JP2010219948A - Display panel and method of manufacturing same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a display module and a method of manufacturing the same wherein a display section of the display module can be made into large screen by reducing a mount area for the display module and a camera module inside a housing. <P>SOLUTION: In a camera module, a lens 131 is mounted onto a front face of a frame portion 112a of a liquid crystal module. Furthermore, a sensor chip 121 is flip-chip mounted on an FPC 170 so as to cover an opening 124 provided in the FPC 170. The FPC 170 is pasted onto a rear face of the frame portion 112a by a double-coated tape 127 so that the center of the sensor chip 121 is matched with an optical axis of the lens 131. Therefore, light from a subject is converged by the lens 131 and transmitted through the frame portion 112a and the opening 124 of the FPC 170 to form a subject image on a light-receiving plane of the sensor chip 121. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a display panel and a manufacturing method thereof, and more particularly to a display panel with a camera module for an in-camera and a manufacturing method thereof.

  In recent years, mobile phones having a videophone function are becoming popular. In videophones, in addition to two-way audio communication, images taken with the camera provided on the caller's mobile phone are displayed on the display screen of the caller's mobile phone and provided on the caller's mobile phone. An image captured by the selected camera is displayed on the display surface of the caller's mobile phone. For this reason, a mobile phone having a videophone function includes a camera (hereinafter referred to as “in-camera”) that photographs a caller by disposing a lens on a display surface side of a display unit that displays a call partner.

  Such a mobile phone needs to store a liquid crystal module including a display unit and a camera module constituting a camera for an in-camera in a casing. Patent Document 1 discloses a configuration of a mobile phone in which a liquid crystal module including a display unit and a camera module for an in-camera are separately stored in a housing.

JP 2005-101838 A

  In a mobile phone having a videophone function, it is desired that the display unit has a large screen in order to make it easier to see the other party during a videophone call. At the same time, there is a strong demand for miniaturization in order to improve portability.

  However, the mobile phone described in Patent Document 1 stores a liquid crystal module and a camera module separately in a casing. For this reason, there is a problem that it is difficult to secure a mounting area for mounting the camera module in a limited-size housing and to further enlarge the display portion of the liquid crystal module.

  Accordingly, an object of the present invention is to provide a display panel that can reduce the mounting area of the display module and the camera module in the housing and increase the display section of the display module, and a method for manufacturing the display panel.

According to a first aspect of the present invention, a display module for displaying an image and a display module having a frame portion on which a wiring pattern is formed are formed on a transparent insulating substrate, and a subject on the display surface side of the display unit is photographed. A display panel with a camera module capable of
A lens attached to the first main surface on which the wiring pattern of the frame portion is formed;
A photoelectric conversion element that photoelectrically converts light from the subject incident on the light receiving surface and outputs an image signal; and
An opening that allows light from the subject to pass therethrough, and a flexible circuit board that is electrically connected to an end of the wiring pattern formed on the first main surface of the frame portion;
The flexible circuit board is bent to a second main surface side facing the first main surface of the frame portion at an end portion of the frame portion and fixed to the second main surface;
The photoelectric conversion element is flip-chip mounted on the flexible circuit board so as to cover the opening with the light receiving surface facing the opening.
The lens is mounted on the first main surface of the frame portion so as to face the light receiving surface through the insulating substrate.

According to a second aspect of the present invention, a display module for displaying an image and a display module having a frame portion on which a wiring pattern is formed are formed on a transparent insulating substrate, and a subject on the display surface side of the display unit is photographed. A display panel with a camera module capable of
A lens attached to the first main surface on which the wiring pattern of the frame portion is formed;
A photoelectric conversion element that photoelectrically converts light from the subject incident on the light receiving surface and outputs an image signal; and
A first flexible circuit board electrically connected to an end of the wiring pattern formed on the first main surface of the frame portion;
An opening for allowing light from the subject to pass through, and a second flexible circuit board fixed to the second main surface of the frame portion,
The photoelectric conversion element is flip-chip mounted on the second flexible circuit board so as to cover the opening with the light receiving surface facing the opening.
The lens is mounted on the first main surface of the frame portion so as to face the light receiving surface through the insulating substrate.

According to a third invention, in the first or second invention,
An optical filter that restricts light incident on the photoelectric conversion element;
The opening formed in the flexible circuit board or the second flexible circuit board is sealed by covering from both sides with the light receiving surface of the photoelectric conversion element and the optical filter. To do.

According to a fourth invention, in the third invention,
The photoelectric conversion element is bonded to the flexible circuit board or the second flexible circuit board by a paste-like conductive adhesive continuously applied so as to surround the opening. It is characterized by.

According to a fifth invention, in the first or second invention,
A capacitor that absorbs an instantaneous change in the power supply voltage supplied to the photoelectric conversion element;
The capacitor is mounted on the flexible circuit board or the second flexible circuit board in the vicinity of the photoelectric conversion element.

A sixth invention is the first or second invention, wherein
A double-sided tape affixed to the second main surface of the frame portion;
The flexible circuit board or the second flexible circuit board is fixed to the second main surface of the frame portion with the double-sided tape.

A seventh invention is the sixth invention, wherein
A light guide plate disposed on the second main surface of the insulating substrate;
A plurality of semiconductor light emitting elements that irradiate light to the side surface of the light guide plate;
The display module is a liquid crystal module;
The double-sided tape is attached to the second main surface of the frame portion along the side surface of the light guide plate,
The plurality of semiconductor light emitting elements are arranged between the double-sided tape and a side surface of the light guide plate, a height of the double-sided tape is substantially the same as a height of the light guide plate, and a height of the semiconductor light emitting element is It is characterized by being lower than the height of the double-sided tape and the light guide plate.

The eighth invention is equipped with the display panel according to the first or second invention,
The camera module is a mobile phone characterized in that the lens is arranged facing the display surface side of the display panel.

A ninth invention is a method of manufacturing a display panel in which a camera module for photographing a subject is mounted on a frame portion of a display module formed on a transparent insulating substrate and having a display unit for displaying an image.
A preparation step of preparing a flexible circuit board in which an opening and a wiring layer are formed;
A paste-like adhesive is applied around the opening, and the photoelectric conversion element placed so as to cover the opening with the light receiving surface for receiving light from the subject facing the opening is flexible. A thermocompression bonding process for thermally bonding to one surface of the circuit board;
A bonding step of bonding an optical filter to the other surface of the flexible circuit board so as to face the light receiving surface and cover the opening;
A connection step of electrically connecting one end of the flexible circuit board to an end portion of a first main surface of a frame portion on which the subject is displayed;
An affixing step of bending the flexible circuit board at an end of the frame portion and attaching the other end to a second main surface facing the first main surface of the frame portion;
Attaching a lens for condensing light from the subject at a position facing the light receiving surface on the first main surface of the frame portion;
The preparation step, the thermocompression bonding step, and the adhesion step are performed in a clean room having a higher cleanliness than any of the connection step, the pasting step, and the attachment step.

  According to the first aspect, in the camera module, the lens is attached to the first main surface of the frame portion of the display module, and the flexible circuit board on which the photoelectric conversion element is flip-chip mounted is attached to the second frame portion. It is fixed to the main surface. For this reason, compared with the case where the display module and the camera module are stored separately in the housing, the mounting area for storing the display panel on which the camera module is mounted can be reduced, and the display portion of the display panel can be reduced. The screen can be enlarged. In addition, if such a display panel is mounted on an electronic device, the electronic device can be reduced in size. Furthermore, since the flip-chip mounted flexible circuit board is fixed to the back surface of the frame portion, there is no need to form wiring on the back surface of the frame portion or form a through electrode on the photoelectric conversion element. For this reason, the manufacturing cost of a display panel can be reduced.

  According to the second invention, as in the first invention, in the camera module, the lens is attached to the first main surface of the frame portion of the display module, and the photoelectric conversion element is flip-chip mounted. The flexible circuit board is fixed to the second main surface of the frame portion. For this reason, the effect of 2nd invention is the same as the effect of 1st invention.

  According to the third aspect, since the display panel is provided with the optical filter on the light receiving surface side of the photoelectric conversion element, it is possible to prevent the deterioration of the image quality of the subject. Further, by covering the opening from both sides with the light receiving surface of the photoelectric conversion element and the optical filter, the opening is sealed, and the photoelectric conversion element is cavity-sealed to the flexible circuit board. For this reason, it is possible to prevent foreign matters that degrade the image quality of the subject from adhering to the vicinity of the light receiving surface.

  According to the fourth aspect, the photoelectric conversion element is bonded to the flexible circuit board or the second flexible circuit board by the paste-like conductive adhesive continuously applied so as to surround the opening. Therefore, the gap between the photoelectric conversion element and the substrate can be completely closed with the conductive adhesive. For this reason, an opening part can be sealed easily. Further, since it is easy to apply a paste-like conductive adhesive around the opening, the photoelectric conversion element can be easily flip-chip mounted on the flexible circuit board.

  According to the fifth aspect, the bypass capacitor can be soldered directly to the flexible circuit board on which the photoelectric conversion element is mounted or the wiring layer of the second flexible circuit board. There is no need to newly provide a flexible circuit board for soldering. For this reason, the manufacturing cost of a display panel can be reduced. In addition, since the bypass capacitor can be disposed in the vicinity of the photoelectric conversion element, it is possible to further easily absorb an instantaneous change in the power supply voltage.

  According to the sixth invention, the flexible circuit board or the second flexible circuit board on which the photoelectric conversion element is mounted is an inexpensive double-sided tape attached to the second main surface of the frame portion. Since it is fixed to the frame portion, the manufacturing cost of the display panel can be reduced.

  According to the seventh aspect, since the height of the double-sided tape and the light guide plate is substantially the same, the flexible circuit board or the second flexible circuit board is attached to the second main surface of the frame portion with the double-sided tape. The end of the flexible circuit board or the second flexible circuit board does not hit the light guide plate and moves so as to slide on the upper surface of the light guide plate. Or stop without reaching. In this case, it is not necessary to consider the alignment margin when the flexible circuit board or the second flexible circuit board is attached to the double-sided tape, so that the frame portion can be narrowed. In addition, since there is no restriction on the stop position of the end portion of the flexible circuit board or the second flexible circuit board, the flexible circuit board or the second flexible circuit board is fixed to the back surface of the frame portion. Workability at times can also be improved.

  According to the eighth aspect, when the display panel according to the first or second aspect is mounted on a mobile phone, the camera module can take a picture of a caller during a videophone call as an in-camera. In addition, by mounting such a display panel, the display portion of the display panel can be enlarged and the mobile phone can be downsized.

  According to the ninth aspect, the photoelectric conversion element is cavity-sealed on the flexible circuit board by performing a series of steps from the preparation step to the bonding step in a clean room with a high degree of cleanliness. Sealing the cavity prevents foreign matter from adhering to the vicinity of the light receiving surface of the photoelectric conversion element, thereby preventing deterioration of the image quality of the subject due to the foreign matter. In addition, since foreign matter does not enter the sealed space after the cavity is sealed, the manufacturing process after the cavity is sealed can be performed in a clean room with a low degree of cleanliness. For this reason, the cost required for maintenance / management of the clean room as a whole manufacturing process can be reduced.

It is sectional drawing which shows the general structure of a liquid crystal module. It is sectional drawing of the frame part of the liquid crystal panel used for the 1st basic examination. It is sectional drawing of the frame part of the liquid crystal panel used for the 2nd basic examination. It is a figure which shows the structure of the liquid crystal panel which concerns on the 1st Embodiment of this invention, More specifically, Fig.4 (a) is a top view of a liquid crystal panel, FIG.4 (b) is FIG.4 (a). It is arrow sectional drawing along the AA of the liquid crystal panel shown. It is detailed sectional drawing of the liquid crystal panel in the said embodiment. It is a figure which shows the structure of the liquid crystal panel before bending FPC based on 2nd Embodiment, and more specifically, Fig.6 (a) is a top view of the liquid crystal panel before bending FPC, FIG.6 (b) ) Is a cross-sectional view taken along the line BB of the liquid crystal panel shown in FIG. It is a figure which shows the structure of the liquid crystal panel after bending FPC based on 2nd Embodiment, and more specifically, Fig.7 (a) is a top view of the liquid crystal panel after bending FPC, FIG. (B) is arrow sectional drawing along CC line of the liquid crystal panel shown to Fig.7 (a). It is process sectional drawing which shows the manufacturing process of the liquid crystal panel in the said embodiment. It is process sectional drawing which shows the manufacturing process of the liquid crystal panel in the said embodiment. It is a figure which shows the structure of the liquid crystal panel which concerns on 3rd Embodiment, and in detail, Fig.10 (a) is a top view seen from the back surface side of the liquid crystal panel, FIG.10 (b) is FIG.10 (a). It is arrow sectional drawing along the DD line | wire of the liquid crystal panel shown to). FIG. 11 is a diagram showing a configuration of a modified example of the liquid crystal panel according to the third embodiment. More specifically, FIG. 11A is a plan view seen from the back side of the liquid crystal panel, and FIG. FIG. 11B is a cross-sectional view taken along line EE of the liquid crystal panel shown in FIG.

<1. Basic study>
In developing a liquid crystal panel according to an embodiment of the present invention, a basic study was conducted to clarify the problems and solutions. For this reason, the liquid crystal panel used for the basic study will be described with reference to the accompanying drawings.

  FIG. 1 is a cross-sectional view showing a general configuration of a liquid crystal module. As shown in FIG. 1, the liquid crystal module includes a TFT substrate 12 on which a plurality of pixel forming portions arranged in a matrix, a plurality of scanning signal lines and data signal lines connected to the pixel forming portion, and a TFT A liquid crystal layer filled in a space sealed by a CF substrate 11 disposed facing the substrate 12 and formed with a color filter and the like, and a sealing material 14 provided between the TFT substrate 12 and the CF substrate 11 16 and the like.

  Since the TFT substrate 12 is larger than the CF substrate 11, the TFT substrate 12 has a portion called a frame portion 12 a that does not face the CF substrate 11. An IC chip (not shown) such as a liquid crystal driver is mounted on the surface of the frame portion 12a on the CF substrate 11 side (hereinafter referred to as “the surface of the frame portion”), and the IC chip is formed on the surface of the frame portion 12a. Connected to the wiring pattern 15. A backlight 13 for irradiating the liquid crystal layer 16 with light through the TFT substrate 12 is provided on the surface of the TFT substrate 12 opposite to the CF substrate 11 (hereinafter referred to as “the back surface of the TFT substrate”). .

  FIG. 2 is a cross-sectional view of the frame portion 12a of the liquid crystal panel 10 used in the first basic study. 2 is an enlarged cross-sectional view of an area 19 surrounded by a dotted line in the liquid crystal module shown in FIG.

  In order to connect the terminal portion of the wiring pattern 15 formed on the surface of the frame portion 12a and the pad electrode of the sensor chip 21, the sensor chip 21 is flipped to the terminal portion of the wiring pattern 15 formed on the surface of the frame portion 12a. Mount the chip. In flip chip mounting, protruding electrodes 22 called bumps are formed on the surface of the sensor chip 21 in a bare chip (chip before packaging) state, and the light receiving surface (circuit surface) of the sensor chip 21 is formed on the frame portion 12a. This is a mounting method in which the protruding electrode 22 and the wiring pattern 15 are electrically connected to the surface using a paste-like conductive adhesive called an ACP (Anisotropic Conductive Paste) 23. On the other hand, on the surface opposite to the surface on which the sensor chip 21 of the frame portion 12a is mounted (hereinafter referred to as “the back surface of the frame portion”), the lens 31 whose optical axis is aligned with the center of the light receiving surface of the sensor chip 21 Is attached.

  In this case, the thickness of the sensor chip 21 on the front surface of the frame portion 12a and the thickness of the lens 31 on the back surface of the frame portion 12a can be set to the same thickness as that of the CF substrate 11 and the backlight 13, respectively. Therefore, the thickness of the liquid crystal panel 10 in which the camera module including the sensor chip 21 and the lens 31 is mounted on the frame portion 12a of the liquid crystal module is approximately the same as the thickness of the liquid crystal module in which the camera module is not mounted. However, when this liquid crystal panel is incorporated in a mobile phone, the lens 31 of the camera module and the light receiving surface of the sensor chip 21 face the back side of the frame portion 12a, in other words, the opposite side of the caller. There is a problem that it is not possible to take a picture of the person who is talking over the phone. An optical filter 25 provided between the light receiving surface of the sensor chip 21 and the lens 31, a bypass capacitor 42, and an FPC (Flexible Printed Circuit: flexible circuit board) 40 on which the bypass capacitor 42 is mounted will be described later. .

  Therefore, in order to use the camera module for the in-camera, if a wiring pattern for connecting the sensor chip 21 is newly formed on the back surface of the frame portion 12a of the liquid crystal module used in the first basic study, the sensor chip 21 can be flip-chip mounted on the back surface of the frame portion 12a, and the lens 31 can be attached to the surface of the frame portion 12a. In this case, the caller can take a picture of himself / herself who is talking by videophone. However, since the wiring pattern is not normally formed on the back surface of the frame portion 12a, a wiring pattern for mounting the sensor chip 21 must be newly formed, which increases the manufacturing cost of the liquid crystal module. .

  FIG. 3 is a cross-sectional view of the frame portion 12a of the liquid crystal panel 20 used in the second basic study. FIG. 3 is an enlarged cross-sectional view of an area 19 surrounded by a dotted line in the liquid crystal module shown in FIG.

  As shown in FIG. 3, in the liquid crystal panel 20 on which the camera module is mounted, the lens 31 is attached on the light receiving surface of the sensor chip 21 and the input / output electrodes 27 of the sensor chip 21 are formed on the back surface of the sensor chip 21. . These input / output electrodes 27 are electrically connected to the terminal portions of the wiring pattern 15 formed on the surface of the frame portion 12a. In this case, the camera module functions as an in-camera camera that can take a picture of a caller during a videophone call.

However, in the liquid crystal panel 20, since the lens 31 is attached on the light receiving surface of the sensor chip 21, the height of the camera module is significantly higher than the height of the CF substrate 11. Accordingly, the thickness of the liquid crystal panel 20 is determined by the height of the camera module, and there is a problem that it is difficult to reduce the thickness of the liquid crystal panel 20 and thus the mobile phone. Further, in order to form the input / output electrode 27 on the back surface of the sensor chip 21, it is necessary to form the through electrode 28 that connects the input / output electrode 27 to the wiring formed on the front surface of the sensor chip 21. However, it is technically difficult to form the through electrode 28 in the sensor chip 21 and there is a problem that the manufacturing cost of the sensor chip 21 is increased. The microlens 26 disposed on the light receiving surface of the sensor chip 21 is formed using an acrylic resin having low heat resistance. For this reason, there is also a problem that it is difficult to electrically connect the sensor chip 21 to the terminal portion of the wiring pattern 15 by a thermocompression bonding method. The optical filter 25 provided between the light receiving surface of the sensor chip 21 and the lens 31, and the FPC 40 on which the bypass capacitor 42 and the bypass capacitor 42 are mounted will be described later.
Hereinafter, a display panel according to an embodiment of the present invention will be described with reference to the accompanying drawings.
<2. First Embodiment>
<2.1 LCD panel configuration>
FIG. 4 is a diagram illustrating the configuration of the liquid crystal panel 100 according to the first embodiment of the present invention. More specifically, FIG. 4A is a plan view of the liquid crystal panel 100, and FIG. It is arrow sectional drawing along the AA of the liquid crystal panel 100 shown to Fig.4 (a).

  As shown in FIG. 4, the liquid crystal panel 100 includes a TFT substrate 112 on which a plurality of pixel forming portions arranged in a matrix, a plurality of scanning signal lines and data signal lines connected to the pixel forming portions, A CF substrate 111 disposed opposite to the TFT substrate 112 and formed with a color filter and the like; a liquid crystal layer 116 filled in a space sealed by a sealing material 114 between the TFT substrate 112 and the CF substrate 111; including. A backlight 113 for irradiating the liquid crystal layer 16 with light via the TFT substrate 112 is provided on the back surface of the TFT substrate 112.

  A plurality of wiring patterns 115 connected to the input terminal and output terminal of the liquid crystal driver 151 are formed on the surface of the frame part 112a provided at the lower part of the TFT substrate 112, such as ITO (Indium Tin Oxide). It is formed of a conductive thin film. Further, the liquid crystal driver 151 formed on the silicon chip is flip-chip mounted on the wiring pattern 115 with its circuit surface facing the surface of the frame portion 112a in a bare chip state. Specifically, the liquid crystal driver 151 uses a bump-like electrode 122 made of gold (Au) called a bump formed on a circuit surface to a film-like conductive adhesive called an ACF (Anisotropic Conductive Film). It is electrically connected to the terminal part provided in the wiring pattern 115 of the frame part 112a through the agent. The liquid crystal driver 151 may be a monolithic liquid crystal driver formed directly on the frame portion 112a using CGS (Continuous Grain silicon).

  One end of the FPC 160 is electrically connected to the wiring pattern 115 formed on the surface of the frame portion 112a and the lower end of the frame portion 112a. One end of the FPC 170 is attached to the back surface of the frame portion 112a by a double-sided tape 127. ing. An electronic component 162 such as a bypass capacitor is mounted on the FPC 160, and a connector 163 for connecting to an external circuit is attached to the other end. The FPC 160 is formed with a plurality of wiring layers (not shown) connected to an external circuit via the connector 163. The wiring layer of the FPC 160 is electrically connected to the wiring pattern 115 formed on the surface side of the frame portion 112a by thermocompression bonding using the ACF 119. For this reason, control signals and data signals given from an external circuit are given to corresponding input terminals of the liquid crystal driver 151 via the wiring layer 115 on the connector 163 and the FPC 160 and the wiring pattern 115 of the frame portion 112a. Note that the wiring layer of the FPC 160 and the wiring pattern 115 may be electrically connected by thermocompression using an NCF (Non Conductive Film) instead of the ACF 119.

  Since the base film constituting the FPC does not transmit light, the FPC 170 is provided with an opening 124 for allowing light from the subject to pass therethrough. A wiring pattern (not shown) including a terminal portion to which an input / output terminal of the sensor chip 121 functioning as a photoelectric conversion element is connected is formed on the surface of the FPC 170 (a surface not facing the frame portion 112a). The sensor chip 121 is a photoelectric conversion element made of a CCD (Charge Coupled Device) or CMOS (Complementary Metal Oxide Semiconductor) sensor formed on a chip made of silicon, and a plurality of protruding electrodes called stud bumps on the surface thereof. 122 is formed. Note that the stud bump is used as the protruding electrode 122 instead of the bump formed by electroplating. The microlens 126 using the acrylic resin having low chemical resistance is already formed on the light receiving surface of the sensor chip 121. Therefore, the plating method cannot be used.

  By directing the light receiving surface of the sensor chip 121 to the surface of the FPC 170 and using the ACP 123, the protruding electrode 122 is electrically connected to a terminal portion (not shown) formed around the opening portion 124 on the FPC 170. The chip 121 is flip-chip mounted on the FPC 170. As a result, the opening 124 is covered with the light receiving surface of the sensor chip 121. On the light receiving surface of the sensor chip 121, a micro lens 126 that efficiently collects light from the subject is formed in each pixel formation portion with acrylic resin. An optical filter 125 is attached to the back surface of the FPC 170 so as to face the light receiving surface of the sensor chip 121 and completely cover the opening 124.

  As a result, the opening 124 on the front surface side of the FPC 170 is completely covered by the light receiving surface of the sensor chip 121 and the ACP 123 that closes the gap between the light receiving surface and the FPC 170, and the opening 124 on the back surface side is covered by the optical filter 125. Since it is completely covered, the space between the sensor chip 121 and the optical filter 125 is completely sealed (hereinafter referred to as “cavity sealing”). By sealing the cavity, not only can the lens effect of the micro lens 126 be maximized, but also degradation of the image quality of the subject due to foreign matter adhering to the vicinity of the light receiving surface as will be described later is prevented. be able to. The optical filter 125 often uses an infrared cut filter (IR cut filter) that cuts infrared rays that enter the sensor chip 121 and generate noise, but other optical elements such as an ND (Neutral Density) filter are used. It may be a filter.

  The FPC 170 on which the sensor chip 121 is flip-chip mounted is fixed by a double-sided tape 127 that is annularly attached to the back surface of the frame portion 112a so that the light receiving surface of the sensor chip 121 faces the back surface of the frame portion 112a. . Further, a lens 131 having an optical axis aligned with the center of the light receiving surface of the sensor chip 121 is attached to the position on the surface of the frame portion 112a facing the light receiving surface of the sensor chip 121 by an adhesive. Therefore, light from the subject is collected by the lens 131, passes through the frame portion 112 a and the opening 124 of the FPC 170, and forms a subject image on the light receiving surface of the sensor chip 121. The sensor chip 121 photoelectrically converts light from the subject and outputs it as an image signal. The output image signal is given to an image processing circuit provided outside the liquid crystal panel 100 through a wiring layer formed on the FPC 170 and a connector 173. The image signal processed by the image processing circuit is given to the liquid crystal driver 151 through the connector 163 of the FPC 160, the wiring layer, and the wiring pattern 115 formed in the frame portion 112a.

  Next, the thickness of the lens 131 and the CF substrate 111 provided on the surface of the frame portion 112a and the thickness of the sensor chip 121 and the backlight 113 provided on the back surface of the frame portion 112a are respectively compared.

  FIG. 5 is a detailed cross-sectional view of the liquid crystal panel 100 in the present embodiment. Unlike the cross-sectional view shown in FIG. 4, all the components that affect the thickness of the liquid crystal panel 100 are described in the cross-sectional view shown in FIG. 5. Therefore, the constituent elements corresponding to those shown in FIG. 4 are given the same reference numerals, and the constituent elements not shown in FIG. 4 will be mainly described. In the following description, for each component, the upper surface shown in FIG. 5 is referred to as the front surface, and the lower surface is referred to as the back surface.

As shown in FIG. 5, polarizing plates 117 and 118 are formed on the front surface of the CF substrate 111 and the back surface of the TFT substrate 112, respectively. In addition, a lens 131 is attached to the surface of the frame portion 112a, and an FPC 160 is attached. An FPC 170 on which a sensor chip 121 is flip-chip mounted is attached to the back surface of the frame portion 112a. The general thickness of each component constituting the liquid crystal panel 100 will be described below. Polarizing plate (surface side) 117... 0.13 mm
CF substrate 111 ... 0.3mm
TFT substrate 112 ... 0.3 mm
Polarizing plate (back side) 118 ... 0.15 mm
Backlight 113… 0.6mm
FPC170 ... 0.1mm
Sensor chip 121 ... 0.15mm
Double-sided tape 127 ... 0.2mm
Lens 131 ... 2mm

  The thickness of the liquid crystal layer 116 is several μm, and the thickness of the wiring pattern 115 formed on the surface of the frame portion 112a is several hundred nm, which is very thin compared to the thickness of other components. Ignore their thickness.

  The thickness from the surface of the TFT substrate 112 to the surface of the polarizing plate 117 is about 0.43 mm, and the thickness from the back surface of the TFT substrate 112 to the surface of the backlight 113 is about 0.75 mm. On the other hand, the thickness from the surface of the TFT substrate 112 to the upper end of the lens 131 is about 2 mm, and the thickness from the back surface of the TFT substrate 112 to the back surface of the sensor chip 121 is about 0.45 mm. As can be seen from the above, since the lens 131 is attached to the surface of the TFT substrate 112, the liquid crystal panel 100 is about 1.57 mm thicker than the conventional one. However, even if the sensor chip 121 is mounted on the back surface of the TFT substrate 112, the thickness from the back surface of the TFT substrate 112 to the back surface of the sensor chip 121 is only 0.30 mm than the thickness of the polarizing plate 118 and the backlight 113 is 0.75 mm. thin. Therefore, in the liquid crystal panel 100 in which the camera module is mounted on the frame portion 112a, the increase in thickness can be suppressed to about 1.57 mm compared to the liquid crystal module in which the camera module is not mounted. As a result, the thickness of the liquid crystal panel 100 is about 3.05 mm, which is about 1.57 mm thicker than the thickness of about 1.48 mm when the camera module is not mounted.

Next, a method for mounting a bypass capacitor that absorbs an instantaneous change in the power supply voltage of the sensor chip will be described. It is more effective to place the bypass capacitor as close to the sensor chip as possible. However, since the wiring pattern 115 formed on the surface of the frame portion 112a is formed of ITO or the like, the terminal of the bypass capacitor cannot be soldered directly to the wiring pattern 115.
Therefore, as shown in FIGS. 2 and 3, when the sensor chip 21 is mounted on the surface of the frame portion 12a, an FPC 40 on which the bypass capacitor 42 is mounted is prepared, and the FPC 40 is mounted on the frame portion 12a on which the sensor chip 21 is mounted. These wiring patterns 15 and ACF were used for electrical connection by thermocompression bonding. Thus, there is a problem that the manufacturing cost of the liquid crystal panel is increased because a process for newly preparing the FPC 40 or connecting the FPC 40 to the wiring pattern 15 on the frame portion 12a becomes necessary.

  However, in the liquid crystal panel 100, since the bypass capacitor 172 can be soldered to the wiring layer of the FPC 170 on which the sensor chip 121 is mounted, it is not necessary to newly provide an FPC for soldering the bypass capacitor 172. For this reason, the manufacturing cost of the liquid crystal panel 100 can be reduced. In addition, since the bypass capacitor 172 can be disposed in the vicinity of the sensor chip 121, the bypass capacitor 172 can more easily absorb an instantaneous change in the power supply voltage.

<2.2 Effect>
As described above, according to the liquid crystal panel 100 of the present embodiment, the camera module can be mounted on the frame portion 112a of the liquid crystal module having the same size as the conventional one. Specifically, among the camera modules, the lens 131 is attached to the surface of the frame portion 112a of the liquid crystal module, and the FPC 170 on which the sensor chip 121 is flip-chip mounted is fixed to the back surface of the frame portion 112a with a double-sided tape 127. For this reason, compared with the case where the liquid crystal module and the camera module are stored separately in the housing, the mounting area when the liquid crystal panel 100 mounted with the camera module is stored can be reduced. Further, when the mounting area is reduced, the display portion of the liquid crystal panel 100 can be enlarged, and the mobile phone with a TV function in which the liquid crystal panel 100 is mounted can be downsized.

  Further, since the FPC 170 on which the sensor chip 121 is flip-chip mounted is affixed to the back surface of the frame portion 112a, wiring for mounting the sensor chip 121 is formed on the back surface of the frame portion 112a, or the through electrode 28 is formed on the sensor chip 121. There is no need to form. For this reason, the manufacturing cost of the liquid crystal module and the sensor chip 121 can be reduced.

  Further, since the sensor chip 121 is disposed on the back surface of the frame portion 112a and the lens 131 is attached to the surface of the frame portion 112a, the thickness of the sensor chip 121 is smaller than the thickness of the backlight 113, and the thickness of the lens 131 is a polarizing plate. The thickness can be suppressed to be a little thicker than the thickness of 117 and the CF substrate 111. Thus, by mounting the lens 131 and the sensor chip 121 on both sides of the frame portion 112a of the TFT substrate 112, an increase in the thickness of the liquid crystal panel 100 can be minimized.

  In addition, since the bypass capacitor 172 of the sensor chip 121 can be mounted on the FPC 170, the mounting cost of the bypass capacitor 172 is reduced, and an instantaneous change in the power supply voltage is more easily absorbed.

<3. Second Embodiment>
<3.1 Liquid crystal panel configuration>
FIG. 6 is a diagram illustrating a configuration of the liquid crystal panel 200 before the FPC 180 is bent according to the second embodiment. More specifically, FIG. 6A is a plan view of the liquid crystal panel 200 before the FPC 180 is bent. FIG. 6B is a cross-sectional view taken along the line BB of the liquid crystal panel 200 shown in FIG. Among the components of the liquid crystal panel 200 shown in FIG. 6, the same or corresponding components as those of the liquid crystal panel 100 according to the first embodiment shown in FIG. The explanation will focus on the elements.

  As shown in FIG. 6, the liquid crystal driver 151 is flip-chip mounted in a bare chip state on the right side of the frame portion 112a of the TFT substrate 112 constituting the liquid crystal panel 200. In addition, the position of the lens 131 to be attached in a later process is shown on the left side of the frame portion 112a. The FPC 180 is electrically connected to the lower end of the surface of the frame portion 112a.

  Electronic components 181 and 182 such as pass capacitors are mounted on the surface of the FPC 180 (the surface shown in FIG. 6A). In addition, wiring layers (not shown) are formed on both sides of the FPC 180, respectively. The end portion of the wiring layer formed on one end of the back surface of the FPC 180 is electrically connected to the end portion of the wiring pattern 115 formed on the surface of the frame portion 112a using the ACF 184. In addition, a connector 183 is provided on the surface of the other end of the FPC 180, and a control signal given from an external circuit is connected to the liquid crystal via the connector 183, the wiring layer of the FPC 180, and the wiring pattern 115 of the frame portion 112a. It is given to the driver 151.

  An opening (not shown) is formed in the lower left portion of the FPC 180. The sensor chip 121 is thermocompression bonded in a state where it is placed on the surface of the FPC 180 so as to cover the opening with the light receiving surface facing the opening. Specifically, the protruding electrode 122 formed on the light receiving surface of the sensor chip 121 is connected to the terminal portion of the wiring layer formed on the surface of the FPC 180 using the ACP 123.

  FIG. 7 is a diagram illustrating a configuration of the liquid crystal panel 200 after the FPC 180 is bent according to the second embodiment. More specifically, FIG. 7A is a plan view of the liquid crystal panel 200 after the FPC 180 is bent. FIG. 7B is a cross-sectional view taken along the line CC of the liquid crystal panel 200 shown in FIG.

  Since the FPC 180 is made of a flexible film, it can be easily folded. Therefore, as shown in FIG. 7, the FPC 180 connected to the surface of the frame portion 112a is bent at the lower end of the frame portion 112a so that the other end of the FPC 180 is disposed on the back side of the frame portion 112a. And the back surface of FPC180 is affixed on the back surface of the frame part 112a using the double-sided tape 127 affixed cyclically | annularly on the back surface of FPC180. As a result, the FPC 180 is fixed to the frame portion 112a. In this case, since the input / output terminals of the sensor chip 121 are connected to the wiring layer formed on the FPC 180, it is not necessary to form a wiring pattern on the back surface of the frame portion 112a, and the manufacturing cost of the liquid crystal panel 200 is reduced. can do.

  In addition, a lens 131 having an optical axis aligned so as to coincide with the center of the light receiving surface of the sensor chip 121 is attached to the surface of the frame portion 112 a facing the light receiving surface of the sensor chip 121. Therefore, the light from the subject is collected by the lens 131, passes through the frame portion 112 a and the opening 124 of the FPC 180, and forms a subject image on the light receiving surface of the sensor chip 121.

  Further, similarly to the liquid crystal panel 100 according to the first embodiment, the bypass capacitor 182 of the sensor chip 121 can be soldered to the wiring layer formed on the FPC 180. For this reason, it is not necessary to newly prepare an FPC for mounting the bypass capacitor 182, and the manufacturing cost of the camera module can be reduced. Further, since the bypass capacitor 182 is mounted on the wiring layer in the vicinity of the sensor chip 121, it becomes easier to absorb an instantaneous change in the power supply voltage.

  Note that the thickness of the liquid crystal panel 200 when the lens is attached to the front surface of the frame portion 112a and the sensor chip 121 is disposed on the back surface is the same as that of the liquid crystal panel 100 of the first embodiment, and thus the description thereof is omitted. To do.

<3.2 Manufacturing method of liquid crystal panel>
8 and 9 are process cross-sectional views illustrating the manufacturing process of the liquid crystal panel 200. As shown in FIG. 8A, first, the FPC 180 is prepared. In the FPC 180, wiring layers 180b made of copper foil are formed on both surfaces of a base film 180a made of polyimide, for example, and each wiring layer 180b is covered with an insulating cover layer 180c such as a solder resist. In addition, the wiring layers 180b formed on each surface of the base film 180a are appropriately connected to each other through through holes (not shown) provided in the base film 180a.

  An opening 124 is provided in the FPC 180. Around the opening 124, the upper cover layer 180c is removed, and the terminal portion of the wiring layer 180b is exposed. While moving the dispenser 185 along the periphery of the opening 124, the ACP 123, which is a paste-like adhesive, is continuously applied onto the base film 180a where the terminal portion around the opening 124 is exposed. The ACP 123 is an adhesive in which conductive particles such as nickel particles and gold-plated plastic particles are dispersed in a paste-like adhesive made of a thermosetting resin such as an epoxy resin. In addition, since the ACP 123 is applied using the dispenser 185, it can be applied relatively easily even if the bonding region has a complicated shape or a stepped shape.

  As shown in FIG. 8B, the light receiving surface of the sensor chip 121 is placed on the ACP 123 with the opening 124 side, and the back surface of the sensor chip 121 is pressed with a crimping tool (not shown) while heating. As a result, the protruding electrode 122 of the sensor chip 121 is electrically connected to the terminal portion of the upper wiring layer 180b of the FPC 180, and the sensor chip 121 is flip-chip mounted on the upper wiring layer 180b. At this time, since the ACP 123 is continuously applied onto the base film 180a, the gap between the light receiving surface of the sensor chip 121 and the base film 180a is closed by the ACP 123 by thermocompression bonding of the sensor chip 121. Instead of applying ACP 123, NCP (Non Conductive Paste) may be applied. Since NCP is a paste-like adhesive that does not contain conductive particles like ACP, NCP does not require management to make the density of conductive particles uniform, and it is cheaper than ACP. Can be reduced.

  Next, as shown in FIG. 8C, the optical filter 125 is mounted on the FPC 180 so as to face the light receiving surface of the sensor chip 121 connected to the upper wiring layer 180b and completely cover the opening 124 from below. Adhere to the lower surface with adhesive. As a result, the opening 124 sandwiched between the sensor chip 121 and the ACP 123 that closes the gap between the sensor chip 121 and the FPC 180 and the optical filter 125 is sealed, and the sensor chip 121 is cavity-sealed to the FPC 180.

  Here, the sensor chip 121 is cavity-sealed for the following reason. The foreign matter that blocks the light incident on the light receiving surface of the sensor chip 121 degrades the image quality of the subject as it adheres to a position closer to the light receiving surface of the sensor chip 121. For example, the foreign matter adhering to the light receiving surface of the sensor chip 121 greatly deteriorates the image quality of the subject when the size is 2 μm or more. However, the foreign matter adhering to the outer surface of the optical filter 125 does not deteriorate the image quality of the subject until it becomes 15 μm or more. For this reason, it is necessary to prevent foreign matter from adhering to the vicinity of the light receiving surface of the sensor chip 121.

  Therefore, the series of steps shown in FIGS. 8A to 8C are performed in a clean room having a high degree of cleanliness, so that foreign matter entering the space between the sensor chip 121 and the optical filter 125 can be removed. Minimize as much as possible. Further, by performing cavity sealing, it is possible to prevent foreign matter from entering the sealed space in the steps after FIG. 8D. By performing cavity sealing in a clean room having a high degree of cleanness in this way, the processes after FIG. 8D can be performed in a clean room having a low degree of cleanness. The cost required for maintenance / management can be reduced.

  Next, as shown in FIG. 8D, in order to electrically connect the wiring layer 180b of the FPC 180 to the wiring pattern 115 formed on the surface of the frame portion 112a, the wiring layer 180b on the upper side of the FPC 180 is exposed. ACF184 is pasted to the end. Next, the wiring layer 180b to which the ACF 184 is attached is aligned with the wiring pattern 115 of the frame portion 112a and thermocompression bonded. As a result, the wiring layer 180b of the FPC 180 is electrically connected to the wiring pattern 115 of the frame portion 112a. Instead of attaching the ACF 184 to the wiring layer 180b of the FPC 180, the ACF 184 may be attached on the wiring pattern 115 of the frame portion 112a. Further, NCF may be used instead of ACF184. Since NCF does not contain conductive particles and is less expensive than ACF, the use of NCF can reduce the manufacturing cost of the liquid crystal panel 200.

  As shown in FIG. 9A, a double-sided tape 127 is attached on the upper cover layer 180 c of the FPC 180. Then, as shown in FIG. 9B, the FPC 180 is bent at the left end of the frame portion 112a (the lower end of FIG. 7A) toward the back surface (the upper surface of FIG. 9B) of the frame portion 112a, and the double-sided tape 127 is attached. To fix to the back surface of the frame portion 112a. In this way, the FPC 180 is fixed to the frame portion 112a, and the sensor chip 121 is disposed on the back surface of the frame portion 112a with the light receiving surface facing the frame portion.

  As shown in FIG. 9C, the lens 131 is attached by using an adhesive 132 at a position facing the light receiving surface of the sensor chip 121 on the surface of the frame portion 112a (the lower surface of FIG. 9B). At this time, the lens 131 is aligned so that the optical axis of the lens 131 coincides with the center of the light receiving surface of the sensor chip 121, and the focus of the lens 131 is adjusted so that the subject image is formed on the light receiving surface of the sensor chip 121. Is done.

  In the above manufacturing method, the sensor chip 121 is mounted on the FPC 180, the FPC 180 is connected to the left end of the front surface of the frame portion 112a, and then the FPC 180 is bent and attached to the back surface of the frame portion 112a. However, the sensor chip 121 may be mounted on the FPC 180 after the FPC 180 connected to the left end of the front surface of the frame portion 112a is bent and attached to the back surface of the frame portion 112a.

<3.3 Effects>
As can be seen from the above description, the liquid crystal panel 200 according to the present embodiment has the same effects as the liquid crystal panel 100 of the first embodiment, and further has the following unique effects.

  Since the size of the FPC 180 used in this embodiment is approximately the same as the size of the two FPCs 160 and FPC 170 used in the first embodiment, the material cost of the FPC 180 is the same as the material cost of the FPC 160 and FPC 170. Degree. However, in the liquid crystal panel 200, it is only necessary to prepare one FPC, so only one type of mold has to be prepared for punching. Further, since each process such as punching, processing, and inspection necessary for manufacturing the FPC is performed only once, compared with the liquid crystal panel 100 in which each process is required twice in order to prepare two FPCs, the FPC The manufacturing cost can be reduced. For this reason, the manufacturing cost of the liquid crystal panel 200 can be reduced.

  In addition, since only one FPC is used in the present embodiment, only one connector 183 is required for the liquid crystal panel 200. For this reason, the wiring connected to the connector 183 can be easily routed. Further, compared to the liquid crystal panel 100 in which the two connectors 163 and 173 need to be provided, the material cost of the connector is reduced and the mounting cost can be reduced because the mounting process to the FPC is performed only once. Also in this respect, the manufacturing cost of the liquid crystal panel 200 can be reduced.

  Further, the step of cavity-sealing the sensor chip 121 in the opening 124 of the FPC 180 is performed in a clean room having a high degree of cleanliness, so that foreign matter does not adhere to the vicinity of the light receiving surface of the sensor chip 121, and the subject due to the foreign matter is prevented. Prevent image quality degradation. In addition, since foreign matter does not enter the sealed space after cavity sealing, the manufacturing process after cavity sealing can be performed in a clean room with low cleanliness. For this reason, the cost required for maintenance / management of the clean room as a whole manufacturing process can be reduced.

<4. Third Embodiment>
<4.1 Liquid crystal panel configuration>
FIG. 10 is a diagram showing a configuration of a liquid crystal panel 300 according to the third embodiment. More specifically, FIG. 10A is a plan view seen from the back side of the liquid crystal panel 300, and FIG. ) Is a cross-sectional view taken along line DD of the liquid crystal panel shown in FIG. In the liquid crystal panel 300 illustrated in FIG. 10, the same components as those of the liquid crystal panel 100 illustrated in FIG. 4 are denoted by the same reference numerals, and different components will be mainly described.

  As can be seen by comparing the liquid crystal panel 300 shown in FIG. 10 with the liquid crystal panel 100 shown in FIG. 4, a light guide plate 113 a is provided on the back surface of the TFT substrate 112. In addition, a double-sided tape 127 is annularly attached to the back surface of the frame portion 112a. On the surface of the TFT substrate 112 sandwiched between the light guide plate 113a and the double-sided tape 127, a plurality of LED (Light Emitting Diode) chips 190 that constitute a backlight together with the light guide plate 113a, the light emitting surface of the light guide plate 113a. Are arranged in a line along the side surface of the light guide plate 113a in a state directed toward the side surface serving as the light incident surface. Therefore, the LED chip 190 and the light guide plate 113a convert white light emitted from the LED chip 190 into planar white light within the light guide plate 113a, and the converted planar white light is backside of the TFT substrate 112. Functions as a backlight for irradiating the liquid crystal layer 116.

  The FPC 170 on which the sensor chip 121 is flip-chip mounted is fixed to the back surface of the frame portion 112a with a double-sided tape 127 so that the light receiving surface of the sensor chip 121 faces the back surface of the frame portion 112a. A thick double-sided tape 127 is used so that the height of the double-sided tape 127 is substantially equal to the height of the light guide plate 113a. For this reason, when the FPC 170 is attached to the double-sided tape 127, the FPC 170 can be attached in a state where the end portion 170a of the FPC 170 is positioned on the upper surface of the light guide plate 113a. In this case, the length of the end 170a of the FPC 170 located on the upper surface of the light guide plate 113a is not limited, and the length may be long or short. Alternatively, the FPC 170 may be attached to the double-sided tape 127 in a state where the end portion 170a does not reach the light guide plate 113a. Since the LED chip 190 is lower than the double-sided tape 127 and the light guide plate 113a, the LED chip 190 does not come into contact with the FPC 170 attached to the double-sided tape 127. Further, the attachment of the lens 131, the generation of the image signal by the sensor chip 121, the processing thereof, and the like are the same as in the case of the liquid crystal panel 100, and the description thereof is omitted.

<4.2 Effects>
As can be seen from the above description, the liquid crystal panel 300 according to the present embodiment has the same effects as the liquid crystal panel 100 of the first embodiment, and further has the following unique effects.

  In the liquid crystal panel 100 shown in FIG. 4, since the height of the FPC 170 attached to the back surface of the frame portion 112a is lower than the height of the backlight 113, when the FPC 170 is attached to the double-sided tape 127, May hit the backlight 113 and the FPC 170 may not be attached. Therefore, it is necessary to consider an alignment margin when the FPC 170 is attached to the double-sided tape 127 so that the end of the FPC 170 does not hit the backlight 113. In this case, there is a problem that the length of the frame portion 112a is increased by the alignment margin. In addition, when the FPC 170 is attached to the double-sided tape 127, care must be taken so that the end of the FPC 170 does not hit the backlight 113, so that there is a problem that workability is deteriorated.

However, in the liquid crystal panel 300 of the present embodiment, when the FPC 170 is attached to the double-sided tape 127, the end 170a of the FPC 170 can move so as to slide on the upper surface of the light guide plate 113a. The movement is not hindered by the light guide plate 113a. Therefore, unlike the liquid crystal panel 100, it is not necessary to consider the alignment margin when the FPC 170 is attached to the double-sided tape 127. Therefore, the frame portion 112a can be narrowed by an amount corresponding to an unnecessary alignment margin. Further, when the FPC 170 is attached to the double-sided tape 127, there is no problem with the end 170a of the FPC 170 hitting the light guide plate 113a, so that the workability is improved. In this case, the thickness of the liquid crystal panel 300 increases by the thickness of the FPC 170 on the upper surface of the light guide plate 113a.
<4.3 Modification>

  FIG. 11 is a diagram illustrating a configuration of a liquid crystal panel 400 that is a modification of the liquid crystal panel 300 according to the third embodiment. More specifically, FIG. 11A is a plan view of the liquid crystal panel 400 viewed from the back side. FIG. 11B is a cross-sectional view taken along the line EE of the liquid crystal panel 400 shown in FIG. In the liquid crystal panel 400 shown in FIG. 11, the same components as those of the liquid crystal panel 300 shown in FIG. 10 are denoted by the same reference numerals, and different components will be mainly described.

  In the liquid crystal panel 400 shown in FIG. 11, one end of the FPC 180 on which the sensor chip 121 is flip-chip mounted is electrically connected to the wiring pattern 115 formed on the surface of the frame portion 112a by the ACF 184. Further, since the FPC 180 is a flexible film, the FPC 180 is bent at the lower end of the frame portion 112a toward the back side of the frame portion 112a. As in the case of the liquid crystal panel 300, the double-sided tape 127 is annularly attached to the back side of the frame portion 112a, so the folded FPC 180 is fixed to the back side of the frame portion 112a with the double-sided tape 127. . Further, the light guide plate 113a and the plurality of LED chips 190 constituting the backlight are arranged in the same manner as in the liquid crystal panel 300.

  In the liquid crystal panel 400, as in the case of the liquid crystal panel 300, a double-sided tape 127 having a thickness comparable to the height of the light guide plate 113a is used. Therefore, when the folded FPC 180 is attached to the double-sided tape 127, the FPC 180 can be attached in a state where the end portion 180a of the FPC 180 is positioned on the upper surface of the light guide plate 113a. In this case, the length of the end portion 180a of the FPC 180 located on the upper surface of the light guide plate 113a is not limited, and the length may be long or short. Alternatively, the FPC 180 may be attached to the double-sided tape 127 in a state where the end portion 180a does not reach the light guide plate 113a.

  In the liquid crystal panel 400 according to this modification, like the liquid crystal panel 300, the frame portion 112a can be narrowed, and workability when the FPC 180 is fixed to the back surface of the frame portion 112a can be improved. .

<5. Other>
In each of the above embodiments, the case where the camera module is mounted on the frame portion of the liquid crystal panels 100 to 400 has been described. However, the camera module can be mounted on the frame portion of the organic EL module instead of the liquid crystal panels 100 to 400. . Also in this case, since the mounting area can be reduced as compared with the case where the organic EL panel and the camera module are separately mounted in the housing, the display portion of the organic EL module can be enlarged. Since the organic EL panel does not require a backlight, the thickness of the organic EL module increases by the thickness of the FPC and sensor chip arranged on the back surface of the frame portion.

DESCRIPTION OF SYMBOLS 100, 200, 300, 400 ... Liquid crystal panel 111 ... CF board | substrate 112 ... TFT board | substrate 112a ... Frame part 113 ... Back light 113a ... Light guide plate 115 ... (on frame part) wiring pattern 121 ... Sensor chip 122 ... Projection electrode (stud) bump)
123 ... ACP (anisotropic conductive paste)
DESCRIPTION OF SYMBOLS 124 ... Opening part 125 ... Optical filter 127 ... Double-sided tape 131 ... Lens 160, 170, 180 ... FPC (flexible circuit board)
170a, 180a ... FPC ends 172, 182 ... Bypass capacitor 190 ... LED chip (semiconductor light emitting element)

Claims (9)

A display module for displaying an image, a display module in which a frame portion on which a wiring pattern is formed is formed on a transparent insulating substrate, and a camera module capable of photographing a subject on the display surface side of the display unit. Display panel,
A lens attached to the first main surface on which the wiring pattern of the frame portion is formed;
A photoelectric conversion element that photoelectrically converts light from the subject incident on the light receiving surface and outputs an image signal; and
An opening that allows light from the subject to pass therethrough, and a flexible circuit board that is electrically connected to an end of the wiring pattern formed on the first main surface of the frame portion;
The flexible circuit board is bent to a second main surface side facing the first main surface of the frame portion at an end portion of the frame portion and fixed to the second main surface;
The photoelectric conversion element is flip-chip mounted on the flexible circuit board so as to cover the opening with the light receiving surface facing the opening.
The display panel according to claim 1, wherein the lens is mounted on the first main surface of the frame portion so as to face the light receiving surface through the insulating substrate. A display module for displaying an image, a display module in which a frame portion on which a wiring pattern is formed is formed on a transparent insulating substrate, and a camera module capable of photographing a subject on the display surface side of the display unit. Display panel,
A lens attached to the first main surface on which the wiring pattern of the frame portion is formed;
A photoelectric conversion element that photoelectrically converts light from the subject incident on the light receiving surface and outputs an image signal; and
A first flexible circuit board electrically connected to an end of the wiring pattern formed on the first main surface of the frame portion;
An opening for allowing light from the subject to pass through, and a second flexible circuit board fixed to the second main surface of the frame portion,
The photoelectric conversion element is flip-chip mounted on the second flexible circuit board so as to cover the opening with the light receiving surface facing the opening.
The display panel according to claim 1, wherein the lens is mounted on the first main surface of the frame portion so as to face the light receiving surface through the insulating substrate. An optical filter that restricts light incident on the photoelectric conversion element;
The opening formed in the flexible circuit board or the second flexible circuit board is sealed by covering from both sides with the light receiving surface of the photoelectric conversion element and the optical filter. The display panel according to claim 1 or 2.   The photoelectric conversion element is bonded to the flexible circuit board or the second flexible circuit board by a paste-like conductive adhesive continuously applied so as to surround the opening. The display panel according to claim 3, wherein: A capacitor that absorbs an instantaneous change in the power supply voltage supplied to the photoelectric conversion element;
The display panel according to claim 1, wherein the capacitor is mounted on the flexible circuit board or the second flexible circuit board in the vicinity of the photoelectric conversion element. A double-sided tape affixed to the second main surface of the frame portion;
The said flexible circuit board or the said 2nd flexible circuit board is being fixed to the said 2nd main surface of the said frame part with the said double-sided tape, The Claim 1 or 2 characterized by the above-mentioned. Display panel. A light guide plate disposed on the second main surface of the insulating substrate;
A plurality of semiconductor light emitting elements that irradiate light to the side surface of the light guide plate;
The display module is a liquid crystal module;
The double-sided tape is attached to the second main surface of the frame portion along the side surface of the light guide plate,
The plurality of semiconductor light emitting elements are arranged between the double-sided tape and a side surface of the light guide plate, a height of the double-sided tape is substantially the same as a height of the light guide plate, and a height of the semiconductor light emitting element is The display panel according to claim 6, wherein the display panel is lower than a height of the double-sided tape and the light guide plate. The display panel according to claim 1 or 2 is mounted,
The mobile phone according to claim 1, wherein the camera module is arranged with the lens facing the display surface side of the display panel. A method of manufacturing a display panel in which a camera module for photographing a subject is mounted on a frame portion of a display module formed on a transparent insulating substrate and having a display unit for displaying an image,
A preparation step of preparing a flexible circuit board in which an opening and a wiring layer are formed;
A paste-like adhesive is applied around the opening, and the photoelectric conversion element placed so as to cover the opening with the light receiving surface for receiving light from the subject facing the opening is flexible. A thermocompression bonding process for thermally bonding to one surface of the circuit board;
A bonding step of bonding an optical filter to the other surface of the flexible circuit board so as to face the light receiving surface and cover the opening;
A connection step of electrically connecting one end of the flexible circuit board to an end portion of a first main surface of a frame portion on which the subject is displayed;
An affixing step of bending the flexible circuit board at an end of the frame portion and attaching the other end to a second main surface facing the first main surface of the frame portion;
An attachment step of attaching a lens for condensing light from the subject at a position facing the light receiving surface on the first main surface of the frame portion;
The preparation process, the thermocompression bonding process, and the bonding process are performed in a clean room having a higher degree of cleanliness than any of the connection process, the pasting process, and the mounting process. Method.

Images