JP2010199474A - Hollow package for electronic component, adhesive sheet for hollow package for electronic component, lid body, and electronic component manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a hollow package for an electronic component for economically and highly efficiently manufacturing an electronic component in which a device component is hermetically sealed, and to provide an adhesive sheet and a lid body used therefor. <P>SOLUTION: The hollow package 1 for an electronic component includes a package body 3 having a recessed portion for housing a device component, and a platy lid body 4 for sealing the recessed portion, wherein the lid body 4 has a base 4a, and an adhesive sheet 4b that is adhered to one main surface of the base 4a and is composed of an epoxy resin-based adhesive composition used for adhering the package body and the base. The package body is composed of a ceramic material, a resin material, or a glass fiber reinforced resin material which is made by reinforcing a resin material with glass fibers. The base of the lid body is composed of a glass fiber reinforced resin material which is made by reinforcing a resin material with glass fibers. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a hollow package for an electronic component in which an element component such as a semiconductor element, a SAW element (surface acoustic wave element) or the like is sealed to form an electronic component, an adhesive sheet of the hollow package for an electronic component, a lid, and an electronic component In particular, an electronic component hollow package capable of manufacturing an electronic component in which element components are hermetically sealed at low cost and high efficiency, an adhesive sheet used for the electronic component hollow package, and a lid The present invention also relates to a method for manufacturing an electronic component using the hollow package for an electronic component.

  As a method of sealing the element component, (a) a method of resin sealing using a molding die, (b) a liquid sealing resin is dropped on the element component, or a liquid sealing resin is added. There are roughly three types: a method of immersing element parts, and (c) a method of accommodating element parts in a hollow package.

  As for the method (a), usually, a mold having many cavities is used as a molding die, and a tablet-shaped sealing resin is heated and pressurized in a state where element parts are arranged in the cavity. The element parts are sealed by the injection. In this case, the outer shape of the sealed object is automatically determined by a molding die (cavity), and a sealed object having a predetermined outer shape can be efficiently obtained (see, for example, Patent Document 1).

  As for the method (b), usually, a liquid sealing resin is dropped onto the element component from the nozzle, or the inner side surrounded by a dam is filled with the sealing resin, and the element component is immersed therein. And seal. At this time, the outer shape of the sealed object is indeterminate for those to which the sealing resin is dropped, and the outer shape of the sealed object is determined by the arrangement of the dam or the like for those surrounded by the dam (for example, Patent Document 2). reference.).

  Finally, the method (c) is suitably applied to sealing element parts such as SAW elements whose characteristics are easily changed by the method of directly sealing with a sealing resin. It seals by providing an element part and providing a space | interval (for example, refer patent document 3).

  Such a hollow package is composed of, for example, a package body having a recess and a lid that covers the recess of the package body. The package body and the lid are simply fixed with a fixing agent, and the lid side of the package body. A step is provided at the end portion of the outer wall, and the lid is fitted into the step portion and fixed with a fixing agent (see, for example, Patent Document 4). Moreover, a low melting point brazing material or an organic resin adhesive is used as a fixing agent that fixes the package body and the lid (see, for example, Patent Document 5).

JP 2002-151530 A JP 2002-57372 A JP 2004-193879 A Japanese Utility Model Publication No. 1-81025 Japanese Utility Model Publication No. 4-23326

  As described above, with respect to the hollow package used for sealing element parts such as SAW elements, the package body and the lid are fixed by a fixing agent such as a low melting point brazing material or an organic resin adhesive. . Among these, by using an organic resin adhesive as a fixing agent, the package body and the lid can be fixed relatively inexpensively.

  However, even when an organic resin adhesive is used, if the amount of adhesive is small or the melt viscosity of the adhesive is low, the package body and the lid are not sufficiently fixed, and the airtightness also decreases. . On the other hand, if the amount of the adhesive is large or the melt viscosity is high, the adhesive oozes out from the fixed portion between the package body and the lid to the inside or outside. In order to improve the airtightness between the package body and the lid, it is effective to provide a step in the package body as described above and fix the lid by fitting the step into the step portion. It takes time to apply the adhesive, and the productivity is reduced.

  The present invention has been made to solve the above problems, and provides an electronic component hollow package capable of manufacturing an electronic component in which element components are hermetically sealed at low cost and high efficiency. It is an object. Another object of the present invention is to provide an adhesive sheet and a lid used for such a hollow package for electronic components. Furthermore, an object of the present invention is to provide a method for manufacturing an electronic component using such a hollow package for an electronic component.

  As a result of diligent investigation to manufacture an electronic component in which element components are hermetically sealed at low cost and high efficiency, the present inventors have determined that a package body and a lid that constitute a hollow package for electronic components The inventors have found that it is effective to bond with an adhesive sheet, and completed the present invention.

  That is, the hollow package for electronic components of the present invention is a hollow package for electronic components having a package body having a recess for housing element components and a plate-like lid for sealing the recess. The lid has a base and an adhesive sheet bonded to one main surface of the base.

  The package body is preferably made of a ceramic material, a resin material, or a glass fiber reinforced resin material obtained by reinforcing a resin material with glass fibers. The lid base is made of a glass fiber reinforced resin material obtained by reinforcing a resin material with glass fibers, and the lid adhesive sheet is an epoxy resin adhesive composition mainly composed of an epoxy resin. Preferably it consists of.

  The epoxy resin-based adhesive composition preferably contains (B1) an epoxy resin, (B2) an epoxy resin curing agent, (B3) an epoxy resin curing accelerator, and (B4) an elastomer as essential components. The adhesive sheet preferably has a melt viscosity of 10 kPa · s to 1000 kPa · s at 100 ° C. to 160 ° C. Furthermore, it is preferable that the adhesive sheet has a tensile modulus after curing of 1 MPa to 1000 MPa.

  In addition, the adhesive sheet for a hollow package for electronic parts according to the present invention is an adhesive sheet made of a thermosetting resin, and seals the package body having a recess for housing element parts and the recess of the package body. It is used for adhesion between the package body and the substrate of a hollow package for electronic parts comprising a lid having a plate-like substrate.

  Furthermore, the lid of the hollow package for electronic components of the present invention is a lid in a hollow package for electronic components comprising a package body having a recess for housing element components and a plate-shaped lid that seals the recess. It is a body, and has a base and an adhesive sheet bonded to one main surface of the base.

  The electronic component manufacturing method according to the present invention includes a housing step of housing the element component in the recess of the package body having a recess for housing the element component, and bonding the base component to one main surface of the base body. And a bonding step of adhering a lid having an adhesive sheet to the package main body so that the adhesive sheet side becomes the package main body side.

  Furthermore, in another electronic component manufacturing method of the present invention, the element component is accommodated in the recess of the package assembly in which a plurality of package bodies having recesses for accommodating the element components are integrally formed in a planar shape. And a lid forming material having a size similar to that of the package assembly material, the housing sheet having an adhesive sheet bonded to the main surface of the substrate and one main surface of the substrate, the adhesive sheet side being the package assembly material side In this way, it has an adhesion step of obtaining an electronic component assembly by overlapping and adhering to the package assembly material, and a cutting step of cutting the electronic component assembly to obtain a plurality of electronic components. To do. The package assembly is preferably made of a resin material or a glass fiber reinforced resin material obtained by reinforcing a resin material with glass fibers.

  According to still another aspect of the invention, there is provided a method for manufacturing an electronic component, in which an element component is accommodated in the recesses of a plurality of package bodies having recesses for accommodating element components, and the package body is disposed in a plane. A lid having a housing step for arranging, a base and an adhesive sheet bonded to one main surface of the base, and covering the entirety of the plurality of package bodies arranged close to the planar shape An adhering step of obtaining an electronic component assembly by overlapping and adhering a forming material on the plurality of package main bodies so that the adhesive sheet side becomes the plurality of package main bodies; and an adjoining in the electronic component aggregate And a cutting step of cutting the lid forming material connecting the electronic components to obtain a plurality of electronic components.

  ADVANTAGE OF THE INVENTION According to this invention, the hollow package for electronic components which can manufacture the electronic component by which the element component was airtightly sealed at low cost and high efficiency can be provided. Moreover, according to this invention, the adhesive sheet and cover body which are used suitably for such a hollow package for electronic components can be provided. Furthermore, according to the present invention, it is possible to provide a manufacturing method capable of manufacturing an electronic component in which element components are hermetically sealed at low cost and high efficiency.

Sectional drawing which illustrates the hollow package for electronic components of this invention, and an electronic component using the same. Sectional drawing which illustrates the other electronic component hollow package of this invention, and an electronic component using the same. Explanatory drawing which shows the manufacturing method of an electronic component. The external view which shows the package assembly material used for the manufacturing method of another electronic component. The external view which shows the electronic component assembly obtained by adhere | attaching a lid | cover formation material on a package assembly material. The external view which shows the some electronic component obtained by cut | disconnecting an electronic component aggregate | assembly.

The present invention will be described below with reference to the drawings.
FIG. 1 illustrates an electronic component hollow package 1 (hereinafter simply referred to as a hollow package 1) and an electronic component 2 using the same. The hollow package 1 of the present invention is composed of a package body 3 having a recess and a lid 4 for sealing the recess of the package body 3.

  The electronic component 2 accommodates an element component 5 such as a semiconductor element or a SAW element in the recess of the package body 3 in the hollow package 1, and a lid 4 on the package body 3 that accommodates the element component 5. It is configured by adhering and sealing.

  The package body 3 is formed so as to surround, for example, the mounting portion 3a on which the element component 5 is mounted, the wiring portion 3b exposed on both main surfaces of the mounting portion 3a, and the mounting portion 3a on which the element component 5 is mounted. Frame portion 3c. The bump 5a of the element component 5 is electrically connected and fixed to the wiring part 3b exposed to the inside of the package body 3 by a conductive adhesive 6 mainly composed of Ag or the like, for example.

  On the other hand, the lid body 4 is provided on a plate-like base body 4a mainly constituting the lid body 4 and the entire main surface of the base body 4a on the package body 3 side, and the lid body 4 (base body 4a), the package body 3 and the like. It has the adhesive sheet 4b which adhere | attaches. The package body 3 and the lid body 4 are bonded to each other by the frame portion 3c of the package body 3 and the peripheral portion of the adhesive sheet 4b in contact with the frame portion 3c. The central portion does not necessarily contribute to adhesion.

  FIG. 2 shows another hollow package 1 of the present invention and an electronic component 2 using the same. In addition, about FIG. 2, illustration of the wiring part 3b is abbreviate | omitted. The hollow package 1 of the present invention is not necessarily limited to one that accommodates a single element component 5 as shown in FIG. 1, and may be one that accommodates a plurality of element components 5 as shown in FIG. 2. The hollow package 1 of the present invention can be appropriately changed in shape, size, etc. according to the shape and number of element parts 5 to be accommodated.

  The base 4a constituting the lid 4 can be made of, for example, a metal material, a ceramic material, or a resin material or a fiber reinforced resin material obtained by reinforcing a resin material with fibers, but is not necessarily limited. From the viewpoint of price, strength, workability, etc., it is preferable that the resin material is made of a fiber reinforced resin material reinforced with fibers, particularly from a fiber reinforced thermosetting resin material in which the resin material is a thermosetting resin. It is preferable to become.

  Examples of such a substrate 4a include those obtained by heating and press-molding one or a plurality of prepregs which are impregnated with a thermosetting resin and dried into a semi-cured state on a fiber base material. For example, a commercially available general glass epoxy laminate or the like can also be used.

  Examples of the fiber base material constituting the substrate 4a include inorganic fiber base materials such as glass cloth and glass mat, and organic fiber base materials such as aromatic polyamide fiber, cellulose fiber, polyester fiber, and carbon fiber. Or a mixture of two or more. As a preferable fiber base material, E glass cloth etc. which are widely used for an electronic component use etc. are mentioned, for example.

  Moreover, as a thermosetting resin which comprises the base | substrate 4a, an epoxy resin, a phenol resin, an unsaturated polyester resin, a polyimide resin etc. are mentioned, Among these, an epoxy resin is mentioned as a suitable thing, Especially (A1) epoxy resin and (A2) The epoxy resin composition which contains the hardening | curing agent for epoxy resins as an essential component is mentioned as a suitable thing.

  The epoxy resin of component (A1) is not particularly limited as long as it is an epoxy resin having two or more epoxy groups in one molecule. For example, bisphenol A type epoxy resin, bisphenol F type epoxy resin, novolac type epoxy resin, Examples thereof include glycidyl ether type epoxy resins, alicyclic epoxy resins, heterocyclic epoxy resins, and polyfunctional epoxy resins having a biphenyl skeleton, and these can be used alone or in admixture of two or more.

  As such an epoxy resin, it is preferable to use a high-purity resin with less chlorine ions and alkali ions from the viewpoint of ensuring the reliability when the electronic component 2 is used. Further, in order to impart flame retardancy to the epoxy resin composition, for example, a flame retardant epoxy resin such as brominated epoxy resin or phosphorus-modified epoxy resin may be used, or an organic phosphorus-containing compound, metal hydroxide A zinc compound or the like may be added.

  The (A2) component epoxy resin curing agent can be used without particular limitation as long as it is a compound usually used for curing epoxy resins. Examples of amine curing systems include dicyandiamide and aromatic diamine. Examples of the phenol curing system include phenol novolak resin, cresol novolak resin, bisphenol A type novolak resin, triazine-modified phenol novolak resin and the like, and these can be used alone or in admixture of two or more.

  The content of such a curing agent for epoxy resin is preferably 2 parts by mass or more and 50 parts by mass or less with respect to 100 parts by mass of the epoxy resin of component (A1) from the viewpoint of efficiently proceeding the curing reaction. Further, from the viewpoint of more efficiently proceeding the curing reaction, the equivalent ratio of the epoxy resin of component (A1) to the curing agent for epoxy resin of component (A2), that is, the number of epoxy groups in the epoxy resin of component (A1) The ratio of the number of functional groups (amine group, hydroxyl group, etc.) that can react with the epoxy group in the epoxy resin curing agent (A2) is preferably 0.5 or more and 1.5 or less.

  Furthermore, such an epoxy resin composition preferably contains an epoxy resin curing accelerator from the viewpoint of efficiently proceeding the curing reaction. As the curing accelerator for epoxy resins, those usually used as curing accelerators for epoxy resins can be used, and imidazole compounds such as 2-ethyl-4-imidazole and 1-benzyl-2-methylimidazole, Examples thereof include boron trifluoride amine complex and triphenylphosphine. These curing accelerators for epoxy resins can be used alone or in admixture of two or more. The content of the epoxy resin curing accelerator is preferably 0.01 parts by mass or more and 5 parts by mass or less with respect to 100 parts by mass of the epoxy resin (A1) from the viewpoint of efficiently proceeding the curing reaction.

  Such an epoxy resin composition is diluted with a suitable organic solvent such as methyl ethyl ketone, toluene, acetone, ethyl cellosolve, methyl cellosolve, cyclohexanone to obtain an impregnation solution. A prepreg can be obtained by impregnating the fiber base material with the impregnation solution and drying it to make it semi-cured. Furthermore, the base | substrate 4a which comprises the cover body 4 can be obtained by heat-press-molding by laminating | stacking one sheet or multiple sheets of this prepreg.

  The thickness of the base body 4a is not necessarily limited as long as the thickness can maintain the concave portion when it is bonded to the package body 3 and can maintain airtightness, and also varies depending on the constituent materials. However, for example, in the case of the one made of the above-described fiber-reinforced thermosetting resin material, it is preferable that the thickness is 30 μm or more and 500 μm or less. If the thickness of the substrate 4a is less than 30 μm, the concave portion cannot be effectively maintained and the airtightness may not be maintained when bonded to the package body 3. On the other hand, when the thickness of the substrate 4a exceeds 500 μm, the thickness of the entire hollow package 1 becomes excessively large, which is not preferable.

  On the other hand, the adhesive sheet 4b constituting the lid body 4 is thermosetting and can effectively bond the package body 3 and the lid body 4 (base 4a). The package body 3 and the lid body 4 ( Although it will not necessarily restrict | limit if the exudation to the inside or the exterior from the adhesion part with the base | substrate 4a) is suppressed, For example, it shall consist of an epoxy resin-type adhesive composition which mainly has an epoxy resin. It is preferable to do.

  As such an epoxy resin adhesive composition, for example, (B1) epoxy resin, (B2) epoxy resin curing agent, (B3) epoxy resin curing accelerator, and (B4) elastomer are contained as essential components. Those are preferred.

  The epoxy resin as the component (B1) is not particularly limited as long as it is an epoxy resin having two or more epoxy groups in one molecule. For example, bisphenol A type epoxy resin, bisphenol F type epoxy resin, novolak type epoxy resin, Examples thereof include glycidyl ether type epoxy resins, alicyclic epoxy resins, heterocyclic epoxy resins, and polyfunctional epoxy resins having a biphenyl skeleton, and these can be used alone or in admixture of two or more.

  As the curing agent for epoxy resin of component (B2), it can be used without particular limitation as long as it is a compound that is usually used for curing epoxy resin, and examples thereof include dicyandiamide and aromatic diamine as an amine curing system, Examples of the phenol curing system include phenol novolak resin, cresol novolak resin, bisphenol A type novolak resin, triazine-modified phenol novolak resin and the like, and these can be used alone or in admixture of two or more.

  The content of the curing agent for epoxy resin is preferably 2 parts by mass or more and 50 parts by mass or less with respect to 100 parts by mass of the epoxy resin of the component (B1) from the viewpoint of efficiently proceeding the curing reaction. Further, from the viewpoint of more efficiently proceeding the curing reaction, the equivalent ratio of the epoxy resin of component (B1) to the curing agent for epoxy resin of component (B2), that is, the number of epoxy groups in the epoxy resin of component (B1) It is preferable that the ratio of the number of functional groups (amine group, hydroxyl group, etc.) reacting with the epoxy group in the epoxy resin curing agent (B2) is 0.5 or more and 1.5 or less.

  As the (B3) component epoxy resin curing accelerator, those usually used as epoxy resin curing accelerators can be used, such as 2-ethyl-4-imidazole and 1-benzyl-2-methylimidazole. Imidazole compound, boron trifluoride amine complex, triphenylphosphine and the like. These curing accelerators for epoxy resins can be used alone or in admixture of two or more. The content of the component (B3) epoxy resin curing accelerator is 0.01 parts by mass or more and 5 parts by mass or less with respect to 100 parts by mass of the component (B1) epoxy resin from the viewpoint of efficiently proceeding the curing reaction. It is preferable to do.

  Examples of the elastomer of component (B4) include various synthetic rubbers such as acrylic rubber, acrylonitrile butadiene rubber and carboxy-containing acrylonitrile butadiene rubber, rubber-modified high molecular weight compounds, polymer epoxy resins, phenoxy resins, modified polyimides, modified polyamideimides, and the like. These may be used alone or in admixture of two or more. Of these, synthetic rubber, rubber-modified polymer compound, and polymer epoxy resin are preferably used.

  The content of the component (B4) elastomer is preferably 5% by mass or more and 80% by mass or less in the entire epoxy resin adhesive composition. If the elastomer content is less than 5% by mass, the reliability during heating of the adhesive sheet 4b and thus the hollow package 1 may be insufficient. On the other hand, if the elastomer content exceeds 80% by mass, the adhesive strength is lowered, and the airtightness of the hollow package 1 may be insufficient.

  Such an epoxy resin-based adhesive composition includes the above-described epoxy resin (B1), the curing agent for epoxy resin (B2), the curing accelerator for epoxy resin (B3), and (B4) In addition to the component elastomer, it may contain an inorganic filler, an organic filler, a coupling agent, a leveling agent, a pigment, an anti-degradation agent, etc., as necessary and within the limits not violating the object of the present invention. it can. For example, examples of the inorganic filler include talc, alumina, aluminum hydroxide, magnesium hydroxide, fused silica, synthetic silica and the like, and these can be used alone or in combination of two or more.

  Such an epoxy resin-based adhesive composition is composed of the above-described (B1) component epoxy resin and (B2) component epoxy resin in a suitable organic solvent such as methyl ethyl ketone, toluene, acetone, ethyl cellosolve, methyl cellosolve, and cyclohexanone. It can be easily obtained by dissolving the curing agent for epoxy resin, the curing accelerator for epoxy resin of component (B3), the elastomer of component (B4), and other components blended as necessary. And the adhesive sheet 4b which comprises the cover body 4 can be obtained easily by apply | coating such an epoxy resin-type adhesive composition on a release paper, for example, and making it dry and making it into a sheet form.

  The thickness of the adhesive sheet 4b is preferably 5 μm or more and 200 μm or less. If the thickness of the adhesive sheet 4b is less than 5 μm, the adhesive portion between the package body 3 and the lid 4 (base 4a) cannot be sufficiently filled, and the airtightness may be insufficient. On the other hand, when the thickness of the adhesive sheet 4b exceeds 200 μm, the overall thickness of the hollow package 1 becomes excessively large, which is not preferable.

  Moreover, it is preferable that the adhesive sheet 4b has a melt viscosity of 10 kPa · s to 1000 kPa · s at 100 ° C. to 160 ° C. Specifically, it is preferable that the melt viscosity at any temperature of at least 100 ° C. to 160 ° C. is 10 kPa · s to 1000 kPa · s, and further melting at all temperatures in the range of 100 ° C. to 160 ° C. The viscosity is preferably 10 kPa · s or more and 1000 kPa · s or less.

  If the melt viscosity at 100 ° C. or higher and 160 ° C. or lower of the adhesive sheet 4b is within the above range, when the package body 3 and the lid 4 (base 4a) are bonded, these are obtained by heating and melting the adhesive sheet 4b. It is possible to sufficiently fill the gap between the adhesive portions, and to suppress internal and external contamination due to the bleeding of the adhesive sheet 4b. The melt viscosity can be measured with a flow tester (for example, Shimadzu Corporation, trade name: CFT-500, etc.) or a rotary melt viscometer (for example, Rhenometric Scientific).

  Furthermore, it is preferable that the adhesive sheet 4b has a tensile modulus after curing of 1 MPa to 1000 MPa. If the tensile modulus after curing of the adhesive sheet 4b is within the above range, when the package body 3 and the lid body 4 (base 4a) are bonded to form the electronic component 2, it will last for a long time regardless of environmental changes. The airtightness can be effectively maintained. The tensile elastic modulus is measured according to ASTM D-882, and is measured at a frequency of 1 Hz using, for example, DMS6100 manufactured by Seiko Instruments Inc.

  Such a base 4a and an adhesive sheet 4b are easily stacked and bonded together by heating and pressing (0 to 0.5 MPa) near the melting temperature of the adhesive sheet 4b using a roll or a press. The lid 4 can be obtained. At this time, the base 4a and the adhesive sheet 4b cut into final sizes may be bonded to form the lid 4, or the base 4a and the adhesive sheet 4b bonded may be final sizes. It is good also as a lid | cover body 4 cut | disconnected.

  On the other hand, the package body 3 is not particularly limited as long as it is mainly made of an insulating material, and a known hollow package can also be used. Specifically, it can be made of a ceramic material or a resin material or a fiber reinforced resin material obtained by reinforcing a resin material with fibers. As such a resin material and a fiber reinforced resin material, the same material as that constituting the base 4a of the lid 4 can be used. Further, the package body 3, specifically, the mounting portion 3a and the frame portion 3c may be formed integrally from the same material, for example, or may be formed separately from different materials, for example. It may be bonded later with a known adhesive sheet.

  Next, a method for manufacturing the electronic component 2 will be described.

FIG. 3 illustrates a method for manufacturing the electronic component 2.
In this manufacturing method, the hollow package 1 as described above is used, and first, element components 5 such as semiconductor elements and SAW elements are mounted and accommodated in the recesses of the package body 3 (accommodating step). On the package main body 3 in which the element component 5 is accommodated, the lid body 4 composed of the base body 4a and the adhesive sheet 4b is overlaid so that the adhesive sheet 4b side becomes the package main body 3 side.

  Thereafter, the entire hollow package 1 is subjected to, for example, a heat treatment at a temperature of 70 to 150 ° C. or a heat and pressure treatment with a pressure of 0.5 MPa or less using a press machine or a roll machine, and the adhesive sheet 4b. Is temporarily bonded to the package body 3 and the lid 4 (base 4a). Further, using an oven or the like, a heat curing process is performed at a temperature of 130 to 170 ° C. for 60 to 180 minutes, and the adhesive sheet 4b is completely cured to bond the package body 3 and the lid 4 (base 4a). The electronic component 2 is obtained (adhesion process).

  Thus, according to the hollow package 1 and the manufacturing method using the same according to the present invention, since the cover 4 is provided with the adhesive sheet 4b, the element part 5 is accommodated in the package body 3, and then the element The electronic component 2 can be easily manufactured by superimposing the lid body 4 on the package body 3 in which the component 5 is accommodated and performing heat treatment or the like.

  In particular, as the adhesive sheet 4b, a package made of a specific epoxy resin-based adhesive composition, and a sheet having a predetermined thickness, melt viscosity, and elastic modulus after curing can be used. Can be securely bonded and airtightness can be maintained, and adhesion unevenness and bleeding to the inside and outside can be suppressed.

  Thus, according to the hollow package 1 of the present invention and the manufacturing method using the same, the electronic component 2 in which the element component 5 is hermetically sealed can be easily manufactured. The SAW element can be suitably used for an element that needs to be accommodated in a hollow package.

  The SAW element as the element component 5 has, for example, a functional part such as an IDT electrode or a reflector formed on one main surface of the piezoelectric substrate, and a connection pad for connecting to the wiring part 3b of the package body 3. It is formed. Such a SAW element as the element component 5 is arranged in the recess of the package body 3 such that the main surface side on which the functional part and the connection pad are formed is the mounting part 3a side, and the connection pad is Ag. It is electrically connected and fixed to the wiring part 3b by the conductive adhesive 6 mainly composed of, for example.

4 to 6 illustrate another method for manufacturing the electronic component 2.
In this manufacturing method, a plurality of electronic components 2 in which the element components 5 are sealed are manufactured in a lump, and a package assembly in which the plurality of package bodies 3 are integrally formed in a planar shape. 13 (FIG. 4) and a lid forming material 14 (FIG. 5) in which a plurality of lids 4 as described above are integrally formed in a planar shape.

  As shown in FIG. 4, the package assembly 13 is such that a plurality of package main bodies 3 are integrally formed in a planar shape, and the element parts 5 are accommodated in the portions that become the package main bodies 3. Are formed, and portions to be the mounting portion 3a and the frame portion 3c are provided. Although not shown, the wiring portion 3b is formed in the mounting portion 3a.

  Such a package assembly 13 can be directly manufactured, for example, by molding a resin material or the like. Moreover, it can manufacture by forming the part used as the recessed part of each package main body 3 by giving a router process etc. with respect to the flat plate which consists of resin materials etc., for example. At this time, for molding, for example, the wiring part 3b may be formed by molding a wiring material together with a resin material, or the wiring part 3b may be formed after molding. Also good. Further, for example, for processing a flat plate, the wiring portion 3b may be formed on the flat plate before processing, or the wiring portion 3b may be formed after processing.

  Further, the package assembly 13 may be manufactured by bonding different flat plates made of a resin material or the like. For example, a plurality of holes are formed by router processing or punching on one flat plate made of resin material or the like. It may be manufactured by manufacturing a part formed with a part to be a plurality of frame parts 3c and bonding this to another flat plate to be a plurality of mounting parts 3a using a known adhesive sheet or the like. . For such a thing, for example, the wiring portion 3b may be formed on the other flat plate before bonding.

  The lid forming material 14 has the same configuration as the lid 4 except that the lid forming material 14 has the same size as the package assembly 13. For example, as shown in FIG. 5, a base material 14 a and one of the base materials 14 a And an adhesive sheet 14b bonded to the main surface.

  In this manufacturing method, first, as shown in FIG. 4, the element component 5 is mounted and accommodated in a portion of the package assembly 13 that becomes each package body 3 (accommodating step). As shown in FIG. 5, the package assembly material 13 in which the element component 5 is accommodated has a lid forming material 14 composed of a base material 14a and an adhesive sheet 14b, and the adhesive sheet 14b side becomes the package assembly material 13 side. And overlap.

  Thereafter, for example, using a press machine or a roll machine, the whole is subjected to a heat treatment at a temperature of 70 to 150 ° C. or a heat and pressure treatment with a pressure of 0.5 MPa or less to melt the adhesive sheet 4b. Thus, the package assembly 13 and the lid forming material 14 are temporarily bonded. Furthermore, using an oven or the like, a heat curing treatment is performed at a temperature of 130 to 170 ° C. for 60 to 180 minutes, and the adhesive sheet 14b is completely cured, whereby the package assembly material 13 and the lid forming material 14 (base material 14a) Are bonded to obtain an electronic component assembly 7 which is an assembly of the electronic components 2 (bonding step).

  Furthermore, a plurality of electronic components 2 can be obtained by cutting and separating the electronic component assembly 7 at a position as indicated by a wavy line in FIG. 5, that is, at an intermediate portion between adjacent electronic components 2 (cutting). Process).

  As shown in this manufacturing method, the package body 3 and the lid body 4 in the hollow package 1 of the present invention are integrated into the package assembly material 13 and the lid forming material 14 up to the cutting process which is the final stage of manufacturing the electronic component 2. May be formed. By using such package assembly material 13 and lid forming material 14, it is possible to easily and efficiently manufacture a large number of electronic components 2 in which the element components 5 are hermetically sealed.

  The method for manufacturing the electronic component 2 has been described above. For example, a lid forming material in which a plurality of previously separated package bodies 3 are used and a plurality of lid bodies 4 are integrally formed in a planar shape. 14 may be used for manufacturing.

  That is, the element parts 5 are accommodated in a plurality of package bodies 3 separated in advance, and the plurality of package bodies 3 that accommodate the element parts 5 are brought into contact with each other or are spaced slightly apart for cutting to be described later. Arrange in a shape.

  Then, a plurality of package bodies 3 arranged in a plane are overlaid with a lid forming material 14 having a size covering the entirety of the plurality of package bodies 3, and the plurality of package bodies 3 and the lids are covered as described above. The forming material 14 is temporarily bonded and permanently bonded to obtain an electronic component assembly 7 in which a plurality of electronic components 2 are connected by the lid forming material 14.

  Thereafter, a plurality of electronic components 2 can be obtained by cutting and separating the lid forming material 14 that connects the adjacent electronic components 2 in the electronic component assembly 7. In this way, even when the component constituting one of the hollow packages 1 is separated and the component constituting the other is integrated, a large number of elements in which the element component 5 is hermetically sealed The component 2 can be manufactured easily and efficiently.

Hereinafter, the present invention will be specifically described with reference to examples.
First, the adhesive sheet used for the Example of this invention is demonstrated.

(Adhesive sheet)
50 parts by mass of carboxy-containing acrylonitrile butadiene rubber (Nipol 1072, manufactured by Nippon Zeon Co., Ltd.), 34 parts by mass of bisphenol A type epoxy resin (Epicoat 1001, Japan Epoxy Resin Co., epoxy equivalent 475), phenol novolac resin (BRG-558, Showa) 7 parts by mass of Polymer Co., Ltd., 0.2 parts by mass of imidazole compound (2E4MZ: 2-ethyl-4-methylimidazole), 0.5 parts by mass of phenol-based anti-aging agent (Sumilyzer GM, manufactured by Sumitomo Chemical Co., Ltd.) 0.5 parts by mass of a sulfur-based anti-aging agent (Sumilyzer TP-D, manufactured by Sumitomo Chemical Co., Ltd.) and 5 parts by mass of aluminum hydroxide powder (Hijilite H42M, manufactured by Showa Denko KK) are dissolved in methyl ethyl ketone, and the solid content is 30 masses. % Epoxy resin adhesive composition solution (epoxy resin adhesive) Solution) was prepared.

  The thickness after drying the above-mentioned epoxy resin adhesive solution on a 110 μm thick release sheet obtained by laminating a 25 μm thick OPP (biaxially oriented polypropylene) film on both sides of a 60 μm thick fine paper. The epoxy resin was applied to 50 μm, dried by heating at 80 ° C. for 2 minutes and 120 ° C. for 5 minutes to remove the solvent, and the epoxy resin adhesive composition was semi-cured and rolled. A system adhesive sheet was obtained. Here, the melt viscosity at 140 ° C. of the adhesive sheet was 18 kPa · s. Moreover, the tensile elasticity modulus after hardening of the adhesive sheet 4b was 120 MPa.

Example 1
As a substrate constituting the lid of the hollow package, a commercially available glass epoxy laminate (TLB-551 manufactured by Kyocera Chemical Co., Ltd., thickness 0.2 mm) cut to 510 mm × 510 mm was prepared. The above-mentioned epoxy resin adhesive sheet is cut into the same size and overlapped, and a pressure of 0.5 MPa is applied at a temperature of 100 ° C. to bond both, and this is cut into 30 mm × 20 mm to form a hollow package. A lid was used.

  On the other hand, as a package body of the hollow package, a 30 mm × 20 mm epoxy resin molded product having a recess for accommodating element parts was prepared. After mounting the piezoelectric element in the recess of the package main body, the above-described lid body was overlapped so that the adhesive sheet side was the package main body side, and temporarily bonded by applying a pressure of 0.5 MPa at a temperature of 100 ° C. Furthermore, using an oven, a heat curing process was performed for 120 minutes at a temperature of 150 ° C., and a lid was adhered to the package body to produce an electronic component.

(Example 2)
Several electronic components were manufactured by batch processing. In other words, a commercially available glass epoxy laminate (TLB-551 manufactured by Kyocera Chemical Co., Ltd., thickness 0.2 mm) cut to 510 mm × 510 mm was prepared as a substrate constituting a lid forming material that is an assembly of lid bodies. The above-mentioned epoxy resin adhesive sheet is cut into the same size and overlapped therewith, and a pressure of 0.5 MPa is applied at a temperature of 100 ° C. to bond them together, and a lid forming material as an assembly of lid bodies is obtained. Manufactured.

  On the other hand, as a package assembly material which is an assembly of package bodies, a 510 mm × 510 mm epoxy resin molded product in which a total of 312 package bodies of 16 mm in length and 24 in width are connected in total was prepared. After mounting the piezoelectric element in each concave portion to be the package body, the above-described lid forming material was superposed so that the adhesive sheet side was the package assembly material side, and temporarily bonded by applying a pressure of 0.5 MPa at 100 ° C. . Furthermore, using an oven, a heat curing process was performed for 120 minutes at a temperature of 150 ° C., and the lid assembly was bonded to the package assembly to obtain an electronic component assembly as an assembly of a plurality of electronic components. Thereafter, the electronic component assembly was cut using a rotary cutting blade to produce a plurality of electronic components.

(Comparative Example 1)
As a lid of the hollow package, a commercially available glass epoxy laminate (TLB-551 manufactured by Kyocera Chemical Co., Ltd., thickness 0.2 mm) cut to 30 mm × 20 mm was prepared. On the other hand, as a package body of the hollow package, a 30 mm × 20 mm epoxy resin molded product having a recess for accommodating element parts was prepared. After mounting the piezoelectric element in the concave portion of the package body, an adhesive (2082c manufactured by ThreeBond Co., Ltd.) is applied to the edge of the package body on the lid side, the lid material is overlaid, and heat curing is performed at a temperature of 100 ° C. for 60 minutes. Processing was performed, and a lid was bonded to the package body to produce an electronic component.

  Next, the following characteristic evaluation was performed on the electronic components of Examples 1 and 2 and Comparative Example 1. The results are shown in Table 1.

[Inner seepage length]
For the electronic components of Examples 1 and 2 and Comparative Example 1, the length of the adhesive sheet or adhesive that oozed out from the end of the bonded portion between the package body and the lid was measured by microscopic observation.
[External bleeding length]
About the electronic component of Examples 1-2 and the comparative example 1, the length of the adhesive sheet or adhesive agent which exuded outside from the edge part of the adhesion part of a package main body and a cover body was measured by microscope observation.
[Heat-resistant]
For the electronic components of Examples 1 and 2 and Comparative Example 1, after performing a moisture absorption treatment for 192 hours at a temperature of 30 ° C. and a relative humidity of 60%, IR reflow at 240 ° C. was performed for 30 seconds, and in the electronic component (hollow package) The presence or absence of cracks was evaluated. The evaluation was performed for each of the electronic parts of each of the examples and comparative examples, and the evaluation was shown by the number of electronic parts in which cracks occurred.
[Moisture resistance]
About the electronic parts of Examples 1 and 2 and Comparative Example 1 in which a silicon chip (test element) having two aluminum wirings was mounted inside a hollow package, pressure was applied in saturated steam at 120 ° C. and 2.5 atm. A cooker test (PCT) was performed, and a disconnection due to corrosion of aluminum was evaluated as a short circuit failure and a current leak was evaluated as a leakage defect. In addition, each evaluation was performed 12 pieces about each electronic component of each Example and the comparative example, and was shown with the number of the electronic components which a defect generate | occur | produced.

  It was recognized that an electronic component in which an element component is sealed can be easily manufactured by bonding the package body and the lid of the hollow package with an adhesive sheet as in Examples 1 and 2. In particular, it was recognized that by using an adhesive sheet, a plurality of electronic components in which element components were sealed as in Example 2 could be manufactured together with high efficiency. In addition, it was confirmed that oozing out of the adhesive sheet into and out of the adhesive sheet can be suppressed, and the heat resistance and moisture resistance can be improved.

  DESCRIPTION OF SYMBOLS 1 ... Hollow package for electronic components, 2 ... Electronic components, 3 ... Package main body, 4 ... Cover body, 4a ... Base | substrate, 4b ... Adhesive sheet, 5 ... Electronic components, 7 ... Electronic component assembly, 13 ... Package assembly material, 14 ... Lid forming material, 14a ... Base, 14b ... Adhesive sheet

Claims (12)

A hollow package for an electronic component having a package body having a recess for housing element components and a plate-like lid for sealing the recess,
The said lid is a hollow package for electronic components characterized by having a base | substrate and the adhesive sheet adhere | attached on one main surface of the said base | substrate. In the hollow package for electronic components according to claim 1,
The package main body is made of a ceramic material, a resin material, or a glass fiber reinforced resin material obtained by reinforcing a resin material with glass fibers. In the hollow package for electronic components according to claim 1 or 2,
The base of the lid is made of a glass fiber reinforced resin material obtained by reinforcing a resin material with glass fibers, and the adhesive sheet of the lid is made of an epoxy resin adhesive composition mainly composed of an epoxy resin. A hollow package for electronic parts. In the hollow package for electronic components according to claim 3,
The epoxy resin-based adhesive composition contains (B1) an epoxy resin, (B2) an epoxy resin curing agent, (B3) an epoxy resin curing accelerator, and (B4) an elastomer as an essential component. Hollow package for electronic parts. In the hollow package for electronic components of any one of Claims 1 thru | or 4,
The adhesive sheet has a melt viscosity at 100 ° C. to 160 ° C. of 10 kPa · s to 1000 kPa · s. In the hollow package for electronic components of any one of Claims 1 thru | or 4,
The adhesive sheet is a hollow package for electronic parts, wherein the tensile modulus after curing is 1 MPa or more and 1000 MPa or less. An adhesive sheet made of a thermosetting resin,
Adhesion between the package body and the base body of a hollow package for electronic parts comprising a package body having a recess for housing element parts and a lid body having a plate-like base for sealing the recess of the package body An adhesive sheet for a hollow package for electronic parts, characterized by being used. A lid body in a hollow package for electronic components comprising a package body having a recess for storing element parts and a plate-like lid body for sealing the recess,
A lid for a hollow package for electronic parts, comprising: a base; and an adhesive sheet bonded to one main surface of the base. An accommodating step of accommodating the element component in the recess of the package body having a recess for accommodating the element component;
An electronic component is obtained by overlaying and bonding a lid having a base and an adhesive sheet bonded to one main surface of the base on the package body such that the adhesive sheet side is the package body side An electronic component manufacturing method comprising: an adhesion step. An accommodating step of accommodating element components in the recesses of the package assembly in which a plurality of package bodies having recesses for accommodating element components are integrally formed in a planar shape;
A lid forming material having a base and an adhesive sheet bonded to one main surface of the base, and having the same size as the package assembly, such that the adhesive sheet side is the package assembly side An adhesion step of obtaining an electronic component assembly by overlapping and adhering to the package assembly;
And a cutting step of cutting the electronic component assembly to obtain a plurality of electronic components. In the manufacturing method of the electronic component of Claim 10,
The method for manufacturing an electronic component, wherein the package assembly is made of a resin material or a glass fiber reinforced resin material obtained by reinforcing a resin material with glass fibers. A housing step of housing the element components in the recesses of the plurality of package bodies having a recess for housing the element components, and disposing the package body close to a plane;
A lid forming material having a base and an adhesive sheet bonded to one main surface of the base, and covering the entirety of a plurality of package bodies arranged close to the planar shape, An adhesion step of obtaining an electronic component assembly by overlapping and adhering to the plurality of package bodies such that the sheet side becomes the plurality of package body sides;
A cutting step of cutting the lid forming material connecting adjacent electronic components in the electronic component assembly to obtain a plurality of electronic components.

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