JP2008079909A - Ultrasonic probe and ultrasonic imaging apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent damage of a circuit element while miniaturizing an ultrasonic probe and realizing high-density packaging of the circuit element. <P>SOLUTION: This ultrasonic probe is provided with an ultrasonic transducer array having a plurality of ultrasonic transducers transmitting ultrasonic waves according to the applied drive signal, receiving the ultrasonic waves and generating a receiving signal, and a substrate having a plurality of wiring patterns and packaged with an integrated circuit; and is characterized in that the substrate is formed with a recess part, the ultrasonic transducer array is disposed on a backing material, and the ultrasonic transducer array and the backing material are inserted into the recess part of the substrate. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an ultrasonic probe including a plurality of ultrasonic transducers that transmit and / or receive ultrasonic waves. Furthermore, the present invention relates to an ultrasonic imaging apparatus for medical use or structural flaw detection, which includes such an ultrasonic probe and a main body apparatus.

  2. Description of the Related Art Conventionally, in an ultrasonic probe (probe) that obtains image information by transmitting and receiving ultrasonic waves, a plurality of elements (ultrasonic transducers) using a piezoelectric material such as PZT (lead zirconate titanate) are used. It is common to use a one-dimensional sensor array arranged in a dimension. Furthermore, a two-dimensional image is acquired by mechanically moving such a one-dimensional sensor array, and a three-dimensional image is obtained by combining a plurality of two-dimensional images.

  However, according to this method, since there is a time lag in the moving direction of the one-dimensional sensor array, cross-sectional images at different times are synthesized, and the synthesized image becomes blurred. Therefore, it is not suitable for a subject that is intended for a living body as in the case of performing ultrasonic echo observation in ultrasonic diagnostic medicine.

  Therefore, in recent years, by using a two-dimensional sensor array in which elements for transmitting and receiving ultrasonic waves are two-dimensionally arranged, the ultrasonic waves are electrically steered, and in the depth direction, a method such as dynamic focusing is used. Attempts have been made to improve the quality of ultrasound images.

  By using the two-dimensional sensor array, a high-quality three-dimensional image can be obtained without mechanically moving the sensor array. In order to put the ultrasonic probe having such a two-dimensional sensor array into practical use, a large number of elements must be highly integrated, and signals can be transmitted and received between the elements and the ultrasonic imaging apparatus body. is necessary.

  In the medical field, for example, a catheter-type ultrasonic probe inserted into a blood vessel has been realized, which is useful for diagnosis of arteriosclerosis and the like. In the catheter-type ultrasonic probe and the ultrasonic endoscope that are used by being inserted into the body of the patient as described above, downsizing of the ultrasonic probe is required.

  Furthermore, in medical ultrasound probes, temperature control circuits such as temperature sensors and Peltier elements are used to ensure patient safety against the fever of the ultrasound probe and to prevent performance degradation due to fever. Mounting is also being studied, and high-density mounting of circuit elements is required. Therefore, various technologies have been developed in order to realize miniaturization of ultrasonic probes and high-density mounting of circuit elements.

  As a related technique, the following Patent Document 1 discloses a probe body for insertion into a cavity having a small size approximate to a coronary artery of a human body, an array of transducer elements mounted on the probe body, and a probe body. Means in proximity to the array of transducer elements that receive the electrical signals from the array of transducer elements and route them in the cable without causing significant loss of imaging information. An imaging device is disclosed for generating an available image in response to detection of ultrasound reflections, and means for converting to be transmitted along at least one channel. According to this imaging apparatus, the number of cables for connecting the catheter-type probe and the imaging apparatus main body can be reduced.

  However, as shown in FIG. 7 of Patent Document 1, since the array of transducer elements and the integrated circuit chip are mounted at different positions on the probe body, the ultrasonic probe can be sufficiently miniaturized. It is hard to say that it has been achieved.

  Patent Document 2 below discloses an ultrasonic probe including a back load material, a composite piezoelectric body, and a matching layer, a silicon substrate integrated with the ultrasonic probe, and a silicon substrate on the silicon substrate. An electric circuit-integrated composite piezoelectric ultrasonic probe including an electric circuit mounted thereon is disclosed. In Patent Document 2, after a part of a silicon substrate is etched, a piezoelectric body is cast and fired using the etched silicon substrate as a mold, and an ultrasonic probe having a fine structure is manufactured. It is described that an electric circuit integrated ultrasonic probe can be manufactured by forming an electric circuit on the remaining surface of the silicon substrate.

  However, when an integrated circuit is formed on a silicon substrate on which a piezoelectric element is formed, a temperature of about 500 ° C. or more is required for forming an insulating film, dopant diffusion, or forming an electrode when forming the integrated circuit. Needed. Therefore, the problem that the epoxy resin etc. which are used for the piezoelectric element will be damaged by the temperature is considered. On the other hand, when a piezoelectric element is formed on a silicon substrate on which an integrated circuit is formed, a temperature of about 1000 ° C. is required to sinter the piezoelectric powder. For this reason, there is a problem that a transistor or the like constituting the integrated circuit is damaged by the temperature.

  Further, in Patent Document 3 below, a semiconductor wafer on which transistors and the like are formed, a piezoelectric vibrator having one signal electrode connected to a buried layer exposed on the substrate side of the wafer, and a matrix array An ultrasonic probe including an element IC created corresponding to the pitch of the transducer, a control circuit for driving the element IC, and an addition circuit is disclosed. In Patent Document 3, since a wafer on which an electronic circuit is formed is attached on a signal electrode of a piezoelectric vibrator via a conductive adhesive, the piezoelectric vibrator and the electronic circuit are made to correspond one-to-one. It is described that the need for wiring can be eliminated.

However, since the piezoelectric vibrator is formed directly under the integrated circuit, when the piezoelectric vibrator is driven, the vibration is directly transmitted to the integrated circuit, and as a result, the integrated circuit may be damaged. Therefore, it is considered that practicality and reliability are low.
Japanese Patent Publication No. 2-502078 (first page, FIG. 7) JP 2000-298119 A (2nd, 4th page, FIG. 1) Japanese Patent Laid-Open No. 5-103397 (second page, FIG. 2)

  Therefore, in view of the above points, an object of the present invention is to prevent damage to circuit elements while realizing miniaturization of an ultrasonic probe and high-density mounting of circuit elements.

  In order to solve the above-described problem, an ultrasonic probe according to one aspect of the present invention transmits a plurality of ultrasonic waves that transmit an ultrasonic wave according to an applied drive signal and generate a reception signal by receiving the ultrasonic wave In an ultrasonic probe comprising an ultrasonic transducer array having a transducer and a substrate having a plurality of wiring patterns and on which an integrated circuit is mounted, a concave portion is formed on the substrate, and the ultrasonic transducer array is The ultrasonic transducer array and the backing material are disposed on the backing material, and are inserted into the recesses of the substrate.

  According to the present invention, the ultrasonic transducer array and the backing material are inserted into the concave portion of the substrate, so that the ultrasonic probe can be miniaturized and the circuit elements can be mounted at a high density while the circuit elements are damaged. Can be prevented.

Hereinafter, the best mode for carrying out the present invention will be described in detail with reference to the drawings. In addition, the same reference number is attached | subjected to the same component and description is abbreviate | omitted.
FIG. 1 is a diagram showing a configuration example of an ultrasonic probe according to the first embodiment of the present invention. The ultrasound probe 1 is, for example, a catheter-type ultrasound probe that is inserted into a patient's body, and is connected to an ultrasound imaging apparatus main body installed outside via a plurality of cables. Is done. As shown in FIG. 1, a drive signal and a reception signal transmitted and received between the ultrasonic imaging apparatus main body and the ultrasonic probe 1 are transmitted using a coaxial cable, and ultrasonic waves are transmitted from the ultrasonic imaging apparatus main body. The control signal transmitted to the probe 1 is transmitted using a single wire cable.

  The ultrasonic probe 1 includes a plurality of impedance matching circuits 2 connected to a plurality of input / output terminals, a plurality of multiplexers (switching circuits) 3 connected to the impedance matching circuits 2, respectively, Each set of transducers (ultrasonic transducers) 11 connected to the multiplexer 3 is included.

  A plurality of sets of transducers 11 included in the ultrasonic probe 1 are arranged one-dimensionally or two-dimensionally to constitute an ultrasonic transducer array. Each transducer 11 generates an ultrasonic wave based on a drive signal supplied from the ultrasonic imaging apparatus main body, and transmits the ultrasonic wave toward the subject. Each transducer 11 receives an ultrasonic echo reflected by the subject and outputs a reception signal to the ultrasonic imaging apparatus main body. The detailed structure of the vibrator 11 will be described later.

  2A to 2D, for example, the impedance matching circuit 2 is a circuit composed of at least one of an inductance, a resistance, and a capacitor, and in each signal path, the characteristic impedance of the coaxial cable. And the impedance of the vibrator 11 can be matched to improve the signal transmission efficiency. In FIG. 1, the impedance matching circuit 2 is connected between the coaxial cable and the multiplexer 3. However, the impedance matching circuit 2 is connected between the multiplexer 3 and the vibrator 11. Also good.

  In the impedance matching circuit shown in FIG. 2A, an inductance L and a resistor R are connected in parallel with the vibrator via the multiplexer 3. Since these impedances become maximum at the resonance frequency of the capacitance and inductance L of the vibrator, the coaxial cable is terminated by the resistor R. Therefore, if the value of the resistance R is close to the value of the characteristic impedance of the coaxial cable, impedance matching can be achieved at the resonance frequency, and signal reflection at the end of the coaxial cable can be prevented. The impedance matching circuit shown in FIG. 2B is a simplified version of the impedance matching circuit shown in FIG. 2A, and a resistor R is connected in parallel with the vibrator via the multiplexer 3.

  In the impedance matching circuit shown in FIG. 2C, a series circuit of an inductance L, a capacitor C, and a resistor R is connected in parallel with the vibrator via the multiplexer 3. The capacitor C is inserted in order to prevent the direct current component from flowing through the ultrasonic probe 1 when the resonance frequency is adjusted or when the direct current component is applied from the drive circuit of the ultrasonic imaging apparatus main body.

  In the impedance matching circuit shown in FIG. 2D, a series circuit of an inductance L1 and an inductance L2 is connected in series with the vibrator via the multiplexer 3, and between the connection point of the inductance L1 and the inductance L2 and the ground terminal. , Capacitor C is connected. In addition to the above, various impedance matching circuits can be used.

  Referring to FIG. 1 again, the multiplexer 3 selects one transducer 11 from one set (four in FIG. 1) based on the control signal supplied from the ultrasonic imaging apparatus main body. Then, it is connected to the ultrasonic imaging apparatus main body via a coaxial cable. By using the multiplexer 3, it is possible to reduce the number of coaxial cables and suppress the increase in size of the entire cable. However, since the four transducers 11 connected to one multiplexer 3 cannot operate simultaneously, the transducers 11 connected to one multiplexer 3 are based on an ultrasonic transmission pattern or reception pattern. The number and arrangement of are determined.

FIG. 3 is a diagram illustrating another configuration example of the ultrasonic probe according to the first embodiment of the present invention.
In FIG. 3, an amplifier circuit (preamplifier) 4 is added to the configuration shown in FIG. The amplifying circuit 4 receives a reception signal generated when the vibrator 11 receives ultrasonic waves via the multiplexer 3, amplifies the signal, and outputs the amplified signal to a coaxial cable for the reception signal. At that time, if the output impedance of the amplifier circuit 4 is matched with the characteristic impedance of the coaxial cable for received signals, impedance matching with the coaxial cable can be achieved. A drive signal coaxial cable is provided separately, and an impedance matching circuit 2 is connected between the drive signal coaxial cable and the multiplexer 3.

  FIG. 4 is a diagram showing a state in which the ultrasonic probe shown in FIG. 1 or FIG. 3 is connected to the ultrasonic imaging apparatus main body. As shown in FIG. 4, the ultrasound probe 1 is electrically connected to the ultrasound imaging apparatus body 6 via a plurality of cables 5. These cables 5 include a coaxial cable that transmits a plurality of drive signals and a plurality of reception signals between the ultrasonic probe 1 and the ultrasonic imaging apparatus main body 6, and an ultrasonic wave from the ultrasonic imaging apparatus main body 6. And a single wire cable for transmitting a control signal transmitted to the probe 1 and covered with a protective cable cover 5a.

  The ultrasonic imaging apparatus main body 6 includes a drive signal generation unit 61, a transmission / reception switching unit 62, a reception signal processing unit 63, an image generation unit 64, a display unit 65, and a control unit 66. The drive signal generation unit 61 includes, for example, a plurality of drive circuits (such as a pulsar) and generates a plurality of drive signals used to drive the plurality of ultrasonic transducers. The transmission / reception switching unit 62 switches between the output of the drive signal to the ultrasonic probe 1 and the input of the reception signal from the ultrasonic probe 1.

  The reception signal processing unit 63 includes, for example, a plurality of preamplifiers, a plurality of A / D converters, and a digital signal processing circuit or CPU, and amplifies, phasing and adding the reception signals output from the plurality of ultrasonic transducers, Predetermined signal processing such as detection is performed. The image generation unit 64 generates image data representing an ultrasonic image based on a reception signal that has been subjected to predetermined signal processing. The display unit 65 displays an ultrasonic image based on the image data generated as described above. As described above, the control unit 66 controls the operation of the entire system, generates a control signal for controlling the operation of the ultrasonic probe 1, and transmits the control signal to the ultrasonic probe 1. To do.

  FIG. 5 is a perspective view showing the internal structure of the ultrasonic element used in the ultrasonic probe according to the first embodiment of the present invention. As shown in FIG. 5, the ultrasonic element 10 includes a plurality of transducers 11 and an acoustic matching layer 15 that increases the propagation efficiency of ultrasonic waves by matching the acoustic impedance between the transducers 11 and the subject. And a backing material 16 for attenuating unnecessary ultrasonic waves generated from the vibrators 11. Each vibrator 11 includes a piezoelectric body 12 that generates an ultrasonic wave by expanding and contracting due to the piezoelectric effect, and a signal electrode 13 and a common electrode 14 formed at both ends of the piezoelectric body 12. In general, the common electrode 14 is connected to a ground potential.

  The ultrasonic element 10 further reduces the interference between the plurality of transducers 11, suppresses the lateral vibration of the transducers 11, and causes the transducers 11 to vibrate only in the vertical direction. 11 may be included. Further, an acoustic lens for focusing the ultrasonic waves may be included on the acoustic matching layer 15. Furthermore, the acoustic matching layer 15 may have a multilayer structure in order to increase the propagation efficiency of ultrasonic waves.

As the material of the piezoelectric body 12, a piezoelectric ceramic or a polymer piezoelectric material is used. In particular, since the piezoelectric ceramic has a high electric / mechanical energy conversion capability, it can generate an ultrasonic wave that can reach a deep part of the body and has high reception sensitivity. Specific materials include PZT (lead zirconate titanate: Pb (Ti, Zr) O ₃ ), a metamorphic material having a similar perovskite crystal structure, and a material generally called a relaxor material. Etc. can be used.

  As a material of the acoustic matching layer 15, for example, a material obtained by mixing a material powder (tungsten, ferrite powder, etc.) having high acoustic impedance with an organic material such as epoxy resin, urethane resin, silicon, and acrylic resin is used. Further, as the material of the backing material 16, an epoxy resin, rubber, or the like having a large acoustic attenuation is used.

  FIG. 6 is a perspective view showing the internal structure of the ultrasonic probe according to the first embodiment of the present invention. In the ultrasonic probe according to the present embodiment, the ultrasonic element 10 and the integrated circuit 20 are mounted on a substrate 40 formed of a material containing glass epoxy resin, ceramic, or silicon. The substrate 40 is provided with at least one wiring layer, and a wiring pattern and a land (substrate electrode) for mounting components are formed.

  The integrated circuit 20 may be formed as an IC chip, or may be formed as a hybrid IC in which an IC chip and a chip component are mounted on a substrate such as ceramic. The integrated circuit 20 incorporates at least one of the impedance matching circuit 2, the multiplexer 3 and the amplifier circuit 4 shown in FIGS. The integrated circuit 20 may be mounted on the side surface or inside of the substrate 40.

  In the present embodiment, the signal electrode 13 and the common electrode 14 and the substrate 40 are connected by the flexible substrates 31 and 32, respectively, and drive signals are output from the integrated circuit 20 to the signal electrode 13 and the common electrode 14. The reception signal can be output from the signal electrode 13 and the common electrode 14 to the integrated circuit 20. Further, communication between the integrated circuit 20 and the ultrasonic imaging apparatus main body is performed via the flexible substrate 33.

  The lands (substrate electrodes) of the flexible substrates 31 to 33 and the terminals of the integrated circuit 20 are bonded to the lands on the substrate 40 using a functional bonding material such as a conductive paste (for example, silver paste) or solder. Since the bonding temperature at that time is about 200 ° C., damage due to the temperature of the ultrasonic element 10 and the integrated circuit 20 does not pose a problem. Instead of the flexible substrates 31 and 32, the signal electrode 13, the common electrode 14, and the substrate 40 may be connected by wire bonding.

  As described above, by separately manufacturing the ultrasonic element 10 and the integrated circuit 20 and mounting them on the substrate 40, it is possible to avoid problems related to the temperature required when manufacturing the vibrator and the IC chip. Further, in the case where the vibrator is formed directly above or below the IC chip, the vibration when the vibrator transmits ultrasonic waves is directly transmitted to the IC chip, so that the IC chip may be damaged. is there. However, in the present embodiment, the substrate 40 is interposed between the ultrasonic element 10 and the integrated circuit 20, and further, the backing material 16 is interposed between the vibrator 11 and the substrate 40 (see FIG. 5). The integrated circuit 20 is not damaged.

FIG. 7A is a perspective view showing an internal structure of an ultrasonic probe according to the second embodiment of the present invention, and FIG. 7B is an ultrasonic probe according to the second embodiment of the present invention. FIG.
In the second embodiment, a recess 40 a having an area slightly larger than the area of the main surface (front surface) of the ultrasonic element 10 is formed in the substrate 40. The ultrasonic element 10 is inserted into the recess 40 a, and the common electrode 14 is positioned at a height substantially equal to the upper surface of the substrate 40.

  The signal electrode 13 of the ultrasonic element 10 is connected to a land (substrate terminal) 41 formed on the substrate 40 via the flexible substrate 31. Further, the common electrode 14 of the ultrasonic element 10 is connected to an earth line 42 formed on the substrate 40 by wire bonding using a lead wire 34 at one place or a plurality of places. Instead of the flexible substrate 31, the signal electrode 13 and the substrate 40 may be connected by wire bonding. Other points are the same as those of the first embodiment shown in FIG.

  In the second embodiment, by inserting the ultrasonic element 10 into the recess 40a formed in the substrate 40, the main surface of the ultrasonic probe can be made substantially flush with the ultrasonic probe. The size of the touch element can be further reduced. Further, when the ultrasonic element 10 is inserted into the recess 40a, the position of the common electrode 14 and the position of the earth line 42 formed on the substrate 40 are aligned, so that the connection between the common electrode 14 and the earth line 42 is easy. is there. Furthermore, since the bonding strength between the ultrasonic element 10 and the substrate 40 can be increased, the ultrasonic element 10 and the substrate 40 are hardly separated even when a mechanical impact is applied to the ultrasonic probe.

  Also in the present embodiment, since the backing material 16 of the ultrasonic element 10 attenuates unnecessary ultrasonic waves, the integrated circuit 20 is not damaged by vibration generated from the vibrator 11. Moreover, when an epoxy resin is used as the material of the substrate 40, the problem of vibration can be solved more effectively.

FIG. 8A is a perspective view showing an internal structure of an ultrasonic probe according to the third embodiment of the present invention, and FIG. 8B is an ultrasonic probe according to the third embodiment of the present invention. FIG.
In the third embodiment, a multilayer substrate having a plurality of wiring layers is used as the substrate 40. In FIG. 8B, a first wiring layer 43 and a second wiring layer 45 are shown. The wiring pattern of the first wiring layer 43 is connected to the second wiring layer 45 through the through hole 44. Connected to the wiring pattern.

  In the ultrasonic element 10, the signal electrode 13 is connected to an electrode terminal 17 formed on the back surface of the backing material 16 through a wiring pattern formed on the side surface or the like of the backing material 16. The electrode terminal 17 is bonded to a land (substrate terminal) formed in the first wiring layer 43 by using a functional bonding material such as conductive paste or solder, and further, the through hole 44 and the second wiring layer 45. The wiring pattern is connected to the integrated circuit 20. Further, the common electrode 14 of the ultrasonic element 10 and the earth line 42 formed on the substrate 40 are connected by wire bonding using a lead wire 34 at one place or a plurality of places. Other points are the same as those of the second embodiment shown in FIGS. 7A and 7B.

  In the third embodiment, in addition to the features described in the second embodiment, the electrode terminal 17 formed on the bottom surface of the ultrasonic element 10 includes the first wiring layer 43 formed on the substrate 40, the through Since it is connected to the integrated circuit 20 through the hole 44 and the second wiring layer 45, wiring is easy and the mounting area of circuit components such as an IC chip on the surface of the substrate 40 is increased. Can be secured. Further, when the ultrasonic element 10 is inserted into the concave portion 40a of the substrate 40, the electrode terminal 17 of the ultrasonic element 10 and the land of the substrate 40 naturally align with each other, so that a positional shift between these hardly occurs.

FIG. 9 is a perspective view showing the internal structure of an ultrasonic probe according to the fourth embodiment of the present invention.
In the fourth embodiment, a plurality of ultrasonic elements 10 and a plurality of integrated circuits 20 are mounted on a substrate 40. The plurality of ultrasonic elements 10 may have the same structure or different structures. Other points are the same as those of the third embodiment shown in FIGS. 8A and 8B. As described above, by mounting a plurality of ultrasonic elements 10 on the substrate 40, an ultrasonic probe having a large number of transducers can be realized. Note that, similarly to the second embodiment shown in FIGS. 7A and 7B, the plurality of ultrasonic elements 10 and the substrate 40 may be bonded using the flexible substrate 31.

FIG. 10 is a perspective view showing the internal structure of an ultrasonic probe according to the fifth embodiment of the present invention.
In the fifth embodiment, two substrates 40 on which a plurality of ultrasonic elements 10 and a plurality of integrated circuits 20 are mounted are combined to form a three-dimensional structure. These substrates 40 are bonded together by, for example, an adhesive. Other points are the same as those of the fourth embodiment shown in FIG.

FIG. 11 is a side view of an ultrasonic probe according to the sixth embodiment of the present invention.
In the sixth embodiment, recesses 40a are formed on both surfaces of the substrate 40, and a plurality of ultrasonic elements 10 and a plurality of integrated circuits 20 are mounted in these recesses 40a. Further, some integrated circuits 20 are mounted inside the substrate 40. The mode of connection between the ultrasonic element 10 and the substrate 40 is the same as that of the third embodiment shown in FIGS. 8A and 8B, but a flexible substrate as in the second embodiment shown in FIGS. 7A and 7B. The ultrasonic element 10 and the substrate 40 may be connected by 31 and the lead wire 34.

FIG. 12 is a side view of an ultrasonic probe according to the seventh embodiment of the present invention.
In the seventh embodiment, the cross section of the substrate 40 is a pentagon or more polygon, and the substrate 40 is a polyhedron of a heptahedron or more. FIG. 12 shows an octahedral substrate 40, in which three concave portions 40a are formed. Or the board | substrate 40 may have a curved surface and the recessed part 40a may be formed in a curved surface. Accordingly, the main surfaces of the plurality of transducers have different angles between the plurality of ultrasonic elements 10 attached to the plurality of planes or one curved surface of the substrate 40. Such a structure is suitable for transmitting and receiving ultrasonic waves over a wide angular range. The mode of connection between the ultrasonic element 10 and the substrate 40 is the same as that of the third embodiment shown in FIGS. 8A and 8B, but a flexible substrate as in the second embodiment shown in FIGS. 7A and 7B. The ultrasonic element 10 and the substrate 40 may be connected by 31 and the lead wire 34.

  Furthermore, the fifth to seventh embodiments shown in FIGS. 10 to 12 may be combined. By combining the fifth to seventh embodiments, the degree of freedom of the shape of the ultrasonic probe can be expanded, and a shape suitable for various diagnostic locations where the ultrasonic probe is used is realized. be able to.

FIG. 13 is a side view of an ultrasonic probe according to the eighth embodiment of the present invention.
In the eighth embodiment, a plurality of recesses 40a to 40c are formed on the front and back surfaces of the substrate 40, the ultrasonic element 10 is inserted into the recess 40a, the temperature sensor 21 is inserted into the recess 40b, and the recess 40c. The temperature control element 22 is inserted into the. A plurality of electrode terminals are formed on the bottom surfaces of the temperature sensor 21 and the temperature control element 22, and these electrode terminals are bonded to the land of the substrate 40 using a functional bonding material such as conductive paste or solder. Yes. Further, an IC chip 23 in which peripheral circuits of the temperature sensor 21 are integrated is mounted on the back surface (which may be a side surface or inside) of the substrate 40.

  In an ultrasonic probe used for a human body, a temperature sensor or the like may be mounted on the ultrasonic probe in consideration of patient safety due to heat generated by the ultrasonic probe. In addition, in order to suppress the heat generation of the ultrasonic probe, a temperature control element may be mounted on the ultrasonic probe. In the present embodiment, the temperature sensor 21 and the temperature adjustment element 22 are provided in the ultrasonic probe, but one of the temperature sensor 21 and the temperature adjustment element 22 may be provided.

  The temperature sensor 21 senses the internal temperature of the ultrasonic probe and outputs temperature information to the IC chip 23. The circuit in the IC chip 23 transmits the input temperature information to the ultrasonic imaging apparatus main body 6 shown in FIG. 4, and the control unit 66 provided in the ultrasonic imaging apparatus main body 6 performs the ultrasonic probe. The patient's safety can be ensured by restricting the child transmission operation to suppress heat generation and operating the temperature control element 22 to cool the ultrasonic probe. As the temperature adjustment element 22, for example, a heater or a Peltier element is used. In addition, there is a case where such a temperature adjusting element 22 and the temperature sensor 21 perform a cooperative operation.

  According to the present embodiment, the ultrasonic element 10, the temperature sensor 21, and the temperature adjustment element 22 are inserted and mounted in the recesses 40a to 40c formed in the substrate 40, so that the heights of these components are increased. Since the position is substantially the same as the front surface or the back surface of the substrate 40, the ultrasonic probe can be reduced in size. In addition to the temperature sensor, depending on the use of the ultrasonic probe, for example, a CCD (Charge Coupled Device) sensor, a thermo sensor, a pyroelectric sensor, an OCT (Optical Coherence Tomography) A tomography) sensor or the like may be provided.

  The present invention relates to an ultrasonic probe including a plurality of ultrasonic transducers that transmit and / or receive ultrasonic waves, and a medical device or a structure including such an ultrasonic probe and a main body device. It can be used in an ultrasonic imaging apparatus for object flaw detection.

It is a figure which shows the structural example of the probe for ultrasonic waves which concerns on the 1st Embodiment of this invention. It is a figure which shows the 1st structural example of the impedance matching circuit in the probe for ultrasonic waves which concerns on the 1st Embodiment of this invention. It is a figure which shows the 2nd structural example of the impedance matching circuit in the probe for ultrasonic waves which concerns on the 1st Embodiment of this invention. It is a figure which shows the 3rd structural example of the impedance matching circuit in the probe for ultrasonic waves which concerns on the 1st Embodiment of this invention. It is a figure which shows the 4th structural example of the impedance matching circuit in the probe for ultrasonic waves which concerns on the 1st Embodiment of this invention. It is a figure which shows the other structural example of the probe for ultrasonic waves which concerns on the 1st Embodiment of this invention. It is a figure which shows the state by which the probe for ultrasonic waves shown in FIG. 1 or FIG. 3 and the ultrasonic imaging device main body were connected. 1 is a perspective view showing an internal structure of an ultrasonic element used in an ultrasonic probe according to a first embodiment of the present invention. It is a perspective view which shows the internal structure of the probe for ultrasonic waves which concerns on the 1st Embodiment of this invention. It is a perspective view which shows the internal structure of the probe for ultrasonic waves which concerns on the 2nd Embodiment of this invention. It is sectional drawing of the probe for ultrasonic waves which concerns on the 2nd Embodiment of this invention. It is a perspective view which shows the internal structure of the probe for ultrasonic waves which concerns on the 3rd Embodiment of this invention. It is sectional drawing of the probe for ultrasonic waves which concerns on the 3rd Embodiment of this invention. It is a perspective view which shows the internal structure of the probe for ultrasonic waves which concerns on the 4th Embodiment of this invention. It is a perspective view which shows the internal structure of the probe for ultrasonic waves which concerns on the 5th Embodiment of this invention. It is a side view of the probe for ultrasonic waves concerning the 6th Embodiment of this invention. It is a side view of the ultrasonic probe which concerns on the 7th Embodiment of this invention. It is a side view of the probe for ultrasonic waves concerning the 8th Embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Ultrasonic probe 2 Impedance matching circuit 3 Multiplexer 4 Amplifying circuit 5 Cable 5a Cable cover 6 Ultrasonic imaging device main body 10 Ultrasonic element 11 Vibrator 12 Piezoelectric body 13 Signal electrode 14 Common electrode 15 Acoustic matching layer 16 Backing material DESCRIPTION OF SYMBOLS 17 Electrode terminal 21 Temperature sensor 22 Temperature control element 23 IC chip 31-33 Flexible substrate 34 Lead wire 40 Substrate 40a-40c Recess 41 Substrate terminal 42 Ground line 43 First wiring layer 44 Through hole 45 Second wiring layer 61 Drive Signal generation unit 62 Transmission / reception switching unit 63 Reception signal processing unit 64 Image generation unit 65 Display unit 66 Control unit

Claims (11)

An ultrasonic transducer array having a plurality of ultrasonic transducers that transmit ultrasonic waves according to an applied drive signal, receive ultrasonic waves, and generate reception signals, and a substrate on which an integrated circuit is mounted having a plurality of wiring patterns In an ultrasonic probe comprising:
A recess is formed in the substrate,
The ultrasonic probe, wherein the ultrasonic transducer array is disposed on a backing material, and the ultrasonic transducer array and the backing material are inserted into a recess of the substrate. The backing material has a plurality of terminals on one surface for inputting a plurality of drive signals to the plurality of ultrasonic transducers and outputting a plurality of reception signals from the plurality of ultrasonic transducers,
A first group of lands connected to the plurality of terminals of the backing material on the bottom surface of the recess; and a second group of lands connected to the integrated circuit and / or a flexible substrate on the surface of the substrate. The ultrasonic probe according to claim 1, further comprising:   The integrated circuit supplies an externally supplied drive signal to a group of ultrasonic transducers selected from among the plurality of ultrasonic transducers, and a group of ultrasonic waves selected from among the plurality of ultrasonic transducers. The ultrasonic probe according to claim 1, further comprising a switching circuit that outputs a reception signal output from the transducer to the outside.   The ultrasonic probe according to claim 1, wherein the integrated circuit includes an amplifier circuit that amplifies a reception signal output from at least one of the plurality of ultrasonic transducers. A plurality of recesses are formed on one surface of the substrate,
The ultrasonic probe according to claim 1, further comprising a plurality of ultrasonic transducer arrays respectively inserted into the plurality of recesses. A plurality of recesses are formed on a plurality of surfaces of the substrate;
At least one ultrasonic transducer array inserted in at least one recess formed in one of the plurality of surfaces of the substrate, and formed in the other one of the plurality of surfaces of the substrate; The ultrasonic probe according to claim 1, further comprising at least one ultrasonic transducer array inserted into the at least one concave portion formed.   A plurality of ultrasonic transducer arrays respectively inserted into a plurality of concave portions formed on a plurality of planes or one curved surface of the substrate, and the plurality of ultrasonic transducers between the plurality of ultrasonic transducer arrays; The ultrasonic probe according to claim 1, wherein the ultrasonic transmission / reception surfaces have different angles.   The ultrasonic probe according to claim 1, wherein the plurality of substrates are bonded to each other to have a three-dimensional structure.   The ultrasonic probe according to claim 1, further comprising a sensor inserted in a recess formed in the substrate.   The ultrasonic probe according to any one of claims 1 to 9, further comprising a temperature adjustment circuit that is inserted into a recess formed in the substrate and adjusts the temperature inside the ultrasonic probe. . The ultrasonic probe according to any one of claims 1 to 10,
Drive signal supply means for respectively supplying a plurality of drive signals to the plurality of ultrasonic transducers;
Signal processing means for generating image data representing an ultrasonic image by processing a plurality of reception signals respectively output from the plurality of ultrasonic transducers;
An ultrasonic imaging apparatus comprising:

Images