JP2007324473A - Board transfer carrier - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent a printed board from deflecting due to the heating of a reflow device. <P>SOLUTION: A positioning hole 18 is formed at four corners 14a of a printed board 10. At four corners 32c of a board transfer carrier 30 that holds the printed board 10, a positioning pin 34 which is inserted at the corresponding positioning hole 18 is provided. A carrier body 32 of the board transfer carrier 30 is formed by laminating metal plates 32a and 32b, having different linear expansion factors. Both metal plates 32a and 32b are laminated together so that a metal plate 32a, having a higher linear expansion factor is on the board-holding surface 36 side. Under the heating of a reflow device, the four corners 32c bend from the board holding surface 36 of the carrier body 32 toward the rear surface on the opposite side, so the four corners 14a of the printed board 10 are pulled away from the center of the printed board 10. As a result, generation of warpage of the printed board 10 due to the heating of the reflow device is prevented. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a substrate transport carrier used for transporting a thin printed circuit board, a flexible printed circuit board, or the like in a reflow apparatus.

  Conventionally, when mounting electronic components on a printed circuit board that is difficult to handle due to its low rigidity, such as a rigid printed circuit board or a flexible printed circuit board, the printed circuit board is held by a plate-shaped substrate transport carrier. And put it in the mounting line. The printed circuit board held on the transport carrier and transported on the mounting line is sequentially sent to the cream solder printing process, the electronic component mounting process, and the reflow process to mount the electronic components.

  In the cream solder printing process, cream solder is printed on the electrode terminals in the component mounting area of the printed circuit board. In the electronic component mounting step, the electronic component is mounted on the component mounting area on which the cream solder is printed. And a reflow process solders an electronic component to a printed circuit board by heating the printed circuit board with which the electronic component was mounted, and melting cream solder.

  By the way, in the above-mentioned reflow process, since the printed circuit board is heated at 200 ° C. or higher, thermal deformation such as warpage or twist may occur in the printed circuit board. In particular, rigid printed boards and flexible printed boards having a small plate thickness have a problem that they are likely to be thermally deformed due to their low rigidity, and easily cause displacement of electronic components, solder bridges, poor connection, and the like.

Therefore, a method for preventing thermal deformation of the printed circuit board due to heating during reflow is well known by providing an adhesive layer or a resin layer on the substrate holding surface of the substrate transport carrier and closely contacting the printed circuit board to the substrate holding surface. (See Patent Documents 1 and 2). A method for preventing thermal deformation of a printed circuit board due to heating during reflow is also well known by providing a tension applying mechanism that always pulls the outer periphery of the printed circuit board in a direction away from the center of the circuit board. (See Patent Document 3).
No. 2005-72556 (refer to page 8, FIG. 2) 2004-71863 (see page 8, Fig. 3) 2004-327944 (see page 8, Fig. 1)

  However, when the printed circuit board is brought into close contact with the substrate holding surface of the substrate transport carrier using the adhesive layer or the resin layer as in the methods described in Patent Documents 1 and 2, the substrate transport carrier is repeatedly used as the substrate transport carrier is repeatedly used. Since the force is reduced, there is a problem that a stable printed circuit board cannot be held. Furthermore, when the printed circuit board is peeled off from the substrate transport carrier after mounting the electronic component, stress is applied to the soldered electronic component, which may destroy the solder joint.

  In addition, if the outer peripheral portion of the printed circuit board is continuously pulled by the tension applying mechanism as in the method described in Patent Document 3, the printed circuit board is excessively stressed and the printed circuit board is deformed or the wiring pattern is disconnected. There is a risk.

  The present invention is for solving the above-described problem, and uses a pressure-sensitive adhesive layer or a resin layer to closely attach a printed circuit board to a substrate holding surface of a substrate transport carrier, or continuously pulls a printed circuit board by a tension applying mechanism. An object of the present invention is to provide a substrate transport carrier that can prevent thermal deformation of a printed circuit board due to heating during reflow.

  The present invention has a board holding surface for holding a printed board, and heating the printed board to mount an electronic component on the printed board in a state where the printed board is held on the board holding surface. In the substrate transport carrier transported to the apparatus, when heated by the heating device, the tension that pulls the outer peripheral portion of the printed board held on the board holding surface in the tension applying direction away from the center of the printed board It is characterized by providing a provision means.

  Provided with a plurality of positioning pins provided on the substrate holding surface and respectively inserted into a plurality of positioning holes formed on an outer peripheral portion of the printed circuit board to position the printed circuit board on the substrate holding surface; It is preferable that the means includes at least the positioning pin and displaces the positioning pin in the tension applying direction when heated by the heating device.

  The tension applying means includes at least a bimetal carrier body having a bimetal structure formed by bonding a plurality of metal plates having the substrate holding surface and having different linear expansion coefficients, and the positioning pin. One of the plurality of metal plates that form a large linear expansion coefficient is disposed on the substrate holding surface side, and when heated by the heating device, the bimetal carrier body thermally expands and the substrate holding surface It is preferable that the substantially central portion is curved so as to be convex, and the positioning pin is displaced in the tension applying direction by the curvature of the bimetal body.

  The tension holding means includes at least a carrier main body having the substrate holding surface and the positioning pins. The carrier main body includes a plurality of pin holding portions each provided with one positioning pin, and the pin holding. The pinless portion, which is a portion excluding the portion, is integrally provided, and the positioning pin is displaced by displacing the pin holding portion with respect to the pinless portion when heated by the heating device. It is preferable to displace in the tension applying direction.

  The pin holding portion has a bimetal structure formed by bonding metal plates having different linear expansion coefficients, and is provided on the back surface opposite to the substrate holding surface due to thermal expansion when heated by the heating device. It is preferable that the pin is displaced with respect to the non-pinned portion by being deformed in the direction in which it goes. The pin holding portion is made of a shape memory alloy, and is deformed in a direction from the substrate holding surface toward the opposite back surface with respect to the pinless portion when heated to a predetermined temperature or more by the heating device. It is preferable. Further, the pin holding portion is cut away on the back side opposite to the substrate holding surface and is made thinner than the pinless portion, and is warped in the direction toward the back surface by heating of the heating device. The substrate carrying carrier according to claim 4, wherein

  The tension applying means includes at least a carrier main body having the substrate holding surface and the positioning pins. The carrier main body forms a part of the substrate holding surface and is provided with one positioning pin. A plurality of pin holding portions, a pinless portion that forms the substrate holding surface at a portion excluding these pin holding portions, a connection between the pin holding portion and the pinless portion, and expansion by heating of the heating device And it is preferable to displace the positioning pin with the pin holding part in the tension applying direction.

  Preferably, the first connecting member is made of a shape memory alloy and expands when heated to a predetermined temperature or higher by the heating device. The first connection member is formed by connecting a first extension member made of a shape memory alloy and a second extension member having a bimetallic structure formed by bonding metal members having different linear expansion coefficients. The first stretching member may be stretched when heated to a predetermined temperature or higher by the heating device, and the second stretching member may be gradually stretched substantially in proportion to a temperature increase due to heating of the heating device. preferable.

  The carrier body has a rectangular outer shape matched to the printed circuit board, the pinless portion where the position matched to the four corner portions of the printed circuit board is cut out, and the four body portions formed according to the four corner portions. It is preferable to have a pin holding part.

  The tension applying means includes the positioning pins and a carrier main body having the substrate holding surface, and the carrier main body includes a plurality of pin holding portions each provided with one positioning pin and the pins adjacent to each other. It is preferable to include a second connecting member that connects the holding portion, extends by heating from the heating device, and displaces the positioning pin in the tension applying direction together with the pin holding portion. The second connecting member is preferably made of a shape memory alloy and stretched when heated to a predetermined temperature or higher by the heating device. The second connecting member preferably has a bimetallic structure formed by bonding metal members having different linear expansion coefficients, and preferably gradually expands substantially in proportion to the temperature rise due to heating of the heating device. .

  The tension applying means includes a carrier main body having the substrate holding surface and the positioning pins. The carrier main body forms a part of the substrate holding surface and is provided with one positioning pin. A plurality of pin holding portions, a plurality of support members in which the substrate holding surface is divided at portions excluding these pin holding portions, and the pin holding portions and the support members are connected to each other by heating from the heating device. A third connecting member that extends, and a fourth connecting member that connects the support members to each other and expands by heating from the heating device, and the pins by the extension of the third connecting member and the fourth connecting member It is preferable to displace the positioning pin together with the holding portion in the tension applying direction.

  One of the third and fourth connecting members has a bimetallic structure formed by bonding metal plates having different linear expansion coefficients, the other is formed of a shape memory alloy, and the one is heated by the heating device. It is preferable that the other side gradually expands in proportion to the temperature rise due to the above and the other side extends when heated by the heating device above the predetermined temperature. In addition, the carrier body has a rectangular outer shape that matches the printed circuit board, and the support member that is cut out at positions corresponding to the four corner parts of the printed circuit board, and is arranged in accordance with the four corner parts. It is preferable to have the said pin holding | maintenance part.

  A guide plate is formed in the shape of a long hole through which the positioning pin is inserted, and a guide hole is formed to guide a displacement direction of the positioning pin when heated by the heating device, and the guide plate is provided on the substrate holding surface. And the printed circuit board are preferably sandwiched and held.

  A plurality of positioning holes are formed in the outer peripheral portion of the printed circuit board, and a plurality of the tension applying means are provided on the substrate holding surface, and the printed circuit boards are inserted through the positioning holes, respectively. It is preferable to comprise a heat-deformation positioning pin that is positioned above and at least partially deformed toward the tension applying direction when heated by the heating device.

  The thermal deformation positioning pin is a bimetal structure formed by bonding columnar metal members having different linear expansion coefficients so that the metal member having a higher linear expansion coefficient faces the substantially central portion of the carrier body. It is preferable to gradually tilt and deform in the tension applying direction substantially in proportion to the temperature rise due to the heating of the heating device.

  The thermal deformation positioning pin is cracked along a plane substantially perpendicular to a straight line passing through the thermal deformation positioning pin and the substantially central portion of the carrier body, and the substantially central portion of the carrier body of the thermal deformation positioning pin. The second tip crack portion on the opposite side to the first tip crack portion on the opposite side is formed from a shape memory alloy, and the second tip crack portion is heated to the predetermined temperature or higher by the heating device. It is preferable that the film be inclined and deformed in the tension applying direction.

  The guide plate is formed in a long hole shape through which the thermal deformation positioning pin is inserted and formed with a guide hole that guides the deformation direction of the thermal deformation positioning pin when heated by the heating device. It is preferable to sandwich and hold the substrate holding surface and the printed board. Moreover, it is preferable that the printed circuit board is a collective printed circuit board in which a plurality of individual printed circuit boards are attached, and an outer peripheral portion of the printed circuit board is a discarded board.

  The substrate transport carrier of the present invention pulls the outer peripheral portion of the printed circuit board in the tension applying direction away from the center of the printed circuit board when heated by being transported into the heating device and the substrate holding surface that holds the printed circuit board. Since the tension applying means is provided, it is possible to prevent the occurrence of thermal deformation such as warping, undulation, and twisting of the printed circuit board due to the heating of the heating device. This eliminates the need for the printed circuit board to be in close contact with the substrate holding surface via the adhesive layer or the resin layer as in the prior art. As a result, it is possible to hold the printed circuit board more stably than when an adhesive layer or a resin layer that may reduce adhesive strength is used.

  Moreover, since force is applied only when heated, the printed circuit board can be easily removed. For this reason, when peeling a printed circuit board from a board | substrate conveyance carrier after mounting an electronic component like before, stress is applied to the soldered electronic component and a solder joint part is prevented from being destroyed.

  Further, when the heating is not performed, it is possible to prevent a force from being applied to the printed circuit board, so that the outer peripheral portion of the printed circuit board is not constantly pulled as in the prior art. As a result, it is possible to prevent the printed circuit board from being overstressed and the printed circuit board to be deformed or the wiring pattern or the solder joint of the circuit board to be disconnected.

  FIG. 1 is an external perspective view of a flexible printed circuit board (hereinafter simply referred to as a printed circuit board) 10 according to the present invention after mounting electronic components. The printed circuit board 10 is a rectangular collective printed circuit board having two individual printed circuit boards 12 and is composed of two individual printed circuit boards 12 and a discarded substrate 14 formed around these printed circuit boards.

  A plurality of various electronic components 16 are mounted in the component mounting area (not shown) of both individual printed circuit boards 12. The discarded board 14 corresponds to the outer peripheral portion of the printed board of the present invention. As will be described in detail later, positioning holes 18 for positioning the printed board 10 are formed in the four corners 14a of the discarded board 14 (printed board 10).

  FIG. 2 is a schematic view of a mounting line 20 for mounting the electronic component 16 on each individual board 12 of the printed board 10. The mounting line 20 includes a cream solder printing device 24, an electronic component mounting device 26, and a reflow device 28 arranged along a conveyor belt 22 that moves in an endless track. As described above, since the printed circuit board 10 is a flexible printed circuit board with low rigidity, it is difficult to use it alone. For this reason, in the mounting line 20, the electronic component 16 is mounted in a state where the printed circuit board 10 is held by a substrate transport carrier 30 described later.

  The conveyor belt 22 conveys the printed circuit board 10 before mounting in the order of the cream solder printing device 24, the electronic component mounting device 26, and the reflow device 28. The cream solder printing device 24 prints cream solder on electrode terminals (not shown) in the component mounting area of the printed circuit board 10 (individual printed circuit board 12). The electronic component mounting device 26 mounts the electronic component 16 on the component mounting area.

  The reflow device 28 corresponds to the heating device of the present invention, and the substrate transfer passage 28a is divided into a plurality of heating blocks (not shown) along the substrate transfer direction. Each heating block (not shown) can be individually adjusted in temperature. Thereby, the heating temperature at the time of heating the printed circuit board 10 conveyed in the board | substrate conveyance path | route 28a can be raised in steps (refer FIG. 5). When the printed circuit board 10 is heated, the cream solder is melted and the electronic component 16 is soldered to the component mounting area of the printed circuit board 10. Thus, the mounting of the electronic component 16 is completed.

  At this time, in the above-described reflow apparatus 28, the printed circuit board 10 is heated at a temperature of 200 ° C. or higher in order to melt the cream solder. Particularly in recent years, the heating temperature has become higher than before due to the lead-free solder material. Moreover, since the printed circuit board 10 which is a flexible printed circuit board does not contain a glass cloth unlike a rigid circuit board, rigidity is remarkably low. For this reason, the printed circuit board 10 is likely to undergo thermal deformation such as warping, twisting, and undulation due to heating during reflow, and as a result, the electronic component 16 is liable to be displaced, solder bridges, poor connections, and the like. .

  Therefore, in the present invention, the substrate transport carrier 30 is used without causing the printed circuit board 10 to be in close contact with the substrate transport carrier 10 using a pressure-sensitive adhesive layer or a resin layer as in the past, or without constantly pulling the printed circuit board 10. Thus, thermal deformation of the printed circuit board 10 due to heating during reflow is prevented. Hereinafter, the substrate transport carrier 30 according to the first embodiment of the present invention will be specifically described with reference to FIGS. 3 and 4. Here, FIG. 3 is a perspective view of the substrate transport carrier 30 with the printed circuit board 10 set therein, and FIG. 4 is a perspective view of the substrate transport carrier 30 with the printed circuit board 10 separated.

  The substrate transport carrier 30 is roughly composed of a carrier body 32 and four positioning pins 34. The carrier body 32 corresponds to the bimetal carrier body of the present invention, and is formed in substantially the same shape as the printed board 10. The carrier body 32 is formed by bonding two metal plates 32a and 32b having different linear expansion coefficients, and has a so-called bimetal structure. In the present embodiment, the metal plate 32 a has a larger linear expansion coefficient than the metal plate 32 b, and both the metal plates 32 a and 32 b have the surface of the metal plate 32 a serving as the substrate holding surface 36 that holds the printed circuit board 10. It is pasted together.

  The positioning pins 34 are provided one by one on the substrate holding surface 36, more specifically, on the four corners 32 c of the carrier body 32 so as to face the positioning holes 18 of the printed circuit board 10. Then, the printed circuit board 10 is positioned on the substrate holding surface 36 by setting the printed circuit board 10 on the substrate holding surface 36 of the carrier body 32 so that each positioning pin 34 is inserted into the corresponding positioning hole 18. It is held in the state.

  FIG. 5 is a graph showing an example of the temperature profile of the printed circuit board 10 in the reflow apparatus 28. As described above, since the substrate transport passage 28a of the reflow device 28 is divided into a plurality of heating blocks (not shown), the heating temperature of the printed circuit board 10 can be increased stepwise. This temperature profile can be arbitrarily adjusted by changing the set temperature of each heating block and the conveyance speed of the printed circuit board 10 (conveyor belt 22).

  As described above, the carrier body 32 has a bimetallic structure, and is formed by bonding the metal plate 32a having a large linear expansion coefficient between the metal plates 32a and 32b so as to be on the substrate holding surface 36 side. Yes. For this reason, when the carrier body 32 is heated by the reflow device 28, due to the difference in thermal expansion coefficient between the metal plates 32a and 32b, the carrier body 32 gradually gradually increases substantially in the center of the substrate holding surface 36 in proportion to the increase in heating temperature. Curves so that becomes convex.

  6A to 6C are cross-sectional views of the substrate transport carrier 30 taken along line VI-VI in FIG. As shown in (A), the carrier body 32 is in a flat state before being conveyed into the reflow device 28. When the carrier body 32 is conveyed into the reflow device 28 and heated with the temperature profile shown in FIG. 5, the substantially central portion of the substrate holding surface 36 gradually protrudes in proportion to the increase in the heating temperature. It curves to become.

  As shown in (C), as shown in (C), the carrier main body 32 is more than when the carrier main body 32 is heated at the heating temperature Y1 (° C.) after the time X1 (min) has elapsed, as shown in (B). When the time X2 (min) elapses and the heating temperature Y2 (° C.) is higher than the heating temperature Y1 (° C.), the bending amount becomes larger. The carrier body 32 has the largest amount of bending when the time elapses further than the time X2 (min) and is heated at the highest heating temperature Y3 (° C.). In addition, the cross section of the carrier main body 32 along a line (not shown) orthogonal to the VI-VI line in FIG. 4 is also deformed to substantially the same shape as FIGS. 6A to 6C as the heating temperature rises. .

  As shown in FIG. 7, when heating is performed by the reflow device 28 so that the substantially central portion of the substrate holding surface 36 of the carrier body 32 is warped, each of the four corners 32c of the carrier body 32 is reversed to the carrier body. Curved in a direction (hereinafter, simply referred to as a downward direction) from the 32 substrate holding surfaces 36 toward the opposite back surface 38 (see FIG. 6). As a result, the positioning pins 34 provided on the four corners 32c are displaced in the tension applying direction away from the center of the printed circuit board 10 held on the board holding surface 36, respectively. At this time, each positioning pin 34 is inserted through the corresponding positioning hole 18 (see FIG. 4) of the printed circuit board 10, so that the four corners 14a of the printed circuit board 10 are pulled in the tension applying direction. As a result, the printed circuit board 10 is also bent in the same direction as the carrier body 32, and the printed circuit board 10 is brought into close contact with the substrate holding surface 36 of the carrier body 32.

  The amount of bending of the printed circuit board 10 at this time is suppressed to such an extent that the electronic component 16 is not misaligned, solder bridged, or poorly connected when the amount of bending becomes maximum when heated at the heating temperature Y3 (° C.). . The amount of bending of the printed circuit board 10 can be adjusted by changing the material and thickness of the metal plates 32a and 32b constituting the carrier body 32. The combination of the materials and thicknesses of the metal plates 32a and 32b from which the optimal amount of bending of the printed circuit board 10 can be obtained is obtained by conducting experiments in advance.

  Thus, in this embodiment, while being heated by the reflow device 28, the carrier body 32 having a bimetallic structure slightly warps to the extent that there is no problem in mounting the electronic component 16. As a result, the four corners 14 a of the printed circuit board 10 are pulled in the tension applying direction, and the printed circuit board 10 is brought into close contact with the substrate holding surface 36 of the carrier body 32. This prevents thermal deformation such as warping, undulation, and twisting of the printed circuit board 10 due to heating of the reflow device 28. In addition, when a rigid printed circuit board having a thin plate thickness is held by the substrate transport carrier 30 instead of the printed circuit board 10 (flexible printed circuit board), the rigid printed circuit board is held when the substrate transport carrier 30 is curved. The surface 36 is not completely adhered, and a slight gap is generated between the rigid printed circuit board and the substrate holding surface 36.

  Next, the operation of this embodiment will be described. The printed circuit boards 10 before electronic component mounting are set on the board conveyance carrier 30 one by one. At this time, the positioning pins 34 on the carrier main body 32 are inserted into the corresponding positioning holes 18 of the substrate 10, and the printed circuit board 10 is held in a state of being positioned on the substrate holding surface 36 of the carrier main body 32 ( 3 and 4). And the board | substrate conveyance carrier 30 with which the printed circuit board 10 was set is sequentially mounted on the conveyor belt 22, and is conveyed by this conveyor belt 22 (refer FIG. 2).

  When the substrate transport carrier 30 is transported to the cream solder printing device 24, the cream solder printing device 24 prints cream solder on the electrode terminals (not shown) in the component mounting area of the printed circuit board 10 (individual substrate 12). After the cream solder printing, the board carrier 30 is carried to the electronic component mounting device 26 where the electronic component 16 is mounted on the component mounting area of the printed board 10. When the mounting of the electronic component 16 is completed, the substrate transport carrier 30 is continuously transported to the reflow device 28.

  Each heating block (not shown) of the reflow device 28 is set so that the printed circuit board 10 is heated with the temperature profile shown in FIG. When the substrate transport carrier 30 is transported into the substrate transport path 28a of the reflow device 28, the printed circuit board 10 is heated. And while the printed circuit board 10 is conveyed in the board | substrate conveyance path | route 28a, cream solder fuse | melts and the electronic component 16 is soldered to the components mounting area of the printed circuit board 10. FIG.

  At this time, in this embodiment, the carrier body 32 that holds the printed circuit board 10 has a bimetal structure, so that when heated by the reflow device 28, the carrier body 32 has a substantially central portion of the substrate holding surface 36. It can be curved to be convex. As a result, each positioning pin 34 can be displaced in the tension applying direction (see FIG. 7). That is, only when heated by the reflow device 28, the printed circuit board 10 can be brought into close contact with the substrate holding surface 36 by pulling the four corners 14 a of the printed circuit board 10 in the tension applying direction. Thereby, generation | occurrence | production of thermal deformation, such as a curvature of the printed circuit board 10 by the heating of the reflow apparatus 28, a wave | undulation, and a twist, can be prevented.

  Moreover, in this embodiment, since the printed circuit board 10 can be stuck on the board | substrate holding surface 36 of the carrier main body 32 using the thermal deformation of the carrier main body 32, it is via an adhesive layer or a resin layer like the past. There is no need for the printed circuit board 10 to be in close contact with the substrate holding surface 36. As a result, the printed circuit board 10 can be held more stably than when an adhesive layer or a resin layer whose adhesive force gradually decreases as the substrate transport carrier is repeatedly used. Furthermore, since the carrier body 32 is restored to the original flat state when it passes through the reflow device 28 and is cooled to room temperature, the printed board 10 can be easily detached from the carrier body 30. For this reason, when peeling a printed circuit board from a board | substrate conveyance carrier after electronic component mounting like before, stress is applied to the soldered electronic component 16 and it will prevent that a solder joint part is destroyed.

  Moreover, in this embodiment, when the carrier body 32 has a bimetal structure, only when the four corners 14a of the printed circuit board 10 are pulled in the tension applying direction and are not heated only when being heated by the reflow device 28. Can prevent a force from being applied to the printed circuit board 10. As a result, the outer peripheral portion of the printed circuit board is not continuously pulled as in the conventional case. Accordingly, it is possible to prevent the printed circuit board 10 from being overstressed and the printed circuit board 10 to be deformed or the wiring pattern or the solder joint portion of the circuit board 10 to be disconnected.

  This completes the mounting process of the electronic component 16. As described above, when the substrate transport carrier 32 is cooled and restored to the original flat state, the printed circuit board 10 is removed from the carrier body 30. Then, the printed circuit board 10 on which the mounting of the electronic component 16 is completed is sent to the next cutting device (not shown), where it is divided into the individual circuit board 12 and the discarded circuit board 14. Although not shown in the drawings, substrate carrier 30 is mounted on conveyor belt 22 at predetermined intervals. Similarly, electronic component 16 is mounted through the above-described cream solder printing process, electronic component mounting process, and reflow process. Is done.

  Next, the board | substrate conveyance carrier 40 of the 2nd Embodiment of this invention is demonstrated using FIG. Here, the same members as those described in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted (hereinafter, the same applies to the third and subsequent embodiments).

  The substrate transport carrier 40 includes a carrier body 42, four positioning pins 34, and a support base 44. The carrier body 42 is integrally formed with four corner portions 46 that form a part of the substrate holding surface 36 and are provided with one positioning pin 34, and support portions 48 that support the four corner portions 46. Here, the four corner portions 46 correspond to the pin holding portion of the present invention, and the support portion 48 corresponds to the pinless portion of the present invention. The support portion 48 is notched at positions corresponding to the four corner portions 14 a of the printed circuit board 10, and the four corner portions 46 are formed to match the four corner portions 14 a of the printed circuit board 10.

  Each of the four corners 46 is formed by bonding together two metal plates 46a and 46b having different linear expansion coefficients, like the above-described carrier body 32 (see FIG. 4), and has a so-called bimetal structure. . The metal plate 46a has a larger linear expansion coefficient than the metal plate 46b, and the two metal plates 46a and 46b are bonded together so that the metal plate 46a is on the substrate holding surface 36 side.

  The support part 48 is formed of various metal materials or resin materials having heat deformation resistance. Therefore, the support portion 48 is not thermally deformed even when heated by the reflow device 28. Further, the support base 44 supports the carrier body 42. In the present embodiment, the mounting process described above is performed with the carrier body 42 placed on the support base 44. The portions of the support base 44 facing the four corners 46 are notched portions 44a. As a result, the carrier body 42 is supported by the support base 44 with the four corners 46 floating in the air.

  In the second embodiment, unlike the first embodiment, only the four corners 46 of the carrier main body 42 have a bimetal structure, and the four corners 46 are metal having a large linear expansion coefficient. The plate 46a is bonded and formed so as to be on the substrate holding surface 36 side. For this reason, when the carrier main body 42 is heated by the reflow device 28, only the four corners 46 gradually move downward (in proportion to the increase in heating temperature) due to the difference in thermal expansion coefficients of both the metal plates 46a and 46b. Curve in the direction from the substrate holding surface 36 toward the back surface 38). At this time, since each of the four corners 46 is in a state of being suspended in the air by the support base 44, the four corners 46 are easily bent as compared with the case where the carrier main body 42 is placed directly on the conveyor belt 22. be able to.

  FIGS. 9A to 9C are cross-sectional views of one corner 46 of the carrier body 42. As shown to (A), before the board | substrate conveyance carrier 40 (carrier main body 42) is conveyed in the reflow apparatus 28, the four corners 46 are in the flat state. When the carrier body 40 is heated by the reflow device 28 with the temperature profile shown in FIG. 5, the four corners 46 are gradually bent downward substantially in proportion to the increase in the heating temperature. And like the above-mentioned carrier main part 32, as shown in (C), the amount of curving of four corners 46 is as shown in (C) rather than when it is heated at heating temperature Y1 (° C.), as shown in (B). It becomes larger when it is heated at the heating temperature Y2 (° C.). The four corners 46 are restored to their original flat state when cooled by passing through the reflow device 28.

  As shown in FIG. 10, also in the second embodiment, the four corners 46 of the carrier body 32 can be bent downward only when heated by the reflow device 28. Accordingly, each positioning pin 34 can be displaced in the above-described tension applying direction. Thereby, the effect similar to the effect demonstrated in the above-mentioned 1st Embodiment is acquired.

  Next, the substrate transport carrier 50 according to the third embodiment of the present invention will be described with reference to FIGS. 11 (A), 11 (B) and FIG. The substrate transport carrier 50 has basically the same configuration as the substrate transport carrier 40 of the second embodiment. However, in the substrate transport carrier 50, the four corners 54 of the carrier body 52 are formed of a shape memory alloy.

  The four corners 54 have a flat shape substantially parallel to the substrate holding surface 36 at a predetermined temperature, for example, lower than the above-described heating temperature Y2 (° C.) (see FIG. 5), and the heating temperature Y2 (° C.) (see FIG. 5). The shape is memorized so as to be bent downward as described above when heated. For this reason, the four corners 54 are flat before the substrate transport carrier 50 (carrier body 52) is transported into the reflow device 28 (see FIG. 11A). When the carrier body 52 is heated with the temperature profile shown in FIG. 5 by the reflow device 28 and the temperature becomes equal to or higher than the heating temperature Y2 (° C.) (see FIG. 5), the four corners 54 are bent downward. (See FIG. 11B). Each of the four corners 54 is restored to the original flat shape when it passes through the reflow device 28 and is cooled to a temperature lower than the heating temperature Y2 (° C.).

  Thus, also in the third embodiment, each positioning pin 34 can be displaced in the tension applying direction only when heated by the reflow device 28 (see FIG. 12). Thereby, the effect similar to the effect demonstrated in the above-mentioned 1st Embodiment is acquired. Note that the shape of the four corners 54 may be memorized so as to bend instead of being memorized so as to be bent at the heating temperature Y2 (° C.) or higher.

  Next, a substrate transport carrier 60 according to the fourth embodiment of the present invention will be described with reference to FIG. The substrate transport carrier 60 has basically the same configuration as the substrate transport carriers 40 and 50 of the second and third embodiments described above. However, in the substrate transport carrier 60, the back surface 38 (see FIG. 14) side of the four corners 64 of the carrier body 62 is notched, and the four corners 64 of the carrier body 62 are thinner than the support part 66.

  As described above, the thinner the printed board is, the lower the rigidity is. Therefore, the printed board is easily warped by heating. For this reason, by reducing the thickness of each of the four corners 66, when the substrate transport carrier 60 (carrier body 62) is heated by the reflow device 28, only the four corners 66 can be warped downward. Note that, for example, the linear expansion coefficient of the four corners 66 on the substrate holding surface 36 side of the four corners 66 is larger than that of the carrier main body 62 (four corners 66) so that the four corners 66 are surely warped downward when heated. It is preferable to provide a high metal layer or resin layer.

  14A and 14B are cross-sectional views of one corner 64 of the carrier body 62. FIG. As shown to (A), before the board | substrate conveyance carrier 60 (carrier main body 62) is conveyed in the reflow apparatus 28 (before heating), the four corner parts 64 are in a flat state. When the carrier body 62 is heated by the reflow device 28 with the temperature profile shown in FIG. 5, the four corners 64 gradually warp downward as the heating temperature rises. Here, (B) shows the warped state of the four corners 64 when the carrier body 62 is heated to the heating temperature Y2 (° C.).

  As shown in FIG. 15, also in the fourth embodiment, each of the four corners 64 of the carrier body 62 can be bent downward only when heated by the reflow device 28. Therefore, each positioning pin 34 can be displaced in the tension applying direction. Thereby, the effect similar to the effect demonstrated in the above-mentioned 1st Embodiment is acquired.

  Next, a substrate transport carrier 70 according to the fifth embodiment of the present invention will be described with reference to FIG. The substrate transport carrier 70 has basically the same configuration as the substrate transport carriers 40, 50, 60 of the second to fourth embodiments described above. However, the carrier body 72 of the substrate transport carrier 70 is divided into four corner portions 74 and a support portion 76. And each four corner part 74 and the support part 76 are connected via the connection member 78 corresponded to the 1st connection member of this invention.

  17A and 17B are front views of one connection member 78. FIG. The connecting member 78 is made of a shape memory alloy. Further, the connecting member 78 has a substantially U-shaped cross section along the gap direction between the four corners 74 and the support 76, and one end 78a is fixed to the four corners 74 and the other end 78b. Is fixed to the support portion 76.

  The connection member 78 has a shape memorized so that the distance between the end portions 78a and 78b is widened when heated to a predetermined temperature, for example, the above-described heating temperature Y2 (° C.) (see FIG. 5) or higher. For this reason, both ends 78a and 78b of the connection member 78 are in a narrow state before the substrate transport carrier 70 (carrier body 72) is transported into the reflow device 28 (see (A)). Then, when the carrier body 72 is heated by the reflow device 28 with the temperature profile shown in FIG. 5 and the temperature becomes equal to or higher than the heating temperature Y2 (° C.) (see FIG. 5), the connecting member 78 has both ends 78a. , 78b are deformed into a wide state (see (B)). That is, the connection member 78 expands in the gap direction between the four corner portions 74 and the support portion 76 when heated by the reflow device 28 to a heating temperature Y2 (° C.) or higher. Note that when the connection member 78 passes through the reflow device 28 and is cooled to a temperature lower than the heating temperature Y2 (° C.), the connection member 78 is restored to the state before heating.

  As shown in FIG. 18, by extending the connecting member 78 in the gap direction, each of the four corner portions 74 can be displaced in the tension applying direction. Therefore, each positioning pin 34 can be displaced in the tension applying direction only when heated by the reflow device 28 to the heating temperature Y2 (° C.) or higher. Thereby, the effect similar to the effect demonstrated in the above-mentioned 1st Embodiment is acquired.

  Next, a substrate transport carrier 80 according to the sixth embodiment of the present invention will be described with reference to FIGS. The substrate transport carrier 80 has basically the same configuration as the substrate transport carrier 70 of the fifth embodiment described above. However, the four corner portions 84 and the support portion 86 constituting the carrier main body 82 of the substrate transport carrier 80 are connected via the connection member 87.

  The connection member 87 is formed by connecting the first extension member 88 and the second extension member 89. The first extension member 88 is the same as the connection member 78 described in the fifth embodiment, and one end 88 a is fixed to the four corners 84 and the other end 88 b is the second extension member 89. It is fixed to.

  The second extension member 89 is formed by bonding two metal members 89a and 89b having different linear expansion coefficients, and has a so-called bimetal structure. Similar to the first extension member 88, the second extension member 89 has a substantially inverted U-shaped cross section along the gap direction between the four corners 84 and the support part 86. At this time, the metal members 89a and 89b are bonded so that the metal member 89a having the larger linear expansion coefficient is on the inside and the metal member 89b having the smaller expansion coefficient is on the outside. The second extension member 89 has one end 89 c fixed to the support 86 and the other end 89 d fixed to the other end 88 b of the first extension member 88.

  Due to the difference in thermal expansion coefficient between the two metal members 89a and 89b, the second extension member 89 is thermally deformed so that the distance between the both end portions 89c and 89d gradually increases in proportion to the increase in the heating temperature. . That is, the second extension member 89 also extends in the gap direction between the four corners 84 and the support part 86 by the heating of the reflow device 28.

  The first and second extension members 88 and 89 constituting the connection member 87 are both in a narrow state before the substrate transport carrier 80 (carrier body 82) is transported into the reflow device 28 (before heating). (See (A)). When the carrier body 82 is heated with the temperature profile shown in FIG. 5 by the reflow device 28, the second expansion member 89 gradually expands in the gap direction as the heating temperature increases (see (B)). When the reflow device 28 is heated to the heating temperature Y2 (° C.) or higher, both end portions 88a and 88b of the first extension member 88 are deformed into a wide state, and the first extension member 88 is also extended in the gap direction ( (See (C)). In addition, when both the extending members 88 and 89 pass through the reflow device 28 and are cooled, they are restored to the state before heating.

  As described above, also in the sixth embodiment, by extending the connecting member 87 in the gap direction, the four corner portions 84 can be displaced in the tension applying direction. Therefore, each positioning pin 34 can be displaced in the tension applying direction only when heated by the reflow device 28. Thereby, the effect similar to the effect demonstrated in the above-mentioned 1st Embodiment is acquired.

  In the sixth embodiment, the first extension member 88 is fixed to the four corners 84 and the second extension member 89 is fixed to the support part 86, but the reverse may be possible. In addition, the first extension member 88 is formed in a substantially U shape, and the second extension member 89 is formed in a substantially inverted U shape. However, the present invention is not limited to this, and the gap direction is caused by heating. It may be formed in an arbitrary shape that can be extended to, for example, a V shape or an inverted V shape. In the fifth embodiment described above, the second extending member 89 having a bimetal structure may be used as the connecting member instead of the connecting member 78.

  Next, a substrate transport carrier 90 according to a seventh embodiment of the present invention will be described with reference to FIG. The substrate transport carrier 90 includes a carrier main body 92, six positioning pins 34, and a support base 94. In the carrier body 92, one positioning pin 34 is provided at each of the four corners 96, and one positioning pin 34 is provided at approximately the center of both end portions parallel to the long axis (longitudinal) direction. The support table 94 is basically the same as the above-described support table 44 (see FIG. 8), and is formed in a rectangular shape. Note that the support table 44 may be used instead of the support table 94.

  The carrier body 92 is divided into six along a line passing between the positioning pins 34 which are parallel to the major axis direction or the minor axis direction and adjacent to each other. That is, the carrier main body 92 is divided into six pin holding portions 92a each having one positioning pin 34 provided. And the pin holding | maintenance part 92a adjacent to each other is connected via the connection member 98 (refer FIG. 21).

  FIGS. 21A and 21B are front views of the connection member 98 corresponding to the second connection member of the present invention. The connection member 98 is the same as the connection member 78 (see FIG. 17) described in the fifth embodiment, and both ends of the connection member 98 when heated to a heating temperature Y2 (° C.) or more (see FIG. 5). The shape is memorized so that the portions 98a, 98b are deformed into a wide state and extend in the gap direction between the pin holding portions 92a.

  The connection member 98 has both ends 98a and 98b in a narrow state before the substrate transport carrier 90 (carrier body 92) is transported into the reflow device 28 (see FIG. 21A). Then, when the carrier body 72 is heated by the reflow device 28 with the temperature profile shown in FIG. 5 and the temperature becomes equal to or higher than the heating temperature Y2 (° C.) (see FIG. 5), the connecting member 98 has both end portions 98a. 98b are deformed into a wide state and stretched in the gap direction (see FIG. 21B). When each connection member 98 passes through the reflow device 28 and is cooled to a temperature lower than the heating temperature Y2 (° C.), the connection member 98 is restored to the state before heating.

  As shown in FIG. 22, each pin holding portion 92a can be displaced in the tension applying direction by extending each connection member 98 in the gap direction. Therefore, each positioning pin 34 can be displaced in the tension applying direction only when heated by the reflow device 28. Thereby, the effect similar to the effect demonstrated in the above-mentioned 1st Embodiment is acquired.

  Next, the substrate transport carrier 100 corresponding to the eighth embodiment of the present invention will be described with reference to FIGS. The substrate transport carrier 100 has basically the same configuration as the substrate transport carrier 90 of the seventh embodiment described above. However, the pin holding part 102a which comprises the carrier main body 102 of the board | substrate conveyance carrier 100 is connected via the connection member 104. FIG.

  The connecting member 104 is the same as the second extending member 89 described in the sixth embodiment, and the metal members 104a and 104b having different linear expansion coefficients are arranged on the inner side of the metal member 104a having the larger linear expansion coefficient. Thus, the metal member 104b having the smaller expansion coefficient is bonded to the outside. Then, the connection member 104 gradually expands in the gap direction between the pin holding portions 102a, with the interval between the two end portions 104c and 104d gradually widening as the heating temperature rises.

  The connection member 104 is in a narrow state before the substrate transport carrier 100 (carrier body 102) is transported into the reflow device 28 (before heating) (see (A)). When the carrier body 100 is heated with the temperature profile shown in FIG. 5 by the reflow device 28, the connecting member 104 gradually expands in the gap direction (see (B)). Then, the extension amount of the connecting member 104 is heated at the heating temperature Y2 (° C.) as shown in (C) rather than being heated at the heating temperature Y1 (° C.) as shown in (B). It will be bigger when you are. Similarly, when the connection member 104 passes through the reflow device 28 and is cooled, the connection member 104 is restored to the state before heating.

  Similarly to the seventh embodiment described above, also in the eighth embodiment, each pin holding portion 102a can be displaced in the tension applying direction by extending each connection member 104 in the gap direction. Therefore, each positioning pin 34 can be displaced in the tension applying direction only when heated by the reflow device 28. Thereby, the effect similar to the effect demonstrated in the above-mentioned 1st Embodiment is acquired.

  Next, the substrate transport carrier 110 according to the ninth embodiment of the present invention will be described with reference to FIG. The substrate transport carrier 110 has basically the same configuration as the substrate transport carrier 70 (see FIG. 16) of the fifth embodiment described above, and the carrier body 112 of the substrate transport carrier 110 is one of the substrate holding surfaces 36. Are formed into four corner portions 113 each having a positioning pin 34 and a support portion 114 for supporting them. However, the support portion 114 is divided into four along a line passing through a substantially central portion of the carrier body 112 and a substantially middle portion of the positioning pins 34 adjacent to each other. That is, the support portion 114 is divided into four divided support members 114a corresponding to the support member of the present invention.

  As shown in FIG. 25, the four corners 113 and the divided support members 114a adjacent thereto are connected via a connection member 116 corresponding to the third connection member of the present invention. The connecting member 116 is the same as the connecting member 78 described in the fifth embodiment, and when heated to a temperature equal to or higher than the heating temperature Y2 (° C.) (see FIG. 5), both end portions 116a and 116b thereof. Is deformed into a wide state, and is memorized so as to extend in the gap direction between the four corners 113 and the divided support members 114a.

  As shown in FIG. 26, the divided support members 114a adjacent to each other are connected via a connection member 118 corresponding to the fourth connection member of the present invention. The connecting member 118 is the same as the second extending member 89 described in the sixth embodiment, and is formed by bonding metal members 118a and 118b having different linear expansion coefficients, and has a so-called bimetallic structure. Yes. The connection member 118 is also formed so that the metal member 118a having a larger linear expansion coefficient is on the inside and the metal member 118b having a smaller expansion coefficient is on the outside. Then, the connection member 118 gradually expands in the gap direction between the divided support members 114a with the interval between the two end portions 118c and 118d gradually widening as the heating temperature rises.

  Both connection members 116 and 118 are in a narrow state before the substrate transport carrier 110 (carrier body 112) is transported into the reflow device 28 (before heating). When the carrier body 82 is heated with the temperature profile shown in FIG. 5 by the reflow device 28, the connection member 118 expands in the gap direction between the divided support members 114a. When the reflow device 28 is heated to a heating temperature Y2 (° C.) or higher, both end portions 116a and 116b of the connecting member 116 are deformed into a wide state, and the connecting member 116 is between the four corners 113 and the divided support members 114a. Stretch in the gap direction.

  As shown in FIG. 27, the four corners 113 can be displaced in the tension applying direction by extending both the connecting members 116 and 118 in the gap direction. Moreover, when both the connection members 116 and 118 pass through the reflow device 28 and are cooled, they are restored to the state before heating. Therefore, each positioning pin 34 can be displaced in the tension applying direction only when heated by the reflow device 28. Thereby, the effect similar to the effect demonstrated in the above-mentioned 1st Embodiment is acquired.

  Next, the substrate transport carrier 120 according to the tenth embodiment of the present invention will be described with reference to FIG. The substrate transport carrier 120 includes a carrier body 122, four thermal deformation positioning pins (hereinafter simply referred to as positioning pins) 124 provided on the four corners 122a, and the above-described support base 94. In the first to ninth embodiments described above, the positioning pins 34 are displaced in the tension applying direction so that the four corners 14a (outer peripheral portions) of the printed circuit board 10 are each pulled in the tension applying direction. In this embodiment, the positioning pins 124 are thermally deformed (tilted and deformed) to pull the four corners 14 a of the printed circuit board 10 away from the center of the circuit board 14.

  FIGS. 29A to 29C are enlarged views in which one positioning pin 124 is enlarged and displayed. The positioning pin 124 is formed by bonding substantially semi-cylindrical metal members 124a and 124b having different linear expansion coefficients, and has a so-called bimetal structure. Further, the positioning pin 124 is formed so that the metal member 124a having the higher linear expansion coefficient of both the metal members 124a and 124b is on the side facing the substantially central portion (the center of the printed circuit board 10) of the carrier body 122. ing.

  The positioning pins 124 extend in a direction perpendicular to the substrate holding surface 36 before the substrate transport carrier 120 (carrier body 122) is transported into the reflow device 28 (before heating) (see (A)). . When the carrier body 122 is heated with the temperature profile shown in FIG. 5 by the reflow device 28, the carrier body 122 is gradually inclined and deformed in the tension applying direction due to the difference in thermal expansion coefficient between the metal members 124 a and 124 b. Then, the tilt deformation amount of the positioning pin 124 is heated at the heating temperature Y2 (° C.) as shown in (C) rather than being heated at the heating temperature Y1 (° C.) as shown in (B). It will be bigger when you are. The positioning pins 124 are restored to a state perpendicular to the substrate holding surface 36 when cooled by passing through the reflow device 28.

  As shown in FIG. 30, each of the positioning pins 124 inserted through the positioning holes 18 of the printed circuit board 10 is inclined and deformed in the direction of applying a tension away from the substantially central portion of the carrier body 122, whereby the four corners 14a of the printed circuit board 10 are obtained. Can be pulled in the tensioning direction. Thereby, the effect similar to the effect demonstrated in the above-mentioned 1st Embodiment is acquired.

  Next, the substrate transport carrier 130 according to the eleventh embodiment of the present invention will be described with reference to FIGS. The substrate transport carrier 130 has basically the same configuration as the substrate transport carrier (see FIG. 28) of the tenth embodiment described above. However, the substrate transport carrier 130 is provided with a heat-deformed positioning pin (hereinafter simply referred to as a positioning pin) 132 having a cracked shape at the four corners 122 a of the carrier body 122.

  Each positioning pin 132 is cracked along a plane perpendicular to a straight line passing through the individual pin 132 and the substantially central portion of the carrier body 122. That is, each positioning pin 132 has a first leading crack 132a on the side facing the substantially central portion of the carrier body 122 and a second leading crack 132b on the opposite side. And only the 2nd tip crack part 132b is formed with a shape memory alloy. The shape of the second tip crack 132b is memorized so as to be inclined and deformed in a direction away from the substantially central portion (the center of the printed circuit board 10) of the carrier body 122 when heated to the heating temperature Y2 (° C.) or higher. Yes.

  Before the substrate transport carrier 130 (carrier body 122) is transported into the reflow device 28, the second tip crack 132b extends in a direction perpendicular to the substrate holding surface 36 (see (A)). Then, when the carrier body 122 is heated by the reflow device 28 with the temperature profile shown in FIG. 5 and the temperature becomes equal to or higher than the heating temperature Y2 (° C.), the second cracked portion 132b is substantially at the center of the carrier body 122. It is inclined and deformed in a direction away from the part (see (B)). Similarly, when the second cracked portion 132b passes through the reflow device 28 and is cooled to a temperature lower than the heating temperature Y2 (° C.), it is restored to a state perpendicular to the substrate holding surface 36.

  As shown in FIG. 32, similarly, the four corner portions of the printed circuit board 10 are similarly formed by inclining and deforming the second tip cracks 132 b of the positioning pins 132 inserted through the positioning holes 18 of the printed circuit board 10 in the tension applying direction. 14a can be pulled in the tensioning direction. Thereby, the effect similar to the effect demonstrated in the above-mentioned 1st Embodiment is acquired.

  When the positioning pin 34 is displaced as in the first to ninth embodiments described above, or the positioning pins 124 and 132 are inclined and deformed as in the tenth and eleventh embodiments described above, It is preferable to restrict the pin displacement direction and the tilt deformation direction to one direction.

  As shown in FIGS. 33 and 34, for example, the substrate transport carrier 70 (see FIG. 16) of the fifth embodiment described above, between the substrate holding surface 36 of the carrier body 72 and the printed circuit board 10, A guide plate 140 corresponding to the first guide plate (second guide plate) of the present invention is sandwiched. The guide plate 140 is formed with guide holes 142 through which the positioning pins 34 provided on the four corners 74 are inserted. Each guide hole 142 is formed in a long hole shape extending in a predetermined direction, for example, the gap direction between the four corner portions 74 and the support portion 76.

  Such a guide plate 140 is sandwiched and held between the board holding surface 36 and the printed board 10, so that the displacement direction of each positioning pin 34 is only in the gap direction between the four corners 74 and the support part 76. Can be regulated. Thereby, the four corners 14a of the printed circuit board 10 can be pulled in the tension applying direction more reliably.

  Also, as shown in FIG. 35, in the case of the substrate transport carrier 110 (see FIG. 28) of the above-described tenth embodiment in which the positioning pins 124 are inclined and deformed, similarly, the substrate holding surface 36 and the printed circuit board of the carrier body 122 are printed. 10, the above-described guide plate 140 is sandwiched and held, so that the tilt deformation direction of each positioning pin 124 can be restricted to one direction. Similarly, occurrence of thermal deformation such as warpage, swell, and twist of the printed circuit board 10 can be reliably prevented. Similarly, the four corners 14a of the printed circuit board 10 can be pulled more reliably in the tension applying direction.

  In the first to eleventh embodiments, the case where a flexible printed circuit board is used as the printed circuit board 10 has been described as an example. However, a rigid printed circuit board with a thin plate thickness is used instead of the flexible printed circuit board. The present invention can be similarly applied to the case where is used.

  Moreover, in the said 1st-11th embodiment, although the printed circuit board and the carrier main body are formed in the rectangular shape (rectangular shape), this invention is not limited to this, Both are made into arbitrary shapes. It may be formed. In this case, what is necessary is just to adjust the displacement direction and inclination deformation direction of a positioning pin according to the shape of a printed circuit board and a carrier main body.

  In the above embodiment, the positioning hole 18 is formed in a circular shape and the positioning pins 34 (124, 132) are formed in a cylindrical shape. However, the present invention is not limited to this, and the positioning hole 18 As long as the positioning pin 19 can be inserted into the shaft 18, both may be formed in an arbitrary shape.

  Further, in the above embodiment, the printed circuit board 10 is provided with two individual printed circuit boards 12, but the present invention is not limited to this, and the individual printed circuit board 12 may be provided with three or more sheets. .

It is an external appearance perspective view of the printed circuit board after electronic component mounting. It is the schematic of a mounting line. It is a perspective view of the board | substrate conveyance carrier of 1st Embodiment in the state in which the printed circuit board was set. It is a perspective view of the board | substrate conveyance carrier of 1st Embodiment of the state which isolate | separated the printed circuit board. It is the graph which showed an example of the temperature profile of the printed circuit board in a reflow apparatus. It is sectional drawing which follows the VI-VI line in FIG. 4, (A) is the state before a heating, (B) is the state heated at heating temperature Y1 (degreeC), (C) is the heating temperature Y2 (degreeC). It shows the state heated at. It is the perspective view which showed the state by which the four corners of the printed circuit board were pulled in the tension | tensile_strength provision direction by the thermal deformation of the carrier main body. It is a perspective view of the board | substrate conveyance carrier of 2nd Embodiment of the state which isolate | separated the printed circuit board. It is sectional drawing of the four corners of the board | substrate conveyance carrier of 2nd Embodiment, (A) is the state before a heating, (B) is the state heated by heating temperature Y1 (degreeC), (C) is heating temperature Y2. The state heated at (° C.) is shown. It is the perspective view which showed the state by which the four corners of the printed circuit board were pulled in the tension | tensile_strength provision direction by the thermal deformation of the four corners of a carrier main body. It is sectional drawing of the four corners of the board | substrate conveyance carrier of 3rd Embodiment, (A) is the state before a heating, (B) shows the state heated at heating temperature Y2 (degreeC) or more. It is the perspective view which showed the state by which the four corners of the printed circuit board were pulled in the tension | tensile_strength provision direction by the thermal deformation of the four corners of a carrier main body. It is a perspective view of the board | substrate conveyance carrier of 4th Embodiment of the state which isolate | separated the printed circuit board. It is sectional drawing of the four corners of the board | substrate conveyance carrier of 3rd Embodiment, (A) is the state before a heating, (B) shows the state heated at heating temperature Y2 (degreeC) or more. It is the perspective view which showed the state by which the four corners of the printed circuit board were pulled in the tension | tensile_strength provision direction by the thermal deformation of the four corners of a carrier main body. It is a perspective view of the board | substrate conveyance carrier of 5th Embodiment of the state which isolate | separated the printed circuit board. It is a front view of the connection member which connects the four corners of a carrier body, and a support part, (A) shows the state before a heating, and (B) shows the state heated at heating temperature Y2 (degreeC) or more. is there. It is the perspective view which showed the state by which the four corners of the printed circuit board were pulled in the tension | tensile_strength provision direction by the displacement of the four corners of a carrier main body. It is a front view of the connection member which connects the four corners of the board | substrate conveyance carrier of 6th Embodiment, and a support part, (A) is the state before a heating, (B) was heated by heating temperature Y1 (degreeC). The state, (C), shows the state heated at the heating temperature Y2 (° C.). It is a perspective view of the board | substrate conveyance carrier of 7th Embodiment of the state which isolate | separated the printed circuit board. It is a front view of the connection member which connects between the pin holding | maintenance parts of the carrier main body of the board | substrate conveyance carrier of 7th Embodiment, (A) is the state before a heating, (B) is heated by heating temperature Y2 (degreeC) or more. It shows the state that was done. It is the perspective view which showed the state by which the outer peripheral part of the printed circuit board was pulled in the tension | tensile_strength provision direction by the displacement of a pin holding | maintenance part. It is a front view of the connection member which connects between the pin holding | maintenance parts of the carrier main body of the board | substrate conveyance carrier of 8th Embodiment, (A) is the state before a heating, (B) is heated by heating temperature Y1 (degreeC). (C) shows the state heated at the heating temperature Y2 (° C.). It is a perspective view of the board | substrate conveyance carrier of 9th Embodiment of the state which isolate | separated the printed circuit board. It is a front view of the connection member which connects the four corners of the carrier main body of the board | substrate conveyance carrier of 9th Embodiment, and a division | segmentation support member. It is a front view of the connection member which connects between each division | segmentation support member of a carrier main body. It is the perspective view which showed the state by which the four corners of the printed circuit board were pulled in the tension | tensile_strength provision direction by the displacement of four corners and a division | segmentation support member. It is a perspective view of the board | substrate conveyance carrier of 10th Embodiment of the state which isolate | separated the printed circuit board. It is an enlarged view of the positioning pin of the board | substrate conveyance carrier of 10th Embodiment, (A) is the state before a heating, (B) is the state heated by heating temperature Y1 (degreeC), (C) is heating temperature Y2. The state heated at (° C.) is shown. It is the perspective view which showed the state by which the four corner parts of the printed circuit board were pulled in the tension | tensile_strength provision direction by the inclination deformation | transformation of the positioning pin. It is an enlarged view of the positioning pin of the board | substrate conveyance carrier of 11th Embodiment, (A) is the state before a heating, (B) shows the state heated at heating temperature Y2 (degreeC) or more. It is the perspective view which showed the state by which the four corners of the printed circuit board were pulled in the tension | tensile_strength provision direction by the inclination deformation | transformation of the tip part of a positioning pin. It is a perspective view of the guide plate of the state isolate | separated from the board | substrate conveyance carrier of 5th Embodiment. It is a top view of the guide plate of the state set to the board | substrate conveyance carrier of 5th Embodiment. It is a perspective view of the guide plate of the state set to the board | substrate conveyance carrier of 10th Embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Printed board 12 Individual board 14 Discarded board 14a Four corner part 16 Electronic component 18 Positioning hole 20 Mounting line 28 Reflow apparatus 30,40,50,60,70,80,90,100,110 Board | substrate conveyance carrier 32,42,52, 62, 72, 82, 92, 102, 112 Carrier body 32a, 32b Metal plate 32c, 46, 54, 64, 74, 84, 113 Four corners 34 Positioning pin 36 Substrate holding surface 48, 76, 86, 114 Supporting part 78 , 87, 98, 104, 116, 118 Connection member 92a Pin holding portion 114a Division support portion 120, 130 Substrate transport carrier 124, 132 Thermal deformation positioning pins 124a, 124b Metal member 140 Guide plate 142 Guide hole

Claims (23)

A printed circuit board holding surface for holding the printed circuit board; and holding the printed circuit board on the printed circuit board holding surface, the printed circuit board is heated and conveyed to a heating device for mounting electronic components on the printed circuit board. In the substrate transport carrier
A substrate comprising tension applying means for pulling an outer peripheral portion of the printed circuit board held on the substrate holding surface in a direction of applying a tension away from the center of the printed circuit board when heated by the heating device. Transport carrier. A plurality of positioning pins provided on the substrate holding surface, respectively inserted into a plurality of positioning holes formed on an outer peripheral portion of the printed circuit board, for positioning the printed circuit board on the substrate holding surface;
The substrate transport carrier according to claim 1, wherein the tension applying unit includes at least the positioning pin and displaces the positioning pin in the tension applying direction when heated by the heating device.   The tension applying means includes at least a bimetallic carrier body having a bimetallic structure formed by bonding a plurality of metal plates having the substrate holding surface and different linear expansion coefficients, and the positioning pin. One of the plurality of metal plates that form a large linear expansion coefficient is disposed on the substrate holding surface side, and when heated by the heating device, the bimetal carrier body thermally expands and the substrate holding surface The substrate transport carrier according to claim 2, wherein the substrate conveyance carrier is curved so that a substantially central portion is convex, and the positioning pin is displaced in the tension applying direction by the curvature of the bimetal body.   The tension holding means includes at least a carrier main body having the substrate holding surface and the positioning pins. The carrier main body includes a plurality of pin holding portions each provided with one positioning pin, and the pin holding. The pinless portion, which is a portion excluding the portion, is integrally provided, and the positioning pin is displaced by displacing the pin holding portion with respect to the pinless portion when heated by the heating device. The substrate transport carrier according to claim 2, wherein the substrate transport carrier is displaced in the tension applying direction.   The pin holding portion has a bimetal structure formed by bonding metal plates having different linear expansion coefficients, and is provided on the back surface opposite to the substrate holding surface due to thermal expansion when heated by the heating device. 5. The substrate transport carrier according to claim 4, wherein the substrate transport carrier is displaced with respect to the pinless portion by being deformed in a direction in which the substrate is directed.   The pin holding part is made of a shape memory alloy, and when the pin holding part is heated to a predetermined temperature or higher by the heating device, the pin holding part is deformed in a direction from the substrate holding surface toward the back side opposite to the pinless part. The substrate carrying carrier according to claim 4, wherein   The pin holding portion is cut away on the back side opposite to the substrate holding surface and is made thinner than the pinless portion, and warps in a direction toward the back side by heating of the heating device. The substrate carrying carrier according to claim 4. The tension applying means includes at least a carrier body having the substrate holding surface and the positioning pins.
The carrier body forms a part of the substrate holding surface and a plurality of pin holding portions each provided with one positioning pin, and a pin that forms the substrate holding surface at a portion excluding these pin holding portions A non-connecting portion is connected between the pin holding portion and the non-pin portion, and is extended by heating of the heating device, and the positioning pin is displaced together with the pin holding portion in the tension applying direction. The substrate transport carrier according to claim 2.   The substrate transport carrier according to claim 8, wherein the first connection member is made of a shape memory alloy and extends when heated to a predetermined temperature or higher by the heating device. The first connecting member is formed by connecting a first extending member made of a shape memory alloy and a second extending member having a bimetallic structure formed by bonding metal members having different linear expansion coefficients,
The first expansion member expands when heated to a predetermined temperature or higher by the heating device, and the second expansion member expands gradually in proportion to a temperature increase due to heating of the heating device. 9. The substrate transfer carrier according to claim 8, wherein   The carrier body has a rectangular outer shape matched to the printed circuit board, the pinless portion where the position matched to the four corner portions of the printed circuit board is cut out, and the four body portions formed according to the four corner portions. The substrate transport carrier according to claim 4, further comprising a pin holding portion. The tension applying means comprises the positioning pin and a carrier body having the substrate holding surface,
The carrier body connects a plurality of pin holding portions each provided with one positioning pin and the pin holding portions adjacent to each other, and is extended by heating from the heating device, and together with the pin holding portion, The substrate transport carrier according to claim 2, comprising a second connecting member that displaces the positioning pin in the tension applying direction.   13. The substrate transport carrier according to claim 12, wherein the second connection member is made of a shape memory alloy and extends when heated to a predetermined temperature or higher by the heating device.   The second connecting member has a bimetallic structure formed by bonding metal members having different linear expansion coefficients, and gradually expands substantially in proportion to a temperature rise due to heating of the heating device. The substrate carrying carrier according to claim 13. The tension applying means includes a carrier main body having the substrate holding surface and the positioning pins.
The carrier body forms a part of the substrate holding surface and has a plurality of pin holding portions each provided with one positioning pin, and the substrate holding surface is divided by a portion excluding these pin holding portions. A plurality of support members, a third connection member that connects between the pin holding portion and the support member, and extends by heating from the heating device, and the support members are connected to each other and heated from the heating device And a fourth connecting member extended by
3. The substrate transport carrier according to claim 2, wherein the positioning pin is displaced in the tension applying direction together with the pin holding portion by extension of the third connection member and the fourth connection member. One of the third and fourth connection members has a bimetal structure formed by bonding metal plates having different linear expansion coefficients, and the other is formed from a shape memory alloy,
The one side is extended gradually in proportion to a temperature rise due to heating of the heating device, and the other side is extended when heated to the predetermined temperature or more by the heating device. 15. The substrate transfer carrier according to 15.   The carrier body has a rectangular outer shape matching the printed circuit board, the support member cut out at positions corresponding to the four corner portions of the printed circuit board, and the pins formed according to the four corner portions. The substrate transport carrier according to claim 15, further comprising a holding portion.   The first guide plate is formed in a long hole shape through which the positioning pin is inserted and formed with a guide hole for guiding a displacement direction of the positioning pin when heated by the heating device. 18. The substrate transport carrier according to claim 2, wherein a board is sandwiched and held between the substrate holding surface and the printed board. A plurality of positioning holes are formed in the outer peripheral portion of the printed circuit board,
A plurality of the tension applying means are provided on the substrate holding surface, and are inserted through the positioning holes to position the printed circuit board on the substrate holding surface and at least one when heated by the heating device. 2. The substrate transport carrier according to claim 1, wherein the portion includes a heat deformation positioning pin that is deformed toward the tension applying direction.   The thermal deformation positioning pin is a bimetal structure formed by bonding columnar metal members having different linear expansion coefficients so that the metal member having a higher linear expansion coefficient faces the substantially central portion of the carrier body. The substrate transport carrier according to claim 19, wherein the substrate transport carrier gradually tilts and deforms in the tension applying direction substantially in proportion to a temperature rise due to heating of the heating device. The heat deformation positioning pin is cracked along a surface substantially perpendicular to a straight line passing through the heat deformation positioning pin and a substantially central portion of the carrier body,
A second tip crack portion opposite to the first tip crack portion on the side facing the substantially central portion of the carrier body of the heat deformation positioning pin is formed of a shape memory alloy;
The substrate transport carrier according to claim 19, wherein the second cracked portion is inclined and deformed in the tension applying direction when heated to the predetermined temperature or more by the heating device.   A second guide plate formed with a long hole shape through which the thermal deformation positioning pin is inserted and formed with a guide hole for guiding the deformation direction of the thermal deformation positioning pin when heated by the heating device; The substrate transport carrier according to any one of claims 19 to 21, wherein the second guide plate is sandwiched and held between the substrate holding surface and the printed board.   23. The substrate transport according to claim 1, wherein the printed circuit board is a collective printed circuit board in which a plurality of individual printed circuit boards are provided, and an outer peripheral portion of the printed circuit board is a discarded board. Career.

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