JP2008004806A - Method for managing result of processing of wafer - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for managing the results of processing of a wafer in which the quality of processing can be managed easily at the time of mass production and variation in surface quality with time can be confirmed visually at a desired time. <P>SOLUTION: Kerf data generated every time of kerf inspection for imaging a formed kerf while positioning at an imaging means (step S108) is stored accumulatively in a storage means together with image information in association with its positional information (step S110). On the other hand, the schematic view of the profile of a wafer and the scheduled cut line is displayed as a wafer map, and a mark indicating the positional information of kerf check is also displayed on the wafer map (step S111) so that the image information can be reproduced on a display panel together with the kerf data by specifying a desired kerf check position utilizing that mark. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a wafer processing result management method in a processing apparatus such as a cutting apparatus.

  A wafer on which a plurality of devices such as IC and LSI are formed has its back surface ground to a predetermined thickness, and is divided into individual devices by a processing device such as a dicing device and used for electronic devices such as mobile phones and personal computers. Is done. Here, when the wafer is cut with a blade by a dicing machine, chipping (chipping) occurs on the cut surface, or the position of the cutting groove (kerf) is moved from the center of the hairline due to the influence of thermal deformation of the spindle or blade. It may shift.

  For this reason, in the dicing apparatus, the kerf check of the blade is performed at a preset timing. The kerf check function for monitoring the cutting situation is pre-set by taking an image of the cutting groove (kerf) cut by the blade with an electron microscope, processing the imaged image information, and calculating the measured value of the kerf position. When the position is different from the reference position (hairline), correction is automatically performed (hairline alignment). The kerf width and chipping size are also measured. In such a kerf check, information such as a deviation amount (off-center amount) between the kerf position and the reference value, a kerf width, and a chipping size is displayed on the display screen so that the operator can confirm.

JP-A-7-130806

  However, in the past, the kerf check function was executed in order to perform hairline alignment. Every time the kerf check function is executed, detailed kerf check measurement data is updated, and only numerical data is recorded as log data. It ’s just that. Therefore, in order to use the kerf check measurement data for production management such as quality confirmation in the mass production process, it is necessary to extract and output the kerf check measurement data from the log data. In addition, since there is no image information at the kerf check position, it is impossible to re-check the surface quality, which is indispensable for management. From the viewpoint of use in quality control, it is reliable to use kerf check measurement data. There's a problem.

  The present invention has been made in view of the above, and provides a wafer processing result management method capable of easily checking the processing quality at the time of mass production and visually confirming a change in surface quality over time when desired. The purpose is to do.

  In order to solve the above-described problems and achieve the object, a wafer processing result management method according to the present invention includes a chuck table that holds a wafer, an imaging unit that images the wafer held by the chuck table, A display panel for displaying an image captured by the imaging means, a processing means for processing the wafer held on the chuck table, and a processing feed means for processing and feeding the processing means and the chuck table relatively in the X-axis direction And a processing result management method for a wafer in a processing apparatus, the indexing means for indexing and feeding the processing means and the chuck table relatively in the Y-axis direction, wherein the processing feeding means and the indexing feeding means A cutting step for forming a cutting groove in a predetermined dividing line of the wafer by the processing means, and the cutting step The cut groove is periodically or randomly positioned on the image pickup means, the cut groove is picked up to generate image information and cut groove data, and the position of the image pickup means and the wafer is expressed in XY coordinates. A storage step of storing the image information and the cutting groove data in a storage unit in relation to the position information to be displayed; and a display of a wafer map on the display panel and a schematic diagram of the division planned line, and the storage step A display step for displaying the mark indicating the position information stored in step S3, and a reproduction step for reproducing the image information corresponding to the mark displayed in the display step and the cutting groove data on the display panel. And.

  In the wafer processing result management method according to the present invention, in the above-described invention, wafer information of the wafer map, the image information, and the cutting groove data is stored in the storage unit for each wafer together with ID information for specifying the wafer. The wafer information of the corresponding wafer is output from the storage means to the display panel based on the designated ID information.

  The wafer processing result management method according to the present invention is characterized in that, in the above invention, the information stored in the storage step and the display step is stored in a portable storage medium.

  The wafer processing result management method according to the present invention is characterized in that, in the above invention, the cutting groove data is a deviation amount between a hairline indicating a center position of the imaging means and a cutting groove center.

  The wafer processing result management method according to the present invention is characterized in that, in the above invention, the cutting groove data includes one of a width of a cutting groove and a size of chipping.

  According to the wafer processing result management method of the present invention, the cutting groove data generated for each kerf check for imaging by positioning the formed cutting groove on the imaging means is stored in association with the position information together with the image information. Since it is stored in a cumulative manner, it is easy to manage the processing quality during mass production for continuous processing of multiple wafers, and image information is also stored for each kerf check, and the shape of the wafer A schematic diagram of the line to be divided is displayed as a wafer map, and a mark indicating the position information of the kerf check is also displayed on the wafer map, and the groove groove data can be specified by designating a desired kerf check point using the mark. At the same time, since the image information is reproduced on the display panel, the surface quality over time can be visually checked during processing or after processing. It can be confirmed, an effect that utilization also allows such to be reflected in subsequent processing.

  Further, according to the wafer processing result management method of the present invention, for example, when processing a plurality of wafers continuously in units of cassettes, the wafer map and image information for each wafer together with ID information for specifying the wafer. Is stored in the storage means, and the wafer information of the corresponding wafer is output from the storage means to the display panel on the basis of the designated ID information. If the wafer ID information is designated at the desired time for the wafer, the kerf check result including the image information can be reproduced on the display panel.

  Hereinafter, a wafer processing result management method which is the best mode for carrying out the present invention will be described with reference to the drawings.

  FIG. 1 is a schematic perspective view showing a configuration example of a processing apparatus for performing a wafer processing result management method according to an embodiment of the present invention, and FIG. 2 is a configuration example of a wafer applied to the present embodiment. FIG. 3 is a schematic front view showing a configuration example of processing means and the like. The processing apparatus 10 according to the present embodiment is applied to a dual-cut type cutting apparatus that cuts a wafer W along a planned division line. As a basic configuration, a chuck table 11 that holds the wafer W, an image pickup device, and the like. Means 12, display panel 13, processing means 14, processing feed means 15 (see FIG. 4), index feed means 16 (see FIG. 3), carry-in / out means 17, transport means 18, cleaning means 19, and transport means 20 are provided. .

  First, as shown in FIG. 2, the wafer W is attached to the surface of the adhesive tape T attached to the annular frame F and is supported by the annular frame F via the adhesive tape T. 21. Here, one cassette 21 can accommodate, for example, 25 wafers W, and by setting the two cassettes 21 in two stages, a maximum of 50 wafers W can be set. As shown in FIG. 2, the wafer W is divided into a plurality of regions by a plurality of division lines S formed in a lattice pattern on the surface Wa, and a semiconductor chip 22 such as an IC or LSI is formed in the divided regions. Has been. The wafer W configured as described above is attached to the adhesive tape T mounted on the annular frame F with the front surface Wa facing up.

  The carry-in / out means 17 carries out the wafer W stored in the cassette 21 to a placement area that can be carried by the carrying means 18 and carries the wafer W after the cutting process into the cassette 21. The transport means 18 transports the wafer W carried out to the placement area by the carry-in / out means 17 onto the chuck table 11. The cleaning means 19 cleans the wafer W that has been processed by the processing means 14. The transport unit 20 transports the wafer W processed by the processing unit 14 from the chuck table 11 to the cleaning unit 19.

  The chuck table 11 is connected to a drive source (not shown) and is rotatable. Further, the chuck table 11 is provided so as to be movable in the X-axis direction by a processing feed means 15 having a known configuration such as a ball screw, a nut, a pulse motor, etc., and the mounted wafer W is moved relative to the processing means 14 in the X-axis direction. Process feed in the direction.

  The imaging means 12 is an electron microscope equipped with a CCD camera or the like that images the surface Wa of the wafer W held on the chuck table 11, and is shared for alignment and kerf check. Here, in the case of alignment, an area portion to be cut is detected based on the image information acquired by the imaging unit 12 and used for positioning of the processing operation by the processing unit 14. In the case of kerf check, the cut groove is positioned at the image pickup position of the image pickup means 12 to pick up the image of the cut groove and generate image information, and to generate cut groove data by image processing. Provide.

  As shown in FIG. 3, the processing means 14 is a dual that cuts the wafer W held by the chuck table 11 along the planned division line S simultaneously or independently by the ring-shaped ultrathin cutting blades 22 a and 22 b. It has a cut configuration and includes a pair of spindles 23a and 23b with cutting blades 22a and 22b attached to the tips. The pair of spindles 23a and 23b are arranged on substantially the same straight line so that the cutting blades 22a and 22b face each other in parallel, and are independently Z-axis by cutting feed means 24a and 24b using ball screws, nuts, pulse motors, or the like. It is provided to be movable in the direction. The index feeding means 16 for indexing and feeding the processing means 14 relative to the chuck table 11 in the Y-axis direction includes a ball screw, a nut, a pulse motor, etc., and individually indexes the cutting blades 22a and 22b in the Y-axis direction. It consists of individual indexing and feeding mechanisms 16a and 16b for feeding and an entire indexing and feeding mechanism 16c for indexing and feeding the entire processing means 14 in the Y-axis direction.

  The display panel 13 is disposed in a place that is easy to see and operate on the processing apparatus 10, displays various information necessary for the processing process in addition to the image captured by the imaging unit 12, and is necessary for the processing process and the like. The touch panel has a key display for performing various input operations and also serves as an operation panel.

  The processing apparatus 10 having such a configuration allows the chuck table 11 to be moved to the processing means 14 by the processing feed means 15 while the cutting blades 22a and 22b rotated at high speed are cut into the wafer W at a predetermined cutting depth. By cutting and feeding relatively in the axial direction, the two division lines S on the wafer W can be cut simultaneously to form a cutting groove (kerf). Therefore, for example, the cutting blades 22a and 22b are sequentially moved from the outer peripheral side to the inner peripheral side of the wafer W (or conversely from the inner peripheral side to the outer peripheral side) at intervals of the scheduled dividing lines S by the index feeding means 16 By relatively indexing and feeding in the axial direction, it is possible to form cutting grooves for all the division lines S (channel 1) in the same direction. Thereafter, the wafer W is rotated by 90 ° by the rotation of the chuck table 11, and the same cutting process is repeated by the processing means 14 for all the division planned lines S (channel 2) newly arranged in the X-axis direction. It can be divided into individual semiconductor chips 22.

  Next, the configuration of the control system built in the processing apparatus 10 of the present embodiment will be described. FIG. 4 is a schematic block diagram illustrating a configuration example of the control unit 30 built in the processing apparatus 10 according to the present embodiment. The control unit 30 includes, for example, an arithmetic processing unit configured by a CPU or the like, a ROM, a RAM, and the like, and is configured mainly by a microprocessor 31 and a storage unit 32 that control the entire processing apparatus 10. The processing means 14, the processing feed means 15, the index feed means 16 and the cutting feed means 24 a and 24 b are connected to the microprocessor 31, and operations such as processing operations are controlled by the microprocessor 31. Further, the microprocessor 31 reads necessary display information for the display panel 13 from the storage means 32 and the panel display pattern storage unit 33 and controls the display contents via the display control unit 34, and on the display panel 13. The input information that has been instructed is analyzed and used for operation control and display control of each unit.

  Further, the microprocessor 31 controls the image pickup unit 12 in an image pickup operation at the time of alignment or kerf check, and controls processing of image information picked up by the image pickup unit 12. As the processing control of this image information, the control is performed by storing the image information captured by the imaging unit 12 in the storage unit 32 as it is, or the image processing unit 35 performs image processing on the image information to generate cutting groove data and the like. Control for storing the cutting groove data and the like in the storage means 32 is performed. Here, as the cutting groove data generated along with the image processing of the image processing unit 35, in the present embodiment, a hairline that represents the amount of deviation between the hairline indicating the center position of the imaging means 12 and the formed cutting groove center. The deviation amount [mm], the width of the formed cutting groove [mm], the maximum chipping value [mm] indicating the size of chipping, and the region [pix] are included. The external connection port 36 is provided with a portable storage medium 37 that can download data stored in the storage means 32. In the present embodiment, for example, a USB memory is used as the storage medium 37.

  The storage means 32 includes a data memory unit 32a, an image memory unit 32b, and a wafer map memory unit 32c. The image memory unit 32b is for storing image information with a large amount of information. In the present embodiment, the image memory unit 32b sequentially stores the image information captured by the imaging unit 12 for each kerf check. The wafer map memory unit 32c and the contour shape (circular shape) and division of each wafer W generated in advance to confirm the cutting progress by the cutting blades 22a (Z1 axis) and 22b (Z2 axis) on the workpiece image. A schematic diagram of the planned line S is stored for each channel of each wafer W as wafer map data.

  The data memory unit 32a is for storing numerical data, which is cutting groove data mainly accompanying kerf check. In the present embodiment, the above-mentioned hairline shift amount [mm] is used as the cutting groove data calculated from the measurement result obtained by performing image processing on the image information captured by the imaging unit 12 for each kerf check by the image processing unit 35. The cutting groove width [mm], the maximum chipping value [mm], and the area [pix] are stored in the data memory unit 32a.

  Here, in the present embodiment, since it corresponds to a maximum of 50 wafers for two cassettes, the data memory unit 32a includes a cassette column a, a wafer ID column b, a channel column c, as shown in FIG. A kerf check coordinate (X, Y) column d, a hairline misalignment column e, a cutting groove width column f, a chipping maximum value column g, a chipping area column h, a kerf check image pointer column i, and a wafer map pointer column j are set. The data corresponding to each column is stored for each kerf check. That is, position information indicated by XY coordinates (X and Y coordinates are relative coordinates with the center of the chuck table 11 being 0) subjected to kerf check is stored in the kerf check coordinate (X, Y) column d, Each cutting data is stored in the corresponding fields e, f, g, h in relation to the position information, and an image as shown in FIG. 6 is displayed in the kerf check image pointer field i in order to specify the corresponding image information. A pointer indicating the storage location of the image information stored on the memory unit 32b is stored, and in addition, a wafer map pointer field j is stored in the wafer map memory unit 32c as shown in FIG. 7 in order to specify the corresponding wafer map. A pointer indicating the storage location of the wafer map data stored in is stored.

  Further, in order to support cutting groove data for a maximum of 50 wafers, wafer ID information which is ID information for specifying each wafer, data on cassette differences, and data on channel differences are also provided in corresponding columns a and b. , C are set to be stored. Here, as the wafer ID information, for example, wafer numbers housed in two cassettes 21 and numbered in order from the top to the bottom (or in reverse order) are used. The cassette 21 has an upper level of 1 and a lower level of 2 (or vice versa).

  Next, a wafer processing result management method that accompanies the cutting operation along the scheduled division line of the wafer W executed by the microprocessor 31 will be described with reference to FIGS. FIG. 8 is a schematic flowchart showing a wafer processing result management method associated with a cutting operation, and FIG. 9 is a schematic flowchart showing an example of kerf information display interrupt processing that can interrupt the processing of FIG. 10 is a schematic front view showing a display example of the display panel 13 during processing, FIG. 11 is a schematic front view showing a display example of the display panel 13 during kerf check data display, and FIG. It is a schematic front view which shows the example of a display of the display panel 13 for check result selection.

  First, prior to processing, device data is created for each wafer W, and it is determined whether or not the condition setting for creating device data has been completed (step S101). At this time, the data to be input includes setting of kerf check data in addition to the processing conditions for the wafer W and data for auto alignment. The setting of the kerf check data includes settings such as how many lines of the scheduled division line S are to be checked, how many times the kerf check is to be performed for each channel 1/2. In the present embodiment, for example, it is assumed that the kerf check is periodically performed at two locations on the third line from the outer peripheral side of the wafer W for each channel 1/2 and for each wafer W. .

  If the condition setting has been completed (step S101, Yes), it is determined whether or not the full auto button displayed on the initial screen of the display panel 13 has been pressed (step S102). If so (step S102, Yes), the process shifts to a fully automatic operation in which cutting is automatically performed along the division line S.

  First, the wafer W to be cut is carried from the cassette 21 onto the chuck table 11 (step S103). Then, the loaded wafer W is imaged by being positioned on the imaging unit 12, the division planned line S to be cut is detected based on the image information acquired by the imaging unit 12, and the automatic alignment (processing) for operating the indexing feeding unit 16 is performed. A position recognition process is executed (step S104). This process is performed for channels 1 and 2. Next, the cutting feed means 24a and 24b and the machining feed means 15 are operated to execute a cutting process for generating a cutting groove with the cutting blades 22a and 22b on the target division line S (step S105; cutting step).

  During such processing, the wafer map-line mode is set, and the wafer map is displayed on the display panel 13 (step S106). Referring to FIG. 10 showing a display example during processing, a kerf image button 41a, a checkpoint button 41b, a wafer map button 41c, and an XIS (Extended) are arranged and displayed in the periphery of the main area 41 of the display panel 13. Interface system) button 41d, work mode button 41e, line mode button 41f, up scroll button 41g, down scroll button 41h, cut pause button 41i, calf check data display button 41j, etc., check point button 41b, wafer A wafer map-line mode is displayed in which a map button 41c, a line mode button 41f, and a kerf check data display button 41j are displayed. In the center of the main area 41, a wafer map-line mode wafer map 4 is displayed. 2 is displayed. The wafer map 42 shows a schematic diagram of the shape (circular shape) of the wafer W and the lines (several horizontal lines) to be divided, and the cutting progress of the cutting blades 22a and 22b on the wafer image is visually observed. It is shown as possible. In the illustrated example, a region 42a indicated by hatching on the wafer map 42 indicates a region where cutting of the planned division line S by the cutting blade 22a (Z1 axis) has been completed, and a region 42b indicated by different hatching indicates the cutting blade 22b ( The cutting-completed area of the division line S by the Z2 axis is shown (in practice, for example, the area 42a is shown in blue, the area 42b is shown in green, and the division-scheduled line S that has not been cut is (Shown in gray).

  In FIG. 10, the kerf image button 41 a is a button for selecting whether or not to display the captured image of the imaging unit 12 in the background of the main area 41 while the cutting operation is stopped. The check point button 41b is a button for selecting an event to be displayed on the line of the wafer map 42 displayed in the main area 41. In the present embodiment, the line on which the kerf check is executed (division planned line) It is assumed that, for example, a star is displayed as a mark indicating the position information on the top. The wafer map button 41c is a button for switching to a mode for displaying a wafer map, and the XIS button 41d is a button for switching to an XIS mode display for performing light amount adjustment, focus adjustment, etc. with respect to the imaging means 12 while the cutting operation is stopped. . The work mode button 41e is a mode setting button for searching for a target at the time of teaching for auto alignment in the wafer map mode, and the line mode button 41f is a wafer map 42 as shown in FIG. This is a mode setting button to be displayed. The up scroll button 41g is a button for moving the selected line on the wafer map 42 up by one line when the cutting operation is stopped, and the down scroll button 41h is used to move the selected line on the wafer map 42 when the cutting operation is stopped. This is a button for moving down one line. The kerf check data display button 41j is a button for displaying detailed information regarding the line selected on the wafer map.

  In FIG. 10, the lower area of the display panel 13 is a software keyboard area 44 including function keys F1 to F10 whose key functions are switched by software according to the operation of four function switching buttons 43, for example.

  After that, if the predetermined division line S is a kerf check line that has been set in advance after cutting (step S107, Yes), the position of the chuck table 11 is moved to move the predetermined division line. The cutting groove formed in S is positioned on the image pickup means 12, and the image pickup means 12 picks up an image of the cutting groove and performs a kerf check process (step S108). That is, image information is generated by picking up an image of the cutting groove with the image pickup means 12, and further processing the image information with the image processing unit 35 to obtain cutting groove data (hairline shift amount, cutting groove width, maximum chipping value and chipping area). ) And position information indicating, in XY coordinates, the positional relationship between the imaging unit 12 that performed the kerf check and the wafer W. The image information of the kerf check position generated in this way, the cutting groove data, and the like are displayed on the main area 41 of the display panel 13 (step S109). The display in this case is the same as in the case of FIG.

  Further, the current image information and cutting groove data subjected to the kerf check are stored in the storage means 32 in association with the position information indicated by the XY coordinates (step S110; storage step). At this time, the type, wafer ID, and channel information of the supplied cassette 21 are acquired as information about the wafer W during the cutting of the cutting groove, and the current image is associated with the wafer ID as shown in FIG. Information, cutting groove data, and wafer map information are stored in the storage means 32. In storing such information, image information and wafer map information having a large amount of information are stored in an image memory unit 32b and a wafer map memory unit 32c as shown in FIGS. 6 and 7, respectively, on the data memory unit 32a. In this case, pointer information indicating the storage position on the image memory unit 32b or the wafer map memory unit 32c is stored to be associated with the position information.

  Further, a star-shaped kerf check mark 45 is displayed as an icon at the kerf check position on the division line (cutting groove) where the kerf check of the wafer map 42 displayed on the display panel 13 is performed (step S111; display step). .

  After this, or when it is not a kerf check line (step S107, No), it is determined whether or not the formation of the cutting groove for all the division planned lines S for channel 1 has been completed (step S112), and the process ends. If not (No at Step S112), the process returns to the cutting process for the subsequent division line S (Step S105).

  When the processing for the channel 1 is completed (step S112, Yes), it is determined whether or not the processing for the channel 2 is completed (step S113). If the processing is not completed (step S113, No), It is determined whether the wafer W has been rotated by 90 ° (step S114). If it has not been rotated by 90 ° (step S114, No), the corresponding wafer map information for channel 1 is updated and recorded in the wafer map memory unit 32c (step S115), and the chuck table 11 is rotated by 90 ° and the wafer is rotated. W is rotated by 90 ° (step S116). In step S115, the wafer map memory 32c is updated and stored as data of the wafer map 42 in which all lines have been cut and the mark 45 is added to the kerf check location. When the wafer W has been rotated by 90 ° or after being rotated by 90 ° (step S114, Yes, step S116), the process returns to the cutting process for the channel 2 (step S105).

  When the process for the channel 2 is completed (step S113, Yes), the corresponding wafer map information for the channel 2 is updated and recorded in the wafer map memory unit 32c (step S117). That is, it is updated and stored in the wafer map memory unit 32c as data of the wafer map 42 in which all the lines have been cut and the mark 45 is added to the kerf check location.

  Thereafter, the wafer W that has been subjected to the cutting process is unloaded from the chuck table 11 and loaded into the cassette 21 through a cleaning process or the like (step S118). Next, it is determined whether or not an unprocessed wafer W remains in the cassette 21 (step S119). If it remains (step S119, Yes), the processes of steps S103 to S118 are repeated in the same manner. . Then, when all the wafers W in the cassette 21 have been cut and no unprocessed wafers W remain in the cassette 21 (step S119, No), a series of full-auto processes are terminated.

  Note that during these series of processes, when the operator instructs data saving to the external storage medium 37 at a desired timing, the storage data stored in the storage means 32 is saved to the external storage medium 37.

  When such processing is completed, the data memory unit 32a, the image memory unit 32b, and the wafer map memory unit 32c store wafer information as kerf check results for all kerf check locations, as shown in FIGS. Stored state. If processing is in progress, the wafer information that is the result of kerf check for all kerf check points up to that stage is stored.

  Next, an example of kerf information display interrupt processing that can be interrupted at any time during or after the processing as shown in FIG. 8 will be described with reference to FIG. For example, when the finger 46 touches the main area 41 outside the wafer map 42 while the wafer map 42 is displayed as shown in FIG. 10, the line on the extension line in the X direction at the position touched by the finger 46 is selected. That's right. In this way, the planned division line S (cutting groove) can be selected, and when the planned division line S (cutting groove) with the mark 45 displayed as an icon is selected, the selection of the kerf check line is instructed. Become. The line selection may be an operation of the up scroll button 41g or the down scroll button 41h. The selected line is clearly displayed in red, for example.

  Therefore, it is monitored whether or not a selection instruction for the kerf check line has been given (step S201), and if there is a selection instruction for the division planned line S (cutting groove) with the mark 45 displayed as an icon (step S201, Yes). , The data in the storage means 42 is searched based on the position information (X, Y) of the kerf check position where the mark 45 is displayed as an icon, and the corresponding image information is read from the image memory unit 32b and stored on the main area 41. Reproduction display is performed (step S202; reproduction step). Further, it is determined whether or not the kerf check data display button 41j for detailed display has been pressed (step S203), and if pressed (step S203, Yes), it corresponds to the kerf check position information instructed to be selected. The cutting groove data is read from the data memory unit 32a in the storage means 32 and reproduced and displayed on the main area 41 (step S204; reproduction step).

  Referring to FIG. 11 showing a display example of the display panel 13 during kerf check data display, image information 51 of the kerf check result imaged by the imaging unit 12 is displayed in the main area 41. In the image information 51, 51a indicates a semiconductor chip portion, 51b indicates a cutting groove generated by cutting a division-scheduled line, 51c indicates a hairline indicating the center position of the imaging means 12, and 51d indicates The center of the cutting groove is shown. The cutting groove data is displayed using a part of the image information 51 that avoids the cutting groove portion. On the right side of the image information 51, for example, what line the cut is, the cut start position on the X axis, the cut end position on the X axis, the Y coordinate at the time of cutting, the blade height, the feed speed, etc. The result display field 52 displays the result. In the upper part of the result display column 52, a Z1 axis / Z2 axis display indicating whether the currently displayed information is a result of the cutting blade 22a (Z1 axis) or a result of the cutting blade 22b (Z2 axis). This is a column 53.

  When the kerf check data display button 41j is pressed again (step S205, Yes), the original wafer map display state as shown in FIG. 10 is restored (step S206).

  On the other hand, for example, whether or not the kerf check result button assigned to the function key F1 in the function keys F1 to F10 in the software keyboard area 44 is pressed while the wafer map 42 as shown in FIG. 10 is displayed. (Step S207), and when the kerf check result button is pressed (step S207, Yes), a kerf check result selection screen as shown in FIG. 12 is displayed on the display panel 13 (step S208). That is, the cassette selection operation column 61a, wafer ID selection operation column 61b, and channel selection operation column 61c are displayed in order to select the cassette 21, wafer W, or channel for which the kerf check result is desired to be displayed. 61d is a display button for instructing display processing, and 61e is an exit button for returning to the normal display as shown in FIG.

  Then, in the operations related to the cassette selection operation field 61a, wafer ID selection operation field 61b, and channel selection operation field 61c, there is an instruction to select a desired cassette 21, wafer ID, and channel (step S209, Yes), and the display button 61d is pressed. When it is done (step S210, Yes), the wafer map information of the wafer W corresponding to the selected cassette 21, wafer ID, and channel is read from the storage means 32 and the wafer map 42 is displayed in the main area 41 (step S211). ). A wafer map 42 shown in FIG. 12 shows a display example corresponding to the wafer W that has already been processed as a whole, and is divided into two regions 42a and 42b. A mark 45 indicating the kerf check position is also reproduced and displayed.

  Therefore, if the exit button 61e is not pressed (No in step S212), the process returns to the determination process in step S201, and the instruction for selecting the kerf check line for the wafer map 42 displayed in the main area 41 indicates the position of the mark 45 as a guide. It becomes possible. That is, the processing in steps S201 to S204 as described above can be performed. As a result, the kerf check result relating to the already processed wafer W carried into the cassette 21 can be reproduced, including the image, when desired.

  As described above, according to the present embodiment, the cutting groove data generated for each kerf check for imaging by positioning the formed cutting groove on the imaging means 12 is stored in association with the position information together with the image information. Therefore, it is easy to manage the processing quality at the time of mass production in which a plurality of wafers W are continuously processed. In addition, image information is also stored for each kerf check, and a schematic diagram of the wafer shape and the line to be divided is displayed as a wafer map 42, and a mark 45 indicating position information of the kerf check is also displayed on the wafer map 42. Since the image information is reproduced on the display panel 13 together with the cutting groove data by designating a desired kerf check location that is easy to understand using the mark 45, the temporal change of the surface quality can be visually confirmed during processing or after processing. It is possible to use such as reflecting in later processing. In particular, when continuously processing a plurality of wafers W in units of cassettes 21, the wafer information of the wafer map, image information, and cutting groove data is stored for each wafer W together with ID information for specifying the wafer W. 32, the wafer information of the corresponding wafer W is output from the storage means 32 to the display panel 13 based on the designated ID information, so that the processed wafer in the same cassette 21 can be processed at a desired time. If the ID information is designated, the kerf check result including the image information can be reproduced on the display panel 13.

  In addition, according to the present embodiment, various information related to the kerf check including the image information stored in the storage unit 32 is also stored in the storage medium 37 such as a USB memory. A kerf check result including image information can be reproduced at an arbitrary time on a personal computer or the like.

  In this embodiment, as an example of application to a dual-cut type processing apparatus, a step-cut type processing apparatus that cuts the same division line in two stages using two cutting blades, Even in the case of a single-cut type processing apparatus using a single cutting blade, the same applies.

  Further, the present invention is not limited to the case where the kerf check process is periodically performed, but can be similarly applied to a case where the kerf check process is performed randomly. Further, the timing and number of kerf check processes may be changed for each channel or wafer. Furthermore, the cassette 21 is not limited to a two-stage stack, and only one cassette 21 may be used. Further, the storage medium 37 is not limited to the USB memory, and various other storage media such as a CD-R, a DVD-R, etc. may be used, and a corresponding drive device may be used. Furthermore, the storage medium 37 may store and manage the data stored in the storage means 32 by transferring it to an external personal computer or the like via a wired / wireless LAN.

It is a schematic perspective view which shows the structural example of the processing apparatus which enforces the processing result management method of the wafer of embodiment of this invention. It is a top view which shows the structural example of the wafer applied to this Embodiment. It is a schematic front view which shows the structural examples, such as a process means. It is a schematic block diagram which shows the structural example of the control part which the processing apparatus of this Embodiment incorporates. It is explanatory drawing which shows the example of data storage of a data memory part typically. It is explanatory drawing which shows typically the example of data storage of an image memory part. It is explanatory drawing which shows typically the example of data storage of a wafer map memory part. It is a schematic flowchart which shows the processing result management method of the wafer accompanying cutting operation. It is a schematic flowchart which shows the example of a kerf information display interruption process which can be interrupted with respect to the process of FIG. It is a schematic front view which shows the example of a display of the display panel during a process. It is a schematic front view which shows the example of a display of the display panel during kerf check data display. It is a schematic front view which shows the example of a display of the display panel for a kerf check result selection.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Processing apparatus 11 Chuck table 12 Imaging means 13 Display panel 14 Processing means 15 Processing feed means 16 Index feed means 32 Storage means 37 Storage medium 42 Wafer map 45 Mark S105 Cutting step S110 Storage step S111 Display step S202, S204 Reproduction step S Division Planned line W wafer

Claims (5)

A chuck table for holding a wafer, an imaging means for imaging a wafer held on the chuck table, a display panel for displaying an image taken by the imaging means, and a processing means for processing the wafer held on the chuck table Machining feed means for machining and feeding the machining means and the chuck table relatively in the X-axis direction; index feeding means for indexing and feeding the machining means and the chuck table in the Y-axis direction; A wafer processing result management method in a processing apparatus comprising:
A cutting step in which the machining feed means and the index feed means are operated to form a cutting groove in a division schedule line of the wafer by the machining means;
The cutting grooves cut in the cutting step are periodically or randomly positioned on the image pickup means, the cutting grooves are picked up to generate image information and cutting groove data, and the positions of the image pickup means and the wafer. A storage step of storing the image information and the cutting groove data in a storage means in relation to the position information indicated by XY coordinates;
A display step for displaying on the display panel a schematic diagram of the shape of the wafer and a line to be divided as a wafer map and displaying a mark indicating the position information stored in the storage step;
A reproduction step of reproducing the corresponding image information and the cutting groove data on the display panel by designating the mark displayed in the display step;
A wafer processing result management method characterized by comprising:   Wafer information of the wafer map, the image information, and the cutting groove data is stored in the storage means for each wafer together with ID information for specifying a wafer, and the wafer of the corresponding wafer based on the specified ID information is stored. 2. The wafer processing result management method according to claim 1, wherein information is output from the storage means to the display panel.   3. The wafer processing result management method according to claim 1, wherein the information stored in the storage step and the display step is stored in a portable storage medium.   The wafer cutting result management method according to any one of claims 1 to 3, wherein the cutting groove data is a deviation amount between a hairline indicating a center position of the imaging means and a cutting groove center.   5. The wafer processing result management method according to claim 4, wherein the cutting groove data includes one of a width of a cutting groove and a size of chipping.

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