JP2008006792A - Inkjet head, inkjet head manufacturing method and wiring substrate for head chip mounting - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an inkjet head which ensures the easy positioning of a head chip with a wiring substrate and a high positioning precision, and an inkjet head manufacturing method and a wiring substrate for head chip mounting. <P>SOLUTION: The head chip 1 is of such a structure that drive walls 11 made up of a piezoelectric element and channels 12 are alternately juxtaposed, and an outlet and an inlet of each channel 12 are arranged on the front surface and the rear surface of the head chip, with a connection electrode connected electrically with a drive electrode formed on the inner surface of the channel 12, formed on the rear surface. In addition, the wiring substrate 3 is connected with the rear surface of the head chip 1, with arranged wiring electrodes 33 connected electrically with the connection electrode. Further, a plurality of projections 36 are formed on the surface of the wiring substrate 3 so as to allow the projections 36 to come into contact with the outer peripheral edge of a joining surface of the head chip 1 joined with the wiring substrate 3. Thus the head chip 1 is positioned by the projections 36. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an ink jet head, a method for manufacturing an ink jet head, and a wiring substrate for mounting a head chip, and more specifically, an ink jet head capable of easily and reliably positioning a head chip and a wiring substrate, a method for manufacturing an ink jet head, and a head. The present invention relates to a wiring board for chip mounting.

  Conventionally, a channel is ground on a piezoelectric substrate, a drive electrode is formed on a drive wall that divides the channel, and a voltage is applied to the drive electrode to shear and deform the drive wall in a U-shape. 2. Description of the Related Art A shear mode type ink jet head that discharges the ink from a nozzle is known. Among them, a so-called harmonica type in which a large number of actuators for ejecting ink are alternately arranged in parallel with drive walls made of piezoelectric elements and channels as pressure chambers, and channel inlets, outlets and nozzles are arranged linearly. By using the head chip, the number of wafers to be taken from one wafer is large, the productivity is extremely high, and since the channel is straight from the inlet to the outlet, bubble removal is good, power efficiency is high, and heat is generated. There are known ink jet heads that have many advantages such as a small number and excellent high-speed response.

  In such a harmonica type head chip, it is difficult to connect a wiring for applying a drive voltage to the drive electrode. Usually, the connection electrode electrically connected to each drive electrode is drawn to the outer surface of the head chip, and the head Wiring is connected on the outer surface of the chip.

  For this reason, the present applicant has arranged a wiring electrode for electrical connection with the connection electrode of the head chip on the surface of the substrate, and has a size that protrudes in a direction perpendicular to the channel row direction from the rear surface of the head chip. A wiring board having a wiring board is prepared, and this wiring board is bonded to the rear surface of the head chip with an adhesive so that an end portion protruding from the head chip can be used to easily connect to an FPC or the like. This technique is proposed (Patent Document 1).

  When joining such a harmonica type head chip to a wiring board, it is necessary to accurately align the connection electrode of the head chip and the wiring electrode of the wiring board.

Conventionally, as a technique for aligning electronic components, a method of using an observation system such as a microscope or CCD (Patent Document 2) or using a positioning mark as a positioning technique, or by fitting uneven parts to each other and fitting them together. A method of performing (Patent Document 3) is known.
JP 2006-82396 A JP 2003-305851 A JP-A-11-204913

  However, in the method described in Patent Document 2, it is necessary to observe a plurality of points for positioning, and it takes time for positioning work, and there is a problem that the adjusted position shifts during handling. is there.

  Further, in the method described in Patent Document 3, it is necessary to form irregularities with complicated shapes for fitting, and in a technical field where a fine wiring pattern such as an inkjet head is required, electrical Short circuit is a concern and difficult.

  Accordingly, an object of the present invention is to provide an inkjet head in which the positional accuracy between the head chip and the wiring substrate is ensured to be high.

  Another object of the present invention is to provide an ink jet head manufacturing method capable of easily and reliably positioning a head chip and a wiring board.

  It is another object of the present invention to provide a head chip mounting wiring board that can be easily and reliably positioned when bonding the head chip to the surface.

  Other problems of the present invention will become apparent from the following description.

  The above problems are solved by the following inventions.

  According to a first aspect of the present invention, drive walls and channels made of piezoelectric elements are alternately arranged side by side, and outlets and inlets of the channels are arranged on the front and rear surfaces, respectively. An ink jet comprising: a head chip having connection electrodes electrically connected to a rear surface; and a wiring substrate having wiring electrodes arranged on the rear surface of the head chip and arranged to be electrically connected to the connection electrodes. In the head, a plurality of protrusions are formed on the surface of the wiring board so as to contact an outer peripheral edge of a bonding surface of the head chip bonded to the wiring board.

  A second aspect of the present invention is the ink jet head according to the first aspect, wherein at least three of the protrusions are arranged with respect to two adjacent surfaces of the side walls of the head chip.

  A third aspect of the invention is the ink jet head according to the first or second aspect, wherein the protrusion is disposed on the wiring electrode.

  According to a fourth aspect of the present invention, in the ink jet head according to the third aspect, the height of the protrusion is ½ or more of the width of the wiring electrode.

  A fifth aspect of the present invention is the ink jet head according to the first or second aspect, wherein the protrusion is disposed between the adjacent wiring electrodes.

  A sixth aspect of the present invention is the ink jet head according to any one of the first to fifth aspects, wherein the protrusion is formed by a bump.

  The invention according to claim 7 is the ink jet head according to claim 6, wherein the bump is formed by solder reflow.

  According to an eighth aspect of the present invention, there is provided a drive electrode formed on the inner surface of the channel, wherein drive walls made of piezoelectric elements and channels are alternately arranged, and an outlet and an inlet of the channel are arranged on the front surface and the rear surface, respectively. A head chip in which a connection electrode to be electrically connected is formed on the rear surface, and a wiring in which wiring electrodes that are bonded to the rear surface of the head chip using an adhesive and are electrically connected to the connection electrode are arranged. In the method of manufacturing an inkjet head having a substrate, the head is formed by forming a protrusion on the surface of the wiring substrate, pressing a side wall surface of the head chip toward the protrusion, and abutting the head chip against the protrusion. A method for manufacturing an ink jet head, comprising: positioning a chip at a predetermined position with respect to a surface of the wiring substrate.

  The invention according to claim 9 is the method of manufacturing an ink jet head according to claim 8, wherein at least three of the protrusions are arranged with respect to two adjacent surfaces of the side wall surfaces of the head chip. .

  A tenth aspect of the present invention is the method of manufacturing an ink jet head according to the eighth or ninth aspect, wherein the protrusion is disposed on the wiring electrode.

  The invention according to claim 11 is the method of manufacturing an ink-jet head according to claim 10, wherein the height of the protrusion is set to ½ or more of the width of the wiring electrode.

  A twelfth aspect of the invention is the method of manufacturing an ink jet head according to the eighth or ninth aspect, wherein the protrusion is disposed between the adjacent wiring electrodes.

  A thirteenth aspect of the invention is the method of manufacturing an ink jet head according to any one of the eighth to twelfth aspects, wherein the protrusion is formed by a bump.

  The invention according to claim 14 is the method of manufacturing an ink-jet head according to claim 13, wherein the bump is formed by solder reflow.

  In the invention described in claim 15, the wiring electrode is arranged on the surface, and the head chip is bonded using an adhesive so that the wiring electrode and the electrode arranged on the surface of the head chip are electrically connected. A wiring substrate for mounting, wherein a plurality of protrusions are formed at positions in contact with an outer peripheral edge of a bonding region with the head chip.

  According to a sixteenth aspect of the present invention, in the head chip according to the fifteenth aspect, at least three of the protrusions are arranged with respect to two adjacent sides of the peripheral edge of the bonding area with the head chip. A wiring board for mounting.

  The invention according to claim 17 is the wiring board for mounting a head chip according to claim 15 or 16, wherein the protrusion is disposed on the wiring electrode.

  The invention according to claim 18 is the wiring board for mounting a head chip according to claim 17, wherein the height of the protrusion is ½ or more of the width of the wiring electrode.

  A nineteenth aspect of the present invention is the head chip mounting wiring board according to the fifteenth or sixteenth aspect, wherein the protrusions are respectively disposed between the adjacent wiring electrodes.

  The invention according to claim 20 is the wiring board for mounting a head chip according to any one of claims 15 to 19, wherein the protrusion is formed by a bump.

  A twenty-first aspect of the invention is the head chip mounting wiring board according to the twenty-first aspect, wherein the bumps are formed by solder reflow.

  According to the present invention, it is possible to provide an inkjet head in which the positional accuracy between the head chip and the wiring substrate is ensured to be high.

  In addition, according to the present invention, it is possible to provide an ink jet head manufacturing method capable of easily and reliably positioning a head chip and a wiring board.

  Furthermore, according to the present invention, it is possible to provide a head chip mounting wiring board that can be easily and reliably positioned when the head chip is bonded to the surface.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is an exploded perspective view of the inkjet head, and FIG. 2 is a rear view showing the rear surface of the head chip.

  In FIG. 1, 1 is a head chip, 2 is a nozzle plate bonded to the front surface of the head chip 1, and 3 is a wiring substrate bonded to the rear surface of the head chip 1.

  In the present specification, the surface on the side where the ink corresponding to the nozzle side of the head chip 1 is ejected is referred to as “front surface”, and the opposite surface is referred to as “rear surface”.

  In the head chip 1, drive walls 11 and channels 12 made of piezoelectric elements are alternately arranged in parallel. The shape of the channel 12 is such that both side walls are formed parallel to each other. An outlet and an inlet of each channel 12 are arranged on the front surface and the rear surface of the head chip 1, respectively, and each channel 12 is a straight type whose size and shape do not change substantially in the length direction from the inlet to the outlet.

  In the head chip 1, each channel 12 has two channel rows. Each channel row is composed of eight channels 12, but the number of channels 12 constituting the channel row in the head chip 1 is not limited at all.

  A drive electrode 13 is formed on the inner surface of each channel 12. The metal that forms the drive electrode 13 includes Ni, Co, Cu, Al, and the like. It is preferable to use Al or Cu from the viewpoint of electrical resistance, but Ni is preferably used from the viewpoint of corrosion, strength, and cost. Alternatively, a laminated structure in which Au is further laminated on Al may be employed.

  Examples of the formation of the drive electrode 13 include a method of forming a metal film by a method using a vacuum apparatus such as a vapor deposition method, a sputtering method, a plating method, or a CVD (chemical vapor reaction method). It is particularly preferable to form by electroless plating. By electroless plating, a uniform and pinhole-free metal coating can be formed. The thickness of the plating film is preferably in the range of 0.5 to 5 μm.

  On the rear surface of the head chip 1, connection electrodes 14 drawn from the drive electrodes 13 of the respective channels 12 are formed. The connection electrode 14 can be formed by vapor deposition or sputtering.

  The nozzle plate 2 is provided with nozzles 21 at positions corresponding to the outlets of the respective channels 12 of the head chip 1, and is bonded to the front surface of the head chip 1 on which the connection electrodes 14 are formed using an epoxy adhesive. The Accordingly, the inlet, outlet and nozzle 21 of each channel 12 are arranged in a straight line.

  The wiring board 3 is a plate-like member for connecting a wiring for applying a driving voltage from a driving circuit (not shown) to each driving electrode 13 of the head chip 1. The substrate used for the wiring substrate 3 is a substrate made of a ceramic material such as non-polarized PZT, AlN-BN, or AlN, a substrate made of low thermal expansion plastic or glass, or a piezoelectric element used in the head chip 1. A substrate obtained by depolarizing the same substrate material as the substrate material can be used. Preferably, in order to suppress the occurrence of distortion or the like of the head chip 1 due to the difference in thermal expansion coefficient, a material having a difference in thermal expansion coefficient within ± 3 ppm with respect to unpolarized PZT is selected.

  The substrate constituting the wiring substrate 3 is not limited to a single plate, and a plurality of thin plate materials may be laminated to form a desired thickness.

  The wiring substrate 3 has a larger area than the rear surface of the head chip 1 and extends in a direction (B direction in the figure) perpendicular to the direction in which the channels 12 of the head chip 1 are arranged (channel row direction). Each of the overhanging ends is extended from the chip 1, and wiring ends 31 and 31 for connecting an FPC or the like (not shown) are provided at the overhanging ends. In addition, the wiring board 3 also protrudes greatly in the direction in which the channels 12 of the head chip 1 are arranged (direction A in the figure).

  An opening 32 is formed through the substantially central portion of the wiring board 3. The opening 32 is formed in such a size that the inlet side of all the channels 12 facing the rear surface of the head chip 1 can be exposed.

  As a method for forming the opening 32, depending on the substrate material, a method of processing with a dicing saw, a method of processing with an ultrasonic processing machine, a method of molding and firing ceramics before sintering, a method of forming by sand blasting Etc. can be adopted.

  Wiring electrodes 33 are formed on the surface of the wiring substrate 3 on the bonding surface side with the head chip 1 at the same number and pitch as the connection electrodes 14 formed on the rear surface of the head chip 1. The wiring connection portions 31 and 31 extend to the outer edge of the wiring board 3. When the FPC or the like is joined, the wiring electrode 33 is electrically connected to each wiring formed in the FPC or the like, and a driving voltage from the driving circuit is supplied to the driving electrode 13 in the channel 12 via the connecting electrode 14. It functions as an electrode for applying to.

  The wiring electrode 33 is formed by coating the surface of the wiring substrate 3 with a positive resist by a spin coating method, and then exposing and developing the positive resist using a stripe-shaped mask to develop a stripe-shaped positive resist. It can be performed by exposing the surface of the wiring substrate 3 at the same number and pitch as the connection electrodes 14 and forming a metal film on the surface with a metal for electrode formation by vapor deposition or sputtering. As the metal for electrode formation, the same metal as the connection electrode 14 can be used.

  In addition to the wiring electrodes 33, a positioning metal thin film pattern 34 for positioning the head chip 1 is formed on the surface of the wiring substrate 3 in parallel with the wiring electrodes 33. This positioning metal thin film pattern 34 is used when positioning the head chip 1 in the A direction along the channel row direction without bonding to the rear surface of the head chip 1 when bonding to the head chip 1.

  In FIG. 1, a region indicated by a broken line on the surface of the wiring substrate 3 is a bonding region 35 of the head chip 1, and the surface of the wiring substrate 3 is in contact with the outer peripheral edge of the bonding region 35 of the head chip 1. A plurality of protrusions 36 are formed.

  FIG. 1 shows an example in which three protrusions 36a, 36b, 36c, which is the minimum number, are formed. The three protrusions 36a, 36b, 36c are two sides of the peripheral edges 35a, 35b of the bonding region 35 corresponding to the adjacent two surfaces 1A, 1B of the side wall surfaces of the head chip 1 bonded to the wiring board 3. It is arranged to touch. That is, here, two protrusions 36a and 36b in contact with the peripheral edge 35a on the side where one wiring electrode 33 is arranged, and a protrusion 36c in contact with the peripheral edge 35b on the side where the positioning metal thin film pattern 34 is formed. have. If at least three protrusions 36a, 36b, 36c are arranged in this way, the two-dimensional position (position in the A direction and B direction) of the head chip 1 on the surface of the wiring board 3 can be determined reliably. .

  Two protrusions 36 a and 36 b provided on the side where the wiring electrode 33 is arranged are formed on the wiring electrode 33. One protrusion 36 c provided on the side where the positioning metal thin film pattern 34 is formed is formed on the positioning metal thin film pattern 34.

  The cross-sectional shape of each protrusion 36 formed on the wiring electrode 33 and the positioning metal thin film pattern 34 is not particularly limited, and may be a trapezoidal shape, a square shape, a hemispherical shape, a spherical shape, or the like. In the present specification, a hemispherical protrusion 36 is shown.

  Such protrusions 36 are preferably formed by bumps. Normally, the bump is used to compensate for a minute difference in the film thickness of the wiring and improve the reliability of the electrical connection. However, according to the bump, the bump is easily formed on the wiring electrode 33 and the positioning metal thin film pattern 34. The protrusion 36 can be formed on the surface.

  The bump can be formed by a normal bump forming method such as solder bonding, wire bonding using gold, aluminum, copper or the like.

  The bumps are preferably formed by solder reflow. In the solder reflow, a solder paste having a predetermined thickness (for example, 30 to 70 μm thickness) is provided on the wiring electrode 33 or the positioning metal thin film pattern 34 by printing, plating or the like, and then heated to a temperature at which the solder melts. A spherical bump can be formed by heating. The solder paste can be printed by ink-jet coating, and bumps can be formed with accurate positional accuracy.

  3 is a cross-sectional view taken along line (iii)-(iii) in FIG. 1. As shown in FIG. 3, the protrusion height h of the protrusion 36 from the surface of the wiring board 3 is the wiring electrode. It is preferable that it is 1/2 or more of 33 width w (refer FIG. 1). By setting the height h of the protrusion 36 to be 1/2 or more of the width of the wiring electrode 33, the head chip 1 can be easily caught during positioning, and the contact with the electrode slightly protruding from the side surface of the head chip 1 can also be achieved. Therefore, the electrical connection is also good. Moreover, it can also serve as a wall that reduces the outflow of adhesive during heat bonding.

  When the protrusion 36 is formed of a metal such as a bump, the upper limit is preferably less than 3/2 of the width of the wiring electrode 33 in order to avoid the risk of short-circuiting between the adjacent wiring electrodes 33.

  When the head chip 1 is bonded to the surface of the wiring board 3, after applying an anisotropic conductive adhesive to the bonding region 35 in advance, the head is applied to the surface of the wiring board 3 as shown in FIG. The rear surface of the chip 1 is placed, and first, the side wall surface 1A of the head chip 1 is moved in parallel with the surface of the wiring substrate 3 toward the two protrusions 36a and 36b formed on the wiring electrode 33. The head chip 1 is pressed against the protrusions 36a and 36b.

  Next, as shown in FIG. 4B, the side wall surface 1B of the head chip 1 in a state of abutting against the two protrusions 36a and 36b on the wiring electrode 33 is formed on the positioning metal thin film pattern 34. The head chip 1 is abutted against the remaining one of the protrusions 36c by moving it in parallel to the surface of the wiring substrate 3 and pressing it toward the protrusion 36c. As a result, as shown in FIG. 5, the head chip 1 is bonded with the two-dimensional position with respect to the surface of the wiring board 3 positioned at a predetermined position. Therefore, in the completed inkjet head, since the side wall surface of the head chip 1 is positioned by the plurality of protrusions 36, the positional accuracy of the head chip 1 with respect to the wiring board 3 is ensured.

  As described above, the positioning of the head chip 1 with respect to the surface of the wiring board 3 is performed by abutting the head chip 1 against the protrusions 36 formed on the surface of the wiring board 3, so that when the head chip 1 is observed by a microscope as in the conventional case. Thus, it is not necessary to observe a plurality of points for positioning, and it is not necessary to adjust XYθ for positioning, and positioning work can be performed easily and reliably in a short time. Moreover, since the periphery of the positioned head chip 1 is supported by the plurality of protrusions 36, there is little fear of causing a positional shift during handling.

  In the above embodiment, the minimum number of protrusions 36 is exemplified, but may be three or more. The protrusion 36 may be formed not only on the wiring electrode 33 side arranged on one side but also on the wiring electrode 33 side arranged on the other side.

  Further, the protrusions 36 may be formed on the wiring electrodes 33, respectively. At this time, it is also preferable to form not only on the wiring electrodes 33 arranged on one side but on all the wiring electrodes 33 as shown in FIG. When the protrusions 36 are formed on all the wiring electrodes 33 in this way, the protrusions are prevented from flowing out of the adhesive applied between the connection electrodes 14 and the wiring electrodes 33 of the head chip 1. Since 36 acts as a wall to be blocked by resistance, the head chip 1 and the wiring board 3 can be more reliably bonded as compared with the case where the projection 36 is provided with the minimum number.

  In this case, if the protrusion 36 is hemispherical or spherical, the surface of the protrusion 36 is guided when the head chip 1 is placed between the protrusion rows arranged on the wiring electrode 33 as shown in FIG. As a surface, the head chip 1 can be smoothly guided to the joining region 35 at the base of the protrusion 36.

  Further, when the protrusion 36 is formed of a hemispherical bump, the end surface 14a of the connection electrode 14 formed on the rear surface of the head chip 1 comes into contact with the base surface of the protrusion 36 as shown in FIG. The effect of increasing the reliability of the electrical connection between the connection electrode 14 and the wiring electrode 33 is also obtained.

  FIG. 8 shows still another aspect of the wiring board 3. In this embodiment, the protrusion 36 on the wiring electrode 33 side is disposed not between the wiring electrode 33 but between the adjacent wiring electrodes 33. This aspect is particularly effective when the arrangement pitch of the wiring electrodes 33 is large and the space between the adjacent wiring electrodes 33 is sufficiently wide. Here, it is disposed between the wiring electrodes 33, but it is sufficient that at least three protrusions 36 including the protrusions 36 formed on the positioning metal thin film pattern 34 are formed.

  When the protrusions 36 are arranged between the wiring electrodes 33 as shown in FIG. 8, the adhesive applied between the head chip 1 and the wiring board 3 is not separated between the wiring boards 33 adjacent to the protrusions 36. Therefore, the head chip 1 and the wiring board 3 can be more reliably bonded to each other than the case where the minimum number of protrusions 36 are provided. Sealing with the adhesive with the substrate 3 can be ensured, and there is no possibility of ink leakage.

  If the protrusion 36 is hemispherical or spherical, the head chip 1 can be smoothly guided to the bonding region 35 at the base of the protrusion 36 using the surface of the protrusion 36 as a guide surface as in the case described above.

  When the protrusions 36 are arranged between the adjacent wiring electrodes 33 in this way, the height and width of the protrusions 36 prevent the short-circuiting between the adjacent wiring electrodes 33 so that the arrangement pitch of the wiring electrodes 33 and the head chip 1 are reduced. It is determined as appropriate in consideration of the abutting condition when abutting.

  FIG. 9 shows still another aspect of the wiring board 3. In this embodiment, all the protrusions 36 are provided in a region other than the region where the wiring substrate 33 is arranged. That is, although one protrusion 36 c is formed on the positioning metal thin film pattern 34, it is the same as the above embodiment, but the wiring electrode 33 and the positioning metal thin film pattern 34 are formed on the surface of the wiring substrate 3. In addition, a positioning metal thin film pattern 37 is formed along the outer peripheral edge of the bonding region 35, and the other two protrusions 36 d and 36 e are formed on the positioning metal thin film pattern 37.

  The positioning metal thin film pattern 37 is formed at a position corresponding to the opposing side wall surface of the head chip 1, but may be formed at a position corresponding to the same side wall surface of the head chip 1.

  The head chip 1 described above is a case where there are two channel rows, but the channel row may be only one row, or may be a plurality of rows of three or more.

Exploded perspective view of inkjet head Rear view showing the rear surface of the head chip Sectional drawing which follows the (iii)-(iii) line | wire in FIG. Diagram showing the method of positioning the head chip on the wiring board The perspective view of the inkjet head which shows the state by which the head chip was positioned on the wiring board Plan view showing another example of wiring board Partial enlarged view showing a state in which the head chip is abutted against the protrusion Plan view showing another example of wiring board Plan view showing another example of wiring board

Explanation of symbols

1: Head chip 1A, 1B: Side wall surface 11: Drive wall 12: Channel 13: Drive electrode 14: Connection electrode 2: Nozzle plate 21: Nozzle 3: Wiring substrate 31: Wiring connection portion 32: Opening portion 33: Wiring electrode 34 37: Metal thin film pattern for positioning 35: Joining region 35a, 35b: Periphery 36: Projection

Claims (21)

Drive walls made of piezoelectric elements and channels are alternately arranged, and outlets and inlets of the channels are arranged on the front and rear surfaces, respectively, and connection electrodes electrically connected to the drive electrodes formed on the inner surfaces of the channels are provided. In an inkjet head having a head chip formed on the rear surface, and a wiring substrate formed by arranging wiring electrodes bonded to the rear surface of the head chip and electrically connected to the connection electrodes,
An inkjet head, wherein a plurality of protrusions are formed on a surface of the wiring board so as to abut on an outer peripheral edge of a bonding surface of the head chip bonded to the wiring board.   2. The ink jet head according to claim 1, wherein at least three protrusions are arranged with respect to two adjacent surfaces of the side wall surfaces of the head chip.   The inkjet head according to claim 1, wherein the protrusion is disposed on the wiring electrode.   4. The ink jet head according to claim 3, wherein the height of the protrusion is ½ or more of the width of the wiring electrode.   The inkjet head according to claim 1, wherein the protrusion is disposed between the adjacent wiring electrodes.   The inkjet head according to claim 1, wherein the protrusion is formed by a bump.   The inkjet head according to claim 6, wherein the bump is formed by solder reflow. Drive walls made of piezoelectric elements and channels are alternately arranged, and outlets and inlets of the channels are arranged on the front and rear surfaces, respectively, and connection electrodes electrically connected to the drive electrodes formed on the inner surfaces of the channels are provided. Manufacture of an inkjet head having a head chip formed on the rear surface, and a wiring substrate on which wiring electrodes are bonded to the rear surface of the head chip using an adhesive and electrically connected to the connection electrodes In the method
Protrusions are formed on the surface of the wiring substrate, and the head chip is pressed against the surface of the wiring substrate by pressing the side wall surface of the head chip toward the protrusions and abutting the head chip against the protrusions. A method for manufacturing an ink jet head, comprising positioning at a position.   9. The method of manufacturing an ink jet head according to claim 8, wherein at least three of the protrusions are arranged with respect to two adjacent surfaces of the side wall surfaces of the head chip.   The method of manufacturing an ink jet head according to claim 8, wherein the protrusion is disposed on the wiring electrode.   The method of manufacturing an ink jet head according to claim 10, wherein a height of the protrusion is set to ½ or more of a width of the wiring electrode.   The method of manufacturing an ink jet head according to claim 8, wherein the protrusion is disposed between the adjacent wiring electrodes.   The method of manufacturing an ink jet head according to claim 8, wherein the protrusion is formed by a bump.   The method of manufacturing an ink jet head according to claim 13, wherein the bump is formed by solder reflow. A wiring board on which a wiring electrode is arranged on the surface, and the head chip is bonded and mounted using an adhesive so that the wiring electrode and the electrode arranged on the surface of the head chip are electrically connected. And
A wiring board for mounting a head chip, wherein a plurality of protrusions are formed at positions in contact with an outer peripheral edge of a bonding region with the head chip.   16. The head chip mounting wiring board according to claim 15, wherein at least three of the protrusions are arranged on two adjacent sides of the periphery of the bonding area with the head chip.   17. The head chip mounting wiring board according to claim 15, wherein the protrusion is disposed on the wiring electrode.   18. The head chip mounting wiring board according to claim 17, wherein the height of the protrusion is at least half of the width of the wiring electrode.   17. The head chip mounting wiring board according to claim 15, wherein the protrusions are respectively disposed between the adjacent wiring electrodes.   20. The head chip mounting wiring board according to claim 15, wherein the protrusion is formed by a bump.   21. The wiring board for mounting a head chip according to claim 20, wherein the bump is formed by solder reflow.

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