JP2009110890A - Mobile equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To suppress a local temperature rise of a key part in a mobile equipment at which a plurality of keys are installed. <P>SOLUTION: A PDA as the mobile equipment includes a substrate 20, an exothermic semiconductor element 30 installed at a first main surface S1 of the substrate 20, a plurality of switches 22 installed at a second main surface S2 of the substrate 20, a key mat 40 positioned on the second main surface S2 side of the substrate 20, a plurality of protruding parts 42 protruded toward the plurality of respective switches 22 from one main surface of the key mat 40 opposing to the second main surface S2 of the substrate 20, a key 16 which is positioned on the other main surface side of the key mat 40 and can be depressed against the key mat 40, and a heat radiator 60 which is composed of a material having higher heat conductivity than that of the key mat 40 and the key 16, installed between the switches 22 and a depression operation face 16a of the key 16, and spread in a face direction of the second main surface S2 of the substrate 20. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a portable device such as a personal digital assistant (PDA), a digital still camera (DSC), a digital video camera (DVC), an electronic dictionary, and a laptop computer.

  A portable device such as a personal digital assistant (PDA) is provided with a plurality of keys on the surface of the casing, and the portable device can be operated by pressing the key.

Regarding such a key structure, the following structure is disclosed (see Patent Document 1). That is, a button key of an integral configuration arranged to face the central switch and a plurality of peripheral switches arranged around the central switch, and the central switch is operated by pressing the central portion of the button key, The peripheral switch is activated by pressing the part. In such a configuration, among the plurality of pressing projections protruding from the button key corresponding to each switch, the height of the central pressing projection is slightly higher than the surrounding pressing projection. Yes. Accordingly, only the central switch is operated when the central portion of the button key is pressed, and the peripheral pressing projections do not operate the corresponding peripheral switch.
JP 2001-31944 A

  By the way, these mobile devices are equipped with semiconductor elements such as a CPU for operating the mobile devices. Many of these semiconductor elements generate heat during the operation of a portable device. The heat generated from the exothermic semiconductor element is transmitted from the switch on the substrate to the key side through the pressing protrusion disposed opposite to the switch. As a result, the key portion close to the semiconductor element that becomes the heat source becomes locally hot. Therefore, the operation of the key causes the user to sweat his / her hand or finger, which may cause discomfort to the user.

  In addition, when a key is disposed on a portion of the portable device that is held by the user, sweat is interposed between the portable device main body and the user's hand, and the grip performance of the portable device is reduced. The operability may be reduced.

  The present invention has been made in view of such a situation, and an object thereof is to provide a technique for suppressing a local temperature rise in a key portion in a portable device provided with a plurality of keys.

  In order to solve the above problems, an embodiment of the present invention is a portable device. The portable device includes a substrate, a heat-generating semiconductor element provided on the first main surface of the substrate, a plurality of switches provided on the second main surface of the substrate and connected to each other by pressing, A plurality of protrusions that are located on the second main surface side and that protrude toward the respective switches from one main surface of the key mat that is made of an elastic member and that faces the second main surface of the substrate And a key that is located on the other main surface side of the key mat and can be pressed down against the key mat, and is made of a material having higher thermal conductivity than the key mat and the key, and the switch and the key pressing operation surface. And a heat radiating body provided in between and extending in the surface direction of the second main surface of the substrate.

  According to this aspect, the heat generated from the semiconductor element and conducted from the substrate to the key mat via the protrusion is conducted more on the heat radiating side than on the key side, and is distributed to the surroundings through the heat radiating body. Therefore, a local temperature rise in the key portion close to the semiconductor element can be suppressed.

  Another embodiment of the present invention is also a portable device. The portable device includes a substrate, a power source as a heating element provided on the first main surface side of the substrate, a plurality of switches provided on the second main surface of the substrate and connected to each other by pressing, and a substrate A plurality of protrusions which are located on the second main surface side and project from one main surface of the key mat opposed to the second main surface of the substrate toward each of the plurality of switches. And a key that is located on the other main surface side of the key mat and can be pressed down against the key mat, and is made of a material having higher thermal conductivity than the key mat and the key, and a switch and a key pressing operation surface. And a heat radiator that extends in the surface direction of the second main surface of the substrate.

  According to this aspect, the heat generated from the semiconductor element and conducted from the substrate to the key mat via the protrusion is conducted more on the heat radiating side than on the key side, and is distributed to the surroundings through the heat radiating body. Therefore, a local temperature rise in the key portion close to the semiconductor element can be suppressed.

  In the said aspect, the heat radiator may be provided in the other main surface side of the keymat.

  Moreover, in the said aspect, the heat radiator may be provided in the one main surface side of the keymat.

  Moreover, in the said aspect, the heat radiator may be embed | buried under the keymat.

  Moreover, in the said aspect, the heat radiator may support the key with respect to the key mat. Moreover, in the said aspect, the heat radiator may have a through-hole in the position corresponding to a projection part.

  In the above aspect, the key may be a numeric keypad including a plurality of keys.

  ADVANTAGE OF THE INVENTION According to this invention, the local temperature rise of a key part can be suppressed in the portable apparatus provided with the some key.

  The present invention will be described below based on preferred embodiments with reference to the drawings. The same or equivalent components, members, and processes shown in the drawings are denoted by the same reference numerals, and repeated descriptions are omitted as appropriate. The embodiments do not limit the invention but are exemplifications, and all features and combinations thereof described in the embodiments are not necessarily essential to the invention.

(Embodiment 1)
FIG. 1 is a schematic diagram showing an external configuration of a personal digital assistant (PDA) 10 as a portable device according to the first embodiment. In the present embodiment, a PDA is shown as an example of a portable device. However, for example, a portable device such as a digital still camera (DSC), a digital video camera (DVC), an electronic dictionary, or a notebook computer may be used.

  As shown in FIG. 1, the PDA 10 has a structure in which a display unit 12 and an operation unit 14 are connected by a hinge unit 11, and the display unit 12 and the operation unit 14 are formed to be rotatable via the hinge unit 11. ing. The display unit 12 is provided with a display panel 13 including a liquid crystal display (LCD). A plurality of keys 16 for instructing execution of various operations of the PDA 10 and inputting characters and the like are arranged on the operation unit 14.

  FIG. 2 is a schematic partial cross-sectional view taken along line AA of the PDA 10 shown in FIG.

  As shown in FIG. 2, a substrate 20 having a heat generating semiconductor element 30 provided on the first main surface S <b> 1 is disposed in the housing 15 of the operation unit 14 of the PDA 10. On the second main surface S2 opposite to the first main surface S1 of the substrate 20, a plurality of switches 22 for connecting the contacts by pressing are provided. A key mat 40 made of an elastic member is disposed on the second main surface S2 side of the substrate 20. On one main surface of the key mat 40 facing the second main surface S <b> 2 of the substrate 20, a plurality of protrusions 42 protruding toward the respective switches 22 are provided, and the other main surface of the key mat 40 is provided. A plurality of keys 16 that can be pushed down with respect to the key mat 40 are provided on the surface. The key 16 is exposed to the outside of the housing 15 through a through hole 15 a formed in the housing 15. Between the switch 22 and the pressing operation surface 16a (upper surface in the drawing) of the key 16, a heat radiating body 60 that extends in the surface direction of the second main surface S2 of the substrate 20 is provided. Further, a battery 70 as a power source is disposed on the first main surface S1 side of the substrate 20.

  Examples of the heat-generating semiconductor element 30 provided on the first main surface S1 of the substrate 20 include a CPU that controls the operation of the PDA 10, other processors, an LCD controller, and the like.

  The plurality of switches 22 provided on the second main surface S2 of the substrate 20 are so-called metal dome switches (disc spring type switches), and a metal dome (disc spring) is provided on a contact electrode (not shown). It is a configuration. When the metal dome is pressed by the downward movement of the protrusion 42 described later accompanying the pressing operation of the key 16, the metal dome is elastically deformed toward the contact electrode and comes into contact with the contact electrode. The switch 22 is turned on / off by the contact and separation of the metal dome from the contact electrode. The configuration of the switch 22 is not particularly limited to this, and may be a so-called membrane switch.

  A key mat 40 is disposed on the second main surface S2 side of the substrate 20. The key mat 40 is made of an elastic member such as silicon rubber. On the lower surface side of the key mat 40 in the figure, a plurality of protrusions 42 that protrude toward the respective switches 22 are integrally provided. Also, a plurality of keys 16 that can be pushed down with respect to the key mat 40 are provided on the upper surface side of the key mat 40 in the drawing, corresponding to the plurality of protrusions 42. The key 16 is made of a resin material such as plastic or rubber, and is fixed to the key mat 40 with an adhesive, for example. The arrangement method of the key 16 is not particularly limited to this, and the key 16 and the key mat 40 may be integrally formed as shown in FIG. In this case, the key 16 and the key mat 40 may be formed using, for example, polycarbonate.

  When the key 16 is pressed, the key mat 40 is elastically deformed and bends, whereby the protrusion 42 moves downward (toward the substrate 20 side). The metal dome is pressed by the movement of the protrusion 42 and is elastically deformed toward the contact electrode, whereby the switch 22 is turned on. When the key 16 is released, the key mat 40 is restored to its original state by elasticity. This also releases the pressing of the metal dome of the switch 22, the metal dome returns to its original state by its own elasticity, and the switch 22 is turned off.

  The radiator 60 is provided between the switch 22 and the pressing operation surface 16 a of the key 16. By providing the heat radiating body 60, more heat conducted to the key mat 40 can be conducted to the heat radiating body 60 side than to the key 16 side. In the present embodiment, the heat radiating body 60 is disposed on the main surface side of the key mat 40 opposite to the substrate 20, that is, between the key mat 40 and the housing 15 in the surface direction of the second main surface S 2 of the substrate 20. It is provided to spread. About the shape of the heat radiator 60 or the range provided, what is shown to FIG. 4 (A)-(C) is mentioned as an example. 4A to 4C are schematic plan views for explaining the arrangement of the radiator 60. As shown in FIG. 4A, for example, the heat radiating body 60 has a well shape and extends to a region on the key mat 40 where the key 16 is not provided. Alternatively, as shown in FIG. 4B, the heat radiator 60 has a through hole corresponding to the shape of the protrusion 42 at a position corresponding to the protrusion 42, and is provided on almost the entire surface of the key mat 40. . Alternatively, as shown in FIG. 4 (C), the radiator 60 has a through hole corresponding to the shape of the character printed on the push-down operation surface 16a of the key 16 at a position corresponding to the protrusion 42. The key mat 40 is provided on almost the entire surface. Some PDAs 10 have a configuration in which the pressing operation surface 16a of the key 16 is illuminated by light emitted from a light source (not shown) such as an LED provided on the substrate 20. Thus, by not providing the heat radiating body 60 on the same axis as the projection 42 and the key 16, it is possible to prevent the irradiation of light from the substrate 20 side to the key 16.

  Alternatively, the heat radiator 60 may be provided in a region where the distance from the heat-generating semiconductor element 30 in the surface direction of the substrate 20 is within a predetermined range. Here, the distance from the semiconductor element 30 is, for example, a distance from the center point of the semiconductor element 30 or a distance from a hot spot where the temperature is highest. Here, the predetermined range means that when the heat radiating body 60 is not provided, the heat generated from the semiconductor element 30 is conducted to the key 16 through the protrusions 42 so that the key 16 has a predetermined temperature or higher, for example, the key. When the key 16 is operated, the key 16 is touched with the skin such as a hand, a finger or a cheek, and the temperature is higher than the temperature at which it feels hot. This temperature is, for example, about 45 ° C. at which low temperature burns may occur after 6 hours of contact, or about 47 ° C. at which low temperature burns may occur after 1 hour of contact, or 1 It is about 50 ° C., which is a temperature at which low-temperature burns may occur when in contact for a minute, or about 70 ° C., which is a temperature at which low-temperature burns may occur in contact for 1 second. Alternatively, the predetermined range is a range in which a package including the semiconductor element 30, the chip, the wiring layer, the sealing layer, the connection electrode, and the like in the surface direction of the substrate 20 exists. Alternatively, the closer the switch is from the semiconductor element 30, the greater the amount of heat conducted from the semiconductor element 30. Therefore, the radiator 60 is connected to the protrusion 42 having the shortest distance from the semiconductor element 30 in the surface direction of the substrate 20. The protrusion 42 may be provided between the protrusion 42 and the adjacent protrusion 42. Here, there may be a plurality of exothermic semiconductor elements 30 such as a CPU and an LCD controller as described above. In that case, the above-described configuration is provided for the semiconductor element 30 that generates the highest heat. You may make it take. In the case of the PDA of this embodiment, the semiconductor element that generates the highest heat is a CPU.

  The heat radiating body 60 is made of a material having higher thermal conductivity than the key mat 40 and the key 16, for example, copper having a high thermal conductivity. The radiator 60 can be provided by, for example, fixing copper foil to the key mat 40 side or the housing 15 side with an adhesive. Alternatively, the key mat 40 or the casing 15 can be provided as a copper plating layer by an electroless plating method. Or it can also provide by application | coating of a copper paste. The thickness of the radiator 60 is about 0.1 mm. Further, the heat radiating body 60 may have a mesh shape in which fine metal wires are knitted, or may be cut out by punching or the like. Thereby, the weight increase of the portable device due to the provision of the heat radiator 60 can be reduced. From the viewpoint of reducing the weight of the mobile device, when the heat radiating body 60 has a mesh shape, it is preferable that the fine metal wires are knitted coarsely.

  5 and 6 are schematic partial cross-sectional views showing a structure in which the plurality of keys 16 are key sheets 17 and the key sheet 17 constitutes a part of the housing, and FIG. It is a general | schematic fragmentary sectional view which shows the structure in the case of comprising a part of body. 5-7, the housing | casing 15 and the battery 70 are abbreviate | omitted.

  As shown in FIG. 5, even in the case of a sheet-shaped key sheet 17 in which a plurality of keys 16 are integrally formed, the radiator 60 can be provided between the key mat 40 and the key sheet 17. . Moreover, as shown in FIG. 6, the structure which arrange | positions a recessed part in the heat sink arrangement | positioning area | region of the key sheet | seat 17, and arrange | positions the heat sink 60 in the said recessed part may be sufficient, According to this, the heat sink 60 is provided. Therefore, the increase in size (thickness) of the portable device can be reduced. Further, as shown in FIG. 7, even when the intervals between the plurality of keys 16 are close and the plurality of keys 16 constitute a part of the casing, the radiator 60 is connected to the key mat 40 and the key. 16 can be provided.

  Thus, in the present embodiment, the heat radiating body 60 made of a material having higher thermal conductivity than the key mat 40 and the key 16 is provided between the key mat 40 and the housing 15. Therefore, the heat emitted from the semiconductor element 30 and conducted from the substrate 20 to the key mat 40 via the protrusions 42 is conducted more on the radiator 60 side than on the key 16 side. And since the heat radiator 60 is provided so that it may spread in the surface direction of the 2nd main surface S2 of the board | substrate 20, the heat | fever conducted by the heat radiator 60 is disperse | distributed to the circumference | surroundings through the inside of the heat radiator 60. . Thereby, the local temperature rise of the key 16 part, especially the key 16 part close to the semiconductor element 30 can be suppressed. In addition, sweating on the user's hand or finger due to key operations is suppressed, and the user can operate the portable device more comfortably. Furthermore, a decrease in grip performance of the mobile device is also suppressed, and the operability of the mobile device is improved.

  In the structure shown in FIGS. 5 and 7, the heat radiating body 60 supports the key sheet 17 or the key 16 with respect to the key mat 40. As a result, a space is provided in an area corresponding to the protrusion 42 between the key mat 40 and the key 16 or the key sheet 17. Since the space is provided, the heat conducted from the substrate 20 to the key mat 40 via the protrusions 42 is not linearly conducted to the key 16 or the key sheet 17, but bypasses the surrounding radiator 60. Conducted by the key 16 or the key sheet 17. Therefore, the local temperature rise of the key 16 or key sheet 17 portion close to the semiconductor element 30 can be further suppressed.

(Embodiment 2)
In the first embodiment described above, the heat radiating body 60 is provided between the key mat 40 and the housing 15, but the following configuration may be employed.

  8 and 9 are schematic partial cross-sectional views of the mobile device according to the present embodiment. The portable device according to the present embodiment is the same as the PDA 10 shown in FIG. 1, and FIGS. 8 and 9 show a cross section cut at the same position as the line AA shown in FIG. 70 is omitted.

  As shown in FIGS. 8 and 9, the heat dissipating body 60 is formed on the main surface side of the key mat 40 facing the second main surface S <b> 2 of the substrate 20, that is, between the substrate 20 and the key mat 40. It is provided so as to spread in the surface direction of the second main surface S2.

  As described above, in this embodiment, the radiator 60 made of a material having higher thermal conductivity than the key mat 40 and the key 16 is provided between the substrate 20 and the key mat 40. Therefore, the heat emitted from the semiconductor element 30 and conducted from the substrate 20 to the key mat 40 via the protrusions 42 is conducted more on the radiator 60 side than on the key 16 side. And since the heat radiator 60 is provided so that it may spread in the surface direction of the 2nd main surface S2 of the board | substrate 20, the heat | fever conducted by the heat radiator 60 is disperse | distributed to the circumference | surroundings through the inside of the heat radiator 60. . Thereby, the local temperature rise of the key 16 portion close to the semiconductor element 30 can be suppressed. In addition, sweating on the user's hand or finger due to key operations is suppressed, and the user can operate the portable device more comfortably. Furthermore, a decrease in grip performance of the mobile device is also suppressed, and the operability of the mobile device is improved.

(Embodiment 3)
In the first embodiment described above, the heat radiator 60 is provided between the key mat 40 and the housing 15, and in the second embodiment, the heat radiator 60 is provided between the substrate 20 and the key mat 40. It is good also as such a structure.

  FIG. 10 is a schematic partial cross-sectional view of the mobile device according to the present embodiment. The portable device according to the present embodiment is the same as the PDA 10 shown in FIG. 1, and FIG. 10 is a cross section cut at the same position as the line AA shown in FIG. 70 is omitted.

  As shown in FIG. 10, the heat radiating body 60 is embedded in the key mat 40 and provided so as to spread in the surface direction of the second main surface S <b> 2 of the substrate 20. The shape of the key 16 is not shown in FIG. 10 and may be a key sheet 17.

  Thus, in this embodiment, the heat dissipating body 60 made of a material having higher heat conductivity than the key mat 40 and the key 16 is provided in the key mat 40. Therefore, the heat emitted from the semiconductor element 30 and conducted from the substrate 20 to the key mat 40 via the protrusion 42 is conducted more to the heat radiator 60 side than to the key 16 side. And since the heat radiator 60 is provided so that it may spread in the surface direction of the 2nd main surface S2 of the board | substrate 20, the heat | fever conducted by the heat radiator 60 is disperse | distributed to the circumference | surroundings through the inside of the heat radiator 60. . Thereby, the local temperature rise of the key 16 portion close to the semiconductor element 30 can be suppressed. In addition, sweating on the user's hand or finger due to key operations is suppressed, and the user can operate the portable device more comfortably. Furthermore, a decrease in grip performance of the mobile device is also suppressed, and the operability of the mobile device is improved.

(Embodiment 4)
In each of the above-described embodiments, the PDA 10 has been described as an example of the mobile device, but in the present embodiment, a mobile phone will be described as an example.

  FIG. 11 is a schematic diagram showing an external configuration of a mobile phone 100 as a mobile device according to the present embodiment.

  As shown in FIG. 11, the mobile phone 100 has a structure in which a display unit 102 and an operation unit 104 are connected by a hinge unit 101, and the display unit 102 and the operation unit 104 can be rotated via the hinge unit 101. Is formed. The display unit 102 is provided with a display panel 103 that displays information such as characters and images, and a speaker unit 106. The operation unit 104 is provided with a plurality of keys 16 for instructing execution of various operations of the mobile phone 100 and inputting characters, and a microphone unit 108.

  FIG. 12 is an exploded perspective view of main components of the operation unit 104 of the mobile phone 100 according to the present embodiment.

  As shown in FIG. 12, a plurality of switches 22 for connecting contacts by pressing are provided on the second main surface S2 of the substrate 20 serving as a base. A key mat 40 made of an elastic member is disposed on the second main surface S2 side of the substrate 20. On one main surface (lower side in the figure) of the key mat 40 facing the second main surface S2 of the substrate 20, a plurality of projections (not shown) projecting toward the plurality of switches 22 are provided. A plurality of keys 16 that can be pushed down with respect to the key mat 40 are provided on the other main surface (upper side in the drawing) of the key mat 40. Further, a semiconductor element and a battery (not shown) are arranged on the opposite side of the substrate 20 from the second main surface S2.

  The configuration of each of the above-described embodiments can be applied to the mobile phone 100 according to this embodiment, and FIGS. 2, 3 and 5 to 10 show the BB line segment of the mobile phone 100 shown in FIG. This corresponds to a schematic partial cross-sectional view taken along the line. Examples of the heat-generating semiconductor element 30 in the mobile phone 100 include an amplifier (power amplifier) and an MSM (Mobile Station Modem) (registered trademark).

  Here, when the user talks on the mobile phone 100, the user talks with the speaker unit 106 in his / her ear and the microphone unit 108 in his / her mouth. At this time, the plurality of keys 16 provided on the operation unit 104, particularly the numeric keypad 16b portion, are in contact with the user's cheek and its surroundings. On the other hand, a call using the mobile phone 100 may take several hours. For this reason, when the numeric keypad 16b is locally heated due to heat from the semiconductor element arranged in the operation unit 104, the high-temperature numeric keypad 16b is in a state of being in contact with the user's cheek or its peripheral portion. There is a risk that so-called low-temperature burn symptoms may appear on the cheek of the user and the surrounding area.

  However, by applying the configurations of the above-described embodiments to the mobile phone 100 according to the present embodiment, heat from the semiconductor element is dispersed to the surroundings, and a local temperature increase of the numeric keypad 16b can be suppressed. Therefore, in addition to the effects in the above-described embodiments, an effect that the safety of the mobile phone 100 is improved can be obtained.

  The present invention is not limited to the above-described embodiments, and various modifications such as design changes can be added based on the knowledge of those skilled in the art, and the embodiments to which such modifications are added are also possible. It can be included in the scope of the present invention.

  For example, the configuration shown in each of the above-described embodiments can be applied to portable devices such as the digital still camera shown in FIG. 13, the digital video camera shown in FIG. 14, the non-foldable electronic dictionary shown in FIG. 15, and the electronic notebook. It is. 2, 3 and 5 to 10 correspond to schematic partial cross-sectional views taken along the line C-C shown in each drawing. Examples of the heat-generating semiconductor element 30 in the digital still camera and the digital video camera include a CPU that performs operation control, a power supply unit, a CCD, and a CCD drive circuit. Examples of the heat-generating semiconductor element 30 in the electronic dictionary or electronic notebook include a CPU that controls operation, other processors, and an LCD controller. The semiconductor element 30 may be other than these. Of exothermic semiconductor elements mounted on digital still cameras, digital video cameras, electronic dictionaries, and electronic notebooks, the semiconductor element that generates the highest heat is a CPU.

  In each of the above-described embodiments, the semiconductor element is described as an example of the heating element. However, for example, a battery as a power source can be the heating element. As shown in FIG. 16, in the configuration in which the battery 70 is disposed on the first main surface S <b> 1 side of the substrate 20, the battery 70 is provided on the substrate 20 via a plurality of spacers 71. In this case, the heat generated from the battery 70 is conducted to the substrate 20 side through the spacer 71, but by applying the configuration of each of the above-described embodiments, the heat from the battery 70 is dispersed around, A local temperature rise in the key 16 portion can be suppressed. In addition, sweating on the user's hand or finger due to key operations is suppressed, and the user can operate the portable device more comfortably. Furthermore, a decrease in grip performance of the mobile device is also suppressed, and the operability of the mobile device is improved.

It is a schematic diagram which shows the external appearance structure of the personal digital assistant (PDA) concerning Embodiment 1. FIG. FIG. 2 is a schematic partial cross-sectional view taken along line AA of the PDA 10 shown in FIG. 1. It is a general | schematic fragmentary sectional view which shows the shape by which the key and the keymat were integrally molded. It is a schematic plan view for demonstrating arrangement | positioning of a heat radiator. It is a schematic fragmentary sectional view which shows the structure where a key sheet comprises a part of housing | casing. It is a schematic fragmentary sectional view which shows the structure where a key sheet comprises a part of housing | casing. It is a schematic fragmentary sectional view which shows a structure in case a some key comprises a part of housing | casing. 6 is a schematic partial cross-sectional view of a mobile device according to Embodiment 2. FIG. It is a general | schematic fragmentary sectional view of a portable apparatus. 6 is a schematic partial cross-sectional view of a mobile device according to Embodiment 3. FIG. FIG. 10 is a schematic diagram illustrating an external configuration of a mobile phone according to a fourth embodiment. It is a disassembled perspective view of the main components of the operation part of a mobile phone. It is a schematic diagram which shows the external appearance structure of a digital still camera. It is a schematic diagram which shows the external appearance structure of a digital video camera. It is a schematic diagram which shows the external appearance structure of portable apparatuses, such as a non-folding type | mold electronic dictionary and an electronic notebook. It is a schematic fragmentary sectional view which shows the structure by which the battery is arrange | positioned at the 1st main surface side of the board | substrate.

Explanation of symbols

  10 PDA, 11 hinge part, 12 display part, 14 operation part, 15 housing, 15a through hole, 16 key, 16a operation surface, 16b numeric keypad, 17 key sheet, 20 substrate, 22 switch, 30 semiconductor element, 40 key mat 42 Projection part, 60 Heat radiator, 70 Battery, 71 Spacer, 100 Mobile phone, 101 Hinge part, 102 Display part, 104 Operation part, 106 Speaker part, 108 Microphone part

Claims (8)

A substrate,
An exothermic semiconductor element provided on the first main surface of the substrate;
A plurality of switches provided on the second main surface of the substrate and connecting contacts by pressing;
A key mat located on the second main surface side of the substrate and made of an elastic member;
A plurality of protrusions projecting from one main surface of the key mat facing the second main surface of the substrate toward each of the plurality of switches;
A key located on the other main surface side of the key mat and capable of being depressed with respect to the key mat;
A heat radiator made of a material having higher thermal conductivity than the key mat and the key, provided between the switch and a pressing operation surface of the key, and extending in a surface direction of the second main surface of the substrate; ,
A portable device comprising: A substrate,
A power source as a heating element provided on the first main surface side of the substrate;
A plurality of switches provided on the second main surface of the substrate and connecting contacts by pressing;
A key mat located on the second main surface side of the substrate and made of an elastic member;
A plurality of protrusions projecting from one main surface of the key mat facing the second main surface of the substrate toward each of the plurality of switches;
A key located on the other main surface side of the key mat and capable of being depressed with respect to the key mat;
A heat radiator made of a material having higher thermal conductivity than the key mat and the key, provided between the switch and a pressing operation surface of the key, and extending in a surface direction of the second main surface of the substrate; ,
A portable device comprising:   The portable device according to claim 1, wherein the heat radiator is provided on the other main surface side of the key mat.   The portable device according to claim 1, wherein the heat radiator is provided on the one main surface side of the key mat.   The portable device according to claim 1, wherein the heat radiator is embedded in the key mat.   The portable device according to claim 3, wherein the heat radiator supports the key with respect to the key mat.   The portable device according to any one of claims 1 to 6, wherein the heat radiator has a through hole at a position corresponding to the protrusion.   The portable device according to claim 1, wherein the key is a ten key including a plurality of keys.

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