JP2007531991A - Heat exchanger - Google Patents

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JP2007531991A
JP2007531991A JP2007505339A JP2007505339A JP2007531991A JP 2007531991 A JP2007531991 A JP 2007531991A JP 2007505339 A JP2007505339 A JP 2007505339A JP 2007505339 A JP2007505339 A JP 2007505339A JP 2007531991 A JP2007531991 A JP 2007531991A
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heat exchanger
cover
exchanger according
conductive
fin
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クラーク，ピーター，テレンス
デイヴィス，モンタグ，クリスチャン
ウェイマウス，ロバート，ミシェル
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ハイドロクール ピーティーワイ リミテッド
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029—Heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

コンピュータ中央処理装置の冷却に適する熱交換器であって、該熱交換器には、伝導性底部（１１）、冷却液を流してもよい複数の流路を画定する該底部（１１）上の熱交換器フィン（１３）列、底部（１１）から遠い側のフィン（１３）表面上に配置する密閉用シート又はパッド（１４）、底部と密封係合させ、熱交換流路を囲む非伝導性カバー（１５）であって、該カバーには流路に通じる流入口及び熱交換流路から通じる少なくとも１つの流出口を有する非伝導性カバーを備えている。
【選択図】図１A heat exchanger suitable for cooling a computer central processing unit, wherein the heat exchanger has a conductive bottom (11) on the bottom (11) defining a plurality of channels through which cooling liquid may flow. A row of heat exchanger fins (13), a sealing sheet or pad (14) placed on the surface of the fin (13) far from the bottom (11), non-conductive surrounding the heat exchange flow path, sealingly engaged with the bottom A conductive cover (15) comprising a non-conductive cover having an inlet leading to the flow path and at least one outlet leading from the heat exchange flow path.
[Selection] Figure 1

Description

本発明は、熱交換器に関し、特にはコンピュータ中央処理装置及び／又は熱電モジュールと関連させて使用するのに適する熱交換器に関する。   The present invention relates to heat exchangers, and more particularly to heat exchangers suitable for use in connection with computer central processing units and / or thermoelectric modules.

先行技術のマルチチャネル熱交換器については、オーストラリア国特許明細書第７７９，５１９号において記載されている。便宜上、本発明については、熱交換器をコンピュータ中央処理装置と関連させて使用することに関して記述する。   Prior art multi-channel heat exchangers are described in Australian Patent Specification No. 779,519. For convenience, the present invention will be described with respect to the use of a heat exchanger in connection with a computer central processing unit.

コンピュータ中央処理装置の性能は、熱の除去によって向上可能である。従ってコンピュータ中央処理装置と関連させて使用するよう構成する熱交換器に対するニーズが存在する。   The performance of the computer central processing unit can be improved by removing heat. Accordingly, there is a need for a heat exchanger that is configured for use in connection with a computer central processing unit.

本発明の１態様によれば、
（ｉ）伝導性底部、
（ｉｉ）冷却液を流してもよい複数の流路を画定する該底部上の熱交換器フィン列、
（ｉｉｉ）該底部から遠い側のフィン表面上に配置する密閉用シート又はパッド、
（ｉｖ）該底部と密封係合させ、熱交換流路を囲む非伝導性カバーであって、該カバーには流路に通じる流入口及び熱交換流路から通じる少なくとも１つの流出口を有する非伝導性カバー、
を備える熱交換器を提供する。 According to one aspect of the invention,
(I) a conductive bottom,
(Ii) a heat exchanger fin row on the bottom defining a plurality of channels through which coolant may flow;
(Iii) a sealing sheet or pad disposed on the fin surface far from the bottom,
(Iv) a non-conductive cover that is hermetically engaged with the bottom and encloses the heat exchange channel, the cover having an inlet leading to the channel and at least one outlet leading from the heat exchange channel Conductive cover,
A heat exchanger is provided.

本発明の別の態様によれば、
（ｉ）伝導性底部、
（ｉｉ）冷却液を流してもよい複数の流路を画定する該底部上の熱交換器フィン列、
（ｉｉｉ）該底部と密封係合させ、熱交換流路を囲む非伝導性カバーであって、該カバーには流路に通じる流入口及び熱交換流路から通じる少なくとも１つの流出口を有する非伝導性カバー、
を備える熱交換器を提供する。 According to another aspect of the invention,
(I) a conductive bottom,
(Ii) a heat exchanger fin row on the bottom defining a plurality of channels through which coolant may flow;
(Iii) a non-conductive cover that is hermetically engaged with the bottom and encloses the heat exchange channel, the cover having an inlet leading to the channel and at least one outlet leading from the heat exchange channel Conductive cover,
A heat exchanger is provided.

本発明の１形態では、伝導性カバーに中央流入口を設け、該流入口は最低温の液体を直接、ＣＰＵダイからの熱源に隣接する金属製のフィンへと導く。中央流入口は、熱交換器をＣＰＵに使用する場合、最も好適であろう。熱電モジュールを熱交換器と共に使用する場合、好適な形態としては、熱交換器のどちらかの端部に流入口及び流出口を有するものになるだろう。   In one form of the invention, the conductive cover is provided with a central inlet that directs the coolest liquid directly to the metal fin adjacent to the heat source from the CPU die. A central inlet would be most suitable when a heat exchanger is used for the CPU. When a thermoelectric module is used with a heat exchanger, a preferred form would have an inlet and outlet at either end of the heat exchanger.

図１〜図７に示す熱交換器１０は銅製の底部又はトレイ１１から成るが、該底部又はトレイはプラスチック製下部フランジ１２に取付けられ、熱交換器流路を画定する銅製フィン１３列を支持する。シート又はパッド１４形状のゴム製シール部材をフィン１３上に配置し、プラスチック製カバー１５を底部フランジ１２と、Ｏリング１６をその間に挟み、密封係合させる。   The heat exchanger 10 shown in FIGS. 1-7 comprises a copper bottom or tray 11, which is attached to a plastic lower flange 12 and supports a row of copper fins 13 defining a heat exchanger flow path. To do. A rubber seal member in the form of a sheet or pad 14 is placed on the fin 13, and the plastic cover 15 is sandwiched between the bottom flange 12 and the O-ring 16 and is sealingly engaged.

フィン１３は１枚の連続した銅製のシートから、該シートを蛇腹状に折畳んで作製する。流路の上面及び下面を、フィンを相互に圧迫させることにより密閉する。フィン１３を銅製底部と半田付けし、ゴム製パッド１４で上部を密閉して、フィン上部とプラスチック製カバーとの間で液体がバイパスするのを防ぐ。   The fin 13 is produced from one continuous copper sheet by folding the sheet into a bellows shape. The upper and lower surfaces of the channel are sealed by pressing the fins against each other. The fin 13 is soldered to the copper bottom and the top is sealed with a rubber pad 14 to prevent liquid from bypassing between the top of the fin and the plastic cover.

フィン１３列によって画定する熱交換器流路は、熱交換器１０の流入口側２０から流出口側２１まで延在する。カバー１５には、流入口側２０に通じる流入口２２及び流出口側２１から通じる流出口２３を有する。   The heat exchanger flow path defined by the rows of fins 13 extends from the inlet side 20 of the heat exchanger 10 to the outlet side 21. The cover 15 has an inlet 22 that leads to the inlet side 20 and an outlet 23 that leads from the outlet side 21.

図５及び図７に示すように、カバー又はマニホルド上部１５には、外周フランジ２４を有し、該フランジは内向きフランジ２５で終端して、外周フランジ２４と内向きフランジ２５との間に流路２６を画定し、該流路２６内にはＯリング１６を収容する。フランジ２４には、段付凹部２７をその内面２８に有し、該凹部２７で同様な形状の下部フランジ１２のリップ部２９を受容する。本発明の１実施例では、熱交換器１０をコンピュータ中央処理装置上に直接置き、その後適所にクランプ固定する。水を、熱交換器を通してポンプで送り、熱をコンピュータ中央処理装置から除去し、離れたラジエータに管で送り、そこで熱を大気中に放散する。   As shown in FIGS. 5 and 7, the cover or manifold top 15 has an outer peripheral flange 24 that terminates in an inward flange 25 and flows between the outer flange 24 and the inward flange 25. A channel 26 is defined, and the O-ring 16 is accommodated in the channel 26. The flange 24 has a stepped recess 27 on the inner surface 28, and the recess 27 receives the lip 29 of the lower flange 12 having the same shape. In one embodiment of the invention, the heat exchanger 10 is placed directly on the computer central processing unit and then clamped in place. Water is pumped through a heat exchanger, heat is removed from the computer central processor, and piped to a remote radiator where it is dissipated into the atmosphere.

本発明の別の実施例では、熱交換器１０を熱電モジュール４０上に装着するが、該モジュールはコンピュータ中央処理装置又は、他の熱源又はコールドシンクと接触するよう配置されている。熱電モジュールは、活発にコンピュータ中央処理装置から熱を除去し、その熱を熱電モジュールの高温側に装着した熱交換器中を流れる水に伝達する。前述のように、離れたラジエータに水を管で送り、該ラジエータにより熱を大気中に放散させる。   In another embodiment of the present invention, the heat exchanger 10 is mounted on a thermoelectric module 40, which is placed in contact with a computer central processing unit or other heat source or cold sink. The thermoelectric module actively removes heat from the computer central processing unit and transfers the heat to water flowing in a heat exchanger mounted on the high temperature side of the thermoelectric module. As described above, water is piped to a remote radiator, and heat is dissipated into the atmosphere by the radiator.

図８〜図１１に示す熱交換器の実施例では、銅製のカバー又はマニホルド上部３０を有し、中央流入口３１及び該流入口３１の両側に２本の流出口３２及び３３を有する。銅製カバー３０を使用することで、半田付けによる接合を図１の実施例のＯリング１６の代わりに使用できる。従って、底部３４をカバー３０に半田付けすると、図１の実施例のフランジ１２及びゴム製パッド１４及びＯリング１６が不要になる。   The heat exchanger embodiment shown in FIGS. 8-11 has a copper cover or manifold top 30 and has a central inlet 31 and two outlets 32 and 33 on either side of the inlet 31. By using the copper cover 30, the joining by soldering can be used in place of the O-ring 16 in the embodiment of FIG. Therefore, when the bottom 34 is soldered to the cover 30, the flange 12, the rubber pad 14, and the O-ring 16 in the embodiment of FIG.

図１１で示すように、銅製フィン１３には、Ｖ字型切欠部３５を該フィンに亘り有して、流体の流入を促進する。この噴流衝合機能によって、最低温の液体を直接、ＣＰＵダイからの熱源に隣接する金属製のフィンに導くが、その結果冷却性能を向上させる。   As shown in FIG. 11, the copper fin 13 has a V-shaped notch 35 extending over the fin to promote the inflow of fluid. This jet collision function directs the coolest liquid directly to the metal fin adjacent to the heat source from the CPU die, resulting in improved cooling performance.

図面に示した熱電熱交換器では、極めて僅かなポンピングパワーで、著しく低い熱抵抗を有する。僅か０．０１°Ｃ／Ｗの熱抵抗を、所要ポンピングパワー２．２ワットで、毎分２リットルの流量を４０ｍｍ×４０ｍｍ表面積上に流すことで、これを獲得している。   The thermoelectric heat exchanger shown in the drawing has a very low thermal resistance with very little pumping power. This is achieved by a thermal resistance of only 0.01 ° C / W with a required pumping power of 2.2 watts and a flow rate of 2 liters per minute over a 40 mm x 40 mm surface area.

最適化したマイクロ流路によって、こうした低い熱抵抗が獲得可能であり、その効果については、高いヒートポンプ性能の熱電モジュールに対する作用を検討することで、証明できよう。該モジュールが１００Ｗ容量で１．０の成績係数（ＣＯＰ）で冷却している場合、低温側を通過する熱は１００Ｗとなり、高温側を通過する熱は２００Ｗとなる。低温側及び高温側の熱交換器は熱流に対して熱抵抗を付加する、即ち、温度差がインターフェース全体に熱を行渡らせるのに必要となる。強制的に対流空気流を起こす典型的な熱電モジュール用熱交換器での熱抵抗は０．１°Ｃ／Ｗであり、それと比較して本発明の熱交換器での熱抵抗は０．０１°Ｃ／Ｗである。   Such a low thermal resistance can be obtained by the optimized micro-channel, and the effect can be proved by examining the effect on the thermoelectric module with high heat pump performance. When the module is cooled with a 100 W capacity and a coefficient of performance (COP) of 1.0, the heat passing through the low temperature side is 100 W and the heat passing through the high temperature side is 200 W. The cold side and hot side heat exchangers add a thermal resistance to the heat flow, i.e. a temperature difference is required to spread the heat across the interface. The thermal resistance of a typical thermoelectric module heat exchanger that forces a convection air flow is 0.1 ° C./W, compared with the thermal resistance of the heat exchanger of the present invention is 0.01. ° C / W.

下表では熱電モジュールが本発明の熱交換器で獲得可能なｄＴへの作用について、典型的な熱交換器と、低温側を１００Ｗとして、比較したものである。




Figure 2007531991
In the table below, the effect of the thermoelectric module on the dT that can be obtained by the heat exchanger of the present invention is compared with a typical heat exchanger and a low temperature side of 100 W.




Figure 2007531991

最良の熱電モジュールでは最大ｄＴが７５℃で、そのため熱交換器インターフェース全体で３０℃の損失が発生し、有効温度差が単に４５℃となってしまう。それと比較すると、本発明の熱交換器では３℃の温度差で、モジュールでは７２℃の有効温度差となる。   The best thermoelectric module has a maximum dT of 75 ° C., which results in a 30 ° C. loss across the heat exchanger interface and an effective temperature difference of simply 45 ° C. In comparison, the heat exchanger of the present invention has a temperature difference of 3 ° C. and the module has an effective temperature difference of 72 ° C.

本発明の別の実施例によれば、底部を純銀製とし、カバーをポリカーボネート製とする。本発明の具体的な１実施例の冷却性能は、以下の通りである：

Figure 2007531991
According to another embodiment of the invention, the bottom is made of pure silver and the cover is made of polycarbonate. The cooling performance of one specific embodiment of the present invention is as follows:

Figure 2007531991

図１２は、本発明による熱交換器に関する、流量（Ｌ／分）に対する、熱抵抗（°Ｃ／Ｗ）及び圧力降下（ｋＰａ）のグラフである。   FIG. 12 is a graph of thermal resistance (° C./W) and pressure drop (kPa) versus flow rate (L / min) for a heat exchanger according to the present invention.

様々な変形を、本発明の意図及び範囲から逸脱することなく、熱交換器の詳細及び設計及び構造において、実施してもよい。
Various modifications may be made in the details and design and construction of the heat exchangers without departing from the spirit and scope of the present invention.

本発明の１実施例による熱交換器について部分的に切除して示した斜視図である。It is the perspective view which partially cut and showed about the heat exchanger by one Example of this invention. 図１で示した熱交換器の分解立体図である。FIG. 3 is an exploded view of the heat exchanger shown in FIG. 1. 図１で示した熱交換器の平面図である。It is a top view of the heat exchanger shown in FIG. 図３のＡ−Ａ線に沿った熱交換器の断面図である。It is sectional drawing of the heat exchanger along the AA line of FIG. 図４の部分Ｃの拡大図である。It is an enlarged view of the part C of FIG. 図３のＤ−Ｄ線に沿った熱交換器の断面図である。It is sectional drawing of the heat exchanger along the DD line | wire of FIG. 図６の部分Ｆの拡大図である。It is an enlarged view of the part F of FIG. 本発明の別の実施例による熱交換器の斜視図である。It is a perspective view of the heat exchanger by another Example of this invention. 図８で示したカバーの平面図である。It is a top view of the cover shown in FIG. 図９のＡ−Ａ線に沿った図８で示したカバーの断面図である。It is sectional drawing of the cover shown in FIG. 8 along the AA line of FIG. Ｂ−Ｂ線に沿った図８で示したカバーの断面図である。It is sectional drawing of the cover shown in FIG. 8 along the BB line. 本発明の１実施例による熱交換器に関する、流量（Ｌ／分）に対する、熱抵抗（℃／Ｗ）及び圧力降下（ｋＰａ）のグラフである。2 is a graph of thermal resistance (° C./W) and pressure drop (kPa) versus flow rate (L / min) for a heat exchanger according to one embodiment of the present invention.

符号の説明Explanation of symbols

１０ 熱交換器
１１、３４ 底部
１２ 下部フランジ
１３ フィン
１４ シート又はパッド
１５、３０ カバー又はマニホルド上部
１６ Ｏリング
２０ 流入口側
２１ 流出口側
２２、３１ 流入口
２３、３２、３３ 流出口
２４ 外周フランジ
２５ 内向きフランジ
２６ 流路
２７ 凹部
３５ 切欠部 DESCRIPTION OF SYMBOLS 10 Heat exchanger 11, 34 Bottom part 12 Lower flange 13 Fin 14 Seat or pad 15, 30 Cover or manifold upper part 16 O-ring 20 Inlet side 21 Outlet side 22, 31 Inlet 23, 32, 33 Outlet 24 Outer flange 25 Inward flange 26 Flow path 27 Recess 35 Notch

Claims (19)

（ｉ）伝導性底部、
（ｉｉ）冷却液を流してもよい複数の流路を画定する前記底部上の熱交換器フィン列、
（ｉｉｉ）前記底部から遠い側のフィン表面上に配置する密閉用シート又はパッド、
（ｉｖ）前記底部と密封係合させ、熱交換流路を囲む非伝導性カバーであって、該カバーには流路に通じる流入口及び熱交換流路から通じる少なくとも１つの流出口を有する非伝導性カバー、
を備えることを特徴とする熱交換器。 (I) a conductive bottom,
(Ii) a row of heat exchanger fins on the bottom that defines a plurality of channels through which coolant may flow;
(Iii) a sealing sheet or pad disposed on the fin surface far from the bottom;
(Iv) a non-conductive cover that is hermetically engaged with the bottom and surrounds the heat exchange channel, the cover having an inlet leading to the channel and at least one outlet leading from the heat exchange channel. Conductive cover,
A heat exchanger comprising: 前記カバーと前記底部との間に「Ｏ」リングシールを更に含むことを特徴とする請求項１に記載の熱交換器。   The heat exchanger of claim 1, further comprising an “O” ring seal between the cover and the bottom. 前記底部を銅製とすること、を特徴とする請求項１に記載の熱交換器。   The heat exchanger according to claim 1, wherein the bottom is made of copper. 前記カバーをプラスチック材料製とすること、を特徴とする請求項１に記載の熱交換器。   The heat exchanger according to claim 1, wherein the cover is made of a plastic material. 前記フィンを１枚の連続した銅を蛇腹状に折畳んで形成すること、を特徴とする請求項１に記載の熱交換器。   The heat exchanger according to claim 1, wherein the fin is formed by folding one continuous copper into a bellows shape. 前記フィン列を圧縮し、それにより該フィン間に形成した隣接する流路の上下部を、フィンを相互に圧迫させることにより、密閉すること、を特徴とする請求項１に記載の熱交換器。   2. The heat exchanger according to claim 1, wherein the fin row is compressed and thereby the upper and lower portions of adjacent flow paths formed between the fins are sealed by pressing the fins against each other. . 前記フィン列の底面を底部に半田付けすること、を特徴とする請求項５に記載の熱交換器。   The heat exchanger according to claim 5, wherein a bottom surface of the fin row is soldered to a bottom portion. 前記カバーには外周フランジを有し、該フランジは内向きフランジで終端させて、流路を該フランジ間で画定し、前記流路で「Ｏ」リングを受容するよう構成すること、を特徴とする請求項１に記載の熱交換器。   The cover has an outer peripheral flange, the flange terminating in an inward flange, defining a flow path between the flanges, and configured to receive an “O” ring in the flow path. The heat exchanger according to claim 1. 前記底部には外向きのリップ部を有する外周フランジを有し、前記カバーの内向きフランジには、前記底部のリップ部と係合するよう構成する同様な形状のリップ部を有すること、を特徴とする請求項８に記載の熱交換器。   The bottom portion has an outer peripheral flange having an outward lip portion, and the inward flange of the cover has a similarly shaped lip portion configured to engage with the lip portion of the bottom portion. The heat exchanger according to claim 8. 熱電モジュールを前記底部の外側と熱伝達し合うよう関係させて更に備えること、を特徴とする請求項１に記載の熱交換器。   The heat exchanger according to claim 1, further comprising a thermoelectric module in thermal communication with the outside of the bottom portion. （ｉ）伝導性底部、
（ｉｉ）冷却液を流してもよい複数の流路を画定する前記底部上の熱交換器フィン列、
（ｉｉｉ）前記底部と密封係合させ、熱交換流路を囲む非伝導性カバーであって、該カバーには流路に通じる流入口及び熱交換流路から通じる少なくとも１つの流出口を有する非伝導性カバー、
を備えることを特徴とする熱交換器。 (I) a conductive bottom,
(Ii) a row of heat exchanger fins on the bottom that defines a plurality of channels through which coolant may flow;
(Iii) a non-conductive cover that is hermetically engaged with the bottom and surrounds the heat exchange channel, the cover having an inlet leading to the channel and at least one outlet leading from the heat exchange channel. Conductive cover,
A heat exchanger comprising: 前記カバーには中央に位置する流入口及び該流入口の両側に流出口を有すること、を特徴とする請求項１１に記載の熱交換器。   The heat exchanger according to claim 11, wherein the cover has an inlet located in the center and outlets on both sides of the inlet. 前記カバーを銅製とすること、を特徴とする請求項１１に記載の熱交換器。   The heat exchanger according to claim 11, wherein the cover is made of copper. 前記カバーを底部に半田付けすること、を特徴とする請求項１３に記載の熱交換器。   The heat exchanger according to claim 13, wherein the cover is soldered to a bottom portion. 前記フィンを１枚の連続した銅製のシートを蛇腹状に折畳んで形成すること、を特徴とする請求項１１に記載の熱交換器。   The heat exchanger according to claim 11, wherein the fin is formed by folding a continuous copper sheet into a bellows shape. 前記フィン列を圧縮し、それにより前記フィン間で形成した隣接する流路の上下部を、フィンを相互に圧迫させることによって、密閉すること、を特徴とする請求項１５に記載の熱交換器。   The heat exchanger according to claim 15, wherein the fin row is compressed and thereby the upper and lower portions of adjacent flow paths formed between the fins are sealed by pressing the fins against each other. . 熱電モジュールを前記伝導性底部の外側と熱伝達し合うよう関係させて更に備えること、を特徴とする請求項１１に記載の熱交換器。   The heat exchanger of claim 11, further comprising a thermoelectric module in thermal communication with the outside of the conductive bottom. 前記底部を銀製とすること、を特徴とする請求項１に記載の熱交換器。   The heat exchanger according to claim 1, wherein the bottom is made of silver. 前記底部を銀製とすること、を特徴とする請求項１１に記載の熱交換器。   The heat exchanger according to claim 11, wherein the bottom is made of silver.
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