor chips along the planned division line by the processing apparatus. The semiconductor chip thus divided is packaged and widely used in electric devices such as mobile phones and personal computers.

  As described above, the division of the workpiece along the planned division line is performed not only by cutting using a cutting blade, but also by laser processing by irradiating a laser beam and cutting. 2. Description of the Related Art Conventionally, as a processing apparatus that divides a workpiece along a planned division line, an apparatus in which an operation panel is provided on one side surface of a housing frame of the processing apparatus is known (for example, see Patent Document 1). This processing apparatus is configured such that processing conditions and the like of the laser processing apparatus are input when an operator touches a predetermined position on the operation panel.

JP 2010-21464 A

  By the way, in a factory equipped with a plurality of processing devices as described above, the processing devices are arranged side by side with one side surface provided with an operation panel directed in the same direction, and one operator operates a plurality of processing devices. Has become commonplace. In this case, since the operator operates the operation panels of the plurality of processing devices, the operator has to move in a wide range along the arrangement direction of the plurality of processing devices, which is a burden.

  For this reason, it is required that a processing apparatus disposed in a factory or the like is designed to have a small width dimension on one side surface of a housing frame provided with an operation unit such as an operation panel. In order to meet this demand, it is conceivable to reduce the width of one side of the housing frame by reducing the size of the processing device. However, the processing device is configured with a complex combination of many parts and is simple. Could not be downsized.

  The present invention has been made in view of such circumstances, and at the expense of the depth dimension orthogonal to the one side surface provided with the operation unit, by reducing the width dimension on the one side surface, It is an object of the present invention to provide a machining apparatus that can reduce the burden on an operator when a plurality of the machines are arranged.

  The machining apparatus of the present invention includes a holding mechanism for holding a workpiece, a machining mechanism for machining the workpiece held by the holding mechanism, an operation mechanism for driving the holding mechanism and the machining mechanism by an operator's operation, A first moving mechanism for relatively moving the holding mechanism and the processing mechanism in a left-right direction parallel to an operation surface side on which the operation mechanism is disposed; and the holding in a front-rear direction orthogonal to the operation surface side. A machining device having a mechanism and a second moving mechanism for relatively moving the machining mechanism, wherein the machining mechanism includes a machining means for machining the workpiece and a position at which the workpiece is machined. The processing means and the imaging means are arranged so that a processing location where the processing means processes the workpiece and an imaging location where the imaging means images the workpiece are aligned in the front-rear direction. Arranged And wherein the Rukoto.

  According to this configuration, the processing means and the imaging means are arranged so that the processing location where the processing means processes the workpiece and the imaging location where the imaging means images the workpiece are aligned in the front-rear direction orthogonal to the operation surface side. Has been. By arranging the machining location and the imaging location side by side in the front-rear direction, the movement range in the front-rear direction of the holding mechanism (processing mechanism) can be increased during processing using the processing means and alignment processing using the imaging means. Although the deviation occurs, the movement range in the left-right direction is matched. Therefore, the depth dimension in the front-rear direction orthogonal to the operation surface side is increased, while the width dimension in the left-right direction parallel to the operation surface side is reduced, compared to the configuration in which the processing location and the imaging location are arranged in the left-right direction. Can do. In this way, by reducing the size in the left-right direction at the expense of the size in the front-rear direction, the operator's movement range in a factory where a plurality of processing devices are arranged side by side is narrowed, reducing the burden on the operator. can do.

  According to the present invention, an operator in a factory or the like where a plurality of processing devices are arranged side by side by reducing the width dimension on one side surface at the expense of the depth dimension orthogonal to the one side surface provided with the operation unit. It is possible to reduce the burden on the operator by narrowing the movement range.

It is a figure which shows embodiment of the laser processing apparatus which concerns on this invention, and is a perspective view of a laser processing apparatus. It is a figure which shows embodiment of the laser processing apparatus which concerns on this invention, and is explanatory drawing of the attachment structure of a wiring protection mechanism. It is a figure which shows embodiment of the laser processing apparatus which concerns on this invention, and is explanatory drawing of the arrangement configuration of a wiring protection mechanism. It is a figure which shows embodiment of the laser processing apparatus which concerns on this invention, and is explanatory drawing of the moving range of the left-right direction of a holding table. It is a figure which shows embodiment of the laser processing apparatus which concerns on this invention, and is a perspective view of the semiconductor wafer supported by the cyclic | annular flame | frame.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. First, before describing the laser processing apparatus according to the present embodiment, a semiconductor wafer to be processed will be briefly described. FIG. 5 is a perspective view of the semiconductor wafer supported by the annular frame.

  As shown in FIG. 5, the semiconductor wafer W is formed in a substantially disc shape, and is partitioned into a plurality of regions by scheduled division lines 71 arranged in a lattice pattern on the surface. A device 72 such as an IC or an LSI is formed in each partitioned area. Further, the semiconductor wafer W is supported by the annular frame 74 via the sticking tape 73 and is carried into and out of the laser processing apparatus 1.

In the present embodiment, a semiconductor wafer such as a silicon wafer or a gallium strain is described as an example of the workpiece, but the present invention is not limited to this configuration. Adhesive members such as DAF (Die Attach Film) provided on the backside of semiconductor wafers, semiconductor product packages, ceramics, glass, sapphire (Al ₂ O ₃ ) based inorganic material substrates, various electrical components and micron-order processing position accuracy Various processing materials that require the above may be used as the workpiece.

  Next, the laser processing apparatus according to the present embodiment will be described with reference to FIG. FIG. 1 is a perspective view of a laser processing apparatus according to an embodiment of the present invention. In the following description, a configuration in which a semiconductor wafer is divided by a laser processing apparatus will be described, but the present invention is not limited to this configuration. The present invention can be applied to any processing apparatus as long as it processes a semiconductor wafer. In FIG. 1, for convenience of explanation, a housing frame and a base portion of the laser processing apparatus are indicated by a one-dot chain line.

  As shown in FIG. 1, the laser processing apparatus 1 has a rectangular parallelepiped casing frame (support base) 2. The housing frame 2 is divided into upper and lower parts by a base portion 3, and a processing mechanism 4 that performs laser processing on the semiconductor wafer W is disposed on the upper side, and a holding table (holding mechanism) 5 that holds the semiconductor wafer W is disposed on the lower side. ing. The laser processing apparatus 1 is configured to process the semiconductor wafer W by relatively moving the processing mechanism 4 and the holding table 5.

  A touch panel type operation panel (operation unit) 15 is provided on the front portion 11 of the housing frame 2. The operation panel 15 drives the processing mechanism 4 and the holding table 5 by an operator's operation, and various processing conditions such as laser beam output, wavelength, frequency, and processing feed rate are set. In addition, an opening / closing door 16 is provided adjacent to the operation panel 15 on the front portion 11 of the housing frame 2, and the semiconductor wafer W is put into the housing frame 2 through the opening / closing door 16.

  The base portion 3 is formed with an opening 18 that communicates with the upper and lower spaces in the housing frame 2. The opening 18 is formed corresponding to the opening / closing door 16, and allows the semiconductor wafer W to be loaded into the lower space of the housing frame 2, that is, the holding table 5 through the opening / closing door 16. The lower portion of the housing frame 2 is a pedestal portion 13. On the upper surface of the pedestal portion 13, the holding table 5 is arranged in the front-rear direction substantially orthogonal to the front portion 11 on which the operation panel 15 is disposed, and the front portion 11. A holding table moving mechanism 6 is provided for moving in the left-right direction substantially parallel to the horizontal direction.

  The holding table moving mechanism 6 moves an X-axis direction moving mechanism (second moving mechanism) 21 that moves the holding table 5 in the X-axis direction that is the front-rear direction, and moves the holding table 5 in the Y-axis direction that is the left-right direction. And a Y-axis direction moving mechanism (first moving mechanism) 22. The X-axis direction moving mechanism 21 includes a pair of guide rails 23 arranged on the upper surface of the pedestal portion 13 and parallel to the X-axis direction, and a motor-driven X-axis table 24 slidably supported by the pair of guide rails 23. have.

  The Y-axis direction moving mechanism 22 includes a pair of guide rails 25 arranged on the upper surface of the X-axis table 24 and parallel to the Y-axis direction, and a motor-driven Y-axis table 26 slidably supported by the pair of guide rails 25. have. A holding table 5 is provided on the upper surface of the Y-axis table 26. Further, nut portions (not shown) are formed on the back surface sides of the X-axis table 24 and the Y-axis table 26, and ball screws 31 and 32 are screwed to the nut portions, respectively. Drive motors 33 and 34 are connected to one end portions of the ball screws 31 and 32, and the ball screws 31 and 32 are rotationally driven by the drive motors 33 and 34.

  Electric power is supplied to the X-axis direction moving mechanism 21, the Y-axis direction moving mechanism 22, and the holding table 5 from a power source outside the housing frame 2 through a plurality of wires 36. The plurality of wirings 36 extend from the back surface 12 side of the housing frame 2 into the housing frame 2, and are laid in a wiring space formed in the X-axis table 24 from the rear surface 37 side of the X-axis table 24. Connected to each part of the axial movement mechanism 21. A part of the wiring 36 extends from the upper surface 38 of the X-axis table 24 to the outside of the X-axis table 24, and is laid in a wiring space formed in the Y-axis table 26 from the lower surface 39 side of the Y-axis table 26. It is connected to each part of the Y-axis direction moving mechanism 22 and the holding table 5.

  In this case, the plurality of wires 36 are led out with a sufficient length from the back surface portion 12 of the housing frame 2 to the rear surface 37 of the X-axis table 24, and are curved in a U-shape in the middle. Further, a part of the wiring 36 is drawn with a sufficient length from the upper surface 38 of the X-axis table 24 to the lower surface 39 of the Y-axis table 26, and is bent in a U-shape in the middle. Wiring protection mechanisms 41 and 42 for preventing twisting and disconnection of the wiring 36 are attached to the extra length portion of the wiring 36 drawn out in a U shape.

  The wiring protection mechanisms 41 and 42 are so-called cable bears (registered trademark) in which a large number of connecting bodies are connected in a long chain shape so as to be rotatable with respect to each other, and are configured to accommodate a plurality of wirings 36. The wiring protection mechanism 41 is adjacent to the X-axis direction moving mechanism 21 in the front-rear direction, and is disposed between the rear surface 37 of the X-axis table 24 and the back surface portion 12 of the housing frame 2 in a horizontal posture. The wiring protection mechanism 42 is adjacent to the Y-axis direction moving mechanism 22 in the front-rear direction, and is disposed between the upper surface 38 of the X-axis table 24 and the lower surface 39 of the Y-axis table 26 in a vertical posture.

  The wiring protection mechanism 41 is bent (bent) in a U shape along the plurality of wirings 36, one end (moving end) is connected to the rear surface 37 of the X-axis table 24, and the other end (fixed end). Is connected to the back surface portion 12 of the housing frame 2. One end and the other end of the wiring protection mechanism 41 are separated and approached in the front-rear direction as the X-axis table 24 moves in the front-rear direction. The wiring protection mechanism 41 is expanded and contracted in the front-rear direction by the separation and approach of the one end and the other end, and can follow the movement of the X-axis table 24. The details of the mounting configuration of the wiring protection mechanism 41 will be described later.

  The wiring protection mechanism 42 is bent (bent) in a U shape along the plurality of wirings 36, one end (moving end) is connected to the lower surface 39 of the Y-axis table 26, and the other end (fixed end). Is connected to the upper surface 38 of the X-axis table 24. One end of the wiring protection mechanism 42 is moved in the left-right direction with respect to the other end fixed to the X-axis table 24 as the Y-axis table 26 moves in the left-right direction. The wiring protection mechanism 42 can follow the movement of the Y-axis table 26 by moving the U-shaped curved portion in the left-right direction by the movement of one end with respect to the other end.

  In this way, the wiring protection mechanisms 41 and 42 are arranged side by side in the front-rear direction with respect to the X-axis direction moving mechanism 21 and the Y-axis direction moving mechanism 22, respectively, and the X-axis direction moving mechanism 21 and the Y-axis direction moving mechanism 22 are arranged. The movement is following. Therefore, the laser processing apparatus 1 has a width dimension in the left-right direction as compared with the configuration in which the wiring protection mechanisms 41, 42 are arranged in the left-right direction with respect to the X-axis direction moving mechanism 21 and the Y-axis direction moving mechanism 22. It is small.

  The holding table 5 includes a θ table 44 that can rotate around the Z axis on the upper surface of the Y-axis table 26, and a work holding unit 45 that is provided on the top of the θ table 44 and holds the semiconductor wafer W by suction. . The work holding part 45 has a disk shape having a predetermined thickness, and an adsorption surface 46 is formed of a porous ceramic material at the center of the upper surface. The suction surface 46 is a surface that sucks the semiconductor wafer W through the sticking tape 73 by a negative pressure, and is connected to a suction source through a pipe inside the θ table 44.

  Around the work holding portion 45, four clamp portions 47 are provided via a pair of support arms extending radially outward from the four sides of the θ table 44. The four clamp portions 47 are driven by an air actuator to clamp and fix the annular frame 74 around the semiconductor wafer W from four directions.

  In addition, the processing mechanism 4 includes a processing head (processing means) 51 that irradiates the semiconductor wafer W with a laser beam, and an imaging unit (imaging means) 52 that images the upper surface of the semiconductor wafer W. The processing head 51 and the imaging unit 52 are arranged side by side in the front-rear direction below the housing 53 supported by the base unit 3, and are held on the holding table 5 through an opening (not shown) of the base unit 3. Opposed to.

  In addition, a control unit 54 that performs overall control of driving of the processing mechanism 4, an oscillator 55 that oscillates a laser beam, and a laser optical system (not shown) are provided in the housing 53. The control unit 54 controls the laser processing by the processing head 51 based on the processing conditions set on the operation panel 15 and also controls the alignment processing by the imaging unit 52. The processing head 51 condenses the laser beam oscillated from the oscillator 55 and irradiates the semiconductor wafer W held on the holding table 5.

  The imaging unit 52 includes an imaging element such as a CCD, and images the semiconductor wafer W by the imaging element to search for an alignment target included in the semiconductor wafer W. The imaging unit 52 moves the imaging range on the semiconductor wafer W along with the movement of the holding table 5, continuously captures images, and outputs captured images to the control unit 54. The control unit 54 searches for an alignment target by pattern matching the reference pattern stored in the storage unit in advance with the alignment target included in the captured image, and determines the division planned line 71 based on this (alignment processing). To implement.

  As described above, the processing head 51 and the imaging unit 52 are arranged side by side in the front-rear direction in the casing 53, and perform laser processing and alignment processing by arranging the processing part and the imaging part in the front-rear direction. For this reason, the laser processing apparatus 1 reduces the horizontal movement range of the holding table 5 in comparison with the configuration in which the processing location of the processing head 51 and the imaging location of the imaging unit 52 are aligned in the left-right direction. The width dimension is reduced.

  The laser processing apparatus 1 configured as described above is arranged side by side with other processing apparatuses with a front side provided with the operation panel 15 in one direction in a factory or the like, and is operated by a small number of operators (for example, one person). Is done. Then, the operator moves along the direction in which the plurality of processing devices are arranged, and the processing is continuously performed by operating the operation panel and loading the semiconductor wafer with respect to each processing device.

  Here, with reference to FIG. 2, the attachment structure of the wiring protection mechanism arrange | positioned along with the front-back direction with respect to an X-axis direction movement table is demonstrated. FIG. 2 is an explanatory diagram of the mounting configuration of the wiring protection mechanism according to the embodiment of the present invention. 2A shows a contracted state of the wiring protection mechanism according to the present embodiment, FIG. 2B shows an expanded state of the wiring protection mechanism according to the present embodiment, and FIG. The extension state of the wiring protection mechanism concerning an example is shown. Here, the Y-axis direction moving mechanism and the holding table are omitted.

  As shown in FIG. 2A, the wiring protection mechanism 41 includes a mechanism main body (protection means) 61 composed of a large number of coupling bodies, and a first fixing portion that fixes one end of the mechanism main body 61 to the X-axis table 24. (First fixing means) 62 and a second fixing portion (second fixing means) 63 for fixing the other end portion of the mechanism main body 61 to the back surface portion 12 of the housing frame 2. The mechanism body 61 is contracted in a U shape when viewed from above when the X-axis table 24 is in the rear position. At this time, one end side and the other end side of the mechanism main body 61 extend in the left-right direction along the rear surface 37 of the X-axis table 24 and the back surface portion 12 of the housing frame 2 with a folded portion by bending.

  The first fixing portion 62 includes a pair of attachment plates (installation members) 64 and 65 and a rotation shaft 66 that rotatably connects the side end portions of the pair of attachment plates 64 and 65. The mounting plate 64 is fixed to the rear surface 37 of the X-axis table 24, and the mounting plate 65 is fixed to the facing surface 67 of the mechanism body 61 that faces the rear surface 37 of the X-axis table 24. Thereby, one end side of the mechanism main body 61 is connected to the X axis table 24 around the rotation shaft 66 so as to be rotatable about the Z axis (a direction perpendicular to the bendable direction of the mechanism main body 61 as an axis). The

  The second fixing portion 63 is formed in a flat plate shape, and is fixed to the back surface portion 12 of the housing frame 2 and is fixed to the facing surface 68 of the mechanism main body 61 facing the back surface portion 12. Thereby, the other end side of the wiring protection mechanism 41 is non-rotatably connected to the back surface portion 12 of the housing frame 2 with the second fixing portion 63 interposed therebetween.

  As shown in FIG. 2B, when the X-axis table 24 is moved forward, the mechanism main body 61 is pulled forward from one end side. At this time, one end portion of the mechanism body 61 is hinged to the X-axis table 24 by the first fixing portion 62, so that the mechanism body 61 is rotated in the direction of the arrow D about the rotation shaft 66. It is directed from the left-right direction along the rear surface 37 to the front-rear direction side. Therefore, the wiring protection mechanism 41 according to the present embodiment is a comparative example in which both ends of the mechanism main body 82 are non-rotatably connected to the X-axis table 24 and the housing frame 2 as shown in FIG. The stroke in the front-rear direction can be made longer than the wiring protection mechanism 81 according to the above.

  Further, since the stroke in the front-rear direction of the wiring protection mechanism 41 can be increased, the short wiring protection mechanism 41 can be used. Further, when the X-axis table 24 moves backward, the one end of the mechanism body 61 and the X-axis table 24 are hinged to each other in the left-right direction of the U-shaped curved portion as compared with the wiring protection mechanism 81 according to the comparative example. Can suppress the swelling. As described above, the wiring protection mechanism 41 according to the present embodiment can be formed in a short length and can suppress the bulging of the curved portion in the left-right direction. Therefore, the width dimension in the left-right direction of the X-axis table 24 when contracted. It is configured to fit easily below. Thereby, it is prevented that the width dimension in the left-right direction of the laser processing apparatus 1 increases due to the swelling of the wiring protection mechanism 41 in the left-right direction.

  In the present embodiment, the one end portion of the mechanism main body 61 is hinged to the X-axis table 24, but is not limited to this configuration. The other end of the mechanism body 61 may be hinged to the housing frame 2, or both ends of the mechanism body 61 may be hinged to the X-axis table 24 and the housing frame 2. When both end portions of the mechanism main body 61 are hingedly connected to the X-axis table 24 and the housing frame 2, the stroke of the wiring protection mechanism 41 in the front-rear direction can be further increased.

  With reference to FIG. 3, the relationship between the arrangement configuration of the wiring protection mechanism and the width dimension in the left-right direction of the laser processing apparatus will be described. FIG. 3 is an explanatory diagram of the arrangement configuration of the wiring protection mechanism according to the embodiment of the present invention. In FIG. 3, (a) shows the arrangement configuration of the wiring protection mechanism according to the comparative example, and (b) shows the arrangement configuration of the wiring protection mechanism according to the present embodiment. Here, the Y-axis direction moving mechanism and the holding table are omitted.

  As shown in FIG. 3A, the laser processing apparatus 83 according to the comparative example has the wiring protection mechanism 88 arranged in the left-right direction with respect to the X-axis direction moving mechanism 85, and between the pedestal portion 86 and the X-axis table 87. It is arranged in the vertical orientation. The wiring protection mechanism 88 extends in the front-rear direction along one end of the X-axis table 87 in the left-right direction below the X-axis table 87. The X-axis table 87 is formed to be large in the left-right direction in order to secure an arrangement area for the wiring protection mechanism 88. For this reason, the laser processing apparatus 83 according to the comparative example is formed with a large width dimension.

  As described above, the laser processing apparatus 83 according to the comparative example has a large width dimension in the left-right direction, and the wiring protection mechanism 88 is arranged in the left-right direction with respect to the X-axis direction moving mechanism 85. Therefore, in a factory or the like where a plurality of laser processing apparatuses 83 according to the comparative example are arranged side by side, the range in which the operator moves to operate the processing apparatus is widened, and the burden on the operator is increased.

  As shown in FIG. 3B, the laser processing apparatus 1 according to the present embodiment has the wiring protection mechanism 41 arranged in the front-rear direction with respect to the X-axis direction moving mechanism 21, and the X-axis table 24 and the housing frame 2 are arranged. It arrange | positions in the sideways attitude | position between the back part 12 of this. The wiring protection mechanism 41 extends in the left-right direction along the rear surface 37 of the X-axis table 24 behind the X-axis table 24. For this reason, the X-axis table 24 is not formed large in the left-right direction in order to secure the arrangement area of the wiring protection mechanism 41. Further, when the X-axis table 24 is moved rearward, the extending range in the left-right direction of the wiring protection mechanism 41 is stored to be equal to or smaller than the width dimension in the left-right direction of the X-axis table 24.

  Thus, in the laser processing apparatus 1 according to the present embodiment, the wiring protection mechanism 41 is arranged side by side in the front-rear direction with respect to the X-axis direction moving mechanism 21, and the wiring protection mechanism 41 extends in the left-right direction. The range is stored below the width dimension of the X-axis table 24 in the left-right direction. Therefore, as compared with the laser processing apparatus 83 according to the comparative example, the laser processing apparatus 1 according to the present embodiment is as deep as the wiring protection mechanism 41 is arranged in the front-rear direction with respect to the X-axis direction moving mechanism 21. Although the size is increased, the width in the left-right direction can be reduced. Therefore, in a factory or the like in which a plurality of laser processing apparatuses 1 according to the present embodiment are arranged side by side, the range in which the operator moves to operate the processing apparatus can be narrowed to reduce the burden on the operator. .

  With reference to FIG. 4, the relationship between the moving range of the holding table in the left-right direction and the width dimension of the laser processing apparatus in the left-right direction will be described. FIG. 4 is an explanatory diagram of a moving range in the left-right direction of the holding table according to the embodiment of the present invention. In FIG. 4, (a) shows the horizontal movement range of the holding table according to the comparative example, and (b) shows the horizontal movement range of the holding table according to the present embodiment.

  As shown in FIG. 4A, the laser processing apparatus 83 according to the comparative example is configured such that the processing location A1 of the processing head and the imaging location A2 of the imaging unit are aligned in the left-right direction. In this case, the holding table 89 is moved around the machining location A1 during laser processing, and is moved around the imaging location A2 during alignment processing. Therefore, although the holding table 89 does not change the moving range in the front-rear direction between the laser processing and the alignment process, there is a shift in the moving range in the left-right direction. For this reason, the laser processing apparatus 83 according to the comparative example is formed to have a large width dimension so as to cover the maximum movement range of the holding table 89 in the left-right direction.

  As described above, the laser processing apparatus 83 according to the comparative example is formed so that the dimension width in the left-right direction is large, and the processing location A1 and the imaging location A2 are arranged in the left-right direction. Therefore, in a factory or the like where a plurality of laser processing apparatuses 83 according to the comparative example are arranged side by side, the range in which the operator moves to operate the processing apparatus is widened, and the burden on the operator is increased.

  As shown in FIG. 4B, the laser processing apparatus 1 according to the present embodiment is configured such that the processing location A1 of the processing head and the imaging location A2 of the imaging unit are aligned in the front-rear direction. In this case, since the processing location A1 and the imaging location A2 are arranged so as to be aligned in the front-rear direction, the movement range in the front-rear direction is shifted between laser processing and alignment processing, but the movement range in the left-right direction is Match.

  As described above, the laser processing apparatus 1 according to the present embodiment arranges the processing location A1 and the imaging location A2 in the front-rear direction, and the horizontal movement range of the holding table 5 coincides between the laser processing and the alignment processing. I am letting. Therefore, the laser processing apparatus 1 according to the present embodiment has a depth dimension larger than the laser processing apparatus 1 according to the comparative example by arranging the processing location A1 and the imaging location A2 in the front-rear direction. It is possible to reduce the width dimension in the left-right direction. Therefore, in a factory or the like where a plurality of laser processing apparatuses 1 according to the present embodiment are arranged side by side, the range in which the operator moves to operate the processing apparatus can be narrowed to further reduce the burden on the operator. it can.

  Here, the processing operation by the laser processing apparatus 1 will be described. The semiconductor wafer W is placed on the holding table 5 through the opening / closing door 16 by the operator. Next, the holding table 5 is moved below the processing mechanism 4 so that the semiconductor wafer W faces the imaging unit 52 and the processing head 51. Next, the surface of the semiconductor wafer W on the holding table 5 is imaged by the imaging unit 52, and alignment processing is performed based on the captured image captured by the imaging unit 52.

  Next, the laser injection port of the processing head 51 is aligned with the division planned line 71 in the X-axis direction of the semiconductor wafer W, and the semiconductor wafer W is irradiated with the laser beam. When the semiconductor wafer W is irradiated with a laser beam by the processing head 51, the holding table 5 is processed and fed in the X-axis direction, and one division planned line 71 of the semiconductor wafer W is processed. Subsequently, the holding table 5 is moved by several pitches in the Y-axis direction, and the laser emission ports of the processing head 51 are aligned with the adjacent division planned lines 71. Then, the holding table 5 is processed and fed in the X-axis direction, and one division planned line 71 of the semiconductor wafer W is processed. This operation is repeated to process all the division lines 71 in the X-axis direction of the semiconductor wafer W.

  Next, when all the planned dividing lines 71 in the X-axis direction of the semiconductor wafer W on the holding table 5 are processed, the θ table 44 is rotated 90 degrees, and the planned dividing lines 71 in the Y-axis direction of the semiconductor wafer W are changed. Processing starts. When all the scheduled division lines 71 of the semiconductor wafer W on the holding table 5 are processed, the laser processing apparatus 1 is stopped. Then, the semiconductor wafer W is taken out by the operator via the opening / closing door 16 and a new semiconductor wafer W is loaded.

  As described above, according to the laser processing apparatus 1 according to the present embodiment, the processing head 51 and the imaging unit 52 are disposed so that the processing location A1 and the imaging location A2 are aligned in the front-rear direction. By arranging the processing location A1 and the imaging location A2 in the front-rear direction, the movement range in the front-rear direction is shifted between the laser processing and the alignment process, but the movement range in the left-right direction is matched. . Therefore, the depth dimension in the front-rear direction can be increased while the width dimension in the left-right direction can be reduced as compared with the configuration in which the processing location A1 and the imaging location A2 are arranged in the left-right direction. In this way, by reducing the size in the left-right direction at the expense of the size in the front-rear direction, the operator's movement range in a factory where a plurality of processing devices are arranged side by side is narrowed, reducing the burden on the operator. can do.

  In the above-described embodiment, the casing frame is formed in a rectangular shape, but is not limited to this configuration. The casing frame may have any configuration as long as the laser processing mechanism and the holding table can be accommodated inside.

  Further, in the above-described embodiment, the laser processing apparatus is configured such that the work is put into the housing frame by the operator, but is not limited to this configuration. The laser processing apparatus may be configured to dynamically load the workpiece into the housing frame from the outside.

  Further, in the above-described embodiment, the semiconductor wafer is divided by the laser processing apparatus, but is not limited to this configuration. The processing apparatus may be any configuration as long as it can divide the semiconductor wafer. For example, the processing apparatus may be a dicing apparatus that cuts the semiconductor wafer with a cutting blade.

  In the above-described embodiment, the wiring protection mechanism has a chain structure in which a plurality of linked bodies are connected. However, the present invention is not limited to this configuration. The wiring protection mechanism may have any configuration as long as it can follow the movement of the X-axis direction movement mechanism and the Y-axis direction movement mechanism in a state where the wiring is accommodated.

  Further, in the above-described embodiment, the wiring protection mechanism is configured to be attached via the first and second fixing portions, but is not limited to this configuration. It is good also as a structure by which the one end part and other end part of a wiring protection mechanism are directly attached with respect to attachment object.

  Further, in the above-described embodiment, the first fixing portion is configured by connecting a pair of attachment plates so as to be rotatable about the rotation shaft, but is not limited to this configuration. The first fixing portion may be configured so that the mechanism body can be hingedly connected to the X-axis direction moving mechanism. For example, the first fixing portion may be configured by rotatably connecting a pair of attachment plates without using a rotating shaft. Good.

  In the above-described embodiment, the holding table is configured to move with respect to the processing mechanism. However, the configuration is not limited to this configuration. The present invention can be applied to a configuration in which the holding table and the processing mechanism are relatively moved. For example, the present invention can also be applied to a configuration in which the processing mechanism is moved with respect to the holding table. In this case, the wiring protection mechanism is arranged side by side in the front-rear direction with respect to the moving mechanism that moves the processing mechanism.

  The embodiment disclosed this time is illustrative in all respects and is not limited to this embodiment. The scope of the present invention is shown not by the above description of the embodiments but by the scope of the claims, and is intended to include all modifications within the meaning and scope equivalent to the scope of the claims.

  As described above, the present invention has the effect that the burden on the operator can be reduced by reducing the width dimension on the one side surface at the expense of the depth dimension orthogonal to the one side surface provided with the operation portion. In particular, it is useful for a processing apparatus that is arranged side by side in a factory or the like and constitutes a workpiece production line.

1 Laser processing equipment (processing equipment)
2 Housing frame (support base)
3 Base part 4 Processing mechanism 5 Holding table (holding mechanism)
6 holding table moving mechanism 11 front part 12 back part 15 operation panel (operation part)
21 X-axis direction moving mechanism (second moving mechanism)
22 Y-axis direction moving mechanism (first moving mechanism)
24 X-axis table 26 Y-axis table 36 Wiring 41, 42 Wiring protection mechanism 51 Processing head (processing means)
52 Imaging unit (imaging means)
61 Mechanism body (protection means)
62 1st fixing | fixed part (1st fixing means)
63 Second fixing portion (second fixing means)
64, 65 Mounting plate (installation member)
66 Axis of rotation A1 Machining location A2 Imaging location W Semiconductor wafer (workpiece)

Claims (1)

A holding mechanism for holding the workpiece, a processing mechanism for processing the workpiece held by the holding mechanism,
An operation mechanism for driving the holding mechanism and the processing mechanism by an operation of an operator;
A first movement mechanism for relatively moving the holding mechanism and the processing mechanism in a left-right direction parallel to an operation surface side on which the operation mechanism is disposed;
A second moving mechanism that relatively moves the holding mechanism and the processing mechanism in the front-rear direction orthogonal to the operation surface side,
The processing mechanism is:
A processing unit that processes the workpiece; an imaging unit that detects a position at which the workpiece is processed; a processing portion where the processing unit processes the workpiece; and an imaging unit that images the workpiece The processing device, wherein the processing means and the imaging means are arranged so that the portions are aligned in the front-rear direction.

Images