JP2008284626A - Micro-flow channel device - Google Patents

Micro-flow channel device Download PDF

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JP2008284626A
JP2008284626A JP2007130005A JP2007130005A JP2008284626A JP 2008284626 A JP2008284626 A JP 2008284626A JP 2007130005 A JP2007130005 A JP 2007130005A JP 2007130005 A JP2007130005 A JP 2007130005A JP 2008284626 A JP2008284626 A JP 2008284626A
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microchannel
substrate
flow channel
microchannel device
lid plate
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JP2008284626A5 (en
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Nobuyuki Kasama
宣行 笠間
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Miraial Co Ltd
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Miraial Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a micro-flow channel device with excellent heat resistance and chemical resistance, manufacturable with an inexpensively manufactured plastic substrate at low costs by a simple process. <P>SOLUTION: In this micro flow channel device, a lid plate 3 closing the open surface of a micro flow channel 2 while having a liquid inlet 4 and a liquid outlet 5 communicated with the micro flow channel 2 is joined in the plastic substrate 1 with the recessed micro flow channel 2 to flow a small amount of liquid through. In this occasion, both of the joining between the substrate 1 and the lid plate 3, and coating relative to the entire or a part of the inner surface of the micro flow channel 2 are conducted with a paint film 6 having silica sol including an organic binder as a main ingredient. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

この発明は、化学反応を微小空間で行わせるために用いられるマイクロ流路デバイスに関する。   The present invention relates to a microchannel device used for performing a chemical reaction in a minute space.

マイクロ流路デバイスは一般に、微量の化学薬品や試液等のような液体を流すためのマイクロ流路が凹んで形成された基板にマイクロ流路の開放面を塞ぐための蓋板が接合され、マイクロ流路に連通する液体注入口と液体排出口が蓋板に形成されている。   In general, a microchannel device is formed by bonding a cover plate for closing an open surface of a microchannel to a substrate in which a microchannel for flowing a liquid such as a small amount of chemicals or a test solution is recessed. A liquid inlet and a liquid outlet that communicate with the flow path are formed in the lid plate.

そのような基板はガラス材料で形成すると、耐熱性が高くかつ化学的に安定している長所があるものの、マイクロ流路をエッチング等で形成するための製造コストが高くつき、大量生産してもさほど量産効果があがらない（例えば、特許文献１）。   When such a substrate is formed of a glass material, it has the advantage of being highly heat-resistant and chemically stable, but the manufacturing cost for forming the microchannel by etching or the like is high, and even if it is mass-produced There is not much mass production effect (for example, Patent Document 1).

しかし、基板をプラスチック材で形成すれば、マイクロ流路を金型成形することができるので製造コストが低減され、大量生産することにより大きな量産効果が得られる。そこで、マイクロ流路が化学的耐久性を有するように二酸化珪素等をコーティングして、それから基板と蓋板を接着剤等で接合している（例えば、特許文献２）。
特開２００５−１３９０１６ 特開２００２−１３９４１９ However, if the substrate is formed of a plastic material, the micro flow path can be molded, so that the manufacturing cost is reduced, and a large mass production effect can be obtained by mass production. Therefore, silicon dioxide or the like is coated so that the microchannel has chemical durability, and then the substrate and the cover plate are bonded with an adhesive or the like (for example, Patent Document 2).
JP-A-2005-139016 JP2002-139419

マイクロ流路を形成する凹部は例えば幅が０．１ｍｍ程度の極めて細いものであり、そのような凹部のみへのコーティングは厚く形成するのが困難である。具体的には、例えば特許文献２に記載された発明では１０ｎｍ〜１００ｎｍ程度のコーティング厚しか得ることができない。そのため、マイクロ流路内での化学反応や高感度測定（例えば、熱レンズ検出装置が用いられた高感度測定）等により熱が発生すると、その熱でプラスチック製の基板が溶解して化学反応やその測定結果等に悪影響を及ぼす場合がある。   The concave portion forming the microchannel is extremely thin, for example, having a width of about 0.1 mm, and it is difficult to form a thick coating only on such a concave portion. Specifically, for example, in the invention described in Patent Document 2, only a coating thickness of about 10 nm to 100 nm can be obtained. Therefore, when heat is generated by a chemical reaction or high sensitivity measurement in the microchannel (for example, high sensitivity measurement using a thermal lens detection device), the plastic substrate is dissolved by the heat and the chemical reaction or The measurement result may be adversely affected.

また、基板と蓋板を接着剤で接合すると、接着剤中の溶剤が薬液や試液等で溶かされて液中に溶出するおそれがある。また、特許文献２に記載された発明では、マイクロ流路へのコーティングが安定状態になった後に基板と蓋板とを接合する工程をとっているため製造コストが嵩んでしまう。   In addition, when the substrate and the cover plate are joined with an adhesive, the solvent in the adhesive may be dissolved in a chemical solution or a test solution and eluted into the solution. Moreover, in the invention described in Patent Document 2, the manufacturing cost increases because the step of joining the substrate and the cover plate is performed after the coating on the microchannel becomes stable.

本発明は、そのような問題を解決するためになされたものであり、製造コストのかからないプラスチック製の基板を用いて、耐熱性と耐薬性に優れ、かつ簡単な工程により低コストで製造することができるマイクロ流路デバイスを提供することを目的とする。   The present invention has been made to solve such a problem, and is manufactured at a low cost by a simple process with excellent heat resistance and chemical resistance, using a plastic substrate that does not require manufacturing costs. An object of the present invention is to provide a microchannel device capable of performing

上記の目的を達成するため、本発明のマイクロ流路デバイスは、微量の液体を流すためのマイクロ流路が凹んで形成されたプラスチック製の基板に、マイクロ流路の開放面を塞ぐと共にマイクロ流路に連通する液体注入口と液体排出口とが形成された蓋板を接合した構成を有するマイクロ流路デバイスにおいて、基板と蓋板との接合、及びマイクロ流路の内面の全部又は一部に対するコーティングが共に、有機バインダーを含有するシリカゾルを主成分とする塗膜で行われているものである。   In order to achieve the above object, the microchannel device of the present invention is configured to block the open surface of the microchannel and cover the microflow channel with a plastic substrate in which a microchannel for flowing a small amount of liquid is recessed. In a microchannel device having a configuration in which a lid plate in which a liquid inlet and a liquid outlet that communicate with a path are formed is joined, the junction between the substrate and the lid plate, and all or part of the inner surface of the microchannel Both coatings are performed with a coating film mainly composed of silica sol containing an organic binder.

なお、塗膜が、基板と蓋板との接合面の両面に各々設けられて、その両面の塗膜どうしが熱圧着されていると好ましい。また、蓋板が基板と同じプラスチック材で形成されていてもよく、あるいは、蓋板がガラス材で形成されていてもよい。そして、基板が全体にシート材で形成されていて、マイクロ流路が形成されている部分では基板が裏面側に突出していてもよい。   In addition, it is preferable that a coating film is provided on both surfaces of the bonding surface of the substrate and the cover plate, and the coating films on both surfaces are thermocompression bonded. Moreover, the cover plate may be formed of the same plastic material as the substrate, or the cover plate may be formed of a glass material. And the board | substrate may be formed in the whole in the sheet | seat material, and the board | substrate may protrude in the back surface side in the part in which the microchannel is formed.

また、基板と蓋板の少なくとも一方のマイクロ流路に面する位置に電気配線が設けられていてもよく、その場合に、電気配線が塗膜の裏側に配置されて、電気配線がマイクロ流路内に露出しない状態になっていてもよい。また、基板と蓋板の少なくとも一方の素材として、電気配線が予め埋設されたフレキシブル基板が用いられていてもよい。   In addition, an electrical wiring may be provided at a position facing at least one of the microchannels of the substrate and the cover plate. In that case, the electrical wiring is arranged on the back side of the coating film, and the electrical wiring is arranged on the microchannel. It may be in a state where it is not exposed inside. Further, a flexible substrate in which electric wiring is embedded in advance may be used as at least one of the substrate and the cover plate.

本発明のマイクロ流路デバイスは、基板と蓋板との接合、及びマイクロ流路の内面の全部又は一部に対するコーティングが共に、有機バインダーを含有するシリカゾルを主成分とする塗膜で行われていることにより、製造コストのかからないプラスチック製の基板を用いて、耐熱性と耐薬性に優れ、かつ簡単な工程により低コストで製造することができる格別の効果を奏する。   In the microchannel device of the present invention, the bonding between the substrate and the cover plate and the coating on the whole or part of the inner surface of the microchannel are both performed with a coating film mainly composed of silica sol containing an organic binder. By using such a plastic substrate, it is possible to produce a plastic substrate that does not require manufacturing cost, and has excellent heat resistance and chemical resistance, and can be manufactured at a low cost by a simple process.

以下、図面を参照して本発明の実施の形態を説明する。
図１〜図４は本発明に係る第１の実施の形態であるマイクロ流路デバイスを示しており、図２はマイクロ流路デバイスの分解斜視図、図３は平面図であり、図１は、図３におけるＩ−Ｉ断面図、図４はIV−IV断面図である。 Embodiments of the present invention will be described below with reference to the drawings.
1 to 4 show a microchannel device according to a first embodiment of the present invention, FIG. 2 is an exploded perspective view of the microchannel device, FIG. 3 is a plan view, and FIG. 3 is a cross-sectional view taken along the line II in FIG. 3, and FIG. 4 is a cross-sectional view taken along the line IV-IV.

１は、プラスチック製の基板であり、例えばポリスチレン、ポリエチレン、ポリプロピレン、ポリエチレンテレフタレート、ポリエチレンナフタレート、ポリメチルメタクリレート、ポリエチレンビニルアルコール、アクリル樹脂、ポリビニル樹脂、エポキシ樹脂、ポリ塩化ビニル、不飽和ポリエステル樹脂、ポリアミド樹脂、ポリイミド樹脂、ポリスルホン樹脂、環状シクロオレフィン樹脂、セルロースアセテート、硝酸セルロース、フルオロカーボン樹脂、又はポリカーボネート等のような有機高分子材料で形成されている。基板１は、例えば一辺が数ｃｍ程度の矩形状に形成されていて、その厚みは例えば０．５ｍｍ程度である。   1 is a plastic substrate, for example, polystyrene, polyethylene, polypropylene, polyethylene terephthalate, polyethylene naphthalate, polymethyl methacrylate, polyethylene vinyl alcohol, acrylic resin, polyvinyl resin, epoxy resin, polyvinyl chloride, unsaturated polyester resin, It is made of an organic polymer material such as polyamide resin, polyimide resin, polysulfone resin, cyclic cycloolefin resin, cellulose acetate, cellulose nitrate, fluorocarbon resin, or polycarbonate. The substrate 1 is formed, for example, in a rectangular shape having a side of about several centimeters, and the thickness thereof is, for example, about 0.5 mm.

基板１の上面側には、微量の化学薬品や試液等のような液体を流すためのマイクロ流路２が凹んで形成されている。マイクロ流路２は、幅が例えば０．１ｍｍ程度で深さが例えば０．０５ｍｍ程度の矩形状の断面形状に形成され、全体として例えば略Ｙ字状の平面形状に形成されている。ただし、マイクロ流路２の断面形状や平面形状は、そのマイクロ流路デバイスの使用目的等に応じて、流路内部に液溜まり、ステップ、分岐、合流あるいは流路幅変更等の要素を含むものであってもよく、例えば、マイクロ流路２の断面形状は半円形等であってもよく、平面形状が略Ｙ字状以外の形状であってもよい。   On the upper surface side of the substrate 1, a micro flow channel 2 for flowing a liquid such as a small amount of chemicals or a test solution is formed in a recessed manner. The microchannel 2 is formed in a rectangular cross-sectional shape having a width of, for example, about 0.1 mm and a depth of, for example, about 0.05 mm, and is formed, for example, in a substantially Y-shaped planar shape as a whole. However, the cross-sectional shape and planar shape of the microchannel 2 include elements such as a liquid pool, step, branch, merge or channel width change in the channel depending on the purpose of use of the microchannel device. For example, the cross-sectional shape of the microchannel 2 may be a semicircular shape, and the planar shape may be a shape other than a substantially Y shape.

このようなマイクロ流路２は、例えば予めシート状に形成された基板１の素材を加熱された金型でプレス加工することにより容易に製造することができる。なお、基板１を透明な材料で形成すれば、マイクロ流路２内を外部から目視観察したり、光学的な計測や処理を行えたりする点で好ましい。また、マイクロ流路２の断面形状が半円形等であってもよい。   Such a microchannel 2 can be easily manufactured by, for example, pressing a material of the substrate 1 formed in a sheet shape in advance with a heated mold. If the substrate 1 is formed of a transparent material, it is preferable in that the inside of the microchannel 2 can be visually observed from the outside and optical measurement and processing can be performed. Moreover, the cross-sectional shape of the microchannel 2 may be a semicircle or the like.

３は、マイクロ流路２の開放面を塞ぐために基板１の上面に接合固着される蓋板であり、基板１と同様に各種の有機高分子材料から一つを選択して形成することができる。ただし、基板１と同じ材料で形成すれば、接合や熱膨張の程度が基板１と一致する点で好ましい。また、蓋板３はガラス材料で形成してもよく、例えば珪酸ソーダガラス、硼珪酸ガラス、バリウム硼珪酸ガラス、石英ガラス等、あるいは結晶化ガラス、低融点ガラス等のようなガラス材料から選択することもできる。ただし、蓋板３側にもマイクロ流路を形成する場合には、製造コストの点でプラスチック製にした方が有利である。   Reference numeral 3 denotes a cover plate that is bonded and fixed to the upper surface of the substrate 1 in order to close the open surface of the microchannel 2, and can be formed by selecting one of various organic polymer materials in the same manner as the substrate 1. . However, it is preferable to form the same material as the substrate 1 in that the degree of bonding and thermal expansion is the same as that of the substrate 1. The lid plate 3 may be formed of a glass material, and is selected from glass materials such as sodium silicate glass, borosilicate glass, barium borosilicate glass, quartz glass, crystallized glass, low melting point glass, and the like. You can also However, when the micro flow path is also formed on the lid plate 3 side, it is advantageous to make the micro flow path from the viewpoint of manufacturing cost.

蓋板３には、マイクロ流路２に連通する液体注入口４と液体排出口５とが形成されている。液体注入口４は、略Ｙ字状に形成されたマイクロ流路２の二つの分岐流路の端部に各々面する位置に蓋板３の表裏を貫通する状態に形成され、液体排出口５は、マイクロ流路２の合流流路の端部に面する位置に蓋板３の表裏を貫通する状態に形成されている。   The lid plate 3 is formed with a liquid inlet 4 and a liquid outlet 5 communicating with the microchannel 2. The liquid inlet 4 is formed in a state of penetrating the front and back of the cover plate 3 at positions facing the ends of the two branch channels of the microchannel 2 formed in a substantially Y shape. Is formed in a state of penetrating the front and back of the cover plate 3 at a position facing the end of the converging flow path of the micro flow path 2.

６は、基板１と蓋板３との接合、及びマイクロ流路２の内面コーティングという二つの目的に供せられる塗膜であり、有機バインダーを含有するシリカゾルを主成分とする同一の塗膜６が、この実施の形態では基板１と蓋板３の双方の対向面全面（即ち、基板１の上面と蓋板３の裏面の各全面）に塗布されて、基板１と蓋板３との接合時に加熱硬化処理されている。なお、必要な場合には、液体注入口４と液体排出口５の内周面にも塗膜６が形成される。   6 is a coating film provided for the two purposes of joining the substrate 1 and the cover plate 3 and coating the inner surface of the microchannel 2. The same coating film 6 mainly composed of silica sol containing an organic binder. However, in this embodiment, it is applied to the entire opposing surfaces of both the substrate 1 and the cover plate 3 (that is, the entire upper surface of the substrate 1 and the entire back surface of the cover plate 3) to join the substrate 1 and the cover plate 3. Sometimes heat-cured. If necessary, the coating film 6 is also formed on the inner peripheral surfaces of the liquid inlet 4 and the liquid outlet 5.

塗膜６の主成分であるシリカゾルは、二酸化珪素（ＳｉＯ2 ）の微粒子を例えばイソプロピルアルコール水溶液等のような溶媒中に分散させたもの、又は化学的に生成されたシリコンアルコキシドからなるゾルであり、溶媒を発散させるとゲル化して固形膜になる。そして、そのようなシリカゾルによって形成されたコーティング膜は有機バインダー濃度が小さい場合は親水性が大きいので、マイクロ流路２の表面に親水性が必要な場合に、親水性を得るための他の表面処理を施す必要がない。一方、コーティング膜における有機バインダー濃度が大きい場合は疎水性の膜になるので、親水性が必要な場合は親水処理をして用いる。 The silica sol as the main component of the coating film 6 is a sol made of silicon dioxide (SiO 2 ) fine particles dispersed in a solvent such as an isopropyl alcohol aqueous solution or a chemically generated silicon alkoxide. When the solvent is released, it gels and becomes a solid film. And since the coating film formed of such a silica sol has high hydrophilicity when the organic binder concentration is low, other surfaces for obtaining hydrophilicity when the surface of the microchannel 2 needs to be hydrophilic. There is no need for processing. On the other hand, when the organic binder concentration in the coating film is high, it becomes a hydrophobic film. Therefore, when hydrophilicity is required, it is used after being subjected to hydrophilic treatment.

また、シリカゾルは耐薬性と耐熱性に優れていて、溶剤等が溶け出すことなくプラスチック材に対し強接合され、接着性の低いポリエチレン樹脂系の材料に対しても強固に接合される。ポリエチレン樹脂系の材料は、再生処理や廃棄処理に際して公害発生のおそれが少ないので、リサイクルにも使い捨て使用にも適しており、透明性があることと合わせマイクロ流路デバイスに使用するメリットが大きい。   Silica sol is excellent in chemical resistance and heat resistance, and is strongly bonded to a plastic material without dissolving a solvent or the like, and is also firmly bonded to a polyethylene resin material having low adhesion. Polyethylene resin-based materials are less likely to cause pollution during recycling and disposal, and are therefore suitable for both recycling and single use. In addition to their transparency, there are great advantages in using them for microchannel devices.

シリカゾル中に含まれる有機バインダーは、アクリル樹脂系又はエポキシ樹脂系等のように一般的な有機バインダーを用いることができ、加熱処理により発散させて任意の量だけ残すことができる。したがって、シリカゾル中への混合量と加熱処理の温度と時間等を適宜選択することにより、シリカゾル中に残る有機バインダー量を任意に制御して、例えば二酸化珪素とプラスチック材との熱膨張率の相違を緩衝する機能等を最適な状態に調整することができる。   As the organic binder contained in the silica sol, a general organic binder such as an acrylic resin type or an epoxy resin type can be used, and it can be diffused by heat treatment and left in an arbitrary amount. Therefore, the amount of organic binder remaining in the silica sol can be arbitrarily controlled by appropriately selecting the mixing amount in the silica sol, the temperature and time of the heat treatment, and the difference in thermal expansion coefficient between, for example, silicon dioxide and the plastic material. It is possible to adjust the function for buffering to an optimal state.

このような有機バインダーを含有するシリカゾルを主成分とする塗膜６は、前述のように基板１と蓋板３の双方の対向面全面に塗布形成されている。したがって、マイクロ流路２内においても十分に厚く（例えば１００ｎｍ〜５μｍ程度に）形成することができ、マイクロ流路２内での化学反応等により発生した熱でプラスチック製の基板１が溶解しない耐熱性を確保することができる。   The coating film 6 containing silica sol containing an organic binder as a main component is applied and formed on the entire facing surfaces of both the substrate 1 and the cover plate 3 as described above. Therefore, it can be formed sufficiently thick (for example, about 100 nm to 5 μm) in the microchannel 2, and the plastic substrate 1 is not dissolved by heat generated by a chemical reaction or the like in the microchannel 2. Sex can be secured.

基板１と蓋板３の各対向面への塗膜６の塗布は、ディッピング、スピンコーティング又は印刷等の手段により所定の膜厚で行うことができる。膜厚は、シリカゾルの粘度、即ちゾル中の固形成分の量や有機バインダーの量等で調整することができる。なお、塗膜６の塗布は、基板１や蓋板３を所定のサイズに切断する前又は後のどちらで行ってもよい。   Application of the coating film 6 to the opposing surfaces of the substrate 1 and the cover plate 3 can be performed with a predetermined film thickness by means such as dipping, spin coating or printing. The film thickness can be adjusted by the viscosity of the silica sol, that is, the amount of solid components in the sol and the amount of organic binder. The coating film 6 may be applied either before or after the substrate 1 or the cover plate 3 is cut into a predetermined size.

基板１と蓋板３の各々に塗布された塗膜６は、基板１と蓋板３を接合する前に、例えば７０℃程度の温度で３０秒〜２分程度仮焼成し、有機バインダーを少し発散させて軽く硬化させるとよい。疎水処理又は特別な親水処理等が必要な場合には、この段階で印刷又はディスペンサー等を用いて処理を行う。   The coating film 6 applied to each of the substrate 1 and the cover plate 3 is pre-baked for about 30 seconds to 2 minutes at a temperature of about 70 ° C., for example, before bonding the substrate 1 and the cover plate 3, and a little organic binder is added. It is better to diverge and lightly cure. If a hydrophobic treatment or a special hydrophilic treatment is required, the treatment is performed at this stage using printing or a dispenser.

そして最後に、基板１に塗布された塗膜６と蓋板３に塗布された塗膜６とを密着させ、例えば８０〜２６０℃程度（基板１と蓋板３の材料の選択により異なる）に加熱して塗膜６どうしを圧着させる。そのような熱圧着は、加熱ローラーやスタンパー等を用いて圧接状態で行うとよい。このようにして、基板１と蓋板３の双方の対向面に塗布された塗膜６どうしが結合して、基板１と蓋板３とが強固に接合された状態になり、同時にマイクロ流路２の内面への厚いコーティングが完了し、マイクロ流路デバイスを極めて低コストに製造することができる。   Finally, the coating film 6 applied to the substrate 1 and the coating film 6 applied to the lid plate 3 are brought into close contact with each other, for example, at about 80 to 260 ° C. (depending on the selection of the material of the substrate 1 and the lid plate 3). Heat to make the coating films 6 crimp. Such thermocompression bonding may be performed in a pressure contact state using a heating roller, a stamper, or the like. In this way, the coating films 6 applied to the opposing surfaces of both the substrate 1 and the cover plate 3 are coupled to each other so that the substrate 1 and the cover plate 3 are firmly bonded, and at the same time, the micro flow path. The thick coating on the inner surface of the two is completed, and the microchannel device can be manufactured at a very low cost.

図５と図６は本発明に係る第２の実施の形態であるマイクロ流路デバイスを示しており、図５は平面図、図６は、図５におけるVI−VI断面図である。この実施の形態においては、電極として機能する電気配線７が基板１の上面に設けられている。基板１、マイクロ流路２及び蓋板３自体の構成は前述した第１の実施の形態に係るマイクロ流路デバイスと同様である。なお、蓋板３側に電気配線７を設けてもよい。   5 and 6 show a microchannel device according to a second embodiment of the present invention. FIG. 5 is a plan view, and FIG. 6 is a sectional view taken along line VI-VI in FIG. In this embodiment, an electrical wiring 7 that functions as an electrode is provided on the upper surface of the substrate 1. The configurations of the substrate 1, the microchannel 2 and the cover plate 3 themselves are the same as those of the microchannel device according to the first embodiment described above. The electrical wiring 7 may be provided on the lid plate 3 side.

電気配線７は、図５に示されるようにマイクロ流路２と交差する二箇所に互いの間に間隔をあけて配置され、各電気配線７が、図６に示されるようにマイクロ流路２の底面に面する状態に配置されている。電気配線７は、塗膜６の表裏どちら側に配置してもよいが、この実施の形態のように塗膜６の裏側に配置して、電気配線７がマイクロ流路２内に露出しないようにすれば、電気配線７がマイクロ流路２内の液体により腐食されるおそれがない点で好ましい。   As shown in FIG. 5, the electric wiring 7 is arranged at two positions intersecting the micro flow path 2 with a space between each other, and each electric wiring 7 is connected to the micro flow path 2 as shown in FIG. 6. It is arrange | positioned in the state which faces the bottom face. The electrical wiring 7 may be disposed on either the front or back side of the coating film 6, but is disposed on the back side of the coating film 6 as in this embodiment so that the electrical wiring 7 is not exposed in the microchannel 2. This is preferable in that the electrical wiring 7 is not corroded by the liquid in the microchannel 2.

図５に示されるように、基板１から外方に突出して設けられた配線基板（リードフレーム）８には、電気配線７と電気的に導通する接続端子９が設けられていて、電気配線７を外部の測定機器等に接続することができる。ただし、接続端子９に代えてコンタクトホールやコネクター等を設けてもよい。なお、図７に示される第３の実施の形態に係るマイクロ流路デバイスのように、電気配線７を電極として駆動するための駆動ＩＣ１０（例えば、交流周波数を制御する）を配線基板８に設けてもよい。また、いわゆる電子タグ１１を基板１又は蓋板３内に埋設又は貼着して、来歴情報等を記録できるようにしてもよい。   As shown in FIG. 5, a wiring board (lead frame) 8 provided so as to protrude outward from the substrate 1 is provided with a connection terminal 9 that is electrically connected to the electric wiring 7. Can be connected to an external measuring device or the like. However, a contact hole or a connector may be provided instead of the connection terminal 9. In addition, like the microchannel device according to the third embodiment shown in FIG. 7, a driving IC 10 (for example, controlling the AC frequency) for driving the electric wiring 7 as an electrode is provided on the wiring board 8. May be. Further, a so-called electronic tag 11 may be embedded or stuck in the substrate 1 or the cover plate 3 so that history information and the like can be recorded.

図８は、本発明に係る第４の実施の形態であるマイクロ流路デバイスを示しており、前述した第１の実施の形態に係るマイクロ流路デバイスと同様に構成されたマイクロ流路２の途中に疎水領域１２を形成したものである。具体的には、その部分だけ塗膜６を塗布せずにプラスチック材の基板１が露出するようにすればその領域が疎水領域１２になる。このように、塗膜６は必ずしも基板１と蓋板３の各対向面全面に設けなくてもよい。ただし、塗膜６の一部分に対して疎水処理を施してもよいことはいうまでもない。   FIG. 8 shows a microchannel device according to a fourth embodiment of the present invention, and shows a microchannel 2 configured similarly to the microchannel device according to the first embodiment described above. A hydrophobic region 12 is formed in the middle. Specifically, if the plastic substrate 1 is exposed without applying the coating film 6 only to that portion, the region becomes the hydrophobic region 12. Thus, the coating film 6 does not necessarily have to be provided on the entire opposing surfaces of the substrate 1 and the cover plate 3. However, it goes without saying that a hydrophobic treatment may be applied to a part of the coating film 6.

図９は、本発明に係る第５の実施の形態を示しており、基板１が全体にシート材で形成されて、マイクロ流路２が形成されている部分では基板１が裏面側に突出する状態になっているものである。マイクロ流路２は、角部に丸みのついた略半円状の断面形状になっている。基板１としてポリエチレン樹脂系の材料やフレキシブル基板を用いる場合等には、このような構成を採ることでマイクロ流路２を容易に低コストで形成することができる。   FIG. 9 shows a fifth embodiment according to the present invention, in which the substrate 1 is formed of a sheet material as a whole, and the substrate 1 protrudes to the back side in a portion where the microchannel 2 is formed. It is in a state. The microchannel 2 has a substantially semicircular cross-sectional shape with rounded corners. When a polyethylene resin material or a flexible substrate is used as the substrate 1, the micro flow path 2 can be easily formed at a low cost by adopting such a configuration.

本発明に係る第１の実施の形態であるマイクロ流路デバイスの側面断面図（図３におけるＩ−Ｉ断面図）である。It is side surface sectional drawing (II sectional drawing in FIG. 3) of the microchannel device which is 1st Embodiment based on this invention. 本発明に係る第１の実施の形態であるマイクロ流路デバイスの分解斜視図である。1 is an exploded perspective view of a microchannel device according to a first embodiment of the present invention. 本発明に係る第１の実施の形態であるマイクロ流路デバイスの平面図である。It is a top view of the microchannel device which is the 1st embodiment concerning the present invention. 本発明に係る第１の実施の形態であるマイクロ流路デバイスの正面断面図（図３におけるIV−IV断面図）である。It is front sectional drawing (IV-IV sectional drawing in FIG. 3) of the microchannel device which is 1st Embodiment based on this invention. 本発明に係る第２の実施の形態であるマイクロ流路デバイスの平面図である。It is a top view of the microchannel device which is the 2nd embodiment concerning the present invention. 本発明に係る第２の実施の形態であるマイクロ流路デバイスの正面断面図（図５におけるVI−VI断面図）である。It is front sectional drawing (VI-VI sectional drawing in FIG. 5) of the microchannel device which is the 2nd Embodiment which concerns on this invention. 本発明に係る第３の実施の形態であるマイクロ流路デバイスの平面図である。It is a top view of the microchannel device which is the 3rd embodiment concerning the present invention. 本発明に係る第４の実施の形態であるマイクロ流路デバイスの分解斜視図である。It is a disassembled perspective view of the microchannel device which is the 4th Embodiment concerning this invention. 本発明に係る第５の実施の形態であるマイクロ流路デバイスの正面断面図である。It is front sectional drawing of the microchannel device which is the 5th Embodiment which concerns on this invention.

符号の説明Explanation of symbols

１ 基板
２ マイクロ流路
３ 蓋板
４ 液体注入口
５ 液体排出口
６ 塗膜
７ 電気配線
１０ 駆動ＩＣ
１１ 電子タグ DESCRIPTION OF SYMBOLS 1 Substrate 2 Micro flow path 3 Cover plate 4 Liquid inlet 5 Liquid outlet 6 Paint film 7 Electrical wiring 10 Drive IC
11 Electronic tag

Claims (8)

微量の液体を流すためのマイクロ流路が凹んで形成されたプラスチック製の基板に、上記マイクロ流路の開放面を塞ぐと共に上記マイクロ流路に連通する液体注入口と液体排出口とが形成された蓋板を接合した構成を有するマイクロ流路デバイスにおいて、
上記基板と上記蓋板との接合、及び上記マイクロ流路の内面の全部又は一部に対するコーティングが共に、有機バインダーを含有するシリカゾルを主成分とする塗膜で行われていることを特徴とするマイクロ流路デバイス。 A plastic substrate in which a microchannel for flowing a small amount of liquid is recessed is formed with a liquid inlet and a liquid outlet that close the open surface of the microchannel and communicate with the microchannel. In the microchannel device having a configuration in which the lid plate is joined,
The bonding between the substrate and the cover plate and the coating on all or a part of the inner surface of the microchannel are both performed with a coating film mainly composed of silica sol containing an organic binder. Microchannel device. 上記塗膜が、上記基板と上記蓋板との接合面の両面に各々設けられて、その両面の塗膜どうしが熱圧着されている請求項１記載のマイクロ流路デバイス。   The microchannel device according to claim 1, wherein the coating films are provided on both surfaces of the joint surface between the substrate and the lid plate, and the coating films on both surfaces are thermocompression bonded. 上記蓋板が上記基板と同じプラスチック材で形成されている請求項１又は２記載のマイクロ流路デバイス。   The microchannel device according to claim 1 or 2, wherein the lid plate is formed of the same plastic material as the substrate. 上記蓋板がガラス材で形成されている請求項１又は２記載のマイクロ流路デバイス。   The microchannel device according to claim 1 or 2, wherein the lid plate is formed of a glass material. 上記基板が全体にシート材で形成されていて、上記マイクロ流路が形成されている部分では上記基板が裏面側に突出している請求項１ないし４のいずれかの項に記載のマイクロ流路デバイス。   The microchannel device according to any one of claims 1 to 4, wherein the substrate is formed of a sheet material as a whole, and the substrate protrudes on the back surface side in a portion where the microchannel is formed. . 上記基板と上記蓋板の少なくとも一方の上記マイクロ流路に面する位置に電気配線が設けられている請求項１ないし５のいずれかの項に記載のマイクロ流路デバイス。   The microchannel device according to any one of claims 1 to 5, wherein an electrical wiring is provided at a position facing at least one of the substrate and the lid plate facing the microchannel. 上記電気配線が上記塗膜の裏側に配置されて、上記電気配線が上記マイクロ流路内に露出しない状態になっている請求項６記載のマイクロ流路デバイス。   The microchannel device according to claim 6, wherein the electrical wiring is disposed on the back side of the coating film so that the electrical wiring is not exposed in the microchannel. 上記基板と上記蓋板の少なくとも一方の素材として、電気配線が予め埋設されたフレキシブル基板が用いられている請求項６記載のマイクロ流路デバイス。   The microchannel device according to claim 6, wherein a flexible substrate in which electrical wiring is embedded in advance is used as at least one of the substrate and the cover plate.
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