JP2009105275A - Wafer carrier - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a wafer carrier not only preventing chemicals from touching a transponder but also allowing only a part with the transponder attached thereto to be replaced, and facilitating maintenance. <P>SOLUTION: This wafer carrier 100 is composed of a vessel body 110 for housing a semiconductor wafer W therein, and a detachable plate 120 detachably held to the vessel body 110 by being inserted into a plate insertion part 115 formed on an outer surface of the vessel body 110 along the outer surface. The transponder 121 is embedded in the detachable plate 120 and sealed. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a wafer carrier used for transferring or storing a semiconductor wafer.

  A semiconductor wafer, which is an intermediate product of semiconductor devices such as IC and LSI, is manufactured through a plurality of processes such as a cleaning process and an etching process. These processes are usually performed in a state where a plurality of semiconductor wafers are accommodated in a container called a wafer carrier. Various wafer carriers have been proposed so far. For example, a bar code plate with a bar code can be inserted into the outer surface (hereinafter referred to as a bar code plate removable wafer carrier). Have been proposed) (for example, Patent Documents 1 to 3). As a result, information such as the lot number of the semiconductor wafer accommodated in the wafer carrier can be read by the barcode reader.

  Bar code plate detachable wafer carriers have been used mainly in semiconductor factories and the like as a means for realizing rational production management of semiconductor wafers, but have the following drawbacks. That is, when trying to update information on a semiconductor wafer accommodated in a certain wafer carrier, the barcode plate has to be replaced, which is very troublesome. For this reason, in the case of a bar code plate removable wafer carrier, process history information indicating what process the semiconductor wafer accommodated in the wafer carrier has undergone, and defective products are generated in the semiconductor wafer accommodated therein. It is not always easy to handle information that needs to be updated, such as defective product information.

  In view of such a situation, so far, a receiver for receiving an external signal, a rewritable memory for storing information, and transmitting the information stored in the memory to the outside In addition, a transponder such as an RFID (Radio Frequency Identification) tag including a transmitter for transmitting is attached to a wafer carrier. As a result, the information stored in the wafer carrier can be updated, and rationalization of the semiconductor wafer production management system can be further promoted.

  However, in the process of manufacturing a semiconductor wafer, the semiconductor wafer may be immersed in a corrosive chemical such as sulfuric acid or hydrochloric acid together with the wafer carrier in an etching process or the like. For this reason, if the transponder is attached to the outer surface of the wafer carrier as it is, the transponder may not operate, and in order to prevent such problems, it is necessary to attach the transponder to the wafer carrier in a sealed state.

  In view of such a situation, until now, a deep hole has been provided from the end of the wall portion of the wafer carrier, and a rod-like transponder has been inserted into the hole so as to be sealed in a sealed state. (For example, Patent Document 4). As a result, the transponder can be prevented from touching chemicals used in the etching process and the like, and the transponder can be prevented from being broken. In addition, since the wafer carrier that has been used can be used, there is an advantage that the introduction cost can be reduced.

  However, if the transponder is inserted into a hole provided in the wall portion of the wafer carrier in a sealed state, the transponder cannot be taken out unless the wafer carrier is broken. For this reason, even when only the transponder fails, there is a drawback that the entire wafer carrier has to be replaced.

  By the way, Patent Document 5 describes that a transponder enclosed in a capsule is detachably attached to the surface of a wafer carrier by a screw attachment, a snap fit attachment or the like. However, when a screw attachment or a snap fit attachment is attached to the surface of the wafer carrier, there is a problem that the manufacturing cost of the wafer carrier increases.

Japanese Utility Model Publication No. 02-084319 Japanese Utility Model Publication No. 02-095245 Japanese Utility Model Publication No. 05-090951 JP 07-283299 A U.S. Pat. No. 4,888,473

  The present invention has been made to solve the above problems, and not only does the chemical not touch the transponder even when immersed in the chemical, it is also possible to replace only the part to which the transponder is attached, A wafer carrier that is easy to maintain is provided. In addition, the present invention provides a wafer carrier that can reduce the introduction cost and the manufacturing cost.

  The above-mentioned problem comprises a container main body for accommodating a semiconductor wafer, and a detachable plate that is detachably held with respect to the container main body by being inserted along the outer surface into a plate insertion portion formed on the outer surface of the container main body. A transponder on the detachable plate (herein, transponder refers to a device that returns some response to the received electrical signal. An IC tag incorporating an RFID is also included in the concept of a transponder) This is solved by providing a wafer carrier that is embedded and sealed.

  This not only prevents the chemical from touching the transponder even if it is immersed in the chemical, but also allows the replacement of only the part to which the transponder is attached, facilitating maintenance and reducing manufacturing and maintenance costs. A possible wafer carrier can be obtained. Further, it can be manufactured by slightly improving the mold of the wafer carrier of the barcode plate removable type. Furthermore, since a transponder is used, information that needs to be updated, such as process history information and defective product information, can be handled, and production management can be easily rationalized.

  In the wafer carrier of the present invention, the form of the plate insertion portion is not particularly limited, but an edge portion parallel to the insertion direction of the attachment / detachment plate (insertion direction when inserting the attachment / detachment plate into the plate insertion portion) is inserted to It is preferable to form a hook-shaped pressing piece for pressing the edge portion from the outside in the plate insertion portion. Thus, it becomes possible to prevent a chemical | medical agent etc. from accumulating in a plate insertion part by setting a plate insertion part as the form which inserts only the edge part of a detachable plate. Further, by adopting such a form for the plate insertion portion, the detachable plate can be bent in a direction perpendicular to the insertion direction. Therefore, as will be described later, this is convenient when the detachable plate cannot be pulled out unless it is curved.

  In the wafer carrier of the present invention, the plate insertion portion is provided with the first convex portion or the first concave portion, and the inner surface of the removable plate for fitting with the second concave portion or the first concave portion for fitting with the first convex portion. If the second convex portion is provided, the detachable plate is curved, and the first convex portion is dropped from the second concave portion, or the second convex portion is not dropped from the first concave portion, the detachable plate is pulled out from the plate insertion portion. It is also preferable to prevent this from occurring. As a result, the detachable plate can be easily attached / detached but cannot be removed from the outer surface of the wafer carrier unless it is intentionally pulled out.

  In the wafer carrier of the present invention, it is preferable that the transponder is a rod-like one and is embedded so that its longitudinal direction is parallel to the insertion direction of the detachable plate. As the transponder, a rod-shaped one is widely used. Depending on the direction in which the transponder is embedded, the transponder may be damaged when the attaching / detaching plate is bent, or the transponder may hinder deformation of the attaching / detaching plate. However, by embedding the transponder in a direction parallel to the insertion direction of the detachable plate, such a problem can be solved.

  Furthermore, in the wafer carrier of the present invention, the location where the transponder is embedded in the detachable plate is not particularly limited, but it is preferable that the transponder is embedded at the edge of the detachable plate. As a result, it is possible to secure a large area of the flat portion of the detachable plate, and to display an identification code such as a bar code or a character or symbol on the flat portion. Become.

  As described above, according to the present invention, not only does the chemical not touch the transponder even if it is immersed in the chemical, but also the part to which the transponder is attached can be replaced, and a wafer carrier that is easy to maintain is obtained. It becomes possible. In addition, it is possible to obtain a wafer carrier that can reduce the introduction cost and the manufacturing cost.

  The wafer carrier of the present invention will be described more specifically with reference to the drawings. FIG. 1 is a perspective view showing a state in which a semiconductor wafer W is accommodated in a wafer carrier 100 of the present invention. FIG. 2 is a perspective view showing a state in which the wafer carrier 100 of the present invention is disassembled into a container body 110 and a detachable plate 120. FIG. 3 is a front view showing the container body 110 in the wafer carrier 100 of the present invention. FIG. 4 is a left side view showing the container body 110 in the wafer carrier 100 of the present invention. FIG. 5 is a right side view showing the container body 110 in the wafer carrier 100 of the present invention. FIG. 6 is a rear view showing the container main body 110 in the wafer carrier 100 of the present invention. FIG. 7 is a plan view showing the container body 110 in the wafer carrier 100 of the present invention. FIG. 8 is a bottom view showing the container body 110 in the wafer carrier 100 of the present invention. 9 is a cross-sectional view showing a state in which the container body 110 in the wafer carrier 100 of the present invention is cut along the XX plane in FIG. FIG. 10 is a cross-sectional view showing a state in which the container main body 110 in the wafer carrier 100 of the present invention is cut along the YY plane in FIG. FIG. 11 is a perspective view showing the detachable plate 120 in the wafer carrier 100 of the present invention. FIG. 12 is a front view showing the detachable plate 120 in the wafer carrier 100 of the present invention. FIG. 13 is a right side view showing the detachable plate 120 in the wafer carrier 100 of the present invention. 14 is a cross-sectional view showing a state in which the detachable plate 120 attached to the container body 110 is cut along the ZZ plane in FIG. FIG. 15 is a cross-sectional view showing a state where the detachable plate 120 attached to the container body 110 is bent from the state of FIG. FIG. 16 is a perspective view showing another embodiment of the detachable plate 120 in the wafer carrier 100 of the present invention.

1. Overview of Wafer Carrier As shown in FIGS. 1 and 2, the wafer carrier 100 of this embodiment includes a container main body 110 for housing the semiconductor wafer W, and a plate insertion portion 115 formed on the outer surface of the container main body 110. The detachable plate 120 is detachably held with respect to the container main body 110 by being inserted along the outer surface. The transponder 121 is embedded in the detachable plate 120 and sealed.

  Although the direction when using the wafer carrier 100 is not particularly limited, the semiconductor wafer W accommodated in the container body 110 is usually arranged so as to be horizontal. In the wafer carrier 100 of this embodiment, the surface provided with the plate insertion portion 115 faces upward so that information can be transmitted from the outside to the transponder 121 and information transmitted from the transponder 121 can be easily received from the outside. In this state, each process and transfer between each process are performed.

2. Transponder In the wafer carrier 100 of this embodiment, as shown in FIGS. 11 to 15, the transponder 121 adopts a rod-shaped one, and inside thereof, a receiver for receiving a signal from the outside, A memory for storing information and a transmitter for transmitting the information stored in the memory to the outside are accommodated. In the wafer carrier 100 of this embodiment, the transponder 121 has a cylindrical shape with a diameter of about 3 mm and a length of about 30 mm.

  The memory of the transponder 121 is rewritable, and not only invariant information such as the lot number of the semiconductor wafer W accommodated in the wafer carrier 100 but also the process of the semiconductor wafer W accommodated therein. It is also possible to store variable information such as process history information indicating whether or not the product has passed through, and defective product information when a defective product is generated in the contained semiconductor wafer W.

3. Container Body The container body 110 is not particularly limited as long as it can accommodate a predetermined number of semiconductor wafers W having a predetermined shape. In the wafer carrier 100 of this embodiment, as shown in FIGS. 3 to 10, the container body 110 has a first wall portion 111, a second wall portion 112, a third wall portion 113, and a fourth wall portion 114 that have outer walls. It is a substantially rectangular tube formed. By making the container main body 110 into such a form, it is possible to prevent the cleaning liquid or the like from collecting in the container main body 110. In the wafer carrier 100 of this embodiment, the plate insertion portion 115 is formed on the first wall portion 111.

  As shown in FIGS. 1, 2, 7, and 9, a plurality of linear folds are formed on the inner surfaces of the third wall portion 113 and the fourth wall portion 114 in the container main body 110 at a predetermined interval. Provided. As shown in FIG. 1, the edge of the disk-shaped semiconductor wafer W can be inserted into the gap between adjacent folds. Therefore, a plurality of semiconductor wafers W can be accommodated in the wafer carrier 100 while being kept in parallel. The number of semiconductor wafers W accommodated in one wafer carrier 100 is not particularly limited, but is usually about 5 to 50. The wafer carrier 100 according to the present embodiment can accommodate 25 semiconductor wafers W.

  The plate insertion part 115 will not be specifically limited if it is a thing which can insert the detachable plate 120. FIG. For example, it may be in a pocket shape that covers almost the entire outer surface of the detachable plate 120. However, when the plate insertion portion 115 is formed in a pocket shape, chemicals and the like are likely to accumulate therein, and there is a risk that problems such as corrosion of the container body 110 and the detachable plate 120 may occur. For this reason, in the wafer carrier 100 of the present embodiment, the plate insertion portion 115 is composed of a pair of pressing pieces 116 and a retaining protrusion 118 as shown in FIGS. Thereby, it is possible to make it difficult for chemicals or the like to accumulate in the plate insertion portion 115.

  The detachable plate 120 can be inserted into the plate insertion portion 115 in the direction of the arrow shown in FIG. Each pressing piece 116 is formed in a bowl shape, and has a form in which an edge of the detachable plate 120 can be inserted and the edge can be pressed from the outside. In the wafer carrier 100 of this embodiment, the pair of pressing pieces 116 are configured to press the edge portion along the short side of the detachable plate 120 formed in a substantially rectangular shape. On the other hand, the retaining protrusion 118 is configured to be able to support an edge portion along one long side of the detachable plate 120 from the end face side. The retaining protrusion 118 can prevent the detachable plate 120 from falling off in the inserting direction. The number of retaining protrusions 118 is not particularly limited, but is two in the wafer carrier 100 of this embodiment.

  Moreover, in the wafer carrier 100 of this embodiment, as shown in FIGS. 3 and 7 to 9, the first convex portion 117 is provided in the portion of the container main body 110 where the plate insertion portion 115 is formed. The first convex portion 117 is provided at a position that fits with the second concave portion 123 (see FIGS. 11 to 13) provided on the inner surface of the detachable plate 120 when the detachable plate 120 is inserted into the plate insertion portion 115. Yes. Accordingly, as shown in FIG. 15, the detachable plate 120 cannot be pulled out from the plate insertion portion 115 unless the detachable plate 120 is curved and the first convex portion 117 is removed from the second concave portion 123. It becomes possible to do so. Therefore, while making it easy to insert the detachable plate 120 into the plate insertion portion 115, it is possible to make it difficult for the detachable plate 120 to come off from the plate insertion portion 115.

  This effect is also achieved by providing a concave portion (first concave portion) in the plate insertion portion 115 and providing a convex portion (second convex portion) on the inner surface of the detachable plate 120 for fitting with the first concave portion. The plate insertion portion 115 is provided with both a convex portion (first convex portion 117) and a concave portion (first concave portion), and a concave portion for fitting the first convex portion 117 to the inner surface of the detachable plate 120 ( The same effect can be obtained by providing both the second concave portion 123) and a convex portion (second convex portion) for fitting into the first concave portion. However, considering that the attaching / detaching plate 120 is bent by a human hand, a concave portion (second) is provided on the attaching / detaching plate 120 side as in the wafer carrier 100 of the present embodiment in terms of ease of bending. It is preferable to provide only the recess 123).

  The shape and arrangement of the first protrusions 117 formed on the container body 110 are not particularly limited. However, if the first convex portion 117 becomes too wide in the direction connecting the pair of pressing pieces 116, or if the first convex portion 117 is formed at a location close to the pressing piece 116, the attachment / detachment inserted into the plate insertion portion 115 is performed. There is a possibility that the plate 120 is difficult to bend. For this reason, in the wafer carrier 100 of this embodiment, as shown in FIGS. 2 and 3, a pair of first convex portions 117 formed in a linear shape is arranged in the center portion of the plate insertion portion 115. The linear first convex portion 117 is provided in a direction parallel to the insertion direction of the detachable plate 120.

  The height of the first convex portion 117 is not particularly limited. However, if the height is too low, the first convex portion 117 easily falls off from the second concave portion without bending the detachable plate 120 to be bent, and the detachable plate 120. There is a risk that the effect of preventing the falling out of the material will be reduced. For this reason, the height of the 1st convex part 117 is normally set to 0.5 mm or more. The height of the first convex portion 117 is preferably 1 mm or more, and more preferably 1.2 mm or more.

  On the other hand, if the first convex portion 117 is too high, it may be difficult to remove the detachable plate 120 from the plate insertion portion 115. For this reason, the height of the 1st convex part 117 shall be 5 mm or less normally. The height of the first convex part 117 is preferably 3 mm or less, and more preferably 2 mm or less. In the wafer carrier 100 of this embodiment, the height of the first convex portion 117 is about 1.6 mm.

  The material of the container body 110 is not particularly limited, but usually a resin is used. For example, tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer (PFA), polypropylene (PP), polybutylene terephthalate (PBT), polyetherimide (PEI), polyetheretherketone (PEEK), cyclic olefin (co) heavy Resin such as coalescence or polyvinylidene fluoride (PVDF) can be suitably used as the material of the container body 110. It is also preferable to add a conductive filler such as carbon black or carbon fiber to these resins. It is also preferable to add an antistatic agent. This is because when the container body 110 is charged, there is a risk that dust, dust, or the like is easily adsorbed to the container body 110 or the semiconductor wafer W. In the wafer carrier 100 of this embodiment, a cyclic olefin copolymer having excellent dimensional stability and contamination resistance is used as the material of the container body 110, and carbon fiber is blended.

4). Attachment / detachment plate The shape of the attachment / detachment plate 120 is not particularly limited as long as the transponder 121 can be embedded in a sealed state, but is usually rectangular in consideration of ease of handling. The dimensions of the detachable plate 120 are not particularly limited, but if the detachable plate 120 is too small, not only the transponder 121 cannot be embedded in the detachable plate 120 but also the detachable plate 120 may be difficult to bend by human hands. . For this reason, when the detachable plate 120 is rectangular, the long side is usually secured at 2 cm or more and the short side is secured at 1 cm or more. The detachable plate 120 preferably has a long side of 5 cm or more and a short side of 3 cm or more.

  On the other hand, if the detachable plate 120 is too large, the detachable plate 120 may be difficult to handle. For this reason, when the attachment / detachment plate 120 is rectangular, the long side is usually kept to 20 cm or less and the short side to 15 cm or less. The detachable plate 120 preferably has a long side of 15 cm or less and a short side of 10 cm or less. In the wafer carrier 100 of this embodiment, the detachable plate 120 has a long side of 8.5 cm and a short side of 5.4 cm.

  In addition, the thickness of the detachable plate 120 is not particularly limited and varies depending on the material of the detachable plate 120. However, if the detachable plate 120 is too thin, the strength of the detachable plate 120 may be reduced, and may be easily damaged. For this reason, the thickness of the detachable plate 120 is normally 0.5 mm or more. The thickness of the detachable plate 120 is preferably 1 mm or more, and more preferably 1.5 mm or more.

  On the other hand, if the detachable plate 120 is too thick, it may be difficult to bend the detachable plate 120 manually. For this reason, the thickness of the detachable plate 120 is normally 8 mm or less. The thickness of the detachable plate 120 is preferably 5 mm or less, and more preferably 3 mm or less. In the wafer carrier 100 of this embodiment, the detachable plate 120 is 2 mm.

  Further, in the wafer carrier 100 of this embodiment, as shown in FIGS. 11 to 13, the inner surface of the detachable plate 120 (the side that can come into contact with the outer surface of the container body 110 when the detachable plate 120 is inserted into the plate insertion portion 115). The second concave portion 123 is provided on the surface. The second concave portion 123 is provided at a position where the second concave portion 123 is fitted to the first convex portion 117 provided on the outer surface of the container body 110 when the detachable plate 120 is inserted into the plate insertion portion 115. The shape and size of the second concave portion 123 are not particularly limited as long as the first concave portion 117 can be fitted therein. In the wafer carrier 100 of this embodiment, two linear second recesses 123 are provided in the central portion on the inner surface of the detachable plate 120.

  The material of the detachable plate 120 is not particularly limited, but usually the same resin as that of the container body 110 is used. For example, tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer (PFA), polypropylene (PP), polybutylene terephthalate (PBT), polyetherimide (PEI), polyetheretherketone (PEEK), cyclic olefin (co) heavy Resins such as coalescence and polyvinylidene fluoride (PVDF) can be suitably used. It is also preferable to add an antistatic agent to these resins. In addition, a conductive filler such as carbon black or carbon fiber may be blended, but it is preferable not to blend a conductive filler from the viewpoint of electromagnetic wave transmission. The detachable plate 120 and the container main body 110 may not be aligned with the same type of resin. In the wafer carrier 100 of the present embodiment, the material of the detachable plate 120 is a colored olefin copolymer that is easily colored, has excellent dimensional stability and stain resistance, and has appropriate flexibility. No functional filler is blended. When antistatic performance is required, polypropylene containing an organic antistatic agent in place of the conductive filler is preferably used.

  The color of the detachable plate 120 is not particularly limited. Although the detachable plate 120 may be unified with one color, it is preferable to prepare a plurality of colors. As a result, the detachable plate 120 can also be used as a marker, and the operator can recognize which process the semiconductor wafer W accommodated in the wafer carrier 100 is in and the type of the process. become. In this case, it is preferable to select a color different from that of the container body 110 so that the detachable plate 120 is conspicuous. When the container body 110 is black, it may be red, yellow, blue, green, white, or the like.

  Where the portion for embedding the transponder 121 (transponder embedding portion 122) is provided in the detachable plate 120 is not particularly limited, but in the wafer carrier 100 of this embodiment, as shown in FIGS. It is provided at the center of the outer surface of the plate 120. At this time, if the transponder embedding part 122 is provided so as to be inclined with respect to the insertion direction of the detachable plate 120, the transponder 121 becomes difficult to bend by bending the detachable plate 120 or when the detachable plate 120 is curved. There is a risk of breaking. For this reason, it is preferable to form the transponder embedding part 122 in parallel with the insertion direction of the detachable plate 120.

  As long as the transponder 121 can be kept in a sealed state, how the transponder 121 is embedded in the transponder embedding part 122 is not particularly limited. In the wafer carrier 100 of this embodiment, the mouth of the deep hole is closed with resin in a state where the transponder is inserted into the deep hole provided in the transponder embedding part 122.

  The type of resin that closes the mouth of the deep hole is not particularly limited, and the same resin as that of the container body 110 and the detachable plate 120 is used. From the viewpoint of sealing properties, it is preferable to use the same type of resin as the detachable plate 120. From the viewpoint of electromagnetic wave transmission, it is preferable that the resin that closes the mouth of the deep hole does not contain a conductive filler. In particular, when a conductive filler is included in the resin of the desorption plate 120, it is important that the conductive filler is not included in the resin that closes the deep holes. At this time, the resin that closes the container body 110 and the mouth of the deep hole is not necessarily the same. In the wafer carrier 100 of this embodiment, polypropylene (PP) to which an antistatic agent is added is used.

  When embedding the transponder 121 in the deep hole provided in the transponder embedding part 122, if there is a gap between the inner wall of the deep hole and the outer peripheral surface of the transponder 121, the transponder 121 vibrates inside the deep hole and makes a sound. Or the transponder 121 may be damaged. For this reason, in the wafer carrier 100 of this embodiment, the transponder 121 is embedded in a tube formed of resin (polypropylene (PP)) and then inserted into the deep hole. A plurality of protrusions extending along the longitudinal direction of the tube are provided on the outer surface of the tube to further enhance the buffering action of the tube.

  By the way, the transponder embedding part 122 is also preferably provided at the edge of the detachable plate 120 as shown in FIG. This makes it possible to secure a wide flat portion on the outer surface of the detachable plate 120. Since this flat part can be used as a symbol such as a barcode, or a place where characters or figures are written, in addition to production management by the transponder 121, production management using symbols such as a barcode, It is also possible to perform production management using graphics.

It is the perspective view which showed the state which accommodated the semiconductor wafer in the wafer carrier of this invention. It is the perspective view which showed the state which decomposed | disassembled the wafer carrier of this invention into the container main body and the attachment / detachment plate. It is the front view which showed the container main body in the wafer carrier of this invention. It is the left view which showed the container main body in the wafer carrier of this invention. It is the right view which showed the container main body in the wafer carrier of this invention. It is the rear view which showed the container main body in the wafer carrier of this invention. It is the top view which showed the container main body in the wafer carrier of this invention. It is the bottom view which showed the container main body in the wafer carrier of this invention. It is sectional drawing which showed the state which cut | disconnected the container main body in the wafer carrier of this invention in the XX plane in FIG. It is sectional drawing which showed the state which cut | disconnected the container main body in the wafer carrier of this invention by the YY plane in FIG. It is the perspective view which showed the attachment / detachment plate in the wafer carrier of this invention. It is the front view which showed the attachment / detachment plate in the wafer carrier of this invention. It is the right view which showed the attachment / detachment plate in the wafer carrier of this invention. It is sectional drawing which showed the state which cut | disconnected the detachable plate attached to the container main body by the ZZ plane in FIG. It is sectional drawing which showed the state which bent the attachment / detachment plate attached to the container main body from the state of FIG. It is the perspective view which showed the other embodiment of the attachment or detachment plate in the wafer carrier of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 Wafer carrier 110 Container body 111 1st wall part 112 2nd wall part 113 3rd wall part 114 4th wall part 115 Plate insertion part 116 Pressing piece 117 1st convex part 118 Detachment protrusion 120 Removable plate 121 Transponder 122 Transponder embedding Insertion part 123 Second recess W Semiconductor wafer

Claims (5)

  A wafer carrier comprising a container body for housing a semiconductor wafer, and a detachable plate that is detachably held with respect to the container body by being inserted along the outer surface into a plate insertion portion formed on the outer surface of the container body. A wafer carrier comprising a transponder embedded in a removable plate and sealed.   The wafer carrier according to claim 1, wherein an edge portion parallel to the insertion direction of the detachable plate is inserted into the plate insertion portion, and a hook-shaped pressing piece for pressing the edge portion from the outside is formed.   The plate insertion portion is provided with a first convex portion or a first concave portion, and an inner surface of the detachable plate is provided with a second concave portion for fitting with the first convex portion or a second convex portion for fitting with the first concave portion, The detachable plate cannot be pulled out from the plate insertion portion unless the detachable plate is curved and the first convex portion is dropped from the second concave portion or the second convex portion is not dropped from the first concave portion. The wafer carrier according to 1 or 2.   The wafer carrier according to any one of claims 1 to 3, wherein the transponder is formed in a rod shape and embedded in the detachable plate in a direction in which a longitudinal direction thereof is parallel to an insertion direction of the detachable plate.   The wafer carrier according to claim 1, wherein a transponder is embedded in an edge of the detachable plate.

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