JP2009029014A - Substrate assembling device and assembling method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To accurately stack and assemble a plurality of substrates by preventing the damage and breakage of the substrates from developing by realizing the sure and stable release at the release of a protective sheet from the substrate equipped with the protective sheet for covering a bonding layer owing to no necessity of the employment of a high bonding force releasing tape. <P>SOLUTION: This substrate assembling device and the like is equipped with a chuck retaining means 7 for chuck retaining the side with no bonding layer 102 of one substrate 101, an impacting means 105 for impacting the surface of the protective sheet stretching over two adjacent sides of the protective sheet 103 of one substrate, a film releasing means 9 for bringing the releasing tape 30 into contact with the surface of the protective sheet floated by the giving of impact so as to release the protective sheet, a substrate conveying means 5 for placing the other substrate on the bonding layer exposed after the releasing of the protective layer, and a thrusting means 11 for thrusting both the substrates in the directions of approaching each other. The lamination of ≥3 sheets of substrates and their assembling are also possible. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a substrate assembling apparatus and an assembling method, and in particular, a protective sheet such as a PET separator on an adhesive sheet attached to a substrate based on an acrylic plate or a glass plate in a single piece state. The present invention relates to an apparatus and a method for assembling a laminated substrate by peeling the substrates without applying a load to each other and stacking the substrates together.

  In general, a functional film having an adhesive sheet such as a polarizing plate used for FPD (Flat Panel Display) or the like has an adhesive layer protected by a separator sheet (hereinafter referred to as “separator”) called a protective sheet on the adhesive sheet surface. Supplied in state. When peeling the separator, conventionally, the release tape is adhered to the separator in a state where the surface opposite to the sticking surface of the functional film is fixed by an adsorbing means or the like, and the release tape is wound up by using a pressing mechanism such as a roller. At the same time, the separator was peeled off.

  As the above technique, for example, in Patent Document 1, in order to peel a separator made of PET (polyethylene terephthalate), a substrate holding plate for fixing a mounting substrate having a piece film attached to the surface, a guide mechanism for an adhesive tape, , Press the adhesive surface of the adhesive tape against the piece film, have a head part that pulls back, attach the piece film to the peeling tape that has an adhesive surface on one side, create a trigger for peeling, and with the peeling tape when pulling back An apparatus having a peeling head mechanism for peeling a film is disclosed.

  Further, in Patent Documents 2 to 6, in order to peel off the separator, a device such as a float such as an air pocket is generated between the separator and the substrate to which the separator is attached, and the separator is peeled off using the float. And methods are described. That is, the film peeling apparatus described in Patent Document 2 uses a needle-shaped part, the protective sheet peeling apparatus described in Patent Document 3 uses a press, and the protective sheet peeling apparatus described in Patent Document 4 uses a blade part. In the thin film peeling apparatus described in Document 5, an electromagnetic vibrator is used, and in the thin film peeling apparatus described in Patent Document 6, floating is generated by a protrusion pressing member, and the floating portion is caused by peeling.

JP 2002-43339 A JP 2006-121035 A JP-A-10-324454 JP-A-10-87158 Japanese Patent Publication No. 06-3550 JP 62-56244 A

  However, in order to peel the separator from the adhesive sheet using the PET separator on the individual substrate, the PET base material is hard, and the PET separator is firmly attached to the adhesive sheet more than the tensile force of the adhesive strength of the peeling tape. Since it is stuck, it is difficult for the peeling method described in Patent Document 1 to peel the peeling tape from the PET separator and to carry out the original peeling step.

  In the case of a hard separator such as a PET separator, it is difficult to generate a complete floating state using the apparatuses described in Patent Documents 2 to 4, and as will be described later, a PET separator In the case where the adhesive sheet is firmly adhered in the meniscus state around the entire periphery of the substrate, the separator can be peeled off with a low load unless the edge of the separator is completely lifted. Can not.

  Furthermore, in the apparatus described in Patent Document 5, when the separator is formed of a hard material such as PET, it is difficult to generate the float, and vibration is transmitted in the process of generating the float. There is a possibility that the adsorption position of the substrate is shifted.

  In addition, in the apparatus described in Patent Document 6, when the substrate is a resin substrate such as acrylic, there is a risk of scratching the substrate, and a pressing force is applied to the substrate that is adsorbed and fixed to the individual piece. There is a possibility that the adsorption position may be shifted.

  Accordingly, the present invention has been made in view of the above-described problems in the prior art, and uses an adhesive sheet (adhesive layer) having strong adhesive strength and a hard separator (protective sheet) such as a PET separator. When assembling the board, it is not necessary to use a tape with high adhesive strength as the peeling tape, and it is possible to achieve reliable and reliable peeling without peeling the influence of tensile strength on the board. Therefore, it is possible to prevent damage and breakage of the substrate, and even when the substrate is held by vacuum suction, no positional deviation occurs, and a substrate assembly apparatus capable of realizing high-precision stacking and assembly, and An object is to provide an assembly method.

  In order to achieve the above object, the present invention provides an adhesive layer on one surface and a protective sheet that covers the adhesive layer. Is a substrate assembly apparatus for assembling a laminated substrate in which two substrates are laminated by pressing both substrates in a direction close to each other, and sucks and holds the surface of the one substrate on which no adhesive layer exists Adsorption holding means, impact applying means for applying an impact to the surface across two adjacent sides of the protective sheet of the one substrate, and the protection by bringing a release tape into contact with the surface of the protective sheet that has floated due to the application of the impact A film peeling means for peeling the sheet, a substrate conveying means for relatively moving the two substrates so that the other substrate is superimposed on the adhesive layer exposed after peeling the protective sheet, and the two substrates close to each other. Characterized in that it comprises a pressing means for pressing in the direction of.

  And according to this invention, the surface of a protective sheet floats by giving an impact to the surface over 2 adjacent sides of the protective sheet of one board | substrate by an impact provision means, and peeling tape is on this surface that floated Since the protective sheet can be peeled by contacting the protective sheet, even if it is a relatively hard protective sheet, it can be lifted from the adhesive layer, and the floating part of the corner part of the protective sheet is caused by peeling. It is possible to generate a stable peeling-induced state. As a result, it is not necessary to use a tape with high adhesive strength as the peeling tape, and it is possible to prevent damage and breakage of the substrate, and even when the substrate is held by vacuum suction, no positional deviation occurs, and high Accurate lamination and assembly can be realized.

  In addition, the present invention provides an adhesive layer on one surface, an adhesive layer on one surface, and an adhesive layer on one surface after peeling the protective sheet of one substrate having an adhesive layer on one surface and a protective sheet covering the adhesive layer. By repeating the operation of superimposing the surfaces of the other substrate having no protective layer on the other substrate provided with a protective sheet covering the adhesive layer, three or more substrates are stacked, and adjacent substrates of the stacked substrates are close to each other A substrate assembly apparatus that assembles a laminated substrate in which three or more substrates are laminated by pressing the entire laminated substrate in a direction to perform suction holding that holds the surface of the one substrate on which no adhesive layer is present Means, an impact applying means for applying an impact to a surface extending over two adjacent sides of the protective sheet of the one substrate, and a release tape being brought into contact with the surface of the protective sheet floated by the application of the impact Peeling Film peeling means, substrate transport means for relatively moving both substrates so that the adhesive layer exposed after peeling the protective sheet overlaps the surface of the other substrate without the adhesive layer, and the laminated substrate And pressing means for pressing the entire stacked substrates in a direction in which adjacent substrates approach each other.

  According to the present invention, when assembling a laminated substrate in which three or more substrates are laminated, it is possible to generate a stable peeling-induced state, and use a tape having a high adhesive force as the peeling tape. There is no need to prevent damage and breakage of the substrate, and even when the substrate is held by vacuum suction, positional displacement does not occur, and highly accurate stacking and assembly can be realized.

  The said board | substrate assembly apparatus WHEREIN: The said impact provision means can be comprised so that it may be provided with the contact part which contacts the surface over 2 adjacent sides of the said protection sheet linearly. Here, as the impact imparting means, for example, an impact imparting member that has a chevron-shaped tip, is formed in a round bar shape, and is movable in the axial direction can be used.

  The substrate assembly apparatus may further include stopper means for restricting movement of the contact portion of the impact applying means in a direction perpendicular to the surface of the protective sheet. Thereby, an impact can be given only to the protective sheet of the uppermost laminated | stacked board | substrate, the corner part of a protective sheet can be peeled from an adhesive sheet stably, and a corner part can be made into a floating state.

  Further, in the substrate assembly apparatus, the film peeling means includes a pressing roller that presses the peeling tape against the surface of the protective sheet, and a contact between the peeling tape and the surface of the peeling tape and the surface of the protective sheet. And a guide roller that holds the formed angle at a predetermined angle. By forming a predetermined angle between the surface of the peeling tape and the surface of the protective sheet by the guide roller, it becomes possible to easily expand the floating state of the corner portion of the protective sheet, and the protective sheet is peeled off more easily. be able to.

  The substrate assembly apparatus is further configured to suck and hold the surface of the one substrate on which no adhesive layer is present by the suction holding means, and to superimpose the other substrate by the substrate transport means. And positioning means for positioning the outer position of the other substrate. Thereby, the board | substrate hold | maintained by a suction holding means can be positioned more accurately, and more highly accurate lamination | stacking and assembly can be implement | achieved.

  In addition, the present invention provides a method in which after the protective sheet of one substrate having an adhesive layer on one surface and a protective sheet covering the adhesive layer is peeled off, the other substrate is superimposed on the exposed adhesive layer. In a substrate assembling method for assembling a laminated substrate in which two substrates are stacked by pressing the substrates in a direction close to each other, the one substrate is sucked and held in a state where the adhesive layer of the one substrate does not exist By applying an impact to the surface over two adjacent sides of the protective sheet, the surface to which the impact was applied is lifted from the adhesive layer, and a release tape is brought into contact with the surface of the lifted protective sheet to protect the surface. The sheet is peeled off, and the other substrate is superimposed on the adhesive layer exposed after the protective sheet is peeled off, and both the substrates are pressed in a direction approaching each other. According to this method, as in the case of the above-mentioned invention, a stable peeling-induced state can be generated, a high-strength peeling tape is unnecessary, damage and breakage of the substrate are prevented, and the substrate is held by vacuum suction. Even in the case of performing the above, no positional deviation occurs, and highly accurate stacking and assembly are possible.

  Furthermore, the present invention provides an adhesive layer on one surface, an adhesive layer on one surface, and an adhesive layer on one surface after peeling the protective sheet of one substrate having an adhesive layer on one surface and a protective sheet covering the adhesive layer. By repeating the operation of superimposing the surfaces of the other substrate having no protective layer on the other substrate provided with a protective sheet covering the adhesive layer, three or more substrates are stacked, and adjacent substrates of the stacked substrates are close to each other A substrate assembly method for assembling a laminated substrate in which three or more substrates are laminated by pressing the entire laminated substrate in a direction in which the surface of the one substrate without the adhesive layer is held by suction The surface of the protective sheet on one of the substrates is subjected to an impact on the adjacent two sides so that the surface subjected to the impact is levitated from the adhesive layer, and a release tape is applied to the surface of the levitated protective sheet. Contact The direction in which the adjacent substrates of the laminated substrates are close to each other is repeated by peeling the protective sheet and repeating the operation of superimposing the surface of the other substrate on which the adhesive layer is not present on the adhesive layer exposed after peeling the protective sheet. The whole of the laminated substrates is pressed. According to this method, in assembling a laminated substrate in which three or more substrates are laminated, as in the above-described invention, a stable delamination state is generated, a high adhesive strength peeling tape is unnecessary, damage to the substrate, Even when the substrate is held by vacuum suction, it is possible to prevent damage and to perform high-precision stacking and assembly without causing positional displacement.

  As described above, according to the present invention, it is not necessary to use a peeling tape having a high adhesive force, and it is possible to realize a reliable and stable peeling of the protective sheet, which has an influence on the tensile strength at the time of peeling. Therefore, the substrate can be prevented from being damaged and broken, and even when the substrate is held by vacuum suction, no misalignment occurs and high-precision stacking and assembly can be realized.

  Next, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 shows an individual substrate 101 assembled by a substrate assembling apparatus and an assembling method according to the present invention. The substrate 101 is formed of a material such as an acrylic plate or a glass plate, and an adhesive sheet (adhesive) is formed on the upper surface. Layer) 102 is adhered, and a PET separator (hereinafter abbreviated as “separator”) 103 as a protective sheet is adhered to the upper surface of the adhesive sheet 102.

  Here, the dimensional relationship between the substrate 101 and the adhesive sheet 102 is such that the adhesive sheet 102 does not protrude from the adhesive surface of the substrate 101 when the plurality of substrates 101 are stacked and assembled. It is set smaller than the external dimensions. Further, when adhering the adhesive sheet 102 and the separator 103 to the substrate 101, in order to prevent air bubbles from being mixed, the adhesive sheet 102 and the separator 103 are affixed at the same time with a roller, an elastic body, or the like. For this reason, the meniscus 106 of the adhesive sheet 102 formed by the applied pressure is present around the separator 103 in a state where it is abutted against the side surface of the separator 103, which makes it difficult to cause peeling.

  By the way, when the separator 103 is peeled from the substrate 101 and the adhesive sheet 102 by a peeling method using a conventional small diameter roller, the adhesive force of the peeling tape needs to be 3N / 10 mm or more. However, when peeling is performed using a peeling tape having such an adhesive force, a large internal stress is generated in the substrate 101 at the start of peeling, and the substrate 101 floats from the stage that is adsorbing the substrate 101, If the substrate 101 is deformed and a vacuum suction leak occurs, the position of the substrate 101 on the stage is shifted, or if the amount of deformation is large, the substrate 101 may be damaged. Therefore, at the start of peeling, a vacuum suction force is required to maintain the suction holding strength that prevents the substrate 101 from being deformed and displaced. This requires expensive members and high vacuum capacity, which increases the cost of the apparatus and increases the speed. There was a problem that it was difficult to realize the peeling operation. Thus, the present invention has solved these problems.

  Hereinafter, an embodiment of a substrate assembly apparatus according to the present invention will be described with reference to the drawings.

  As shown in FIG. 2, this board assembly apparatus is roughly divided to supply a supply unit 1 for supplying the individual board 101, a supply handler 2 for supplying the individual board 101 to the positioning unit 4, and a supply handler 2. Supply handler transport robot 3, positioning unit 4 for positioning individual substrate 101, transport handler 5 for transporting substrate 101 from positioning unit 4 through suction stage unit 7 until it is discharged from the apparatus, and transport handler 5 are transported A transport handler transport robot 6, a suction stage unit 7 for sucking the substrate 101, a suction stage transport robot 8 for transporting the suction stage unit 7, a peeling unit 9 for continuously peeling the separator 103 (see FIG. 1), The peeling head 10 that presses the peeling tape 30 against the separator 103 and the substrate 10 from which the separator 103 has been peeled off Consisting of the press roller unit 11 or the like for pressing the press after laminating the.

  As shown in FIG. 3, the supply unit 1 includes a stacking tray 13 in which individual substrates 101 are stacked, a lift elevator unit 12 that raises the substrate 101 to the suction supply height, and the substrate 101 at the supply height position. In a certain state, the substrate holder 14 that presses and holds the substrate immediately below from the side surface, the substrate upper surface detection sensor 15 that detects whether or not the substrate 101 is at the supply height position, and the substrate handler 101 that is installed in the supply handler 2. A suction pad 16 for suction is provided. Three sets of the elevator unit 12 to the substrate upper surface detection sensor 15 are provided.

  As shown in FIG. 4, the positioning unit 4 contacts the two sides of the positioning stage 19 for placing and positioning the substrate 101 and the substrate 101 on the positioning stage 19 to position the substrate 101 at a predetermined position. The long side positioning unit 17 and the short side positioning unit 18 are provided.

  As shown in FIGS. 2 and 5, the transfer handler 5 is transferred by the transfer handler transfer robot 6. As shown in FIG. 6, the transport handler 5 absorbs the height difference between the positioning stage 19 and the suction stage 24 shown in FIG. 2 and the height difference of the substrate (product) when stacked and assembled. In order to give an impact (indentation) to the corner of the separator 103 from the up-and-down cylinder 20 constituting the height correction mechanism and the upper surface of the substrate 101, the indentation tool 105 whose tip is chevron-shaped and the indentation tool 105 are raised and lowered A dent cylinder 21 constituting the mechanism, a stopper 22 that prevents an excessive load from being applied to the substrate 101 by the dent tool 105, and an adsorption to the lower surface to prevent displacement when the substrate 101 is adsorbed. And a transport suction plate 23 having holes.

  As shown in FIG. 7, the dent tool 105 is formed in a round bar shape as a whole, and one end 105a is formed in a mountain shape. An impact is applied to the separator 103 by this angle-shaped tip.

  As shown in FIG. 5, the suction stage unit 7 has two types of suction stages 24 for separating the separator 103, stacking and assembling the substrate 101, and pressure pressing on the suction conveyance stage 26, and behind the suction stage 24. And a receiving block 25 for preventing the position of the substrate 101 from being displaced or damaged by the pressure applied by the peeling head 10 when the peeling head 10 (see FIG. 2) is lowered in the peeling step. .

  As shown in FIG. 8, the peeling unit 9 can wind up and collect the peeling tape 30 together with the peeled separator 103 through several idlers so that the peeling tape 30 can be peeled continuously. Configured as follows. The peeling unit 9 includes a peeling head 10, a tape lock 29, a holding unit for the supply tape 27 and the collection tape 28, and the like, and the peeling tape 30 that has passed through the peeling head 10 is wound as the collection tape 28. Is done. The peeling unit 9 is configured so that the two substrates 101 can be processed at the same time in consideration of the exchange workability of the peeling tape 30 used for peeling and the recovered tape 28 after peeling.

  As shown in FIGS. 9 and 10, the peeling head 10 includes a peeling small-diameter roller 31 for securing the adhesion of the peeling tape 30, and a guide roller 32 for determining a peeling angle 33 between the peeling tape 30 and the substrate 101. And a pressurizing buffer mechanism 34 that enables the actuator of the peeling head 10 to be moved up and down and to adjust the pressurization.

  As shown in FIG. 11, the press roller unit 11 includes a rubber press roller 35 and a roller pressure cylinder 36, and moves or reciprocates the suction stage 24 in one direction while applying pressure by the press roller unit 11. By moving, the stacked substrate 101 is pressurized.

  Next, the operation of the substrate assembly apparatus having the above configuration will be described. In the following description, the case where the number of layers of the laminated substrate as the final product is three will be described as an example.

  As shown in FIG. 3, when the substrate 101 is lifted by the lift elevator unit 12 from the stack tray 13 in which the individual substrates 101 are stored in a stacked manner, and the top surface of the substrate 101 is detected by the substrate top surface detection sensor 15, the lift elevator unit 12 is stopped, and the substrate 101 is positioned at the suction supply height.

  In a state where the substrate 101 is positioned at the suction supply height, the substrate 101 positioned immediately below the substrate 101 is clamped from the side surface by the substrate presser 14, and the upper surface of the substrate 101 to be supplied in this state is clamped by the supply handler 2. Suction is supplied by the suction pad 16 and supplied to the positioning unit 4 in FIG. In this way, the substrate 101 positioned immediately below the substrate 101 is clamped from the side surface by the substrate holder 14 and the upper surface of the substrate 101 is sucked and supplied by the suction pad 16, so that static electricity and the surroundings of the separator 103 of the immediately lower substrate can be obtained. It is possible to prevent two or more substrates 101 from being sucked and supplied at the same time due to the influence of the protruding adhesive or the like.

  The substrate 101 supplied to the positioning unit 4 in FIG. 4 is positioned at a predetermined position on the positioning stage 19 by the long side positioning unit 17 and the short side positioning unit 18. Next, as shown in FIG. 5, the substrate 101 positioned by the positioning unit 4 by the transfer handler 5 is transferred to the suction stage 24 of the suction stage unit 7.

  At the same time as confirming that the substrate 101 is adsorbed on the adsorption stage 24, as shown in FIG. 12B, an impact is applied to the upper surface of the separator 103 by the dent tool 105, and FIGS. ), The corner portion of the separator 103 is peeled off from the adhesive sheet 102 with the chevron-shaped ridge line as a base point, and the float 104 is generated. The dent tool 105 is set so as to always give a constant impact to the upper surface of the separator 103 without applying an excessive load to the substrate 101 by the stopper 22 of FIG.

  Next, in FIG. 2, the transport handler 5 moves to the positioning stage 19 to process the next substrate 101, and simultaneously, the suction stage 24 moves to the peeling start position of the peeling unit 9.

  FIG. 12 shows a detailed process of peeling the separator 103 using the float 104 due to the dent of the dent tool 105 as a cause of peeling.

  FIG. 12A shows a state where the substrate 101 having the separator 103 is positioned and held on the suction stage 24 of FIG. In this state, as shown in FIG. 12B, a dent impact is applied to the separator 103 by the dent tool 105, and the state shown in FIG. 12C is obtained. FIG. 12G is an enlarged view of the dent portion, and the float 103 is generated in the range where the separator 103 straddles two sides from the substrate 101 due to the dent impact of the dent tool 105.

  FIG. 12D shows a state in which the suction stage 24 on which the dent substrate 101 has been placed on the separator 103 has moved to the peeling head 10. From this state, as shown in FIG. 12 (e), the peeling head 10 is lowered, and the peeling tape 30 and the peeling small-diameter roller 31 for bringing the separator 103 into close contact with the tip of the separator 103 are lowered to press the suction stage. Simultaneously with the movement of 24, the winding and peeling operation of the peeling tape 30 is started.

  Here, as shown in FIG. 9, the guide roller 32 positioned in front of the peeling small-diameter roller 31 ensures that the peeling area of the float 104, which is caused by the peeling of the separator 103, pulls up the separator 103 at the corner minimum portion. The peeling area is expanded from the adhesive sheet 102, and the separator 103 can be peeled without applying a load due to the peeling to the substrate 101. FIG. 12F shows a state during the peeling operation.

  As described above, with respect to the substrate 101 located on the suction stage 24 that has been peeled off from the third layer and the second layer, the transport handler 5 and the suction stage 24 are used to change the uppermost one-layer substrate 101 into 2 layers. One-layer and two-layer temporary stacking assembly in the state of being laminated on the layer substrate 101 and temporarily bonded by the adhesive force of the two-layer adhesive sheet 102 by the combined operation of the orthogonal handler of the transfer handler 5 and the suction transfer stage 26 The product is assembled in three layers.

  Next, as shown in FIG. 11, after stacking the substrates 101 from which the separator 103 has been peeled, the suction stage 24 is moved while being pressed by the press roller 35 and the roller pressurizing cylinder 36 of the press roller unit 11. After completing the pressurizing operation, the substrate handler 101 is transported to the discharge position by the transport handler 5, and a series of operations are completed.

  As described above, in the above embodiment, the cause of peeling due to the float 104 of the separator 103 due to the dent of the dent tool 105 and the effect of maintaining the angle between the substrate 101 and the peeling tape 30 by the guide roller 32 of the peeling head 10. This makes it possible to keep the peel strength necessary for the cause of peeling low, and the separator 103 can be peeled off with a peeling tape having an adhesive strength of about 1.5 N / 10 mm, so that an inexpensive consumable member can be applied.

  Further, since high vacuum suction is not required for the suction of the substrate 101, expensive vacuum equipment is not required, and it is possible to prevent the position of the substrate 101 from being shifted by the suction stage 24 during the peeling process. It can be assembled in a state in which the positioning accuracy is secured.

  In the above-described embodiment, the substrate 101 is mounted on the suction stage 24, and at the same time, an impact is applied to the corner position of the separator 103 by the dent tool 105 to generate a float 104 on the separator 103. As shown in FIG. A simple fixed component 107 and a stopper 22 are mounted on the supply handler 5, a dent tool 105 is fixed on the fixed component 107, and a substrate 101 is mounted using the transfer handler transfer robot 6 being used. Later, the dent tool 105 can be moved to the dent position to give a dent impact, and the same result as described above can be obtained while reducing the cost of the apparatus.

  14A, the substrate 101 is supplied onto the suction stage 24 by the transfer handler 5, and then the transfer handler 5 is moved to the right in the drawing by the transfer handler transfer robot 6. As shown in FIG. 14 (b), it is possible to generate the float 104 on the separator 103 on the substrate 101 using the dent tool 105.

  It is possible to use a resin substrate such as acrylic or a glass substrate as a base material, and incorporate a filter product into these substrates to form a single-piece filter, which can be laminated and applied to an inspection part or the like. In addition, the substrate assembly apparatus according to the present invention can be used when a substrate is provided with a path through which a liquid or gas passes and is superposed with a filter or a reaction component incorporated in the stacked substrate.

BRIEF DESCRIPTION OF THE DRAWINGS It is a single block diagram of the board | substrate laminated | stacked by the board | substrate assembly apparatus concerning this invention, Comprising: (a) is a top view, (b) is the sectional view on the AA line of (a), (c) is (b). FIG. 1 is a partially broken overall perspective view showing an embodiment of a substrate assembly apparatus according to the present invention. It is a partially broken perspective view which shows the supply unit and supply handler of the board | substrate assembly apparatus of FIG. It is a perspective view which shows the positioning unit of the board | substrate assembly apparatus of FIG. FIG. 3 is a perspective view showing a transfer handler and a suction stage unit of the substrate assembly apparatus of FIG. 2. It is a perspective view which shows the conveyance handler of the board | substrate assembly apparatus of FIG. It is a figure which shows the dent tool of the board | substrate assembly apparatus of FIG. 2, Comprising: (a) is a front view, (b) is a side view, (c) is a top view, (d) is a perspective view. It is a whole perspective view which shows the peeling unit of the board | substrate assembly apparatus of FIG. It is a side view which shows the peeling head of the peeling unit of FIG. It is a perspective view of the peeling head of FIG. It is a side view which shows the press roller part of the board | substrate assembly apparatus of FIG. It is a perspective view which shows peeling operation | movement using the peeling head etc. of the board | substrate assembly apparatus concerning this invention. It is a perspective view which shows the conveyance handler in other embodiment of the board | substrate assembly apparatus concerning this invention. It is operation | movement explanatory drawing of the conveyance handler in other embodiment of the board | substrate assembly apparatus concerning this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Supply unit 2 Supply handler 3 Supply handler transfer robot 4 Positioning unit 5 Transfer handler 6 Transfer handler transfer robot 7 Suction stage unit 8 Suction stage transfer robot 9 Peeling unit 10 Peeling head 11 Press roller unit 12 Lifting elevator unit 13 Laminating tray 14 Substrate Presser 15 Substrate upper surface detection sensor 16 Suction pad 17 Long side positioning unit 18 Short side positioning unit 19 Positioning stage 20 Lifting cylinder 21 Striking cylinder 22 Stopper 23 Transport suction plate 24 Suction stage 25 Receiving block 26 Suction transport stage 27 Supply tape 28 Recovery Tape 29 Tape lock 30 Peeling tape 31 Peeling small diameter roller 32 Guide roller 33 Peeling angle 34 Pressure buffer 35 Press roller 36 Roller pressure cylinder 101 (A (Crill or glass) substrate 102 adhesive sheet 103 separator 104 float 105 dent tool 105a one end 106 of the dent tool 107 meniscus 107 fixed part

Claims (8)

A direction in which one substrate having an adhesive layer on one surface and a protective sheet covering the adhesive layer is peeled off, the other substrate is superimposed on the exposed adhesive layer, and both substrates are close to each other A board assembly apparatus for assembling a laminated board in which two boards are laminated,
Suction holding means for sucking and holding the surface of the one substrate on which no adhesive layer is present;
An impact applying means for applying an impact to a surface straddling two adjacent sides of the protective sheet of the one substrate;
Film peeling means for peeling the protective sheet by bringing a peeling tape into contact with the surface of the protective sheet that has been levitated by the application of the impact;
Substrate transport means for relatively moving both substrates so that the other substrate is superimposed on the adhesive layer exposed after peeling off the protective sheet;
A board assembly apparatus, comprising: a pressing unit that presses both boards in a direction approaching each other. After peeling off the protective sheet of one substrate having an adhesive layer on one surface and a protective sheet covering the adhesive layer, an adhesive layer on the one surface and a protective sheet covering the adhesive layer on the exposed adhesive layer By repeating the operation of superimposing the surfaces of the other substrate on which the adhesive layer does not exist, three or more substrates are stacked, and the stacked substrates are stacked in a direction in which adjacent substrates are adjacent to each other. A board assembly apparatus that assembles a laminated board in which three or more boards are laminated by pressing the entire board,
Suction holding means for sucking and holding the surface of the one substrate on which no adhesive layer is present;
An impact applying means for applying an impact to a surface straddling two adjacent sides of the protective sheet of the one substrate;
Film peeling means for peeling the protective sheet by bringing a peeling tape into contact with the surface of the protective sheet that has been levitated by the application of the impact;
Substrate transport means for relatively moving both substrates so that the surface of the other substrate on which the adhesive layer does not exist is superimposed on the adhesive layer exposed after peeling off the protective sheet;
A substrate assembly apparatus comprising: a pressing unit that presses the entire stacked substrates in a direction in which adjacent substrates of the stacked substrates approach each other.   3. The substrate assembly apparatus according to claim 1, wherein the impact applying unit includes a contact portion that linearly contacts a surface extending over two adjacent sides of the protective sheet.   The substrate assembly apparatus according to claim 3, further comprising stopper means for restricting movement of the contact portion of the impact applying means in a direction perpendicular to the surface of the protective sheet.   The film peeling means is in contact with the peeling tape and a pressing roller that presses the peeling tape against the surface of the protective sheet, and maintains an angle formed by the surface of the peeling tape and the surface of the protective sheet at a predetermined angle. The board assembly apparatus according to claim 1, further comprising a guide roller that performs the above operation.   Before the suction holding of the surface of the one substrate without the adhesive layer by the suction holding means and the stacking of the other substrate by the substrate transport means, the outer positions of the one substrate and the other substrate are determined. 6. The board assembly apparatus according to claim 1, further comprising positioning means for positioning. A direction in which one substrate having an adhesive layer on one surface and a protective sheet covering the adhesive layer is peeled off, the other substrate is superimposed on the exposed adhesive layer, and both substrates are close to each other In the board assembly method for assembling a laminated board in which two boards are laminated,
In a state where the surface of the one substrate on which the adhesive layer does not exist is adsorbed and held, an impact is applied to the surface over two adjacent sides of the protective sheet of the one substrate, whereby the surface to which the impact is applied is bonded to the surface. Lift from the layer,
A peeling tape is brought into contact with the surface of the floated protective sheet to peel off the protective sheet,
Overlay the other substrate on the adhesive layer exposed after peeling off the protective sheet,
A substrate assembling method comprising pressing both substrates in directions close to each other. After peeling off the protective sheet of one substrate having an adhesive layer on one surface and a protective sheet covering the adhesive layer, an adhesive layer on the one surface and a protective sheet covering the adhesive layer on the exposed adhesive layer By repeating the operation of superimposing the surfaces of the other substrate on which the adhesive layer does not exist, three or more substrates are stacked, and the stacked substrates are stacked in a direction in which adjacent substrates are adjacent to each other. A substrate assembly method for assembling a laminated substrate in which three or more substrates are laminated by pressing the entire substrate,
In a state where the surface of the one substrate on which the adhesive layer does not exist is adsorbed and held, an impact is applied to the surface over two adjacent sides of the protective sheet of the one substrate, whereby the surface to which the impact is applied is bonded to the surface. Lift from the layer,
A peeling tape is brought into contact with the surface of the floated protective sheet to peel off the protective sheet,
Repeating the operation of superimposing the surface of the other substrate on which the adhesive layer does not exist on the adhesive layer exposed after peeling off the protective sheet,
A method of assembling a substrate, comprising pressing the entire stacked substrates in a direction in which adjacent substrates of the stacked substrates approach each other.

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