JP2008016634A - Thin substrate transfer jig - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a thin substrate transfer jig which properly positions and holds a thin substrate by restraining the positioning pins of a positioning object from being bent when hitting against a carrier plate, and repeatedly laminates the carrier plates on the positioning object. <P>SOLUTION: The thin substrate transfer jig is equipped with: a rigid positioning plate 1; a carrier plate 20 which is manually laminated on the surface of the positioning plate 1 in a detachable manner and holds an electronic part mounting flexible printed wiring board in a detachable manner; two or more aligning pins 2 provided upright at the surface corners of the positioning plate 1; two or more aligning pieces 3 disposed upright on the peripheral face of the positioning plate 1, and interfering with the peripheral face of the carrier plate 20; two or more positioning pins 4 disposed in upright position on the surface of the positioning plate 1, and interfering with the peripheral edge of the flexible printed wiring board; two or more aligning holes 21 which are bored in the carrier plate 20 to allow the aligning pins 2 to penetrate through them, and two or more positioning holes 22 which are bored in the carrier plate 20 to allow the positioning pins 4 to penetrate through them. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a thin substrate transport jig for positioning and holding a flexible printed wiring board or the like for mounting electronic components.

  For mobile phones and DVDs, etc., flexible printed wiring boards that are excellent in workability and flexibility and can be made thinner, lighter, and smaller are used, but this flexible printed wiring board has low rigidity, Since it is easy to warp and bend, it is difficult to mount various electronic components on the mounting line as they are.

  Therefore, conventionally, a technique has been devised in which a flexible printed wiring board is fixed to a rigid plate body via a plurality of positioning pins, and an electronic component is mounted in a state in which the flexible printed wiring board is fixed (Patent Literature). 1 and 2), apart from this technique, a thin substrate transport jig having a positioning plate and a carrier plate has been proposed.

  Although not shown, this type of thin substrate transport jig includes a rigid positioning plate and a carrier plate that is manually detachably stacked on the surface of the positioning plate, and an electronic component is provided on the surface of the carrier plate. A flexible printed wiring board for mounting is detachably held. A plurality of positioning pins that interfere with the flexible printed wiring board on the carrier plate are erected in a predetermined pattern on the surface of the positioning plate, and a plurality of positioning holes that are loosely penetrated by the positioning pins are drilled in the carrier plate. Has been. Each positioning pin is formed in a cylindrical shape with a small diameter of about φ4 to 5 mm.

When holding the flexible printed wiring board on the surface of the carrier plate using such a thin substrate transport jig, the carrier plate is manually overlapped on the surface of the positioning plate to expose the positioning pins from the plurality of positioning holes, respectively. If the plurality of positioning pins interfere with the peripheral edge of the flexible printed wiring board, the flexible printed wiring board can be positioned and held on the surface of the carrier board.
Japanese Patent Laid-Open No. 1-198094 JP 2004-71863 A

  Since the conventional thin substrate transport jig is configured as described above, when the carrier plate is stacked on the surface of the positioning plate, the carrier plate is displaced in the X and Y directions, and the positioning pin of the positioning plate becomes the positioning hole of the carrier plate. It may collide and bend without being inserted. As a result, there is a problem that the plurality of positioning pins cannot properly interfere with the peripheral edge portion of the flexible printed wiring board, and the flexible printed wiring board cannot be positioned and held. Further, with the bending of the positioning pin, there is a possibility that the carrier plate cannot be overlaid again on the positioning plate.

  The present invention has been made in view of the above, and can suppress the bending of the positioning pin of the positioning body due to the collision with the carrier plate to appropriately position and hold the thin substrate, and the carrier plate is attached to the positioning body. An object of the present invention is to provide a thin substrate transfer jig that can be repeatedly stacked.

In the present invention, in order to solve the above-mentioned problem, a carrier plate for detachably holding a thin substrate for mounting electronic components is stacked on the surface of the positioning body,
A plurality of alignment pieces that interfere with the peripheral edge of the carrier plate, positioning pins that stand on the surface of the positioning body and interfere with the thin substrate, and positioning holes that are provided on the carrier plate and penetrate the positioning pins, Each positioning piece is higher than the positioning pin.

Note that an adhesive layer for detachably attaching the thin substrate can be provided on all or part of the surface of the carrier plate.
Also, a counterbore region formed on the surface of the carrier plate, an adhesive layer that is adhered to the counterbore region and detachably holds the thin substrate, and is provided in the vicinity of the counterbore region. And a thickness-absorbing recess that is fitted to the portion and absorbs the thickness thereof, and positioning holes can be provided inside and outside the spot facing region.

  Further, the positioning body is formed from a first positioning body and a second positioning body that is detachably stacked on the first positioning body, and the first positioning body is larger than the second positioning body. In addition, a plurality of alignment pieces can be erected on the first positioning body, and positioning pins can be provided on the second positioning body.

Further, the tip of the positioning pin can be chamfered.
Further, the positioning pin may be formed of a widened portion fitted into the positioning hole of the carrier plate, and a narrowed portion extending from the widened portion and exposed from the positioning hole and interfering with the thin substrate on the carrier plate. Is possible.

Also, on the surface of the positioning body, a carrier plate for detachably holding a thin substrate for mounting electronic components is stacked,
Alignment pins that are erected on the surface of the positioning body, a plurality of alignment pieces that interfere with the peripheral edge of the carrier plate, positioning pins that are erected on the surface of the positioning body and interfere with the thin substrate, and the carrier A positioning hole provided in the plate and penetrating the positioning pin, and a positioning hole provided in the carrier plate and penetrating the positioning pin, each positioning piece being higher than the positioning pin and / or the positioning pin It may be characterized by that.

Also, an adhesive layer that is formed on the surface of the carrier plate and holds the thin substrate in a detachable manner, and a thickness that is provided in the vicinity of the adhesive layer and fits with the thick portion of the thin substrate to absorb the thickness. It is also possible to provide positioning holes inside and outside the adhesive layer, including an absorption recess.
Furthermore, it is possible to form the carrier plate in a size not larger than the size of the positioning body.
Furthermore, the tip of the alignment pin and / or the positioning pin can be chamfered.

  Here, the positioning body and the carrier plate in the claims are mainly rectangular, but may be polygonal, circular, elliptical, or the like. The positioning body may have a multilayer structure or a single layer structure. Further, the thin substrate includes at least one flexible printed wiring board and a plurality of printed wiring boards. If there are two or more alignment pieces, the number of alignment pieces can be increased to 3, 4 or the like, and can be provided on the peripheral portion (circumferential surface or surface peripheral portion) of the positioning body. This alignment piece can be provided on the positioning body at an angle of 90 ° or more. Further, the positioning pins may be cylindrical or prismatic, but may be substantially I-shaped or L-shaped.

  According to the present invention, when holding the thin substrate on the carrier plate, if the carrier plate is overlapped on the positioning body and the positioning pin protrudes from the positioning hole, and the protruding positioning pin interferes with the thin substrate appropriately, The thin substrate can be positioned and held on the carrier plate. At this time, since the plurality of alignment pieces come into contact with the carrier plate and restrict its movement, the work of positioning and overlapping the carrier plate on the positioning body is facilitated.

According to the present invention, it is possible to appropriately position and hold the thin substrate by suppressing the positioning pin of the positioning body from being bent by the collision with the carrier plate, and it is possible to repeatedly overlap the carrier plate on the positioning body. effective.
In addition, if the tip of the positioning pin is chamfered and rounded or inclined, the impact at the time of collision can be reduced even if it collides with the carrier plate, and the occurrence of pin cracks and cracks is suppressed. You can also

  Furthermore, if the positioning pin is formed from a widened portion fitted into the positioning hole of the carrier plate and a narrowed portion extending from the widened portion and exposed from the positioning hole and interfering with the thin substrate on the carrier plate, Since the contact of the narrow narrow part of the positioning pin with the positioning hole of the carrier plate can be reduced, the positioning pin can be prevented from bending due to a collision with the carrier plate, and good positioning and fixing of the thin substrate can be expected. it can. In addition, since it is not necessary to shorten the total length of the positioning pins, it is possible to prevent the fixing operation from becoming difficult even if the thin substrate is easily warped.

  Hereinafter, a preferred embodiment of the present invention will be described with reference to the drawings. As shown in FIGS. 1 to 3 and 5, a thin substrate transport jig in the present embodiment includes a positioning plate 1 having rigidity, The positioning plate 1 includes a carrier plate 20 that is detachably stacked on the surface of the positioning plate 1 and manually holds a plurality of flexible printed wiring boards 10 for mounting electronic components. The positioning plate 1 includes a plurality of positioning pins. 2, the alignment piece 3 and the positioning pin 4 are provided, and the carrier plate 20 is provided with a plurality of alignment holes 21 and positioning holes 22.

  The positioning plate 1 and the carrier plate 20 are formed into flat rectangles on the front and back surfaces, respectively, and the carrier plate 20 is formed to be the same size or smaller than the positioning plate 1 so that the carrier plate 20 can be easily applied. A recess (not shown) is formed in the positioning plate 1 from the viewpoint of facilitating attachment / detachment. This indentation can be appropriately formed on the peripheral edge of one side, two opposite sides, three sides, or four sides.

  As shown in FIG. 3, the positioning plate 1 is formed into a planar rectangle thicker than the carrier plate 20 using, for example, lightweight aluminum having excellent workability, and the tip is round and hemispherical at the four corners of the surface. Each of the cylindrical alignment pins 2 chamfered in the vertical direction is press-fitted vertically to be erected.

  The positioning plate 1 is vertically erected with positioning pieces 3 that are 2 mm or more taller than the positioning pins 2 and the positioning pins 4 on the circumferential surface, specifically, at the two adjacent corners of the long side. Each alignment piece 3 is bent and formed into a plane L shape using aluminum or the like, and this alignment piece 3 functions to come into contact with the peripheral corner portion of the carrier plate 20 and properly align.

  As shown in FIG. 3, on the surface of the positioning plate 1, a plurality of positioning pins 4 for positioning by interfering with the peripheral edge portion of the flexible printed wiring board 10 and the positioning through-holes are vertically arranged in a predetermined pattern. The pin 4 is formed in a cylindrical shape with a small diameter of about 4 to 5 mm, which is lower than the alignment pin 2.

  As shown in FIG. 5, the flexible printed wiring board 10 is formed by printing a predetermined conductive pattern on an insulating film made of, for example, polyester or polyimide, and a thick connector portion 11 is formed at an end thereof. And the reinforcing plate 12 are selectively formed, cream solder is applied in a state of being held on the surface of the carrier plate 20, and thereafter various electronic components are mounted. In the peripheral portion of the flexible printed wiring board 10, a required number of positioning through holes penetrating the positioning pins 4 are perforated.

  As shown in FIG. 1 and FIG. 2, the carrier plate 20 is formed into a flat rectangular shape that is thinner than the positioning plate 1 using a material such as aluminum or glass epoxy, for example. Round alignment holes 21 are formed in the alignment pins 2 through the gaps. The carrier plate 20 has a plurality of adhesive layers 24 that adhere and hold the flexible printed wiring board 10 in a predetermined pattern on the surface thereof. The carrier plates 20 are adhered in a predetermined pattern. A plurality of positioning holes 22 that are loosely passed through the gaps 4 are respectively drilled in a round shape.

  In the above configuration, when the flexible printed wiring board 10 is held on the surface of the carrier plate 20, the carrier plate 20 is manually overlapped on the flat surface of the positioning plate 1 from above and aligned from the plurality of alignment holes 21. Each of the pins 2 is exposed through, and the positioning pins 4 are exposed through the plurality of positioning holes 22 (see FIG. 1), and the protruding plurality of positioning pins 4 are caused to interfere with the peripheral portion of the flexible printed wiring board 10 as appropriate. Then, the flexible printed wiring board 10 can be positioned and held on the surface of the carrier board 20 via the adhesive layer.

  During this operation, each L-shaped alignment piece 3 contacts the corner of the carrier plate 20 and guides it from two directions (see FIGS. 1 and 2), so the alignment pin 2 and the positioning pin 4 Thus, the alignment hole 21 and the positioning hole 22 can be appropriately fitted. Therefore, the operation of positioning and laminating the carrier plate 20 on the positioning plate 1 is really facilitated.

  According to the above, since the positioning piece 3 having a simple configuration assists in the stacking of the carrier plate 20, when the carrier plate 20 is stacked on the surface of the positioning plate 1, the carrier plate 20 is largely rattled in the XY direction. There is no deviation. Therefore, it is possible to reliably suppress and prevent the positioning pins 4 of the positioning plate 1 from bending due to the collision with the carrier plate 20. As a result, a plurality of positioning pins 4 can be appropriately interfered with the peripheral portion of the flexible printed wiring board 10 and good positioning and holding of the flexible printed wiring board 10 can be greatly expected, and workability can be greatly improved.

  In addition, the carrier plate 20 can be repeatedly and repeatedly stacked on the positioning plate 1 on the basis of preventing the positioning pins 4 from bending, which can greatly contribute to work efficiency and mass production. Further, since the alignment piece 3 is higher than the alignment pin 2 and the positioning pin 4, the tip of the alignment pin 2 and the positioning pin 4 does not contact the carrier plate 20 before the alignment piece 3 is guided. It becomes possible to further prevent damage to the alignment pins 2 and the positioning pins 4.

Next, FIG. 4 shows a second embodiment of the present invention. In this case, a plate-shaped alignment piece 3 is erected at the center of the long side and each short side of the positioning plate 1. I try to wear it. The other parts are the same as those in the above embodiment, and the description thereof is omitted.
In the present embodiment, it is possible to expect the same effect as the above embodiment, and it is obvious that the degree of freedom in design can be improved by changing the number and shape of the alignment pieces 3.

  Next, FIG. 5 and FIG. 6 show a third embodiment of the present invention. In this case, the alignment pieces 3 are respectively provided upright on the two corners on the diagonal line of the positioning plate 1. The carrier plate 20 is provided with a plurality of spot facing regions 23, an adhesive layer 24, and a thickness absorption hole 25, and at least a part of the plurality of positioning holes 22 is drilled inside and outside each spot facing region 23. ing.

  One corner of the positioning plate 1 and the carrier plate 20 is cut obliquely and functions as a mark for alignment. In addition, columnar alignment pins 2 whose tip portions are rounded and chamfered are vertically press-fitted at three corners on the surface of the positioning plate 1 so as to stand upright. Further, the plurality of spot facing regions 23 are formed in a 2 × 2 pattern on most of the surface of the carrier plate 20, and each spot facing region 23 is formed in a size larger than the size of the flexible printed wiring board 10. In addition, the recess is formed at a depth equal to or greater than the thickness of the flexible printed wiring board 10.

  Each adhesive layer 24 is formed into a weakly adhesive thin sheet using, for example, epoxy resin, silicone rubber, urethane rubber, fluoro rubber, and the like, and is adhered to the spot facing region 23 so that the flexible printed wiring board 10 can be freely attached and detached. It adheres and functions so that the surface of the carrier board 20 and the surface of the flexible printed wiring board 10 are substantially aligned to facilitate the application of cream solder to the flexible printed wiring board 10.

  Each thickness absorption hole 25 is perforated in the vicinity of the spot facing region 23 and the adhesive layer 24 and is fitted to and opposed to the thick connector portion 11 and the reinforcing plate 12 of the flexible printed wiring board 10 to absorb the thickness. The cream solder application work on the flexible printed wiring board 10 is smoothed. The other parts are the same as those in the above embodiment, and the description thereof is omitted.

  In the present embodiment, the same effect as the above embodiment can be expected, and the surface of the carrier plate 20 and the surface of the flexible printed wiring board 10 are aligned at substantially the same height, and there is no unevenness between them. Clearly, cream solder can be applied smoothly and uniformly to the flexible printed wiring board 10.

  Next, FIG. 7 shows a fourth embodiment of the present invention. In this case, each positioning pin 4 is inserted into the positioning hole 22 of the carrier plate 20 and has a cylindrical diameter-enlarged portion 4a. And a cylindrical narrow diameter that extends vertically upward from the enlarged diameter portion 4a and is exposed through the positioning hole 22 through a gap and interferes with the peripheral edge of the flexible printed wiring board 10 that is adhesively held by the carrier plate 20. Steps are integrally formed with the portion 4b. The other parts are the same as those in the above embodiment, and the description thereof is omitted.

  In this embodiment, the same effect as that of the above embodiment can be expected. Moreover, since the narrow narrow portion 4b of the positioning pin 4 does not collide with the thick positioning hole 22 of the carrier plate 20, the positioning pin 4 is used as the carrier. Obviously, it is possible to prevent the flexible printed wiring board 10 from being bent due to a collision with the board 20 and to expect better positioning and fixing of the flexible printed wiring board 10. Furthermore, since the total length of the positioning pin 4 is not shortened, it is possible to prevent the flexible printed wiring board 10 that is easily warped from being difficult to fix.

  Next, FIG. 8 shows a fifth embodiment of the present invention. In this case, a single positioning plate 1 is placed on a flat first positioning plate 1A and the first positioning plate 1A. The first positioning plate 1A on the lower side is made larger than the second positioning plate 1B on the upper side by forming a plurality of multilayer structures from the flat second positioning plate 1B that is detachably stacked on the first positioning plate 1B. A plurality of alignment pieces 3 are appropriately provided upright at the peripheral edge or corner of the surface of one positioning plate 1A, and a plurality of alignment pins 2 and positioning pins 4 are disposed on the second positioning plate 1B, respectively. Like to do. The other parts are the same as those in the above embodiment, and the description thereof is omitted.

  In this embodiment, the same effect as the above embodiment can be expected, the configuration of the positioning plate 1 can be diversified, and it is obvious that it is meaningful when only the arrangement pattern of the plurality of positioning pins 4 is to be changed. is there.

  In the above embodiment, the carrier plate 20 is stacked on the surface of the positioning plate 1 from above by manual operation. However, the carrier plate 20 may be automatically stacked on the positioning plate 1 by various devices. In addition, from the viewpoint of facilitating the application of a finger to facilitate attachment / detachment of the carrier plate 20, a necessary number of dents may be formed in the peripheral portion of the carrier plate 20 or the like. Further, the spot facing region 23, the adhesive layer 24, and the thickness absorption hole 25 can be appropriately increased or decreased. The thickness absorption hole 25 may or may not be a through-hole.

It is a whole perspective explanatory view showing typically an embodiment of a thin substrate conveyance jig concerning the present invention. It is a disassembled perspective explanatory drawing which shows typically the positioning board and carrier board in embodiment of the thin substrate conveyance jig which concerns on this invention. It is a perspective explanatory view showing typically the positioning plate in the embodiment of the thin substrate transport jig according to the present invention. It is a plane explanatory view showing typically a 2nd embodiment of a thin substrate conveyance jig concerning the present invention. It is a whole perspective explanatory view showing typically a 3rd embodiment of a thin substrate conveyance jig concerning the present invention. It is a perspective explanatory view showing typically the positioning board and carrier board in a 3rd embodiment of the thin substrate conveyance jig concerning the present invention. It is principal part cross-sectional explanatory drawing which shows typically 4th Embodiment of the thin substrate conveying jig which concerns on this invention. It is explanatory drawing which shows typically 5th Embodiment of the thin board | substrate conveyance jig which concerns on this invention.

Explanation of symbols

1 Positioning plate (positioning body)
1A 1st positioning board 1B 2nd positioning board 2 Positioning pin 3 Positioning piece 4 Positioning pin 4a Wide diameter part (widening part)
4b Narrow diameter part (narrow width part)
10 Flexible printed wiring boards (thin substrates)
11 Connector part (thick part)
12 Reinforcement plate (thick part)
20 Carrier plate 21 Positioning hole 22 Positioning hole 23 Counterbore region 24 Adhesive layer 25 Thickness absorption hole (thickness absorption recess)

Claims (5)

A thin substrate transport jig for stacking carrier plates that detachably hold a thin substrate for mounting electronic components on the surface of a positioning body,
A plurality of alignment pieces that interfere with the peripheral edge of the carrier plate, positioning pins that stand on the surface of the positioning body and interfere with the thin substrate, and positioning holes that are provided on the carrier plate and penetrate the positioning pins, A thin substrate transfer jig characterized in that each alignment piece is higher than a positioning pin.   2. The thin substrate carrying jig according to claim 1, wherein an adhesive layer for detachably sticking and holding the thin substrate is provided on all or part of the surface of the carrier plate.   The positioning body is formed from a first positioning body and a second positioning body that is detachably stacked on the first positioning body, and the first positioning body is made larger than the second positioning body, The thin substrate transport jig according to claim 1 or 2, wherein a plurality of alignment pieces are erected on the first positioning body, and positioning pins are provided on the second positioning body.   The thin board | substrate conveyance jig of Claim 1, 2, or 3 which chamfered the front-end | tip part of the positioning pin.   The positioning pin is formed of a widened portion fitted into a positioning hole of the carrier plate, and a narrowed portion extending from the widened portion and exposed from the positioning hole and interfering with the thin substrate on the carrier plate. 4. The thin substrate transfer jig according to any one of 4 above.

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