JP2010034400A - Electronic apparatus - Google Patents

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JP2010034400A
JP2010034400A JP2008196409A JP2008196409A JP2010034400A JP 2010034400 A JP2010034400 A JP 2010034400A JP 2008196409 A JP2008196409 A JP 2008196409A JP 2008196409 A JP2008196409 A JP 2008196409A JP 2010034400 A JP2010034400 A JP 2010034400A
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electrolytic capacitor
case
cap
wall portion
hole
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JP5156526B2 (en
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Toshifumi Okano
俊史 岡野
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Shindengen Electric Manufacturing Co Ltd
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Shindengen Electric Manufacturing Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To normally operate an explosion-proof valve while preventing moisture or dust from contacting an electrolytic capacitor, in an electronic apparatus having structure where a circuit board with an electrolytic capacitor having an explosion-proof valve mounted thereon is arranged in a case, and a resin is filled in the case. <P>SOLUTION: In this electronic apparatus 1, a through-hole 23 making the internal region of a case 7 communicate with the outside is formed on the case 7 to face the other end face 5b of the electrolytic capacitor 5 with the explosion-proof valve formed thereon; a bottomed tubular cap 31 closing the through-hole 23 is attached thereto; and the cap 31 includes a thin-plate-like easily-rupturable wall part 32 arranged opposite to the explosion-proof valve, a tubular circumferential wall part 33 erected on an edge in the surface direction of the easily-rupturable wall part 32 and arranged opposite to the circumferential surface of the electrolytic capacitor 5, and an elastic holding part 34 embedding a space between the circumferential wall part 33 and the circumferential surface of the electrolytic capacitor 5 over the circumferential direction. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

この発明は、防爆弁を有する電解コンデンサを備えた電子機器に関する。   The present invention relates to an electronic device including an electrolytic capacitor having an explosion-proof valve.

従来、インバータ電源装置等の電子機器には、例えば特許文献1のように、電解コンデンサを他の電子部品と共に回路基板の実装面に実装した状態でケース内に収容し、ケース内部に樹脂を充填して気密封止したものがある。
この電子機器に備える電解コンデンサでは、内部の電解液が漏れないように気密性が高められているが、何らかの要因で過電圧、逆電圧が電解コンデンサに印加されたり、電解コンデンサが過酷な充放電条件や許容以上の高温で使用される等すると、電解コンデンサの内部圧力が上昇することがある。このため、電解コンデンサの外面には防爆弁が形成されており、電解コンデンサの内部圧力が過剰に上昇する前に防爆弁において破裂させるようにしている。すなわち、電解コンデンサが上記防爆弁を備える場合には、防爆弁が正常に作動するように電解コンデンサの外面側に防爆弁を破裂させるための空間部を確保する必要がある。
Conventionally, in an electronic device such as an inverter power supply device, as in Patent Document 1, for example, an electrolytic capacitor is housed in a case in a state where it is mounted on a mounting surface of a circuit board together with other electronic components, and the case is filled with resin. And there is a hermetically sealed one.
The electrolytic capacitor provided in this electronic device has improved airtightness so that the internal electrolyte does not leak, but overvoltage or reverse voltage is applied to the electrolytic capacitor for some reason, or the electrolytic capacitor is subjected to severe charge / discharge conditions. If the battery is used at a higher temperature than allowable, the internal pressure of the electrolytic capacitor may increase. For this reason, an explosion-proof valve is formed on the outer surface of the electrolytic capacitor, and the explosion-proof valve is ruptured before the internal pressure of the electrolytic capacitor rises excessively. That is, when the electrolytic capacitor includes the explosion-proof valve, it is necessary to secure a space for bursting the explosion-proof valve on the outer surface side of the electrolytic capacitor so that the explosion-proof valve operates normally.

そこで、上記従来の電子機器には、図5に示すように、ケース101に形成された窓部102を介して防爆弁をケース101の外方に露出させたものがある。この構成では、窓部102の周縁に位置するケース101の内面に電解コンデンサ103の防爆弁の周縁が密接するように電解コンデンサ103が配置されており、ケース101の内部が樹脂封止されている。
また、上記従来の電子機器には、図6に示すように、筒状に形成されたチムニー105を防爆弁上に被せたものがある。この構成では、チムニー105を電解コンデンサ103に取り付けた状態でこれらをケース101内に配置すると共に、チムニー105の開口部分が露出した状態でケース101内に樹脂107を充填して電解コンデンサ103及びチムニー105を封止している。
特開平8−154377号公報
Therefore, as shown in FIG. 5, some of the conventional electronic devices have an explosion-proof valve exposed to the outside of the case 101 through a window portion 102 formed in the case 101. In this configuration, the electrolytic capacitor 103 is disposed so that the peripheral edge of the explosion-proof valve of the electrolytic capacitor 103 is in close contact with the inner surface of the case 101 located at the peripheral edge of the window portion 102, and the inside of the case 101 is resin-sealed. .
In addition, as shown in FIG. 6, the above-mentioned conventional electronic device includes a chimney 105 formed in a cylindrical shape and covered on an explosion-proof valve. In this configuration, the chimney 105 is mounted on the electrolytic capacitor 103 and disposed in the case 101, and the resin 101 is filled in the case 101 with the opening portion of the chimney 105 exposed, so that the electrolytic capacitor 103 and the chimney 105 are filled. 105 is sealed.
JP-A-8-154377

しかしながら、上記従来の電子機器において、窓部102の周縁に位置するケース101の内面に防爆弁の周縁を密接して配置する場合には、樹脂107をケース101内に充填する際に樹脂107が窓部102からケース101の外側に樹脂107が漏れ出ないように、窓部102と防爆弁との相対的な位置決めに高い精度が要求される。このため、ケース101の窓部102に対する電解コンデンサ103の位置決めが面倒になる、という問題がある。
また、筒状に形成されたチムニー105を防爆弁上に被せた構成では、樹脂107を充填する際にチムニー105の開口部分からチムニー105内に樹脂107が入り込まないように注意を要するため、樹脂107の充填が面倒となる虞がある。
さらに、電解コンデンサ103には水分や塵埃が接触しないことが望ましいが、上記従来の電子機器においては、防爆弁が窓部102を介してケース101の外側空間に露出している、あるい、チムニー105の開口部分がケース101及び充填された樹脂107の外側に露出しているため、水分や塵埃が電解コンデンサ103に到達してしまう虞もある。
However, in the above-described conventional electronic device, when the periphery of the explosion-proof valve is disposed in close contact with the inner surface of the case 101 located at the periphery of the window portion 102, the resin 107 is filled when the resin 107 is filled in the case 101. High accuracy is required for the relative positioning of the window 102 and the explosion-proof valve so that the resin 107 does not leak from the window 102 to the outside of the case 101. For this reason, there exists a problem that positioning of the electrolytic capacitor 103 with respect to the window part 102 of case 101 becomes troublesome.
In addition, in the configuration in which the cylindrical chimney 105 is placed on the explosion-proof valve, care should be taken so that the resin 107 does not enter the chimney 105 from the opening of the chimney 105 when the resin 107 is filled. There is a possibility that the filling of 107 becomes troublesome.
Furthermore, it is desirable that moisture and dust do not contact the electrolytic capacitor 103. However, in the above-described conventional electronic device, the explosion-proof valve is exposed to the outer space of the case 101 through the window portion 102, or chimney. Since the opening portion 105 is exposed to the outside of the case 101 and the filled resin 107, there is a possibility that moisture and dust may reach the electrolytic capacitor 103.

この発明は、上述した事情に鑑みたものであって、水分や塵埃が電解コンデンサに接触することを防止しながらも、防爆弁を正常に作動させることができる電子機器を提供することを目的とする。   The present invention has been made in view of the above-described circumstances, and an object thereof is to provide an electronic device that can normally operate an explosion-proof valve while preventing moisture and dust from contacting an electrolytic capacitor. To do.

この課題を解決するために、本発明の電子機器は、防爆弁を有する電解コンデンサが実装された回路基板をケース内に収容すると共に、当該ケース内に樹脂を充填する構成の電子機器であって、前記ケースには、前記防爆弁に対向するように前記ケースの内部領域を外方に連通させる貫通孔が形成されると共に、当該貫通孔に挿入することで前記貫通孔を閉塞する有底筒状のキャップが取り付けられ、前記キャップは、前記防爆弁に対向配置される薄板状の易破断壁部、当該易破断壁部の面方向の周縁に立設されて前記電解コンデンサの外周面に対向配置される筒状の周壁部、及び、前記周壁部と前記電解コンデンサの外周面との隙間を周方向にわたって埋める弾性保持部を備えることを特徴としている。   In order to solve this problem, an electronic apparatus according to the present invention is an electronic apparatus having a configuration in which a circuit board on which an electrolytic capacitor having an explosion-proof valve is mounted is accommodated in a case, and the resin is filled in the case. The case is formed with a through-hole that communicates the inner region of the case outwardly so as to face the explosion-proof valve, and the bottomed cylinder that closes the through-hole by being inserted into the through-hole. A cap is attached, and the cap is a thin plate-like easy-to-break wall portion disposed opposite to the explosion-proof valve, and is provided on the periphery in the surface direction of the easily-breakable wall portion to face the outer peripheral surface of the electrolytic capacitor A cylindrical peripheral wall portion to be disposed, and an elastic holding portion that fills a gap between the peripheral wall portion and the outer peripheral surface of the electrolytic capacitor in the circumferential direction are provided.

この発明に係る電子機器を製造する際には、キャップをケースの貫通孔に挿入するだけでケースの貫通孔を容易に閉塞することができる。これにより、ケース内に樹脂を充填する際にケースの貫通孔から外方に漏れ出すことを容易に防止できる。また、例えば防爆弁を覆うようにキャップを電解コンデンサに取り付けた状態でキャップをケースの貫通孔に挿入するだけで、あるいは、キャップをケースの貫通孔に取り付けた後に電解コンデンサをキャップに取り付けるだけで、ケースの貫通孔に対する電解コンデンサの位置決めを容易に行うこともできる。   When manufacturing the electronic apparatus according to the present invention, the through hole of the case can be easily closed only by inserting the cap into the through hole of the case. Accordingly, it is possible to easily prevent the case from leaking outward from the through hole of the case when the case is filled with resin. For example, just insert the cap into the through-hole of the case with the cap attached to the electrolytic capacitor so as to cover the explosion-proof valve, or simply attach the electrolytic capacitor to the cap after attaching the cap to the through-hole of the case. In addition, the electrolytic capacitor can be easily positioned with respect to the through hole of the case.

さらに、この電子機器を製造する際に、電解コンデンサが実装された回路基板がケース内に収容された状態でケース内に樹脂を充填した際には、回路基板と共に電解コンデンサのうちキャップによって覆われていない部分が樹脂によって封止される。一方、電解コンデンサのうちキャップによって覆われる外周面及び防爆弁は樹脂によって封止されない。これは、キャップの周壁部と電解コンデンサの外周面との隙間が弾性保持部によって閉塞されていることで、この隙間に樹脂が侵入することを防止できるためである。   Furthermore, when manufacturing the electronic device, when the circuit board on which the electrolytic capacitor is mounted is filled in the case with the circuit board being accommodated in the case, the circuit board and the electrolytic capacitor are covered with a cap. The part that is not sealed is sealed with resin. On the other hand, the outer peripheral surface covered with the cap and the explosion-proof valve of the electrolytic capacitor are not sealed with resin. This is because the gap between the peripheral wall portion of the cap and the outer peripheral surface of the electrolytic capacitor is blocked by the elastic holding portion, thereby preventing the resin from entering the gap.

そして、以上のようにして製造される電子機器においては、電解コンデンサがキャップによって電子機器の外側空間に対して密閉されているため、水分や塵埃が電解コンデンサに接触することを確実に防止できる。
なお、この電子機器において電解コンデンサの内部圧力が過度に上昇した際には、防爆弁を正常に作動させることができる。ここで、防爆弁にはキャップの易破断壁部が対向配置されているが、この易破断壁部は薄板状に形成されることで防爆弁の破裂に伴って容易に破断するため、防爆弁を正常に作動させることができる。
And in the electronic device manufactured as mentioned above, since the electrolytic capacitor is sealed with respect to the outer space of the electronic device by the cap, it can prevent reliably that a water | moisture content and dust contact an electrolytic capacitor.
In this electronic apparatus, when the internal pressure of the electrolytic capacitor is excessively increased, the explosion-proof valve can be normally operated. Here, the easily breakable wall portion of the cap is disposed opposite to the explosion-proof valve. Since the easily breakable wall portion is formed in a thin plate shape and easily breaks when the explosion-proof valve bursts, the explosion-proof valve Can be operated normally.

そして、前記電子機器において、前記キャップの外周面及び前記貫通孔の内周面の少なくとも一方に凹凸形状が形成され、当該凹凸形状によって前記貫通孔に前記キャップを嵌合させる嵌合部が構成される場合には、キャップによって貫通孔を確実に閉塞することが可能となる。   And in the said electronic device, an uneven | corrugated shape is formed in at least one of the outer peripheral surface of the said cap, and the internal peripheral surface of the said through-hole, and the fitting part which fits the said cap to the said through-hole is comprised by the said uneven | corrugated shape. In this case, it is possible to reliably close the through hole with the cap.

また、前記電子機器において、前記ケースには、外方に突出して前記電解コンデンサを挿入する筒状壁部が形成され、当該筒状壁部によって前記貫通孔が構成されていてもよい。
この場合には、回路基板や電解コンデンサが収容されるケース内の容積を縮小して電子機器の小型化を図ることができる。すなわち、回路基板(の実装面)には、電解コンデンサの他に各種電子部品が実装されるが、これら電子部品の高さ寸法は電解コンデンサの高さ寸法と比較して低いことが多い。そこで、ケースに電解コンデンサ用の筒状壁部を形成しておくことで、ケース内に余分な空間が形成されることを防止できるため、前述したように電子機器の小型化を図ることができる。
In the electronic device, the case may be formed with a cylindrical wall portion that protrudes outward and into which the electrolytic capacitor is inserted, and the through-hole is configured by the cylindrical wall portion.
In this case, it is possible to reduce the volume of the electronic device by reducing the volume in the case in which the circuit board and the electrolytic capacitor are accommodated. That is, various electronic components are mounted on the circuit board (mounting surface thereof) in addition to the electrolytic capacitor, and the height dimension of these electronic components is often lower than the height dimension of the electrolytic capacitor. Therefore, by forming a cylindrical wall portion for the electrolytic capacitor in the case, it is possible to prevent an extra space from being formed in the case, and thus it is possible to reduce the size of the electronic device as described above. .

さらに、前記電子機器において、前記弾性保持部が、前記周壁部の内周面から当該周壁部の径方向内側に突出する環状の内向突起部によって構成されていてもよいし、さらに、前記内向突起部が、その突出方向に向けて先細に形成されていてもよい。
これらの場合には、弾性保持部が電解コンデンサの外周面に当接する面積を小さくすることができるため、キャップを小さな力で電解コンデンサに取り付けることが可能となる。
Furthermore, in the electronic device, the elastic holding portion may be configured by an annular inward protrusion that protrudes inward in the radial direction of the peripheral wall from the inner peripheral surface of the peripheral wall. The portion may be tapered toward the protruding direction.
In these cases, since the area where the elastic holding portion abuts on the outer peripheral surface of the electrolytic capacitor can be reduced, the cap can be attached to the electrolytic capacitor with a small force.

また、前記電子機器においては、前記キャップを構成する前記易破断壁部、前記周壁部及び前記弾性保持部が、弾性変形可能な弾性材料によって一体に形成されていてもよい。   In the electronic device, the easily breakable wall portion, the peripheral wall portion, and the elastic holding portion constituting the cap may be integrally formed of an elastic material that can be elastically deformed.

本発明によれば、キャップによりケースの貫通孔を容易に閉塞できると共にケースに対する電解コンデンサの位置決めを容易に行うことができる。また、ケース内に樹脂を充填する際には、注意を要しなくても防爆弁が樹脂によって封止されることを防止できるため、電子機器の製造を容易に行うことができる。
また、水分や塵埃が電解コンデンサに接触することを確実に防止しつつ、電解コンデンサの内部圧力が過度に上昇した際には、防爆弁を正常に作動させることができる。
According to the present invention, the through hole of the case can be easily closed by the cap, and the electrolytic capacitor can be easily positioned with respect to the case. In addition, when filling the case with resin, the explosion-proof valve can be prevented from being sealed with the resin even if care is not required, and thus the electronic device can be easily manufactured.
Further, the explosion-proof valve can be normally operated when the internal pressure of the electrolytic capacitor is excessively increased while reliably preventing moisture and dust from coming into contact with the electrolytic capacitor.

以下、図面を参照して本発明の一実施形態について説明する。
図1,2に示すように、この実施形態に係る電子機器1は、2つの回路基板2,3と、第1回路基板2に実装される円柱状の電解コンデンサ5と、これら2つの回路基板2,3及び電解コンデンサ5を収容するケース7と、回路基板2,3及び電解コンデンサ5が収容されたケース7内に充填される樹脂9と、を備えている。
電解コンデンサ5は、例えば既存のアルミニウム電解コンデンサであり、その一端面5aに第1回路基板2と電気接続するための電極11を形成し、かつ、他端面5bに防爆弁(不図示)を形成して構成されている。
Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
As shown in FIGS. 1 and 2, the electronic apparatus 1 according to this embodiment includes two circuit boards 2 and 3, a columnar electrolytic capacitor 5 mounted on the first circuit board 2, and these two circuit boards. 2 and 3 and a case 7 for accommodating the electrolytic capacitor 5, and a resin 9 filled in the case 7 in which the circuit boards 2 and 3 and the electrolytic capacitor 5 are accommodated.
The electrolytic capacitor 5 is, for example, an existing aluminum electrolytic capacitor, and an electrode 11 for electrical connection with the first circuit board 2 is formed on one end surface 5a, and an explosion-proof valve (not shown) is formed on the other end surface 5b. Configured.

ケース7は、電解コンデンサ5と電気的に接続される複数の端子12を備えたコネクタ部13と、2つの回路基板2,3及び電解コンデンサ5を収容する収容部15とから構成されている。
収容部15は、その厚さ方向に開口する開口部15aを有する箱状に形成されている。第2回路基板3はこの収容部15の底面16aに配置されており、第1回路基板2は収容部15の底面16aの上方に間隔をあけて配置されている。そして、第2回路基板3には、第1回路基板2の実装面2aのうち電解コンデンサ5が実装されていない領域が対向している。また、第1回路基板2は、第1接続子17、第2回路基板3及び第2接続子18を介してコネクタ部13の端子12に電気接続されている。
The case 7 includes a connector portion 13 having a plurality of terminals 12 electrically connected to the electrolytic capacitor 5, and a housing portion 15 that houses the two circuit boards 2 and 3 and the electrolytic capacitor 5.
The accommodating part 15 is formed in the box shape which has the opening part 15a opened to the thickness direction. The second circuit board 3 is disposed on the bottom surface 16 a of the housing portion 15, and the first circuit board 2 is disposed above the bottom surface 16 a of the housing portion 15 with a space therebetween. And the area | region where the electrolytic capacitor 5 is not mounted is opposed to the 2nd circuit board 3 among the mounting surfaces 2a of the 1st circuit board 2. FIG. The first circuit board 2 is electrically connected to the terminals 12 of the connector portion 13 via the first connector 17, the second circuit board 3 and the second connector 18.

また、ケース7には、底面16aをなす収容部15の底壁部16から外方に突出する円筒状の筒状壁部21が形成されており、この筒状壁部21によってケース7の内部領域を外方に連通させる貫通孔23が形成されている。第1回路基板2をケース7内に収容した状態においては、第1回路基板2に実装された電解コンデンサ5がこの筒状壁部21に挿入されるようになっている。そして、この挿入状態においては、電解コンデンサ5の他端面5bが筒状壁部21の突出方向の先端に位置する貫通孔23の外側開口部23aに対向して配置される。   Further, the case 7 is formed with a cylindrical tubular wall portion 21 that protrudes outward from the bottom wall portion 16 of the housing portion 15 that forms the bottom surface 16a. A through hole 23 is formed to communicate the region outward. In a state where the first circuit board 2 is housed in the case 7, the electrolytic capacitor 5 mounted on the first circuit board 2 is inserted into the cylindrical wall portion 21. In this inserted state, the other end surface 5 b of the electrolytic capacitor 5 is disposed to face the outer opening 23 a of the through hole 23 located at the tip of the cylindrical wall portion 21 in the protruding direction.

以上のように構成されるケース7には、筒状壁部21の貫通孔23に挿入することで貫通孔23を閉塞する有底円筒状のキャップ31が取り付けられている。
このキャップ31は、図3に示すように、ゴム等のように弾性変形可能な弾性材料により、電解コンデンサ5の他端面5bに対向配置される薄板状の易破断壁部32、易破断壁部32の面方向の周縁に立設されて電解コンデンサ5の外周面に対向配置される円筒状の周壁部33、及び、周壁部33と電解コンデンサ5の外周面との隙間を周方向にわたって埋める弾性保持部34を一体に形成して構成されている。
易破断壁部32は、キャップ31をケース7に取り付けた状態において貫通孔23の外側開口部23aに配置され、この易破断壁部32の厚さ寸法や形状は、防爆弁が破裂した際に容易に破断する程度の強度を有するように設定されている。
A bottomed cylindrical cap 31 that closes the through hole 23 by being inserted into the through hole 23 of the cylindrical wall portion 21 is attached to the case 7 configured as described above.
As shown in FIG. 3, the cap 31 is made of a thin plate-like easily breakable wall portion 32 and an easily breakable wall portion, which are opposed to the other end surface 5b of the electrolytic capacitor 5 by an elastically deformable elastic material such as rubber. The cylindrical peripheral wall portion 33 standing on the peripheral edge of the surface direction 32 and disposed opposite to the outer peripheral surface of the electrolytic capacitor 5 and the elasticity that fills the gap between the peripheral wall portion 33 and the outer peripheral surface of the electrolytic capacitor 5 in the circumferential direction. The holding part 34 is formed integrally.
The easily breakable wall portion 32 is disposed in the outer opening 23a of the through hole 23 in a state where the cap 31 is attached to the case 7, and the thickness dimension and shape of the easily breakable wall portion 32 are determined when the explosion-proof valve is ruptured. The strength is set so as to easily break.

そして、キャップ31の外周面には、易破断壁部32から周壁部33にわたって周壁部33の立設方向に沿う凹凸形状が形成されており、この凹凸形状によって径方向内側に窪む環状凹部35が構成されている。この環状凹部35は周壁部33の外周面の周方向にわたって環状に形成されている。一方、図1,4に示すように、貫通孔23の外側開口部23aに位置する貫通孔23の内周面には、筒状壁部21の突出方向に沿う凹凸形状が形成されており、この凹凸形状によって貫通孔23の内周面から径方向内側に突出する環状突起部25が形成されている。この環状突起部25は貫通孔23の内周面の周方向にわたって形成されている。   And the uneven | corrugated shape in alignment with the standing direction of the surrounding wall part 33 is formed in the outer peripheral surface of the cap 31 from the easily breakable wall part 32 to the surrounding wall part 33, The cyclic | annular recessed part 35 recessed in radial direction inner side by this uneven | corrugated shape. Is configured. The annular recess 35 is formed in an annular shape over the circumferential direction of the outer peripheral surface of the peripheral wall 33. On the other hand, as shown in FIGS. 1 and 4, the inner circumferential surface of the through hole 23 located in the outer opening 23 a of the through hole 23 is formed with an uneven shape along the protruding direction of the cylindrical wall portion 21. Due to the uneven shape, an annular protrusion 25 is formed that protrudes radially inward from the inner peripheral surface of the through hole 23. The annular protrusion 25 is formed along the circumferential direction of the inner peripheral surface of the through hole 23.

この筒状壁部21の環状突起部25が前述したキャップ31の環状凹部35に嵌合することで、キャップ31がケース7に固定され、キャップ31によって貫通孔23の外側開口部23aが閉塞される。すなわち、キャップ31の環状凹部35及びケース7の環状突起部25によって、貫通孔23にキャップ31を嵌合させる嵌合部37が構成されている。なお、この実施形態においては、キャップ31全体が弾性材料によって形成されているため、特に、キャップ31を弾性変形させながら筒状壁部21の環状突起部25をキャップ31の環状凹部35に容易に嵌合させることができ、また、キャップ31によって貫通孔23を確実に閉塞することができる。
また、キャップ31がケース7に固定された状態においては、環状凹部35が周壁部33の立設方向の基端側に位置しており、この環状凹部35の形成位置よりも周壁部33の立設方向の先端側に位置する周壁部33の外周面と貫通孔23の内周面との間には隙間が形成されている。
The annular protrusion 25 of the cylindrical wall 21 is fitted into the annular recess 35 of the cap 31 described above, whereby the cap 31 is fixed to the case 7 and the outer opening 23a of the through hole 23 is closed by the cap 31. The That is, the annular recess 35 of the cap 31 and the annular protrusion 25 of the case 7 constitute a fitting portion 37 for fitting the cap 31 into the through hole 23. In this embodiment, since the entire cap 31 is made of an elastic material, the annular protrusion 25 of the cylindrical wall portion 21 is easily formed in the annular recess 35 of the cap 31 while the cap 31 is elastically deformed. In addition, the cap 31 can reliably close the through hole 23.
Further, in the state where the cap 31 is fixed to the case 7, the annular recess 35 is located on the proximal end side in the standing direction of the peripheral wall portion 33, and the peripheral wall portion 33 is raised more than the formation position of the annular recess 35. A gap is formed between the outer peripheral surface of the peripheral wall 33 located on the front end side in the installation direction and the inner peripheral surface of the through hole 23.

弾性保持部34は、周壁部33の内周面から周壁部33の径方向内側に突出する環状の内向突起部39によって構成されている。この内向突起部39は、周壁部33の内周面のうち周壁部33の立設方向の先端と基端との間に形成されており、その突出方向に向かって先細に形成されている。
また、図1,2に示すように、内向突起部39の内径寸法は、電解コンデンサ5の外径寸法よりも小さく形成されている。すなわち、内向突起部39は、防爆弁が覆われるように電解コンデンサ5の他端面5b側の端部をキャップ31内に挿入した状態において、周壁部33の内周面とこれに対向する電解コンデンサ5の外周面との隙間を埋める閉塞手段を構成している。
The elastic holding portion 34 is configured by an annular inward projection 39 that protrudes inward in the radial direction of the peripheral wall portion 33 from the inner peripheral surface of the peripheral wall portion 33. The inward projecting portion 39 is formed between the distal end and the proximal end of the peripheral wall portion 33 on the inner peripheral surface of the peripheral wall portion 33, and is tapered toward the protruding direction.
As shown in FIGS. 1 and 2, the inner diameter dimension of the inward projection 39 is smaller than the outer diameter dimension of the electrolytic capacitor 5. That is, the inward protruding portion 39 has an electrolytic capacitor facing the inner peripheral surface of the peripheral wall portion 33 in a state where the end portion on the other end surface 5b side of the electrolytic capacitor 5 is inserted into the cap 31 so as to cover the explosion-proof valve. 5 constitutes a closing means for filling the gap with the outer peripheral surface of 5.

そして、電解コンデンサ5の端部をキャップ31内に挿入した状態においては、図4に示すように、内向突起部39よりも先端側、及び、内向突起部39よりも基端側に位置する周壁部33の内周面と電解コンデンサの外周面との間には、それぞれ隙間が形成されることになる。
なお、図示例では、第1回路基板2に実装された電解コンデンサ5をケース7に固定されたキャップ31内に挿入した状態においては、電解コンデンサ5の他端面5bとキャップ31の易破断壁部32との間にも隙間が形成されているが、例えば電解コンデンサ5の他端面5bがキャップ31の易破断壁部32に当接していても構わない。
In the state where the end portion of the electrolytic capacitor 5 is inserted into the cap 31, as shown in FIG. 4, the peripheral wall located on the distal end side with respect to the inward projection portion 39 and on the proximal end side with respect to the inward projection portion 39. A gap is formed between the inner peripheral surface of the portion 33 and the outer peripheral surface of the electrolytic capacitor.
In the illustrated example, when the electrolytic capacitor 5 mounted on the first circuit board 2 is inserted into the cap 31 fixed to the case 7, the other end surface 5b of the electrolytic capacitor 5 and the easily breakable wall portion of the cap 31 are used. A gap is also formed between the cap 32 and the other end surface 5b of the electrolytic capacitor 5 may be in contact with the easily breakable wall portion 32 of the cap 31, for example.

図1,4に示すように、樹脂9は、前述したように2つの回路基板2,3、電解コンデンサ5、2つの接続子17,18がケース7内に収容されると共に、キャップ31がケース7に取り付けられた状態において、収容部15内に充填されるものであり、2つの回路基板2,3及び2つの接続子17,18を封止している。
また、樹脂9は、電解コンデンサ5のうちキャップ31によって覆われていない部分のみを封止しており、キャップ31によって覆われる部分は樹脂によって封止されない。なお、本実施形態において、キャップ31によって覆われる部分とは、電解コンデンサ5のうち内向突起部39に当接した部分よりも他端面5b側の部分を示している。
さらに、樹脂9は、内向突起部39よりも先端側に位置する周壁部33の内周面と電解コンデンサ5の外周面との隙間、及び、環状凹部35の形成位置よりも周壁部33の立設方向の先端側に位置する周壁部33の外周面と貫通孔23の内周面との隙間にも充填されている。
As shown in FIGS. 1 and 4, the resin 9 includes the two circuit boards 2 and 3, the electrolytic capacitor 5, and the two connectors 17 and 18 in the case 7 as described above, and the cap 31 is formed in the case. 7, the container 15 is filled, and the two circuit boards 2 and 3 and the two connectors 17 and 18 are sealed.
In addition, the resin 9 seals only a portion of the electrolytic capacitor 5 that is not covered by the cap 31, and a portion covered by the cap 31 is not sealed by the resin. In the present embodiment, the portion covered by the cap 31 indicates a portion of the electrolytic capacitor 5 on the side of the other end surface 5b with respect to the portion that is in contact with the inward projection 39.
Further, the resin 9 is formed so that the clearance between the inner peripheral surface of the peripheral wall portion 33 and the outer peripheral surface of the electrolytic capacitor 5 located on the front end side with respect to the inward projecting portion 39 and the standing position of the peripheral wall portion 33 with respect to the formation position of the annular recess 35. A gap between the outer peripheral surface of the peripheral wall 33 located on the front end side in the installation direction and the inner peripheral surface of the through hole 23 is also filled.

次に、以上のように構成された電子機器1を製造する方法について述べる。
電子機器1を製造する際には、はじめに、第1回路基板2に電解コンデンサ5を実装しておき、また、ケース7にキャップ31を取り付けておく。
次いで、第2回路基板3を収容部15の底面16aに配置し、その後、電解コンデンサ5が実装された第1回路基板2を収容部15内に収容する。この収容の際には、電解コンデンサ5を筒状壁部21に挿入し、さらに、電解コンデンサ5の他端面5b側の端部をキャップ31内に挿入する。この際には、例えば、先細に形成された内向突起部39が電解コンデンサ5の挿入方向に屈曲するように弾性変形し、この弾性力によって内向突起部39の先端が電解コンデンサ5の外周面に押し付けられる。すなわち、内向突起部39によって周壁部33の内周面とこれに対向する電解コンデンサ5の外周面との隙間が埋められることになる。
Next, a method for manufacturing the electronic apparatus 1 configured as described above will be described.
When manufacturing the electronic apparatus 1, first, the electrolytic capacitor 5 is mounted on the first circuit board 2, and the cap 31 is attached to the case 7.
Next, the second circuit board 3 is placed on the bottom surface 16 a of the housing part 15, and then the first circuit board 2 on which the electrolytic capacitor 5 is mounted is housed in the housing part 15. In this accommodation, the electrolytic capacitor 5 is inserted into the cylindrical wall portion 21, and the end portion on the other end surface 5 b side of the electrolytic capacitor 5 is further inserted into the cap 31. At this time, for example, the tapered inward projection 39 is elastically deformed so as to bend in the insertion direction of the electrolytic capacitor 5, and the tip of the inward projection 39 is brought into contact with the outer peripheral surface of the electrolytic capacitor 5 by this elastic force. Pressed. That is, the gap between the inner peripheral surface of the peripheral wall portion 33 and the outer peripheral surface of the electrolytic capacitor 5 facing the inner projecting portion 39 is filled.

上述のように、第1回路基板2に実装された電解コンデンサ5をケース7に取り付けられたキャップ31内に挿入することで、電解コンデンサ5の端部を容易にキャップ31内に挿入することができる。すなわち、第1回路基板2に対する電解コンデンサ5の実装位置にズレが生じていても、挿入の際にキャップ31が弾性変形することで、このズレを解消することができる。すなわち、ケース7の貫通孔23に対する電解コンデンサ5の位置決めを容易に行うことができる。   As described above, by inserting the electrolytic capacitor 5 mounted on the first circuit board 2 into the cap 31 attached to the case 7, the end of the electrolytic capacitor 5 can be easily inserted into the cap 31. it can. That is, even if the mounting position of the electrolytic capacitor 5 with respect to the first circuit board 2 is displaced, the displacement can be eliminated by elastic deformation of the cap 31 during insertion. That is, the electrolytic capacitor 5 can be easily positioned with respect to the through hole 23 of the case 7.

第1回路基板2の収容が完了した後には、第1接続子17により第1回路基板2と第2回路基板3とを電気接続すると共に、第2接続子18により第2回路基板3とコネクタ部13の端子12とを電気接続する。最後に、開口部15a側から収容部15内に溶融した樹脂9を流し込み、この樹脂9が硬化することで電子機器1の製造が完了する。
なお、この樹脂充填に際して、第1回路基板2は収容部15の開口部15aの大半を覆うように配置されているが、図2に示すように、第1回路基板2にはその厚さ方向に貫通する開口孔2bが形成され、また、第1回路基板2の実装面2aの周縁と収容部15の側壁との間にも隙間が形成されているため、樹脂9を第1回路基板2とケース7の底壁部16との間や筒状壁部21内に滑らかに導くことができる。
After the accommodation of the first circuit board 2 is completed, the first circuit board 2 and the second circuit board 3 are electrically connected by the first connector 17 and the second circuit board 3 and the connector are connected by the second connector 18. The terminal 12 of the unit 13 is electrically connected. Finally, the molten resin 9 is poured into the accommodating portion 15 from the opening 15a side, and the resin 9 is cured, whereby the manufacture of the electronic device 1 is completed.
In this resin filling, the first circuit board 2 is disposed so as to cover most of the opening 15a of the accommodating portion 15, but the first circuit board 2 has a thickness direction as shown in FIG. Since an opening 2b penetrating through the first circuit board 2 is formed, and a gap is formed between the peripheral edge of the mounting surface 2a of the first circuit board 2 and the side wall of the housing portion 15, the resin 9 is added to the first circuit board 2. And the bottom wall portion 16 of the case 7 or into the cylindrical wall portion 21 can be smoothly guided.

また、貫通孔23の外側開口部23aがキャップ31によって閉塞されているため、筒状壁部21内に導かれた樹脂9は、外側開口部23aからケース7の外方に漏れ出すことを容易に防止できる。
さらに、図4に示すように、周壁部33の内周面と電解コンデンサ5の外周面との隙間は内向突起部39によって埋められているため、筒状壁部21内に導かれた樹脂9がこの隙間に侵入することも防止できる。すなわち、電解コンデンサ5と内向突起部39との当接部分よりも電解コンデンサ5の他端面5b側に位置する電解コンデンサ5とキャップ31との隙間には、樹脂9が入り込まない。
Further, since the outer opening 23a of the through hole 23 is closed by the cap 31, the resin 9 guided into the cylindrical wall portion 21 can easily leak out of the case 7 from the outer opening 23a. Can be prevented.
Further, as shown in FIG. 4, since the gap between the inner peripheral surface of the peripheral wall portion 33 and the outer peripheral surface of the electrolytic capacitor 5 is filled with the inward protruding portion 39, the resin 9 introduced into the cylindrical wall portion 21. Can also be prevented from entering the gap. That is, the resin 9 does not enter the gap between the electrolytic capacitor 5 and the cap 31 located on the other end surface 5 b side of the electrolytic capacitor 5 with respect to the contact portion between the electrolytic capacitor 5 and the inward projection 39.

そして、筒状壁部21内に導かれた樹脂9は、内向突起部39よりも先端側に位置する周壁部33の内周面と電解コンデンサ5の外周面との隙間、及び、環状凹部35の形成位置よりも周壁部33の立設方向の先端側に位置する周壁部33の外周面と貫通孔23の内周面との隙間に充填される。これにより、内向突起部39よりも先端側に位置する周壁部33はその内側及び外側の両方から樹脂9によって挟み込まれるため、キャップ31を樹脂9に強固に固定することができる。   The resin 9 introduced into the cylindrical wall portion 21 has a gap between the inner peripheral surface of the peripheral wall portion 33 and the outer peripheral surface of the electrolytic capacitor 5 positioned on the tip side of the inward projecting portion 39, and the annular concave portion 35. The gap between the outer peripheral surface of the peripheral wall portion 33 and the inner peripheral surface of the through hole 23 that is located on the distal end side in the standing direction of the peripheral wall portion 33 with respect to the formation position is filled. Thereby, since the peripheral wall part 33 located in the front end side rather than the inward protrusion part 39 is inserted | pinched by the resin 9 from both the inner side and the outer side, the cap 31 can be firmly fixed to the resin 9.

以上説明したように、上記実施形態による電子機器1によれば、キャップ31によりケース7の貫通孔23を容易に閉塞できると共にケース7に対する電解コンデンサ5の位置決めを容易に行うことができる。また、ケース7内に樹脂9を充填する際には、注意を要しなくても防爆弁が樹脂9によって封止されることを防止できるため、電子機器1の製造を容易に行うことができる。
また、この電子機器1によれば、電解コンデンサ5がキャップ31によって電子機器1の外側空間に対して密閉されているため、水分や塵埃が電解コンデンサ5に接触することを確実に防止できる。なお、この電子機器1において電解コンデンサ5の内部圧力が過度に上昇した際には、防爆弁を正常に作動させることができる。ここで、防爆弁にはキャップ31の易破断壁部32が対向配置されているが、この易破断壁部32は薄板状に形成されることで防爆弁の破裂に伴って容易に破断するため、防爆弁を正常に作動させることができる。
As described above, according to the electronic device 1 according to the above embodiment, the cap 31 can easily close the through hole 23 of the case 7, and the electrolytic capacitor 5 can be easily positioned with respect to the case 7. In addition, when filling the case 9 with the resin 9, the explosion-proof valve can be prevented from being sealed with the resin 9 without requiring caution, so that the electronic device 1 can be easily manufactured. .
Further, according to the electronic device 1, since the electrolytic capacitor 5 is sealed with respect to the outer space of the electronic device 1 by the cap 31, it is possible to reliably prevent moisture and dust from coming into contact with the electrolytic capacitor 5. In the electronic device 1, when the internal pressure of the electrolytic capacitor 5 rises excessively, the explosion-proof valve can be operated normally. Here, the easily breakable wall portion 32 of the cap 31 is disposed opposite to the explosion-proof valve. However, the easily breakable wall portion 32 is formed in a thin plate shape so that it easily breaks when the explosion-proof valve bursts. The explosion-proof valve can be operated normally.

さらに、ケース7に電解コンデンサ5を挿入する筒状壁部21が形成されることで、第1回路基板2や電解コンデンサ5が収容されるケース7内の容積を縮小して電子機器1の小型化を図ることができる。すなわち、第1回路基板2の実装面2aには、電解コンデンサ5の他にも各種電子部品が実装されることがあるが、これら電子部品の高さ寸法は電解コンデンサ5の高さ寸法と比較して低いことが多い。そこで、ケース7に電解コンデンサ5用の筒状壁部21を形成しておくことで、ケース7内に余分な空間が形成されることを防止できるため、前述したように電子機器1の小型化を図ることができる。
また、弾性保持部34が先細状の内向突起部39によって構成されることで、電解コンデンサ5の外周面に当接する弾性保持部34の面積を小さくすることができるため、キャップ31を小さな力で電解コンデンサ5に取り付けることができる。
Furthermore, the cylindrical wall portion 21 into which the electrolytic capacitor 5 is inserted is formed in the case 7, thereby reducing the volume in the case 7 in which the first circuit board 2 and the electrolytic capacitor 5 are accommodated, thereby reducing the size of the electronic device 1. Can be achieved. That is, in addition to the electrolytic capacitor 5, various electronic components may be mounted on the mounting surface 2 a of the first circuit board 2. The height dimensions of these electronic components are compared with the height dimension of the electrolytic capacitor 5. Often low. Therefore, by forming the cylindrical wall portion 21 for the electrolytic capacitor 5 in the case 7, it is possible to prevent an extra space from being formed in the case 7, so that the electronic device 1 can be downsized as described above. Can be achieved.
In addition, since the elastic holding portion 34 is configured by the tapered inward projection portion 39, the area of the elastic holding portion 34 that contacts the outer peripheral surface of the electrolytic capacitor 5 can be reduced. It can be attached to the electrolytic capacitor 5.

以上、本発明の実施形態である電子機器1について説明したが、本発明の技術的範囲はこれに限定されることはなく、本発明の技術的思想を逸脱しない範囲で適宜変更可能である。
例えば、電子機器1は、回路基板2,3を2つ備えるとしたが、少なくとも電解コンデンサ5を実装する第1回路基板2を備えていればよい。この場合には、第1回路基板2とコネクタ部13の端子12とを接続子のみにより接続すればよい。
また、ケース7の筒状壁部21やキャップ31は円筒状に形成されるとしたが、これに限ることは無く、少なくとも電解コンデンサ5の形状に対応する筒状に形成されていればよい。
As mentioned above, although the electronic device 1 which is embodiment of this invention was demonstrated, the technical scope of this invention is not limited to this, It can change suitably in the range which does not deviate from the technical idea of this invention.
For example, the electronic apparatus 1 includes the two circuit boards 2 and 3, but may include the first circuit board 2 on which at least the electrolytic capacitor 5 is mounted. In this case, what is necessary is just to connect the 1st circuit board 2 and the terminal 12 of the connector part 13 only with a connector.
Further, the cylindrical wall portion 21 and the cap 31 of the case 7 are formed in a cylindrical shape, but the present invention is not limited to this, and it is sufficient that the cylindrical wall portion 21 and the cap 31 are formed in a cylindrical shape corresponding to at least the shape of the electrolytic capacitor 5.

さらに、内向突起部39は、周壁部33の先端と基端との間に形成されるとしたが、少なくとも電解コンデンサ5の他端面5bと易破断壁部32との隙間に樹脂が侵入しないように形成されていればよい。したがって、内向突起部39は、例えば周壁部33の先端に形成されていてもよいし、周壁部33の基端に形成されていてもよい。
また、キャップ31の周壁部33には、その内周面から周壁部33の径方向内側に突出する環状の内向突起部39が形成されるとしたが、少なくとも周壁部33と電解コンデンサ5の外周面との隙間を周方向にわたって埋める弾性保持部34が形成されていればよい。したがって、この弾性保持部34は、例えば周壁部33の内周面全体に形成されていてもよい、すなわち、周壁部33全体が電解コンデンサ5の外周面に押し付けられてもよい。
Furthermore, although the inward projection 39 is formed between the distal end and the proximal end of the peripheral wall 33, the resin does not enter at least the gap between the other end surface 5b of the electrolytic capacitor 5 and the easily breakable wall 32. What is necessary is just to be formed. Therefore, the inward projection 39 may be formed at the distal end of the peripheral wall 33, for example, or may be formed at the proximal end of the peripheral wall 33.
In addition, the circumferential wall portion 33 of the cap 31 is formed with an annular inward projection 39 that protrudes inward in the radial direction of the circumferential wall portion 33 from the inner circumferential surface, but at least the outer circumference of the circumferential wall portion 33 and the electrolytic capacitor 5 The elastic holding part 34 which fills up the clearance gap between the surfaces over the circumferential direction should just be formed. Therefore, the elastic holding portion 34 may be formed on the entire inner peripheral surface of the peripheral wall portion 33, for example, the entire peripheral wall portion 33 may be pressed against the outer peripheral surface of the electrolytic capacitor 5.

さらに、環状突起部25は貫通孔23の外側開口部23aに形成されるとしたが、これに限ることは無く、例えば外側開口部23aよりも第1回路基板2に近い側に形成されてもよい。この場合には、キャップ31の易破断壁部32も外側開口部23aよりも第1回路基板2に近い側に位置することになる。
また、貫通孔23にキャップ31を嵌合させる嵌合部37は、キャップ31の環状凹部35及び貫通孔23の環状突起部25によって構成されるとしたが、キャップ31の外周面及び貫通孔23の内周面の少なくとも一方に形成された凹凸形状によって構成されていればよい。例えば、嵌合部は、キャップ31の外周面から径方向外側に突出する環状の突起部と、貫通孔23の内周面から径方向外側に窪んで前記突起部に嵌合する環状の凹部とによって構成されてもよい。なお、突起部はキャップ31の外周面に凹凸形状を形成することで構成することができ、貫通孔23の凹部は貫通孔23の内周面に凹凸形状を形成することで構成することができる。
Further, the annular protrusion 25 is formed in the outer opening 23a of the through hole 23. However, the present invention is not limited to this. For example, the annular protrusion 25 may be formed closer to the first circuit board 2 than the outer opening 23a. Good. In this case, the easily breakable wall portion 32 of the cap 31 is also positioned closer to the first circuit board 2 than the outer opening 23a.
Further, although the fitting portion 37 for fitting the cap 31 into the through hole 23 is configured by the annular recess 35 of the cap 31 and the annular protrusion 25 of the through hole 23, the outer peripheral surface of the cap 31 and the through hole 23. What is necessary is just to be comprised by the uneven | corrugated shape formed in at least one of the internal peripheral surface of this. For example, the fitting portion includes an annular protrusion that protrudes radially outward from the outer peripheral surface of the cap 31, and an annular recess that is recessed radially outward from the inner peripheral surface of the through hole 23 and fits into the protrusion. It may be constituted by. The protrusion can be formed by forming an uneven shape on the outer peripheral surface of the cap 31, and the concave portion of the through hole 23 can be formed by forming an uneven shape on the inner peripheral surface of the through hole 23. .

さらに、ケース7には、電解コンデンサ5を挿入する筒状壁部21が形成されるとしたが、少なくとも電解コンデンサ5の防爆弁に対向する位置に、ケース7の内部領域を外方に連通させる貫通孔23が形成されていればよい。すなわち、ケース7の収容部15の厚さ寸法が第1回路基板2に実装された電解コンデンサ5を収容できる程度に設定されていれば、例えばケース7の底壁部16のうち電解コンデンサ5の他端面5bに対向する位置に貫通孔が形成されていてもよい。
なお、このようにケース7が筒状壁部21を有さない場合には、例えば上記実施形態と同様の環状凹部35をキャップ31に形成しておき、この環状凹部35を貫通孔周縁の底壁部16に嵌合させればよい。この場合には、キャップ31の外周面に形成された凹凸形状のみによって貫通孔にキャップ31を嵌合させる嵌合部を構成することができる。
Furthermore, the cylindrical wall portion 21 into which the electrolytic capacitor 5 is inserted is formed in the case 7, but the internal region of the case 7 is communicated outward at least at a position facing the explosion-proof valve of the electrolytic capacitor 5. The through-hole 23 should just be formed. That is, if the thickness dimension of the accommodating portion 15 of the case 7 is set to such an extent that the electrolytic capacitor 5 mounted on the first circuit board 2 can be accommodated, for example, of the electrolytic capacitor 5 in the bottom wall portion 16 of the case 7. A through hole may be formed at a position facing the other end surface 5b.
When the case 7 does not have the cylindrical wall portion 21 as described above, for example, an annular recess 35 similar to that in the above embodiment is formed in the cap 31, and the annular recess 35 is formed at the bottom of the through-hole periphery. What is necessary is just to make it fit in the wall part 16. FIG. In this case, a fitting portion for fitting the cap 31 into the through hole can be configured only by the uneven shape formed on the outer peripheral surface of the cap 31.

また、キャップ31は、易破断壁部32、周壁部33及び弾性保持部34を弾性材料によって一体に形成して構成されるとしたが、少なくとも弾性保持部34が弾性変形可能に形成されていればよく、易破断壁部32及び周壁部33は例えば他の樹脂材料によって形成されてもよい。
さらに、上記実施形態において電子機器1を製造する際には、第1回路基板2に実装された電解コンデンサ5をケース7に取り付けられたキャップ31内に挿入するとしたが、例えば電解コンデンサ5をキャップ31内に挿入した後に、キャップ31を貫通孔23に挿入してもよいし、例えば第1回路基板2に実装された電解コンデンサ5をケース7に取り付けた後に、キャップ31をケース7に取り付けることで電解コンデンサ5をキャップ31内に挿入してもよい。これらの場合でも、上記実施形態と同様に、ケース7の貫通孔23に対する電解コンデンサ5の位置決めを容易に行うことができる。
Further, the cap 31 is configured by integrally forming the easily breakable wall portion 32, the peripheral wall portion 33, and the elastic holding portion 34 with an elastic material. However, at least the elastic holding portion 34 is formed so as to be elastically deformable. The easily breakable wall portion 32 and the peripheral wall portion 33 may be formed of other resin materials, for example.
Further, when the electronic device 1 is manufactured in the above embodiment, the electrolytic capacitor 5 mounted on the first circuit board 2 is inserted into the cap 31 attached to the case 7. After being inserted into the cap 31, the cap 31 may be inserted into the through hole 23. For example, after the electrolytic capacitor 5 mounted on the first circuit board 2 is attached to the case 7, the cap 31 is attached to the case 7. The electrolytic capacitor 5 may be inserted into the cap 31. Even in these cases, the electrolytic capacitor 5 can be easily positioned with respect to the through hole 23 of the case 7 as in the above embodiment.

本発明の一実施形態である電子機器を示す概略断面図である。It is a schematic sectional drawing which shows the electronic device which is one Embodiment of this invention. 図1の電子機器において、樹脂を充填する前の状態を示す概略断面図である。In the electronic device of FIG. 1, it is a schematic sectional drawing which shows the state before filling with resin. 図1の電子機器に備えるキャップを示す拡大断面図である。It is an expanded sectional view which shows the cap with which the electronic device of FIG. 1 is equipped. 図1の電子機器において、貫通孔の外側開口部近傍の構造を示す要部拡大断面図である。In the electronic device of FIG. 1, it is a principal part expanded sectional view which shows the structure of the outer side opening part vicinity of a through-hole. 従来の電子機器の一例を示す概略断面図である。It is a schematic sectional drawing which shows an example of the conventional electronic device. 従来の電子機器の他の例を示す概略断面図である。It is a schematic sectional drawing which shows the other example of the conventional electronic device.

符号の説明Explanation of symbols

1 電子機器
2 第1回路基板
5 電解コンデンサ
5b 他端面
7 ケース
9 樹脂
21 筒状壁部
23 貫通孔
31 キャップ
32 易破断壁部
33 周壁部
34 弾性保持部
37 嵌合部
39 内向突起部
DESCRIPTION OF SYMBOLS 1 Electronic device 2 1st circuit board 5 Electrolytic capacitor 5b Other end surface 7 Case 9 Resin 21 Cylindrical wall part 23 Through-hole 31 Cap 32 Easy-to-break wall part 33 Peripheral wall part 34 Elastic holding part 37 Fitting part 39 Inward protrusion part

Claims (6)

防爆弁を有する電解コンデンサが実装された回路基板をケース内に収容すると共に、当該ケース内に樹脂を充填する構成の電子機器であって、
前記ケースには、前記防爆弁に対向するように前記ケースの内部領域を外方に連通させる貫通孔が形成されると共に、当該貫通孔に挿入することで前記貫通孔を閉塞する有底筒状のキャップが取り付けられ、
前記キャップは、前記防爆弁に対向配置される薄板状の易破断壁部、当該易破断壁部の面方向の周縁に立設されて前記電解コンデンサの外周面に対向配置される筒状の周壁部、及び、前記周壁部と前記電解コンデンサの外周面との隙間を周方向にわたって埋める弾性保持部を備えることを特徴とする電子機器。
An electronic device having a configuration in which a circuit board on which an electrolytic capacitor having an explosion-proof valve is mounted is accommodated in a case, and resin is filled in the case.
The case is formed with a through-hole that communicates the inner region of the case outward so as to face the explosion-proof valve, and has a bottomed cylindrical shape that closes the through-hole by being inserted into the through-hole. The cap is attached,
The cap is a thin plate-shaped easily breakable wall portion disposed opposite to the explosion-proof valve, and a cylindrical peripheral wall that is erected on the peripheral edge in the surface direction of the easily breakable wall portion and is disposed opposite to the outer peripheral surface of the electrolytic capacitor. And an elastic holding portion that fills a gap between the peripheral wall portion and the outer peripheral surface of the electrolytic capacitor in the circumferential direction.
前記キャップの外周面及び前記貫通孔の内周面の少なくとも一方に凹凸形状が形成され、当該凹凸形状によって前記貫通孔に前記キャップを嵌合させる嵌合部が構成されることを特徴とする請求項1に記載の電子機器。   An uneven shape is formed on at least one of an outer peripheral surface of the cap and an inner peripheral surface of the through hole, and a fitting portion for fitting the cap into the through hole is configured by the uneven shape. Item 2. The electronic device according to Item 1. 前記ケースには、外方に突出して前記電解コンデンサを挿入する筒状壁部が形成され、当該筒状壁部によって前記貫通孔が構成されていることを特徴とする請求項1又は請求項2に記載の電子機器。   3. The case according to claim 1, wherein the case is formed with a cylindrical wall portion that protrudes outward and into which the electrolytic capacitor is inserted, and the through-hole is formed by the cylindrical wall portion. The electronic device as described in. 前記弾性保持部が、前記周壁部の内周面から当該周壁部の径方向内側に突出する環状の内向突起部によって構成されることを特徴とする請求項1から請求項3のいずれか1項に記載の電子機器。   The said elastic holding part is comprised by the cyclic | annular inward protrusion part which protrudes in the radial inside of the said surrounding wall part from the internal peripheral surface of the said surrounding wall part, The any one of Claims 1-3 characterized by the above-mentioned. The electronic device as described in. 前記内向突起部が、その突出方向に向けて先細に形成されていることを特徴とする請求項4に記載の電子機器。   The electronic device according to claim 4, wherein the inward protrusion is tapered toward the protruding direction. 前記キャップを構成する前記易破断壁部、前記周壁部及び前記弾性保持部が、弾性変形可能な弾性材料によって一体に形成されていることを特徴とする請求項1から請求項5の何れか1項に記載の電子機器。   The easily breakable wall portion, the peripheral wall portion, and the elastic holding portion constituting the cap are integrally formed of an elastic material that can be elastically deformed. The electronic device as described in the paragraph.
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