JP2011018572A - Male terminal fitting - Google Patents

Male terminal fitting Download PDF

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JP2011018572A
JP2011018572A JP2009162661A JP2009162661A JP2011018572A JP 2011018572 A JP2011018572 A JP 2011018572A JP 2009162661 A JP2009162661 A JP 2009162661A JP 2009162661 A JP2009162661 A JP 2009162661A JP 2011018572 A JP2011018572 A JP 2011018572A
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plating layer
gold plating
terminal fitting
gold
male terminal
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JP5293464B2 (en
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Masayasu Fujii
雅康 藤井
Satoshi Tobari
聡 戸張
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Sumitomo Wiring Systems Ltd
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Sumitomo Wiring Systems Ltd
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Abstract

PROBLEM TO BE SOLVED: To reduce a use volume of gold at gold plating.SOLUTION: A given length area positioned away from a tip of a tab part 11 is to be a contact area L with a female terminal fitting F, and a first gold-plated layer 13 is formed on the surface of the contact area L, while a second gold-plated layer 14 thinner than the first gold-plated layer 13 is to be formed at an area in front of the contact area L in the tab part 11. Thus, as the first gold-plated layer 13 with a given film thickness is formed at a part where electric conduction with the female terminal fitting F is necessary, durability unchanged from the prior art is maintained, and, as film thicknesses of gold-plated layers of other sites are lowered, a use volume of gold can be reduced.

Description

本発明は雄端子金具に関するものである。   The present invention relates to a male terminal fitting.

例えば、端子金具が、自動車用エアバッグ回路等のような端子間の接触に高い信頼性が要求される回路で用いられる場合、相手側端子金具との接触領域の表面には金メッキが施されることがある。そのような技術の一例として、下記特許文献1のものが知られている。   For example, when the terminal fitting is used in a circuit that requires high reliability for contact between terminals such as an automobile airbag circuit, the surface of the contact area with the counterpart terminal fitting is plated with gold. Sometimes. As an example of such a technique, one disclosed in Patent Document 1 below is known.

特開2002−231356号公報JP 2002-231356 A

金メッキの手法としては、メッキ液中へ被メッキ部位を浸漬してメッキを行う方式、メッキ液を被メッキ部位へ吹き付けてメッキを行う方式等、種々知られている。例えば、雄端子金具のタブ部に対しても、いずれかの方式によって金メッキが施されてきた。   Various gold plating methods are known, such as a method of plating by immersing a portion to be plated in a plating solution, and a method of performing plating by spraying a plating solution onto the portion to be plated. For example, the gold plating has been applied to the tab portion of the male terminal fitting by any method.

しかし、タブ部における金メッキが施される長さ領域は、タブ部先端から後方へ所定長さ範囲に亘っており、しかもメッキ層の厚さについては、耐摺動磨耗性や耐熱等の耐久性の要因を考慮した必要最小限の寸法を確保する管理がなされるだけであり、本来、雌端子金具との接触に直接関与しない領域までもが、必要以上の厚みをもって金メッキ層が形成されていた。さらに、タブ部の先端(雌端子金具との接続を誘導するために先細り状に形成されている)では、いわゆる「エッジ効果」によって、逆に、金メッキ層が局部的に厚くなってしまう現象さえ生じていた(図3において、破線で示されるグラフ参照)。   However, the length region where the gold plating is applied in the tab portion extends over a predetermined length range from the tip of the tab portion to the rear, and the thickness of the plating layer is durability such as sliding wear resistance and heat resistance. It was only managed to ensure the minimum required dimensions in consideration of the above factors. Originally, the gold plating layer was formed with a thickness more than necessary even in areas that were not directly involved in contact with the female terminal fittings. . Furthermore, at the tip of the tab (which is tapered to guide the connection with the female terminal fitting), the so-called “edge effect”, on the contrary, causes the gold plating layer to become thick locally. This occurred (see the graph indicated by the broken line in FIG. 3).

このことから、タブ部が雌端子金具との接触に関与する領域(接触領域)より前部側領域に着目し、ここの部分における金メッキ層の膜厚を低下させれば、良好な電気導通状況を保持したまま金メッキの使用量を減少させることが可能となる。   For this reason, if the tab portion is focused on the front side region rather than the region involved in contact with the female terminal fitting (contact region), and the thickness of the gold plating layer in this portion is reduced, a good electrical conduction state It is possible to reduce the amount of gold plating while maintaining the value.

本発明は、上記した考えのもとに案出されたものであって、金メッキを効果的に使用した雄端子金具を提供することを目的とする。   The present invention has been devised based on the above-described idea, and an object thereof is to provide a male terminal fitting that effectively uses gold plating.

上記の目的を達成するための手段として、請求項1の発明は、一端側にタブ部が形成され、このタブ部において先端から離れて位置する所定長さ領域が、雌端子金具との接触領域とされた雄端子金具であって、前記接触領域の表面には第1の金メッキ層が形成されるとともに、前記タブ部のうち前記接触領域より前側領域は、前記接触領域の金メッキ層よりも薄い第2の金メッキ層が形成されるか、あるいはこの第2の金メッキ層が形成されることなく下地が露出されるところに特徴を有する。   As a means for achieving the above object, the invention of claim 1 is characterized in that a tab portion is formed on one end side, and a predetermined length region located away from the tip of the tab portion is a contact region with the female terminal fitting. A first gold-plated layer is formed on the surface of the contact area, and a region of the tab portion in front of the contact area is thinner than the gold-plated layer of the contact area. The second gold plating layer is formed or the base is exposed without forming the second gold plating layer.

請求項2の発明は、請求項1に記載のものにおいて、前記タブ部は断面略方形状に形成されるとともに、前記接触領域は、前記雌端子金具において対向して配された接点部によって挟持され、かつ前記第1の金メッキ層は、少なくとも前記タブ部のうち前記接点部によって挟持される側の2面に形成されているところに特徴を有する。   According to a second aspect of the present invention, in the first aspect, the tab portion is formed in a substantially rectangular cross section, and the contact region is sandwiched between contact portions arranged opposite to each other in the female terminal fitting. The first gold plating layer is characterized in that it is formed on at least two surfaces of the tab portion that are sandwiched by the contact portion.

請求項3の発明は、請求項1または請求項2に記載のものにおいて、前記タブ部の先端には、先細り状をなして前記雌端子金具との接続を誘導する誘導部が形成され、前記第2の金メッキ層は前記第1の金メッキ層の前端から前記誘導部の先端に至るまでの全長さ領域に亘って形成されているところに特徴を有する。   According to a third aspect of the present invention, in the first or second aspect of the present invention, a leading portion of the tab portion is formed with a guiding portion that guides the connection with the female terminal fitting in a tapered shape. The second gold plating layer is characterized in that it is formed over the entire length region from the front end of the first gold plating layer to the tip of the guide portion.

請求項4の発明は、請求項1又は請求項2に記載のものにおいて、前記タブ部の先端には、先細り状をなして雌端子金具との接続を誘導する誘導部が形成され、前記第2の金メッキ層は前記第1の金メッキ層の前端から前記誘導部の後端に至るまでの領域のうち、少なくとも前記第1のメッキ層寄りの長さ領域を含んで形成され、この第2の金メッキ層の前端から前記誘導部にかけての長さ領域は前記下地が露出されているところに特徴を有する。   According to a fourth aspect of the present invention, in the first or second aspect of the present invention, a guide portion is formed at the tip of the tab portion to guide the connection with the female terminal fitting in a tapered shape. The second gold plating layer is formed so as to include at least a length region near the first plating layer in a region from the front end of the first gold plating layer to the rear end of the guide portion. A length region from the front end of the gold plating layer to the guiding portion is characterized in that the base is exposed.

請求項5の発明は、請求項1又は請求項2に記載のものにおいて、前記タブ部の先端には、先細り状をなして前記雌端子金具との接続を誘導する誘導部が形成され、前記第1の金メッキ層は前記接触領域を含みつつ前記誘導部の後端に至るまでの全長さ領域に亘って形成され、前記誘導部は前記下地が露出されているところに特徴を有する。   According to a fifth aspect of the present invention, in the one according to the first or second aspect, a guide portion is formed at a tip of the tab portion so as to guide the connection with the female terminal fitting in a tapered shape. The first gold plating layer is formed over a full length region including the contact region and reaching the rear end of the guide portion, and the guide portion is characterized in that the base is exposed.

請求項1の発明によれば、タブ部のうち雌端子金具との接触領域には第1の金メッキ層を形成し、それより先端部側には第1の金メッキ層より膜厚の薄い第2の金メッキ層を形成するか、あるいは全く形成することなく下地を露出させるようにしたから、金の使用量を従来より低減させることができ、もって雄端子金具の製造コストを低下させることができる。   According to the first aspect of the present invention, the first gold plating layer is formed in the contact area of the tab portion with the female terminal fitting, and the second portion having a thickness smaller than that of the first gold plating layer is formed on the tip end side. Since the base is exposed without forming the gold plating layer or not at all, the amount of gold used can be reduced as compared with the conventional case, and the manufacturing cost of the male terminal fitting can be reduced.

請求項2の発明によれば、第1の金メッキ層を形成するにしても、雌端子金具との接触に関与する二面のみに限定することも可能であり、そのようにすれば金の使用量の一層の低減になる。   According to the invention of claim 2, even if the first gold plating layer is formed, it can be limited to only two surfaces involved in contact with the female terminal fitting. The amount is further reduced.

請求項3乃至請求項5の発明によれば、誘導部の後端から接触領域に至るまでの間にも金メッキ層を形成して下地を覆うようにしたため、例えば雌雄端子の接続に伴って下地が削れその微粒子が雌雄の両接点間に進入する事態を未然に回避することができる。   According to the third to fifth aspects of the present invention, since the gold plating layer is formed also from the rear end of the guide portion to the contact area so as to cover the base, for example, the base is connected with the connection of the male and female terminals. It is possible to avoid a situation in which the particles are scraped and the fine particles enter between the male and female contacts.

雌雄端子金具の接続状態の要部を示す断面図Sectional drawing which shows the principal part of the connection state of a male and female terminal metal fitting 実施形態1に係る雄端子金具のタブ部の説明図Explanatory drawing of the tab part of the male terminal metal fitting which concerns on Embodiment 1. FIG. 同じく金メッキ層の膜厚とタブ部における位置関係を示すグラフSimilarly, a graph showing the positional relationship between the thickness of the gold plating layer and the tab 実施形態2にかかる雄端子金具のタブ部の説明図Explanatory drawing of the tab part of the male terminal metal fitting concerning Embodiment 2. 実施形態3に係る雄端子金具のタブ部の説明図Explanatory drawing of the tab part of the male terminal metal fitting which concerns on Embodiment 3. 実施形態4に係る雄端子金具のタブ部の説明図Explanatory drawing of the tab part of the male terminal metal fitting which concerns on Embodiment 4. 実施形態5に係る雄端子金具のタブ部の説明図Explanatory drawing of the tab part of the male terminal metal fitting which concerns on Embodiment 5.

<実施形態1>
以下、本発明を具体化した実施形態を図1乃至図3を参照して説明する。図1は雌雄コネクタのハウジング同士(雄側のハウジングは図示されていない)が嵌合し、雌雄端子金具F,M同士が正規に接続された状態を示している。雌ハウジング1には、雌端子金具Fを収容するキャビティ2が複数室形成され、それぞれの内部には雌端子金具Fを抜け止めするランス3が形成されている。
<Embodiment 1>
DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments embodying the present invention will be described below with reference to FIGS. FIG. 1 shows a state in which the male and female connector housings (the male housing is not shown) are fitted and the male and female terminal fittings F and M are properly connected. A plurality of cavities 2 for accommodating the female terminal fittings F are formed in the female housing 1, and a lance 3 for preventing the female terminal fittings F from being detached is formed in each of the cavities 2.

雌端子金具Fは前端部に角筒状をなす箱部4が形成されている。箱部4においてランス3と対向する側の面は二重壁構造となっていて、外側の壁面の前端寄りには係止突部5が形成されて、ランス3の先端に係止可能である。内側の壁面は内方へ台状に叩き出され、台状接点部6が形成されている。この台状接点部6は、タブ部11より幅広に形成されかつ雄端子金具Mの挿入方向に沿った水平面7を有し、その前後は共に緩やかな傾斜面8a,8bをもって周囲に連続している。 一方、箱部4の内側において、台状接点部6と高さ方向に対向する面は箱部4の前端縁から内側へ折返され、後方へ片持ち状に延びる弾性舌片9となっている。この弾性舌片9は台状接点部6に対し離間する方向への撓みが可能であるとともに、長さ方向の途中位置でかつ幅方向のほぼ中央位置には半球状接点部10が形成されている。この半球状接点部10は外方へ半球形状に叩き出されることによって形成され、その頂点は台状接点部6における前後方向に関してほぼ中央に配置されている。そして、雌雄の端子金具F,Mが正規深さで嵌合すると、雄端子金具Mのタブ部11は台状接点部6の水平面7と半球状接点部10との間で弾性舌片9のばね力をもって挟持される。より具体的には、半球状接点部10はタブ部11の対向面に対し頂点部によってほぼ点当たり状態で接触し、台状接点部6はタブ部11の対向面に対し水平面7の全長さ範囲に亘ってほぼ面当たり状態で接触する。   The female terminal fitting F is formed with a box portion 4 having a rectangular tube shape at the front end. The surface of the box portion 4 facing the lance 3 has a double wall structure, and a locking projection 5 is formed near the front end of the outer wall surface so that it can be locked to the tip of the lance 3. . The inner wall surface is knocked out inwardly to form a trapezoidal contact portion 6. The trapezoidal contact portion 6 has a horizontal plane 7 that is formed wider than the tab portion 11 and extends in the insertion direction of the male terminal fitting M, and the front and rear thereof are continuous with the surrounding surfaces with gentle inclined surfaces 8a and 8b. Yes. On the other hand, on the inner side of the box part 4, the surface facing the base contact part 6 in the height direction is turned inward from the front end edge of the box part 4 to form an elastic tongue piece 9 extending in a cantilevered manner rearward. . The elastic tongue piece 9 can be bent in a direction away from the base contact portion 6, and a hemispherical contact portion 10 is formed at an intermediate position in the length direction and at a substantially central position in the width direction. Yes. The hemispherical contact portion 10 is formed by being knocked outward in a hemispherical shape, and the apex thereof is arranged substantially in the center in the front-rear direction of the trapezoidal contact portion 6. When the male and female terminal fittings F and M are fitted at a normal depth, the tab portion 11 of the male terminal fitting M is formed between the horizontal surface 7 of the base contact portion 6 and the hemispherical contact portion 10 between the elastic tongue piece 9. It is clamped with spring force. More specifically, the hemispherical contact portion 10 is in contact with the opposing surface of the tab portion 11 in a substantially pointed state by the apex portion, and the trapezoidal contact portion 6 is the total length of the horizontal plane 7 with respect to the opposing surface of the tab portion 11. The contact is almost in the surface contact state over the range.

なお、弾性舌片9のうち半球状接点部10を含んだ所定領域、及び台状接点部6を含む周辺の所定領域は、それぞれ所定膜厚(例えば0.4μm)をもった金メッキが施されている。ここで、金メッキとしては例えばCo,Ni等が微量添加された合金メッキが好適であるが、純金メッキも排除されない。   The predetermined region including the hemispherical contact portion 10 and the peripheral predetermined region including the trapezoidal contact portion 6 in the elastic tongue piece 9 are each subjected to gold plating having a predetermined film thickness (for example, 0.4 μm). ing. Here, as the gold plating, for example, alloy plating to which a small amount of Co, Ni or the like is added is suitable, but pure gold plating is not excluded.

雄端子金具Mは一端側にタブ部11が形成され、他端側には、図示しないが、プリント基板側に接続されるプレスフィット部が形成されている(プレスフィットに代えて半田付けによりプリント基板上の回路へ接続する仕様、あるいはプリント基板上の回路への接続に代えて電線に接続する仕様であってもよく、他端側の形式は問わない)。この実施形態では、タブ部11は断面が略方形状に形成されている。タブ部11の先端には雌端子金具Fの箱部4への挿入ガイドのための誘導部12が形成されている。この誘導部12は厚み方向及び幅方向に関して共に先細りとなるように形成されている。   The male terminal fitting M has a tab portion 11 formed on one end side, and a press-fit portion connected to the printed circuit board side (not shown) is formed on the other end side (printed by soldering instead of press-fit). The specification for connecting to the circuit on the board or the specification for connecting to the electric wire instead of connecting to the circuit on the printed board may be used. In this embodiment, the tab portion 11 has a substantially square cross section. A guiding portion 12 for guiding insertion of the female terminal fitting F into the box portion 4 is formed at the tip of the tab portion 11. The guiding portion 12 is formed so as to be tapered in both the thickness direction and the width direction.

ところで、雄端子金具Mは雌端子金具F同様、例えば銅合金を母材として形成されており、母材の表面には全領域に亘ってNiメッキによる下地層がほぼ均一な膜厚をもって形成されている。タブ部11に関しては、以下に説明するように、所定範囲に亘って金メッキが施されている。金メッキの処理の方式は、公知の吹き付け方式等が好適である。   By the way, the male terminal fitting M, like the female terminal fitting F, is formed using, for example, a copper alloy as a base material, and a base layer made of Ni plating is formed on the surface of the base material over the entire area with a substantially uniform film thickness. ing. As described below, the tab portion 11 is plated with gold over a predetermined range. A well-known spraying method or the like is suitable for the gold plating process.

タブ部11は前述したように、台状接点部6の水平面7の全長さ範囲に亘ってほぼ面当たりする。本実施形態では、タブ部11において台状接点部6と接触する側には、所定の膜厚(例えば0.4μm)をもった第1の金メッキ層13がNiメッキ層の表面に積層されている。この第1の金メッキ層13が施された前後範囲は、台状接点部6の水平面7と接する水平面7の前後長さ範囲(図1、図3に示すA寸法の範囲)の前後に、キャビティ内への雄端子金具の挿入深さの前後ばらつき分(共にD寸法)を付加した範囲(以下、この範囲を接触領域Lと言う。この接触領域Lの前後寸法は「有効接触代」とも言われる。接触領域Lの長さ寸法Lは、L=A+2D)に設定されている。第1の金メッキ層13は台状接点部6と対向する側の面のみならず、半球状接点部10と接する側の面にも同一範囲に亘って形成されている。
なお、タブ部11のうち接触領域Lに対応する部分の幅方向両側面(台状接点部6と半球状接点部10とで挟持される面と直交する位置にある両側面)には、正規状態での金メッキ処理は施されていない。つまり、Ni下地層を露出させてもよいし、上記した二面へ第1の金メッキ層13を吹き付ける際に生じる側面への周り込みが許容された程度に施されても構わない。
As described above, the tab portion 11 substantially touches the entire length range of the horizontal surface 7 of the base contact portion 6. In the present embodiment, a first gold plating layer 13 having a predetermined film thickness (for example, 0.4 μm) is laminated on the surface of the Ni plating layer on the side of the tab portion 11 that contacts the trapezoidal contact portion 6. Yes. The front-rear range where the first gold plating layer 13 is applied is a cavity around the front-rear length range of the horizontal plane 7 in contact with the horizontal plane 7 of the table-like contact portion 6 (range of dimension A shown in FIGS. 1 and 3). A range to which variation in the insertion depth of the male terminal fitting in the front and rear (both D dimension) is added (hereinafter this range is referred to as a contact area L. The front and rear dimensions of the contact area L are also referred to as “effective contact allowance”. The length L of the contact region L is set to L = A + 2D). The first gold plating layer 13 is formed not only on the surface facing the trapezoidal contact portion 6 but also on the surface contacting the hemispherical contact portion 10 over the same range.
In addition, the width direction both side surfaces of the portion corresponding to the contact region L in the tab portion 11 (both side surfaces at positions orthogonal to the surface sandwiched between the trapezoidal contact portion 6 and the hemispherical contact portion 10) The gold plating process in the state is not performed. That is, the Ni base layer may be exposed, or may be applied to such an extent that the wraparound to the side surface that occurs when the first gold plating layer 13 is sprayed onto the two surfaces described above is allowed.

また、タブ部11において上記した接触領域Lの前端位置から誘導部12の先端に至るまでの範囲には、第1の金メッキ層13の膜厚に比べて薄い膜厚をもって第2の金メッキ層14が形成されている(図1及び図2で点描されている領域)。図3に示すように、第2の金メッキ層14は第1の金メッキ層13との境界から誘導部12の先端にかけて徐々に膜厚が薄くなるようにしてある(本実施形態では、最も膜厚の薄い部位で0.2μm程度としてある。)。このような膜厚が変化するメッキ層の形成は、例えばメッキ処理の際に、第2の金メッキ層14の形成領域に対するマスク(図示しない)とタブ部11との間隔を適宜調整することによって可能である。   Further, in the tab portion 11, the second gold plating layer 14 having a thickness smaller than the thickness of the first gold plating layer 13 in the range from the front end position of the contact region L to the tip of the guide portion 12. Are formed (regions illustrated in FIGS. 1 and 2). As shown in FIG. 3, the thickness of the second gold plating layer 14 is gradually reduced from the boundary with the first gold plating layer 13 to the tip of the guiding portion 12 (in this embodiment, the film thickness is the largest). The thickness is about 0.2 μm at the thin part.) Formation of such a plating layer with a varying film thickness is possible by, for example, appropriately adjusting the distance between the mask (not shown) and the tab portion 11 with respect to the formation region of the second gold plating layer 14 during the plating process. It is.

さらに、この実施形態1では、タブ部11の接触領域Lより後側(挿入方向後側)にも第1の金メッキ層13より薄い膜厚をもった第3の金メッキ層15を形成するようにしている。図3に示すように、第3の金メッキ層15が形成される前後範囲は、第1、第2の金メッキ層13,14の前後範囲よりも短く、かつ後方へ行くにつれ徐々に膜厚が低下するようにしてある。   Further, in the first embodiment, the third gold plating layer 15 having a thickness smaller than that of the first gold plating layer 13 is also formed on the rear side (rear side in the insertion direction) of the contact area L of the tab portion 11. ing. As shown in FIG. 3, the range before and after the third gold plating layer 15 is formed is shorter than the range before and after the first and second gold plating layers 13 and 14, and the film thickness gradually decreases as going backward. I have to do it.

実施形態1は上記のように構成されたものである。実施形態1では、タブ部11が雌端子金具Fとの電気的導通を確保すべき領域(接触領域L)についてだけは、従来と同様の膜厚をもった第1の金メッキ層13を形成して耐久性を保持するようにしている。しかし、この接触領域Lより前部は、雌端子金具Fとの導通に直接関与する領域でないことから、膜厚を徐々に低下させた第2の金メッキ層14を形成するようにした。このことによって、金の使用量を低減して雄端子金具の製造コストを低減させることができる。また、電気的導通に直接は関与しない領域にも敢えて第2の金メッキ層14を形成することで、Niメッキによる下地層を覆うようにしたため、雌雄端子金具の接続時にNi粉が端子間に噛み込んで導通性を損ねる事態を未然に防ぐこともできる。   The first embodiment is configured as described above. In the first embodiment, only the region (contact region L) where the tab portion 11 should ensure electrical continuity with the female terminal fitting F is formed with the first gold plating layer 13 having the same film thickness as the conventional one. To maintain durability. However, since the front part from the contact region L is not a region directly involved in conduction with the female terminal fitting F, the second gold plating layer 14 having a gradually reduced film thickness is formed. As a result, the amount of gold used can be reduced and the manufacturing cost of the male terminal fitting can be reduced. In addition, the second gold plating layer 14 is intentionally formed in a region that is not directly involved in electrical continuity so as to cover the base layer formed by Ni plating, so that Ni powder bites between the terminals when the male and female terminal fittings are connected. It is possible to prevent a situation in which the electrical conductivity is impaired.

<実施形態2>
図4は本発明の実施形態2を示している。実施形態1と異なる点は、実施形態1では第2の金メッキ層14を第1の金メッキ層13から誘導部12の先端に至るまでの全範囲に亘って形成したが、本実施形態では誘導部12は第2の金メッキ層14を形成せず、Niメッキの下地層を露出させるようにした点である。
<Embodiment 2>
FIG. 4 shows Embodiment 2 of the present invention. The difference from the first embodiment is that in the first embodiment, the second gold plating layer 14 is formed over the entire range from the first gold plating layer 13 to the tip of the guiding portion 12, but in this embodiment, the guiding portion is formed. Reference numeral 12 denotes a point in which the second gold plating layer 14 is not formed and the Ni plating base layer is exposed.

誘導部12は、雌雄の端子金具が傾斜姿勢をとることなく軸芯に沿った姿勢で正規に嵌合する場合には、雌端子金具と接することはないことから、同部についての金メッキを施さないこととしたものである。   When the male and female terminal fittings are normally fitted in a posture along the axis without taking an inclined posture, the guiding portion 12 is not in contact with the female terminal fitting, and therefore the same portion is subjected to gold plating. It is not to be.

このように構成すれば、誘導部12に金メッキがされない分、実施形態1に比較して金の使用量を低減させることができる。
他の構成は実施形態1と同様である。
If comprised in this way, since gold | metal plating is not carried out to the guidance | induction part 12, the usage-amount of gold | metal | money can be reduced compared with Embodiment 1. FIG.
Other configurations are the same as those of the first embodiment.

<実施形態3>
図5は本発明の実施形態3を示している。実施形態2と異なる点は、第2の金メッキ層14が施されない領域を誘導部12に留まらず、この後端から第1の金メッキ層13の前端に至るまでの途中の位置(ほぼ前半部16)にまで拡張したものである。
<Embodiment 3>
FIG. 5 shows Embodiment 3 of the present invention. The difference from the second embodiment is that the region where the second gold plating layer 14 is not applied is not limited to the guiding portion 12, but a midway position from this rear end to the front end of the first gold plating layer 13 (almost the first half portion 16. ).

このような構成によれば、実施形態2よりもさらに金の使用量を低減することができる。他の構成は実施形態2と同様である。   According to such a configuration, the amount of gold used can be further reduced as compared with the second embodiment. Other configurations are the same as those of the second embodiment.

<実施形態4>
図6は本発明の実施形態4を示している。この実施形態は、タブ部11において金メッキ層が形成される範囲を接触領域L、つまり第1の金メッキ層13のみに限定し、これより前方は全てNiメッキによる下地層を露出させることとしたものである。また、図示では接触領域Lの後方に、第3の金メッキ層15も形成されていない形態が示されている。他の構成は、実施形態3と同様である。
<Embodiment 4>
FIG. 6 shows Embodiment 4 of the present invention. In this embodiment, the range in which the gold plating layer is formed in the tab portion 11 is limited to the contact region L, that is, the first gold plating layer 13 only, and the base layer made of Ni plating is exposed in front of this area. It is. Further, in the drawing, a form in which the third gold plating layer 15 is not formed behind the contact region L is shown. Other configurations are the same as those of the third embodiment.

実施形態4の構成によれば、実施形態3に比べてもさらに一層の金使用量を低下させることができる。   According to the configuration of the fourth embodiment, it is possible to further reduce the amount of gold used as compared with the third embodiment.

<実施形態5>
図7は本発明の実施形態5を示している。この実施形態は、第1の金メッキ層13を、接触領域Lの前端からさらに誘導部12の前端に至るまでの領域に拡張したものであり、誘導部12全体でNi下地層を露出させている。したがって、この実施形態のものも第2の金メッキ層14及び第3の金メッキ層15を具備しない。
<Embodiment 5>
FIG. 7 shows Embodiment 5 of the present invention. In this embodiment, the first gold plating layer 13 is expanded to a region extending from the front end of the contact region L to the front end of the guide portion 12, and the Ni underlayer is exposed in the entire guide portion 12. . Therefore, this embodiment also does not include the second gold plating layer 14 and the third gold plating layer 15.

実施形態5によっても、誘導部12のみは金メッキ層が形成されないのであるから、従来に比較すれば金の使用量を低減させることができる。   Also according to the fifth embodiment, since only the guiding portion 12 is not formed with the gold plating layer, the amount of gold used can be reduced as compared with the conventional case.

<他の実施形態>
本発明は上記記述及び図面によって説明した実施形態に限定されるものではなく、例えば次のような実施態様も本発明の技術的範囲に含まれる。
(1)上記実施形態1では、接触領域Lにおいて雌側の両接点部6,10で挟持されない側の2面には正規状態では第1の金メッキ層13を形成しない形式を示したが、正規状態で形成することを禁じるものではない。
(2)実施形態1では、第2の金メッキ層14の膜厚を誘導部12の先端に至るまで一定の割合で連続的に薄くするようにしたが、多段階に離散的に薄くするようにしてもよい。
(3)実施形態1乃至実施形態3では、接触領域Lの後方に第3の金メッキ層15を形成したが、省略してもよい。
(4)実施形態1では、タブ部11を雌端子金具Fの台状接点部6と半球状接点部10とで挟持するようにしたが、これら雌端子金具F側の接点部の形状は決して限定されるべき性質のものではなく、その場合に双方の接点部が共にばね性を有するものであってもよい。
(5)いずれの実施形態においても、母材の表面にNiメッキの下地層を形成したが、他のメッキ層であってもよく、またメッキ層を形成することなく、母材自体を下地とすることもあり得る。
<Other embodiments>
The present invention is not limited to the embodiments described with reference to the above description and drawings. For example, the following embodiments are also included in the technical scope of the present invention.
(1) In the first embodiment, the first gold plating layer 13 is not formed in the normal state on the two surfaces of the contact region L that are not sandwiched between the female contact portions 6 and 10. It is not forbidden to form in the state.
(2) In the first embodiment, the thickness of the second gold plating layer 14 is continuously thinned at a constant rate until reaching the tip of the guiding portion 12, but it is thinned discretely in multiple stages. May be.
(3) In the first to third embodiments, the third gold plating layer 15 is formed behind the contact region L, but may be omitted.
(4) In the first embodiment, the tab portion 11 is sandwiched between the base contact portion 6 and the hemispherical contact portion 10 of the female terminal fitting F. However, the shape of the contact portion on the female terminal fitting F side is never It is not the thing which should be limited, In that case, both contact parts may have a spring property.
(5) In any of the embodiments, the Ni plating base layer is formed on the surface of the base material. However, other plating layers may be used, and the base material itself may be used as the base without forming the plating layer. It is possible to do.

11…タブ部
12…誘導部
13…第1の金メッキ層
14…第2の金メッキ層
F…雌端子金具
M…雄端子金具
DESCRIPTION OF SYMBOLS 11 ... Tab part 12 ... Guidance part 13 ... 1st gold plating layer 14 ... 2nd gold plating layer F ... Female terminal metal fitting M ... Male terminal metal fitting

Claims (5)

一端側にタブ部が形成され、このタブ部において先端から離れて位置する所定長さ領域が、雌端子金具との接触領域とされた雄端子金具であって、
前記接触領域の表面には第1の金メッキ層が形成されるとともに、前記タブ部のうち前記接触領域より前側領域は、前記第1の金メッキ層よりも薄い第2の金メッキ層が形成されるか、あるいはこの第2の金メッキ層が形成されることなく下地が露出されることを特徴とする雄端子金具。
A tab portion is formed on one end side, and a predetermined length region located away from the tip in the tab portion is a male terminal fitting that is a contact region with the female terminal fitting,
Is a first gold plating layer formed on the surface of the contact area, and whether a second gold plating layer thinner than the first gold plating layer is formed in the front part of the tab portion from the contact area? Alternatively, the male terminal fitting is characterized in that the base is exposed without forming the second gold plating layer.
前記タブ部は断面略方形状に形成されるとともに、
前記接触領域は、前記雌端子金具において対向して配された接点部によって挟持され、かつ前記第1の金メッキ層は、少なくとも前記タブ部のうち前記接点部によって挟持される側の2面に形成されていることを特徴とする請求項1に記載の雄端子金具。
The tab portion is formed in a substantially rectangular cross section,
The contact area is sandwiched between contact portions disposed opposite to each other in the female terminal metal fitting, and the first gold plating layer is formed on at least two surfaces of the tab portion on the side sandwiched by the contact portion. The male terminal fitting according to claim 1, wherein the male terminal fitting is formed.
前記タブ部の先端には、先細り状をなして前記雌端子金具との接続を誘導する誘導部が形成され、前記第2の金メッキ層は前記第1の金メッキ層の前端から前記誘導部の先端に至るまでの全長さ領域に亘って形成されていることを特徴とする請求項1又は請求項2に記載の雄端子金具。 A leading portion of the tab portion is tapered to guide the connection with the female terminal fitting, and the second gold plating layer extends from the front end of the first gold plating layer to the leading end of the guiding portion. The male terminal fitting according to claim 1, wherein the male terminal fitting is formed over a full length region up to. 前記タブ部の先端には、先細り状をなして雌端子金具との接続を誘導する誘導部が形成され、前記第2の金メッキ層は前記第1の金メッキ層の前端から前記誘導部の後端に至るまでの領域のうち、少なくとも前記第1のメッキ層寄りの長さ領域を含んで形成され、この第2の金メッキ層の前端から前記誘導部にかけての長さ領域は前記下地が露出されていることを特徴とする請求項1又は請求項2記載の雄端子金具。 A leading portion of the tab portion is tapered to guide connection with the female terminal fitting, and the second gold plating layer extends from the front end of the first gold plating layer to the rear end of the guiding portion. Is formed including at least the length region closer to the first plating layer, and the length region from the front end of the second gold plating layer to the guide portion is exposed to the base. The male terminal fitting according to claim 1, wherein the male terminal fitting is provided. 前記タブ部の先端には、先細り状をなして前記雌端子金具との接続を誘導する誘導部が形成され、前記第1の金メッキ層は前記接触領域を含みつつ前記誘導部の後端に至るまでの全長さ領域に亘って形成され、前記誘導部は前記下地が露出されていることを特徴とする請求項1又は請求項2に記載の雄端子金具。 A leading portion of the tab portion is tapered to guide the connection with the female terminal fitting, and the first gold plating layer reaches the rear end of the guiding portion while including the contact area. 3. The male terminal fitting according to claim 1, wherein the base portion is exposed in the guiding portion.
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