JP2008542578A - Insulating glass unit and method - Google Patents

Abstract

  The sealed multiple glazing window assembly consists of first and second glazing sheets formed from a transparent material. The first sealing member has an inner end and an outer end, and the inner end is sealed and attached to the peripheral portion of the first window glass sheet by diffusion bonding. The second seal member has an inner end and an outer end, and the inner end is sealed and attached to the periphery of the second window glass sheet by diffusion bonding, and the outer end is sealed to the outer end of the first seal member. Attached. The spacer assembly is disposed between the first and second window glass sheets, and maintaining the spacing defines a sealed cavity between the first and second window frames.

Description

  The present invention relates to a thermally insulated building window, and more particularly to a multiple pane frame unit having a vacuum or thermal insulation located in the space between the panes.

[Cross-reference of related applications]
This application includes US application 11 / 381,733 filed May 4, 2006 (Attorney Docket No. STRK-27,637), US application 11/381, filed May 4, 2006. 742 (Attorney Docket No. STRK-27663), US Provisional Application 60 / 678,570 (Attorney Docket No. STRK-27,067) filed on May 6, 2005, and August 11, 2005 Claiming priority benefits from US Provisional Application No. 60 / 707,367 (Attorney Docket No. STRK-27,275).

  US application 11 / 381,733 filed on May 4, 2006 (Attorney Docket STRK-27,637), US application 11 / 381,742 filed May 4, 2006 (agent) Person Reference Number STRK-27663) is currently one of US Patent No. 6,627,814, US Application No. 10 / 104,315 (Attorney Reference Number STRK-25,911) filed on March 22, 2002. Continuation of a part of US Application No. 10 / 133,049 (Attorney Docket No. STRK-26,033) filed on April 26, 2002, currently US Pat. No. 6,723,379 US Patent No. 6,962,834, which is a continuation of US Application No. 10 / 713,475 (Attorney Docket No. STRK-26,032) filed on November 14, 2003. , Which is a continuation-in-part of January 2004 pending which was filed on 27 days US application Ser. No. 10 / 766,493 (Attorney Docket No. STRK-26,581).

[Background of the invention]
Optical communications, photovoltaic cells, optical and micromechanical devices typically have active elements (ie, emitters, receivers, micromirrors, etc.) placed in sealed chambers to protect them from handling and other ambient hazards. To be packaged. In many cases, it is preferred that the chamber be sealed to prevent inflow, outflow or exchange of gas between the chamber and the surroundings. Of course, it is necessary to provide a window so that light or other electromagnetic energy of the desired wavelength can enter and / or exit the package. In some cases, the window will be visually transparent, eg, when visible light is involved, while in other cases the window may be visually opaque, even though it is visually opaque. It may be “optically” transparent to electromagnetic energy. In many cases, the window is given specific optical properties to enhance the performance of the device. For example, a glazed window may be ground and polished to obtain specific curve and planarity specifications in order to disperse in a specific pattern and / or avoid light curvature through it. In other cases, an anti-reflective or anti-reflective coating may be applied to the window to improve light transmission through the window.

  Window sealed microdevice packages have traditionally been produced using cover assemblies that typically have a metal frame and a glass pane. In order to obtain the necessary seal, the fusion of a glass pane (or other transparent window material) to a metal frame has traditionally been done by one of several methods. The first of these methods is heating in a furnace at a temperature that exceeds the glass transition temperature of the window, TG, and / or the softening temperature Ts of the window (usually 900 ° C. or higher). However, since the fusing temperature exceeds TG or Ts, the original surface finish of the glass frame is usually devastatingly damaged and both sides of the glazing are finished after fusing to obtain the required optical properties. Or it may be necessary to refinish (eg grinding and polishing). This polishing of the window glass requires additional process steps during the manufacture of the cover assembly, which tend to be relatively time and labor intensive, thus significantly increasing the cost of the cover assembly. As a result, the cost of the entire package increases. Furthermore, after fusing, polishing both sides of the glass requires that the glass protrude both above and below the attached frame. This limits cover assembly design options with respect to glass thickness, dimensions, etc., and can also lead to increased material costs.

  A second method for sealingly attaching the transparent window to the frame is to solder the two items using separate preforms made from a metal or metal alloy solder material. The solder preform is placed between a pre-metallized window and a metal or metallized frame, and soldering is performed in a furnace. During soldering, no great pressure is applied, i.e. the parts are connected with only enough force to keep them in place. For this type of soldering, the most common solder preform material is eutectic gold tin.

  The eutectic gold tin solder melts and solidifies at 280 ° C. Its coefficient of thermal expansion at 20 ° C. is 16 ppm / ° C. These two physical properties pose three difficulties for the reliability of the assembled window. First, the coefficient of thermal expansion of military standard Kovar from 280 ° C. to ambient temperature is about 5.15 +/− 0.2 ppm / 0 C, but most windowpanes intended to be sealed to Kovar are In the same temperature range, it has a higher average coefficient of thermal expansion. While cooling from a constant value of 280 ° C. to ambient temperature, the glass shrinks at a relatively higher rate than the Kovar frame to which it is attached. The cooled glass tends to crack because it will be under tension. To avoid cracking, the glass should have an average coefficient of thermal expansion that is identical to or slightly lower than Kovar so that after cooling it is unstressed or very slightly compressed It is. Using a solder with a relatively low liquidus / solidus temperature will cause the Kovar to have a relatively high average coefficient of thermal expansion, closer to the average coefficient of thermal expansion of the glass. However, this exacerbates the second difficulty of solder sealing using metals.

  A second difficulty in soldering glass to the Kovar frame is that the window assembly delaminates above the liquidus temperature of the solder used. Using a relatively low liquidus / solidus temperature solder further reduces application to window assemblies while reducing the coefficient of thermal expansion mismatch between Kovar and glass. Most lead-free solders have a liquidus / solidus temperature that is relatively higher than 183 ° C. for eutectic Sn / Pb. Surface mount technology (SMT) reflow ovens are designed to heat printed circuit board (PWB) assemblies 15-20 degrees above the liquidus / solidus temperature of the solder. Thus, SMT reflow soldering to PWB of a window MOEMS device manufactured using a relatively low melting point solder preform would cause window delamination when reflowing the solder of the window assembly. There may be an impact.

  A third difficulty is that the solder, which is an intermediate layer between glass and Kovar frame, has a coefficient of thermal expansion that is up to three times greater than the two materials to which it adheres. Ideally, the intermediate adhesive material will have a compensated coefficient of thermal expansion between the two materials to be joined.

  A third way to seal and attach the glass window to the frame is to solder two items using a solder glass material. Solder glass is a special glass with a particularly low softening point. They are used to bond glass to other glasses, ceramics, or metals without thermally damaging the material to be bonded. Soldering takes place in the viscosity range h, where h is in the range from 104 to 106 dPa s (Poise) for solder glass, which is generally in the temperature range T (glass Equivalent to solder or solder glass).

  Once a cover assembly having a sealed window is created, it is typically seam welded to the device base (ie, the substrate) to produce a finished sealed package. Seam welding welds the metal cover assembly to the package base by using an accurately applied AC current to produce a local temperature of about 1,100 ° C. at the frame / base junction and weld seal Form. To prevent glazing or package bowing, the metal frame of the cover assembly has a coefficient of thermal expansion (i.e., thermal expansion coefficient similar to that of the transparent window material and the package base. Should be machined from a metal or metal alloy having a modulus).

  Although the methods described above have traditionally produced suitable window assemblies for hermetically sealed microdevice packages, the relatively high cost of these window assemblies is a major obstacle for a wide range of applications. Become. Accordingly, there is a need for a package and component design and assembly method that reduces the labor costs associated with the production of each package.

  There is a further need for package and component design and assembly methods that minimize the manufacturing cycle time required to produce a finished package.

  There is a further need for package and component design and assembly methods that reduce the number of process steps required to produce each package. Reducing process steps reduces overhead / floor area required at production facilities, capital equipment required for manufacturing, and handling costs associated with transporting processed products between various steps in the process It will be understood that There may also be a reduction in labor costs. Naturally, such a reduction would further reduce the production costs of these sealed packages.

  There is a further need for package and component design and assembly methods that reduce the overall material costs associated with each package by reducing initial material costs and / or by reducing waste or losses during production. It is.

  Many types of multiple window frame insulation window assemblies are known. A conventional multiple window frame insulating window assembly consists of at least two panes bonded together by a frame that secures the space between them. The space is filled with air or a gas that is usually another thermal insulating material. Multiple window frame insulation window assemblies typically have more efficient thermal insulation than single glass windows, however, it is often desirable to improve insulation performance.

  A vacuum glass unit (VGU) is a window assembly that is similar to the insulating window assembly of a multiple window frame, except that a vacuum or incomplete vacuum is ensured in the space between the window panes. The purpose of this type of construction is to produce an insulating window unit having a relatively high level of thermal insulation that can be obtained from an insulating window assembly filled with air or gas. Until now, however, many problems have been plagued in producing durable and reliable VGUs. For example, it has proven difficult to obtain a seal between a glazing and a frame that has the necessary sealing properties to maintain a vacuum (or incomplete vacuum) for an extended period of time. Furthermore, it can withstand large and / or rapid temperature cycles (eg due to external temperature changes and / or use of high performance air conditioning systems) without eventually leaking or cracking , It has proven difficult to produce VGUs for external wall mounting (ie, for (exterior) walls and doors facing the outside of the building). Accordingly, there is a need for improved VGUs and methods for producing durable and reliable VGUs suitable for exterior walls and doors and other applications.

  The Department of Energy (DOE) proposal dated 10 June 2005 shows that the main technical challenges associated with high insulation fenestration products are relatively large sizes (~ 25 square feet and above), increased durability, excessive Including, but not limited to, weight, seal durability and high cost. Without an active program for changing the energy-related role of building windows, it is virtually impossible to meet the goals of zero-energy buildings. After the DOE Window Technology Industry Schedule (Roadmap), published by the Building Technology Authority, National Community Program (BTS), describes several areas of window technology that need improvement, such improvements High cost of improved products, cost and uncertain durability of existing high-insulation window technology, lack of industry cooperation in improving insulation technology and manufacturing methods, and high-risk, low-revenue investments for improved technology States that it is not realized due to factors including rate.

  In fact, the window industry has not been able to improve the basic technology or reliability of insulated windows for decades. The manufacturer uses an adhesive to join the window pane set to the intermediate spacer to obtain an airtight cavity between the panes. There is no airtightness of epoxy, glue, or anything else used today. There is a possibility of some gas exchange occurring in all. According to data published in 2002 by the Sealed Insulating Glass Manufacturers Association (SIGMA), the warranty requirement for installation of insulating glass (IG) window units due to seal defects is 4% after installation and 15 years after installation. It is almost 10%. Most window units do not specify a manufacturer. Many homeowners have chosen to live with or without being aware of window seal defects and moisture condensation between IG glazings that reduce energy efficiency. It is believed that most of the IG unit (IGU) seal defects are not included in the SIGMA data. The actual number of IGU seal defects 15 years after installation is unknown and is considered very high. These situations exploit us for energy.

  Several academic, corporate and government laboratories have tried to solve the leak seal problem while at the same time trying to achieve relatively high insulation values (relatively high R values, relatively low U values). It was. Those solutions contain a vacuum between windows # 1 and # 2 so that the unit provides higher insulation than the fill gas; mechanical spacers are used for window bars (ie, window frames) # 1 and # 2. Used to ensure separation (if the bars are in physical contact with each other, this creates an undesirable thermal path that substantially reduces the insulation value of the IG unit); (Usually use reflowed solder glass to seal the two bars that are strictly separated, and more commonly, use a laser to melt and match the two bars. All of the vacuum glass units currently being produced or described use tubes (ie pinch tubes) and after the tubes are sealed and closed, the IG unit is emptied; It has all of the common four matters.

  These experimental solutions have not been commercialized in the United States because they have been unsuccessful or have not proven to be reliable. The problem is that spacers are opaque and not aesthetically appealing, so they do not meet industrial needs; laser attempts at sealing have resulted in breakage of the beam due to thermal shock of the glass; High thermal conductivity between the inner peripheral surfaces of the glass bars; the sealing method is not suitable (easy to bend), and eventually the seals or bars are damaged due to stress; Inability to use some soft coat low emissivity coatings; and / or increasing the complexity of the unit and reducing its reliability when adding vacuum tubes.

  Therefore, there is a need for a vacuum glass unit (VGU) and an insulating glass unit (IGU) having an improved design that addresses some of the aforementioned problems with the present technology.

[Disclosure of the Invention]
The invention disclosed herein comprises, in one aspect, a sealed multiple glass window assembly. The window assembly comprises first and second window glass sheets formed from a transparent material. The first sealing member has an inner end and an outer end, and the inner end is sealed and attached to the peripheral portion of the first window glass sheet by diffusion bonding. The second seal member has an inner end and an outer end, and the inner end is sealed and attached to the periphery of the second window glass sheet by diffusion bonding, and the outer end is the outer end of the first seal member. Sealed and attached to the end. A spacer assembly is disposed between the first and second glazing sheets and maintains a gap thereby defining a sealed cavity between the first window frame and the second window frame.

  The invention disclosed herein, in another aspect thereof, comprises a method for manufacturing a sealed multiple glass window assembly. A first glazing sheet made of a transparent material and having a peripheral portion, and a first seal member having an inner end and an outer end are provided. The inner end of the first seal member is disposed with respect to the first window glass sheet. The inner end of the first sealing member is pressed with sufficient force against the first window glass sheet, and a predetermined first contact is made along a first joint between the inner end and the window glass sheet. Generate pressure. The first joint is heated to generate a predetermined first temperature along the first joint. The predetermined first contact pressure and high temperature are maintained until diffusion bonding is formed along the periphery of the first window glass sheet between the first seal member and the first window glass sheet. A second window glass sheet having a peripheral portion formed of a transparent material and a second sealing member having an inner end and an outer end are provided. The inner end of the second seal member is disposed along the periphery of the second window glass sheet. The inner end of the second seal member is pressed with sufficient force against the second window glass sheet, and a predetermined second contact is made along a second joint between the inner end and the window glass sheet. Generate pressure. The second joint is heated to generate a predetermined second temperature along the second joint. The predetermined second contact pressure and high temperature are maintained until diffusion bonding is formed between the second seal member and the second window glass sheet along the peripheral portion of the second window glass sheet. A spacer assembly is disposed between the first and second glazing sheets to maintain the spacing. A sealed cavity is defined between the first and second window frames by attaching the outer end of the first seal member to the outer end of the second seal member in a sealed state.

  The invention disclosed herein, in yet another aspect thereof, comprises a sealed multiple glass window assembly comprising a first window glass formed of a transparent material and having a perimeter. The first seal member has an inner end and an outer end. The inner end is sealed to the first window glass along the periphery. The second window glass is formed of a transparent material and has a peripheral portion. The second glazing is spaced from the first glazing. The second seal member has an inner end and an outer end. The inner end is hermetically attached to the periphery of the second window glass sheet, and the outer end is hermetically attached to the outer end of the first seal member. At least one of the first and second seal members is adapted to allow relative movement between the first glazing and the second glazing. Thus, a sealed cavity is formed between the first and second panes.

  The present invention addresses many of the limitations of the prior art, and in various embodiments, the following advantages are perpetuated: glass to metal, glass to glass and / or metal to metal bonding, i. Use diffusion bonding so that they cannot be disassembled by any known means so that they can last for years; the sealing system acts as a spring and is adapted (ie flexible) Incorporating a sleeve / frame unit (also called bellows), the window bars facing the outside (window # 1) will expand and contract due to temperature changes, independent of the bars facing the inside (window # 2) The glass sleeve is bonded to the glass beam using a diffusion bonding process of glass and metal, so that other known glass and gold can be bonded. The metal sleeve is thin and easy to bend, because the heat resistance of the metal sleeve is high, so that they do not adversely affect the overall insulation value; Can be used for any currently used glass installation and coating, including low emissivity coatings and UV block coatings, and is compatible with electrochromic coatings; Whether it is a fenestration product or a fenestration product, the unit of the present invention can be made thinner to reduce the weight and depth of the product; some of the spacer systems that are almost invisible from any viewing angle Or VGU and / or IGU with all.

  Further embodiments of the present invention address the need for a drop-in replacement system for the single glass window unit that is still in use in most US buildings. The IGU of the present invention is currently 6 mm (1 mm) in most US buildings so that a vast number of owners can save significant heating and cooling energy without incurring the high cost of replacing windows. / 4 inch) thick single glass window is thin enough to replace and can be economically installed.

  A further embodiment of the present invention creates an insulating window and addresses all of the DOE concerns and needs. In one such embodiment, the IGU of the present invention uses an incomplete vacuum instead of a fill gas to increase the insulation value.

  In another embodiment, the invention comprises an IGU containing a vacuum in the cavity between the set of panes. Vacuum is the ultimate thermal insulation. The higher the degree of vacuum, the fewer the molecules available to conduct heat between the set of panes. Thus, a window assembly containing a vacuum instead of gas will have the highest theoretical thermal insulation value (U value) of any window unit consisting of two or more window frames made of glass or other material.

  In a further embodiment, the present invention consists of an IGU having a fitted (flexible) metal sleeve / frame (also known as “bellow”) that seals the IG unit, and has high heat resistance (low heat) And at the same time provide high reliability and minimize the impact on the overall thermal performance of the unit.

  In a further embodiment, the present invention consists of an IGU using glass-to-metal diffusion bonding, and a flexible metal sleeve is bonded to the glass bar (windows # 1 and # 2). This bond is permanent because it is molecular in nature and is more sealable than any other known attachment method. The IGU may contain and maintain a vacuum for more than 80 years.

  In yet another embodiment, the present invention consists of an IGU that uses a unique glass-based glass spacer system in which the glass is standoff on the top and bottom substrate surfaces. Any coating that can be applied to the known IGU surface # 2 or # 3 can alternatively be applied to either surface of the glass spacer substrate. IGU surfaces # 2 and # 3 can be coated with a scratch-resistant thin film material, such as diamond-like coating (DLC), so that the glass spacers they support and the different movements of the crosspieces Do not scratch.

  In another embodiment, the present invention comprises an IGU having a relatively thin window that reduces the weight and depth of the fenestration product. The frame and associated structural material will also reduce weight.

  In a further embodiment, the present invention is thin or as thin as or thinner than the 6 mm (1/4 inch) thick single glass window currently installed in most homes. It consists of residential and small business IGUs that may simplify and / or reduce the cost of repairing super-insulated IG units for existing fenestration products.

  In a further embodiment, the present invention comprises an IGU that eliminates breakage due to expansion at high altitudes.

  The invention disclosed and required herein, in another aspect thereof, comprises a frame assembly for hermetically mounting on one side of a sheet of transparent material having a plurality of window opening regions defined therein, The window opening area is surrounded by a frame attachment area having a predetermined plan view. The frame assembly is composed of a plurality of continuous side walls surrounding a plurality of frame openings such that a part of the side walls is disposed between two adjacent frame openings. The side wall has an upper plan view configured to substantially correspond to the predetermined plan view of the frame mounting region of the seat. The side wall disposed between the adjacent frame openings includes two generally parallel side wall members having an overall vertical thickness and a first connection tab extending therebetween. When viewed in a cross-section perpendicular to the plan view, the configuration of the sidewalls disposed between adjacent frame openings is significantly greater than the overall vertical thickness of the adjacent side members. Characterized by the first connection knob having a thin, relatively constant thickness.

  The invention disclosed and required herein, in another aspect thereof, comprises a frame assembly for hermetically mounting on one side of a sheet of transparent material having a plurality of window opening regions defined therein, The window opening area is surrounded by a frame attachment area having a predetermined plan view. The frame assembly comprises a first layer having a plan view including a plurality of continuous side walls surrounding a plurality of frame openings so as to place a portion of the side walls between two adjacent frame openings. The side wall has an upper plan view configured to substantially correspond to the predetermined plan view of the frame mounting region of the seat. The second layer has a plan view that includes a plurality of continuous sidewalls. The sidewalls of the second layer have an upper plan view so that at least a portion of the plan view of the sidewalls of the first layer overlaps to the end of the periphery of each frame opening. The first and second layers are bonded together to create a hermetic frame that is hermetically sealed around each frame opening.

  The invention disclosed and required herein further comprises, in another aspect thereof, a sealed multiple glass window assembly. The window assembly consists of a spacer having continuous sidewalls that encloses and defines an opening therein. The side wall has an upper seal surface and a lower seal surface. The upper sealing surface is disposed on the upper side of the side wall and continuously surrounds the opening, and the lower sealing surface is disposed on the lower side of the side wall and continuously surrounds the opening. The window assembly further comprises first and second transparent glazing sheets. Placing the first sheet directly over at least a portion of the upper sealing surface in a continuous perimeter of the opening, and placing the second sheet in the subordinate in a continuous perimeter of the opening Positioning directly over at least a portion of the sealing surface defines a cavity surrounded by the side walls and the glazing sheet. Each of the first and second transparent glazing sheets is hermetically bonded to the spacer without using an unsealed adhesive to form a continuous sealed joint around the opening.

  The details of the present invention are set forth below with reference to certain preferred embodiments illustrated in the accompanying drawings.

[Detailed Description of the Invention]
With reference to FIGS. 1 and 2, a standard hermetically packaged microdevice for storing one or more microdevices is illustrated. For the purposes of this application, the term “microdevice” refers to an optical element, a photovoltaic device, an optical device (ie, including reflective, refractive and diffractive devices), electro-optic and electro-optical devices (EO devices), light emission. Device (LED), liquid crystal display (LCD), liquid crystal silicon (LCOS) technology including direct image laser amplifier (D-ILA), opto-mechanical device, micro-electro-electro-mechanical system (MOEMS) device and micro-electro-mechanical system (ie MEMS) device. The package 102 comprises a base or substrate 104 sealed to a cover assembly 106 comprising a frame 108 and a transparent window 110. The micro device 112 mounted on the base 104 is enclosed in the cavity 114 when the cover assembly 106 is joined to the base 104. One or more conductive lines 116 can carry power to, ground, and carry signals through the base 104 to or from the microdevice 112 in the package 102. It will be appreciated that the conductive lines 116 must also be sealed to preserve the integrity of the package 102. The window 110 is formed from an optically or electromagnetically transparent material. For the purposes of this application, the term “transparent” is a material that allows transmission of electromagnetic radiation having a predetermined wavelength, including but not limited to visible light, infrared light, ultraviolet light, microwaves, electromagnetic waves, or X-rays. Point to. Frame 108 is typically formed from a material that is a metal alloy, which preferably has a coefficient of thermal expansion close to that of both the window 110 and the package base 104.

  Referring to FIG. 3, an exploded view of a cover assembly manufactured in accordance with an embodiment of the present invention is shown. The cover assembly 300 includes a frame 302 and a sheet 304 of transparent material. The frame 302 has a continuous side wall 306 that defines a frame opening 308 therethrough. The frame sidewall 306 includes a frame seal ring region 310 (shown with cross-hatching) that surrounds the frame opening 308. Since the frame 302 is ultimately welded to the package base 104 (from FIGS. 1 and 2), it is typically formed from a weldable metal or alloy and has a very high coefficient of thermal expansion of the microdevice package base 104. It preferably has a close thermal expansion coefficient. However, in some embodiments, the cover assembly frame 304 can be formed from a non-metallic material such as ceramic or alumina. Regardless of whether the frame 302 is formed from a metallic material or a non-metallic material, the surface of the frame seal ring region 310 may be metal (eg, if not solid metal) to facilitate sealing the sheet 304 to the frame. Is preferably a plated metal). In a preferred embodiment, the frame is formed primarily from an alloy having a chemical composition of 54% iron (Fe), 29% nickel (Ni) and 17% cobalt (Co). The alloys are also known by ASTM F-15 alloy designations and Kovar alloy trade names. As used in this application, the term “Kovar alloy” is understood to mean an alloy having a chemical composition as described above. In embodiments in which the Kovar alloy frame 302 is used, the surface of the frame seal ring region 310 preferably has a gold (Au) surface layer overlying a nickel (Ni) layer or a nickel layer that does not overlay gold. The frame 302 also includes a base seal region 320 that is adapted for final bonding to the package base 104, typically by welding. The base seal region 320 often includes a nickel layer overlaid with a gold layer to facilitate seam welding to the package base. Gold on the nickel face layer is only required along the base seal ring region 320, but in many cases, for example, when using solution immersion plating to apply surface material, on the nickel layer. It will be appreciated that other gold may be applied to the entire surface of the frame 302. The sheet 304 is any type of transparent material, for example, soft glass (eg, soda lime glass), hard glass (eg, borosilicate glass), crystalline materials such as quartz and sapphire, or polycarbonate Polymer materials such as plastic. In addition to the optically transparent material, the sheet 304 is visibly opaque but may be transparent to invisible wavelengths of energy. As already discussed, the material of the sheet 304 has a coefficient of thermal expansion similar to the material of the frame 304 and the material of the package base 104 that ultimately welds the cover assembly. For many semiconductor photons, photovoltaic cells, MEMS or MOEMS applications, borosilicate glass is a suitable material for sheet 304. Examples of suitable glasses include Corning 7052, 7050, 7055, 7056, 7058, 7062, Kimble (Owens Corning) EN-1, and Kimble K650 and K704. Other suitable glasses include Abrisa soda lime glass, Schott 8245 and Sharam 60 from Ohara.

  Sheet 304 has a window 312 defined thereon, that is, it must remain transparent in order to allow proper functioning of the encapsulated or packaged microdevice 112. This is a part of the sheet 302 that should not be. Each sheet window 312 has a top surface 314 and a bottom surface 316, which are optically finished in the preferred embodiment. Sheet 304 is preferably procured in such a way that top surface 314 and bottom surface 316 of window 312 are readily available, but if necessary, the material may be ground and polished or otherwise The method can be formed into a desired surface shape and finished as a preliminary step in the manufacturing process. Often, the window 312 has a top surface 314 and a bottom surface 316 and is optically planar and parallel to each other, but in other embodiments, at least one of the finished surfaces of the window is curved. It will be understood. A seat seal ring region 318 (shown with cross-hatching) surrounds the window 312 of the seat 304 and provides a suitable surface for joining to the front of the seal ring region 310.

  Referring now to FIGS. 4a and 4b, a transparent sheet having a curved surface is illustrated. In FIG. 4a, the transparent sheet 304 'has a curved top surface 314' and a curved bottom surface 316 'that form a window 312 having a curved contour with a constant thickness. In 4b, the sheet 304 "has a curved upper side 314" and a planar bottom side 316 ", thereby providing a window 312 with an arrangement of plano-convex lenses. In a similar manner (not illustrated). The finished surfaces 314 and 316 of the window 312 can have a refractive lens configuration including a plano-convex lens, a bi-convex lens, a plano-concave lens or a bi-concave lens as previously shown. The finished surface of the window 312 can be provided with a Fresnel lens configuration or a diffraction grating configuration, ie, a “diffractive lens”.

  In many applications, it is desirable for the window 312 of the sheet 304 to enhance optical and physical properties. In order to obtain these properties, a surface treatment or coating can be applied to the sheet 304 before or during the assembly process. For example, the sheet 304 can be treated with silicon oxynitride (SiOn) to provide a harder painted surface for the window material. Regardless of whether or not it is treated with SiOn, the sheet 304 may be amorphous diamond-like carbon (DLC) such as that sold by Diamonex under the name Diamond Shield®. It may be coated with an anti-scratch / abrasion resistant material. Other coatings that can be applied in addition to or instead of SiOn or diamond-like carbon are types of optical coatings, anti-reflective coatings, refractive coatings known for use in lenses, windows and other optical elements Including, but not limited to, achromatic coatings, optical filters, solar energy filters or reflectors, electromagnetic interference (EMI) and radio frequency (RF) filters. It will be appreciated that the optical coating and / or surface treatment can be applied to either the top surface 314 or the bottom surface 316 of the window 312 or a combination of both surfaces. It will be further understood that the optical coatings and processes are not shown in the figure because of their transparent nature.

  In some applications, a visible aperture is obtained by first depositing a layer of opaque material, such as chromium (Cr), and sometimes coating the material over the entire surface of the sheet and etching the opaque material from the desired aperture area. Is formed around the window 312 of the sheet 304. This procedure provides a clear boundary to window 312 that is desirable in some applications. This operation can be performed before or after the application of other processes, depending on compatibility and process economics.

  The next step in manufacturing the cover assembly 300 is to pretreat the seat seal ring region 318 for metallization. A seat seal ring region 318 surrounds the window 312 of the seat 304 and is generally disposed around the bottom surface 316 for a single aperture cover. However, in some embodiments, the seat seal ring region 318 is internal to the seat, eg, a square to form a plurality of cover assemblies (ie, as described later herein). Can be cut into In general, the seat seal ring region 318 has a configuration that closely matches the frame seal ring region 310 that is ultimately joined. Formation of the seat seal ring region 318 may include thorough cleaning to remove any grease, oil or other contaminants from the surface and / or chemical etching, Roughening the seal ring area by laser cutting, mechanical grinding or sand blasting may be included. This roughening increases the surface area of the seat seal ring when the sheet seal ring is metallized prior to bonding to the frame seal ring region 310 or other substrate or device package base, and thus later metallization. The adhesion for welding the material can be increased.

  Referring to FIG. 5, a portion of the seat 304 placed on the bottom side is further illustrated to further illustrate the formation of the seat seal ring region 318. In this embodiment, the seal ring region 318 has a rough surface 501 to improve the adhesion of the applied metal layer. Chemical etching to roughen glass and similar transparent materials is known. Alternatively, laser cutting, conventional mechanical grinding or sand blasting can be used. Diamond grinding wheels are used for sapphire and other metallized materials, but a 325 grit grinding wheel is considered appropriate for most glass materials. The depth 502 through which the rough surface 501 of the seat seal ring region 318 penetrates the sheet 304 is due to at least two factors, one of which is the window bottom for the microdevice 112 attached to the package bottom and / or package. The desired mounting height of the bottom surface 316, another is due to the required thickness of the frame 306, including all deposited metal layers (described below). Etching or grinding the seat seal ring region 318 to a depth of 502 within a range of about 0 inches to about 0.05 inches during subsequent joining operations places the seat 304 in place with respect to the frame 306. It would be conceivable to provide sufficient adhesion to the metallized layer as well as providing an “edge” that can be easily detected.

  It will be appreciated that finishing surfaces 314 and / or 316 (eg, surfaces having optical activity in the finishing cover assembly) in the window 312 of the sheet are necessary or desirable to protect against damage during the roughening process. I will. In that case, the surfaces 314 and / or 316 may be covered with a semiconductor grade “adhesive tape” or other known protective material prior to roughening. Of course, the protective material must be removed in areas where etching or grinding is performed. Sandblasting is probably the most economical way to selectively remove the edge of the tape or protective material in the area to be roughened. When using sandblasting, it is possible to simultaneously perform the tape removal operation and the roughening of the underlying sheet.

  Referring to FIG. 6, a view of the seal ring region 318 of the sheet 304 after metallization is shown. The next step in the manufacturing process can apply one or more metal layers to the processed sheet seal ring region 318. In the present invention, several options are considered to achieve metallization. The first option is to apply a metal layer to the seat seal ring region 318 using conventional chemical vapor deposition (CVD) techniques. CVD techniques include atmospheric pressure chemical vapor deposition (APCVD), low pressure chemical vapor deposition (LPCVD), plasma assisted chemical vapor deposition (PACVD, PECVD), and photochemical vapor deposition (PCVD). Laser chemical vapor deposition (LCVD), metal organic chemical vapor deposition (MOCVD) and chemical beam growth (CBE). A second option for metallizing the roughened seal ring region 318 is to use physical vapor deposition (PVD) techniques. PVD techniques include sputtering, ion plasma assist, thermal evaporation, vacuum deposition, and molecular beam epitaxy (MBE). A third option for metallizing the roughened sheet seal ring region 318 is to utilize solution immersion plating technology (SBP). Solution immersion plating includes electroplating, chemical plating, and electrolytic plating. Solution immersion plating cannot be used to deposit an initial metal layer on a non-metallic surface such as glass or plastic, but can be used to deposit a subsequent metal or metal alloy to the first layer. Furthermore, in many cases, solution immersion plating is envisioned to be the most cost effective metal deposition technique. Since the use of chemical vapor deposition, physical vapor deposition and solution immersion plating to deposit metals and metal alloys is known, these techniques will not be described further here.

  A fourth option for metallizing the seat seal ring region 318 of the seat 304 is referred to as cold gas dynamic spraying and is also known as “cold spray”. The technology uses high-velocity gas jets to form a continuous metal coating at temperatures well below the melting temperature of the powder material, to target the powder metal, alloy, or metal and alloy Spraying the mixture. Details of the cold gas dynamic spraying method are disclosed in US Pat. No. 5,302,414 to Alkhimov et al. Aluminum has been found to give good results when applied to glass using cold gas dynamic spray deposition. The aluminum layer adheres fairly well to the glass and can create chemical bonds in the formation of aluminum silicate. However, other materials, including tin, zinc, silver and gold, can also be applied as the first layer using a cold spray. Cold gas dynamic spraying can be used at low temperatures (eg, near room temperature), so it has a relatively low melting point such as polycarbonate or other plastics, as well as metallizing traditional materials such as glass, alumina, and ceramic. Suitable for metallizing materials having

  It is conceivable that any of the first metal layers deposited on the sheet 304 could be chromium, nickel, aluminum, tin, tin-bismuth alloy, gold, gold-plated alloy, this list is more glass This indicates the order in which the degree of adhesion to is high. Other materials are also suitable. Any of these materials can be applied to the seat seal ring region 318 using any of the CVD methods or PVD (eg, sputtering) techniques described above. After the first layer 602 is deposited on the sheet seal ring region 318 of the non-metallic sheet 304, additional metal layers, such as the second layer 604, the third layer 606, and the fourth layer 608 (if applicable) are immersed in the solution. It can be added by any of the vapor deposition methods described above, including plating. Application of the following provisions is believed to result in satisfactory thicknesses for various metal layers. Rule 1: The minimum thickness is 0.002 microns, except for aluminum or tin based metals or alloys that bond to gold plated Kovar alloy frames. Rule 2: The minimum thickness for bonding an aluminum or tin based metal or alloy to a sheet or as a final layer and bonded to a gold plated Kovar alloy frame is 0.8 microns. Rule 3: The maximum thickness of aluminum or tin based metal or alloy deposited on the sheet or as the final layer and bonded to the gold plated Kovar alloy frame is 63.5 microns. Rule 4: The maximum thickness of the layer on which metal, other than chromium, is deposited on the sheet as the first layer and then other metals or alloys are deposited on top is 25 microns. Rule 5: The maximum thickness of metal, other than chromium, deposited on other metals or alloys as an intermediate layer is 6.35 microns. Rule 6: The minimum thickness that acts as solder to deposit metal or alloy on the sheet or as a final layer and adhere to the gold-plated Kovar alloy frame is 7.62 microns. Rule 7: Maximum thickness of 101.6 microns acting as solder to deposit metal or alloy on sheet or as final layer and adhere to gold plated Kovar alloy frame. Rule 8: The maximum thickness for chromium is 0.25 microns. Rule 9: The minimum thickness for gold plated solder applied by inkjet or provided as a pre-formed solder is 6 microns. Rule 10: The maximum thickness for gold-plated solder applied by inkjet or provided as a preformed solder is 101.6 microns. Specification 11: Minimum thickness for electroless zinc finish is 0.889 microns. It should be noted that the above provisions apply to metals deposited using all deposition methods other than cold gas dynamic spray deposition.

  The following provisions apply for cold spray applications: Rule 1: The minimum practical thickness for any metal layer is 2.54 microns. Rule 2: The maximum practical thickness for the first layer and all additional layers not including the final Kovar alloy layer is 127 microns. Rule 3: The maximum practical thickness of the final Kovar alloy layer is 12,700 microns, ie 0.5 inches.

  By way of example, but not by way of example, thermal processed (TC) bonding or sonic, ultrasonic or thermocompression bonding is used to bond processed sheet 304 to Kovar alloy-nickel-gold frame 302 (ie, initially The following combinations of metals are considered appropriate for the seal ring region 318: a Kovar alloy core plated with nickel and then gold.

  The assembly sequence can also initially bond the frame / spacer and window sheet together to form a sealed window unit, which can then be bonded to the substrate. A third assembly sequence can also first bond the frame / spacer and window sheet together, and then bond this substrate / frame / spacer unit to the window. In some examples, an intermediate material referred to as an interlayer material can also be used between the substrate and the frame / spacer and / or between the frame / spacer and the window sheet. Although the embodiments described herein are understood to be suitable for metallizing the seal ring surface of a sheet or lens prior to bonding in applications using metallization, diffusion bonding (ie, thermocompression bonding) In some other embodiments that use), all metallization of the seal ring area of the sheet or lens is excluded when the sheet / lens is bonded to the frame or to other substrates of the device package base be able to.

  By way of example and not limitation, if the processed sheet 304 is bonded to the Kovar alloy-nickel-gold frame 302 using thermal compression (TC) bonding or sonic, ultrasonic or thermocompression bonding: The metal combinations and thicknesses may be appropriate for the seal ring region 318.

  As indicated above, the above-described embodiments are understood to be suitable for use in thermocompression bonding, among other steps. TC bonding is a diffusion bonding process that brings two processed surfaces into close contact, and plastic deformation is introduced by the combined effect of pressure and temperature, causing the crystal lattice to advance, and connecting the gaps between the contact surfaces. In turn cause atomic motion. TC bonding can be performed at a much lower temperature than many other types of forms such as soldering solder.

Referring to FIG. 7, a cross-sectional view of a pre-made frame 302 suitable for use in this embodiment is shown. The illustrated frame 302 includes a Kovar alloy core 702, or a core of a different metal or alloy, which is overlaid with a first metal layer 704 of nickel and, in turn, an outer layer of gold 706. A temperature of 30 ° C. to 300 ° C. within a range of about 5.0 · 10 ⁻⁶ / K to about 5.6 · 10 ⁻⁶ / K (eg, about 5.0 to about 5.6 ppm / K) Because of the coefficient of thermal expansion over the range, the use of Kovar alloy for the core 702 of the frame 302 uses a hard glass such as Corning 7056 or 7058 for the sheet 304 and a Kovar alloy or similar material for the package base 104. It is preferred that

  Still referring to FIG. 7, the next step in the manufacturing process is the formation of a prepared frame 302 for joining the sheets 304. As described above, the frame 302 includes a continuous sidewall 306 that defines and passes through the opening 308. Side wall 306 includes a frame seal ring region 310 on its upper surface and a base seal ring region 320 on its lower surface. The frame seal ring region 310 is generally sized to match the sheet seal ring region 318 of the transparent sheet 304, while the base seal ring region 320 generally matches the corresponding seal region on the package base. It is a big size. The frame 302 can be manufactured using a variety of conventional metal forming techniques including stamping, casting, die casting, extrusion / split, and machining. It is contemplated that stamping or die casting is the most cost effective method for the production of frame 302. However, processing the frame 302 using photochemical processing (PCM) is also a method known as chemical etching and, in some embodiments, the most economical method. In some embodiments, several sheets of photochemically processed (ie, etched) metal and / or alloy can be bonded together to form frame 302. One bonding method is TC bonding, also known as diffusion bonding, where multiple PCMed layers can be combined to produce frame 302. Depending on the flatness required by the scheduled bonding procedure and the degree achieved by the particular frame manufacturing method, surface grinding and / or lapping or polishing provides the final flatness required for successful hermetic packaging. Therefore, the frame seal ring region 310 or the base seal ring region 320 may be necessary.

  In this embodiment, the base seal ring region 320 is on the frame surface facing the frame seal ring region 310 and uses the same layer of nickel 704 overlaid with gold 706, and finally is welded to the package base 104. Can be promoted. In some embodiments, gold 706 may not be overlaid with nickel 704.

  In some embodiments, the frame 302 serves as a “heat sink” and / or “heat spreader” when the cover assembly 300 is ultimately welded to the package base 104. It is contemplated that conventional high temperature welding processes (eg, manual or automatic electrical resistance seam welding or laser welding) can be used for this task. When using these welding processes to weld the metalized glass sheet 304 directly to the package base 104, concentrated heat can cause thermal stress that can crack the glass sheet or distort its optical properties. Can cause. However, when joining a metal frame to a transparent sheet, the metal frame is wider so as to reduce the thermal stress of the heat sink that absorbs the welding heat and the transparent sheet 304 and minimize the possibility of cracking or optical distortion. It acts as both a heat spreader that dissipates heat in the region. Kovar alloys are particularly useful in this heat sink and heat spreader, as explained by 0.0395, which is about 14 times higher than the thermal conductivity of Corning 7052 glass, which is about 14 times higher than the thermal conductivity of 0.0028.

  Another important aspect of the frame 302 is that it should be formed from a material having a thermal expansion coefficient similar to that of the transparent sheet 304 and the thermal expansion coefficient of the package base 104. Coefficient of thermal expansion between the frame 302, the transparent sheet 304 and the package base 104 ensures long-term reliability of the hermetic packaging between these components under thermal cycling conditions and / or thermal shock environments. After connecting to each other, it is beneficial to minimize the stress between them.

  For window assemblies that are joined to a package base formed of ceramic, alumina, or Kovar alloy, Kovar alloy is preferably used as the material for frame 304. It will be appreciated that in many embodiments detailed herein, Kovar alloy is used for the frame, but not necessarily suitable for use with all transparent sheet materials. In addition, other frame materials of Kovar alloy may be suitable for use with glass. Its suitability is determined by the requirement that the material of the transparent sheet 304, the material of the frame 302, and the material of the package base 104 all have substantially matching coefficients of thermal expansion in order to ensure the long-term reliability of the sealed packaging. The

  Referring to FIG. 8, the next step in the manufacturing process is to ensure that at least the frame seal ring region 310 and at least a portion of the seat seal ring region 318 are joined together along a continuous connection region 804 that surrounds the window 312. Positioning 302 with respect to the sheet 304. In essence, in some examples, the plasma cleaning operation and / or the solvent or cleaning cleaning operation may be performed immediately before joining the components to ensure maximum joining reliability and any other Performed on the sealing surface. In FIG. 8, the sheet 304 moves from its original position (indicated by a broken line) before joining with the frame 302. Of course, first of all, any remaining adhesive tape or other protective material from the work used to pre-treat the seat seal ring region 318 can be used in the joining process without the deterioration of the protective material and / or its adhesive. If it cannot withstand the high temperatures it encounters and it is used to adhere the cover to the sheet, it must be removed. The seat seal ring region 318 and the frame seal ring region 310 need not have an exact match with respect to the entire region, but rather some number of two seal ring regions between the two seal ring regions that form a continuous connection region 804 that surrounds the window 312. It will be understood that it is only necessary that there is a match. In the embodiment shown in FIG. 8, the metal layer 610 in the seat seal ring region 318 is much wider than the plated outer layer 706 in the frame seal ring region 310. Further, the window 312 of the sheet 304 partially extends through the frame opening 308 and provides a means for centering the sheet 304 in the frame 302.

  The next step in the manufacturing process is to heat the connection region 804 until a bond is formed between the frame 302 and the sheet 304 along all of the connection region to form a weld seal surrounding the window 312. It is to be. During the heating step of the connection area 804, the temperature of the window 312 of the sheet 304 is lower than TG, which is the transition temperature of the glass at the same time as the sheet 304 softening temperature to prevent damage to the finished surfaces 314 and 316. maintain. The softening point of glass is defined as a temperature having an adhesiveness of 107.6 dPas or 107.6 poise (measurement method: ISO 7884-3). The present invention considers several options to achieve this heating. The first option utilizes thermal compression (TC) bonding, also known as diffusion bonding, including conventional hot compression bonding as well as hot isostatic pressing or hot isostatic pressing (HIP) diffusion bonding. It is to be. As mentioned above, TC bonding, also known as diffusion bonding, involves the application of high pressure to the material to produce the required diffusion bonding and may require lower temperatures. Joined. The rules for determining the thickness and composition of the metal layer 610 on the sheet 304 have been shown previously for TC bonding to, for example, Kovar alloy, nickel or gold frames as shown in FIG. The estimated process variables for TC bonding of Kovar alloy / nickel / gold frame 302 to metallized sheet 304 with aluminum as the final layer is about 380 ° C. at an applied pressure of about 95,500 psi (671.65 kg / cm 2). Temperature. Under these circumstances, the gold plating 706 on the Kovar alloy frame 302 diffuses / both into the aluminum layer, eg, layer 4 in Example 7. Because the 380 ° C. coefficient of thermal expansion required for TC bonding is lower than between about 500 ° C. and 900 ° C. for hard glass such as Corning 7056, TC bonding is a cover assembly component together in a compressed state. It can be implemented in single mode or batch mode by placing the assembly 302, 304 fixed and compressed at about 380 ° C. in a furnace (or oven, etc.). A hermetic bond can be obtained without risk to the finished surfaces 314 and 316 of the window 312. A vacuum, sometimes an environment containing a certain small amount of gas, or other environment with negative pressure, positive pressure is required in the furnace to facilitate the TC bonding process.

  Alternatively, using resistance welding at the connection region 804 to apply additional heat in addition to TC bonding allows the window assembly to be preheated below 380 ° C., reducing the overall bonding process time. To do. Alternatively, TC coupling can be achieved by securing cover assembly components 302 and 304 using a heated tool that heats connection region 304 by conduction. In yet another alternative, electrical resistance welding can provide the 100% heat required to achieve the required TC bonding temperature, thereby heating furnaces, ovens, etc. Or the need for a dedicated thermally conductive tool can be eliminated.

  After completing the TC bonding or other welding process, after assembly, during cleaning, marking, or other operations, the window assembly 300 is the final process, for example, smoothing edges and chipping, scratching, marking, etc. It is possible to proceed to a pretreatment of the chamfering of the edge of the cover assembly to avoid. In some examples, the final step can include the use of various coatings on windows and / or frames.

  Referring to FIG. 9, a block diagram of the manufacturing process described above according to an embodiment of the present invention is illustrated. Block 902 represents the step of obtaining a sheet of transparent material, such as glass or other material, having a top and bottom surface as described above. The process proceeds to block 904 as indicated by the arrow.

  Block 904 represents the step of surface treatment of the sheet, eg, anti-scratch coating or anti-reflection coating, as described above. Further, in addition to these permanent surface treatments, block 904 shows a sub-step in which tape or other temporary protection is used to protect the face of the sheet in subsequent steps. It will be appreciated that the steps indicated by block 904 are optional and that one or more of these steps may not be shown in all embodiments of the invention. Thereafter, the process proceeds to block 906 as indicated by the arrow.

  Block 906 shows the step of pre-treating the seal ring area in the sheet to provide better adhesion to the metal layer if that metal layer is used. This step typically involves roughening the seal ring area using chemical etching, mechanical grinding, laser cutting, or sand blasting as described above. To the extent required, block 906 also shows a sub-step of removing any protective material from the seal ring area. Further, block 906 represents an optional step of cleaning the sheet (or at least the seal ring area of the sheet) to remove any grease, oil, or other contaminants from the surface of the sheet. As previously discussed, the cleaning step is such that the seal ring region is metallized (i.e. to promote better adhesion of the metal layer) or remains unmetallized (i.e. non-metallized sheet). To promote better diffusion bonding). It will be understood that the steps indicated by block 906 are optional and some or all of these steps are not shown in all embodiments of the invention. The process then proceeds to block 908 as indicated by the arrow.

  Block 908 shows the step of metallizing the seal ring area of the sheet. The step represented by block 908 is only required if the desired bond of the sheet 304 to the frame 302 is an inter-metal bond. This is because at least one metal layer must be used in the seal ring area of the sheet. As an example of using the diffusion bonding process, the sheet 304 can be bonded to the frame 302 without first metallizing the sheet 304. In most embodiments, block 908 shows a number of sub-steps for using a continuous metal layer on the sheet, each sub-step layer comprising CVD, PVD, cold spray or solution immersion plating as described above. Can be used in the process. Following the steps indicated by block 908, the sheet is ready to be joined to the frame. However, the process must first form a suitable frame before it can proceed to the main joining step (ie, block 916).

  Block 910 represents the step of obtaining a prefabricated frame that preferably has a thermal expansion coefficient that substantially matches the thermal expansion coefficient of the transparent sheet from block 902 with the thermal expansion coefficient of the package base. In most cases where the base is alumina or Kovar alloy, a frame made of Kovar alloy is suitable. As described above, the frame can be formed using stamping, die casting, or other known metal forming processes. Thereafter, the process proceeds to block 912 as indicated by the arrow.

  Block 912 includes a frame seal ring to increase its flattening so that it can be closely fitted as needed to the seal ring region of the transparent sheet by grinding, polishing and / or other methods. The step of planarizing the region is shown. It will be appreciated that the steps indicated by block 912 are optional and may not be required or shown for all embodiments of the invention. Thereafter, the process proceeds to block 914 as indicated by the arrow.

  Block 914 shows the step of using an additional metal layer for the seal ring area of the frame. These metal layers are sometimes necessary to achieve compatible chemical reactions for joining at the metallized seal ring region of the transparent sheet. In most implementations, block 914 shows a number of substeps for using a continuous metal layer for the frame. Further, block 914 represents an optional step of cleaning the frame (or at least the seal ring area of the frame) to remove any grease, oil or other contaminants from the surface of the frame. As previously discussed, the cleaning step may be performed regardless of whether the seal ring region of the frame is metallized with or without an additional metal layer. When the step indicated by block 914 is complete, the frame is ready to be connected to a transparent sheet. In this way, as a result of both block 908 and block 914, the process proceeds to block 916, as indicated by the arrows.

  Block 916 secures the prefabricated frame with the prefabricated transparent sheet so that the respective metallized seal ring regions can contact each other under conditions that cause a predetermined contact pressure at the connection region surrounding the window. Steps are shown. The pre-determined contact pressure between the seal ring surfaces is lower than that required for conventional welding (including most soldering and brazing processes), and heat compression (TC) of the metallized surface. Allows joining to occur. The process then proceeds to block 918 as indicated by the arrow.

  Block 918 illustrates applying heat to the bond between the frame and the transparent sheet while maintaining a predetermined contact pressure until the temperature is sufficient to cause a hot compression bond. In some embodiments, block 918 represents a single heating step, such as overheating the assembly secured in the furnace. In other embodiments, block 918 may include, for example, preheating the assembly (eg, in a furnace) initially fixed to an intermediate temperature, and then the temperature of the local region of the metal layer to the temperature at which thermal compression bonding occurs. Several sub-steps are shown that apply heating to the joint area, such as using resistance welding techniques with the joint to increase the speed. Hot compression bonding creates a welded seal between the transparent sheet material and the frame. Thereafter, the process proceeds to block 920 as indicated by the arrow.

  In the illustrated embodiment, the metallized seal ring region is removed using diffusion bonding / thermocompression bonding where a predetermined pressure is first applied (block 916) and then heat is applied (block 918). Join. However, it will be understood that the use of diffusion bonding is not limited to these particular situations. In some other embodiments, the sheet and / or frame will not be metallized prior to joining. In yet other embodiments, the heating is initially applied until a desired bonding temperature is reached, and a predetermined pressure can then be applied until a diffusion bond is formed. In still further embodiments, the heating and pressure can be applied simultaneously until a diffusion bond is formed.

  Block 920 shows the step of completing the window assembly. Block 920 indicates a simple window assembly cooling step after thermocompression bonding, or chamfering the edges of the assembly to avoid chipping, cracking, etc., marking the assembly, windows using one or more materials, and / or Alternatively, additional final steps may be indicated, including frame coating or other post-assembly procedures. The process of this embodiment is thus described.

  In another embodiment of the present invention, it is understood that conventional welding techniques (including soldering and / or brazing) can be used instead of hot compression bonding to join the frame to the transparent sheet. Will. In such an alternative embodiment, the steps shown in blocks 916 and 918 of FIG. 9 include a frame and a transparent so that the metallized seal ring regions can contact each other (no need to create a predetermined contact pressure due to bonding). Fixing the sheets together, and then applying heating to the joint area using conventional means until the temperature is sufficient to cause the melting and diffusion of the metal layers necessary to achieve the weld joint Can be replaced in the step.

  In another embodiment, brazed solder is used to join the frame 302 to the metallized sheet 304. In this embodiment, a soldering metal or soldering alloy can be used as the final layer of the metal layer 610 on the metallized sheet 304, and the step of securing the sheet 304 to the frame 302 with a high predetermined contact pressure. do not need. The soldering metal or soldering alloy preform is used between the frame 302 and the sheet 304 instead of having the soldering metal or soldering alloy as the final layer of the metal layer 610 in the metallized sheet 304. Available as a separate intermediate product. Mild to moderate clamping pressures 1) to ensure placement during the melting phase of the solder, and 2) further distribute the distribution of all molten solder along the connection area between each seal ring area Although it can be used to facilitate, thereby helping to ensure a weld seal, this clamping pressure does not contribute to the process of joining itself in TC bonding. However, in most other respects, this embodiment is very similar to that described above.

  Without being limited, the following example details the metal layer 610 in the sheet seal ring region 318 suitable for brazing and soldering to a Kovar alloy / nickel / gold frame 302 as illustrated in FIG. Provided to show.

  Many examples here show the use of eutectic Au-Sn systems, but other applications include non-eutectic Au-Sn systems, or other eutectic or non-eutectic systems for bonding windows. Crystal solder can be used. This makes it possible to bond higher level assemblies without melting the window joints, allowing subsequent use of solder with higher melting temperatures thereafter.

  By way of example, and not by way of limitation, for the metal layer 610 in the seat seal ring region 318 for brazing and soldering to a Kovar alloy / nickel / gold frame 302 as illustrated in FIG. Is preferred.

  Referring to FIG. 10, the present invention shows yet another embodiment. Note that in this embodiment, the cover assembly 300 is circular rather than rectangular in construction. It will be understood that this is just another configuration for a cover assembly manufactured in accordance with the present invention, and that this embodiment is not limited to any particular configuration. As in the previous embodiment, this embodiment also uses brazed solder to hermetically bond the transparent sheet 304 to the frame 302. However, in this embodiment, the solder for brazing solder is provided in the form of a separate solder preform 1000 having the form of a seat seal ring region 318 or a frame seal ring region 310. Further, in this embodiment, the preform 1000 can be a material other than solder for use as an inner or intermediate layer material between the transparent sheet 304 and the frame 302. When used as an inner or intermediate layer for TC bonding, one or more components of preform 1000 diffuse with one or more components of sheet 304 and frame 302.

  In this embodiment, if the solder preform 1000 is used for brazing solder to hermetically join the transparent sheet 304 to the frame 302 instead of positioning the frame and sheet directly to each other, the frame 302 and sheet 304 is positioned against the opposite side of the solder preform 1000 so that the solder preform can intervene between the frame seal ring region 310 and the seat seal ring region 318 along a continuous connection region surrounding the window 312. It is done. After the frame 302 and the sheet 304 are positioned relative to the solder preform 1000, the connection area until all of the frames and sheets along the connection area are fused to form a solder joint between the frame and the sheet. Is heated. The heating of the connection area is performed in any of the foregoing procedures, including heating or preheating in a furnace, oven, etc., alone or in combination with other heating methods including resistance welding. During the step of heating the connection area, the temperature of the window 312 of the sheet 304 needs to be kept below the glass transition temperature TG and the softening temperature so as not to adversely affect the finished surfaces 314 and 316 on the sheet. .

  This embodiment using a solder preform 1000 can be used to join a metallized sheet 304 to a Kovar alloy / nickel / gold frame, as shown in FIG. According to a preferred embodiment, the solder preform 1000 forms a gold tin (Au—Sn) alloy, and in a further preferred embodiment the gold tin alloy is a eutectic composite. One other alloy for the preform 1000 is tin-copper-silver (Sn-Cu-Ag). The thickness of the gold tin preform 1000 is probably in the range of about 6 microns to about 101.2 microns. Other alloy thicknesses for preform 1000 are probably in the range of about 6 microns to about 101.2 microns.

  The following examples, which should not be considered limiting, are provided to show details of the metal layer 610 and the seat seal ring region 318, which includes, but is not limited to, a tin-copper-silver alloy, gold Suitable for brazing solder to Kovar alloy / nickel / gold frame in combination with a preform of tin or other suitable solder alloy.

  By way of example, and not limitation, the following combinations are combined with a gold-tin solder preform to braze to a Kovar alloy / nickel / gold frame for brazing and a metal layer 610 and a sheet seal: Preferred for ring region 318. In addition to having a Kovar alloy / nickel / gold frame, any material other than Kovar can be used as the base material for the frame, the layer or layers being nickel without using gold, or nickel And a combination of two or more metals, including but not limited to gold.

  Referring to FIG. 11, yet another embodiment of the present invention is illustrated. This embodiment also uses solder, but in this embodiment, soldering is applied through inkjet technology to either the metallized region 610 in the seat seal ring region 318 or the seat seal ring 310 of the frame assembly. . FIG. 11 shows a portion of a Kovar alloy / nickel / gold frame 302 (or other frame alloy and overlay combination) and an ink jet dispenser tip 1102, as shown by arrow 1106. When moving around the frame opening 308 or under the tip of the dispensing device, the solder droplet 1104 is dispensed onto the frame seal ring region 310. Preferably, the inkjet dispense solder is a gold-tin (Au—Sn) alloy, and more preferably, eutectic assembly. In this embodiment, the preferred thickness of the gold tin solder applied to the dispenser tip 1102 is in the range of about 6 microns to about 101.2 microns. The embodiment shown in FIG. 11 shows a dispenser tip 1102 that deposits solder droplets 1104 on the frame 302, but in other embodiments, ink jet deposited solder is applied to the frame seal ring region 310. It will be appreciated that the seat seal ring region 318 may be applied either alone or in combination. In yet other embodiments, the ink jet deposited solder may be used to create a preform for discrete solders used as described herein in the previous examples. In yet another embodiment, an ink-jet deposition material, whether or not soldered, can be used to make an inner layer or intermediate layer preform, such as TC bonding or as described herein in the previous examples. Used for intended use in HIP diffusion bonding. Details of the metal layer 610 in the seat seal ring region 318, suitable for soldering to a Kovar alloy / nickel / gold frame 302 as shown in FIG. Substantially similar to the layers shown in Examples 21-32.

  With reference to FIGS. 12a to 12c and FIGS. 13a to 13c, yet another alternative method for fabricating a cover assembly for constructing another embodiment of the present invention is illustrated. In the above embodiment, separate prefabricated metal frames were joined to the transparent sheet to serve as a heat spreader / heat sink required for subsequent welding, whereas in this embodiment, cold gas dynamic The thermal spray deposition process is used to directly process a metal frame / heat spreader on a transparent sheet material. In other words, in this embodiment, the frame is processed directly into the transparent sheet as an indispensable part and does not require a subsequent joining operation. Further, since cold gas dynamic spray deposition can be achieved at about room temperature, this method is particularly useful for transparent sheet materials and / or surface treatments having relatively low TG, melting temperature, or other heat resistant conditions. .

  With particular reference to FIG. 12a, a sheet of transparent material 304 having a window 312 as defined above is illustrated. The window 312 has a finished top surface 314 and bottom surface 316 (note that the sheet 304 is shown with the bottom up in FIGS. 12a to 12c). A frame bonding area 1200, which is a frame bonding area surrounding the window 312, is defined in the sheet 304. In the embodiment shown in FIGS. 12a-c, the frame bonding area 1200 follows a specific boundary of the window area 312 (ie, circular in this case) as long as the frame bonding area 1200 completely surrounds the window. It will be understood that it is not necessary.

  Unless otherwise noted, the first step of obtaining a transparent sheet with a finished top and bottom window is to pre-treat the seal ring area of the sheet and metallize the seal ring area of the sheet It will be appreciated that the steps are substantially similar to those described in the previous embodiments and will not be described in detail again.

  Also, referring to FIG. 13 a, a partial cross-sectional view is shown at the end of the sheet 304. In this embodiment, the step of pre-processing the frame bonding area 1200 on the sheet 304 is an optional step of roughening the frame bonding area by roughening and / or its original level to form the recess 1302. Grinding the surface from (shown in broken lines). After the frame bond area 1200 is pretreated, a metal layer is deposited on the frame bond area of the sheet using cold gas dynamic spray deposition. In FIG. 12b, the initial metal layer 1202 is applied to the frame adhesion area 1200 using cold gas dynamic spray deposition.

  Referring also to FIG. 13 b, the cold gas dynamic spray nozzle 1304 illustrates the step of depositing a jet of metal particles 1306 in the frame adhesion region 1200. Here, the first layer 1202 is overlaid with the second layer 1204 and the spray nozzle 1304 is shown when deposition begins on the final Kovar alloy layer 1206. Layer 1206 need not be Kovar.

  Referring to FIGS. 12c and 13c, the completed cover assembly 1210 includes an integral frame / heat spreader 1212 that is assembled from a layer 1206 to a predetermined height, indicated by reference numeral 1308, and the finished surface of the sheet. Shown above. In a preferred embodiment, the predetermined height 1308 of the assembled metal frame above the frame bonding area 1200 is about 5% to about 100% of the thickness indicated by the reference numeral 1310 of the sheet 304 directly below the frame bonding area. Within range. In the embodiment shown here, depositing the metal using a cold gas kinetic spray included depositing a layer of Kovar alloy on the sheet to fabricate the assembly frame / heat spreader 1212. The use of cold gas dynamic spray deposition allows for a tremendous range of Kovar alloy layer thickness, which is in the range of about 2.54 microns to about 12,700 microns. Of course, it will be appreciated that the frame / heat spreader 1212 can be processed through the deposition of other materials than Kovar alloys, depending on the nature of the transparent sheet 304 and the package base 104, particularly the respective thermal expansion coefficients.

  The following examples, which should not be considered as limiting, show details of the metal layers collectively denoted by reference numeral 1207 to form a frame / heat spreader that is compatible with hard glass transparency and Kovar alloy or ceramic package bases. Provided to show. According to the characteristics of the transparent sheet 304 and the package base 104, in particular the respective coefficients of thermal expansion, whenever a Kovar alloy is indicated as the final layer, a deposition step of other materials than the Kovar alloy may be used as the final layer. Will be understood.

  By way of example but not limitation, the following combinations are preferred for the metal layer 1207 to form a frame / heat spreader that is compatible with a hard glass transparency and Kovar or other alloy or ceramic package base. According to the characteristics of the transparent sheet 304 and the package base 104, in particular the respective coefficients of thermal expansion, whenever a Kovar alloy is indicated as the final layer, a deposition step of other materials than the Kovar alloy may be used as the final layer. Will be understood.

  After the deposition of the metal layer using cold gas dynamic spray deposition, the top surface of the assembly frame 1212 is removed before performing additional steps to ensure that the desired bond is made in a subsequent bond. It may be necessary to grind or shape to a predetermined plane. Another process that can be used either alone or in combination with molding the top surface of the assembly frame is the step of depositing an additional metal layer on the assembly frame / heat spreader 1212 using solution immersion plating. is there. What is the most common reason for using this plating layer? This is to facilitate desirable bonding when the frame / heat spreader is adjacent to the package base 104. In a preferred embodiment, the additional metal layer applied to the assembly frame 1212 has a thickness in the range of about 0.002 microns, and in some cases about 25 microns, on a metal directly deposited with a cold gas dynamic spray. Followed by solution dip plating a gold layer onto the nickel layer until the metal layer has a thickness in the range of about 0.0508 microns to about 0.508 microns.

  Referring to FIG. 14, a block diagram of another embodiment using cold gas dynamic spray deposition is shown. If not specified otherwise, it will be understood that the first step of obtaining a transparent sheet with a finished surface is the step of applying a surface treatment to the sheet, the cleaning step, the roughening step or it It will be appreciated that pre-treating the frame-bonded area of the sheet in a manner other than is substantially similar to the steps described in the previous embodiments and will not be described in detail again. For example, block 1402 of FIG. 14 shows the steps of obtaining a sheet of transparent material having a finished surface and corresponds directly with block 902 and description of the appropriate transparent material. Similarly, unless otherwise noted, blocks 1404, 1406, and 1408 of FIG. 14 correspond to blocks 904, 906, and 908 of FIG. 9, along with the previous description of the steps and substeps provided herein. Thus, in the previous (i.e. preprocessed frame) implementation, all options described for performing the various steps and sub-steps indicated by blocks 902 to 908 are current (i.e., cold). It will be appreciated that the spray embodiment is applicable to blocks 1402 to 1408.

  The next step in the process is the use of cold gas dynamic deposition deposition to deposit the frame / heat spreader metal on any previously deposited metal layer in the frame adhesion area 1200. This step is indicated by block 1410. As described above in connection with FIGS. 13b and 13c, the high velocity particles 1306 exiting the gas nozzle 1304 form a new layer on the previous metal layer and repeatedly apply a cold spray spray through the frame bonding area 1200, The new material can be a continuous metal layer around the entire surface of the frame bonding area, i.e. can surround the window 312 of the transparent sheet 304. If the material of the package base 104 (the package base to which the cover assembly 1210 is ultimately bonded) is Kovar alloy or suitably metallized alumina, the Kovar alloy will be cold sprayed to form an integral frame. Is suitable for material 1206. In other cases, a heat spreader material having a thermal expansion coefficient that approximately matches the thermal expansion coefficient of the package base 104 should be selected. Of course, the material must also be compatible with the cold gas welding process.

  Cold gas welding of the powder heat spreader material is continued until the new layer 1206 reaches the thickness required to serve as a heat spreader / integral frame. This marks the end of the process shown in block 1410. For some applications, the assembled heat spreader / frame 1212 is now complete and ready for use. However, for other applications, it is desirable to perform additional work on the heat spreader / frame 1212.

  For example, it is known that as a result of the spraying process mechanism, there may be a large residual stress in the metal structure deposited using the cold gas dynamic welding process. These stresses can be structurally prone to dimensional changes, cracking, or other stress related problems during later use. Annealing by controlled heating and cooling is known as a method of reducing or eliminating residual stress. Thus, in some applications, the integral heat spreader / frame 1212 is annealed following deposition on the sheet 304. This optional step is indicated by block 1411 in FIG. In some embodiments, the annealing step 1411 can include a total annealing and alloy of the sprayed metal that makes up the heat spreader / frame 1212. However, in other embodiments, the annealing step 1411 includes annealing only the outermost portion of the monolithic heat spreader / frame 1212 while the inner layer is not annealed.

  It will be appreciated that a flat surface is required for the sealing surface at the “top surface” (substantially protruding from the bottom surface 316 of the sheet) of the heat spreader. If these planar requirements are not met through the application of heat spreader material by a cold spray process, the sealing surface must be planarized in the next step of the process. This step is indicated by block 1412 in FIG. There are many options to achieve the required surface planarization. First, the surface material can be removed from the heat spreader to achieve the required planarization. This can be achieved by conventional surface grinding, other conventional mechanical means, or by laser ablation of raised points. If material removal occurs, care must be taken to avoid damage to the finished window surfaces 314 and 316 during the material removal operation. Special windows 312 may be required to secure and / or protect. Alternatively, if the heat spreader 1212 deposited with cold spray has sufficient ductility, the surface may be planar using stress work, ie work by pressing the frame against a flat mold or using rolling work. It may happen. This will reduce the precautions of handling compared to using surface grinding or laser work.

  Finally, as described above, in some embodiments, an additional metal layer is plated onto the integral frame / heat spreader 1212. These optional plating operations are shown in block 1414 in FIG. 14, such as a solution dipping that plating a nickel and gold layer onto a Kovar alloy frame. In the embodiment shown in FIG. 14, optional plating operation 1414 is performed after optional planarization operation 1412, which is performed subsequent to optional annealing operation 1411. While such an order is preferred, it will be understood that in other embodiments, the order of the optional finishing steps 1411, 1412 and 1414 can be repositioned. The main consideration for the order of these completed steps is whether subsequent steps will damage the results of the previous steps. For example, if planarization is performed by pressure molding, it is acceptable, but if planarization is performed by grinding prior to planarization step 1412, performing plating step 1414 is not practical. I will.

  Referring to FIGS. 15a and 15b, a method of simultaneously manufacturing a cover assembly is illustrated, according to another embodiment of the current invention. An exploded view of a composite assembly that can be subdivided after manufacture to produce a cover assembly is shown in FIG. Composite assembly 1500 includes a frame 1502 and a sheet of transparent material 1504. Frame 1502 has a side wall 1506 that outlines a plurality of frame openings 1508 therethrough. Each frame opening 1508 is surrounded by a continuous sidewall section having a frame seal ring region 1510 (shown as cross-hatched). Each frame seal ring region 1510 has a metal surface and may be caused by the unique metal of the frame 1502 or may be from a metal layer applied to the surface of the frame. In some embodiments, the frame 1502 includes a reduced cross-sectional thickness region 1509 that forms a frame sidewall 1506 between adjacent frame openings 1508. FIG. 15 b shows the bottom side of the frame 1502 and further shows a reduced cross-sectional thickness region 1509 formed between each opening 1508. Also shown is a base seal ring region 1520 (shown with cross-hatching) that surrounds each opening 1508 to allow bonding to the package base 104.

  Further, with respect to the plurality of aperture frames shown in FIGS. 15a and 15b, the frame 1502 has an open end with a V-shaped notch facing away from the sheet, as shown, or alternatively It will be understood that it is possible to join by having an open end of the V-shaped notch facing the sheet.

  Except for the details described above, the plurality of aperture frames 1502 of this embodiment share material, manufacturing, and design details with the single aperture frame 302 described above. In this regard, the preferred embodiment of the frame 1502 is primarily formed of Kovar alloy or similar material, and more preferably, Kovar with a nickel intermediate layer overlaid with a gold surface layer as described above. It has an alloy core.

  The transparent sheet 1504 for the composite assembly can be formed from any type of transparent material as discussed above for the sheet 304. However, in this embodiment, the sheet 1504 has a respective window with a top surface 1514 and a bottom surface 1516 of the respective finished surface, resulting in a plurality of defined windows 1512. A plurality of seat seal ring regions 1518 are shown in FIG. 15a by cross-hatching surrounding each window. For the material of the sheet 1504 and for the surface treatment and / or coating for each of the top 1515 and bottom 1515 finishing structures of each window 1512, the sheet 1504 is a single window sheet 304 as discussed above. Is substantially similar.

  The next step in the process of manufacturing the composite assembly 1500 is to pretreat the seat seal ring region 1518 for metallization. As previously mentioned, each seat seal ring region 1518 surrounds the window portion of the seat 1504. The seat seal ring region 1518 typically has a structure that generally matches the structure of the frame seal ring region 1510 that will ultimately be joined. However, in some cases, other considerations include, for example, if electrical resistance heating is used to produce a bond, the seal ring region 1518 must be connected to form an appropriate circuit. It will be appreciated that it affects the structure of the frame grid. Pre-treating the seat seal ring region 1518 for metallization is substantially similar to the steps and options shown in the description of pre-processing the frame seal ring region 310 in the single aperture frame 302. Thus, at a minimum, the pre-treatment step of the seat seal ring region 1518 typically includes a thorough (eg, plasma, solvent or purifier) clean to remove any contaminants from the surface, and This typically involves roughening the seal ring region by chemical etching, laser cutting, mechanical grinding or sand blasting of this region.

  The step of metallizing the pretreated seat seal ring region 1510 of the seat 1502 is substantially similar to the steps described for metallizing the frame seal ring region 310 in the single aperture frame 302. For example, the metal layers shown in Examples 1 to 120 are used in conjunction with hot compression bonding for soldering where the solder material is plated onto the sheet as the final metal layer, and separate solder preform gold Used in conjunction with solder in combination with tin and can be used to solder in conjunction with deposited or formed solder using ink jet technology.

  The next step in the process is that each of the windows 1512 is overlaid on one of the frame openings 1508, and for each such window / frame opening combination, at least a portion of the associated frame seal ring region 1510 and Positioning the frame 1502 relative to the sheet 1504 such that at least a portion of the associated sheet seal ring area 1518 joins along a continuous connection area surrounding the associated window (brazing solder seats the frame 1502 When used to bond to 1504, it is understood to intervene a solder preform or solder layer between the frame and the sheet). This operation is generally similar to the step for positioning the frame relative to the sheet at a single opening, as in the embodiment described above. If diffusion bonding is used to bond the frame 1502 to the sheet 1504, the intermediate or inner layer between the frame 1502 and the sheet 1504 may or may not be used.

  Referring to FIG. 16a, in accordance with another embodiment, a corresponding tool is used to position a plurality of window sheets 1504 (in this case having window portions 1512 with contoured surfaces) relative to a plurality of opening frames 1502. The steps to do are shown. The corresponding tool includes a corresponding element 1650 and lower support plates 1652, 1654, respectively. Support plates 1652 and 1654 are subjected to compressive forces at discrete locations (not shown) from the tool fixture, as indicated by arrow 1656. Corresponding portion 1650 is positioned between one of the support plates and the prefab of the cover assembly (ie, frame 1502 and seat 1504). Corresponding portion 1650 deforms elastically when a force is applied, and thus is distributed against the uneven surface to ensure that the required contact pressure is achieved along the frame / sheet joint. While applying the applied force simultaneously, it can conform to a bumpy surface (such as sheet 1504). If the corresponding tool does not completely flatten the two parts, it can also take advantage of the inherent flexibility (even if small) present in all materials, while taking advantage of the sheet or other parts Can be used to press the frame. In the described example, the corresponding portion 1650 is formed from a solid block from, for example, an elastomeric material such as rubber, but in other embodiments, the corresponding portion is also manufactured from discrete elements such as, for example, a spring. There may be things to do. Corresponding materials must be able to withstand the high temperatures applied during the joining operation.

  The next step in the process is to heat all of the connection areas until an intermetallic bond is formed between all the frames 1502 and the sheets 1504 along each connection area, so each window 1512 is A composite assembly 1500 having an enclosed sealed frame / seat seal is produced. If diffusion bonding is used to bond the frame 1502 and the sheet 1504, bonding is possible between the outermost metal layer of the frame and the non-metallized sheet 1504. Any of the heating techniques as described above for joining a single aperture frame 302 to a single sheet 304 may be applicable to join multiple aperture frames 1502 to corresponding multiple window sheets 1504. Will be understood.

  Referring to FIG. 16b, the final step in the current process is to divide the composite assembly 1500 along each common connection area between two windows 1512, preserving and maintaining a weld seal surrounding each window. It is a step to do. A plurality of individual cover assemblies are thereby produced. FIG. 16 b shows a side view of the composite assembly 1500 following hermetic bonding of the sheet 1504 to the frame 1502. If the frame 1502 includes a reduced cross-sectional thickness region 1509, the step of dividing the composite assembly creases the frame along the back side of the reduced cross-sectional thickness region at the location indicated by arrow 1602. A step may be included, preferably breaking through or substantially weakening the lower region 1509 of the residual frame material, and also simultaneously folding the sheet 1504 along a straight line perpendicular to the region 1509 At the step of applying, i.e., at the point indicated by arrow 1604, for example, the assembly 1500 is bent in the direction indicated by arrow 1606, e.g., a crack is spread away from the fold line 1608 along the straight line, thereby Can be divided into two parts. This process reduces the thickness of the cross-section until the composite assembly 1500 is completely subdivided into a single aperture cover assembly that is substantially similar to that manufactured in the manner described hereinabove. Can be repeated along each region of 1509. In other embodiments, instead of using a polyline break method, the cover assembly is preferably in arrow 1602 using mechanical cutting, dicing wheels, laser, water jet, or other separation techniques. It can be separated from the frame side (ie, between windows 1512) along the path shown.

  Referring to FIGS. 17a and 17b, yet another method for manufacturing multiple cover assemblies simultaneously is illustrated. This method extends to the cold gas dynamic spraying method used to build an integral frame / heat spreader directly on the transparent sheet material, as described above in connection with FIGS. 12a to 12c and 13a to 13c. To do. As shown in FIG. 17a, the process consists of a sheet of unmetallized transparent material 1704 with a plurality of windows 1712 defined thereafter and each window having a top surface 1714 and a bottom surface 1716 of the finished surface, respectively. Started in the department. The performance and characteristics of the transparent sheet 1704 are substantially similar to the embodiments discussed above. The next step in the process includes pre-processing a plurality of frame bonding areas 1720 (indicated by the dashed path surrounding each window 1712) and each frame bonding area 1720 surrounding one of the windows 1712. As in the above embodiment, the step of pre-treating the frame bonding area comprises the step of modifying the frame bonding area by cleaning, roughening, grinding or otherwise in the pre-processing for metallization. There may be things.

  The next step in the process is to metallize the pre-treated frame adhesion area with the sheet, i.e. this metallization can be performed using cold gas dynamic spraying or the layers are compared. Can be carried out using CVD, physical vapor deposition or other conventional metal deposition techniques at thin spots. It will be appreciated that the main purpose of this step is to meet the metallurgical requirements for applying and / or anticorrosion with a metal layer that needs to achieve good adhesion to the transparent sheet 1704.

  Referring to FIG. 17b, the next step in the process is the pre-treatment of the sheet 1704 using cold gas dynamic deposition deposition until the assembled metal frame 1722 is formed into a sheet having a seal ring region 1726. Depositing metal on the metallized frame bond area, a predetermined vertical thickness on the frame bond area, and thus a composite having a weld seal between the frame 1722 and the sheet 1704 surrounding each window 1712 Manufacturing the assembly. In some embodiments, the reduced cross-sectional thickness region 1724 is formed by selectively depositing metal during cold spray deposition. In other embodiments, the reduced cross-sectional thickness region section 1724 can be formed following deposition of the frame / heat spreader 1722 through the use of grinding, cutting or other mechanical techniques such as laser cutting and water jets. . Further, a reduced cross-sectional thickness region section 1724 can be formed following deposition of the frame / heat spreader 1722 through the use of photochemical processing (PCM).

  The next step in the process, which is a non-essential but highly preferred step, is that if necessary, the seal ring region 1726 on the sprayed frame 1722 to meet the planarization requirements for bonding to the package base 104. Is a step of flattening. This planarization can be achieved, for example, by mechanical means such as grinding, lapping, polishing, or other techniques such as laser cutting.

  The next step in the process, which is a non-essential but strongly preferred step, is to seal ring region 1726 of frame 1722 sprayed to facilitate welding of the cover assembly to package base 104, for example, a nickel layer, and preferably Is a step of adding an additional metal layer such as a gold layer. These metal layers can be added using a solution immersion plating process such as, for example, solution immersion plating, although other techniques can be used.

  The next step in the process is to divide the composite assembly 1700 along each frame wall section common between the two windows 1712 while simultaneously preserving and maintaining a weld seal surrounding each window. After splitting the composite 1700, a plurality of single aperture cover assemblies 1728 (shown in dashed lines) are substantially the same as the single aperture cover assembly manufactured using the method described in FIGS. 12a to 12c and FIGS. 13a to 13c. Each is similar in terms. All of the options, attributes, and techniques described for use in a single cover assembly manufactured using cold gas dynamic spraying are applicable to this embodiment. For example, it will be appreciated that operations such as planarizing the frame and plating the frame with an additional metal layer can be performed on the composite assembly 1700 before separation of the individual units, or on individual units after separation. I will.

  As mentioned above, the step of heating the connection area between the metallized seal ring area of the transparent sheet and the seal ring area of the frame is required to form a weld seal therebetween. Also as described above, this heating step can be accomplished using a variety of electrical heating techniques including furnaces, ovens, or electrical resistance heating (ERH). Referring to FIGS. 18a to 18c, the use of electrical resistance heating to simultaneously manufacture multiple cover assemblies is illustrated.

  Referring first to FIG. 18a, a transparent sheet 1804 having a plurality of seal ring regions 1818 arranged in a grid pattern around a plurality of windows 1812 is illustrated. These seal ring regions 1818 are first pretreated and then metallized with one or more metals or metal alloys as previously described herein. Further, the transparent sheet 1804 includes a metallized electrode portion 1830 but does not surround any window 1812. This electrode portion is electrode-connected to the sheet metallized seal ring region 1818. One or more electrode pads 1832 can be provided to the electrode portion 1830 to receive electrical energy from the electrodes during subsequent ERH procedures.

  Referring to FIG. 18b, a frame 1802 having a plurality of sidewalls 1806 arranged in a grid pattern around a plurality of frame openings 1808 is illustrated. The opening 1808 is arranged to correspond to the position of the window 1812 of the seat 1804 and the side wall 1806 can correspond to the position of the seat seal ring area 1818 of the seat with the frame seal ring area 1810 (positioned thereon). So that it is arranged. The frame is made of metal or metallized to facilitate joining as previously described herein. Further, the frame 1802 includes an electrode portion 1834 that does not surround any frame opening 1808. The frame electrode portion 1834 is positioned so as not to correspond to the position of the sheet electrode portion 1830 and is preferably positioned on the opposite side of the seat window / frame grid assembly (ie, when the sheet is assembled to the frame). Frame electrode portion 1834 is electrode connected to the metallized frame seal ring region 1810 of the sheet. One or more electrode pads 1836 can be provided to the electrode portion 1834 to receive electrical energy from the electrodes during subsequent ERH procedures.

  Referring to FIG. 18c, the sheet 1804 illustrates positioning relative to the frame 1802 in a pre-treatment for heating to create a weld seal therebetween. Where applicable, solder or solder preforms are placed between them as described above. It is understood that the transparent sheet 1804 is acquired relative to the frame 1802, and the metallized seal ring area 1818 on the lower surface of the sheet is in electrical contact with the metallized seal ring area 1810 on the upper surface of the frame. It will be. However, the sheet electrode portion 1830 and the frame electrode portion 1834 are not in direct contact with each other, but instead are only electrically connected through the metallized seal ring regions 1818 and 1810 that each electrically connect. When a potential is applied from electrode pad 1832 to electrode pad 1836 (indicated by the + and-symbols adjacent to the electrode), current flows through the connection area of the entire seat window / frame grid assembly. This current flow creates electrical resistance heating (ERH) because of the inherent resistance in the metal layer. In some embodiments, this electrical resistance heating is necessary to produce a TC bond, soldering, or other weld seal formation between the sheet 1804 and the frame 1802 itself to form a composite assembly. It can be sufficient to supply heating. However, in other embodiments, electrical resistance heating may be combined with other heating forming such as furnace or oven preheating to provide the necessary heating required for bonding to form the composite assembly. it can.

  After joining the sheet 1804 to the frame 1802 to form a composite assembly, the sheet electrode portion 1830 and the frame electrode portion 1834 are external electrodes (or other electrical electrodes) in the respective metallized seal ring regions of the sheet and frame. After serving the function of providing electrical access to the supply part), it can be excised and discarded. The excision of these “sacrificial” electrode portions 1830 and 1834 may occur before or during the “dicing” process step, ie, the step of separating the composite assembly into separate cover assemblies. It will be appreciated that any technique for separating composite assemblies into individual cover assemblies, as previously described herein, can be used as a dicing step for separating composite assemblies manufactured using ERH heating. Will.

  If ERH is used to manufacture multiple cover assemblies at the same time, the structure of the seat window / frame grid array and / or the placement of the electrode portions within the sheet window / frame grid array will allow current to flow through the connection area during heating. There may be choices to moderate the flow. The main type of moderation is to create a more uniform temperature, i.e. to avoid "hot spots" or "cold spots", to reduce the current flow during the heating step over various parts of the seat window / frame grid. Make uniform.

  Referring to FIGS. 19a to 19f, various seat window / frame grid configurations adapted to emit a more uniform temperature during ERH are illustrated. In each of FIGS. 19a to 19f, a sheet window / frame grid array 1900 comprising a pretreated, metallized transparent sheet 1904 overlying a pretreated metal / metallized frame 1902 is shown. The window portion of the seat 1904 directly overlays the frame opening of the frame 1902 and the sheet metalized seal ring region directly overlays the frame seal ring region (in these figures, the metal of the seat 1904 and the frame 1902 It will be understood that the normalized parts are shown simultaneously). The metallized electrode portions formed on the transparent sheet 1904 are indicated by reference characters A, B, C and D. These electrode portions A, B, C and D are electrically connected to the seal ring region of the adjacent sheet, but are electrically isolated from each other by the non-metallized region 1906 of the sheet. The external electrode is applied to the top surface of the metal / metallized frame (on the opposite side of the sheet) through the area indicated by the reference letter E. For bonding or soldering, the power is, for example, simultaneously one line to electrodes A, B, C and D and the other line to electrode E, or each electrode A, B, C and D. It is applied to electrodes such as one line in sequence and other lines to electrode E. It will be understood that many other electrode force combinations are within the scope of the present invention.

  Referring to FIG. 19f, this embodiment provides a seat window / frame grid having a “saw” configuration, ie, when the seal ring area between the window / frame openings does not form a continuous straight line through the assembly array. 1900 is illustrated. The saw array frame assembly requires even more labor to separate using a scribe break method or a cutting method. The assembly separation step requires that each row is first separated from the entire grid and the individual cover assemblies are separated from the rows by scribe-breaking or cutting operations. However, the use of the saw array assembly may have the advantages associated with heating using the ERH method.

  A metal frame, such as 1802 or 1902, may include one or more additional layers on its exterior, including but not limited to a metal or metal alloy layer, but ERH for applying heating to the frame Can be used to diffusion bond to non-metallized sheets. The amount of temperature rise through the thickness of the unmetalized sheet depends on the strength and duration of the application of power (volts and amperes) to the frame, as well as other factors. As discussed above, an inner layer material or an intermediate layer material can be used between the frame and the sheet during the diffusion bonding process.

  It will be further understood that the terms “thermal compression bonding” (and its abbreviation “TC bonding”) and “diffusion bonding” are used interchangeably throughout this application. The term “diffusion bonding” is preferred by metallurgists, but in many industries (eg, semiconductors) to avoid possible confusion with other types of “diffusion” processes used to manufacture semiconductor devices. In manufacturing, the term “thermal compression bonding” is preferred. As discussed above, regardless of which term is used, diffusion bonding is only to form a bond between mating surfaces at a temperature below the normal melting temperature of either mating surface. Reference is made to a group of joining methods using only heating, pressure, specific positive or negative pressure and time. In other words, the mating surfaces are not intentionally melted, no melted padding is added, and no chemical bonding is used.

  As mentioned above, diffusion bonding is used to hermetically bond two surfaces together without first melting one or both adjacent surfaces (as in conventional soldering, brazing and welding processes). Use a combination of high heat and high pressure. When making optical cover assemblies, wafer level assemblies or other temperature sensitive products, the bonding temperature almost always needs to be kept below a certain upper limit. For example, in an optical cover assembly, the bonding temperature of the sheet material should be lower than the TG and softening temperature TS so as not to affect the existing optical properties of the sheet. As another example, in a wafer level assembly, the bonding temperature should be lower than the upper temperature limit for the embedded microdevice and / or its working pressure (ie, the gas environment within the sealed package). However, the specific temperature and pressure parameters required to create a sealed diffusion bond can vary widely depending on the nature and configuration for joining the two mating surfaces. Thus, some combination of transparent sheet material (eg glass) and frame material (eg metal or metallized non-metal), or some of frame material and substrate material (eg silicon, alumina or metal) The combination can have a diffusion bonding temperature that exceeds the TG and / or TS of the sheet material or exceeds other temperature limits. In such cases, if temperature limits must be observed, it may be inappropriate for use in the step of hermetically joining the components together. However, in fact, the use of an “intermediate layer”, ie an intermediate layer of a specially selected material, placed between the sheet material and the frame or between the frame material and the substrate material makes the same sheet material identical. It is possible to cause hermetic diffusion bonding at a significantly lower temperature than when directly bonded to the same frame material or when the same frame material is directly bonded to the same substrate material. It should be noted here that the terms “intermediate layer” and “inner layer” are used interchangeably throughout this application as they may encounter both terms within the technology that mean the same thing. Is Rukoto.

  A properly matched intermediate layer improves the strength and sealing (ie, gas or vacuum tightness) of the diffusion bond. In addition, it promotes the formation of interchangeable joints, produces a single joint at lower joint temperatures, reduces internal stresses in the joint zone, and is extremely stable preventing diffusion, especially on the surface of aluminum, titanium and precipitation hardened alloys The formation of the oxidized oxide may be hindered. The intermediate layer is believed to diffuse into the matrix, thereby increasing the melting point of the joint as a whole. Depending on the material to be joined by diffusion bonding, the intermediate layer material can be composed of metal, metal alloy, glass material, solder glass material including tape-type or sheet-type solder glass, or other materials. In diffusion bonding of BT5-1 titanium alloy to Armco iron, an intermediate layer with a thickness of 0.3 mm molybdenum foil is used. Reliable, glass-to-glass and glass-metal bonding is usually achieved with metal interlayers such as aluminum, copper, kovar, niobium and titanium in foil molds that do not exceed 0.2 mm thickness. The inner layer is usually formed into a thin preform such as a seal ring region of the mating surfaces to be joined.

  It is important to distinguish the use for diffusion bonding of the intermediate layer from the use of conventional solder preforms and other processes as disclosed above. For the purposes of this application, the intermediate layer is a material used between the sealing surfaces to facilitate surface diffusion bonding by diffusion bonding to the intermediate layer so that each mating surface is directly with each other. It is. For example, using an appropriate intermediate layer material, the appropriate diffusion bonding temperature for bonding between the sheet material and the intermediate layer material and between the intermediate layer material and the frame material is between the sheet material and the frame material. It may be much lower than the diffusion bonding temperature of the directly formed bond. Thus, the use of the intermediate layer allows diffusion bonding of the sheet to the frame at a temperature significantly lower than the diffusion bonding temperature required to directly bond the sheet material and the frame material. The hermetic bond is still formed by a diffusion bonding process, i.e., a material that does not melt during the bonding process (not a sheet material, intermediate layer material or frame material). This is a major difference between diffusion bonding using an intermediate layer and other processes such as using a solder preform that actually melts the solder material to form a bond between the materials to be bonded. For example, as the intermediate layer for diffusion bonding, it is possible to use a material conventionally used as solder such as Au—Sn solder preform. However, when used as an intermediate layer, it is used for diffusion bonding properties, not as conventional (they melt) solder.

  The use of intermediate layers in the manufacture of window assemblies or other packages may provide additional advantages over the use to promote diffusion bonding. These advantages include an intermediate layer that serves as an activator for the mating surfaces. Sometimes it has a higher ductility compared to the substrate. The intermediate layer can also be compensated for stresses that occur when the seal is accompanied by materials having different coefficients of thermal expansion or other thermal expansion characteristics. The intermediate layer may also promote mass transfer or chemical reaction between the layers. Finally, the intermediate layer may serve as a buffer that prevents the formation of undesirable chemical or metal phases at the joint between the components.

  Referring to FIGS. 20a and 20b, a window cover assembly that includes an intermediate layer to facilitate bonding by diffusion bonding is illustrated. In this embodiment, the window assembly 2050 includes a transparent glass sheet 2052, an intermediate layer 2054 and a metal or metal alloy base 2056. Base 2056 includes an assembly seal ring region 2058 and a flange 2060 that facilitate electrical resistance seam welding to the package base or other higher level final component portion of the subsequent finish window assembly. In this embodiment, the intermediate layer 2054 takes the form of a metal preform having a structure selected to match the seal ring region 2058 of the frame. In a material fixture (ie, tool) or mechanical device (not shown) that can provide the required joint pressure between the seal ring regions of each component to form a hermetic window assembly, the sheet 2052, An intermediate layer 2054 and a frame 2056 are installed. In some cases, the material fixture may be useful only for placing components during joining, although high joining pressure is applied from a mechanical device such as a ram. However, in other cases, the material fixture can be designed to suppress expansion of the laminate component (ie, along the laminate axis) during heating, and thus the assembly configuration towards the material fixture The thermal expansion of the elements and towards the components of the material fixture itself “naturally generate” some or all of the required joint pressure between the components as the temperature increases.

  Referring to FIGS. 20e and 20f, an example of a “self-compressing” mounting assembly is shown. As best seen in FIG. 20e, the material fixture 2085 includes a top mounting portion 2086 and a bottom mounting portion 2087 that together define a cavity 2088 for receiving the window assembly components to be joined. A fastener 2089 is provided that restrains outward movement of the attachment portions 2086 and 2087 in the axial direction (indicated by arrow 2090). In general, the coefficient of thermal expansion of the material forming fastener 2089 is lower than the coefficient of thermal expansion of the material forming attachment portions 2086 and 2087. FIG. 20f shows the components for the window assembly 2070 (FIGS. 20c and 20d) that load the cavity 2088 of the material fixture 2085 in a pre-process for bonding. It should be noted that the attachment portions 2086 and 2087 connect to the top and bottom surfaces of the window component, but when a small gap 2097 is between the material fixtures and when heated, they face each other axially. Can be expanded (because it is constrained by fasteners). Furthermore, it should be noted that the small gap 2098 is generally between the sides of the window assembly component and the mounting portions 2086 and 2087 to minimize the lateral forces exerted on the component by the mounting portion during heating. It is to be. When the material fixture 2085 is heated, the inner surfaces of the attachment portions 2086 and 2087 (ie, facing the cavity 2088) expand axially with respect to each other (due to thermal expansion) relative to the window component, and the window configuration The element expands relative to the material fixture. These thermal expansions can exert great forces in the axial direction and press the window components against each other to promote diffusion bonding. It will be appreciated that the thermal expansion of the attachment portions 2086 and 2087 also occurs in the lateral direction (indicated by arrow 2091). This lateral expansion is generally undesirable, but in most cases does not interfere with the use of a self-compressing attachment.

  Referring to FIG. 20g, another self-compressing material fixture applied to enhance thermal expansion (and thus compression) in the axial direction 2090 without causing excessive thermal expansion in the lateral direction 2091 is illustrated. Has been. As the above embodiments have, an alternative material fixture 2092 has a top mounting portion 2086 and a bottom mounting portion 2087 that define a cavity 2088 for receiving the window assembly to be joined, and in the axial direction 2090 outside the mounting portion. Includes a fastener 2089 (only one shown for purposes of illustration) to restrain movement toward Also, as in the above embodiment, a first small gap 2097 is shown between the mounting portions 2086 and 2087, and a second small gap 2098 is between the window component and the side of the mounting portion. Indicated. However, unlike the embodiments described above, each attachment portion 2086 and 2087 of the alternative material fixture 2092 is two sub-portions, namely primarily axially relative to the window assembly component (not shown). First sub-portion 2093 and first sub-portion 2094, respectively, applied to proceed, and second sub-portion 2095 and second sub-portion 2096, respectively, applied to apply and align the window assembly in the cavity. Prepare. By selecting materials for the first sub-portion 2093 and the first sub-portion 2094 that have a high coefficient of thermal expansion, the axial expansion (and thus compression) during heating is correspondingly higher. However, the lateral expansion and associated lateral movement between the second sub-portion 2095, the second sub-portion 2096, and the window component may cause a different material of the second sub-portion, i.e. a lower coefficient of thermal expansion (i.e. Can be minimized by selecting a material having a coefficient of thermal expansion lower than that of the first sub-portion. Preferably, the coefficient of thermal expansion of the second sub-portion 2095 and the second sub-portion 2096 is approximately close to the coefficient of thermal expansion of the window component.

  Referring again to FIGS. 20a and 20b, the assembled (unjoined) components of the window assembly 2050 are heated until a diffusion bonding pressure / temperature situation is reached, which is the first diffusion bonding sheet 2052. And the intermediate layer 2054 is maintained until a second diffusion bond is formed between the intermediate layer 2054 of the frame 2056 and the seal ring region 2058. It will be appreciated that the first bond between the sheet and the intermediate layer occurs substantially before, after, or simultaneously with the second bond between the intermediate layer and the frame. As explained above, the order of the steps of applying heat and pressure to form a diffusion bond is not considered important, i.e., in other words, a pre-determined pressure is applied and then heating is applied. Whether it is applied or whether heating is applied and then a pre-determined pressure is applied or whether both heating and pressure are increased simultaneously is not considered important, rather Diffusion bonding occurs when a preselected pressure and temperature are shown in the bonding area for a sufficient time. After the diffusion bond is formed, the sheet 2052 is hermetically bonded to the frame 2056 to form a finished window assembly 2050, as shown in FIG. 20b.

  In further embodiments of the present invention, it has been discovered that clean, i.e., non-metalized, glazed windows may be joined directly to a frame of Kovar or other metallic material using diffusion bonding. As already explained, this is in addition to the step of diffusion bonding the metallized glass window to the Kovar frame. Optionally, direct diffusion bonding of a non-metalized glazed window to a metal frame may be enhanced by using certain compounds, such as molybdenum manganese, for example in the frame. Whether the glass is metallized or not, diffusion bonding is most commonly performed at vacuum pressure, however, it may be performed under various other atmospheres. However, the use of an oxidizing atmosphere is usually not necessary because any resulting oxide tends to disperse with the pressures encountered in the operation of the junction. In yet another embodiment of the present invention, a diffusion bond is used to directly bond a frame bond made of Kovar and other metallic materials to a semiconductor sheet or wafer comprising silicon and gallium arsenide (GaAs). can do.

  The physical properties of the surface finish of the mating surfaces can be an important parameter of the present invention because the mating surfaces need to be joined in intimate contact with each other for successful diffusion bonding. The following paired surface parameters are: Kovar and metallized glass, Kovar and clean (ie, nonmetallized) glass, Kovar and metallized silicon, Kovar and clean (ie, nonmetallized) silicon, Kovar and metallized gallium It is believed that diffusion bonding between the Kovar frame and the mating surface of the thin sheet material can be successful, including but not limited to arsenic (GaAs) and Kovar and clean (ie non-metallized) GaAs. Sheet material parallelism (ie, thickness uniformity) in the range of about 12.7 microns; surface flatness in the range of 5 mils / inch to about 10 mils / inch (ie, ideal) Deviation in height per unit length when placed on a flat surface); at most about 16 microinches (0.4064 microns) A surface roughness. These surface parameters can also be used for direct diffusion bonding of Kovar and Kovar, for example, metal frames by manufacturer assembly.

  The temperature parameter for diffusion bonding between the above-mentioned Kovar frame and the mating surface of the thin sheet material is an absolute melting temperature of about 40% to about 70% of the base material having a relatively low melting temperature in Kelvin degrees. It is considered to be in the range of When diffusion bonding is used to bond optically finished glass or other transparent material, the bonding temperature may be selected to be below the TG and / or softening temperature of the other glass transparent material. Well, thereby avoiding damage to the optical finish. Depending on the selected bonding temperature, in some embodiments, application of the optical and / or protective coating to the transparent sheet (ie, the window) is performed after the sheet is bonded to the frame, rather than before bonding. May be. In other embodiments, some of the optical and / or protective coatings may be applied to the glass sheet prior to bonding, although other coatings may be applied subsequent to bonding. . With respect to pressure parameters, a pressure of 105.5 kg / cm 2 (500 psi) is considered appropriate for diffusion bonding of the aforementioned Kovar frame and thin sheet material.

  It will be noted that because the diffusion bonding occurs at high temperatures, the thermal expansion coefficient of the glass sheet should match the thermal expansion coefficient of the metal frame. Within a range where the coefficients of thermal expansion cannot be perfectly matched (for example, due to non-linearities in the coefficients of thermal expansion beyond the expected temperature range), the coefficient of thermal expansion of the glass sheet will be lower than that of the metal frame. Is preferred. This results in the metal frame shrinking more than the glass sheet as the combined window / frame assembly cools from the bonded high temperature (or from the operating high temperature) to the original room temperature. Thus, glass is primarily affected by compressive stress rather than tension, reducing the tendency to crack.

  Referring now to FIGS. 20c and 20d, a window assembly having inner and outer frames of an additional embodiment of the present invention is illustrated. FIG. 20c illustrates the components of the window assembly 2070 prior to assembly, while FIG. 20d illustrates the completed assembly. The window assembly 2070 is joined (using diffusion bonding, soldering, brazing, or other techniques disclosed herein) to individual frames on the inner and outer surfaces 2076 and 2078, respectively, of the transparent sheet 2080. Members 2072 and 2074 are included. In other words, the transparent window material is “sandwiched” between the frame material layer at the top of the window and the frame material layer at the bottom of the window. The intermediate layers 2082 and 2084 may be applied to the diffusion bonding described above, or a solder preform (also illustrated as 2082 and 2084) may be applied to the bonding by soldering described above.

  Usually, the same joining technique will be used to join both the inner and outer frames to the window, however this is not required. Similarly, internal and external junctions will usually be formed simultaneously, but this is not essential. However, it is necessary to hermetically bond the inner frame 2072 to the window 2080 in order to produce a sealed window assembly. A hermetic bond is usually not necessary when bonding an external frame 2074 to the window 2080, however, it may be preferred for a number of reasons.

  One advantage of a window assembly having a so-called “sandwiched” frame configuration is that, for example, during post-join cooling or during temperature cycling, the frame 2072 and 2074 and the sheet have different thermal expansion characteristics (unequal thermal expansion coefficients). For example, the stress applied to the inner surface 2076 and the outer surface 2078 of the transparent sheet 2080 is made uniform. In other words, if the window assembly has a frame joined to only one surface, uneven expansion and contraction between the frame and the sheet may create significant shear stress in the sheet. These shear stresses can be strong enough to cause shear failure (eg, cracking or falling off) in the transparent sheet, even if the window-frame joint itself remains intact. is there. However, when the frame is joined to both the inner and outer surfaces of the window, the shear stress in the glass (or other transparent material) may be greatly reduced. This is especially true when the same material or a material with a similar coefficient of thermal expansion is used for both the inner and outer frames. This equalization of stress by window thickness improves the reliability and durability of the assembled window during subsequent temperature cycling and / or physical shock.

  The sandwiched structure may be used in a window assembly or a WLP assembly. The sandwiched structure with inner and outer frames is particularly advantageous when the sheet and frame material have significantly different coefficients of thermal expansion. In addition to the stress balancing feature of the sandwiched structure, the use of an external frame on the sheet enhances thermal diffusion across the window; enhances heat dissipation from the assembly; as an optical aperture Useful; facilitates alignment / fixing or clamping of the device during joining or assembly to a higher level assembly; may have additional advantages, including displaying work symbolization.

  Referring now to FIGS. 21a and 21b, two illustrations of a sealed wafer level package (also known as “WLP”) for a microdevice according to another embodiment of the present invention are illustrated. . These embodiments show that the wafer level package 2002 (FIG. 21a) has an external electrical connection on the opposite side, whereas the wafer level package 2024 (FIG. 21b) has an external electrical connection on the same side. Except that, they are substantially similar to each other. The wafer level package is similar in many respects to the separate device package already disclosed herein, but the microdevice's own substrate, usually a semiconductor substrate, is used as part of the package's sealed envelope. use. Such wafer level packaging provides a very economical way to seal wafer processing microdevices, especially when high production volumes are involved. As described below, a single microdevice may be packaged using WLP technology, or multiple microdevices associated with the original production wafer may use WLP technology in accordance with various aspects of the invention. And may be packaged at the same time.

  Referring now specifically to FIG. 21a, a wafer level package 2002 surrounds one or more microdevices 2004, eg, a MEMS or MOEMS device fabricated on a substrate 2006. The substrate 2006 is typically a silicon (Si) or gallium arsenide (GaAs) wafer on which electronic circuits 2008 associated with the microdevice 2004 are formed using known semiconductor processing methods. Electrical via 2010 (shown in dashed lines) uses known methods to connect circuit 2008 to externally accessible connection pads 2012 located on the opposite side of the substrate (ie, relative to the device). Alternatively, the substrate 2006 may be formed. It will be appreciated that the via 2010 path shown in FIG. 20 is simplified for illustrative purposes. One end of a frame 2014 made of Kovar or other metal material is hermetically bonded to the substrate 2006, and the transparent window 2016 then completes a sealed envelope that seals the microdevice in the cavity 2018. Sealed to the other end. The framed surface of the substrate 2006 may be treated or metallized with one or more metal layers 2020 to facilitate bonding to the frame, and similarly, the framed surface of the window 2016 is: It may be treated or metallized with one or more metal layers 2022 for the same purpose.

  Referring now specifically to FIG. 21b, the wafer level package 2024 in this case is the package 2002 described above, except that vias 2026 are routed to external connection pads 2028 located on the same side of the substrate 2006. Is substantially the same. Obviously, in such an embodiment, the frame 2014 and the window 2016 are dimensioned to maintain an uncovered portion of the top surface of the substrate.

  Referring now to FIG. 21c, there is shown an exploded view of WLP 2100 illustrating one possible manufacturing method. For packaging single or multiple microdevices using the WLP method, the following components, substrate 2006 with microdevices 2004 on top; A frame / spacer 2014 that is “taller” than the device to be made; a transparent sheet or window 2016 is required. Depending on the joining method used, diffusion alloy 2102 and 2103 may require additional metal alloy or glass composition, or intermediate layer solder preforms. It will be appreciated that the top preform 2102 (between the window 2106 and the frame 2014) may be of a different material than the bottom preform 2103 (between the frame 2014 and the substrate 2006).

  In short, the method for forming the package 2100 is as follows. The attachment area 2104 of the first frame is created on the surface of the wafer substrate 2006 of the target microdevice. The attachment area 2104 of the first frame has a micro device on the substrate 2006 or a plan view surrounding the micro device 2004 (that is, a configuration when viewed from above). A second frame attachment area 2106 is created on the surface of the window 2016. The second frame attachment region 2106 typically has a plan view substantially corresponding to the plan view of the first frame attachment region 2104. The order of execution of the previous two steps is not important. Next, a frame / spacer 2014 is disposed between the substrate 2006 and the window 2016. The frame / spacer 2014 substantially corresponds to and has a plan view corresponding to the respective plan views of the attachment areas 2104 and 2106 of the first and second frames. Where appropriate, solder preforms 2102 and 2103 or diffusion bonding interlayers 2102 and 2103 are now placed between frame / spacer 2014 and frame attachment areas 2104 and / or 2106. Finally, the substrate 2006, the frame / spacer 2014 and the window 2016 encapsulate the microdevice 2004 but are sealed through which light can pass through and / or from the microdevice through the window's transparent aperture area 2108. Bonded to form the package (facilitated by preforms 2102 and 2103 or diffusion bonded interlayers 2102 and 2103 with solder or glass, where appropriate).

  It will be appreciated that diffusion bonding of the package 2100 can be performed in a single (combined) step or in many sub-steps. For example, all five components (sheet 2016, first intermediate layer 2102, frame 2014, second intermediate layer 2103 and substrate 2006) can be stacked on a single fixture and formed on their respective sealing surfaces. It is possible to heat and press simultaneously to obtain diffusion bonding. Alternatively, the window sheet 2016 may be first diffusion bonded to the frame 2014 using the first intermediate layer 2102 (making a first subassembly), after which the first subassembly is 2103 may be used for diffusion bonding subsequent to the substrate 2006. In another alternative method, the frame 2014 may be diffusion bonded to the substrate 2006 using the second intermediate layer 2103, after which the transparent sheet 2016 continues to the subassembly using the first intermediate layer 2102. May be joined. The choice of which joining sequence to use is, of course, the actual material used, the thermal sensitivity of the transparency in the sheet 2016, the thermal sensitivity of the microdevice 2004, and possibly the expansion characteristics of the frame 2014 and the interlayer material, etc. May depend on other parameters.

  It will be further understood that the present invention is similar in some respects to the manufacture of the “stand alone” sealed window assembly previously disclosed. The creation of the frame attachment area 2106 of the window 2016 includes cleaning, roughening and / or metallization with one or more metal layers as described in Examples 1 to 96 above. It may be performed using the same method already disclosed for use in creating 318.

  The transparent glazing 2016 may be roughened (e.g., when creating the frame attachment area 2106) to facilitate adhesion of the first metal layer deposited thereon (e.g., CVD or PVD). Therefore, the wafer substrate 2006 is not usually roughened in the same way. Instead, the initial metal layer on the wafer substrate 2006 is typically deposited using conventional wafer processing techniques. Conventional methods of wafer processing include the need or option of etching a silicon or GaAs wafer to promote adhesion of metal deposition, and then when constructing a WLP device, the frame on the wafer substrate 2006 The same practice follows in creating the attachment region 2104.

  Other wafer or substrate materials include, but are not limited to glass, diamond and ceramic materials. Some ceramic wafers are known as alumina wafers. These alumina wafers or substrates may be multilayer substrates and may be manufactured using low temperature cofired ceramic (LTCC) or high temperature cofired ceramic (HTCC) materials and processes. LTCC and HTCC substrates often have internal and external electrical circuits or interconnections. This circuit is usually screen printed onto a ceramic or alumina material layer prior to co-firing the layers together.

  In addition, any of the bonding techniques and parameters already described for use in window assemblies include diffusion bonding / TC bonding with or without an intermediate layer, soldering with a solder preform, and inkjet. It may include soldering using solder dispensed in a manner and may be used to hermetically join the WLP components together. The main difference is that when making a “stand alone” window assembly, only two components (ie, transparent sheet / window 304 and frame 302) are joined, while when making a WLP, there are three main components: New components (ie, window 2016, frame 2014, and substrate 2006) are joined (sometimes simultaneously). Of course, producing WLP using soldering techniques may require additional components, such as one or more solder preforms 2102 or solder dispensed in multiple ink jet systems. If used, solder preforms may be attached to the upper and / or lower ends of frame 2014 as one step in the manufacture of the article. This will simplify the alignment of the three main components of the WLP assembly. Of course, it will be appreciated that this pre-attachment of the solder preform to the frame can also be applied to the "stand alone" window assembly already described. One method for attaching the solder preform to the window 2016, frame 2014 and / or substrate 2006 is to use a partial heat source to connect the preform in place.

  Prior to soldering the components together, cleaning the surface of the solder preform and / or the metalized surface of the window 2016, the frame 2014 and / or the substrate 2006 to remove surface oxides It may be necessary. It is desirable to avoid the use of flux during the soldering process to eliminate the need for subsequent soldering or defluxing. Several surface preparation techniques can be used to create soldering metal and solder surfaces that do not use flux.

  Some other processes may be used for surface preparation of soldering window assemblies or WLP components to avoid the need to remove the flux after soldering. The first option is to use what is known in the commercial field as no-clean flux. This type of flux is intended to remain in place after soldering. The second option is to use gas plasma treatment to improve solder wettability without using flux. For example, a non-toxic fluorine-containing gas that reacts on the solder surface may be incorporated. This reaction forms a hardened surface with solder and decomposes when dissolved again. The welds and joints formed are comparable to or better than those formed when using flux. Such a plasma offers advantages including removal by reduction of oxides and glass to facilitate improvements in solder wettability and wire bondability. Such treatment has been demonstrated in thick film copper, gold and palladium. Further candidate gases for leaving a clean surface free of oxides include hydrogen and carbon monoxide plasma. Still further candidate gases include a combination of hydrogen, argon and flon gases. One version of plasma processing is known as plasma assisted dry soldering (PADS). The PADS process converts tin oxide (which appears in solder that does not use flux when the unstable reduced tin oxide is reoxygenated when exposed to air) to oxyfluoride to promote wetting. The conversion film is torn and reflowable when the solder melts. The film is understood to be stable for over a week in air and for over 2 weeks if the part is stored in nitrogen.

  The selection of materials that are compatible with the various components for manufacturing WLP, such as the method described above, for manufacturing single and multiple window assemblies for hermetically packaged separate microdevices is the invention. Is another aspect of. For example, each of the main components of WLP (eg, windows, frames / spacers, and wafer substrates) preferably have close thermal expansion coefficients to ensure long-term reliability maximization of the sealed state. The frame / spacer 2014 may be formed from either a metallic material or a non-metallic material. The best thermal expansion coefficient match would be achieved by forming the frame / spacer 2014 from the same material as either the wafer substrate 2006 or the window 2016. However, gallium arsenide (GaAs) and silicon (Si) (ie, materials commonly used for wafer substrates) and most glasses (ie, materials commonly used for windows) are at least most metals and metal alloys. It is relatively vulnerable compared to Thus, these metals and metal alloys are usually less preferred than metals or metal alloys to form the frame / spacer 2014 because metals and metal alloys typically exhibit a higher resistance to cracking. In fact, using a metal or metal alloy for the frame / spacer 2014 is believed to provide additional resistance to accidental cracks or subdivisions of the bonded wafer substrate 2006, window 2016 and finished WLP 2002. Yes. When using a metal frame / spacer 2014, it is preferably sometimes to facilitate diffusion bonding or soldering, but more often to provide various types of protection between the frame / spacer and the atmosphere inside the package. To provide a surface on the frame / spacer to be provided, it will be plated either by simply using gold or using nickel then gold. However, when using a non-metallic frame / spacer 2014, it may be metalized to facilitate diffusion bonding or soldering. The metal layer used on the frame / spacer 2014 may be the same as that used on the window glass 304 to make the window assembly, for example, the final layer is chromium, nickel, tin, bismuth tin and gold. One of them.

  When selecting compatible materials for the WLP components, silicon (Si) is in the range of about 2.6 PPM / ° K at 293 ° K to about 4.1 PPM / ° K at 1400 ° K. It has been recognized that it has a coefficient of thermal expansion. The operating temperature of microdevices such as MEMS and MOEMS is considered to be in the range of about −55 ° C. to about + 125 ° C. and the expected temperature for diffusion bonding or soldering is considered to be in the range of about + 250 ° C. to about + 500 ° C. In this case, the type of silicon wafer used for the WLP substrate is said to have a coefficient of thermal expansion in the range of about 2.3 PPM / ° K to about 2.7 PPM / ° K by interpolation. One metal material that is considered suitable for use in the frame / spacer 2014 that will be bonded to a silicon (Si) substrate is known as the “low expansion 39 alloy” developed by Carpenter Specialty Alloys. Alloy. The low expansion 39 alloy has a composition of about 0.05% C, about 0.40% Mn, about 0.25% Si, about 39.0% Ni, and the draw ratio is Fe composition as follows: (Weight percent; nominal analysis). Low expansion 39 alloys range from about 2.3 PPM / ° K between 25 ° C to 93 ° C to about 2.7 PPM / ° K at 149 ° C, about 3.2 PPM / ° K at 260 ° C, 371 ° C. With a coefficient of thermal expansion understood to range up to about 5.8 PPM / ° K.

  Similarly, the type of gallium arsenide (GaAs) used in WLP wafer substrates is believed to have a nominal coefficient of thermal expansion of about 5.8 PPM / ° K. Based on material supplier data, Kovar alloys are understood to have a coefficient of thermal expansion ranging from about 5.86 PPM / ° K at 20 ° C. to about 5.12 PPM / ° K at 250 ° C. Yes. Thus, Kovar alloy appears to be a good choice of frame / spacer 2014 bonded to the GaAs substrate. Another material believed to be suitable for the frame / spacer 2014 bonded to the GaAs substrate is known as Silver developed by Metallurgical Materials Division of Texas Instruments Inc, Attleboro, Massachusetts. Alloy. Silvar ™ is understood to be a derivative of Kovar having a coefficient of thermal expansion close to that of a GaAs device.

For windows / lenses for WLP, Kovar frames such as Corning 7052, 7050, 7055, 7056, 7058 and 7062, Kimble (Owens Corning) EN-I, Kimble K650 and K704, Abrisa lime glass, Schott 8245 and Ohara Corp. -It is contemplated that all of the aforementioned glasses for use in manufacturing single and multiple window assemblies with LAM 60 would be suitable for WLP window / lens 2016 with GaAs substrate 2006. ing. Pyrex glass and similar formations are considered suitable for the WLP window / lens 2016 with the silicon substrate 2006. According to Corning's website, Pyrex® properties include a softening point of about 821 ° C., an annealing point of about 560 ° C., a strain point of about 510 ° C., a working point of about 1252 ° C., about 32.5 × 10 Expansion at ⁻⁷ / ° C. (0-300 ° C.), density of about 2.23 g / cm ³ , Knoop hardness of about 418 and refractive index of about 1.474 (at 589.3 nm).

  Referring now to FIG. 22, a semiconductor wafer 2202 having a plurality of microdevices 2204 formed thereon is illustrated. It will be appreciated that it has become a method standard for producing multiple microdevices on a single semiconductor wafer. However, conventionally, if the microdevice 2204 is of a type that needs to be sealed and packaged before using optoelectronic or optical devices, such as, for example, MEMS, MOEMS, etc., a single micro Wafer 2202 can be, for example, cut into pieces, separated into pieces, or subdivided, and then packaged into individualized microdevices within individual packages, to sections that typically only have devices. Thus, “separation” or “single” first has become an industry standard technique for microdevices. From now on, according to a further embodiment of the present invention, the multiple microdevices remain multiple and either separately sealed and packaged in the WLP prior to substrate wafer isolation or identification, or multiple sealed packages May be used. This process is referred to as a multi-wafer level package, or "MS-WLP", that exists simultaneously.

  Referring now to FIGS. 23-29, one method for MS-WLP of a microdevice is illustrated. Briefly, the method includes a) creating a first frame attachment region on a surface of a semiconductor wafer substrate having a plurality of microdevices, wherein the first frame attachment region is a single region on the substrate. (B) having a plan view surrounding the microdevice; and b) creating a second frame attachment area on the surface of the window (ie, a sheet of transparent material), the second frame attachment area. Comprises a plan view substantially corresponding to the plan view of the mounting area of the first frame, and c) placing the frame / spacer between the frame / spacer, the substrate and the window, the frame / spacer Substantially corresponds to a plan view of each of the attachment regions of the first and second frames and has a plan view corresponding thereto. And-up, d) to encapsulate microdevices, and a step of sealing bonded substrate, the frame / spacer and the window. Where appropriate, other materials, including but not limited to solder preforms or intermediate layers for diffusion bonding, are also placed between the frame / spacer and the window and / or substrate prior to bonding. The

  With particular reference now to FIG. 23, the frame mounting area 2302 of the semiconductor wafer 2202 deposits a metallizing layer on the entire surface of (eg, surrounding) the wafer substrate around each microdevice 2204. Has been created by. In the embodiment shown here, the mounting area 2302 of the created frame is a double-width metallized row 2304 and column 2306 (microdevice 2204) surrounded by a single-width outer row 2308 and column 2310. A rectangular grid composed of). The composition and thickness of the metallization layer in the frame attachment region 2302 is as described above for use in making the seat seal ring region 318 as described in Examples 1-96. Any of them may be used.

  Referring now to FIG. 24, a mounting MS-WLP frame / spacer 2402 between the wafer 2202 and window sheet 2602 of the MS-WLP assembly is illustrated. In this embodiment, the MS-WLP frame / spacer 2402 has a double-width row member 2404 and column member 2406 surrounded by a single-width outer row member 2408 and column member 2410 on the wafer substrate 2202. It will be appreciated that a plan view substantially corresponding to the plan view of the frame mounting area 2302 is provided. As described further below, the purpose of the double-width row member 2404 and column member 2406 is to allow room for cutting the frame during unification of the MS-WLP assembly after joining. In other embodiments, the MS-WLP frame / spacer may have a different configuration. In this embodiment, the MS-WLP frame / spacer 2402 is formed from a metal alloy having a coefficient of thermal expansion that substantially matches the coefficient of thermal expansion of the wafer substrate; however, in other embodiments, the frame / spacer is It will be understood that it may be formed from the aforementioned non-metallic materials. Also as previously described, the frame / spacer 2402 will preferably be plated or metallized to facilitate the bonding process.

  Referring now to FIGS. 25a-25d, details of a preferred configuration for the frame / spacer 2402 are illustrated. FIG. 25a shows an enlarged plan view of a portion of the double width row member 2406 and FIG. 25b shows an end view of the same portion. It will be appreciated that the row members 2404 of the frame / spacer 2402 preferably have a similar configuration. Member 2406 has a “groove” 2502 or has a region of reduced thickness along the center of each member, ie, between adjacent microdevices in the completed MS-WLP assembly. Formed as follows. As described further below, the groove 2502 facilitates breaking the MS-WLP assembly apart during the packaging microdevice isolation. After being cut apart along the groove 2502, the frame member 2406 is divided into two single-width members 2504, each having the configuration shown in FIGS. 25c and 25d. During assembly, the groove member groove side 2505 is preferably positioned relative to the wafer substrate 2202, while the non-groove side 2505 is positioned relative to the window sheet.

  Referring now to FIG. 26, an MS-WLP window sheet 2600 for attachment to the MS-WLP frame / spacer 2402 is illustrated. The window sheet 2600 may be formed from glass or other transparent material having a coefficient of thermal expansion that is compatible with the other main components of the assembly. At least the inside of the sheet 2600 (ie, the side that goes inside the sealed envelope), and preferably both sides, must be optically finished. Any desired optical or protective coating is preferably applied at this point at least on the inside of the sheet 2600 and preferably on both sides. However, if the sheet 2600 is attached only to the frame / spacer 2402 in the first of the two bonding operations, then the optical or protective coating will attach the window assembly to the wafer a second time. It may be applied prior to the subsequent joining step. A frame attachment area 2602 is created in the MS-WLP window sheet 2600 to enclose a plurality of window openings 2603 that are ultimately aligned with the microdevice 2204 in the final MS-WLP assembly. In the illustrated embodiment, the created frame attachment area 2602 is deposited on a sheet 2600 in a rectangular grid of double-width rows 2604 and columns 2606 surrounded by a single-width outer row 2608 and columns 2610. It becomes a metal layer. This provides a plan view for the frame attachment area 2602 that substantially corresponds to the plan view of the frame / spacer 2402. The composition and thickness of the metallization layers 2604, 2606, 2608 and 2610 in the frame attachment area 2602 are determined in creating the “stand alone” window seat seal ring area 318 described in Examples 1-96. Any of those previously described for use may be used.

  In some embodiments, the interior surface of the window sheet 2600 is scribed using a diamond needle, for example, by scribing each portion of the mounting area 2602 of the frame and cutting the MS-WLP assembly apart during isolation. It may be easy to do. The scribing of the window sheet 2600 will of course be performed prior to joining or gluing it to the frame / spacer 2402. If the frame / spacer 2402 includes a groove member as illustrated in FIGS. 25a-25b, the scribing line on the seat 2600 preferably corresponds to the frame member groove 2502 in the MS-WLP assembly. .

  Referring now to FIG. 27, a side view of the completed MS-WLP assembly 2700 is illustrated. It will be appreciated that the proportions of some of the components shown in FIG. 27 (eg, metal layer thickness) may be exaggerated for purposes of illustration. The frame / spacer 2402 is a frame attachment area 2302 that substantially corresponds to the top view of the frame / spacer 2402 such that each microdevice or set of microdevices 2204 is positioned directly below the window opening area 2603 of the window sheet. And 2602 are positioned between the wafer substrate 2202 (related to the microdevice 2204) and the window sheet 2600. Of course, if the assembly 2700 is joined using solder technology, a solder preform (not shown) having a top view substantially corresponding to the attachment areas 2302 and 2602 of the frame is also available prior to joining. Located between the frame / spacer 2402 and the mounting area of the frame. Further, if an inner layer or intermediate layer is used with a diffusion bond, these intermediate layers (not shown) having a plan view substantially corresponding to the attachment areas 2302 and 2602 of the frame are also prior to bonding, Located between the frame / spacer 2402 and the mounting area of the frame. Any of the aforementioned joining techniques may be used to achieve joining between components. The MS-WLP assembly 2700 will look essentially the same before and after bonding (except for incorporation into the bonding area in the form of any solder preform).

  After bonding, the MS-WLP assembly 2700 is cut apart or singulated to form a sealed package, each containing one or more microdevices. There are several options for performing the singulation process. However, because the window sheet 2600, frame 2402, and wafer substrate 2202 are joined, mere scribing or subdivision of the window sheet (as was done for multiple stand-alone window assemblies) is not practical. Instead, at least the window sheet 2600 or the wafer substrate 2202 needs to be cut. The remaining portion may then be cut, scribed or subdivided. The best result is that either a wafer dicing saw is used to cut the wafer substrate 2202, and then the window sheet 2600 is scribed and subdivided, or a similar dicing saw is used to cut the window sheet. It is believed that it would be obtained by

  Referring now to FIG. 28, one option for the uniqueization of the MS-WLP assembly is illustrated. The MS-WLP assembly 2800 shown in FIG. 28 is similar in most respects to the assembly 2700 shown in FIG. 27, however, in this case, the window sheet 2600 is attached to the mounting area of the inner frame (for further use, In addition, when using a layer 2404) that runs perpendicular to it, it is pre-scribed through the metal layer 2406 (indicated by reference numeral 2802). After bonding, the assembly 2800 opens from the outside of the wafer substrate 2202 (as indicated by arrow 2804), completely through the substrate, and the groove of the inner frame / spacer member 2606 (and member 2604 extending perpendicular thereto). It is cut into 2502. However, the cutting 2804 does not continue until the window sheet 2600. Instead, after the wafer substrate 2202 and frame 2402 are cut, the window sheet 2600 is subdivided by bending it along a pre-scribed line 2802. The assembly 2800 may first be subdivided into rows, and then the rows may be subdivided into separate packages along the columns, or vice versa. In another form of this method, the window sheet 2600 is not pre-scribed but is scribed through a cut 2806 formed by cutting through the wafer substrate 2202 and the frame 2402. It will be appreciated that this scribing needs to be strong enough to cut through the frame member 2406 under the groove 2502 and the remainder of the metal layer 2606. The assembly is then subdivided into separate packages along the scribing line as before.

  Referring now to FIG. 29, in another form, the MS-WLP assembly 2900 fully assembles the wafer substrate 2202, frame / spacer 2402, and window sheet 2600 between each microdevice 2204 as indicated by arrows 2902. Is separated by simply cutting through. The result is a plurality of separate WLP microdevices 2904. The discrete cuts may be made from either the window side or the substrate side, however, to protect against breakage during the sawing operation, the outer surface of the window sheet (eg using a protective tape or the like) ) It may be necessary to protect.

  When using electrical resistance heating (“ERH”) to facilitate diffusion bonding or soldering of components of an MS-WLP assembly, current is typically simultaneously applied to both the window / frame junction and the frame / substrate junction. Apply to flow. In order to facilitate this ERH heating, the MS-WLP assembly configuration allows the “sacrificial” metallized areas (ie, areas that are no longer needed) to be placed on the window sheet and wafer substrate to place the ERH electrodes. It may be modified to provide. Preferably, the electrode arrangement in the substrate and window will be accessible to the wafer from a substantially vertical orientation.

  Referring now to FIG. 30, having a plurality of microdevices 2204 formed thereon and a metallization frame attachment region 3002 formed thereon to enclose the wafer 2002 of FIG. 23, ie, microdevices. A wafer 3000 that is similar in most respects to wafer 2002 is illustrated. In this case, however, the wafer 3000 further includes a metallized electrode placement pad 3004 that is placed at one end of the wafer. The electrode placement pad 3004 is in electrical contact with the metallization layers 2304, 2306, 2308 and 2310 of the frame attachment region 3002.

  Referring now to FIG. 31, the sheet 2600 of FIG. 26, i.e., having a metallized frame attachment area 3102 formed thereon to enclose the window opening area 2603 on the sheet, almost eliminates the A window sheet 3100 that is similar in that respect is illustrated. In this case, however, the sheet 3100 further includes a metallized electrode placement pad 3104 disposed at one end of the sheet. The electrode placement pad 3104 is in electrical contact with the metallization layers 2604, 2606, 2608 and 2610 of the attachment area 3102 of the frame.

  Referring now to FIG. 32, an MS-WLP assembly 3200 is illustrated, according to another embodiment. The components of assembly 3200 are positioned such that wafer substrate 3000 and window sheet 3100 are adjacent to frame / spacer 2402, but the corresponding metallized electrode placement pads 3004 and 3104 project to the opposite side of the assembly. This configuration provides unobstructed access to pads 3004 and 3104 in a direction perpendicular to the wafer (as indicated by arrow 3202) and facilitates electrode attachment for ERH procedures. be able to.

  During the bonding of the WLP assembly, there are usually two bonds that should occur simultaneously, the bond point between the frame / spacer and the window sheet and the bond point between the frame / spacer and the wafer substrate. However, as described above, the window may be initially joined only to the frame, and later the ERH can be used to attach the window / frame assembly to the device substrate. As described above in the process for manufacturing a stand-alone window assembly, the construction of the metal frame and the placement of the ERH electrodes are also critical in heating using ERH heating techniques. Similarly, for MS-WLP devices, the metallization pattern and the ERH electrode placement location on the wafer substrate and window sheet may be important to obtain uniform heating. Thus, the frame size / shape, possibly including excessive or sacrificial features, and the metallization pattern of both the window sheet and wafer substrate are designed to ensure uniform heating of the bonding surface / appearance Modeling (eg, using software simulation) and prototyping should be done simultaneously.

  It will be appreciated that the previous embodiments describe a method for manufacturing an MS-WLP assembly suitable for microdevices having opposite electrical connection pads. Referring now to FIG. 33, a microdevice having ipsilateral electrical connections is illustrated. The micro device 3300 is disposed on one side of the semiconductor substrate 3302. A plurality of vias 3304 extend from the active area of the microdevice through the substrate to a plurality of connection pads 3306 disposed on the same side of the substrate. Obviously, the electrical connection pads 3306 need to be accessible even after the microdevice 3300 is sealed in a sealed package. In the following embodiments, another method for manufacturing an MS-WLP assembly suitable for use with such microdevices having ipsilateral connections is presented.

  Referring to FIG. 34, there is illustrated a wafer 3402 having multiple microdevices 3300 formed on a wafer 3402, each microdevice having one or more sets 3403 of associated ipsilateral connection pads 3306. . According to this embodiment, the plurality of microdevices 3300 are separately sealed packaged in WLP prior to the separation of the substrate wafer 3402, however, the electrical connection pads 3306 on the same side remain accessible. To do. The steps of this embodiment are similar in many respects to the previous embodiment, except for the modifications described below.

  Referring now to FIG. 35, the frame attachment region 3502 of the semiconductor wafer 3402 is first created in this case by depositing a metallization layer on the surface of the wafer substrate surrounding each microdevice 3300. In the illustrated embodiment, the created frame attachment area 3502 includes three "ladder" grids 3503, each of which has a double-width metallization row 3504 (ie, a ladder "crosspiece") and It consists of a single width row 3506 (the “side” of the ladder) connected by a bus strip 3508 at each end. The composition and thickness of the metallization layer at the frame attachment region 3502 may be any of those already described for use in creating the seat seal ring region or the frame attachment region.

  Referring now to FIG. 36, an MS-WLP frame / spacer 3602 for mounting the MS-WLP assembly between the wafer 3402 and the window sheet 3702 (FIG. 37) is illustrated. In this embodiment, the MS-WLP frame / spacer 3602 is configured into a plurality of ladder-shaped portions 3603, each of which is a plane substantially corresponding to a ladder-shaped plan view 3503 of a frame attachment area 3502 on the wafer substrate 3402. It will be appreciated that it has a double-wide crosspiece member 3604 and a single-wide side member 3606 that are configured to have a view. Ladder-shaped portions 3603 are attached and held relative to each other by connecting members 3608 disposed at opposite ends of the frame / spacer 3602. As in the previous embodiment, the double width member 3604 provides room to cut the frame 3602 between the microdevices during the singulation of the MS-WLP assembly (ie, after bonding). In a preferred embodiment, the double width member has a groove cross section (eg, similar to that shown in FIGS. 25a and 25b) to facilitate cutting apart. However, in other embodiments, the MS-WLP frame / spacer may have a different configuration. In this embodiment, the MS-WLP frame / spacer 3602 is formed from a metal alloy having a coefficient of thermal expansion that substantially matches the coefficient of thermal expansion of the wafer substrate; however, in other embodiments, the frame / It will be appreciated that the spacer may be formed from the aforementioned non-metallic materials. As further noted above, the frame / spacer 3602 is preferably plated or metallized to facilitate subsequent bonding steps.

  Referring now to FIG. 37, an MS-WLP window sheet 3700 for attaching an MS-WLP frame / spacer 3602 is illustrated. The window sheet 3700 is formed from glass or other transparent material having a coefficient of thermal expansion that is compatible with the other main components of the assembly. At least the inside of the sheet 3700 (ie, the side that is inside the sealed envelope) (and preferably both sides) is optically finished and any desired optical or protective coating is placed in place inside. Before and after any desired optical or protective coating is also placed in place inside (and preferably on both sides) of sheet 3700, a plurality of final alignments with microdevice 3300 in the final MS-WLP assembly A frame attachment area 3702 is created on the MS-WLP window sheet 3700 to surround the window opening 3705. In the illustrated embodiment, the created frame attachment region 3702 includes a metal layer deposited on the sheet 3700 with a plurality of ladder-shaped portions 3703, each portion having a double-width transverse beam member 3704 and A single width side member 3706 is included. Each ladder portion 3703 has a plan view substantially corresponding to the plan view of the ladder portion 3603 of the frame / spacer 3602. The method and procedure for window sheet 3700, including the composition and thickness of metallization layers 3704 and 3706 at frame attachment area 3702, is the "stand alone" window seal sheet seal ring area 318 and MS-WLP window. Any of the above-described ones used when creating the frame attachment region 2602 of the seat 2600 may be used.

  In the embodiment illustrated in FIG. 37, the metallization layer of window sheet 3700 included additional portions configured to extend beyond ladder portion 3703 and facilitate resistance heating (ERH). These additional portions include an electrode attachment portion 3708 and a bridge portion 3710, both of which are electrically connected to the metallization layers 3704 and 3706 of the ladder portion 3703. The configuration, eg, placement and thickness, of these electrode mounting portions 3708 and bridge portions 3710 is such that the flow of ERH current passes through the interface between the metallized portion of the window sheet 3700 and the frame / spacer 3602, and the frame By adjusting the heating at these contact surfaces during the ERH-promoted bonding operation by passing through the contact surfaces between the spacer 3602 and the metallized portion of the substrate 3402.

  As in the previous embodiment, the internal surface of the window sheet 3700 is used to facilitate subdivision of the MS-WLP assembly during singulation, for example using a laser or diamond needle, etc. Scribing may be performed through respective portions of the frame attachment region 3702. If the frame / spacer 3602 includes a groove member as illustrated in FIGS. 25a-25b, the scribing line on the window sheet 3700 preferably corresponds to the frame member groove 2502 in the MS-WLP assembly. To do.

  Referring now to FIG. 38, each component ladder region 3503, 3603 and 3703 substantially corresponds to each other, and the microdevice 3300 is positioned directly below the window opening region 3705 of the window sheet. FIG. 9 illustrates a top view of a completed MS-WLP assembly 3800 including a wafer substrate 3402, a frame / spacer 3602 and a window sheet 3700 stacked together. In this embodiment, it is understood that the configuration of wafer 3402 and window sheet 3700 are complementary to facilitate the placement of ERH electrodes. In particular, the portion of the wafer 3402 with the metallized bus strip 3508 protrudes beyond the edge of the sheet 3700 (when viewed from above), allowing one set of ERH electrodes to be connected from above vertically, The portion of the sheet with metallized contact portion 3708 protrudes beyond the edge of the wafer (when viewed from below), allowing one set of ERH electrodes to be connected from below vertically.

  Of course, if the assembly 3800 is to be joined using solder technology, the result is that a solder preform (not shown) having a plan view substantially corresponding to the attachment area of the frame is also prior to joining. Thus, the window sheet 3700 and the frame / spacer 3602 of the substrate 3402 are disposed between the frame mounting region and the frame mounting region. Any of the aforementioned joining techniques may be used to achieve joining between components. If the assembly 3800 is to be bonded using diffusion bonding techniques, when using intermediate layer preforms (not shown), these preforms are planes substantially corresponding to the mounting area of the frame. And is positioned between the frame / spacer 3602 and the frame mounting area of the window sheet 3700 and / or between the frame / spacer 3602 and the substrate 3402 prior to joining. The MS-WLP assembly 3800 will look essentially the same before and after bonding (except for anything previously formed with solder for diffusion bonding or incorporation into an intermediate layer).

  After bonding, the window sheet 3700 of the assembly 3800 has a main strip portion 3802 lying on top of a plurality of encapsulated microdevices 3300, a second strip portion 3804 lying between the strips or lying on an unencapsulated contact pad 3403. , And an end strip portion 3806 disposed at each end of the window sheet and lying in a row of unencapsulated contact pads 3403. During the unification of the assembly 3800, the second strip portion 3804 and the end strip portion 3806 of the window sheet are each cut away and made unnecessary, and these portions are essentially “sacrificial”. Further, during unification, the substrate 3402 is divided along a cutting line (indicated by arrow 3808) between the rows of microdevices 3300 and the contact pads 3403 to form a multi-unit strip. The Window sheet separation may be performed using a saw, laser, or other conventional means, but substrate separation may be performed by sawing, laser, or snapping along the score line. .

  Referring now to FIGS. 39 and 40, the singularization of the MS-WLP assembly 3800 is illustrated. Referring initially to FIG. 39, a multi-unit strip 3900 separated from the MS-WLP assembly 3800 is shown. The multi-unit strip 3900 includes a plurality of microdevices 3300 on a portion 3902 of the original wafer substrate 3402, the microdevice having one or more microdevices under each window portion 3705 of the original window sheet. Enclosed in adjacent sealed envelopes, but their associated electrical contact pads 3403 are not encapsulated. In this embodiment, the multi-unit strip 3900, corresponding to the center of the frame member 3604 that separates adjacent sealing envelopes, is further cut or uniqued along the cutting line 3904. The result is a plurality of separate sealed WLP packages that contain one or more microdevices under each window portion 3705. An example of a separate WLP package 4000 produced by this method is shown in FIG.

  During the singulation of the multi-unit strip 3900, at least the window sheet 3700 or wafer substrate portion 3902 needs to be cut. The remaining portion may then be cut, scribed or subdivided. The best results are by either cutting the wafer substrate portion 3902 using a wafer dicing saw and then scribing and subdividing the window sheet 3700 or cutting the window sheet using a similar dicing saw. It is believed that it will be obtained.

  As already described and illustrated (eg, in FIGS. 15a-19f), when making multiple cover assemblies simultaneously, or as already described and illustrated (eg, in FIGS. 22-40), When making wafer level packages at the same time, the frame sidewalls between adjacent frame openings include a reduced cross-sectional thickness area, and bonded multi-unit assemblies can be separated into separate window assemblies or separate wafer level packages. To make it easy to singulate (ie split). As best seen in FIGS. 15a-16b, 17b, 25a-25b, 27 and 32, this reduced cross-sectional thickness region is formed in the frame sidewall between adjacent frame openings. V-shaped indentation. However, alternative frame designs are those already described to make frame processing of bonded multi-unit assemblies easier and / or easier to simplify and into separate window assemblies or separate wafer level packages. It will be understood that a substitution may be made.

  Referring now to FIG. 41, a portion (in side view) of a plurality of simultaneous wafer level package assemblies 4100 incorporating one alternative frame design is illustrated. It will be appreciated that assembly 4100 is shown prior to uniqueization into a separate package. It will be further appreciated that assembly 4100 is similar in most respects to the MS-WLP assembly previously described and illustrated in FIGS. The assembly 4100 includes a wafer substrate 4104 having microdevices 4106 formed (and / or fitted) on the wafer substrate 4104 and a frame 4102 that is hermetically bonded to the transparent window sheet 4108 so that adjacent frame openings 4114 are in between. Form a plurality of separate sealed units 4110 that can be unique (eg, along line 4112) to form separate sealed packages. Diffusion bonding, or any of the bonding techniques already described, may be used to achieve a seal between the frame 4102, the substrate 4104, and the sheet 4108. As in the previous design, when viewed in a plan view (ie, from above as in FIG. 24), the side walls of the frame 4102 surround the frame opening 4114 and also in the plan view of a given frame attachment area of the seat 4108. It has a substantially equivalent top plan view. Further, as in the previous design, when viewed from the front, the sidewall disposed between adjacent frame openings 4114 includes a reduced cross-sectional thickness region. However, in this embodiment, the reduced cross-sectional thickness region of the frame 4102 is in the form of a relatively thin connection knob 4116 extending between the two relatively thick sidewall members 4118. In FIG. 41, undivided inner frame sidewalls are denoted by reference numeral 4120.

  The connection knob 4116 of the sidewall 4120 is characterized by a relatively constant vertical thickness Tcτ that is significantly smaller than the overall vertical thickness Tsw of the adjacent sidewall member 4118. Preferably, the value of the connection knob thickness Tcτ is less than 25% of the value of the overall sidewall member thickness Tsw. More preferably, the thickness Tcτ of the connection knob is less than 10% of the value of the sidewall member thickness Tsw, and in some cases the value of Tcτ is less than 5% of the value of Tsw. During processing of a multi-unit assembly, the relatively thin connection knob 4116 of this design is strong enough to maintain the structural integrity of the overall frame 4102. However, during unification, the relatively thin connection knob 4116 can be cut with little chance of damaging or distorting the adjacent, relatively thick sidewall member 4118, or damaging the unit seal. In addition, the relatively thin connection knob 4116 can also be used as a unique device, such as a dicing saw, laser, etc., for a reduced cross-sectional area of the frame, and sometimes the substrate 4104 and / or window sheet 4108 in the same operation. Makes it easier to open.

  Referring now to FIGS. 42a-42e, there are illustrated several alternative frame designs that can be used for either making multiple cover assemblies at the same time or making multiple wafer level packages at the same time. Yes. Each figure shows a cross-sectional view of an undivided inner sidewall 4120 having a reduced cross-sectional thickness region consisting of a relatively thin connection knob 4116 extending between two relatively thick sidewall members 4118. Sidewall 4120 is designed to be unique along the line indicated by arrow S. It will be appreciated that the entire frame 4102 will consist of many such sidewalls arranged in a grid pattern to form the separation openings. Connection knob 4116 includes, but is not limited to, between sidewall members 4118, upper end (FIG. 42a), middle (FIG. 42c), lower end (FIG. 42e), upper middle or lower middle position (FIGS. 42b and 42d). It may be placed in any desired vertical position. It would be impractical to show all possible vertical positions of the connecting knob 4116, although the connecting knob is significantly more than the overall vertical thickness Tsw of the adjacent sidewall member 4118. If it has a relatively constant vertical thickness Tcτ that is small, preferably less than 25% of Tsw, more preferably less than 10% of Tsw, and occasionally less than 5% of Tsw, such a design is It will be understood that it falls within the scope.

  Referring now to FIGS. 43a-43e, further frame designs are illustrated by showing undivided sidewalls 4120 in the same manner as FIGS. 42a-42e. Sidewall 4120 has only a single connection knob 4116 extending between sidewall members 4118 (FIG. 43a), while it also has two (FIGS. 43b and 43c), three (FIG. 43d), extending between sidewall members. 4 (FIG. 43e), or more connection knobs. Further, the plurality of connection knobs 4116 may be placed in any desired vertical position between the side wall members 4118, including but not limited to upper and lower ends (FIG. 43b) or intermediate positions (FIG. 43c). Good. It would be impractical to indicate all possible numbers of connection knobs 4116 and all possible vertical positions of connection knobs, although each connection knob may be adjacent to a side wall member. A relatively constant vertical thickness that is significantly less than the overall vertical thickness Tsw of 4118, preferably less than 25% of Tsw, more preferably less than 10% of Tsw, and occasionally less than 5% of Tsw. It will be understood that such a design is within the scope of the present invention if it has a thickness Tcτ.

  Referring now to FIGS. 44a-44e, further frame designs are illustrated by showing undivided sidewalls 4120 in the same manner as FIGS. 42a-43e. Although the side wall member 4118 may generally be rectangular in cross-sectional configuration (as shown in FIGS. 42a-43e), this is not essential. Rather, the sidewall members 4118 may have a cross-sectional configuration that tapers (ie, narrows) as they progress vertically from the location of the connection knob 4116. The connection knob 4116 further includes an upper end (FIG. 44a), a center (FIG. 44c), a lower end (FIG. 44e), an upper middle or lower middle position (FIGS. 44b and 44d), between but not limited to between the side wall members 4118. It may be placed in any desired vertical position. This results in some designs that taper in a single direction (eg, FIGS. 44a and 44e) and some designs that taper in both directions (eg, FIGS. 44b-44d). The tapered sidewalls 4118 of these designs may improve manufacturing quality if, for example, the frame is cast or embossed and needs to be removed cleanly from the tool. It would not be practical to illustrate all possible vertical positions of the connecting knob 4116 and the tapered configuration of the side wall member 4118, although at least one of the side wall members is tapered. Having a cross-sectional configuration and the connection knob is significantly less than the overall vertical thickness Tsw of the adjacent sidewall member, preferably less than 25% of Tsw, more preferably less than 10% of Tsw; It will also be understood that such designs are within the scope of the present invention if they have a relatively constant vertical thickness Tcτ, sometimes less than 5% of Tsw.

  Referring now to FIGS. 45a-45f, further frame designs are illustrated by showing undivided sidewalls 4120 in the same manner as FIGS. 42a-44e. In these designs, single, double, or multiple connection tabs 4116 extend between sidewall members 4118 having a single, double, multiple taper cross-sectional configuration. For example, the side wall 4120 of FIG. 45a has a single connection knob and a unidirectional taper, while the design of FIG. 45f has multiple (ie, three) connection knobs and multiple (ie, six) tapers. Have Some more complex configurations may be unsuitable for conventional stamping or casting production, and instead other manufacturing methods such as extrusion or photochemical machining (discussed further below) Need to be formed using. It would be impractical to illustrate all possible cross-sectional configurations for these sidewalls 4120, although a cross-sectional configuration in which at least one of the side wall members is tapered. Each connecting knob is significantly less than the overall vertical thickness Tsw of adjacent sidewall members, preferably less than 25% of Tsw, more preferably less than 10% of Tsw, and occasionally Tsw It will be understood that such designs are within the scope of the present invention if they have a relatively constant vertical thickness Tcτ of less than 5%.

  Referring now to FIGS. 46a-46d, some internal sidewall 4120 portions are shown in plan view (ie, from above) to better illustrate the configuration of the connection knob 4116. It will be appreciated that the side walls 4120 extend beyond what is shown in the figure to form a finished frame grid. As can be seen in the plan view, the paired sidewall members 4118 of the inner sidewalls 4120 are typically located parallel to each other, but the connecting knob 4116 may extend continuously between the sidewall members, or they may be intermittent. It may be. Further, the connection knob 4116 may be perforated by longitudinal or lateral perforations. For example, in FIG. 46a, the inner sidewall (indicated by 4120 ') has a connection knob 4116, which is a non-hollow piece extending between two sidewall members 4118. In this embodiment, the knob 4116 is not continuous anywhere between the side wall members 4118 but rather has a fixed length L. Similar further disconnect connection knobs 4116 may be provided intermittently at other locations between the side wall members 4118 as desired. In contrast, another internal sidewall (shown as 4120 ") in Fig. 46b has a connection knob 4116 that extends continuously between two sidewall members 4118. In this embodiment, the longitudinal perforations 4602 have a respective sidewall. Formed in a connection knob along the member to facilitate separation of the side wall member during singulation. Figure 46c shows a third internal side wall (indicated by 4120 '' '. Connection of side wall 4120' '' The knob 4116 has a fixed length L and it now has a longitudinal perforation 4604 formed along the center of the knob to facilitate separation of the side wall member 4118 during unification. , Shows a fourth internal side wall (indicated by 4120 ′ ″). The connection knob 4116 on the side wall 4120 ″ ″ is formed laterally across the fixed length L and the knob from one side wall member to the other. It has perforations 4606. The non-airborne knobs will preferably be cut apart by laser or mechanical (eg sawing, shearing, etc.) The perforated knobs are separated in a similar manner. Although it may cut | disconnect, you may isolate | separate by further bending along the perforation | twisting or twisting repeatedly.

  Whether for separate units or multiple units, the cover assembly or the frame of the wafer level package may be processed using photochemical machining (also known as PCM). . Photochemical machining is a material removal process that uses an etchant (eg, acid) to the “machine” precision part without cutting. PCM can also be used for non-metallic materials (eg, glass, semiconductor, ceramic, etc.) using a suitable etchant, but it is typically used to form metal parts. Briefly, the desired component outline is first imaged as a photograph on a sheet of metal or other material processed using a light-resistant material. After processing, unwanted material (ie, material that is not protected by the resist material) is removed by etching, recreating the original contour, free of stress, nicks, and as uniform as the etched parent sheet. Become. Due to the specific physical properties of the etching process, the maximum sheet thickness that can be satisfactorily processed using PCM is limited. However, if a frame that is thicker than this maximum thickness of the sheet is desired, a multi-layer frame assembly may be used as described below.

  In yet another aspect, a multi-layer frame assembly (also known as a laminate frame) is fabricated from multiple thin, pre-formed sheets that are stacked and joined to a single unit frame. Also good. Each sheet may be pre-formed to have the desired cross-sectional profile for each location in the finished frame, thereby reducing or eliminating the need for further processing after joining. The sheet may be formed by PCM, stamping, cutting, casting or other known processing methods. The sheet in the multilayer frame may be made from any of the frame materials disclosed in the present invention. Diffusion bonding (i.e., thermocompression bonding) may be used to laminate the sheets together, as with other manufacturing methods such as conventional soldering, brazing, and the like. The multi-layer frame assembly can also be used to fabricate a relatively complex structure, eg, a frame having a flange frame as shown in FIG. 20a, with different contours for different layers.

  It will be appreciated that the various layers of the multilayer frame need not necessarily be made of the same material. It is only necessary that the materials of the directly adjacent sheets can be sealed together. Thus, various metals, non-metals, or combinations of metals and non-metals may be combined together to form a multilayer frame. Such a lamellar frame using “mixed material” allows the mechanical, thermal, electrical and / or scientific properties of the frame to be customized. For example, the multilayer frame can be made from different materials on the top and bottom surfaces to facilitate bonding to different window and substrate materials. In another example, the overall coefficient of thermal expansion of the resulting multilayer frame may be customized by laminating sheets of material having different coefficients of thermal expansion.

  Referring now to FIGS. 47 and 48, an assembly diagram of a multilayer frame fabricated from a sheet made by photochemical machining (PCM) is illustrated. Although this example uses PCM, a similar general recipe with only relatively minor modifications can be used if the sheet is processed using the alternative method described above. FIG. 47 shows a plan view of assembly 4700, while FIG. 48 shows a cross-sectional front view. The assembly 4700 of this embodiment includes four layers 4701, 4702, 4703, and 4704. Each layer is machined by PCM and includes a plurality of separate frames 4705, each frame including a continuous sidewall 4706 that surrounds and defines a frame opening 4708. The plan view of the sidewall 4706 on each layer 4701, 4702, 4703 and 4704 of the assembly 4700 at least partially overlaps the top view of the sidewalls of adjacent layers over the entire periphery of each frame opening 4708 and It will be appreciated that the plan view of layer 4701 will also substantially correspond to the plan view of the frame mounting area on the window sheet (not shown) to which the frame assembly will be connected. In the illustrated embodiment, the top views of the sidewalls 4706 on the respective layers 40701, 4702, 4703, and 4704 are substantially the same, however, such identity of structure is not required in all embodiments (ie, The flange frame will have at least some layers with non-identical plan views). Frame sidewalls 4706 located between the two frame openings 4708 in each seat are held in place by connection knobs 4710 similar to those shown in FIGS. 46a and 46c. However, in this case, the connection knob 4710 is usually (although not always) having the same vertical thickness as the original sheet thickness. To facilitate later identification, the connection knobs 4710 of the different layers 4701, 4702, 4703, and 4704 "alternately overlap" with respect to different positions on each layer, so that any Minimize the thickness of a single knob. Further, these connection knobs 4710 may be desired non-hollow or perforated. Additional connection knobs 4712 are used to connect the frame sidewalls 4706 of each layer to the outer frame 4714.

  After PCM machining, the four layers 4701, 4702, 4703 and 4704 are stacked and bonded together as described above. The completed frame assembly 4700 is then hermetically bonded to a single window sheet and / or substrate as described above to create a multiple unit cover assembly or multiple unit wafer level package assembly. The completed multiple unit assembly is later uniqueized by cutting through the window sheet and connecting the connection knobs and substrates (if appropriate) between the separate frame units 4705 to form multiple separation units. Alternatively, rather than joining the finished frame assembly 4700 to a single window sheet, a plurality of relatively small individual window sheets are each at the top of each individual frame unit 4705 (ie, one window sheet per frame unit). It may be placed, held in place using appropriate tools, and sealed together. This eliminates the need to cut out the window sheet during unification after bonding, and similarly, instead of bonding the finished frame assembly 4700 to a single substrate, a plurality of relatively small individual substrates (ie, , One substrate per frame unit 4705) may be collectively in sealing contact with the frame assembly 4700. Although these processing methods may be used, many other processing methods and industrial tools previously disclosed herein for hermetic bonding of window assemblies and wafer level packages are also included in the PCM frame assembly. It will be understood that it may apply.

  Referring now to FIG. 49, a perspective view of a multi-unit assembly 4900 of a PCM machined frame suitable for resistance seam welding is illustrated. It will be noted that the separate frame 4902 consists of a flange design with a flange shape on the bottom PCM layer 4904 and a non-flange shape on the upper PCM layer (s) 4906. As described above, the provisional connection knob 4908 can be compared during the process of adhering the frame assembly to a single large window sheet, or multiple relatively small window sheets (ie, one per frame unit 4902). The individual frame units 4902 are grouped together for easy handling of materials and so that a relatively simple tool is required.

  In yet another application of this discovery, the transparent glazing is hermetically bonded to the opposite side of a metal or non-metal spacer, for residential and commercial buildings, for household goods and industrial equipment, and for aircraft and other vehicle windows. For this purpose, a sealed multiple glass thermally insulated window assembly is made. Like conventional insulating windows, the spacers maintain adjacent sets of gaps in the glazing. The space within this gap (ie, the gap cavity) may contain a gas such as air, nitrogen or argon, or may be incomplete vacuum. The contents of the gap cavity provide thermal insulation by reducing the flow of heat through the window. However, conventional insulating windows use either non-sealing mechanical means (eg, clamps, gaskets) or non-sealing adhesives such as rubber, glue, epoxy, resin, etc., and attach the glazing to the spacer. As a result, it is well known that conventional insulating windows cause leakage between the gap cavity and the external perimeter over time. In contrast, a true hermetic multiple window frame insulating window assembly can maintain hermetic integrity permanently.

  Referring now to FIGS. 50 and 51, a basic sealed multiple glass window assembly, ie, a sealed double glass window assembly 5000 is illustrated. It will be appreciated that the relative dimensions of the assembly 5000 are exaggerated for illustrative purposes. The sealed window assembly 5000 includes a spacer 5006 having an upper transparent glazing 5002, a lower transparent glazing 5004, and a continuous sidewall 5008 that defines a gap cavity 5010 in the sidewall. Upper glazing 5002 and spacer 5006 are stacked with lower glazing 5004 (indicated by arrows in FIG. 50) and then glued or joined to create a hermetic seal between each glazing and spacer. If specific gas mixing, pressure or other conditions in the gap cavity 5010 are desired, they may be taken in prior to or during the joining phase of the assembly. After bonding, the gap cavity 5010 is sealed against any movement of gas to or from the environment. The completed assembly 5000 (FIG. 51) can be used “as is” or can be incorporated into a more sophisticated assembly as described below.

  In some cases, it may be desirable or necessary to incorporate the desired gas or incomplete vacuum into the gap cavity 5010 between the panes 5002 and 5004 after the pane is joined to the spacer 5006. To do this, a passage may be formed in the wall 5008 of the spacer 5006 and a valve or pinch-off tube may be provided outside the spacer. This may be done before or after joining. Next, after bonding, the desired atmosphere (including vacuum or incomplete vacuum) may be taken into the gap cavity 5010 through a valve or pinch-off tube. Obviously, if undesired gases remain in the gap cavity as a byproduct of the bonding process, first use a valve or pinch-off tube to drain them from the gap cavity and then capture the desired gas or atmosphere. Also good. When the gap cavity atmosphere is in the desired state, the bulb or pinch-off tube may be sealed, for example, by soldering or welding to close it, maintaining the desired long term seal of the window assembly.

  The mating surfaces of glazings 5002, 5004 and / or spacers 5006 (ie, “seal ring regions”) may require various pretreatment or finishing operations prior to the bonding operation. Appropriate pre-processing and finishing operations are described herein in connection with window assemblies and wafer level packaging and will not be repeated. However, it will be appreciated that such pretreatment and finishing operations can be applied to the processing of sealed multiple glass window assemblies.

  The panes 5002 and 5004 of the sealed window assembly 5000 are typically formed from glass, however, other transparent materials may also be used. For example, quartz, silicon, sapphire and other transparent minerals may be used. When applied to specific radiology, certain metals, metal alloys and ceramics are considered “transparent” (eg, for X-rays), and therefore in such applications these materials are also windowed It may be used for glasses 5002 and 5004. Transparent resins such as polycarbonate may also be used, however, these materials use a spacer on the glazing itself (a spacer is used so that a true “sealed” assembly cannot be permanently maintained. Allow gas diffusion (as opposed to hermetic joints).

  Further, the glazings 5002 and 5004 of the sealed window assembly 5000 are typically flat on the side (ie, viewed from the side) and rectangular in shape (ie, viewed perpendicular to the sheet). This is not mandatory. The panes 5002 and 5004 may be concave, convex or otherwise curved on the sides, and each pane is paired with a spacer 5006 continuously around the entire upper or lower (possibly) perimeter. If so, each pane may have a different side. In other words, during the bonding process, the respective surfaces of the glazings 5002 and 5004 need to be in intimate contact with the respective surfaces of the spacers 5006 to be bonded. Similarly, glazings 5002 and 5004 may be any shape including circular, oval and triangular as long as correspondingly shaped spacers 5006 are used.

  The spacer 5006 of the sealed window assembly 5000 is typically assumed to be metal or metal alloy stamped, extruded, cast or other part processed or joined (if necessary) to continuously surround the gap cavity. (It is understood that the spacer itself needs to seal and resist gas diffusion therethrough and out of the gap cavity). For large window assemblies, aluminum or aluminum alloy may be used for spacer 5006, especially where cost is an important consideration. However, it is not necessary to use a metal or metal alloy for the spacer 5006 and may not even be preferred in some applications. Other materials considered suitable for forming the spacer 5006 include glass, ceramic, composite materials, woven fabric encapsulated in composite materials, and materials consisting of combinations of the above materials (metals and metal alloys). Including, but not limited to). Further, some or all of the surface of the spacer 5006 may be coated or plated to facilitate bonding to the glazing. Suitable coatings are believed to include, but are not limited to, glass, metals, metal alloys, ceramics, composite materials, and woven fabrics encapsulated in composite materials.

  A preferred process for sealingly bonding the transparent glazings 5002 and 5004 to the spacer 5006 is currently considered to be diffusion bonding. As mentioned above, diffusion bonding is a process in which the joints can be made between similar or different metals, alloys, and / or non-metals by causing diffusion of atoms across the surface contact surface. is there. This diffusion is effected by applying pressure and heat to the surface contact surface for a specified time. The variables during joining, such as temperature, load (ie pressure) and time, depend on the type of material to be joined, the surface finish and the expected use conditions.

  As mentioned above, a very important physical property of diffusion bonding is the quality of the joint produced. Diffusion bonding is known to be the only process that preserves the inherent properties of monolithic materials in both metal-to-metal and non-metal containing joints. With appropriately selected process variables, ie temperature, indentation load, and time, the material at the joint (and adjacent to it) will have the same strength and plasticity as most of the matrix (s) Would have. When processing under vacuum, the mating surfaces are not only protected from further contamination, such as oxidation, but also oxides exhibit dissociation, sublimation or dissolution and diffuse into most of the matrix. May be cleaned. Excellent diffusion bonding (sometimes known as “diffusion welding”) is free of incomplete bonding, oxide content, low and high temperature cracks, voids, warping, loss of alloying elements, and the like. As a result, there is no need for flux, electrodes, solder, fillers, etc. if the bonding surface is truly tightly bonded. Diffusion bonded parts usually retain their original maximum tensile strength, bending angle, impact toughness, vacuum tightness, etc.

  In some cases, the bonding process of bonding the glazings 5002 and 5004 to the spacer 5006 can include one or more gases (which can increase or decrease oxide under vacuum or incomplete vacuum (ie, a discharge chamber)). It is envisioned that it will be performed under an incomplete vacuum with but not limited to hydrogen) or an incomplete vacuum with one or more inert gases such as argon. In other cases, the bonding process may be performed in a special atmosphere that increases oxidation of the frame material and / or glass. This special atmosphere can be negative pressure, ambient pressure, positive pressure with the addition of one or more gases, which may promote (instead of reducing) oxidation of the frame material and / or glass. Gases added to promote oxidation include, but are not limited to oxygen.

  In some cases, it is envisioned that the joint between glazings 5002 and 5004 and spacer 5006 may include a chemical bond between the spacer material and the glazing material. This chemical bonding material can be added to true diffusion bonding (ie, atomic diffusion). In another case, the chemical bonding material may show little evidence of atomic diffusion.

  For some combinations of materials, the surface finish and processing conditions, the glazing and spacer and diffusion bonding process in a sealed multiple glazing window assembly are placed between the glazing and spacer during the diffusion bonding process It may be facilitated by using intermediate layers of different materials (also known as “intermediate layers”). The intermediate layer is hereinafter referred to as a mating surface activator; a highly ductile contact surface between two substrates with low ductility; a compensation factor for stresses that occur when the joint includes materials with different thermal expansion properties; Mass transfer and / or chemical reaction facilitators; believed to serve one or more of buffering factors that prevent the formation of undesirable phases at the junction. As mentioned above, the intermediate layer can be screened on metal, metal alloy, glass material, solder glass material, tape-like solder glass, sheet-like glass, paste-like solder glass, dispensing or window glass or spacer Paste to be applied by printing, powdered solder glass, glass powder mixed with water, sprayed, brushed or otherwise applied to spacer contact surface or window glass contact surface or otherwise Or a material composed of a combination of glass and metal and / or metal alloy.

  After joining, the finished sealed composite glass window assembly may be used in almost any application where a conventional insulated glass window is used. However, unlike conventional windows, the sealed window assembly does not lose hermetic integrity. This allows sealed window assemblies to be installed in residential and commercial buildings (for example, to reduce warranty requirements due to fogging or condensation between panes), appliances such as ovens, or harsh, or Suitable for use in hazardous environments (eg, chemical plants, nuclear power plants, outer space, etc.).

  Referring now to FIGS. 52 and 53, a raising and lowering window unit comprising a pair of sealed double glass window assemblies similar to that shown in FIGS. 50 and 51 is illustrated. Raising and lowering window unit 5200 includes respective upper window frame 5202 and lower window frame 5204 that are slid into frame / rail assembly 5206. A sealed double glass window assembly 5000 is fitted into the respective window frames 5202 and 5204. The completed raising / lowering window unit 5200 (FIG. 53) can be attached to a green building frame (not shown), such as a conventional window unit. The raising and lowering window unit is only one example, and a sealed multiple glass window assembly may also be used for fixed frame windows, entry / exit windows, glass sliding doors, casement assemblies, and many other buildings and structures, It will be understood that they are not so limited.

  Referring now to FIGS. 54 and 55, another sealed multiple glass window assembly, ie, a sealed triple glass window assembly 5400 is illustrated. It will be appreciated that the relative dimensions of assembly 5400 are exaggerated for illustrative purposes. Similar to the double window frame assembly 5000 described above, the triple window frame assembly 5400 includes a transparent pane 5402 and a spacer 5406 having a continuous sidewall 5408 defining a gap cavity 5410 within the sidewall. In this embodiment, however, there are three panes 5402 sandwiched by two spacers 5406. Further in this embodiment, the spacer 5406 includes a pinch-off tube 5407 that is connected to the passage 5409 through the spacer wall. As described above, the pinch-off tube allows the atmosphere of the gap cavity 5410 to be adjusted after bonding. Upper window glass 5402 and spacer 5406 are stacked on lower window glass 5402 (indicated by arrows in FIG. 54). The stack is then joined as described above to form a hermetic seal between each windowpane and spacer. The methods and principles of processing of the sealed double and triple glass window assemblies disclosed herein may be easily extended and are 3, 4, 5. . . (N-1) 4, 5, 6 between the spacers. . . It will be appreciated that it is possible to process a sealed window assembly having n panes.

  Referring now to FIG. 56, there is illustrated one instrument for simultaneously producing multiple sealed multi-window frame insulated window assemblies by securing multiple sets of window components for simultaneous diffusion bonding. ing. Fixed article instrument 5600 includes a base 5601 on which three sets of panes 5602 and spacers 5606 similar to those described in FIGS. 50-51 are stacked. A hydraulic or pneumatic ram 5608 applies pressure (ie, a load) against the top of the laminate and presses the glazing and spacer elements together (to the base) during bonding. Under the expected bonding conditions, a partition 5610 formed from a material that is not bonded to the glazing 5602, base 5601, or ram 5608 separates adjacent glazings (ie, those belonging to different assemblies). The entire fixture is placed inside a diffusion bonding chamber (not shown). The diffusion bonding chamber heats the fixture 5600 and its stacked components to the bonding temperature, thereby causing the ram 5608 to apply a bonding load (pressure) to the stacked components. The bonding temperature and pressure are maintained until the required bonding time required to create a complete seal between all of the panes 5602 and their respective spacers 5606. During the bonding process, the diffusion bonding chamber vents and pressurizes one or more gases necessary to ensure that the gap cavities of the assembly have the desired contents and / or to facilitate the bonding of the components. And / or filling. After joining, the three sealed double window frame insulating window assemblies are complete. Of course, if the assembly is equipped with a valve or pinch-off tube through the aforementioned spacer, then the atmosphere of the gap cavity may still be adjusted as desired before the assembly is finally sealed. It will be appreciated that similar instruments and processes can be used to simultaneously produce multiple sealed multi-window frame insulating window assemblies.

  Diffusion bonding is considered to be the preferred method for bonding glazing to sheets in a sealed multiple glazing window assembly, but is another bonding tool known as hot isostatic pressing ("HIP"). May be used in place of a conventional diffusion bonding chamber having an internal ram shown in FIG. A hot isostatic press (“HIP”) unit can apply heating and high pressure simultaneously. In the HIP unit, a high temperature heating furnace is placed in a pressure vessel. The product being processed (eg, the window assembly component) is heated and an inert gas, usually argon, applies a uniform pressure. Temperature, pressure and processing time are all controlled to obtain optimal material properties.

  Furthermore, although diffusion bonding is considered preferred, many window and frame bonding / bonding methods may be used to bond the window glass to the sheet in a sealed multiple glass window assembly. These other methods include, but are not limited to, soldering, brazing, welding, electrical resistance heating (ERH), utilization of metallization, solder preforms, and the like. A number of suitable methods are not repeated because they are described in detail herein in connection with sealed window assemblies and wafer level packages. However, it will be appreciated that such a window / frame bonding / joining process may be applicable to the processing of sealed glass window assemblies.

  Preferably, when processing a sealed multi-window frame insulating window assembly, the (linear) coefficient of thermal expansion (thermal expansion coefficient) of the spacer material is as much as possible to the coefficient of thermal expansion of the associated glass pane. Get close enough. The coefficient of thermal expansion of most glasses is approximately constant from about 273 ° K (0 degrees Celsius) to the maximum glass softening temperature. However, some metals and alloys have very different coefficients of thermal expansion at different temperatures. Therefore, the average coefficient of thermal expansion of the spacer material (s) at the high glass / spacer joint temperature should be as close as possible to the average coefficient of thermal expansion of the glass over the same temperature range. As the average coefficient of thermal expansion of the two materials is approached, the residual stresses in the spacers and glazed panes decrease after the assembly is cooled back from the joint high temperature to ambient temperature (room temperature).

  The long-term reliability of spacers and glass seals is affected by the degree of agreement between the predicted end-use environment spacer material and the thermal expansion coefficient of the glass. For example, if the window assembly is expected to be exposed to temperatures of -40 ° C to 100 ° C (-40 ° F to 212 ° F), the spacer material and glass material will have a very close thermal expansion coefficient over this temperature range. Should have. If the thermal expansion coefficient of the spacer material cannot exactly match the thermal expansion coefficient of the glass material, the thermal expansion coefficient of the spacer material should be slightly higher than the thermal expansion coefficient of the glass. In such cases (ie, when the thermal expansion coefficient of the spacer material exceeds the thermal expansion coefficient of the glass), the spacer will shrink further than the glass while it is cooled back to high ambient temperature. As a result, the glass is slightly compressed. This is preferred for glass under tension, as glass under tension tends to crack.

  Therefore, when designing and processing sealed multi-glazed insulating window assemblies, ensure post-bonding stress minimization, maximum long-term reliability of spacers and glass seals, and prevention of cracks in glass windows In order to do so, it is desirable to take into account data on the linear coefficient of thermal expansion (CTE) range of metals, metal alloys and other spacer materials, as well as data on the coefficients of thermal expansion of glass and other glazing materials .

  This disclosure further describes a method of attaching two or more transparent glazings to a metal or non-metal spacer to create sealed and thermally insulated window assemblies for residential and commercial building structures and other applications. . The spacer maintains a gap or space between the pane sets. This space may contain a gas such as nitrogen or argon, or may be incomplete or high vacuum.

  A vacuum glass unit (VGU) is an insulating glass (IG) window unit that contains and maintains an incomplete vacuum inside an insulating glass unit (IGU). In a full vacuum, there will be no atoms or molecules at all inside the sealed space. The term “incomplete vacuum” means a level of obtainable vacuum, or a state where the amount of atoms and molecules is significantly reduced in a given volume of space, since a complete vacuum is not practical to create at the moment. Use to do.

  A vacuum glass unit (VGU) has a space between a window glass and a sealed frame assembly joined to the window glass and with the window glass defining, containing and maintaining a volume of space that maintains a practical level of vacuum. A window assembly consisting of at least two panes. The purpose of this type of structure is to produce an IG window unit that has a relatively high degree of thermal isolation potential obtained by most other structures of the IG unit (IGU). The relatively high thermal insulation performance of VGUs when compared to gas-filled IGUs is known to be the best thermal insulation of vacuum, so use incomplete vacuum instead of fill gas. to cause. Since the highest insulation values are not present at all or are derived from very low amounts of atoms and / or molecules, there is little material in the vacuum volume that conducts or transfers thermal energy mechanically.

  In order to make a VGU for mounting on exterior (exterior) walls and doors facing the exterior of the building reliable and practical, the VGU can vary in temperature and pressure, and differences in temperature and pressure inside and outside the building. It is necessary to be able to resist. The key elements of VGU's long-term insulation performance, reliability and durability are the level of sealability of the components and the assembled VGU, the strength and integrity of the seal mounting of the components that form the overall structure of the VGU Maintaining a practical separation of the VGU's internal and external facing panes. The internal facing refers to the VGU side facing and touching the interior (interior) of the building structure, and the external facing refers to the VGU side facing and touching the exterior (exterior) of the building structure.

  Referring now to FIG. 57, for the purpose of explaining the vocabulary commonly used in the architectural window industry for the double glazing VGU glazing and sometimes used herein, a conventional double glazing VGU according to the prior art is shown. Illustrated. VGU 5750 includes internal and external glazings (also referred to as “glass” or “crosspiece”) 5752 and 5754, respectively. In the industry, the outer glass 5754 is sometimes referred to as window # 1, and the inner glass 5754 is sometimes referred to as window # 2. Frame 5756 attaches VGUs to the building's inner and outer walls 5758 and 5760, respectively, and also maintains a separation between glass 5752 and 5754 to form an insulating gap (also referred to as a “cavity”) 5762. In the industry, the surface facing the outside of the external window glass 5754 is sometimes referred to as surface # 1, the surface facing the inside of the internal window glass is sometimes referred to as surface # 2, and the surface facing the outside of the external window glass 5752 is sometimes referred to as surface. This surface is referred to as surface # 3, and the surface facing the inside of the internal window glass is sometimes referred to as surface # 4.

  The rate of expansion and contraction of the material each time the temperature changes is called the coefficient of thermal expansion (CTE) or the coefficient of thermal expansion (TCE). CTE and TCE are usually expressed in parts per million as a change in the dimension of the temperature changing once in degrees Celsius or Fahrenheit, or abbreviated as PPM / ° C. or PPM / ° F.

  In general, the temperature difference on the exterior of most buildings is greater than the interior of the building due to external weather that changes daily. Thereby, the surface (surface # 1) facing the outside of the VGU is exposed to a larger temperature difference than the surface facing the inside (surface # 4). If both the inner and outer facing glazings have the same average coefficient of thermal expansion, their temperature difference causes the outer facing glazing to expand and contract more than the inner facing glazing. Any frame or seal mechanism that keeps the VGUs together will need to compensate for the relative size position of the inwardly facing and outwardly facing panes. If the frame or seal mechanism does not fit, i.e. if the position difference between the perimeters of the two panes cannot be compensated, then the joint that attaches the frame or seal mechanism to the two panes will be It will be stressed by the effect of the relative change in temperature between the inner facing surface and the outer facing surface. This is why the frame mechanism needs to be designed and configured with special functions. These functions include that the coefficient of thermal expansion of the frame member exactly matches or resembles the glazing or other item to be attached and adapted to the design and use of the ductile material in the structure. By incorporating these attributes, the frame member can expand and contract, and thus can move like a spring, compensating for the difference in position that the item to which the frame member is attached will occupy.

  Another attribute that a VGU frame member should have is that it is composed of a relatively low thermal conductivity material. This is because the frame member conducts heat from the hotter surface to which it is attached (bonded, glued) to the cooler surface to which it is attached (bonded, glued). Therefore, minimizing the thermal conductivity of this frame member minimizes the conduction of heat from one window pane of the VGU to the other window pane.

  A preferred method for hermetically attaching the frame member to the window glass is by a process called diffusion bonding, a solid bonding process. This process is also known as hot-pressure bonding (TC bonding). Diffusion bonding can be made between metals, alloys, and / or non-metals where the joints are similar or different due to the diffusive action of atoms across the contact surface, and the specified time, bonding pressure and heat can be applied. It is a process brought about by adding. The variables during bonding (temperature, load and time) depend on the type of material to be joined, the surface finish and the expected use conditions.

  A very important attribute of diffusion bonding is the high quality of the joint. It is known to be the only process that retains the inherent properties of monolithic materials at both metal-to-metal and metal-to-nonmetal joints. If properly selected process variables (temperature, indentation load, and time), the material at and adjacent to the joint will have the same strength and plasticity as most preforms . When processing under vacuum, the mating surfaces are not only protected from further contamination, such as oxidation, but also oxides exhibit dissociation, sublimation or dissolution and diffuse into most of the matrix. May be beautiful. Diffusion bonding is free of incomplete bonding, oxide content, low and high temperature cracks, voids, warping, loss of alloying elements, and the like. If the ends are tightly bonded, there is no need for flux, electrodes, solder, fillers, etc. Diffusion bonded parts usually retain their original maximum tensile strength, bending angle, impact toughness, vacuum tightness, etc.

  The bonding process of adhering glass and other transparent and translucent materials to the frame material may include one or more gases (but not limited to) that promote or reduce oxides under vacuum or incomplete vacuum (evacuation chamber). Hydrogen or the like) or one or more inert gases such as argon may be performed.

  The bonding process for bonding the glass to the frame material may be performed in a special atmosphere that increases oxidation of the frame material and / or glass. This special atmosphere can be negative, ambient or positive, and one or more gases can be added to promote (instead of reducing) oxidation of the frame material and / or glass. . Gases added to promote oxidation include, but are not limited to oxygen.

  In some cases, the bond (bond) resulting from the bonding process will show a chemical bond between the frame / spacer material and the glass. This chemical bonding may be added to the trace of diffusion bonding (atomic diffusion). In another case, a chemical bond (junction) will show little evidence of atomic diffusion.

  Composition of the frame member to be bonded to the window glass and / or the internal spacer assembly. The frame member is a sealed structure made of one or more materials. These materials include glass materials, metal materials, metal alloy materials, ceramic materials, composite materials, woven fabrics encapsulated in composite materials, and materials composed of combinations of two or more of the above items, It is not limited to.

  The frame member may be coated or plated to facilitate joining (sealing mounting) two or more frame materials together. These materials include, but are not limited to glass materials, metal materials, metal alloy materials, ceramics and composite materials.

  The frame member may be coated or plated to facilitate bonding to the glass pane. These materials include glass materials, metal materials, metal alloy materials, ceramic materials, composite materials, woven fabrics encapsulated in composite materials, and materials composed of combinations of two or more of the above items, It is not limited to.

  A typical diffusion bonding process involves bringing together surface treated components for a specified time at high temperature under load (ie, bonding pressure). The specific values of the diffusion bonding parameters (ie pressure, temperature and time) depend on the type of material to be bonded, the surface finish and the expected use conditions. However, generally speaking, the joining pressure used is usually below that which would cause large deformation of the matrix, and the temperature used is usually 80% of the melting temperature of the matrix (in ° K). Lower. As described above, in many cases, diffusion bonding is performed in a protective atmosphere or a vacuum, but this is not always necessary.

  The assembly of the VGU using the intermediate layer (intermediate layer) will now be described in more detail. Glass and frame seals may be made during the diffusion bonding process using one or more intermediate layers between the window and the frame assembly. These intermediate layers are hereinafter referred to as intermediate layers. The intermediate layer has the following functions: mating surface activator; intermediate layer material that is sometimes more ductile than the substrate; stress compensation factor that occurs when the seal contains different materials in thermal expansion; It may serve one or more of the following: migration and / or chemical reaction facilitators; buffering factors that prevent the formation of undesirable phases; or other purposes not mentioned here. The intermediate layer is made of a glass material; a solder glass material; a tape-like solder glass; a sheet-like solder glass; a paste-like solder glass (for example, the paste is either a dispensing or window component or a frame component) May be applied by screen printing); powdered solder glass (eg glass powder is mixed with water or alcohol or another solvent, either frame sealing area or window sealing area) Glass, glass solder, metal, including but not limited to ceramics, composites, woven fabrics encapsulated in composites; metal materials; metal alloy materials; Or materials other than metal alloys; or materials composed of glass and a combination of metals and / or metal alloys. .

  It is important to distinguish the use of diffusion bonding interlayers from conventional solder alloys (preforms, pastes and other forms), or the use of solder glass (preforms, pastes and other forms), and other processes is there. In this application, an intermediate layer is a material used between paired surfaces to facilitate surface diffusion bonding, and each paired surface is diffusion bonded to the intermediate layer or directly to each other. For example, if an appropriate intermediate layer material is used, the diffusion bonding temperature between the bonding frame member and the intermediate layer material, and the diffusion bonding temperature at the junction between the intermediate layer material and the window glass are the same as those of the frame member material and the window glass material. The diffusion bonding temperature of the joint portion directly formed therebetween can be greatly reduced. Therefore, the use of the intermediate layer makes it possible to perform diffusion bonding of the component layers at a temperature that is significantly lower than the diffusion bonding temperature necessary for directly bonding the two or three assembly component layers. Joints that are desired to be sealed are also formed in a diffusion bonding process. That is, the base material is not melted during the joining process, and the intermediate layer material is diffused into the base material at the atomic level. This allows diffusion bonding using intermediate layers from other processes where the solder material only joins the surface between the materials to be joined, such as the use of solder alloys (various forms) and solder glass of preforms and pastes. Are distinguished. It is possible to use a material conventionally used for solder for an intermediate layer for diffusion bonding. However, when it is used as an intermediate layer, it is not used as a role of a conventional solder, but uses diffusion bonding characteristics.

  The use of an intermediate layer in the production process of VGUs and other devices may provide additional advantages compared to those used in promoting diffusion bonding. The advantages also include the use of an intermediate layer as a mating surface activator. The intermediate layer material may have higher ductility than the base material. The intermediate layer can also offset stresses that occur when sealing materials with different coefficients of thermal expansion or other thermal expansion properties. The intermediate layer can also facilitate mass transfer and chemical reaction between the layers. The intermediate layer can also serve as a buffer, preventing the formation of harmful chemical phases and metal layers at the joints between the components.

  In some embodiments, some of the junctions used in assemblies to which different forms of diffusion bonding, known as liquid phase diffusion bonding, or sometimes transient liquid phase diffusion bonding (ie, TLP bonding), are bonded. Or all. In liquid phase diffusion bonding, the solid diffusion process caused by increased pressure (ie, load) and heat generated during the bonding process changes the material composition (eg, material phase) of the joint, and the initial bonding temperature is Determined by the melting temperature of the active phase. Also, an intermediate layer of a material having a lower melting temperature than the base material is placed between the layers to be bonded, and the initial bonding temperature is determined by the temperature at which the intermediate layer is dissolved. Accordingly, the thin liquid phase spreads on the contact surface of the joint and is temporarily joined at a temperature lower than the melting point of the base material. The initial joining temperature then decreases slightly to the second temperature and the melt solidifies. This elevated temperature (ie, the second temperature) and increased pressure (ie, load) are maintained until the temporarily solidified joint member is diffused into the base material by solid diffusion, resulting in joining between the base materials. Causes diffusion bonding in the part.

  The intermediate layer is not necessarily configured as a separate item from the two items to be joined, but rather is a material that is applied to one or both of the joining surfaces of the items to be joined. If the intermediate layer is pre-used on one or both of the paired surfaces, it can be used with one of a variety of means. They include, but are not limited to, spray deposition, vapor deposition, solution dip plating, growth of interlayer material on the surface of the item to be bonded, painting with a brush or roller, and various other means.

  Note that “diffusion bonding” and “thermal compression bonding” (TC bonding for short) are often used interchangeably herein and in the art. While metallurgists prefer to use “diffusion bonding”, many in the industry (eg, the semiconductor manufacturing industry) use “thermal” to avoid confusion with other “diffusion” processes that exist in the semiconductor manufacturing industry. Prefers to use "compression bonding". As mentioned above, regardless of which term is used, diffusion bonding refers to the type of bonding method that utilizes only heat, pressure, pressure, and time, at a temperature below the normal melting temperature of the mating surface, Join the mating surfaces. That is, the paired surfaces are not intentionally dissolved and no chemical adhesive is used.

  There are a wide variety of designs and materials used for VGU and IGU. Some variations are described in FIGS. 58a to 96c. In explaining these figures, “upper” and “lower” are used as an alternative to “inside”, “inside inside”, “indoor”, “outside”, “outside inside”, “outside”, etc. Used to explain. Furthermore, VGUs are often mounted vertically, such as vertical walls and doors, but are depicted horizontally. When the VGU constitutes a part of a flat light portion such as a horizontal part of a roof or a floor, horizontal mounting is possible. When explaining the positional relationship of an item or description in the item description and diagram details, the relative relationship of the item is often reversed even when “upper”, “lower”, “upper” and “lower” are used. Note that the “upper” and “lower” items are interchangeable. Thus, after installation on the high-level assembly of the VGU, these figures have not been made to imply which side of the VGU faces the outside, which side faces the inside, or faces in a specific direction .

  58a and 58b show the basic structure and components of a vacuum glass unit (VGU). The VGU 5800 includes an upper end frame member 5810 joined to the upper end surface portion 5831 of the upper end window glass 5830. The lower end frame member 5890 is joined to the lower end surface portion 5873 of the lower end window glass 5870. The spacer / standoff 5840 is attached to the upper end surface portion 5871 of the lower end window glass 5870. The spacer prevents the upper window glass 5830 from contacting the lower window glass 5870.

  The side of the frame member 5810 is shown in cross-sectional view. In the vertical direction, it has at least two radii, an upper inner radius 5815 and a lower outer radius 5817. The radius is aligned with the frame member.

  The spacer / standoff 5840 is made of various materials and can be attached to the window glass surface using various means. The spacer is preferably made of a material having low heat conduction in order to construct a heat conduction path between two adjacent window glass surface portions. Once the VGU has been assembled and sealed, the spacer should ensure that little gas escapes. It should be so small that you won't notice the spacer in any situation unless it is so close to the VGU. For the scheduled VGU installation, the quantity and placement of the spacers should be sufficient to maintain the mechanical separation of the glazing surface portions 5833 and 5871.

  The spacer / standoff 5840 may be used to secure the spacer / standoff 5840 after ink jet printing, paper pattern printing or screen printing, and after being attached to the surface 5871, or at least until the VGU is assembled and sealed. It can be attached to the surface portion 5871 of the window glass 5870 by means including, but not limited to, automatic pick and place machines used. When ink jet printing is used to form the spacer / standoff 5840, each spacer / standoff may be formed with more than one drop of material. Multiple drops of inkjet material are used to form the spacer surface 5843 on the desired glazing surface 5871. To form the desired height of the spacer 5840, multiple drops of ink jet material are used. In some embodiments, the spacer top surface 5841 is planar, but in other embodiments the top surface 5841 is not planar and has a radius to minimize the contact area between the spacer and the glazing surface 5833. Have (having a curve or dome shape).

  If a spacer is used to separate the two panes, the pane surface can be treated or coated with a material that reduces friction resulting from the relative movement of the spacer relative to the pane. Variations in temperature that cause a change in dimensions change the relative position of the spacer. Friction that occurs when the spacer surface 5841 moves relative to the glazing surface 5833 can cause damage (such as scratches) and / or affect the optical appearance of either and / or both the spacer and glazing. And / or may affect the transparency of either or both of the spacer and the pane. A coating that reduces friction and / or reduces or eliminates the possibility of breakage described above includes chemical vapor deposition diamond (CVD diamond). In addition, materials such as sheet film can be attached to spacers or window glass surfaces, or both (5833 and / or 5841).

  The IG window is often coated on the internal surface # 2 and / or # 3 with a material that enhances the characteristics of the IGU. There are low-emissivity coatings and chromatic or chromic coatings such as electrochromic and multicolor coatings. The above and other coatings currently in use can also be used on the inner surface # 2 and / or # 3 of the VGU described herein.

  IGUs with a special coating on the outer surface # 1 and / or # 4 are in circulation. These coatings impart properties and functions such as facilitating window cleaning. The VGU described herein also includes windows with these and other coatings on the exterior facing the surface portions # 1 and # 4.

  Diffusion bonding if the coating can withstand the diffusion bonding temperature when bonding the frame member to the window glass, whether or not the coating is applied to the surface # 1, # 2, # 3, or # 4 It is possible to apply the coating to the glazing before the process. If the coating cannot withstand the diffusion bonding temperature when bonding the frame member to the glazing, the coating on the surface of the glazing needs to be applied after performing the diffusion bonding process. The film applied to the surface of the window glass is similarly applied.

  Even when the intermediate layer is used or not used, it is necessary to remove the pre-applied coating on the surface of the window glass where the frame member and the window glass are bonded before bonding the frame member and the window glass. Sometimes there are. Coating removal methods include chemical wear, polishing or grinding, and / or mechanical wear such as laser cutting.

  During the actual diffusion bonding process, the upper end bonding surface portion 5811 of the upper frame member 5810 contacts the upper end surface portion 5831 of the upper end window glass 5830. The joining surface portion 5811 and the window glass 5830 are pressed with a sufficient load, and a preset contact pressure is applied between the joining surface portion and the window glass along the first joining portion. And the said joining site | part is heated to the temperature preset along the 1st joining site | part. The two procedures can be performed simultaneously or sequentially (whichever comes first), and can also be performed in a vacuum or at a special atmospheric pressure. The preset contact pressure and elevated temperature are maintained until the upper frame member 5810 and the top window glass 5830 at the outer periphery of the window glass are diffusion bonded.

  Similarly, the upper end bonding surface portion 5891 of the lower frame member 5890 contacts the lower end surface portion 5873 of the lower end window glass 5870. The joining surface portion 5891 and the window glass 5870 are pressed with sufficient pressure, and a preset contact pressure is applied between the joining surface portion and the window glass along the second joining portion. Then, the joining part is heated to a preset temperature along the second joining part. The two procedures can be performed simultaneously or sequentially (whichever comes first), and can also be performed in a vacuum or at a special atmospheric pressure. The preset contact pressure and increased temperature are maintained until the lower frame member 5890 and the lower end window glass 5870 at the outer periphery of the window glass are diffusion-bonded.

  In FIGS. 58a and 58b, when the frame member is attached to the glazing and the spacer is attached to the bottom glazing, the product enters the final assembly process. The process also includes hermetically bonding the lower end surface portion 5813 of the upper frame member 5810 and the upper end surface portion 5891 of the lower frame member 5893.

  FIG. 58c shows the upper frame bottom edge / flange / bottom surface 5819 and the lower frame member bottom surface 5893. FIG. In order to hermetically bond and bond the upper frame member and the lower frame member, heat can be applied simultaneously to the surface portions of both 5819 and 5893. Heat is applied by techniques such as electrical resistance seam welding, can welding and laser welding. The auxiliary material is used on one or both of the surface portion 5813 at the lower end of the upper frame member 5810 and the surface portion 5819 at the upper end of the lower frame member 5810 before joining the two types of frame members. Often. Nickel is often used as an auxiliary material. When nickel is pre-used for either or both materials, heat is applied to the joint to a temperature sufficient to dissolve the nickel coating and a nickel solder joint is applied. A general method of using nickel for the frame member is a method in which solution immersion plating is performed on the frame member when the frame is made of a metal or metal alloy. Complementarily, a thin metal or metal alloy may then be plated or otherwise attached to the top or nickel or solder material. This is usually done for aesthetic reasons or to prevent oxidation of the solder material prior to the soldering or brazing process that joins the two frame members.

  FIG. 58d shows a heating place to a portion to be a junction of the upper and lower contact portions 5899 of the frame member. Heating techniques include laser and forced air convection.

  Figure 58a shows the heating location for both parts of Figures 58c and 58d. Heat is applied using any or a combination of laser, forced air convection, heater bars (such as those used for hot rod soldering of electronic equipment) and seam welding where the electrode contacts all three surfaces.

  In a preferred embodiment, the frame member of the VGU is bonded in a vacuum. Here “automatically” creating the desired vacuum in the gap, and after assembly and sealing, eliminates the need to use pinch tubes, valves, etc. to evacuate the VGU gap. However, in other embodiments, pinch tubes or valves may be used and the VGU gap may be removed after assembly.

  While vacuum conditions provide the best thermal insulation properties in multiple insulated windows, the physical configuration of the inventive VGU is useful for multiple insulated window assemblies containing insulating materials such as fill gas and airgel. . A matching frame assembly sealed and bonded is also expected to extend the insulation time of such windows (non-vacuum). Filling gases such as xenon are more insulating than krypton but are still expensive for many consumers so far. Assuming that multiple insulating glazing assemblies hold a new type of fill gas for 20-25 years, the use of alternative fill gases becomes practical. On the other hand, non-gas adiabatic alternatives such as airgel may or may not require sealed capsule filling such as vacuum or gas-filled windows.

  FIG. 58f is a perspective view of one embodiment of a frame member suitable for use with the VGU and IGU described in connection with FIGS. 58a-58e. The frame 5808 fits three axes at the side portion 5811 located below the upper end flange 5812 and the lower end flange 5814. The upper end flange 5812 is adapted to join the upper end window glass (eg, the surface portion 5831 of FIG. 58a) to the upper end surface portion, and the lower end flange 5814 is the upper end surface portion of the lower frame member (eg, the surface portion 5891 of FIG. 58a). Suitable for joining to. The side 5811 can incorporate multiple conforming molds to have an essential multidimensional fit. In the illustrated embodiment, the side 5811 comprises a step 5816, a convex curve 5818, and a concave curve 5820, although other configurations are understood to be within the scope of the present invention. The characteristics of the frame member 5810 of FIGS. 58a to 58e can correspond to the characteristics of the embodiment 5808 as follows: the top joining surface 5811 (FIG. 58a) is the opposite side of the top flange 5812 (FIG. 58f); The upper radius 5815 (FIG. 58a) is the opposite side of the upper recursion 5818 (FIG. 58f), the lower radius 5817 (FIG. 58a) is the lower recursion 5820 (FIG. 58f), and the lower joint surface 5813 (FIG. 58a). May be on the opposite side of the lower end flange 5814 (FIG. 58f).

  59a and 59b are an exploded view and an assembled view, respectively, of a VGU according to another embodiment. VGU 5900 is broadly similar to the VGU previously described herein, but has interwoven spacers 5950 as described below. The VGU 5900 further includes an upper end window glass 5930 constituted by an upper end surface 5931 and a lower end surface 5933, and a lower end window glass 5970 constituted by an upper end surface 5971 and a lower end surface 5973. The knitted spacer 5950 has warp knitted fibers 5953 in which the first fibers / filaments are substantially parallel to each other, and the second fibers / filaments in which the first fibers / filaments are woven together are substantially parallel to each other. Consists of. The spacer maintains the spacing between the interior surfaces 5933 and 5971 of the glazing. The VGU 5900 is coupled by an upper frame member 5910 and a lower frame member 5990. The upper frame member 5910 includes an upper end coupling surface 5911, an upper inner radius 5915, a lower outer radius 5917, and a lower end coupling surface 5913 that are hermetically coupled to the upper end surface 5931 of the upper window glass 5930. The lower frame member 5990 includes an upper end surface 5991 hermetically coupled to a lower end coupling surface 5913 of the upper frame member 5910 and a lower end surface 5973 of the lower end window glass 5970.

  Suitable materials for the production of warp knitted fibers / filaments 5953 and weft knitted fibers / filaments 5955 include glass fibers as used in optical fibers. This type of fiber has advantages such as an oversupply, availability of extremely small diameters, and sufficient visual transparency. The area where warp and weft fibers are interwoven is higher, longer and thicker than the diameter of warp and weft fibers alone. The interwoven portion serves as a stand-off that separates the upper end window glass 5930 from the lower end window glass 5970. Even when only warp knitting or weft knitting in parallel is used between the glazing surfaces 5933 and 5971, it is possible to separate the two glazings, but the knitting has an appropriate mesh space. When the embedded spacer is used, it is considered that the surface contact portion increases.

  60a and 60b are an exploded view and an assembled view, respectively, of a VGU according to another embodiment. The VGU 6000 is broadly similar to the VGU previously described herein, but has any one or more of intermediate layers 6020, 6080 and / or 6086 that facilitate diffusion bonding with the frame member and window glass. The purpose of use of the intermediate layer will be described later in this specification.

  The VGU 6000 includes an upper end window glass 6030 having an upper end surface 6031 and a lower end surface 6033, and a lower end window glass 6073 having an upper end surface 6071 and a lower end surface 6073. The plurality of spacers 6040 have an upper end surface 6041 and a lower end surface 6043, respectively, and are installed to maintain the interval between the inner surfaces 6033 and 6071 of the window glass. The VGU 6000 is coupled by an upper frame member 6010 and a lower frame member 6090. The upper frame member 6010 is composed of an upper end coupling surface 6011, an upper inner radius 6015, a lower outer radius 6017, and a lower end coupling surface 6013 that are hermetically coupled to the upper end surface 6031 of the upper window pane 6030. The lower frame member 6090 is configured with an upper end surface 6091 hermetically bonded to the lower end coupling surface 6013 of the upper frame member 6010 and to the lower end surface 6073 of the lower end window glass 6070. A first intermediate layer 6020 having an upper end surface 6021 and a lower end surface 6023 is used for diffusion bonding the bonding surfaces 6011 and 6031 of the upper frame member 6010 and the upper window glass 6030, respectively. A second intermediate layer 6080 having an upper end surface 6081 and a lower end surface 6083 is used to diffusely bond the coupling sites 6073 and 6091 of the lower end window glass 6070 and the lower frame member 6090, respectively. A third intermediate layer 6086 having an upper surface 6087 and a lower surface 6089 is used for diffusion bonding the bonding surfaces 6013 and 6091 of the upper frame member 6010 and the lower frame member 6090, respectively. The use of an intermediate layer is optional.

  61a and 61b are an exploded view and an assembled view, respectively, of a VGU according to another embodiment. The VGU 6100 is broadly similar to the VGU previously described herein, but is a glazing manufactured with an integrated spacer / standoff used to maintain the spacing between the two glazings. Have. A window glass with an integrated spacer eliminates the need to attach a spacer to the window glass individually. The VGU 6100 includes an upper end window glass 6130 having an upper end surface 6131 and a lower end surface 6133, and an integrated stand-off 6161 and a lower end window glass 6160 having an upper end surface and a lower end surface 6163. An integrated standoff maintains the distance between the two panes. The VGU 6100 is coupled by an upper frame member 6110 and a lower frame member 6190. The upper frame member 6110 includes an upper end coupling surface 6111 hermetically coupled to the upper end surface 6131 of the upper end window glass 6130, an upper inner radius 6115, a lower outer radius 6117, and a lower end coupling surface 6113. The lower frame member 6190 constitutes an upper end surface 6191 that is hermetically coupled to the lower coupling surface 6113 of the upper frame member 6110 and to the lower end surface 6163 of the lower end window glass 6160. 61a and 61b show a VGU with a spacer / standoff incorporated in the manufacture of the bottom glazing 6160, but in another embodiment, the standoff is integrated into the top glazing, or both top and bottom bottom windows. Consider that it can be incorporated into glass.

  FIGS. 62a, 62b, and 62c show an embodiment of a glazing that is similar to the bottom glazing 6160 described in FIGS. 61a and 61b, with spacers attached to one side of the glazing being a glazing manufacturing process. Is incorporated into. Since standoffs are not necessarily drawn to scale, it is taken into account that the standoff ratio and the associated space are different from the figures. The window glass sheet 6260 includes a substrate having a substantially flat upper end 6261 and lower end 6263, and a plurality of standoff features 6265 extending upward from the upper end surface. In the described embodiment, the standoffs 6265 are evenly arranged in a truncated conical configuration, but in other embodiments, in another configuration / arrangement.

  63a and 63b are an exploded view and an assembled view, respectively, of a VGU according to another embodiment. The VGU 6300 is broadly similar to the VGU previously described herein, but spacer / standoff as part of the top and bottom edges of the spacer sheet to enhance the thermal performance (ie, insulation properties) of the VGU. A transparent sheet center spacer unit 6350 processed into The spacer sheet with integrated spacers eliminates the need to attach the spacers individually to the windows.

  The VGU 6300 includes an upper end window glass 6330 having an upper end surface 6331 and a lower end surface 6333, and a lower end window glass 6370 having an upper end surface 6371 and a lower end surface 6373. The spacer unit 6350 has a stand-off 6351 integrated on the upper surface and a stand-off 6353 integrated on the lower surface. The spacer unit 6350 is attached between the window glasses 6330 and 6370 in order to maintain a distance. The VGU 6300 is coupled by an upper frame member 6310 and a lower frame member 6390. The upper frame member 6310 includes an upper end coupling surface 6311 that is hermetically coupled to the upper end surface 6331 of the upper end window glass 6330, an upper inner radius 6315, a lower outer radius 6317, and a lower end coupling surface 6313. The lower frame member 6390 has an upper end surface 6391 that is hermetically coupled to the lower end coupling surface 6313 of the upper frame member 6310 and to the lower end surface 6373 of the lower end window glass 6370. 63a and 63b show a VGU with a spacer / standoff incorporated at both ends of the spacer unit 6350, but in another embodiment it may be incorporated at either the top or bottom of the spacer unit.

  The spacer unit 6350 increases the heat conduction path between the upper window pane 6330 and the lower window pane 6370 when compared to the two window separation method previously described and applied. As a material constituting the spacer sheet, glass, a plastic sheet or a film can be used. Spacers / standoffs 6351 and 6353 can be made from a number of materials. As described above, the spacer is preferably manufactured from a material having low heat conduction. The spacer unit 6350 can be manufactured in a single piece or can be constructed from a sheet or film that is later attached with a standoff using the means previously described in the spacer 5840 mounting instructions of FIGS. 58a and 58b.

  64a and 64b are an exploded view and an assembled view, respectively, of a VGU according to another embodiment. The VGU 6400 is broadly similar to the VGU 6300 previously described herein, but has a side shield member disposed between the sealed frame member and the window pane. The VGU 6400 includes an upper end window glass 6430 having an upper end surface 6431 and a lower end surface 6433 and a lower end window glass 6470 having an upper end surface 6471 and a lower end surface 6473. The spacer unit 6450 includes a standoff 6451 disposed on the upper surface and a standoff 6453 disposed on the lower surface. The spacer unit 6450 is installed between the window glasses 6430 and 6470 in order to maintain a space. The side shield member 6402 is installed along the side surfaces of the window glass and the spacer. The side shield member 6402 desirably has low thermal conductivity. In some embodiments, the shield member may be included for aesthetic reasons, such as concealing internal frame components when viewed from the glazing. In another embodiment, the shield member 6402 has a “getter” (ie, a material that removes) that adsorbs or fixes atoms or molecules remaining in the vacuum space within the VGU. Even if the VGU is sealed, atoms or molecules may appear in the vacuum space when removing one or more of the materials used on or within the VGU. This atom or molecule slowly permeates through the external surface (eg, window glass or frame member), the frame / window glass junction / bond, and / or the upper and lower frame member junctions within the VGU. May appear in a sealed space.

  VGU 6400 is coupled by upper frame member 6410 and lower frame member 6490. The upper frame member 6410 includes a coupling surface 6411 that is hermetically coupled to the upper end surface 6431 of the upper window pane 6430, an upper inner radius 6415, a lower outer radius 6417, and a lower end coupling surface 6413. The lower frame member 6490 includes an upper end surface 6491 that is hermetically bonded to the lower end coupling surface 6413 of the upper frame member 6410 and to the lower end surface 6473 of the lower end window glass 6470, respectively.

  Figures 65a and 65b are an exploded view and an assembled view, respectively, of a VGU according to another embodiment. The VGU 6500 is broadly similar to the VGU 6400 previously described herein, but has upper and lower frame members having similar shapes and sizes. The VGU 6500 constitutes an upper end window glass 6530 and a lower end window glass 6570. The spacer unit 6550 constitutes a standoff 6551 on the upper surface and a standoff 6553 on the lower surface. The spacer unit 6550 is installed between the window glasses 6530 and 6570 in order to maintain a space. Optional side shield member 6502 is attached along the sides of the windowpane and spacer, but is not required. The VGU 6500 is coupled by an upper frame member 6510 and a lower frame member 6590. It is desirable that the shapes of the upper frame member 6510 and the lower frame member 6590 completely match. Shape matching provides advantages such as shortening part calculations and process steps. The upper frame member 6510 has an upper end coupling surface 6511 and a lower end coupling surface 6513 that are hermetically coupled to the upper end surface 6531 of the upper end window glass 6530. The lower frame member 6590 constitutes an upper end surface 6591 hermetically coupled to the lower end coupling surface 6513 of the upper frame member 6510 and a lower end coupling surface 6593 hermetically coupled to the lower end surface 6573 of the lower end window glass 6570.

  66a, 66b and 66c are three cross-sectional views of the frame member. The frame member can be used for the upper frame member described in FIGS. 58a to 5a, 63a and 64a, or when a bilateral frame member is used as described in FIG. 65a, Can be used for upper or lower frame members. FIG. 66a shows a frame member 6620 having two radii (denotations 6621 and 6622) as described above. When the vertical component of the frame member has two or more radii, the frame member can be more flexible. 66b shows a frame member 6640 with four radii (indications 6641, 6642, 6643 and 6644) and FIG. 66c has six radii (indicators 6661, 6662, 6663, 6664, 6665 and 6666). A frame member 6660 is shown.

  Figures 67a to 67f show a crosspiece assembly suitable for use as a spacer assembly to maintain the window spacing of the VGU and for aesthetic applications. Looking first at FIG. 67a, there is shown a crosspiece unit 6751 having a first parallel crossbar 6752 disposed perpendicular to the second parallel crossbar 6754. FIG. 67b shows a crosspiece assembly comprising a crosspiece unit 6751 and a plurality of spacer / standoffs 6753 and 6755 (see FIG. 67c) disposed on at least one side of the crosspiece unit. FIG. 67c is a side view of a crosspiece assembly 6750 with standoffs 6753 and 6755 on both sides. FIG. 67d is an overall exploded view of the crosspiece assembly 6750 installed between the VGU upper glazing 6730 and the VGU lower glazing 6770. FIG. FIG. 67e is a perspective view of a crossbar assembly 6750 that is installed between the upper window pane 6730 and the lower window pane 6770 and contacts both windows. FIG. 67 f is a side view of the crossbar assembly 6750 installed between the upper window glass 6730 and the lower window glass 6770.

  67g and 67h are an exploded view and an assembled view, respectively, of a VGU according to yet another embodiment. The VGU 6700 constitutes an upper end window glass 6730 having an upper end surface 6731 and a lower end window glass 6770 having a lower end surface 6773. A crosspiece assembly 6750 with standoffs on the top and bottom surfaces is placed between the panes 6730 and 6770 to maintain the spacing. VGU 6700 is coupled by upper frame member 6710 and lower frame member 6790. The upper frame member 6710 has an upper end coupling surface 6711 and a lower end coupling surface 6713 that are hermetically coupled to the upper end surface 6731 of the upper end window glass 6730. The lower frame member 6790 has an upper end surface 6791 that is hermetically bonded to the lower end coupling surface 6713 of the upper frame member 6710 and to the lower end surface 6773 of the lower end window glass 6770. Optionally, intermediate layers 6720 and 6780 can be used to enhance the bonding of the upper and lower frame members to each pane.

  FIGS. 68a and 68b show a VGU 6800 having frame members 6810 and 6890 that couple to the inner surfaces of the inner beam assembly 6850, the upper pane 6830 and the lower pane 6870, respectively. The process of attaching the frame members 6810 and 6890 to the inner surfaces of the upper and lower end window glasses 6830 and 6870 is performed when the thickness of the two frame members can be sufficiently secured between the two windows. In the crosspiece assembly 6850 illustrated in this embodiment, a sufficient space is secured. FIG. 68a is an exploded view of a VGU having upper and lower frame members 6810 and 6890 joined to the interior surfaces of the panes 6830 and 6870. FIG. FIG. 68b is an assembled VGU having a frame member bonded to the interior surface of the glazing.

  FIGS. 69a and 69b show a VGU 6900 having an internal beam assembly 6950 and frame members 6910 and 6990 that extend beyond (ie, up and down) the outer surface of the top and bottom glazings 6930 and 6970 and are coupled inside the glazing. This is different from FIGS. 68a and 68b, which show frame members 6810 and 6890 coupled to the inside of the glazing that do not extend above or below the outer surfaces of the top and bottom glazings 6830 and 6870, respectively.

  FIGS. 70a and 70b show a VGU 7000 having frame members 7010 and 7090 coupled to the interior of the glazing, similar to FIGS. 68a and 68b. The VGU 7000 includes upper and lower middle layers 7020 and 7040 that are optionally installed between the upper and lower frame members 7010 and 7090 and between the upper and lower frame windows 7030 and 7070 in order to promote and / or strengthen bonding. Including. FIG. 70a is an exploded view of a VGU 7000 having a frame member bonded to the internal window glass and an optional intermediate layer placed between the frame members and between the window glasses. FIG. 70b is an assembled view of the VGU. Consider that the intermediate layers 7020 and 7040 are actually visible or invisible after bonding depending on whether the intermediate layer material is fully incorporated into the joint.

  71a, 71b and 71c illustrate examples of VGUs using an additional intermediate frame member coupled to the center spacer assembly. In some cases, the use of such additional frame members adds further advantages to the VGU. Specifically, FIG. 71a shows a VGU 7101 having upper and lower end panes 7130 and 7170, a center spacer unit 7150, and upper and lower frame members 7110 and 7190, similar to FIGS. 63a and 63b.

  FIG. 71b shows a VGU 7102 similar to VGU 7101 except for the spacer unit (indication 7150a) over the sides of the upper and lower window panes 7130 and 7170 and the lower frame member (indication 7190a) over the same. With this configuration, an exposed portion is formed on the upper and lower end surfaces of the spacer unit 7150a attached to both surfaces of the center frame member 7140 and added to the surface of the lower frame member 7190a in order to join the expanded upper frame member 7120 and the center frame member. Space is born. In the illustrated form, the center frame member 7140 is attached to the upper end surface of the spacer unit 7150a, but in another form, it may be attached to the lower end surface.

  FIG. 71c illustrates a VGU 7103 that is similar to VGU 7102 except that the spacer unit 7150a and the bottom window glass (display 7170a) cross the side of the top window unit 7130. FIG. Again, the intermediate frame member 7140 is attached to the upper end surface of the spacer unit 7150a.

  72a and 72b are an exploded view and an assembled view, respectively, of a VGU according to yet another embodiment. The VGU 7200 is in this form except that a flat spacer sheet 7250 made of a transparent material is mounted between the glazing sheets 7230 and 7270 and a standoff 7255 is provided on the inner surface of the glazing sheet. 65a and 65b are similar to those described above. The standoff 7255 may be formed as an integral part of the glazings 7230 and 7270 (eg, making or embossing a mold during manufacture) or individually attached to the glazing after the glazing is manufactured (eg, ,adhesive). If the latter, i.e., the standoff is mounted after manufacture, it allows the glazing inner surfaces 7230 and 7270 to be coated (e.g., coating with low emissivity or other coating), while the glazing inner surface is flat. In this state, the standoff 7255 is attached after the coating. The spacer sheet 7250 can be made of glass, plastic sheet, film, or other transparent material. The spacer sheet 7250 has inherently special emissivity, thermal insulation and other physical properties (eg, damage resistance), or can be coated with other materials to possess the desired properties. The upper and lower frame members 7210 and 7290 are diffusion bonded to the window glasses 7230 and 7270 as described above. Additional seal / getter member 7202 is provided in the package as described above.

  It will be appreciated that alternative glazing shapes may be used. The window glass combination need not be flat. It may be concave or convex. As long as each window glass is intimately bonded to the frame member, for example, the glass surface is in intimate contact with the surface of the bonded frame member during the bonding process, each window glass has a different shape. It may be.

  It will also be appreciated that alternative glazing materials may be used. The material of the window glass need not be glass. Other transparent or opaque materials may be used, including but not limited to quartz, sapphire, silicon, and metals, metal alloys, and ceramics.

  As an alternative to conventional diffusion bonding chambers with internal rams, another device suitable for diffusion bonding glass panes to strength reinforcement layers to form a layered strength reinforcement window assembly is Known as a hydraulic press ("HIP"). The HIP unit can be used simultaneously with heat and high pressure. In a HIP unit, the material (eg, window assembly component) is usually sealed in a vacuum bag where it is evacuated. The bag with the parts inside is sealed in a pressure containment vessel or device, which then becomes part of or stored in a high temperature furnace. A gas, usually argon, is introduced into a container around the parts in the bag and the furnace is turned on. Since the heating furnace heats the pressure vessel, the temperature inside and the gas pressure rise simultaneously. The gas pressure provides a strong force and simultaneously applies pressure to the parts in the bag, and the gas temperature provides the necessary amount of heating to join. The HIP unit makes it possible to control the temperature, pressure and processing time for optimum material properties.

  In some embodiments, the CTEs of the materials that are joined together are compatible. The coefficient of linear expansion (CTE) of the frame material must accurately match the glazing to which the frame is joined. The CTE of many glasses is extremely stable from about 273 ° K (0 ° C) to the softening temperature of the glass. However, some metals and alloys have different CTEs at different temperatures.

  The average CTE of the frame material with a high glass frame bonding temperature should approximately match that of the average CTE of the glass over a similar temperature range. The closer the average CTE of the two materials, the lower the residual stresses in the frame and glass pane after the assembly is cooled from high bonding temperature to ambient temperature (room temperature).

  In one embodiment, what is important for the long term reliability of the frame-glass seal is that the CTE of the frame material and the glass are nearly compatible with the expected end use environment. For example, if the window assembly is considered to be exposed to temperatures of minus 400 ° C. to 1000 ° C. (from minus 400 ° F. to 212 ° F.), the frame material and glass material should have a CTE that is approximately compatible over this temperature range. It must be.

  In many embodiments, if the CTE of the frame material does not exactly match the CTE of the glass material, it is desirable that the CTE of the frame material be somewhat larger than that of the glass. In situations where the CTE of the frame material exceeds that of the glass, the frame shrinks more than the glass during the cooling period when it drops from the bonding temperature to ambient temperature. As a result, some pressure is applied to the glass. Tensioned glass tends to crack and is therefore preferred for tensioned glass.

  In addition to diffusion bonding, there are methods that can be used to seal and bond the frame material to the window glass of the VGU. Among them, solder glass is used between the frame material to be joined and the window glass, and the two are partially or wholly heated to form a solder joint and a fusion joint. Is also included. Although these and other methods are used to bond the frame material to the glazing in the VGU configuration described and illustrated, the preferred bonding method is diffusion bonding and / or transient liquid phase diffusion bonding.

  The present invention is referred to as diffusion bonding in which a glass pane is sealed and bonded directly to an elastic (such as a spring) metal or metal alloy sleeve / frame component for registered trademark and pending patent applications. Using conventional commercial technology. No adhesive or epoxy material is used between the glass and frame components. Bonding is permanent and is further sealed (airtight) compared to other bonding methods.

  73a and b, the components of one embodiment of the vacuum containment IG unit are depicted, FIG. 73a is an exploded view, and FIG. 73b is an assembly view. The IGU 7300 is composed of an upper window glass (eg, material) 7330 and a lower window glass 7370, which are separated by a transparent spacer unit 7350 disposed therebetween. As described in detail below, the ends of the glazings 7330 and 7370 are sealed and sealed together using metal or metal alloy frame components 7310 and 7390. The cavity between the panes 7330 and 7370 contains a vacuum or a partially evacuated atmosphere.

  Referring to FIG. 73c, one embodiment of an elastic metal frame / sleeve material 7310 and 7390 is shown. Designed to be flexible on all three axes, so that glass 7330 and 7390 can expand independently of each other, even if there is no significant pressure on the sleeve or glass bond And shrink. When it is pulled or pushed, it shows a bellows-like action such as expanding or contracting. This sleeve unit is made so that it hardly expands from the upper and lower sides of the window glass.

  Item 7302 is shown as an optional feature of IGU 7300. A getter (residual gas removal material) as made by SAES Getter. Getters are used in high-reliability sealed packaging that absorbs atoms and molecules released from the material or absorbs gas that has leaked into the package for an extremely long period of time.

  The spacer unit 7350 is preferably formed from transparent glass, but most are also formed from a transparent polymer material such as plastic or resin. In the specific embodiment described herein, other transparent materials may be used. The spacer unit 7350 comprises a sheet-like substrate portion 7352 having an integrally formed standoff (also known as a “post”) 7354, which standoff may be on one and / or both sides of the substrate portion. Sticks out. Its configuration is similar to plastic chair mat fixtures found on carpets under castor chairs in offices, except that there may be standoffs on both the front and bottom Sometimes. Standoff 7354 is typically placed flat across the surface of substrate portion 7352 to provide even support for adjacent glazing. Viewed from above, the standoffs 7354 are preferably arranged in an ordered arrangement (see FIGS. 77-79), but as long as they provide adequate support to prevent the window glass from cracking, There is no need.

  For the purposes of this application, the term “integrated formation” means that the standoff 7354 attaches the body of the substrate portion 7352 rather than separating the substrate portion and first forming the standoffs and then bonding them to the substrate portion. Used to mean formed by processing (eg, casting, embossing, excavation, etching, etc.). The standoff 7354 and the substrate portion 7352 are usually made of the same material at the time of formation, but the standoff and / or the substrate portion are further processed (eg, heat treatment, chemical treatment, polishing, etc.) to change the properties after formation.

  Referring to FIG. 74, a spacer unit 7450 is shown according to one embodiment. The spacer unit 7450 includes a substrate portion 7452 such as an integrally formed transparent sheet and a standoff 7454 protruding from one side. In this example, unit 7450 is formed of transparent glass, but other materials may be used in other examples.

  Referring to FIG. 75, a spacer unit 7550 is shown according to one embodiment. The spacer unit 7550 includes a substrate portion 7552 such as an integrally formed transparent sheet and a standoff 7554 protruding from one side. In this example, the unit 7550 is formed of transparent glass, but other materials may be used in other examples.

  Referring to FIG. 76, a spacer unit 7650 is shown according to yet another embodiment. In this embodiment, the spacer unit 7650 has a substrate portion formed of a plurality of discrete layers. The top layer 7655 includes an upper substrate portion 7656 with an integrated upper standoff 765, similar to that of FIG. The bottom layer 7658 includes a top substrate portion 7659 with an integrated top standoff 7660, which is also similar to that described above, but the top layer 7655 and the bottom layer 7658 are not necessarily formed of the same material. There is no need to be. 7656 and 7659 arranged in a “sandwiched” configuration between the upper and lower substrate portions are layers of discrete material 7661. In this example, the top and bottom layers 7655 and 7658 are formed of transparent glass, while the intermediate layer 7661 is formed of a transparent plastic material such as Lexan. The discrete material layer 7661 has different thermal conductivity, acoustic transmission, breakage resistance, or properties other than adjacent layers. The discrete material is glass, plastic, polymer, resin, adhesive or other material. Materials that can be formed into separate sheets and films, or sprayed on or otherwise applied to a free surface (eg without a standoff) that is part of the substrate Sometimes it is. It will be appreciated that there are three layers in the illustrated embodiment, while the other embodiments have only two layers. (Example: top layer 7655 and discrete layer 7661 only, or bottom layer 7658 and discrete layer 7661 only, or top layer 7655 and bottom layer 7658 only.) Similarly, multiple discrete inner layers (eg, no standoffs) Is used to provide a spacer unit 7650 having four or more layers.

  In certain embodiments, a performance enhancing coating may be “introduced” into the multi-layer laminated spacer 7650. For example, the coating may be applied to the inner surface of the upper substrate portion 7656 and / or the lower substrate portion 7659 or the surface of the core material 7661. These coatings include low emissivity coatings, UV absorption or reflective coatings, tints, electrochromic coatings, antireflective coatings and / or other performance enhancing coatings. After coating the target surface, the layers of spacers 7650 are laminated together. Thus, the coating, which is often a very thin film, is protected from physical damage caused by the relative movement between the glazing and the spacer. If the same coating is applied to the inner surface of the glazing, it may be damaged by contact and / or standoff movement on the spacer unit.

  Referring to FIGS. 74, 75, and 76, the performance enhancing coating is not a surface inside the glazing itself (eg, surfaces # 2 and # 3), but is one of the spacer units such as spacer units 7450, 7550, 7650, for example. Applied to the side. These coatings on the spacer unit include low emissivity coatings, UV absorption or reflective coatings, tints, electrochromic coatings, antireflective coatings and / or other performance enhancing coatings. In some cases, all coatings are applied to one side of the spacer unit, while in other cases a premium coating is applied to the front side of the spacer unit and the other coating is applied to the other side of the spacer unit. . In the case of a multi-layer spacer unit 7650 (eg, FIG. 76), it is applied to the free side surface of the substrate portion and / or the intermediate layer.

  The spacer system (i.e., the spacer unit) is often exposed to a temperature different from both the window # 1 and the window # 2 as a whole, and is smaller than the window # 1 from the center, and compared to the window # 2. It may be advantageous to apply a performance-enhancing coating on the spacer unit 7450, 7550 or 7650 as it will be large, expand and come into contact. If a coating such as low emissivity is applied to the surface of the spacer instead of the surface # 2 and / or # 3 of the IG unit, the possibility of scratches and damage due to differentials of the components of the IG unit can be excluded. In addition, special coatings are used to enhance the resistance of surfaces # 2 and # 3 to reduce wear due to spacer standoff movement. Coatings such as diamond-like coating (DLC) are used to maintain a scratch-free glass surface for long periods of time. DLC and other coatings are already used to provide scratch resistance and other durability. Another advantage of the proposed spacer system is that the thicker the spacer substrate, the higher the heat resistance of the unit and thus the overall insulation value of the resulting IG unit.

  The standoffs of spacer units such as spacers 7450, 7550, 7650 can be circular, cone-shaped, or have other cross sections (when viewed from above). 77 and 78, in one embodiment, the standoff has a cross-section (viewed from above) that resembles a cross or a “plus” sign (“+”), and the internal surface (surface) of the IG unit window glass. Provide physical separation between # 2 and # 3) and the substrate portion of the spacer unit. In the embodiment shown in FIG. 77, a spacer unit 7750 includes a substrate 7752 and a plurality of standoffs 7754, all of which are integrally formed of glass. Stand-off 7754 in the shape of “+” is a material of about 0.5 ″ length and width, and its wall thickness and height is within about 25 microns to about 50 microns (0.001 ″ to 0.002 ″) The average human hair thickness is about 70 microns (0.003 "). In addition to transparency, the extremely small width and height of the glass standoff makes it virtually invisible. In the embodiment shown in FIG. 78, the spacer unit 7850 is also comprised of a substrate 7852 and a plurality of “+” shaped standoffs 7854. Although both are made of glass, in this embodiment the substrate 7852 is formed as a flat sheet, and a standoff 7854 is later added to the substrate.

  Referring to FIG. 79, in an alternative embodiment, the spacer unit 7950 is comprised of a standoff 7954 having a cross-section similar to the letter “C” arranged in an array over the surface of the substrate portion 7952. . The standoff can be of any shape and size as long as it is strong enough to support the IGU windowpane force by being pushed inward by atmospheric pressure on the outside of these two panes.

  The standoffs need to be strong enough to remain large enough to continue functioning in response to the requirement that the two panes (of the appropriate material components and dimensions) not contact the spacer unit substrate. Thereby providing a direct heat path. The standoff must also be designed with a sufficient surface area so that the window glass it supports will not crack, damage or otherwise interfere with its static load.

  In order to minimize the conduction path through the spacer system and to maximize the insulation value of the IG unit, it is preferable to minimize the overall contact area between the spacer unit and the windowpane. However, because the inside of the unit is near zero psi in a vacuum, while the outside of the IG unit is 14.7 psi (atmospheric or 1 atmospheric pressure), the spacers are exposed from the surface through windows # 2 and # 3. An extremely high load (pressure) is applied. Therefore, the surface area of each standoff is the area of windows # 1 and # 2 that compresses it to the extent that the load can cause minimal cracks in the window, damage the window, or retain the intended separation. You must choose so that there is no such thing.

  In an embodiment, the IGU is assembled as follows: First, a flexible (eg elastic) metal sleeve (also called “bellows”) is hermetically sealed and glued to windows # 1 and # 2, and the window sub Make an assembly. The spacer system (if used) is then placed between the two window subassemblies. The sleeves are then sealed and bonded together in a vacuum so that all IG units are sealed in this vacuum, eliminating the need for vacuum tubes and subsequent assembly vacuum steps. Diffusion bonding is suitable for hermetic bonding, but there are embodiments that perform other methods such as solder glass bonding.

  Among the alternatives for sealing the sleeves together are electrical resistance seam welding or laser welding. The key to this step is to minimize the heat affected zone to prevent thermal shock and glass cracking. In both processes, this possibility can be reduced by reducing the heat generation rate. In addition, a copper plate or other material can be placed on the surface and bottom of the unit, which serves as a heat sink during the sealing process.

  Referring to FIG. 80, an insulating glass unit (IGU) having a floating spacer unit that maintains separation is depicted (eg, window glass). The IGU 8000 includes window glasses 8002 and 8004 that are spaced from each other by spacers 8006. The difference between the panes 8002 and 8004 and the gap 8008 provide ideal insulating properties by filling with a gas or gas mixture or by including a vacuum or partial vacuum. Flexible sleeves 8010 and 8012 are sealed and bonded to glazing 8002 and 8004, each sealed from one end and bonded to the opposite end to provide a gas or gas mixture (or vacuum) within IGU space 8008. To be filled with. The spacer 8006 can float, i.e. glued to one of the two or by other means, but not to both. The position of the spacer 8006 between 8002 and 8004 is maintained by a holding rod or rod 8014 so that it can be in two central positions. Each retention rod 8014 adheres to one tip of spacer 8006 and flexible sleeves 8010 and 8012 adhere to the other tip. Preferably, the retaining rod 8014 is adhered to the flexible sleeve by being pulled between them or by other mechanical methods, which does not affect the sealing adhesion between the sleeves.

  Referring to FIG. 81, three window panes IGU are depicted according to another embodiment. The IGU 8100 includes 8102, 8104, and 8106. It is preferable that the gas of IGU8100 is filled. Elastic frames (e.g., bellows) 8108, 8110, 8112 are sealed and glued at one end, and then one or both sides of the other frame are glued at the opposite end, and sealed spaces 8114 and 8116 between the panes. Provide a weld seal so that the gas continues to be filled in. The IGU 8100 relies on the mechanical strength of the frames 8108, 8110, 8112 (rather than the spacers) to maintain the ideal space between materials. Therefore, this configuration is not well suited for use where the space 8114 and 8116 are at a high vacuum level and / or where the compressive load of the unit is high.

  Referring to FIG. 82, a triple pane IGU is depicted in accordance with another embodiment suitable for use with higher vacuum levels and / or compressive loads than the embodiment shown in FIG. The IGU 8200 includes glazings 8202, 8204, 8206 that adhere to the respective elastic frames 8208, 8210, 8212. The frame is hermetically bonded to the glazing at the first tip and maintains a space 8214 and 8216 sealed between the glazings at the second tip. As in the embodiment described in connection with FIG. 80, spacers 8218 and 8220 are floating, ie, adhere to both adjacent materials, even though they adhere to one of the two adjacent materials. There is no. In the embodiment depicted in FIG. 82, the spacer 8218 is disposed substantially at the inner edge of the elastic sleeve 8210, and therefore the height of the spacer 8218 is the same if the space between the panes is the same. Must be slightly lower than the height of 8220. In other embodiments (eg, FIG. 87), the spacers may be attached inside the sleeve joint area so that the two spacers have the same thickness. Spacers 8218 and 8220 are held in place by retaining rods 8222 and 8224, each extending from the spacer to the elastic frame as previously discussed. It will be noted later that the retaining rods 8222 and 8224 are preferably elastic so as to be in relative motion with the material.

  Referring to FIG. 83, the IGU 8000 having the two panes of FIG. 80 is shown from above and describes the details. For purposes of explanation, it is understood that the size of the window area relative to the frame area is very small. However, it is intended to better describe the details of the frame and is not considered a limitation of the invention. FIG. 83 shows how the windowpanes 8002, 8004 and spacers 8006 are arranged between the elastic frames or between the sleeves 8010 and 8012. The elastic frame is hermetically sealed and bonded to a glass material along the inside of the bonding surface 8310 and another glass material along the external bonding surface 8312. Floating spacers 8006 are maintained in place by holding rods 8014, one or more of which are attached along the ends of the spacers. The inner end 8314 of the holding bar is bonded to the spacer, and the outer end 8316 of the holding bar extends outwardly and is pulled at both ends or joined to the elastic frame 8010 and / or 8012.

  Referring to FIG. 84, two panes IGU are depicted according to another embodiment. The IGU 8400 is very similar to that shown in FIGS. There are included panes 8002 and 8004 located at both ends of spacer 8406 to define internal space 8008. Elastic frames or sleeves 8010 and 8012 are hermetically bonded at one end to the outer surface of the glazing and at the opposite end, space 8008 is filled and sealed with gas. The spacer unit 8406 is different from the spacer 8006 shown in FIG. 80 where the spacer of this embodiment includes an internal reinforcement 8408. In the described embodiment, the reinforcement 8408 is constructed from an internal web in the shape of X, but other configurations can be used. If possible, spacer 8406 is preferably an extruded item having reinforcement 8408 as part of the integral formation. The retaining rod 8014 in this example has an outer shape designed to be elastic so that the spacer 8406 floats against 8002 and 8004. The retainer rod 8014 further includes a connector portion 8410 disposed at the inner end and is configured to join the spacer 8406 as described in detail herein.

  Referring to FIGS. 85 and 86, enlarged cross-sectional views of some spacer units 8406 are shown to better explain the internal reinforcement and the joining aspect of the present invention. The outer wall 8506 of the spacer includes a connector function 8504 adapted to cooperate with the connector function 8410 of the retaining bar 8014. In the described embodiment, the spacer connector feature 8504 is comprised of a slot 8508 having a width formed in the wall 8506 in the form of a “w”, and the retainer bar connector feature 8410 is a spaced disc formed at the end of the retainer rod 8014. It consists of a pair of 8510 and 8512. The width “w” is selected to fully accept the rod 8014, but the diameter d of the disks 8510 and 8512 is d> w. As best seen in FIG. 85, as pointed to by arrow 8514, the connector function 8410 on the retaining bar 8014 may move to the connector function 8508 on the spacer. In the bonded configuration shown in FIG. 86, the retaining rod 8014 is attached to the spacer 8406 so that it does not move in either direction.

  Referring to FIGS. 87 and 88, an IGU having three panes internally bonded to a frame is depicted in accordance with another embodiment. IGU 8700 includes glazings 8702, 8704, 8706 that are separated by spacers 8708 and 8710 to form spaces 8712 and 8714. The elastic frames 8716, 8718, 8720 are sealed and bonded to the inner surface edges of 8702, 8704, 8706, respectively, and sealed to the outer edges of each other to seal the gas filled in the spaces 8712 and 8714, respectively. Apply vacuum. Holding rods 8722 joined between the spacers and between the frames are used to keep the spacers in place against the window glass.

  In the embodiment depicted in FIG. 87, spacers 8708 and 8710 are adapted to fit the internally bonded frame of IGU 8700. The upper spacer 8708 is dimensioned to be slightly smaller than the width of the glazing so that it is attached to the edge of the inner frame and does not contact the edge of the glued frame. As best seen in FIG. 88, the lower spacer 8710 has a stepped configuration at the tip inset 8724 where the spacer is bonded to the adjacent interior surfaces of the panes 8704 and 8706. To avoid contact. It will be appreciated that the configuration described is only an example and is not limiting. Numerous other configurations for attaching the elastic frame to the interior and exterior are to be understood within the scope of the invention.

  Referring to FIGS. 89-93, an IGU having a support block according to an additional embodiment is illustrated. When the IGU is mounted vertically in a window or door frame system, the support block is joined to support a significant percentage of the weight of the IGU with a flexible sleeve (eg, frame). In order to reduce thermal transfer therebetween, the support block is preferably configured to minimize contact with the flexible sleeve. This also allows the sleeve to adapt to the relative movement of the glazing as required.

  Referring initially to FIG. 89, a dual IGU suitable for use with a support block is depicted. The IGU 8900 is composed of window glasses 8902 and 8904 separated by a spacer unit 8906. In this embodiment, the spacer unit 8906 is composed of a transparent sheet 8908 having a plurality of standoffs 8910 protruding from both sides. The elastic frame materials 8912 and 8914 are hermetically bonded to the interior surfaces of the glazings 8902 and 8904 at the first end 8916 and form a sealed cavity 8920 between the glazings at the second end 8918. Then seal and bond. Spacer unit 8906 can be held in place using the previously described retaining rod (not shown) and by other means described herein.

  Referring to FIG. 90, an IGU 8900 incorporated in the support block is depicted. Viewed at the end portion, the support block 9000 appears to include a base portion 9001 and riser portions 9002 and 9004 projecting upward from the base portion, defining a sleeve cavity 9008. Each riser portion 9002 and 9004 has a support surface 9010 attached to the upper tip. Support block 9000 is supported by elastic sleeves 8912 and 8914 (sealed together when the IGU 8900 is placed on the block, with the tips of glazings 8902 and 8904 supported by the surface 9010 of the support surface of the respective risers 9002 and 9004. Dimensioned so that it is placed in the sleeve cavity 9008. To minimize thermal transfer, the bonded sleeves 8912 and 8914 preferably do not contact the cavity 9008 so that their movement is not constrained. However, a significant proportion (if not all) of the IGU weight will be supported by the riser and the base portion of the block. The support block 9000 can be formed of a metal such as steel or aluminum, but is preferably formed of a non-metal having low heat conductivity such as wood, vinyl, PVC, fiber glass, polyethylene, or the like. Although not required, in the preferred embodiment, the support block 9000 is formed by extrusion. In other embodiments, other forming processes such as rolling, milling, and routing can be used to form the support block.

  Referring to FIG. 91a, IGU 8900 and support block 9000 are described after attachment to a channel frame, such as a building window or door frame. The channel frame 9100 has a base portion 9101 and riser portions 9102 and 9104 protruding upward from the base, defining a channel 9108. Channel frame 9100 is dimensioned so that all support blocks 9000 and a portion of IGU 8900 fits into channel 9108. In this way, the channel frame 9100 supports both the vertical direction and the horizontal direction with respect to the IGU 8900. The channel frame 9100 can be formed of a metal such as metal or aluminum, but is preferably formed of a non-metal having low thermal conductivity such as wood, vinyl, PVC, fiberglass, polyethylene, or the like.

  It will be appreciated that the channel frame 9100 may be a conventional U-shaped window or door frame. In that case, the support block 9000 acts as an adapter, which allows the IGU 8900 with external elastic sealing frames (eg, frames 8912 and 8914) to be incorporated into new or existing structures.

  Referring to FIG. 91b, it is further understood that in some embodiments the support block and channel frame can be combined into a single combined frame. The coupling frame 9150 is an example of a single frame and a support block. The combined frame can be used in a new configuration for support of an IGU (eg, IGU8900) using only an external elastic frame without using a separate support block.

  Referring to FIG. 92, a perspective view of an example support block is depicted. Support block 9200 is very similar to the cross-sectional view of block 9000 described above. Block 9200 can be formed by extrusion, although other manufacturing methods can be used. Block 9200 is the length indicated by L and may be equivalent to the length of the associated IGU. However, in other cases, the length L is only a portion of the length of the IGU, and multiple blocks 9200 are attached along the end of the IGU for support.

  Referring to FIG. 93, a thermal breakdown slot 9202 is formed through the base portion 9001 of the support block 9200 to provide an additional insulating effect. These slots reduce the cross-sectional area of the material that is bonded to the sides of block 9200 to reduce thermal transfer from one block to the other.

  Referring to FIG. 94a, a double pane IGU incorporated in an anchor spacer according to another embodiment is depicted. IGU 9400 includes windowing material (ie, window glass) 9402 and 9404 separated by spacer unit 9406 to form gap cavity 9408. Elastic frames 9410 and 9412 are hermetically sealed at one end to the interior surfaces of window glasses 9402 and 9404 and hermetically sealed together at one end on the opposite side. A spacer anchor 9414 is provided at each tip of the spacer 9406 and extends to a cavity 9416 between the frame materials 9410 and 9412. The spacer anchor 9414 has a profile function that captures a portion of the anchor within the elastic frame cavity 9416 when the IGU is assembled.

  In the described embodiment, the profile feature includes a notch adjacent face tip 9418 that accommodates the inner tip width of the frame material 9410 and 9412 and the inner joint point so that the width between the frame materials is tight. And an overhanging distal end 9420 having an extended profile to fill. It will be appreciated that many other profile functions are used depending on the profile of the frame material.

  During assembly of the IGU 9400, the frame material 9410 and 9412 is first hermetically bonded to the respective panes 9402 and 9404. Next, a spacer 9406 with an anchor 9414 is placed in place between the two subassemblies. The two window subassemblies are hermetically sealed together along the outer frame joint, thereby capturing the anchor 9414 in place between the frame materials 9410 and 9412. The trapped spacer anchor 9414 prevents the spacer 9406 from moving a significant distance in either direction between the two panes.

  The configuration depicted in FIG. 94a is typical of a gas filled IGU having an “open” spacer unit 9406 (see FIG. 83). In such an IGU, since the pressure difference across the window glass is low, no direct support is required inside the window glass. However, in other embodiments, including low pressure IGUs or vacuum IGUs (eg, VGU), direct support to the interior of the glazing is required. In such embodiments, an open spacer unit 9406 with spacer anchor 9414 is a stand-off type spacer unit with spacer anchor 9414 (eg, as shown in FIGS. 63a to 65a, 74 to 76, or 89 to 91a). IGU is used which is very similar to the IGU 9400 except that it may be replaced. The stand-off type spacer is placed between the window glasses to maintain the distance, and the molded spacer anchor 9414 is adhered to the tip of the spacer and fixed in the cavity between the frame materials described above, so that the window glass is fixed. Maintain the position of the spacer in between.

  Referring to FIG. 94b, an IGU is depicted that does not have any spacers according to another embodiment. IGU 9450 includes glazings 9452 and 9454 that are spaced apart from each other to form a gap cavity 9458. Elastic frames (eg, bellows) 9460 and 9462 are hermetically bonded at one end to the interior surfaces of the panes 9552 and 9454 and hermetically bonded to each other at one end. Although elastic, the frames 9460 and 9462 along the sides of the IGU provide sufficient mechanical rigidity (or “springs”) without mechanical spacers to maintain the spacing of the panes 9492 and 9454. In that case, a separate spacer unit is not required, whether it is an open unit mounted around the perimeter of the cavity or a standoff unit mounted between the panes. Typically, an IGU without an internal spacer becomes an insulating glass unit filled with gas or air, as the air pressure in the cavity 9458 lowers the pressure difference across the glazing, thereby requiring it in the frames 9460 and 9462. Reduce stiffness and maintain spacing.

  Referring to FIG. 95, an IGU having three panes incorporating split anchor spacers is depicted in accordance with yet another embodiment. IGU 9500 includes window members (ie, window glasses) 9502, 9503, 9504 separated by spacer units 9506 and 9507 to form gap cavities 9508 and 9509. Elastic frames 9510 and 9512 are sealed and bonded together at the inner surface of the outer panes 9502 and 9504 at one end and sealed together at the opposite end. Spacer anchor 9514 is expanded into a cavity 9516 between frame materials 9510 and 9512 and is provided at both ends of spacers 9506 and 9507. The spacer anchor 9514 in this embodiment is substantially similar to the double glazing anchor 9414 described above. However, the spacer anchor 9514 in this embodiment has various external functions at each tip. In particular, when the IGU is assembled, the outer surface has features 9517 and 9518 that capture a portion of the anchor in the elastic frame cavity 9516, and the inner surface has features 9520 that support the center pane 9503. is there.

  During assembly of the IGU 9500, the frame materials 9510 and 9512 are first hermetically bonded to the respective outer panes 9502 and 9504 to form the outer pane pane subassembly. Next, spacers 9506 and 9507 with separating anchors 9514 are placed on each side of the center pane 9503 to form the center subassembly. The central subassembly is then placed between the two outer window subassemblies. The two outer window subassemblies are hermetically bonded together along the outer frame joint, thereby catching the anchor 9514 (with associated spacer and center window glass) and placing it between the frame materials 9510 and 9512. . The trapped spacer anchor 9514 prevents the spacers 9506 and 9507 and the central window glass 9503 from moving significantly in either direction between the two outer window glasses.

  Referring to FIGS. 96a, 96b, 96c, in accordance with yet another embodiment, an IGU is depicted that includes a resilient metal sleeve bonded to the exterior or interior surface of the glazing. Although the flexible sleeve system described herein has a resilient portion that extends through the outer peripheral side of the window pane to which it is bonded, in this embodiment, the resilient component of the IGU is Hermetically seals and adheres to the inner surface of the two panes (i.e., # 2 and # 3 in industry terms), and the resilience is "just in line" with the outer periphery, i.e. roughly within the outer periphery of the IGU Be placed. Seal adhesion is by diffusion bonding or the use of solder glass. While this arrangement appears to be similar to known gas filled IGUs that use spacers along the inner periphery of the spacer, there are significant differences in this embodiment. First, the resilient metal spacer is bonded by diffusion bonding or solder glass to form a hermetic bond to the inner surface of each of the two panes. Known IGU systems employ non-hermetic bonding or epoxy to bond the spacer unit to the inside of the glazing. Secondly, the spacer in this concept is elastic in the three axes of X, Y, and Z, so that the two panes expand due to the effect of temperature changes on both sides of the IGU (that is, the inner and outer walls included in the IGU). And allows you to contract. If there is a significant pressure difference between the inner and outer walls of the IGU (eg, if the IGU is vacuum or contains depressurized pressure gas), the transparent spacer system mechanically separates the window glass, Must be used in. The spacer system also provides the necessary depth for the resilient sleeve to be located between the panes.

  Referring specifically to FIG. 96a, in the depicted example, the IGU 9600 is comprised of an upper window glass 9602, an upper elastic frame material 9604, a lower elastic frame material 9606, and a lower window glass 9608. It is understood that the frame materials 9604 and 9606 are dimensioned to fit within the outer perimeter, and each frame material has an upper and lower joining surface. The outer bonding surfaces of each resilient frame material 9604 and 9606 are hermetically bonded to the panes 9602 and 9608, respectively, to form a pair of window subassemblies 9612 and 9614 using diffusion bonding or solder glass. preferable.

  Referring to FIG. 96b, the transparent spacer unit 9610 is disposed between the window subassemblies 9612 and 9614. In the depicted embodiment, the spacer unit 9610 is constructed of a transparent sheet with a series of standoffs on both sides, but the spacer unit in other embodiments uses the other configurations previously described herein. Yes. Next, the inner bonding surfaces of the two subassemblies 9612 and 9614 are hermetically bonded to each other, preferably using diffusion bonding or solder glass, thereby forming a sealed cavity therebetween, with a spacer 9610 therein. capture.

  Referring to FIG. 96c, a completed IGU 9600 is shown. It is understood that the frame materials 9604 and 9606 are not present beyond the periphery. It is further understood that the ideal atmosphere (eg, vacuum, reduced pressure atmosphere, or filled gas) in the IGU cavity is placed in the IGU by various methods. Initially, the joining of the two subassemblies 9612 and 9614 is done directly in a suitable atmosphere (eg, vacuum, reduced pressure atmosphere, etc.), so that the ideal fill is “trapped” in the joining cavity. A pinch tube or other such port (not shown) is also incorporated into one of the frame materials. In that case, the cavities are evacuated and / or refilled with a moderate filling gas via a pinch tube after joining. The pinch tube can then be sealed and sealed by known methods.

  In one embodiment of the invention, an insulating glass unit having a metal sleeve and an electrochromic or electrochromic coating on the inner surface of one or more panes is envisioned. Electrical bonding from the outside of the sealed unit to the coating inside the unit is necessary for control of the coating, and in such cases the bond through the metal sleeve must also be sealed. Glass metal seals have been used to maintain the seal and electrical insulation between the feedthrough and the metal frame. The use of feedthroughs utilizing glass metal seals is known in the electronic component mounting industry. Preferred materials have the characteristics of wettability by glass, adaptive temperature expansion, and low outgassing rates at relative temperatures, thereby making them easy to use in vacuum systems.

  In a further embodiment, the VGU is from an indicator that indicates whether an ideal vacuum or reduced pressure atmosphere is still contained within the cavity between the VGU windowpanes (ie, whether the VGU is not leaking). Will be composed. One such embodiment is a display mounted in the internal cavity of the VGU, where the color of the display changes when the vacuum level drops and / or outside air enters the cavity. The indicator is incorporated with a label or other attached along the periphery of the VGU so that it is visible through the inside of the glazing.

  In yet another embodiment, the IGU filled with gas is the integrity of the IGU seal, i.e. whether the desired fill gas has leaked and / or whether the gas is being exchanged between the outside and inside of the IGU. It is comprised with the indicator which shows such a thing. It is preferable that the indicator is composed of a color that changes through the inside of the label or the window glass. More preferably, the color characteristics such as intensity and tint can indicate leakage and / or loss of insulation characteristics.

  While the invention has been shown and described in more various forms, it will be apparent to those skilled in the art that further and further modifications can be made without departing from the scope of the invention without being limited to these examples. is there.

  In particular, it is understood that the present invention is performed using a variety of gases including air, nitrogen, argon, krypton, xenon and mixtures of these gases to fill the gaps between the panes instead of vacuum. Is done. The gas in the void may be depressurized or at partial pressure, in which case the spacer assembly described herein may be required and may be described here at atmospheric or high pressure. The spacer assembly may be removed. In other embodiments, the spacer assembly described herein can be replaced with a simple spacer assembly located only around the pane.

It is a perspective view of a sealed micro device package. It is sectional drawing of the micro device package of FIG. FIG. 3 is an exploded view of a cover assembly manufactured in accordance with an embodiment of the present invention. A sheet having both sides formed. A sheet having one side molded. It is an enlarged view of the sheet seal ring region before metallization. It is an enlarged view of the sheet | seat seal ring area | region after metallization. It is sectional drawing by the flame | frame processed beforehand. It is a figure illustrating attachment of the frame with respect to the sheet | seat to be metallized before joining. FIG. 5 is a block diagram of a process for manufacturing a cover assembly using a pre-machined frame according to one embodiment. FIG. 3 is an exploded view of a cover assembly manufactured using a solder preform. FIG. 6 is a partial perspective view of another embodiment utilizing solder applied by inkjet. In accordance with yet another embodiment of the present invention, the first transparent sheet in the process of manufacturing the cover assembly. In accordance with yet another embodiment of the present invention, a transparent sheet after the initial metallization of the process of manufacturing the cover assembly. In accordance with yet another embodiment of the present invention, a transparent sheet after deposition of the completed frame / heat spreader in the process of manufacturing the cover assembly. 12b is a partial cross-sectional view of the sheet of FIG. 12a. 12b is a partial cross-sectional view of the sheet of FIG. 12b. 12c is a partial cross-sectional view of the sheet of FIG. 12c. FIG. 6 is a block diagram of a process for manufacturing a cover assembly using cold gas dynamic spraying technology, according to another embodiment. FIG. 6 is an exploded view of a multi-unit assembly manufactured according to another embodiment. FIG. 15b is a bottom view of the frame of FIG. 15a. FIG. 6 illustrates a fitted tool formed according to another embodiment. FIG. 6 is a side view of a multi-unit assembly illustrating a method of separation. FIG. 6 illustrates the manufacture of a plurality of cover assemblies according to yet another embodiment, a transparent sheet in its original state. FIG. 6 illustrates the fabrication of a plurality of cover assemblies according to yet another embodiment, illustrating the sheet after deposition of a multi-opening frame / heat spreader. FIG. 5 illustrates an assembly configuration suitable for use with electrical resistance heating, illustrating a sheet configuration. FIG. 5 illustrates an assembly configuration suitable for use with electrical resistance heating, illustrating a frame configuration. FIG. 6 illustrates an assembly configuration suitable for use with electrical resistance heating, illustrating a bonded sheet and frame. FIG. 6 illustrates a suitable multi-unit assembly configuration for heating with electrical resistance heating. FIG. 6 illustrates a suitable multi-unit assembly configuration for heating with electrical resistance heating. FIG. 6 illustrates a suitable multi-unit assembly configuration for heating with electrical resistance heating. FIG. 6 illustrates a suitable multi-unit assembly configuration for heating with electrical resistance heating. FIG. 6 illustrates a suitable multi-unit assembly configuration for heating with electrical resistance heating. FIG. 5 illustrates a multi-unit assembly configuration suitable for heating with electrical resistance heating. FIG. 6 is an exploded view of a window assembly including an intermediate layer for diffusion bonding. FIG. 20b illustrates the window assembly of FIG. 20a after diffusion bonding. FIG. 6 illustrates an additional embodiment of the present invention having an inner and an outer frame, and is an exploded view of a “sandwiched” window assembly prior to joining. FIG. 21 illustrates an additional embodiment of the present invention having an inner and an outer frame, illustrating the complete assembly of FIG. 20c after joining. FIG. 6 illustrates a fixture for aligning or pushing a window assembly during diffusion bonding, and illustrates a fixture and clamp without a content. FIG. 21 illustrates the fixture for aligning or pushing the window assembly during diffusion bonding, illustrating the fixture of FIG. 20e with the window assembly disposed therein for bonding. FIG. 5 illustrates a fixture for aligning or pushing a window assembly during diffusion bonding, illustrating an alternative fixture designed to generate more axial pressure on the window assembly. . FIG. 4 is a cross-sectional view of a wafer level sealed microdevice package according to another embodiment of the present invention, a wafer level sealed microdevice package having opposite electrical connections. FIG. 6 is a cross-sectional view of a wafer level sealed microdevice package according to another embodiment of the present invention, a wafer level sealed microdevice package having ipsilateral electrical connections. FIG. 21b is an exploded view showing a method of assembly of the package of FIG. 21b. FIG. 2 illustrates a semiconductor wafer having multiple microdevices formed thereon that are suitable for packaging multiple wafer levels simultaneously. FIG. 23 illustrates the semiconductor wafer of FIG. 22 after metallization of the wafer surface. FIG. 6 illustrates a metal frame for attachment between a sealed package wafer surface and a window sheet. FIG. 25 is an enlarged view of the frame member of FIG. 24, a top view of a portion of the double frame member prior to singulation. FIG. 26 is an enlarged view of the frame member of FIG. 24 and an end view of the double frame member of FIG. 25a. FIG. 25 is an enlarged view of the frame member of FIG. 24, a top view of a portion of a single frame member from around the frame or after device isolation. FIG. 26 is an enlarged view of the frame member of FIG. 24 and an end view of the single frame member of FIG. 25c. FIG. 25 illustrates a metallized window sheet for attachment to the frame of FIG. 24. FIG. 6 is a cross-sectional side view of a multiple package assembly before singulation. FIG. 28 illustrates one option for unification of the multiple package assembly of FIG. 27. FIG. 28 illustrates another option for unification of the multiple package assembly of FIG. 27. FIG. 6 illustrates a semiconductor wafer after metallization of a wafer surface according to another embodiment having an electrode array. FIG. 6 illustrates a metallized window sheet according to another embodiment having an electrode array. FIG. 7 is a cross-sectional side view of a multiple package assembly prior to singulation according to another embodiment with direct electrode access. It is a top view of the microdevice which has a pad on the same side. FIG. 34 illustrates a semiconductor wafer having a plurality of microdevices formed therein of FIG. FIG. 35 illustrates the semiconductor wafer of FIG. 34 after metallization of the wafer surface. FIG. 36 illustrates a metal frame for attachment to the wafer surface of FIG. 35. It is a figure illustrating the metallized window sheet for attaching to the frame of FIG. FIG. 3 is a top view of a completed multiple package assembly. FIG. 39 illustrates strips of multiple packages after column separation of the multiple package assembly of FIG. 38. FIG. 40 illustrates a single packaged microdevice after unification of multiple package strips of FIG. 39. FIG. 6 is a partial cross-sectional side view of a multi-package assembly with an alternative frame design prior to singulation. FIG. 5 is a cross-sectional side view of an alternative frame design, each of a set of adjacent frame side members that are bonded together by connecting tabs. FIG. 5 is a cross-sectional side view of an alternative frame design, each of a set of adjacent frame side members that are bonded together by connecting tabs. FIG. 5 is a cross-sectional side view of an alternative frame design, each of a set of adjacent frame side members that are bonded together by connecting tabs. FIG. 5 is a cross-sectional side view of an alternative frame design, each of a set of adjacent frame side members that are bonded together by connecting tabs. FIG. 5 is a cross-sectional side view of an alternative frame design, each of a set of adjacent frame side members that are bonded together by connecting tabs. FIG. 4 is a cross-sectional side view of an additional alternative frame design, each of which is a set of adjacent frame side members that are bonded together by one or more connection tabs. FIG. 4 is a cross-sectional side view of an additional alternative frame design, each of which is a set of adjacent frame side members that are bonded together by one or more connection tabs. FIG. 4 is a cross-sectional side view of an additional alternative frame design, each of which is a set of adjacent frame side members that are bonded together by one or more connection tabs. FIG. 4 is a cross-sectional side view of an additional alternative frame design, each of which is a set of adjacent frame side members that are bonded together by one or more connection tabs. FIG. 4 is a cross-sectional side view of an additional alternative frame design, each of which is a set of adjacent frame side members that are bonded together by one or more connection tabs. FIG. 6 is a cross-sectional side view of yet another alternative frame design, each of which is a set of adjacent frame side members that are bonded together by connecting tabs. FIG. 6 is a cross-sectional side view of yet another alternative frame design, each of which is a set of adjacent frame side members that are bonded together by connecting tabs. FIG. 6 is a cross-sectional side view of yet another alternative frame design, each of which is a set of adjacent frame side members that are bonded together by connecting tabs. FIG. 6 is a cross-sectional side view of yet another alternative frame design, each of which is a set of adjacent frame side members that are bonded together by connecting tabs. FIG. 6 is a cross-sectional side view of yet another alternative frame design, each of which is a set of adjacent frame side members that are bonded together by connecting tabs. FIG. 6 is a cross-sectional side view of yet another alternative frame design, each of which is a set of adjacent frame side members that are bonded together by one or more connection tabs. FIG. 6 is a cross-sectional side view of yet another alternative frame design, each of which is a set of adjacent frame side members that are bonded together by one or more connection tabs. FIG. 6 is a cross-sectional side view of yet another alternative frame design, each of which is a set of adjacent frame side members that are bonded together by one or more connection tabs. FIG. 6 is a cross-sectional side view of yet another alternative frame design, each of which is a set of adjacent frame side members that are bonded together by one or more connection tabs. FIG. 6 is a cross-sectional side view of yet another alternative frame design, each of which is a set of adjacent frame side members that are bonded together by one or more connection tabs. FIG. 6 is a cross-sectional side view of yet another alternative frame design, each of which is a set of adjacent frame side members that are bonded together by one or more connection tabs. FIG. 4 is a partial plan view of an alternative frame design, each of which is a set of adjacent frame side members that are glued together by connecting tabs. FIG. 4 is a partial plan view of an alternative frame design, each of which is a set of adjacent frame side members that are glued together by connecting tabs. FIG. 4 is a partial plan view of an alternative frame design, each of which is a set of adjacent frame side members that are glued together by connecting tabs. FIG. 4 is a partial plan view of an alternative frame design, each of which is a set of adjacent frame side members that are glued together by connecting tabs. FIG. 5 is a plan view of a frame assembly that is machined by photochemical machining (PCM). FIG. 48 is a cross-sectional side view of the frame assembly of FIG. 47. It is a perspective view of the arrangement | sequence of many frames of PCM processing before unification. FIG. 5 is an exploded view of a double window frame sealed window assembly. FIG. 52 is a perspective view of the assembled double window frame sealed window assembly of FIG. 50; 1 is an exploded view of a building window unit including two double window frame sealed window assemblies. FIG. FIG. 53 is a perspective view of the window unit of the assembled building of FIG. 52. FIG. 6 is an exploded view of a triple window frame sealed window assembly. FIG. 56 is a perspective view of the assembled window pane sealed window assembly of FIG. 54; FIG. 6 illustrates an instrument for securing multiple sets of sealed window assemblies for simultaneous joining. 2 is a double window frame vacuum glass unit ("VGU") according to the prior art. It is an exploded view of the structural material of the vacuum glass unit by one embodiment. FIG. 58b is an assembly view of the VGU of FIG. 58a. It is a figure illustrating adhesion / joining to a lower frame member of an upper frame member. It is a figure illustrating adhesion / joining to a lower frame member of an upper frame member. It is a figure illustrating adhesion / joining to a lower frame member of an upper frame member. FIG. 6 is a perspective view of a conforming frame according to another embodiment. FIG. 6 is an exploded view of a vacuum glass unit component incorporating a fabric spacer, according to another embodiment. FIG. 59b is an assembly view of the VGU of FIG. 59a. FIG. 6 is an exploded view of a VGU component having an optional intermediate layer according to another embodiment. FIG. 60b is an assembly view of the VGU of FIG. 60a. FIG. 6 is an exploded view of a VGU component having a spacer incorporated into the processing of the lower pane according to another embodiment. FIG. 61b is an assembly view of the VGU of FIG. 61a. FIG. 5 is a side view of a glazing having a spacer on one of the surfaces incorporated in the processing of the glazing, according to another embodiment. FIG. 62b is a first perspective view of the window glass with spacers of FIG. 62a. FIG. 62b is a second perspective view of the window glass with spacers of FIG. 62a. FIG. 6 is an exploded view of a VGU component having a transparent sheet central spacer unit that is processed with standoffs on (and as part of) the upper and lower ends of the sheet according to another embodiment. FIG. 63b is an assembly view of the VGU of FIG. 63a. FIG. 5 is an exploded view of a VGU component having an optional member between a sealing frame member and a windowpan, according to another embodiment. FIG. 64b is an assembly view of the VGU of FIG. 64a. FIG. 6 is an exploded view of a VGU component having upper and lower frame members of similar shape and size, according to another embodiment. FIG. 65b is an assembled view of the VGU of FIG. 65a. It is a figure which shows three deformation | transformation of the side surface of the cross section of the "gull wing" of a frame member. It is a figure which shows three deformation | transformation of the side surface of the cross section of the "gull wing" of a frame member. It is a figure which shows three deformation | transformation of the side surface of the cross section of the "gull wing" of a frame member. FIG. 6 is a perspective view of an assembly of horizontal and vertical grids according to another embodiment. FIG. 5 is a perspective view of a standoff horizontal and vertical grid assembly, according to another embodiment. FIG. 67b is a side view of the grating assembly of FIG. 67b. FIG. 67b is an exploded view of the lattice assembly of FIG. 67b positioned between the upper and lower panes to form a subassembly. FIG. 67d is an assembled perspective view of the subassembly of FIG. 67d. FIG. 67b is an assembled side view of the subassembly of FIG. 67d. FIG. 67f is an exploded view showing components of a VGU using the crosspiece and glazing subassembly of FIG. 67f. FIG. 67B is an assembly diagram illustrating the VGU of FIG. 67g. FIG. 6 is an exploded view of a VGU having a frame member joined to the inner (inner) surface of the glazing, according to another embodiment. FIG. 68b is an assembly view showing the VGU of FIG. 68a. FIG. 5 is an exploded view of a VGU having an inner window pane and an inner window pane joined with a frame member extending beyond the outer surface of the upper and lower window panes, according to another embodiment. FIG. 69b is an assembly diagram illustrating the VGU of FIG. 69a. FIG. 4 is an exploded view of a VGU having a frame member joined with an internal window glass and an optional intermediate layer between the frame member and the window glass, according to another embodiment. FIG. 70b is an assembly diagram illustrating the VGU of FIG. 70a. FIG. 6 shows a VGU with a central spacer unit according to another embodiment. FIG. 6 shows a VGU having a central spacer unit and an intermediate frame member attached to the central spacer unit, according to yet another embodiment. FIG. 5 shows a VGU having a central spacer unit and an intermediate frame member attached to the central spacer unit, according to a further embodiment. FIG. 6 is an exploded view of a VGU component having upper and lower panes with spacers and flat central spacers in accordance with another embodiment. FIG. 72b is an assembled view of the VGU of FIG. 72a. It is an exploded view of the structural material of a vacuum glass unit by another embodiment. FIG. 73b is an assembled view of the VGU of FIG. 73a. FIG. 6 is a perspective view of a fitted frame, according to another embodiment. It is a side view of the spacer unit for vacuum glass units by one embodiment. FIG. 6 is a side view of a spacer unit for a vacuum glass unit according to another embodiment. FIG. 6 is a side view of a spacer unit for a vacuum glass unit, according to a further embodiment having a “layered” or “sandwiched” structure. It is an enlarged front view of a part of the spacer unit of the cross-shaped standoff. It is another front view of a part of spacer unit of a cross-shaped standoff. FIG. 6 is an enlarged front view of a part of a spacer unit of a “C” -shaped standoff. FIG. 6 is a cross-sectional view of two IGUs with spacers according to another embodiment. FIG. 4 is a cross-sectional view of a gas filled IGU of three bars according to another embodiment. FIG. 7 is a cross-sectional view of a three crosspiece IGU with spacers, according to another embodiment. FIG. 81 is a top view of the IGU of FIG. 80 with a torn portion. FIG. 6 is a cross-sectional view of two IGUs with spacers according to another embodiment. FIG. 85 is an enlarged cross-sectional perspective view of the spacer and retainer bar of FIG. 84. It is the spacer and retainer bar of FIG. 85 showing the connection. FIG. 6 is a cross-sectional view of a three-bar IGU having an inner frame base and spacers according to another embodiment. It is an enlarged part of IGU of FIG. FIG. 4 is a cross-sectional view of two IGUs with spacers, according to another embodiment. FIG. 90 is the IGU of FIG. 89 supported by a pedestal block, according to another embodiment. 90 is a block of the IGU and platform of FIG. 90 fitted into a frame. According to another embodiment, a single composite frame. It is a perspective view of a part of block of the stand of FIG. FIG. 93 is a top view of a portion of the platform block of FIG. 92. Figure 2 is an IGU of two window frames with fixed spacers according to another embodiment. Figure 2 is an IGU of two window frames without spacers, according to another embodiment. Figure 3 is a three window frame IGU with split and fixed spacers according to yet another embodiment. FIG. 7 is a perspective view showing an assembly of an IGU having a flexible spacer according to another embodiment. FIG. 7 is a perspective view showing an assembly of an IGU having a flexible spacer according to another embodiment. FIG. 7 is a perspective view showing an assembly of an IGU having a flexible spacer according to another embodiment.

Claims (56)

A first window glass sheet formed from a transparent material and having a peripheral portion;
A first seal member having an inner end and an outer end, wherein the inner end is sealed and attached to the periphery of the first window glass sheet by diffusion bonding, and creates a sealed state therebetween;
A second window glass sheet formed from a transparent material and having a peripheral part;
A second seal member having an inner end and an outer end, the inner end being sealed and attached to the periphery of the second window glass sheet by diffusion bonding, and creating a sealed state therebetween,
A spacer assembly disposed between the first and second glazing sheets to maintain a distance between them, and a spacer is slidable relative to at least one of the first and second glazing sheets; and the second seal. An outer end of the first seal member attached in a sealed state to the outer end of the member,
A sealed multi-window assembly whereby a sealed cavity containing the spacer assembly is formed between the first and second window frames.   The sealed window assembly of claim 1, wherein the sealed cavity between the first and second window frames is a vacuum.   The sealed window assembly of claim 2, wherein the sealed cavity between the first and second window frames is incomplete vacuum.   The sealed window assembly of claim 1, wherein the sealed cavity between the first and second window frames comprises a gas.   The sealed window assembly of claim 4, wherein the gas in the sealed cavity between the first and second window frames is one of air, nitrogen, argon, krypton, and xenon.   The sealed window assembly of claim 1, wherein the sealed cavity between the first and second window frames comprises airgel.   The sealed multiple glazing window assembly of claim 1, wherein at least one of the first and second sealing members is adapted for lateral expansion and contraction of an attached glazing sheet.   The sealed window assembly of claim 1, wherein at least one of the first and second seal members is formed from metal.   The sealed window assembly of claim 1, wherein the spacer assembly includes a plurality of spaced standoff members attached to an interior surface of one of the glazing sheets.   The spacer assembly further includes another glazing sheet disposed between the two glazing sheet standoff members and a plurality of spaced standoff members attached to an interior surface of the spacer sheet. A sealed window assembly as described in.   The sealed window assembly of claim 1, wherein the spacer assembly includes a plurality of standoff members formed on an interior surface of one of the glazing sheets during manufacture of the glazing sheet.   The sealed window assembly of claim 1, wherein the spacer assembly includes a sheet having a plurality of stand-off members formed on an opposite side of the window glass sheet. A first window glass sheet formed from a transparent material and having a peripheral portion;
A second window glass sheet formed from a transparent material and having a peripheral part;
A spacer assembly disposed between the first and second glazing sheets to maintain a distance between the first layer and the first layer having a plate-like first substrate portion made of a transparent material; and A first assembly of standoffs formed integrally with the substrate portion, the standoff being disposed on at least one surface of the substrate portion and projecting outward therefrom;
A sealing assembly attached in a sealed state to the periphery of the first and second window glass sheets by diffusion bonding, wherein the first and second window frames are formed by creating a sealed state between the window glass sheets. A sealed multiple glass window assembly including a sealing assembly between which a sealed cavity is defined.   The sealed window assembly of claim 13, wherein a first layer of the spacer assembly including the standoff is formed from transparent glass.   14. The sealed window assembly of claim 13, wherein the first layer of the spacer assembly including the standoff is formed from a transparent plastic.   The sealed window assembly of claim 13, wherein the first layer substrate portion of the spacer assembly includes a performance enhancing coating.   The sealed window assembly of claim 16, wherein the performance enhancing coating is a low radiation coating.   The sealed window assembly of claim 16, wherein the performance enhancing coating is a UV block coating.   The sealed window assembly of claim 16, wherein the performance enhancing coating is a tinted tint.   The sealed window assembly of claim 16, wherein the performance enhancing coating is an electrochromic coating.   The sealed window assembly according to claim 13, wherein the stand-off is disposed so as to extend over a top surface and a bottom surface of the substrate portion and protrude outward.   The sealed window assembly of claim 13, wherein the spacer assembly further comprises a second layer spaced from the first layer.   The second layer of the spacer assembly includes a second substrate portion and a second plurality of standoffs formed integrally with the second substrate portion, and the second plurality of standoffs is a second substrate. 23. The sealed window assembly of claim 22, wherein the sealed window assembly is disposed on one surface of the substrate portion and projects outwardly therefrom, and generally the first and second multiple standoffs project oppositely outwardly.   24. The sealed window assembly of claim 23, further comprising at least one additional individual layer material disposed between the first layer and the second layer.   The sealed window assembly of claim 13, wherein the air in the sealed cavity is at least partially depressurized.   26. The sealed window assembly of claim 25, wherein the air in the sealed cavity is a vacuum. A first window glass formed from a transparent material and having a peripheral part;
A first seal member having an inner end and an outer end, wherein the inner end is attached to the periphery of the first window glass sheet in a sealed state;
A second glazing formed from a transparent material, having a peripheral portion and disposed away from the first glazing,
A second seal having an inner end and an outer end, wherein the inner end is attached to the periphery of the second window glass in a sealed state, and the outer end is attached to the outer end of the first seal member in a sealed state Members,
A sealed multiple glazing window assembly including at least one of the first and second sealing members that allows associated movement between the first and second glazings.   28. The window assembly of claim 27, wherein the first glazing is hermetically attached to the first seal member using a diffusion bonding process.   Solid phase diffusion wherein the diffusion bonding process comprises holding the glazing and the sealing member at a specified high temperature below a specified surface pressure, a specified length of time, and a melting point of any of the glazing and sealing member. 30. The window assembly of claim 28, comprising a bonding process.   30. The window assembly of claim 29, further comprising an intermediate layer material disposed between the first glazing and the first seal member prior to diffusion bonding.   The diffusion bonding process includes transient liquid phase diffusion bonding, and the initial temperature is high enough to dissolve the bonding material on one of the window glass and the seal member, and the subsequent temperature is set higher than the initial temperature. 29. The window assembly of claim 28, wherein the window assembly is allowed to solidify to maintain the subsequent temperature until the bonding material diffuses into the base metal by low temperature diffusion bonding.   32. The window assembly of claim 31, further comprising an intermediate layer material disposed between the first glazing and the first seal member prior to diffusion bonding.   28. The window assembly of claim 27, wherein the first glazing is hermetically attached to the first seal member using a solder process.   34. The window assembly of claim 33, wherein the soldering process utilizes a solder glass material.   And further comprising a third glazing disposed between the first and second glazings, wherein the sealed cavity is a first cavity between the first and third window frames, and the second and third. 28. The window assembly of claim 27, further divided into a second cavity disposed between the window frames.   36. The window assembly of claim 35, wherein the first cavity is sealed from the second cavity.   A spacer assembly disposed between the first and second glazing sheets, the spacer assembly being suspended relative to at least one of the first and second glazings; 28. A window assembly according to claim 27.   A viewing region defined in the center of the windowpane, wherein the visibility of the window assembly is not blocked by the seal member, and the spacer assembly is disposed along the periphery of the windowpane to 38. The window assembly of claim 37, occupying less than 10%.   And further comprising an observation region defined in the center of the window pane, wherein the visibility of the window assembly is not blocked by the seal member, and the spacer assembly is disposed between the window panes and is at least 10% of the observation zone. 38. The window assembly of claim 37.   38. The window assembly of claim 37, wherein the spacer assembly comprises a crosspiece assembly including a plurality of vertical and horizontal grids.   The inner ends of the first and second sealing members are sealed to the inner surfaces of the first and second glazings, respectively, and the outer ends of the sealing members extend outward beyond the periphery of the glazing. 28. The window assembly of claim 27, wherein the window assembly defines a profile of a seal member having a cavity.   And further comprising an anchor spacer disposed at a periphery of the spacer assembly, wherein the anchor shape is adapted to fit an outer shape of the seal member, and a horizontal movement of the spacer assembly is substantially performed by the spacer anchor. 42. The window assembly of claim 41, wherein the window assembly is restricted.   A support block comprising a base portion, a riser portion projecting upward from the base portion to define a seal cavity therebetween, and a seating surface disposed on the riser portion, wherein the support block dimensions are the window assembly An outer portion of the seal member fits within the seal cavity when the ends of the first and second panes are positioned relative to the seating surface. Item 42. The window assembly according to Item 41. A method of manufacturing a sealed multiple glass window assembly comprising:
Providing a first glazing sheet formed from a transparent material and having a peripheral portion; and a first seal member having an inner end and an outer end;
Arranging the inner end of the first seal member in the periphery of the first window glass sheet;
The inner end of the first seal member is pressed with sufficient force against the first window glass sheet, and a predetermined first contact pressure is formed along the first joint between the inner end and the window glass sheet. A step of generating
Heating the first joint to generate a predetermined first temperature along the first joint;
Maintaining the predetermined first contact pressure and high temperature until diffusion bonding is formed along the periphery of the first window glass sheet between the first seal member and the first window glass sheet;
Providing a second glazing sheet having a periphery formed from a transparent material and a second sealing member having an inner end and an outer end;
Arranging the inner end of the second seal member along the periphery of the second window glass sheet;
A predetermined second contact pressure is pressed along the second joint between the inner end and the window glass sheet by pressing the inner end of the second seal member with a sufficient force against the second window glass sheet. A step of generating
Heating the second joint and generating a predetermined second temperature along the second joint;
Maintaining the predetermined second contact pressure and high temperature until a diffusion bond is formed along the periphery of the second window glass sheet between the second seal member and the second window glass sheet;
Defining a sealed cavity between the first and second window frames by attaching the outer end of the first seal member to the outer end of the second seal member in a sealed state.   Prior to the step of sealingly attaching the outer end of the first seal member to the outer end of the second seal member, a spacer assembly is disposed between the first and second glazing sheets to maintain the spacing therebetween. 45. The method of manufacturing a window assembly according to claim 44, further comprising the step of:   45. The method of manufacturing a window assembly according to claim 44, wherein the first and second sealing members are sealed in a vacuum environment.   45. The window assembly manufacturing method of claim 44, further comprising: after sealing the first and second seal members, evacuating the sealed cavity between the first and second window frames to create a sealed condition. Method.   45. The method of manufacturing a window assembly according to claim 44, further comprising filling the sealed cavity between the first and second window frames with gas after the first and second seal members are sealed. A method of manufacturing a sealed multiple glass window assembly comprising:
Providing a first glazing formed from a transparent material and having a periphery;
Providing a first seal member having an inner end and an outer end;
Attaching the inner end of the first seal member along the periphery of the first window glass in a sealed state;
Providing a second glazing formed from a transparent material, having a periphery, and disposed away from the first glazing;
Providing a second seal member having an inner end and an outer end;
Attaching the inner end of the second seal member in a sealed state along the periphery of the second window glass;
Attaching the outer end of the second seal member to the outer end of the first seal member in a sealed state;
At least one of the first and second seal members is adapted to allow relative movement between the first and second window frames, thereby sealing a cavity in the first and second window frames. And a step of forming between.   50. The method of claim 49, wherein the at least one sealing step comprises a diffusion bonding process.   The diffusion bonding process includes a solid diffusion bonding process, and holds the window glass and the seal member at a specific high temperature lower than a specific surface pressure, a specific length of time, and a melting point of any of the window glass and the seal member. 51. The method of claim 50, comprising steps.   52. The method of claim 51, further comprising placing an interlayer material between the first pane and the first seal member prior to diffusion bonding.   The diffusion bonding process includes transient liquid phase diffusion bonding, and the initial temperature is high enough to dissolve the bonding material on one of the window glass and the seal member, and the subsequent temperature is set higher than the initial temperature. 51. The method of claim 50, wherein lowering allows the bonding material to solidify and maintains the subsequent temperature until the bonding material diffuses into the base material by low temperature diffusion bonding.   54. The method of claim 53, further comprising placing an interlayer material between the first pane and the first seal member prior to diffusion bonding.   50. The window assembly of claim 49, wherein the at least one sealing step includes a soldering process.   56. The method of claim 55, wherein a solder glass material is utilized in the soldering process.

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