JP2008016624A - Semiconductor manufacturing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing method capable of so simply obtaining a thinly-ground wafer with an interlayer adhesive, and so simply manufacturing a highly stacked semiconductor using this. <P>SOLUTION: A semiconductor manufacturing method includes the step 1 of pasting the adhesive layer for interlayer adhesion of an adhesive sheet comprising a base and the adhesive layer for interlayer adhesion formed on the base and a wafer together; the step 2 of grinding the wafer in a state in which it is fixed onto the adhesive sheet; and the step 3 of peeling the base off from the wafer after grinding so that the adhesive layer for interlayer adhesion remains, and obtaining the wafer to which the adhesive layer for interlayer adhesion is adhered. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

The present invention relates to a method for manufacturing a semiconductor, which can obtain a wafer with an interlayer adhesive that has been extremely thinly ground, and that can be used to easily manufacture a highly stacked semiconductor.

In recent years, high integration of semiconductors has progressed, and a stacked chip in which a plurality of thinly ground IC chips are stacked has been proposed. At the same time, various methods for highly integrated mounting of semiconductors have been proposed, and at present, bonding between IC chips is usually performed by using an interlayer adhesive (cited documents 1, 2, etc.).

Such a stacked chip is usually manufactured as follows. First, an adhesive tape called a back grind tape is attached to the wafer, and in this state, the wafer is ground to a predetermined thickness. The back grind tape is peeled off after grinding. Next, an interlayer adhesive is applied to the surface of the wafer, and then laminated with another wafer, a substrate, or the like.
However, such a process has a problem that it is extremely complicated.

JP 2005-126658 A JP 2003-231875 A

In view of the above-mentioned present situation, the present invention provides a method for manufacturing a semiconductor capable of obtaining a wafer with an interlayer adhesive that has been thinly ground very easily, and that can be used to easily manufacture a highly laminated semiconductor. The purpose is to provide.

The present invention includes a step 1 of bonding an adhesive layer for interlayer adhesion of a pressure-sensitive adhesive sheet formed of a base material and an adhesive layer for interlayer adhesion formed on the base material, and the wafer; Step 2 of grinding in a state of being fixed to the wafer, Step of removing the base material from the ground wafer while leaving the adhesive layer for interlayer adhesive, and obtaining a wafer to which the adhesive layer for interlayer adhesion is adhered 3.
The present invention is described in detail below.

A schematic diagram for explaining a method for producing a semiconductor of the present invention is shown in FIG.
The method for producing a semiconductor of the present invention includes a step 1 for bonding an adhesive sheet and a wafer (FIG. 1A). By sticking the adhesive sheet to the wafer, it is possible to prevent the wafer from being damaged by an impact during grinding or the like. Moreover, when a support plate such as a glass plate is attached using the pressure-sensitive adhesive sheet as a double-sided pressure-sensitive adhesive sheet, the wafer can be more reliably prevented from being damaged.

The wafer is obtained by slicing a silicon single crystal, a gallium arsenide single crystal, or the like and then forming a predetermined circuit pattern, bump, or the like on the surface thereof. When sticking an adhesive sheet on a wafer, the surface on which the circuit of the wafer is formed is attached to the adhesive sheet.

The said adhesive sheet consists of a base material and the adhesive bond layer for interlayer adhesion formed on the base material.
Although it does not specifically limit as said base material, It is preferable that it is what permeate | transmits or passes light, For example, transparent, such as an acryl, an olefin, a polycarbonate, vinyl chloride, ABS, a polyethylene terephthalate (PET), nylon, urethane, a polyimide And a sheet made of a simple resin, a sheet having a network structure, a sheet having holes, and the like.

The pressure-sensitive adhesive sheet may be subjected to a mold release treatment on the surface on which the interlayer adhesive layer is formed. By performing the mold release treatment, the base material and the adhesive layer for interlayer adhesive can be more easily peeled in Step 3 to be described later.

The adhesive for interlayer adhesion constituting the adhesive layer for interlayer adhesion is not particularly limited. For example, thermoplasticity such as ethylene-vinyl acetate copolymer, ethylene-acrylate copolymer, polyamide, polyethylene, polysulfone, etc. Adhesives mainly composed of thermosetting resins such as resins, epoxy resins, polyimide resins, silicone resins, phenol resins, adhesives mainly composed of acrylic resins, rubber polymers, fluororubber polymers, fluororesins, etc. Can be mentioned. These may be used independently and 2 or more types may be used together.

Although it does not specifically limit as thickness of the said adhesive bond layer for interlayer adhesion, A preferable minimum is 5 micrometers and a preferable upper limit is 200 micrometers. If the thickness is less than 5 μm, a uniform adhesive surface may not be formed or sufficient adhesive strength may not be obtained. If the thickness exceeds 200 μm, the wafer is held when it is ground while being fixed to the pressure-sensitive adhesive sheet. The power may be insufficient. A more preferred lower limit is 5 μm, and a more preferred upper limit is 100 μm.

The pressure-sensitive adhesive tape may have a gas generating pressure-sensitive adhesive layer containing a gas generating agent that generates gas by stimulation between the base material and the adhesive layer for interlayer adhesion. By having such a gas generating pressure-sensitive adhesive layer, in step 3 to be described later, the gas generated from the gas generating agent is stimulated by generating a gas from the gas generating agent by stimulating the pressure-sensitive adhesive sheet. Since it is released to the adhesive interface with the adhesive layer and peels at least a part of the adhesive surface, the substrate can be peeled off more easily leaving the adhesive layer for interlayer adhesion on the wafer.

Although it does not specifically limit as a gas generating agent which generate | occur | produces gas by the said irritation | stimulation, For example, an azo compound and an azide compound are used suitably.
Examples of the azo compound include 2,2′-azobis (N-cyclohexyl-2-methylpropionamide), 2,2′-azobis [N- (2-methylpropyl) -2-methylpropionamide], 2 , 2′-azobis (N-butyl-2-methylpropionamide), 2,2′-azobis [N- (2-methylethyl) -2-methylpropionamide], 2,2′-azobis (N-hexyl) -2-methylpropionamide), 2,2′-azobis (N-propyl-2-methylpropionamide), 2,2′-azobis (N-ethyl-2-methylpropionamide), 2,2′-azobis {2-methyl-N- [1,1-bis (hydroxymethyl) -2-hydroxyethyl] propionamide}, 2,2′-azobis {2-methyl-N- [2- (1-hydroxy) Butyl)] propionamide}, 2,2′-azobis [2-methyl-N- (2-hydroxyethyl) propionamide], 2,2′-azobis [N- (2-propenyl) -2-methylpropionamide 2,2'-azobis [2- (5-methyl-2-imidazolin-2-yl) propane] dihydrochloride, 2,2'-azobis [2- (2-imidazolin-2-yl) propane] dihydro Chloride, 2,2′-azobis [2- (2-imidazolin-2-yl) propane] disulfate dihydrolate, 2,2′-azobis [2- (3,4,5,6-tetrahydropyrimidine- 2-yl) propane] dihydrochloride, 2,2′-azobis {2- [1- (2-hydroxyethyl) -2-imidazolin-2-yl] propane} dihydrochloride Id, 2,2′-azobis [2- (2-imidazolin-2-yl) propane], 2,2′-azobis (2-methylpropionamidine) dihydrochloride, 2,2′-azobis (2-aminopropane) ) Dihydrochloride, 2,2′-azobis [N- (2-carboxyacyl) -2-methyl-propionamidine], 2,2′-azobis {2- [N- (2-carboxyethyl) amidine] propane }, 2,2′-azobis (2-methylpropionamidooxime), dimethyl 2,2′-azobis (2-methylpropionate), dimethyl 2,2′-azobisisobutyrate, 4,4′- Azobis (4-cyancarbonic acid), 4,4′-azobis (4-cyanopentanoic acid), 2,2′-azobis (2,4,4-trimethylpentane) ) And the like. These azo compounds generate nitrogen gas when stimulated by light, heat, or the like.

As the azo compound, those having a 10-hour half-life temperature of 80 ° C. or more are more preferable. When the 10-hour half-life temperature is less than 80 ° C., the pressure-sensitive adhesive sheet for wafer sticking of the present invention may cause foaming when it is dried by forming a pressure-sensitive adhesive layer by casting, or it may decompose over time. As a result, the decomposition residue may bleed out, or gas may be generated over time to cause floating at the interface with the adherend. If the 10-hour half-life temperature is 80 ° C. or higher, the heat resistance is excellent, and therefore, use at a high temperature and stable storage are possible.

Examples of the azo compound having a 10-hour half-life temperature of 80 ° C. or higher include an azoamide compound represented by the following general formula (1). In addition to being excellent in heat resistance, the azoamide compound represented by the following general formula (1) is also excellent in solubility in an adhesive polymer such as an acrylic acid alkyl ester polymer, which will be described later, in the adhesive layer. The particles may not exist as particles.

In formula (1), R ¹ and R ² each represent a lower alkyl group, and R ³ represents a saturated alkyl group having 2 or more carbon atoms. R ¹ and R ² may be the same or different.

Examples of the azoamide compound represented by the general formula (1) include 2,2′-azobis (N-cyclohexyl-2-methylpropionamide) and 2,2′-azobis [N- (2-methylpropyl). -2-methylpropionamide], 2,2′-azobis (N-butyl-2-methylpropionamide), 2,2′-azobis [N- (2-methylethyl) -2-methylpropionamide], 2 , 2′-azobis (N-hexyl-2-methylpropionamide), 2,2′-azobis (N-propyl-2-methylpropionamide), 2,2′-azobis (N-ethyl-2-methylpropionamide) Amide), 2,2′-azobis {2-methyl-N- [1,1-bis (hydroxymethyl) -2-hydroxyethyl] propionamide}, 2,2′-azobis {2-methy -N- [2- (1-hydroxybutyl)] propionamide}, 2,2'-azobis [2-methyl-N- (2-hydroxyethyl) propionamide], 2,2'-azobis [N- ( 2-propenyl) -2-methylpropionamide] and the like. Among these, 2,2′-azobis (N-butyl-2-methylpropionamide) and 2,2′-azobis [N- (2-propenyl) -2-methylpropionamide] have improved solubility in solvents. It is preferably used because it is particularly excellent.
Among them, 2,2′-azobis (N-cyclohexyl-2-methylpropionamide), 2,2′-azobis [N- (2-methylpropyl) -2-methylpropionamide], 2,2′-azobis (N-butyl-2-methylpropionamide), 2,2′-azobis [N- (2-methylethyl) -2-methylpropionamide], 2,2′-azobis (N-hexyl-2-methylpropion) Amide), 2,2′-azobis (N-propyl-2-methylpropionamide), 2,2′-azobis (N-ethyl-2-methylpropionamide) and the like represented by the following general formula (1) Azoamide compounds are preferred.

Examples of the azide compound include 3-azidomethyl-3-methyloxetane, terephthalazide, p-tert-butylbenzazide, and glycidyl azide polymer obtained by ring-opening polymerization of 3-azidomethyl-3-methyloxetane. And polymers having an azide group such as These azide compounds generate nitrogen gas when stimulated by light, heat, impact, or the like.

The gas generating agent is preferably dissolved in the gas generating pressure-sensitive adhesive layer. Since the gas generating agent is dissolved in the gas generating adhesive layer, the gas generated from the gas generating agent is efficiently released out of the gas generating adhesive layer when stimulation is applied. In addition, when the gas generating agent is present as particles in the gas generating adhesive layer, when light is irradiated as a stimulus for generating gas, light is scattered at the particle interface, resulting in low gas generation efficiency. The surface smoothness of the gas generating pressure-sensitive adhesive layer may be deteriorated. The fact that the gas generating agent is dissolved in the gas generating adhesive layer can be confirmed by the absence of gas generating agent particles when the gas generating adhesive layer is observed with an electron microscope.

In order to dissolve the gas generating agent in the gas generating pressure-sensitive adhesive layer, a gas generating agent that dissolves in the pressure-sensitive adhesive constituting the gas generating pressure-sensitive adhesive layer may be selected. When selecting a gas generating agent that does not dissolve in the pressure-sensitive adhesive, for example, the gas generating agent is dispersed as finely as possible in the gas-generating pressure-sensitive adhesive layer by using a dispersing machine or using a dispersing agent in combination. It is preferable. In order to finely disperse the gas generating agent in the gas generating pressure-sensitive adhesive layer, the gas generating agent is preferably fine particles. Further, these fine particles can be obtained using, for example, a disperser or a kneading apparatus. It is preferable to use finer particles as necessary. That is, it is more preferable to disperse the gas generating agent to a state where it cannot be confirmed when the gas generating adhesive layer is observed with an electron microscope.

The content of the gas generating agent may be appropriately selected depending on the type of the gas generating agent. For example, when an azo compound is used as the gas generating agent, 100 parts by weight of the adhesive constituting the gas generating adhesive layer The preferred lower limit is 5 parts by weight and the preferred upper limit is 50 parts by weight. If the amount is less than 5 parts by weight, a sufficient peeling pressure may not be obtained and peeling may not be possible. If the amount exceeds 50 parts by weight, the solubility may deteriorate and problems such as bleeding may occur. A more preferred lower limit is 15 parts by weight, and a more preferred upper limit is 30 parts by weight.

The pressure-sensitive adhesive constituting the gas generating pressure-sensitive adhesive layer is not particularly limited, and examples thereof include (meth) acrylic acid alkyl ester polymers, ethylene-vinyl acetate copolymers, ethylene-acrylic copolymers, silicone resins, and modified silicones. Resins; Rubbers such as SEBS, SIS, SBR, epoxy resins, fluororesins, polyester resins, polyamide resins, etc. can be used. These resins may be used alone or in combination of two or more.

The gas generating pressure-sensitive adhesive layer may contain a crosslinkable resin component that crosslinks upon stimulation. By giving a stimulus and crosslinking the crosslinkable resin component, the elastic modulus of the gas generating pressure-sensitive adhesive layer is increased and the adhesive force is decreased. Furthermore, when a gas is generated from the gas generating agent in a hard cured product having an increased elastic modulus, most of the generated gas is released to the outside, and the released gas is at least on the adhesive surface of the adhesive from the adherend. Peel part and reduce adhesion. The stimulus for crosslinking the crosslinkable resin component may be the same as or different from the stimulus for generating gas from the gas generating agent.

As such a crosslinkable resin component, for example, an acrylic acid alkyl ester-based and / or methacrylic acid alkyl ester-based polymerizable polymer having a radical polymerizable unsaturated bond in the molecule, and a radical polymerizable A photo-curing pressure-sensitive adhesive comprising a polyfunctional oligomer or monomer as a main component and containing a photopolymerization initiator as necessary, or an alkyl acrylate ester having a radical polymerizable unsaturated bond in the molecule And / or a methacrylic acid alkyl ester-based polymerizable polymer and a radical polymerizable polyfunctional oligomer or monomer as main components and a thermosetting pressure-sensitive adhesive containing a thermal polymerization initiator.

Such a photo-curing pressure-sensitive adhesive or a thermosetting pressure-sensitive adhesive such as a thermosetting pressure-sensitive adhesive is polymerized because the entire pressure-sensitive adhesive layer is uniformly and quickly polymerized and cross-linked by irradiation with light or heating. The increase in elastic modulus due to curing becomes significant, and the adhesive strength is greatly reduced. In addition, when gas is generated from the gas generating agent in a hard cured product having an increased elastic modulus, most of the generated gas is released to the outside, and the released gas is at least on the adhesive adhesive surface from the adherend. Peel part and reduce adhesion.

The polymerizable polymer is prepared by, for example, previously synthesizing a (meth) acrylic polymer having a functional group in the molecule (hereinafter referred to as a functional group-containing (meth) acrylic polymer) and reacting with the functional group in the molecule. It can obtain by making it react with the compound (henceforth a functional group containing unsaturated compound) which has a functional group to perform and a radically polymerizable unsaturated bond.

The functional group-containing (meth) acrylic polymer is an acrylic having an alkyl group usually in the range of 2 to 18 as a polymer having adhesiveness at room temperature, as in the case of a general (meth) acrylic polymer. By copolymerizing an acid alkyl ester and / or methacrylic acid alkyl ester as a main monomer, a functional group-containing monomer, and, if necessary, another modifying monomer copolymerizable therewith by a conventional method It is obtained. The weight average molecular weight of the functional group-containing (meth) acrylic polymer is usually about 200,000 to 2,000,000.

Examples of the functional group-containing monomer include a carboxyl group-containing monomer such as acrylic acid and methacrylic acid; a hydroxyl group-containing monomer such as hydroxyethyl acrylate and hydroxyethyl methacrylate; and an epoxy group containing glycidyl acrylate and glycidyl methacrylate. Monomers; Isocyanate group-containing monomers such as isocyanate ethyl acrylate and isocyanate ethyl methacrylate; and amino group-containing monomers such as aminoethyl acrylate and aminoethyl methacrylate.

Examples of other modifying monomers that can be copolymerized include various monomers used in general (meth) acrylic polymers such as vinyl acetate, acrylonitrile, and styrene.

The functional group-containing unsaturated compound to be reacted with the functional group-containing (meth) acrylic polymer is the same as the functional group-containing monomer described above according to the functional group of the functional group-containing (meth) acrylic polymer. it can. For example, when the functional group of the functional group-containing (meth) acrylic polymer is a carboxyl group, an epoxy group-containing monomer or an isocyanate group-containing monomer is used, and when the functional group is a hydroxyl group, an isocyanate group-containing monomer is used. When the functional group is an epoxy group, a carboxyl group-containing monomer or an amide group-containing monomer such as acrylamide is used, and when the functional group is an amino group, an epoxy group-containing monomer is used. The polyfunctional oligomer or monomer preferably has a molecular weight of 10,000 or less, and more preferably has a molecular weight of 5, so that the three-dimensional network of the pressure-sensitive adhesive layer can be efficiently formed by heating or light irradiation. 000 or less and the number of radically polymerizable unsaturated bonds in the molecule is 2 to 20. Examples of such more preferred polyfunctional oligomers or monomers include trimethylolpropane triacrylate, tetramethylolmethane tetraacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol monohydroxypentaacrylate, dipentaerythritol hexaacrylate. Or the above-mentioned methacrylates etc. are mentioned. Other examples include 1,4-butylene glycol diacrylate, 1,6-hexanediol diacrylate, polyethylene glycol diacrylate, commercially available oligoester acrylate, and methacrylates similar to those described above. These polyfunctional oligomers or monomers may be used alone or in combination of two or more.

Examples of the photopolymerization initiator include those activated by irradiation with light having a wavelength of 250 to 800 nm. Examples of such a photopolymerization initiator include acetophenone derivative compounds such as methoxyacetophenone. Benzoin ether compounds such as benzoin propyl ether and benzoin isobutyl ether; ketal derivative compounds such as benzyl dimethyl ketal and acetophenone diethyl ketal; phosphine oxide derivative compounds; bis (η5-cyclopentadienyl) titanocene derivative compounds, benzophenone, Michler's ketone , Chlorothioxanthone, todecylthioxanthone, dimethylthioxanthone, diethylthioxanthone, α-hydroxycyclohexyl phenyl ketone, 2-hydroxymethylphenyl pro Examples include photo radical polymerization initiators such as bread. These photoinitiators may be used independently and 2 or more types may be used together.

Examples of the thermal polymerization initiator include those that decompose by heat and generate active radicals that initiate polymerization and curing, such as dicumyl peroxide, di-t-butyl peroxide, and t-butyl peroxybenzoale. , T-butyl hydroperoxide, benzoyl peroxide, cumene hydroperoxide, diisopropylbenzene hydroperoxide, paramentane hydroperoxide, di-t-butyl peroxide and the like. Among these, cumene hydroperoxide, paramentane hydroperoxide, di-t-butyl peroxide, and the like are preferable because of their high thermal decomposition temperature. Although it does not specifically limit as what is marketed among these thermal-polymerization initiators, For example, perbutyl D, perbutyl H, perbutyl P, permenta H (all are the products made from NOF) etc. are suitable. These thermal polymerization initiators may be used independently and 2 or more types may be used together.

In addition to the above components, the post-curing pressure-sensitive adhesive described above is variously blended with general pressure-sensitive adhesives such as isocyanate compounds, melamine compounds, and epoxy compounds as desired for the purpose of adjusting the cohesive force as the pressure-sensitive adhesive. You may mix | blend a polyfunctional compound suitably. Moreover, well-known additives, such as a plasticizer, resin, surfactant, wax, and a fine particle filler, can also be added.

Although it does not specifically limit as thickness of the said gas generation adhesive layer, A preferable minimum is 3 micrometers and a preferable upper limit is 50 micrometers. If the thickness is less than 3 μm, the adhesive strength may be insufficient and the wafer may not be sufficiently fixed during grinding. If the thickness exceeds 50 μm, the adhesive strength may be too high and the peelability may be reduced.

The semiconductor manufacturing method of the present invention includes a step 2 of grinding the wafer while being fixed to the pressure-sensitive adhesive sheet (FIG. 1B).

The method for producing a semiconductor of the present invention includes a step 3 of obtaining a wafer having an adhesive layer for adhesion between layers by peeling the base material from the ground wafer while leaving the adhesive layer for the interlayer adhesive. (FIG. 1C). When the pressure-sensitive adhesive sheet has the gas generating pressure-sensitive adhesive layer, the gas-generating pressure-sensitive adhesive layer and the adhesive layer for interlayer adhesion can be more easily peeled by giving a stimulus to the pressure-sensitive adhesive sheet.

According to the semiconductor manufacturing method of the present invention, it is possible to obtain a wafer with an interlayer adhesive that is extremely thinly ground. By laminating this ground wafer with an interlayer adhesive on another wafer, substrate or the like by a conventional method, a highly laminated semiconductor can be easily manufactured.

According to the present invention, it is possible to obtain a semiconductor manufacturing method capable of obtaining a wafer with an interlayer adhesive that has been extremely thinly ground, and capable of easily producing a highly stacked semiconductor using the wafer. Can do.

Hereinafter, embodiments of the present invention will be described in more detail with reference to examples. However, the present invention is not limited to these examples.

(Example 1)
(1) Preparation of pressure-sensitive adhesive sheet (preparation of adhesive for adhesive layer for interlayer adhesion)
The compounds described below were mixed using a homodisper stirrer to prepare an ethyl acetate solution of an adhesive for an adhesive layer for interlayer adhesion.
Negami Kogyo Co., Ltd., Balaclon W248E 100 parts by weight Nippon Polyurethane Co., Ltd., Coronate L 1.5 parts by weight 2,2′-azobis- (N-butyl-2-methylpropionamide) 50 parts by weight

(Adjustment of adhesive for gas generating adhesive layer)
The following compounds were dissolved in ethyl acetate and polymerized by irradiating with ultraviolet rays to obtain an acrylic copolymer having a weight average molecular weight of 700,000.
The resin solid content of 100 parts by weight of the ethyl acetate solution containing the acrylic copolymer thus obtained is reacted by adding 3.5 parts by weight of 2-isocyanatoethyl methacrylate, and further the resin of the ethyl acetate solution after the reaction. A polyisocyanate 0.5 part by weight and a photopolymerization initiator (Irgacure 651) 0.1 part by weight were mixed with 100 parts by weight of a solid content to prepare an ethyl acetate solution of an adhesive.
Butyl acrylate 79 parts by weight Ethyl acrylate 15 parts by weight Acrylic acid 1 part by weight 2-hydroxyethyl acrylate 5 parts by weight Photopolymerization initiator 0.2 part by weight (Irgacure 651, 50% ethyl acetate solution)
0.01 part by weight of lauryl mercaptan 30 parts by weight of 2,2′-azobis (N-butyl-2-methylpropionamide) with respect to 100 parts by weight of the resin solid content of the obtained adhesive in ethyl acetate solution, 3.6 parts by weight of 4-diethylthioxanthone, 4 parts by weight of Irgacure and 0.5 parts by weight of polyisocyanate were mixed to prepare an ethyl acetate solution of a pressure-sensitive adhesive for gas generating pressure-sensitive adhesive layer.

(Preparation of adhesive sheet)
The ethyl acetate solution of the pressure-sensitive adhesive for the gas generating pressure-sensitive adhesive layer is placed on a transparent polyethylene terephthalate (PET) film having a thickness of 50 μm by a release knife so that the dry film thickness is about 10 μm. The coating solution was heated at 110 ° C. for 5 minutes to dry the coating solution. Next, the surface of the pressure-sensitive adhesive layer was laminated to a transparent polyethylene terephthalate (PET) film (base material) having a thickness of 100 μm and subjected to corona treatment on both sides. Then, static curing was performed at 40 ° C. for 3 days.

On the other hand, an ethyl acetate solution of an adhesive for an adhesive layer for interlayer adhesion was applied on a PET film subjected to a release treatment with a doctor knife so that the thickness after drying was 40 μm, and then 110 ° C. And dried for 3 minutes to form an adhesive layer for interlayer adhesion.

Peel off the PET film on the other side of the gas generating pressure-sensitive adhesive layer formed on the substrate and peel off the PET film. Adhesion for interlayer adhesion so that the adhesive layer for interlayer adhesion overlaps the gas-generating pressure-sensitive adhesive layer The PET film on which the agent layer was formed was stacked and pressure-bonded using a laminator (LMP-350EX, manufactured by Lamy Corporation) heated to 60 ° C. to obtain an adhesive sheet.

(2) Manufacturing of semiconductor After peeling off the PET film that protects the adhesive layer for interlayer adhesion of the pressure-sensitive adhesive sheet and attaching it to a silicon wafer having a diameter of 20 cm and a thickness of about 700 μm using a laminator, this is attached to a grinding device, The silicon wafer was ground until the thickness was about 100 μm. At this time, the operation was performed while water was sprayed on the silicon wafer so that the temperature of the silicon wafer did not rise due to frictional heat of grinding.
The silicon wafer was removed from the grinding apparatus and irradiated with ultraviolet light of 365 nm from the glass plate side for 120 seconds while adjusting the illuminance so that the illuminance on the surface of the glass plate was 40 mW / cm ² (integrated light amount 4800 mJ / Cm ² ).
When the base material of the pressure-sensitive adhesive sheet was peeled off, an adhesive layer for interlayer adhesion was left on the ground wafer, and a wafer with an interlayer adhesive could be obtained.
Finally, the wafer with the interlayer adhesive was laminated with another wafer to obtain a highly laminated semiconductor.

According to the present invention, it is possible to obtain a semiconductor manufacturing method capable of obtaining a wafer with an interlayer adhesive that has been extremely thinly ground, and capable of easily producing a highly stacked semiconductor using the wafer. Can do.

It is a schematic diagram explaining the manufacturing method of the semiconductor of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Wafer 1 'Ground wafer 12 Bump 2 Adhesive sheet 21 Base material 22 Adhesive layer for interlayer adhesion

Claims (2)

A step 1 of bonding the adhesive layer for interlayer adhesion of a pressure-sensitive adhesive sheet composed of a base material and an adhesive layer for interlayer adhesion formed on the base material to the wafer;
Step 2 for grinding the wafer while being fixed to the adhesive sheet.
The semiconductor has a step 3 of obtaining a wafer having the interlayer adhesive layer adhered thereto by peeling the base material from the ground wafer while leaving the interlayer adhesive layer remaining. Production method. The pressure-sensitive adhesive tape has a gas generating pressure-sensitive adhesive layer containing a gas generating agent that generates gas by stimulation between the base material and the adhesive layer for interlayer adhesion,
2. The step 3, wherein the pressure-sensitive adhesive sheet is stimulated to generate a gas from a gas generating agent, and the gas-generating pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet and the adhesive layer for interlayer adhesion are peeled off. Semiconductor manufacturing method.

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