JP2009529237A - System and method for cooling a server-based data center - Google Patents

Abstract

In accordance with one embodiment of the present invention, a cooling system for a heat generating structure includes a plurality of heat exchangers, a structure that directs a flow of fluid coolant in a substantially liquid form to each of the plurality of heat exchangers, and A structure that reduces the pressure of the fluid coolant to a pressure at which the fluid coolant has a boiling temperature less than that of the exothermic structure. Each of the plurality of heat exchangers is in thermal communication with at least one of its exothermic structures and has an inlet and an outlet. The thermal energy from the heat generating structure causes the fluid coolant in substantially liquid form to boil and evaporate in each of the plurality of heat exchangers, and the fluid coolant changes when the fluid coolant changes state. Makes it possible to absorb the heat energy from the heating structure.

Description

  The present invention relates generally to the field of cooling systems, and more particularly to systems and methods for cooling server-based data centers with sub-atmospheric cooling.

  A variety of types of structures can generate heat or heat energy during operation.

  To prevent such structures from overheating, a variety of types of cooling systems, including air conditioning systems, can be utilized to dissipate the thermal energy.

  In accordance with one embodiment of the present invention, a cooling system for a heating structure includes a plurality of heat exchangers, a structure that directs a flow of fluid coolant that is substantially in liquid form to each of the plurality of heat exchangers, And a structure that reduces the pressure of the fluid coolant to a pressure at which the fluid coolant has a boiling point less than the temperature of the heat generating structure. Each of the plurality of heat exchangers is in thermal communication with at least one heat generating structure and has an inlet and an outlet. The thermal energy from the heat generating structure causes the substantially liquid fluid coolant to boil and evaporate in each of the plurality of heat exchangers. This is because the fluid coolant can absorb the heat energy from the heat generating structure when the fluid coolant changes state.

  Certain embodiments of the present invention may provide a number of technical advantages. For example, a technical advantage of one embodiment may include the ability to increase data center cooling performance with reduced energy consumption. Another technical advantage in another embodiment may include the ability to minimize the need for conditioned air in the cooling system. Yet another technical advantage in another embodiment may include the ability to minimize the potential impact if a leak occurs in the cooling system.

  Although specific advantages are listed above, various embodiments may include all, some, or none of the listed advantages. Furthermore, other technical advantages may be readily apparent to those skilled in the art after reviewing the following figures and description.

  For a more complete understanding of embodiments of the present invention and its advantages, reference is now made to the following description, taken in conjunction with the accompanying drawings.

  While embodiments of the present invention are described below, it should first be understood that the present invention can be implemented using a variety of techniques, whether currently known or already exists. is there. The present invention should in no way be limited to the examples, drawings, and techniques described below, including the examples and implementations described and described herein. Further, the drawings are not necessarily drawn to scale.

  Conventional server-based data centers are typically cooled by cooling air. The American Society for Heating, Refrigerating and Air-Conditioning (ASHRAE) proposed grouping server cabinets in a row with conditioned air in the space between every other row. The cold air is drawn through the front of the cabinet to cool the electronics inside and then blows out behind it towards the ceiling where it is exhausted. In addition, the ASHRAE document proposed the use of heat pipes to concentrate the heat and loop thermosyphons to bring heat to the top of individual cabinets.

  The heat or heat energy is then removed from the top of the individual cabinets by cold conditioned air.

  Problems can arise with such a configuration. For modern data centers (eg, with 1300 server cabinets) that can be about 40000 square feet, the cooling requirements include about 1000 tons (3513 kW), including auxiliary cooling loads (lighting, fan heat, UPS, etc.). ) Can also be cooled. To meet these cooling requirements, the cooling system may require two 500 ton chillers with variable speed compressors and 40 30 ton chilled water computer room air conditioning units. In other words, these systems require a lot of energy consumption. Accordingly, it can be seen that some embodiments of the present invention teach a cooling system that efficiently increases the cooling performance of a data center with reduced energy consumption. It can also be seen that some embodiments of the present invention teach a cooling system that minimizes the need for conditioned air. Further, it can be seen that some embodiments of the present invention teach a configuration that minimizes the impact on the server when a leak occurs in the cooling system.

  FIG. 1 is a block diagram of an embodiment of a cooling system 10 that may be utilized with other embodiments disclosed herein (ie, the embodiments described with reference to FIGS. 3-5B). Details of one cooling system are described below, but it is clearly understood that other cooling systems may be used with embodiments of the present invention, including the cooling system 100 described with reference to FIG. Should.

  The cooling system 10 of FIG. 1 illustrates cooling a structure 12 that is exposed to or generates heat energy. The structure 12 may be any of a variety of structures, including but not limited to electronic components, circuits, computers, and servers. Since the structure 12 can vary greatly, the details of the structure 12 are not illustrated or described.

  The cooling system 10 of FIG. 1 includes a vapor line 61, a liquid line 71, heat exchangers 23 and 24, a pump 46, inlet orifices 47 and 48, a condensation heat exchanger 41, an expansion reservoir 42, and a pressure controller 51.

  The structure 12 may be arranged and designed to conduct heat or heat energy to the heat exchangers 23,24. In order to receive this thermal energy or heat, the heat exchangers 23, 24 are placed on the edge of the structure 12 (eg, a thermosiphon, heat pipe or other device) or one of the structures 12. It may extend through the section (eg, through the thermal plane of the structure 12). In certain embodiments, the heat exchangers 23, 24 may extend to a component of the structure 12 so that they receive thermal energy directly from that component. Although two heat exchangers 23, 24 are shown in the cooling system 10 of FIG. 1, one heat exchanger or two or more heat exchangers may be used to cool the structure 12 in another cooling system. Good.

  During operation, fluid coolant flows through each of the heat exchangers 23, 24. As will be described below, this fluid coolant may be a two-phase fluid coolant and enters the inlet conduit 25 of the heat exchangers 23, 24 in liquid form. Absorption of heat from the structure 12 causes some or all of the liquid coolant to boil so that some or all of the fluid coolant exits the outlet conduit 27 of the heat exchangers 23, 24 in the gas phase. And evaporate. In order to facilitate such absorption or transfer of thermal energy, the heat exchangers 23, 24 increase the surface contact between the pin fins or, inter alia, its fluid coolant and the walls of the heat exchangers 23, 24. Other similar devices may be arranged side by side. Also, in certain embodiments, the fluid coolant is pressed against the heat exchangers 23, 24 to ensure fluid contact between the fluid coolant and the walls of the heat exchangers 23, 24; Alternatively, it may be sprayed.

  The fluid coolant exits the outlet conduit 27 and reaches the inlet conduit 25 of the heat exchangers 23, 24 again to reach the steam line 61, condensation heat exchanger 41, expansion reservoir 42, pump 46, liquid line. 71 and each of the two orifices 47 and 48 flow. The pump 46 circulates its fluid coolant around the loop shown in FIG. In certain embodiments, the pump 46 may use a magnetic drive that does not have a shaft seal that can wear or leak over time. Vapor line 61 uses the term “vapor” and liquid line 71 uses the term “liquid”, although each of the individual lines may have a different phase of fluid. For example, the liquid line 71 may contain some vapor and the vapor line 61 may contain some liquid.

  The orifices 47 and 48 in certain embodiments may facilitate proper separation of the fluid coolant between the individual heat exchangers 23, 24, and the heat at which the output of the pump 46 and the fluid coolant evaporates. It may be helpful to create a large pressure drop between the exchangers 23,24. Orifices 47 and 48 may have the same size, or may have different sizes to separate their coolant in a proportional manner that facilitates the desired cooling profile.

  The fluid (either gas or liquid) stream 56 may be forced to flow through the condensation heat exchanger 41 by, for example, a fan (not shown) or other suitable device. In certain embodiments, fluid flow 56 may be ambient fluid. The condensation heat exchanger 41 transfers heat from its fluid coolant to the ambient fluid stream 56, thereby condensing any portion of the fluid coolant that is in the gas phase to the liquid phase. In certain embodiments, a liquid bypass 49 may be provided for liquid fluid coolant that has exited heat exchangers 23, 24 or condensed from vapor fluid coolant during transfer to condensation heat exchanger 41. . In certain embodiments, the condensation heat exchanger 41 may be a cooling tower.

  Liquid fluid coolant exiting the condensation heat exchanger 41 may be supplied to the expansion reservoir 42. Because fluids typically occupy more volume when they are in the gas phase than when they are in the liquid phase, some or all of the coolant in the system moves from the liquid phase to the gas phase. An expansion reservoir 42 may be provided to receive a volume of liquid fluid coolant that is replaced when changed. In part, due to the fact that the amount of heat or thermal energy produced by structure 12 varies over time as the system of structure 12 operates in various modes of operation, fluid coolant in the gas phase. The amount of changes with time.

  Considering now further details of the fluid coolant, one very efficient technique for removing heat from the surface is to boil and evaporate the liquid in contact with the surface. As the liquid evaporates in this process, it inherently absorbs heat to effect such evaporation. The amount of heat that can be absorbed per unit volume of liquid is commonly known as the latent heat of vaporization of the liquid. As the latent heat of vaporization increases, the amount of heat that can be absorbed per unit volume of the liquid to be evaporated increases.

  The fluid coolant used in the embodiment of FIG. 1 may include, but is not limited to, a mixture of antifreeze and water, or water alone. In certain embodiments, the antifreeze may be ethylene glycol, propylene glycol, methanol, or other suitable antifreeze. In other embodiments, the mixture may also contain a fluoroinert. In certain embodiments, the fluid coolant can absorb a significant amount of heat during evaporation and therefore can have a very high latent heat of vaporization.

  Water boils at a temperature of about 100 ° C. at atmospheric pressure of 14.7 PSIA (pounds per square inch absolute pressure). In certain embodiments, by placing the fluid coolant under a sub-atmospheric pressure of about 2-3 PSIA, the boiling temperature of the fluid coolant can be reduced to between 55-65 ° C. As a result, in the cooling system 10 of FIG. 1, the orifices 47 and 48 have fluid coolant pressures downstream of them that are shown as fluid coolant pressure between the pump 46 and the orifices 47 and 48 (in this example about 12 PSIA). )) To be substantially lower. The pressure controller 51 is at a pressure of about 2-3 PSIA from the orifices 47 and 48 to the pump 46, particularly along the portions of the loop extending through the heat exchangers 23 and 24, the condensation heat exchanger 41, and the expansion reservoir 42. Maintain that coolant. In certain embodiments, a metal bellows may be used in the expansion reservoir 42 and connected to the loop using a brazed joint. In certain embodiments, the pressure controller 51 uses a motor driven linear actuator that is part of the metal bellows of the expansion reservoir 42 or a small gear pump to empty the loop to the desired pressure level. By using it, the loop pressure may be controlled. The removed fluid coolant is stored in a metal bellows whose fluid connection is brazed. In other configurations, the pressure controller 51 may utilize other suitable devices that can control pressure.

  In certain embodiments, fluid coolant flowing from pump 46 through liquid line 71 to orifices 47 and 48 may have a temperature of about 55-65 ° C. and a pressure of about 12 PSIA, as described above. After passing through orifices 47 and 48, the fluid coolant may still have a temperature of about 55-65 ° C, but may have a low pressure in the range of about 2-3 PSIA. Thanks to this reduced pressure, some or all of the fluid coolant will boil or evaporate as it passes through the heat exchangers 23 and 24 and absorbs heat from them.

  After exiting the outlet port 27 of the heat exchangers 23, 24, the subatmospheric coolant vapor condenses where heat or thermal energy can be transferred from the subatmospheric fluid coolant to the fluid stream 56 through the vapor line 61. Move to heat exchanger 41. The fluid flow 56 in certain embodiments may have a temperature of less than 50 ° C. In other examples, the flow 56 may have a temperature of less than 40 ° C. When heat is removed from the fluid coolant, any portion of the fluid that is in the gas phase will cause substantially all of the fluid coolant to be in liquid form as it exits the condensation heat exchanger 41. , Set. At this point, the fluid coolant may have a temperature of about 55-65 ° C. and a sub-atmospheric pressure of about 2-3 PSIA. The fluid coolant may then flow to a pump 46 that in certain embodiments may increase the pressure of the fluid coolant to a value in the range of about 12 PSIA as described above. Prior to pump 46 there may be a fluid connection to expansion reservoir 42 that can control the pressure in its cooling loop when used with pressure controller 51.

  It should be noted that the embodiment of FIG. 1 can operate without a refrigeration system. In the context of an electronic circuit such as may be used in structure 12, the absence of a refrigeration system results in the size, weight, and power of the structure being prepared to cool the circuit components of structure 12. It can lead to a significant reduction in consumption.

  FIG. 2 is a block diagram of another embodiment of a cooling system 100 that may be utilized with other embodiments disclosed herein (ie, the embodiments described with reference to FIGS. 3-5B). . The cooling system 100 of FIG. 2 may operate similarly to the cooling system 10 of FIG. However, the cooling system 100 of FIG. 2 also incorporates an air removal system 190. For various reasons, unintentional air or other fluids can be introduced into the cooling system 100. For example, in embodiments operating at sub-atmospheric pressure, the outer ambient fluid tends to leak into the sub-atmospheric system (ie, from high pressure to low pressure) in the presence of leaks in the system. Accordingly, the cooling system 100 may utilize the air removal system 190 to remove air or other fluid from the cooling system 100. The air removal system 190 in the embodiment of FIG. 2 includes an air pump 192, a regenerative heat exchanger 194, an air trap 196, and a regenerative charge valve 198.

  Referring to FIG. 2, the cooling loop of the cooling system 100 is similar to the cooling loop of the cooling system 10 of FIG. 1, for example, the heat exchanger 123, the pump 160, the liquid line 171, the vapor line 161, the expansion reservoir 142, A pressure controller 151 and a condensation heat exchanger 141 are included. However, the fluid or air leak 112 may enter the system at the heat exchanger 123 of the structure 112 or at other locations and travel within the steam line 161 to the condensation heat exchanger 141. In the condensation heat exchanger 141, the condensed coolant liquid passes while air (and any associated coolant vapor that may be present therein) is passed to the regenerative heat exchanger 194 using an air pump 192. Can be sent. The regenerative heat exchanger 194 can cool the air / coolant steam combination and condenses the steam from the air stream removed from the bottom of the condensation heat exchanger 141. The coolant separates from the air in the trap 196 while the air exits through the vent 195. A level switch 197 can be in communication with the regeneration fill valve 198 so that the regeneration fill valve 198 can be opened when recovered coolant is present. The recovered coolant can be reintroduced into the loop through the regeneration fill valve 198 and a conduit communicating with the pump 146.

  Although an example of an air removal system 190 is shown with reference to FIG. 2, other air removal systems may be used in other embodiments of the present invention with more, fewer, or alternative components. May be. Also, although the components of the embodiment in the cooling systems 10 and 100 are shown in FIGS. 1 and 2, it will be appreciated that other embodiments of the cooling system 10 have more, fewer, or different components. May be included. For example, while specific temperatures and pressures have been described for one embodiment of cooling systems 10 and 100, other embodiments of cooling systems 10 and 100 may operate at different temperatures and pressures. Also, in some embodiments, the coolant fill port and / or the coolant outflow port may be utilized with an intermetallic cap to seal them. Further, in some embodiments, all or part of the joints between the various components may be brazed using a metal tube sealing cap, soldered, or welded. .

  3A and 3B illustrate in a block diagram the transfer of thermal energy from the structure 212 to the cooling system, according to an embodiment of the present invention. In FIG. 3A, the heat exchanger 223 is disposed at the end of the structure 212. In such embodiments, the heat exchanger 223 may be a thermosiphon, a heat pipe, or other similar device. Although not explicitly shown, the structure 212 may include various features to enhance the transfer of thermal energy to the heat exchanger 223. The fluid is received in a substantially liquid phase through the liquid line 271 and evaporates in the heat exchanger 223. The fluid exits heat exchanger 223 to vapor line 261 in a substantially gaseous state.

  In FIG. 3B, a plurality of heat exchangers 223 are spread in the structure 212 to enhance the transfer of thermal energy. In each of these heat exchangers, fluid is received in a substantially liquid phase through liquid line 271 and evaporates in heat exchanger 223. The fluid exits heat exchanger 223 to vapor line 261 in a substantially gaseous state.

  FIG. 4 is a block diagram of a cooling system 300 according to an embodiment of the present invention. The cooling loop for the cooling system 300 can operate in a manner similar to the cooling loop for the cooling system 10 of FIG. 1 and the cooling system 100 of FIG. 2, for example, heat exchanger 323, pump 346, liquid Line 371, steam line 361, and condensation heat exchanger 341. The cooling system 300 can be used to cool a plurality of structures 312 (eg, servers in a data center).

  During operation, components in each of the servers or structures 312 may generate thermal energy that is dissipated to the heat exchanger 323. Each heat exchanger 323 in the server or structure 312 interacts with a common liquid line 371 and a supply vapor line 361. Each of the heat exchangers 323 receives fluid in a substantially liquid phase through the liquid line 371 and evaporates the fluid in the heat exchanger 323. The fluid exits the heat exchanger 323 to the vapor line 361 in a substantially gaseous state.

  As briefly described above in FIGS. 3A and 3B, in some embodiments, the heat exchanger 323 is disposed at the end of a server or structure 312, for example, as a thermosyphon, heat pipe, or other similar device. May be. In other embodiments, the heat exchanger 323 may span a portion of the structure 312 to enhance heat energy transfer. In any of these embodiments, the server or structure 312 may include a variety of features to enhance the transfer of thermal energy to the heat exchangers 323.

  In certain embodiments, the server or structure 312 may be located inside the building, while the condensation heat exchanger 341 and / or the pump 346 may be located outside the building.

  5A and 5B illustrate a subsystem 400 for the transfer of thermal energy from the structure 412 to the cooling system, according to an embodiment of the present invention. The subsystem 400 of FIGS. 5A and 5B may be utilized with the cooling systems 10, 100, and 300 of FIGS. 1, 2, and 4, or other cooling systems. The structure 412 is shown as a server tower and may hold a plurality of circuit card assemblies 492 and their associated chassis 462 on a shelf 488 or other suitable component. Subsystem 400 includes a liquid manifold line 482 that communicates with liquid line 471 of the cooling system and a gas phase manifold line 484 that communicates with vapor line 461 of the cooling system. To supply liquid coolant and receive gas phase coolant, the liquid manifold line 482 and the gas phase manifold line 484 can be arranged in various configurations. In certain embodiments, the liquid manifold line 482 and the gas phase manifold line 484 are disposed vertically at the rear of the rack 480.

  One or more electronic chassis 462 may each be plugged into a liquid manifold line 482 and a gas phase manifold line 484 to obtain a cooling function for the electronic chassis 462. The chassis 462 may have a heat exchanger 423 on its wall that includes an inlet port 425 (eg, for fluid coolant that is substantially liquid) and a (eg, substantially gas phase). Outlet port 427 (for fluid coolant). The inlet port 425 is fluidly coupled to the liquid manifold line 482 using various fluid coupling techniques, including but not limited to techniques utilizing seals, O-rings and other devices, and the outlet port 427 is A gas phase manifold line 484 may be fluidly coupled.

  Although the chassis 462 in the structure 412 in this example has been described as fluidly coupled to the liquid manifold line 482 and the gas phase manifold line 484, in other examples, the structure 412 can be shown, for example, in FIG. A series of coolant channels or heat exchangers piped to the walls of the rack 412 in a manner similar to that described with reference may be provided. In response, each of the chassis 462 easily slides into its assigned slot where it can be coupled or clamped to its coolant channel or heat exchanger. The advantage of such an embodiment is that the cooling system can be sealed. As a result, minimal disruption to such a sealed system occurs during insertion or removal of the chassis 462.

  Although the invention has been described in several embodiments, myriad changes, variations, modifications, variations and improvements may be suggested to one skilled in the art and the invention falls within the scope of the appended claims. Such changes, variations, modifications, variations and improvements are intended to be encompassed.

FIG. 6 is a block diagram of one embodiment of a cooling system that can be utilized with other embodiments. FIG. 6 is a block diagram of another embodiment of a cooling system that may be utilized with other embodiments. 2 is a block diagram illustrating the transfer of thermal energy from a structure to a cooling system in accordance with an embodiment of the present invention. FIG. 2 is a block diagram illustrating the transfer of thermal energy from a structure to a cooling system in accordance with an embodiment of the present invention. FIG. 1 is a block diagram of a cooling system according to an embodiment of the present invention. FIG. 3 is an illustration of a subsystem for transfer of thermal energy from a structure to a cooling system in accordance with an embodiment of the present invention. FIG. 3 is an illustration of a subsystem for transfer of thermal energy from a structure to a cooling system in accordance with an embodiment of the present invention.

Claims (20)

A cooling system for an exothermic structure located in an environment having an ambient pressure comprising:
A structure that reduces the pressure of the fluid coolant to a sub-atmospheric pressure where the fluid coolant has a boiling temperature below the temperature of the exothermic structure;
A plurality of heat exchangers, each of the plurality of heat exchangers being in thermal communication with at least one of the heat generating structures, each of the plurality of heat exchangers having an inlet and an outlet, wherein each inlet is Where each heat exchanger functions to receive fluid coolant in a substantially liquid form and each outlet functions to eject fluid coolant out of each heat exchanger in a substantially gas phase form. Multiple heat exchangers;
A structure that directs a flow of the fluid coolant that is substantially in liquid form to each of the plurality of heat exchangers, wherein thermal energy from the heat generating structure is substantially equal to each of the plurality of heat exchangers. A structure in which the fluid coolant in liquid form is boiled and evaporated to allow the fluid coolant to absorb thermal energy from the heat generating structure when the fluid coolant changes state; And a structure that receives the flow of fluid coolant from each of the plurality of heat exchangers in a substantially gas phase form;
Having a cooling system. A structure for directing a flow of the fluid coolant in a substantially liquid form to each of the plurality of heat exchangers and a flow of the fluid coolant in a substantially gas phase form from each of the plurality of heat exchangers. A condensing heat exchanger fluidly coupled to a receiving structure such that the condensing heat exchange condenses a fluid coolant in a substantially gas phase form into a fluid coolant in a substantially liquid form. Further comprising a functioning heat exchanger,
The cooling system of claim 1. The condensation heat exchanger is a water tower;
The cooling system of claim 2. The heat generating structure is a server.
The cooling system of claim 1. The fluid is water;
The cooling system of claim 1. At least some of the plurality of heat exchangers are configured to direct the flow of fluid coolant in a substantially liquid form to each of the plurality of heat exchangers, and from each of the plurality of heat exchangers Removably connectable to a structure that receives the flow of fluid coolant in substantially gas phase form;
The cooling system of claim 1. The heat generating structure includes a thermosyphon that receives heat energy from the heat generating structure; and
The plurality of heat exchangers function to receive thermal energy from the thermosyphon;
The cooling system of claim 1. A plurality of heat exchangers for at least one of the heating structures;
A liquid manifold line coupled to each of the plurality of heat exchangers for the at least one of the heating structures, the liquid manifold line:
Receiving fluid coolant from a structure that directs the flow of fluid coolant in substantially liquid form to each of the plurality of heat exchangers; and
A liquid manifold line operative to direct a flow of the fluid coolant in substantially liquid form to each of the plurality of heat exchangers for the at least one of the heating structures;
A gas phase manifold line coupled to each of the plurality of heat exchangers for the at least one of the heating structures, the gas phase manifold line:
Receiving the flow of fluid coolant in substantially gaseous form from each of the plurality of heat exchangers for the at least one of the heating structures; and
A gas functioning to direct the flow of fluid coolant in a substantially gaseous form to a structure that receives the flow of fluid coolant in a substantially gaseous form from each of the plurality of heat exchangers. A phase manifold line;
The cooling system of claim 1. The plurality of heat exchangers can be removably coupled to the liquid manifold line and the gas phase manifold line.
The cooling system of claim 8. A cooling system for a heating structure comprising:
A plurality of heat exchangers, each of the plurality of heat exchangers being in thermal communication with at least one of the heat generating structures, each of the plurality of heat exchangers having an inlet and an outlet, wherein each inlet is Where each heat exchanger functions to receive fluid coolant in a substantially liquid form, and each outlet functions to eject fluid coolant out of each heat exchanger in a substantially gas phase form. Multiple heat exchangers;
A structure that directs a flow of the fluid coolant that is substantially in liquid form to each of the plurality of heat exchangers, wherein thermal energy from the heat generating structure is substantially equal to each of the plurality of heat exchangers. A structure in which the fluid coolant in liquid form is boiled and evaporated to allow the fluid coolant to absorb heat energy from the heat generating structure when the fluid coolant changes state;
Having a cooling system. Further comprising a structure for reducing the pressure of the fluid coolant to a pressure at which the fluid coolant has a boiling temperature less than the temperature of the exothermic structure.
The cooling system of claim 10. The heat generating structure is disposed in an environment having an atmospheric pressure, and the pressure of the fluid coolant is reduced to a sub-atmospheric pressure;
The cooling system of claim 11. Further comprising a structure for receiving a flow of the fluid coolant in a substantially gas phase form from each of the plurality of heat exchangers;
The cooling system of claim 10. A structure for directing a flow of the fluid coolant in a substantially liquid form to each of the plurality of heat exchangers and a flow of the fluid coolant in a substantially gas phase form from each of the plurality of heat exchangers. A condensing heat exchanger fluidly coupled to a receiving structure such that the condensing heat exchange condenses a fluid coolant in a substantially gas phase form into a fluid coolant in a substantially liquid form. Further comprising a functioning heat exchanger,
The cooling system of claim 13. A plurality of heat exchangers for at least one of the heating structures;
A liquid manifold line coupled to each of the plurality of heat exchangers for the at least one of the heating structures, the liquid manifold line:
Receiving fluid coolant from a structure that directs a flow of the fluid coolant in substantially liquid form to each of the plurality of heat exchangers; and
A liquid manifold line that functions to direct a flow of the fluid coolant that is substantially in liquid form to each of the plurality of heat exchangers for the at least one of the heating structures;
A gas phase manifold line coupled to each of the plurality of heat exchangers for the at least one of the heating structures, the gas phase manifold line:
Receiving the flow of fluid coolant in substantially gaseous form from each of the plurality of heat exchangers for the at least one of the heating structures; and
A gas functioning to direct the flow of fluid coolant in a substantially gaseous form to a structure that receives the flow of fluid coolant in a substantially gaseous form from each of the plurality of heat exchangers. A phase manifold line;
The cooling system of claim 13. At least some of the plurality of heat exchangers are configured to direct the flow of fluid coolant in a substantially liquid form to each of the plurality of heat exchangers, and from each of the plurality of heat exchangers Removably connectable to a structure that receives the flow of fluid coolant in substantially gas phase form;
The cooling system of claim 13. A method for cooling an exothermic structure comprising:
Providing a plurality of heat exchangers, each of the plurality of heat exchangers being in thermal communication with at least one of the exothermic structures, wherein each of the plurality of heat exchangers is the plurality of heat exchanges. Each of the vessels has an inlet and an outlet, each inlet functioning to receive a fluid coolant in each heat exchanger in a substantially liquid form, and each outlet in a substantially gas phase form. A step that functions to pump fluid coolant out of the heat exchanger;
Reducing the pressure of the fluid coolant to a pressure at which the fluid coolant has a boiling temperature less than that of the heat generating structure; and the fluid coolant can absorb heat from each of the plurality of heat exchangers. Thermally communicating the fluid coolant with each of the plurality of heat exchangers through a structure;
Having a method. The heat generating structure is disposed in an environment having an atmospheric pressure, and the pressure of the fluid coolant is reduced to a sub-atmospheric pressure;
The method of claim 17. Providing a plurality of heat exchangers for at least one of the heating structures;
Receiving the fluid coolant in a substantially liquid form at a liquid manifold line coupled to each of a plurality of heat exchangers for at least one of the heat generating structures; and from the liquid manifold line substantially Directing fluid coolant in liquid form to each of the plurality of heat exchangers for at least one of the heating structures;
18. The method of claim 17, further comprising: The plurality of heat exchangers can be removably coupled from the structure.
The method of claim 17.

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