JP2007266196A - Multilayer printed-wiring board and manufacturing method thereof - Google Patents

Multilayer printed-wiring board and manufacturing method thereof Download PDF

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JP2007266196A
JP2007266196A JP2006087566A JP2006087566A JP2007266196A JP 2007266196 A JP2007266196 A JP 2007266196A JP 2006087566 A JP2006087566 A JP 2006087566A JP 2006087566 A JP2006087566 A JP 2006087566A JP 2007266196 A JP2007266196 A JP 2007266196A
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wiring board
cavity
printed wiring
multilayer printed
side wall
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JP4935139B2 (en
Inventor
Takahiro Sawara
隆広 佐原
Atsushi Kobayashi
厚志 小林
Shinsahiko Igaue
真左彦 伊賀上
Kiyoshi Takeuchi
清 竹内
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Dai Nippon Printing Co Ltd
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Dai Nippon Printing Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19102—Disposition of discrete passive components in a stacked assembly with the semiconductor or solid state device
    • H01L2924/19103—Disposition of discrete passive components in a stacked assembly with the semiconductor or solid state device interposed between the semiconductor or solid-state device and the die mounting substrate, i.e. chip-on-passive

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  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a multilayer printed-wiring board that has a cavity having an opening for embedding electronic components and prevents the inclination of an area near a sidewall on the side of the cavity, and to provide a manufacturing method of the multilayer printed-wiring board. <P>SOLUTION: In the multilayer printed-wiring board 100, an upper printed-wiring board 10 with a through-hole that serves as a cavity 1 for packaging electronic components and a lower printed-wiring board 20 for constituting the bottom surface of cavities are laminated and integrated via a prepreg 7. An insulating support film, made of solder resist 8, is arranged near the sidewall of the bottom surface of the cavity 1 in the lower printed-wiring board 20, by interposing its portion at the lower side of the upper printed-wiring board. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、多層プリント配線板及びその製造方法に関し、特に、半導体装置その他の電子部品を実装するためのキャビティ（窪み、凹部）を有する多層プリント配線板及びその製造方法に関する。   The present invention relates to a multilayer printed wiring board and a method for manufacturing the same, and more particularly to a multilayer printed wiring board having a cavity (depression, recess) for mounting a semiconductor device and other electronic components and a method for manufacturing the same.

各種電子機器の小型化、薄型化、軽量化、高機能化、複合化などの多様な要求に応えるため、複数種類の機器で共通に使われるような機能をまとめた電子部品実装済みの多層プリント配線板をモジュール基板として提供することが行われている。また、電子部品を実装する前の段階の多層プリント配線板をモジュール基板として提供することも行われている。   Multi-layer prints with electronic components mounted that combine functions commonly used in multiple types of devices in order to meet various requirements such as miniaturization, thinning, weight reduction, high functionality, and compounding of various electronic devices Providing a wiring board as a module substrate has been performed. In addition, a multilayer printed wiring board at a stage before mounting electronic components is provided as a module substrate.

このようなモジュール基板としての多層プリント配線板には、さらなる小型化、薄型化、高密度化が求められている。そのような要求に応えるために半導体装置その他の電子部品を埋め込むための窪み（キャビティ）を有するリジッド多層プリント配線板を用いて製造することが提案されている（例えば特許文献１）。   Multilayer printed wiring boards as such module boards are required to be further reduced in size, thickness, and density. In order to meet such requirements, it has been proposed to manufacture using a rigid multilayer printed wiring board having a recess (cavity) for embedding a semiconductor device or other electronic components (for example, Patent Document 1).

キャビティを有するリジッド多層プリント配線板は、例えば、次のように製造される。すなわち、埋め込む電子部品用の回路を有する下側プリント配線板と、この電子部品を埋め込むための所望の大きさの窓をあけた上側プリント配線板とを、絶縁性接着シートを介して積層一体化し、各配線層を導体バンプやスルーホール等の層間接続導体により導通させて、キャビティ付きリジッド多層プリント配線板とする。これにより、窓をあけた部分が、電子部品を埋め込むためのキャビティとなる。   A rigid multilayer printed wiring board having a cavity is manufactured, for example, as follows. That is, a lower printed wiring board having a circuit for an embedded electronic component and an upper printed wiring board having a window of a desired size for embedding the electronic component are laminated and integrated through an insulating adhesive sheet. Each wiring layer is made conductive by an interlayer connection conductor such as a conductor bump or a through hole to obtain a rigid multilayer printed wiring board with a cavity. Thereby, the part which opened the window becomes a cavity for embedding an electronic component.

このようにして製造されたキャビティ付き多層プリント配線板のキャビティには、後に、電子部品が実装され、必要に応じて樹脂封止されるなどして、モジュール基板又は最終的に機器に配設される構成の多層プリント配線板となる。   In the cavity of the multilayer printed wiring board with cavities manufactured in this way, electronic components are later mounted and resin-sealed as necessary, so that they are disposed on the module substrate or finally on the equipment. A multilayer printed wiring board having a configuration as described above.

一方、硬質性と柔軟性を併せ持つ多層プリント配線板の一例として、フレキシブル配線板の片面に未硬化のプリプレグを介して２つの多層リジッド配線板をそれぞれ離間させて積層し、加熱加圧して一体化して、リジッド配線板の導体パターンとフレキシブル配線板の導体パターンとを導体バンプなどの層間接続導体により導通させたリジッド−フレキシブル配線板が提案されている（例えば特許文献２）。
特開２００５−０７０８５５号公報 特開２００５−３２２８７８号公報（特に段落００８２〜００８４、図３３〜３６） On the other hand, as an example of a multilayer printed wiring board having both rigidity and flexibility, two multilayer rigid wiring boards are laminated on one side of the flexible wiring board with uncured prepregs separated from each other and integrated by heating and pressing. There has been proposed a rigid-flexible wiring board in which a conductive pattern of a rigid wiring board and a conductive pattern of a flexible wiring board are made conductive by an interlayer connection conductor such as a conductor bump (for example, Patent Document 2).
JP-A-2005-070855 JP-A-2005-322878 (especially paragraphs 0082 to 0084, FIGS. 33 to 36)

ところが、キャビティとなる窓を設けた上側プリント配線板とキャビティ底部となる下側プリント配線板とを未硬化のプリプレグを介して積層して加熱加圧した際に、その圧力により、図２３に示すように、キャビティ９０１の側壁底部近傍において、このプリプレグ９２７が上側プリント配線板９１０と共に押しつぶされて傾斜し、上側プリント配線板９１０の上面の平坦性が失われるという問題があった。また、このプリプレグ９２７を介して対向する配線層９１２と配線層９２２とがキャビティ側壁底部近傍において押しつぶされて絶縁性が低下したり、極端な場合は短絡することがあるという問題もあった。このような傾斜の問題はキャビティ側壁部から通常０．５ｍｍの範囲、配線板の材質が柔らかい場合は側壁から１ｍｍ程度の範囲に及ぶ場合がある。これらの問題は、特に、上側プリント配線板としてのリジッド配線板を薄くした場合に、キャビティ側壁部近傍において顕著であった。   However, when an upper printed wiring board provided with a window serving as a cavity and a lower printed wiring board serving as a cavity bottom are laminated through an uncured prepreg and heated and pressed, the pressure is shown in FIG. Thus, in the vicinity of the bottom of the side wall of the cavity 901, the prepreg 927 is crushed and inclined together with the upper printed wiring board 910, and the flatness of the upper surface of the upper printed wiring board 910 is lost. Further, the wiring layer 912 and the wiring layer 922 facing each other through the prepreg 927 are crushed in the vicinity of the bottom of the cavity side wall, resulting in a problem that insulation is lowered or, in an extreme case, a short circuit may occur. Such a tilting problem may usually be in the range of 0.5 mm from the side wall of the cavity, and may be in the range of about 1 mm from the side wall when the material of the wiring board is soft. These problems are particularly prominent in the vicinity of the cavity side wall when the rigid wiring board as the upper printed wiring board is thinned.

そこで、本発明は、かかる問題を解決するためになされたもので、キャビティ側壁部近傍の傾斜を防止したキャビティを有する多層プリント配線板及びその製造方法を提供することを目的とする。   Accordingly, the present invention has been made to solve such a problem, and an object of the present invention is to provide a multilayer printed wiring board having a cavity in which the inclination in the vicinity of the cavity side wall is prevented and a method for manufacturing the same.

上記目的を達成するために、本発明に係る多層プリント配線板は、電子部品実装用のキャビティとなる貫通穴をあけた上側プリント配線板と前記キャビティ底面を構成する下側プリント配線板とをプリプレグを介して積層一体化させた多層プリント配線板であって、前記下側プリント配線板の前記キャビティ底部を構成する面のキャビティ側壁部近傍に、前記上側プリント配線板の下側に介在させて絶縁性の支持膜を配設したことを特徴とする。   In order to achieve the above object, a multilayer printed wiring board according to the present invention comprises a prepreg comprising an upper printed wiring board having a through hole serving as a cavity for mounting an electronic component and a lower printed wiring board constituting the bottom surface of the cavity. A multilayer printed wiring board laminated and integrated via an insulating layer interposed between the lower printed wiring board and the cavity side wall portion of the surface constituting the cavity bottom, and interposed below the upper printed wiring board. A characteristic support membrane is provided.

さらに、前記絶縁性の支持膜を、前記上側プリント配線板の下側から前記キャビティ側壁部を越えてキャビティ内側まで配設することが好ましい。   Furthermore, it is preferable that the insulating support film is disposed from the lower side of the upper printed wiring board to the cavity inside beyond the cavity side wall.

ここで、電子部品実装用のキャビティとは、その内部に半導体装置やチップ部品などの電子部品を実装するために必要な大きさの開口部と底面と内側壁面とを有した凹部である。キャビティ内部に電子部品を実装するためには、キャビティ底面に電子部品を載置する必要があるほか、電子部品の電極端子と接続される実装用端子が必要である。実装用端子は必ずしもキャビティ底面に設ける必要はなく、多層プリント配線板の最上層のキャビティ側壁近傍など、電子部品の電極と接続可能な位置に設けられていればよい。   Here, the electronic component mounting cavity is a recess having an opening, a bottom surface, and an inner wall surface of a size necessary for mounting an electronic component such as a semiconductor device or a chip component therein. In order to mount an electronic component inside the cavity, it is necessary to place the electronic component on the bottom surface of the cavity, and a mounting terminal connected to the electrode terminal of the electronic component. The mounting terminal is not necessarily provided on the bottom surface of the cavity, and may be provided at a position where it can be connected to the electrode of the electronic component, such as near the cavity side wall of the uppermost layer of the multilayer printed wiring board.

キャビティ底部を構成する面のキャビティ側壁部近傍に、上側プリント配線板の下側に介在させて絶縁性の支持膜を配設することで、その上側に積層されているプリプレグ及び上側プリント配線板を支持することができる。これにより、キャビティ底面のキャビティ側壁近傍での配線層の傾斜を防止することができ、また、上側プリント配線板の上面のキャビティ側壁上端部近傍での平坦性を確保できる。   By disposing an insulating support film on the lower side of the upper printed wiring board in the vicinity of the cavity side wall of the surface constituting the cavity bottom, the prepreg and the upper printed wiring board stacked on the upper side are arranged. Can be supported. Thereby, the inclination of the wiring layer in the vicinity of the cavity side wall on the bottom surface of the cavity can be prevented, and the flatness in the vicinity of the upper end portion of the cavity side wall on the upper surface of the upper printed wiring board can be secured.

さらに、前記絶縁性の支持膜を、前記上側プリント配線基板の下側から前記キャビティ側壁部を越えてキャビティ内側まで配設することで、上側プリント配線板と下側プリント配線板とを絶縁性接着シートを介して積層一体化する際に、上下のプリント配線板の位置にずれが生じた場合でも、上側プリント配線板の配線層もしくは上面がキャビティ側壁近傍で傾斜するのを防止する本発明の効果をより確実に奏することができる。   Further, the insulating support film is disposed from the lower side of the upper printed wiring board to the inside of the cavity beyond the cavity side wall, thereby insulatingly bonding the upper printed wiring board and the lower printed wiring board. The effect of the present invention to prevent the wiring layer or the upper surface of the upper printed wiring board from being inclined near the cavity side wall even when the positions of the upper and lower printed wiring boards are displaced when stacking and integrating via the sheet Can be played more reliably.

この絶縁性の支持膜は、例えば、ソルダーレジスト又はフォトレジストで構成するとよい。特別の材料や工程を必要とせずに、容易に絶縁性の支持膜を形成することができる。ソルダーレジスト又はフォトレジストは絶縁性であるから、配線パターン間の絶縁性を高め、短絡を防止するという点でも好ましい。   This insulating support film may be made of, for example, a solder resist or a photoresist. An insulating support film can be easily formed without requiring any special material or process. Since the solder resist or the photoresist is insulative, it is also preferable in terms of enhancing the insulation between the wiring patterns and preventing short circuit.

この絶縁性の支持膜は、前記上側プリント配線板の下側に介在させた部分よりもキャビティ内側の部分を高くさせて形成するとよい。例えば、キャビティ底面の側壁近傍にダミー配線パターンを形成し、そのダミー配線パターン上に一部分を重ねて絶縁性の支持膜を形成することで、絶縁性の支持膜のキャビティ内側部分を高くすることができる。   The insulating support film may be formed by making a portion inside the cavity higher than a portion interposed below the upper printed wiring board. For example, by forming a dummy wiring pattern in the vicinity of the side wall of the bottom surface of the cavity and forming an insulating support film by overlapping a part on the dummy wiring pattern, the cavity inner portion of the insulating support film can be raised. it can.

また、この絶縁性の支持膜に代えて、下側プリント配線板のキャビティ側壁底部近傍に支持部材を突設して前記プリプレグに貫挿させてもよい。この突設した支持部材は、例えば導体バンプなど導電性組成物の固化物で構成してもよい。   Further, instead of the insulating support film, a support member may be provided in the vicinity of the bottom of the cavity side wall of the lower printed wiring board so as to be inserted into the prepreg. The protruding support member may be formed of a solidified conductive composition such as a conductor bump.

本発明によれば、キャビティ側壁部近傍の傾斜を防止したキャビティを有する多層プリント配線板及びその製造方法を提供することができる。   ADVANTAGE OF THE INVENTION According to this invention, the multilayer printed wiring board which has the cavity which prevented the inclination of the cavity side wall part vicinity, and its manufacturing method can be provided.

以下、図面を参照して本発明の実施形態を詳細に説明する。以下、原則として、同じものには同じ符号を付し、説明を省略する。なお、本発明の実施形態を図面に基づいて記述するが、それらの図面は図解のために提供されるものであり、本発明はそれらの図面に限定されるものではない。   Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Hereinafter, in principle, the same components are denoted by the same reference numerals, and description thereof is omitted. Although embodiments of the present invention are described based on the drawings, the drawings are provided for illustration, and the present invention is not limited to the drawings.

図１は、本発明の実施形態に係るキャビティ付き多層プリント配線板１００のキャビティ開口部側から見た平面図である。図２は、図１のＡ−Ａ線に沿った垂直断面を、幅方向に比べて厚さ方向を強調して、模式的に示した断面図である。図２において、図面右下に示す２本の波線は、この波線の間の部分が省略されていることを示している。   FIG. 1 is a plan view of a multilayer printed wiring board 100 with a cavity according to an embodiment of the present invention as viewed from the cavity opening side. FIG. 2 is a cross-sectional view schematically showing a vertical cross section along the line AA in FIG. 1 with an emphasis on the thickness direction compared to the width direction. In FIG. 2, two wavy lines shown in the lower right of the drawing indicate that a portion between the wavy lines is omitted.

図１及び図２に示すように、この多層プリント配線板１００は、その内部にＩＣチップやセンサなどの所望の電子部品を実装するための開口部を有するキャビティ１を備えている。このキャビティ１は、その内部に所望の電子部品を所望の向きで載置し埋め込める大きさ及び深さとされている。キャビティ１の底面には、キャビティ内部に載置される電子部品を電気的に接続するための実装用端子２が露出している。キャビティ１の底面の実装用端子２が露出しない部分は、ソルダーレジスト等の保護膜８で被覆されている。   As shown in FIGS. 1 and 2, the multilayer printed wiring board 100 includes a cavity 1 having an opening for mounting a desired electronic component such as an IC chip or a sensor therein. The cavity 1 has such a size and depth that a desired electronic component can be placed and embedded in the cavity 1 in a desired direction. A mounting terminal 2 for electrically connecting an electronic component placed inside the cavity is exposed at the bottom surface of the cavity 1. A portion of the bottom surface of the cavity 1 where the mounting terminal 2 is not exposed is covered with a protective film 8 such as a solder resist.

図１及び図２に示すように、この多層プリント配線板１００は、導体パターンが形成された例えば６層の配線層を有している。各配線層１２、２２、３２は、それぞれ層間接続導体１３、２３、３３により導通されている。多層プリント配線板１００の最外層は、配線層１２を構成する導体パターンの一部が後に種々の電子部品などを実装するための実装用端子３として露出され、その他の部分は、ソルダーレジスト等の保護膜８で被覆されている。   As shown in FIGS. 1 and 2, the multilayer printed wiring board 100 has, for example, six wiring layers on which conductor patterns are formed. The wiring layers 12, 22, and 32 are electrically connected by interlayer connection conductors 13, 23, and 33, respectively. In the outermost layer of the multilayer printed wiring board 100, a part of the conductor pattern constituting the wiring layer 12 is exposed as a mounting terminal 3 for mounting various electronic components and the like, and the other part is made of a solder resist or the like. It is covered with a protective film 8.

なお、上記したキャビティ１底部に露出した実装用端子２や最外層に露出した実装用端子３などを含む導体パターンの構成は、任意であり、図示したものに限られないことはもちろんである。また、配線層は６層である必要はなく何層であってもよいが、小型化、高密度化の要請から３層以上とされる。   Note that the configuration of the conductor pattern including the mounting terminal 2 exposed at the bottom of the cavity 1 and the mounting terminal 3 exposed at the outermost layer is arbitrary and is not limited to the illustrated one. Further, the wiring layers need not be six layers and may be any number of layers. However, the number of layers is three or more because of demands for miniaturization and high density.

キャビティ内部に電子部品を実装するには、その電子部品の電極と電気的に接続するための実装用端子が必要となる。その実装用端子は、図１及び図２に示す符号２のようにキャビティ底面に設けられていることが好ましいが、キャビティ底面である必要はなく、多層プリント配線板の最上層のキャビティ開口部の周縁部など、電子部品の電極と接続可能な箇所に設けられていればよい。   In order to mount an electronic component inside the cavity, a mounting terminal for electrical connection with the electrode of the electronic component is required. The mounting terminals are preferably provided on the bottom surface of the cavity as indicated by reference numeral 2 shown in FIGS. 1 and 2, but need not be the bottom surface of the cavity. It should just be provided in the location which can be connected with the electrode of electronic components, such as a peripheral part.

この多層プリント配線板１００の上側プリント配線板の部分は、図１及び図２に示すように、キャビティ１となる開口部を設けた４層リジッド配線板１０及びそれと離間して配設された開口部を設けていない小面積の４層リジッド配線板３０とで構成されている。この多層プリント配線板１００の下側プリント配線板の部分は、全面的に、両面フレキシブル配線板２０で構成されている。リジッド配線板１０とリジッド配線板３０とは、両面フレキシブル配線板２０に形成された導体パターン２２より電気的に接続されている。なお、この例ではリジッド配線板３０はリジッド配線板１０に比べて小面積であるが、リジッド配線板３０はリジッド配線板１０と同程度の面積であってもよく、リジッド配線板３０にもキャビティとなる貫通穴があけられていてもよいことはもちろんである。   As shown in FIGS. 1 and 2, the upper printed wiring board portion of the multilayer printed wiring board 100 includes a four-layer rigid wiring board 10 provided with an opening serving as a cavity 1 and an opening spaced apart from the four-layer rigid wiring board 10. It is comprised with the 4-layer rigid wiring board 30 of the small area which does not provide the part. The lower printed wiring board portion of the multilayer printed wiring board 100 is entirely composed of a double-sided flexible wiring board 20. The rigid wiring board 10 and the rigid wiring board 30 are electrically connected by a conductor pattern 22 formed on the double-sided flexible wiring board 20. In this example, the rigid wiring board 30 has a smaller area than the rigid wiring board 10, but the rigid wiring board 30 may have the same area as the rigid wiring board 10, and the rigid wiring board 30 has a cavity. Of course, a through hole may be formed.

リジッド配線板１０の層間絶縁層１１、及び、リジッド配線板３０の層間絶縁層３１は、硬質な（リジッドな）絶縁層であり、例えば、ガラス繊維、アラミド繊維などの有機繊維の不織布、紙等の基材に、未硬化のエポキシ樹脂、ポリイミド樹脂、ビスマレイミド系樹脂、フェノール系樹脂等を含浸させたプリプレグ（例えばガラス―エポキシ系プリプレグ）を積層しガラス転移温度以上に加熱加圧して硬化させたものである。   The interlayer insulating layer 11 of the rigid wiring board 10 and the interlayer insulating layer 31 of the rigid wiring board 30 are hard (rigid) insulating layers, for example, non-woven fabric of organic fibers such as glass fiber and aramid fiber, paper, and the like A prepreg impregnated with an uncured epoxy resin, polyimide resin, bismaleimide resin, phenol resin, etc. (eg glass-epoxy prepreg) is laminated on the base material and cured by heating and pressurizing to a temperature higher than the glass transition temperature. It is a thing.

フレキシブル配線板２０の層間絶縁層２１は、可撓性を有する柔軟な（フレキシブルな）絶縁層であり、例えば、液晶ポリマー、ポリイミド樹脂、ガラス布を基材としながら硬化後も柔軟性を有するプリプレグなどで構成される。   The interlayer insulating layer 21 of the flexible wiring board 20 is a flexible (flexible) insulating layer having flexibility, for example, a prepreg having flexibility even after curing while using a liquid crystal polymer, polyimide resin, or glass cloth as a base material. Etc.

上側プリント配線板であるリジッド配線板１０及びリジッド配線板３０と、下側プリント配線板であるフレキシブル配線板２０とは、絶縁層７を介して積層され加熱加圧により一体化されている。フレキシブル配線板２０のリジッド配線板１０と接続する側の配線層２２の一部である接続ランド５と、リジッド配線板１０のフレキシブル配線板２０と接続する側の配線層１２の一部である接続ランド４との間は、層間接続導体６により導通されている。この層間接続導体６は、例えば、フレキシブル基板側の接続ランド５上に導電性ペーストをスクリーン印刷することにより形成された導体バンプを、その先端を絶縁層７となる未硬化のプリプレグに貫挿させ対向する接続ランド４に当接させて塑性変形して固化したものである。   The rigid wiring board 10 and the rigid wiring board 30 that are the upper printed wiring boards and the flexible wiring board 20 that is the lower printed wiring board are stacked via the insulating layer 7 and integrated by heating and pressing. The connection land 5 which is a part of the wiring layer 22 on the side of the flexible wiring board 20 connected to the rigid wiring board 10 and the connection land which is a part of the wiring layer 12 of the rigid wiring board 10 on the side connected to the flexible wiring board 20. The land 4 is electrically connected by an interlayer connection conductor 6. The interlayer connection conductor 6 is formed by, for example, inserting a conductor bump formed by screen-printing a conductive paste on the connection land 5 on the flexible substrate side into an uncured prepreg serving as an insulating layer 7. It is made to abut against the opposing connection land 4 and is plastically deformed and solidified.

このように、この多層プリント配線板１００は、ＩＣチップやセンサその他の電子部品を実装するための凹部であるキャビティ１を具備し、併せて、硬質性と柔軟性を兼ね備えた基板でもある。また、この多層プリント配線板１００は、スルーホールを用いていないから、高密度化が容易であり、製造工程も簡略化できる。   As described above, the multilayer printed wiring board 100 includes the cavity 1 that is a recess for mounting an IC chip, a sensor, and other electronic components, and is also a substrate having both rigidity and flexibility. Moreover, since this multilayer printed wiring board 100 does not use through holes, it is easy to increase the density and the manufacturing process can be simplified.

また、多層プリント配線板１００の一方の面側（図面下側）は、全面的にフレキシブル配線板２０で被覆されているため、フレキシブル配線板側の最外層に形成された導体パターン２２（実装用端子３）とソルダーレジスト（保護膜）８との厚みの違いはあるものの、実質的に平坦である。したがって、リジッド配線板１０の片面に部分的にフレキシブル配線板２０が積層された場合や、フレキシブル配線板の両面にリジッド配線板が積層された場合など、多層プリント配線板の両面が実質的に平坦でない場合に比べて、フレキシブル配線板とリジッド配線板との積層一体化が容易である。また、後に最外層の面に電子部品を実装する際も、多層プリント配線板１００の下面側が実質的に平坦であるから、平坦でない場合に比べて実装が容易になる。   Further, since one surface side (the lower side in the drawing) of the multilayer printed wiring board 100 is entirely covered with the flexible wiring board 20, the conductor pattern 22 (for mounting) formed on the outermost layer on the flexible wiring board side is provided. Although there is a difference in thickness between the terminal 3) and the solder resist (protective film) 8, it is substantially flat. Accordingly, both sides of the multilayer printed wiring board are substantially flat, for example, when the flexible wiring board 20 is partially laminated on one side of the rigid wiring board 10 or when the rigid wiring board is laminated on both sides of the flexible wiring board. Compared with the case where it is not, lamination | stacking integration of a flexible wiring board and a rigid wiring board is easy. Further, when the electronic component is mounted on the outermost layer later, the lower surface side of the multilayer printed wiring board 100 is substantially flat, so that the mounting is easier than when it is not flat.

ここで、図１のキャビティ１の周囲に点線で示すように、キャビティ１の底面を被覆している保護膜としてのソルダーレジスト８は、その一部をキャビティ１側壁下部に重なるように配設されている。このソルダーレジスト８は、キャビティ１底面を保護する保護膜としての役割を有するとともに、側壁部の傾斜を防止する絶縁性の支持膜でもある。   Here, as shown by a dotted line around the cavity 1 in FIG. 1, the solder resist 8 as a protective film covering the bottom surface of the cavity 1 is disposed so that a part thereof overlaps the lower part of the side wall of the cavity 1. ing. The solder resist 8 serves as a protective film that protects the bottom surface of the cavity 1 and is also an insulating support film that prevents the side wall portion from being inclined.

図３〜図８は、このキャビティ１側壁底部近傍の実施形態の複数の具体例を説明するための図である。図３〜図８は、図１のＢ線で囲んだ領域を、キャビティ１側壁の垂直断面に沿って、キャビティ１外側を図面左側に、キャビティ１内側を図面右側にして、その断面を模式的に示している。   3-8 is a figure for demonstrating the several specific example of embodiment of this cavity 1 side wall vicinity vicinity. FIGS. 3 to 8 schematically show the section surrounded by line B in FIG. 1 along the vertical cross section of the cavity 1 side wall, with the cavity 1 outside on the left side of the drawing and the cavity 1 inside on the right side of the drawing. It shows.

図３〜図８において、符号１０は、リジッドな絶縁層１１と導体パターンからなる配線層１２とが交互に積層され導通されたリジッド配線板であり、キャビティ１及びその側壁を構成している上側プリント配線板でもある。符号２０は、フレキシブルな絶縁層２１と導体パターンからなる配線層２２を具備したフレキシブル配線板であり、キャビティ１底部を構成している下側プリント配線板でもある。図３〜図８において、キャビティ１側壁の導体パターンや層間接続部等の細部は図示を省略して模式的に示しており、実際には、導体パターンが側壁端面まで連続しているとは限らない。   3 to 8, reference numeral 10 denotes a rigid wiring board in which a rigid insulating layer 11 and a wiring layer 12 made of a conductor pattern are alternately laminated and are electrically connected, and the upper side constituting the cavity 1 and its side wall. It is also a printed wiring board. Reference numeral 20 denotes a flexible wiring board having a flexible insulating layer 21 and a wiring layer 22 composed of a conductor pattern, and is also a lower printed wiring board constituting the bottom of the cavity 1. 3 to 8, the details of the conductor pattern and the interlayer connection portion on the side wall of the cavity 1 are schematically shown without illustration, and the conductor pattern is not always continuous to the end face of the side wall. Absent.

図３〜図６に示すように、下側プリント配線板２０のキャビティ１底面の側壁から１ｍｍの近傍で、その一部を上側プリント配線板１０の下側に介在させて、絶縁性の支持膜６８を配設するとよい。そうすることで、図１０に示すようなキャビティ１となる貫通穴１４を設けた上側プリント配線板１０と、下側プリント配線板２０とをプリプレグ２７を介して積層して加熱加圧した際に、図２３に示すようなリジッド配線板１０のキャビティ側壁近傍の下側に積層されたプリプレグ２７が押しつぶされて、リジッド配線板１０のキャビティ側壁近傍部分が傾斜してしまうのを防止することができる。   As shown in FIGS. 3 to 6, an insulating support film is interposed between a part of the lower printed wiring board 20 and the lower side of the upper printed wiring board 10 in the vicinity of 1 mm from the side wall of the bottom surface of the cavity 1. 68 may be disposed. By doing so, when the upper printed wiring board 10 provided with the through hole 14 that becomes the cavity 1 as shown in FIG. 10 and the lower printed wiring board 20 are laminated via the prepreg 27 and heated and pressed. 23, it is possible to prevent the prepreg 27 stacked below the cavity side wall of the rigid wiring board 10 as shown in FIG. 23 from being crushed and tilting the vicinity of the cavity side wall of the rigid wiring board 10. .

絶縁性の支持膜６８としては、ソルダーレジストを用いることができる。一般に、プリント配線板の最外層となる実装面には、部分的にソルダーレジスト等の保護膜８を配設する。本発明においては、下側プリント配線板となるフレキシブル配線板２０の、キャビティ１側壁の下部となる位置の近傍に、リジッド配線板１０の下側に重なる領域とキャビティ１底面として露出する領域とに跨るように、絶縁性の支持膜６８としてのソルダーレジストを配設しておくとよい。そうすることで、製造工程を増やさずに絶縁性の支持膜６８を配設することができ、キャビティ側壁近傍部分の傾斜を防止することもできるという効果が得られる。ソルダーレジスト８のかわりに、フレキシブル配線板２０の製造工程において通常用いるフォトレジスト（図示せず）を用いてもよい。   As the insulating support film 68, a solder resist can be used. In general, a protective film 8 such as a solder resist is partially disposed on the mounting surface that is the outermost layer of the printed wiring board. In the present invention, a flexible printed circuit board 20 serving as a lower printed circuit board has a region that overlaps the lower side of the rigid circuit board 10 and a region that is exposed as the bottom surface of the cavity 1 in the vicinity of the position that is the lower part of the side wall of the cavity 1. A solder resist as the insulating support film 68 may be disposed so as to straddle. By doing so, the insulating support film 68 can be disposed without increasing the number of manufacturing steps, and the effect of preventing the inclination of the portion near the cavity side wall can be obtained. Instead of the solder resist 8, a photoresist (not shown) that is usually used in the manufacturing process of the flexible wiring board 20 may be used.

絶縁性の支持膜６８は、図３に示すように上側プリント配線板と下側プリント配線板とが積層されている部分にのみ介在して配設されていればよいが、図４に示すように、キャビティ１の底面に配設される保護膜８としてのソルダーレジストと連続して配設してもよく、図５に示すように、キャビティ１の底面に配設される保護膜８としてのソルダーレジストと離間させて（間隙部９を設けて）配設してもよい。こうすることで、その上側に積層されているプリプレグ２７及び上側プリント配線板１０を支持することができるので、キャビティ１底面の側壁近傍の配線層１２の傾斜を防止することができ、上側プリント配線板１０の上面の平坦性を確保できる。   As shown in FIG. 4, the insulating support film 68 may be disposed only in the portion where the upper printed wiring board and the lower printed wiring board are laminated as shown in FIG. Further, it may be disposed continuously with the solder resist as the protective film 8 disposed on the bottom surface of the cavity 1, and as shown in FIG. 5, as the protective film 8 disposed on the bottom surface of the cavity 1. You may arrange | position apart from a soldering resist (providing the gap | interval part 9). By doing so, the prepreg 27 and the upper printed wiring board 10 laminated on the upper side can be supported, so that the inclination of the wiring layer 12 near the side wall of the bottom surface of the cavity 1 can be prevented, and the upper printed wiring The flatness of the upper surface of the plate 10 can be ensured.

図５に示すように、キャビティ１の底面に配設される保護膜８としてのソルダーレジストと離間させて間隙部９を設けて配設した場合は、上下のプリント配線板を積層するために加熱加圧した際に、プリプレグ２７の含浸樹脂がキャビティ１内側に浸出するのを前記間隙部９でせき止める作用を奏することができる。   As shown in FIG. 5, when the gap portion 9 is provided apart from the solder resist as the protective film 8 provided on the bottom surface of the cavity 1, heating is performed to stack the upper and lower printed wiring boards. When the pressure is applied, the gap portion 9 can prevent the impregnating resin of the prepreg 27 from leaching inside the cavity 1.

図６に示すように、絶縁性の支持膜６８を、上側プリント配線板１０の下側に介在させた部分よりもキャビティ１の内側の部分を高くさせて配設してもよい。そうすることで、上下のプリント配線板を積層一体化するために加熱加圧した際に、プリプレグ２７の含浸樹脂がキャビティ１内側に浸出するのをより確実にせき止めることができ、側壁部の傾斜を防止できる。さらに、絶縁性の支持膜６８のキャビティ内側のほうの端部と、その内側に配設するソルダーレジスト等の保護膜８との間には、間隙部（ソルダーレジストも導体パターンも設けず、下側プリント配線板２０の絶縁層２１が露出した部分、又は、導体パターンのみが形成されて絶縁性の支持膜６８より低くなった部分）９を僅かに設けておくとよい。絶縁性の支持膜６８のキャビティ１内側の部分を高くさせて配設するには、図６に示すように、絶縁性の支持膜６８の下部にダミー導体パターン６９を形成するとよい。すなわち、予め、フレキシブル配線板２０の最外層に導体パターンを形成する際に、キャビティ底面の側壁近傍となる位置に、ダミー導体パターン６９を設けておくとよい。そして、その上に、ソルダーレジストにより絶縁性の支持膜６８を配設するとよい。そうすることで、製造工程を増やすことなく、キャビティ１側壁近傍の傾斜を防止することができると共にキャビティ１内側に浸出する樹脂量を抑えることができる。   As shown in FIG. 6, the insulating support film 68 may be disposed such that the portion inside the cavity 1 is higher than the portion interposed below the upper printed wiring board 10. By doing so, it is possible to more reliably prevent the impregnating resin of the prepreg 27 from leaching into the cavity 1 when heated and pressed to integrate the upper and lower printed wiring boards, and the inclination of the side wall portion. Can be prevented. Further, there is a gap between the end of the insulating support film 68 on the inner side of the cavity and the protective film 8 such as a solder resist disposed on the inner side of the insulating support film 68. It is preferable to provide a slight portion 9 of the side printed wiring board 20 where the insulating layer 21 is exposed or a portion where only the conductor pattern is formed and lower than the insulating support film 68. In order to arrange the insulating support film 68 at a higher portion inside the cavity 1, a dummy conductor pattern 69 may be formed below the insulating support film 68 as shown in FIG. That is, when the conductor pattern is formed on the outermost layer of the flexible wiring board 20, the dummy conductor pattern 69 is preferably provided at a position near the side wall of the cavity bottom surface. Then, an insulating support film 68 may be disposed thereon with a solder resist. By doing so, the inclination near the side wall of the cavity 1 can be prevented without increasing the number of manufacturing steps, and the amount of resin leached out to the inside of the cavity 1 can be suppressed.

図７〜図８に示すように、絶縁性の支持膜６８を配設するかわりに、下側プリント配線板２０のキャビティ１底面となる面側のキャビティ側壁部近傍下部となる位置に導体バンプを突設して、絶縁層７となる未硬化のプリプレグ２７に貫挿させて、支持部材６６としてもよい。この支持部材６６となる導体バンプは、図７に示すように、下側プリント配線板２０の最上層のキャビティ側壁部近傍下部に形成されたダミーパターン６９上に形設し、絶縁層を貫挿させて対向する上側プリント配線板１０の最下層の導体パターン１２に当接させて塑性変形させてもよい。この支持部材６６となる導体バンプは、図８に示すように、下側プリント配線板２０の最上層の側壁近傍下部の導体パターン２２上に設け、対向する上側プリント配線板１０の絶縁層１１に当接又は没入させてもよい。また、支持部材６６となる導体バンプの先端は、絶縁層７となる未硬化のプリプレグ２７を貫通せずに、絶縁層７の途中でとどまっていてもよい。   As shown in FIGS. 7 to 8, instead of providing the insulating support film 68, conductor bumps are placed at positions near the cavity side wall near the bottom surface of the cavity 1 of the lower printed wiring board 20. The support member 66 may be provided by protruding and penetrating through the uncured prepreg 27 to be the insulating layer 7. As shown in FIG. 7, the conductor bumps serving as the support member 66 are formed on a dummy pattern 69 formed in the lower part near the cavity side wall of the uppermost layer of the lower printed wiring board 20, and the insulating layer is inserted therethrough. Then, it may be plastically deformed by being brought into contact with the lowermost conductive pattern 12 of the upper printed wiring board 10 facing each other. As shown in FIG. 8, the conductor bumps serving as the support members 66 are provided on the conductor pattern 22 in the lower part near the upper side wall of the lower printed wiring board 20, and are formed on the insulating layer 11 of the opposing upper printed wiring board 10. You may abut or immerse. Further, the tip of the conductor bump that becomes the support member 66 may stay in the middle of the insulating layer 7 without penetrating the uncured prepreg 27 that becomes the insulating layer 7.

このように、下側プリント配線板２０のキャビティ１底面となる面側のキャビティ側壁近傍下部となる位置に突設する支持部材６６は、層間接続しないダミーバンプとして設けることが好ましいが、層間接続導体としての通常の導体バンプを、キャビティ側壁部近傍の下部となる位置に突設することで、支持部材６６としてもよい。キャビティ側壁下部近傍の配線パターンが複雑になった場合には、配線パターンの合間にダミーパターンやダミーバンプを設けることは困難となる。その場合には、層間接続導体としての通常の導体バンプを支持部材６６として共用することが効果的である。   As described above, the support member 66 protruding at a position near the cavity side wall near the bottom surface of the cavity 1 of the lower printed wiring board 20 is preferably provided as a dummy bump without interlayer connection, but as an interlayer connection conductor. These normal conductor bumps may be provided as a support member 66 by projecting at a position at the lower part near the cavity side wall. When the wiring pattern near the cavity sidewall lower part becomes complicated, it becomes difficult to provide dummy patterns and dummy bumps between the wiring patterns. In that case, it is effective to share a normal conductor bump as an interlayer connection conductor as the support member 66.

いずれにしても、支持部材６６となる導体バンプは、上側プリント配線板１０の最下層の導体パターンと下側プリント配線板２０の最上層の導体パターンとの層間接続導体６となる導体バンプと同様の方法で同一工程にて、まとめて形成することができる。そうすることで、製造工程を増やすことなく、キャビティ１側壁近傍の傾斜を防止することができる。   In any case, the conductor bump serving as the support member 66 is the same as the conductor bump serving as the interlayer connection conductor 6 between the lowermost conductor pattern of the upper printed wiring board 10 and the uppermost conductor pattern of the lower printed wiring board 20. In the same process, it can be formed collectively. By doing so, the inclination of the cavity 1 side wall vicinity can be prevented, without increasing a manufacturing process.

図９〜図１２は、この多層プリント配線板１００の製造方法として最適な実施形態の一例を説明するための模式的な断面図である。図において波線で示した部分の右側又は左側は、省略されていることを示している。   FIGS. 9-12 is typical sectional drawing for demonstrating an example of optimal embodiment as a manufacturing method of this multilayer printed wiring board 100. FIG. In the drawing, the right side or the left side of the portion indicated by the wavy line indicates that it is omitted.

まず、図９に示すように、キャビティとなる窓（貫通穴）を設ける上側プリント配線板として、窓をあけていないリジッド配線板１０を用意する。   First, as shown in FIG. 9, a rigid wiring board 10 without a window is prepared as an upper printed wiring board provided with a window (through hole) serving as a cavity.

リジッド配線板１０の構成は、必要な回路、電子部品を埋め込むのに必要な厚さ及び大きさ、モジュール基板として要求される厚さ（薄さ）及び大きさ、その他の設計事項を考慮して、適宜定められる。配線層は何層であってもよいが、予め、内層及び外層に導体パターンからなる配線層を形成し、層間接続導体で導通しておく。   The configuration of the rigid wiring board 10 takes into consideration the necessary circuits, the thickness and size necessary for embedding electronic components, the thickness (thinness) and size required for the module substrate, and other design matters. As appropriate. Any number of wiring layers may be used, but a wiring layer made of a conductor pattern is formed in advance on the inner layer and the outer layer, and is made conductive by the interlayer connection conductor.

リジッド配線板１０は、複数の配線層を有するリジッドプリント配線板として周知の材料及び方法により製造することができ、その材料や製造方法は特に限定されない。例えば、周知のスルーホール、レーザービアホールなどの層間接続法を用いたものでもよい。ここでは、一例として、Ｂ２ｉｔ（登録商標）と呼ばれる例えば特開平０６−３４２９７７号公報により知られる製法により、図９に模式的に示す４層の導体パターンを具備したリジッド配線板１０を製造した。 The rigid wiring board 10 can be manufactured by a well-known material and method as a rigid printed wiring board having a plurality of wiring layers, and the material and manufacturing method are not particularly limited. For example, an interlayer connection method such as a known through hole or laser via hole may be used. Here, as an example, a rigid wiring board 10 having a four-layer conductor pattern schematically shown in FIG. 9 is manufactured by a manufacturing method known as Japanese Patent Application Laid-Open No. 06-342977 called B 2 it (registered trademark). did.

図９において、符号１１は、厚さ４０〜６０μｍのガラス−エポキシ系プリプレグの硬化物である硬質な絶縁層、符号１２は、厚さ１８μｍの電解銅箔を周知のフォトリソグラフィ技術を用いたパターニングにより形成された導体パターンである。符号１３は、電解銅箔又は導体パターンの上に形成されたポリマータイプの銀系の導電性ペーストの硬化物からなる略円錐形（例えば底面の直径０．１５ｍｍ、高さ６０〜１５０μｍ）の導体バンプを、未硬化のプリプレグに貫挿させ、導体パターン１２に当接させて、加圧加熱することにより、略円錐台形に塑性変形して固化した層間接続導体である。符号８はソルダーレジスト等の保護膜である。   In FIG. 9, reference numeral 11 denotes a hard insulating layer that is a cured product of a glass-epoxy prepreg having a thickness of 40 to 60 μm, and reference numeral 12 denotes an electrolytic copper foil having a thickness of 18 μm that is patterned using a well-known photolithography technique. It is the conductor pattern formed by. Reference numeral 13 denotes a conductor having a substantially conical shape (for example, a bottom diameter of 0.15 mm and a height of 60 to 150 μm) made of a cured product of a polymer-type silver-based conductive paste formed on an electrolytic copper foil or a conductor pattern. This is an interlayer connection conductor that is solidified by being plastically deformed into a substantially frustoconical shape by inserting a bump into an uncured prepreg, contacting the conductor pattern 12, and applying pressure and heating. Reference numeral 8 denotes a protective film such as a solder resist.

図２及び図９に示すように、リジッド配線板１０の多層プリント配線板１００として外層になる側（図面上側）は、実装用端子３となる導体パターン領域を残して、ソルダーレジスト等の保護膜８で被覆されている。また、リジッド配線板１０のフレキシブル配線板２０と接続される側（図面下側）には、絶縁層を介してフレキシブル配線板２０と導通できるように、所定位置に接続ランド４が形成され、ソルダーレジスト等の保護膜８は形成されていない。電子部品を埋め込むキャビティ１となる貫通穴１４を形成する領域には、導体パターン等は形成されていない。   As shown in FIGS. 2 and 9, the side (upper side of the drawing) of the rigid wiring board 10 as the multilayer printed wiring board 100 leaves a conductor pattern region to be the mounting terminal 3 and a protective film such as a solder resist. 8 is covered. In addition, a connection land 4 is formed at a predetermined position on the side (lower side of the drawing) of the rigid wiring board 10 connected to the flexible wiring board 20 so as to be electrically connected to the flexible wiring board 20 through an insulating layer. A protective film 8 such as a resist is not formed. A conductor pattern or the like is not formed in a region where the through hole 14 serving as the cavity 1 for embedding the electronic component is formed.

なお、層間接続導体１３は、この例では、上記したように導体パターン１２の所定位置に形成された略円錐形の導体バンプがリジッドな絶縁層１１を貫通して対向する導体パターンに当接して塑性変形して固化したもので構成されている。これにより、スルーホール、レーザービアホールなど孔をあけてその内壁をめっきするタイプの層間接続法による場合に比べて、導体パターンの微細化に対応でき、製造工程も簡略化できるという利点がある。   In this example, the interlayer connection conductor 13 has a substantially conical conductor bump formed at a predetermined position of the conductor pattern 12 as described above in contact with the opposing conductor pattern through the rigid insulating layer 11. It is composed of one that has been solidified by plastic deformation. As a result, there are advantages in that the conductor pattern can be made finer and the manufacturing process can be simplified as compared with the case of using an interlayer connection method in which a hole such as a through hole or a laser via hole is formed and the inner wall is plated.

次に、図１０に示すように、このリジッド配線板１０に、電子部品実装用のキャビティ１とするための所望の大きさ及び形状で、リジッド配線板１０を貫通する窓（貫通穴）１４をあける。この窓１４は、ルーター加工、打ち抜き加工、ドリル加工、レーザー加工等によりあけることができる。粉塵の発生しにくい加工方法であることが好ましい。ここでは、一例として、ルーター加工により、リジッド配線板１０に窓１４をあけた。穴あけ後、例えばゴミ取りロール又は水洗などにより清掃し、リジッド配線板１０の窓１４の近傍に粉塵がない状態にした。   Next, as shown in FIG. 10, a window (through hole) 14 that penetrates the rigid wiring board 10 is formed in the rigid wiring board 10 in a desired size and shape for forming the cavity 1 for mounting electronic components. I can make it. The window 14 can be opened by router processing, punching processing, drill processing, laser processing, or the like. It is preferable that the processing method is less likely to generate dust. Here, as an example, the window 14 is opened in the rigid wiring board 10 by router processing. After drilling, it was cleaned by, for example, a dust removal roll or water washing so that there was no dust in the vicinity of the window 14 of the rigid wiring board 10.

一方、図１１に示すように、リジッド配線板１０、３０の下側に積層されるフレキシブル配線板２０を用意する。フレキシブル配線板２０として、ここでは、リジッド配線板１０、３０と同じ幅で、かつ、リジッド配線板１０とリジッド配線板３０とを繋ぐのに必要十分な長さのものを用意した。そうすることで、図１に示す多層プリント配線板１００の裏面側が全面的にフレキシブル配線板２０となるため実質的に平坦になるので、フレキシブル配線板２０とリジッド配線板１０、３０との積層一体化が容易になる。   On the other hand, as shown in FIG. 11, the flexible wiring board 20 laminated | stacked on the lower side of the rigid wiring boards 10 and 30 is prepared. Here, a flexible wiring board 20 having the same width as the rigid wiring boards 10 and 30 and a length sufficient to connect the rigid wiring board 10 and the rigid wiring board 30 was prepared. By doing so, since the back surface side of the multilayer printed wiring board 100 shown in FIG. 1 becomes the flexible wiring board 20 entirely, it becomes substantially flat. Therefore, the flexible wiring board 20 and the rigid wiring boards 10 and 30 are integrally laminated. It becomes easy.

キャビティ１の底部を構成する下側プリント配線板としてのフレキシブル配線板の構成は、必要な回路、モジュール基板として要求される厚さ（薄さ）及び大きさ、その他の設計事項を考慮して、適宜定められる。下側プリント配線板の配線層は何層であってもよいが、下側プリント配線板には、予め、内層及び外層に導体パターンを形成しておく必要がある。配線層を複数にする場合には、各配線層間は、予め層間接続導体で導通しておく。   The configuration of the flexible printed circuit board as the lower printed circuit board that constitutes the bottom of the cavity 1 takes into account the necessary circuit, thickness (thinness) and size required for the module substrate, and other design matters. As appropriate. The number of wiring layers of the lower printed wiring board may be any number, but it is necessary to form conductor patterns on the inner layer and the outer layer in advance on the lower printed wiring board. When a plurality of wiring layers are used, each wiring layer is electrically connected in advance by an interlayer connection conductor.

キャビティ１の底部を構成するフレキシブル配線板２０は、公知の材料や製造方法で製造することができ、その材料や製造方法は特に限定されない。ここでは、一例として、Ｂ２ｉｔ（登録商標）と呼ばれる例えば特開平０６−３４２９７７号公報により知られる製法により、図１１に模式的に示す２層の導体パターンを具備したフレキシブル配線板２０を製造した。 The flexible wiring board 20 constituting the bottom of the cavity 1 can be manufactured by a known material or manufacturing method, and the material or manufacturing method is not particularly limited. Here, as an example, a flexible wiring board 20 having a two-layered conductor pattern schematically shown in FIG. 11 is manufactured by a manufacturing method called B 2 it (registered trademark) known from, for example, Japanese Patent Laid-Open No. 06-342977. did.

図１１において、符号２１は、硬化後にも通常のリジッド基板用のプリプレグよりも柔軟性を有する、フレキシブル基板用のプリプレグの硬化物からなるフレキシブルな絶縁層で、その厚さは４０〜６０μｍである。符号２２は、厚さ１８μｍの電解銅箔のパターニングにより形成された導体パターンである。符号２３は、電解銅箔又は導体パターンの上に形成されたポリマータイプの銀系の導電性ペーストの硬化物からなる略円錐形（例えば底面の直径０．１５ｍｍ、高さ６０〜１５０μｍ）の導体バンプを、フレキシブルな絶縁層２１に貫挿させ、導体パターン２２に当接させて、加圧加熱することにより、略円錐台形に塑性変形して固化した層間接続導体である。符号８はソルダーレジスト等の保護膜である。   In FIG. 11, the code | symbol 21 is a flexible insulating layer which consists of the hardened | cured material of the prepreg for flexible substrates which has a softness | flexibility rather than the prepreg for normal rigid substrates after hardening, The thickness is 40-60 micrometers. . Reference numeral 22 denotes a conductor pattern formed by patterning an electrolytic copper foil having a thickness of 18 μm. Reference numeral 23 denotes a conductor having a substantially conical shape (for example, a bottom diameter of 0.15 mm and a height of 60 to 150 μm) made of a cured product of a polymer-type silver-based conductive paste formed on an electrolytic copper foil or a conductor pattern. It is an interlayer connection conductor that is solidified by being plastically deformed into a substantially frustoconical shape by inserting bumps into a flexible insulating layer 21, contacting the conductor pattern 22, and applying pressure and heating. Reference numeral 8 denotes a protective film such as a solder resist.

図２及び図１１に示すように、フレキシブル配線板２０の多層プリント配線板１００として外層になる側（図面下側）は、実装用端子３となる導体パターン領域を残して、ソルダーレジスト等の保護膜８で被覆されている。また、フレキシブル配線板２０のリジッド配線板１０と接続される側（図面上側）には、絶縁層を介してリジッド配線板１０と導通できるように、所定位置に接続ランド５が形成され、ソルダーレジスト等の保護膜８は形成されていない。   As shown in FIGS. 2 and 11, the side (lower side of the drawing) of the flexible printed circuit board 20 that is the outer layer of the multilayer printed wiring board 100 leaves a conductor pattern region that becomes the mounting terminal 3, and protects the solder resist and the like. Covered with a membrane 8. Further, a connection land 5 is formed at a predetermined position on the side of the flexible wiring board 20 connected to the rigid wiring board 10 (upper side in the drawing) so as to be electrically connected to the rigid wiring board 10 through an insulating layer. The protective film 8 such as is not formed.

次に、フレキシブル配線板２０とリジッド配線板１０、３０との層間接続導体とするため、用意した両面フレキシブル配線板２０の一方の面の導体パターン２２の所定位置（接続ランド５）に、略円錐形の導体バンプ２６を形成した。すなわち、板厚１５０μｍのステンレス又はアルミ合金等の材質からなる金属板の所定箇所に０．１５ｍｍ径の穴を明けたメタルマスクを用意し、このメタルマスクをフレキシブル配線板２０の片面側に位置決め配置して導電性ペーストを印刷し、この印刷された導電性ペーストの乾燥後、同一位置に再度印刷する方法で印刷を繰り返し、高さ６０〜１５０μｍの略円錐形の導体バンプ２６を必要数まとめて形成した。ここで、導体バンプ２６の底面の径及び高さは、この例には限定されず、配線間隔や貫通する絶縁層の厚さを考慮して適宜定められる。   Next, in order to obtain an interlayer connection conductor between the flexible wiring board 20 and the rigid wiring boards 10 and 30, a substantially conical shape is formed at a predetermined position (connection land 5) of the conductor pattern 22 on one surface of the prepared double-sided flexible wiring board 20. A conductor bump 26 having a shape was formed. That is, a metal mask having a 0.15 mm diameter hole is prepared at a predetermined position of a metal plate made of a material such as stainless steel or aluminum alloy having a thickness of 150 μm, and this metal mask is positioned on one side of the flexible wiring board 20. Then, the conductive paste is printed, and after the printed conductive paste is dried, the printing is repeated by the method of printing again at the same position, and the necessary number of substantially conical conductor bumps 26 having a height of 60 to 150 μm are collected. Formed. Here, the diameter and height of the bottom surface of the conductor bump 26 are not limited to this example, and are appropriately determined in consideration of the wiring interval and the thickness of the insulating layer that penetrates.

一方、リジッド配線板１０、３０とフレキシブル配線板２０との間の接着性絶縁層７とするため、厚さ４０〜６０μｍの未硬化のプリプレグ２７を用意した。プリプレグ２７は、フレキシブル基板２０のリジッド配線板１０と積層される領域及びリジッド配線板１０と積層される領域に対応する大きさ及び形状のものを用意すればよい。したがって、プリプレグ２７にも、リジッド配線板１０と同様に、予め、ルーター加工等で窓（貫通穴）を形成した。   On the other hand, an uncured prepreg 27 having a thickness of 40 to 60 μm was prepared in order to obtain an adhesive insulating layer 7 between the rigid wiring boards 10 and 30 and the flexible wiring board 20. The prepreg 27 may be prepared in a size and shape corresponding to the region of the flexible substrate 20 laminated with the rigid wiring board 10 and the region laminated with the rigid wiring board 10. Therefore, similarly to the rigid wiring board 10, a window (through hole) was previously formed in the prepreg 27 by router processing or the like.

ここで、プリプレグ２７は、例えば、ガラス繊維、アラミド繊維などの有機繊維の不織布、紙等の基材に、電気絶縁性及び熱融着性を有する未硬化の合成樹脂を含浸させたフィルム状のシートである。プリプレグ２７としては、通常のリジッド基板の絶縁層と同様に、流動性の低い樹脂を含浸させたノンフロータイプのガラス−エポキシ系のプリプレグを用いることができる。   Here, the prepreg 27 is, for example, a film-like material obtained by impregnating a non-woven synthetic resin having electrical insulation properties and heat-sealability into a base material such as glass fiber, organic fiber non-woven fabric such as aramid fiber, and paper. It is a sheet. As the prepreg 27, a non-flow type glass-epoxy prepreg impregnated with a resin having low fluidity can be used as in the case of an insulating layer of a normal rigid substrate.

次に、図１２に示すように、導体バンプ２６の上にこのプリプレグ２７を当接させ、アルミ箔及びゴムシートを介して、たとえば１００℃に保持した熱板の間に配置し、１ＭＰａで１分間ほど加熱加圧することにより、導体バンプ２６の先端をこのプリプレグ２７を貫挿させて、導体バンプ２６の先端がこのプリプレグ２７から突き出したフレキシブル配線板２０を得た。   Next, as shown in FIG. 12, the prepreg 27 is brought into contact with the conductor bumps 26, and is placed between, for example, a hot plate maintained at 100 ° C. with an aluminum foil and a rubber sheet, and at 1 MPa for about 1 minute. By applying heat and pressure, the tip of the conductor bump 26 was inserted through the prepreg 27, and the flexible wiring board 20 in which the tip of the conductor bump 26 protruded from the prepreg 27 was obtained.

次に、図示を省略するが、導体バンプ２６の先端がこのプリプレグ２７から突き出したフレキシブル配線板２０と、窓１４をあけたリジッド配線板１０とを、導体バンプ２６の先端とリジッド配線板１０の接続ランド４とが対向するように位置合わせして、積層配置し、ガラス転移温度以上の温度に保持した熱板の間に配置し、例えば２ＭＰａで数十分〜１時間ほど加熱加圧した。硬化後、冷却してから取り出して、図１及び図２に示すキャビティ付き多層プリント配線板１００を得た。   Next, although not shown in the figure, the flexible wiring board 20 in which the tip of the conductor bump 26 protrudes from the prepreg 27 and the rigid wiring board 10 having the window 14 formed therein are connected to the tip of the conductor bump 26 and the rigid wiring board 10. They were aligned so as to face the connection land 4, stacked and arranged between hot plates maintained at a temperature equal to or higher than the glass transition temperature, and heated and pressurized at 2 MPa, for example, for several tens of minutes to 1 hour. After curing, the product was cooled and taken out to obtain a multilayer printed wiring board 100 with cavities shown in FIGS. 1 and 2.

図１及び図２に示すキャビティ付き多層プリント配線板１００は、以上のようにして製造される。   The multilayer printed wiring board 100 with a cavity shown in FIGS. 1 and 2 is manufactured as described above.

なお、上記において、層間接続導体や支持部材となる導体バンプとしては、たとえば銀、金、銅、半田粉などの導電性粉末、これらの合金粉末もしくは複合（混合）金属粉末と、たとえばポリカーボネート樹脂、ポリスルホン樹脂、ポリエステル樹脂、フェノキシ樹脂、フェノール樹脂、ポリイミド樹脂などのバインダー成分とを混合して調製されたペースト状の導電性組成物（導電性ペースト）、あるいは導電性金属などで構成することができる。導体バンプを導電性組成物で形成する場合、たとえば比較的厚いメタルマスクを用いた印刷法により、アスペクト比の高いバンプを形成することができる。導電性金属で導体バンプを形成する手段としては、（ａ）ある程度形状もしくは寸法が一定の微小金属魂を、粘着剤層を予め設けておいた導電性金属層面に散布し、選択的に固着させる（このときマスクを配置して行ってもよい）、（ｂ）電解銅箔面にめっきレジストを印刷・パターニングして、銅、錫、金、銀、半田などめっきして選択的に微小な金属柱（バンプ）を形成する、（ｃ）導電性金属層面に半田レジストの塗布・パターニングして、半田浴に浸漬して選択的に微小な金属柱（バンプ）を形成する、（ｄ）金属板の一部をレジストにて被覆し、エッチングして微小な金属バンプを形成する、などが挙げられる。ここで、導体バンプに相当する微小金属魂ないし微小な金属柱は、異種金属を組み合わせて成る多層構造、多層シェル構造でもよい。たとえば銅を芯にし表面を金や銀の層で被覆して耐酸化性を付与したり、銅を芯にし表面を半田層被覆して半田接合性をもたせたりしてもよい。なお、本発明において、導体バンプを導電性組成物で形成する場合には、めっき法などの手段で行う場合に較べて、さらに工程など簡略化し得るので、低コスト化の点で有効である。   In the above, as the conductor bumps serving as the interlayer connection conductor and the support member, for example, conductive powder such as silver, gold, copper, solder powder, alloy powder or composite (mixed) metal powder, for example, polycarbonate resin, It can be composed of a paste-like conductive composition (conductive paste) prepared by mixing a binder component such as a polysulfone resin, a polyester resin, a phenoxy resin, a phenol resin, or a polyimide resin, or a conductive metal. . When the conductive bump is formed of a conductive composition, the bump having a high aspect ratio can be formed by, for example, a printing method using a relatively thick metal mask. As means for forming a conductive bump with a conductive metal, (a) a fine metal soul having a certain shape or size is spread on a conductive metal layer surface on which an adhesive layer has been provided in advance, and is selectively fixed. (At this time, a mask may be arranged), (b) A plating resist is printed and patterned on the surface of the electrolytic copper foil, and copper, tin, gold, silver, solder, etc. are plated to selectively form a minute metal. Forming columns (bumps); (c) applying and patterning a solder resist on the surface of the conductive metal layer; and dipping in a solder bath to selectively form minute metal columns (bumps); (d) metal plate A part of the film is covered with a resist and etched to form a fine metal bump. Here, the fine metal soul or the fine metal pillar corresponding to the conductor bump may have a multilayer structure or a multilayer shell structure in which different metals are combined. For example, copper may be cored and the surface may be coated with a gold or silver layer to provide oxidation resistance, or copper may be cored and the surface may be coated with a solder layer to provide solder jointability. In the present invention, when the conductive bump is formed of a conductive composition, the process can be further simplified as compared with the case where the conductive bump is formed by means such as plating, which is effective in terms of cost reduction.

本実施形態では、上側プリント配線板として、２つのリジッド配線板をそれぞれ離間させて、キャビティ底部を構成するフレキシブル配線板２０の上に積層配置した例を示した。これに限られず、上側プリント配線板としてのリジッド配線板は１つでもよい。すなわち、図面右側に示されたリジッド配線板３０を備えない構成の多層リジッド−フレキシブル配線板であってもかまわない。また、配線層数はこれに限られるものではなく、他の層数であっても同様に実施できることはもちろんである。   In the present embodiment, as an upper printed wiring board, an example in which two rigid wiring boards are separated from each other and stacked on the flexible wiring board 20 constituting the cavity bottom portion is shown. However, the present invention is not limited to this, and one rigid wiring board may be used as the upper printed wiring board. That is, it may be a multilayer rigid-flexible wiring board that does not include the rigid wiring board 30 shown on the right side of the drawing. Further, the number of wiring layers is not limited to this, and it is needless to say that the present invention can be similarly implemented even with other numbers of layers.

次に、キャビティ１底面の側壁近傍にキャビティ内外に跨って連続する導体パターンがある場合の実施形態について、図１３〜図１５を参照して説明する。上記の実施形態と共通する部分については、原則として同じ符号を付し、説明を省略する。   Next, an embodiment in the case where there is a conductor pattern continuous across the inside and outside of the cavity near the side wall of the bottom surface of the cavity 1 will be described with reference to FIGS. In principle, the same reference numerals are given to portions common to the above-described embodiment, and description thereof is omitted.

図１３は、この実施形態に係る多層プリント配線板２００をキャビティ１側から見た平面図である。図１４は、図１３のＣ−Ｃ線に沿った垂直断面を模式的に示した断面図である。図１５は、図１３のＤ−Ｄ線に沿った垂直断面を模式的に示した断面図である。   FIG. 13 is a plan view of the multilayer printed wiring board 200 according to this embodiment as viewed from the cavity 1 side. FIG. 14 is a cross-sectional view schematically showing a vertical cross section along the line CC in FIG. FIG. 15 is a cross-sectional view schematically showing a vertical cross section along the line DD in FIG.

図１３及び図１４に示すように、この多層プリント配線板２００の下側プリント配線板となっているフレキシブル配線板２２０には、キャビティ１底面の側壁近傍に、キャビティ内外に跨って連続する導体パターンが形成されている。それらの導体パターンの一部は実装用端子２としてキャビティ１内に露出している。その他の構成は、図１及び図２で示したのと同様である。製造方法も、上記の実施形態と同様である。   As shown in FIG. 13 and FIG. 14, the flexible printed circuit board 220 which is the lower printed circuit board of the multilayer printed circuit board 200 has a conductive pattern that extends continuously in and out of the cavity near the side wall of the bottom surface of the cavity 1. Is formed. A part of the conductor pattern is exposed in the cavity 1 as a mounting terminal 2. Other configurations are the same as those shown in FIGS. The manufacturing method is also the same as in the above embodiment.

ここで、Ｃ−Ｃ線に沿った垂直断面においては、図１４に示すように、キャビティ１底面のキャビティ側壁部近傍には、実装用端子２と連続した導体パターンが形成されているため、ソルダーレジスト８は配設されていない。しかし、実装用端子２と連続した導体パターンが形成されていない部分、例えば、Ｄ−Ｄ線に沿った垂直断面においては、図１５に示すように、キャビティ１底面のキャビティ側壁部近傍には、その一部をキャビティ側壁下部に介在させて、ソルダーレジスト８からなる支持膜６８が配設されている。この支持膜６８により、キャビティ１側壁部近傍のリジッド配線板２１０及び絶縁層７（プリプレグ２７）を支持することができ、キャビティ１側壁部近傍の傾斜を防止することができる。なお、図示を省略するが、このような、キャビティ内外に跨って連続する導体パターンが形成されている場合の実施形態においても、図５〜図８に例示したのと同様の構成にしてもよいことはもちろんである。すなわち、支持膜６８を保護膜８と離間させて配設してもよく、支持膜のかわりに、導体バンプを下側プリント配線板上面のキャビティ１側壁部下部に突設してもよい。   Here, in the vertical cross section along the line CC, as shown in FIG. 14, a conductor pattern continuous with the mounting terminal 2 is formed in the vicinity of the cavity side wall on the bottom surface of the cavity 1. The resist 8 is not provided. However, in a portion where a conductor pattern continuous with the mounting terminal 2 is not formed, for example, in a vertical cross section along the line DD, as shown in FIG. A support film 68 made of the solder resist 8 is disposed with a part thereof interposed below the cavity side wall. The support film 68 can support the rigid wiring board 210 and the insulating layer 7 (prepreg 27) in the vicinity of the cavity 1 side wall, and can prevent the inclination in the vicinity of the cavity 1 side wall. In addition, although illustration is abbreviate | omitted, also in embodiment in such a case where the conductor pattern continuous over the inside and outside of a cavity is formed, you may make it the same structure as illustrated in FIGS. Of course. That is, the support film 68 may be disposed separately from the protective film 8, and instead of the support film, a conductor bump may protrude from the cavity 1 side wall lower portion of the upper surface of the lower printed wiring board.

次に、他の実施形態について、図１６〜図１８を参照して説明する。上記実施形態と共通する部分については、原則として同じ符号を付し、説明を省略する。   Next, another embodiment will be described with reference to FIGS. In principle, the same reference numerals are given to portions common to the above-described embodiment, and description thereof is omitted.

図１６は、他の実施形態に係る多層プリント配線板３００をキャビティ１側から見た平面図である。図１７は、図１６のＥ−Ｅ線に沿った垂直断面を模式的に示した断面図である。図１８は、図１６のＦ−Ｆ線に沿った垂直断面を模式的に示した断面図である。   FIG. 16 is a plan view of a multilayer printed wiring board 300 according to another embodiment as viewed from the cavity 1 side. FIG. 17 is a cross-sectional view schematically showing a vertical cross section along the line EE of FIG. 18 is a cross-sectional view schematically showing a vertical cross section along the line FF in FIG.

図１６及び図１７に示すように、この多層プリント配線板３００は、上側プリント配線板、下側プリント配線板ともに、リジッド配線板を用いた例である。すなわち、この多層プリント配線板３００は、電子部品を埋め込む開口部を有するキャビティ１を設けた上側プリント配線板である４層リジッド配線板３１０と開口部を設けていない下側プリント配線板である４層リジッド配線板３２０とが絶縁層７を介して積層一体化されたキャビティ付き８層リジッドプリント配線板である。上側プリント配線板３１０と下側プリント配線板３２０とは同じ外形を有している。キャビティ１底面には、４個の実装用端子２がキャビティ１内に露出している。その他の構成は、図１及び図２で示したのと同様である。製造方法も、上記の実施形態と同様である。   As shown in FIGS. 16 and 17, this multilayer printed wiring board 300 is an example in which a rigid wiring board is used for both the upper printed wiring board and the lower printed wiring board. That is, this multilayer printed wiring board 300 is a four-layer rigid wiring board 310 that is an upper printed wiring board provided with a cavity 1 having an opening for embedding electronic components, and a lower printed wiring board that is not provided with an opening. This is an 8-layer rigid printed wiring board with a cavity in which the layer rigid wiring board 320 is laminated and integrated with the insulating layer 7 interposed therebetween. The upper printed wiring board 310 and the lower printed wiring board 320 have the same outer shape. Four mounting terminals 2 are exposed in the cavity 1 on the bottom surface of the cavity 1. Other configurations are the same as those shown in FIGS. The manufacturing method is also the same as in the above embodiment.

このようにリジッド配線板どうしを絶縁層を介して積層一体化する場合であっても、図１８に示すように、キャビティ１底面の側壁部近傍には、その一部をキャビティ側壁下部に介在させて、ソルダーレジスト８からなる絶縁性の支持膜６８が配設されている。この支持膜６８により、キャビティ１側壁部近傍のリジッド配線板３１０及び絶縁層７（プリプレグ２７）を支持することができ、キャビティ１側壁部近傍の傾斜を防止することができる。   Even when the rigid wiring boards are laminated and integrated through an insulating layer as described above, as shown in FIG. 18, a part of the rigid wiring boards is interposed in the cavity sidewall bottom portion near the cavity sidewall bottom portion. Thus, an insulating support film 68 made of the solder resist 8 is provided. The support film 68 can support the rigid wiring board 310 and the insulating layer 7 (prepreg 27) in the vicinity of the cavity 1 side wall, and can prevent the inclination in the vicinity of the cavity 1 side wall.

図示を省略するが、この実施形態においても、図３〜図８に例示したのと同様の構成にしてもよいことはもちろんである。すなわち、図３に例示したのと同様に、支持膜６８を、キャビティ１側壁部近傍下部の上側プリント配線板３１０と下側プリント配線板３２０とが積層されている部分にのみ介在させて配設してもよい。支持膜６８を、図４と同様に保護膜８としてのソルダーレジストと連続して配設してもよく、図５、図６と同様に離間させて配設してもよい。支持膜６８のかわりに、図７、図８と同様に導体バンプをキャビティ１側壁部下部に突設して支持部材６６としてもよい。   Although illustration is omitted, it is needless to say that this embodiment may have the same configuration as that illustrated in FIGS. That is, as illustrated in FIG. 3, the support film 68 is disposed so as to be interposed only in the portion where the upper printed wiring board 310 and the lower printed wiring board 320 are laminated near the side wall of the cavity 1. May be. The support film 68 may be disposed continuously with the solder resist as the protective film 8 as in FIG. 4, or may be disposed apart from the support film 68 as in FIGS. Instead of the support film 68, conductor bumps may be provided projecting from the lower part of the side wall of the cavity 1 in the same manner as in FIGS.

以上で述べてきたキャビティ側壁部近傍での上側プリント配線板の傾斜の問題と同様の問題は、例えばプリント配線板１０の端部の側壁近傍でも問題となる場合があり、そのような場合は本発明の解決手段と同様の方法を適用できる。   The problem similar to the problem of the inclination of the upper printed wiring board in the vicinity of the cavity side wall described above may also be a problem in the vicinity of the side wall of the end of the printed wiring board 10, for example. A method similar to the solution of the invention can be applied.

［その他］
図１９〜図２２は、本発明の実施形態に係る多層プリント配線板のキャビティ１内部に電子部品７０を実装した様々な例を模式的に示した断面図である。 [Others]
19 to 22 are sectional views schematically showing various examples in which the electronic component 70 is mounted in the cavity 1 of the multilayer printed wiring board according to the embodiment of the present invention.

図１９〜図２２に示すように、キャビティ付き多層プリント配線板を製造した後、キャビティ１内には、電子部品７０を実装することができる。キャビティ付き多層プリント配線板の具体的な構成や電子部品の接続方式は、これらの図に示すものに限られず、いろいろの態様をとり得る。   As shown in FIGS. 19 to 22, an electronic component 70 can be mounted in the cavity 1 after the multilayer printed wiring board with the cavity is manufactured. The specific configuration of the multilayer printed wiring board with the cavity and the connection method of the electronic components are not limited to those shown in these drawings, and can take various forms.

図１９は、側面に複数の電極端子７１を備えた電子部品７０がキャビティ１内部に載置され、その電子部品７０の各電極端子７１が、キャビティ１底面に設けられた各実装用端子２に、半田ボール７２により各々接続された例を示している。キャビティ１の底面には側壁部下部に跨ってソルダーレジスト８が配設されており、保護膜としての役割と共に、キャビティ側壁部近傍の傾斜を防止する支持膜としての役割を果たしている。本発明の多層プリント配線板は、このような構成で電子部品７０をキャビティ１内に実装するためのものであってもよい。なお、半田ボール７２に限らず、半田バンプ、導電性ペーストバンプ、その他のバンプ等で接続してもよいことはもちろんである。   In FIG. 19, an electronic component 70 having a plurality of electrode terminals 71 on the side surface is placed inside the cavity 1, and each electrode terminal 71 of the electronic component 70 is attached to each mounting terminal 2 provided on the bottom surface of the cavity 1. In this example, the solder balls 72 are connected to each other. A solder resist 8 is disposed on the bottom surface of the cavity 1 so as to straddle the lower portion of the side wall, and serves as a protective film and a support film for preventing inclination near the side wall of the cavity. The multilayer printed wiring board of the present invention may be for mounting the electronic component 70 in the cavity 1 with such a configuration. Of course, not only the solder balls 72 but also solder bumps, conductive paste bumps, other bumps or the like may be used for connection.

図２０は、一方の主面に複数の電極７１を備えた電子部品７０が、電極端子７１面をキャビティ開口部側に向けてキャビティ１内部に載置され、その電子部品７０の各電極端子７１が、キャビティ１底面に設けられた各実装用端子２に、ボンディングワイヤ７３により各々接続された例を示している。この例では、図１３及び図１４に示したのと同様に、キャビティ１の底面には側壁部下部とキャビティ内側に跨って導体パターン２が形設されているので、ソルダーレジスト８が配設されていない。しかし、この場合においても、図１５及び図４〜図６に示すように、キャビティ側壁部近傍の他の部分には、下側プリント配線板上面には、キャビティ１の側壁部下部とキャビティ内側底面に跨ってソルダーレジスト等からなる支持膜が配設されている。もちろん、図７〜図８に示すように、下側プリント配線板上面のキャビティ側壁部近傍下部には、導体バンプ等からなる支持部材が突設されていてもよい。本発明の多層プリント配線板は、このような構成で電子部品７０をキャビティ１内に実装するためのものであってもよい。   In FIG. 20, an electronic component 70 having a plurality of electrodes 71 on one main surface is placed inside the cavity 1 with the surface of the electrode terminal 71 facing the cavity opening, and each electrode terminal 71 of the electronic component 70 is placed. Shows an example in which each of the mounting terminals 2 provided on the bottom surface of the cavity 1 is connected by a bonding wire 73. In this example, as shown in FIG. 13 and FIG. 14, since the conductor pattern 2 is formed on the bottom surface of the cavity 1 so as to straddle the lower portion of the side wall and the inside of the cavity, the solder resist 8 is disposed. Not. However, even in this case, as shown in FIG. 15 and FIGS. 4 to 6, there are other portions near the cavity side wall portion, the lower printed wiring board upper surface, the lower portion of the side wall portion of the cavity 1 and the bottom surface inside the cavity. A support film made of a solder resist or the like is disposed across the substrate. Of course, as shown in FIGS. 7 to 8, a support member made of a conductor bump or the like may protrude from the lower portion of the upper surface of the lower printed wiring board near the cavity side wall. The multilayer printed wiring board of the present invention may be for mounting the electronic component 70 in the cavity 1 with such a configuration.

図２１は、一方の主面に複数の電極端子７１を備えた電子部品７０が、電極端子７１面をキャビティ開口部側に向けてキャビティ１内部に載置され、その電子部品７０の各電極端子７１が、リジッド配線板１０の最外層のキャビティ側壁近傍に設けられた各実装用端子３に、ボンディングワイヤ７３により各々接続された例を示している。この例のように、電子部品７０の各電極端子７１と接続される実装用端子はキャビティ１底面に設けられていなくてもよく、ソルダーレジストからなる保護膜８は、キャビティ底面内側のほうに連続して配設されていなくてもよい。その場合であっても、キャビティ底面の側壁近傍には、その一部をキャビティ側壁部下部に介在させて、ソルダーレジスト８からなる支持膜が配設されている。この支持膜を設けることにより、キャビティ側壁部近傍の傾斜を防止できる。もちろん、図７〜図８に示すように、下側プリント配線板上面のキャビティ側壁部近傍下部には、導体バンプ等からなる支持部材が突設されていてもよい。本発明の多層プリント配線板は、このような構成で電子部品７０をキャビティ１内に実装するためのものであってもよい。   In FIG. 21, an electronic component 70 having a plurality of electrode terminals 71 on one main surface is placed inside the cavity 1 with the electrode terminal 71 surface facing the cavity opening, and each electrode terminal of the electronic component 70 is placed. 71 shows an example in which bonding wires 73 are connected to the respective mounting terminals 3 provided in the vicinity of the cavity side wall of the outermost layer of the rigid wiring board 10. As in this example, the mounting terminals connected to the electrode terminals 71 of the electronic component 70 may not be provided on the bottom surface of the cavity 1, and the protective film 8 made of solder resist is continuous toward the inside of the bottom surface of the cavity. It does not need to be arranged. Even in such a case, a supporting film made of the solder resist 8 is disposed in the vicinity of the side wall of the bottom surface of the cavity with a part thereof interposed below the side wall of the cavity. By providing this support film, the inclination near the cavity side wall can be prevented. Of course, as shown in FIGS. 7 to 8, a support member made of a conductor bump or the like may protrude from the lower portion of the upper surface of the lower printed wiring board near the cavity side wall. The multilayer printed wiring board of the present invention may be for mounting the electronic component 70 in the cavity 1 with such a configuration.

図２２は、図１９に示したようにキャビティ内に電子部品を実装した上で、キャビティ１の開口部を塞ぐように他の電子部品７０を搭載し、その各電極端子７１を、リジッド配線板１０の最外層に設けられた各実装用端子３に、ボンディングワイヤ７３により各々接続された例を示している。本発明の多層プリント配線板は、このような構成で電子部品を接続するものであってもよい。   In FIG. 22, after mounting electronic components in the cavity as shown in FIG. 19, another electronic component 70 is mounted so as to close the opening of the cavity 1, and each electrode terminal 71 is connected to a rigid wiring board. An example is shown in which each of the mounting terminals 3 provided on the outermost layer 10 is connected by a bonding wire 73. The multilayer printed wiring board of the present invention may connect electronic components with such a configuration.

キャビティ内に実装される電子部品の接続方法は、これらに限られず、いろいろの形態を採ることができる。   The connection method of the electronic component mounted in the cavity is not limited to these, and can take various forms.

上記説明したように、キャビティ内に実装される電子部品の構成やその接続方法はいろいろの形態を採り得るが、いずれの場合であっても、キャビティ側壁部近傍下部には、ソルダーレジスト等からなる絶縁性の支持膜又は導体バンプからなる支持部材が配設されている。したがって、キャビティ側壁部近傍の傾斜を防止することができる。   As described above, the configuration of the electronic components mounted in the cavity and the connection method thereof can take various forms, but in any case, the lower part near the cavity side wall is made of a solder resist or the like. A support member made of an insulating support film or a conductor bump is disposed. Therefore, the inclination near the cavity side wall can be prevented.

本発明の一実施形態に係るキャビティ付き多層プリント配線板のキャビティ開口部側から見た平面図。The top view seen from the cavity opening part side of the multilayer printed wiring board with a cavity which concerns on one Embodiment of this invention. 図１のＡ−Ａ線に沿った断面を模式的に示した断面図。Sectional drawing which showed typically the cross section along the AA of FIG. キャビティ側壁近傍の一例を拡大して断面を模式的に示した断面図。Sectional drawing which expanded an example of the cavity side wall vicinity, and showed the cross section typically. キャビティ側壁近傍の他の一例を拡大して断面を模式的に示した断面図。Sectional drawing which expanded the other example near the cavity side wall, and showed the cross section typically. キャビティ側壁近傍の他の一例を拡大して断面を模式的に示した断面図。Sectional drawing which expanded the other example near the cavity side wall, and showed the cross section typically. キャビティ側壁近傍の他の一例を拡大して断面を模式的に示した断面図。Sectional drawing which expanded the other example near the cavity side wall, and showed the cross section typically. キャビティ側壁近傍の他の一例を拡大して断面を模式的に示した断面図。Sectional drawing which expanded the other example near the cavity side wall, and showed the cross section typically. キャビティ側壁近傍の他の一例を拡大して断面を模式的に示した断面図。Sectional drawing which expanded the other example near the cavity side wall, and showed the cross section typically. キャビティ付き多層プリント配線板の製造方法を説明するための模式的断面図。Typical sectional drawing for demonstrating the manufacturing method of the multilayer printed wiring board with a cavity. キャビティ付き多層プリント配線板の製造方法を説明するための模式的断面図。Typical sectional drawing for demonstrating the manufacturing method of the multilayer printed wiring board with a cavity. キャビティ付き多層プリント配線板の製造方法を説明するための模式的断面図。Typical sectional drawing for demonstrating the manufacturing method of the multilayer printed wiring board with a cavity. キャビティ付き多層プリント配線板の製造方法を説明するための模式的断面図。Typical sectional drawing for demonstrating the manufacturing method of the multilayer printed wiring board with a cavity. 本発明の他の実施形態に係るキャビティ付き多層プリント配線板のキャビティ開口部側から見た平面図。The top view seen from the cavity opening part side of the multilayer printed wiring board with a cavity which concerns on other embodiment of this invention. 図１３のＣ−Ｃ線に沿った断面を模式的に示した断面図。FIG. 14 is a cross-sectional view schematically showing a cross section along the line CC in FIG. 13. 図１３のＤ−Ｄ線に沿った断面を拡大して模式的に示した断面図。FIG. 14 is a cross-sectional view schematically showing an enlarged cross section along the line DD in FIG. 13. 本発明の他の実施形態に係るキャビティ付き多層プリント配線板のキャビティ開口部側から見た平面図。The top view seen from the cavity opening part side of the multilayer printed wiring board with a cavity which concerns on other embodiment of this invention. 図１６のＥ−Ｅ線に沿った断面を模式的に示した断面図。Sectional drawing which showed typically the cross section along the EE line | wire of FIG. 図１６のＦ−Ｆ線に沿った断面を拡大して模式的に示した断面図。FIG. 17 is a cross-sectional view schematically showing an enlarged cross section taken along line FF in FIG. 16. 本発明の実施形態に係る多層プリント配線板のキャビティ内に電子部品を実装した例を示す図。The figure which shows the example which mounted the electronic component in the cavity of the multilayer printed wiring board which concerns on embodiment of this invention. 本発明の実施形態に係る多層プリント配線板のキャビティ内に電子部品を実装した例を示す図。The figure which shows the example which mounted the electronic component in the cavity of the multilayer printed wiring board which concerns on embodiment of this invention. 本発明の実施形態に係る多層プリント配線板のキャビティ内に電子部品を実装した例を示す図。The figure which shows the example which mounted the electronic component in the cavity of the multilayer printed wiring board which concerns on embodiment of this invention. 本発明の実施形態に係る多層プリント配線板のキャビティ内及びキャビティ上部に電子部品を実装した例を示す図。The figure which shows the example which mounted the electronic component in the cavity of the multilayer printed wiring board which concerns on embodiment of this invention, and a cavity upper part. 従来のキャビティ側壁部近傍の問題点を説明するための模式的断面図。The typical sectional view for explaining the problem of the conventional cavity side wall part neighborhood.

符号の説明Explanation of symbols

１…キャビティ、１ａ…キャビティ内側壁、２，３…実装用端子、４，５…接続ランド、６…導体バンプ（層間接続導体）、７…プリプレグの硬化物（絶縁層）、８…ソルダーレジスト、９…間隙部、１０…リジッド配線板（上側プリント配線板）、１１…硬質な絶縁層、２０…フレキシブル基板（下側プリント配線板）、２１…柔軟な絶縁層、１２，２２,３２，９１２…導体パターンからなる配線層、１３，２３,３３…層間接続導体、１４…窓（貫通穴）、２６…導体バンプ、２７…未硬化のプリプレグ、６６…支持部材（バンプ）、６８…支持膜（ソルダーレジスト）、６９…ダミーパターン、７０…電子部品、７１…電極端子、７２…半田ボール、７３…ボンディングワイヤ、１００，２００，３００…キャビティ付き多層プリント配線板。   DESCRIPTION OF SYMBOLS 1 ... Cavity, 1a ... Cavity inner side wall, 2, 3 ... Mounting terminal, 4, 5 ... Connection land, 6 ... Conductor bump (interlayer connection conductor), 7 ... Hardened | cured material (insulation layer) of prepreg, 8 ... Solder resist , 9 ... Gap, 10 ... Rigid wiring board (upper printed wiring board), 11 ... Hard insulating layer, 20 ... Flexible substrate (lower printed wiring board), 21 ... Flexible insulating layer, 12, 22, 32, 912... Wiring layer made of a conductor pattern, 13, 23, 33... Interlayer connection conductor, 14... Window (through hole), 26... Conductor bump, 27 ... Uncured prepreg, 66 ... Support member (bump), 68. Film (solder resist), 69 ... dummy pattern, 70 ... electronic component, 71 ... electrode terminal, 72 ... solder ball, 73 ... bonding wire, 100, 200, 300 ... multilayer print with cavity Line plate.

Claims (6)

電子部品実装用のキャビティとなる貫通穴をあけた上側プリント配線板と前記キャビティ底面を構成する下側プリント配線板とをプリプレグを介して積層一体化させた多層プリント配線板であって、
前記下側プリント配線板の前記キャビティ底部を構成する面のキャビティ側壁部近傍に、前記上側プリント配線板の下側に介在させて絶縁性の支持膜を配設したことを特徴とする多層プリント配線板。 A multilayer printed wiring board in which an upper printed wiring board having a through-hole serving as a cavity for mounting electronic components and a lower printed wiring board constituting the bottom surface of the cavity are laminated and integrated via a prepreg,
A multilayer printed wiring, wherein an insulating support film is disposed below the upper printed wiring board in the vicinity of a cavity side wall of a surface constituting the cavity bottom of the lower printed wiring board. Board. 前記絶縁性の支持膜は、前記上側プリント配線板の下側から前記キャビティ側壁部を越えてキャビティ内側まで配設したことを特徴とする請求項１に記載の多層プリント配線板。   2. The multilayer printed wiring board according to claim 1, wherein the insulating support film is disposed from a lower side of the upper printed wiring board to an inner side of the cavity beyond the side wall of the cavity. 前記絶縁性の支持膜は、ソルダーレジスト又はフォトレジストであることを特徴とする請求項１又は２に記載の多層プリント配線板。   The multilayer printed wiring board according to claim 1, wherein the insulating support film is a solder resist or a photoresist. 前記絶縁性の支持膜は、前記上側プリント配線板の下側に介在させた部分よりもキャビティ内側の部分を高くさせて配設したこと特徴とする請求項１乃至３のいずれか１項に記載の多層プリント配線板。   4. The insulating support film according to claim 1, wherein a portion inside the cavity is arranged higher than a portion interposed below the upper printed wiring board. Multilayer printed wiring board. 電子部品実装用のキャビティとなる貫通穴をあけた上側プリント配線板と前記キャビティ底部となる面を有する下側プリント配線板とをプリプレグを介して積層一体化させた多層プリント配線板であって、
前記下側プリント配線板の前記キャビティ側壁底部近傍に突設した支持部材が、前記プリプレグに貫挿されていることを特徴とする多層プリント配線板。 A multilayer printed wiring board obtained by laminating and integrating an upper printed wiring board having a through hole serving as a cavity for mounting electronic components and a lower printed wiring board having a surface serving as the bottom of the cavity via a prepreg,
A multilayer printed wiring board, wherein a support member protruding near the bottom of the cavity side wall of the lower printed wiring board is inserted through the prepreg. 前記突設した支持部材は、導電性組成物の固化物からなることを特徴とする請求項５に記載の多層プリント配線板。   The multilayer printed wiring board according to claim 5, wherein the protruding support member is made of a solidified conductive composition.
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