JP2010075824A - Device and nozzle for liquid coating - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To coat only a limited part, evading a specified part, with a liquid of a resin or the like in a uniform thickness. <P>SOLUTION: A liquid coating device has a coating nozzle 5 provided with a surface 54 facing an object to be attached, a projected wall 55, and a liquid discharge hole. The projected wall 55 is projected at a fixed height H from the position of surrounding a non-coatable region R2 of the surface facing the object to be attached, and a projected end face 55A is abutted to the object to be attached. The liquid discharge hole is formed in the coating region R1 of the surface 54 facing the object to be attached, which is separated from the non-coatable region R2 by the projected wall 55. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a liquid application apparatus for uniformly applying a liquid having adhesiveness or high viscosity to a part of a surface of an application target, and a liquid application nozzle that can be suitably used for the liquid application apparatus.

  In manufacturing an electronic component, there is a step of uniformly applying a liquid material such as an adhesive to a specific surface of the electronic component.

  For such applications, application nozzles having liquid discharge holes are used (see, for example, Patent Documents 1 to 5).

  The coating nozzle described in Patent Document 1 has a discharge surface having a plurality of adhesive discharge holes, and a protrusion that is detachable from the nozzle and biased by a spring around the discharge surface.

  The application nozzles described in Patent Documents 2 to 4 are common to the application nozzle described in Patent Document 1 in that a discharge surface having a plurality of adhesive discharge holes and a protrusion around the discharge surface are provided. However, the protrusion of the application nozzle described in Patent Documents 2 to 4 is a fixed support member having a tip at a height different from the discharge surface. Therefore, the protrusion does not move so as to freely move out of the discharge surface, and the height difference from the discharge surface is constant. Note that Patent Document 4 has an adhesive discharge hole on the bottom surface of the recess, and the expression thereof is different from those described in Patent Documents 2 and 3. However, the nozzle structure of Patent Document 4 is not much different from the nozzle structures described in Patent Documents 2 and 3 that “the discharge surface and the periphery thereof have protrusions”.

In the coating nozzle described in Patent Document 5, the discharge pipe protrudes from the adherend facing surface, and a support having a higher height from the adherend facing surface is provided around the discharge pipe.
JP 11-76869 A JP 2002-9232 A Japanese Patent Laid-Open No. 01-249163 Japanese Patent Laid-Open No. 06-236900 Japanese Patent Laid-Open No. 06-91215

  In any of the coating nozzles described in Patent Documents 1 to 5, it is impossible to apply the resin with a uniform thickness only to a limited portion while avoiding a specific portion.

  The present invention is to provide a liquid coating apparatus that applies a liquid such as a resin with a uniform thickness only to a limited portion while avoiding a specific portion. Moreover, this invention is for providing the liquid application nozzle suitable for the said liquid application apparatus.

The liquid application apparatus according to the present invention includes an application nozzle having an adherend facing surface, a projecting wall portion, and a liquid discharge hole.
The protruding wall portion protrudes at a certain height from a position surrounding a partial region of the adherend facing surface, and the protruding end surface is abutted against the adherend.
The liquid discharge hole is formed in another region of the adherend facing surface separated from the partial region by the protruding wall portion.

The application nozzle having the above configuration is abutted against the surface of the adherend to which the liquid is to be applied. At this time, the protruding end surface of the protruding wall portion abuts the adherend. The projecting wall portion is disposed so as to surround a part (partial region) of the surface of the coating nozzle on which the projection nozzle is provided. Therefore, when the protruding end surface of the projecting wall portion is abutted against the adherend, the projecting wall portion functions to partition a space whose thickness is the height of the projecting wall portion.
Liquid is discharged onto the surface of the adherend from liquid discharge holes provided in another part (other area) of the adherend-corresponding surface. Since the space from which the resin is discharged is a space other than the space surrounded by the protruding wall portion, only one of the spaces is filled with the liquid. At this time, the height of the protruding wall portion substantially determines the thickness of the filled liquid. The protruding wall portion prevents liquid from entering the other space (partial region side).

Preferably, in the present invention, the plurality of liquid discharge holes are regularly arranged in the other region of the adherend-facing surface, and the liquid is disposed on the far side compared to the side of the other region near the projecting wall. The arrangement density of the discharge holes is large.
Alternatively, preferably, a plurality of the liquid discharge holes are regularly arranged in the other region of the surface facing the adherend, and the liquid discharge holes are farther on the far side than the side of the other region close to the protruding wall portion. The diameter of is large.

  According to this preferred configuration, since the liquid filling density is high on the side farther from the projecting wall portion, even if the liquid reaches the projecting wall portion, the internal pressure of the liquid in that portion is low, and from the abutting gap No liquid leaks.

In the present invention, it preferably has a temperature adjustment jacket for adjusting the temperature of the coating nozzle.
More preferably, the application nozzle includes an application part 5B having the adherend facing surface and the protruding wall part, and an internal space that is formed of a heat transfer material together with the application part and accumulates a certain amount of liquid, The liquid in the internal space has a noise main body whose temperature is adjusted by the temperature control jacket, and a liquid introduction portion formed of a material having a lower thermal conductivity than the heat transfer material.

According to this preferred configuration, even when the viscosity at room temperature varies depending on the type of liquid, the temperature adjustment jacket adjusts the liquid temperature to adjust the liquid viscosity to be suitable for application. For example, if the extrusion pressure is made constant, temperature adjustment by a temperature adjustment jacket is performed so that the viscosity is uniform even if the type of liquid changes.
During this temperature adjustment, the nozzle body for storing a certain amount of liquid is insulated from the liquid supply side, so the temperature adjustment speed and accuracy are high.

  The liquid application nozzle according to the present invention protrudes at a certain height from a position surrounding an adherend-facing surface and a partial region of the adherend-facing surface, and a protruding wall portion whose protruding end surface is abutted against the adherend, A liquid ejection hole formed in another region of the surface facing the adherend, separated from the partial region by the protruding wall portion.

  ADVANTAGE OF THE INVENTION According to this invention, the liquid application apparatus which can apply | coat liquids, such as resin, with a uniform thickness only in the location limited avoiding a specific location can be provided. Moreover, according to this invention, the liquid application nozzle which can be used conveniently for such a liquid application apparatus can be provided.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings, taking as an example a resin coating apparatus for adhesive resin used when assembling an electronic component having a daylighting window such as an image sensor.

FIG. 1A shows an overall configuration of a resin coating apparatus according to the present embodiment. FIG. 1B is an enlarged view of a main part.
A resin coating device 1 illustrated in FIG. 1A includes a device main body 2, a component fixing portion 3 provided on the upper surface of the device main body 2, and a resin injection portion (hereinafter referred to as a syringe 4).

  As shown in FIG. 1 (B), the syringe 4 is provided around a longitudinally long cylindrical syringe body 41, an application nozzle 5 attached to the tip (lower end) of the syringe body 41, and the application nozzle 5. Temperature control jacket 42. The application nozzle 5 corresponds to an example of “liquid application nozzle”.

As shown in FIG. 1A, an air hose 44 is attached to the upper portion of the syringe body 41 via a socket portion 43. The syringe 4 has a role of pushing out the liquid (resin) stored therein from the application nozzle 5 by the air that is sent, like a large syringe. The air hose 44 is a tube that supplies an inert gas or dry air. The socket part 43 or the syringe body 41 has a function of adjusting the air pressure.
The raw material resin is supplied as a lump into the syringe body 41, and when almost used up, a new raw material is supplied. Alternatively, the raw material may be supplied to the syringe 4 in a necessary amount in a state where the viscosity is lowered at a high temperature.

The apparatus main body 2 is a base that supports the component fixing unit 3 and the syringe 4, and incorporates power, a control unit, and the like.
The syringe 4 is supported by a standing part 21 fixed to the upper surface of the apparatus main body 2 and a support part 22 extending laterally from the standing part 21. The standing portion 21 includes a power mechanism that moves the syringe 4 in the vertical direction (Z direction) together with the support portion 22.

The component fixing unit 3 has an adherend 100 such as an electronic component fixed to the upper surface thereof. The part fixing part 3 is formed so that a part or the whole of the part fixing part 3 can be replaced in accordance with the outer shape of the adherend 100. Hereinafter, it is assumed that the adherend 100 is a cap of a package that accommodates a chip of a solid-state imaging device.
The application nozzle 5 limits the application range according to the outer shape of the adherend 100, particularly the shape of the resin application surface. Therefore, when the type of the adherend 100 changes, the coating nozzle 5 can also be replaced with a dedicated one for the adherend 100.
Hereinafter, the shape, material, and the like of the application nozzle 5 which are one of the major features of the present embodiment will be described in detail with reference to the drawings.

FIG. 2 shows a bottom view ((A)), a side sectional structure diagram ((B)), and a partially enlarged view ((C)) of the end portion of the application nozzle 5.
The application nozzle 5 is an assembly of three parts. These three parts are the nozzle body 5A, the application part 5B fixed to the lower end of the nozzle body 5A (left side of FIG. 2B), and the upper end of the nozzle body 5A (right side of FIG. 2B). This is a fixed resin introduction part 5C.

The nozzle body 5A is made of a heat transfer material having high thermal conductivity, high wear resistance, and high corrosion resistance, such as SUS420J2 (JIS standard). An application site 5B is formed at the tip (lower end) of the nozzle body 5A. The application site 5B may be integrally formed from the same material as the nozzle body 5A. In this case, the number of parts forming the application nozzle 5 is two points.
As shown in FIG. 1B, the nozzle body 5A is surrounded by the temperature control jacket 42 in the body rotation direction of the nozzle body 5A when the syringe is mounted. For this reason, the temperature of the nozzle body 5A and the inside thereof is precisely controlled by the temperature control jacket 42 and maintained at a constant temperature. Part of the application site 5B is also housed in the temperature control jacket 42, but the tip of the application site 5B protrudes downward from the edge of the temperature control jacket 42.
As described above, the nozzle main body 5A and the application portion 5B are made of the above-described metal, and thus transmit the heat of the temperature control jacket 42 well.

On the other hand, the resin introducing portion 5C is made of a plastic such as PEEK (polyether ether ketone) resin having high heat resistance and low thermal conductivity. The PEEK resin has the highest heat resistance (around 200 [° C.]) as a thermoplastic resin that can be injection-molded.
The resin introduction part 5C corresponds to an example of “liquid introduction part”. The reason why the resin introduction portion 5C is made of resin in this way is that the liquid introduction portion is formed from a material having a lower thermal conductivity than the heat transfer material that is the material of the nozzle body 5A. Therefore, as long as the material satisfies this requirement, the resin introduction portion 5C is not limited to resin and may be any material.
Thereby, the resin introduction part 5C is thermally insulated, and the holding heat of the nozzle body 5A is prevented from being dispersed from the resin introduction part 5C. As a result, the temperature of the nozzle body 5A can be controlled efficiently and with high accuracy, and the viscosity of the internal resin can be kept constant.

  The syringe body 41 is made of a general resin and has low heat resistance (heat resistant temperature: about 40 ° C.). Therefore, there is also an intention that the resin introduction part 5C that connects the syringe body 41 and the nozzle body 5A is formed from a high heat-resistant resin such as PEEK resin.

As shown in FIG. 2B, the application site 5B has an intermediate step 51 that is slightly smaller than the outer diameter of the nozzle body 5A, and a tip step 52 that has a smaller outer diameter. An internal space (resin storage portion 53) serving as a “resin reservoir” is formed from the inside of the intermediate step portion 51 to the nozzle body 5A.
The protruding end surface of the tip step portion 52 is an “adhering object facing surface 54” having a shape matching the resin application surface of the adherend 100 (FIG. 1).
As shown in FIG. 2A, the adherend facing surface 54 has a rectangular outer shape in a pattern viewed from the lower surface. In FIG. 2A, a hatched area is referred to as “application area R1”, and a smaller rectangular area not hatched is referred to as “application non-application area R2”. The adherend facing surface 54 has these two regions. Here, the unapplicable region R2 corresponds to an example of “a partial region of the adherend facing surface”, and the application region R1 corresponds to an example of “another region of the adherend facing surface”.

The application region R1 and the non-application region R2 are partitioned by a protruding wall portion 55 protruding from the adherend facing surface 54 (application region R1 thereof).
As shown in FIG. 2A, the protruding wall 55 is a flat surface having a protruding end surface 55A (see an enlarged view of FIG. 2C) having a rectangular frame shape. When the flat surface is abutted against the adherend 100, a thin space having a thickness corresponding to the height H of the projecting wall 55 is formed outside the projecting wall 55, that is, along the application region R1. The This thin space becomes a resin filling space.

On the other hand, on the inner side of the projecting wall portion 55, that is, on the side of the unapplicable region R2, a deep recess 55B having the unapplicable region R2 as a bottom surface is formed. For this reason, this deep inner space is not filled with the resin because the protruding wall portion 55 interferes.
Thus, the projecting wall 55 serves as an abutting portion for the adherend 100, a resin application thickness limiting portion, and a resin application range limiting wall.

  FIG. 3A and FIG. 3B show examples of specific dimensions of the application nozzle 5. The unit of the numbers shown in FIG. 3 is [mm]. Moreover, the height H of the protruding wall portion 55 shown in FIG. 2C is usually several tens [μm], for example, about 40 to 50 [μm].

FIG. 4 shows a cap of the solid-state imaging device after the resin is applied as the adherend 100.
In FIG. 4, the portions corresponding to the adherend facing surface 54 in FIGS. 2A and 3A are marked on the surfaces corresponding to “application region R1” and “non-application region R2”. Is attached in parentheses. The hatched lines in FIG. 4 represent the resin applied to the surface corresponding to the application region R1.

Comparing FIG. 4 with FIG. 2 (A) or FIG. 3 (A), the coating region R1, the surface of the adherend 100 corresponding to the coating region R1, the non-coating region R2, and the non-coating region R2 It can be seen that the corresponding surface of the adherend 100 is mirror symmetric.
The shape of the adherend facing surface 54 of the coating nozzle 5, more specifically, the surface of the adherend 100 corresponding to the unapplicable region R <b> 2 surrounded by the protruding wall portion 55 is not coated with resin. On the other hand, resin is applied to the surface of the adherend 100 corresponding to the region (application region R1) outside the protruding wall portion 55.
As described above, it can be easily understood from the comparison between FIG. 4 and FIG. 2 that the shape of the end face of the application nozzle 5 is transferred to define the resin application range of the adherend 100. It can also be easily seen that the projecting wall 55 plays a role of limiting the resin application range.

FIG. 5A shows a detailed plan view (bottom view) of the adherend facing surface 54.
As shown in FIG. 5A, in the application region R1 of the adherend facing surface 54, a large number of resin discharge holes 56 are formed as “liquid discharge holes”.
Here, three more regions are defined in the application region R1. A frame region having a constant width located in the vicinity of the protruding wall portion 55 is referred to as a “wall peripheral region R10”, and the resin discharge hole 56 is not formed there. The frame region outside the wall peripheral region R10 is referred to as “inner region R11”, and the outer frame region is referred to as “outer region R12”. A large number of resin discharge holes 56 of the same size are formed in the inner region R11 and the outer region R12. In FIG. 5A, in order to clarify the distinction between the regions, the resin discharge holes 56 in the inner region R11 are indicated by black circles, and the resin discharge holes 56 in the outer region R12 are indicated by white circles. The same thing. The resin discharge hole 56 communicates with the resin storage unit 53 shown in FIG. 2B, and the resin is pushed out from the resin discharge hole 56 when pressure is applied to the resin in the resin storage unit 53.

FIG. 5B1 shows the resin discharge hole 56 in an enlarged manner.
The diameter of the resin discharge hole 56 is, for example, φ (meaning diameter) 0.14 [mm]. When a certain amount of pressure is applied to the resin stored at a certain temperature, the resin is extruded and spreads within a range of φ0.15 [mm] by a broken line in FIG. 5 (B1). The diameter of the range in which the resin is extruded can be arbitrarily controlled by applying a pressure corresponding to the viscosity of the resin.
For this reason, the arrangement density of the resin discharge holes 56 is optimized according to the assumed resin type, viscosity, and pressure.

FIG. 5B2 shows a hole arrangement pattern of the inner region R11, and FIG. 5B3 shows a hole arrangement pattern of the outer region R12.
From FIG. 5 (B2) and FIG. 5 (B3), the hole arrangement pattern is different between the inner region R11 and the outer region R12. In the inner region R11, resin discharge holes 56 are arranged in a lattice arrangement, and in the outer region R12, resin discharge holes 56 are arranged in a staggered arrangement (check shape).

For example, the hole pitch A in the X direction and the Y direction of the inner region R11 is 0.28 [mm]. Then, the hole pitch component in the X direction of the outer region R12 is half that of 0.14 [mm]. At this time, the hole pitch component in the Y direction of the outer region R12 is 0.28 [mm], which is the same as that of the outer region R12. However, the hole pitch of the staggered arrangement is narrower than that of the lattice arrangement, and the value (hole pitch B) is about 0.24 [mm].
When the two hole pitches are compared, A> B is established, and the arrangement density of the resin discharge holes 56 in the outer region R12 is larger than the arrangement density of the resin discharge holes 56 in the inner region R11. Further, the resin discharge hole 56 is not formed in the wall peripheral region R10.

From the above, in the application region R1, the arrangement density of the resin discharge holes 56 is larger on the far side than on the side closer to the protruding wall portion 55.
For this reason, the resin is supplied in a sparse state toward the inside closer to the non-applicable region R2, and the resin is supplied in a denser state toward the outer side farther from the non-applicable region R2 and the application area spreads radially. Thereby, the resin can be supplied without excess or deficiency.

FIG. 6A shows a state of resin supply by a schematic cross-sectional view in a state where the application nozzle 5 and the adherend 100 are in contact with each other.
As shown in FIG. 6A, a daylighting window is opened on the adherend 100 side facing the non-application region R2, and the daylighting window is closed with a transparent member 101. The outer frame member 102 of the daylighting window has a recess on the side facing the application nozzle 5. The protruding wall portion 55 of the coating nozzle 5 is abutted against the edge portion of the bottom surface of the concave portion near the lighting window. In the state where the protruding wall portion 55 is abutted, a space having an L-shaped cross section is formed from the bottom surface of the recess to the side wall of the recess.

Resin (hereinafter referred to as “Res.”) Is stored in the resin storage portion 53 and formed in the application region R1 through a thin tube passing through the intermediate step portion 51 and the tip step portion 52 according to pressure. A large number of the resin discharge holes 56 are discharged into the L-shaped space. The discharged resin Res. Expands in the space according to the pressure applied from the inside of the coating nozzle 5.
At this time, the resin Res. That reaches the protruding wall portion 55 in particular due to the difference in arrangement density of the resin discharge holes 56 shown in FIG. Is not so large, and the side surface of the protruding wall 55 is made of resin Res. Is not pushed inward by For this reason, even if there is a slight gap between the protruding end surface 55A (see FIG. 2C) of the protruding wall portion 55 and the adherend 100, the resin Res. The risk of leakage is reduced.

On the other hand, since the arrangement density of the resin discharge holes 56 is high in the outer portion of the L-shaped space, the excess resin Res. However, it rises along the side wall of the recessed part formed in the transparent member 101 of the adherend 100, and fills the L-shaped space.
Resin Res. Since the viscosity and pressure are precisely controlled according to the type of the resin, the resin Res. Will not protrude. However, if the resin Res. Even if it protrudes into a burr shape, the burr can be easily removed by polishing the upper surface of the outer frame member 102.
On the other hand, the concave side wall of the L-shaped space is made of resin Res. The structure that crawls up and escapes to the outside is an effective structure in that no resin pressure is applied to the projecting wall 55 side.
The above is the advantage that “the adherend facing surface 54 is the upper surface of the step (tip stepped portion 52) formed in the coating nozzle”.
In this way, the resin Res. Is applied to the peripheral wall surface.

  In the application of such a resin, the size of the space through which the resin is pushed out onto the adherend 100 and the pressure at which the resin is pushed out are important. However, even if the pressure is constant, uniform application of resin is impossible if the load pressure and the force to push back vary.

In order to make the liquid application apparatus versatile, the fixed header (component fixing portion 3 in FIG. 1A) is replaced according to the adherend 100, and the liquid application apparatus is adapted to the shape of the application surface of the adherend 100. It is necessary to replace the coating nozzle 5 having a different shape.
Moreover, it is necessary to be able to apply different types of resins even when the adherend 100 is the same.

  However, if the type of resin is different, even if the resin is extruded at the same pressure due to the difference in viscosity at room temperature, the amount of resin extruded in a certain time varies. As a result, it is difficult to uniformly apply resins having different types of resin, in particular, different viscosities.

  In particular, in the application of a resin having a high viscosity, after the resin is extruded onto the adherend 100, the mold release from the nozzle is poor at the edge of the resin in the process of separating the tip surface of the application nozzle 5 from the adherend 100. There is. In this case, “string drawing” occurs in which the resin pulls the tail like a string. When "string drawing" occurs, it takes time to repair by trimming. In addition, “threading” is a factor that produces non-standard products such as unevenness in the resin coating thickness, and also causes generation of dust. In addition, the possibility of adversely affecting the product characteristics depending on the degree of “stringing” cannot be denied.

The resin coating apparatus 1 of the present embodiment is configured so that uniform coating is possible even when the viscosity of the resin is different, and the occurrence of “string drawing” can be prevented.
Specifically, the resin coating apparatus 1 of this embodiment can strictly control the resin temperature at the time of extrusion by the temperature control jacket 42.
Thereby, even if it is high viscosity resin, it becomes possible to make resin low viscosity by heating the nozzle main body 5A. The resin whose viscosity has been lowered can prevent the occurrence of unevenness in the coating thickness due to the occurrence of “string drawing” when the application site 5B is pulled away from the adherend 100.
In addition, a resin that does not spread wet with high viscosity can be reduced in viscosity by heating in the same manner, so that wettability can be improved and spread easily.

FIG. 7A is a graph showing the relationship between temperature and viscosity for two resins (resin A and resin B). FIG. 7B is raw data of the viscosity of the resin A.
It can be seen that the viscosity of any resin decreases as the temperature increases. Also, the viscosity varies at the same temperature depending on the type of resin.
As described above, since the temperature and the viscosity are different depending on the kind of the resin, it is necessary to strictly control the temperature according to the resin to be used.

For example, in the case of a resin having a viscosity of 3000 [mPa · sec], a case where the resin is discharged from a resin discharge hole 56 having a hole diameter of φ0.14 [mm] arranged as shown in FIG. At this time, the thickness of the L-shaped space formed between the adherend 100 and the application nozzle 5 when the protruding wall 55 is abutted reflects the height H of the protruding wall 55. It is assumed that it is 0.04 [mm]. In this case, the resin is uniformly applied in the range of φ0.15 [mm] as shown in FIG. 5 (B1) by controlling the application time and application pressure of the resin having a viscosity of 3000 [mPa · sec]. be able to.
As a result, the inner region R11 of the application region R1 is filled with resin without excess and deficiency, and the gap between the wall peripheral regions R10 is filled with resin without excess and deficiency. Further, surplus is generated in the resin in the outer region R12, and the distance from the adherend 100 is limited, so that it spreads outward.
Thereby, the resin reaches the peripheral wall surface portion, and the resin can be uniformly applied to the L-shaped surface of the adherend 100.

<Modification 1>
The liquid coating apparatus is not limited to an apparatus for applying an adhesive resin to a cap of an electronic component having a daylighting window. The present invention is widely applicable to the manufacture of products that require application of a liquid.
For example, it can be applied to uses other than adhesion, such as application of a sealing resin and application of a protective film. The non-application area is not limited to the daylighting window, but may be an area where it is simply desired to prevent the resin from wrapping around for an overview or other reasons. In addition, since a low-viscosity liquid cannot be applied, a liquid having a certain degree of viscosity is applied, but the liquid is not necessarily a resin. For example, the liquid application apparatus of this embodiment can be used for application of a conductive paste that also serves as an electrical connection.
Further, the adherend is not an electronic component, and may be a toy, a decoration, or any other thing.

<Modification 2>
In the case of a low-viscosity resin, the nozzle body 5A is cooled with a temperature control jacket with a cooling function using the Peltier effect, so that the viscosity can be increased and the coating can be performed.
If the temperature control jacket has both the function of heating and cooling, the range of resin that can be used is expanded, and the versatility of the resin coating apparatus 1 is further enhanced.

<Modification 3>
In the above-described embodiment, the arrangement density of the resin discharge holes is changed in three stages of no hole, small hole density, and high hole density as the distance from the protruding wall portion side of the adherend facing surface increases.
The change in the arrangement density of the resin discharge holes may be performed in a stepwise manner so that the arrangement density gradually increases toward the outside. Further, the pore density may be changed in two steps, four steps or more other than the three steps.

<Modification 4>
The difference in the resin supply capability on the surface facing the adherend may be realized not by the hole density but by the difference in the resin passage resistance of the resin passage to the resin discharge hole 56, assuming that the hole density is constant.
When the size is changed, “the diameter of the resin discharge hole 56 is larger on the far side of the application region R1 on the adherend facing surface than the side near the protruding wall portion 55”.

In the embodiment described above, a resin such as an adhesive is applied to a limited region such as a cap when the solid-state imaging device chip is sealed in a package. At this time, if the resin (adhesive) protrudes from the daylighting window, the optical characteristics are adversely affected, and such protrusion of the resin to the inside must be strictly prevented.
In the present embodiment, it is possible to apply the resin to such an adherend 100 up to a wide range of planes and wall surfaces perpendicular to the planes, avoiding the non-applicable region R2.

The coating nozzle 5 is provided with a projecting wall portion 55, and when the coating nozzle 5 is abutted against the flat surface of the adherend 100, a thin coating layer having the same height as or less than the height of the projecting wall portion 55 is formed. Is possible.
Further, on the adherend facing surface 54 of the application nozzle 5, a large number of minute holes (resin discharge holes 56) are opened in the application region R1 such as several hundreds. For this reason, it is possible to apply the resin in a batch on a specific portion of the adherend 100 as if it were transferred by a transfer pin.
The projecting wall portion 55 also has a function of preventing the resin from entering the unapplicable region R2 during the application.

  The nozzle main body 5A that mainly stores the resin is made of metal, and the temperature of the resin is strictly adjusted by covering the temperature control jacket 42. In order to improve the controllability of the temperature to the nozzle body 5A by the temperature adjustment jacket 42, the resin introduction part 5C connecting the nozzle body 5A and the syringe body 41 is made of a high heat resistance plastic. For this reason, heat insulation is performed so as not to transmit heat to the syringe that is vulnerable to heat, and temperature controllability by the temperature control jacket 42 is improved.

  By using the resin coating apparatus 1 of this embodiment, the temperature controllability of the resin is high, the resin can be uniformly applied all at once, and the occurrence of burrs and the like can be prevented, thereby reducing the tact time in the manufacturing process. Therefore, the manufacturing cost can be reduced accordingly.

(A) is the whole block diagram of the resin coating apparatus 1 in connection with embodiment. (B) is the principal part enlarged view of (A). (A) is a bottom view of the application nozzle 5 according to the embodiment. FIG. 2B is a side sectional view of the application nozzle 5. (C) is a partially enlarged view of the end of the application nozzle 5. (A) and (B) are dimensional diagrams corresponding to FIGS. 2 (A) and 2 (B). It is a general-view figure of the cap of the solid-state imaging device after resin is applied, and shows the example of adherend 100. (A) is a detailed plan view (bottom view) of the adherend facing surface 54. (B1)-(B3) are the principal part enlarged views for showing the dimension of (A). (A) is typical sectional drawing of the application nozzle 5 and the to-be-adhered body 100 which show the mode of resin supply. (B) is a top view which shows the application | coating range of resin. (A) is a graph which shows the relationship between temperature and viscosity. (B) is a data value chart showing the temperature dependence of the viscosity of resin A.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Resin coating device, 4 ... Syringe, 41 ... Syringe main body, 42 ... Temperature control jacket, 43 ... Socket part, 44 ... Air hose, 5 ... Application nozzle, 5A ... Nozzle main body, 5B ... Application | coating part, 5C ... Resin introduction part , 51 ... Intermediate step part, 52 ... Tip step part, 53 ... Resin storage part, 54 ... Adhering surface, 55 ... Projection wall part, 55A ... Projection end face, 55B ... Recess, 56 ... Resin discharge hole, 100 ... Substrate, 101 ... transparent member, 102 ... outer frame member, R1 ... application region, R10 ... wall peripheral region, R11 ... inner region, R12 ... outer region, R2 ... non-application region

Claims (10)

Having a coating nozzle,
The application nozzle is
An adherend facing surface;
A protruding wall portion that protrudes at a certain height from a position surrounding a partial region of the adherend-facing surface, and the protruding end surface is abutted against the adherend;
A liquid ejection hole formed in another region of the surface facing the adherend, separated from the partial region by the protruding wall portion;
A liquid coating apparatus. A plurality of the liquid discharge holes are regularly arranged in the other region of the adherend facing surface,
The liquid coating apparatus according to claim 1, wherein the arrangement density of the liquid ejection holes is greater on a far side than on a side of the other region that is closer to the protruding wall portion. A plurality of the liquid discharge holes are regularly arranged in the other region of the adherend facing surface,
The liquid coating apparatus according to claim 1, wherein a diameter of the liquid discharge hole is larger on a far side than on a side of the other region close to the projecting wall portion. The liquid coating apparatus according to claim 1, wherein the surface to be adhered is an upper surface of a step formed in the coating nozzle. The liquid application apparatus according to claim 1, further comprising a temperature adjustment jacket that adjusts a temperature of the application nozzle. The application nozzle is
An application site having the adherend facing surface and the protruding wall;
A noise body that is formed of a heat transfer material together with the application site, has an internal space in which a certain amount of liquid is accumulated, and the temperature of the liquid in the internal space is adjusted by the temperature control jacket;
A liquid inlet formed from a material having a lower thermal conductivity than the heat transfer material;
The liquid coating apparatus according to claim 5, comprising: An adherend facing surface;
A protruding wall portion that protrudes at a certain height from a position surrounding a partial region of the adherend-facing surface, and the protruding end surface is abutted against the adherend;
A liquid ejection hole formed in another region of the surface facing the adherend, separated from the partial region by the protruding wall portion;
A liquid application nozzle. A number of the liquid discharge holes are regularly arranged in the other region of the adherend facing surface,
The liquid application nozzle according to claim 7, wherein the disposition density of the liquid discharge holes is greater on a far side than on a side of the other region that is closer to the protruding wall portion. A plurality of the liquid discharge holes are regularly arranged in the other region of the adherend facing surface,
The liquid application nozzle according to claim 7, wherein a diameter of the liquid discharge hole is larger on a far side than a side near the projecting wall portion of the other region. The liquid application nozzle according to claim 7, wherein the adherend facing surface is an upper surface of a step formed in the nozzle body.

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