JP2009027051A - Cooling device for electronic device - Google Patents

Cooling device for electronic device Download PDF

Info

Publication number
JP2009027051A
JP2009027051A JP2007190290A JP2007190290A JP2009027051A JP 2009027051 A JP2009027051 A JP 2009027051A JP 2007190290 A JP2007190290 A JP 2007190290A JP 2007190290 A JP2007190290 A JP 2007190290A JP 2009027051 A JP2009027051 A JP 2009027051A
Authority
JP
Japan
Prior art keywords
cooling
temperature
electronic device
housing
modules
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007190290A
Other languages
Japanese (ja)
Inventor
Hiroaki Sasaki
博章 佐々木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yokogawa Electric Corp
Original Assignee
Yokogawa Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yokogawa Electric Corp filed Critical Yokogawa Electric Corp
Priority to JP2007190290A priority Critical patent/JP2009027051A/en
Publication of JP2009027051A publication Critical patent/JP2009027051A/en
Pending legal-status Critical Current

Links

Images

Abstract

<P>PROBLEM TO BE SOLVED: To achieve a cooling device for an electronic device, which prevents thermal destruction of the electronic device and other modules installed in the enclosure of the electronic device even when multiple modules having different heating values are installed. <P>SOLUTION: An improved cooling device for an electronic device having an enclosure into/from which multiple modules are installed/removed is provided. The cooling device includes: multiple variable rotation speed cooling fans that are provided above positions, in which respective modules are to be installed, and are two-dimensionally arranged on the top surface of the enclosure; temperature sensors that are provided for the respective modules; a rotation speed control section that increases the rotation speed(s) of the cooling fan(s) positioned above the temperature sensor(s) sensing higher temperature(s) on the basis of the temperatures sensed by the temperature sensors; and a power-off section that powers off the whole electronic device in the case where the temperature sensed by any temperature sensor exceeds a specified temperature even when the cooling fans rotate at the maximum speed. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、筐体内に複数のモジュールが取り付け、取り外される組込み電子機器の冷却装置に関し、詳しくは、発熱量の異なるモジュールが複数装着された場合でも、機器本体の筐体に装着される他のモジュールや機器本体の熱破壊を防止する電子機器の冷却装置に関するものである。   The present invention relates to a cooling device for an embedded electronic device in which a plurality of modules are attached to and detached from a housing, and more specifically, even when a plurality of modules having different heat generation amounts are attached, The present invention relates to a cooling device for electronic equipment that prevents thermal destruction of modules and equipment bodies.

アドバンスＴＣＡやＶＭＥのような組込み電子機器では、機器本体の筐体に複数のスロットが設けられ、このスロット内にモジュールが実装される。そして、筐体側には、実装されたモジュールを冷却するための冷却装置が設けられる（例えば、特許文献１〜３参照）。   In an embedded electronic device such as Advanced TCA or VME, a plurality of slots are provided in a housing of the device body, and a module is mounted in the slot. And the cooling device for cooling the mounted module is provided in the housing | casing side (for example, refer patent documents 1-3).

図４は、従来の組込み電子機器の冷却装置を示した構成図である。図５（ａ）は、図４に示す装置の上面の断面図であり、図５（ｂ）は、側面の断面図である。図４、図５において、筐体１０は、組込みの電子機器の本体であり、機器前面に複数のスロットが設けられ、マザーボード１１、冷却用ファン１２を有する。マザーボード１１は、スロットごとにコネクタ１３が設けられる。冷却用ファン１２は、機器背面の下部に複数個設けられる。   FIG. 4 is a configuration diagram illustrating a cooling device for a conventional embedded electronic device. 5A is a cross-sectional view of the top surface of the apparatus shown in FIG. 4, and FIG. 5B is a cross-sectional view of the side surface. 4 and 5, a housing 10 is a main body of a built-in electronic device, and a plurality of slots are provided on the front surface of the device, and includes a motherboard 11 and a cooling fan 12. The motherboard 11 is provided with a connector 13 for each slot. A plurality of cooling fans 12 are provided in the lower part of the back of the device.

モジュール２０は、コネクタ２１を有し、筐体１０の所望のスロットに取り付け、取り外しが可能であり、マザーボード１１からの信号に従って所定の動作を行なう。コネクタ２１は、マザーボード１１のコネクタ１３と電気的に接続され、マザーボード１１と信号の授受を行なう。また、モジュール２０は、様々な電子部品が実装される基板（図示せず）を有する。   The module 20 has a connector 21, can be attached to and detached from a desired slot of the housing 10, and performs a predetermined operation in accordance with a signal from the motherboard 11. The connector 21 is electrically connected to the connector 13 of the mother board 11 and exchanges signals with the mother board 11. The module 20 has a substrate (not shown) on which various electronic components are mounted.

このような装置の動作を説明する。
モジュール２０が筐体１０の所望のスロットに実装される。そして、筐体１０の電源がオンされて各モジュール２０にも電力が供給され、筐体１０からの指示に従って個々のモジュールが動作する。これにより、各モジュール２０の基板に実装される発熱部品が発熱する。 The operation of such an apparatus will be described.
The module 20 is mounted in a desired slot of the housing 10. Then, the power supply of the housing 10 is turned on to supply power to each module 20, and each module operates in accordance with an instruction from the housing 10. Thereby, the heat-generating component mounted on the board of each module 20 generates heat.

一方、冷却用ファン１２が、所定の回転数で回転し、筐体１０の背面下部から空気を取り込み、筐体１０の下部を通ってモジュール２０の下まで空気を流す。そして、モジュール２０の下面の空気孔（図示せず）から上面の空気孔（図示せず）を通り、筐体１０の上面から空気が排出される。これにより、モジュール２０が冷却される。   On the other hand, the cooling fan 12 rotates at a predetermined number of revolutions, takes air from the lower back of the housing 10, and flows the air through the lower portion of the housing 10 to the bottom of the module 20. Then, air is discharged from the upper surface of the housing 10 through an air hole (not shown) on the upper surface from an air hole (not shown) on the lower surface of the module 20. Thereby, the module 20 is cooled.

特開平５−９５０６３号公報JP-A-5-95063 特開平６−４２４９４号公報JP-A-6-42494 特開平９−２５０４８９号公報Japanese Patent Laid-Open No. 9-250489

しかしながら、発熱体の電子部品は、モジュール２０の基板上の所望の位置に実装され、モジュール２０内で温度勾配が生ずる。そして、モジュール２０は、複数の種類が存在し、仕様や機能によって発熱量がモジュール２０ごとに異なり、アドバンストＴＣＡの規格に準拠したモジュール２０では、最大２００［Ｗ］の発熱量に達することもある。また、同じ種類のモジュール２０であっても、マザーボード１１からの指示によっても動作が異なり発熱量も異なる。さらに、モジュール２０は、筐体１０のスロットの所望の位置に装着することができ、ユーザの使用方法によって装着位置が異なる場合もある。   However, the electronic component of the heating element is mounted at a desired position on the substrate of the module 20, and a temperature gradient is generated in the module 20. There are a plurality of types of modules 20, and the amount of heat generated varies depending on the specifications and functions of each module 20. The module 20 compliant with the Advanced TCA standard may reach a maximum amount of heat of 200 [W]. . Even in the same type of module 20, the operation differs depending on the instruction from the mother board 11, and the amount of heat generated is also different. Furthermore, the module 20 can be mounted at a desired position in the slot of the housing 10, and the mounting position may differ depending on the usage method of the user.

そのため、筐体１０の背面下部に設けられた冷却用ファン１２によっては、個々のモジュール２０を的確に冷却することが困難であり、最悪の場合、筐体１０内の温度が上昇し、他のモジュール２０や、機器本体の筐体１０側の電子回路をも熱破壊されるという問題があった。   Therefore, depending on the cooling fan 12 provided at the lower back of the housing 10, it is difficult to accurately cool the individual modules 20. In the worst case, the temperature in the housing 10 rises, There was a problem that the module 20 and the electronic circuit on the housing 10 side of the device main body were also thermally destroyed.

そこで本発明の目的は、発熱量の異なるモジュールが複数装着された場合でも、機器本体の筐体に装着される他のモジュールや機器本体の熱破壊を防止する電子機器の冷却装置を実現することにある。   SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to realize a cooling device for an electronic device that prevents thermal destruction of other modules or the device body that are mounted on the housing of the device body even when a plurality of modules having different calorific values are mounted. It is in.

請求項１記載の発明は、
筐体内に複数のモジュールが取り付け、取り外される電子機器の冷却装置において、
前記モジュールが装着される位置の上側であり前記筐体の上面に２次元的に配置され、回転数可変の複数の冷却用ファンと、
前記モジュールそれぞれに設けられる温度センサと、
これらの温度センサの検出温度に基づいて、複数の温度センサのうち検出温度の高い温度センサの上側に位置する前記冷却用ファンの回転数を上げる回転数制御部と、
前記冷却用ファンの回転数が最大であっても前記温度センサの検出温度が所定の温度を超えた場合、電子機器全体の電源をオフする電源遮断部と
を設けたことを特徴とするものである。
請求項２記載の発明は、請求項１記載の発明において、
電源遮断部は、電子機器全体の電源をオフした場合であっても、前記冷却用ファンへの電力の供給を続けることを特徴とするものである。
請求項３記載の発明は、請求項１または２記載の発明において、
前記冷却用ファンは、前記筐体から外部に空気を排出するファンであることを特徴とするものである。 The invention described in claim 1
In a cooling device for an electronic device in which a plurality of modules are attached and removed from the housing,
A plurality of cooling fans that are two-dimensionally arranged on the upper surface of the housing above the position where the module is mounted;
A temperature sensor provided in each of the modules;
Based on the detected temperatures of these temperature sensors, a rotational speed control unit that increases the rotational speed of the cooling fan located above the temperature sensor having a higher detected temperature among the plurality of temperature sensors;
A power shut-off unit is provided for turning off the power of the entire electronic device when the detected temperature of the temperature sensor exceeds a predetermined temperature even when the number of rotations of the cooling fan is maximum. is there.
The invention according to claim 2 is the invention according to claim 1,
The power shut-off unit is characterized in that the power supply to the cooling fan is continued even when the power of the entire electronic device is turned off.
The invention according to claim 3 is the invention according to claim 1 or 2,
The cooling fan is a fan that discharges air from the housing to the outside.

本発明によれば、以下のような効果がある。
冷却用ファンが、筐体の上面に２次元的に配置され、モジュールそれぞれに複数の温度センサが設けられる。そして、回転数制御部が、検出温度の高い温度センサ近くの冷却用ファンの回転数を増加させるので、モジュールの冷却に最適な風量を流すことができる。また、電源遮断部が、冷却用ファンの回転数が最大となっても、温度センサの検出温度が所定の温度を超えた場合、電子機器全体の電源をオフする。これにより、発熱量の異なるモジュールが複数装着された場合でも、機器本体の筐体に装着される他のモジュールや機器本体等の熱破壊を防止することができる。 The present invention has the following effects.
A cooling fan is two-dimensionally arranged on the upper surface of the housing, and a plurality of temperature sensors are provided for each module. And since a rotation speed control part increases the rotation speed of the cooling fan near the temperature sensor with high detection temperature, it can flow the optimal air volume for cooling of a module. Moreover, even if the number of rotations of the cooling fan becomes maximum, the power shut-off unit turns off the power supply of the entire electronic device if the temperature sensor detects a temperature that exceeds a predetermined temperature. Thereby, even when a plurality of modules having different calorific values are mounted, it is possible to prevent thermal destruction of other modules mounted on the casing of the device main body or the device main body.

以下図面を用いて本発明の実施の形態を説明する。
図１は、本発明の一実施例を示した構成図である。ここで、図４、図５と同一のものには同一符号を付し説明を省略する。図１（ａ）は上面断面図であり、図１（ｂ）は側面断面図である。図１において、筐体１０には、空気排出用の冷却用ファン１４、回転数制御部１５、電源遮断部１６が新たに設けられる。また、モジュール２０には、温度センサ２２が設けられる。 Embodiments of the present invention will be described below with reference to the drawings.
FIG. 1 is a block diagram showing an embodiment of the present invention. Here, the same components as those in FIG. 4 and FIG. FIG. 1A is a top sectional view, and FIG. 1B is a side sectional view. In FIG. 1, a housing 10 is newly provided with a cooling fan 14 for exhausting air, a rotation speed control unit 15, and a power cutoff unit 16. The module 20 is provided with a temperature sensor 22.

空気排出用の冷却用ファン１４は、空気吸入用の冷却用ファン１２とは別に設けられ、モジュール２０が装着されるスロットの位置の上側であって、筐体１０の上面に２次元的に配置される。また、冷却用ファン１２、１４は、回転数が可変である。ここで、図１においては、説明上、モジュール２０が筐体１０に挿入される方向をｘ軸とし、モジュール２０が筐体１０内で並ぶ方向をｙ軸とし、筐体１０の高さ方向をｚ軸として説明する。そして、図１に示す装置では一例として、９個（ｘ軸方向に３個、ｙ軸方向に３個）の冷却用ファン１４が設けられる例を示している。   The cooling fan 14 for discharging air is provided separately from the cooling fan 12 for sucking air, and is two-dimensionally arranged on the upper surface of the housing 10 above the slot where the module 20 is mounted. Is done. Further, the cooling fans 12 and 14 have variable rotation speeds. Here, in FIG. 1, for the sake of explanation, the direction in which the module 20 is inserted into the housing 10 is the x axis, the direction in which the modules 20 are arranged in the housing 10 is the y axis, and the height direction of the housing 10 is Explanation will be made on the z-axis. 1 shows an example in which nine cooling fans 14 (three in the x-axis direction and three in the y-axis direction) are provided.

回転数制御部１５は、マザーボード１１を介して温度センサ２２と電気的に接続され、温度センサ２２の検出した検出温度に基づいて、冷却用ファン１２、１４の回転数を制御する。   The rotational speed control unit 15 is electrically connected to the temperature sensor 22 via the mother board 11 and controls the rotational speeds of the cooling fans 12 and 14 based on the detected temperature detected by the temperature sensor 22.

電源遮断部１６は、回転数制御部１５による冷却用ファン１２、１４の回転数と、温度センサ２２の検出温度とに基づいて、電子機器全体の電源をオフする。   The power cutoff unit 16 turns off the power supply of the entire electronic device based on the number of rotations of the cooling fans 12 and 14 by the rotation number control unit 15 and the temperature detected by the temperature sensor 22.

ここで、図２は、モジュール２０の構成の一例を示した図である。また、図３は、温度センサ２２、冷却用ファン１４、回転数制御部１５の関係を示したブロック図である。   Here, FIG. 2 is a diagram illustrating an example of the configuration of the module 20. FIG. 3 is a block diagram showing the relationship between the temperature sensor 22, the cooling fan 14, and the rotation speed control unit 15.

モジュール２０は、基板２３の両面をフレーム２４が覆うように構成される。基板２３は、後端にコネクタ２１が取り付けられ、両面に様々な電子部品（発熱体）２５が実装され、これら電子部品２５用の放熱部品２６も取り付けられる。   The module 20 is configured so that the frame 24 covers both surfaces of the substrate 23. The board 23 has a connector 21 attached to the rear end, various electronic components (heating elements) 25 are mounted on both sides, and a heat dissipation component 26 for the electronic components 25 is also attached.

フレーム２４は、基板２３の防塵、電気的なシールド等を兼ね、冷却用の空気を流す空気孔２７がフレーム２４の上面、下面に複数設けられる。   The frame 24 also serves as a dust-proof and electrical shield for the substrate 23, and a plurality of air holes 27 through which cooling air flows are provided on the upper and lower surfaces of the frame 24.

温度センサ２２は、基板２３やフレーム２４の所望の位置に取り付けられ、例えば、発熱量の多い電子部品２５、放熱部品２６に直接取り付けられたり、電子部品２５、放熱部品２６の近傍の基板２３上に取り付けられる。また、フレーム２４の上面の空気孔２７付近にも設けらる。   The temperature sensor 22 is attached to a desired position of the substrate 23 or the frame 24. For example, the temperature sensor 22 is directly attached to the electronic component 25 and the heat dissipation component 26 that generate a large amount of heat, or on the substrate 23 in the vicinity of the electronic component 25 and the heat dissipation component 26. Attached to. It is also provided near the air hole 27 on the upper surface of the frame 24.

このような装置の動作を説明する。
モジュール２０が筐体１０の所望のスロットに実装される。そして、筐体１０の電源（図示せず）がオンされて各モジュール２０にも電力が供給され、筐体１０からの指示に従って個々のモジュール２０が動作する。これにより、各モジュール２０の基板２３で発熱する。 The operation of such an apparatus will be described.
The module 20 is mounted in a desired slot of the housing 10. Then, a power source (not shown) of the housing 10 is turned on to supply power to each module 20, and each module 20 operates according to an instruction from the housing 10. As a result, heat is generated on the substrate 23 of each module 20.

一方、回転数制御部１５が、電源のオンと共に冷却用ファン１２、１４を所定の回転数（初期値）で回転させ、筐体１０の背面下部から空気を取り込み、筐体１０の下部を通ってモジュール２０の下まで空気を流す。そして、モジュール２０のフレーム２４下面の空気孔２７から上面の空気孔２７を通り、筐体１０の上面のファン１４から空気を筐体１０の外部に排出し、各モジュール２０を冷却させる。   On the other hand, the rotation speed control unit 15 rotates the cooling fans 12 and 14 at a predetermined rotation speed (initial value) when the power is turned on, takes in air from the lower back of the housing 10, and passes through the lower portion of the housing 10. Then, let air flow to the bottom of the module 20. Then, air passes through the air hole 27 on the lower surface of the frame 24 of the module 20 through the air hole 27 on the upper surface, and the air is discharged from the fan 14 on the upper surface of the housing 10 to the outside of the housing 10 to cool each module 20.

そして、回転数制御部１５が、各モジュールの２０の各温度センサ２２による検出温度をマザーボード１１を介して収集し、検出温度に基づいて２次元的に配列された個々のファン１４の回転数を制御する。例えば、検出温度が上昇している温度センサ２２は、冷却用の空気の風量が不足と判断し、この温度センサ２２に近いファン１４の回転数を増加させる。一方、検出温度が下降している場合、下降している温度センサ２２に近いファン１３の回転数を低下させる。   Then, the rotation speed control unit 15 collects the detected temperatures of the 20 temperature sensors 22 of each module via the mother board 11, and determines the rotation speeds of the individual fans 14 arranged two-dimensionally based on the detected temperatures. Control. For example, the temperature sensor 22 whose detected temperature is rising determines that the air volume of the cooling air is insufficient, and increases the rotational speed of the fan 14 close to the temperature sensor 22. On the other hand, when the detected temperature is decreasing, the rotational speed of the fan 13 close to the decreasing temperature sensor 22 is decreased.

図１（ｂ）で具体的に説明する。図１（ｂ）において、ｘ軸方向に並んだ冷却用ファン１４を、コネクタ２１側から１４（１）、１４（２）、１４（３）とする。そして、ファン１４（３）の下に位置する温度センサの検出温度が最も高く（検出温度上昇中）、ファン１４（２）の下に位置する温度センサの検出温度が最も低い場合、回転数制御部１５が、ファン１４の回転数を（ファン１４（３）＞１４（１）＞１４（２））に制御する。そして、検出温度が設定した温度以下になるまで風量の調整を行なう。ｙ軸方向に並んだファン１４も同様に、ファン１４の下に位置する温度センサ２２の検出温度に基づいて回転数を制御し、風量を調整する。   This will be specifically described with reference to FIG. In FIG. 1B, the cooling fans 14 arranged in the x-axis direction are referred to as 14 (1), 14 (2), and 14 (3) from the connector 21 side. When the detected temperature of the temperature sensor located under the fan 14 (3) is the highest (while the detected temperature is rising) and the detected temperature of the temperature sensor located under the fan 14 (2) is the lowest, the rotational speed control is performed. The unit 15 controls the rotational speed of the fan 14 to (fan 14 (3)> 14 (1)> 14 (2)). Then, the air volume is adjusted until the detected temperature falls below the set temperature. Similarly, the fans 14 arranged in the y-axis direction control the rotational speed based on the temperature detected by the temperature sensor 22 located under the fan 14 to adjust the air volume.

そして、温度センサ２２の検出温度がさらに上昇した場合、回転数制御部１５が、ファン１２、１４それぞれの回転数を最大まで上げる。さらに、ファン１２、１４の回転数が最大であっても検出温度の上昇が止まらず所定の温度を超えた場合、電源遮断部１６が、風量不足と判断して電子機器全体の電源をオフし、全モジュール２０、マザーボード１１への電力の供給を強制的に止める。この際、電源遮断部１６が、ファン１２、１４のみは電力の供給を続け、筐体１０、モジュール２０の冷却を続けるとよい。   When the temperature detected by the temperature sensor 22 further increases, the rotation speed control unit 15 increases the rotation speeds of the fans 12 and 14 to the maximum. Further, if the detected temperature does not stop rising even if the rotation speed of the fans 12 and 14 is maximum and exceeds a predetermined temperature, the power shut-off unit 16 determines that the air volume is insufficient and turns off the power to the entire electronic device. The power supply to all the modules 20 and the mother board 11 is forcibly stopped. At this time, it is preferable that the power shut-off unit 16 keeps supplying power only to the fans 12 and 14 and cooling the casing 10 and the module 20.

このように、冷却用ファン１４が、筐体１０の上面に２次元的に配置され、モジュール２０それぞれに複数の温度センサが設けられる。そして、回転数制御部１５が、検出温度の高い温度センサ２２近くの冷却用ファン１４の回転数を増加させるので、モジュール２０の冷却に最適な風量を流すことができる。   As described above, the cooling fan 14 is two-dimensionally arranged on the upper surface of the housing 10, and a plurality of temperature sensors are provided in each module 20. And since the rotation speed control part 15 increases the rotation speed of the cooling fan 14 near the temperature sensor 22 with a high detected temperature, it is possible to flow an air volume optimum for cooling the module 20.

また、電源遮断部１６が、冷却用ファン１２、１４の回転数が最大となっても、温度センサ２２の検出温度が所定の温度を超えた場合、電子機器全体の電源をオフする。これにより、発熱量の異なるモジュール２０が複数装着された場合でも、機器本体の筐体１０に装着される他のモジュール２０や機器本体のマザーボード１１等の熱破壊を防止することができる。   Moreover, even if the rotation speed of the cooling fans 12 and 14 becomes maximum, the power shut-off unit 16 turns off the power supply of the entire electronic device when the temperature detected by the temperature sensor 22 exceeds a predetermined temperature. Thereby, even when a plurality of modules 20 having different calorific values are mounted, it is possible to prevent thermal destruction of other modules 20 mounted on the casing 10 of the apparatus body, the motherboard 11 of the apparatus body, and the like.

なお、本発明はこれに限定されるものではなく、以下に示すようなものでもよい。
冷却用ファン１４を筐体１０の上面に９個（３個×３個）設ける構成を示したが、ｘ軸方向、ｙ軸方向に何個設けてもよい。 The present invention is not limited to this, and may be as shown below.
Although the configuration in which nine cooling fans 14 (3 × 3) are provided on the upper surface of the housing 10 is shown, any number of cooling fans 14 may be provided in the x-axis direction and the y-axis direction.

また、組込み電子機器の一種であるアドバンストＴＣＡに適用する構成を示したが、筐体１０内に複数のモジュールが装着される電子機器であれば、どのようなものでもよい。例えば、局内装置、多チャネル装置、ＶＸＩ用の筐体、ＰＣＩ用の筐体等である。   Moreover, although the structure applied to advanced TCA which is a kind of built-in electronic device was shown, what kind of thing may be sufficient if it is an electronic device by which a some module is mounted in the housing | casing 10. FIG. For example, an intra-station device, a multi-channel device, a VXI casing, a PCI casing, and the like.

本発明の一実施例を示した構成図である。It is the block diagram which showed one Example of this invention. 図１に示す装置のモジュール２０の構成を示した図である。It is the figure which showed the structure of the module 20 of the apparatus shown in FIG. 図１に示す装置の温度センサ２２、ファン１２、回転数制御部１５の関係を示したブロック図である。FIG. 2 is a block diagram showing a relationship among a temperature sensor 22, a fan 12, and a rotation speed control unit 15 of the apparatus shown in FIG. 従来の電子機器の冷却装置の構成を示した図である。It is the figure which showed the structure of the cooling device of the conventional electronic device. 図４に示す装置の断面図である。It is sectional drawing of the apparatus shown in FIG.

符号の説明Explanation of symbols

１０ 筐体
１４ 冷却用ファン
１５ 回転数制御部
１６ 電源遮断部
２０ モジュール
２２ 温度センサ DESCRIPTION OF SYMBOLS 10 Case 14 Cooling fan 15 Rotational speed control part 16 Power supply interruption part 20 Module 22 Temperature sensor

Claims (3)

筐体内に複数のモジュールが取り付け、取り外される電子機器の冷却装置において、
前記モジュールが装着される位置の上側であり前記筐体の上面に２次元的に配置され、回転数可変の複数の冷却用ファンと、
前記モジュールそれぞれに設けられる温度センサと、
これらの温度センサの検出温度に基づいて、複数の温度センサのうち検出温度の高い温度センサの上側に位置する前記冷却用ファンの回転数を上げる回転数制御部と、
前記冷却用ファンの回転数が最大であっても前記温度センサの検出温度が所定の温度を超えた場合、電子機器全体の電源をオフする電源遮断部と
を設けたことを特徴とする電子機器の冷却装置。 In a cooling device for an electronic device in which a plurality of modules are attached and removed from the housing,
A plurality of cooling fans that are two-dimensionally arranged on the upper surface of the housing above the position where the module is mounted;
A temperature sensor provided in each of the modules;
Based on the detected temperatures of these temperature sensors, a rotational speed control unit that increases the rotational speed of the cooling fan located above the temperature sensor having a higher detected temperature among the plurality of temperature sensors;
An electronic apparatus comprising: a power cutoff unit that turns off the power supply of the entire electronic apparatus when the detected temperature of the temperature sensor exceeds a predetermined temperature even when the number of rotations of the cooling fan is maximum Cooling system. 電源遮断部は、電子機器全体の電源をオフした場合であっても、前記冷却用ファンへの電力の供給を続けることを特徴とする電子機器の冷却装置。   The power supply cutoff unit continues to supply power to the cooling fan even when the power supply of the entire electronic device is turned off. 前記冷却用ファンは、前記筐体から外部に空気を排出するファンであることを特徴とする請求項１または２記載の電子機器の冷却装置。   3. The electronic apparatus cooling apparatus according to claim 1, wherein the cooling fan is a fan that discharges air from the housing to the outside.
JP2007190290A 2007-07-23 2007-07-23 Cooling device for electronic device Pending JP2009027051A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007190290A JP2009027051A (en) 2007-07-23 2007-07-23 Cooling device for electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007190290A JP2009027051A (en) 2007-07-23 2007-07-23 Cooling device for electronic device

Publications (1)

Publication Number Publication Date
JP2009027051A true JP2009027051A (en) 2009-02-05

Family

ID=40398556

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007190290A Pending JP2009027051A (en) 2007-07-23 2007-07-23 Cooling device for electronic device

Country Status (1)

Country Link
JP (1) JP2009027051A (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011100806A (en) * 2009-11-05 2011-05-19 Nec Corp Cooling device
JP2014072411A (en) * 2012-09-28 2014-04-21 Fujitsu Ltd Container type data center, air conditioning control program, and air conditioning control method
JP2014142708A (en) * 2013-01-22 2014-08-07 Fujitsu Ltd Container-type data center and method for controlling container-type data center
JP2015088672A (en) * 2013-10-31 2015-05-07 富士通株式会社 Cooling device and cooling method
JP5853072B1 (en) * 2014-08-25 2016-02-09 株式会社ＥｘａＳｃａｌｅｒ Electronic equipment cooling system
JP2016505116A (en) * 2013-01-30 2016-02-18 ゼットティーイー コーポレイション Subrack fan control method and apparatus
JP2016207782A (en) * 2015-04-20 2016-12-08 富士通株式会社 Electronic apparatus and cooling method
KR20170005626A (en) * 2015-07-06 2017-01-16 하이윈 테크놀로지스 코포레이션 Cooling method for multi-axis controller
US20170188484A1 (en) * 2015-12-28 2017-06-29 Lsis Co., Ltd. Fan assembly and electric power equipment having the same
WO2017197963A1 (en) * 2016-05-18 2017-11-23 中兴通讯股份有限公司 Speed regulation method, apparatus and system for fan of device
US10156876B2 (en) 2015-04-20 2018-12-18 Fujitsu Limited Electronic apparatus and cooling method thereof

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011100806A (en) * 2009-11-05 2011-05-19 Nec Corp Cooling device
JP2014072411A (en) * 2012-09-28 2014-04-21 Fujitsu Ltd Container type data center, air conditioning control program, and air conditioning control method
US9420726B2 (en) 2012-09-28 2016-08-16 Fujitsu Limited Container-type data center and air-conditioning control method
JP2014142708A (en) * 2013-01-22 2014-08-07 Fujitsu Ltd Container-type data center and method for controlling container-type data center
US9732759B2 (en) 2013-01-30 2017-08-15 Zte Corporation Method and apparatus for controlling subrack fans
JP2016505116A (en) * 2013-01-30 2016-02-18 ゼットティーイー コーポレイション Subrack fan control method and apparatus
JP2015088672A (en) * 2013-10-31 2015-05-07 富士通株式会社 Cooling device and cooling method
JP5853072B1 (en) * 2014-08-25 2016-02-09 株式会社ＥｘａＳｃａｌｅｒ Electronic equipment cooling system
WO2016031781A1 (en) * 2014-08-25 2016-03-03 株式会社ＥｘａＳｃａｌｅｒ System for cooling electronic equipment
JP2016207782A (en) * 2015-04-20 2016-12-08 富士通株式会社 Electronic apparatus and cooling method
US10156876B2 (en) 2015-04-20 2018-12-18 Fujitsu Limited Electronic apparatus and cooling method thereof
KR101717514B1 (en) 2015-07-06 2017-03-17 하이윈 테크놀로지스 코포레이션 Cooling method for multi-axis controller
KR20170005626A (en) * 2015-07-06 2017-01-16 하이윈 테크놀로지스 코포레이션 Cooling method for multi-axis controller
US20170188484A1 (en) * 2015-12-28 2017-06-29 Lsis Co., Ltd. Fan assembly and electric power equipment having the same
CN106917767A (en) * 2015-12-28 2017-07-04 Ls 产电株式会社 Fan component and the power equipment with the fan component
US9961801B2 (en) 2015-12-28 2018-05-01 Lsis Co., Ltd. Fan assembly and electric power equipment having the same
WO2017197963A1 (en) * 2016-05-18 2017-11-23 中兴通讯股份有限公司 Speed regulation method, apparatus and system for fan of device
CN107401520A (en) * 2016-05-18 2017-11-28 中兴通讯股份有限公司 A kind of equipment fan speed regulating method and device, system

Similar Documents

Publication Publication Date Title
JP2009027051A (en) Cooling device for electronic device
US7656664B2 (en) Airflow direction controlling apparatus
JP4606233B2 (en) Storage device, storage device fan control method, and fan control program
JP4554503B2 (en) Heat dissipation device and electronic device
US7218515B2 (en) Cooling fan with external circuit board
EP2020739B1 (en) Electric power conversion system
US7471513B2 (en) Information processing device and manufacturing method of the information processing device
US20090215380A1 (en) Fan module for failure backup
US20070096665A1 (en) Method and circuit for controlling motor speed
JP2008084173A (en) Information processor having cooling function
JP2002132387A (en) Control method for cooling fan and information processor
JP2010182786A (en) Electronic device and dust-proofing method for electronic device
KR100360446B1 (en) Structure of tower type pc
JP2005190316A (en) Electronic device
CN102548347B (en) Electronic equipment
JPWO2004075615A1 (en) Electronic device cooling structure and cooling method
US20130107439A1 (en) Electronic apparatus and cooling method thereof
JP2009266852A (en) Control device
JPH0661390A (en) Cooling structure of semiconductor integrated circuit element, semiconductor integrated circuit element cooling board provided therewith, and computer semiconductor integrated circuit element cooling structure provided therewith
US20170192472A1 (en) Arrangement for a computer system and computer system
JP2010263105A (en) Cooling system for electronic devices
JP2005057119A (en) Air cooling method and cooling device for electronic equipment
JP2006229118A (en) Method and device for stabilizing wind volume and electronic apparatus comprising it
JP2011066366A (en) Electric apparatus, and method of controlling rotation number of cooling fan
JP6094318B2 (en) Information processing apparatus and support apparatus