JP2009295811A - Interposer bonding method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an interposer bonding method capable of physically, electrically and highly surely bonding an interposer and a base circuit sheet to each other. <P>SOLUTION: The interposer bonding method includes: an adhesive applying step of providing an adhesive arrangement layer 25 made of an electrically insulating adhesive, on a surface of a base-side terminal 22 out of a surface of a base circuit sheet 20; an interposer disposing step of disposing an interposer 10 on the surface of the base circuit sheet 20; and a pressure bonding step of applying a pressure to the base circuit sheet 20 and the interposer 10. The base-side terminal 22 of the base circuit sheet 20 before bonding of the interposer 10 is formed with a concave recess 220 where a bump electrode 26 is stored. In the pressure bonding step, the bump electrode 26 stored in the recess 220 is pushed up into press contact with an interposer-side terminal 12 by deforming the recess 220 so as to push up it from the bottom. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a joining method for joining an interposer as an electronic component to a base circuit sheet.

  Conventionally, as an interposer bonding method for bonding an interposer as an electronic component to a base circuit sheet, for example, a method of bonding an interposer connection terminal with an insulating adhesive applied to the surface of the connection terminal of the base circuit sheet is known. It has been. For example, there is a bonding method in which the connection terminal of the interposer is bonded to the connection terminal of the base circuit sheet in which the application region and the non-application region of the insulating adhesive are formed. In this interposer joining method, the physical connection between the connection terminals in the part that abuts with the insulating adhesive and the electrical connection between the connection terminals in the part that abuts without interposing the insulating adhesive. It is going to be realized simultaneously (for example, refer to Patent Document 1).

  However, the conventional interposer joining method has the following problems. That is, in the above interposer bonding method, depending on the coating pattern of the insulating adhesive and the amount of coating, there is a possibility that it is impossible to achieve both physical bonding and electrical bonding between the connection terminals. If the ratio of the application area | region of an insulating adhesive agent increases in the surface of a connection terminal, there exists a possibility that electrical joining may become inadequate although physical joining is enough. On the other hand, when the ratio of the unapplied region of the insulating adhesive increases, physical bonding becomes insufficient, which may result in failure to maintain high reliability of electrical bonding.

JP 2003-69216 A

  The present invention has been made in view of the above-described conventional problems, and is a joining method for joining an interposer to a base circuit sheet, which joins the interposer and the base circuit sheet with high physical and electrical certainty. It is an object of the present invention to provide an obtained interposer joining method.

The present invention provides an interposer joining method for joining an interposer, which is an electronic component having an interposer side terminal, to a base circuit sheet provided with a base side terminal on the surface of a sheet-like base substrate.
An adhesive application step of providing an adhesive disposition layer made of an electrically insulating adhesive on at least the surface of the base-side terminal of the surface of the base circuit sheet;
An interposer placement step of placing the interposer on the surface of the base circuit sheet so that the base side terminal and the interposer side terminal face each other via the adhesive placement layer;
A pressure bonding step of pressing and bonding the base circuit sheet and the interposer,
The base side terminal of the base circuit sheet before joining the interposer is formed with a concave recess that accommodates the electrode member,
The pressure bonding step is a step of pushing up the electrode member accommodated in the depression by deforming the depression so that the depression is pushed up from the bottom side and pressing the electrode member against the interposer side terminal. It exists in the joining method (Claim 1).

  The base circuit sheet (before bonding) handled by the interposer bonding method of the present invention is a sheet-like electronic substrate including the base-side terminal including the hollow portion in which the electrode member is accommodated. And the said interposer joining method is the joining containing the said interposer arrangement | positioning process which arrange | positions the said interposer on the surface of this base circuit sheet, and the said pressurization joining process of pressurizing and joining the said base circuit sheet and the said interposer. Is the method.

  In the interposer arrangement step, the interposer is arranged on the surface of the base circuit sheet so that the base-side terminal including the depression and the interposer-side terminal face each other through the adhesive-disposing layer. In the pressure bonding step, by deforming the depression so as to be pushed up from the bottom side, the electrode member accommodated in the depression is pushed up and pressed against the interposer side terminal.

  When the electrode member is pressed against the interposer side terminal, the electrical connection between the base side terminal and the interposer side terminal is realized with high reliability. On the other hand, in the part where the electrode member is not pressed, the interposer side terminal and the base side terminal are physically separated by the electrically insulating adhesive existing between the interposer side terminal and the base side terminal. Bonding is realized with high reliability.

  As described above, in the interposer bonding method according to the present invention, physical bonding via the electrically insulating adhesive and electrical connection via the electrode member are performed at the bonding location between the interposer side terminal and the base side terminal. Can be realized at the same time with high certainty.

  The base substrate of the present invention includes PET (polyethylene terephthalate) film, PPS (polyphenylene sulfide) resin, PLA (polylactic acid) resin, synthetic resin such as general-purpose engineering plastic, paper, nonwoven fabric, aluminum foil, copper foil, etc. It can be formed of a metal material or a material such as glass. Furthermore, as the electrical insulating adhesive, a hot melt adhesive, an epoxy adhesive, an acrylic adhesive, an elastic adhesive, or the like can be used.

  Note that the deformation of the depression so as to push up from the bottom means that the depression is pushed up from the bottom of the depression toward the interposer. The push-up direction is not limited to the upper side in the vertical direction.

The interposer includes an electronic component in which a semiconductor chip such as an IC chip is mounted on a sheet-shaped chip holding substrate, a sheet-shaped electronic component on which an electronic circuit is printed, a film-shaped electronic substrate on which an electronic circuit is formed, a metal There is an electronic component having an electronic circuit printed on the surface of the sheet.

Moreover, the hollow part formation process which provides the said hollow part in the said base side terminal formed in the smooth surface of the said base base material,
And a bump forming step of disposing the electrode member in the recess (claim 2).
In this case, the said hollow part can be formed by performing the said hollow part shaping | molding process with respect to the said base base material after forming the said base side terminal. Then, the said electrode member can be accommodated in the said hollow part by performing the said bump formation process further.

In addition, a terminal forming step of forming the base-side terminal including the recessed portion by forming a conductive material arrangement layer on the surface of the base substrate provided with a recess in advance;
And a bump forming step of disposing the electrode member in the recess.
In this case, the base-side terminal provided with the depression can be formed by performing the terminal forming step on the base substrate on which the recess is provided in advance. Then, if the said bump formation process is given, the said electrode member can be accommodated in the said hollow part.

Further, the electrically insulating adhesive is an adhesive exhibiting thermoplasticity,
The pressure bonding step is a step of pressing the base circuit sheet and the interposer using a pair of press dies, and at least one of the pair of press dies heats the pressing surface. It is preferable that the heater is provided (claim 4).
In this case, the fluidity can be increased by heating the electrically insulating adhesive with the heater. If the fluidity of the electrical insulating adhesive is increased, it becomes easy to push up the electrode member while pushing away the electrical insulating adhesive, and the electrode member is pushed relatively easily against the interposer side terminal. You will be able to guess.

  The base substrate may be formed of a thermoplastic material. In this case, the base substrate can be easily deformed by heating with the heater. Materials such as PS (polystyrene), PC (polycarbonate), PA (polyamide), PP (polypropylene), PPE (polyphenylene ether), and PET can be used as the thermoplastic material. Furthermore, as the electrical insulating adhesive, a hot melt adhesive, an epoxy adhesive, an acrylic adhesive, an elastic adhesive, or the like can be used.

Moreover, it is preferable that the adhesive arrangement | positioning area | region which forms the said adhesive arrangement | positioning layer in the said adhesive coating process includes the interposer arrangement | positioning area | region which arrange | positions the said interposer in the said interposer arrangement | positioning process. ).
In this case, a method (paste) surface made of the electrically insulating adhesive can be formed between the outer peripheral side surface of the interposer and the surface of the base circuit sheet. Therefore, physical bonding between the interposer and the base circuit sheet can be realized with higher reliability by the electrically insulating adhesive attached not only to the surface of the interposer but also to the outer peripheral side surface.

Further, the base circuit sheet is an electronic component in which an antenna pattern for transmitting or receiving radio waves is formed on the surface of the base substrate, and the interposer is formed on the surface of the sheet-like chip holding substrate with RF- An electronic component on which an IC chip for ID is mounted is preferable.
Here, RF-ID is an abbreviation for Radio Frequency IDentification. And when producing the RF-ID media which joined the said interposer to the said base circuit sheet by the interposer joining method of this invention, the said interposer and the said base circuit sheet are joined with high physical and electrical certainty. Highly reliable and excellent quality products can be manufactured efficiently. In addition, it is also possible to produce ID media for contact ID using the said interposer joining method.

  The sheet-like chip holding substrate is made of metal materials such as stainless steel, aluminum foil, copper foil, synthetic resin such as PET (polyethylene terephthalate) film, PPS (polyphenylene sulfide) resin, PLA (polylactic acid) resin, general-purpose engineering plastics, etc. Alternatively, it can be formed of a material such as paper, non-woven fabric, or glass. The material of the chip holding substrate and the material of the base substrate may be the same material combination or different material combinations.

The embodiment of the present invention will be specifically described with reference to the following examples.
(Example 1)
This example is an example of a method for manufacturing an electronic component in which the interposer 10 is bonded to the base circuit sheet 20, particularly an interposer bonding method for the base circuit sheet 20. The contents will be described with reference to FIGS.
This example relates to an interposer joining method for joining the interposer 10 to the base circuit sheet 20. The interposer 10 includes an RF-ID IC chip 11 mounted on the surface of a sheet-like chip holding base material 13 and has an interposer-side terminal 12 that is a connection terminal extending from the IC chip 11. It is. The base circuit sheet 20 is an electronic component in which a base-side terminal 22 is provided on the surface of a sheet-like base substrate 21.
This interposer joining method includes an adhesive application step in which an adhesive disposing layer 25 made of an electrically insulating adhesive is provided on the surface of the base side terminal 22 in the surface of the base circuit sheet 20, and the base side terminal 22 and the interposer side. An interposer placement step for placing the interposer 10 on the surface of the base circuit sheet 20 so that the terminals 12 face each other via the adhesive placement layer 25, and a pressure bonding step for pressurizing the base circuit sheet 20 and the interposer 10 And a method including:
The base-side terminal 22 of the base circuit sheet 20 before joining the interposer 10 is formed with a concave recess 220 in which an electrode member 26 (hereinafter referred to as a bump electrode 26) is accommodated.
The pressure bonding process is a process in which the bump electrode 26 accommodated in the depression 220 is pushed up and pressed against the interposer side terminal 12 by deforming the depression 220 so as to push up from the bottom side.
This content will be described in detail below.

  The electronic component 1 manufactured using the interposer joining method of this example is a RF-ID (Radio-Frequency IDentification) medium for non-contact ID as shown in FIGS. 1). The RF-ID medium 1 is an electronic device in which an interposer 10 on which an IC chip 11 for RF-ID is mounted and a base circuit sheet 20 provided with an antenna pattern 24 (hereinafter referred to as an antenna sheet 20 as appropriate). It is a part. In addition, ID media for contact ID can also be produced using the interposer joining method of this example.

  As shown in FIGS. 1 to 3, the interposer 10 is an electronic component in which the IC chip 11 is mounted on the surface of a chip holding base material 13 made of a PSF (polysulfone) film having a thickness of 177 μm. The size of the chip holding substrate 13 is set to a size that includes the formation region of the pair of base-side terminals 22 of the antenna sheet 20. The surface of the chip holding base 13 includes a conductive pad (not shown) that is electrically joined to an electrode pad (not shown) of the IC chip 11 and an interposer side terminal 12 extending from the conductive pad. A pair of conductive patterns is formed. This conductive pattern is a printed pattern made of conductive ink.

  Here, as a material of the chip holding base material 13, PC, processed paper, etc. can be adopted in addition to the PSF of this example. Further, an underfill material, a potting material, or the like may be used in order to protect the electrical joint portion between the conductive pad and the electrode pad. Moreover, as a method of forming the conductive pattern of the chip holding substrate 13, instead of the method of printing the conductive ink of this example, copper etching, dispensing, metal foil pasting, metal direct vapor deposition, metal vapor deposition film transfer, A method such as formation of a conductive polymer layer may be employed.

  As shown in FIGS. 1 to 3, the antenna sheet 20 is a sheet-like component in which an antenna pattern 24 printed with conductive ink is provided on the surface of a thermoplastic base substrate 21 made of PET and having a thickness of 50 μm. . Base-side terminals 22 that are electrically joined to the interposer-side terminals 12 are formed at both ends of the antenna pattern 24. Six concave depressions 220 arranged in three rows and two columns are formed on the surface of the base-side terminal 22, and a bump electrode 26 made of a silver paste is formed on at least a part of the concave depressions 220. Contained. In addition, the code | symbol 221 in FIG.2, FIG3 and FIG.9 has shown the part which the hollow part 220 buckled in the height direction. The cross-sectional shape of the recess 220 before buckling is as shown in FIGS.

  As with the conductive pattern formed on the chip holding substrate 13, the antenna pattern 24 is formed by a method such as copper etching, dispensing, metal foil pasting, direct metal vapor deposition, metal vapor deposition film transfer, or conductive polymer layer formation. It can also be formed. In addition to the PET of this example, PET-G, PC, PP, nylon, paper, etc. can be used as the material of the base substrate 21. As the ink material for the conductive ink, silver, graphite, silver chloride, copper, nickel, or the like can be used. Furthermore, as a material for forming the bump electrode 26, various conductive materials such as a copper paste, an aluminum paste, a solder member, a brazing material, silver powder, and carbon can be used instead of the silver paste of this example.

  Next, a method for joining the interposer 10 to the antenna sheet 20 will be described. The interposer joining method of this example includes a recess forming step for forming the recess 220 on the surface of the base-side terminal 22, a bump forming step for disposing the bump electrode 26 inside the recess 220, and bonding to the surface of the antenna sheet 20. A bonding method including an adhesive application step for providing the agent arrangement layer 25, an interposer arrangement step for arranging the interposer 10 on the surface of the antenna sheet 20, and a pressure bonding step for pressurizing and bonding the interposer 10 and the antenna sheet 20 to each other. It is.

  As shown in FIGS. 4 and 5, the dent forming step is a step of forming a concave dent 220 on the surface of the base-side terminal 22. In the recess forming step, the recess 220 is formed in the base-side terminal 22 using the press dies 40 facing each other. The pressing surface of the punch 41 (upper die) that contacts the surface of the base-side terminal 22 in the press die 40 has six convex portions 410 arranged in three rows and two columns at a position corresponding to the base-side terminal 22. is doing. A concave portion (not shown) corresponding to the convex portion 410 is formed on the pressing surface of a die (not shown) that contacts the back surface of the base side terminal 22. In this example, the protrusion height of the convex portion 410 having a substantially rectangular cross section is set to 150 μm so that a concave recess 220 having a depth of 100 μm can be formed in the base side terminal 22.

In addition, as the depth of the hollow part 220, the range of 30-300 micrometers is preferable, and it is good to set the protrusion height of the said convex part 410 in the range of 50-500 micrometers for that purpose.
Furthermore, as the shape of the convex portion 410 provided on the punch 41, convex portions having various shapes such as a columnar shape, a cross shape, and a comb shape can be formed instead of the substantially rectangular shape in this example. Depending on the shape of the portion 410, various shapes of recessed portions can be formed.

  As shown in FIGS. 6 and 7, the bump forming step is a step of forming the bump electrode 26 in the recess 220. The bump electrode 26 formed in the bump forming process of this example is a portion where the silver paste is solidified to be a lump. In the bump forming process of this example, a liquid silver paste is sprayed toward the recessed portion 220 by an ink jet device to form the bump electrode 26. A region 261 in FIG. 6 represents a silver paste spraying region. The region 261 may be a region including at least one recess 220, and is not essential to include all the recesses 220. This is because the object of the present invention can be realized if the bump electrode 26 can be formed in at least one of the six recessed portions 220.

  As shown in FIGS. 6 and 7, the adhesive application step is a step of applying an electrically insulating adhesive to the adhesive arrangement region 250 including the pair of base-side terminals 22 of the antenna sheet 20. The adhesive placement area 250 is an area that includes the interposer placement area 150 in which the interposer 10 is placed. In this example, as shown in FIG. 7, the adhesive disposing layer 25 having a thickness t = 40 μm is provided in the adhesive disposing region 250.

  In this example, as the electrically insulating adhesive, a thermoplastic and moisture-curable hot melt adhesive (model number TE-031 manufactured by 3M) was used. In addition, as an electrically insulating adhesive, it can replace with the above and can utilize an epoxy adhesive, an acrylic adhesive, an elastic adhesive, a urethane adhesive, etc. Furthermore, instead of the moisture curable electrical insulating adhesive, an electrical insulating adhesive such as a thermosetting, ultraviolet curable, or electron beam curable adhesive may be used.

  The interposer arrangement step is a step of arranging the interposer 10 on the surface of the antenna sheet 20 as shown in FIGS. In this interposer arrangement step, the interposer 10 is arranged on the surface of the antenna sheet 20 so that the base side terminal 22 (antenna sheet 20) and the interposer side terminal 12 (interposer 10) face each other. Here, as described above, the interposer arrangement area 150 is an area included in the adhesive arrangement area 250. Therefore, the interposer 10 arranged by the interposer arrangement process faces the antenna sheet 20 through the adhesive arrangement layer 25 over the entire surface.

  The pressure bonding step is a step of pressing and bonding the antenna sheet 20 and the interposer 10 as shown in FIGS. In the pressure bonding step, the bump electrode 26 is pressed against the interposer-side terminal 12 by deforming the recessed portion 220 of the antenna sheet 20 so as to be pushed up from the bottom side.

  The press die 30 for performing the pressure bonding process has a press anvil 32 (upper die) and a die 31 (lower die) facing each other. The pressing surfaces of the press anvil 32 and the die 31 are both substantially flat surfaces. A heater (not shown) is disposed on the die 31 that contacts the antenna sheet 20. According to this heater, the antenna sheet 20 made of a thermoplastic material can be easily deformed, and the fluidity of the electrically insulating adhesive exhibiting thermoplasticity can be increased. In this example, the temperature of the pressing surface of the die 31 was set to 200 ° C.

  Here, the pressure bonding process of the base side terminal 22 and the interposer side terminal 12 in the pressure bonding process of the present example will be specifically described. As shown in FIGS. 8 and 9, when the antenna sheet 20 and the interposer 10 are pressed by the press anvil 32 and the die 31, the depression 220 of the base side terminal 22 (antenna sheet 20) is deformed so as to be pushed up. As described above, when the recess 220 is deformed, the bump electrode 26 (lumped silver paste) in the recess 220 is pushed up, and the electric insulating adhesive covering the surface of the base terminal 22 is pushed away to the interposer terminal 12. Push it.

  In this example, the antenna sheet 20 is formed of a thermoplastic material as described above, and an electrically insulating adhesive having thermoplasticity is employed. In the antenna sheet 20 heated by the die 31, the recess 220 of the base-side terminal 22 is easily deformed, and the bump electrode 26 can be efficiently pushed up toward the interposer-side terminal 12. The electrically insulating adhesive heated by the die 31 and improved in fluidity is pushed away in response to the bump electrode 26 being pushed up. As a result, the electrically insulating adhesive flows out from the facing portion between the bump electrode 26 and the interposer side terminal 12, and the bump electrode 26 directly presses against the interposer side terminal 12.

  As shown in FIGS. 2, 3, and 9, the bump electrode 26 is pressed against the interposer-side terminal 12 among the joining positions of the interposer-side terminal 12 and the base-side terminal 22 joined by the pressure joining process. In the part where the two are connected, electrical connection between the two is realized with high reliability. On the other hand, in the portion where the bump electrode 26 is not pressed against the interposer side terminal 12, the physical connection between the interposer side terminal 12 and the base side terminal 22 is performed via an electrically insulating adhesive that covers the surface of the base side terminal 22. Bonding is realized with high reliability.

  In the pressure bonding process of this example, the interposer 10 and the antenna sheet 20 are pressurized by applying a pressure of about 500 N between the die 31 and the press anvil 32 and pressing for about 0.1 second. Joined. In this example, in order to perform the pressurization by the above-described pressure between the die 31 and the press anvil 32, the two are brought close to each other until the gap between the die 31 and the press anvil 32 becomes approximately 237 μm.

  As described above, according to the interposer bonding method of this example, the interposer-side terminal 12 and the base-side terminal 22 are pressed and bonded to each other, so that the electric bonding and the electric insulating bonding via the bump electrode 26 are performed. Physical joining through the agent can be realized with high certainty. According to this interposer joining method, the interposer 10 can be joined to the surface of the base circuit sheet 20 with high reliability, and the RF-ID media 1 with high reliability can be manufactured.

  In particular, in this example, the interposer arrangement area 150 is formed to be included in the adhesive arrangement area 250 as described above. Therefore, a method (paste) surface made of an electrically insulating adhesive can be formed between the outer peripheral side surface of the interposer 10 and the surface of the antenna sheet 20, and physical bonding between the interposer 10 and the antenna sheet 20 is further ensured. Highly realizable.

  In this example, the concave depression 220 is formed by pressing the base substrate 21 provided with the base-side terminals 22. Instead of this, the base-side terminal 22 including the concave recess 220 may be formed by forming a conductive material arrangement layer on the surface of the base substrate 21 provided with a recess in advance.

  Furthermore, a concave recess may be formed on the surface of the interposer side terminal 12, and the bump electrode 26 may be disposed in the recess. In this case, the chip holding substrate 13 may be formed of a thermoplastic material, and a heater may be provided on the press anvil 32 that contacts the interposer 10. If the pressure bonding step is performed using a press anvil 32 provided with a heater, the concave depressions of the interposer-side terminal 12 can be easily deformed and the bump electrode 26 can be pushed up efficiently.

  In addition, the interposer joining method of this example is not limited to the manufacture of the RF-ID media 1, but is effective in the production of various electronic components using the interposer 10. For example, it can be utilized in the manufacturing process of various electronic components such as FPC (flexible printed circuit board), paper computer, and disposable electrical products. The interposer 10 may be an electronic component on which an electronic circuit is formed in addition to an electronic component on which a semiconductor chip such as an IC chip is mounted.

  Furthermore, the pressure bonding process may be performed using a press die provided with an ultrasonic vibration unit. At the location where the interposer side terminal 12 and the base side terminal 22 are joined via the bump electrode 26, both can be fused by ultrasonic joining, and the reliability of the electrical joining state can be further improved.

  Furthermore, in this example, the adhesive arrangement area 250 is formed so as to include the interposer arrangement area 150. By reversing this inclusion relationship, the adhesive placement area 250 can be made smaller than the interposer placement area 150. Also, it is possible to form an adhesive disposition region independently for each of the two base side terminals 22.

  Although the specific example of this invention was described in detail like this example, these specific examples are only disclosing the example of the technique included in a claim. Needless to say, the scope of the claims should not be construed as limited by the configuration, numerical values, or the like of the specific examples. The scope of the claims includes techniques obtained by variously modifying or changing the above specific examples using known techniques, knowledge of those skilled in the art, and the like.

FIG. 3 is a structural diagram showing the structure of an RF-ID medium in the first embodiment. Sectional drawing which shows the cross-sectional structure of RF-ID media in Example 1 (AA arrow directional cross-sectional view in FIG. 1). Sectional drawing which shows the cross-section of RF-ID media in Example 1 (BB sectional view taken on the line in FIG. 2). Explanatory drawing explaining the content of the hollow part formation process in Example 1. FIG. The front view which shows the antenna sheet | seat in which the hollow part in Example 1 was formed. The front view which shows the antenna sheet which ejected the silver paste in Example 1. FIG. Sectional drawing which shows the cross-section of an interposer and an antenna sheet | seat in Example 1 (sectional drawing corresponded in the AA arrow cross section in FIG. 1). Sectional drawing which shows the cross-sectional structure of the interposer and antenna sheet before pressure joining in Example 1. FIG. Explanatory drawing explaining the content of the pressure bonding process in Example 1. FIG.

Explanation of symbols

1 Electronic components (RF-ID media)
10 Interposer 11 IC chip 12 Interposer side terminal 13 Chip holding substrate 20 Base circuit sheet (antenna sheet)
21 Base substrate 22 Base side terminal 220 Recessed portion 24 Antenna pattern 25 Adhesive arrangement layer 26 Electrode member (bump electrode)
30 Press mold 31 Die (lower mold)
32 Press anvil (upper mold)
40 Press mold 41 Punch (upper mold)

Claims (6)

In an interposer joining method for joining an interposer, which is an electronic component having an interposer side terminal, to a base circuit sheet having base side terminals provided on the surface of a sheet-like base substrate,
An adhesive application step of providing an adhesive disposition layer made of an electrically insulating adhesive on at least the surface of the base-side terminal of the surface of the base circuit sheet;
An interposer placement step of placing the interposer on the surface of the base circuit sheet so that the base side terminal and the interposer side terminal face each other via the adhesive placement layer;
A pressure bonding step of pressing and bonding the base circuit sheet and the interposer,
The base side terminal of the base circuit sheet before joining the interposer is formed with a concave recess that accommodates the electrode member,
The pressure bonding step is a step of pushing up the electrode member accommodated in the depression by deforming the depression so that the depression is pushed up from the bottom side and pressing the electrode member against the interposer side terminal. Joining method. In Claim 1, The hollow part formation process which provides the said hollow part in the said base side terminal formed in the smooth surface of the said base base material,
A bump forming step of disposing the electrode member in the recess. In Claim 1, the terminal formation process which forms the base side terminal containing the hollow part by forming the arrangement layer of a conductive material in the surface of the base substrate which provided the concave part beforehand.
A bump forming step of disposing the electrode member in the recess. In any one of Claims 1-3, the said electrically insulating adhesive agent is an adhesive agent which exhibits thermoplasticity,
The pressure bonding step is a step of pressing the base circuit sheet and the interposer using a pair of press dies, and at least one of the pair of press dies heats the pressing surface. An interposer joining method characterized by comprising a heater.   5. The adhesive disposing region for forming the adhesive disposing layer in the adhesive applying step in any one of claims 1 to 4 includes an interposer disposing region for disposing the interposer in the interposer disposing step. An interposer joining method characterized by comprising:   6. The base circuit sheet according to claim 1, wherein the base circuit sheet is an electronic component in which an antenna pattern for transmitting or receiving radio waves is formed on a surface of the base substrate, and the interposer is in a sheet form. An interposer joining method comprising: an electronic component having an RF-ID IC chip mounted on the surface of the chip holding substrate.

Images