JP2008199216A - Head-mounted display - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a head-mounted display which is free from a high temperature due to heating regardless of incorporation of many electric circuit boards. <P>SOLUTION: The head-mounted display includes two headphones 1 and 2 incorporating speakers. The headphone 1 is connected to an enclosure 3 having electric circuit boards stored therein and can be turned to the enclosure 3. A supporting arm 4 is turnably attached to the enclosure 3, and a display part 5 for displaying an image on user's eyes is attached to a front end part of the supporting arm 4. The enclosure 3 and the headphone 2 are connected to a connection part 9 through headphone position adjustment mechanism 6 and 5. The surface area of the enclosure 3 has enough size to dissipate total heat generated from electric circuit boards stored in the enclosure 3, from the surface. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a head mounted display.

  In recent years, various glasses-type image display devices for observing an image displayed on a display such as a liquid crystal panel (LCD) as a virtual image enlarged through an optical system having an eyepiece, a half mirror, etc. have been proposed, and wearable displays. is called. An example of such a wearable display is described in, for example, WO2004 / 061519A1 (Patent Document 1).

This video display device is often configured to be worn on the head in a form wound around the head (referred to as a head-mounted display), and a binocular with a video display system formed at a position corresponding to both eyes. There is a one-eye type in which a video display system is formed at a position corresponding to one of the left and right eyes. Such a head-mounted display usually has a display unit for displaying video and a headphone for outputting sound.
WO2004 / 061519A1 publication

  In such a head mounted display, recently, an attempt has been made to store a large number of storage devices such as electric circuits and hard disks therein. In that case, the problem is the heat generated by these electric circuits. Normally, it is conceivable that the storage place of these electric circuits is inside the headphones, but there is a problem of storage space, and the temperature of the headphones rises due to the heat generated by the electric circuits, which makes the wearer uncomfortable. There is a problem of giving.

  As a countermeasure against this, there has been considered a method of dividing electrical circuits into a plurality of parts and distributing storage locations. However, when electrical circuits are arranged in a distributed manner, wiring that connects them is required, and when the wiring becomes long, there is a problem that it becomes weak against noise. Although a method of cooling with a cooling fan is conceivable, in addition to the problem that the operating sound reaches the ear directly, there is a problem that vibrations occur, so these measures are necessary and are not practical. Although it is conceivable to use a heat pipe to release the generated heat to other parts, the cost ratio of the heat transfer material to the product price increases and is not practical.

  The present invention has been made in view of such circumstances, and it is an object of the present invention to provide a head mounted display that does not cause a problem of high temperature due to heat generation even when many electric circuit boards are accommodated. .

  A first means for solving the above problem is a head-mounted display that is attached to the head and outputs an image to the eyes of the wearer, and has two ear pads provided so as to contact the ears of the wearer A display unit that outputs an image to a wearer, a support arm that is attached to the tip of the display unit and disposed in front of the wearer, and a housing that houses an electric circuit board, One ear pad and the housing are connected by a connecting part that comes into contact with the head when the head mounted display is mounted, and the other ear pad and the support arm are connected to the housing. In the head mounted display, the surface area of the casing is sized so that all the heat generated by the electric circuit board can be dissipated from the surface of the casing.

  The second means for solving the problem is the first means, wherein the housing is sized so as to contact the head when the head mounted display is mounted. It is what.

  According to the present invention, it is possible to provide a head mounted display that does not cause a problem of high temperature due to heat generation even when many electric circuit boards are accommodated.

  Hereinafter, examples of embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a diagram showing an outline of a head mounted display as an example of an embodiment of the present invention. The head-mounted display is provided with two headphones 1 and 2 (ear pads) with built-in speakers. The headphone 1 is connected to a housing 3 in which an electric circuit board is housed, and can rotate with respect to the housing 3. A support arm 4 is rotatably attached to the housing 3, and a display unit 5 that displays an image on the user's eyes is attached to the tip of the support arm 4.

  The housing 3 and the headphone 2 are connected to the connecting portion 8 via the headphone position adjusting mechanisms 6 and 7, respectively. The connecting portion 8 is formed so as to contact the top of the head when the head mounted display is mounted. The headphone position adjusting mechanism 6 and the headphone position adjusting mechanism 7 are slide mechanisms. By sliding the headphone position adjusting mechanism 6 and the headphone position adjusting mechanism 7, the distance between the housing 3 and the connecting portion 8 and the headphone 2 and the connecting portion 8 is adjusted. The positions of the headphone 1 and the headphone 2 and the position of the support arm 4 when the display is mounted are adjusted. The connecting portion 8 is an elastic body and has an urging force that presses the headphone 1 and the headphone 2 against the ears of the wearer. The support arm 4 may be connected with a cable 9 for electrical connection with an external device.

The surface area of the housing 3 is large enough to dissipate the total amount of heat generated from the electric circuit board housed in the housing 3 from the surface. That is, the total heat generated from the electric circuit board is Q, the average heat transfer coefficient on the surface of the housing 3 is α, the allowable temperature of the surface of the housing 3 is θ, the ambient temperature is t, and the surface area of the housing 3 is If A, then A ≧ Q / {α (θ−t)}
It is supposed to be. Thereby, the temperature of the surface of the housing | casing 3 is maintained below permissible temperature (theta). In addition, since the electrical circuits are housed in one housing, the number of wirings can be reduced and the influence of noise can be reduced.

  FIG. 2 is a diagram showing an outline of a head mounted display which is another example of the embodiment of the present invention. In FIG. 2, the same components as those shown in FIG. 1 may be denoted by the same reference numerals and the description thereof may be omitted. In the example shown in FIG. 2, since the required surface area of the housing 3 is large, the housing 3 is sized so as to come into contact with the head when the head mounted display is mounted. Accordingly, the length of the connecting portion 8 is shortened.

  Further, in this example, the headphone position adjusting mechanism 6 shown in FIG. 1 is not provided. This is because the shape of the housing 3 matches the shape of the head. Therefore, the relative positions of the headphone 1 and the support arm 4 with respect to the housing 3 are adjusted to adjust the positions of the headphone 1 and the support arm 4 when the head mounted display is mounted. That is, a slide mechanism is provided inside the housing 3, and a mounting portion for the headphone 1 and the support arm 4 is provided on the slide mechanism, and the headphone 1 and the support arm 4 are moved by sliding the slide mechanism. It becomes one body and moves in the vertical direction when mounted on the housing 3. In addition, the attachment part of the headphone 1 and the support arm 4 has a structure which attaches the headphone 1 and the support arm 4 so that rotation is possible respectively.

It is a figure which shows the outline | summary of the head mounted display which is an example of embodiment of this invention. It is a figure which shows the outline | summary of the head mounted display which is another example of embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Headphone, 2 ... Headphone, 3 ... Housing | casing, 4 ... Support arm, 5 ... Display part, 6 ... Headphone position adjustment mechanism, 7 ... Headphone position adjustment mechanism, 8 ... Connection part, 9 ... Cable

Claims (2)

  A head-mounted display that is mounted on the head and outputs an image to the wearer's eye, two ear pads provided to contact the wearer's ear, and a display unit that outputs an image to the wearer The display unit is attached to the distal end and has a support arm disposed in front of the wearer's eye, and a housing for storing the electric circuit board, wherein the one ear pad and the housing are The head mounted display is connected by a connecting portion that contacts the head when the head mounted display is mounted, and the other ear pad and the support arm are coupled to the housing, and the surface area of the housing is determined by the electric circuit board. A head-mounted display characterized in that it is sized so that all of the heat generated can be dissipated from the surface of the housing.   The head mounted display is characterized in that the casing is sized so as to come into contact with the head when the head mounted display is mounted.

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