JP2009071036A - Component packaging board and composite board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a component packaging board which enhances a component packaging property and further has an excellent high frequency characteristic in component packaging using a wiring board formed of an insulating board having a low elastic modulus in a high temperature range, and a composite board. <P>SOLUTION: The component packaging board 10 comprises: a wiring board 11 having a first wiring layer 14 and a second wiring layer 15; an electronic component 12 packaged on its one face 11a. The wiring board 11 has the first wiring layer 14 and the second wiring layer 15 on both faces of an insulator 13 having a through hole 13c, and a connector 16 for connecting the first wiring layer 14 and the second wiring layer 15 is provided in the through hole 13c. The electronic component 12 is connected to the first wiring layer 14 so that its terminal 17 is opposed to the connector 16. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a component mounting substrate on which electronic components are mounted, and a composite substrate formed by bonding a plurality of substrates.

In addition to generally known hard wiring boards, flexible printed boards (FPC = Flexible Printed Circuit) are widely used inside electronic devices.
This FPC is a flexible substrate in which a wiring layer for passing an electric current or a signal is formed on the surface of a flexible insulating base material.

In recent years, double-sided FPCs in which wiring layers are formed on both surfaces of an insulating layer are frequently used due to the reduction in the substrate area accompanying the downsizing of electronic equipment and the increase in the number of wirings accompanying higher functionality of electronic equipment ( For example, refer nonpatent literature 1).
In this double-sided FPC, it is necessary to electrically connect the wiring layers on both sides. Generally, a method is used in which a through hole is formed in an insulating layer and plating is performed on the inner surface of the through hole to ensure conduction between wiring layers. Usually, this through hole is called a through hole.
FIG. 10 is a schematic cross-sectional view showing an example of a conventional wiring board. In this wiring board 100, a first wiring layer 102 and a second wiring layer 103 are formed on both surfaces of a 101 having a through hole 104, respectively. Yes. A plating layer 105 is formed on the inner surface of the through hole 104, the surface of the first wiring layer 102, and the surface of the second wiring layer 103, and the plating layer 105 allows the first wiring layer 102, the second wiring layer 103, Are connected to each other.

As a method for conducting between the wiring layers on both sides, in addition to a method using a through hole, a method of embedding a connection body in the through hole has been proposed (see, for example, Patent Document 1).
FIG. 11 is a schematic cross-sectional view showing an example of a conventional method for manufacturing a wiring board.
As shown in FIG. 11, the wiring layers 112 and 113 are formed on both surfaces of the insulator 111 having the through hole 114 by a subtractive method or the like, and then the connection body 115 is filled in the through hole 114 to thereby connect this connection. A wiring substrate 110 in which the wiring layers 112 and 113 are connected to each other by the body 115 is obtained.

In addition, there are many FPCs on which electronic components are mounted so that electronic components are mounted on a hard wiring board, and IC chips are mounted on various mounting components. An electrode is formed on one surface of the IC chip, and terminals called bumps made of gold, solder, or the like are formed on the electrode.
As an example of the IC chip mounting method, for example, there is a method using an anisotropic conductive film (hereinafter abbreviated as “ACF”) (for example, see Non-Patent Document 2).
FIG. 12 is a schematic cross-sectional view showing a method using ACF as an example of an IC chip mounting method.
In this IC chip mounting method, the IC chip 121 and the insulator 122 are joined via the anisotropic conductive film 126.
The IC chip 121 and the insulator 122 have terminals (conductive portions) 123 and 124 formed on one surface, respectively. The anisotropic conductive film 126 is obtained by dispersing conductive particles 127 in a thermosetting resin 128. In this mounting method, the terminals 123 and 124 are electrically connected by the conductive particles 127 interposed between the bumps 125 formed on the terminals 123 and the terminals 124.
Numakura Kenji, “Introduction to High Density Flexible Substrate”, Nikkan Kogyo Shimbun, 1998, p. 119-127 JP 2006-179833 A Numakura Kenji, “Introduction to High Density Flexible Substrate”, Nikkan Kogyo Shimbun, 1998, p. 97-98

A polyimide film is generally used as an FPC insulator, but an FPC using a film made of a liquid crystal polymer having excellent high-frequency characteristics and hygroscopicity has also been developed. In addition, the dynamic viscoelasticity of the liquid crystal polymer is generally about 10 ⁹ to 10 ¹⁰ Pa at room temperature, but the value drops to about 1/10 at a temperature of 200 ° C. or higher applied to ACF mounting. To do. Further, the liquid crystal transition temperature of the liquid crystal polymer is generally 350 ° C. or lower.
Therefore, as shown in FIGS. 13A and 13B, when the IC chip 133 is mounted on the FPC 130 using the base material 131 made of a liquid crystal polymer by ACF or solder bonding, the elastic modulus of the liquid crystal polymer decreases. In this state, since the IC chip 133 is pressed and mounted, the wiring layer (terminal) 132 sinks in the base material 131. As a result, a defect that the edge 134 of the IC chip 133 and the wiring layer 132 of the FPC 130 are in contact with each other, and the wiring layer 132 may be deformed and disconnected.
In addition, one of the characteristics of the liquid crystal polymer is that it has excellent high frequency characteristics as compared with polyimide. The relative dielectric constant of general polyimide is about 3.5 and the dielectric loss tangent is about 0.008, whereas the relative dielectric constant of liquid crystal polymer is about 2.8 to 3.0, and the dielectric loss tangent is 0.002 to 0.002. As low as 0.003. However, in the FPC using a liquid crystal polymer, it is difficult to mount components by heating and pressurization, and therefore, it has not been possible to take advantage of the feature that the liquid crystal polymer is excellent in high frequency characteristics.

  In addition, in the method of conducting between the wiring layers by through holes or via holes, a through hole is formed in the central portion of the FPC. However, it is not possible to design a circuit in which a bump of an IC chip is disposed immediately above the through hole. Usually impossible. Therefore, in the FPC, when a circuit is formed from the wiring layer on the surface where the IC chip is mounted to the wiring layer on the back surface, a through hole is formed around the portion where the IC chip is mounted. However, as the frequency of electronic equipment has increased, there has been a problem that such circuit design in which the length of the wiring is increased is disadvantageous in terms of transmission characteristics.

  The present invention has been made in view of the above circumstances, and in component mounting using a wiring substrate made of an insulating substrate having a low elastic modulus in a high temperature range, improves component mounting properties, and further has excellent high frequency characteristics. Another object is to provide a component mounting board and a composite board.

  The component mounting board of the present invention is a component mounting board comprising a wiring board having a conductive portion and an electronic component mounted on at least one surface of the wiring board, the wiring board having a through hole. Conductive portions are formed on both surfaces of the insulator, and a connection body that connects the conductive portions is provided in the through hole. The electronic component has the conductive portion so that the terminal faces the connection body. It is characterized by being connected to.

The insulator is preferably an insulating material having an elastic modulus of 10 ⁹ Pa or less at 200 ° C. or higher, but may be an insulating material having an elastic modulus of 10 ⁹ Pa or higher at 200 ° C. or higher.

  The composite substrate of the present invention is a composite substrate in which a pair of wiring substrates having conductive portions are joined to each other via the conductive portions, and at least one of the pair of wiring substrates is an insulator having a through hole. Conductive portions are formed on both surfaces, and a connection body for connecting the conductive portions is provided in the through hole.

The insulator is preferably an insulating material having an elastic modulus of 10 ⁹ Pa or less at 200 ° C. or higher, but may be an insulating material having an elastic modulus of 10 ⁹ Pa or higher at 200 ° C. or higher.

  According to the component mounting board of the present invention, an electronic component is formed on a wiring board in which conductive portions are formed on both surfaces of an insulator having a through hole, and a connecting body that connects the conductive portions is provided in the through hole. Since the terminal is connected so as to face the connection body, the conductive portion can be prevented from sinking into the insulator due to the pressing of the terminal of the electronic component. Therefore, electronic components such as an IC chip can be favorably mounted. Also, if a bump is provided on the terminal of the electronic component and the connection body is disposed at a position opposite to the bump, a wiring layer made of the connection body is formed at the shortest distance from one surface of the wiring board to the other surface. Therefore, it is possible to realize a component mounting board having very high frequency characteristics.

  According to the composite substrate of the present invention, the pair of wiring boards having the conductive portion are joined to each other via the conductive portion, and at least one of the pair of wiring boards has the conductive portion on both surfaces of the insulator having the through hole. Since the connection body for connecting the conductive portions is provided in the through hole, the conductive portion can be prevented from sinking into the insulator due to the pressure between the pair of wiring board terminals. Therefore, a pair of wiring boards can be bonded satisfactorily. Further, if a bump is provided on a terminal of one wiring board and the connecting body is disposed at a position opposite to the bump, the connecting body is formed at the shortest distance from one surface of one wiring board to the other surface. Since the wiring layer can be formed, it is possible to realize a composite substrate having very high frequency characteristics.

The best mode of the component mounting board and the composite board of the present invention will be described.
This embodiment is specifically described for better understanding of the gist of the invention, and does not limit the present invention unless otherwise specified.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
(Component mounting board)
FIG. 1 is a schematic cross-sectional view showing an embodiment of a component mounting board of the present invention.
The component mounting board 10 of this embodiment is schematically configured from a wiring board 11 and an electronic component 12 mounted on the one surface 11 a side of the wiring board 11.
The wiring substrate 10 includes a first wiring layer (conductive portion) 14 formed on one surface 13a of the insulator 13, and a second wiring layer (conductive portion) 15 formed on the other surface 13b of the insulator 13. The first wiring layer 14 and the second wiring layer 15 are electrically connected to each other in the insulator 13.
In addition, the electronic component 12 is mounted on the wiring substrate 11 by ACF or solder bonding so that the terminal 17 is connected to the first wiring layer 14 so as to face the connection body 16 of the wiring substrate 13.

A through hole 13c is formed in the insulator 13, and a connection body 16 for connecting the first wiring layer 14 and the second wiring layer 15 to each other is provided in the through hole 13c.
The shape of the through hole 13c is not particularly limited, and can be, for example, a circular cross section or a polygonal cross section.

The insulator 13 is made of an insulating material. For example, one or two selected from thermoplastic resins such as polyimide resin, epoxy resin, liquid crystal polymer (LCP), glass epoxy, aramid fiber, and Teflon (registered trademark). More than seeds are used.
In the present invention, an insulating material having an elastic modulus of 10 ⁹ Pa or less at 200 ° C. or higher is preferably used. Specific examples of the insulating material having such characteristics include a liquid crystal polymer having excellent high frequency characteristics. Note that the present invention can also be applied to an insulating material having an elastic modulus exceeding 10 ⁹ Pa at 200 ° C. or higher.

The first wiring layer 14 and the second wiring layer 15 are made of copper. The first wiring layer 14 and the second wiring layer 15 are preferably made of copper having a purity as high as possible. For example, the first wiring layer 14 and the second wiring layer 15 are preferably made of copper having a purity of 99% or more. Specifically, one type or two or more types selected from rolled copper, electrolytic copper, tough pitch copper, and oxygen-free copper are used.
In addition, the first wiring layer 14 and the second wiring layer 15 are plated with the same material as that constituting the first wiring layer 14 and the second wiring layer 15 at least in a portion in contact with the connection body 16. Also good.

The connection body 16 is made of copper. The connection body 16 is preferably made of copper having a purity as high as possible. For example, the connection body 16 is preferably made of copper having a purity of 99% or more. Specifically, one type or two or more types selected from rolled copper, electrolytic copper, tough pitch copper, and oxygen-free copper are used.
The connection body 16 is directly bonded to the first wiring layer 14 and the second wiring layer 15. That is, the connection body 16 and the first wiring layer 14 and the second wiring layer 15 are firmly joined to each other by metal bonding or the like with substantially no inclusion.

  The electronic component 12 includes an IC chip, an optical element such as a CCD element, a micro relay, a micro switch, a pressure sensor, an acceleration sensor, a high frequency filter, a micro mirror, a micro reactor, a μ-TAS, a DNA chip, a MEMS device, and a micro fuel cell. Etc.

Next, with reference to FIGS. 1-5, the manufacturing method of the component mounting board | substrate 10 is demonstrated.
An insulator 13 having a through hole 13c is prepared by laser processing (CO ₂ laser, YAG laser, etc.), drilling, or the like.
Next, as shown in FIG. 2, connecting particles 26 made of copper are disposed in the through holes 13 c of the insulator 13.

The connecting particles 26 may be deformed by applying pressure in a process to be described later, and may be in the shape that becomes the connecting body 16 described above. For example, the connecting particles 26 are substantially spherical, substantially elliptical, substantially cylindrical, substantially polygonal, or substantially conical. Shape or substantially polygonal pyramid shape.
Moreover, since the connection particle | grain 26 is formed longer than the through-hole 13c, it is the state protruded from at least any one among the one surface 13a of the insulator 13, and the other surface 13b.
The connecting particles 26 preferably have a volume that is 10% or more (preferably 10 to 30%) larger than the volume of the through hole 13c. The diameter of the connecting particle 26 is preferably 10 μm or more.
The connection particles 26 may be plated with the same material as that constituting the connection particles 26.

The connection particles 26 are made of copper (for example, a purity of 99% or more). For example, one or more selected from rolled copper, electrolytic copper, tough pitch copper, and oxygen-free copper are used.
In order to put the connecting particles 26 into the through holes 13c, a method of supplying the connecting particles 26 on one surface 13a of the insulator 13 and dropping them into the through holes 13c may be used. Alternatively, the connecting particles 26 may be gripped using a mounter. May be supplied into the through hole 13c.
The through-hole 13c has substantially the same diameter as the connection particle 26 or is formed in a tapered shape whose diameter gradually decreases toward the other surface 13b of the insulator 13, whereby the connection particle 26 penetrates. It can be prevented from falling off the hole 13c.

Next, as shown in FIG. 2, the pressing plates 30, 30 are used to sandwich the insulator 13, the metal layers 24, 25 and the connection particles 26, and the pressing plates 30, 30 approach each other as indicated by arrows. Press in the direction to do.
By this step, as shown in FIG. 3, the substantially spherical connecting particles 26 are deformed in the pressing direction (thickness direction of the insulator 13) to form the connecting body 16 and the metal layer 24 on both surfaces of the insulator 13. , 25 are joined.
In this case, the temperature condition is preferably 200 ° C. or higher (preferably 250 ° C. or higher, more preferably 300 ° C. or higher). The pressing force is preferably 30 kg / cm ² or more (preferably 50 kg / cm ² or more). Thereby, the metal layers 24 and 25 can be sufficiently adhered to the insulator 13 made of thermoplastic resin.
The connection body 16 is formed so as to substantially fill the through-hole 13c, that is, to be in contact with substantially the entire inner surface of the through-hole 13c, and has a shape (for example, a cylindrical shape) along the through-hole 13c.

Next, as shown in FIG. 4, a pattern is formed on the metal layers 24 and 25 by a subtractive method or the like to form a first wiring layer 14 and a second wiring layer 15.
Thereby, the wiring board 11 in which the first wiring layer 14 and the second wiring layer 15 are connected to each other by the connection body 16 in the through hole 13c is obtained.
In the wiring substrate 11, the electrical resistance between the first wiring layer 14, the second wiring layer 15, and the connection body 16 is reduced, and the first wiring layer 14, the second wiring layer 15, and the connection body 16 are reduced. Can be joined firmly.

Next, as shown in FIG. 5, the terminal 17 is brought into contact with the first wiring layer 14 so that the terminal 17 provided on one surface of the electronic component 12 faces the connection body 16 of the wiring board 13.
Next, the terminals 17 are connected to the first wiring layer 14 by ACF or solder bonding, and the electronic component 12 is mounted on the wiring substrate 11 to obtain the component mounting substrate 10 shown in FIG.

  According to the component mounting board 10 of this embodiment, the first wiring layer 14 and the second wiring layer 15 are formed on both surfaces of the insulator 13 having the through hole 13c, and the first wiring layer 14 and the second wiring layer 15 are formed in the through hole 13c. Since the electronic component 12 is connected to the wiring board 11 provided with the connection body 16 for connecting the two wiring layers 15 so that the terminal 17 faces the connection body 16, the terminal 17 of the electronic component 12 is connected. The first wiring layer 14 can be prevented from sinking into the insulator 13 by pressing. Therefore, the electronic component 12 can be mounted satisfactorily. Further, if bumps are provided on the terminals 17 of the electronic component 12 and the connection body 16 is disposed at a position facing the bumps, the connection body 16 is formed from the one surface 11a of the wiring board 11 to the other surface at the shortest distance. Since the wiring layer can be formed, it is possible to realize a component mounting board with very high frequency characteristics.

(Composite substrate)
FIG. 6 is a schematic cross-sectional view showing an embodiment of the composite substrate of the present invention.
The composite substrate 40 of this embodiment is generally configured by a pair of wiring substrates 41 and 42, and these wiring substrates 41 and 42 are respectively connected to the respective second wiring layers (conductive portions) 45, by ACF or solder bonding, 45 are joined together.

The wiring boards 41 and 42 include a first wiring layer (conductive portion) 44 formed on one surface 43 a of the insulator 43 and a second wiring layer (conductive portion) formed on the other surface 43 b of the insulator 43. 45, a connection body 46 that electrically connects the first wiring layer 44 and the second wiring layer 45 in the insulator 43, and a coating layer that covers one surface 43a of the insulator 43 and the first wiring layer 44. 47.
Further, a through hole 43c is formed in the insulator 43, and a connecting body 46 for connecting the first wiring layer 44 and the second wiring layer 45 to each other is provided in the through hole 43c.
The shape of the through hole 43c is not particularly limited, and can be, for example, a circular cross section or a polygonal cross section.

The insulator 43 is made of an insulating material, and for example, one or two selected from thermoplastic resins such as polyimide resin, epoxy resin, liquid crystal polymer (LCP), glass epoxy, aramid fiber, and Teflon (registered trademark). More than seeds are used.
In the present invention, an insulating material having an elastic modulus of 10 ⁹ Pa or less at 200 ° C. or higher is preferably used. Specific examples of the insulating material having such characteristics include a liquid crystal polymer having excellent high frequency characteristics. Note that the present invention can also be applied to an insulating material having an elastic modulus exceeding 10 ⁹ Pa at 200 ° C. or higher.

The first wiring layer 44 and the second wiring layer 45 are made of copper. The first wiring layer 44 and the second wiring layer 45 are preferably made of copper having the highest possible purity, and are preferably made of copper having a purity of 99% or more, for example. Specifically, one type or two or more types selected from rolled copper, electrolytic copper, tough pitch copper, and oxygen-free copper are used.
The first wiring layer 44 and the second wiring layer 45 are subjected to plating made of the same material as that constituting the first wiring layer 44 and the second wiring layer 45 at least in a portion in contact with the connection body 46. Also good.

The connection body 46 is made of copper. The connection body 46 is preferably made of copper having a purity as high as possible. For example, the connection body 46 is preferably made of copper having a purity of 99% or more. Specifically, one type or two or more types selected from rolled copper, electrolytic copper, tough pitch copper, and oxygen-free copper are used.
Further, the connection body 46 is directly bonded to the first wiring layer 44 and the second wiring layer 45. That is, the connection body 46, the first wiring layer 44, and the second wiring layer 45 are firmly joined by metal bonding or the like with substantially no inclusion.

  The covering layer 47 functions as a buffer material against stress caused by thermal strain or the like on the first wiring layer 44 and is overcoated so that the first wiring layer 44 is not exposed to the outside air. It consists of resin used for coating | covering a wiring board etc.

Next, a method for manufacturing the component mounting board 40 will be described with reference to FIGS.
An insulator 43 having a through hole 43c is prepared by laser processing (CO ₂ laser, YAG laser, etc.), drilling, or the like.
Next, connecting particles made of copper are disposed in the through holes 43 c of the insulator 43.

The connecting particles may be deformed by applying pressure in a process to be described later, and may be in the shape to become the connecting body 46, for example, a substantially spherical shape, a substantially elliptical shape, a substantially cylindrical shape, a substantially polygonal column shape, a substantially conical shape. The shape can be any of a substantially polygonal pyramid shape.
Further, the connecting particles are formed longer than the through-hole 43c and protrude from at least one of the one surface 43a and the other surface 43b of the insulator 43.
The connecting particles preferably have a volume that is 10% or more (preferably 10 to 30%) larger than the volume of the through-hole 43c. The diameter of the connecting particles is preferably 10 μm or more.
The connection particles may be plated with the same material as that constituting the connection particles.

The connection particles are made of copper (for example, a purity of 99% or more), and for example, one or more selected from rolled copper, electrolytic copper, tough pitch copper, and oxygen-free copper are used.
In order to put the connecting particles into the through-hole 43c, a method of supplying the connecting particles on one surface 43a of the insulator 43 and dropping it into the through-hole 43c may be employed, or the connecting particles may be gripped using a mounter. You may supply in 43c.
The through-holes 43c have substantially the same diameter as the connecting particles, or are formed in a tapered shape in which the diameter gradually decreases toward the other surface 43b of the insulator 43, so that the connecting particles can pass through the through-holes 43c. Can be prevented from falling off.

Next, the insulator 43, the metal layers 54 and 55, and the connection particles are sandwiched using the pressing plate, and the pressing plate is pressed in a direction approaching each other.
Through this step, as shown in FIG. 7, the substantially spherical connecting particles are deformed in the thickness direction of the insulator 43 to form the connecting body 46, and the metal layers 54 and 55 are bonded to both surfaces of the insulator 43. The
In this case, the temperature condition is preferably 200 ° C. or higher (preferably 250 ° C. or higher, more preferably 300 ° C. or higher). The pressing force is preferably 30 kg / cm ² or more (preferably 50 kg / cm ² or more). As a result, the metal layers 54 and 55 can be sufficiently adhered to the insulator 43 made of the thermoplastic resin.
The connecting body 46 is formed so as to substantially fill the through-hole 43c, that is, so as to be in contact with substantially the entire inner surface of the through-hole 43c, and has a shape (for example, a cylindrical shape) along the through-hole 43c.

Next, as shown in FIG. 8, a pattern is formed on the metal layers 54 and 55 by a subtractive method or the like to form a first wiring layer 44 and a second wiring layer 45.
Accordingly, the first wiring layer 44 and the second wiring layer 45 are connected to each other by the connection body 46 in the through hole 43c, and the electrical connection between the first wiring layer 44, the second wiring layer 45, and the connection body 46 is achieved. While reducing resistance, the 1st wiring layer 44, the 2nd wiring layer 45, and the connection body 46 can be joined firmly.

  Next, as shown in FIG. 9, one surface 43a of the insulator 43 and the first wiring layer 44 are covered with a resin to form a covering layer 47, whereby the wiring substrate 41 (42) is obtained.

Next, the second wiring layer 45 of the wiring board 41 and the second wiring layer 45 of the wiring board 42 are brought into contact with each other.
Next, the second wiring layers 45 and 45 of the wiring substrates 41 and 42 are connected by ACF or solder bonding, and the composite substrate 40 shown in FIG. 6 is obtained.

  According to the composite substrate 40 of this embodiment, the pair of wiring substrates 41 and 42 having the first wiring layer 44 and the second wiring layer 45 are joined to each other via the first wiring layers 44 and 44. Since the substrates 41 and 42 are provided with connection bodies 46 that connect the first wiring layer 44 and the second wiring layer 45 in the through holes 43c, the substrates 41 and 42 are pressed into the insulator 43 by pressing between the wiring substrates 41 and 42. The first wiring layer 44 can be prevented from sinking. Therefore, the wiring boards 41 and 42 can be favorably bonded. Further, for example, by providing bumps on the second wiring layer 45 of the wiring board 41 and disposing the connecting body 46 at a position facing the bumps, the shortest distance from one surface of the wiring boards 41 and 42 to the other surface is achieved. Since the wiring layer made of the connection body 46 can be formed at a distance, a composite substrate having very high frequency characteristics can be realized.

  In this embodiment, the insulator 43, the first wiring layer 44 and the second wiring layer 45 formed on both surfaces thereof, and the first wiring layer 44 and the second wiring layer 45 are electrically connected to each other. Wiring boards 41 and 42 composed of a connecting body 46 and a covering layer 47 covering one surface 43a of the insulator 43 and the first wiring layer 44 are joined to each other via second wiring layers 45 and 45. Although the composite substrate 40 is illustrated, the composite substrate of the present invention is not limited to this. In the composite substrate of the present invention, at least one of the wiring boards is formed with conductive portions formed on both sides of an insulator having a through hole, and a connecting body for connecting the conductive portions is provided in the through hole. If it is.

  A circuit board such as a printed wiring board can be applied to the component mounting board or the composite board of the present invention. A semiconductor substrate can also be used.

It is a schematic sectional drawing which shows one Embodiment of the component mounting board | substrate of this invention. It is a schematic sectional drawing which shows the manufacturing method of one Embodiment of the component mounting board | substrate of this invention. It is a schematic sectional drawing which shows the manufacturing method of one Embodiment of the component mounting board | substrate of this invention. It is a schematic sectional drawing which shows the manufacturing method of one Embodiment of the component mounting board | substrate of this invention. It is a schematic sectional drawing which shows the manufacturing method of one Embodiment of the component mounting board | substrate of this invention. It is a schematic sectional drawing which shows one Embodiment of the composite substrate of this invention. It is a schematic sectional drawing which shows the manufacturing method of one Embodiment of the composite substrate of this invention. It is a schematic sectional drawing which shows the manufacturing method of one Embodiment of the composite substrate of this invention. It is a schematic sectional drawing which shows the manufacturing method of one Embodiment of the composite substrate of this invention. It is a schematic sectional drawing which shows an example of the conventional wiring board. It is a schematic sectional drawing which shows an example of the manufacturing method of the conventional wiring board. It is a schematic sectional drawing which shows the method using ACF as an example of IC chip mounting construction method. It is a schematic sectional drawing which shows the other example of the manufacturing method of the conventional component mounting board | substrate.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Component mounting board, 11, 41, 42 ... Wiring board, 12 ... Electronic component, 13, 43 ... Insulator, 13c, 43c ... Through-hole, 14, 44 ... 1st wiring layer, 15 and 45 ... 2nd wiring layer, 16 and 46 ... connection body, 17 ... terminal, 24, 25 ... metal layer, 26 ... connection particle, 40 ... -Component mounting board, 47 ... coating layer.

Claims (4)

A component mounting board comprising a wiring board having a conductive portion and an electronic component mounted on at least one surface of the wiring board,
The wiring board has conductive portions formed on both sides of an insulator having a through hole, and a connecting body that connects the conductive portions is provided in the through hole. The terminal of the electronic component has the connection A component mounting board, wherein the component mounting board is connected to the conductive portion so as to face the body. The component mounting board according to claim 1, wherein the insulator is made of an insulating material having an elastic modulus of 10 ⁹ Pa or less at 200 ° C. or more. A pair of wiring boards having a conductive portion is a composite substrate joined together via the conductive portion,
At least one of the pair of wiring boards includes a conductive portion formed on both surfaces of an insulator having a through hole, and a connecting body that connects the conductive portions is provided in the through hole. substrate. The composite substrate according to claim 3, wherein the insulator is made of an insulating material having an elastic modulus of 10 ⁹ Pa or less at 200 ° C. or more.

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