JP2007251047A - Mounter for surface-mounting component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mounter for surface-mounting components capable of high precisely mounting components too such as IC components and tall capacitors and planting to improve a mounting productivity. <P>SOLUTION: The mounter for the surface-mounting components is equipped with: a substrate positioning portion 16 which unidirectionally moves a substrate 14 on which the components are mounted in a component mounting area 12 to position the substrate 14; and a mounting head positioning portion 22 which flatly moves a mounting head portion 17 picking up the components to position the mounting head portion 17, wherein it is made possible to select a mode in which the components are mounted at a target position on the substrate 14 by both positionings of the substrate positioning portion 16 and the mounting head positioning portion 22 according to the mounting components, or a mode in which a movement of the substrate 14 is stopped and the components are mounted at the target position on the substrate 14 by a positioning of only the mounting head positioning portion 22. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a surface mount component mounting machine for mounting components such as electronic components on an electronic circuit board.

  For example, as shown in FIG. 1, a conventional surface mount component mounting machine 5 has a plurality of suction nozzles 20 that suck electronic components, and the vertical direction (depth and front direction in FIG. 1) of the sucked components and Mounting head portions 17A and 17B for positioning in the direction of rotation (rotation in the Z-axis direction orthogonal to the X-axis and Y-axis in FIG. 1), and the mounting head portion in the direction parallel to the transport axis (X-axis direction in FIG. 1) The component supply units 26A and 26B and the electronic circuit board 14 which are disposed on both sides of the component mounting area 12 on the side of the substrate transport path 25 and which are positioned on the side of the substrate transport path 25 and where the component supply device 28 having a tape feeder is installed. A substrate transport unit 32 that transports the substrate and a substrate positioning unit 16 that positions the substrate in the direction perpendicular to the transport axis (the Y-axis direction in FIG. 1).

  In the above configuration, the mounting head portions 17A and 17B are arranged in parallel to the Y coordinate position of the pickup coordinates (the coordinates for picking up the electronic component from the component supply device 28 in the component supply portions 26A and 26B), that is, in parallel to the component supply portions 26A and 26B. The movement in the Y-axis direction is fixed at the position of the Y coordinate where the component is exposed so that the component can be picked up from the mounted component supply device 28, and is the target position on the electronic circuit board 14 after picking up the component. Positioning of the mounting coordinates in the X-axis direction is performed by the mounting head positioning unit 24, and positioning of the Y coordinates is performed by moving the electronic circuit board 14 in one direction by the substrate positioning unit 16.

  Further, Patent Document 1 discloses a surface mounting component mounting machine in which a mounting head unit, a mounting head positioning unit, a component supply unit, a substrate positioning unit, and the like are installed on both sides of a substrate conveyance path and can be mounted on two substrates at the same time. Is described.

  Further, Patent Document 2 has a plurality of beams and a mounting head mounted on the beams, and when mounting accuracy of mounting components is required, mounting the components requiring accuracy mounted on one beam. A mounting method is described in which when the movement of the beam and the mounting head in the horizontal direction is stopped due to the component being mounted while being held by the head, the movement of other beams is decelerated or stopped.

JP 2002-271091 A Japanese Patent No. 3696413

  However, in the conventional surface mounting component mounting machine 5 and the surface mounting component mounting machine disclosed in Patent Document 1, the substrate positioning unit moves the substrate in the Y-axis direction and positions the mounting coordinate in the Y coordinate. Immediately after mounting an IC component that requires mounting accuracy, a tall component such as an aluminum electrolytic capacitor, or a heavy component such as a transformer, an overshoot is likely to occur if the board is suddenly stopped. Mounting displacement due to substrate vibration, etc., and after mounting, the mounting position shifts due to parts falling or moving the board before the solder is solidified by moving the board, causing the wiring to be short-circuited. There was a possibility of deterioration of mounting quality.

  In addition, when mounting IC parts, etc., it is necessary to reduce the operating speed of the board positioning part to prevent the occurrence of misalignment, and the operating speed of the mounting head positioning part is also reduced accordingly, so that mounting productivity is reduced. Has led to a decline.

  Further, in Patent Document 2, in the case of a component having mounting accuracy, the beam that does not hold it is decelerated or stopped to prevent interference between the beams, and the accuracy is improved at the expense of productivity. It is difficult to increase productivity. Further, since positioning is performed only with the mounting head, it is difficult to perform a high-speed mounting operation in which the electronic circuit board 14 is moved and mounted as in the surface mounting component mounting machine 5 shown in FIG. It was.

  SUMMARY OF THE INVENTION An object of the present invention is to mount a component such as an IC component or a tall capacitor in a surface mount component mounting machine with high accuracy and improve mounting productivity.

  The present invention relates to a substrate positioning device for positioning a substrate in a surface mounting component mounting machine for mounting a component picked up by a mounting head on a substrate by moving the substrate on which the component is mounted in one direction in the component mounting area. And a mounting head positioning part that positions the mounting head part by moving the mounting head part picking up the components in the plane direction, and depending on the mounting part, the substrate positioning part and the mounting head positioning part And a mode in which the component is mounted at a target position on the substrate by both positioning and a mode in which the movement of the substrate is stopped and the component is mounted at the target position on the substrate by positioning only the mounting head positioning unit, The above-mentioned problem is solved.

  By selecting the positioning mode according to the mounted parts, the target position on the board can be stopped only by the mounting head positioning part that can move in the plane direction for specific parts such as aluminum electrolytic capacitors. Therefore, there is no vibration of the board at the time of mounting, and high-precision and high-speed mounting is possible. On the other hand, in the case of a component that is not a specific part, higher speed is achieved by positioning both the board positioning part and the mounting head positioning part. A component can be mounted at a target position on the board at an operation speed, and can be mounted with high accuracy in total, and the mounting productivity can be improved.

  Hereinafter, embodiments of the present invention will be described in detail with reference to FIGS. 2 and 3.

  FIG. 2 is a plan view of the surface mount component mounting machine according to the embodiment of the present invention. In FIG. 2, 10 is a surface mount component mounting machine, 12 is a component mounting area for mounting an electronic component on the electronic circuit board 14, 16 is a board positioning portion for positioning the electronic circuit board 14, and 17 is an electronic component. A mounting head portion having a plurality of suction nozzles 20, 22 is a mounting head positioning portion for positioning the mounting head portion 17, 26 is a component supply portion for installing the component supply device 28, and 30 is a large capacitor or large A large component supply unit 32 that supplies large components such as IC components is a substrate transfer unit that transfers the electronic circuit board 14.

  The surface mount component mounting machine 10 according to the present embodiment is configured to be mounted on two electronic circuit boards 14 at the same time. The component mount area 12, the substrate positioning unit 16, the component supply unit 26, and a large component Two supply units 30 in the upper and lower sides in FIG. 2, component mounting areas 12U and 12L, board positioning units 16U and 16L, component supply units 26U and 26L, and large component supply units 30U and 30L are provided. Two mounting heads 17 that mainly pick up electronic components from the unit 26 (18U, 18L) on the upper side and lower side in FIG. 2 respectively, and the mounting head unit 17 that mainly picks up electronic components from the large component supply unit 30 2 has two (19U, 19L) on the upper side and the lower side in FIG.

  The mounting head positioning unit 22 includes a pair of Y-axis linear motors 23A and 23B that move the mounting head unit 17 in the Y-axis direction in FIG. 2 and two X-axis linear motors 24U that move the mounting head unit 17 in the X-axis direction. , 24L.

  In the component supply unit 26, a plurality of component supply devices 28 are mounted side by side for each component type. Although not shown, the component supply device 28 is located on the tip side of the component supply device 28 (the side facing the substrate transport unit 32). ), And each component pickup position is arranged in a straight line in the X-axis direction (the Y coordinate of the pickup coordinate is common).

  The large component supply unit 30 has a plurality of trays that can accommodate specific components such as tall aluminum electrolytic capacitors and large IC components. The specific component includes a small but heavy component such as a transformer, and a small IC component that requires high mounting accuracy even if it is small, and such a component is supplied from the component supply unit 26.

  The board transport unit 32 is disposed substantially at the center of the surface mount component mounting machine 10 and supplies electronic components to be mounted on one electronic circuit board 14 to the upper side (upper side in FIG. 2) of the board transport unit 32. A component supply unit 26U and a large component supply unit 30U are disposed, and a component mounting area 12U is provided therebetween. Similarly, a component supply unit 26L, a large component supply unit 30L, and a component mounting area 12L are also provided below the board transfer unit 32.

  The Y-axis linear motors 23A and 23B of the mounting head positioning unit 22 are respectively arranged on the left and right sides in FIG. 2, and two X-axis linear motors 24U and 24L are parallel to the Y-axis linear motors 23A and 23B. It is arranged.

  Next, the operation of the surface mount component mounting machine in the present embodiment will be described.

  The electronic circuit board 14 is carried into the board conveyance path 25 by the board conveyance section 32 from either the left or right side of the surface mount component mounting machine 10 shown in FIG. It is carried out to the side.

  After the electronic circuit board 14 is carried into the board conveyance path 25, the electronic circuit board 14 is carried to the board positioning section 16 by the board conveyance section 32, and component mounting having rails orthogonal to the board conveyance path 25 by the board positioning section 16. It is conveyed to area 12.

  The board positioning unit 16 positions the board by moving the electronic circuit board 14 on which the electronic component is to be mounted up and down in the Y direction (conveying axis orthogonal direction) in the component mounting area 12, and is a target position on the electronic circuit board 14. The Y coordinate component of the mounting coordinates can be determined.

  The mounting head positioning unit 22 positions the mounting head unit 17 in the Y-axis direction by the Y-axis linear motors 23A and 23B and in the X-axis direction by the X-axis linear motors 24U and 24L, and mounts electronic components on the electronic circuit board 14. It is possible to determine the X coordinate axis and the Y coordinate component of the mounting coordinates, which are the upper target positions.

  Here, the positioning operation of the upper part of the surface mount component mounting machine 10 will be specifically described based on the flowchart of FIG.

i) Determining whether the part is a specific part (step S1)
The production program determines whether the electronic component to be picked up or picked up is a specific component. Here, the specific component is disturbed by the movement of the electronic circuit board 14 such as an IC component requiring high mounting accuracy, a tall component such as an aluminum electrolytic capacitor, or a heavy component such as a transformer. Parts.

  If it is not a specific part, the process proceeds to step S2, and if it is a specific part, the process proceeds to step S3.

ii) Positioning in the X direction by the mounting head positioning portion, and positioning in the Y direction by the substrate positioning portion (step S2)
When the electronic component supplied from the component supply unit 26U is not a specific component, the mounting head units 18U and 19U have a pickup position on the component supply device 28 with respect to the movement in the Y-axis direction (the Y coordinate of the pickup coordinate). After the electronic component is picked up, the positioning movement is performed only in the X-axis direction, and the mounting coordinates are positioned in the X-axis direction. Positioning in the Y-axis direction is performed by the board positioning unit 16U, and positioning is performed in a mode in which electronic components can be mounted at target positions on the electronic circuit board 14 by positioning both the board positioning unit 16U and the mounting head positioning unit 18U or 19U. I do.

iii) Stopping the substrate and positioning in the X and Y directions by the mounting head positioning unit (step S3)
On the other hand, in the case of a specific component having a large mass such as a large capacitor or large IC component supplied from the large component supply unit 30U or a transformer supplied from the component supply unit 26U, the positioning by the substrate positioning unit 16U is not performed. The movement of the electronic circuit board 14 is stopped, and only the mounting head positioning unit 22, that is, the mounting head unit 17 is moved in the plane direction of the X and Y axes by the X axis linear motor 24U and the Y axis linear motors 23A and 23B. Then, positioning is performed in a mode in which a specific component can be mounted at a target position on the electronic circuit board 14.

  As described above, positioning is performed according to the mounted component, and the electronic component is mounted on the electronic circuit board 14.

  The positioning operation of the lower part of the surface mount component mounting machine 10 is the same as the positioning operation of the upper part.

  For specific parts such as an aluminum electrolytic capacitor, the movement of the electronic circuit board 14 is stopped by not performing the positioning by the board positioning part 16, and the mounting head positioning part 22 that can move in the plane direction causes the mounting on the electronic circuit board 14. Since the target position is determined, there is no vibration of the electronic circuit board 14 at the time of mounting, it can be mounted with high accuracy and reliability, and even after mounting, the electronic circuit board 14 is not moved before the solder is solidified. , Tall electronic components do not fall down and can be mounted with high precision, resulting in high quality products. Conventionally, it has been necessary to reduce the operation speed of the substrate positioning unit in order to prevent the occurrence of misalignment, but in this embodiment, the operation of the mounting head positioning unit according to the operation speed of the substrate positioning unit. It is not necessary to reduce the speed, and high-speed mounting is possible only with the mounting head positioning portion.

  Further, the movement of the mounting head in the X-axis direction can be performed at a higher speed, unlike the movement of the Y-axis linear motors 23A and 23B that also move the X-axis linear motors 24U and 24L. Therefore, in the case of a component that is not a specific component, the mounting head portion is moved only in the X-axis direction on the component pickup position to perform positioning in the X-axis direction. By moving in the Y-axis direction and positioning both the substrate positioning unit and the mounting head positioning unit, the component can be mounted at a target position on the substrate at a higher operating speed.

  In this way, by making it possible to select the positioning mode according to the mounted component, it is not necessary to reduce the operation speed of the board positioning unit across all component types in order to prevent the displacement of the mounted component. Specified parts can be mounted at high speed only with the mounting head positioning section, and the mounting productivity can be improved in total.

  In particular, in the case where a specific part is mounted after mounting of a non-specific part, or when a non-specific part is mounted after mounting of a specific part, step S2 as in the embodiment of the present invention is performed. By switching between the mode in step 3 and the mode in step 3, it is possible to mount with high accuracy and improve mounting productivity.

  Further, the upper side of the surface mounting component mounting machine 10 (the same applies to the lower side) is supplied from the mounting head unit 18U that mainly picks up electronic components supplied from the component supply unit 26U and the large component supply unit 30U. By providing the mounting head portion 19U that mainly picks up the components, the components can be efficiently supplied to the substrate from both sides.

  In addition, since the electronic component can be mounted on two substrates at the same time, the productivity is high.

  In this embodiment, the substrate is positioned in a direction orthogonal to the substrate transport direction, but a component mounting area is provided on the substrate transport path, the substrate is positioned in the transport direction, and an X-axis linear motor is provided. A Y-axis linear motor may be mounted on the Y-axis linear motor, and a mounting head unit may be provided on the Y-axis linear motor to supply components from both sides of the conveyance path. In addition, the component supply apparatus 28 is mounted in parallel in the direction orthogonal to the conveyance direction. In this case, it is not necessary to change the direction from the conveyance path and move to the component mounting area.

  Moreover, as a mode in which the movement of the board is stopped, the timing of stopping the board and the time during which the board is stopped may be changed for each part. It may be controlled by a production program. In addition to not performing positioning by the substrate positioning unit, the movement of the substrate may be actively applied to stop the movement of the substrate.

  The driving means of the positioning unit is not limited to the linear motor, and may be a ball screw, a timing belt, or the like, and is not limited to the present embodiment.

  In addition, the present invention is intended to improve the productivity of mounting with high accuracy, and can be applied to mounting general parts on a certain board (not necessarily a flat surface), and is therefore limited to an electronic circuit board. However, the component is not limited to the electronic component used in the present embodiment, and may be a screw or the like.

  The production program is a program for controlling the surface mount component mounting machine, and includes, for example, control of the positioning unit, control of board conveyance, component mounting procedure, and the like.

Plan view showing the overall configuration of a conventional surface mount component mounting machine The top view which shows the whole structure of the surface mounting component mounting machine which concerns on embodiment of this invention Flow chart showing positioning procedure

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Surface mount component mounting machine 12 ... Component mounting area 14 ... Electronic circuit board 16 ... Board positioning part 17 ... Mounting head part 22 ... Mounting head positioning part

Claims (1)

In a surface mounting component mounting machine for mounting a component picked up by a mounting head on a substrate,
A board positioning unit for positioning the board by moving the board on which the part is mounted in one direction in the component mounting area;
A mounting head positioning part for positioning the mounting head part by moving the mounting head part picked up in the plane direction,
Depending on the mounting component, the mode in which the component is mounted at the target position on the substrate by positioning both the substrate positioning unit and the mounting head positioning unit, the movement of the substrate is stopped, and only the mounting head positioning unit A surface mount component mounting machine, wherein a mode in which a component is mounted at a target position on a substrate by positioning is selectable.

Images