JP2009196188A - Manufacturing method of woody compound substrate and woody decorative plate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a woody decorative plate having high peeling strength and an anti-castering property at a low production cost and at a high yield by using a divided woody fibrous plate having decreased strength which has never been used in relation with a woody compound substrate comprising a laminate of a divided woody fibrous plate and a compound plate substrate and also by conducting impregnation of a resin into a divided woody fibrous plate homogeneously and rapidly. <P>SOLUTION: As divided woody fibrous plate, a divided woody fibrous plate 20 in which strength is decreased or a back part 13 is broken by irregular dividing or multiple dividing is used, wherein a resin 15 is impregnated into the divided woody fibrous plate, the resin-impregnated divided fibrous plate is adhered to the compound substrate plate 30 to give a compound woody decorative plate 40 and a decorative layer 40 is laminated on the divided woody fibrous plate to give a woody decorative plate A. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a wood composite base material used as a base material for a wood decorative board and the like, a method for producing the same, and a wood decorative board using the produced wood composite base material as a base material.

  A wood composite base material composed of a laminate of a wood fiber board and a plywood base material as a surface layer is known, and such a wood composite base material is used as a base material, such as a veneer or a decorative sheet on its surface. It is also known to laminate a decorative layer to make a wooden decorative board such as a flooring material or an interior material. As a wood fiber board to be used, MDF (medium density fiber board) is mainly used, but a wood fiber board such as a hard board is also used. By disposing such a thin (usually 1 mm or less) wood fiber board between the plywood substrate and the surface decorative layer, it is possible to avoid inconveniences such as cracks in the surface decorative layer.

  Due to the manufacturing process of the wood fiber board, it is inevitable that a density difference occurs in the thickness direction. In general, the high-density layer, the low-density layer, and the high-density layer are stacked in this order while having a density gradient between the layers in the thickness direction. For example, in the case of MDF, the density of the high-density layer that is the surface layer is about 0.9 to 1.1, and the density of the low-density layer that is the inner layer is about 0.6 to 1.0. Depending on the production mode, a wood fiber board in which a low density layer, a high density layer, and a low density layer form a layer structure in the thickness direction in this order is also formed.

  The wood fiberboard is the thinnest and is usually about 1 to 4 mm in relation to the manufacturing process. Therefore, when manufacturing the above-mentioned wood composite base material, the wood fiber board is divided in the thickness direction so as to have a thickness of 1 mm or less, and is bonded and laminated to the plywood base material using an adhesive. I am doing so. However, the low-density layer is not sufficient in strength, and when a wooden decorative material is produced using a wood composite base material bonded to a plywood base material with the low-density layer side as the surface side, sufficient peel strength and caster resistance Sex cannot be obtained. For this purpose, the low-density layer is ground and removed, and a divided wood fiber board consisting of only a high-density region is bonded and laminated to the wood substrate (see Patent Document 1, etc.). Therefore, the use yield rate of the wood fiber board is low, which contributes to the cost increase.

  From such a viewpoint, Patent Document 2 discloses a wood fiber plate material having a density gradient in which one surface side is divided into a high-density layer and the other surface side is formed into a low-density layer by being divided from the central portion in the thickness direction. After that, the wood fiber plate is laminated and integrated on the surface of the wood substrate with the low density layer side facing up to form a composite plate, and further the low density of the wood fiber plate on the surface of the composite plate After the surface of the layer is ground to obtain a smooth surface, a synthetic resin liquid is applied to and impregnated on the surface of the wood fiber board material of the composite board to form a reinforced wood fiber board material, and then the reinforced wood fiber board material. A method of manufacturing a decorative board in which a decorative layer is provided on the surface is disclosed.

Japanese Patent Laid-Open No. 10-46796 JP-A-11-170210

  According to the method for manufacturing a decorative board described in Patent Document 2, the strength of the low density layer is improved by impregnating the resin on the low density layer side of the divided wood fiber board divided into two from the central portion in the thickness direction. Therefore, it is unnecessary to remove the low-density layer portion, and it can be expected that the wood composite base material and the decorative board can be manufactured in a state in which the use yield rate of the wood fiber board is high. However, after dividing into two from the central part in the thickness direction due to the relationship between the thickness of the wood fiberboard used as the material and the thickness required for the wood fiberboard actually bonded and laminated to the plywood substrate, the low density layer region May need to be removed by grinding, resulting in a decrease in yield rate.

  When a thinner divided wood fiberboard is required, the yield rate is reduced by dividing irregularly at a location that is shifted to one side in the thickness direction, instead of dividing it into two from the center in the thickness direction. It is possible to obtain a divided wood fiber board having a required thickness without lowering. Further, in the case of a wood fiber board having a sufficiently large thickness, an irregular division in which the thickness is divided into 3 or 4 in the thickness direction, the divided wood fiber board having a required thickness without reducing the yield rate. Can be obtained. However, when such an irregular division is performed, each divided division is divided with a different load, so depending on the division method, the division is performed with a significantly large load. Even in the case of splitting a plurality of times, the strength is deteriorated because the load is applied to the wood fiber board a plurality of times. Therefore, it has been performed so far to produce a divided wood fiber board of the required thickness by irregularly dividing the wood fiber board or dividing it several times and actually using it to make a wood composite base material. Not come.

  In addition, in the irregular division in which the wooden fiberboard is divided into three or four, a divided wooden fiberboard consisting only of the low density layer region is made, but the divided wooden fiberboard consisting only of the low density layer is a property value such as peel strength. However, it has never been done so far to actually use it as a wood composite substrate. In that respect, the use yield rate is reduced.

  On the other hand, it is not easy to impregnate the resin uniformly in any form of divided wood fiber board, and a long processing time is required.

  The present invention has been made in view of the circumstances as described above, and in a wood composite base material composed of a laminate of a divided wood fiber board and a plywood base material, while maintaining a high use yield rate of the wood fiber board. An object is to obtain a wood composite base material having a strength that can sufficiently withstand actual use, and to provide a method for producing the same. Another object is to obtain a wood composite base material in which resin is uniformly impregnated into a divided wood fiber board in a short time and to provide a method for producing the same. Another object of the present invention is to obtain a wood decorative board having high peel strength and caster resistance using such a wood composite base material.

  The first aspect of the wood composite base material according to the present invention is a wood material comprising a laminate of divided wood fiber boards and plywood base materials obtained by dividing wood fiber boards having different densities in the thickness direction in the thickness direction. A composite base material, wherein the divided wood fiber board is a divided wood fiber board having a high density layer and a low density layer obtained by irregularly dividing the wood fiber board in the thickness direction and impregnated with a resin. It is a divided wood fiber board (Claim 1). Said aspect WHEREIN: As for the said division | segmentation wood fiber board, the high density layer side may adhere | attach the plywood base material, and the low density layer side may adhere | attach the plywood base material.

  In the wood composite base material of this aspect, a divided wood fiber board whose strength has deteriorated due to irregular division, which has not been conventionally used, is used by improving the strength by impregnating the resin. Therefore, the use yield rate of a wood fiber board improves. The divided wood fiber board has sufficient strength such as high peel strength. Furthermore, since the laminated divided wood fiber boards are impregnated with the resin, the amount of formaldehyde emitted from the plywood substrate can be further reduced.

  A second aspect of the wood composite base material according to the present invention is a wood material comprising a laminate of divided wood fiber boards and plywood base materials obtained by dividing wood fiber boards having different densities in the thickness direction in the thickness direction. It is a composite substrate, and the divided wood fiber board is a divided wood fiber board having a back crack formed at the time of division on a divided surface and having a high density layer and a low density layer and impregnated with a resin. It is a divided wood fiber board (Claim 4). Also in this aspect, the divided wood fiber board may be bonded to the plywood substrate on the high-density layer side, or may be bonded to the plywood substrate on the low-density layer side.

  In the wood composite base material of this aspect, a divided wood fiber board in which a crack is formed on the divided surface is used, and the resin is impregnated therein to improve the strength. Because it has cracks in the back, the applied resin is uniformly and quickly impregnated into the divided wood fiberboard, and the divided wood fiberboard has a sufficiently stable strength and sufficient strength such as high peel strength. Is provided. Even in this aspect, the laminated wood fiberboards impregnated with the resin can reduce the amount of formaldehyde emitted from the plywood substrate.

  A third aspect of the wood composite substrate according to the present invention is a wood material comprising a laminate of divided wood fiber boards and plywood base materials obtained by dividing wood fiber boards having different densities in the thickness direction in the thickness direction. It is a composite base material, and the divided wood fiber board is a divided wood fiber board composed of only a low density layer obtained from a low density region of the wood fiber board and is a divided wood fiber board impregnated with a resin. It is characterized (claim 7). In the wood composite base material of the third aspect, one or both surfaces of the divided wood fiber board may have a back crack (claim 8).

  In the wood composite base material of this aspect, a divided wood fiber board composed only of a low-density layer that has not been conventionally used is used by improving the strength by impregnating the resin. Therefore, the use yield rate of a wood fiber board improves. Also in this aspect, the divided wood fiber board has sufficient strength such as high peel strength. Moreover, when the laminated | segmented division | segmentation wood fiber board impregnates resin, the amount of formaldehyde emission from a plywood base material can be made into a still lower value. In the wood composite base material of the third aspect, when one side or both sides of the divided wood fiber board has a back crack, the applied resin impregnates the divided wood fiber board uniformly and quickly, The divided wood fiberboard has a uniform strength and can be provided with a sufficient strength.

  The present invention further uses the above-mentioned wood composite base material as a base material, and is provided with a surface decorative layer on the surface opposite to the adhesive surface of the divided wood fiber board with the plywood base material. A decorative board is also disclosed.

The present invention further provides a method for producing a woody composite substrate according to the first aspect of the first aspect,
(A) A step of irregularly dividing a wood fiberboard having a density different in the thickness direction at a position shifted to one side instead of the center in the thickness direction to obtain a divided wood fiberboard having a high density layer and a low density layer ,
(B) grinding the split surface of the divided wood fiber board to make it a flat surface;
(C) impregnating the resin from one or both sides of the divided wood fiber board, and
(D) A method for producing a wood composite base material comprising at least each step of adhering a divided wood fiber board to a plywood base material using either a split surface or a surface opposite to the split surface as an adhesive surface. Is disclosed (claim 10).

The present invention further provides a method for producing a woody composite substrate according to the second aspect of the present invention, as described in claim 4.
(A) a step of dividing a wood fiber board having a different density in the thickness direction so that a crack is formed on the divided surface to obtain a divided wood fiber board having a high density layer and a low density layer;
(B) grinding the split surface of the divided wood fiber board to make it a flat surface;
(C) impregnating the resin from one or both sides of the divided wood fiber board, and
(D) A method for producing a wood composite base material comprising at least each step of adhering a divided wood fiber board to a plywood base material using either a split surface or a surface opposite to the split surface as an adhesive surface. Is disclosed (claim 11).

The present invention further provides a method for producing a woody composite substrate according to the third aspect of the present invention as described in claim 7 or 8,
(A) a step of separating a split wood fiber board consisting of only a low density region from a wood fiber board having a different density in the thickness direction without forming a back crack on the split surface or by forming a back crack;
(B) grinding the split surface of the divided wood fiber board to make it a flat surface;
(C) impregnating the resin from one or both sides of the divided wood fiber board, and
(D) A method for producing a wood composite base material comprising at least each step of adhering a divided wood fiber board to a plywood base material using either a split surface or a surface opposite to the split surface as an adhesive surface. Is disclosed (claim 12).

  In any of the above manufacturing methods, the order of the steps after the step (a) for obtaining the divided wood fiber board is arbitrary, and the order of the step (a) → the step (b) → the step (c) → the step (d) Embodiment, step (a) → step (b) → step (d) → step (c), embodiment (step (a) → step (d) → step (b) → step (c) The mode performed in the above step, the mode performed in the order of step (a) → step (c) → step (d) → step (b), and the like can be appropriately selected.

In each invention of the present application, the wood fiber board to be used is preferably MDF (medium density fiber board), but a wood fiber board such as hard board or HDF (high density fiber board) is also used. be able to. Moreover, when using any wood fiber board, the low density layer which comprises a division | segmentation wood fiber board may have a density (average density) of the whole layer of 0.75 g / cm < ³ > or less.

  Examples of the resin impregnated into the divided wood fiberboard include aqueous resins such as melamine resin, urea resin, urea / melamine resin, acrylic resin and polyurethane resin, and further, aqueous vinyl urethane, ABS resin, or a mixture thereof. Alternatively, emulsions made of modified resins, aqueous emulsions such as SB emulsions, vinyl acetate emulsions, acrylic emulsions, NB emulsions, and the like can be exemplified. Examples of the decorative layer on the surface side of the divided wood fiberboard include a veneer, a decorative synthetic resin sheet, and a decorative sheet such as decorative paper.

  According to the present invention, when manufacturing a wood composite base material composed of a laminate of divided wood fiberboard and plywood base material, it has been conventionally discarded without being used for reasons such as insufficient strength. While using split wood fiberboard with degraded strength, wood fiberboard with cracks in the back, or split wood fiberboard consisting only of low-density layers, it is fully practical with high delamination strength and caster resistance. A rugged wood composite substrate can be obtained. Therefore, it is possible to greatly improve the use yield of the wood fiber board, and as a result, the manufacturing cost of the wood composite base material can be greatly reduced.

  Moreover, in the wood composite base material by this invention, the division | segmentation wood fiber board is used in the state which impregnated resin, Therefore, there also exists an advantage which can greatly reduce the amount of formaldehyde diffused from a plywood base material.

  Specific embodiments of each invention of the present application will be described with reference to the drawings. 1-4 is a figure for demonstrating the division | segmentation wood fiber board used by this invention, and its manufacturing method. 5 and 6 are diagrams for explaining several examples of a method for producing a wood composite base material according to the first aspect of the present invention. FIG. 7 is a view for explaining a wooden decorative board manufactured using the manufactured wooden composite base material. FIG. 8 and FIG. 9 are diagrams for explaining several examples of the method for producing a wood composite base material according to the second aspect of the present invention. FIGS. 10-14 is a figure explaining some examples of the manufacturing method of the wood composite base material by the 3rd aspect of this invention.

  1 and 2 show divided wood fibers having a high density layer and a low density layer obtained by irregularly dividing a wood fiber board having a different density in the thickness direction at a position shifted to one side instead of the center in the thickness direction. An example of a plate is shown. In FIG. 1A, 10 is a wood fiber board which is MDF with a thickness of about 2.7 mm, for example, and the density differs in the thickness direction. In this example, the surface layer side of the wood fiber board 10 is the high density layers 11 and 11, the inner layer is the low density layer 12 having a lower density than the surface layer, and the high density layer 11 and the low density layer 12 have a density gradient. Is continuous. In order to obtain a thin wood fiber board 20 having a thinner thickness (for example, about 0.6 mm thick), it is displaced to one surface side by a cutter (half-split machine or the like: not shown) instead of the center in the thickness direction. The done part is divided into two as a dividing plane L. As shown in FIG. 1 (b), one divided wood fiber board 20a divided into two parts has a required thickness (0.6 mm), while the other divided wood fiber board 20b has a thickness smaller than 0.6 mm. thick. Therefore, although not shown in the figure, in order to increase the use yield rate of the wood fiber board, the other divided wood fiber board 20b is further divided into two at appropriate positions, thereby dividing the divided wood fiber board 20a having a required thickness (0.6 mm). Further can be obtained.

  However, when such irregular division or multiple divisions are performed, each divided division may be divided with a different load, and may be divided with a significantly large load. In particular, strength deterioration is likely to occur on the divided surface side.

  The wood fiber board 10A shown in FIG. 2A has different densities in the thickness direction, but the surface layer side is the low-density layers 12 and 12, and the inner layer is the high-density 11 that is higher in density than the surface layer. . The high density layer 11 and the low density layer 12 are continuous with a density gradient. Also in this form of the wood fiber board 10A, in order to obtain a thinner divided wood fiber board 20, a part displaced to one surface side by a cutter (half-splitting machine or the like: not shown) is defined as 2 as a divided surface L. If it divides | segments, as shown in FIG.2 (b), it will become the division | segmentation wooden fiber board 20a provided with required thickness, and the division | segmentation wooden fiber board 20b with thicker thickness. Then, in order to increase the use yield rate of the wood fiber board, the other divided wood fiber board 20b can be obtained by further dividing the other divided wood fiber board 20b into two at appropriate positions. However, also in this case, strength degradation occurs in the divided wood fiber board 20a.

  As shown in FIG. 3, a back crack 13 may occur on the dividing surface when dividing with a cutter. Further, by appropriately adjusting conditions such as the cutting depth of the blade and the cutting angle, the back crack 13 can be positively generated on the dividing surface L. 3A corresponds to the wood fiber board shown in FIG. 1A, the central portion is a low density region, and the wood fiber board 10 in FIG. It corresponds to the wood fiber board shown in (a), and the central part is a high-density layer. Such back cracks are not limited to the divided wood fiber boards 20a1 and 20b1 in the case of irregular division (division plane L) as shown in the right side of FIGS. 3 (a) and 3 (b). (A), as shown in the center figure of (b), it forms also in the division | segmentation wooden fiber board 20c divided into 2 in the thickness direction (division surface L1). Therefore, in this invention, when mentioning the division | segmentation wooden fiber board which has a crack in a division | segmentation surface, it uses as what includes both unless there is particular notice.

  In FIG. 3 and FIG. 4 described above, the “high density” region and the “low density” region in FIGS. 1 and 2 are simply expressed as “high” and “low”.

  FIG. 4 illustrates still another divided wood fiber board 20d used in the wood composite base material of the present invention. As shown in FIGS. 4A and 4B, when the wood fiber boards 10 and 10A are thick, for example, a divided wood fiber board mainly composed of the high-density layer 11 having a thickness of about 0.6 mm. When trying to obtain 20e, the divided wood fiber board 20d composed only of the low-density layer 12 is cut out. The divided wood fiber board 20e composed of the high-density layer 11 has been conventionally used to produce a wood composite base material, but the divided wood fiber board 20d composed only of the low-density layer is weak in strength, and therefore discarded. It was often processed.

  In addition, as shown in FIGS. 4C and 4D, in this case as well, the split surface may be cracked at the time of division by the cutter, and can be positively generated. The divided wood fiber boards in which the back cracks are generated are shown as 20d1 and 20e1, respectively.

  Next, a method of manufacturing the wood composite base material 40 using the above-described divided wood fiber boards 20a, 20a1, 20c, 20e, and 20e1 will be described. 5 and 6 show the high density obtained by irregularly dividing the divided wood fiber board 20a shown in FIG. 1 (b) or FIG. 2 (b), that is, the wood fiber board at a location displaced in the thickness direction. This is a case where a wood composite base material 40 is manufactured using a divided wood fiber board 20a having a layer and a low density layer (a method for manufacturing a wood composite base material according to the first aspect of the present invention).

  In FIG. 5 (a), first, the divided wood fiber board 20a is obtained by grinding the divided surface L side of the divided wood fiber board 20a with a means such as sanding or a planar surface to form a flat surface. The surface side as an initial wood fiber board which is the grinding surface (divided surface) L side or the opposite surface is bonded and laminated to the plywood substrate 30 using an appropriate adhesive. Next, a resin composite 15 such as a melamine resin or an aqueous vinyl urethane emulsion is applied to the exposed surface of the divided wood fiber board 20a and impregnated in the divided wood fiber board 20a, whereby the wood composite base material 40 is obtained. The surface side on which the resin 15 is applied may be on the low-density layer 12 side or the high-density layer 11 side in the divided wood fiber board 20a on condition that the applied resin is impregnated inside. Absent.

  In FIG. 5 (b), it is the same as that of FIG. 5 (a) that the divided wood fiber board 20a is first formed into the flat surface on the divided surface L side, but the divided wood fiber board 20a having both surfaces flat. Is bonded to the plywood substrate 30 and the resin 15 is applied to the side that becomes the bonding surface, and then the divided wood fiber board 20a and the plywood substrate 30 are bonded and laminated to form a wood composite substrate 40. Yes. Also in this case, the side to be the bonding surface may be the low-density layer 12 side or the high-density layer 11 side in the divided wood fiber board 20a.

  In FIG.5 (c), after apply | coating the resin 15 on both surfaces of the division | segmentation wooden fiber board 20a which both surfaces became a flat surface by grinding the division | segmentation surface L side, and impregnating an inside, the division | segmentation wooden material which the resin 15 impregnated The wood composite base material 40 is formed by adhesion and lamination to the fiber board 20a and the plywood base material 30. Also in this case, the side to be the bonding surface may be the low-density layer 12 side or the high-density layer 11 side in the divided wood fiber board 20a.

  In FIG.5 (d), first, the surface opposite to the dividing surface L in the divided wood fiber board 20a, that is, the surface side of the original wood fiber board is bonded to the plywood substrate 30, and then divided. The dividing surface L of the wood fiber board 20a is ground by an appropriate means to make a flat surface. And the resin composite 15 is apply | coated and impregnated on the surface of the division | segmentation wood fiber board 20a which became flat by grinding, and it is set as the wood composite base material 40. FIG. In this case as well, the side that becomes the bonding surface may be the low-density layer 12 side or the high-density layer 11 side in the divided wood fiber board 20a.

  In FIG. 6, first, the resin 15 is applied to the surface of the divided wood fiber board 20a opposite to the divided surface L, that is, the surface side of the original wood fiber board, and impregnated inside. Then, the divided wood fiber board 20a impregnated with the resin 15 is bonded and laminated to the plywood substrate 30 with the surface side on which the resin 15 is applied as an adhesive surface. Thereafter, the divided surface L side of the divided wood fiber board 20a is ground by a suitable means to form a flat surface, thereby forming the wood composite substrate 40. In this case as well, the side that becomes the bonding surface may be the low-density layer 12 side or the high-density layer 11 side in the divided wood fiber board 20a.

  FIG. 7 shows a surface such as a veneer on the surface opposite to the bonding surface of the divided wood fiber board 20a to the plywood base material 30 using the wood composite base material 40 manufactured as described above as a base material. A wooden decorative board A formed by attaching a decorative layer 50 is shown. In this form of the wood decorative board A, even if the divided wood fiber board 20a whose strength is reduced by irregular division is interposed between the plywood base material 30 and the surface decorative layer 50, the divided wood fiber board 20a is uniform inside. Since the resin 15 is impregnated with the material, the physical properties are improved, and as shown in the following examples, a wooden decorative board A with improved physical properties such as peel resistance and caster resistance is obtained. In FIG. 7, it is obvious that the divided wood fiber board 20a manufactured by any of the manufacturing methods shown in FIGS. 5 and 6 can be equally used as the divided wood fiber board 20a.

  FIGS. 8 and 9 show the high density obtained by irregularly dividing the divided wood fiber board 20a1 or 20c shown in FIGS. 3 (a) and 3 (b), that is, the wood fiber board at a location displaced in the thickness direction. A divided wood fiber board having a layer and a low density layer, and a divided wood fiber board 20a1 having a crack 13 on the dividing surface L, or a divided surface obtained by dividing the wood fiber board at the center in the thickness direction This is a case where a wood composite base material 40 is manufactured using a divided wood fiber board having a high density layer having L1 and a low density layer, and a divided wood fiber board 20c having a back crack 13 on the split surface L1 ( A method for producing a wood composite base material according to the second aspect of the present invention). In addition, as a manufacturing method, since 2 types of division | segmentation wood fiber boards 20a1 and 20c can be handled as the same thing, in FIG. 8 and FIG. 9, only the division | segmentation wood fiber board 20c is illustrated as a representative of both. . By using what has the back crack 13 as a division | segmentation wood fiber board, as mentioned above, it is accelerated | stimulated that the apply | coated resin 13 impregnates into a division | segmentation wood fiber board uniformly and rapidly.

  In FIG. 8 (a), first, a divided wood fiber board 20c having a flat surface by grinding the divided surface L1 side of the divided wood fiber board 20c having the back crack 13 on the divided surface L1, and the ground surface thereof is shown. (Divided surface) The L1 side is bonded and laminated to the plywood substrate 30 using an appropriate adhesive. Next, a resin composite 15 such as a melamine resin or an aqueous vinyl urethane emulsion is applied to the exposed surface of the divided wood fiber board 20c and impregnated in the divided wood fiber board 20c, whereby the wood composite base material 40 is obtained. In addition, the division surface side which has the back crack 13 may be the low-density layer 12 side in the division | segmentation wood fiber board 20c, or the high-density layer 11 side.

  In FIG.8 (b), after the division surface L1 side of the division | segmentation wood fiber board 20c is ground and made into a flat surface, the surface side without the back crack 13 and the plywood base material 30 are adhere | attached. Next, the resin 15 is applied to the exposed surface of the divided wood fiber board 20c and impregnated into the divided wood fiber board 20c to form the wood composite base material 40. Here, the split surface side having the back crack 13 may be the low density layer 12 side or the high density layer 11 side in the split wood fiber board 20c.

  In FIG. 8 (c), after the divided surface L1 side of the divided wood fiber board 20c is ground to be a flat surface, the surface having the back crack 13 on which the resin 15 is applied and impregnated and the resin 15 is applied. The side is bonded to the plywood substrate 30 to form a wood composite substrate 40. Here, the split surface side having the back crack 13 may be the low density layer 12 side or the high density layer 11 side in the split wood fiber board 20c.

  In FIG. 8D, after dividing the divided surface L1 side of the divided wood fiber board 20c into a flat surface, resin 15 is applied and impregnated on the surface side without the back crack 13, and the back crack of the resin 15 is applied. The non-surface side is bonded to the plywood substrate 30 to form a wood composite substrate 40. Here, the split surface side having the back crack 13 may be the low density layer 12 side or the high density layer 11 side in the split wood fiber board 20c.

  In Fig.9 (a), it is set as the division | segmentation wooden fiber board 20c which grind | polished the division surface L1 side of the division | segmentation wooden fiber board 20c which has the crack 13 in the division | segmentation surface L1, and both surfaces became a flat surface, Resin 15 is applied to the both surfaces. What was applied and impregnated inside was bonded and laminated to the plywood substrate 30 with the surface side having the back crack 13 as an adhesive surface, thereby forming a wood composite substrate 40. In this case as well, the split surface side having the back crack 13 may be the low density layer 12 side or the high density layer 11 side in the split wood fiber board 20c.

  In FIG. 9 (b), the divided wood fiber board 20c is divided into the divided wood fiber board 20c having the both surfaces flattened by grinding the divided surface L1 side, and the resin 15 is applied to both faces and impregnated inside. Are bonded and laminated on the plywood substrate 30 with the surface side not having the back crack 13 as an adhesive surface, thereby forming a wood composite substrate 40. In this case as well, the split surface side having the back crack 13 may be the low density layer 12 side or the high density layer 11 side in the split wood fiber board 20c.

  In FIG. 9 (c), the divided wood fiber board 20c is bonded and laminated with the plywood substrate 30 on the surface side without the back crack 13 which is the opposite surface to the divided surface L1, and then the divided surface of the divided wood fiber board 20c. (Grinding surface) After the L1 side is ground to make a flat surface, the ground surface side is coated and impregnated with resin 15 to form the wood composite base material 40. Here, the split surface side having the back crack 13 may be the low density layer 12 side or the high density layer 11 side in the split wood fiber board 20c.

  In FIG. 9 (d), the resin 15 is applied and impregnated on the inner surface side of the back crack of the divided wood fiber board 20c, and the back crack 13 is formed after bonding and laminating the surface without the back crack and the plywood substrate 30. The wood composite base material 40 is formed by grinding the dividing surface L1 side to make a flat surface. Here, the split surface side having the back crack 13 may be the low density layer 12 side or the high density layer 11 side in the split wood fiber board 20c.

  Next, the divided wood fiber board 20d or 20d1 shown in FIGS. 4 (a) to 4 (d), that is, the divided wood fiber board 20d made of only the low density layer 12 and having no back cracks, or only the low density layer 12 is used. 10 to 14 show some examples in the case of manufacturing a wood composite base material 40 using a divided wood fiber board 20d1 having a crack 13 on one side or both sides. (A method for producing a wood composite substrate according to the third aspect of the present invention). FIGS. 10 and 11 are some examples in the case of using the divided wood fiber board 20d or 20d1 including only the low-density layer 12 in which only one side is a divided surface shown in FIGS. 4B and 4D. 12 and 13 show some examples in the case of using the divided wood fiber board 20d or 20d1 including only the low-density layer 12 whose both surfaces are divided surfaces shown in FIGS. 4 (a) and 4 (c). As the manufacturing method, the two types of divided wood fiber boards 20d and 20d1 can be handled as substantially the same, and therefore in FIG. 10 and FIG. 11, the divided wood fiber board 20d having no back crack is taken as an example. Moreover, in FIG. 12 and FIG. 13, the divided wood fiber board 20d1 having the back crack 13 will be described as an example.

  In FIG. 10 (a), the divided surface of the divided wood fiber board 20d consisting only of the low-density layer 12 is ground to be a flat surface, and this is the plywood substrate 30 with the divided surface or the non-divided surface as the adhesive surface. After being laminated and integrated, the surface of the divided wood fiber board 20d is coated and impregnated with the resin 15 to form the wood composite base material 40.

  In FIG. 10 (b), the divided surface of the divided wood fiber board 20d composed only of the low density layer 12 is ground to a flat surface, and the resin 15 is applied and impregnated on the side to be the adhesive surface with the plywood substrate 30. Then, the wood composite base material 40 is obtained by bonding and laminating it to the plywood base material 30. In this case, the bonding surface, that is, the surface on which the resin is applied may be a divided surface or a surface that is not a divided surface.

  In FIG.10 (c), after dividing the division | segmentation surface of the division | segmentation wood fiber board 20d which consists only of the low density layer 12 into a flat surface, the resin 15 is apply | coated and impregnated on both surfaces. And the wood composite base material 40 is made by adhering and laminating on either side of the plywood base material 30 as an adhesive surface.

  In FIG. 10 (d), the divided wood fiber board 20d consisting only of the low density layer 12 is bonded and laminated to the plywood substrate 30 on the surface side that is not the divided surface, and the divided surface side is ground to form a flat surface. Thereafter, the surface (grinding surface side) of the divided wood fiber board 20d is coated and impregnated with the resin 15 to form the wood composite base material 40.

  In FIG. 11, the resin 15 is applied and impregnated on the non-divided surface (adhesive surface side with the plywood substrate 30) of the divided wood fiber board 20 d composed of only the low-density layer 12, and this is impregnated. After the adhesive lamination, the divided surface side is ground to form a wood composite base material 40 as a flat surface.

  In FIG. 12 (a), both sides of a divided wood fiber board 20d1 (hereinafter simply referred to as “divided wood fiber board 20d1”) having only a low density layer 12 whose both surfaces are divided surfaces and having a crack 13 are ground. After making it a flat surface and bonding and laminating it to the plywood substrate 30, the wood composite substrate 40 is obtained by applying the resin 15 to the surface of the divided wood fiber board 20d1 and impregnating the resin 15 inside.

  In FIG. 12 (b), both surfaces of the divided wood fiber board 20d1 are ground to form a flat surface, and the resin 15 is applied and impregnated on the side that becomes the adhesive surface with the plywood substrate 30, and then the plywood substrate The wood composite base material 40 is formed by adhesively laminating 30.

  In FIG. 12 (c), both surfaces of the divided wood fiber board 20d1 are ground to form a flat surface, and after applying and impregnating the resin 15 on both surfaces, either surface is bonded and laminated to the plywood substrate 30. Thus, the wood composite base material 40 is obtained.

  In FIG. 12 (d), one surface of the divided wood fiber board 20 d 1 is ground to a flat surface, which is bonded and laminated to the plywood substrate 30. Then, the other surface of the divided wood fiber board 20d1 is ground to be a flat surface, and then the resin 15 is applied to the surface of the divided wood fiber board 20d1 and impregnated therein, thereby forming the wood composite base material 40.

  In FIG. 13, the surface of the divided wood fiber board 20d1 on the side to be bonded to the plywood substrate 30 is ground to a flat surface, and the ground surface is coated with resin 15 and impregnated therein. Adhesive lamination is performed on the plywood substrate 30. And the other surface of the division | segmentation wood fiber board 20d1 is ground, and it is set as the wood composite base material 40 by making it a flat surface.

  Although explanation is omitted, in any of the manufacturing methods described above, when it is necessary to stabilize the resin 15 impregnated into the divided wood fiber board 20, the wood composite base material 40 after resin impregnation is used. On the other hand, conventionally known hot-pressure treatment is performed. Further, in the wood composite base material 40 manufactured by any of the manufacturing methods, as described with reference to FIG. 7, an appropriate surface decorative material is attached to the surface side of the divided wood fiber board 20, thereby making the wood makeup. Plate A can be used. As described above, each of the wooden decorative boards A has a divided wooden fiber board whose physical properties are improved by impregnating a resin on the surface layer, thereby improving the wooden makeup with improved peeling resistance and caster resistance. It becomes board A.

Hereinafter, the present invention will be described with reference to examples and comparative examples.
[Example A]
The wood composite base material of the first form according to the present invention, that is, “a laminated body of divided wood fiber boards and plywood base materials obtained by dividing wood fiber boards having different densities in the thickness direction in the thickness direction” The divided wood fiber board is a divided wood fiber board having a high density layer and a low density layer obtained by irregularly dividing the wood fiber board in the thickness direction and impregnated with a resin. Examples of "divided wood fiberboard" (divided wood fiberboard by irregular division) and a wood decorative board having the same as a base material.

[Example A: 1-1 peel strength test]
An MDF with a thickness of 2.7 mm is irregularly divided in the thickness direction at the low-density layer portion which is the inner layer to obtain a divided MDF whose strength has deteriorated, and after bonding the high-density side and the plywood, the low-density side is ground. The thickness of the divided MDF was 0.6 mm. A wood composite base material was obtained by applying 2.9 g / scale ² of SB-based emulsion on the low density side as a solid content, impregnating and hot-pressing. A veneer was bonded to the surface to make a wood decorative board, and an interlayer peel test was performed on the veneer to measure the plane tensile strength (N / mm ² ). The results are shown in Table 1.

[Example A: 1-2 peel strength test]
An MDF with a thickness of 2.7 mm was irregularly divided in the thickness direction at the low density layer portion, which is the inner layer, to obtain a divided MDF with deteriorated strength, and melamine resin was applied to the high density side with 12 g / scale ² in solid content. After the impregnation, the high-density side of the divided MDF coated with the plywood deck and the melamine resin was hot-pressure bonded, and the surface was ground to obtain a wood composite base material having a divided MDF thickness of 0.6 mm. A veneer was bonded to the surface to make a wood decorative board, and an interlayer peel test was performed on the veneer to measure the plane tensile strength (N / mm ² ). The results are shown in Table 1.

[Comparative Example A: 1-peel strength test]
Except for using divided MDF not impregnated with emulsion on the low density layer side, a wooden decorative board was obtained in the same manner as in Example A-1-1, and the delamination test was performed in the same manner as in Example A-1-1. The plane tensile strength (N / mm ² ) was measured. The results are shown in Table 1.

[Evaluation]
From Table 1, it can be seen that the wood composite base material (woody decorative board) manufactured by the method according to the present invention can reinforce the wood fiber board damaged by irregular division, and the strength of the divided MDF is improved. . In addition, as shown in Example 1-2, it can be seen that even when the resin is impregnated from the high-density layer side, the resin impregnation proceeds to the whole, thereby improving the strength.

The delamination test was performed as follows. That is, the attachments are fixed to both the front and back surfaces of the wooden decorative board via a strong adhesive, and the attachments facing each other are pulled at a constant load speed in a direction away from each other. And the maximum load when the low density layer in a division | segmentation wood fiber board raise | generates delamination was measured, and this maximum load was measured as plane tensile strength (N / mm < ² >).

[Example A: 2-formaldehyde emission test]
An MDF having a thickness of 2.7 mm was irregularly divided in the thickness direction at the low density layer portion which is the inner layer to obtain a divided MDF having deteriorated strength, and the low density side was ground to obtain a divided MDF having a thickness of 0.6 mm. . After applying 4.0 g / scale ² of SB-based emulsion on both sides as a solid content, the low density side and the plywood deck were bonded by heat and pressure to obtain a wood composite base material. A veneer was bonded to the surface to obtain a wood decorative board, and the amount of formaldehyde emitted by the desiccator method was measured on the obtained wooden decorative board. The results are shown in Table 2.

[Comparative Example A: 2-formaldehyde emission test]
Except for using divided MDF not impregnated with emulsion, a wooden decorative board was obtained in the same manner as in Example A: 2, and the amount of formaldehyde emitted (mg / L) was measured by the desiccator method in the same manner as in Example A: 2. did. The results are shown in Table 2.

[Evaluation]
As shown in Table 2, the wooden decorative board produced by the method according to the present invention has very little formaldehyde emission. This is understood because the resin (SB emulsion) impregnated into the divided MDF functions as a suppressant.

  In addition, the formaldehyde emission amount test was conducted as follows. That is, a crystal dish containing 300 ml of distilled water is placed on the bottom of the desiccator, and a test piece is placed on the support fitting in the desiccator to close the desiccator. It is allowed to stand at 20 degrees for 24 hours, and formaldehyde is absorbed into distilled water, and the distilled water that has absorbed formaldehyde is quantified.

[Example A: 3-DuPont test]
Example A: The wood decorative board used in 2 was subjected to a DuPont test, and the amount of dents (mm) was measured. The results are shown in Table 3.

[Comparative Example A: 3-DuPont test]
A DuPont test was performed on the same wood decorative board as in Example A: 3 except that a divided MDF not impregnated with an emulsion was used, and the amount of dents (mm) was measured. The results are shown in Table 3.

[Evaluation]
From Table 3, the wooden decorative board manufactured by the method according to the present invention has improved DuPont performance. This is understood to be the result of the resin impregnated in the used divided MDF (SB emulsion) improving the strength of the low density layer of the divided MDF.

  The DuPont test was conducted as follows. That is, a shooting mold is placed on a test piece, and a weight of 500 g is dropped onto the shooting mold from a height of 300 mm. The amount of dent at that time is measured.

[Example A: 4-1 caster resistance test]
Example A: The same four wood decorative boards as used in Example 1-1 were subjected to a caster resistance test to verify the caster resistance. In the test, the case where no peeling occurred was regarded as acceptable. The results are shown in Table 4.

[Example A: 4-2 caster resistance test]
Example A: The same caster resistance test as in Example A: 4-1 was performed on the same four wood decorative boards as used in Example 1-2, and the caster resistance was verified. In the test, the case where no peeling occurred was regarded as acceptable. The results are shown in Table 4.

[Comparative Example A: 4-caster resistance test]
A wooden decorative board was obtained in the same manner as in Example A: 4-1 except that a split MDF having a thickness of 0.6 mm not impregnated with resin was used as the divided wooden fiberboard, and Example A: 4-1 Similarly, a caster resistance test was performed to verify the caster resistance. The results are shown in Table 4.

[Evaluation]
From Table 4, it can be seen that the wooden decorative board manufactured by the method of the present invention has improved caster resistance. This is understood to be the result of the emulsion or resin impregnated in the used divided MDF improving the strength of the low density layer of the divided MDF.

  The caster resistance test was conducted as follows. That is, a caster of 25 kgf is placed on the test piece, and the caster is reciprocated to examine peeling.

[Example A: 5-1: Wax tape test]
Example A: The same wooden decorative board as that used in 1-1 was immersed in wax for 1 minute and then taken out, and a wax tape test was performed to measure the permeation distance (mm) from the mouth end surface. The results are shown in Table 5.

[Example A: 5-2: Wax tape test]
Example A: The same wood decorative board as that used in 1-2 was immersed in wax for 1 minute and then taken out, and a wax tape test was performed to measure the permeation distance (mm) from the mouth end surface. The results are shown in Table 5.

[Comparative Example A: 5: Wax tape test]
As a divided wood fiber board, a wooden decorative board was obtained in the same manner as in Example A: 5-1 except that a split MDF having a thickness of 0.6 mm which was not impregnated with resin was used, and Example A: 5-1 A wax tape test was conducted in the same manner. The results are shown in Table 5.

[Evaluation]
From Table 5, it can be seen that the wood decorative board produced by the method according to the present invention has a reduced penetration width from the end surface and improved water absorption resistance. In particular, when impregnated with melamine resin, high water absorption resistance is obtained.

[Example B]
The wood composite base material of the second form according to the present invention, that is, “a laminated body of divided wood fiber boards and plywood base materials obtained by dividing wood fiber boards having different densities in the thickness direction in the thickness direction” A wood composite base material, wherein the split wood fiber board is a split wood fiber board having a back crack formed at the time of splitting on a split surface and having a high density layer and a low density layer and impregnated with a resin. Examples of “divided wood fiberboard” (divided wood fiberboard with cracks) and a wood decorative board having the same as a base material.

[Example B: 1-1 peel strength test]
After dividing the MDF with a thickness of 2.7 mm in the thickness direction at the low density layer portion which is the inner layer, a divided MDF with a crack on the low density side is obtained, and after bonding the high density side and the plywood, the low density The side was ground and the thickness of the split MDF with cracks was 0.6 mm. A wood composite substrate was obtained by applying and impregnating 2.9 g / scale ² of an SB-based emulsion on the low density side with a solid content and hot pressing. A veneer was bonded to the surface to give a wood decorative board, and an interlayer peel test was performed in the same manner as in Example A: 1-1 to measure the plane tensile strength (N / mm ² ). The results are shown in Table 6.

[Example B: 1-2 peel strength test]
A 2.7 mm thick MDF is divided in the thickness direction at the low density layer portion which is the inner layer to obtain a divided MDF with a crack on the low density side, and the low density side is ground to a thickness of 0.6 mm It was set as the division | segmentation MDF with a back crack. By adhering the low density layer side of the divided MDF and the plywood substrate and applying and impregnating 2.5 g / scale ² of SB-based emulsion in solid content on the high density side without back cracks, A composite substrate was obtained. A veneer was bonded to the surface to make a wood decorative board, and the same delamination test as in Example B-1-1 was performed on the surface, and the plane tensile strength (N / mm ² ) was measured. The results are shown in Table 6.

[Example B: 1-3 peel strength test]
A 2.7 mm thick MDF is divided in the thickness direction at the low density layer portion, which is the inner layer, to obtain a divided MDF with a crack on the low density side, and a melamine resin on the high density side without the back crack as a solid content Then, 12 g / scale ² was applied and impregnated, and then the plywood deck and the divided MDF were heat-pressure bonded using the melamine resin coating surface as the bonding surface. The low density side of the split MDF with cracks in the back was ground to obtain a wood composite base material having a thickness of 0.6 mm. A veneer was bonded to the ground surface of the divided MDF to make a wood decorative board, and the same delamination test as in Example B-1-1 was performed to measure the plane tensile strength (N / mm ² ). . The results are shown in Table 6.

[Comparative Example B: 1-peel strength test]
A wooden decorative board was obtained in the same manner as in Example B-1-1 except that a split MDF with a back crack not impregnated with an emulsion was used, and a delamination test was performed in the same manner as in Example B-1-1. The plane tensile strength (N / mm ² ) was measured. The results are shown in Table 6.

[Evaluation]
From Table 6, the wood composite base material (wooden decorative board) manufactured by the method according to the present invention can reinforce the wood fiber board with the back crack by impregnating the resin, and the split MDF with the back crack can be strengthened. It can be seen that the strength is improved. Further, as shown in Example B: 1-2, it can be seen that even if the resin impregnation is performed from the high-density layer side, the resin impregnation proceeds as a whole, thereby improving the strength.

[Example B: 2-formaldehyde emission test]
A MDF having a thickness of 2.7 mm is divided in the thickness direction at the low density layer portion which is the inner layer to obtain a divided MDF having a back crack, and the low density side which is the divided surface is ground to a thickness of 0.6 mm A divided MDF was used. After applying 4.0 g / scale ² of SB-based emulsion on both sides of the solid, a low density side with cracks and a plywood deck were bonded by heat and pressure to obtain a wood composite base material. A veneer was bonded to the surface to obtain a wooden decorative board, and the amount of formaldehyde emitted by the desiccator method was measured for the obtained wooden decorative board in the same manner as in Example A: 2. The results are shown in Table 7.

[Comparative Example B: 2-formaldehyde emission test]
Except for using split MDF with cracks not impregnated with emulsion, a wooden decorative board was obtained in the same manner as in Example B: 2, and the amount of formaldehyde emitted by the desiccator method (mg / kg) was obtained in the same manner as in Example B: 2. L) was measured. The results are shown in Table 7.

[Evaluation]
As shown in Table 7, the wooden decorative board produced by the method according to the present invention has very little formaldehyde emission. This is understood because the resin (SB emulsion) impregnated into the divided MDF with cracks functioned as a suppressant.

[Example B: 3-DuPont test]
About the wood decorative board used in Example B: 2, the DuPont test similar to Example A: 3 was done, and the amount of dents (mm) was measured. The results are shown in Table 8.

[Comparative Example B: 3-DuPont test]
A DuPont test was performed on the same wooden decorative board as Example B: 3 except that a split MDF with a back crack that was not impregnated with an emulsion was used, and the amount of dents (mm) was measured. The results are shown in Table 8.

[Evaluation]
From Table 8, the wooden decorative board manufactured by the method according to the present invention has improved DuPont performance. This is understood to be a result of improving the strength of the low-density layer of the divided MDF having the back crack by the resin (SB emulsion) impregnated in the divided MDF having the back crack used.

[Example B: 4-1 caster resistance test]
Example B: The same four wooden decorative boards as used in Example 1-1 were subjected to a caster resistance test in the same manner as in Example A-4 to verify the caster resistance. In the test, the case where no peeling occurred was regarded as acceptable. The results are shown in Table 9.

[Example B: 4-2 caster resistance test]
Example B: The same four wood decorative boards as used in 1-3 were subjected to a caster resistance test in the same manner as in Example A-4 to verify the caster resistance. In the test, the case where no peeling occurred was regarded as acceptable. The results are shown in Table 9.

[Comparative Example B: 4-caster resistance test]
A wooden decorative board was obtained in the same manner as in Example B: 4, except that a split MDF with a back crack of 0.6 mm in thickness that was not impregnated with resin was used as the divided wooden fiberboard. Example B: 4 Similarly, a caster resistance test was performed to verify the caster resistance. The results are shown in Table 9.

[Evaluation]
It can be seen from Table 9 that the wood decorative board manufactured by the method according to the present invention has improved caster resistance. This is understood to be the result of the resin impregnated in the split MDF with the back crack used improving the strength of the low density layer of the split MDF with the back crack.

[Example B: 5-1: Wax tape test]
Example B: The same wooden decorative board as that used in 1-1 was immersed in wax for 1 minute and then taken out, and a wax tape test for measuring the permeation distance (mm) from the mouth end surface was performed. The results are shown in Table 10.

[Example B: 5-2: Wax tape test]
Example B: The same wood decorative board as that used in 1-2 was immersed in wax for 1 minute and then taken out, and a wax tape test for measuring the permeation distance (mm) from the mouth end surface was performed. The results are shown in Table 10.

[Comparative Example B: 5: Wax tape test]
Example B: A wooden decorative board was obtained in the same manner as in Example 5-1, except that a divided MDF without a resin crack and having a thickness of 0.6 mm without cracks was used. The wax tape test was conducted in the same manner as in 5-1. The results are shown in Table 10.

[Evaluation]
From Table 10, it can be seen that the wood decorative board produced by the method according to the present invention has a reduced penetration width from the end surface and improved water absorption resistance. In particular, when impregnated with melamine resin, high water absorption resistance is obtained.

[Example C]
The wood composite base material of the third form according to the present invention, that is, “a laminated body of divided wood fiber boards and plywood base materials obtained by dividing wood fiber boards having different densities in the thickness direction in the thickness direction” A wood composite base material, wherein the split wood fiberboard is a split wood fiberboard composed of only a low density layer obtained from a low density region of the wood fiberboard and is impregnated with a resin. Density-divided wood fiberboard) and a wood decorative board having the same as a base material.

[Example C: 1-1 peel strength test]
After grinding one side of the low-density divided MDF obtained by splitting both sides of the MDF with a thickness of 2.7 mm from the low-density layer part that is the inner layer, bonding the ground surface to the plywood deck, and then grinding the other side Thus, a wood composite substrate having a low density divided MDF having a thickness of 0.6 mm was obtained. Furthermore, after applying and impregnating 2.9 g / scale ² of SB emulsion as a solid content from the surface of the low density divided MDF, a wood composite base material was obtained by hot pressing. A veneer was bonded to the surface to give a wood decorative board, and an interlayer peel test was performed in the same manner as in Example A: 1-1 to measure the plane tensile strength (N / mm ² ). The results are shown in Table 11.

[Example C: 1-2 peel strength test]
Grinding one side of a low-density division MDF obtained by splitting a 2.7 mm thick MDF from the low-density layer part that is the inner layer, and applying and impregnating 12 g / scale ² of melamine resin as a solid content on the ground surface Then, the plywood deck and the low-density divided MDF were heat-pressure bonded with the application surface of the melamine resin as the bonding surface. The low density divided MDF was further ground to obtain a wood composite base material having a thickness of 0.6 mm. A veneer is bonded to the ground surface of the low-density divided MDF to form a wood decorative board, and the same delamination test as in Example C-1-1 is performed, and the plane tensile strength (N / mm ² ) is set. It was measured. The results are shown in Table 11.

[Example C: 1-3- peel strength test]
After grinding one side of the low density division MDF with cracks on both sides obtained by splitting both sides of the MDF with a thickness of 2.7 mm from the low density layer part that is the inner layer, The melamine resin was applied and impregnated at a solid content of 12 g / scale ² , and then the plywood deck and the ground surface of the low-density divided MDF were heat-pressure bonded. The low density divided MDF was further ground to obtain a wood composite base material having a thickness of 0.6 mm. A veneer is bonded to the ground surface of the low-density divided MDF to form a wood decorative board, and the same delamination test as in Example C-1-1 is performed, and the plane tensile strength (N / mm ² ) is set. It was measured. The results are shown in Table 11.

[Comparative Example C: 1-peel strength test]
Except for using low-density divided MDF not impregnated with emulsion, a wooden decorative board was obtained in the same manner as in Example C-1-1, and the delamination test was conducted in the same manner as in Example C-1-1. The strength (N / mm ² ) was measured. The results are shown in Table 11.

[Evaluation]
From Table 11, the wood composite substrate (wooden decorative board) produced by the method according to the present invention uses a divided MDF consisting of only a low-density layer that has not been used in the past. It can be seen that the impregnation improves the strength. Moreover, the value is a value which can fully be practically used. Even a low-density divided MDF with a crack in the back has high strength.

[Example C: 2-formaldehyde emission test]
Both sides of the low density divided MDF obtained by dividing the MDF having a thickness of 2.7 mm from the low density layer portion which is the inner layer on both sides were ground to obtain a low density divided MDF having a thickness of 0.6 mm. After applying 4.0 g / scale ² of SB-based emulsion on both sides as a solid content, a plywood deck was bonded by heat and pressure to obtain a wood composite base material. A veneer was bonded to the surface to obtain a wooden decorative board, and the amount of formaldehyde emitted by the desiccator method was measured for the obtained wooden decorative board in the same manner as in Example A: 2. The results are shown in Table 12.

[Comparative Example C: 2-Formaldehyde Emission Test]
Except for using low-density divided MDF not impregnated with emulsion, a wooden decorative board was obtained in the same manner as in Example C: 2, and the amount of formaldehyde emitted by the desiccator method (mg / L) in the same manner as in Example C: 2. Was measured. The results are shown in Table 12.

[Evaluation]
As shown in Table 12, the wooden decorative board produced by the method according to the present invention has very little formaldehyde emission. This is understood because the resin (SB emulsion) impregnated in the low-density divided MDF functioned as an inhibitor.

[Example C: 3-DuPont test]
About the wood decorative board used in Example C: 2, the DuPont test similar to Example A: 3 was done, and the amount of dents (mm) was measured. The results are shown in Table 13.

[Comparative Example C: 3-DuPont test]
A DuPont test was performed on the same wood decorative board as in Example C: 3 except that low density divided MDF not impregnated with an emulsion was used, and the amount of dents (mm) was measured. The results are shown in Table 13.

[Evaluation]
From Table 13, the wooden decorative board manufactured by the method according to the present invention has improved DuPont performance. This is understood to be the result of the resin (SB emulsion) impregnated in the divided MDF composed of the used low density layer improving the strength of the low density divided MDF.

[Example C: 4-1 caster resistance test]
Example C: The same two wooden decorative boards as used in Example 1-1 were subjected to a caster resistance test in the same manner as in Example A-4 to verify the caster resistance. In the test, the case where no peeling occurred was regarded as acceptable. The results are shown in Table 14.

[Example C: 4-2 caster resistance test]
Example C: The same two wood decorative boards as used in Example 1-2 were subjected to a caster resistance test in the same manner as in Example C: 4-1 to verify the caster resistance. In the test, the case where no peeling occurred was regarded as acceptable. The results are shown in Table 14.

[Example C: 4-3-caster resistance test]
Example C: The same two wood decorative boards as used in Example 1-3 were subjected to a caster resistance test in the same manner as in Example C: 4-1 to verify the caster resistance. In the test, the case where no peeling occurred was regarded as acceptable. The results are shown in Table 14.

[Comparative Example C: 4-caster resistance test]
Example C: A wooden decorative board was obtained in the same manner as in Example 4-1, except that a divided MDF consisting only of a low-density layer having a thickness of 0.6 mm that was not impregnated with a resin was used. C: The caster resistance test was conducted in the same manner as in 4-1, and the caster resistance was verified. The results are shown in Table 14.

[Evaluation]
It can be seen from Table 14 that the wooden decorative board manufactured by the method according to the present invention has improved caster resistance despite using a divided MDF consisting of only a low-density layer as the divided MDF. This is understood to be a result of the emulsion impregnated in the used low density divided MDF improving the strength of the low density layer of the low density divided MDF. The caster resistance is also improved in the low density divided MDF with cracks in the back.

[Example C: 5-1: Wax tape test]
Example C: The same wooden decorative board as that used in 1-1 was immersed in wax for 1 minute and then taken out, and a wax tape test for measuring the permeation distance (mm) from the mouth end surface was performed. The results are shown in Table 15.

[Example C: 5-2: Wax tape test]
Example C: The same wooden decorative board as that used in 1-2 was immersed in wax for 1 minute and then taken out, and a wax tape test was performed to measure the permeation distance (mm) from the mouth end surface. The results are shown in Table 15.

[Comparative Example C: 5: Wax tape test]
Example C: A wooden decorative board was obtained in the same manner as in Example 5-1, except that a divided MDF consisting only of a low-density layer having a thickness of 0.6 mm that was not impregnated with a resin was used. C: A wax tape test was conducted in the same manner as in 5-1. The results are shown in Table 15.

[Evaluation]
From Table 15, it can be seen that the wood decorative board produced by the method according to the present invention has a reduced penetration width from the end surface and improved water absorption resistance. In particular, when impregnated with melamine resin, high water absorption resistance is obtained.

The figure explaining one mode when making a division wood fiber board. The figure explaining the other aspect when making a division | segmentation wooden fiber board. The figure explaining one aspect when making the division | segmentation wooden fiber board with a back crack. The figure explaining one aspect | mode when making the wood fiber board which consists only of a low density layer. The figure explaining some manufacturing methods when manufacturing the woody composite base material of the 1st aspect by this invention. The figure explaining the further another manufacturing method when manufacturing the woody composite base material of the 1st aspect by this invention. The figure explaining an example of the wooden decorative plate by this invention. The figure explaining some manufacturing methods when manufacturing the woody composite base material of the 2nd aspect by this invention. The figure explaining further another manufacturing method when manufacturing the woody composite base material of the 2nd aspect by this invention. It is a figure explaining the manufacturing method when manufacturing the woody composite base material of the 3rd aspect by this invention, Comprising: Some examples in the case of using the low density division | segmentation wood fiber board whose one side is a division surface Show. It is a figure following FIG. 10, Comprising: The other example in the case of using the low-density division | segmentation wood fiber board whose one surface is a division surface is shown. It is a figure explaining the manufacturing method when manufacturing the wood composite base material of the 3rd aspect by this invention, Comprising: Some examples in the case of using the low density division | segmentation wood fiber board which both surfaces are a division surface are shown. It is a figure following FIG. 12, Comprising: The other example in the case of using the low density division | segmentation wood fiber board which both surfaces are a division surface is shown.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10, 10A ... Wood fiber board, 11 ... High density layer of wood fiber board, 12 ... Low density layer of wood fiber board, 13 ... Back crack formed in division | segmentation wood fiber board, 15 ... Impregnation into division | segmentation wood fiber board Resin, 20, 20a, 20a1, 20b, 20bl, 20c, 20d, 20d1, 20e, 20e1 ... split wood fiberboard, 30 ... plywood substrate, 40, 40A ... wood composite substrate, 50 ... decorative layer, A ... woody Veneer

Claims (16)

A wood composite base material comprising a laminate of divided wood fiber boards and plywood base materials obtained by dividing wood fiber boards having different densities in the thickness direction,
The divided wood fiber board is a divided wood fiber board having a high density layer and a low density layer obtained by irregularly dividing the wood fiber board in the thickness direction, and is a divided wood fiber board impregnated with a resin. A wood-based composite base material.   The wood composite base material according to claim 1, wherein the high-density layer side of the divided wood fiber board is bonded to a plywood base material.   The wood composite base material according to claim 1, wherein the low-density layer side of the divided wood fiber board is bonded to a plywood base material. A wood composite base material comprising a laminate of divided wood fiber boards and plywood base materials obtained by dividing wood fiber boards having different densities in the thickness direction,
The divided wood fiber board is a divided wood fiber board having a crack formed at the time of division on the dividing surface, a divided wood fiber board having a high density layer and a low density layer, and impregnated with a resin. A wood-based composite base material.   The wood composite base material according to claim 4, wherein the high-density layer side of the divided wood fiber board is bonded to a plywood base material.   The wood composite base material according to claim 4, wherein the low density layer side of the divided wood fiber board is bonded to a plywood base material. A wood composite base material comprising a laminate of divided wood fiber boards and plywood base materials obtained by dividing wood fiber boards having different densities in the thickness direction,
The above-mentioned divided wood fiberboard is a divided wood fiberboard consisting of only a low-density layer obtained from a low-density region of the wood fiberboard, and is a divided wood fiberboard impregnated with a resin. .   The wood composite base material according to claim 7, wherein one side or both sides of the divided wood fiber board have a back crack.   The wood composite base material according to any one of claims 1 to 8 is used as a base material, and a surface decorative layer is provided on the surface opposite to the adhesive surface of the divided wood fiber board with the plywood base material. A wooden veneer characterized by that. It is a manufacturing method of the woody composite base material according to claim 1,
(A) A step of irregularly dividing a wood fiberboard having a density different in the thickness direction at a position shifted to one side instead of the center in the thickness direction to obtain a divided wood fiberboard having a high density layer and a low density layer ,
(B) grinding the split surface of the divided wood fiber board to make it a flat surface;
(C) impregnating the resin from one or both sides of the divided wood fiber board, and
(D) a step of adhering a divided wood fiber board to a plywood substrate with either a divided surface or a surface opposite to the divided surface as an adhesive surface;
A method for producing a wood composite base material comprising at least each of the steps. A method for producing a woody composite substrate according to claim 4,
(A) a step of dividing a wood fiber board having a different density in the thickness direction so that a crack is formed on the divided surface to obtain a divided wood fiber board having a high density layer and a low density layer;
(B) grinding the split surface of the divided wood fiber board to make it a flat surface;
(C) impregnating the resin from one or both sides of the divided wood fiber board, and
(D) a step of adhering a divided wood fiber board to a plywood substrate with either a divided surface or a surface opposite to the divided surface as an adhesive surface;
A method for producing a wood composite base material comprising at least each of the steps. A method for producing a woody composite substrate according to claim 7 or 8,
(A) a step of separating a split wood fiber board consisting of only a low density region from a wood fiber board having a different density in the thickness direction without forming a back crack on the split surface or by forming a back crack;
(B) grinding the split surface of the divided wood fiber board to make it a flat surface;
(C) impregnating the resin from one or both sides of the divided wood fiber board, and
(D) a step of adhering a divided wood fiber board to a plywood substrate with either a divided surface or a surface opposite to the divided surface as an adhesive surface;
A method for producing a wood composite base material comprising at least each of the steps. A method for producing a woody composite substrate according to any one of claims 10 to 12,
A method for producing a wood composite base material, wherein each step is performed in the order of step (a) → step (b) → step (c) → step (d). A method for producing a woody composite substrate according to any one of claims 10 to 12,
A method for producing a wood composite base material, wherein each step is performed in the order of step (a) → step (b) → step (d) → step (c). A method for producing a woody composite substrate according to any one of claims 10 to 12,
A method for producing a wood composite base material, wherein each step is performed in the order of step (a) → step (d) → step (b) → step (c). A method for producing a woody composite substrate according to any one of claims 10 to 12,
A method for producing a wood composite substrate, wherein each step is performed in the order of step (a) → step (c) → step (d) → step (b).

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