JP2008164885A - Photosensitive resin composition - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which can form fine patterns without missing even on a transparent electric conductive film of ITO (indium-tin oxide) or the like, and form a pattern or a coated film excellent in solvent and heat resistance and can resolve even finer patterns. <P>SOLUTION: This photosensitive resin composition contains a binder resin (A), a photopolymerizable compound (B), a photopolymerization initiator (C), and a solvent (D). The binder resin (A) is a copolymer of unsaturated carboxylic acid and/or unsaturated carboxylic anhydride (A1), a monomer having an aliphatic multi-ring epoxy group (A2), and a monomer which can be copolymerized with (A1) and (A2) (excepting (A1) and (A2)) (A3). The photopolymerizable compound (B) contains a compound whose unsaturated double bond equivalent is 120-400 g/eq. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a photosensitive resin composition.

  The present invention relates to a photosensitive resin composition. More specifically, a material for forming a transparent film constituting a part of the color filter, for example, an overcoat, a photo spacer, an insulating film, a liquid crystal alignment control protrusion, a coat layer for adjusting the thickness of the colored pattern, etc. The present invention relates to a photosensitive resin composition suitable for forming a transparent film, a color filter comprising the transparent film, and a display device comprising the color filter.

A spacer is provided between the color filter constituting the display device, such as a liquid crystal display device or a touch panel, and the array substrate in order to keep the distance between the two substrates. Conventionally, spherical particles such as glass beads and plastic beads are used for this spacer.
However, when such spherical particles are used, the spherical particles are randomly distributed on the glass substrate, resulting in damage to TFT elements and electrodes, or when the spherical particles are present in the transmissive pixel portion, the incident light In some cases, the contrast of the liquid crystal display element may be reduced due to the scattering of light. Therefore, it has been proposed to form spacers with a photosensitive resin instead of using spherical particles. According to this method, since the spacer can be formed at an arbitrary place, the above-mentioned problems can be solved.
As such a photosensitive resin, a spacer-forming composition containing an acrylic copolymer having a carboxyl group and a glycidyl ether group as a binder resin is known (Patent Document 1), and after development in the spacer forming step. During post-baking, an epoxy group derived from a glycidyl ether group and a carboxyl group are crosslinked, and a spacer pattern having excellent solvent resistance and heat resistance can be obtained.

JP-A-11-133600, page 2, left column, line 2-page 2, left column, line 9

When forming a spacer pattern using a photosensitive resin composition, it is usually formed on a transparent conductive film such as ITO (indium-tin oxide). It was found that there was a problem that the pattern was missing.
Therefore, an object of the present invention is to form a pattern or coating film that can be formed on a transparent conductive film such as ITO (indium-tin oxide) without loss of a fine pattern and has excellent solvent resistance and heat resistance. It is an object of the present invention to provide a photosensitive resin composition that can be formed and can be resolved to a finer pattern.

As a result of intensive studies on new means that can solve the above-mentioned problems, the present inventor has found that the photosensitive resin composition of the present invention can solve the above-mentioned problems, leading to the present invention.
That is, the present invention relates to a photosensitive resin composition containing a binder resin (A), a photopolymerizable compound (B), a photopolymerization initiator (C) and a solvent (D), wherein the binder resin (A) is unsaturated. Carboxylic acid and / or unsaturated carboxylic acid anhydride (A1), monomer having aliphatic polycyclic epoxy group (A2), and monomer copolymerizable with (A1) and (A2) (provided that (Excluding (A1) and (A2).) A copolymer with (A3), and the photopolymerizable compound (B) contains a compound having an unsaturated double bond equivalent of 120 to 400 g / eq. Provided is a photosensitive resin composition which is a photopolymerizable compound (B).

[In Formula (BA), R ^{a to} R ^f each independently represent a hydrogen atom or any group represented by Formulas (BA-1) to (BA-3).

However, at least four groups of R ^{a to} R ^f are any groups represented by formulas (BA-1) to (BA-3), and at least one group of R ^{a to} R ^f is represented by the formula ( Group represented by formula (BA-2) or formula (BA-3). ]

  Furthermore, the present invention provides a pattern formed using the photosensitive resin composition and a display device including the pattern.

  The photosensitive resin composition of the present invention can be formed on a transparent conductive film such as ITO (indium-tin oxide) without loss of a fine pattern, and has a pattern and coating excellent in solvent resistance and heat resistance. A film can be formed.

  Hereinafter, the present invention will be described in detail.

  The photosensitive resin composition of the present invention is mainly used as a pattern forming material, and includes a binder resin (A), a photopolymerizable compound (B) and a photopolymerization initiator (C), and optionally other. The additive (F) is dissolved or dispersed in the solvent (D).

  The binder resin (A) used in the photosensitive resin composition of the present invention has alkali solubility, and is unsaturated carboxylic acid and / or unsaturated carboxylic acid anhydride (A1), aliphatic polycyclic epoxy. A monomer having a group (A2) and a monomer copolymerizable with (A1) and (A2) (excluding (A1) and (A2)) (A3) .

Specific examples of the unsaturated carboxylic acid and / or unsaturated carboxylic acid anhydride (A1) include unsaturated monocarboxylic acids such as acrylic acid, methacrylic acid, and crotonic acid;
Unsaturated dicarboxylic acids such as maleic acid, fumaric acid, citraconic acid, mesaconic acid, itaconic acid;
And anhydrides of the aforementioned unsaturated dicarboxylic acids;
Unsaturated mono [(meth) acryloyloxy of polyvalent carboxylic acids such as succinic acid mono [2- (meth) acryloyloxyethyl] and phthalic acid mono [2- (meth) acryloyloxyethyl] Alkyl] esters;
Examples thereof include unsaturated acrylates containing a hydroxy group and a carboxyl group in the same molecule, such as α- (hydroxymethyl) acrylic acid.
Of these, acrylic acid, methacrylic acid, maleic anhydride and the like are preferably used from the viewpoint of copolymerization reactivity and solubility in an alkaline aqueous solution. These may be used alone or in combination.

The monomer (A2) having an aliphatic polycyclic epoxy group refers to a compound having an epoxy group in the ring of the aliphatic polycyclic compound and having an unsaturated bond. Examples of the aliphatic polycyclic compound include dicyclopentane and tricyclodecane.
The monomer (A2) having an aliphatic polycyclic epoxy group is preferably at least one compound selected from the group consisting of a compound represented by formula (I) and a compound represented by formula (II) Is mentioned.

[In formula (I) and formula (II), R represents a C1-C4 alkyl group which may be substituted by the hydrogen atom or the hydroxyl group each independently.
X represents each independently a C1-C6 alkylene group which may contain a single bond or a hetero atom. ]

Specific examples of R include alkyl groups such as hydrogen atom, methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, sec-butyl group, and tert-butyl group;
Hydroxymethyl group, 1-hydroxyethyl group, 2-hydroxyethyl group, 1-hydroxy-n-propyl group, 2-hydroxy-n-propyl group, 3-hydroxy-n-propyl group, 1-hydroxy-isopropyl group, And hydroxyl group-containing alkyl groups such as 2-hydroxy-isopropyl group, 1-hydroxy-n-butyl group, 2-hydroxy-n-butyl group, 3-hydroxy-n-butyl group and 4-hydroxy-n-butyl group. It is done. Among these, Preferably a hydrogen atom, a methyl group, a hydroxymethyl group, 1-hydroxyethyl group, 2-hydroxyethyl group is mentioned, More preferably, a hydrogen atom and a methyl group are mentioned.

X represents a single bond or an alkylene group such as a methylene group, an ethylene group or a propylene group;
Examples thereof include heteroatom-containing alkylene groups such as oxymethylene group, oxyethylene group, oxypropylene group, thiomethylene group, thioethylene group, thiopropylene group, aminomethylene group, aminoethylene group, and aminopropylene group. Of these, a single bond, a methylene group, an ethylene group, an oxymethylene group, and an oxyethylene group are preferable, and a single bond and an oxyethylene group are more preferable.

  Examples of the compound represented by the formula (I) include compounds represented by the formula (I-1) to the formula (I-15), preferably the formula (I-1) and the formula (I-3). , Formula (I-5), formula (I-7), formula (I-9), formula (I-11) to formula (I-15), and more preferably formula (I-1), formula (I-7), Formula (I-9), and Formula (I-15) are mentioned.

  Examples of the compound represented by the formula (II) include compounds represented by the formula (II-1) to the formula (II-15), preferably the formula (II-1) and the formula (II-3). , Formula (II-5), formula (II-7), formula (II-9), formula (II-11) to formula (II-15), more preferably formula (II-1), (II-7), Formula (II-9), and Formula (II-15) are mentioned.

  At least one compound selected from the group consisting of the compound represented by formula (I) and the compound represented by formula (II) can be used alone. They can also be mixed in any ratio. In the case of mixing, the mixing ratio is a molar ratio, preferably 5:95 to 95: 5, more preferably 10:90 to 90:10, particularly preferably 20:80 in the formula (I): formula (II). ~ 80: 20.

As the monomer (A3) copolymerizable with (A1) and (A2) (excluding (A1) and (A2)), methyl (meth) acrylate, ethyl (meth) acrylate, (meth) acrylic acid alkyl esters such as n-butyl (meth) acrylate, sec-butyl (meth) acrylate and t-butyl (meth) acrylate;
Alkyl acrylates such as methyl acrylate and isopropyl acrylate;
Cyclohexyl (meth) acrylate, 2-methylcyclohexyl (meth) acrylate, tricyclo [5.2.1.0 ^2,6 ] decan-8-yl (meth) acrylate (in this technical field, dicyclopenta Nyl (meth) acrylate), (meth) acrylic acid cyclic alkyl esters such as dicyclopentanyloxyethyl (meth) acrylate, isoboronyl (meth) acrylate;
Cyclohexyl acrylate, 2-methylcyclohexyl acrylate, tricyclo [5.2.1.0 ^2,6 ] decan-8-yl acrylate (referred to as dicyclopentanyl acrylate as a common name in the art), dicyclo Acrylic acid cyclic alkyl esters such as pentaoxyethyl acrylate and isobornyl acrylate;
(Meth) acrylic acid aryl esters such as phenyl (meth) acrylate and benzyl (meth) acrylate;
Acrylic acid aryl esters such as phenyl acrylate and benzyl acrylate;
Dicarboxylic acid diesters such as diethyl maleate, diethyl fumarate, diethyl itaconate;
Hydroxyalkyl esters such as 2-hydroxyethyl (meth) acrylate and 2-hydroxypropyl (meth) acrylate;
Bicyclo [2.2.1] hept-2-ene, 5-methylbicyclo [2.2.1] hept-2-ene, 5-ethylbicyclo [2.2.1] hept-2-ene, 5- Hydroxybicyclo [2.2.1] hept-2-ene, 5-carboxybicyclo [2.2.1] hept-2-ene, 5-hydroxymethylbicyclo [2.2.1] hept-2-ene, 5- (2′-hydroxyethyl) bicyclo [2.2.1] hept-2-ene, 5-methoxybicyclo [2.2.1] hept-2-ene, 5-ethoxybicyclo [2.2.1 ] Hept-2-ene, 5,6-dihydroxybicyclo [2.2.1] hept-2-ene, 5,6-dicarboxybicyclo [2.2.1] hept-2-ene, 5,6- Di (hydroxymethyl) bicyclo [2.2.1] hept-2-e 5,6-di (2′-hydroxyethyl) bicyclo [2.2.1] hept-2-ene, 5,6-dimethoxybicyclo [2.2.1] hept-2-ene, 5,6 -Diethoxybicyclo [2.2.1] hept-2-ene, 5-hydroxy-5-methylbicyclo [2.2.1] hept-2-ene, 5-hydroxy-5-ethylbicyclo [2.2 .1] Hept-2-ene, 5-carboxy-5-methylbicyclo [2.2.1] hept-2-ene, 5-carboxy-5-ethylbicyclo [2.2.1] hept-2-ene 5-hydroxymethyl-5-methylbicyclo [2.2.1] hept-2-ene, 5-carboxy-6-methylbicyclo [2.2.1] hept-2-ene, 5-carboxy-6- Ethylbicyclo [2.2.1] hept-2-ene, 5, 6-dicarboxybicyclo [2.2.1] hept-2-ene anhydride (hymic acid anhydride), 5-t-butoxycarbonylbicyclo [2.2.1] hept-2-ene, 5-cyclohexyloxy Carbonylbicyclo [2.2.1] hept-2-ene, 5-phenoxycarbonylbicyclo [2.2.1] hept-2-ene, 5,6-di (t-butoxycarbonyl) bicyclo [2.2. 1] Bicyclo unsaturated compounds such as hept-2-ene and 5,6-di (cyclohexyloxycarbonyl) bicyclo [2.2.1] hept-2-ene;
N-phenylmaleimide, N-cyclohexylmaleimide, N-benzylmaleimide, N-succinimidyl-3-maleimidobenzoate, N-succinimidyl-4-maleimidobutyrate, N-succinimidyl-6-maleimidocaproate, N-succinimidyl-3 -Dicarbonylimide derivatives such as maleimide propionate, N- (9-acridinyl) maleimide;
Styrene, α-methylstyrene, m-methylstyrene, p-methylstyrene, vinyl toluene, p-methoxystyrene, acrylonitrile, methacrylonitrile, vinyl chloride, vinylidene chloride, acrylamide, methacrylamide, vinyl acetate, 1,3-butadiene , Isoprene, 2,3-dimethyl-1,3-butadiene, glycidyl acrylate, glycidyl methacrylate, glycidyl α-ethyl acrylate, glycidyl α-n-propyl acrylate, glycidyl α-n-butyl acrylate, acrylic acid -3,4-epoxybutyl, methacrylic acid-3,4-epoxybutyl, acrylic acid-6,7-epoxyheptyl, methacrylic acid-6,7-epoxyheptyl, α-ethylacrylic acid-6,7-epoxyheptyl , O-Vinylbenzylglycidyl A Le, m--vinylbenzyl glycidyl ether, p- vinylbenzyl glycidyl ether.
Of these, styrene, N-phenylmaleimide, N-cyclohexylmaleimide, N-benzylmaleimide, bicyclo [2.2.1] hept-2-ene and the like are preferable from the viewpoint of copolymerization reactivity and solubility in an aqueous alkali solution. . These may be used alone or in combination.

The binder resin (A) used in the present invention is a copolymer obtained by copolymerizing (A1), (A2) and (A3), and the ratio of the constituent components derived from each is the above-mentioned copolymer. It is preferably in the following range in terms of mole fraction with respect to the total number of moles of the constituent components constituting the polymer.
Structural units derived from (A1); 2 to 40 mol%
Structural units derived from (A2); 2 to 95 mol%
Structural units derived from (A3); 1 to 65 mol%

Moreover, it is more preferable in the ratio of the said structural component being the following ranges.
Structural units derived from (A1); 5-35 mol%
Structural units derived from (A2); 5 to 80 mol%
Structural units derived from (A3); 1-60 mol%
When the composition ratio is in the above range, storage stability, developability, solvent resistance, heat resistance and mechanical strength tend to be good.

The binder resin (A) is, for example, a method described in the document “Experimental Method for Polymer Synthesis” (Takayuki Otsu, published by Kagaku Dojin Co., Ltd., First Edition, First Edition, issued March 1, 1972). And it can manufacture with reference to the cited reference described in the said literature.
Specifically, a predetermined amount of a compound that leads to the units (A1), (A2), and (A3) constituting the copolymer, a polymerization initiator, and a solvent are charged into a reaction vessel, and oxygen is substituted with nitrogen. Thus, a polymer can be obtained by stirring, heating and heat-retaining in the absence of oxygen. In addition, the obtained copolymer may use the solution after reaction as it is, may use the concentrated or diluted solution, and took out as solid (powder) by methods, such as reprecipitation. Things may be used.

The weight average molecular weight in terms of polystyrene of the binder resin (A) is preferably 3,000 to 100,000, more preferably 5,000 to 50,000. When the weight average molecular weight of the binder resin (A) is in the above range, the coating property tends to be good, the film is not easily reduced during development, and the non-pixel portion is easily removed during development. It tends to be preferable.
The molecular weight distribution [weight average molecular weight (Mw) / number average molecular weight (Mn)] of the binder resin (A) is preferably 1.1 to 6.0, and more preferably 1.2 to 4.0. The molecular weight distribution in the above range is preferable because it tends to be excellent in developability.
Content of binder resin (A) used for the photosensitive resin composition of this invention is a mass fraction with respect to solid content in the photosensitive resin composition, Preferably it is 5-90 mass%, More preferably, it is 10 -70 mass%. When the content of the binder resin (A) is in the above range, the solubility in the developer is sufficient, and a development residue is hardly generated on the non-pixel portion of the substrate. This is preferable because the film loss is less likely to occur, and the non-pixel portion is liable to be removed.

  The photosensitive resin composition of the present invention contains a photopolymerizable compound (B), and the compound having an unsaturated double bond equivalent contained in the photopolymerizable compound (B) of 120 to 400 g / eq is preferably A compound represented by the formula (BA) can be given.

[In Formula (BA), R ^{a to} R ^f each independently represents a hydrogen atom or any group of Formulas (BA-1) to (BA-3).

However, at least four of R ^{a to} R ^f are any groups represented by formulas (BA-1) to (BA-3), and at least one of R ^{a to} R ^f is represented by formula (BA -2) or a group represented by the formula (BA-3). ]

As the compound represented by the formula (BA), preferably, among R ^{a to} R ^f , two are hydrogen atoms, three are groups represented by the formula (BA-1), and one is a formula (BA-2). A compound which is a group represented by the following; two are hydrogen atoms, three are groups represented by the formula (BA-1), one is a group represented by the formula (BA-3); two are hydrogen atoms, 2 One is a group represented by the formula (BA-1), two are groups represented by the formula (BA-2); two are hydrogen atoms, two are groups represented by the formula (BA-1), 1 One is a group represented by the formula (BA-2), one is a group represented by the formula (BA-3); two are hydrogen atoms, two are groups represented by the formula (BA-1), 2 One is a group represented by the formula (BA-3); two are hydrogen atoms, one is a group represented by the formula (BA-1), and three are groups represented by the formula (BA-2) Compound: two hydrogen atoms, one group represented by the group represented by the group represented by the formula (BA-1), two groups represented by the formula (BA-2), one represented by the formula (BA -3) a compound which is a group represented by 2; two are hydrogen atoms, one is a group represented by formula (BA-1), one is a group represented by formula (BA-2), and two are formula (BA -3) a compound which is a group represented by two; two are hydrogen atoms, one is a formula (BA-1), three are groups represented by the formula (BA-3); two are hydrogen atoms, four are Compound that is a group represented by formula (BA-2); two are hydrogen atoms, three are groups represented by formula (BA-2), and one is a group represented by formula (BA-3) A compound in which two are hydrogen atoms, two are groups represented by formula (BA-2), two are groups represented by formula (BA-3); two are hydrogen atoms, one is formula (BA-2) A group represented by the formula (BA-3); two compounds represented by the formula (BA-3); four compounds represented by the formula (BA-3); One group represented by the formula (BA-1), one compound represented by the formula (BA-2), one hydrogen atom, four groups represented by the formula (BA-1), 1 One is a group represented by the formula (BA-3); one is a hydrogen atom, three are groups represented by the formula (BA-1), and two are groups represented by the formula (BA-2) Compound: one is a hydrogen atom, three is a group represented by the formula (BA-1), one is a group represented by the formula (BA-2), and one is a group represented by the formula (BA-3) Compound: Compound in which one is a hydrogen atom, three is a group represented by formula (BA-1), two is a group represented by formula (BA-3); one is a hydrogen atom, two are formula (BA A group represented by 1), three compounds represented by the formula (BA-2); one hydrogen atom, two groups represented by the formula (BA-1), two compounds represented by the formula (BA- A group represented by 2), one group represented by (BA-3); one hydrogen atom, two groups represented by formula (BA-1), one compound represented by formula (BA-2) A group represented by formula (BA-3), two are groups represented by formula (BA-3), one is a hydrogen atom, two are groups represented by formula (BA-1), and three are formula (BA-3) 1 is a hydrogen atom, 1 is a group represented by the formula (BA-1), 4 is a group represented by the formula (BA-2); 1 is a hydrogen atom 1 is a group represented by the formula (BA-1), 3 is a group represented by the formula (BA-2), 1 is a group represented by the formula (BA-3); 1 is a hydrogen atom One is A group represented by formula (BA-1), two are groups represented by formula (BA-2), two are groups represented by formula (BA-3); one is a hydrogen atom, one is A group represented by the formula (BA-1), one group represented by the formula (BA-2), three compounds represented by the formula (BA-3); one hydrogen atom, one Compound represented by formula (BA-1), four compounds represented by formula (BA-3); one compound represented by hydrogen atom and five groups represented by formula (BA-2) Compound having 1 hydrogen atom, 4 groups represented by formula (BA-2), 1 group represented by formula (BA-3); 1 hydrogen atom, 3 groups represented by formula (BA-2) A group represented by formula (2), two are groups represented by formula (BA-3); one is a hydrogen atom, two are groups represented by formula (BA-2), and three are (BA-3) expressed A compound in which one is a hydrogen atom, one is a group represented by the formula (BA-2), four are groups represented by (BA-3); one is a hydrogen atom, five is a formula (BA- 3) a compound which is a group represented by
5 is a group represented by the formula (BA-1), 1 is a group represented by the formula (BA-2); 5 is a group represented by the formula (BA-1), and 1 is a formula (BA -3): a compound represented by formula (BA-1); four compounds represented by formula (BA-1); two compounds represented by formula (BA-2); four compounds represented by formula (BA-1) ), One compound represented by the formula (BA-2), one compound represented by the formula (BA-3); four compounds represented by the formula (BA-1) A group in which two are groups represented by the formula (BA-3); a group in which three are represented by the formula (BA-1); and a compound in which three are groups represented by the formula (BA-2); Three compounds represented by the formula (BA-1), two compounds represented by the formula (BA-2), one compound represented by the formula (BA-3); three compounds represented by the formula (BA -1), one group A group represented by formula (BA-2), two compounds represented by formula (BA-3); three groups represented by formula (BA-1), and three compounds represented by formula (BA-3) A compound represented by formula (BA-1); two compounds represented by formula (BA-2); two compounds represented by formula (BA-1); A group represented by the formula (BA-2), three groups represented by the formula (BA-2), one group represented by the formula (BA-3); two groups represented by the formula (BA-1), 2 One is a group represented by the formula (BA-2), two are groups represented by the formula (BA-3); two are groups represented by the formula (BA-1), and one is a formula (BA- 2) a group represented by the formula (BA-3); three compounds represented by the formula (BA-3); two groups represented by the formula (BA-1); and four compounds represented by the formula (BA-3). A compound which is a group; one having the formula ( A group represented by A-1), five compounds represented by the formula (BA-2); one group represented by the formula (BA-1), and four compounds represented by the formula (BA-2) A group represented by formula (BA-3), one group represented by formula (BA-1), three groups represented by formula (BA-2), Compound in which two are groups represented by formula (BA-3); one is a group represented by formula (BA-1), two are groups represented by formula (BA-2), and three are formula (BA A compound represented by formula (BA-1); one group represented by formula (BA-2); four groups represented by formula (BA-3); A compound represented by the formula (BA-1), five compounds represented by the formula (BA-3), and six compounds represented by the formula (BA-2). The group is a compound; five are of the formula (BA- 2) a group represented by the formula (BA-3), one compound represented by the formula (BA-3); four groups represented by the formula (BA-2), and two compounds represented by the formula (BA-3). A compound in which three are groups represented by the formula (BA-2), a compound in which three are groups represented by the formula (BA-3); a group in which two are represented by the formula (BA-2) Compound in which four are groups represented by formula (BA-3); one is a group represented by formula (BA-2), and five is a group represented by formula (BA-3); 6 Examples thereof include compounds in which one is a group represented by (BA-3).
Among them, more preferably, a compound having an unsaturated double bond equivalent of 200 to 350 g / eq is mentioned. As the compound, a compound in which six groups are groups represented by the formula (BA-2), 6 The compound whose one group is group represented by a formula (BA-3) is mentioned.
As the compound represented by the formula (BA), among R ^{a to} R ^f , two are compounds represented by the formula (BA-2), KAYARAD DPCA-20, and three are represented by the formula (BA-2). KAYARAD DPCA-30, six of which are compounds represented by the formula (BA-2), KAYARAD DPCA-60, which is a compound of the formula (BA-2), and six KAYARAD DPCA-120, which is a compound of the formula (BA-3) Any commercially available products such as Nippon Kayaku Co., Ltd. can be used.

The photopolymerizable compound other than the compound represented by the formula (BA) contained in the photopolymerizable compound (B) contained in the photosensitive resin composition of the present invention can be a trifunctional or higher polyfunctional monomer. .
Specific examples of the trifunctional or higher polyfunctional monomer include trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol penta (meth) acrylate, dipentaerythritol. Examples include hexa (meth) acrylate, a reaction product of pentaerythritol tri (meth) acrylate and an acid anhydride, a reaction product of dipentaerythritol penta (meth) acrylate and an acid anhydride, and the like. Of these, tetrafunctional or higher polyfunctional monomers are preferably used. These photopolymerizable compounds can be used alone or in combination of two or more.
Content of a photopolymerizable compound (B) is a mass fraction with respect to the total amount of binder resin (A) and a photopolymerizable compound (B), Preferably it is 1-70 mass%, More preferably, it is 5-60. % By mass. When the content of the photopolymerizable compound (B) is in the above range, the strength, smoothness, and reliability of the pixel portion tend to be favorable, which is preferable.
The content of the compound represented by the formula (BA) is a mass fraction relative to the total amount of the photopolymerizable compound other than the compound represented by the formula (BA) and the compound represented by the formula (BA). In general, it is 3 to 100% by mass, preferably 3 to 70% by mass, more preferably 3 to 50% by mass, and particularly preferably 5 to 40% by mass. When the content of the compound represented by the formula (BA) is in the above range, the balance between sensitivity and development adhesion tends to be good, which is preferable.

  The photopolymerization initiator (C) contained in the photosensitive resin composition of the present invention is preferably an acetophenone-based, biimidazole-based, oxime-based, triazine-based, or acylphosphine oxide-based initiator. When the photopolymerization initiator auxiliary agent (C-1) is used in combination with these photopolymerization initiators (C), the resulting photosensitive resin composition has a higher sensitivity. This is preferable because the productivity of the pattern is improved.

  Examples of the acetophenone compound include diethoxyacetophenone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, benzyldimethyl ketal, 2-hydroxy-1- [4- (2-hydroxyethoxy) phenyl]. 2-methylpropan-1-one, 1-hydroxycyclohexyl phenyl ketone, 2-methyl-1- (4-methylthiophenyl) -2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) butan-1-one, 2- (2-methylbenzyl) -2-dimethylamino-1- (4-morpholinophenyl) -butanone, 2- (3-methylbenzyl) -2-dimethylamino -1- (4-morpholinophenyl) -butanone, 2- (4-methylbenzyl) -2-dimethyl Amino-1- (4-morpholinophenyl) -butanone, 2- (2-ethylbenzyl) -2-dimethylamino-1- (4-morpholinophenyl) -butanone, 2- (2-propylbenzyl) -2-dimethyl Amino-1- (4-morpholinophenyl) -butanone, 2- (2-butylbenzyl) -2-dimethylamino-1- (4-morpholinophenyl) -butanone, 2- (2,3-dimethylbenzyl) -2 -Dimethylamino-1- (4-morpholinophenyl) -butanone, 2- (2,4-dimethylbenzyl) -2-dimethylamino-1- (4-morpholinophenyl) -butanone, 2- (2-chlorobenzyl) 2-dimethylamino-1- (4-morpholinophenyl) -butanone, 2- (2-bromobenzyl) -2-dimethylamino-1- (4-moly Holinophenyl) -butanone, 2- (3-chlorobenzyl) -2-dimethylamino-1- (4-morpholinophenyl) -butanone, 2- (4-chlorobenzyl) -2-dimethylamino-1- (4-morpholino Phenyl) -butanone, 2- (3-bromobenzyl) -2-dimethylamino-1- (4-morpholinophenyl) -butanone, 2- (4-bromobenzyl) -2-dimethylamino-1- (4-morpholino) Phenyl) -butanone, 2- (2-methoxybenzyl) -2-dimethylamino-1- (4-morpholinophenyl) -butanone, 2- (3-methoxybenzyl) -2-dimethylamino-1- (4-morpholino) Phenyl) -butanone, 2- (4-methoxybenzyl) -2-dimethylamino-1- (4-morpholinophenyl) -butanone, 2 -(2-Methyl-4-methoxybenzyl) -2-dimethylamino-1- (4-morpholinophenyl) -butanone, 2- (2-methyl-4-bromobenzyl) -2-dimethylamino-1- (4 -Morpholinophenyl) -butanone, 2- (2-bromo-4-methoxybenzyl) -2-dimethylamino-1- (4-morpholinophenyl) -butanone, 2-hydroxy-2-methyl-1- [4- ( 1-methylvinyl) phenyl] propan-1-one oligomer and the like.

  Examples of the biimidazole compound include 2,2′-bis (2-chlorophenyl) -4,4 ′, 5,5′-tetraphenylbiimidazole and 2,2′-bis (2,3-dichlorophenyl) -4. , 4 ′, 5,5′-tetraphenylbiimidazole (see, for example, JP-A-6-75372 and JP-A-6-75373), 2,2′-bis (2-chlorophenyl) -4, 4 ′, 5,5′-tetraphenylbiimidazole, 2,2′-bis (2-chlorophenyl) -4,4 ′, 5,5′-tetra (alkoxyphenyl) biimidazole, 2,2′-bis ( 2-chlorophenyl) -4,4 ′, 5,5′-tetra (dialkoxyphenyl) biimidazole, 2,2′-bis (2-chlorophenyl) -4,4 ′, 5,5′-tetra (trialkoxy) Phenyl) biimidazole (for example, see JP-B-48-38403, JP-A-62-174204, etc.), and the phenyl group at the 4,4′5,5′-position is substituted with a carboalkoxy group. Imidazole compounds (see, for example, JP-A-7-10913) and the like, preferably 2,2′-bis (2-chlorophenyl) -4,4 ′, 5,5′-tetraphenylbiimidazole, 2,2′-bis (2,3-dichlorophenyl) -4,4 ′, 5,5′-tetraphenylbiimidazole may be mentioned.

  Examples of the oxime compound include O-ethoxycarbonyl-α-oximino-1-phenylpropan-1-one, a compound represented by formula (3), a compound represented by formula (4), and the like.

  Examples of the triazine compound include 2,4-bis (trichloromethyl) -6- (4-methoxyphenyl) -1,3,5-triazine, 2,4-bis (trichloromethyl) -6- (4- Methoxynaphthyl) -1,3,5-triazine, 2,4-bis (trichloromethyl) -6-piperonyl-1,3,5-triazine, 2,4-bis (trichloromethyl) -6- (4-methoxy Styryl) -1,3,5-triazine, 2,4-bis (trichloromethyl) -6- [2- (5-methylfuran-2-yl) ethenyl] -1,3,5-triazine, 2,4 -Bis (trichloromethyl) -6- [2- (furan-2-yl) ethenyl] -1,3,5-triazine, 2,4-bis (trichloromethyl) -6- [2- (4-diethylamino- 2-methylphenyl) Thenyl] -1,3,5-triazine, such as 2,4-bis (trichloromethyl) -6- [2- (3,4-dimethoxyphenyl) ethenyl] -1,3,5-triazine.

  Examples of the acylphosphine oxide initiator include 2,4,6-trimethylbenzoyldiphenylphosphine oxide.

Moreover, as long as the effects of the present invention are not impaired, a photopolymerization initiator or the like usually used in this field can be further used together. Examples of the photopolymerization initiator include benzoin compounds and benzophenones. Compounds, thioxanthone compounds, anthracene compounds, and the like.
More specifically, the following compounds can be mentioned, and these can be used alone or in combination of two or more.

  Examples of the benzoin-based compound include benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, and benzoin isobutyl ether.

  Examples of the benzophenone compounds include benzophenone, methyl o-benzoylbenzoate, 4-phenylbenzophenone, 4-benzoyl-4′-methyldiphenyl sulfide, 3,3 ′, 4,4′-tetra (tert-butyl). Peroxycarbonyl) benzophenone, 2,4,6-trimethylbenzophenone, and the like.

  Examples of the thioxanthone compound include 2-isopropylthioxanthone, 4-isopropylthioxanthone, 2,4-diethylthioxanthone, 2,4-dichlorothioxanthone, 1-chloro-4-propoxythioxanthone, and the like.

  Examples of the anthracene compound include 9,10-dimethoxyanthracene, 2-ethyl-9,10-dimethoxyanthracene, 9,10-diethoxyanthracene, and 2-ethyl-9,10-diethoxyanthracene. It is done.

  Other examples of the photopolymerization initiator include 10-butyl-2-chloroacridone, 2-ethylanthraquinone, benzyl, 9,10-phenanthrenequinone, camphorquinone, methyl phenylglyoxylate, and titanocene compounds. .

Further, as a photopolymerization initiator having a group capable of causing chain transfer, a photopolymerization initiator described in JP-T-2002-544205 can be used.
As a photoinitiator which has the group which can raise | generate the said chain transfer, the photoinitiator of Formula (5)-(10) is mentioned, for example.

  The photopolymerization initiator having a group capable of causing chain transfer can also be used as the constituent component (A3) of the copolymer. And the obtained copolymer can be used for binder resin used as binder resin of the photosensitive resin composition of this invention, and can also be used together.

Moreover, a photoinitiator (C-1) can also be used in combination with a photoinitiator. As the photopolymerization initiation assistant, an amine compound and the following carboxylic acid compound are preferable, and the amine compound is more preferably an aromatic amine compound.
Specific examples of the photopolymerization initiation aid include aliphatic amine compounds such as triethanolamine, methyldiethanolamine, triisopropanolamine, methyl 4-dimethylaminobenzoate, ethyl 4-dimethylaminobenzoate, 4-dimethylaminobenzoic acid. Isoamyl, 2-dimethylhexyl 4-dimethylaminobenzoate, 2-dimethylaminoethyl benzoate, N, N-dimethylparatoluidine, 4,4′-bis (dimethylamino) benzophenone (common name: Michler's ketone), 4,4′- Examples include aromatic amine compounds such as bis (diethylamino) benzophenone.
Examples of the carboxylic acid compound include phenylthioacetic acid, methylphenylthioacetic acid, ethylphenylthioacetic acid, methylethylphenylthioacetic acid, dimethylphenylthioacetic acid, methoxyphenylthioacetic acid, dimethoxyphenylthioacetic acid, chlorophenylthioacetic acid, dichlorophenylthioacetic acid, Examples include aromatic heteroacetic acids such as N-phenylglycine, phenoxyacetic acid, naphthylthioacetic acid, N-naphthylglycine, and naphthoxyacetic acid.

Content of a photoinitiator (C) is a mass fraction with respect to the total amount of binder resin (A) and a photopolymerizable compound (B), Preferably it is 0.1-40 mass%, More preferably, it is 1 -30 mass%.
The content of the photopolymerization initiation assistant (C-1) is preferably 0.01 to 50% by mass, more preferably 0.1 to 40% by mass, based on the same standard as described above.
When the total amount of the photopolymerization initiator (C) is in the above range, the photosensitive resin composition becomes highly sensitive, and the strength of the pixel portion formed using the photosensitive resin composition, The smoothness on the surface tends to be good, which is preferable. In addition to the above, when the amount of the photopolymerization initiation assistant (C-1) is in the above range, the sensitivity of the obtained photosensitive resin composition is further increased, and the photosensitive resin composition is formed using the photosensitive resin composition. This is preferable because the productivity of the patterned substrate tends to be improved.

The photosensitive resin composition of the present invention contains a solvent (D). The solvent (D) can be various organic solvents used in the field of photosensitive resin compositions. Specific examples thereof include ethylene glycol monoalkyl ethers such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether and ethylene glycol monobutyl ether;
Diethylene glycol dialkyl ethers such as diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol dipropyl ether and diethylene glycol dibutyl ether;
Ethylene glycol alkyl ether acetates such as methyl cellosolve acetate and ethyl cellosolve acetate;
Alkylene glycol alkyl ether acetates such as propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, propylene glycol monopropyl ether acetate, methoxybutyl acetate and methoxypentyl acetate;
Aromatic hydrocarbons such as benzene, toluene, xylene and mesitylene;
Ketones such as methyl ethyl ketone, acetone, methyl amyl ketone, methyl isobutyl ketone and cyclohexanone;
Alcohols such as ethanol, propanol, butanol, hexanol, cyclohexanol, ethylene glycol and glycerin;
Esters such as ethyl 3-ethoxypropionate and methyl 3-methoxypropionate;
and cyclic esters such as γ-butyrolactone.
Among the above-mentioned solvents, from the viewpoints of coating properties and drying properties, an organic solvent having a boiling point of 100 ° C. to 200 ° C. is preferable among the solvents, and more preferably alkylene glycol alkyl ether acetates, ketones, And esters such as ethyl 3-ethoxypropionate and methyl 3-methoxypropionate, particularly preferably propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, cyclohexanone, ethyl 3-ethoxypropionate and 3-methoxy And methyl propionate.
These solvents (D) can be used alone or in admixture of two or more.
Content of the solvent (D) in the photosensitive resin composition of this invention is a mass fraction with respect to the photosensitive resin composition, Preferably it is 60-90 mass%, More preferably, it is 70-85 mass%. When the content of the solvent (D) is within the above range, when applied by a spin coater, slit & spin coater, slit coater (sometimes called a die coater or curtain flow coater), an ink jet or the like. The coating property is expected to be good, and is preferable.

In the photosensitive resin composition of the present invention, a filler, other polymer compound, a pigment dispersant, an adhesion promoter, an antioxidant, an ultraviolet absorber, an anti-aggregating material, an aggregating agent, and chain transfer are optionally included. An additive (F) such as an agent can also be used in combination.
Specific examples of the filler include glass, silica, alumina, and pigment.
Specific examples of other polymer compounds include curable resins such as epoxy resins and maleimide resins, and thermoplastic resins such as polyvinyl alcohol, polyacrylic acid, polyethylene glycol monoalkyl ether, polyfluoroalkyl acrylate, polyester, and polyurethane. Can be used.
Commercially available surfactants can be used as the pigment dispersant, and examples include silicone-based, fluorine-based, ester-based, cationic-based, anionic-based, nonionic-based, and amphoteric surfactants. Or a combination of two or more. Examples of the surfactant include polyoxyethylene alkyl ethers, polyoxyethylene alkyl phenyl ethers, polyethylene glycol diesters, sorbitan fatty acid esters, fatty acid-modified polyesters, tertiary amine-modified polyurethanes, and polyethyleneimines. In addition, KP (manufactured by Shin-Etsu Chemical Co., Ltd.), Polyflow (manufactured by Kyoei Chemical Co., Ltd.), F-Top (manufactured by Tochem Products), MegaFuck (manufactured by Dainippon Ink & Chemicals, Inc.) ), FLORARD (manufactured by Sumitomo 3M Co., Ltd.), Asahi Guard, Surflon (manufactured by Asahi Glass Co., Ltd.), Solsperse (manufactured by Geneca Corporation), EFKA (manufactured by EFKA CHEMICALS), PB821 (manufactured by Ajinomoto Co., Inc.) ) And the like.
Specific examples of the adhesion promoter include vinyltrimethoxysilane, vinyltriethoxysilane, vinyltris (2-methoxyethoxy) silane, N- (2-aminoethyl) -3-aminopropylmethyldimethoxysilane, N- (2- Aminoethyl) -3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 2- (3,4-epoxycyclohexyl) Examples include ethyltrimethoxysilane, 3-chloropropylmethyldimethoxysilane, 3-chloropropyltrimethoxysilane, 3-methacryloyloxypropyltrimethoxysilane, and 3-mercaptopropyltrimethoxysilane.
Specific examples of the antioxidant include 2,2′-thiobis (4-methyl-6-tert-butylphenol) and 2,6-di-tert-butyl-4-methylphenol.
Specific examples of the ultraviolet absorber include 2- (3-tert-butyl-2-hydroxy-5-methylphenyl) -5-chlorobenzotriazole and alkoxybenzophenone.
Specific examples of the flocculant include sodium polyacrylate.
Examples of the chain transfer agent include dodecyl mercaptan and 2,4-diphenyl-4-methyl-1-pentene.

  For example, the photosensitive resin composition can be applied onto a substrate as described below, and can be photocured and developed to form a pattern. First, this composition is applied to a substrate (usually glass) or a layer made of a solid content of a previously formed photosensitive resin composition, or ITO (indium-tin oxide) or IZO (indium-zinc oxide). It coats on the formed substrate and removes volatile components such as a solvent by pre-baking from the coated photosensitive resin composition layer to obtain a smooth coating film. At this time, the thickness of the coating film is about 1 to 6 μm. The coating film thus obtained is irradiated with ultraviolet rays through a mask for forming a target pattern. At this time, it is preferable to use an apparatus such as a mask aligner or a stepper so that the entire exposed portion is uniformly irradiated with parallel light rays and the mask and the substrate are accurately aligned. Thereafter, the cured coating film is brought into contact with an alkaline aqueous solution to dissolve the non-exposed portion and developed, whereby the intended pattern shape is obtained. The developing method may be any of a liquid piling method, a dipping method, a spray method, and the like. Further, the substrate may be tilted at an arbitrary angle during development.

The developer used for development after patterning exposure is usually an aqueous solution containing an alkaline compound and a surfactant.
The alkaline compound may be either an inorganic or organic alkaline compound. Specific examples of the inorganic alkaline compound include sodium hydroxide, potassium hydroxide, disodium hydrogen phosphate, sodium dihydrogen phosphate, diammonium hydrogen phosphate, ammonium dihydrogen phosphate, potassium dihydrogen phosphate, sodium silicate, potassium silicate, Examples thereof include sodium carbonate, potassium carbonate, sodium hydrogen carbonate, potassium hydrogen carbonate, sodium borate, potassium borate, and ammonia.
Specific examples of the organic alkaline compound include tetramethylammonium hydroxide, 2-hydroxyethyltrimethylammonium hydroxide, monomethylamine, dimethylamine, trimethylamine, monoethylamine, diethylamine, triethylamine, monoisopropylamine, diisopropylamine, and ethanolamine. Etc. These inorganic and organic alkaline compounds can be used alone or in combination of two or more. The concentration of the alkaline compound in the alkaline developer is preferably 0.01 to 10% by mass, more preferably 0.03 to 5% by mass.

The surfactant in the alkaline developer may be any of a nonionic surfactant, an anionic surfactant, or a cationic surfactant.
Specific examples of nonionic surfactants include polyoxyethylene alkyl ether, polyoxyethylene aryl ether, polyoxyethylene alkyl aryl ether, other polyoxyethylene derivatives, oxyethylene / oxypropylene block copolymers, sorbitan fatty acid esters, polyoxyethylene Examples thereof include oxyethylene sorbitan fatty acid ester, polyoxyethylene sorbitol fatty acid ester, glycerin fatty acid ester, polyoxyethylene fatty acid ester, and polyoxyethylene alkylamine.
Specific examples of anionic surfactants include higher alcohol sulfate salts such as sodium lauryl alcohol sulfate and sodium oleyl alcohol sulfate, alkyl sulfates such as sodium lauryl sulfate and ammonium lauryl sulfate, sodium dodecylbenzenesulfonate, And alkyl aryl sulfonates such as sodium dodecyl naphthalene sulfonate.
Specific examples of the cationic surfactant include amine salts or quaternary ammonium salts such as stearylamine hydrochloride and lauryltrimethylammonium chloride.
These surfactants can be used alone or in combination of two or more.
The concentration of the surfactant in the alkali developer is preferably in the range of 0.01 to 10% by mass, more preferably 0.05 to 8% by mass, and more preferably 0.1 to 5% by mass.

  After the development, it is washed with water, and further post-baked at 150 to 230 ° C. for 10 to 60 minutes, if necessary.

  By using the photosensitive resin composition of the present invention, a pattern can be formed on the substrate or the color filter substrate through the above steps. This pattern is useful as a photospacer used in a liquid crystal display device. Moreover, if a photomask for hole formation is used in patterning exposure to a dry coating film, a hole can be formed and it is useful as an interlayer insulation film. The shape, size, and pitch of the pattern layout of the photomask can be arbitrarily changed. In addition, when exposing to a dry coating film, a transparent film can be formed only by full exposure and heat curing, or heat curing without using a photomask, and this transparent film is useful as an overcoat, It can also be used for a touch panel.

  Therefore, by incorporating the pattern thus obtained into a display device such as a liquid crystal display device, an excellent quality display device can be manufactured with a high yield.

  While the embodiments of the present invention have been described above, the embodiments of the present invention disclosed above are merely examples, and the scope of the present invention is not limited to these embodiments. The scope of the present invention is defined by the terms of the claims, and includes the meaning equivalent to the description of the claims and all modifications within the scope.

  EXAMPLES Hereinafter, although an Example demonstrates this invention in detail, this invention is not limited by these Examples. In the examples, “%” and “part” representing the content or amount used are based on mass unless otherwise specified.

Synthesis example 1
In a 1 L flask equipped with a reflux condenser, a dropping funnel and a stirrer, nitrogen was allowed to flow at 0.02 L / min to form a nitrogen atmosphere, and 200 parts by mass of 3-methoxy-1-butanol and 105 parts by mass of 3-methoxybutyl acetate were added. And heated to 70 ° C. with stirring. Subsequently, 55 parts by mass of methacrylic acid, 3,4-epoxytricyclo [5.2.1.0 ^2.6 ] decyl acrylate (a compound represented by the formula (I-1) and a formula (II-1) The compound to be mixed is mixed at a molar ratio of 50:50.) A solution is prepared by dissolving 175 parts by mass and 70 parts by mass of N-cyclohexylmaleimide in 140 parts by mass of 3-methoxybutyl acetate. Then, it was dropped into a flask kept at 70 ° C. for 4 hours using a dropping pump. On the other hand, a solution obtained by dissolving 30 parts by mass of a polymerization initiator 2,2′-azobis (2,4-dimethylvaleronitrile) in 225 parts by mass of 3-methoxybutyl acetate was added to a flask over another 5 hours using another dropping pump. It was dripped in. After completion of the dropwise addition of the polymerization initiator solution, the temperature was maintained at 70 ° C. for 4 hours, and then cooled to room temperature, viscosity (23 ° C.) 114 mPa · s, solid content 32.6% by mass, acid value 34.3 mg. A solution of -KOH / g copolymer (resin Aa) was obtained. The obtained resin Aa had a weight average molecular weight Mw of 13,600 and a dispersity of 2.54.
The viscosity of the copolymer solution was measured with a B-type viscometer.

About the measurement of the weight average molecular weight (Mw) and the number average molecular weight (Mn) of the said binder polymer, it carried out on condition of the following using GPC method.
Apparatus; K2479 (manufactured by Shimadzu Corporation)
Column; SHIMADZU Shim-pack GPC-80M
Column temperature: 40 ° C
Solvent; THF (tetrahydrofuran)
Flow rate: 1.0 mL / min
Detector; RI
The ratio of the weight average molecular weight and the number average molecular weight obtained in the above-mentioned manner as polystyrene was defined as the dispersity (Mw / Mn).

Example 1
<Preparation of photosensitive resin composition>
Resin solution part containing resin Aa obtained in Synthesis Example 1 (55 parts in terms of solid content), 40 parts of dipentaerythritol hexaacrylate (KAYARAD DPHA manufactured by Nippon Kayaku Co., Ltd.), caprolactone-modified polyfunctional acrylate (Nipponization) KAYARAD DPCA-120 manufactured by Yakuhin Co., Ltd., 6 parts 2-methyl-2-morpholino (4-thiomethylphenyl) propan-1-one, 53 parts propylene glycol monomethyl ether acetate, 3-ethoxyethyl propionate 20 parts, 37 parts of 3-methoxy 1-butanol and 87 parts of 3-methoxybutyl acetate were mixed to obtain a photosensitive resin composition 1.

<Pattern formation>
A substrate on which an ITO film was formed (film thickness 1500 mm, resistance value 10 Ω / sq) on a 2-inch square glass substrate (# 1737; manufactured by Corning) was sequentially washed with a neutral detergent, water and alcohol and then dried. On this glass substrate, the photosensitive resin composition 1 is exposed at an exposure amount (365 nm) of 100 mJ / cm ² , so that the film thickness after each step of development, washing with water, and post baking is 3.5 μm. And then pre-baked at 75 ° C. for 2 minutes. After cooling, the distance between the substrate coated with the photosensitive resin composition and the quartz glass photomask was set to 10 μm, and an exposure machine (TME-150RSK; manufactured by Topcon Co., Ltd.) was used, and the air atmosphere was 100 mJ / cm. Light was irradiated with an exposure amount of ² (based on 365 nm).
In addition, the photomask in which the following pattern was formed on the same plane was used as the photomask.

A photomask having 5600 square light-transmitting portions (patterns) each having a side of 7 μm and a space between the squares of 100 μm.

  After light irradiation, the coating film was immersed in an aqueous developer containing 0.12% of a nonionic surfactant and 0.05% of potassium hydroxide at 23 ° C. for 80 seconds to develop, and an ultrasonic cleaner (frequency 38 kHz). ) For 20 minutes and then post-baked in an oven at 230 ° C. for 20 minutes. After standing to cool, the film thickness was measured using a film thickness measuring device (DEKTAK3; manufactured by Nippon Vacuum Technology Co., Ltd.).

<Storage stability>
The viscosity of the photosensitive resin composition 1 obtained above was measured. Then, the photosensitive resin composition 1 was sealed in a light shielding container, and the container was stored in a thermostatic bath at 23 ° C. for 2 weeks.
The viscosity of the photosensitive resin composition 1 after storage was measured. The viscosity change obtained based on the following formula was 100%.

[Viscosity of photosensitive resin composition after storage at 23 ° C. for 2 weeks]
Viscosity change = ──────────────────────── × 100 (%)
[Viscosity of photosensitive resin composition before storage]

The smaller the change in viscosity, the better, for example, in the range of 100 to 103%. The viscosity was measured as follows.
The viscosity was measured at 23 ° C. using a viscometer (VISCOMETER TV-30; manufactured by Toki Sangyo Co., Ltd.).

<Transmissivity>
In the exposure process in the pattern formation, a cured film is prepared by performing the same operation as described above except that a photomask is not used and the film thickness is 2.9 to 3.1 μm. The film thickness was measured using a film thickness measuring device (DEKTAK3; manufactured by Nippon Vacuum Technology Co., Ltd.).
Next, the transmittance (%) at 400 nm of the obtained cured film was measured using a microspectrophotometer (OSP-SP200; manufactured by OLYMPUS), and the transmittance was the transmittance at a film thickness of 3.0 μm. When converted, it was 96.3%.

<Surface smoothness>
A cured film was prepared using the photosensitive resin composition 1 in the same manner as described above except that a photomask was not used. The obtained cured film was evaluated for the items shown in Table 2.
The surface of the obtained cured film was observed using a scanning electron microscope (S-4000; manufactured by Hitachi, Ltd.).
The case where the surface of the cured film was smooth was evaluated as ◯, and the case where there was unevenness was evaluated as ×.

<Pattern shape>
When the line width of the pattern used for measurement in surface smoothness was measured using a scanning electron microscope (S-4000; manufactured by Hitachi, Ltd.), it was 7.9 μm.
Regarding the shape, the pattern was observed from the side. The case where the line width of the lower base is larger than the upper base is classified as a forward taper, the case where the line width of the upper base and the lower base are equal is rectangular, and the case where the line width of the lower base is smaller than the upper base is classified as reverse taper.
It is preferable that the pattern shape is rectangular, since the development adhesion tends to be good.

<Development adhesion>
In the pattern forming step, the developed substrate was immersed in a 1 L glass beaker containing 500 mL of pure water, and an ultrasonic cleaner (US-4, measurement frequency: 38 kHz, Co., Ltd.) at 23 to 25 ° C. After washing with water for 10 minutes and 20 minutes, the number of peeled patterns in 5600 pieces was counted. The number of peeled was 0 in all cases, and no peeling occurred. It can be said that the smaller the number of peeled, the better the development adhesion.

<Mechanical properties (total displacement and recovery rate)>
About one hardening pattern obtained in the said pattern formation, using a dynamic ultra micro hardness meter (DUH-W201; manufactured by Shimadzu Corporation), the total displacement (μm) and the elastic displacement (μm) Measurement was made and the recovery rate (%) was calculated.
-Measurement conditions-
Test mode: Load-unloading test force: 20 mN
Load speed: 4.4 mN / sec
Holding time: 5 sec
Indenter: truncated cone indenter (diameter 50 μm)
Recovery rate (%); [elastic displacement (μm) / total displacement (μm)] × 100

  As the mechanical characteristics, when the film thickness is 3 to 5 μm and the line width is 7 to 10 μm, it can be said that the pattern having a total displacement of 0.90 μm or more and a recovery rate of 45% or more is good.

<Solvent resistance>
In the exposure process in the pattern formation described above, the same operation was performed except that no photomask was used, a coating film was prepared, and the film thickness and transmittance were measured. The prepared coating film was immersed in N-methylpyrrolidone at 30 ° C. for 30 minutes, the film thickness and transmittance after the immersion were measured, and their changes were determined according to the following formula.

Change in film thickness (%); [film thickness after immersion (μm) / film thickness before immersion (μm)] × 100
Change in transmittance (%); [Transmittance after immersion (%) / Transmittance before immersion (%)] × 100

  It can be said that the film thickness change and the transmittance change are good when they are 90 to 103%, respectively.

Solvent-resistant adhesion;
On the coating film after immersion in the solvent resistance test, 100 squares each having a side of 1 mm were produced using a commercially available cutter knife. A commercially available cellophane tape was used, a peel test was performed, and the following numerical values were evaluated.

[(Number of squares left on the substrate without peeling) / 100]

It can be said that the larger the numerical value, the better the adhesion and the better.

<Heat resistance>
In the exposure process in the pattern formation, a coating film was prepared by performing the same operation except that no photomask was used. The prepared coating film was allowed to stand in a clean oven at 240 ° C. for 1 hour, and the film thickness and transmittance (measurement wavelength; 400 nm) before and after heating were measured, and their changes were determined according to the following formula. As a result, the film thickness change was 92.4%. The transmittance change was 96.3%.

Change in film thickness (%); [film thickness after heating (μm) / film thickness before heating (μm)] × 100
Change in transmittance (%); [Transmittance after heating (%) / Transmittance before heating (%)] × 100

  It is satisfactory when the change in film thickness and the change in transmittance are 90 to 103%, respectively.

  Heat resistant adhesiveness: 100 squares each having a side of 1 mm were produced on the coated film after heating in the heat resistance test using a commercially available cutter knife. A commercially available cellophane tape was used, a peel test was performed, and the following numerical values were evaluated.

[(Number of squares left on the substrate without peeling) / 100]

The larger the value, the better the adhesion and the better.

Example 2
In the same manner as in Example 1, a photosensitive resin composition 2 was obtained and evaluated so as to have the composition shown in Table 1. The results are shown in Table 2.

Example 3
In the same manner as in Example 1, a photosensitive resin composition 3 was obtained and evaluated so as to have the composition shown in Table 1. The results are shown in Table 2.

Comparative Example 1
In the same manner as in Example 1, a photosensitive resin composition 4 was obtained and evaluated so as to have the composition shown in Table 1. The results are shown in Table 2.

From the results of Examples 1 to 3 shown in Table 2, when the photosensitive resin composition of the present invention is used, a pattern having excellent development adhesion can be formed even when a fine pattern is formed, so that the process margin is wide. Furthermore, it can be seen that the pattern formed and the coating film excellent in the pattern shape, surface smoothness, mechanical properties, heat resistance, and solvent resistance can be obtained.
On the other hand, the photosensitive resin composition which does not contain the compound whose unsaturated double bond equivalent contained in this invention of Comparative Example 1 is 120-400 g / eq was only inferior to image development adhesion.

The photosensitive resin composition of the present invention is excellent in storage stability, and can form a pattern and a coating film excellent in pattern shape, surface smoothness, mechanical properties, heat resistance, and solvent resistance, It can be used to form a transparent film used in a display device, such as an overcoat, a photo spacer, an insulating film, a protrusion for controlling liquid crystal alignment, and a coat layer for adjusting the thickness of a colored pattern.

Claims (5)

  In the photosensitive resin composition containing the binder resin (A), the photopolymerizable compound (B), the photopolymerization initiator (C) and the solvent (D), the binder resin (A) is an unsaturated carboxylic acid and / or Unsaturated carboxylic acid anhydride (A1), monomer having aliphatic polycyclic epoxy group (A2), and monomer copolymerizable with (A1) and (A2) (provided that (A1) and ( A2) is excluded.) A photopolymerizable compound (A3) and a photopolymerizable compound (B) containing a compound having an unsaturated double bond equivalent of 120 to 400 g / eq. B) The photosensitive resin composition characterized by the above-mentioned. The photosensitive resin composition according to claim 1, wherein the compound having an unsaturated double bond equivalent of 120 to 400 g / eq is a compound represented by the formula (BA).

[In Formula (BA), R ^{a to} R ^f each independently represent a hydrogen atom or any group represented by Formulas (BA-1) to (BA-3).

However, at least four groups of R ^{a to} R ^f are any groups represented by formulas (BA-1) to (BA-3), and at least one group of R ^{a to} R ^f is represented by the formula ( Group represented by formula (BA-2) or formula (BA-3). ] The monomer (A2) having an aliphatic polycyclic epoxy group is at least one compound selected from the group consisting of a compound represented by formula (I) and a compound represented by formula (II). Item 3. The photosensitive resin composition according to Item 1 or 2.

[In formula (I) and formula (II), R represents a C1-C4 alkyl group which may be each independently substituted with a hydrogen atom or a hydroxyl group.
X represents each independently a C1-C6 alkylene group which may contain a single bond or a hetero atom. ]   The pattern formed using the photosensitive resin composition of Claims 1-3. A display device comprising the pattern according to claim 4.