JP2008198780A - Device for cooling electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To evenly cool a plurality of electronic equipment housed in a cabinet, to efficiently carrying out circulating cooling in the cabinet, and to prevent the entry of dust etc. and/or the noise. <P>SOLUTION: In this device 1 for cooling electronic apparatus for cooling a plurality of electronic apparatus units 5 by circulating air, a pair of chambers 21 and 31 are provided on two opposed sidewalls, and one chamber 31 has a plurality of inlet ports 312 for sucking the hot air 6 from the electronic equipment units 5, and the other chamber 21 has a plurality of outlet ports 212 for blowing off the cold air 7 into the cabinet 4. A heat exchanger 41 comprises a heat inlet port 412 for sucking the hot air 6 and a cold blast port 411 for ejecting the cold air 7, and the heat inlet port 412 and the cold blast port 411 are provided to communicate with each of the chambers 21 and 31. <P>COPYRIGHT: (C)2008,JPO&amp;INPIT

Description

  The present invention relates to a cooling device that cools a plurality of electronic device units accommodated in a housing.

2. Description of the Related Art In recent years, electronic devices including communication devices such as servers and switching hubs have a tendency to increase in heat density as processing capacity improves and electronic components are mounted with higher density.
In particular, in a housing that houses a plurality of such electronic devices, the temperature rise in the housing may have a serious effect on each electronic device, and measures for heat dissipation and cooling in the housing are important issues. Yes.
For example, when the temperature in the housing rises, not only the life of the electronic device to be accommodated is shortened, but also malfunction of the electronic device may be induced.
In order to prevent such a situation from occurring, keeping the inside of the housing at an appropriate temperature and taking measures for heat radiation and cooling are indispensable means for securing an appropriate operating environment of the electronic device.

On the other hand, several techniques for cooling the inside of the housing using a heat exchanger have been disclosed.
For example, Patent Document 1 discloses a heat dissipating mechanism of a sealed housing having an induction plate for guiding cooled air downward between an electronic device and a heat exchanger. Collision between the rising air heated by the air and the falling air cooled by the heat exchanger can be avoided, and a decrease in heat exchange capacity can be prevented.

  Patent Document 2 describes a communication system including a door body and a structure that supports the door body so that the door body can be opened and closed, and control means (such as a brush) that controls the direction of the cooling air by the cooling device of the heat exchanger. A method for internally cooling an equipment housing is disclosed. Thereby, the flow control of the cooling air is facilitated, and the cooling air can be efficiently circulated in the housing.

Further, Patent Document 3 discloses a heat dissipating device for a double-shell structure electronic device casing composed of an inner casing and an outer casing in which electronic components are incorporated, and the outer casing is provided on the top surface of the casing. A heat exchanger is installed across the body and the inner housing, and the gap between the outer housing and the inner housing is used as an air circulation path, and the internal air after heat dissipation is returned to the lower portion of the inner housing. A return opening is provided.
As a result, the heated air from the electronic component is radiated by the upper heat exchanger, descends via the air circulation path, and is returned to the inner casing again from the return port provided in the lower part. As a result, the electronic components are cooled.

Japanese Patent Laid-Open No. 2001-244683 JP 2004-055656 A Japanese Patent Laid-Open No. 10-190266

However, the case-type electronic device cooling apparatus disclosed so far may cause the following problems.
In any of the above-described techniques, the cooling of the electronic device is performed by circulating air from the bottom to the top in the case. For example, a plurality of electronic device units are stacked inside the case. When accommodated, the electronic device unit located in the lowermost layer and the electronic device unit located in the uppermost layer are cooled sufficiently because the electronic device unit located in the lowermost layer is cooled first, Since the electronic device unit located at the end was cooled lastly, the heat dissipation was insufficient. As a result, the internal temperature was disparate and could not be cooled uniformly.

  In particular, when accommodating a plurality of electronic device units, the air heated by each of these units is discharged to the back of the unit by a heat radiating fan mounted on the unit, so that heat is accumulated in a specific part of the housing. The (HEAT SPOT) phenomenon is likely to occur, and this may cause a malfunction due to heat.

  Moreover, in patent document 1 and patent document 3, although the heat exchanger is provided in the housing | casing upper part and in patent document 2, it is equipped with the door body, In the case where a liquid is used for the refrigerant | coolant of a heat exchanger. The leakage of the refrigerant may cause a malfunction in the electronic device inside the housing.

In general, as a device for cooling a housing-type electronic device, a cooling device having a large heat exchanger that cools an internal electronic device by taking in outside air is known. In the case of a heat exchanger that takes in outside air, the following problems have occurred.
For example, when taking in the outside air, external dust and moisture may be taken in at the same time, so that the housed electronic device may be defective.
Moreover, since the heated air is discharged into the room where the cooling device is installed instead of taking in the outside air, it is necessary to increase the capacity of the air conditioning equipment in the room, and it is necessary to consume extra power.
In addition, since the soundproofing is not sufficient by communicating with the outside air, the operation of the cooling fan mounted on the housing or the heat dissipating fan mounted on the heat generating electronic device unit will cause severe noise, and noise will be reduced. There was a need to reduce.
In addition, when using a large heat exchanger external to the housing, an increase in installation area and an increase in power consumption for cooling have been problems.

  The present invention has been proposed in order to solve the above-described problems, and evenly cools a plurality of electronic devices housed in the housing and has a compact sealed structure. It is an object of the present invention to provide an electronic device cooling apparatus that can efficiently cool and circulate the air and prevent entry of dust and noise.

  In order to achieve the above object, an electronic device cooling apparatus according to the present invention cools a casing capable of accommodating a plurality of electronic device units and air heated by the electronic device unit as described in claim 1. An electronic device cooling apparatus comprising a heat exchanger and a circulation fan that circulates air in the housing, wherein a pair of chambers serving as air flow paths provided on two opposing side walls of the housing One chamber has a plurality of suction ports provided at predetermined intervals for sucking air heated by the electronic device unit and guiding the air into the chamber, and the other chamber is cooled by the heat exchanger. A plurality of air outlets provided at predetermined intervals for blowing out the heated air into the casing, and a heat intake port through which the heat exchanger sucks heated air, and a cold air outlet through which the cooled air is discharged And With obtaining the heat mouthpiece and the cold air port, it is constituted that the provided so as to communicate with each chamber.

According to the electronic device cooling device of the present invention having such a configuration, a plurality of suction ports and air outlets are provided in a pair of chambers provided on two opposing side walls, respectively. Thus, a plurality of electronic device units that are stacked and accommodated between the inlet and the outlet can be uniformly cooled.
In addition, the side walls of the housing are used as chambers, inlets, and outlets, and heat exchangers are provided so as to communicate with the respective chambers, thereby eliminating the need for complicated piping and the like, which is simple and efficient. An air circulation path is formed.
Thereby, in the housing | casing, while the accommodation space of the electronic device unit accommodated can fully be ensured, the housing | casing itself can be formed in a compact size.
Moreover, the circulation cycle which can circulate and cool the air inside a housing | casing with a heat exchanger, a circulation fan, a chamber, a blower outlet, and a suction inlet is formed.
Thereby, it becomes unnecessary to take in external air, and an electronic device can be protected from dust, moisture, and the like.
Moreover, the heat exchanger is integrally provided, and the installation area can be minimized.

According to another aspect of the present invention, there is provided the electronic device cooling apparatus, wherein the two side walls provided with the chamber are door bodies supported to be openable and closable by the housing, and each door body is provided. By closing, the heat inlet and the cold air outlet can be communicated with the chambers.
By adopting such a configuration, the doors that can be opened and closed are provided at the front and rear, so that maintenance management such as taking in and out of the electronic device units to be accommodated and wiring connection and inspection of each unit becomes easy.
In addition, an electronic device unit such as a server device generally includes a heat dissipation fan that discharges air heated inside the unit to the back side of the unit. Further, when the electronic device unit is housed in a housing-type cooling device having a door body, it is usual to house the electronic device unit so that the front side of the electronic device unit faces the opening side of the door body. Therefore, as in the present invention, the air flow generated by the circulation fan is provided to each electronic device by providing the air outlet and the suction port on the door body facing the front and rear of the electronic device unit with the electronic device unit interposed therebetween. Each electronic device unit can be accommodated and arranged in the housing so as not to oppose the flow of air discharged by the heat dissipating fan built in the device unit, and cold air and hot air can be circulated efficiently in the housing.

Moreover, the electronic device cooling apparatus of this invention can be set as the structure by which the said suction inlet and the said blower outlet were provided in the position which faced, as described in Claim 3.
With such a configuration, since a linear air flow is formed in the housing, the electronic device unit to be accommodated can be efficiently cooled.

Moreover, the electronic device cooling apparatus of this invention can be set as the structure by which the said suction inlet and the said blower outlet were provided in the equal space | interval, as described in Claim 4.
With such a configuration, the inside of the housing is uniformly cooled, and the electronic device unit to be accommodated can be uniformly cooled.

Moreover, the electronic device cooling apparatus of this invention can be set as the structure by which the said heat exchanger was provided in the lower part in the said housing | casing, as described in Claim 5.
By adopting such a configuration, for example, when a heat exchanger is provided in the upper part of the housing, when the liquid refrigerant used in the heat exchanger leaks, each electronic device unit to be accommodated is damaged by the leaked refrigerant. However, it is possible to protect each electronic device unit from such damage by providing it in the lower part.
In addition, in the case of a vertically long casing in which electronic device units are stacked and accommodated in the casing, the heat exchanger is not provided in the upper part but in the lower part, thereby facilitating maintenance management of the heat exchanger.

Moreover, the electronic device cooling apparatus of this invention can be set as the structure which consists of a sealing structure in which the said housing | casing cuts off external air, as described in Claim 6.
With such a configuration, since outside air does not enter, cold air is not lost, and circulation cooling can be performed efficiently inside the housing.
Further, intrusion of dust, moisture and the like can be surely eliminated, and noise from the heat dissipating fan mounted on the circulation fan and the electronic device can be cut off, thereby providing a soundproof effect.

Moreover, the electronic device cooling apparatus of this invention can be set as the structure provided with the opening-and-closing means which opens and closes the said blower outlet and the said suction inlet, as described in Claim 7. FIG.
By adopting such a configuration, when a predetermined electronic device unit is removed from a plurality of electronic device units accommodated in the casing of the electronic device cooling device, and a space that does not require cooling is formed. Can close the air outlet and the suction port corresponding to the space, or reduce the opening area, so that the space corresponding to the electronic device unit that needs to be cooled can be intensively cooled. It is possible to efficiently cool the electronic device unit in the housing.

Moreover, the electronic device cooling apparatus of this invention is provided with the temperature sensor which detects the temperature in the said housing | casing, and the control means which performs predetermined | prescribed control based on the numerical value of the said temperature sensor as described in Claim 8. It can be configured.
With this configuration, the control means operates based on the numerical value of the temperature sensor, for example, adjusting the cooling temperature of the heat exchanger or controlling the rotational speed of the motor provided in the circulation fan. It is also possible to adjust the air speed by adjusting the wind speed or by controlling the aforementioned opening / closing means. Thereby, the temperature in the housing can be automatically adjusted to suppress the temperature rise, and the temperature in the housing can be kept at an appropriate temperature.

  According to the electronic device cooling device of the present invention, a plurality of electronic devices housed in the housing can be evenly cooled, and the circulating cooling can be efficiently performed in the housing, preventing entry of dust and noise. can do.

Hereinafter, a preferred embodiment of an electronic device cooling apparatus according to the present invention will be described with reference to FIGS.
[First embodiment]
First, with reference to FIGS. 1-3, 1st embodiment of the electronic device cooling device which concerns on this invention is described.
FIG. 1 is a schematic perspective view illustrating an electronic device cooling apparatus according to the present embodiment, and FIG. 2 is a schematic perspective view illustrating a state in which a door body of the electronic apparatus cooling apparatus according to the present embodiment is opened. Further, FIG. 3 is a schematic cross-sectional view showing the air flow of the electronic device cooling apparatus according to the present embodiment.

First, the overall configuration of the electronic device cooling apparatus in the present embodiment will be described. As shown in FIG. 1, an electronic device cooling apparatus 1 according to the present embodiment includes a front door 2 and a rear door 3 that are provided to face each other, and a housing 4 that supports the doors so that they can be opened and closed. It is configured.
These materials are housed by laminating a plurality of electronic device units, which will be described later, in the housing, so that each unit can be held without shaking, and in consideration of earthquake resistance, a strong metal such as steel is used. It is formed with.

As shown in FIG. 2, a chamber 21 that is paired with a chamber 31 provided on the back side of the rear door 3 to be described later is provided on the back side of the front door 2. The chamber 21 is formed in a box shape with an open bottom surface, and a gap is provided on the inside so as to be a flow path through which air circulates.
On the bottom surface of the chamber 21, an inlet 211 is formed for taking cold air 7 cooled by a heat exchanger 41 described later into the chamber 21. The inlet 211 communicates with a cold air outlet 411 through which the cool air 7 formed in the heat exchanger 41 is discharged when the front door 2 is closed.

The chamber 21 is formed with a plurality of outlets 212 provided at equal intervals. The air outlet 212 communicates with the inside of the housing 4 to be described later when the front door 2 is closed, and the cool air 7 cooled by the heat exchanger 41 is blown into the housing 4 through the air chamber 21. It is like that.
The air outlet 212 is provided at a position opposite to a suction port 312 provided in the rear door 3 to be described later with the internal space of the housing 4 interposed therebetween, and in the vicinity of the center of the front surface of each electronic device unit 5 to be described later. It is drilled at a position where cold air can hit.

On the other hand, as shown in the figure, a chamber 31 that forms a pair with the chamber 21 of the front door 2 described above is also provided on the back side of the rear door 3. The chamber 31 is formed in a box shape with an open bottom, and a gap is provided on the inner side so as to be a flow path through which air circulates.
The chamber 31 is formed with a plurality of suction ports 312 provided at equal intervals. The suction port 312 communicates with the inside of the housing 4 when the rear door 3 is closed, and the heated hot air 6 discharged from the back of the plurality of electronic device units 5 provided in the housing 4 31 is sucked into.
The suction port 312 is provided at a position facing the air outlet 212 of the front door 2 with the internal space of the housing 4 therebetween, and a position corresponding to the vicinity of the center of the back of each electronic device unit 5 described later. Has been drilled.

  Further, the bottom surface of the chamber 31 is formed with a delivery port 311 for sending the hot air 6 sucked into the chamber 31 to a heat exchanger 41 to be described later, and heat is generated when the rear door 3 is closed. The heat exchanger 412 communicates with a heat suction port 412 for sucking hot air 6 formed in the exchanger 41.

Next, in the example shown in the figure, the housing 4 is a member formed in a box shape that supports the front door 2 and the rear door 3 described above so as to be opened and closed via a hinge (not shown).
Packing rubber 11 is provided on the surface of the housing 4 that contacts the front door 2 and the rear door 3, so that the electronic device cooling device 1 is in a sealed state that blocks outside air with each door closed. The inside of the housing 4 can be efficiently cooled without losing the cooled air. In addition, intrusion of dust and operating sounds of the circulation fan 414 and the heat radiating fan 51 described later are prevented from leaking to the outside (see FIG. 3).

Four electronic device units 5 that are heating elements are provided in the middle stage inside the casing 4, and a heat exchanger 41 that forcibly cools the inside of the casing using a refrigerant is provided in the lower stage.
The four electronic device units 5 contain a substrate on which predetermined electronic components are mounted at a high density, and hot air 6 generated inside the unit is provided on the back side from a vent hole provided on the front side of the unit. A heat radiating fan 51 for exhausting air toward the exhaust port is provided (see FIG. 3).
Each electronic device unit 5 is accommodated in the housing 4 by being inserted into a rack rail (not shown) provided inside the housing 4.

The heat exchanger 41 is provided in the lower stage of the housing 4 in consideration of failure of each electronic device unit 5 due to refrigerant leakage and ease of maintenance management.
The heat exchanger 41 is connected to an outdoor unit (not shown) installed outdoors by piping, and the hot air 6 heat-exchanged in the housing is exhausted to the outdoors via the refrigerant.
The heat exchanger 41 is provided with a heat exchanging unit 413 where heat is exchanged and a circulation fan 414 for circulating air, and takes in outside air through the cold air inlet 411 and the heat inlet 412 described above. The air inside the housing 4 can be forcedly circulated to exchange heat.

The cold air vent 411 is an opening formed on the top surface of the heat exchanger 41 on the front door 2 side, and communicates with the inlet 211 of the front door 2 described above when the front door 2 is closed. The cool air 7 cooled by the exchange unit 413 is forcibly blown out by the circulation fan 414.
On the other hand, the heat inlet 412 is an opening formed in the top surface of the heat exchanger 41 on the rear door 3 side, and communicates with the aforementioned outlet 311 of the rear door 3 when the rear door 3 is closed. The hot air 6 in the chamber 31 is forcibly sucked by the circulation fan 414.

Next, the flow of air in the electronic device cooling apparatus 1 will be described with reference to FIG.
In the example shown in the figure, the front door 2 and the rear door 3 are in a closed state, and each accommodated electronic device unit 5 is operating, and hot air 6 is generated by this operation. .
First, the hot air 6 is discharged into the housing 4 from an exhaust port (not shown) provided on the back side of the unit by the heat radiating fan 51 of each electronic device unit 5.
Next, the hot air 6 is forcibly sucked in from the suction ports 312 formed in the rear door 3 side chamber 31 by the circulation fan 414 and taken into the chamber 31.
The taken-in hot air 6 descends in the chamber 31 and is sent from the outlet 311 of the rear door 3 to the heat inlet 412 of the heat exchanger 41.
The hot air 6 sent to the heat suction port 412 is cooled by heat exchange by the heat exchange unit 413 through the circulation fan 414, becomes cold air 7, and passes from the cold air port 411 of the heat exchanger 41 to the front door 2. Are sent to the inlet 211.
The cool air 7 sent to the inlet 211 rises in the chamber 21 of the front door 2 and is blown out evenly from the outlets 212 of the front door 2 side chambers 21 toward the inside of the housing 4.
The blown-out cool air 7 strikes the front surface of each electronic device unit 5 and is sucked into the unit 5 from the vent hole (not shown) provided near the center of the front surface of each electronic device unit 5 with the assistance of the heat radiating fan 51 described above. As a result, cooling is performed including the built-in substrate and the like.

In this manner, the air outlet 212 that blows out the cold air 7 and the air inlet 312 that sucks in the hot air 6 are provided at equal intervals and in positions facing each other while sandwiching the plurality of electronic device units 5 that are heating elements. As a result, a parallel and uniform air flow is formed in the housing 4, and the air outlet 212 and the suction port 312 are provided in the front door 2 and the rear door 3. A circulation cycle using the air flow discharged by the fan 51 can be formed, and each electronic device unit 5 can be cooled efficiently and evenly.
Moreover, while using the side wall of the housing | casing 4 as the chambers 21,31, the blower outlet 212, and the suction inlet 312, providing the heat exchanger 41 so that it may connect with each chamber 21,31, it is simple and efficient. An air circulation path is formed.
Thereby, in the housing | casing 4, while the accommodation space of the electronic device unit 5 accommodated can fully be ensured, housing | casing 4 itself can be formed in a compact magnitude | size.

In addition, the air in the housing 4 can be passed through the circulation fan 414, the heat exchange unit 413, the front door 2 side chamber 21, the air outlet 212, the suction port 312, and the rear door 3 side chamber 31 without taking in outside air. A circulation cycle that can be circulated and cooled is formed, and a sealed structure using the packing rubber 11 is also added, so that the inside of the housing 4 can be efficiently cooled without loss of cold air. .
In addition, the electronic device unit 5 can be protected from dust, moisture, and the like, and since the outside air is not taken in, it is not necessary to directly discharge the heated air into the room, and the indoor air conditioning in which the electronic device cooling apparatus 1 is installed The burden on facilities and the like is reduced, and power consumption can be reduced.

As described above, according to the electronic device cooling apparatus 1 of the present embodiment, the plurality of electronic device units 5 can be appropriately cooled by uniformly cooling the plurality of electronic device units 5 accommodated in the housing 4. It can be operated under temperature environment.
In addition, since the housing 4 is formed in a compact manner, it is possible to save space, prevent problems due to leakage of the refrigerant in the heat exchanger 41, and facilitate maintenance.
Furthermore, since the housing 4 has a sealed structure, the inside of the housing 4 can be efficiently circulated and cooled without loss of cool air. Further, since the exhaust heat is not directly performed to the outside, an increase in the cost of air conditioning caused by the exhaust heat is suppressed, and intrusion of dust, dust and the like into the housing 4 is eliminated, and the circulation fan 414 and the electronic device unit 5 are eliminated. The noise of the heat radiating fan 51 can be prevented.

[Second Embodiment]
Next, a second embodiment of the electronic device cooling apparatus according to the present invention will be described with reference to FIG.
FIG. 4 is a schematic perspective view showing the inside of the electronic device cooling apparatus according to the present embodiment.
The electronic device cooling apparatus 1 according to the present embodiment shown in the figure is a modified embodiment of the first embodiment described above, and includes shutters 213 and 313 for adjusting the air volume in the housing 4, a temperature sensor 214a, and the sensor. The controller 214 is configured to control the rotational speed of the circulation fan 414 based on the numerical value of the above.
Therefore, other components are the same as those in the first embodiment, and the same components are denoted by the same reference numerals as those in the first embodiment in the drawing, and detailed description thereof is omitted.

As shown in the figure, in the present embodiment, unlike the first embodiment, the electronic device unit 5 is housed in the housing 4 with the lower two of the four units removed.
The front door 2 side chamber 21 and the rear door 3 side chamber 31 are respectively provided with shutters 213 and 313 slidable up and down so as to function as the opening / closing means according to the present invention. By sliding the shutters 213 and 313 up and down, the air outlet 212 of the front door 2 and the inlet 312 of the rear door 3 can be opened and closed, and the opening area can be adjusted. Yes.
Thereby, the blower outlet 212 of the front door 2 and the suction inlet 312 of the rear door 3 corresponding to the space where the electronic device unit 5 is not inserted can be closed, and the corresponding cool air 7 is removed from the upper two electronic device units. 5 and the cool air 7 can be circulated efficiently.

A control device 214 for controlling the rotational speed of the circulation fan 414 to which the temperature sensor 214a is attached is attached to the back surface of the front door 2 side chamber 21 and is connected to a circulation fan 414 (not shown) via an electric cable. ing.
The control device 214 is a control means according to the present invention, and is formed from a metal casing, and is provided so that the temperature sensor 214a is exposed to the outside through an opening formed in the casing. .
A control board on which predetermined electronic components such as an MPU, ROM, RAM, and I / O port are mounted is built in the housing. Then, the MPU compares and determines the temperature of the temperature sensor 214a quantified based on the input from the I / O port and the predetermined temperature recorded in the mounted ROM, thereby controlling the rotational speed of the circulation fan 414. It has a configuration.

Specifically, when the numerical value of the temperature sensor 214a exceeds a predetermined temperature, the control device 214 performs control to increase the rotational speed of the circulation fan 414, and as a result, the numerical value of the temperature sensor 214a decreases to the predetermined temperature. Then, control for returning to a predetermined number of revolutions is performed.
As a result, it is possible to control the air circulation cycle period in the housing 4, to automatically adjust the temperature in the housing 4, to suppress the temperature rise, and to adjust the temperature in the housing 4 appropriately. Temperature can be maintained.

  In this embodiment, the target to be controlled by the control device 214 is the circulation fan 414. However, a motor or the like as a driving unit for adjusting the cooling temperature of the heat exchanger 41 or sliding the shutters 213 and 313 up and down is used. It can also be controlled.

The electronic device cooling apparatus according to the present invention has been described with reference to the preferred embodiment. However, the electronic apparatus cooling apparatus according to the present invention is not limited to the above-described embodiment, and various modifications are possible within the scope of the present invention. It goes without saying that changes can be made.
For example, in the present embodiment, the chamber is formed so as to protrude from the door body, but the door body may have a double structure and the chamber may be provided inside.

  The present invention can be widely used as a device for cooling the inside of a housing in which a plurality of electronic devices and the like are accommodated.

It is a schematic perspective view which shows the electronic device cooling device which concerns on 1st embodiment of this invention. It is a schematic perspective view which shows the state which open | released the door body of the electronic device cooling device which concerns on 1st embodiment of this invention. It is a schematic sectional drawing which shows the flow of the air of the electronic device cooling device which concerns on 1st embodiment of this invention. It is a schematic perspective view which shows the inside of the electronic device cooling device which concerns on 2nd embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electronic device cooling device 2 Front door 21 Chamber 211 Inlet 212 Outlet 213 Shutter 214 Control device 214a Temperature sensor 3 Rear door 31 Chamber 311 Outlet 312 Inlet 313 Shutter 4 Housing 41 Heat exchanger 411 Cold air inlet 412 Heat inlet 413 Heat Exchanger 414 Circulation Fan 5 Electronic Device Unit 51 Heat Dissipation Fan

Claims (8)

An electronic device cooling apparatus comprising: a housing that can accommodate a plurality of electronic device units; a heat exchanger that cools air heated by the electronic device units; and a circulation fan that circulates air in the housing. And
A pair of chambers serving as air flow paths provided on two opposite side walls of the housing;
One chamber has a plurality of suction ports provided at predetermined intervals for sucking the air heated by the electronic device unit and guiding it into the chamber,
The other chamber has a plurality of outlets provided at predetermined intervals for blowing out the air cooled by the heat exchanger into the housing,
The heat exchanger is
A heat inlet for sucking heated air and a cold air outlet for discharging cooled air, and the heat inlet and the cold air outlet are provided so as to communicate with the respective chambers. Electronic equipment cooling device.   The two side walls provided with the chamber are formed of doors that are supported by the housing so as to be opened and closed. By closing the doors, the heat suction port and the cold air port are communicated with the chambers. The electronic device cooling device according to claim 1.   The electronic device cooling device according to claim 1, wherein the suction port and the air outlet are provided at opposing positions.   The electronic device cooling device according to any one of claims 1 to 3, wherein the suction port and the air outlet are provided at equal intervals.   The electronic device cooling device according to any one of claims 1 to 4, wherein the heat exchanger is provided at a lower portion in the housing.   The electronic device cooling apparatus according to any one of claims 1 to 5, wherein the casing is formed of a sealed structure that blocks outside air.   The electronic device cooling device according to any one of claims 1 to 6, further comprising an opening / closing means for opening and closing the air outlet and the suction port.   The electronic device cooling apparatus according to claim 1, further comprising: a temperature sensor that detects a temperature in the housing; and a control unit that performs predetermined control based on a numerical value of the temperature sensor.

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