JP2008089536A - Connection inspection apparatus for integrated circuit device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To construct a connection inspection apparatus for integrated circuit devices capable of checking the quality of coupling sections of integrated circuit devices with a high degree of accuracy in a short time. <P>SOLUTION: The connection inspection apparatus for integrated circuit devices is constructed of a multipoint probe equipped with a test wave application circuit, where a plurality of probe pins contacting a plurality of contacting parts of an inspected integrated circuit device, respectively, are implanted in an insulating plate, connected to a test wave application terminal applying test wave through switching elements for each probe pin, a switching control means outputting switch signal selectively for each one element to switching elements of the test wave application circuit to form the test wave application circuit, a test wave application means applying test wave to the test wave application circuit formed by the switching control means, and a connectedness diagnostic means observing the applied test wave and the reflected wave reflected from the inspected integrated circuit device to diagnose connectedness of the inspected integrated circuit device. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a connection inspection device for an integrated circuit device that inspects a connection state of an integrated circuit device in which an integrated circuit such as a BGAIC is mounted on a mounting substrate.

  An integrated circuit device such as a BGA package or an SOJ package has terminals on the lower surface of the mounted mounting board, and the terminals and the mounting board are connected by solder balls. Since the connection part is hidden between the package and the mounting board and cannot be visually inspected, the connection part is inspected by placing an X-ray generation source on the upper part of the connection part and image inspection on the lower part. A part is placed and irradiated with X-rays, a predetermined signal processing is applied to the detection signal of the image detection part, and this is imaged, and a laser light source is placed above the semiconductor connection part In many cases, a laser beam is irradiated from the laser light source to the semiconductor connection portion, the reflected laser beam is detected by a CCD camera, and the quality of the connection state is identified by the shape of the solder fillet.

  Patent Document 1 discloses a method for detecting a non-connection state of a connection part by applying an ultrasonic pulse to a connection part of a semiconductor device and observing the reflection state thereof.

  In Patent Document 2, a high-frequency pulse wave is applied to a land of a substrate via a probe, an input pulse wave and a reflected pulse wave are measured, and the waveform is analyzed to identify whether the connection state of the solder part is good or bad. The method is shown. In this method, the probe is connected to the land of the substrate by the XY drive means, sequentially connected to the land to be inspected, input pulses are input, the input pulse and the reflected wave are observed, and the connection state is inspected. The inspection device to be shown is shown.

Japanese Patent Laid-Open No. 03-084453 JP 09-061486 A

In the inspection method by irradiating the connection portion with X-rays and applying predetermined signal processing to the detection signal of the image detection portion and imaging it, it is difficult to display a clear image with a minute portion to be confirmed. There was a problem that the connection status could not be confirmed in detail.
In addition, in the inspection method disclosed in Patent Document 1, when an ultrasonic pulse is applied and there are a large number of connection portions, the inspection is sequentially performed for each connection portion, and the inspection time becomes long, and the product is mass-produced. There is a problem that it is difficult to apply.
In the case of Patent Document 2, a high-frequency pulse wave is applied to a land of a substrate through a probe, an input pulse wave and a reflected pulse wave are measured, and the waveform is analyzed to determine whether the connection part is good or bad. There is a problem that the probe is moved by the XY driving means and sequentially connected to the land to be inspected, but the moving time for moving the connecting portion is necessary, and the inspection time becomes long.

  The present invention has been made to solve the above-described problems, and an object thereof is to provide a connection inspection device for an integrated circuit device capable of accurately and quickly inspecting the quality of many connection points of the integrated circuit device. To do.

  In the integrated circuit device connection inspection device according to the present invention, a plurality of probe pins respectively contacting a plurality of contact portions of the integrated circuit device to be inspected are implanted in an insulating plate, and a test wave is connected to each probe pin via a switching element. A test wave applying circuit that selectively outputs an open / close signal for each element to a switching element of the test wave applying circuit and a multipoint probe connected to a test wave applying circuit connected to a test wave applying terminal A switching control means for forming a test wave, a test wave applying means for applying a test wave to a test wave applying circuit formed by the switching control means, and an observation of the applied test wave and a reflected wave reflected from the integrated circuit device to be inspected And connection state diagnosis means for diagnosing the connection state of the integrated circuit device to be inspected.

  If comprised in this way, it will become an inspection apparatus which can test | inspect accurately and efficiently the non-destructive connection part of the integrated circuit device provided with many connection parts which cannot be visually recognized from the outside.

Embodiment 1 FIG.
An integrated circuit device of a BGA (ball grid array) package or a SOJ (small outline j lead) package, for example, a BGA package in which a BGAIC is mounted on a mounting substrate, is configured as shown in FIGS.
FIG. 1A is a cross-sectional view of an integrated circuit device of a BGA package, and FIG. 1B is a partially enlarged view of FIG. FIG. 2 is a diagram showing a state of the connection side of the IC mounting surface of the mounting substrate and the opposite surface, FIG. 2A is an arrangement state of lands and through holes on the IC mounting surface, and FIG. It is a figure which shows the state of the connection surface opposite to (a).

The IC 11 of the integrated circuit device 10 shown in FIG. 1 includes a plurality of connecting portions 12 regularly arranged on the mounting board side, and the mounting side of the mounting board 21 is connected to the IC 11 as shown in FIG. A land 22 connected via a solder ball 15 is provided at a position facing the connection portion 12, and a through hole 23 penetrating from each land 22 to the opposite surface is provided, and a connection land connected to the outside is provided on the opposite connection surface. 24 are regularly arranged, and the land 22 and the connection land 24 are connected to the through hole 23 through a conductor.
The integrated circuit device 10 is configured by integrating the IC 11 and the mounting substrate 21 by disposing and heating the solder balls 15 between the connection portion 12 of the IC 11 and the land 22 of the mounting substrate 21.

3 is a configuration diagram of a connection inspection device for an integrated circuit device, FIG. 4 is an enlarged view of a probe pin portion, and FIG.
The integrated circuit device connection inspection device simultaneously contacts a plurality of connection portions of the integrated circuit device 10, and provides a switching element at each contact portion to form a test wave application circuit for a connection portion that is inspected by an open / close signal. The probe 30 and a switching control means 51 for sequentially forming a test wave application circuit to a contact portion to be inspected, a test wave application means 52, a connection state diagnosis means 53, a storage means 53, and a display means 54 are provided.

  In the multipoint probe 30, probe pin holes 33 are formed in the insulating plate 32 in accordance with the arrangement interval of the connecting portions 24 of the integrated circuit device 10 so that the insulating plate 32 contacts the plurality of contact portions 24 of the integrated circuit device 10 simultaneously. A probe plate 31 in which holes are provided and the probe pins 35 are implanted, and a test wave application circuit 42 in which all the probe pins 35 of the probe plate 31 are in contact with each other and a switching element 43 is provided in the middle and connected to the test wave application terminal 45. The control line 44 for controlling the opening / closing of each switching element 43 is constituted by an interface substrate 41 wired so as to be connected to the switching control means 51.

As shown in FIG. 4, the probe pin 35 has a configuration in which a pressing spring 35b is arranged at the center of the inner diameter of the cylindrical member 35a, and a contact 35c and a contact 35d are inserted at both ends so as to be movable in the axial direction. It is.
With this configuration, the probe pin 35 is always applied to the integrated circuit device 10 contact portion 24 and the test wave application circuit 42 of the interface substrate 41 by the spring 35b even if the contact portion 24 of the integrated circuit device 10 has some unevenness. It is pressed and a reliable contact state is ensured.

  Since the contact portion 24 of the integrated circuit device 10 is connected to the land 22 by soldering through a conductor, there is a slight unevenness and a crown shape (crown) as shown in FIG. Type). Thus, when it forms in a crown shape, since there are two contact points, it can be made to contact reliably.

  The switching control means 51 sends an open / close signal to the switching element 43 so as to form a test wave application circuit 42 by selecting each connection part to which the test wave is applied to the connection part for inspecting the integrated circuit device. The transmission is configured so that the connection unit is sequentially switched.

  The test wave application unit 52 includes a pulse generation circuit that generates a high-frequency pulse to be applied to the connection unit 24 of the integrated circuit device 10, and is configured to operate in synchronization with the switching signal of the switching control unit 51. .

The connection state diagnosis unit 53 observes the applied wave of the high-frequency pulse applied from the test wave applying unit 52 and the reflected wave from the integrated circuit device 10, and calculates the distance of the reflection point from the time interval between the applied wave and the reflected wave. When the distance of the reflection point is calculated, it is determined as a defect, and the position of the defect can be specified by the calculated distance.
By using a time domain reflectometer (TDR: Time Domain Reflectometer) as the waveform observation device of the connection state diagnosis means 53, the unconnected portion of the integrated circuit device 10 can be easily detected.

For example, as shown in FIG. 6, examples of observed waveforms of applied waves and reflected waves when there is a solder crack (crack) in the solder ball 15 portion of the integrated circuit device 10 are shown in FIG.
FIG. 7A shows the applied waveform, and FIG. 7B shows the waveform observed by the connection state diagnosis means 53. With respect to the application time t0 of the observed waveform (b), the voltage rises stepwise at the time tr when the reflected wave returns. The position of the disconnection portion is calculated from the time T between the application time t0 and the reflected wave observation time tr. If the position of the disconnected portion is the position of the solder ball, it is determined that the solder ball has a connection failure.

  The storage means 54 transmits the diagnosis result of the connection state diagnosis means 53 by the digital communication means and stores it corresponding to the inspection position. The storage means 53 may be installed in the inspection apparatus or may be arranged at another location.

  The display unit 55 is configured to display the diagnosis result of each connection unit stored in the storage unit 54 corresponding to the connection unit.

When the connection portion of the integrated circuit device 10 is inspected using the connection inspection device of the integrated circuit device configured as described above, the integrated circuit device 10 to be inspected is mounted on the multipoint probe 30 and inspected by the switching control means 51. A test wave application circuit for the connecting portion to be formed, a test wave is applied by the test wave application means 52, and when the application waveform of the test wave and the waveform of the reflected wave are observed by the connection state diagnosis means 53, the application time and The distance to the reflection point is calculated based on the difference from the detection time of the reflected wave, and the calculated distance becomes the disconnection position. If the disconnection position is the soldering position, it becomes a soldering defect. If the distance is inside the integrated circuit device, Can be determined as a malfunction in the integrated circuit.
By repeating such an operation for each connection portion, the connection portion of the integrated circuit device having a large number of connection portions that cannot be visually recognized from the outside can be inspected accurately and efficiently without destruction.

It is sectional drawing which shows the structure of an integrated circuit device. It is a figure which shows the state of the connection side of the IC mounting surface of the mounting substrate of an integrated circuit device, and its opposite surface. It is a block diagram of the connection inspection apparatus of an integrated circuit device. It is an enlarged view of the probe pin part of FIG. It is a structure explanatory view of a multipoint probe. It is explanatory drawing when a solder crack remains in the solder ball part of the connection part of an integrated circuit device. It is explanatory drawing of an observation waveform.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Integrated circuit device, 11 Integrated circuit, 12 Connection part, 15 Solder ball,
21 mounting board, 22 lands, 23 through holes, 24 connection lands,
30 multipoint probe, 31 probe plate, 32 insulation plate, 35 probe pin,
41 interface board, 42 test wave application circuit, 43 switching element,
44 switching element control circuit, 45 test wave application terminal, 51 switching control means,
52 test wave application means, 53 connection state diagnosis means, 54 storage means, 55 display means.

Claims (5)

A plurality of probe pins that are in contact with a plurality of contact portions of the integrated circuit device to be inspected are implanted in an insulating plate and connected to a test wave application terminal that applies a test wave to each probe pin via a switching element. A multipoint probe having an application circuit; a switching control means for selectively outputting an opening / closing signal for each switching element of the test wave application circuit to form a test wave application circuit; and the switching control means A test wave applying means for applying a test wave to the test wave applying circuit formed by the method, and a connection state of the integrated circuit device to be inspected by observing the applied test wave and a reflected wave reflected from the integrated circuit device to be inspected. And a connection state diagnosis means for diagnosing the connection. 2. The integrated circuit device according to claim 1, further comprising storage means for storing a diagnosis result diagnosed by the connection state diagnosis means for each inspection position and a display means for displaying the stored diagnosis result. Connection inspection device. 3. The probe pin according to claim 1, wherein a pressing spring is disposed at a central portion of the inner diameter of the cylindrical member, and contacts are inserted into both ends so as to be movable in the axial direction. Integrated circuit device connection inspection device. 4. The connection inspection of an integrated circuit device according to claim 1, wherein the tip of the contact that contacts the inspected integrated circuit device side of the probe pin is formed in a crown shape. apparatus. 5. The integrated circuit device connection inspection device according to claim 1, wherein the connection state diagnosis means is a time domain reflection measurement device.

Images