JP2011159094A - Method for manufacturing electric solid state device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing an electric solid state device which can prevent substrate damage even when manufacturing an electric solid state device substrate composed of a tempered glass substrate having a functional layer from a large glass substrate. <P>SOLUTION: In the manufacture of a touch panel substrate 20 composed of a tempered glass substrate having a functional layer such as electrodes from a large glass substrate, when chemical tempering is applied to the large glass substrate 200 to produce a large tempered glass substrate 200f, areas along cutting lines 200t are formed into low strength areas 200u composed of non-tempered areas 205u. After a functional layer such as electrodes is formed on the large tempered glass substrate 200f, the large tempered glass substrate 200f is cut along the low strength areas 200u. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a method for manufacturing an electrical solid state device such as a touch panel.

  A touch panel, a liquid crystal device, an organic electroluminescence device, a solar cell, and the like are configured as an electric solid device including a substrate for an electric solid device on which a functional layer including a wiring layer and / or an electrode layer is formed. In such an electrical solid state device, it is conceivable to use tempered glass as means for reducing the thickness of the substrate while maintaining the strength of the substrate. In order to efficiently manufacture an electrical solid state device, it is preferable to employ a method of forming a functional layer on a large glass substrate and then cutting the large glass substrate into a single-size substrate. However, in the case of tempered glass, when the cutting groove is formed with a glass diamond cutter, there is a problem that it is easily broken by the stress of the tempered glass itself.

  On the other hand, as a technique for preventing breakage of tempered glass, in the field of solar cells, there is a method of forming a cutting groove in tempered glass by heating with nichrome wire, and then cutting the tempered glass by applying a compressive load. It has been proposed (see Patent Document 1).

JP 2002-289899 A

  However, even in the method described in Patent Document 1, when a tempered glass is cut by applying a compressive load, the tempered glass itself may be damaged. For this reason, conventionally, after cutting a large glass substrate into a small glass substrate, a tempering treatment is performed, and a method of forming a functional layer on the small tempered glass substrate has to be adopted. Therefore, when a tempered glass substrate is used, there is a problem that productivity is remarkably low. In addition, after forming a functional layer on a large glass substrate, the method of cutting to a single size and then performing a tempering treatment prevents the ion exchange during the tempering treatment by the functional layer, thus strengthening the entire glass substrate. Difficult to do.

  In view of the above problems, an object of the present invention is to provide an electrical device capable of preventing damage to a substrate even when a substrate for an electrical solid device made of a tempered glass substrate having a functional layer is manufactured from a large glass substrate. An object of the present invention is to provide a method for manufacturing a solid state device.

  In order to solve the above-described problems, the present invention is a method for manufacturing an electrical solid state device including a substrate for an electrical solid state device in which a functional layer including at least a wiring layer and / or an electrode layer is formed on a tempered glass substrate. When the large glass substrate on which the plurality of substrates for the electrical solid device are formed is tempered to obtain a large tempered glass substrate, or before the tempering is performed, the substrate for the electrical solid device A large tempered glass substrate forming step with a low-strength region that forms a low-strength region having a lower strength than the substrate-forming region for the electric solid device in a region along the outer periphery of the substrate-forming region for the electric solid device, A functional layer forming step of forming the functional layer on at least one surface of the substrate forming region for the electric solid state device, and cutting the substrate forming region for the electric solid state device along the low strength region; And having a cutting step of obtaining the electrical solid state device substrate Te.

  In the present invention, a large-sized tempered glass substrate with a low-strength region in which a low-strength region is formed in a region along the outer periphery of the substrate-forming region for an electric solid device that forms the substrate for an electric solid-state device is prepared. After the functional layer is formed on the glass substrate, the large tempered glass substrate is cut along the low-strength region to obtain a substrate for an electrical solid device. For this reason, since it can cut | disconnect a large tempered glass board | substrate, without applying an excessive load to a large tempered glass board | substrate, it can prevent that a large tempered glass board | substrate or an electric solid apparatus board | substrate is damaged at the time of a cutting | disconnection. . Further, since the tempering treatment is performed before the functional layer is formed, the tempering treatment can be performed on the large glass without being obstructed by the functional layer.

  In the present invention, in the large tempered glass substrate forming step with the low-strength region, the tempered processing is performed except the region along the low-strength region in the large-sized glass substrate, and the non-strengthened region not subjected to the tempering treatment It is preferable to form a low strength region. According to this configuration, the formation of the low-strength region and the strengthening of the large glass substrate can be performed at the same time.

  In the present invention, in the large tempered glass substrate forming step with the low-strength region, the large glass substrate is entirely in the thickness direction in a region along the outer periphery of the substrate forming region for the electrical solid device with respect to the large glass substrate. A low-strength region forming step of forming the low-strength region composed of the slits and the connecting portions by alternately providing the removed slits and the connecting portions from which the large glass substrate is not removed, and forming the low-strength regions You may employ | adopt the method of performing the tempering process which performs a tempering process to the said large sized glass substrate after a process, and obtains the said large tempered glass substrate.

  Further, in the present invention, in the large tempered glass substrate forming step with the low-strength region, the large glass substrate has a thickness direction in a region along the outer periphery of the substrate forming region for the electrical solid device with respect to the large glass substrate. A low-strength region forming step for forming the low-strength region consisting of the grooves by forming a groove removed halfway; a strengthening treatment step for obtaining the large-sized tempered glass substrate by performing a tempering treatment on the large-sized glass substrate; It is also possible to adopt a method of performing.

  In the present invention, the strengthening treatment is preferably a chemical strengthening treatment. In the present invention, since the strengthening process is performed before the functional layer is formed, when the chemical strengthening process is performed, ion exchange can be performed without being obstructed by the functional layer.

  In this invention, when performing the said cutting process, it is preferable to cover the said functional layer with a protective layer. If comprised in this way, it can prevent that a functional layer is damaged in a cutting process.

  In the present invention, examples of the electric solid device include a touch panel. In this case, the substrate for an electric solid device is a substrate for a touch panel on which an input position detection electrode is formed as the functional layer.

  In this case, it is preferable that the substrate for an electrical solid device is a capacitive touch panel substrate in which the input position detection electrode is formed on a surface opposite to the input operation surface.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an explanatory diagram schematically illustrating an entire configuration of an electro-optical device with an input function including a touch panel according to a first embodiment of the present invention. It is explanatory drawing which shows schematic structure of the board | substrate for touchscreens used for the electrostatic capacitance type input device which concerns on Embodiment 1 of this invention. It is explanatory drawing which shows a mode that the board | substrate for single-size touch panels is cut out from a large sized glass substrate in the manufacturing method of the touch panel which concerns on Embodiment 1 of this invention. In the manufacturing method of the touch panel which concerns on Embodiment 1 of this invention, it is explanatory drawing which expands and shows the low intensity | strength area | region of a large tempered glass substrate. It is explanatory drawing which shows the manufacturing method of the large tempered glass board | substrate provided with the low intensity | strength area | region in the manufacturing method of the touchscreen which concerns on Embodiment 1 of this invention. It is explanatory drawing which shows a mode that the board | substrate for single-size touch panels is cut out from a large sized glass substrate in the manufacturing method of the touch panel which concerns on Embodiment 2 of this invention. It is explanatory drawing which expands and shows the low intensity | strength area | region of a large tempered glass board | substrate in the manufacturing method of the touchscreen which concerns on Embodiment 2 of this invention. It is explanatory drawing which shows the manufacturing method of the large tempered glass substrate provided with the low intensity | strength area | region in the manufacturing method of the touchscreen which concerns on Embodiment 2 of this invention. It is explanatory drawing which shows a mode that the board | substrate for single-size touch panels is cut out from a large sized glass substrate in the manufacturing method of the touch panel which concerns on Embodiment 3 of this invention. It is explanatory drawing which expands and shows the low intensity | strength area | region of a large tempered glass board | substrate in the manufacturing method of the touchscreen which concerns on Embodiment 3 of this invention. It is explanatory drawing which shows the manufacturing method of the large tempered glass substrate provided with the low intensity | strength area | region in the manufacturing method of the touchscreen which concerns on Embodiment 3 of this invention. It is explanatory drawing which shows a mode that the board | substrate for single-size touch panels and another member are cut out from a large sized glass substrate in the manufacturing method of the touch panel which concerns on Embodiment 5 of this invention. It is explanatory drawing of the electronic device provided with the electro-optical apparatus with an input function to which this invention is applied.

  Embodiments of the present invention will be described with reference to the drawings. In addition, although this invention can be applied to various electric solid devices, such as a touchscreen, a liquid crystal device, an organic electroluminescent device, a solar cell, etc., in the following description, the case where this invention is applied to a touchscreen is illustrated. . For this reason, in the following description, the touch panel corresponds to an “electric solid device”, the touch panel substrate corresponds to an “electric solid device substrate”, and the input position detection electrodes and wiring correspond to “functional layers”. To do. In the drawings referred to in the following description, the scales are different for each layer and each member so that each layer and each member have a size that can be recognized on the drawing.

[Embodiment 1]
FIG. 1 is an explanatory diagram schematically showing the overall configuration of an electro-optical device with an input function including a touch panel according to Embodiment 1 of the present invention, and FIGS. FIG. 2 is an explanatory diagram schematically showing an external appearance of the electro-optical device, and an explanatory diagram schematically showing a cross-sectional configuration of the electro-optical device with an input function.

  In FIG. 1, an electro-optical device 100 with an input device according to the present embodiment is generally an image generating device 5 composed of a liquid crystal device or the like, and a static light arranged on the surface on the display light emitting side of the image generating device 5. It has a capacitance-type input device 1. The input device 1 includes a touch panel 2 (electric solid device), and the image generation device 5 includes a liquid crystal panel as an electro-optical panel 5a (display panel). In the present embodiment, the touch panel 2 and the electro-optical panel 5a both have a rectangular planar shape, and the central region when the input device 1 and the electro-optical device 100 with an input device are viewed in plan is the input region 2a. Further, in the image generating device 5 and the electro-optical device 100 with the input device, an area that overlaps the input area 2a in a plan view is an image forming area. Of the four end portions 20e, 20f, 20g, and 20h of the touch panel 2, the flexible wiring board 35 is connected to the side where the end portion 20e is located, and the flexible wiring is connected to the side where the end portion 20e is located in the electro-optical panel 5a. A substrate 73 is connected.

  The image generation device 5 is a transmissive or transflective active matrix liquid crystal display device, and is opposite to the side on which the touch panel 2 is disposed with respect to the electro-optical panel 5a (the display light emission side and Is provided with a backlight device (not shown). The backlight device includes, for example, a translucent light guide plate that is disposed on the side opposite to the side on which the touch panel 2 is disposed with respect to the electro-optical panel 5a, and a white color toward the side end of the light guide plate. A light source such as a light emitting diode that emits light, etc., and the light emitted from the light source is incident on the side end of the light guide plate and then is emitted toward the electro-optical panel while propagating through the light guide plate. The A sheet-like optical member such as a light scattering sheet or a prism sheet is disposed between the light guide plate and the electro-optical panel 5a, and the side opposite to the side where the electro-optical panel 5a is located with respect to the light guide plate. A reflective sheet is arranged in the case.

  In the image generating apparatus 5, a first polarizing plate 81 is placed on the electroluminescent panel 5a on the display light emission side, and a second polarizing plate 82 is placed on the opposite side. The electro-optical panel 5a includes a light-transmitting element substrate 50 disposed on the side opposite to the display light emission side, and a light-transmitting counter element disposed opposite to the element substrate 50 on the display light emission side. And a substrate 60. The counter substrate 60 and the element substrate 50 are bonded to each other with a rectangular frame-shaped sealing material 71, and the liquid crystal layer 55 is held in a region surrounded by the sealing material 71 between the counter substrate 60 and the element substrate 50. ing. In the element substrate 50, a plurality of pixel electrodes 58 are formed on a surface facing the counter substrate 60 by a translucent conductive film such as an ITO (Indium Tin Oxide) film or an IZO (Indium Zinc Oxide) film. A common electrode 68 is formed of a light-transmitting conductive film such as an ITO film on the surface facing the element substrate 50. Further, a color filter (not shown) is formed on the counter substrate 60. When the image generation apparatus 5 is an IPS (In Plane Switching) method or an FFS (Fringe Field Switching) method, the common electrode 68 is provided on the element substrate 50 side. Further, the element substrate 50 may be arranged on the display light emitting side with respect to the counter substrate 60. In the element substrate 50, a driving IC 75 is COG-mounted in an overhang region 59 projecting from the edge of the counter substrate 60, and a flexible wiring board 73 is connected to the overhang region 59. Note that a drive circuit may be formed on the element substrate 50 simultaneously with the switching elements on the element substrate 50.

(Detailed configuration of the input device 1)
In the input device 1, the touch panel 2 includes a translucent touch panel substrate 20. Hereinafter, in the touch panel substrate 20, a side located on the input operation surface side is defined as a first surface 20 a, and the opposite side is defined. This will be described as the second surface 20b.

  In the input device 1 of this embodiment, a light-transmitting cover or the like is not provided on the first surface 20a side of the touch panel substrate 20, and the first surface 20a itself of the touch panel substrate 20 is an input operation surface. Yes. For this reason, the touch panel 2 is reduced in thickness because a light-transmitting cover or the like is not provided. The touch panel substrate 20 is a tempered glass substrate, and has sufficient strength without providing a light-transmitting cover or the like. In addition, since the touch panel substrate 20 is a tempered glass substrate, the touch panel 2 can be made thinner because the thickness of the touch panel substrate 20 can be reduced. On the first surface 20a side of the touch panel substrate 20, a light shielding layer 90 (not shown in FIG. 1A) is provided in a peripheral region 2b corresponding to the outside of the input region 2a. It consists of a printing layer and a light shielding sheet.

  In the input device 1 of the present embodiment, on the second surface 20b side of the touch panel substrate 20, the first light-transmissive conductive film 4a, the interlayer insulating film 214, and the like from the lower layer side to the upper layer side as viewed from the touch panel substrate 20, A second translucent conductive film 4b is formed, and the input position detecting electrode 21 is formed by the first translucent conductive film 4a out of the first translucent conductive film 4a and the second translucent conductive film 4b. Is formed. Moreover, the flexible wiring board 35 is connected to the 1st surface 20a in the edge part 20e of the board | substrate 20 for touch panels.

  Between the touch panel 2 and the electro-optical panel 5a, a conductive film 99 for shielding in which a light-transmitting conductive film such as an ITO film is formed on a light-transmitting film is disposed. It is adhered to the second surface 20b side of the touch panel substrate 20 by an adhesive layer 99e. In the touch panel 2, the conductive film 99 side is integrated with the image generating device 5 by an adhesive layer (not shown). The conductive film 99 has a function of preventing a potential change on the image generating device 5 side from affecting the input position detecting electrode 21 as noise. When a sufficient distance can be secured between them, the conductive film 99 may be omitted.

(Schematic configuration of electrodes of input device 1)
FIG. 2 is an explanatory diagram showing a schematic configuration of the touch panel substrate 20 used in the capacitance-type input device 1 according to the first embodiment of the present invention, and FIGS. 2A and 2B are planar configurations. It is explanatory drawing which shows, and explanatory drawing which shows a cross-sectional structure. In FIG. 2A, the corner of the input area 2a is indicated by an English letter “L” mark. FIG. 2B corresponds to a cross-sectional view taken along the line CC ′ of the touch panel substrate 20. Note that FIG. 2A shows the second surface 20b side of the touch panel substrate 20, and is shown to be reversed from the left and right in FIG.

  As shown in FIG. 2A, in the capacitance-type input device 1 of this embodiment, the input surface 2b extends in the X direction (first direction) on the second surface 20b of the touch panel substrate 20. A plurality of first electrodes 211 for input position detection and a plurality of second electrodes 212 for input position detection extending in the Y direction (second direction) intersecting the X direction in the input region 2a are formed. The first electrode 211 and the second electrode 212 form an input position detection electrode 21 (electrode layer / functional layer). Further, on the second surface 20b of the touch panel substrate 20, the signal wiring 27 (wiring layer / functional layer) extending from one end of the first electrode 211 is provided in the peripheral region 2b corresponding to the outside of the input region 2a. The signal wiring 27 extending from one end portion of the second electrode 212 is formed, and a portion of the signal wiring 27 located at the end portion 20e is a mounting terminal 24. Note that the light shielding layer 90 described with reference to FIG. 1B overlaps the signal wiring 27, the mounting terminal 24, and the like, and the signal wiring 27 and the mounting terminal 24 cannot be seen from the input operation surface side. It is like that.

  As shown in FIG. 2B, in the capacitance-type input device 1 of the present embodiment, the second surface 20b side of the touch panel substrate 20 is directed from the lower layer side to the upper layer side as viewed from the touch panel substrate 20. The first light-transmitting conductive film 4a, the interlayer insulating film 214, and the second light-transmitting conductive film 4b are sequentially formed. Further, on the second surface 20b side of the touch panel substrate 20, a metal film is formed on the upper surface of the first translucent conductive film 4a in the portion of the first translucent conductive film 4a constituting the signal wiring 27. 4c is formed.

  In this embodiment, the first light-transmitting conductive film 4a is made of a polycrystalline ITO film, and a light-transmitting insulating film such as a photosensitive resin film or a silicon oxide film is formed on the upper layer side of the first light-transmitting conductive film 4a. An interlayer insulating film 214 made of is formed. In the present embodiment, the second translucent conductive film 4b is also made of a polycrystalline ITO film, like the first translucent conductive film 4a. The metal film 4c is made of a silver-palladium-copper alloy or the like. The second surface 20b of the touch panel substrate 20 may have a light-transmitting base protective film made of a silicon oxide film or the like formed on the entire surface thereof. In this case, the first transparent surface is formed on the base protective film. The photoconductive film 4a, the interlayer insulating film 214, and the second translucent conductive film 4b are sequentially stacked.

  In the capacitance-type input device 1 of the present embodiment, the first light-transmissive conductive film 4a is first formed as a plurality of rhombus regions in the input region 2a. The pad portions 211a and 212a (large area portion) of the first electrode 211 and the second electrode 212) are configured. These pad portions 211a and 212a are alternately arranged in the X direction and the Y direction. In the plurality of pad portions 211a, adjacent pad portions 211a in the X direction (first direction) are connected via a connecting portion 211c, and the pad portion 211a and the connecting portion 211c extend in the X direction. Is configured. On the other hand, the plurality of pad portions 212a constitute the second electrode 212 extending in the Y direction (second direction), but overlap between the pad portions 212a adjacent in the Y direction, that is, the connecting portion 211c. The portion is a discontinuous portion 218a. The first translucent conductive film 4a is formed as a lower layer side wiring 271 that constitutes a lower layer side of the signal wiring 27 in the peripheral region 2b.

  The interlayer insulating film 214 is formed in a wide region from the input region 2a to the peripheral region 2b. A contact hole 214a is formed in the interlayer insulating film 214, and the contact hole 214a is formed at a position overlapping the end portion facing the gap portion 218a in the pad portion 212a. On the upper layer side of the interlayer insulating film 214, the second light-transmissive conductive film 4b is formed as a relay electrode 215 in a region overlapping with the contact hole 214a. The metal layer 4c is formed as an upper layer side wiring 272 constituting the upper layer side of the signal wiring 27 in the peripheral region 2b. Further, a top coat layer 219 made of a photosensitive resin or the like is formed on substantially the entire surface of the touch panel substrate 20 on the upper layer side of the second translucent conductive film 4b.

  In the capacitance-type input device 1 configured as described above, the first electrode 211 and the second electrode 212 are formed of the same conductive film (first translucent conductive film 4a) and intersect each other. Therefore, an intersection 218 where the first electrode 211 and the second electrode 212 intersect exists on the touch panel substrate 20. Here, of the first electrode 211 and the second electrode 212, the first electrode 211 extends in the X direction by the connecting portion 211c made of the second light-transmissive conductive film 4b even at the intersection 218. On the other hand, the second electrode 212 has a discontinuous portion 218 a at the intersection 218. However, at the intersection 218, a relay electrode 215 is formed in the upper layer of the interlayer insulating film 214, and the relay electrode 215 is adjacent to the pad adjacent to the interrupted portion 218a through the contact hole 214a of the interlayer insulating film 214. 212a is electrically connected. For this reason, the second electrode 212 extends in the Y direction while being electrically connected in the Y direction. Note that the relay electrode 215 overlaps the connecting portion 211c with the interlayer insulating film 214 interposed therebetween, so there is no possibility of short circuit.

(Input position detection method)
In the input device 1 configured as described above, when a position detection signal in the form of a rectangular pulse is output to the input position detection electrode 21, if no capacitance is parasitic on the input position detection electrode 21, the input position detection electrode 21 A signal having the same waveform as the applied position detection signal is detected. On the other hand, if a capacitance is parasitic on the input position detection electrode 21, a waveform distortion due to the capacitance occurs. Therefore, it is detected whether or not the capacitance is parasitic on the input position detection electrode 21. be able to. Therefore, when the finger approaches one of the plurality of input position detection electrodes 21, the input position detection electrode 21 that is in proximity to the finger has a capacitance corresponding to the capacitance generated between the finger. Since it increases, it is possible to identify the electrode that the finger is close to.

(Method for manufacturing touch panel 2)
FIG. 3 is an explanatory diagram showing a state in which a single-size touch panel substrate 20 is cut out from a large glass substrate in the manufacturing method of the touch panel 2 according to Embodiment 1 of the present invention, and FIGS. These are explanatory drawing of the board | substrate cutting-out area | region (electrical solid apparatus substrate formation area) cut out as the board | substrate 20 for touch panels in a large sized glass substrate, and explanatory drawing of the low intensity | strength area | region provided in the large tempered glass substrate. FIG. 4 is an explanatory view showing, in an enlarged manner, a low-strength region of a large tempered glass substrate in the method for manufacturing the touch panel 2 according to Embodiment 1 of the present invention, and FIG. 4 (a), FIG. 4 (b), FIG. ) Is an explanatory diagram showing an enlarged planar configuration of a part of a large tempered glass substrate (for two substrate cut-out regions), an A1-A1 ′ sectional view, and an explanatory diagram showing an enlarged sectional view. FIG. 5 is an explanatory view showing a method for manufacturing a large tempered glass substrate having a low-strength region in the method for manufacturing the touch panel 2 according to Embodiment 1 of the present invention, and FIG. 5 (a), FIG. (C) is explanatory drawing which expands and shows the planar structure of a part of large glass substrate (for two board | substrate cutting-out area | regions), A1-A1 'sectional drawing, and explanatory drawing which expands and shows a cross section. In FIGS. 4A and 5A, the planned cutting line 200t is represented by a thick one-dot chain line with respect to one substrate cutting region 200s.

  In the touch panel 2 of this embodiment, a tempered glass substrate is used as the touch panel substrate 20, and a large tempered glass substrate with a low-strength region prepared by the method described below with reference to FIGS. 3 to 5 is used. Manufactured.

  In this embodiment, when manufacturing the touch panel substrate 20, as shown in FIG. 3A, a large glass substrate 200 that can take a large number of touch panel substrates 20 is used. It is drawn along the outer periphery of the substrate cutout region 200s cut out as the touch panel substrate 20.

  In manufacturing the touch panel substrate 20 using such a large glass substrate 200, first, in this embodiment, as shown in FIGS. 3B, 4A, and 4B, large tempered glass with a low strength region is provided. In the substrate forming process, when the large glass substrate 200 is tempered to obtain the large tempered glass substrate 200f, the low strength region 200u having a lower strength than the substrate cutting region 200s is provided in the region along the outer periphery of the substrate cutting region 200s. Form.

  In forming the low-strength region 200u, in the present embodiment, as shown in FIG. 4C, in the large tempered glass substrate forming step with the low-strength region, the low-strength along the planned cutting line 200t in the large-sized glass substrate 200. The strengthening process is performed except for the area where the area 200u is formed, and the low-strength area 200u is formed by the non-strengthened area 205u that has not been subjected to the strengthening process.

  More specifically, as shown in FIGS. 5A, 5B, and 5C, the first surface 200a of the large glass substrate 200 (the first surface 20a of the touch panel substrate 20) and the second surface 200b ( A mask 210a is formed on both of the second surfaces 20b) of the touch panel substrate 20 along the planned cutting line 200t, and in this state, a strengthening process is performed. In this embodiment, the chemical strengthening process is performed by immersing the large glass substrate 200 in a potassium salt molten bath having a temperature of about 400 ° C. as the strengthening process. Therefore, as the mask 210a, a resist, an oxide film or the like having heat resistance that can withstand such a bath temperature and an ion exchange element function is used. As a result, sodium ions of the large glass substrate 200 are ion-exchanged with potassium ions on the surface of the region exposed from the mask 210a in the large glass substrate 200. Here, the ionic radius of sodium is 95 nm, whereas the ionic radius of potassium ions is 133 nm. The ionic radius of potassium ions is larger than that of sodium ions. For this reason, the large glass substrate 200 becomes a large tempered glass substrate 200f whose strength is reinforced by the compressive stress caused by the chemical strengthening layer 205 on the surface. In the large tempered glass substrate 200f, the substrate cutting region 200s is chemically strengthened. On the other hand, the region covered with the mask 210a is a low-strength region 200u (non-reinforced region) that is not chemically strengthened. For this reason, the strength of the low strength region 200u is lower than that of the substrate cutout region 200s and the like.

  In this embodiment, a boundary region having a width larger than the width of the mask 210a is interposed between adjacent substrate cutout regions 200s, and the mask 210a is independent for each substrate cutout region 200s. Is formed. For this reason, since two rows of masks 210a are formed in parallel between the adjacent substrate cutout regions 200s with a predetermined gap therebetween, two rows of masks 210a are formed between the adjacent substrate cutout regions 200s. Between the masks 210a is a chemically strengthened reinforcing region 200w.

  After forming the large tempered glass substrate 200f with the low-strength region 200u in this way, the mask 210a is removed and a functional layer forming step is performed. In the functional layer forming process, the film forming process and the patterning process are repeated, and the input position detection described on the second surface 200b side of the large tempered glass substrate 200f with reference to FIGS. Functional layers such as the electrode 21, the signal wiring 27, and the mounting terminal 24 are formed. Further, the top coat layer 219 such as the input position detecting electrode 21 and the signal wiring 27 is also formed at the stage of the large tempered glass substrate 200f. Here, the mounting terminals 24 are exposed from the interlayer insulating film 214 and the topcoat layer 219. Therefore, in the present embodiment, at the stage of the large tempered glass substrate 200f, a protective layer 240 that covers the mounting terminal 24 is formed as shown by a one-dot chain line in FIG. The next cutting process is performed in a state of covering. Note that since the protective layer 240 needs to be removed after the cutting step, a sheet or a resin layer that is easily peeled off after the cutting step is used as the protective layer 240.

  Next, in the cutting step, the large tempered glass substrate 200f is cut along the low-strength region 200u (scheduled cutting line 200t) and its extension line to obtain the touch panel substrate 20, and then the protective layer 240 is removed. As a result, a single-size touch panel substrate 20 can be obtained. In such a cutting step, a cutting method such as chemical etching, CNC cutting, dicing, or water jet may be employed for cutting the large tempered glass substrate 200f.

(Main effects of this form)
As described above, in the present embodiment, the large tempered glass substrate 200f in which the low-strength region 200u is formed along the planned cutting line 200t when cutting out the touch panel substrate 20 (electrical solid device substrate) is prepared. After functional layers such as the input position detection electrode 21 and the signal wiring 27 are formed on the large tempered glass substrate 200f, the large tempered glass substrate 200f is cut along the low-strength region 200u to obtain the touch panel substrate 20. For this reason, since the large tempered glass substrate 200f can be cut without applying an excessive load to the large tempered glass substrate 200f, the large tempered glass substrate 200f or the touch panel substrate 20 is caused by its own internal stress at the time of cutting. Damage can be prevented. Further, since the chemical strengthening process is performed before the functional layers such as the input position detecting electrode 21 and the signal wiring 27 are formed on the large tempered glass substrate 200f, ion exchange (strengthening process) is performed without being interrupted by the functional layers. Can be done. Therefore, even when tempered glass is used for the touch panel substrate 20, functional layers such as the input position detection electrode 21 and the signal wiring 27 are formed in a large-sized substrate state in which a plurality of touch panel substrates 20 can be cut out. Since it only has to be formed, productivity can be improved. In addition, the film forming apparatus for forming the functional layer only needs to correspond to the size of the large glass substrate 200, and does not need to have a specification that matches the size of the single-size touch panel substrate 20. Therefore, even when the size of the touch panel substrate 20 differs depending on the model, the film forming apparatus can be used efficiently.

  In this embodiment, since the tempered glass substrate is used for the touch panel substrate 20, the thickness of the touch panel substrate 20 may be thin. Further, a tempered glass substrate is used for the touch panel substrate 20, and functional layers such as the input position detection electrode 21 and the signal wiring 27 are formed on the second surface 20 b of the touch panel substrate 20. Therefore, the first surface 20a of the touch panel substrate 20 can be used as an input operation surface, and there is no need to provide a separate cover on the input operation surface side of the touch panel substrate 20. Therefore, the touch panel 2 can be thinned.

  In the present embodiment, in the large tempered glass substrate forming step with the low strength region for forming the large tempered glass substrate 200f with the low strength region, the tempering process is performed on the large glass substrate 200 except for the region along the planned cutting line 200t. The low-strength region 200u is formed by the non-strengthened region that has not been subjected to the strengthening process. For this reason, formation of the low intensity | strength area | region 200u and reinforcement | strengthening of the large sized glass substrate 200 can be performed simultaneously.

  Further, when performing the cutting process, functional layers such as the input position detection electrode 21, the signal wiring 27, and the mounting terminal 24 are covered with the topcoat layer 219 (protective layer) and the protective layer 240. It is possible to prevent the functional layer from being damaged.

[Embodiment 2]
FIG. 6 is an explanatory view showing a state in which a single-size touch panel substrate 20 is cut out from the large glass substrate 200 in the manufacturing method of the touch panel 2 according to Embodiment 2 of the present invention. ) Is an explanatory diagram of a substrate cutout region 200s cut out as the touch panel substrate 20 in the large glass substrate 200, and an explanatory diagram of a low strength region 200u provided in the large tempered glass substrate 200f. FIG. 7 is an explanatory diagram showing, in an enlarged manner, the low-strength region 200u of the large tempered glass substrate 200f in the manufacturing method of the touch panel 2 according to Embodiment 2 of the present invention. (C) and (d) are enlarged explanatory views showing a part of the large tempered glass substrate 200f (for two substrate cut-out regions), A2-A2 ′ sectional view, B2-B2 ′ sectional view, It is explanatory drawing which expands and shows a cross section. FIG. 8 is an explanatory view showing a method for manufacturing a large tempered glass substrate 200f having a low-strength region 200u in the method for manufacturing the touch panel 2 according to Embodiment 2 of the present invention, and FIGS. ), (C), (d) are enlarged explanatory views showing a part of the large glass substrate 200 (two substrate cut-out regions), A2-A2 ′ sectional view, B2-B2 ′ sectional view. It is explanatory drawing which expands and shows a cross section. In FIG. 7A and FIG. 8A, a planned cutting line is represented by a thick one-dot chain line with respect to one substrate cutting region.

  In this embodiment, the structure and the like of the touch panel 2 are the same as those in the first embodiment, and only the manufacturing method thereof is different from the first embodiment. Therefore, in the following description, common parts are denoted by the same reference numerals and description of the structure and the like is omitted.

  Also in this embodiment, a tempered glass substrate is used for the touch panel substrate 20 of the touch panel 2 described with reference to FIGS. 1 and 2, as in the first embodiment. 8 using a large tempered glass substrate with a low strength region prepared by the method described below with reference to FIG.

  In this embodiment, as in the first embodiment, when manufacturing the touch panel substrate 20, as shown in FIG. 6A, a large glass substrate 200 that can take a large number of touch panel substrates 20 is used. The substrate cutout region 200s cut out as the touch panel substrate 20 is represented as a region surrounded by the planned cutting line 200t.

  In manufacturing the touch panel substrate 20 using such a large glass substrate 200, in the present embodiment, first, as shown in FIGS. 6B and 7A, in a large tempered glass substrate forming step with a low strength region. Before the large glass substrate 200 is tempered to obtain the large tempered glass substrate 200f, the low strength region 200u having a lower strength than the substrate cut region 200s is formed along the planned cutting line 200t.

  In forming the low-strength region 200u, in this embodiment, as shown in FIGS. 7A, 7B, 7C, and 7D, a large glass is formed in the large-sized tempered glass substrate forming step with the low-strength region. A slit 201u formed of a through hole from which the large glass substrate 200 is removed in the entire thickness direction along the planned cutting line 200t with respect to the substrate 200, and a narrow connecting portion 202u from which the large glass substrate 200 is not removed Are alternately provided to form a low-strength region 200u composed of slits 201u and connecting portions 202u.

  More specifically, as shown in FIGS. 8A, 8B, 8C, and 8D, the first surface 200a of the large glass substrate 200 (the first surface 20a of the touch panel substrate 20) and the first surface The mask 210b is formed on both the two surfaces 200b (the second surface 20b of the touch panel substrate 20) except for the region along the planned cutting line 200t, and in this state, the large glass substrate 200 is etched. . At that time, the mask 210b is left in a plurality of locations in the circumferential direction (regions where the joint portions 202u shown in FIGS. 6 and 7 are to be formed) even in the region along the planned cutting line 200t. As a result, as shown in FIG. 6B and FIG. 7, in the region along the planned cutting line 200t, in the region exposed from the mask 210b, the entire large glass substrate 200 in the thickness direction is etched, and the slit 201u is formed. Even in the region along the planned cutting line 200t, the region covered with the mask 210b is not etched, and the joint portion 202u remains. In this embodiment, the connecting portion 202u is left near the corner portions at both ends in any of the four side portions of the substrate cutout region 200a. Therefore, in this embodiment, one low-strength region 200u is formed by a total of eight slits 201u and a total of eight connecting portions 202u at the side and corner portions.

  In this embodiment, a boundary region having a width larger than the width of the mask 210b is interposed between adjacent substrate cutout regions 200s, and the mask 210b is independent for each substrate cutout region 200s. Is formed. For this reason, since two rows of masks 210b are formed in parallel between the adjacent substrate cutout regions 200s with a predetermined gap therebetween, the slit 201u is formed between the adjacent substrate cutout regions 200s. In the middle, there remains a reinforcing region 200w that extends continuously without interruption.

  After forming the low-strength region 200u in this way, the mask 210b is removed, and then the large glass substrate 200 is tempered. Also in this embodiment, as in the first embodiment, the chemical strengthening treatment is performed by immersing the large glass substrate 200 in a potassium salt molten bath having a temperature of about 400 ° C. as the strengthening treatment. As a result, as shown in FIG. 7, sodium ions of the large glass substrate 200 are ion-exchanged with potassium ions on the entire surface of the large glass substrate 200 including the inner surface of the slit 201 u and the connecting portion 202 u. For this reason, the large glass substrate 200 becomes a large tempered glass substrate 200f whose strength is reinforced by the compressive stress caused by the chemical strengthening layer 205 on the surface. At that time, the connecting portion 202u is also chemically strengthened, but since the width dimension is narrow, the strength is lower than that of the substrate cutting region 200s and the like.

  After forming the large tempered glass substrate 200f with the low-strength region 200u in this way, the film forming step and the patterning step are repeated in the functional layer forming step, as in the first embodiment, and the large tempered glass substrate. On the second surface 200b side of 200f, functional layers such as the input position detection electrode 21, the signal wiring 27, and the mounting terminal 24 described with reference to FIGS. 2A and 2B are formed. Here, since the slit 201u is formed in the large tempered glass substrate 200f, when the resist mask is formed in the patterning process, the resist penetrates into the slit 201u by using the slit coat method rather than the speed coat method. Can be prevented. In this embodiment, the topcoat layer 219 such as the input position detection electrode 21 and the signal wiring 27 is also formed at the stage of the large tempered glass substrate 200f. Here, the mounting terminals 24 are exposed from the interlayer insulating film 214 and the topcoat layer 219. Therefore, in the present embodiment, at the stage of the large tempered glass substrate 200f, a protective layer 240 that covers the mounting terminal 24 is formed as shown by a one-dot chain line in FIG. The next cutting process is performed in a state of covering. Note that since the protective layer 240 needs to be removed after the cutting step, a sheet or a resin layer that is easily peeled off after the cutting step is used as the protective layer 240.

  Next, in the cutting step, the large tempered glass substrate 200f is cut along the low-strength region 200u (scheduled cutting line 200t) and its extension line to obtain the touch panel substrate 20, and then the protective layer 240 is removed. As a result, a single-size touch panel substrate 20 can be obtained. In such a cutting step, a cutting method such as chemical etching, CNC cutting, dicing, or water jet may be employed for cutting the large tempered glass substrate 200f.

  As described above, in this embodiment as well, as in the first embodiment, the large-scale reinforcement in which the low-strength region 200u is formed along the planned cutting line 200t when the touch panel substrate 20 (electric solid device substrate) is cut out. A glass substrate 200f is prepared, and functional layers such as the input position detection electrode 21 and the signal wiring 27 are formed on the large tempered glass substrate 200f, and then the large tempered glass substrate 200f is cut along the low-strength region 200u. A working substrate 20 is obtained. For this reason, since the large tempered glass substrate 200f can be cut without applying an excessive load to the large tempered glass substrate 200f, the large tempered glass substrate 200f or the touch panel substrate 20 is caused by its own internal stress at the time of cutting. Damage can be prevented. Further, since the chemical strengthening process is performed before the functional layers such as the input position detecting electrode 21 and the signal wiring 27 are formed on the large tempered glass substrate 200f, ion exchange (strengthening process) is performed without being interrupted by the functional layers. Can be done. Therefore, even when tempered glass is used for the touch panel substrate 20, functional layers such as the input position detection electrode 21 and the signal wiring 27 are formed in a large-sized substrate state in which a plurality of touch panel substrates 20 can be cut out. Since it only has to be formed, the effects similar to those of the first embodiment can be obtained, such as improvement in productivity.

[Embodiment 3]
FIG. 9 is an explanatory diagram showing a state in which a single-size touch panel substrate 20 is cut out from the large glass substrate 200 in the manufacturing method of the touch panel 2 according to Embodiment 3 of the present invention. ) Is an explanatory diagram of a substrate cutout region 200s cut out as the touch panel substrate 20 in the large glass substrate 200, and an explanatory diagram of a low strength region 200u provided in the large tempered glass substrate 200f. FIG. 10 is an explanatory diagram showing, in an enlarged manner, the low-strength region 200u of the large tempered glass substrate 200f in the method for manufacturing the touch panel 2 according to Embodiment 3 of the present invention. (C) is explanatory drawing which expands and shows the plane structure of a part (for two board | substrate cutting-out area | regions) of the large tempered glass board | substrate 200f, A3-A3 'sectional drawing, and explanatory drawing which expands and shows a cross section. is there. FIG. 11 is an explanatory diagram showing a method for manufacturing a large tempered glass substrate 200f having a low-strength region 200u in the method for manufacturing the touch panel 2 according to Embodiment 3 of the present invention. ), (C) are enlarged explanatory views showing a planar configuration of a part of the large glass substrate 200 (for two substrate cut-out regions), A3-A3 ′ sectional view, and explanatory views showing the enlarged section. It is. In FIGS. 10A and 11A, a planned cutting line is represented by a thick one-dot chain line with respect to one substrate cutting region.

  In this embodiment, the structure and the like of the touch panel 2 are the same as those in the first embodiment, and only the manufacturing method thereof is different from those in the first and second embodiments. Therefore, in the following description, common parts are denoted by the same reference numerals and description of the structure and the like is omitted.

  Also in this embodiment, a tempered glass substrate is used for the touch panel substrate 20 of the touch panel 2 described with reference to FIGS. 1 and 2 as in the first and second embodiments. ~ Manufactured using a large tempered glass substrate with a low strength region prepared by the method described below with reference to FIG.

  In this embodiment, as in the first and second embodiments, when manufacturing the touch panel substrate 20, as shown in FIG. 9A, a large glass substrate 200 that can take a large number of the touch panel substrates 20 is used. In 200, the board | substrate cutting-out area | region 200s cut out as the board | substrate 20 for touchscreens is represented as an area | region enclosed by the cutting planned line 200t.

  In manufacturing the touch panel substrate 20 using such a large glass substrate 200, in the present embodiment, first, as shown in FIGS. 9B and 10A, in a large tempered glass substrate forming step with a low strength region. Before the large glass substrate 200 is tempered to obtain the large tempered glass substrate 200f, the low strength region 200u having a lower strength than the substrate cut region 200s is formed along the planned cutting line 200t.

  In forming the low-strength region 200u, in this embodiment, as shown in FIGS. 10A, 10B, and 10C, in the large tempered glass substrate forming step with the low-strength region, Thus, the low-strength region 200u is formed which includes the bottomed groove 203u from which the large glass substrate 200 has been removed to a middle position in the thickness direction along the planned cutting line 200t.

  More specifically, as shown in FIGS. 11A, 11B, and 11C, the first surface 200a of the large glass substrate 200 (the first surface 20a of the touch panel substrate 20) and the second surface 200b ( The mask 210c is formed on the entire second surface 200b of the second surface 20b) of the touch panel substrate 20, while the mask 210c is formed on the first surface 200a side except for the region along the planned cutting line 200t. To do. Then, the large glass substrate 200 is etched. As a result, as shown in FIG. 9B and FIG. 10, in the region along the planned cutting line 200 t, the region exposed from the mask 210 c is etched to a middle position in the thickness direction of the large glass substrate 200, A low-strength region 200u composed of the groove 203u is formed.

  In this embodiment, a boundary region having a width larger than the width of the mask 210c is interposed between adjacent substrate cutout regions 200s, and the mask 210c is independent for each substrate cutout region 200s. Is formed. For this reason, since two rows of masks 210c are formed in parallel with each other with a predetermined gap between adjacent substrate cutout regions 200s, grooves 203u are formed between adjacent substrate cutout regions 200s. In the middle, there remains a reinforcing region 200w that extends continuously without interruption.

  After forming the low-strength region 200u in this way, the mask 210c is removed, and then the large glass substrate 200 is tempered. Also in this embodiment, as in the first embodiment, the chemical strengthening treatment is performed by immersing the large glass substrate 200 in a potassium salt molten bath having a temperature of about 400 ° C. as the strengthening treatment. As a result, as shown in FIG. 10, sodium ions of the large glass substrate 200 are ion-exchanged with potassium ions over the entire surface of the large glass substrate 200 including the inner surface of the groove 203u. For this reason, the large glass substrate 200 becomes a large tempered glass substrate 200f whose strength is reinforced by the compressive stress caused by the chemical strengthening layer 205 on the surface. At that time, the inner surface of the groove 203u is also chemically strengthened, but the strength is lower than that of the substrate cutting region 200s and the like because the thickness is thin.

  After forming the large tempered glass substrate 200f with the low-strength region 200u in this way, the film forming step and the patterning step are repeated in the functional layer forming step, as in the first embodiment, and the large tempered glass substrate. On the second surface 200b side of 200f, functional layers such as the input position detection electrode 21, the signal wiring 27, and the mounting terminal 24 described with reference to FIGS. 2A and 2B are formed. In this embodiment, the topcoat layer 219 such as the input position detection electrode 21 and the signal wiring 27 is also formed at the stage of the large tempered glass substrate 200f. Here, the mounting terminals 24 are exposed from the interlayer insulating film 214 and the topcoat layer 219. Therefore, in the present embodiment, at the stage of the large tempered glass substrate 200f, a protective layer 240 that covers the mounting terminal 24 is formed as shown by a one-dot chain line in FIG. The next cutting process is performed in a state of covering. Note that since the protective layer 240 needs to be removed after the cutting step, a sheet or a resin layer that is easily peeled off after the cutting step is used as the protective layer 240.

  Next, in the cutting step, the large tempered glass substrate 200f is cut along the low-strength region 200u (scheduled cutting line 200t) and its extension line to obtain the touch panel substrate 20, and then the protective layer 240 is removed. As a result, a single-size touch panel substrate 20 can be obtained. In such a cutting step, a cutting method such as chemical etching, CNC cutting, dicing, or water jet may be employed for cutting the large tempered glass substrate 200f.

  As described above, also in this embodiment, the low-strength region 200u is formed along the planned cutting line 200t when the touch panel substrate 20 (electrical solid device substrate) is cut out, as in the first and second embodiments. After preparing a large tempered glass substrate 200f and forming functional layers such as the input position detecting electrode 21 and the signal wiring 27 on the large tempered glass substrate 200f, the large tempered glass substrate 200f is cut along the low-strength region 200u. Thus, the touch panel substrate 20 is obtained. For this reason, since the large tempered glass substrate 200f can be cut without applying an excessive load to the large tempered glass substrate 200f, the large tempered glass substrate 200f or the touch panel substrate 20 is caused by its own internal stress at the time of cutting. Damage can be prevented. Further, since the chemical strengthening process is performed before the functional layers such as the input position detecting electrode 21 and the signal wiring 27 are formed on the large tempered glass substrate 200f, ion exchange (strengthening process) is performed without being interrupted by the functional layers. Can be done. Therefore, even when tempered glass is used for the touch panel substrate 20, functional layers such as the input position detection electrode 21 and the signal wiring 27 are formed in a large-sized substrate state in which a plurality of touch panel substrates 20 can be cut out. Since it only has to be formed, the effects similar to those of the first embodiment can be obtained, such as improvement in productivity.

  Furthermore, in this embodiment, since the groove 203u is formed on the first surface 200a side where the functional layer is not formed in the large glass substrate 200, the entire second surface 200b where the functional layer is formed is flat. For this reason, there is an advantage that it is not affected by the groove 203u during film formation or when a resist mask for patterning is formed.

[Embodiment 4]
In the second and third embodiments, the chemically strengthened glass remains in the low-strength region 200u. However, when the chemical strengthening process is performed, the mask described in the first embodiment is formed, and the low-strength region 200u is formed. Alternatively, a method in which chemical strengthening is not performed may be employed. According to such a configuration, the strength of the low-strength region 200u can be further reduced, so that the large tempered glass substrate 200f or the touch panel substrate 20 is reliably prevented from being damaged due to its own internal stress during cutting. There is an advantage that you can.

[Embodiment 5]
FIG. 12 is an explanatory diagram showing a state in which a single-size touch panel substrate 20 and other members are cut out from the large glass substrate 200 in the manufacturing method of the touch panel 2 according to Embodiment 5 of the present invention. (a), (b) is explanatory drawing at the time of cutting out a cover as another member, and explanatory drawing at the time of cutting out a button as another member.

  In the above embodiment, the present invention is applied to take a large number of touch panel substrates 20. However, as described below, one or more touch panel substrates 20 are formed from a glass substrate larger than the touch panel substrate 20. As shown in FIG. 12 (a), it is cut out and provided at the end of the touch panel substrate 20 as shown in FIG. 12 (b). The present invention may be applied to cut out a button 98 or the like disposed in a hole from a large glass substrate as tempered glass.

[Other embodiments]
In the above embodiment, a liquid crystal device is used as the image generating device 5, but an organic electroluminescence device may be used as the image generating device 5.

  In the above embodiment, the capacitive touch panel has been described as the electrical solid state device. However, other capacitive touch panels with different electrode structures, touch panels other than the capacitive touch panel, liquid crystal devices, and organic devices. The present invention may be applied to manufacturing a substrate (substrate for an electrical solid state device) used for an electrical solid state device such as an electroluminescence device or a solar cell.

[Example of mounting on electronic devices]
An electronic apparatus to which the electro-optical device 100 with an input function according to the above-described embodiment is applied will be described. FIG. 13 is an explanatory diagram of an electronic apparatus including the electro-optical device 100 with an input function to which the present invention is applied. FIG. 13A shows the configuration of a mobile personal computer including the electro-optical device 100 with an input function. The personal computer 2000 includes an electro-optical device 100 with an input function as a display unit and a main body 2010. The main body 2010 is provided with a power switch 2001 and a keyboard 2002. FIG. 13B shows a configuration of a mobile phone including the electro-optical device 100 with an input function. A cellular phone 3000 includes a plurality of operation buttons 3001, scroll buttons 3002, and the electro-optical device 100 with an input function as a display unit. By operating the scroll button 3002, the screen displayed on the electro-optical device 100 with an input function is scrolled. FIG. 13C shows the configuration of a personal digital assistant (PDA) to which the electro-optical device 100 with an input function is applied. The information portable terminal 4000 includes a plurality of operation buttons 4001, a power switch 4002, and the electro-optical device 100 with an input function as a display unit. When the power switch 4002 is operated, various types of information such as an address book and a schedule book are displayed on the electro-optical device 100 with an input function.

  As an electronic apparatus to which the electro-optical device 100 with an input function is applied, a digital still camera, a liquid crystal television, a viewfinder type, a monitor direct-view type video tape recorder, a car navigation device, a pager, Examples include electronic notebooks, calculators, word processors, workstations, video phones, POS terminals, bank terminals, and other electronic devices. The electro-optical device 100 with an input function described above can be applied as a display unit of these various electronic devices.

1..Capacitance type input device, 2..Touch panel (electrical solid state device), 2a..Substrate input area, 2b..Substrate peripheral region, 20..Touch panel substrate (for electric solid state device) Substrate), 21... Input position detection electrode (functional layer), 27 .. Signal wiring (functional layer), 100 .. Electro-optical device with input function, 200.. Large glass substrate, 200 f. , 200 s .. substrate cutting region, 200 t .. planned cutting line, 200 u .. low strength region, 201 u .. slit, 202 u .. connecting portion, 203 u .. groove, 205 .. chemically strengthened layer, 205 u. Area, 240 ... Protective layer

Claims (8)

A method for producing an electrical solid state device comprising an electrical solid state device substrate in which a functional layer comprising at least a wiring layer and / or an electrode layer is formed on a tempered glass substrate,
When the large glass substrate on which a plurality of substrates for the electrical solid device are formed is tempered to obtain a large tempered glass substrate, or before the tempering is performed, the substrate for the electrical solid device is formed. A large tempered glass substrate forming step with a low-strength region that forms a low-strength region having a lower strength than the substrate-forming region for the electric solid device in a region along the outer periphery of the substrate-forming region for the electric solid device;
A functional layer forming step of forming the functional layer on at least one surface of the substrate forming region for the electrical solid device;
A cutting step of cutting the electric solid device substrate forming region along the low-strength region to obtain the electric solid device substrate;
A method for manufacturing an electrical solid state device.   In the large-sized tempered glass substrate forming step with the low-strength region, the tempering process is performed on the large-sized glass substrate except the low-strength region, and the low-strength region is formed by the non-strengthened region not subjected to the tempering process. The method of manufacturing an electrical solid state device according to claim 1.   In the large tempered glass substrate forming step with the low-strength region, a slit in which the large glass substrate is removed in the entire thickness direction in a region along the outer periphery of the substrate forming region for the electrical solid device with respect to the large glass substrate And a low-strength region forming step for forming the low-strength region consisting of the slit and the connecting portion by alternately providing a connecting portion from which the large glass substrate has not been removed, and after the low-strength region forming step, The method for manufacturing an electrical solid state device according to claim 1, wherein a tempering process is performed to perform a tempering process on the large glass substrate to obtain the large tempered glass substrate.   In the large tempered glass substrate forming step with the low-strength region, a groove in which the large glass substrate is removed partway in the thickness direction in a region along the outer periphery of the substrate forming region for the electrical solid device with respect to the large glass substrate A low-strength region forming step for forming the low-strength region composed of the grooves and a tempering step for strengthening the large-sized glass substrate to obtain the large-sized tempered glass substrate. A method for manufacturing an electrical solid state device according to claim 1.   The method of manufacturing an electrical solid state device according to claim 1, wherein the strengthening process is a chemical strengthening process.   6. The method for manufacturing an electrical solid state device according to claim 1, wherein the functional layer is covered with a protective layer when the cutting step is performed.   The electrical solid state device according to any one of claims 1 to 6, wherein the electrical solid state device substrate is a touch panel substrate on which an input position detection electrode is formed as the functional layer. Manufacturing method.   The electric solid-state device substrate according to claim 7, wherein the substrate for an electrical solid device is a capacitive touch panel substrate in which the input position detection electrode is formed on a surface opposite to the input operation surface. Of manufacturing a solid state device.