JP2008129327A - Method for manufacturing liquid crystal element - Google Patents

Method for manufacturing liquid crystal element Download PDF

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Publication number
JP2008129327A
JP2008129327A JP2006314228A JP2006314228A JP2008129327A JP 2008129327 A JP2008129327 A JP 2008129327A JP 2006314228 A JP2006314228 A JP 2006314228A JP 2006314228 A JP2006314228 A JP 2006314228A JP 2008129327 A JP2008129327 A JP 2008129327A
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Prior art keywords
sealing material
liquid crystal
injection hole
crystal element
substrate
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Inventor
Shunji Maekawa
俊二 前川
Masahiko Hachiman
正彦 八幡
Yoshinobu Wakabayashi
芳信 若林
Shoichi Tanaka
正一 田中
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Citizen Holdings Co Ltd
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Citizen Holdings Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To solve a problem of failure in long-term reliability when a liquid crystal element having a level difference around an injection hole is sealed by a sealing material. <P>SOLUTION: A method for manufacturing a liquid crystal display element includes a step of applying a first sealing material 18 on an injection hole and a step of applying a second sealing material 19 to cover the first sealing material 18. Thereby, a portion with weak adhesion strength on the interface between the sealing material and a substrate seal material and an insufficient portion of the sealing material generating upon pouring the sealing material to the injection hole are reinforced by the second sealing material 19. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

この発明は、2枚の基板とシールによって形成された空間にシール開口部(以下注入孔と称する)から液晶を注入する液晶素子に対し、その注入孔を封止するための液晶素子の封孔工程に関わる。   The present invention relates to a liquid crystal element sealing device for sealing an injection hole for a liquid crystal element that injects liquid crystal from a seal opening (hereinafter referred to as an injection hole) into a space formed by two substrates and a seal. Involved in the process.

光透過制御用の液晶素子は、携帯電話器から大型液晶テレビに至る様々な表示体として実用化されているほか、最近では光ディスクドライブ装置のなかの収差補正素子としても使われるようになった。このような液晶素子は、数マイクロメータ程度の間隙を持って対向した2枚の透明基板の間隙に液晶を挟み込み、透明基板の周辺部をシールで封止している。液晶を挟み込むため広く用いれている方法(以下真空注入法と称する)は、予めシールを介して2枚の透明基板を貼りあわせておき、次に透明基板とシールから形成される空間を真空にし、やはり予め設けてあった注入孔を液晶溜に浸し、外部を外気圧に戻し、外部とこの空間との圧力差を利用して液晶を注入している。この真空注入法では最後に注入孔を接着剤で封孔する。   Liquid crystal elements for controlling light transmission have been put into practical use as various display bodies ranging from mobile phones to large-sized liquid crystal televisions. Recently, they have also been used as aberration correction elements in optical disk drive devices. In such a liquid crystal element, liquid crystal is sandwiched between two transparent substrates facing each other with a gap of about several micrometers, and the periphery of the transparent substrate is sealed with a seal. A widely used method for sandwiching liquid crystal (hereinafter referred to as a vacuum injection method) is that two transparent substrates are pasted together in advance through a seal, and then the space formed by the transparent substrate and the seal is evacuated, An injection hole provided in advance is immersed in the liquid crystal reservoir, the outside is returned to the external pressure, and the liquid crystal is injected using the pressure difference between the outside and this space. In this vacuum injection method, the injection hole is finally sealed with an adhesive.

注入孔と封孔材の塗布情況を図6を参考にしながら説明する。図6において、(a)と(b)は注入孔側の基板端面が上下で揃っている場合の液晶素子の斜視図と平面図であり、(c)と(d)は注入孔側の基板端面が揃っておらず注入孔周りで段差を形成している液晶素子の斜視図と平面図である。   The application situation of the injection hole and the sealing material will be described with reference to FIG. 6A and 6B are a perspective view and a plan view of the liquid crystal element when the substrate end surfaces on the injection hole side are aligned vertically, and FIGS. 6C and 6D are the substrates on the injection hole side. FIG. 6 is a perspective view and a plan view of a liquid crystal element in which end faces are not aligned and a step is formed around an injection hole.

注入孔側の基板端面が揃った構造は工程が短く注入時の液晶使用効率が良い。図6(a),(b)において、上基板60と下基板61はシール62に形成された注入孔の存在する基板端面がそろっている一方、この基板端面と対向する側では上基板60に対し下基板61が延出している。この延出部には、シール62により囲まれた平面領域に形成された液晶素子の駆動電極に、外部回路から駆動信号を伝達させる接続用電極が設けられている(図示せず)。封孔材63は注入孔を塞ぐように塗布され端面から盛り上がっており、一部は注入孔に浸入している。注入孔にはシール辺に対し外側に直角に曲がったシール突起部64がある。このシール突起部64は封孔後の空気の浸入や液晶の漏れを防いでいる。なおシール62は上基板60の外周のやや内側で、上基板60と下基板61の間隙を線状に取り囲んでいるが、上基板60越しに見ているので点線で示した。またシール62は、図6(b)の下側に開口部を有し、これが液晶の注入孔となる。(以下同様)   The structure in which the substrate end face on the injection hole side is aligned has a short process and has high efficiency of using liquid crystal at the time of injection. 6 (a) and 6 (b), the upper substrate 60 and the lower substrate 61 have the same substrate end surface where the injection holes formed in the seal 62 are present, while the upper substrate 60 is opposite to the substrate end surface. On the other hand, the lower substrate 61 extends. A connection electrode for transmitting a drive signal from an external circuit to the drive electrode of the liquid crystal element formed in the planar region surrounded by the seal 62 is provided in the extending portion (not shown). The sealing material 63 is applied so as to close the injection hole and rises from the end face, and a part of the sealing material penetrates into the injection hole. The injection hole has a seal projection 64 bent at a right angle to the outside with respect to the seal side. The seal protrusion 64 prevents air from entering after sealing and leakage of liquid crystal. The seal 62 is slightly inside the outer periphery of the upper substrate 60 and linearly surrounds the gap between the upper substrate 60 and the lower substrate 61. However, since the seal 62 is seen through the upper substrate 60, it is indicated by a dotted line. The seal 62 has an opening on the lower side of FIG. 6B, which serves as a liquid crystal injection hole. (The same applies hereinafter)

注入孔側にも接続用の電極を設けたい場合や、注入孔側の端面を基準面としたい場合など様々な理由で注入孔側に段差を形成することがある。図6(c),(d)において、下基板66は注入孔側にも下基板66の延出部があり、上基板65の端面とこの延出部から形成される角部に注入孔が存在する。(a)と同様に注入孔と対向する側にも下基板66の延出部がある。封孔材68は注入孔を塞ぐように塗布され、延出部で盛り上がっており、一部は注入孔に浸入している。上基板65の切り取り精度を考慮して注入孔のシール突起部69の一部は下基板66の延出部にはみ出している。なお下基板66の注入孔側の端面は、封孔材が付着していないので精度良く加工すれば基準面として使える。   A step may be formed on the injection hole side for various reasons, such as when it is desired to provide a connection electrode also on the injection hole side or when an end surface on the injection hole side is used as a reference surface. 6 (c) and 6 (d), the lower substrate 66 also has an extended portion of the lower substrate 66 on the injection hole side, and an injection hole is formed at an end surface of the upper substrate 65 and a corner formed from the extended portion. Exists. Similar to (a), there is an extended portion of the lower substrate 66 on the side facing the injection hole. The sealing material 68 is applied so as to close the injection hole, swells at the extending portion, and a part of the sealing material enters the injection hole. In consideration of the cutting accuracy of the upper substrate 65, a part of the sealing projection 69 of the injection hole protrudes from the extended portion of the lower substrate 66. The end surface of the lower substrate 66 on the injection hole side can be used as a reference surface if it is processed with high accuracy because no sealing material is attached.

図6(c),(d)で示した注入孔部に段差を有する液晶素子は、段差を形成する前に液晶を注入しても、段差を形成した後に液晶を注入しても良い。例えば文献1には、「電極が形成されている2枚の基板の液晶注入孔側の端面が揃っていない液晶表示素子において、2枚の基板を貼り合わせるためのシール材を液晶注入の注入孔の部分を長くして、基板の端部まで延ばした形にし、2枚の基板間に液晶注入を行い、その後一方の基板を所定
の位置で切断して2枚の基板の液晶注入孔側の端面が揃っていない形状(段差)とし、最後に液晶材料注入孔の封止を行った。」ことが記載されている。なお文献1は、シール材で壁をつくり注入時の液晶の消費削減を目的としていた。
In the liquid crystal element having a step in the injection hole portion shown in FIGS. 6C and 6D, the liquid crystal may be injected before the step is formed, or the liquid crystal may be injected after the step is formed. For example, in Reference 1, “in a liquid crystal display element in which the end surfaces on the liquid crystal injection hole side of two substrates on which electrodes are formed are not aligned, a sealing material for bonding the two substrates is used as an injection hole for liquid crystal injection. This part is made long and extended to the end of the substrate, liquid crystal is injected between the two substrates, one of the substrates is then cut at a predetermined position, and the liquid crystal injection hole side of the two substrates is The shape of the end faces is not uniform (step), and finally the liquid crystal material injection hole is sealed. " Reference 1 was intended to reduce the consumption of liquid crystal during injection by creating a wall with a sealing material.

また封孔情況が悪いと、注入孔を通して液晶が漏れ出したり、外部から異物が浸入したりすることがある。例えば文献2では、「注入孔にも配向膜を設け液晶注入時に液晶が基板上の界面活性材と触れることによって起こる不具合を避けながら、吸湿性のある配向膜を露出させないように延出部にはみ出した配向膜を封孔材で覆い、封孔材が基板面と接着し充分な密着力を確保することで水分の浸入を防いだ。」ということが記載されている。
特許第2776028号公報 特許第3229172号公報
If the sealing condition is bad, the liquid crystal may leak through the injection hole or foreign matter may enter from the outside. For example, in Reference 2, “an alignment film is also provided in the injection hole and liquid crystal is in contact with the surface active material on the substrate at the time of liquid crystal injection, while avoiding the problem that the hygroscopic alignment film is not exposed. The protruding alignment film is covered with a sealing material, and the sealing material adheres to the substrate surface to ensure sufficient adhesion, thereby preventing moisture from entering. "
Japanese Patent No. 2776028 Japanese Patent No. 3229172

注入孔の周りに段差がある液晶素子を封孔材で封孔したところ、水分の浸入が原因と見られる電気抵抗の低下や、液晶の漏れ出しが起きてしまった。文献1は、注入時の液晶消費削減を目的にしているので、前述のような長期信頼性に関わるような事項には言及していない。また今回、印刷法で指定された基板領域に配向膜を形成していたことは文献2の情況と似ていたが、注入孔付近には配向膜がなかったので文献2で示された手法ではこの不具合は解決できない。   When a liquid crystal element having a step around the injection hole was sealed with a sealing material, the electrical resistance was lowered due to the ingress of moisture, and the liquid crystal leaked out. Since Document 1 is aimed at reducing the consumption of liquid crystal during injection, it does not mention the above-mentioned matters relating to long-term reliability. In addition, this time, the alignment film was formed on the substrate region specified by the printing method was similar to the situation in Reference 2, but there was no alignment film near the injection hole, so the method shown in Reference 2 This bug cannot be solved.

そこで本発明の目的は、注入孔の周りの長期信頼性が確保できる液晶素子の製造方法を提供することである。   Accordingly, an object of the present invention is to provide a method of manufacturing a liquid crystal element that can ensure long-term reliability around an injection hole.

対向する一対の基板間をシール材により囲んで形成した空間に液晶を注入するための注入孔を備えた液晶素子の製造方法において、液晶を注入する工程と、注入孔に第1の封孔材を塗布する工程と、第1の封孔材を覆うようにさらに第2の封孔材を塗布する工程とを有することを特徴とする。   In a method for manufacturing a liquid crystal element having an injection hole for injecting liquid crystal into a space formed by enclosing a pair of opposing substrates with a sealing material, a step of injecting liquid crystal, and a first sealing material in the injection hole And a step of further applying a second sealing material so as to cover the first sealing material.

注入孔の外側の第1の封孔材を除去する工程をさらに有することを特徴とする。   The method further includes a step of removing the first sealing material outside the injection hole.

延出部を形成する工程をさらに有し、注入孔が延出部に形成されていることを特徴とする。   The method further includes the step of forming the extension, and the injection hole is formed in the extension.

第1の封孔材を延出部上に残るように塗布したことを特徴とする。   The first sealing material is applied so as to remain on the extended portion.

第1の封孔材を塗布する工程と前記第2の封孔材を塗布する工程との間に注入孔の周辺部を洗浄する工程を有することを特徴とする。   It has the process of wash | cleaning the peripheral part of an injection hole between the process of apply | coating a 1st sealing material, and the process of apply | coating the said 2nd sealing material.

延出部は、外部回路との接続をとるための電極が形成されていないことを特徴とする。   The extending portion is characterized in that an electrode for connecting to an external circuit is not formed.

注入孔の周りに第1の封孔材を塗布しただけでは、十分な長期信頼性を確保することができなかった。これは次の二つの原因が相乗したものである。第1の原因は、封孔材とシール材の密着力が封孔材と基板面との密着力より弱いため、封孔材とシール材との界面で水分の浸入や液晶の漏れ出しが起きてしまったものである。第2の原因は、封孔時に封孔材が注入孔へ流れ込むため、シール突起部ないしその先端付近を回りこむ封孔材の流速が注入孔の中央付近を流れる封孔材の流速より早くなっているためシール突起部周辺で封孔材の少ない部分(剥がれ等)が形成されたものである。シール突起部と接着しているため長期信頼性が不十分な第1の封孔材を覆うように第2の封孔材を塗布した場合、第2の封
孔材は第1の封孔材表面や基板面とだけに強い密着力で接着できるので長期信頼性が確保できる。また第1の封孔材と異なり、第2の封孔材は、塗布してから注入孔に向かって流動することがないのでシール突起部との間に封孔材の少ない部分ができない。このためシール突起部がたまたま第1の封孔材から飛び出していたとしても、第2の封孔材により覆われるので長期信頼性を損なうことはない。
A sufficient long-term reliability could not be ensured only by applying the first sealing material around the injection hole. This is a combination of the following two causes. The first cause is that the adhesion force between the sealing material and the sealing material is weaker than the adhesion force between the sealing material and the substrate surface, so that moisture enters and liquid crystal leaks out at the interface between the sealing material and the sealing material. It is what has been. The second cause is that the sealing material flows into the injection hole at the time of sealing, so that the flow rate of the sealing material that wraps around the seal projection or the tip thereof is faster than the flow rate of the sealing material that flows near the center of the injection hole. Therefore, a portion with little sealing material (peeling off) is formed around the seal projection. When the second sealing material is applied so as to cover the first sealing material that has insufficient long-term reliability because it is bonded to the seal protrusion, the second sealing material is the first sealing material. Long-term reliability can be ensured because it can be bonded with strong adhesion only to the surface and substrate surface. Further, unlike the first sealing material, the second sealing material does not flow toward the injection hole after being applied, and therefore, there is no portion with a small sealing material between the sealing protrusion and the second sealing material. For this reason, even if the seal protrusion happens to protrude from the first sealing material, it is covered with the second sealing material, so long-term reliability is not impaired.

第2の封孔材を塗布する前に注入孔の外側に残っていた第1の封孔材を除去すると、第
1の封孔材は注入孔内だけに残る。このため特に密着力の弱かったシール突起部周辺の第1の封孔材が除去され、さらに第2の封孔材が注入孔に残った第1の封孔材を覆いながら基板面と強い密着力で接着するので長期信頼性がいっそう向上する。
If the first sealing material remaining outside the injection hole is removed before the second sealing material is applied, the first sealing material remains only in the injection hole. For this reason, the first sealing material around the seal projection portion, which has a particularly weak adhesion, is removed, and the second sealing material is in close contact with the substrate surface while covering the first sealing material remaining in the injection hole. Long-term reliability is further improved due to adhesion by force.

背景技術で述べたように、延出部を形成し注入孔を延出部に設けるようにすると、液晶素子の接続端子数が多い場合や、延出部を基準辺として利用する場合に設計の自由度が大きくなる。しかしこの場合、基板の切断精度やシール印刷精度を考慮して延出部にシール突起部がはみ出るよう設計するので、封孔材とシール材界面で生じる不具合要因が延出部にまで広がってしまう。注入孔に第1の封孔材を浸入させた後も延出部上に第1の封孔材が残るように第1の封孔材を塗布し、第1の封孔材を覆うように第2の封孔材を塗布すれば前述の理由から長期信頼性が確保できる。さらに注入孔の外側に残っていた第1の封孔
材を除去すればさらに長期信頼性が向上する。
As described in the background art, when the extension part is formed and the injection hole is provided in the extension part, the design of the liquid crystal element when the number of connection terminals is large or when the extension part is used as a reference side is designed. The degree of freedom increases. However, in this case, since the cutting projection and the seal printing accuracy of the substrate are taken into consideration, the seal protrusion is designed to protrude from the extended portion, so that the cause of the failure that occurs at the interface between the sealing material and the seal material extends to the extended portion. . After the first sealing material has entered the injection hole, the first sealing material is applied so that the first sealing material remains on the extending portion, and the first sealing material is covered. If the second sealing material is applied, long-term reliability can be ensured for the reasons described above. Further, if the first sealing material remaining outside the injection hole is removed, the long-term reliability is further improved.

第1の封孔材を塗布してから第2の封孔材を塗布する前までに注入孔の周辺部を洗浄すると、注入孔の周りや基板面に残っていた液晶を完全に除去できるため第2の封孔材と基板面とを確実に密着できるのでさらに長期信頼性が向上する。   If the peripheral portion of the injection hole is washed before the second sealing material is applied after the first sealing material is applied, the liquid crystal remaining around the injection hole and on the substrate surface can be completely removed. Since the second sealing material and the substrate surface can be reliably adhered, the long-term reliability is further improved.

注入孔が設けられた延出部に外部回路との接続をとるための電極が形成されていないこと、密着力の異なる接続用電極との接着部位がなくなるので熱膨張などによる界面の付近の応力の分布がより均一化するため長期信頼性が向上する。   Stress in the vicinity of the interface due to thermal expansion, etc. because there is no electrode for connecting to the external circuit at the extension part where the injection hole is provided, and there is no adhesion part with the connection electrode with different adhesion force Long-term reliability is improved because of the more uniform distribution.

この発明の液晶素子の製造方法は、上記のような構成および作用を有しているので、封孔材とシール材との間に存在する密着力の弱さや剥がれによる異物の浸入や液晶物資の漏洩に対応できているので、長期信頼性を確保することが可能となった。
Since the method for manufacturing a liquid crystal element of the present invention has the above-described configuration and operation, the infiltration of foreign matter due to weak adhesion or peeling between the sealing material and the sealing material and the liquid crystal material Long-term reliability can be secured because it can cope with leakage.

以下、図面を参照しながらこの発明の実施の形態について詳細に説明する。   Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

(実施例1)
図1と図2で示した実施例1は、延出部を形成する工程と、注入孔に第1の封孔材を塗布する工程と、注入孔の周辺部を洗浄する工程と、第1の封孔材を覆うよう第2の封孔材を塗布する工程を有するものである。図1は重ね合わせまで済んだマザ−基板から第2の封孔材塗布に至るまでの工程図であり、図2は第2の封孔材を硬化させた後の注入孔のシール突起部を縦断する断面図である。
(Example 1)
The first embodiment shown in FIGS. 1 and 2 includes a step of forming an extending portion, a step of applying a first sealing material to the injection hole, a step of cleaning the peripheral portion of the injection hole, A step of applying the second sealing material so as to cover the sealing material. FIG. 1 is a process diagram from a mother substrate that has been overlaid to the application of a second sealing material, and FIG. 2 shows the sealing protrusion of the injection hole after the second sealing material is cured. It is sectional drawing which carries out a longitudinal section.

図1(a)は、重ね合わせあわされた2枚のマザー基板10がシール材11で接着された状態を示している。マザー基板10の対向し合う面は、スペーサにより一定の間隙を有しており、個々の液晶素子の電極がシール材11に対応する領域に形成されている。なおシール材11をマザー基板10上で4行4列のマトリクス状に配列させたが、実際の収差補正用液晶素子はマザー基板上に数100個配列している。シール材11は、2枚のマザー基板10の一方に印刷され、2枚のマザー基板10を重ね合わせたのち加圧状態で焼成
され硬化する。
FIG. 1A shows a state in which the two mother substrates 10 that are overlapped are bonded together by a sealing material 11. Opposing surfaces of the mother substrate 10 have a certain gap due to spacers, and electrodes of individual liquid crystal elements are formed in regions corresponding to the sealing material 11. Although the sealing material 11 is arranged in a matrix of 4 rows and 4 columns on the mother substrate 10, several hundreds of actual aberration correcting liquid crystal elements are arranged on the mother substrate. The sealing material 11 is printed on one of the two mother substrates 10, and after the two mother substrates 10 are overlaid, they are baked and cured in a pressurized state.

図1(b)は、マザー基板10から横一列に配列した液晶素子群(以下短冊と称する)を切り出す工程が含まれた一連の工程を示している。この工程は以下の手順となる。マザー基板10にキズ(以下スクライブ線と称する)をつけ、このスクライブ線に圧力をかけることでマザー基板10を割り短冊12を切り出す。   FIG. 1B shows a series of steps including a step of cutting out liquid crystal element groups (hereinafter referred to as strips) arranged in a horizontal row from the mother substrate 10. This process is as follows. A scratch (hereinafter referred to as a scribe line) is applied to the mother substrate 10 and pressure is applied to the scribe line to divide the mother substrate 10 and cut out strips 12.

図1(c)は、短冊12に延出部を形成する工程が含まれた一連の工程を示している。この工程は以下の手順となる。上基板15にスクライブ線をいれ、上基板15だけを割り、不要部を取り去ると、下基板13が現れ、注入孔側の延出部14と注入孔と反対側の延出部16が形成される。   FIG. 1 (c) shows a series of steps including a step of forming the extending portion in the strip 12. This process is as follows. When a scribe line is inserted into the upper substrate 15, only the upper substrate 15 is split, and unnecessary portions are removed, the lower substrate 13 appears, and the extension portion 14 on the injection hole side and the extension portion 16 on the opposite side of the injection hole are formed. The

図1(d)は、短冊12上の各素子領域に液晶17を注入する工程が含まれた一連の工程を示している。この工程は以下の手順となる。短冊12と液晶溜を真空チャンバーに入れ、チャンバー内を真空にする。短冊12の注入孔を液晶溜に浸し、チャンバー内を大気圧に戻すと、上下の基板15,13とシール材11によって作られた空間に液晶17が入り込む。   FIG. 1D shows a series of steps including a step of injecting the liquid crystal 17 into each element region on the strip 12. This process is as follows. The strip 12 and the liquid crystal reservoir are placed in a vacuum chamber, and the inside of the chamber is evacuated. When the injection hole of the strip 12 is immersed in the liquid crystal reservoir and the inside of the chamber is returned to the atmospheric pressure, the liquid crystal 17 enters the space formed by the upper and lower substrates 15 and 13 and the sealing material 11.

図1(e)は、短冊12上の各素子領域の注入孔に第1の封孔材18を塗布する工程が含まれた一連の工程を示している。この工程は以下の手順となる。液晶17が注入された短冊12を真空チャンバーからとりだし、延出部14に付着している液晶をふき取り、ディスペンサーで各注入孔に第1の封孔材18を塗布する。   FIG. 1 (e) shows a series of steps including a step of applying the first sealing material 18 to the injection hole of each element region on the strip 12. This process is as follows. The strip 12 into which the liquid crystal 17 has been injected is taken out of the vacuum chamber, the liquid crystal adhering to the extension 14 is wiped off, and the first sealing material 18 is applied to each injection hole with a dispenser.

図1(f)は、第1の封孔材18を注入孔に浸入させたのち硬化させる工程が含まれた一連の工程を示している。この工程は以下の手順となる。液晶17が充填された空間を冷却し液晶17を収縮させ、封孔材18を注入孔に引き込む。図中の18aは注入孔に浸入した封孔材である。第1の封孔材18、18aに紫外線を照射し硬化させる。   FIG. 1 (f) shows a series of steps including a step of allowing the first sealing material 18 to enter the injection hole and then hardening. This process is as follows. The space filled with the liquid crystal 17 is cooled, the liquid crystal 17 is contracted, and the sealing material 18 is drawn into the injection hole. In the figure, 18a is a sealing material that has entered the injection hole. The first sealing materials 18 and 18a are cured by irradiating with ultraviolet rays.

図1(g)は、短冊12上の各素子毎に、第1の封孔材18を覆うようにさらに第2の封孔材19を塗布する工程が含まれた一連の工程を示している。この工程は以下の手順となる。第1の封孔材18を硬化させたら、延出部14と注入孔側の上基板15の端面を洗浄し(洗浄工程は図示せず)、ここに付着していた液晶やその他の異物を除去する。その後ディスペンサーで各液晶素子の第1の封孔材18とシール突起部を完全に覆うように第2の封孔材19を塗布し、紫外線により封孔材19を硬化させる。   FIG. 1G shows a series of steps including a step of applying a second sealing material 19 so as to cover the first sealing material 18 for each element on the strip 12. . This process is as follows. After the first sealing material 18 is cured, the end surface of the extended portion 14 and the upper substrate 15 on the injection hole side is cleaned (the cleaning process is not shown), and the liquid crystal and other foreign matters adhering thereto are removed. Remove. Thereafter, a second sealing material 19 is applied by a dispenser so as to completely cover the first sealing material 18 and the seal protrusion of each liquid crystal element, and the sealing material 19 is cured by ultraviolet rays.

基準面を作る場合は、延出部14の一部を延出方向とは直角にダイシングによって精度良く切り落とす。最後に短冊12にスクライブ線を入れ各液晶素子を分離する。   When the reference surface is formed, a part of the extending portion 14 is cut off with high accuracy by dicing at a right angle to the extending direction. Finally, a scribe line is inserted into the strip 12 to separate each liquid crystal element.

図2により、液晶素子の注入孔の状態を説明する。なお同一の部材について図1と図2は同じ番号で示す。上基板15と下基板13の6μmの間隙に液晶17が充填されている。シール材のシール突起部11aは上基板15から延出部に100〜200μm程度はみ出している。第1の封孔材18は、シール突起部の上面と上基板15の端面に接着している。なお第1の封孔材18は、塗布後に注入孔に引き込まれるときの流動で必ずしもシール突起部11aを覆うとは保証できないので、悪い情況を想定しシール突起部11aの一部が第1の封孔材18から露出するよう図示している。第2の封孔材19は、第1の封孔材18とシール突起部11aの露出部を完全に覆い、上基板15の端面と下基板13の延出部の基板面に接着している。   The state of the injection hole of the liquid crystal element will be described with reference to FIG. In addition, FIG. 1 and FIG. 2 show the same member with the same number. A liquid crystal 17 is filled in a 6 μm gap between the upper substrate 15 and the lower substrate 13. The sealing protrusion 11a of the sealing material protrudes from the upper substrate 15 to the extending portion by about 100 to 200 μm. The first sealing material 18 is bonded to the upper surface of the seal projection and the end surface of the upper substrate 15. Since the first sealing material 18 cannot necessarily guarantee that the seal protrusion 11a is covered with the flow when drawn into the injection hole after application, a part of the seal protrusion 11a is assumed to be in the first state assuming a bad situation. It is shown so as to be exposed from the sealing material 18. The second sealing material 19 completely covers the exposed portion of the first sealing material 18 and the seal projection 11 a and adheres to the end surface of the upper substrate 15 and the substrate surface of the extension portion of the lower substrate 13. .

(実施例2)
図3と図4で示した実施例2は、実施例1に、注入孔の外側の第1の封孔材を除去する
工程を追加したものである。図3は重ね合わせまで済んだマザ−基板から第2の封孔に至るまでの工程図であり、図4は第2の封孔後の注入孔周りを縦断する断面図である。なお実施例1と同一の部材に対し、図3,図4と図1,図2は同じ番号で示す。また図3の(a)から(e)までの工程は、図1で示した実施例1の(a)から(e)までの工程と同じである。
(Example 2)
The second embodiment shown in FIGS. 3 and 4 is obtained by adding a step of removing the first sealing material outside the injection hole to the first embodiment. FIG. 3 is a process diagram from the mother substrate that has been overlapped to the second sealing hole, and FIG. 4 is a cross-sectional view that longitudinally cuts around the injection hole after the second sealing. 3, 4 and FIGS. 1 and 2 are denoted by the same reference numerals with respect to the same members as in the first embodiment. Also, the steps from (a) to (e) of FIG. 3 are the same as the steps from (a) to (e) of the first embodiment shown in FIG.

図3(f)は、第1の封孔材18を注入孔に浸入させ硬化させ後、延出部に残っているシール材と封孔材を除去する工程が含まれた一連の工程を示している。この工程は以下の手順となる。実施例1と同様に、液晶17が充填された空間を冷却し液晶17を収縮させ第1の封孔材18を注入孔に引き込み、第1の封孔材18、18aに紫外線を照射し硬化させる。その後、延出部14に残っている第1の封孔材18をシール突起部と共にナイフで削り取る。   FIG. 3 (f) shows a series of steps including a step of removing the sealing material and the sealing material remaining in the extending portion after the first sealing material 18 is infiltrated into the injection hole and cured. ing. This process is as follows. Similarly to Example 1, the space filled with the liquid crystal 17 is cooled, the liquid crystal 17 is contracted, the first sealing material 18 is drawn into the injection hole, and the first sealing materials 18 and 18a are irradiated with ultraviolet rays and cured. Let Thereafter, the first sealing material 18 remaining in the extending portion 14 is scraped off together with the seal protrusion with a knife.

図3(g)は、短冊12上の各素子毎に、第1の封孔材18を覆うようにさらに第2の封孔材19を塗布する工程が含まれた一連の工程を示している。この工程は以下の手順となる。延出部14に残っているシール突起部と第1の封孔材18が除去されたら、延出部14と注入孔側の上基板15の端面を洗浄し(洗浄工程は図示せず)、ここに付着している液晶やシール材、その他の異物を除去する。その後ディスペンサーで各液晶素子の注入孔における第1の封孔材18aの端面と注入孔周りの基板面に第2の封孔材19を塗布し、紫外線により封孔材19を硬化させる。     FIG. 3G shows a series of steps including a step of further applying a second sealing material 19 so as to cover the first sealing material 18 for each element on the strip 12. . This process is as follows. After the seal protrusion and the first sealing material 18 remaining on the extension part 14 are removed, the end face of the extension part 14 and the upper substrate 15 on the injection hole side is cleaned (the cleaning process is not shown), The liquid crystal, sealing material, and other foreign matters adhering thereto are removed. Thereafter, the second sealing material 19 is applied to the end surface of the first sealing material 18a in the injection hole of each liquid crystal element and the substrate surface around the injection hole with a dispenser, and the sealing material 19 is cured by ultraviolet rays.

図4により、液晶素子の注入孔の状態を説明する。(a)はシール突起部を縦断する断面図であり、(b)は注入孔の中央を縦断する断面図である。(a)において、上基板15と下基板13の6μmの間隙には液晶17と削り残されたシール材のシール突起部11bが挟まれている。下基板13の延出部ではシール突起部のシール材は除去されており、第2の封孔材19が残ったシール突起部11bの端面と上基板15の端面、および下基板13の延出部の基板面に接着している。(b)において、上基板15と下基板13の間には、液晶17と注入孔に浸入した封孔材18が挟まれており、延出部では第2の封孔材19が注入孔内に残ったシール突起部18aの端面と上基板15の端面、および下基板13の延出部の上基板15に接着している。   The state of the injection hole of the liquid crystal element will be described with reference to FIG. (A) is sectional drawing which longitudinally cuts a seal projection part, (b) is sectional drawing which longitudinally cuts the center of an injection hole. In (a), the 6 μm gap between the upper substrate 15 and the lower substrate 13 is sandwiched between the liquid crystal 17 and the seal protrusion 11b of the seal material left uncut. The seal material of the seal protrusion is removed from the extended portion of the lower substrate 13, the end surface of the seal protrusion 11 b where the second sealing material 19 remains, the end surface of the upper substrate 15, and the extension of the lower substrate 13. It adheres to the board surface of the part. In (b), between the upper substrate 15 and the lower substrate 13, the liquid crystal 17 and the sealing material 18 that has entered the injection hole are sandwiched, and the second sealing material 19 is placed in the injection hole in the extended portion. The end surfaces of the seal projections 18 a remaining on the end surface of the upper substrate 15 and the upper substrate 15 of the extended portion of the lower substrate 13 are bonded.

基準面を作る場合は、実施例1と同様に延出部14の一部を延出方向とは直角にダイシングによって切り落とす。実施例1は比較的大きな延出部14をもてる場合に有効な方法であったが、実施例2は延出部14を狭くしなければならない場合に有効である。実施例2は、ダイシング時に第2の封孔材19の一部が切りとられたとしても、シール突起部が延出部14に存在しないので長期信頼性を損なうことはない。最後に短冊12にスクライブ線を入れ各液晶素子を分離する。   When the reference surface is formed, a part of the extending portion 14 is cut off by dicing at a right angle to the extending direction as in the first embodiment. The first embodiment is an effective method when a relatively large extending portion 14 is provided, but the second embodiment is effective when the extending portion 14 must be narrowed. In the second embodiment, even if a part of the second sealing material 19 is cut off at the time of dicing, the long-term reliability is not deteriorated because the seal protrusion does not exist in the extending portion 14. Finally, a scribe line is inserted into the strip 12 to separate each liquid crystal element.

(実施例3)
図5で示した実施例3は、実施例2の注入孔の外側の第1の封孔材を除去する工程がダイシングに変わったものである。、図5は注入孔のシール突起部を縦断する断面図であり、第1の封孔材を硬化させてから基準面を作成までの工程を示している。なお実施例1および実施例2と同一の部材は図1、図2と同じ番号で示す。また図5の(e),(f)、(g)は図3の(e),(f),(g)と対応関係にあり、図5(h)は基準面作成工程が含まれた一連の工程を示している。
(Example 3)
In Example 3 shown in FIG. 5, the process of removing the first sealing material outside the injection hole of Example 2 is changed to dicing. FIG. 5 is a cross-sectional view of the injection hole sealing protrusion, which shows a process from curing the first sealing material to creating a reference surface. In addition, the same member as Example 1 and Example 2 is shown with the same number as FIG. 1, FIG. 5 (e), (f), and (g) correspond to (e), (f), and (g) in FIG. 3, and FIG. 5 (h) includes a reference surface creation step. A series of steps is shown.

図5(e)は、第1の封孔材18を塗布する工程が含まれた一連の工程において、第1の封孔材18の硬化が終了した状態を示している。上基板15と下基板13の6μmの間隙には液晶17が充填されている。シール材からなるシール突起部11aは上基板15から延出部に100〜200μm程度はみ出している。第1の封孔材18は、シール突起部
11aの上面と上基板15の端面に接着している。なお第1の封孔材18は、塗布後に注入孔に引き込まれるときの流動で必ずしもシール突起部11aを覆うとは保証できないので、悪い情況を想定しシール突起部11aの一部が第1の封孔材18から露出するよう図示している。
FIG. 5E shows a state in which the first sealing material 18 has been cured in a series of steps including the step of applying the first sealing material 18. A liquid crystal 17 is filled in a 6 μm gap between the upper substrate 15 and the lower substrate 13. The seal protrusion 11a made of the seal material protrudes from the upper substrate 15 to the extended portion by about 100 to 200 μm. The first sealing material 18 is bonded to the upper surface of the seal projection 11 a and the end surface of the upper substrate 15. Since the first sealing material 18 cannot necessarily guarantee that the seal protrusion 11a is covered with the flow when drawn into the injection hole after application, a part of the seal protrusion 11a is assumed to be in the first state assuming a bad situation. It is shown so as to be exposed from the sealing material 18.

図5(f)は、封入孔の外側の第1の封孔材18を除去する工程が含まれた一連の工程において、ダイシングで第1の封孔材18を削り取った情況を示している。この工程は以下の手順となる。第1の封孔材18を注入孔に浸み込ませ硬化させた後、上基板15の端面21と延出部の上面22をそれぞれ75μmずつダイシングブレードで削り粗面を形成する。ダイシングブレードの厚みは150ミクロンなので、延出部14の延出方向と直角(紙面に垂直な方向)に複数の溝を(75ミクロンの切り込み)を入れる。このとき延出部に残っていた第1の封孔材18とシール突起部11a、および注入孔内にあった第1の封孔材18a(図示せず)とシール突起部11aの一部も削り取られる。なお図示していないが、注入孔(シール突起部11aと重なる位置)に第1の封孔材18aが残っている。   FIG. 5F shows a situation where the first sealing material 18 is removed by dicing in a series of steps including the step of removing the first sealing material 18 outside the sealing hole. This process is as follows. After the first sealing material 18 is dipped into the injection hole and hardened, the end surface 21 of the upper substrate 15 and the upper surface 22 of the extended portion are each cut by 75 μm with a dicing blade to form a rough surface. Since the thickness of the dicing blade is 150 microns, a plurality of grooves (notches of 75 microns) are made at right angles to the extending direction of the extending portion 14 (perpendicular to the paper surface). At this time, the first sealing material 18 and the seal protrusion 11a remaining in the extending portion, and the first sealing material 18a (not shown) and a part of the seal protrusion 11a in the injection hole are also included. Scraped off. Although not shown, the first sealing material 18a remains in the injection hole (position overlapping the seal projection 11a).

図5(g)は、第1の封孔材18を覆うようにさらに第2の封孔材19を塗布する工程が含まれた一連の工程において、第2の封孔材19が硬化した情況を示している。第2の封孔材19は、シール突起部11aの端面、上基板15の端面21、延出部の上面22と接着している。図示していないが、第2の封孔材19は注入孔内に残った第1の封孔材18aの端面とも接着している。   FIG. 5G shows a situation where the second sealing material 19 is cured in a series of steps including a step of applying the second sealing material 19 so as to cover the first sealing material 18. Is shown. The second sealing material 19 is bonded to the end surface of the seal projection 11a, the end surface 21 of the upper substrate 15, and the upper surface 22 of the extending portion. Although not shown, the second sealing material 19 is also bonded to the end surface of the first sealing material 18a remaining in the injection hole.

図5(h)は、基準面作成工程が含まれた一連の工程において、基準面23を作成し終わった情況を示している。延出部14の一部を延出方向とは直角にダイシングによって基板を切り落とし基準面23を作成する。この結果延出部の幅は0.5mmとなり、ダイシング時に第2の封孔材19の一部も切りとられる。最後に短冊12にスクライブ線を入れ各液晶素子を分離する。   FIG. 5H shows a situation where the reference surface 23 has been created in a series of steps including the reference surface creation step. A part of the extended portion 14 is cut off by dicing at a right angle to the extending direction to create a reference surface 23. As a result, the width of the extended portion is 0.5 mm, and a part of the second sealing material 19 is also cut during dicing. Finally, a scribe line is inserted into the strip 12 to separate each liquid crystal element.

なお第1の封孔材18と第2の封孔材19は同一の材料であっても、別の材料であってもかまわない。第2の封孔材19は液晶に触れることがほとんどないため液晶との相性に配慮しなくて良いので選択肢が広がる。   The first sealing material 18 and the second sealing material 19 may be the same material or different materials. Since the second sealing material 19 hardly touches the liquid crystal, there is no need to consider the compatibility with the liquid crystal, so the options are widened.

実施例1,2,3とも延出部14を作成してから液晶17を注入していたが、液晶を注入してから延出部を作成してもよい。この場合は注入孔のシール突起部を延出側基板の端部まで延ばしておき、このシール突起部間から液晶の注入を行い、その後延出部を形成し第1の封孔を行う。延出部にはシール突起部が残っているので封孔材とシール突起部のシール材を除去してから第2の封孔材を塗布することが好ましい。

In each of the first, second, and third embodiments, the liquid crystal 17 was injected after the extended portion 14 was formed. However, the extended portion may be formed after the liquid crystal is injected. In this case, the seal projection of the injection hole is extended to the end of the extension side substrate, liquid crystal is injected from between the seal projections, and then the extension is formed to perform the first sealing. Since the seal protrusion remains in the extended portion, it is preferable to apply the second sealant after removing the sealant and the seal material of the seal protrusion.

本発明の実施例1の液晶素子の工程図である。It is process drawing of the liquid crystal element of Example 1 of this invention. 本発明の実施例1の液晶素子のシール材のシール突起部を縦断する断面図である。It is sectional drawing which longitudinally cuts the sealing projection part of the sealing material of the liquid crystal element of Example 1 of this invention. 本発明の実施例2の液晶素子の工程図である。It is process drawing of the liquid crystal element of Example 2 of this invention. 本発明の実施例2の液晶素子の注入孔周りを縦断する断面図である。It is sectional drawing which carries out the longitudinal section around the injection hole of the liquid crystal element of Example 2 of this invention. 本発明の実施例3の液晶素子の注入孔周りの工程毎の断面図である。It is sectional drawing for every process around the injection hole of the liquid crystal element of Example 3 of this invention. 従来例の液晶素子を注入孔側から見た斜視図と平面図である。It is the perspective view and top view which looked at the liquid crystal element of the prior art example from the injection hole side.

符号の説明Explanation of symbols

10 マザー基板
11,62,67 シール材
13,61,66 下基板
14,16 延出部
15,60,65 上基板
17 液晶
18 第1の封孔材
19 第2の封孔材
21 上基板の端面
22 延出部の上面
23 基準面
63,68 封孔材
64,69 注入孔のシール突起部

10 Mother substrate 11, 62, 67 Sealing material 13, 61, 66 Lower substrate 14, 16 Extension portion 15, 60, 65 Upper substrate 17 Liquid crystal 18 First sealing material 19 Second sealing material 21 Upper substrate 21 End surface 22 Upper surface 23 of extension part Reference surface 63, 68 Sealing material 64, 69 Seal projection part of injection hole

Claims (6)

対向する一対の基板間をシール材により囲んで形成した空間に液晶を注入するための注入孔を備えた液晶素子の製造方法において、
前記液晶を注入する工程と、
前記注入孔に第1の封孔材を塗布する工程と、
前記第1の封孔材を覆うようにさらに第2の封孔材を塗布する工程と、
を有することを特徴とする液晶素子の製造方法。
In a method of manufacturing a liquid crystal element having an injection hole for injecting liquid crystal into a space formed by enclosing a pair of opposing substrates with a sealing material,
Injecting the liquid crystal;
Applying a first sealing material to the injection hole;
Applying a second sealing material to cover the first sealing material;
A method for producing a liquid crystal element, comprising:
前記注入孔の外側の前記第1の封孔材を除去する工程をさらに有することを特徴とする
請求項1記載の液晶素子の製造方法。
The method of manufacturing a liquid crystal element according to claim 1, further comprising a step of removing the first sealing material outside the injection hole.
延出部を形成する工程をさらに有し、前記注入孔が前記延出部に形成されていることを特徴とする請求項1または2記載の液晶素子の製造方法。   The method for manufacturing a liquid crystal element according to claim 1, further comprising a step of forming an extension portion, wherein the injection hole is formed in the extension portion. 前記第1の封孔材を、前記延出部上に残るように塗布したことを特徴とする請求項3に記載の液晶素子の製造方法。   The method for manufacturing a liquid crystal element according to claim 3, wherein the first sealing material is applied so as to remain on the extending portion. 前記第1の封孔材を塗布する工程と前記第2の封孔材を塗布する工程との間に前記注入孔の周辺部を洗浄する工程を有することを特徴とする請求項1乃至4のいずれか1項に記載の液晶素子の製造方法。   5. The method according to claim 1, further comprising a step of cleaning a peripheral portion of the injection hole between the step of applying the first sealing material and the step of applying the second sealing material. The manufacturing method of the liquid crystal element of any one. 前記延出部は、外部回路との接続をとるための電極が形成されていないことを特徴とする請求項3乃至5のいずれか1項に記載の液晶素子の製造方法。


6. The method of manufacturing a liquid crystal element according to claim 3, wherein an electrode for connecting to an external circuit is not formed in the extension portion.


JP2006314228A 2006-11-21 2006-11-21 Method for manufacturing liquid crystal element Pending JP2008129327A (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013205578A (en) * 2012-03-28 2013-10-07 Citizen Finetech Miyota Co Ltd Liquid crystal display element and method for manufacturing the same
US9075257B2 (en) 2012-05-07 2015-07-07 Samsung Display Co., Ltd. Display device and manufacturing method thereof
US9356050B2 (en) 2014-01-08 2016-05-31 Samsung Display Co., Ltd. Display apparatus and method of manufacturing the same
CN108107631A (en) * 2017-12-21 2018-06-01 苏州汉朗光电有限公司 A kind of novel liquid crystal box structure and its manufacture craft

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013205578A (en) * 2012-03-28 2013-10-07 Citizen Finetech Miyota Co Ltd Liquid crystal display element and method for manufacturing the same
US9075257B2 (en) 2012-05-07 2015-07-07 Samsung Display Co., Ltd. Display device and manufacturing method thereof
US9500913B2 (en) 2012-05-07 2016-11-22 Samsung Display Co., Ltd. Display device and manufacturing method thereof
US9356050B2 (en) 2014-01-08 2016-05-31 Samsung Display Co., Ltd. Display apparatus and method of manufacturing the same
CN108107631A (en) * 2017-12-21 2018-06-01 苏州汉朗光电有限公司 A kind of novel liquid crystal box structure and its manufacture craft

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