JP2009116190A - Manufacturing method of display panel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To easily expose a terminal region by partially removing one of a pair of glass substrates. <P>SOLUTION: The manufacturing method of a display panel includes the stages of: fabricating a first glass mother board 120aa having a plurality of display regions and a plurality of terminal regions T defined; fabricating a second glass mother board 130aa having a plurality of display regions defined; forming a stuck body 150aa by sticking the first glass mother board 120aa and second glass mother board 130aa together with a thermally expansive resin layer 33a disposed in each terminal region T; parting the second glass mother board 130aa for every display region by heating at least the resin layer 33a after forming first scribe lines L1 and second scribe lines on a surface of the second glass mother board 130aa constituting the cemented body 150aa; and parting the first glass mother board 120aa constituting the cemented body having the second glass mother board 130aa parted for every display region. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a display panel manufacturing method, and more particularly to a display panel manufacturing method manufactured from a pair of glass substrates bonded to each other.

  In order to improve the manufacturing efficiency of the liquid crystal display panel, a plurality of display areas are often manufactured with a plurality of chamfers from a pair of substrates each defined in a matrix.

For example, in Patent Document 1, in a large panel structure formed by laminating two large substrates and having a plurality of electro-optic regions enclosing an electro-optic material, the electro-optic region is attached to one large substrate. It is disclosed that a test terminal connected to the external connection terminal formed every time through a wiring pattern is formed, and the test terminal is exposed after bonding. And according to this, it is possible to inspect the display state by bringing the terminal of the inspection probe into contact with the test terminal while the two large substrates are bonded together, and the efficiency of the inspection process is realized. It is described that it is possible.
JP 2005-249939 A

  By the way, in the large-sized panel structure for an electro-optical device disclosed in Patent Document 1, as described above, in order to realize the efficiency of the inspection process, each is connected to an external connection terminal formed for each electro-optical region. It is necessary to form a test terminal on the edge of one substrate. Here, in order to directly input the inspection signal to the external connection terminal formed for each electro-optical region without forming the test terminal on the edge of the substrate, the external connection terminal for each electro-optical region is formed. It is necessary to partially remove the other substrate that covers the terminal region. And in order to partially divide and remove the other substrate, even if a pair of scribe lines extending in parallel with each other are formed on the surface of the glass substrate constituting the other substrate by a wheel cutter or a laser, Since the part to be removed arranged between the pair of scribe lines fits between the substrate bodies, it is difficult to separate them from the substrate bodies. Therefore, in a pair of glass substrates in which a plurality of display areas are respectively defined in a matrix and bonded together, one glass substrate (the other substrate) between the display areas is partially removed to remove the terminal area. It is difficult to expose. In addition, even when one display region is defined and a pair of glass substrates are bonded to each other, and the terminal region is defined not on the edge of the substrate but on the inside, one glass substrate is partially removed. Thus, it is considered difficult to expose the terminal region.

  This invention is made | formed in view of this point, The place made into the objective is to remove partially one side of a pair of glass substrate, and to expose a terminal area | region easily.

  In order to achieve the above object, the present invention provides a terminal after forming a scribe line on a second glass (mother) substrate of a bonded body obtained by bonding a first glass (mother) substrate and a second glass (mother) substrate. The resin layer having thermal expansibility arranged in the region is heated.

  Specifically, the method for manufacturing a display panel according to the present invention produces a first glass mother substrate in which a plurality of display areas each for performing image display and a plurality of terminal areas provided for each display area are defined. A first glass mother substrate manufacturing step, a second glass mother substrate manufacturing step for manufacturing a second glass mother substrate in which a plurality of display areas for performing image display are defined so as to overlap the display areas, respectively, A bonding step of forming a bonded body by bonding the first glass mother substrate and the second glass mother substrate in a state where a resin layer having a thermal expansion property is disposed in the terminal region, and a first forming the bonded body. A first scribe line for exposing the terminal regions to the surface of the two glass mother substrate, and a second scribe line for dividing the second glass mother substrate into the display regions. After the formation, by heating at least the resin layer, a first dividing step of dividing the second glass mother substrate for each display region and a bonded body in which the second glass mother substrate is divided are configured. And a second dividing step of dividing the first glass mother substrate for each display area.

  According to said method, in a bonding process, the 1st glass mother substrate produced at the 1st glass mother substrate preparation process and the 2nd glass mother substrate produced at the 2nd glass mother substrate preparation process are mutually. By bonding the display regions so that the resin layers having thermal expansibility are disposed in each terminal region while overlapping each other, a bonded body is produced. And in a 1st parting process, after forming the 1st scribe line and the 2nd scribe line in the 2nd glass mother board of a pasting object, by heating and thermally expanding the resin layer arranged at the terminal field, at least Since the second glass mother substrate is divided along the first scribe line, each terminal region of the first glass mother substrate is exposed. In the first dividing step, when the first scribe line and the second scribe line are formed by a specially shaped cutter wheel, the cracks of each scribe line proceed in the thickness direction of the substrate. When the second scribe line is formed, the second glass mother substrate is divided for each display region. In addition, when the crack of each scribe line is formed only on the surface of the second glass mother substrate, the second glass mother substrate is divided for each display region by applying stress to the second glass mother substrate. The Then, the 1st glass mother board | substrate of a bonding body is parted for every display area by performing a 2nd parting process. Therefore, by performing the first dividing step of dividing the second glass mother substrate, one of the pair of glass substrates each having a plurality of display regions is partially removed to easily expose the terminal region. It becomes possible.

  You may provide the test | inspection process which inputs a signal into each said terminal area | region between the said 1st cutting process and the 2nd cutting process, and performs a display test | inspection.

  According to said method, since a test | inspection process is performed before the 2nd parting process which divides a bonding body for every display area, a display test is collectively performed with respect to the bonding body which is not divided for every display area. This makes it possible to improve display inspection efficiency.

  In the first glass mother substrate manufacturing step, the first glass mother substrate may be manufactured such that the terminal regions are defined in a plurality of rows.

  According to said method, since each terminal area | region in a 1st glass mother board | substrate is prescribed | regulated in the shape of a some row | line | column, by dividing | segmenting a 2nd glass mother board | substrate in a 1st cutting process, each terminal area | region has multiple. Will be exposed in a row. In addition, when the inspection process is performed between the first dividing process and the second dividing process, the display inspection can be quickly and collectively performed by the inspection probe in which a plurality of output terminals are linearly arranged. Thus, the display inspection efficiency can be further improved.

  In the second glass mother substrate manufacturing step, the resin layer may be formed at a position overlapping the terminal regions of the second glass mother substrate.

  According to the above method, in the second glass mother substrate manufacturing step, the resin layer is formed in the region of the second glass mother substrate corresponding to each terminal region of the first glass mother substrate, and in the first dividing step, Since part of the second glass mother substrate on which the resin layer is formed is removed, the thermally expanded resin layer does not exist in the manufactured display panel.

  In the first glass mother substrate manufacturing step, the resin layer may be formed in each terminal region of the first glass mother substrate.

  According to the above method, since the resin layer is formed in each terminal region of the first glass mother substrate in the first glass mother substrate manufacturing step, the thermally expanded resin layer remains on the manufactured display panel. It will be.

  In the first dividing step, the resin layer may be thermally expanded so as not to protrude from the second glass mother substrate.

  According to the above method, since the thermally expanded resin layer does not protrude from the second glass mother substrate, a decrease in yield in the process of mounting an FPC (flexible printed circuit) or the like in the terminal region is suppressed.

  Between the said bonding process and the 1st cutting process, it comprises the thinning process which thins at least the 2nd glass mother substrate which comprises the said bonding body, and the said resin layer is made into the said thin board in the said 1st cutting process. The thermal expansion may be performed so as not to protrude from the second glass mother substrate.

  According to the above method, since the thermally expanded resin layer does not protrude from the second glass mother substrate thinned in the thinning step, the yield in the step of mounting a flexible printed circuit (FPC) or the like in the terminal region is reduced. Is suppressed.

  You may provide the thinning process which thins at least one of the 1st glass mother board | substrate and 2nd glass mother board | substrate which comprise the said bonding body between the said bonding process and a 1st cutting process.

  According to the above method, since at least one of the first glass mother substrate and the second glass mother substrate is thinned in the thinning step, the manufactured display panel can be thinned and lightened. In addition, when the second glass mother substrate is thinned in the thinning step, the weight of the second glass mother substrate removed in the first dividing step is reduced, so the amount of the resin layer disposed in each terminal region Can be reduced.

  In the bonding step, a liquid crystal layer may be disposed between each display region of the first glass mother substrate and each display region of the second glass mother substrate.

  According to the above method, in the bonding step, for example, the liquid crystal layer is sealed between the first glass mother substrate and the second glass mother substrate via the frame-shaped sealing material formed for each display region. Therefore, a liquid crystal display panel is specifically manufactured as the display panel.

  The method for manufacturing a display panel according to the present invention also includes a first glass substrate manufacturing method for manufacturing a first glass substrate in which a display area for displaying an image and a terminal area for inputting a signal to the display area are defined. And a second glass substrate manufacturing step of manufacturing a second glass substrate in which a display region for displaying an image so as to overlap the display region is defined, and a resin layer having a thermal expansion property is disposed in the terminal region. In the state, the first glass substrate and the second glass substrate are bonded together to produce a bonded body, and the surface of the second glass substrate constituting the bonded body is scribed along the peripheral edge of the terminal region. And a dividing step of dividing the second glass substrate by heating the resin layer after forming the line.

  According to the above method, in the bonding step, each display region overlaps the first glass substrate produced in the first glass substrate production step and the second glass substrate produced in the second glass substrate production step. A bonded body is produced by bonding so that a resin layer having thermal expansibility is disposed in the terminal region. And in a dividing process, after forming a scribe line in the 2nd glass substrate of a pasting object, the 2nd glass substrate is divided along a scribe line by heating and thermally expanding the resin layer arranged in the terminal field. Therefore, the terminal region of the first glass substrate is exposed. Therefore, it is possible to easily expose the terminal region by partially removing one of the pair of glass substrates by performing a dividing step of dividing the second glass substrate.

  According to this invention, after forming a scribe line in the 2nd glass (mother) board | substrate of the bonding body which bonded the 1st glass (mother) board | substrate and the 2nd glass (mother) board | substrate, resin arrange | positioned in the terminal area | region. Since the layer is heated and thermally expanded, one of the pair of glass substrates can be partially removed to easily expose the terminal region.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In each of the following embodiments, a liquid crystal display panel is exemplified as the display panel, but the present invention is not limited to the following embodiments.

Embodiment 1 of the Invention
1 to 7 show Embodiment 1 of a method for manufacturing a liquid crystal display panel according to the present invention.

  FIG. 1 is a cross-sectional view of the liquid crystal display panel 50a of the present embodiment.

  As shown in FIG. 1, the liquid crystal display panel 50a includes a TFT (thin film transistor) array substrate 20a and a CF (color filter) substrate 30a that are disposed to face each other, and a TFT array substrate 20a and a CF substrate 30a. The liquid crystal layer 25 is provided, and the TFT array substrate 20a and the CF substrate 30a are bonded to each other and a sealing material 26 provided in a frame shape to enclose the liquid crystal layer 25 is provided. In the liquid crystal display panel 50a, as shown in FIG. 1, a rectangular display area D for displaying an image and a frame-like frame area F around the display area D are defined. Further, in the liquid crystal display panel 50a, the TFT array substrate 20a protrudes from the CF substrate 30a on one side, and the protruding region of the TFT array substrate 20a constitutes a terminal region T. Note that a driver for driving a liquid crystal display is mounted on the terminal region T of the liquid crystal display panel 50a after an inspection process described later.

  As shown in FIG. 1, the TFT array substrate 20a includes an insulating substrate 10a, a TFT array layer 12 provided in the display region D on the insulating substrate 10a, and a plurality of connection terminals 11 provided in the terminal region T. I have.

  The TFT array layer 12 includes a plurality of gate lines (not shown) provided so as to extend in parallel with each other and a plurality of source lines (not provided) provided so as to extend in parallel with each other in a direction orthogonal to the gate lines. A plurality of TFTs (not shown) provided at each intersection of the gate lines and the source lines, and a protective insulating film (not shown) provided so as to cover the TFTs. And a plurality of pixel electrodes (not shown) provided in a matrix on the protective insulating film.

  Each of the TFTs has an island shape in a position corresponding to the gate electrode on the gate insulating film, a gate insulating film provided so as to cover the gate electrode, and a gate electrode in which the gate lines protrude sideways. The semiconductor layer is provided, and the source electrode and the drain electrode are provided so as to face each other on the semiconductor layer. Here, the source electrode is a portion where each of the source lines protrudes laterally. The drain electrode is connected to each pixel electrode through a contact hole formed in the protective insulating film.

  The connection terminal 11 is connected to display wiring such as each gate line and each source line.

  As shown in FIG. 1, the CF substrate 30 a includes an insulating substrate 10 b, a CF layer 21 provided on the insulating substrate 10 b, and a common electrode 22 provided so as to cover the CF layer 21.

  The CF layer 21 includes a black matrix (not shown) provided in a frame shape in the frame region F and in a lattice shape in the display region D in the frame, and a red layer provided between each lattice of the black matrix, It includes colored layers (not shown) such as a green layer and a blue layer.

  The liquid crystal layer 25 is made of a nematic liquid crystal material having electro-optical characteristics.

  In the liquid crystal display panel 50a having the above configuration, when the TFT is turned on when the gate signal from the gate line is sent to the gate electrode of the TFT in the sub-pixel constituting each pixel which is the minimum unit of the image, A source signal from the line is sent to the TFT and a predetermined charge is written to the pixel electrode via the semiconductor layer of the TFT, so that each pixel electrode on the TFT array substrate 20a and the common electrode 22 on the CF substrate 30a are written. A potential difference is generated, and a predetermined voltage is applied to the liquid crystal layer 25. In the liquid crystal display panel 50a, the transmittance of light incident from the backlight is adjusted by utilizing the change in the alignment state of the liquid crystal layer 25 according to the magnitude of the voltage applied to the liquid crystal layer 25, thereby obtaining an image. Is displayed.

  Next, a manufacturing method of the liquid crystal display panel 50a having the above configuration will be described with reference to FIGS. Here, FIG. 2 is a flowchart for manufacturing the liquid crystal display panel 50a. Moreover, FIG. 3 is sectional drawing of bonding body 150aa produced at the bonding process, and FIG. 4 is a perspective view of bonding body 150aa. And FIG. 5 is sectional drawing of the bonding body 150ab produced at the thin plate forming process. Furthermore, FIG. 6 is sectional drawing of the bonding body 150ac after performing a 1st parting process, and FIG. 7 is a perspective view of the bonding body 150ac. The manufacturing method of this embodiment includes the following first glass mother substrate (TFT side substrate) manufacturing step, second glass mother substrate (CF side substrate) manufacturing step, bonding step, thinning step, and first dividing step. And an inspection step and a second dividing step.

-TFT side substrate manufacturing process-
As shown in FIG. 2, the TFT side substrate manufacturing process includes the following TFT array layer forming process, alignment film forming process, and conductive paste coating process.

<TFT array layer formation process>
First, for example, a metal film such as aluminum is formed by sputtering on the entire substrate of the insulating substrate (10a) made of non-alkali glass having a thickness of about 0.7 mm, and then, for each display region D, photolithography is performed. To form gate lines and gate electrodes.

  Subsequently, a silicon nitride film or the like is formed on the entire substrate on which the gate line and the gate electrode are formed by a CVD (Chemical Vapor Deposition) method, thereby forming a gate insulating film.

  Further, an intrinsic amorphous silicon film and an n + amorphous silicon film doped with phosphorus are continuously formed by CVD on the entire substrate on which the gate insulating film has been formed. A semiconductor layer composed of an intrinsic amorphous silicon layer and an n + amorphous silicon layer is formed by patterning in an island shape on the gate electrode by lithography.

  Then, a metal film such as titanium is formed on the entire substrate on which the semiconductor layer has been formed by sputtering, and then patterned for each display region D by photolithography to form a source line, a source electrode, and a drain electrode. Form.

  Subsequently, for each display region D, the n + amorphous silicon layer of the semiconductor layer is etched using the source electrode and the drain electrode as a mask, thereby patterning the channel portion to form a TFT.

  Further, a photosensitive acrylic resin or the like is formed on the entire substrate on which the TFT is formed using a spin coating method, and then a contact hole is patterned on the drain electrode by photolithography for each display region D. Then, a protective insulating film is formed.

  Then, an ITO (Indium Tin Oxide) film is formed on the entire substrate on which the protective insulating film is formed by a sputtering method, and then patterning is performed by photolithography for each display region D to form a pixel electrode. .

  As described above, the plurality of TFT array layers 12 are formed in a matrix on the insulating substrate (10a). The plurality of connection terminals 11 disposed in each terminal region T are formed by appropriately patterning the metal films that constitute the gate lines, source lines, pixel electrodes, and the like disposed in each display region T. .

<Alignment film formation process>
An alignment film is formed by applying a polyimide resin to the entire substrate on which the plurality of TFT array layers 12 have been formed in the TFT array layer forming step by a printing method and then performing a rubbing process.

<Conductive paste application process>
In order to electrically connect the capacitor line extending between the gate lines on the TFT array substrate 20a and the common electrode 22 of the CF substrate 30a to a part of each frame region of the substrate on which the alignment film is formed in the alignment film forming step. Apply the conductive paste.

  As described above, the TFT side substrate 120aa in which the plurality of display regions D and the plurality of terminal regions T are respectively defined can be manufactured.

~ CF side substrate manufacturing process ~
As shown in FIG. 2, the CF side substrate manufacturing process includes the following CF layer forming process, common electrode forming process, alignment film forming process, spacer spraying process, sealing material forming process, liquid crystal dropping process, and resin layer forming process. .

<CF layer formation process>
First, for example, a chromium thin film is formed on the entire substrate of an insulating substrate (10b) made of non-alkali glass having a thickness of about 0.7 mm, for example, by sputtering, and then, for each display region D, photolithography is performed. To form a black matrix.

  Subsequently, for example, a photosensitive resist material colored in red, green, or blue is applied to the entire substrate on which the black matrix is formed, and then, for each display region D, patterning is performed between the lattices by photolithography. Then, a colored layer (for example, a red layer) of the selected color is formed. Thereafter, by repeating the same process for the other two colors, other colored layers (for example, a green layer and a blue layer) are formed, and the CF layer 21 is formed for each display region D.

<Common electrode formation process>
An ITO film is formed by sputtering on the substrate on which the CF layer 21 has been formed in the CF layer forming step, and the common electrode 22 is formed for each display region D.

<Alignment film formation process>
A polyimide resin is applied to the entire substrate on which the common electrode 22 is formed in the common electrode forming step by a printing method, and then a rubbing process is performed to form an alignment film.

<Spacer spraying process>
A spherical spacer made of silica or plastic is dispersed on the surface of the substrate on which the alignment film has been formed in the alignment film forming step.

<Sealing material formation process>
For example, a drawing device such as a dispenser is used to draw a UV curable resin in a frame shape for each display region D on the substrate on which the spacers are dispersed in the spacer spraying step. A material 26 is formed.

<Liquid crystal dropping process>
A liquid crystal material (25) is dropped onto each display region D of the substrate on which the sealing material 26 is formed in the sealing material forming step.

<Resin layer forming step>
After applying a resin film having thermal expansibility to the substrate on which the liquid crystal material (25) has been dropped in the liquid crystal dropping step with a syringe or the like at a position overlapping both ends of each terminal region T of the TFT side substrate 120a, The resin layer 33a is formed by irradiating the applied resin film with UV light.

  Here, the resin layer 33a is made of a UV curable resin 31a containing microcapsules 32a having thermal expansion properties. The microcapsule 32a includes a thermoplastic shell and a core enclosed in the shell. The shell is composed of acrylonitrile, vinyl chloride, vinylidene chloride, acrylic ester, acrylonitrile, methacrylic ester, styrene, vinyl acetate and copolymers thereof. The core is composed of an organic solvent having a boiling point of about −50 ° C. to 150 ° C., such as hydrocarbon and petroleum ether, and carbonates or bicarbonates that generate carbon dioxide by thermal decomposition or chemical reaction. ing. And when the microcapsule 32a is heated to about 100 ° C. to 170 ° C., the shell softens, and the vapor pressure of the core increases, thereby causing thermal expansion.

Also, the force generated when a sufficient amount of heat is applied to the microcapsules 32a are per capsule, it is about ^{1.0MPa~3.0MPa (1.0N / mm 2 ~3.0N /} mm 2). And since the to-be-removed part of the CF side substrate arranged in the terminal region T is large and 4 mm long × 40 mm wide, if the thickness of the glass substrate is 0.1 mm to 1.1 mm, the volume ^is a 16mm ³ ~176mm 3. Furthermore, since the specific gravity of the alkali-free glass is 2.5 g / cm ³ , the weight of the part to be removed is 0.04 g to 0.44 g. Here, the force generated by one of the microcapsules 32a, as described ^above, since it is ^{1.0N / mm 2 ~3.0N / mm 2} , for example, in the region of the terminal near the microcapsules 32a is 1 By forming about 4.4 × 10 ⁻² mm ^{2 of} the resin layer 33a containing about pieces / mm ^2, the force for pushing up the removed portion is sufficiently secured.

  As described above, the CF side substrate 130aa in which the plurality of display areas D are defined can be manufactured.

~ Lamination process ~
First, the TFT side substrate 120aa produced in the TFT side substrate production step and the CF side substrate 130aa produced in the CF side substrate production step are bonded so that the respective display regions D overlap each other under reduced pressure. Thereby, as shown in FIG.3 and FIG.4, bonded body 150aa is produced.

  Then, the surface and the back surface of the bonded body 150aa are pressurized by releasing the bonded body 150aa to atmospheric pressure.

  Furthermore, with respect to each frame area | region F of bonding body 150aa, UV light is irradiated and the sealing material 26 is hardened.

~ Thinning process ~
The glass substrate (10a) which comprises TFT side board | substrate 120aa and CF side board | substrate 130aa by performing processes, such as chemical etching and mechanical grinding | polishing, on the surface and back surface of bonding body 150aa which hardened sealing material 26 by the said bonding process. And 10b) are each thinned to about 0.3 mm, and as shown in FIG. 5, a bonded body 150ab including the thinned TFT side substrate 120ab and CF side substrate 130ab is produced.

~ First parting process ~
First, on the surface of the CF-side substrate 130ab of the bonded body 150ab produced in the thinning step, as shown in FIG. 5, along the peripheral edge of each display area D (the outer peripheral edge of each frame area F), for example, The first scribe line L1 and the second scribe line L1 are formed by rolling a highly penetrating cutter wheel such as Penet (registered trademark) having a micro-size unevenness at the tip of the wheel and having cracks formed deeper than usual. A scribe line L2 (see FIG. 4) is formed. In the present embodiment, as described above, cracks are formed on the substrate surface using a specially shaped cutter wheel, and thus the formed cracks proceed in the substrate thickness direction to form the bonded body 150ab. The CF side substrate 130ab is divided for each display region D.

  Then, by irradiating the resin layer 33a arrange | positioned at each terminal area | region T of the bonding body 150ab with a laser beam, the resin layer 33a is heated to about 100 to 150 degreeC, and the resin layer 33a is thermally expanded. As a result, the thermally expanded UV curable resin 31b and the resin layer 33b including the microcapsules 32b are formed. As shown in FIGS. 6 and 7, the glass edge material S is removed from the CF side substrate 130ab. Then, a bonded body 150ac including the TFT side substrate 120ab and the CF substrate 30a is manufactured.

~ Inspection process ~
An inspection probe is brought into contact with the plurality of connection terminals 11 in each terminal region T of the bonded body 150ac produced in the first dividing step, and the display probe D is connected to each display region D through the plurality of connection terminals 11 from the inspection probe. By inputting a predetermined inspection signal, each sub-pixel is appropriately turned on, and the display state of each display area D is observed with an image reading device such as a CCD (charge coupled device) camera to perform display inspection at once. And do it.

~ Second parting process ~
On the surface of the TFT-side substrate 120ab of the bonded body 150ac subjected to the display inspection in the inspection step, the side between each terminal region T and each adjacent display region D, and between the adjacent display regions D. As shown in FIG. 7, the third scribe line L3 is formed by rolling a cutter wheel having a special shape along the side of the TFT side substrate 120ab constituting the bonded body 150ac to each display region D. Divide every time.

  As described above, the liquid crystal display panel 50a of this embodiment can be manufactured. Thereafter, the liquid crystal display panel 50a determined to be a non-defective product in the inspection process is bonded to the front and back surfaces of the liquid crystal display panel 50, and a liquid crystal display driving driver or the like is mounted on the terminal region T. Manufactured.

  As described above, according to the manufacturing method of the liquid crystal display panel 50a of this embodiment, in the bonding process, the TFT side substrate 120aa manufactured in the TFT side substrate manufacturing process and the CF side substrate manufacturing process were manufactured. A bonded body 150aa (150ab) is manufactured by bonding the CF-side substrate 130aa to each other so that the display areas D overlap each other and the resin layers 33a having thermal expansion properties are disposed in the terminal areas T. And in a 1st parting process, after forming the 1st scribe line L1 and the 2nd scribe line L2 in CF side board | substrate 130ab of bonding body 150ab, the resin layer 33a arrange | positioned at the terminal area | region T is heated and thermally expanded. As a result, the CF side substrate 130ab is divided along at least the first scribe line L1, so that each terminal region T of the TFT side substrate 120ab is exposed. In the first dividing step, since the first scribe line L1 and the second scribe line L2 are formed with a specially shaped cutter wheel, the cracks in the scribe lines L1 and L2 progress in the substrate thickness direction. When the first scribe line L1 and the second scribe line L2 are formed, the CF side substrate 130ab is divided for each display region D. Then, the TFT side substrate 120ab of the bonded body 150ac is divided for each display region D by performing the second dividing step. Therefore, by performing the first dividing step of dividing the CF side substrate 130ab, one of the TFT side substrate 120aa (120ab) and the CF side substrate 130aa (130ab) in which the plurality of display regions D are respectively defined is partially removed. Thus, each terminal region T can be easily exposed.

  Moreover, according to this embodiment, since an inspection process is performed before the 2nd parting process which divides the bonding body 150ac for every display area D, with respect to the bonding body 150ac which is not divided for each display area D Display inspection can be performed collectively, and the efficiency of display inspection can be improved.

  Further, according to the present embodiment, since each terminal region T in the TFT side substrate 120aa (120ab) is defined in a plurality of rows, each CF side substrate 130ab is divided in the first dividing step. The terminal region T is exposed in a plurality of rows. In addition, since the inspection process is performed between the first dividing process and the second dividing process, the display inspection can be quickly and collectively performed by the inspection probe in which a plurality of output terminals are arranged in a line, The efficiency of display inspection can be further improved.

  Further, according to the present embodiment, in the CF side substrate manufacturing step, the resin layer 33a is formed in the region of the CF side substrate 130aa corresponding to each terminal region T of the TFT side substrate 120aa, and in the first dividing step, Since a part of the CF side substrate 130ab (glass end material S) on which the resin layer 33b in which the resin layer 33a is thermally expanded is formed is removed, the manufactured liquid crystal display panel 50a is used for dividing the glass substrate. The resin layer 33b does not exist.

  Further, according to the present embodiment, since both the TFT side substrate 120aa and the CF side substrate 130aa are thinned in the thinning step, it is possible to reduce the thickness and weight of the manufactured liquid crystal display panel. In the thinning step, the CF side substrate 130aa to be removed in the first dividing step is reduced in weight, so that the amount of the resin layer 33a disposed in each terminal region T can be reduced.

<< Embodiment 2 of the Invention >>
8 to 13 show Embodiment 2 of the method for manufacturing a liquid crystal display panel according to the present invention. In the first embodiment, the method of forming the thermally expandable resin layer 33a on the CF side substrate 130aa is exemplified. However, in the present embodiment, the method of forming the thermally expandable resin layer 36a on the TFT side substrate 120ba. Is illustrated. In addition, in each following embodiment, the same code | symbol is attached | subjected about the same part as FIGS. 1-7, and the detailed description is abbreviate | omitted.

  FIG. 8 is a cross-sectional view of the liquid crystal display panel 50b of the present embodiment.

  As shown in FIG. 1, the liquid crystal display panel 50b includes a TFT array substrate 20b and a CF substrate 30a arranged to face each other, a liquid crystal layer 25 provided between the TFT array substrate 20b and the CF substrate 30a, and a TFT An array substrate 20b and a CF substrate 30a are bonded to each other and a sealing material 26 provided in a frame shape is provided to enclose the liquid crystal layer 25.

  As shown in FIG. 8, the TFT array substrate 20b includes an insulating substrate 10a, a TFT array layer 12 provided in the display region D on the insulating substrate 10a, and a plurality of connection terminals 11 and a resin provided in the terminal region T. Layer 36b.

  The resin layer 36b has a thermally expanded UV curable resin 34b and microcapsules 35b, and is formed at both ends of the plurality of connection terminals 11 arranged in a row in the terminal region T. (See FIG. 13).

  Next, a manufacturing method of the liquid crystal display panel 50b having the above configuration will be described with reference to FIGS. Here, FIG. 9 is a flowchart for manufacturing the liquid crystal display panel 50b. Moreover, FIG. 10 is sectional drawing of bonding body 150ba produced at the bonding process. And FIG. 11 is sectional drawing of the bonding body 150bb produced at the thinning process. Furthermore, FIG. 12 is sectional drawing of the bonding body 150bc after performing a 1st parting process, FIG. 13 is a perspective view of bonding body 150bc. The manufacturing method of this embodiment includes the following first glass mother substrate (TFT side substrate) manufacturing step, second glass mother substrate (CF side substrate) manufacturing step, bonding step, thinning step, and first dividing step. And an inspection step and a second dividing step.

-TFT side substrate manufacturing process-
As shown in FIG. 9, the TFT side substrate manufacturing step includes a TFT array layer forming step, an alignment film forming step, a conductive paste applying step, and a resin layer forming step.

  Since the TFT array layer forming step, the alignment film forming step, and the conductive paste applying step are substantially the same as the corresponding steps in the first embodiment, detailed description thereof is omitted.

<Resin layer forming step>
The TFT array layer forming step, the alignment film forming step, and the conductive paste coating step are sequentially performed, and a resin film having a thermal expansion property is applied to both ends of each terminal region T with a syringe or the like on the substrate coated with the conductive paste. After the application, the resin layer 36a is formed by irradiating the applied resin film with UV light.

  As described above, the TFT side substrate 120ba in which the plurality of display regions D and the plurality of terminal regions T are respectively defined can be manufactured.

~ CF side substrate manufacturing process ~
As shown in FIG. 9, the CF side substrate manufacturing process includes a CF layer forming process, a common electrode forming process, an alignment film forming process, a spacer spraying process, a sealing material forming process, and a liquid crystal dropping process. The CF layer forming step, common electrode forming step, alignment film forming step, spacer spraying step, sealing material forming step, and liquid crystal dropping step are substantially the same as the corresponding steps in the first embodiment. The detailed explanation is omitted.

  A CF side substrate 130ba in which a plurality of display regions D are defined is manufactured by sequentially performing the CF layer forming step, the common electrode forming step, the alignment film forming step, the spacer spraying step, the sealing material forming step, and the liquid crystal dropping step. be able to.

~ Lamination process ~
First, the TFT side substrate 120ba produced in the TFT side substrate production step and the CF side substrate 130ba produced in the CF side substrate production step are bonded so that the respective display regions D overlap each other under reduced pressure. Thereby, as shown in FIG. 10, bonding body 150ba is produced.

  Subsequently, the front and back surfaces of the bonded body 150ba are pressurized by releasing the bonded body 150ba to atmospheric pressure.

  Furthermore, with respect to each frame area | region F of bonding body 150ba, UV light is irradiated and the sealing material 26 is hardened.

~ Thinning process ~
The glass substrate (10a) which comprises TFT side board | substrate 120ba and CF side board | substrate 130ba by performing processes, such as chemical etching and mechanical grinding | polishing, on the surface and back surface of bonding body 150ba which hardened sealing material 26 by the said bonding process. And 10b) are each thinned to about 0.3 mm, and as shown in FIG. 11, a bonded body 150bb including the thinned TFT side substrate 120bb and the CF side substrate 130bb is produced.

~ First parting process ~
First, on the surface of the CF-side substrate 130bb of the bonded body 150bb produced in the thinning step, a cutter wheel having a special shape is rolled along the peripheral edge of each display area D (the outer peripheral edge of each frame area F). By doing so, the 1st scribe line L1 and the 2nd scribe line L2 are formed, and the CF side board | substrate 130bb which comprises the bonding body 150bb is parted for every display area D. FIG.

  Then, by irradiating the resin layer 36a arrange | positioned at each terminal area | region T of bonding body 150bb with a laser beam, the resin layer 36a is heated to about 100 to 150 degreeC, and the resin layer 36a is thermally expanded. As a result, the resin layer 36b including the thermally curable UV curable resin 34b and the microcapsules 35b is formed. As shown in FIGS. 12 and 13, the glass edge material S is removed from the CF side substrate 130bb. A bonded body 150bc including the TFT side substrate 120bb and the CF substrate 30a is produced.

~ Inspection process ~
An inspection probe is brought into contact with the plurality of connection terminals 11 in each terminal region T of the bonded body 150bc produced in the first dividing step, and each display region D is connected to the display region D through the plurality of connection terminals 11 from the inspection probe. By inputting a predetermined inspection signal, each sub-pixel is appropriately turned on, and the display state of each display area D is observed with an image reading device such as a CCD (charge coupled device) camera to perform display inspection at once. And do it.

~ Second parting process ~
In the surface of the TFT-side substrate 120bb of the bonded body 150bc subjected to the display inspection in the inspection step, the side between each terminal region T and each adjacent display region D, and between each adjacent display region D As shown in FIG. 13, by rolling a cutter wheel having a special shape along the side, a third scribe line L3 is formed, and the TFT side substrate 120bb constituting the bonded body 150bc is arranged in each display region D. Divide every time.

  As described above, the liquid crystal display panel 50b of this embodiment can be manufactured. Thereafter, the liquid crystal display panel 50b determined to be a non-defective product in the inspection process is bonded to the front and back surfaces of the liquid crystal display panel, and a liquid crystal display driving driver or the like is mounted on the terminal region T. Manufactured.

  As described above, according to the method for manufacturing the liquid crystal display panel 50b of the present embodiment, as in the first embodiment, the resin layer 36a disposed in the terminal region T is heated and thermally expanded, so that the CF Since the side substrate 130bb can be divided, one of the TFT side substrate 120ba (120bb) and the CF side substrate 130ba (130bb) in which the plurality of display regions D are respectively defined is partially removed to remove each terminal region T. Can be easily exposed.

  In addition, according to the present embodiment, in the TFT side substrate manufacturing process, the resin layer 36a is formed in each terminal region T of the TFT side substrate 120ba, so that the manufactured liquid crystal display panel 50b was used for dividing the glass substrate. The resin layer 36b remains. However, since the thermally expanded resin layer 36b does not protrude from the CF substrate 30a, it is possible to suppress a decrease in yield in the process of mounting FPC or the like in each terminal region T. In the present embodiment, the method of performing the thinning process between the bonding process and the first dividing process is exemplified. However, when this thinning process is not performed, the CF side substrate 130ba is used in the first dividing process. The resin layer 36a may be thermally expanded so as not to protrude from the surface.

<< Embodiment 3 of the Invention >>
14 and 15 show Embodiment 3 of the method for manufacturing a liquid crystal display panel according to the present invention. In each of the above embodiments, a method of manufacturing a liquid crystal display panel with multiple chamfering has been illustrated, but in this embodiment, a method of manufacturing a liquid crystal display panel with single chamfering is illustrated.

  FIG. 14 is a perspective view of the liquid crystal display panel 50ca of the present embodiment.

  As shown in FIG. 14, the liquid crystal display panel 50ca includes a TFT array substrate 20a and a CF substrate 30ca arranged to face each other, and a liquid crystal layer (not shown) provided between the TFT array substrate 20a and the CF substrate 30ca. And a sealing material (not shown) provided in a frame shape for adhering the TFT array substrate 20a and the CF substrate 30ca to each other and enclosing the liquid crystal layer.

  Further, in the liquid crystal display panel 50ca, the peripheral edge of the TFT array substrate 20a coincides with the outer peripheral edge of the CF substrate 30ca on the four sides, and the TFT C is formed by the opening C formed in the CF substrate 30ca in a rectangular shape. The terminal region T of the array substrate 20a is exposed from the CF substrate 30ca.

  Since the configuration of the CF substrate 30ca is substantially the same as the CF substrate 30a of each of the above embodiments except that the opening C is provided as described above, detailed description thereof is omitted.

  Next, a manufacturing method of the liquid crystal display panel 50ca having the above configuration will be described with reference to FIG. Here, FIG. 15 is a perspective view of a bonded body 50cb for manufacturing the liquid crystal display panel 50b. Note that the manufacturing method of the present embodiment includes the following first glass substrate (TFT array substrate) manufacturing step, second glass substrate (CF substrate) manufacturing step, bonding step, and dividing step.

  Regarding the TFT array substrate manufacturing process and the CF substrate manufacturing process, the TFT array substrate and the CF substrate are respectively manufactured by replacing the TFT side substrate manufacturing process and the CF side substrate manufacturing process by multi-chamfering of the first embodiment with single-chamfering. Detailed description thereof will be omitted.

~ Lamination process ~
First, the TFT array substrate 20a produced in the TFT array substrate production step and the CF substrate 30cb produced in the CF substrate production step are bonded so that the display regions D overlap each other under reduced pressure. As shown in 15, the bonded body 50cb is produced.

  Then, the surface and back surface of the bonding body 50cb are pressurized by releasing the bonding body 50cb to atmospheric pressure.

  Further, the sealing material is cured by irradiating each frame region of the bonded body 50cb with UV light.

~ Splitting process ~
First, on the surface of the CF substrate 30cb of the bonded body 50cb produced in the bonding step, as shown in FIG. 15, along the peripheral edge of the region overlapping the terminal region T of the TFT array substrate 20a, a special-shaped cutter By rolling the wheel, a scribe line L is formed, and a part of the CF substrate 30cb constituting the bonded body 50cb is divided.

  Subsequently, by irradiating the resin layer disposed in the terminal region T of the bonded body 50cb with laser light, the resin layer is heated to about 100 ° C. to 150 ° C., and the resin layer is thermally expanded. Thereby, as shown in FIG. 14, the glass end material is removed from the CF substrate 30cb, and the CF substrate 30ca in which the opening C is formed is manufactured.

  Thereafter, the liquid crystal display panel 50ca of this embodiment can be manufactured through an inspection process.

  As described above, according to the manufacturing method of the liquid crystal display panel 50ca of the present embodiment, in the bonding process, the TFT array substrate 20a manufactured in the TFT array substrate manufacturing process and the CF manufactured in the CF substrate manufacturing process. A bonded body 50cb is produced by bonding the substrate 30cb so that each display region D overlaps and a resin layer having a thermal expansion property is disposed in the terminal region T. And in a parting process, after forming the scribe line L in the CF board | substrate 30cb of the bonding body 50cb, by heating and thermally expanding the resin layer arrange | positioned to the terminal area | region T, CF board | substrate 30cb along the scribe line L As a result, the terminal region T of the TFT array substrate 20a is exposed. Therefore, by performing a dividing step of dividing the CF substrate 30cb, one of the TFT array substrate 20a and the CF substrate 30cb can be partially removed to easily expose the terminal region T.

  In each of the above embodiments, the method of forming a scribe line with a specially shaped cutter wheel in the dividing step is exemplified, but after forming a scribe line crack only on the surface of the glass substrate, stress is applied to the glass substrate. By doing so, the glass substrate may be divided.

  Further, in each of the above embodiments, an active matrix liquid crystal display panel is exemplified as the display panel. However, the present invention is a passive matrix liquid crystal display panel and a glass substrate bonded to prevent, for example, moisture mixing. The present invention can also be applied to other display panels such as an EL (electroluminescence) display element.

  As described above, the present invention can perform display inspection collectively by inputting a signal to each terminal region exposed by partially removing one of a pair of glass substrates. It is useful for the manufacturing method of the display panel in general including the manufacturing method of the display panel of a use.

3 is a cross-sectional view of a liquid crystal display panel 50a according to Embodiment 1. FIG. It is a flowchart which shows the manufacturing method of the liquid crystal display panel 50a. It is sectional drawing of bonding body 150aa produced at the bonding process. It is a perspective view of bonding body 150aa. It is sectional drawing of the bonding body 150ab produced at the thinning process. It is sectional drawing of the bonding body 150ac after performing a 1st parting process. It is a perspective view of the bonding body 150ac. It is sectional drawing of the liquid crystal display panel 50b which concerns on Embodiment 2. FIG. It is a flowchart which shows the manufacturing method of the liquid crystal display panel 50b. It is sectional drawing of bonding body 150ba produced at the bonding process. It is sectional drawing of bonding body 150bb produced at the thin plate forming process. It is sectional drawing of the bonding body 150bc after performing a 1st parting process. It is a perspective view of bonding body 150bc. It is a perspective view of liquid crystal display panel 50ca which concerns on Embodiment 3. FIG. It is a perspective view of the bonding body 50cb for manufacturing liquid crystal display panel 50ca.

Explanation of symbols

D display area L scribe line L1 first scribe line L2 second scribe line T terminal area 20a TFT array substrate 25 liquid crystal layer 30ca, 30cb CF substrates 33a, 33b, 36a, 36b resin layers 50a, 50b, 50ca liquid crystal display panel 50cb, 150aa-ac, 150ba-bc Bonded body 120aa, 120ab, 120ba, 120bb TFT side substrate 130aa, 130ab, 130ba, 130bb CF side substrate

Claims (10)

A first glass mother substrate producing step of producing a first glass mother substrate in which a plurality of display areas each for performing image display and a plurality of terminal areas provided for each of the display areas are defined;
A second glass mother substrate production step of producing a second glass mother substrate in which a plurality of display areas each performing image display so as to overlap each display area are defined;
A laminating step for producing a bonded body by laminating the first glass mother substrate and the second glass mother substrate in a state in which a resin layer having a thermal expansion property is disposed in each terminal region,
The 1st scribe line for exposing each said terminal area | region with respect to the surface of the 2nd glass mother board | substrate which comprises the said bonding body, and the 2nd for dividing | segmenting this 2nd glass mother board | substrate for every said display area | region. After forming the scribe line, by heating at least the resin layer, the first glass cutting substrate is divided for each of the display regions,
And a second dividing step of dividing the first glass mother substrate constituting the bonded body from which the second glass mother substrate is divided for each display region. In the manufacturing method of the display panel according to claim 1,
A display panel manufacturing method comprising an inspection step of performing a display inspection by inputting a signal to each of the terminal regions between the first dividing step and the second dividing step. In the manufacturing method of the display panel according to claim 1,
In the first glass mother substrate manufacturing step, the first glass mother substrate is manufactured so that the terminal regions are defined in a plurality of rows. In the manufacturing method of the display panel according to claim 1,
In the second glass mother substrate manufacturing step, the resin layer is formed at a position overlapping the terminal regions of the second glass mother substrate. In the manufacturing method of the display panel according to claim 1,
In the first glass mother substrate manufacturing step, the resin layer is formed in each terminal region of the first glass mother substrate. In the manufacturing method of the display panel according to claim 5,
In the first dividing step, the resin layer is thermally expanded so as not to protrude from the second glass mother substrate. In the manufacturing method of the display panel according to claim 5,
Between the laminating step and the first dividing step, comprising a thinning step of at least thinning the second glass mother substrate constituting the bonded body,
In the first dividing step, the resin layer is thermally expanded so as not to protrude from the thinned second glass mother substrate. In the manufacturing method of the display panel according to claim 1,
A display panel comprising a thinning step of thinning at least one of a first glass mother substrate and a second glass mother substrate constituting the bonded body between the bonding step and the first dividing step. Production method. In the manufacturing method of the display panel according to claim 1,
In the bonding step, a liquid crystal layer is disposed between each display region of the first glass mother substrate and each display region of the second glass mother substrate. A first glass substrate manufacturing step for manufacturing a first glass substrate in which a display region for displaying an image and a terminal region for inputting a signal to the display region are respectively defined;
A second glass substrate production step of producing a second glass substrate in which a display area for displaying an image so as to overlap the display area is defined;
A laminating step of fabricating a bonded body by laminating the first glass substrate and the second glass substrate in a state in which a resin layer having a thermal expansion property is disposed in the terminal region;
After forming a scribe line along the peripheral edge of the terminal region on the surface of the second glass substrate constituting the bonded body, the dividing step of dividing the second glass substrate by heating the resin layer; A method for manufacturing a display panel, comprising:

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