JP2009231331A - Method of manufacturing laminate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a laminate by which a collective substrate can be easily split and manufacturing cost be reduced. <P>SOLUTION: The method of manufacturing a laminate includes: a first step to (i) prepare a collective substrate 20 where a resin substrate 18 is stacked on one main surface of a ceramic substrate 10 and a split groove 11 is formed from the other main surface of the ceramic substrate 10; and a second step to (ii) press the side of the resin substrate 18 of the collective substrate 20, split the collective substrate 20 along the split groove 11 of the ceramic substrate 10 and form one or more pieces of a laminate 22. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a laminate, and more particularly, to a method for manufacturing a laminate in which a resin substrate is laminated on a ceramic substrate.

  Conventionally, a method of manufacturing a plurality of laminated bodies by dividing an aggregate substrate has been proposed.

For example, as shown in the cross-sectional view of FIG. 5, after the circuit components 111 and 112 are mounted on the front surface 121 of the ceramic substrate 102 in which the division grooves 104 are formed from the back surface 122 side, the ceramic on which the circuit components 111 and 112 are mounted. The resin substrate 103 is formed by coating the surface of the substrate 102 with a sealing resin, and then the divided grooves 105 are formed in the resin substrate 103 along the divided grooves 104 of the ceramic substrate 102, whereby the collective substrate 100 is laminated. The body 101 is divided (see, for example, Patent Document 1).
JP 2007-129109 A

  However, according to this method, when the dividing groove 105 is formed on the resin substrate 103, the dividing groove 104 is already formed on the ceramic substrate 102 side. The position of the blade) needs to be matched with the position corresponding to the dividing groove 104 on the ceramic substrate 102 side, and high positional accuracy is required.

  Further, since the material is removed by the width of the blade when the dividing groove 105 is formed by dicing, the resin substrate 103 needs to be formed to be excessively large, resulting in an increase in cost.

  In view of such circumstances, the present invention is intended to provide a method for manufacturing a laminated body, which can easily perform a dividing operation of an aggregate substrate and can reduce manufacturing costs.

  In order to solve the above problems, the present invention provides a method for manufacturing a laminate having the following configuration.

  The method for producing a laminate includes (i) a first step of preparing a collective substrate in which a resin substrate is laminated on one main surface of a ceramic substrate and a dividing groove is formed from the other main surface side of the ceramic substrate; (Ii) pressing the resin substrate side of the collective substrate to divide the collective substrate along the dividing grooves of the ceramic substrate to form one or more individual pieces of the laminate; The process is provided.

  The aggregate substrate prepared in the first step can be produced by an appropriate method. For example, a resin substrate is laminated on a ceramic substrate in a state where the division grooves are formed. In this case, the dividing groove may be formed in advance before firing the ceramic substrate or may be formed after firing the ceramic substrate. Or you may form a division | segmentation groove | channel in a ceramic substrate in the state which laminated | stacked the ceramic substrate and the resin substrate.

  By pressing the resin substrate of the collective substrate in the second step, a crack progresses from the dividing groove formed in the ceramic substrate to the resin substrate side, and the crack penetrates the resin substrate to collect along the crack. A board | substrate is divided | segmented and a laminated body can be formed.

  In the second step, the aggregate substrate prepared in the first step is divided into boundary lines of the laminate included in the aggregate substrate so that the aggregate substrate is divided along the dividing grooves to form a laminate. The division | segmentation groove | channel is formed along at least one part among these.

  According to the above method, the laminated body is divided along the division grooves formed in advance on the collective substrate, so that positional accuracy is not required at the time of division. Therefore, the work of dividing the collective board becomes easy.

  Further, the resin substrate is only divided along the crack, and the material of the resin substrate is not wasted, so that the manufacturing cost can be reduced.

  In addition, the brittle ceramic substrate is divided along the division grooves formed in advance, and it is difficult for extra cracks and chips to occur at the time of division, so it is possible to suppress adverse effects on the wiring pattern etc. formed on the ceramic substrate, Miniaturization is easy.

  Further, when dividing, the elastic resin substrate side is pressed instead of the fragile ceramic substrate, and the load acts directly on the resin substrate side. Therefore, the influence of the load when dividing the ceramic substrate can be suppressed.

  Preferably, in the first step, after the resin substrate is laminated on the one main surface of the ceramic substrate, the divided substrate is formed on the other main surface of the ceramic substrate to prepare the collective substrate. To do.

  In this case, a collective substrate can be manufactured more easily than laminating a resin substrate on a ceramic substrate in which division grooves are formed in advance.

  Preferably, in the second step, the aggregate substrate is divided along the division grooves of the ceramic substrate by moving a roller along the resin substrate while pressing a roller toward the resin substrate side of the collective substrate. Then, one or more pieces of the laminate are formed.

  In this case, when the roller pressed against the resin substrate moves along the resin substrate, the divided grooves formed in the ceramic substrate are opened, and the progress of cracks starting from the divided grooves is promoted. As a result, cracks are efficiently developed in the resin substrate, so that the aggregate substrate can be divided smoothly.

  Preferably, the roller is pressed and moved in a state where the aggregate substrate is covered with a protective sheet.

  In this case, by covering the collective substrate with the protective sheet, it is possible to suppress the load applied to the collective substrate by the roller and to prevent the divided collective substrate from scattering.

  Preferably, the divided grooves penetrating between the one main surface and the other main surface of the ceramic substrate are formed in the ceramic substrate of the aggregate substrate prepared in the first step.

  In this case, the risk of the cracks progressing in a direction not intended for the resin substrate resin is reduced, and the quality of the laminate can be improved. In addition, since the crack is formed in the resin substrate quickly, the dividing operation can be performed efficiently.

  Preferably, in the first step, after mounting the circuit component on the one main surface of the ceramic substrate, the resin substrate is laminated on the one main surface of the ceramic substrate so as to cover the circuit component. To do.

  In this case, the circuit components mounted on the ceramic substrate and the joints thereof can be covered and protected by the resin substrate.

  According to the present invention, it is possible to easily divide the aggregate substrate, and to reduce the manufacturing cost.

  Hereinafter, embodiments of the present invention will be described with reference to FIGS. 1-4 is sectional drawing which shows the process of the manufacturing method of the laminated body of this invention.

  The method for producing a laminate of the present invention generally includes a first step of preparing a collective substrate and a second step of dividing the collective substrate to form a laminate.

  First, the first step for preparing a collective substrate will be described.

  As shown in FIG. 1A, the circuit component 14 is mounted on the ceramic substrate 10. The ceramic substrate 10 is a circuit board made of ceramic such as alumina, LTCC (Low Temperature co-fired ceramics), ferrite, and the like, and is designed to satisfy a desired function. The circuit component 14 is a semiconductor element (IC), for example, and is mounted on the one main surface 10a of the ceramic substrate 10 by flip chip bonding using Au bumps or solder bumps, die bonding using a conductive paste, wire bonding, or the like. .

  In a state where the circuit component 14 is exposed on the ceramic substrate 10, there is a high risk of damage to the circuit component 14 or a joint portion thereof, and thus protection is performed with a sealing resin. For example, as shown in FIG. 1B, a sheet-like resin substrate 18 is laminated on one main surface 10a of the ceramic substrate 10 on which the circuit component 14 is mounted, as shown by an arrow 19, and FIG. As shown in FIG. 3, the aggregate substrate 20 in which the resin substrate 18 is laminated on the one main surface 10a of the ceramic substrate 10 is formed.

  The resin substrate 18 may be laminated on the one main surface 10 a of the ceramic substrate 10 by applying a liquid resin to the one main surface 10 a of the ceramic substrate 10.

  Next, as shown in FIG. 2D, the division grooves 11 for dividing the aggregate substrate 20 into individual pieces of the laminated body are formed. For example, the scriber blade (scribing wheel) 32 is moved as indicated by an arrow 34 while pressing against the other main surface 10b of the ceramic substrate 10 with a desired pressure to form the dividing groove 11 from the other main surface 10b side of the ceramic substrate. To do. This construction method is generally called scribe (diamond scribe, glass scribe). For the scribe blade 32, a diamond sintered body (a powder obtained by sintering diamond powder together with a cemented carbide) generally having excellent durability is used.

  The dividing groove 11 may be formed by a method such as laser scribing or dicing.

  The division grooves 11 are formed discontinuously, that is, in a broken line shape or a dotted line shape, along the boundary line of the laminated body included in the aggregate substrate 20 when the other main surface 10b of the ceramic substrate 10 is viewed from the normal direction. Alternatively, it may be formed continuously, that is, without interruption.

  Even if the dividing grooves 11 are formed in the ceramic substrate 10, the resin substrate 18 is bonded to the one main surface 10a of the ceramic substrate 10, so that the collective substrate 20 maintains an integral shape. That is, when the dividing groove 11 is formed in the ceramic substrate 10, the collective substrate 20 is not divided into laminated bodies.

  When the dividing groove 11 is formed from the other main surface 10 b side of the ceramic substrate 10, the initial crack propagates to the opposite surface of the ceramic substrate 10, that is, the one main surface 10 a which is a bonding surface with the resin substrate 18, and the dividing groove 11 is formed. However, it is desirable to penetrate between the main surfaces 10b, 10a of the ceramic substrate 10. When the dividing groove 11 penetrates between the main surfaces 10b, 10a of the ceramic substrate 10, there is a risk that cracks develop in an unintended direction in the resin substrate 18 when the aggregate substrate 20 is divided by roller pressing or the like in a subsequent process. And the quality of the laminate can be improved. Moreover, since the crack is formed in the resin substrate 18 quickly, the dividing operation can be performed efficiently.

  Next, the second step of dividing the aggregate substrate to form a laminate will be described.

  As shown in FIG. 3, both surfaces of the collective substrate 20 are sandwiched between two flat protective sheets 42 and 44 having elasticity, and the collective substrate 20 is placed on the stage 40 while being covered with the protective sheets 42 and 44. . At this time, the aggregate substrate 20 is such that the ceramic substrate 10 is on the stage 40 side (lower side) and the resin substrate 18 is on the side opposite to the stage 40 (upper side).

  Then, the roller 50 is moved along the collective substrate 20 as indicated by an arrow 52 while pressing the roller 50 against the collective substrate 20 via the protective sheet 42. As a result, the aggregate substrate 20 is deformed to open the dividing groove 11, and a crack starting from the dividing groove 11 propagates toward the resin substrate 18, and the aggregate substrate 20 is divided along the dividing groove 11.

  The protective sheets 42 and 44 are deformed by the pressure of the roller 50 and prevent the divided aggregate substrate 20 from scattering.

  What is necessary is just to set the outer diameter of the roller 50, the pressing pressure of the roller 50, the feed speed of the roller 50, the material of the protection sheets 42 and 44, etc. according to the size of a laminated body.

  By moving the roller 50, the collective substrate 20 can be divided, and high positional accuracy is not required.

  The collective substrate 20 can be divided by folding along the dividing grooves 11 of the ceramic substrate 10 without using the protective sheets 42 and 44.

  Moreover, it is preferable to stick an adhesive sheet between the protective sheet 42 and the resin substrate 18. As a result, even after the aggregate substrate 20 is divided into the laminated bodies along the dividing grooves 11, a plurality of laminated bodies can be held together, and the transition to the subsequent process is facilitated.

  The division of the aggregate substrate will be further described with reference to FIG. FIG. 4 is an enlarged cross-sectional view schematically showing an essential part of the collective substrate 20 in an exaggerated manner. In FIG. 4, illustration of the protective sheets 42 and 44 and the stage 40 is omitted.

  As shown in FIG. 4A, the roller 50 moves while pressing the resin substrate 18 side of the collective substrate 20 as indicated by an arrow 53, and as shown by a chain line 51, the back side of the dividing groove 11 of the ceramic substrate 10. When reaching the vicinity, as shown in FIG. 4B, the collective substrate 20 is curved and deformed so that the dividing grooves 11 are on the outside, and the dividing grooves 11 are opened as indicated by arrows 13. As a result, a crack starting from the dividing groove 11 propagates in the resin substrate 18. When the tip of the crack reaches the side 18a opposite to the ceramic substrate 10 of the resin substrate 18 (the surface pressed by the roller 50) 18a, the aggregate substrate 20 is divided along the dividing groove 11, and FIG. As shown in FIG.

  As described above, the aggregate substrate 20 is divided in a state where the dividing grooves 11 are formed only on the ceramic substrate 10 side, so that the crack penetrates the resin substrate 18 obliquely, and the resin substrate 18 of the laminate 22 The proportion of the side surface 18s extending in an oblique direction (non-vertical direction) with respect to the bonding surface 10b between the resin substrate 18 and the ceramic substrate 10 increases.

  In addition, in FIG. 3, although the flat protective sheets 42 and 44 have shown the state which deform | transforms along the shape of the collective substrate 20, the hollow was previously formed instead of the flat protective sheet. A protective sheet may be used to accommodate the collective substrate 20 in a recess of the protective sheet. In this case, the collective substrate 20 can be divided while preventing the positional displacement of the collective substrate 20.

  Even when the collective substrate 20 is sandwiched between the flat protective sheets 42 and 44, holes are formed in the lower protective sheet 44 and the stage 40 on which the collective substrate 20 is placed, and suction is performed through these holes. The laminate 22 obtained by dividing the substrate 20 may be sucked and fixed.

  By forming the dividing groove 11 from the ceramic substrate 10 side, the ceramic substrate 10 is less likely to be shattered when the aggregate substrate 20 is divided, and the risk of the internal electrodes of the ceramic substrate 10 being exposed is reduced. High reliability.

  A method such as a diamond scriber can be applied to the formation of the dividing groove 11, and the groove processing can be performed at high speed with processing quality equal to or higher than the case of dividing the resin substrate side of the collective substrate by dicing as in the conventional example. Yes, tact time can be shortened. Therefore, it is excellent in mass productivity and the manufacturing cost can be reduced.

  In the case of dicing, the blade width + α (groove expansion due to vibration during processing) is cut away, so the effective product area of the laminate must be narrowed. In the case of scribing, by forming the divided grooves at a high pressure, the initial cracks are straightened in the ceramic substrate, and it is possible to form grooves with less digging. Furthermore, a part of the product is not cut by the blade blade, and the product effective area can be widened and the substrate end gap can be narrowed. As a result, it is possible to reduce the size of the laminated body, increase the number of laminated bodies 22 to be taken from the aggregate substrate 20, and manufacture at a low cost.

  <Summary> As described above, the dividing groove 11 is formed on the ceramic substrate 10 side of the collective substrate 20 and the collective substrate 20 is divided by pressing the resin substrate 18 side, thereby dividing the collective substrate 20. This can be done easily and the manufacturing cost can be reduced.

  The present invention is not limited to the above embodiment, and can be implemented with various modifications.

  For example, a laminated body is manufactured by firing a raw ceramic substrate in which division grooves have been formed in advance and then laminating a resin substrate on the fired ceramic substrate along the division grooves. May be.

It is sectional drawing which shows the manufacturing process of a laminated body. (Example) It is sectional drawing which shows the manufacturing process of a laminated body. (Example) It is sectional drawing which shows the manufacturing process of a laminated body. (Example) It is a principal part expanded sectional view which shows the manufacturing process of a laminated body. (Example) It is sectional drawing which shows the manufacturing process of a laminated body. (Conventional example)

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Ceramic substrate 11 Dividing groove 14 Circuit component 18 Resin substrate 20 Collective substrate 22 Laminate 50 Roller

Claims (6)

A first step of preparing a collective substrate in which a resin substrate is laminated on one main surface of a ceramic substrate and a dividing groove is formed from the other main surface side of the ceramic substrate;
Pressing the resin substrate side of the collective substrate to divide the collective substrate along the dividing grooves of the ceramic substrate to form one or more pieces of a laminate; and ,
A method for producing a laminate, comprising:   In the first step, after the resin substrate is laminated on the one main surface of the ceramic substrate, the divided substrate is formed on the other main surface of the ceramic substrate, thereby preparing the collective substrate. The manufacturing method of the laminated body of Claim 1 characterized by the above-mentioned.   In the second step, the roller is moved along the resin substrate while pressing the roller toward the resin substrate side of the collective substrate, and the collective substrate is divided along the dividing groove of the ceramic substrate, The method for producing a laminate according to claim 1, wherein one or more pieces of the laminate are formed.   The method for manufacturing a laminate according to claim 3, wherein the roller is pressed and moved in a state where the aggregate substrate is covered with a protective sheet.   The dividing groove penetrating between the one main surface and the other main surface of the ceramic substrate is formed in the ceramic substrate of the collective substrate prepared in the first step. The manufacturing method of the laminated body as described in any one of Claims 1 thru | or 4.   In the first step, after mounting a circuit component on the one main surface of the ceramic substrate, the resin substrate is laminated on the one main surface of the ceramic substrate so as to cover the circuit component. The manufacturing method of the laminated body as described in any one of Claims 1 thru | or 5 characterized by the above-mentioned.

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