JP2008288542A - Ultraviolet irradiation device and ultraviolet irradiation method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To adjust light volume of a plurality of wavelength bands individually and to adjust light intensity distribution of irradiating light arbitrarily. <P>SOLUTION: A lamp unit 30 is constituted by including a light source 1 supplying the irradiating light, a first reflecting mirror group 2A and a second reflecting mirror group 3A. The light emitted from the lamp unit 30 is irradiated on an object 12 to be irradiated with light. The first reflecting mirror group 2A and the second reflecting mirror group 3A are constituted by a plurality of separate reflecting mirrors 2a and 3a whose reflection angles and positions can be individually adjusted. The separate reflecting mirrors 3a constituting the second reflecting mirror group 3A reflects the irradiating light of the wavelength band of visible-infrared ray, and transmits the light of the other wavelength band. The separate reflecting mirrors 2a constituting the first reflecting mirror group 2A reflects the irradiating light of the wavelength band of ultraviolet ray, and transmits the light of the other wavelength band. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an ultraviolet irradiation apparatus and an ultraviolet irradiation method, and more particularly, to an ultraviolet irradiation apparatus that uses a light source that emits visible light and infrared light together with ultraviolet light and simultaneously irradiates light of other wavelengths together with ultraviolet light, and the apparatus. The present invention relates to an ultraviolet irradiation method.

  A mercury discharge lamp or the like widely used as a light source of an ultraviolet irradiation device emits not only ultraviolet rays but also visible light and infrared rays. In many ultraviolet irradiation apparatuses, it is considered that infrared rays do not reach the light irradiation object as unnecessary or harmful (see, for example, Patent Documents 1 and 2). The one described in Patent Document 1 uses only two reflecting mirrors: a reflecting mirror that reflects ultraviolet light and transmits infrared light, and a reflecting mirror that reflects visible light and transmits infrared light, and only ultraviolet light and visible light are light. It reaches the irradiation object. Moreover, in what was described in patent document 2, infrared rays do not reach | attain a light irradiation target object using a cold reflecting mirror and a cold filter.

  On the other hand, an apparatus that actively uses infrared rays together with ultraviolet rays has also been proposed (see, for example, Patent Document 3). FIG. 13 is a cross-sectional view of the ultraviolet irradiation device disclosed in Patent Document 3. As shown in FIG. A wafer 51 having a photoresist 50 coated on its surface is supported by a thermal ballast 52 as a support plate. The lamp system 55 emits ultraviolet rays for curing and infrared rays for heating. When irradiation is completed, the wafer 51 is separated from the thermal ballast 52, the thermal ballast 52 is lowered by the pins 53, and is brought into contact with the heat sink 54. This ultraviolet irradiation method is used for the purpose of improving the heat resistance and plasma resistance of a photoresist film after development. By using the above ultraviolet irradiation device, a photoresist film having excellent heat resistance and deformation resistance can be obtained by short-time ultraviolet irradiation.

  In addition, in the treatment for improving the heat resistance and plasma resistance of the developed photoresist film, it is preferable to perform ultraviolet irradiation while gradually raising the substrate temperature (see, for example, Patent Document 4). FIG. 14 is a configuration diagram of an ultraviolet ray processing apparatus that is disclosed in Patent Document 4 and includes means for increasing the substrate heating temperature in stages. As shown in the figure, the ultraviolet processing apparatus disclosed in Patent Document 4 includes a processing chamber 40, a plurality of work stages WS1 to WS4 that have a mechanism for vacuum-adsorbing a substrate and that heat the substrate at different temperatures, Workpiece transport mechanism 35, carry-in gate 23, carry-out gate 24, lamps LP1 to LP3 arranged at positions corresponding to workstages WS1 to WS3, mirror MR reflecting the light of lamps LP1 to LP3, and substrate on workstages WS1 to WS3 A shutter 21 for blocking the lamp light so that the lamp radiated light does not enter the processing chamber 40 when it is not mounted, and a quartz window 22 for irradiating the radiated light from the lamps LP1 to LP3 into the processing chamber 40. Is done. The lamps LP1 to LP3 are, for example, high-pressure mercury lamps and emit light including ultraviolet light having a wavelength of 220 to 320 nm. The work stages WS1, WS2, WS3, and WS4 are heated to 100 ° C., 150 ° C., 200 ° C., and 100 ° C., respectively, and the work stage WS4 is a cooling stage. This ultraviolet processing apparatus is a large-area substrate processing apparatus, and the length of the substrate in the left-right direction on the paper surface is equal to the distance from the right end of the work stage WS1 to the left end of the work stage WS3. The work transport mechanism 35 can move in the horizontal direction of the drawing and can move up and down. The work transport mechanism 35 transports the substrate onto the work stages WS1 to WS4 in a raised state, and then descends to move the substrate to the work stage. Can be placed on top.

A substrate (not shown) on which the developed photoresist film is formed is carried into the processing chamber 40 via a loading gate 23 provided on the right side of the processing chamber 40. First, a part of the substrate (1/3 on the left side) is placed on the work stage WS1, vacuumed and heated. The rest of the substrate is in a state of protruding from the work stage. Next, the shutter 21 is opened, and the substrate portion on the work stage WS1 is irradiated with ultraviolet rays from the lamp LP1. After the substrate is processed for a predetermined time, the shutter 21 is closed, the vacuum suction is released, the substrate is further moved by the length of 1/3 of the substrate by the work transport mechanism 35, and the substrate installed on the work stage WS1. Is moved onto the work stage WS2. At this time, the unprocessed portion of the substrate (1/3 of the substrate) is placed on the work stage WS1. Next, the substrate is vacuum-sucked on the work stage, and the substrate is processed for a predetermined time in the same manner as described above. Thereafter, similarly, the substrate is processed while being intermittently moved by the work transfer mechanism 35. When the processing of the substrate is finished, the unloading gate 24 is opened and the substrate is unloaded from the processing chamber 40.
JP 2005-38627 A Japanese Patent Laid-Open No. 63-249853 Japanese Patent Publication No. 5-26189 Japanese Patent Laid-Open No. 2003-158057

The mercury discharge lamp used as the light source of the ultraviolet irradiation device has a fixed spectrum and cannot increase or decrease only the light intensity in a specific wavelength band. On the other hand, the amount of ultraviolet irradiation necessary for curing the resist is also determined, and the method disclosed in Patent Document 3 cannot control the amount of ultraviolet irradiation and the amount of infrared irradiation independently. Temperature control is difficult. In addition, since the apparatus disclosed in Patent Document 3 uses a reflector having a fixed structure, the irradiation amount of ultraviolet rays or infrared rays at a specific part of the light irradiation object may be insufficient or excessive. However, it was not possible to cope with it, and it was difficult to perform in-plane uniform exposure and temperature control.
Further, in the ultraviolet irradiation apparatus disclosed in Patent Document 4, since the set temperature is different for each work stage, the substrate processing temperature is the temperature between the work stages due to the heat conduction of the substrate itself at the boundary of the work stage. The difference becomes an intermediate temperature, and the substrate is not heated to the target temperature, which may cause the resist film to have the required resistance. In addition, since different temperatures are set for the work stages that heat the substrate, the substrate temperature cannot be changed continuously, and a sudden temperature change occurs at the moment when the substrate is placed on the work stage. For this reason, internal stress is generated in the substrate, and the substrate and the film formed on the substrate may be damaged due to a rapid temperature change.
An object of the present invention is to solve the above-described problems of the prior art, and the object of the present invention is to firstly adjust the light amounts of a plurality of wavelength bands so that each wavelength can be individually adjusted. The light amount of the band can be adjusted appropriately, and in particular, when temperature control of the irradiation target is necessary, it is possible to perform appropriate temperature control by controlling the irradiation amount of infrared rays. Secondly, by making it possible to locally adjust the amount of light applied to the light irradiation object, it is possible to achieve uniform exposure within the surface and temperature uniformity within the surface. is there. Thirdly, the resist film can be processed accurately by preventing a sudden temperature change from occurring in the substrate surface and adjusting each part of the substrate surface to a desired temperature. It is.

  To achieve the above object, according to the present invention, a light source that emits light including ultraviolet light, a first reflecting mirror that is disposed near the light source and reflects ultraviolet light, and a side away from the light source. A second reflecting mirror that reflects light having a wavelength longer than that of ultraviolet light, and at least one of the first reflecting mirror and the second reflecting mirror is directed to a light irradiation object of the reflected light. An ultraviolet irradiation device having a mechanism capable of independently adjusting the light intensity is provided.

  In order to achieve the above object, according to the present invention, a light source that emits light including ultraviolet light, a first reflecting mirror that is disposed closer to the light source and reflects ultraviolet light, and separated from the light source. And a second reflecting mirror that reflects light having a wavelength longer than that of ultraviolet light, and at least one of the first reflecting mirror and the second reflecting mirror is divided into a plurality of reflecting surfaces. And an ultraviolet irradiation device characterized in that the reflection angle or the position and the reflection angle of each reflection surface can be adjusted.

  In order to achieve the above object, according to the present invention, a light source that emits light including ultraviolet light, a first reflecting mirror that is disposed closer to the light source and reflects ultraviolet light, and separated from the light source. A second reflecting mirror that is disposed on the side and reflects light having a wavelength longer than that of ultraviolet rays, and the amount of light reflected from the second reflecting mirror between the first reflecting mirror and the second reflecting mirror. There is provided an ultraviolet irradiation device characterized by having means for adjusting the intensity.

  In order to achieve the above object, according to the present invention, a light source that emits light including ultraviolet light, a first reflecting mirror that is disposed closer to the light source and reflects ultraviolet light, and separated from the light source. A second reflecting mirror that is disposed on the side and reflects light having a wavelength longer than that of ultraviolet rays, between the first reflecting mirror and the light source, and between the first reflecting mirror and the second reflecting mirror. There is provided an ultraviolet irradiation device characterized by having means for adjusting the amount of light reflected from the first or second reflecting mirror between the reflecting mirrors.

  In order to achieve the above object, according to the present invention, a light source that emits light including ultraviolet light, a first reflecting mirror that is disposed closer to the light source and reflects ultraviolet light, and separated from the light source. A second reflecting mirror that is disposed on the side and reflects light having a wavelength longer than that of ultraviolet rays, and at least one of the first reflecting mirror and the second reflecting mirror has a curvature of a reflecting surface, or There is provided an ultraviolet irradiation device characterized by having means for adjusting the position of the reflecting surface and the curvature of the reflecting surface.

  In order to achieve the above object, according to the present invention, there is provided an ultraviolet irradiation method for a light irradiation object using any of the ultraviolet irradiation devices described above, wherein the temperature of the light irradiation object is set. There is provided an ultraviolet irradiation method characterized by monitoring and adjusting a reflected light intensity of a second reflecting mirror.

  In order to achieve the above object, according to the present invention, there is provided an ultraviolet irradiation method for a light irradiation object using any one of the ultraviolet irradiation apparatuses described above, wherein the light is applied to the light irradiation object. Prior to irradiation, the ultraviolet irradiation is characterized in that the light irradiation intensity in the region where the light irradiation object is placed is measured, and the reflected light intensity of the first or second reflecting mirror is adjusted in advance. A method is provided.

  In order to achieve the above object, according to the present invention, a light source that emits light including ultraviolet light, a first reflecting mirror that is disposed closer to the light source and reflects ultraviolet light, and separated from the light source. A lamp unit including a second reflecting mirror disposed on the side and reflecting light having a wavelength longer than ultraviolet light; a substrate processing chamber into which light emitted from the lamp unit is incident; In the ultraviolet irradiation apparatus having a workpiece transfer mechanism that transfers indoors, a temperature sensor that measures the temperature of the substrate, and an ultraviolet sensor that measures the ultraviolet irradiation intensity, the first reflecting mirror and the second reflecting mirror are provided. Is provided with a mechanism capable of independently and locally adjusting the intensity of the reflected light incident on the processing chamber of the substrate.

  In order to achieve the above object, according to the present invention, a light source that emits light including ultraviolet light, a first reflecting mirror that is disposed closer to the light source and reflects ultraviolet light, and separated from the light source. A lamp unit including a second reflecting mirror disposed on the side and reflecting light having a wavelength longer than ultraviolet light; a substrate processing chamber into which light emitted from the lamp unit is incident; In the ultraviolet irradiation apparatus having a workpiece transfer mechanism that transfers indoors, a temperature sensor that measures the temperature of the substrate, and an ultraviolet sensor that measures the ultraviolet irradiation intensity, the first reflecting mirror and the second reflecting mirror are provided. Is configured to be divided into a plurality of reflecting surfaces, and an ultraviolet irradiation device characterized in that the reflection angle or position and reflection angle of each reflecting surface can be adjusted.

  In order to achieve the above object, according to the present invention, there is provided an ultraviolet irradiation method using the ultraviolet irradiation apparatus described in paragraphs [0014] to [0015], wherein the ultraviolet irradiation from the lamp unit to the substrate surface is performed. A workpiece transfer mechanism in which the angles or angles and positions of the plurality of divided reflecting mirrors of the first reflecting mirror are adjusted in advance so that the profile becomes a predetermined profile, and a dummy substrate equivalent to the substrate is mounted Is moved at a predetermined speed, and the angle or angle and position of the divided reflecting mirror of the second reflecting mirror is adjusted in advance so that the substrate temperature becomes a predetermined temperature profile, and then the substrate is mounted. There is provided an ultraviolet irradiation method characterized in that a substrate is processed by moving a workpiece transfer mechanism at a predetermined speed.

  In order to achieve the above object, according to the present invention, there is provided an ultraviolet irradiation method using the ultraviolet irradiation apparatus described in paragraphs [0014] to [0015], wherein the ultraviolet irradiation from the lamp unit to the substrate surface is performed. A workpiece transfer mechanism in which the angles or angles and positions of the plurality of divided reflecting mirrors of the first reflecting mirror are adjusted in advance so that the profile becomes a predetermined profile, and a dummy substrate equivalent to the substrate is mounted Is moved at a variable speed (including the case of stopping), and the angle or the angle and the position of the divided reflector of the second reflector are previously set so that the substrate temperature becomes a predetermined temperature profile. An ultraviolet irradiation method characterized by adjusting and then processing the substrate by moving the workpiece transfer mechanism on which the substrate is mounted at the fluctuation speed, It is provided.

  In order to achieve the above object, according to the present invention, there is provided an ultraviolet irradiation method using the ultraviolet irradiation apparatus described in paragraphs [0014] to [0015]. The irradiation intensity or equivalent ultraviolet irradiation intensity is read by an ultraviolet sensor, and the angle or angle and position of the divided reflector of the first reflecting mirror is controlled in real time so as to be close to an irradiation profile to be set. The temperature is read by the temperature sensor, and the angle or the angle and position of the divided reflecting mirror of the second reflecting mirror is controlled in real time so as to approach the temperature profile to be set, and the workpiece transfer mechanism on which the substrate is mounted is moved. There is provided an ultraviolet irradiation method characterized in that a substrate is processed.

  In order to achieve the above object, according to the present invention, there is provided an ultraviolet irradiation method using the ultraviolet irradiation apparatus described in paragraphs [0014] to [0015], wherein the ultraviolet irradiation from the lamp unit to the substrate surface is performed. The angle or angle and position of each of the plurality of divided reflectors of the first reflector is adjusted in advance so that the profile becomes a predetermined profile, and the current substrate temperature is read by the temperature sensor, and the temperature to be set The substrate is processed while moving the work transfer mechanism on which the substrate is mounted by controlling the angle or angle and position of the divided reflecting mirror of the second reflecting mirror so as to approach the profile in real time. An ultraviolet irradiation method is provided.

According to the present invention, since it is possible to adjust the amount of irradiation in a necessary wavelength band for the light irradiation target, it is possible to irradiate a necessary and sufficient amount of light for each wavelength band. When irradiating with infrared rays, the temperature of the light irradiation target can be appropriately controlled by controlling the amount of infrared irradiation. In addition, when the reflecting mirror is divided so that the angle of each of the dividing reflecting mirrors can be controlled independently, it becomes possible to control the amount of local light irradiation, and light irradiation within the surface of the light irradiation object Variation in quantity can be suppressed.
In addition, according to the ultraviolet irradiation apparatus of the present invention, the substrate is continuously moved in a state in which ultraviolet and infrared rays are continuously irradiated, so that any part of the substrate reaches a necessary temperature for processing. Therefore, film processing can be performed with high quality. In addition, since the substrate heating temperature and the amount of ultraviolet irradiation can be changed arbitrarily and continuously, a rapid temperature change and a change in the amount of ultraviolet light can be suppressed, and damage to the substrate and the film structure can be avoided.

Next, embodiments of the present invention will be described in detail with reference to the drawings.
[First Embodiment]
FIG. 1 is a cross-sectional view schematically showing an ultraviolet irradiation apparatus according to the first embodiment of the present invention. As shown in FIG. 1, the lamp unit 30 includes a light source 1 that supplies irradiation light, a first reflecting mirror group 2A that reflects light emitted from the light source 1, and a second reflecting mirror group 3A. Is done. The light emitted from the lamp unit 30 is irradiated onto the light irradiation target 12 held on the mounting table 11.
The first reflecting mirror group 2A and the second reflecting mirror group 3A are each composed of a plurality of divided reflecting mirrors 2a and 3a whose reflection angles and positions can be individually adjusted. The divided reflecting mirror 3a constituting the second reflecting mirror group 3A reflects the irradiation light in the visible to infrared wavelength band among the radiated light of the light source 1, and transmits the light in the other wavelength bands. The divided reflecting mirror 2a constituting the first reflecting mirror group 2A reflects the irradiation light in the ultraviolet wavelength band among the radiated light of the light source 1, and transmits the light in the other wavelength bands.
In the state shown in FIG. 1, the first reflecting mirror group 2A and the second reflecting mirror group 3A are in positions of the split reflecting mirror 2a and the split reflecting mirror 3a so as to form a spheroid as a whole. The reflection angle is adjusted, and the light source 1 is installed so that the center thereof coincides with one focal position of the spheroid. In this state, ultraviolet rays 4 and infrared rays 5 are irradiated on the light irradiation target 12.

If it is determined that the infrared irradiation of the light irradiation target 12 has become excessive, as shown in FIG. 2, the vertical direction of the reflecting surface of the divided reflecting mirror 3a is from the light source 1 for the second reflecting mirror group 3A. The angles of some of the split reflectors are adjusted so as to be perpendicular to the incident light direction. In this way, by adjusting the angles of some of the divided mirrors of the second reflecting mirror group 3A so that the emission direction is out of or not reflected from the light irradiation target 12, the light irradiation target The irradiation light quantity in the visible to infrared wavelength band reaching 12 can be adjusted, and the temperature of the light irradiation target 12 can be controlled.
Further, when it is determined that the ultraviolet irradiation to the light irradiation target 12 is excessive, as shown in FIG. 2, the vertical direction of the reflecting surface of the divided reflecting mirror 2a is from the light source 1 in the first reflecting mirror group 2A. The angles of some of the split reflectors are adjusted so as to be perpendicular to the incident light direction. In this way, by adjusting the angles of some of the divided mirrors of the first reflecting mirror group 2A so that the emission direction deviates from or does not reflect the light irradiation target 12, the light irradiation target The irradiation light amount in the wavelength band of ultraviolet rays reaching 12 can also be adjusted.
In the present embodiment, both the first reflecting mirror group 2A and the second reflecting mirror group 3A are divided reflecting mirrors. Instead, only one of them is a reflecting mirror group made up of divided reflecting mirrors. The other may be a single spheroid reflector. When the first reflecting mirror group 2A is a single reflecting mirror, the reflecting mirror must transmit light in the visible to infrared wavelength band.

[Second Embodiment]
FIG. 3 is a cross-sectional view schematically showing an ultraviolet irradiation apparatus according to the second embodiment of the present invention. As shown in FIG. 3, the lamp unit 30 includes a light source 1, a reflecting mirror 2 that reflects light emitted from the light source 1, and a reflecting mirror 3. The light emitted from the lamp unit 30 is irradiated onto the light irradiation target 12 held on the mounting table 11. Here, the reflecting mirror 2 and the reflecting mirror 3 have a spheroid shape, and the light source 1 is installed at one focal position thereof. The reflecting mirror 2 reflects ultraviolet rays and transmits light in the visible to infrared wavelength band. On the other hand, the reflecting mirror 2 reflects light in the visible to infrared wavelength band.
Between the reflecting mirror 2 and the reflecting mirror 3, a blind 6 that absorbs the radiated light from the light source 1 is disposed. The blind 6 can be rotated, and by adjusting the rotation angle, the irradiation light from the light source 1 toward the reflection mirror 3 and the reflection light from the reflection mirror 3 toward the light irradiation target 12 are absorbed and blocked, thereby being reflected by the reflection mirror 3. The amount of light applied to the light irradiation target 12 in the visible to infrared wavelength band can be adjusted.
In this embodiment, the infrared irradiation intensity is adjusted by the blind 6, but instead of this method, two slit plates provided with slit rows are combined to adjust the position of the two slit plates. By adjusting the aperture ratio, it is also possible to adjust the amount of light applied to the light irradiation target 12 in the visible to infrared wavelength band reflected by the reflecting mirror 3.

[Third Embodiment]
FIG. 4 is a cross-sectional view schematically showing an ultraviolet irradiation apparatus according to the third embodiment of the present invention. 4, parts that are the same as the parts of the second embodiment shown in FIG. 3 are given the same reference numerals, and redundant descriptions are omitted. In the present embodiment, a blind 7 is arranged between the light source 1 and the reflecting mirror 2 to block the ultraviolet rays and transmit the light in the visible to infrared wavelength band, as compared with the second embodiment. The blind 7 is rotatable, and the ultraviolet light reflected by the reflecting mirror 2 by blocking the radiated light from the light source 1 toward the reflecting mirror 2 and the reflected light from the reflecting mirror 3 toward the light irradiation target 12 by adjusting the rotation angle. The amount of light applied to the light irradiation target 12 can be adjusted.
According to the present embodiment, by appropriately setting the angles of the blinds 6 and the blinds 7, it is possible to appropriately set the irradiation intensity of the ultraviolet light and the light in the visible to infrared wavelength band to the light irradiation target 12. it can.
In the present embodiment, the blind 6 and the blind 7 are provided, but it can be changed so that only the blind 7 is installed.

[Fourth Embodiment]
FIG. 5 is a cross-sectional view schematically showing an ultraviolet irradiation apparatus according to the fourth embodiment of the present invention. As shown in FIG. 3, the lamp unit 30 includes a light source 1, a reflecting mirror 2 that reflects light emitted from the light source 1, and a reflecting mirror 3. The light emitted from the lamp unit 30 is irradiated onto the light irradiation target 12 held on the mounting table 11.
The reflecting mirror 2 and the reflecting mirror 3 have a substantially spheroid shape, and the light source 1 is installed at their approximate focal position. The reflecting mirrors 2 and 3 are made of a flexible material, and each is provided with means for changing its curvature. That is, the reflecting mirror 3 is configured to be movable by the actuator 8 at a plurality of locations, and the curvature of the reflecting mirror 3 can be changed by operating the actuator 8. Further, one end of a wire 9 pulled by the puller 10 is connected to the reflecting mirror 2, and the curvature of the reflecting mirror 2 can be changed by pulling the wire 9.
In the state shown in the figure, when it becomes necessary to suppress the irradiation of infrared rays, the actuator 8 is operated to increase the curvature of the reflecting mirror 3 to weaken the irradiation light to the light irradiation target 12. Moreover, when it becomes necessary to reduce the irradiation intensity of ultraviolet rays, the wire pulling by the puller 10 is loosened to increase the curvature of the reflecting mirror 2. Thereby, the irradiation intensity | strength of the ultraviolet-ray to the light irradiation object 12 is weakened.
In the present embodiment, the curvatures of both the reflecting mirrors 2 and 3 can be changed. However, only one of them may be changed. Alternatively, instead of changing the curvature, either one of the reflecting mirrors or both may be moved in the left-right direction in the figure, and the irradiation intensity of the reflected light to the light irradiation target may be adjusted.

In the above embodiment, the reflecting mirror reflects the ultraviolet wavelength band and the visible to infrared wavelength band, but the wavelength band of the reflected light of each reflecting mirror can be appropriately changed. . For example, one reflecting mirror may reflect the wavelength band of ultraviolet to visible light, and the other reflecting mirror may reflect the wavelength band of infrared.
Further, in each of the above embodiments, two reflecting mirror groups or two reflecting mirrors are used. However, the present invention is not limited to this, and by installing three or more, three or more wavelengths are provided. You may make it adjust a light quantity and irradiation light distribution about a zone | band.
Further, the shape of the reflecting mirror may be a rotary parabolic mirror, a spherical mirror, a combination of a plurality of plane mirrors, or the like, instead of the spheroid shape in the above embodiment. Further, a fluorescent lamp type linear light source may be used as the light source. In this case, a reflecting mirror having an ellipsoidal shape, a parabolic shape, or a circular shape is used.

  Next, Embodiment 1 of the present invention will be described with reference to FIG. As shown in FIG. 6, actuators 13 to 14 are attached to the divided reflecting mirror 2a and the divided reflecting mirror 3a, respectively, so that they can rotate and move independently. Before the light irradiation target 12 is placed on the mounting table 11, the spectral characteristics and light amount distribution of the lamp unit 30 irradiated on the light irradiation target 12 are obtained in advance by the spectral sensor 15 and the spectral intensity / light amount distribution reading device 16. Next, based on the irradiation intensity of the ultraviolet wavelength band reflected by the first reflecting mirror group 2A and the irradiation intensity of the visible to infrared wavelength band reflected by the second reflecting mirror group 3A, in each wavelength band The actuator 13 & 14 operation control device 17 adjusts the actuator 13 to the actuator 14 attached to each of the split reflecting mirrors 2a or 3a so that the required irradiation intensity is obtained and the light quantity is uniform within the surface of the light irradiation target. By controlling, the angles of the split reflecting mirrors 2a and 3a are adjusted independently. After completion of this preliminary adjustment, the light irradiation target 12 is set on the mounting table 11, and light irradiation on the light irradiation target 12 is started.

  Then, in order to control the temperature of the light irradiation target 12, the surface temperature of the light irradiation target 12 is measured by the radiation thermometer 18 and the temperature distribution reader 19. When it is necessary to change the amount of infrared irradiation, the actuator 14 operation control device 20 controls the actuator 14 attached to each divided reflecting mirror 3a of the second reflecting mirror group 3A to change the angle of the divided reflecting mirror 3a. Adjust independently and control the temperature. In this case, the function of the actuator 13 & 14 operation control device 17 is not used.

[Fifth Embodiment]
FIG. 7 is a cross-sectional view schematically showing an ultraviolet irradiation apparatus according to the fifth embodiment of the present invention. As shown in FIG. 7, the ultraviolet irradiation device according to the present embodiment includes a light source 1, a first reflecting mirror group 2A including a plurality of split reflecting mirrors 2a, and a plurality of split reflecting mirrors 3a. A lamp unit 30 including the second reflecting mirror group 3A, a shutter 21 that blocks radiation emitted from the lamp unit 30, a quartz window 22 that transmits light emitted from the lamp unit, and a substrate carry-in gate 23 and a carry-out gate A processing chamber 40 provided with a part of the outer wall 24 and a substrate 26 carried into the processing chamber 40 are placed, and are driven at a speed controlled by a drive control device (not shown) in the horizontal direction in the figure. The workpiece transport mechanism 25, the temperature sensor 27 for measuring the temperature of the substrate placed on the workpiece transport mechanism 25, and the irradiation intensity of the ultraviolet rays that will be irradiated on the substrate in a state where the substrate is removed. Measure The first reflecting mirror that controls the position and angle of the split reflecting mirror 2a of the first reflecting mirror group 2A by reading the signal from the ultraviolet sensor 28 so that the substrate 26 is irradiated with ultraviolet rays with a predetermined profile. Second reflector control for reading the signal of the temperature sensor 27 and controlling the position and angle of the divided reflector 3a of the second reflector group 3A so that the temperature of the control unit 31 and the substrate 26 becomes a predetermined profile. And a unit 32. Note that the light source 1 of the lamp unit 30 is a lamp having a shape that is long in the direction perpendicular to the paper surface (that is, a fluorescent lamp shape), and the first reflecting mirror group 2A and the second reflecting mirror group 3A as a whole are roughly shaped like a coconut box. It has the shape of However, the curvature of the portion near the carry-in gate 23 of the second reflecting mirror group 3A is larger than that of the other portions. This is a consideration to moderate the temperature rise of the substrate in the initial stage.

Next, the operation of the ultraviolet irradiation device of the present embodiment will be described. Prior to processing the substrate, the angles and positions of the divided reflectors of the first reflector group 2A and the divided reflectors of the second reflector group 3A are adjusted in advance. For ultraviolet rays, the shutter 21 is opened with the substrate not mounted on the workpiece transfer mechanism 25, the workpiece transfer mechanism 25 is moved, the ultraviolet ray irradiation intensity is measured by the ultraviolet sensor 28, and the ultraviolet ray irradiation intensity is a predetermined profile. The split reflector 2a of the first reflector group 2A is adjusted by the first reflector control unit 31 so that For infrared rays, the same dummy substrate as the substrate is placed on the workpiece transfer mechanism 25, the workpiece transfer mechanism 25 is moved at a predetermined speed, the substrate temperature is measured by the temperature sensor 27, and the temperature change of the substrate (on the time axis) The angle and position of the split reflecting mirror 3a of the second reflecting mirror group 3A are adjusted by the second reflecting mirror control unit 32 so that the temperature profile in FIG. For example, the split reflecting mirror is adjusted so that the temperature of the substrate is gradually increased and then maintained at a constant temperature. An example of an irradiation intensity profile obtained by the adjusted reflector group is shown in FIG. 8A to 8C, the right side of the horizontal axis shows a position near the carry-in gate 23, and the left side shows a position near the carry-out gate 24.
After adjusting the reflecting mirror groups 2 </ b> A and 3 </ b> A, the substrate 26 is carried from the carry-in gate 23 and placed on the work carrying mechanism 25. Then, the workpiece transfer mechanism 25 is moved at a predetermined speed by the drive control device (not shown) with the shutter 21 opened. Thereby, each part of the substrate is irradiated with ultraviolet rays and infrared rays having a desired irradiation intensity profile, and the substrate is processed. After the processing is completed, the substrate 26 is removed from the work transport mechanism 25 and is transported out of the processing chamber via the transport gate 24.

The above is a method of performing substrate processing by moving the workpiece transfer mechanism 25 at a constant speed. Next, a method of performing substrate processing while changing the moving speed of the workpiece transfer mechanism 25 will be described. Prior to substrate processing, the angles and positions of the divided reflectors of the first reflector group 2A and the divided reflectors of the second reflector group 3A are adjusted in advance. For ultraviolet rays, the shutter 21 is opened with the substrate not mounted on the workpiece transfer mechanism 25, the workpiece transfer mechanism 25 is moved, the ultraviolet ray irradiation intensity is measured by the ultraviolet sensor 28, and the ultraviolet ray irradiation intensity is a predetermined profile. The split reflector 2a of the first reflector group 2A is adjusted by the first reflector control unit 31 so that For infrared rays, the same dummy substrate as the substrate is placed on the workpiece transfer mechanism 25, and the workpiece transfer mechanism 25 is moved while changing the speed (may be temporarily stopped), and the temperature sensor 27 is used to adjust the substrate temperature. The angle and position of the divided reflecting mirror 3a of the second reflecting mirror group 3A are measured by the second reflecting mirror control unit 32 so that the temperature change of the substrate (temperature profile on the time axis) becomes a predetermined profile. adjust.
After the adjustment of the reflecting mirror groups 2A and 3A, similarly to the above description, the same fluctuation as the moving speed when the original substrate is placed on the work transport mechanism 25 instead of the dummy substrate and the dummy substrate is moved. The substrate is processed by moving at a speed. If this method is applied, it becomes possible to maintain a constant total amount of ultraviolet irradiation even when the irradiation intensity deteriorates due to the elapsed use time of the light source lamp.
In the present embodiment, the angle and position of the split reflector are adjusted to adjust the reflector group, but only the angle may be adjusted.

[Sixth Embodiment]
FIG. 9 is a cross-sectional view schematically showing an ultraviolet irradiation apparatus according to the sixth embodiment of the present invention. The fifth embodiment is different from the fifth embodiment shown in FIG. 7 in that a plurality of temperature sensors 27 and ultraviolet sensors 28 are installed in the work transport mechanism 25. Other than that, there is no difference from the fifth embodiment. In the previous fifth embodiment, since there is one temperature sensor 27 and one ultraviolet sensor 28, it was not possible to appropriately control different points in the substrate surface. Accordingly, since temperature detection and ultraviolet irradiation intensity measurement can be performed at a plurality of points in the substrate surface, appropriate control can be performed for each point, and control with higher accuracy is possible.
Although the first and second reflecting mirror control units are not displayed in FIG. 9, these control units are equipped as in the case of the fifth embodiment shown in FIG. . The same applies to the following embodiments.

[Seventh Embodiment]
FIG. 10 is a cross-sectional view schematically showing an ultraviolet irradiation apparatus according to the seventh embodiment of the present invention. As shown in FIG. 10, in this embodiment, no sensor is installed in the workpiece transfer mechanism 25, and a plurality of radiation thermometers 18 and ultraviolet sensors 28 are installed on the bottom surface of the processing chamber 40. ing. Other than that, there is no difference from the fifth and sixth embodiments. In the ultraviolet irradiation apparatus of the present embodiment, it is possible to measure the irradiation intensity of ultraviolet rays to a region other than on the substrate during the ultraviolet irradiation treatment process on the substrate. That is, the length of the light source 1 and the first reflecting mirror group 2A in the vertical direction of the paper surface is longer than the length of the substrate 26 in the vertical direction of the paper surface, and the ultraviolet sensors 28 are arranged in a matrix. An ultraviolet sensor is also installed in a region other than the traveling region of the substrate in the direction.

Next, the operation of the ultraviolet irradiation device of the present embodiment will be described. In the present embodiment, the first and second reflecting mirror groups are adjusted while measuring the ultraviolet irradiation intensity and the substrate temperature. Here, in the present embodiment, control is performed so that the ultraviolet irradiation intensity is always equal in the direction perpendicular to the paper surface.
First, the substrate 26 is carried from the carry-in gate 23 and placed on the work conveyance mechanism 25. Subsequently, the shutter 21 is opened, and the work transport mechanism 25 is moved at a predetermined speed. Initially, the left portion of the substrate 26 enters the infrared region. Thereby, the temperature of the infrared irradiation part of a board | substrate rises. When this temperature is measured by the radiation thermometer 18 and this temperature is out of the predetermined temperature, the split reflection of the second reflecting mirror group 3A is performed via a second reflecting mirror control unit (not shown). The angle (or angle and position) of the mirror 3a is adjusted. When the work transport mechanism 25 further moves, the left portion of the substrate enters the ultraviolet region. At this time, the irradiation intensity of the ultraviolet rays received by the substrate is substituted by the measurement value of the ultraviolet sensor 28 that is outside the substrate and receives ultraviolet rays having the same intensity as the irradiation intensity on the substrate. The measured value of the ultraviolet sensor 28 is input to a first reflecting mirror control unit (not shown), and it is verified whether it is a predetermined value. If it is a predetermined value, it remains as it is, but if it is deviated from the predetermined value, the corresponding portion of the divided reflecting mirror 2a of the first reflecting mirror group 2A passes through the first reflecting mirror control unit. Adjust the angle (or angle and position). At this time, the substrate temperature simultaneously measured by the radiation thermometer 18 is input to the second reflecting mirror control unit, where it is verified whether it is a predetermined value. The divisional reflecting mirrors 3a of the corresponding portions of the second reflecting mirror group 3A are adjusted via the two reflecting mirror control units. Thereafter, in the same manner, the ultraviolet irradiation intensity and the substrate temperature at a plurality of locations are measured while moving the substrate, and the substrate processing is performed while adjusting each of the divided reflecting mirrors so that they have predetermined values. After the processing is completed, the substrate 26 is removed from the work transport mechanism 25 and is transported out of the processing chamber 40 via the transport gate 24.
The movement of the work transport mechanism 25 may be a constant speed or may be moved intermittently. Further, in the above method, the first and second reflecting mirror groups 2A and 3A are adjusted while performing the substrate processing. However, for the first reflecting mirror group 2A, a predetermined ultraviolet irradiation intensity profile is set in advance. It may be adjusted so that only the substrate temperature is controlled in real time. Further, using the ultraviolet irradiation device of the present embodiment, the first and second reflecting mirror groups 2A and 3A are adjusted in advance in the same manner as in the method of the fifth embodiment. Substrate processing may be performed under conditions.

[Eighth Embodiment]
FIG. 11 is a cross-sectional view schematically showing an ultraviolet irradiation apparatus according to the eighth embodiment of the present invention. As shown in FIG. 11, in the present embodiment, no ultraviolet sensor is installed inside the processing chamber 40, and an ultraviolet sensor 28 is formed on the outer surface of the quartz window 22. A plurality of temperature sensors 27 are installed in the workpiece transfer mechanism 25. Other than that, there is no difference from the other embodiments.

Next, the operation of the ultraviolet irradiation device of the present embodiment will be described. In the present embodiment, the first and second reflecting mirror groups are adjusted while measuring the ultraviolet irradiation intensity and the substrate temperature.
First, the substrate 26 is carried from the carry-in gate 23 and placed on the work conveyance mechanism 25. Subsequently, the shutter 21 is opened, and the work transport mechanism 25 is moved at a predetermined speed. Initially, the left portion of the substrate 26 enters the infrared region. The substrate temperature of the infrared irradiation unit is measured by the temperature sensor 27 and transmitted to a second reflecting mirror control unit (not shown). Then, it is verified whether or not the temperature is a predetermined value. If the temperature is deviated, the angle (or angle and position) of the divided reflecting mirror 3a corresponding to the second reflecting mirror group 3A is adjusted. When the work transport mechanism 25 further moves, the left portion of the substrate enters the ultraviolet region. The intensity of ultraviolet rays applied to the substrate is measured by the ultraviolet sensor 28, and the measured value is transmitted to a first reflecting mirror control unit (not shown). Then, it is verified whether the value is a predetermined value. If the value is deviated from the predetermined value, the divided reflecting mirror of the corresponding part of the first reflecting mirror group 2A is passed through the first reflecting mirror control unit. The angle (or angle and position) of 2a is adjusted. At this time, the substrate temperature measured by the temperature sensor 27 at the same time is input to the second reflecting mirror control unit, where it is verified whether it is a predetermined value. The divided reflecting mirrors 3a of the corresponding portions of the second reflecting mirror group 3A are adjusted via the reflecting mirror control unit. Thereafter, in the same manner, the ultraviolet irradiation intensity and the substrate temperature at a plurality of locations are measured while moving the substrate, and the substrate processing is performed while adjusting each of the divided reflecting mirrors so that they have predetermined values. After the processing is completed, the substrate 26 is removed from the work transport mechanism 25 and is transported out of the processing chamber 40 via the transport gate 24.
The movement of the work transport mechanism 25 may be a constant speed or may be moved intermittently. Further, in the above method, the first and second reflecting mirror groups 2A and 3A are adjusted while performing the substrate processing. However, for the first reflecting mirror group 2A, a predetermined ultraviolet irradiation intensity profile is set in advance. It may be adjusted so that only the substrate temperature is controlled in real time. Further, using the ultraviolet irradiation device of the present embodiment, the first and second reflecting mirror groups 2A and 3A are adjusted in advance in the same manner as in the method of the fifth embodiment. Substrate processing may be performed under conditions.

[Ninth Embodiment]
FIG. 12 is a cross-sectional view schematically showing an ultraviolet irradiation device according to the ninth embodiment of the present invention. The ultraviolet irradiation device of the present embodiment is obtained by adding a heating unit 33 and a cooling unit 34 to the ultraviolet irradiation device of the fifth embodiment shown in FIG. The heating unit 33 and the cooling unit 34 are connected to a blower, and a plurality of air outlets are opened below.

  The operation method is the same as in the case of the fifth embodiment. The substrate 26 is carried into the processing chamber 40 via the carry-in gate 23 and is placed on the work conveyance mechanism 25. The substrate 26 passes directly under the heating unit 33 before moving under the lamp unit 30 at a predetermined speed by the work transport mechanism 25. Since heated air is blown onto the substrate 26 from the heating unit 33, the substrate temperature rises to a certain temperature before light irradiation by the lamp. Thereafter, it passes under the lamp unit 30 in the same manner as in the fifth embodiment. When the substrate that has passed under the lamp unit 30 then passes directly under the cooling unit 34, cooling air is blown to cool the substrate to near room temperature.

Instead of the method of blowing heating air or cooling air to the substrate while moving the substrate as described above, the substrate is placed directly under the heating unit 33 or directly under the cooling unit 34 before and after the step of performing the substrate processing under the lamp unit 30. You may make it stop for a fixed time and to perform a heat processing and a cooling process. Alternatively, the substrate may be stopped immediately below the heating unit 33 or the cooling unit 34, and heated or cooled while monitoring the substrate temperature to move the substrate when a predetermined temperature is reached. Further, instead of the air blowing method, the heating unit itself and the cooling unit itself may perform heating and cooling as a high-temperature object and a low-temperature object by heat conduction or heat radiation. Further, only one of the heating unit and the cooling unit may be provided, and only one of heating before light irradiation or cooling after light irradiation may be performed.
You may make it add a heating unit and a cooling unit to the ultraviolet irradiation device of 6th thru | or 8th Embodiment.

1 is a cross-sectional view showing a schematic configuration of a first embodiment of the present invention. Sectional drawing for demonstrating operation | movement of the 1st Embodiment of this invention. Sectional drawing which shows the schematic structure of the 2nd Embodiment of this invention. Sectional drawing which shows the schematic structure of the 3rd Embodiment of this invention. Sectional drawing which shows the schematic structure of the 4th Embodiment of this invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. Sectional drawing which shows the structure of the outline of the 5th Embodiment of this invention. Example of irradiation intensity profile of ultraviolet and infrared rays. Sectional drawing which shows the schematic structure of the 6th Embodiment of this invention. Sectional drawing which shows the schematic structure of the 7th Embodiment of this invention. Sectional drawing which shows the schematic structure of the 8th Embodiment of this invention. Sectional drawing which shows the structure of the outline of the 9th Embodiment of this invention. Sectional drawing of a prior art example. The block diagram of another prior art example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Light source 2, 3 Reflective mirror 2A 1st reflective mirror group 3A 2nd reflective mirror group 2a, 3a Division | segmentation reflective mirror 4 Ultraviolet rays 5 Infrared rays 6, 7 Blinds 8, 13, 14 Actuator 9 Wire 10 Puller 11 Mounting stand 12 Light irradiation object 15 Spectral sensor 16 Spectral intensity / light quantity distribution reader 17 Actuator 13 & 14 operation control device 18 Radiation thermometer 19 Temperature distribution reader 20 Actuator 14 operation control device 21 Shutter 22 Quartz window 23 Carry-in gate 24 Carry-out gate 25, 35 Workpiece Transport mechanism 26 Substrate 27 Temperature sensor 28 Ultraviolet sensor 30 Lamp unit 31 First reflecting mirror control unit 32 Second reflecting mirror control unit 33 Heating unit 34 Cooling unit 40 Processing chamber MR Mirrors WS1 to WS4 Work stage

Claims (23)

A light source that emits light including ultraviolet light, a first reflecting mirror that is disposed closer to the light source and that reflects ultraviolet light, and a first light reflector that is disposed on the side away from the light source and reflects light having a longer wavelength than ultraviolet light. A mechanism in which at least one of the first reflecting mirror and the second reflecting mirror can independently adjust the light intensity of the reflected light to the light irradiation target. An ultraviolet irradiation device comprising: The ultraviolet irradiation apparatus according to claim 1, wherein the mechanism capable of independently adjusting the light intensity is capable of adjusting a local light intensity on the light irradiation object. A light source that emits light including ultraviolet light, a first reflecting mirror that is disposed closer to the light source and that reflects ultraviolet light, and a first light reflector that is disposed on the side away from the light source and reflects light having a longer wavelength than ultraviolet light. And at least one of the first reflecting mirror and the second reflecting mirror is divided into a plurality of reflecting surfaces, and the reflection angle or position of each reflecting surface and An ultraviolet irradiation device characterized in that the reflection angle can be adjusted. A light source that emits light including ultraviolet light, a first reflecting mirror that is disposed closer to the light source and that reflects ultraviolet light, and a first light reflector that is disposed on the side away from the light source and reflects light having a longer wavelength than ultraviolet light. 2. An ultraviolet irradiation apparatus comprising: two reflecting mirrors, and means for adjusting the amount of light reflected from the second reflecting mirror between the first reflecting mirror and the second reflecting mirror. A light source that emits light including ultraviolet light, a first reflecting mirror that is disposed closer to the light source and that reflects ultraviolet light, and a first light reflector that is disposed on the side away from the light source and reflects light having a longer wavelength than ultraviolet light. Two reflecting mirrors, and the first or second reflecting mirror between the first reflecting mirror and the light source and between the first reflecting mirror and the second reflecting mirror, respectively. An ultraviolet irradiation device comprising means for adjusting the amount of light reflected from the device. The means for adjusting the amount of light reflected from the reflecting mirror is a member having a function of absorbing light of a specific wavelength band or a member having a function of transmitting only light of a specific wavelength band. The ultraviolet irradiation device according to claim 4 or 5. A light source that emits light including ultraviolet light, a first reflecting mirror that is disposed closer to the light source and that reflects ultraviolet light, and a first light reflector that is disposed on the side away from the light source and reflects light having a longer wavelength than ultraviolet light. And at least one of the first reflecting mirror and the second reflecting mirror has means for adjusting the curvature of the reflecting surface, or the position of the reflecting surface and the curvature of the reflecting surface. Ultraviolet irradiation device characterized by. A method of irradiating a light irradiation object using the ultraviolet irradiation device according to claim 1, wherein the temperature of the light irradiation object is monitored, and the reflected light of the second reflecting mirror An ultraviolet irradiation method characterized by adjusting intensity. An ultraviolet irradiation method for a light irradiation object using the ultraviolet irradiation device according to claim 1, wherein the light irradiation object is placed prior to the light irradiation to the light irradiation object. An ultraviolet irradiation method characterized by measuring the light irradiation intensity in a region to be measured and adjusting in advance the reflected light intensity of the first or second reflecting mirror. 10. The ultraviolet irradiation method according to claim 8, wherein the adjustment of the reflected light intensity is performed locally on the light irradiation surface. A light source that emits light including ultraviolet light, a first reflecting mirror that is disposed closer to the light source and that reflects ultraviolet light, and a first light reflector that is disposed on the side away from the light source and reflects light having a longer wavelength than ultraviolet light. A lamp unit having two reflecting mirrors, a substrate processing chamber into which light emitted from the lamp unit is incident, a workpiece transfer mechanism for transferring the substrate in the substrate processing chamber, and measuring the temperature of the substrate In the ultraviolet irradiation apparatus having a temperature sensor and an ultraviolet sensor for measuring the ultraviolet irradiation intensity, the first reflecting mirror and the second reflecting mirror are configured to transmit the reflected light to the processing chamber of the substrate. An ultraviolet irradiation device having a mechanism capable of independently adjusting the intensity locally. A light source that emits light including ultraviolet light, a first reflecting mirror that is disposed closer to the light source and that reflects ultraviolet light, and a first light reflector that is disposed on the side away from the light source and reflects light having a longer wavelength than ultraviolet light. A lamp unit having two reflecting mirrors, a substrate processing chamber into which light emitted from the lamp unit is incident, a workpiece transfer mechanism for transferring the substrate in the substrate processing chamber, and measuring the temperature of the substrate In the ultraviolet irradiation apparatus having a temperature sensor and an ultraviolet sensor for measuring the ultraviolet irradiation intensity, the first reflecting mirror and the second reflecting mirror are divided into a plurality of reflecting surfaces, and each reflecting An ultraviolet irradiation device characterized in that a reflection angle of a surface, or a position and a reflection angle can be adjusted. The ultraviolet irradiation apparatus according to claim 11 or 12, wherein the work transfer mechanism is provided with a transfer control device that controls a moving speed thereof. The ultraviolet irradiation apparatus according to claim 11, wherein a shutter that blocks light is installed between the lamp unit and the substrate processing chamber. The ultraviolet irradiation device according to claim 11, wherein a plurality of the temperature sensors and the ultraviolet sensors are arranged on the workpiece transfer mechanism. 15. The ultraviolet irradiation apparatus according to claim 11, wherein a plurality of the temperature sensors and the ultraviolet sensors are fixedly arranged in the substrate processing chamber. A plurality of the temperature sensors are arranged on the workpiece transfer mechanism, and a plurality of the ultraviolet sensors are fixedly arranged in the substrate processing chamber, or a portion of the substrate processing chamber facing the lamp unit. The ultraviolet irradiation device according to claim 11, wherein a plurality of the ultraviolet irradiation devices are fixedly arranged on the installed transparent window. The heating unit is provided on the front side of the region where the light emitted from the lamp unit of the substrate processing chamber is incident, and the cooling unit is provided on the rear side thereof. The ultraviolet irradiation device described. 19. An ultraviolet irradiation method using the ultraviolet irradiation device according to claim 12, wherein the first reflecting mirror is divided so that an ultraviolet irradiation profile from the lamp unit to the substrate surface becomes a predetermined profile. The angle or angle and position of each of the plurality of reflecting mirrors are adjusted in advance, and the substrate transfer temperature is changed to a predetermined temperature profile by moving a workpiece transfer mechanism on which a dummy substrate equivalent to the substrate is mounted at a predetermined speed. The angle or angle and position of the divided reflecting mirrors of the second reflecting mirror are adjusted in advance so that the substrate is processed by moving the work transfer mechanism on which the substrate is mounted at the predetermined speed. The ultraviolet irradiation method characterized by the above-mentioned. 19. An ultraviolet irradiation method using the ultraviolet irradiation device according to claim 12, wherein the first reflecting mirror is divided so that an ultraviolet irradiation profile from the lamp unit to the substrate surface becomes a predetermined profile. The angle or angle and position of each of the reflected mirrors is adjusted in advance, and the workpiece transfer mechanism on which a dummy substrate equivalent to the substrate is mounted is moved at a variable speed (including when it stops). Then, the angle or the angle and the position of the divided reflecting mirror of the second reflecting mirror are adjusted in advance so that the substrate temperature has a predetermined temperature profile, and then the workpiece transfer mechanism on which the substrate is mounted is An ultraviolet irradiation method characterized in that the substrate is processed by moving at a varying speed. An ultraviolet irradiation method using the ultraviolet irradiation device according to claim 12, wherein the ultraviolet irradiation intensity currently irradiated on the substrate or an equivalent ultraviolet irradiation intensity is read by an ultraviolet sensor and set. The angle or angle and position of the divided reflector of the first reflector is controlled in real time so as to be close to the desired irradiation profile, the current substrate temperature is read by the temperature sensor, and the first reflecting mirror is brought close to the desired temperature profile. An ultraviolet irradiation method characterized in that the substrate is processed by controlling the angle or angle and position of the divided reflecting mirrors of the two reflecting mirrors in real time. 19. An ultraviolet irradiation method using the ultraviolet irradiation device according to claim 12, wherein the first reflecting mirror is divided so that an ultraviolet irradiation profile from the lamp unit to the substrate surface becomes a predetermined profile. The angle or angle and position of each of the plurality of reflecting mirrors are adjusted in advance, and the current substrate temperature is read by the temperature sensor, and the reflecting mirrors divided by the second reflecting mirror are brought close to the temperature profile to be set. An ultraviolet irradiation method characterized in that the substrate is processed while moving the workpiece transfer mechanism on which the substrate is mounted by controlling the angle or angle and position of the substrate in real time. Either or both of the step of heating the substrate before irradiating the substrate with the emitted light from the lamp unit and the step of cooling the substrate after the irradiation of the emitted light from the lamp unit is completed on the substrate are added. The ultraviolet irradiation method according to claim 19, wherein the ultraviolet irradiation method is performed.

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