JP2008172137A - Positioning apparatus and photolithography machine - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a positioning apparatus in which the deformation of the top caused by the force of the electromagnetic coupling is suppressed. <P>SOLUTION: The positioning apparatus of the present invention comprises: a first stage 202 for placing an object to be positioned thereon; a second stage 206 for placing the first stage thereon and transporting it; and an actuator 204 for driving the first stage relative to the second stage, wherein the first stage has a hollow structure and comprises a first rib 213 having a rectangle-shaped cross sections along the direction of the force generated by the actuator 204 and along the direction perpendicular to the above direction and constituting a side plate of the first stage; a second rib 211 joined with the first rib at angles therewith and having a lozenge-shaped cross section; and further in the above hollow structure, a third rib 212 running in a direction substantially parallel to the direction of the force generated by the actuator 204 and passing through a point to which the force is applied. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a positioning apparatus for positioning a substrate such as a semiconductor wafer, a mask, or a reticle in a projection exposure apparatus, various precision processing apparatuses, or various precision measurement apparatuses.

The semiconductor exposure apparatus includes a positioning device for positioning the wafer. FIG. 13 is a diagram showing a positioning device described in Patent Document 1. As shown in FIG. 13 includes a chuck 1 for holding a wafer W, a top plate 2 on which the chuck 1 is mounted, a stage 51a on which the top plate 2 is mounted and moved in a long stroke.
Between the top plate 2 and the stage 51a, linear motors LMZ and LMY for controlling the positioning of the top plate 2 with six degrees of freedom and the acceleration / deceleration force when the stage 51a moves in the XY direction are transmitted to the top plate. An electromagnetic coupling 4 is provided.
The top plate 2 has a hollow structure, and the inside is reinforced by ribs. With such a configuration, the natural frequency is improved and the positioning characteristic of the control system is enhanced.

FIG. 14 is a view showing a rib structure of the top plate described in Patent Document 1. As shown in FIG. The rib structure has a configuration in which ribs R1a and R1b having a quadrangular cross section along the XY direction of the wafer W and ribs R2a and R2b having a rhombic cross section joined at an angle to the ribs R1a and R1b are alternately inserted. It has become.
JP 2003-163257 A JP 2005-243751 A JP-A-2005-297109

In the conventional positioning device, the top plate may be deformed by the force of the electromagnetic coupling. In order to suppress such deformation, Patent Document 1 discloses that the top plate portion to which the movable part of the electromagnetic coupling is attached has a hollow structure.
However, the influence of deformation cannot be sufficiently suppressed only by making the top plate have a hollow structure. This is because when a force is applied to the side plate of the hollow top plate, the rigidity against deformation at that portion is lowered, which causes deformation of the entire top plate. In particular, as described in Patent Document 2, in the case where the electromagnetic coupling is provided on the side surface of the top plate, the top plate is greatly deformed by applying a large force to the side plate. If the side plate is thickened to reduce this deformation, the lightness that is the merit of the hollow top plate is impaired. Further, the deformation of the top plate also affects the position measuring means provided on the top plate, which causes the positioning accuracy to deteriorate.
The present invention has been made in consideration of the above-described points, and an object thereof is to suppress the deformation of the top plate caused by the force of the electromagnetic coupling.

  In order to achieve the above object, a positioning apparatus of the present invention includes a first stage on which a positioning object is mounted, a second stage on which the first stage is mounted and moved, and a first stage relative to the second stage. And an actuator for driving. Further, the first stage has a hollow structure, and the first stage is provided with a rib in the hollow interior that is substantially parallel to the direction of the force generated by the actuator and passes through the portion where the force is applied.

  According to the present invention, the following ribs are arranged on the top plate of an integral hollow structure that most affects the accuracy of the structural members of the stage. Specifically, this rib has a range corresponding to the back side of the surface where the electromagnetic coupling is attached on the side plate of the top plate and a range corresponding to the back side of the side plate having the electromagnetic coupling existing on the opposite side. These ribs are linearly coupled in parallel to the direction of the force applied to the electromagnetic coupling. As a result, a highly rigid and lightweight top plate that suppresses deformation during acceleration / deceleration motion can be realized, and highly accurate positioning can be performed.

The positioning apparatus according to the embodiment of the present invention will be described in detail with reference to the drawings, with reference to the accompanying drawings. Examples in the case where the positioning target is a wafer as a photosensitive substrate or a reticle as an original having a photosensitive pattern.
[Example 1]
FIG. 1A is a schematic cross-sectional view of a fine movement stage showing the top plate and its periphery constituting the positioning device according to the first embodiment of the present invention, and FIG. It is a schematic sectional drawing.

  This positioning apparatus includes a top plate 202 (first stage) on which a wafer (positioning target) is mounted, an XY slider 206 (second stage) on which the top plate 202 is mounted and moved, and a top plate 202 with respect to the XY slider 206. And an actuator 204 for driving the plate 202. The top plate 202 has a hollow structure. The top plate 202 includes an outer peripheral side plate 213 having a quadrangular cross section along the direction of the force generated by the actuator 204 and a direction perpendicular thereto, and a symmetrical rib 211 having a rhombic cross section joined to the outer peripheral side plate 213 at an angle. Is provided. The top plate 202 further includes a lattice rib 212 in the hollow interior that is substantially parallel to the direction of the force generated by the actuator 204 and passes through the portion where the force is applied.

  This positioning device also includes an electromagnetic coupling 204 and a self-weight compensation mechanism 205. Also, an X-direction fine movement linear motor 208, a Y-direction fine movement linear motor 209, and a Z-direction fine movement linear motor 210 for finely adjusting the position of the top plate 202 and the like are provided on an XY slider (not shown). Configured.

  On the top surface of the top plate 202, there is a wafer chuck 201 for mounting a wafer which is a photosensitive substrate. The chuck 201 is fixed to the top plate 202 by vacuum air or mechanical clamp (not shown). The wafer is also clamped to the chuck 201 by vacuum air or electrostatic force (not shown). Further, a mirror 203 is provided to measure the position of the wafer. Although only one mirror 203 is shown in FIG. 1A, a plurality of mirrors 203 exist so that six degrees of freedom can be measured.

As shown in FIG. 1A, the top plate 202 includes an electromagnetic actuator for moving the wafer to a predetermined position on the lower surface with six degrees of freedom, and a mechanism for supporting the gravity direction of the top plate 202. Yes. There are two types of electromagnetic actuators.
One is a fine movement linear motor as a Lorentz force actuator for controlling six degrees of freedom. The fine movement linear motor has a short stroke and is placed on an XY slider upper plate 206 that can move for a long stroke.

  The fine movement linear motor includes an X-direction fine movement linear motor 208, a Y-direction fine movement linear motor 209, and a Z-direction fine movement linear motor 210. The mover magnets 208a, 209a, 210a, the stator coils 208b, 209b, 210b, and the magnet mounting plate, respectively. 208c, 209c, and 210c. As shown in FIGS. 1A and 1B, the mover magnets 208a, 209a, and 210a of each linear motor are attached to magnet attachment plates 208c, 209c, and 210c, and the stator coils 208b, 209b, and 210b are attached to XY. It is provided on the slider upper plate 6. There are two fine movement linear motors 209 in the Y direction on the X axis and two fine movement linear motors 208 in the Y direction on the Y axis. The yawing direction is controlled by either the Y direction fine movement linear motor 209 or the X direction fine movement linear motor 208. This is done by either linear motor.

  The other is an electromagnetic coupling 204 that transmits an acceleration force generated by a long stroke actuator of a coarse movement movable unit (not shown) to a fine movement movable unit including the top plate 202. Since the electromagnetic coupling 204 generates only a force in the attractive force direction in one unit, as shown in FIG. 1B, two electromagnetic couplings 204 are arranged opposite to each other in the X direction and the Y direction. In the electromagnetic coupling 204, the fixed side 204b is disposed on the XY slider upper plate 206, and the movable side 204a is disposed on the four side surfaces around the side plate 213 of the top plate. At this time, the movable side 204a and the side plate 213 are attached with high surface accuracy over the entire contact surface. Further, when the fine movement movable unit positions the wafer in the rotation direction, the opposing surfaces of the electromagnetic coupling 204 are also cylindrical so that they do not interfere around the Z axis. The centers of the arcs of the opposing surfaces of the unit composed of the four electromagnetic couplings 204 are all the same. From the viewpoint of machining accuracy, it is desirable that the radius of the arc is the same. It is desirable that the center of the arc in the XY plane is as equal as possible to the center of gravity G of the finely movable portion including the top plate 202.

  A self-weight compensation mechanism 205 is further provided on the lower surface of the top plate 202. The self-weight compensation mechanism 205 is configured such that the generated force is substantially equal to the weight of the fine movement movable portion. The force residual is due to a change in the force generated from the self-weight compensation mechanism 205 depending on the vertical position of the top plate 202. This force residual is completely removed by the fine movement linear motor 210 in the Z direction. When the self-weight compensation mechanism 205 is coaxial with the Z-direction fine movement linear motor 210, the self-weight compensation mechanism 205 does not give the top plate 202 a force residual that cannot be completely removed by the self-weight compensation mechanism 205.

  In FIG. 1B, in order to transmit the acceleration force from the coarse moving part to the fine moving part, suction is performed from the fixed side 204b of the electromagnetic coupling to one of the surfaces corresponding to the arc portion of the moving side 204a of the electromagnetic coupling. Electromagnetic force is generated in the direction that is generated. Therefore, when the top plate 202 is accelerated or decelerated, rigidity is particularly required around the side plate of the mounting portion of the movable side 204a of the electromagnetic coupling.

  Therefore, in the rib structure of this example, the range corresponding to the back side of the side plate surface with any one of the electromagnetic couplings and the range corresponding to the back side of the surface with the electromagnetic couplings on the side plate on the opposite side are A rib configuration 212 is provided that is parallel to the direction of the force generated in the joint 204 and is linearly coupled. This makes it possible to make a top plate having high rigidity against deformation during acceleration.

  Further, the following configuration is also conceivable as a modification of the present embodiment. Depending on the elements to be mounted and the configuration around the top plate, the top plate 202 may preferably have a configuration in which the central portion of the bottom surface of the top plate is convex downward and has a hollow structure. FIG. 2A is a cross-sectional view of the fine movement stage according to this embodiment, and FIG. 2B is a view of the fine movement stage as viewed from below the aa cross section.

In this modification, the self-weight compensation mechanism 205 and the fine movement linear motors 208, 209, and 210 are disposed outside the central side plate 213 as shown in FIG. In the electromagnetic coupling 204, the fixed side 204b is disposed on the XY slider upper plate 6, and the movable side 204a is disposed on the four side surfaces around the convex side plate 213 at the center of the top plate. In such a configuration, by providing the rib configuration 212 inside the hollow structure at the center, similarly, a top plate having high rigidity against deformation when a force is generated and accelerated in the electromagnetic coupling 204 is made. Is possible.
In addition, although the number of the rib configurations 212 in this embodiment and the modification is illustrated as two, the range corresponding to the back side of the side plate surface with any one electromagnetic coupling and the opposite side The number of the side plates is not limited as long as it is within the range corresponding to the back side of the surface with the electromagnetic coupling.

[Example 2]
In Example 1, the electromagnetic coupling 204a shown in FIG. 1 (b) has surface accuracy over the entire mounting surface of the mounting side of the convex side plate 213 at the center of the side surface of the top plate and the movable side 204a of the electromagnetic coupling. An example is shown where it is installed. In order to attach the movable side of the electromagnetic coupling to the side plate of the top plate in this way, the surface accuracy of both must be obtained with high accuracy, but in practice, a wide range of surfaces are processed over the entire surface to obtain surface accuracy. However, there is a problem that the mounting accuracy is not good. For this reason, in this embodiment, an embodiment will be described in which the problem is solved by increasing the surface accuracy of a surface in a narrow area where surface accuracy is easily obtained.

FIGS. 3A and 3B show details of a mounting portion between the movable side of the electromagnetic coupling and the side plate of the top plate. FIG. 4 is an overview of the entire top plate of FIGS. 3 (a) and 3 (b).
As shown in FIG. 3 (a), the side plate 302 of the top plate is provided with a slightly raised bank 303 in a convex shape having a surface accuracy in a narrow area to secure a mounting surface, and an electromagnetic coupling is provided on the upper surface of the bank. The attachment surface of the movable side 301 is attached in contact. Accordingly, when the electromagnetic force 304 is generated on the arc surface of the movable side 301 of the electromagnetic coupling as shown in FIG. 3B, the movable side 301 of the electromagnetic coupling is joined only to the side plate of the top plate by the bank. Therefore, the force corresponding to the electromagnetic force is concentrated on the contact surface 305 of the bank. Therefore, when the rib of the present invention is applied to the hollow top plate in FIGS. 3A and 3B, it is as shown in FIG. Parallel to the direction of the force 304 generated on the movable side 301 of the electromagnetic coupling, the starting point of the rib starts from the portion corresponding to the back surface of the contact surface 305 where the force is generated, and the portion corresponding to the back surface of the bank on the opposite side plate The rib 306 is disposed so that both are linearly joined. In this way, by accurately disposing the rib at the place where the force is generated, the rigidity can be increased and the deformation of the entire top plate can be suppressed.
In addition, although the said rib 306 and the bank 303 in a present Example are shown in figure 2 each, it is a range equivalent to the back side of the side plate surface with any one electromagnetic coupling, and the side plate on the opposite side. The number is not limited as long as it is within the range corresponding to the back side of the surface with the electromagnetic coupling.

Embodiment 3 FIG. 5 is a schematic perspective view showing a reticle stage according to a third embodiment of the present invention, and FIGS. 6 and 7 are plan views of the reticle stage shown in FIG. FIG. 6 (a) is a coarse movement unit, FIG. 6 (b) is a fine movement unit, and FIG. 7 (a) is a detailed view of the interior of the top plate showing the present embodiment. An exposure apparatus using this reticle stage is a light source with a short wavelength, such as EUV, which uses a reflective mirror instead of a lens, and has an upside-down configuration.

  In the stage of this embodiment, a slider surface plate 502 is mounted on the center of the base surface plate 501, and a Y surface plate 503 is mounted on the left and right sides thereof. A Y-foot 505 is mounted on the slider base plate 502 on the left and right sides, and is guided in the Z direction (vertical direction) by a static pressure air bearing (not shown) with respect to the slider base plate 502. 507 is provided. As shown in FIG. 6A, the Y foot 505 is provided with an E-shaped electromagnet 506 having a coil, and in a non-contact manner in the X direction with respect to the magnetic body plate 504 disposed at the center of the slider surface plate 502. Guided. Further, it is moved in the Y direction by a driving force between the movable magnet 507 and the linear motor stator 508 mounted on the Y surface plate 503. A fine movement fixing plate 509 is placed on the Y foot 505, and a reticle top plate 611 is placed on the fine movement fixing plate 509 via a six-axis fine movement linear motor 610 to constitute a reticle stage. A self-weight support spring (not shown) is provided between fine movement fixing plate 509 and reticle top plate 611 to support the self-weight of reticle top plate 611.

  The fine movement linear motor 610 is disposed on the fine movement fixing plate 509 outside the reticle top plate 511 having a hollow structure. As shown in FIG. 6B, stators 610Xa, 610Ya, and 610Za having coils (not shown) are mounted on the fine movement fixing plate 509, and movers 610Xb, 610Yb, and 610Zb having magnets are mounted on the reticle top plate 611. 610Xa and 610Xb generate thrust in the X direction, 610Ya and 610Yb generate thrust in the Y direction, and 610Za and 610Zb generate thrust in the Z direction.

  A magnetic body 614 is attached to the opposite side surface of the reticle top plate 611 in the Y direction via an attachment plate 615, and an E-shaped electromagnet 612 having a coil is provided on the fine movement fixing plate 509 with a predetermined gap in the magnetic body 614. It is arranged via the mounting plate 613 so as to face each other. When an electric current is passed through the coil of the E-shaped electromagnet 612 by making the E-shaped electromagnet 612 and the magnetic body 614 face each other, an attractive force is generated between the two and functions as an electromagnetic coupling. That is, in order to transmit the acceleration force generated in the Y foot 505 and the fine movement fixed plate 509 to the reticle top plate 611 by the thrust between the coarse movement linear motor stator 508 and the movable magnet 507, the E-shaped electromagnet 612 and the magnetic A suction force is generated between the body 614 and the body 614. Thus, a fine linear motor 610 is not burdened during acceleration / deceleration. It is preferable that the suction force action line passes through the center of gravity position of the reticle top plate 611 and the entire linear motor attached thereto.

A detailed view of the inside of the top plate 611 to which this embodiment is applied is shown in FIG.
The reticle top plate is provided with a linear motor 610 for fine movement, and thrust is generated in the X direction by the mover 610Xa and the stator 610Xb and in the Y direction by the mover 610Ya and the stator 610Yb as shown in FIG. . Therefore, in addition to the diamond-shaped ribs 617 for increasing the eigenvalue for the torsion mode, the following ribs are provided in this embodiment. That is, a side plate surface that is parallel to and opposite to the direction in which the thrust is applied (X direction), starting from the portion corresponding to the back surface of the side surface of the top plate to which the mover 610Xa of the fine movement linear motor that generates thrust in the X direction of the reticle top plate is attached. The ribs 620 connect the two. Similarly, the side plate surface parallel to and opposing the direction in which the thrust is applied (Y direction) starts from the portion corresponding to the back surface of the side surface of the top plate to which the mover 610Ya of the fine movement linear motor that generates thrust in the Y direction is attached. Ribs 618 are provided to connect the two. As a result, it is possible to increase the rigidity against the deformation of the reticle top plate when the force from the fine movement linear motor is generated.

In addition, the reticle top plate has a configuration in which a magnetic body 614 serving as an electromagnetic coupling is attached via a mounting plate to the opposite side surface in the Y direction among the four side surfaces of the periphery, and is accelerated in a uniaxial direction. . Therefore, an acceleration force is generated in the fine movement fixing plate 609, and in order to transmit the acceleration force to the top plate, a force is applied to the vicinity of the side plate with the magnetic plate mounting plate 615 by the attractive force from the E-shaped electromagnet 612. For this reason, the rigidity of the reticle top plate must be increased. FIG. 7B shows a rib configuration in the present embodiment for realizing this. In addition to the ribs 618 and 620, a range corresponding to the back surface of the magnetic attachment plate inside the hollow of the top plate and a range corresponding to the back surface of the magnetic attachment plate existing on the opposite side A rib 619 is provided in parallel to the direction of the attractive force from the mold electromagnet 612 (Y direction) and linearly coupled. As a result, the rigidity of the top plate during acceleration / deceleration can be increased.
Although the number of the ribs 619 in the present embodiment is shown as two, the range corresponding to the back surface of the mounting plate of the magnetic body inside the hollow of the top plate and the mounting of the magnetic body existing on the opposite side The number is not limited as long as it is within the range corresponding to the back surface of the plate.

[Example 4]
FIG. 8A is a schematic plan view of the fine movement portion of the reticle stage according to the fourth embodiment of the present invention as viewed from above. FIG. 8B is a schematic diagram showing the internal configuration of the reticle top plate 711 of this embodiment. This embodiment is an example of an exposure apparatus in which a lens such as KrF or ArF can be used as a light source. A hole is formed in the center of fine movement fixed plate 719 and reticle top plate 711 so that exposure light can pass through. , It has become a top-and-bottom configuration. The reticle top plate 711 includes an X-direction fine movement linear motor, a Y-direction fine movement linear motor, and a Z-direction fine movement linear motor (not shown) that apply thrust in the X direction, the Y direction, and the Z direction, respectively.

As shown in FIG. 8A, the reticle top plate 711 with a hole has an E-shape generated in the magnetic body 714 during acceleration / deceleration when the E-shaped electromagnet 712 and the magnetic body 714 are arranged at the center of the opposite side in the Y direction. The reticle top plate 711 is deformed as indicated by a broken line in the figure by the attractive force from the mold electromagnet 712. Therefore, it is necessary to provide a rib that alleviates deformation due to this suction force. Therefore, when the rib structure of the present invention is applied, as shown in FIG. 8 (b), in addition to the conventional rhombus rib 717, the back surface of the mounting plate 715 of the magnetic body 714 is used as a starting point to the position of the hole in the center. And a rib 716 parallel to the direction in which the suction force is generated (Y direction). This makes it possible to increase the rigidity of the reticle top plate with holes against deformation during acceleration.
Although the number of the ribs 716 in this embodiment is shown as two, the range corresponding to the back surface of the magnetic material mounting plate inside the hollow of the top plate and the attachment of the magnetic material existing on the opposite side The number is not limited as long as it is within the range corresponding to the back surface of the plate.

[Example 5]
An example in which the present invention is applied to a reticle top plate with holes as shown in FIG. However, in actuality, when the E-shaped electromagnet 712 and the magnetic body 714 are disposed at positions facing the central hole, the magnetic body 714 generates an attractive force from the E-shaped electromagnet 712. At that time, since the rigidity is weakened in the hole portion in the central portion, the magnetic body 814 is arranged at two right and left positions where the rigidity of the opposite side of the reticle top plate 811 is high as shown in FIG. 9A. In addition, the E-shaped electromagnet 812 is arranged on the fine movement fixing plate 819 so as to oppose it.

  The fine movement fixing plate 819 also has a large hole in the center, and the E-shaped electromagnet 812 is arranged at a position with high rigidity. The E-shaped electromagnet 812 is attached to the fine movement fixing plate 819 via the attachment plate 813, and the magnetic body 814 is attached to the side surface of the reticle top plate 811 via the attachment plate 815. The action lines of the two pairs of electromagnetic couplings are preferably located symmetrically with respect to the position of the center of gravity of the reticle top plate 811 and the members mounted thereon.

Here, FIG. 9B shows a detailed cross-sectional view of the hollow interior of the reticle top plate of FIG. 9A representing this embodiment.
A diamond-shaped rib 831 for increasing the eigenvalue with respect to the torsion mode is arranged inside the hollow. However, when the attractive force of the electromagnetic coupling is applied to the magnetic body, the magnetic body mounting portion is applied with force, so that the rib is reinforced. There is a need. Therefore, the range corresponding to the back surface of the magnetic plate mounting surface and the range corresponding to the back surface of the mounting plate of the magnetic plate existing on the opposite side are determined by the direction of the attractive force from the E-shaped electromagnet 812 (Y direction). ), The top plate can be made rigid.
The number of the ribs 832 in the present embodiment is shown two for each magnetic body, but on the opposite side to the range corresponding to the back surface of the mounting plate of the magnetic body inside the hollow of the top plate. As long as it is within a range corresponding to the back surface of the existing magnetic material mounting plate, the number thereof is not limited.

  According to the above-described embodiment, the following ribs are arranged in addition to the conventional diamond-shaped ribs on the top plate having an integral hollow structure that most affects the accuracy of the structural members of the stage. Specifically, the range corresponding to the back side of the surface where the electromagnetic coupling is applied on the side plate of the top plate and the range corresponding to the back side of the side plate having the electromagnetic coupling existing on the opposite side are It is a rib that is linearly coupled parallel to the direction of the force applied to the joint. As a result, a highly rigid and lightweight top plate that suppresses deformation during acceleration / deceleration motion can be realized, and highly accurate positioning can be performed.

[Example 6]
Hereinafter, an exemplary exposure apparatus to which the positioning apparatus of the present invention is applied will be described. As shown in FIG. 10, the exposure apparatus includes an illumination device 101, a reticle stage 102 on which a reticle is mounted, a projection optical system 103, and a wafer stage 104 on which a wafer is mounted. The exposure apparatus projects and exposes a circuit pattern formed on a reticle onto a wafer, and may be a step-and-repeat projection exposure method or a step-and-scan projection exposure method.

The illumination device 101 illuminates a reticle on which a circuit pattern is formed, and includes a light source unit and an illumination optical system. The light source unit uses, for example, a laser as a light source. As the laser, an ArF excimer laser with a wavelength of about 193 nm, a KrF excimer laser with a wavelength of about 248 nm, an F ₂ excimer laser with a wavelength of about 153 nm, or the like can be used. However, the type of laser is not limited to the excimer laser, and for example, a YAG laser may be used, and the number of lasers is not limited. When a laser is used as the light source, it is preferable to use a light beam shaping optical system that shapes the parallel light beam from the laser light source into a desired beam shape and an incoherent optical system that makes the coherent laser light beam incoherent. The light source that can be used in the light source unit is not limited to a laser, and one or a plurality of lamps such as a mercury lamp and a xenon lamp can be used.
The illumination optical system is an optical system that illuminates the mask, and includes a lens, a mirror, a light integrator, a diaphragm, and the like.

As the projection optical system 103, an optical system composed only of a plurality of lens elements or an optical system (catadioptric optical system) having a plurality of lens elements and at least one concave mirror can be used. An optical system having a plurality of lens elements and at least one diffractive optical element such as a kinoform, an all-mirror optical system, or the like can also be used.
The reticle stage 102 and the wafer stage 104 can be moved by, for example, a linear motor. In the case of the step-and-scan projection exposure method, each stage moves synchronously. In addition, an actuator is separately provided on at least one of the wafer stage and the reticle stage in order to align the reticle pattern on the wafer.
Such an exposure apparatus can be used for manufacturing a semiconductor device such as a semiconductor integrated circuit or a device on which a fine pattern such as a micromachine or a thin film magnetic head is formed.

[Example 7]
Next, an embodiment of a device manufacturing method using the above-described exposure apparatus will be described with reference to FIGS. FIG. 11 is a flowchart for explaining how to fabricate devices (ie, semiconductor chips such as IC and LSI, LCDs, CCDs, etc.). Here, a semiconductor chip manufacturing method will be described as an example.
In step S1 (circuit design), a semiconductor device circuit is designed. In step S2 (mask production), a mask is produced based on the designed circuit pattern. In step S3 (wafer manufacture), a wafer is manufactured using a material such as silicon. Step S4 (wafer process) is called a pre-process, and an actual circuit is formed on the wafer by using the mask and the wafer by the above-described exposure apparatus using the lithography technique. Step S5 (assembly) is called a post-process, and is a process for forming a semiconductor chip using the wafer manufactured in step S4. The assembly process includes an assembly process (dicing, bonding), a packaging process (chip encapsulation), and the like. including. In step S6 (inspection), inspections such as an operation check test and a durability test of the semiconductor device manufactured in step S5 are performed. Through these steps, the semiconductor device is completed and shipped (step S7).

  FIG. 12 is a detailed flowchart of the wafer process in Step 4. In step S11 (oxidation), the surface of the wafer is oxidized. In step S12 (CVD), an insulating film is formed on the surface of the wafer. In step S13 (electrode formation), an electrode is formed on the wafer by vapor deposition. In step S14 (ion implantation), ions are implanted into the wafer. In step S15 (resist process), a photosensitive agent is applied to the wafer. In step S16 (exposure), the circuit pattern of the mask is exposed on the wafer by the exposure apparatus. In step S17 (development), the exposed wafer is developed. In step S18 (etching), portions other than the developed resist image are removed. In step S19 (resist stripping), the resist that has become unnecessary after the etching is removed. By repeatedly performing these steps, multiple circuit patterns are formed on the wafer.

(A) is schematic sectional drawing of the fine movement stage containing the top plate based on 1st Example of this invention, (b) is sectional drawing seen from the lower surface (aa cross section) of the fine movement stage of (a). 1A is a schematic cross-sectional view of a fine movement stage including a top plate having a pattern different from that of FIG. 1 showing a modification of FIG. 1, and FIG. 2B is a cross-section as viewed from the lower surface (a-a cross section) of the fine movement stage of FIG. FIG. (A) is a schematic top view which shows the relationship between the top plate rib and electromagnetic coupling which concern on 2nd Example of this invention, (b) is the schematic which shows the positional relationship of the top plate rib, electromagnetic coupling, and side plate part of (a). It is a top view. It is a schematic plan view which shows the structure of the top-plate rib of FIG. 3, an electromagnetic coupling, and a side-plate part. It is a schematic perspective view which shows the reticle stage applied to the semiconductor exposure apparatus based on 3rd Example of this invention. (A) is a schematic plan view showing a coarse movement part in an exploded plan view of the reticle stage of FIG. 5, and (b) is a schematic plan view showing a fine movement part of the reticle stage of (a). (A) is a schematic top view of the reticle stage of FIG. 5, (b) is a schematic plan view which supplements the structure of the reticle stage of (a). (A) is a top view of the reticle top plate based on 4th Example of this invention, (b) is a schematic sectional drawing which shows the rib structure for not making the deformation | transformation shown by a dotted line to (a). (A) is a schematic top view which shows the fine movement part of the reticle stage applied to the semiconductor exposure apparatus based on 5th Example of this invention, (b) is a schematic sectional drawing which shows the rib structure of (a). It is a figure for demonstrating an example of the exposure apparatus with which this invention is applied. It is a flowchart for demonstrating manufacture of the device using an exposure apparatus. 12 is a detailed flowchart of the wafer process in Step 4 shown in the flowchart of FIG. 11. (A) is a schematic sectional view of a fine movement base of a semiconductor exposure apparatus according to a conventional example, and (b) is a sectional view seen from the lower surface of a fine movement stage including a top plate in the exposure apparatus of (a). It is a general-view figure of the wafer stage of the semiconductor exposure apparatus used conventionally.

Explanation of symbols

201: Chuck 202: Top plate 203: Mirror 204: Electromagnetic coupling (204a: movable side, 204b: fixed side)
205: Self-weight compensation mechanism 206: XY slider upper plate 208: X linear motor (208a: mover magnet, 208b: stator coil, 208c: magnet mounting plate)
209: Y linear motor (209a: mover magnet, 209b: stator coil, 209c: magnet mounting plate)
210: Z linear motor (210a: mover magnet, 210b: stator coil, 210c: magnet mounting plate)
211, 617, 717, 831: Symmetric ribs 212, 306, 616, 618, 619, 620, 716, 832: Lattice ribs 213: Outer peripheral plate 217, 304: Electromagnetic force 301: Electromagnetic coupling 302: Outer peripheral plate 303: Bank portion 305: Mounting portion 501: Base surface plate 502: Slider surface plate 503: Y surface plate 504: Magnetic body plate 505: Y foot 506: E-shaped electromagnet 507: Movable magnet 508: Linear motor stator 509, 609, 719, 819: Fine movement fixing plate 610: Fine movement linear motor (610Xa: X direction fine movement linear motor mover, 610Xb: X direction fine movement linear motor stator)
611, 711, 811: Reticle top plate 612, 712, 812: E-shaped electromagnet 613, 713, 813: E-shaped electromagnet mounting plate 614, 714, 814: Magnetic body 615, 715, 815: Magnetic body mounting plate

Claims (10)

A first stage for mounting a positioning object; a second stage for mounting and moving the first stage; and an actuator for driving the first stage relative to the second stage;
The first stage has a hollow structure,
The positioning apparatus according to claim 1, wherein the first stage includes a rib in the hollow interior that is substantially parallel to a direction of the force generated by the actuator and passes through the portion where the force is applied.   The positioning device according to claim 1, wherein the actuator applies a force to a side surface of the first stage.   The positioning device according to claim 1, wherein the actuator includes a pair of electromagnets arranged so as to sandwich the first stage before and after the moving direction.   The positioning device according to claim 3, wherein the electromagnet generates a force during acceleration / deceleration of the second stage.   5. The positioning device according to claim 1, wherein the line of action of the force of the actuator passes through the center of gravity of the movable part including the second table.   6. The positioning device according to claim 1, wherein the rib is arranged so as to connect a pair of opposing side surfaces of the side surfaces of the first stage.   The positioning device according to claim 1, wherein two ribs are provided.   An exposure apparatus for exposing a pattern of an original to a substrate, wherein the exposure apparatus positions at least one of the original and the substrate using the positioning apparatus according to any one of claims 1 to 7. .   9. The exposure apparatus according to claim 8, wherein an opening for allowing exposure light to pass through is provided in the first stage, and each of the ribs is configured to avoid the opening.   10. A device manufacturing method comprising a step of exposing a substrate using the exposure apparatus according to claim 8 or 9.

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