JP2007234681A - Semiconductor manufacturing apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing apparatus which can change the attitude of a semiconductor device beforehand that is used in the next step, and can house or convey the semiconductor device. <P>SOLUTION: The semiconductor manufacturing apparatus 1 is provided with a first suction head 11 to suck a semiconductor device 3 in first attitude, a rotary mechanism 12 to turn the first suction head by 90° from the first attitude of the semiconductor device to a second attitude thereof, and a second suction head 31 to suck the semiconductor device in second attitude. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a semiconductor manufacturing apparatus, and more particularly, to an apparatus for transporting a semiconductor device to a device or the like that is attracted by negative pressure and mounted on a substrate.

  For example, a handler as an example of a semiconductor manufacturing apparatus adsorbs each semiconductor device (for example, Chip Size Package) held by a carrier tape such as a UV tape by negative air pressure and stores it on a storage tray. It is used as a device that transports the substrate to the mounting process.

  For example, as disclosed in Patent Document 1, a conventional handler transports a semiconductor device in an attracted posture or transports it in a posture reversed 180 degrees. As a result, the transferred semiconductor device can be stored in the storage tray or mounted on the substrate in the transfer posture.

Specifically, as shown in FIG. 12A, the upper surface of the semiconductor device 101 is sucked by the suction head 102 and is transported onto the storage tray 103 as it is. 12B, the upper surface of the semiconductor device 101 is sucked by the suction head 102, and the semiconductor device 101 is inverted 180 degrees together with the suction head 102. Then, the upper surface (bottom surface) of the semiconductor device 101 is sucked by another suction head 104 and conveyed onto the storage tray 103 in a posture inverted by 180 degrees.
Japanese Patent Laid-Open No. 2002-252251 (FIGS. 1, 2, etc.)

  However, some semiconductor devices, such as semiconductor acceleration sensors and geomagnetic sensors, are mounted on a substrate in a posture (vertical posture) rotated 90 degrees vertically from a posture on the carrier tape (lateral posture). is there. In this case, as described above, when proceeding to the mounting process in the horizontal position or in a 180-degree inverted position, it is necessary to vertically rotate the semiconductor device by 90 degrees in the mounting process, which complicates the mounting process. It takes longer time.

  An object of the present invention is to provide a semiconductor manufacturing apparatus which can be transported and stored after changing the posture of the semiconductor device to a posture suitable for the next process or the like.

  A semiconductor manufacturing apparatus according to one aspect of the present invention includes a first suction head that sucks a semiconductor device in a first posture, and a second posture in which the semiconductor device is vertically rotated 90 degrees with respect to the first posture. A rotation mechanism for rotating the first suction head and a second suction head for sucking the semiconductor device in the second posture are provided.

  In the above invention, the first suction head may be provided with a receiving portion that comes into contact with the second surface of the semiconductor device opposite to the first surface that is sucked by the second suction head. In this case, a suction force may be applied to the semiconductor device by the first suction head so that the second surface is brought into contact with the receiving portion.

  Furthermore, a transport mechanism that transports the semiconductor device sucked by the second suction head in the second posture may be provided.

  Further, the rotating mechanism causes the first operation to rotate the first suction head so that the semiconductor device is in the second posture, and the third posture in which the semiconductor device is inverted 180 degrees with respect to the first posture. The second operation of rotating the first suction head may be performed so that

  According to the present invention, the semiconductor device sucked by the first suction head is moved to the second suction head in a posture (second posture) rotated 90 degrees vertically from the posture at the time of suction (first posture). It can be adsorbed and transported or stored. For this reason, in the next step, for example, the step of mounting the semiconductor device in the second posture on the substrate, it is not necessary to rotate the semiconductor device to the second posture, simplifying the next step or reducing the time required for the next step. Can be.

  In particular, by providing the receiving portion in the first suction head, the semiconductor device can be reliably and stably delivered from the first suction head to the second suction head.

  Embodiments of the present invention will be described below with reference to the drawings.

  FIG. 1 shows a plan view of a handler as a semiconductor manufacturing apparatus that is Embodiment 1 of the present invention. Here, of the two axes that are parallel to the sheet of FIG. 1 and orthogonal to each other, the axis that extends to the left and right in the figure is the X axis, and the axis that extends vertically is the Y axis. In addition, an axis perpendicular to the paper surface of FIG.

  In FIG. 1, 1 is a handler body, and 2 is a base of the handler. A ring in which a circular UV carrier tape 4 with a large number of semiconductor chips (semiconductor devices) 3 attached thereto is adsorbed and fixed by negative air pressure at a position on the upper left of the base 2 in the figure (hereinafter referred to as a reverse position). A frame 5 is arranged.

  Each semiconductor chip 3 is cut out in a rectangular parallelepiped shape by a dicing apparatus (not shown) from a circular wafer after forming a circuit attached to the UV carrier tape 4. In the present embodiment, a sensor chip is assumed as a semiconductor chip mounted in a vertical posture with respect to a product substrate. For example, a chip for a sensor such as a semiconductor acceleration sensor or a geomagnetic sensor that is mounted on a product such as an automobile, a car navigation system, a camera, a mobile phone, a game machine, or a GPS and detects acceleration, vibration, and geomagnetism in the vertical direction is assumed. . However, the semiconductor device referred to in the present invention is not limited to such a sensor chip, but includes all semiconductor devices that can be adsorbed by negative air pressure.

  Further, each semiconductor chip 3 may be a chip immediately after being cut out by a dicing apparatus, or may be a chip that has been tested after being cut out.

  The semiconductor chips 3 on the UV carrier tape 4 at the reversal position are sucked by the suction reversing device 10 one by one and then peeled off from the UV carrier tape 4, and then their postures are changed.

  The suction reversing unit 10 includes a suction head (first suction head: hereinafter referred to as a reversing head) 11 that sucks the semiconductor chip 3 disposed at a predetermined suction position in the reversing position by negative air pressure, and the reversing head 11. And a stepping motor 12 as a rotating mechanism for rotating the motor vertically (rotating in the Z-axis direction). The portion of the reversing head 11 that contacts the semiconductor chip 3 is made of an elastic material such as rubber, a metal material such as aluminum having good workability, or a resin material.

  An arm 13 extending in a direction perpendicular to the rotating shaft 12a is fixed to the tip of the rotating shaft 12a of the stepping motor 12. A reversing head 11 is fixed to the tip of the arm 13. For this reason, when the stepping motor 12 rotates, the reversing head 11 rotates around the rotating shaft 12a extending in the Y-axis direction, and the semiconductor chip 3 attracted to the reversing head 11 rotates vertically. In this embodiment, a case where a stepping motor is used as a rotating mechanism for rotating the reversing head 11 vertically will be described. However, another actuator may be used as the rotating mechanism.

  In the reverse position, the ring frame 4 is slid in the X axis direction and the Y axis direction. Thereby, the semiconductor chips 3 on the UV carrier tape 4 are sequentially conveyed to the suction position by the reversing head 11.

  In addition, a ring frame 6 on which a UV carrier tape (not shown) on which a plurality of semiconductor chips are bonded is mounted on the base 2 at a lower left position in the drawing. After all the semiconductor chips 3 are peeled off from the UV carrier tape 4 at the reverse position, the next ring frame 6 (that is, the UV carrier tape to which the semiconductor chip is attached) is conveyed to the reverse position by the drive mechanism 7, The UV carrier tape is adsorbed and fixed to the ring frame 6 by negative air pressure at the reverse position.

  Further, a storage tray 21 is disposed on the base 2 at the upper right position in the figure (hereinafter referred to as a storage position). The semiconductor chip 3 attracted by the reversing head 11 at the reversing position and peeled off from the UV carrier tape 4 is rotated 90 degrees longitudinally together with the reversing head 11 by the rotational drive of the stepping motor 12 and then attracted by the suction housing unit 30. Then, it is conveyed and stored on the storage tray 21. In the present embodiment, “90 degrees” and “180 degrees” include not only perfect 90 degrees and 180 degrees but also an angle different from the angle within the allowable error range.

  The suction storage unit 30 includes a suction head (second suction head: hereinafter referred to as a storage head) 31 that sucks the semiconductor chip 3 by negative air pressure, a support member 32 that supports the storage head 31, and the support member 32. Rails 33 and 34 for guiding the motor in the X-axis direction and the Y-axis direction. The rail 34 may be replaced by a Y-direction feed mechanism for the storage tray described later.

  The support member 32 (that is, the storage head 31) is driven in the X-axis direction and the Y-axis direction while being guided by the rails 33 and 34 by the driving force of a transport actuator (not shown). The storage head 31 is driven in the Z-axis direction by the driving force of a lifting actuator (not shown) attached to the support member 32. These rails 33, 34, the transport actuator and the lifting actuator constitute a transport mechanism.

  The storage tray 21 is disposed on the base 2 at an upper right position in the figure (hereinafter referred to as a storage position). A next storage tray (empty tray) 22 is disposed on the base 2 at the lower right position in the figure.

  The storage trays 21 and 22 hold the semiconductor chip 3 in the vertical posture (second posture) rotated 90 degrees vertically from the horizontal posture (first posture) when sucked by the reversing head 11 on the UV carrier tape 4. A plurality of pieces can be stored in the vertical posture.

  When a predetermined number of semiconductor chips 3 are stored in the storage tray 21 in the storage position, the storage tray 21 is stored in a rack (not shown), and the empty tray 22 is conveyed to the storage position.

  The semiconductor chip 3 stored in the storage tray 21 in a vertical posture is mounted in a vertical posture on the product substrate as described above by a mounting device (not shown).

  Although not shown, the handler is provided with a vacuum source that supplies negative air pressure to the ring frame 5 (6), the reversing head 11, and the storage head 31.

  A controller 51 controls the operations of the suction reversal unit 10 and the suction storage unit 30, the XY direction drive of the ring frame 5, and the transport operation of the ring frame 6 and the storage tray 22.

  FIG. 2 shows a front view of the ring frame 5, the reversing head 11, the storage head 31, and the storage tray 21. As shown by the solid line in the figure, the reversing head 11 is located at the 0 ° position for adsorbing the semiconductor chip 3 on the UV carrier tape 4 and the position rotated 90 from the 0 ° position, and indicated by the dashed line in the figure. It can be rotated vertically between the position (I).

  In the reverse position, the semiconductor chip 3 arranged at a predetermined suction position is pushed up from the lower surface side of the UV carrier tape 4 by the pin 41 a of the push-up actuator 41. Thereby, the semiconductor chip 3 arranged at a predetermined suction position is reliably sucked by the reversing head 11, and the peeling from the UV carrier tape 4 is also promoted.

  As shown in FIG. 3, the reversing head 11 has an upper surface suction portion 11a and a side surface suction portion 11b extending so as to be perpendicular to the upper surface suction portion 11a. When the semiconductor chip 3 in the horizontal position on the UV carrier tape 4 is adsorbed by the reversing head 11, the upper surface 3a of the semiconductor chip 3 is in close contact with the upper surface adsorbing portion 11a. The side surface (second surface) 3b of the semiconductor chip 3 is in close contact with the side surface adsorption portion 11b.

  When the reversing head 11 is rotated from the 0 ° position to the 90 ° position (I) and the semiconductor chip 3 is in the vertical posture as shown by the white arrow in FIG. It functions also as a receiving part which supports the side surface 3b.

  Then, the upper surface (first surface) 3c opposite to the surface 3b of the semiconductor chip 3 in which the lower surface 3b is received by the receiving portion is attracted by the storage head 31. Is done.

  Here, since the receiving portion is provided in the reversing head 11, when the storage head 31 comes into contact with the upper surface 3 c of the vertical semiconductor chip 3, the semiconductor chip 3 is moved downward from the reversing head 11. Can be prevented from shifting or falling.

  Further, when viewed from the central axis direction of the vertical rotation shown in FIG. 3, the side surface adsorbing portion 11 b that is a receiving portion is in contact with a region that is 1/2 or more of the lower surface 3 b of the semiconductor chip 3 in the vertical posture. It extends from the upper surface adsorption part 11a. Thereby, when the storage head 31 comes into contact with the upper surface 3 c of the semiconductor chip 3, it is possible to prevent the semiconductor chip 3 from rotating from the tip of the receiving portion as a fulcrum and falling off the reversing head 11. In order to further enhance the drop-off preventing effect, the side surface adsorbing portion 11b is extended from the upper surface adsorbing portion 11a so as to come into contact with a region of 2/3 or more of the lower surface 3b of the lower semiconductor chip 3. It is good to let them.

  By providing the reversing head 11 with the receiving portion as described above, the positional accuracy of the storage head 31 required when the semiconductor chip 3 rotated in the vertical posture is attracted by the storage head 31 can be relaxed. That is, the suction pad 31a of the storage head 31 is formed of an elastic material such as rubber, and the storage head 31 is moved to an appropriate position where the suction pad 31a contacts the upper surface 3c of the semiconductor chip 3 and elastically deforms to some extent. If lowered, the semiconductor chip 3 can be reliably adsorbed.

  If the reversing head 11 has no receiving portion, if the storage head 31 is lowered too much from the uppermost position where the suction pad 31a contacts the upper surface 3c of the semiconductor chip 3, the semiconductor chip 3 is pressed by the pressing force of the suction pad 31a. Is greatly displaced or dropped downward from the reversing head 11. Thereby, there is a possibility that the semiconductor chip 3 cannot be sucked. Therefore, it is necessary to strictly control the lowered position of the storage head 31 between the uppermost position where the suction pad 31a contacts the upper surface 3c of the semiconductor chip 3 and the position slightly below it.

  In order to perform such strict position control, it is necessary to use a lowering actuator having a higher position resolution than in other cases, which causes an increase in cost. In addition, it is necessary to slow down the lowering speed of the storage head 31, and it takes a long time to transfer the semiconductor chip 3 from the reversing head 11 to the storage head 31. For this reason, it leads to the fall of the conveyance speed of the semiconductor chip 3 from the UV carrier tape 4 to the storage tray 21.

  When the semiconductor chip 3 is sucked by the storage head 31, the suction by the reversing head 11 is released, and then the semiconductor chip 3 is transported and stored on the storage tray 21 in the vertical position by driving the transport mechanism.

  In the handler according to the present embodiment, the reversing head 11 can be rotated 180 degrees vertically in addition to being able to rotate 90 degrees vertically. In FIG. 1, 52 is a switch for switching the angle setting of the vertical rotation of the reversing head 11 between 90 degrees and 180 degrees. The controller 51 controls the vertical rotation angle of the reversing head 11 to 90 degrees and 180 degrees in accordance with the input signal from the reversing angle changeover switch 52. A position (II) indicated by a one-dot chain line in FIG. 2 indicates a position (hereinafter, referred to as a 180 ° position) where the reversing head 11 is rotated 180 degrees vertically with respect to the 0 ° position.

  As shown in FIG. 4, in a state where the reversing head 11 sucks the semiconductor chip 3 at the 0 ° position and then rotates to the 180 ° position (II), the upper surface sucking portion 11 a functions as a receiving portion for the semiconductor chip 3. The upper surface (bottom surface) of the semiconductor chip 3 is reliably attracted by the storage head 31. In this case, the upper surface adsorbing portion 11a, which is a receiving portion, has a side adsorbing portion so as to abut a half or more of the lower surface of the semiconductor chip 3 when viewed in the central axis direction of the vertical rotation shown in FIG. It is good to extend from 11b.

  When the semiconductor chip 3 reversed by 180 ° is sucked by the storage head 31, the suction by the reversing head 11 is released, and then the semiconductor chip 3 is transported on the storage tray 21 ′ in the inverted posture by driving the transport mechanism. Stored.

  FIG. 8A shows an example of a cross-sectional shape of the reversing head 11. In the reversing head 11, a negative pressure path that opens so as to include a right angle portion formed by the upper surface suction portion 11 a and the side surface suction portion 11 b, that is, a portion facing the corner portion formed by the upper surface 3 a and the side surface 3 b of the semiconductor chip 3. 11c is formed.

  When a negative pressure is supplied from a vacuum source (not shown) to the negative pressure path 11c, the semiconductor chip 3 has the reversing head 11 so that the upper surface 3a thereof is in close contact with the upper surface adsorption portion 11a and the side surface 3b is in close contact with the side surface adsorption portion 11b. It is adsorbed by.

  Thereby, the semiconductor chip 3 is held by the reversing head 11 in a stable state in which the two surfaces of the upper surface 3 a and the side surface 3 b are in contact with the reversing head 11. Therefore, it is possible to improve the stability of the semiconductor chip 3 when the reversing head 11 is rotated vertically or when the semiconductor chip 3 is transferred from the reversing head 11 to the storage head 31.

  2 can be positioned in the X-axis direction in FIG. 2 with respect to the reversing head 11 of the semiconductor chip 3 in the lateral posture.

  Further, as shown in FIG. 8B, if the reversing head 11 is provided with two side surface adsorbing portions 11b1 and 11b2 that are in contact with two adjacent side surfaces 3b1 and 3b2 of the semiconductor chip 3, the reversal of the semiconductor chip 3 in the lateral position is reversed. Positioning in the X-axis direction and the Y-axis direction with respect to the head 11 can also be performed.

  By these positioning, the semiconductor chip 3 can be properly conveyed and stored in a predetermined storage position (a recess formed in accordance with the shape of the semiconductor chip 3) on the storage tray 21. Of course, by providing the reversing head 11 with the two side surface suction portions 11b1 and 11b2, the stability of the semiconductor chip 3 during the longitudinal rotation of the reversing head 11 or during chip transfer can be further improved.

  The shape of the reversing head in the present invention is not limited to that shown in FIGS. 8A and 8B. For example, as shown in FIG. 9, the negative pressure path 11c ′ may be formed so as to open only at the upper surface suction portion 11a ′ of the reversing head 11 ′. In this case, when the semiconductor chip 3 is attracted by the reversing head 11 ′, a gap is formed between the side surface 3b of the semiconductor chip 3 and the receiving portion 11b ′, or the semiconductor chip 3 is rotated laterally with respect to the receiving portion 11b ′. It may become a state. However, when the semiconductor chip 3 is rotated vertically and is attracted by the storage head 31, it is pushed downward by the storage head 31 and the side surface 3b comes into contact with the receiving portion 11b 'and moves further downward. Is prevented or the horizontal rotation state is corrected. For this reason, the semiconductor chip 3 can be reliably adsorbed by the storage head 31.

  Further, as shown in FIG. 10, a negative pressure path 11c ″ may be formed which branches in the reversing head 11 ″ and has an opening at the upper surface suction portion 11a ″ and an opening at the side surface suction portion 11b ″. In this case, in the reversing head 11 ″, if a relief 11d ″ is provided at a right angle portion where the corner portion formed by the upper surface 3a and the side surface 3b of the semiconductor chip 3 faces each other, interference between the corner portion and the right angle portion is prevented. In addition, it is possible to appropriately perform the suction at the upper surface suction portion 11a ″ and the side surface suction portion 11b ″.

  FIG. 5 shows a transfer operation control sequence of the semiconductor chip 3 from the reversing head 11 to the storage head 31 when the reversing head 11 has a receiving portion (side suction portion 11b) as in this embodiment. . This control is executed by the controller 51 that operates according to the computer program.

  FIG. 6 shows a semiconductor chip transfer operation control sequence when the reversing head does not have a receiving portion. Further, FIG. 7 shows the delivery operation timing in both cases. In FIG. 7, when the reversing head 11 has a receiving part, a different part from the case where it does not have a receiving part is shown with a double line.

  As shown in FIG. 5, when using the reversing head 11 having the receiving portion, the controller 51 first reads the state of the reversing angle changeover switch 52 and sets the rotation angle of the reversing head 11 after adsorbing the semiconductor chip 3. . Here, it is assumed that the rotation angle is set to 90 °. Then, the semiconductor chip 3 is sucked by the reversing head 11 at the 0 ° position.

Next, the controller 51 starts rotating the reversing head 11 to the 90 ° position. The starting point of this rotation is shown as an operation starting time T ₀ in Figure 7. When the reversing head reaches the 90 ° position, the controller 51 stops the rotation of the reversing head 11.

  Next, the controller 51 starts lowering the storage head 31 and starts supplying negative pressure to the storage head 31. In FIG. 5 and FIG. 7, this is referred to as “adsorption ON”. Then, almost simultaneously with the completion of the lowering of the storage head 31, the supply of negative pressure to the reversing head 11 is stopped (vacuum break). In the figure, this is referred to as “adsorption OFF”.

Thereafter, when the suction sensor (not shown) detects that the suction of the semiconductor chip 3 by the reversing head 11 is released (OFF) and the suction of the semiconductor chip 3 by the storage head 3 is executed (ON). The counting of a predetermined time T _S is started by the adsorption stabilization timer in the controller 51.

  Here, the controller 51 monitors the negative pressure (degree of vacuum) supplied to each head through the suction sensor, and if the degree of vacuum is higher than a predetermined value, suction has been executed or suction has not been released. Is determined. On the other hand, when the degree of vacuum is lower than the predetermined value, it is determined that the suction has been released or the suction has not been executed.

Further, the adsorption stabilization timer is a margin time (predetermined time T _S ) for causing the storage head 31 to more reliably attract the semiconductor chip 3 after the suction sensor detects the suction release of the semiconductor chip 3 by the reversing head 11. ).

Then, the controller 51, the predetermined time T _S has elapsed, starts to rise in the housing head 31.

When the raising of the storage head 31 is completed, the controller 51 starts the rotation for returning the reversing head 11 to the 0 ° position, and ends the rotation when the reversing head 11 reaches the 0 ° position. Thereafter, the storing operation of the storage tray 21 of the semiconductor chip 3 due to the operation of the transport mechanism of the suction housing unit 30 is made, in Fig. 7, 0 ° operation completion time T _F of at returning to the position of the inversion head 11 As shown. Note that the supply of negative pressure to the reversing head 11 is resumed as the reversing head 11 returns to the 0 ° position.

On the other hand, as shown in FIG. 6, when using a reversing head that does not have a receiving portion, the reversing head has a receiving portion from the start of operation until the storage head is lowered and negative pressure supply to the receiving head is started. Same as the case. In addition, a predetermined time T _S ′ (which may be the same as or different from T _S ) is counted by a suction stabilization timer on condition that suction by the reversing head by the suction sensor and detection of suction by the storage head are detected. The operation until the storage head is raised and the reversing head is returned to the 0 ° position is the same as that when the reversing head 11 has a receiving portion.

  However, when using a reversing head that does not have a receiving portion, after the lowering of the storage head is completed, negative pressure is supplied to the reversing head until it is determined that the suction of the semiconductor chip by the storage head has been performed through the suction sensor. continue. This is different from the case where the reversing head 11 having the receiving portion is used.

  This is because if the reversing head has no receiving part, the semiconductor chip may be displaced downward or fall with respect to the reversing head even if the storage head supplied with negative pressure is lowered to a position where it comes into contact with the semiconductor chip. This is because it is necessary to confirm whether or not the semiconductor chip is adsorbed by the storage head.

  On the other hand, in the case where the reversing head 11 has a receiving portion, if the storage head 31 to which negative pressure is supplied is lowered to a position where it contacts the semiconductor chip 3 (position where the suction pad 31a is elastically deformed to some extent), the semiconductor The chip 3 is reliably adsorbed by the storage head 31. For this reason, even if the suction of the semiconductor chip 3 by the storage head 31 is not confirmed by the suction sensor, the negative pressure supply to the reversing head 11 can be stopped (the suction is released).

In this way, the start timing of the suction stabilization timer (predetermined time T _S ), that is, the storage head, is set by advancing the stop timing of the negative pressure supply to the reversing head 11 as compared with the case where the reversing head has no receiving portion. The detection timing of the suction release by the reversing head 11 by the suction sensor, which is one of the conditions of the lifting operation 31 and the returning operation of the reversing head 11, is also advanced. Accordingly, the time until the final operation is completed (time T _F ) is shorter than the time until the operation is completed (time T _F ′) when the reversing head has no receiving portion.

  As described above, according to this embodiment, the horizontal semiconductor chip 3 attracted by the reversing head 11 is rotated to the vertical position and transferred to the storage head 31, and conveyed and stored on the storage tray 21 in the vertical position. can do. For this reason, it is not necessary to rotate the semiconductor chip 3 in the vertical posture in the next step (mounting step on the product substrate), and the next step can be simplified or the time required for the next step can be shortened.

  In the first embodiment, the merit when the receiving portion is provided in the reversing head has been described in comparison with the case where the receiving portion is not provided. This is because the receiving portion is not provided in the reversing head as an embodiment of the present invention. It does not mean to exclude the case.

  FIG. 11 shows a handler as a second embodiment of the present invention, in which the reversing head does not have a receiving portion. In FIG. 11, components common to the first embodiment are denoted by the same reference numerals as in the first embodiment.

  In FIG. 11, reference numeral 61 denotes a reversing head, and a 0 ° position for adsorbing the upper surface of the semiconductor chip 3 in the horizontal position by the driving force of the stepping motor 12 described in the first embodiment (only the rotating shaft 12a is shown). The semiconductor chip 3 can be rotated to a 90 ° position with the vertical posture.

  In the present embodiment, a member for suppressing the slip of the semiconductor chip 3 in the in-plane direction (vertical direction) of the upper surface 3a is disposed in a portion 61a of the reversing head 71 that is in contact with the upper surface 3a of the semiconductor chip 3. . Specifically, a member having adhesiveness is disposed in the portion 61a, or an electromagnet that adsorbs a semiconductor chip using a magnetic material for an electrode or the like by a magnetic force is disposed. The portion 61a may be subjected to a surface treatment for suppressing the slip of the semiconductor chip 3.

  Thus, even if the reversing head 61 is not provided with a receiving portion, it is possible to make it difficult for the vertical semiconductor chip 3 to be displaced downward or dropped with respect to the reversing head 61, and the semiconductor from the reversing head 61 to the storage head 31. The delivery of the chip 3 can be performed stably and in a short time.

  In each of the above embodiments, the case where the semiconductor chip passed from the reversing head (first suction head) to the storage head (second suction head) is stored on the storage tray has been described. The manufacturing apparatus is not limited to this. For example, it is possible to mount a vertically oriented semiconductor chip sucked by the second suction head on the substrate as it is using the second suction head.

1 is a plan view of a handler that is Embodiment 1 of the present invention. FIG. 6 is a front view showing the periphery of the reversing head and the storage head in the handler according to the first embodiment. FIG. 6 is a front view illustrating operations of the reversing head and the storage head in the handler according to the first embodiment. FIG. 6 is a front view illustrating operations of the reversing head and the storage head in the handler according to the first embodiment. 6 is a flowchart illustrating an operation sequence of a handler according to the first embodiment. The flowchart which shows the operation | movement sequence of the handler using the inversion head which does not have a receiving part. 6 is a timing chart showing operation timing of a handler using the first embodiment and a reversing head having no receiving portion. Sectional drawing which shows the shape of the inversion head in the handler of Example 1. FIG. FIG. 3 is a perspective view illustrating a shape of a reversing head in the handler according to the first embodiment. FIG. 6 is a perspective view illustrating a modification of the reversing head in the handler according to the first embodiment. FIG. 6 is a perspective view illustrating a modification of the reversing head in the handler according to the first embodiment. The front view which shows the operation | movement of the inversion head and storage head in the handler which is Example 2 of this invention. The figure which shows operation | movement of the conventional handler. The figure which shows operation | movement of the conventional handler.

Explanation of symbols

1 Handler 3 Semiconductor chip Ring ring 11, 61 Reversing head 11b Side suction part (receiving part)
12 Stepping motors 21, 22 Storage tray 31 Storage head

Claims (5)

A first suction head for sucking the semiconductor device in the first position;
A rotation mechanism for rotating the first suction head so that the semiconductor device is in a second posture vertically rotated by 90 degrees with respect to the first posture;
A semiconductor manufacturing apparatus comprising: a second suction head that sucks the semiconductor device in the second posture.   2. The first suction head has a receiving portion that abuts against a second surface of the semiconductor device opposite to the first surface that is sucked by the second suction head. The semiconductor manufacturing apparatus described in 1.   The semiconductor manufacturing apparatus according to claim 2, wherein the first suction head applies an suction force to the semiconductor device such that the second surface is in contact with the receiving portion.   4. The semiconductor manufacturing apparatus according to claim 1, further comprising a transport mechanism configured to transport the semiconductor device sucked by the second suction head in the second posture. 5. The rotation mechanism includes: a first operation for rotating the first suction head so that the semiconductor device is in the second posture; and a first operation in which the semiconductor device is inverted 180 degrees with respect to the first posture. 5. The semiconductor manufacturing apparatus according to claim 1, wherein a second operation of rotating the first suction head so as to be in a posture of 3 is performed.