JP2007214227A - Board holding device, board holding method, part mounting device and method utilizing the both - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To disclose a board holding device, a board holding method, a part mounting device and a part mounting method, wherein an inconvenience is avoided in mounting parts with a deformation of a circuit board. <P>SOLUTION: A circuit board 14 is curved arcuately so as to absorb a deformation of the circuit board 14, and is restricted and held by a board holding device 20. For this reason, the circuit board 14 is supported from both sides in a widthwise direction, and a height of a plurality of support pins 28 is appropriately selected for supporting the back of the circuit board 14. It is possible to select the appropriate support pin 28 from among the support pins 28 having various heights, and to select a support height by expanding and contracting a height of the support pin 28. Alternatively, a support block 38 having a curved face corresponding to the desired curved shape of the supported circuit board 14 is abutted on the back of the circuit board. Further, the supported circuit board 14 may be held by being pressed from both sides of a support. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a component mounting apparatus and component mounting method for mounting components on a circuit board. More specifically, the present invention relates to a substrate holding device that regulates and holds a circuit board during component mounting, a substrate holding method, a component mounting device that uses the substrate holding device and method, and a component mounting method.

  An example of a component mounting apparatus is shown in FIG. In the figure, a component mounting apparatus 1 includes a component supply unit 2 that supplies components to be mounted, a mounting head 4 that takes out components from the component supply unit 2 using a suction nozzle 3 and mounts them on a circuit board 14, and a mounting head. A robot 5 that transports 4 to a predetermined position, a component recognition device 6 that captures an image of the component held by the suction nozzle 3 and recognizes a deviation in position and angle, and a substrate holding device 7 that carries in and holds the circuit board 14. And a control unit 9 for controlling the overall operation.

  During the operation of the component mounting apparatus 1 configured as described above, the mounting head 4 moves to a position facing the component supply apparatus 8 mounted on the component supply unit 2 by conveyance of the robot 5, and uses the suction nozzle 3. Then, the parts are taken out from the parts supply device 8. Thereafter, the suction nozzle 3 moves to a position facing the component recognition device 6 by the movement of the mounting head 4, and recognizes the holding state of the component including the position and angle deviation of the sucked component.

  During this time, the circuit board 14 is carried into the component mounting apparatus 1 and is held at a predetermined mounting position by the board holding apparatus 7. The mounting head 4 holding the components on the suction nozzle 3 moves to a position facing the circuit board 14 by the conveyance of the robot 5. The board recognition device 15 attached to the mounting head 4 captures an image of the circuit board 14, recognizes the position / angle shift, and transmits the recognition result to the control unit 9. The control unit 9 is loaded with NC data in which the mounting positions of the components mounted on the circuit board 14 are recorded in advance. Based on the state of the component input from the component recognition device 6 and the state of the circuit board 14 input from the substrate recognition device 15, the control unit 9 commands the necessary correction for the position and angle of the suction nozzle 3.

  The mounting head 4 corrects the position and angle of the component 10 based on the command, and mounts the component 10 at a predetermined mounting position on the circuit board 14 using the nozzle 3. The mounting head 4 that has finished mounting the component moves again to the position facing the component supply device 8 by the transport of the robot 5, and repeats the operation so far. The circuit board 14 that has finished mounting all the predetermined components is carried out of the component mounting apparatus 1 by the board holding device 7, and then the next circuit board 14 is carried in and the operation so far is repeated.

  FIG. 6 shows the substrate holding device 7 that holds the circuit board 14 at the mounting position, and a part of the front side is cut off. In the figure, the circuit board 14 is held from both sides in the width direction by a pair of rail units 21 extending in the X direction and facing each other. Each rail unit 21 is provided with a groove 22 in a direction facing each other, and a flat belt 23 is stretched along the groove 22 so as to be movable. The flat belt 23 drawn in two stages is connected to both ends of the X direction (not shown) to be endless, and is engaged with a drive source such as a motor. The circuit board 14 is fitted on a pair of flat belts 23 so that both edges thereof fit into a pair of opposed groove portions 22 and can be conveyed and moved in the X direction in the figure.

  One of the rail units 21 (for example, the right side in the figure) can move in a direction (Y direction) opposite to the other rail unit 21 (the same left side), and the circuit board 14 of various width dimensions can be moved by this movement. Can be transported and held. On the upper surface of each rail unit 21, a reference rail 24 having an L-shaped cross section is fixed to a main rail 25 by a fixing pin 26. The surface (lower surface) of the L-shaped reference rail 24 facing the circuit board 14 restricts the upward movement of the circuit board 14, and the reference of the circuit board 14 upward in the Z direction when mounting components. Form a surface.

  A support table 27 is positioned below the rail units 21, and a holder plate 30 placed on the support table 27 holds a plurality of support pins 28 in the Z direction in the figure. As will be described later, the support pins 28 are in contact with the back surface of the circuit board 14 to support the circuit board 14 from the back side against loads and vibrations during component mounting. In the present specification, the back surface opposite to the surface of the circuit board 14 on which components are mounted by the suction nozzle 3 is referred to as a back surface.

  The operation of the substrate holding device 7 configured as described above is as follows. First, when the circuit board 14 is carried into the component mounting apparatus 1 by a loader (not shown), the endless flat belt 23 of the board holding device 7 that rotates in synchronization with the loader mounts the circuit board 14 to the mounting position. Transport toward. A retractable stopper 16 protrudes at a predetermined mounting position so as to block the path of the circuit board 14. When the conveyed circuit board 14 hits the stopper 16, the circuit board 14 is positioned at a predetermined position, and at the same time, the flat belt 23 is stopped.

  Next, the support table 27 is lifted by the extension of the cylinder 19 that supports the support table 27 so as to be movable up and down below the support table 27, and the circuit board 14 is moved upward together with the holding rail 29 that houses the flat belt 23. Push up. As a result, the upper surface of the circuit board 14 comes into close contact with the reference surface, which is the lower surface of the reference rail 24, and the circuit board 14 is positioned in the Z direction. At the same time, a plurality of support pins 28 attached to the holder plate 30 abut against the back surface of the circuit board 14 to support it from the back side, and support the circuit board 14 to withstand loads and vibrations during component mounting.

  The operation of the board holding device 7 after the component mounting is completed is contrary to the above-described operation, and the pressing force of the flat belt 23 to the upper side of the circuit board 14 when the cylinder 19 contracts and the support table 27 descends. At the same time, support from the back surface of the circuit board 14 by the support pins 28 is released. Next, the flat belt 23 is re-driven to move the circuit board 14 further to the back of the figure, and is placed on an unloader (not shown) that is driven synchronously and carried out of the component mounting apparatus 1. At the same time, the next circuit board 14 is mounted on the flat belt 23 and carried to a predetermined position. When the circuit board 14 is unloaded, the stopper 16 temporarily retracts downward to allow the circuit board 14 to move. After unloading, the stopper 16 faces the next circuit board 14 and protrudes toward the fixed position again.

  The number of support pins 28 attached to the holder plate 30 varies depending on specifications such as the thickness and area of the circuit board 14 to be supported. If the board thickness is thick and the circuit board is highly rigid, the support pins 28 may be unnecessary in the extreme. On the contrary, in the case of the thin circuit board 14 having a wide width, for example, a large number for every 10 to 15 mm pitch. The support pin 28 may be used.

  Further, as shown in FIG. 6, when there is a component 10 already mounted on the back surface of the circuit board 14, the support pin 28 corresponding to the corresponding position (indicated by the empty pin fixing hole 31) is Without mounting, interference between the mounted component 10 and the support pin 28 is avoided. Therefore, a setup for changing the arrangement of the support pins 28 is performed every time the model of the circuit board 14 to be produced is changed in accordance with the size of the circuit board 14 and the component mounting state on the back surface.

  The support table 27 is fixed to the component mounting apparatus 1 via the cylinder 19, and the surface facing the circuit board 14 is parallel to the lower surfaces of the pair of reference rails 24 that regulate the position of the circuit board 14 from above. It has been adjusted. The surface of the holder plate 30 placed on the support table 27 is also fixed so as to be parallel to the lower surfaces of the pair of reference rails 24, so that each support pin 28 attached to the holder plate 30 can be evenly loaded. The back surface of the circuit board 14 can be supported from below.

  FIG. 7 shows the support pin 28. In the figure, the support pin 28 is generally composed of a support portion 28a, a step portion 28b, and a fixing portion 28c each formed in a cylindrical shape. The support portion 28a has its tip abutted against and supported by the circuit board 14, and the fixing portion 28c on the opposite side is inserted into a pin fixing hole 31 (see FIG. 6) provided in the holder plate 30. The entire support pin 28 is supported substantially vertically with respect to the surface of the holder plate 30. At this time, the stepped portion 28b serves as a stopper when the fixed portion 28c is inserted into the holder plate 30, and the support height from the surface of the holder plate 30 (that is, the end surface of the stepped portion 28b) to the tip of the support portion 28a. h is defined. The support height h in this case refers to the height in a state where the support table 27 has been raised to the top dead center. In the example shown in the figure, the fixing portion 28c is simply inserted into the holder plate 30 so that sufficient attachment strength can be obtained. However, if necessary, the fixing portion 28c can be threaded. It may be fastened to the screw hole 31 on the holder plate 30 side.

  However, the substrate holding device and the holding method described above are in an ideal form, that is, it is assumed that the circuit board 14 to be held maintains an ideal flat surface shape. The circuit board 14 actually does not necessarily form an ideal flat surface due to various factors, and is deformed to be convex upward, convex downward, or even wavy while being held by the substrate holding device. There are many. This is because, for example, the circuit board 14 itself mainly composed of epoxy resin or the like does not have an ideal flat surface, and the component is already mounted on one side and passes through a reflow furnace for melting the solder. In such a case, thermal deformation is added.

  When the circuit board 14 having no flat surface is held by the substrate holding device 7 as described above, even if the flatness of the holder plate 30 and the length accuracy of the holder pins 28 are ensured, the circuit board 14 If it is deformed in a convex state, the circuit board 14 is lifted from the holder pin 28 at the center portion of both rail units 21. When the component is lowered and mounted on the circuit board 14 from above by the suction nozzle 3 (see FIG. 5), the component collides with the floating circuit board 14 to prevent correct mounting, and vibration caused by the collision. May adversely affect other parts already mounted. On the other hand, when the convex shape is downward, the entire circuit board 14 is supported from below by the plurality of holder pins 28 as described above, but the degree of influence can be reduced. For example, as shown in the component 10 of FIG. In order to avoid interference, there are places where the holder pins 28 are removed, and it is considered that the circuit board 14 sinks locally and adversely affects component mounting.

In order to avoid such an unforeseen situation, some countermeasures have been disclosed in the prior art. One measure is to secure the flatness by sucking the circuit board 14 projecting upward upward by a suction pad and vacuum suction means disposed below (for example, see Patent Document 1). . As another measure, the amount of warping due to deformation of the circuit board 14 is measured in advance by a measuring means before component mounting is started, and the descending amount of the suction nozzle 3 is adjusted in accordance with the measured amount, and the circuit board 14 And avoiding a collision between parts (see, for example, Patent Document 2).
JP-A-11-17397 Japanese Patent Laid-Open No. 11-145682

  However, there remains a problem with the above-mentioned countermeasures for dealing with the deformation of the circuit board. First, according to a measure for sucking the circuit board from below by vacuum, a suction means is newly provided on the back surface of the circuit board 14 which is limited in space, and the board holding device becomes complicated. When the is mounted, there may be inconveniences such as poor placement of the suction pad. According to the measure for measuring the amount of warpage of the other circuit board 14, it is necessary to newly provide a measuring means, and the heights at a plurality of points are measured for each circuit board that is carried in, and according to the result, This causes an increase in the amount of work such as controlling the amount of lowering of the suction nozzle 3 at a point, resulting in a problem of lowering productivity.

  As described above, the present invention solves the above-described problems in the prior art, avoids the occurrence of problems when mounting components due to the deformed circuit board, and corrects components without reducing productivity. It is an object of the present invention to provide a substrate holding device, a substrate holding method, a component mounting device, and a component mounting method capable of realizing mounting.

  The present invention holds the circuit board curved in a predetermined amount in a predetermined direction in a predetermined direction so as to absorb the deformation amount regardless of whether the circuit board is deformed or not. And the problem mentioned above is solved by controlling the component mounting height by a suction nozzle corresponding to the said bending amount, Specifically, the following content is included.

  That is, one aspect according to the present invention is a substrate holding method of a component mounting apparatus that regulates and holds a circuit board during component mounting, and the circuit board is regulated and held by curving the circuit board in a bow shape. The present invention relates to a substrate holding method characterized in that the circuit board is maintained in a predetermined shape during component mounting by correcting the deformation of the circuit board.

  The curved regulation holding of the circuit board can be performed by appropriately selecting the heights of a plurality of support pins that support both sides of the circuit board in the width direction and support the back surface of the circuit board. The height of the support pin can be selected by either selecting an appropriate support pin from support pins of various heights, or by extending and contracting the height of the support pin by positioning means such as a servo motor. .

  The curved regulation holding of the circuit board also supports a plurality of support pins that support the back side of the circuit board on a support table that supports both sides of the circuit board in the width direction and has a curved shape corresponding to the desired curved shape of the circuit board. It can also be done by installing. Furthermore, it is possible to support both sides of the circuit board in the width direction and bring a support block having a curved surface corresponding to a desired curved shape of the circuit board into contact with the back surface of the circuit board. A further alternative method of curving and regulating and holding the circuit board is to support both sides of the circuit board in the width direction and press the circuit board from both sides to bend.

  Another aspect of the present invention is a component mounting method in which a component supplied from a component supply unit is taken out by a suction nozzle, and the component is mounted at a regulated mounting position of a circuit board. The present invention relates to a component mounting method characterized in that a circuit board is regulated and held at a predetermined position during component mounting using the substrate holding method.

  When mounting a component on the inclined surface of the circuit board inclined by the curve, either the suction nozzle or the circuit board is set to either one so that the mounting surface of the component to be mounted is parallel to the mounting surface of the circuit board. It can be inclined with respect to. Alternatively, the suction nozzle may be controlled to descend in the normal direction of the inclined surface of the inclined circuit board.

  According to still another aspect of the present invention, there is provided a pair of rail units that support both ends of the circuit board in the width direction from both sides, a plurality of support pins that contact and support the back surface of the circuit board, and the height of the support pins A substrate holding device that includes a support table that forms a reference surface and attaches the support pins, and an elevating drive unit that raises and lowers the support table, and restricts and holds a circuit board on which the component is mounted during component mounting. In the plurality of support pins, the height of the support pins in the position close to the pair of rail units is relatively low, and the height of the support pins is relatively large as it goes to the center of the pair of rail units. The height of the support pins that are disposed so as to be higher or close to the pair of rail units is relatively high, and the pair of labels The support pin is arranged so that the height of the support pin becomes relatively lower as it goes to the center of the unit, thereby supporting the circuit board in a curved shape that is convex upward or downward. The present invention relates to a substrate holding device.

  The support table can be formed on a curved surface corresponding to the curved shape of the circuit board. Alternatively, the support table may be formed on a flat surface and the plurality of support pins may have different heights. Furthermore, the support pin may be attached so as to be movable up and down relatively with respect to the support table.

  Still another aspect according to the present invention is a board holding device that regulates and holds a circuit board on which components are also mounted during component mounting, and the surfaces of the support blocks that contact the back of the circuit board are the pair of The height is relatively low at a position close to the rail unit, and the height is relatively high as it goes to the center of the pair of rail units, or high at a position close to the pair of rail units. The height of the circuit board is relatively high, and the height is relatively low as it goes to the center of the pair of rail units, so that the circuit board is curved upward or convex downward. It is related with the board | substrate holding | maintenance apparatus characterized by supporting in the form which did.

  Still another aspect according to the present invention is a board holding device that regulates and holds a circuit board on which components are also mounted during component mounting, wherein the pair of rail units are configured to be movable toward each other, and A board comprising a mechanism that holds the circuit board held in a bow shape so as to be convex upward or downward by pressing the circuit board that is moved and held from both sides. The present invention relates to a holding device.

  In order to guide the curved direction of the circuit board to be convex upward or downward, the center part in the width direction of the circuit board held in advance by the pair of rail units is directed upward or downward, respectively. A push rod can be further provided.

  Still another aspect of the present invention includes a component supply unit that supplies components, a mounting head that includes a suction nozzle that takes out and mounts components, a robot that transports the mounting head, and a circuit board A component holding device configured to take out a component from the component supply unit by the mounting head and mount the component at a mounting position of the circuit substrate, the substrate holding and restricting the circuit substrate The present invention relates to a component mounting apparatus, wherein the holding device is any one of the above-described board holding devices.

  Since the component is mounted on the inclined surface of the circuit board inclined by the curve, the suction nozzle or the circuit board can be inclined so that the mounting surface of the component to be mounted is parallel to the mounting surface of the circuit board. . Alternatively, the mounting head may be formed so that the suction nozzle descends in the normal direction of the inclined surface of the inclined circuit board.

  By implementing the present invention, even if the circuit board is deformed due to some factor, it becomes possible to absorb the deformation by holding the circuit board in a predetermined shape, and the component mounting failure caused by the deformation of the circuit board Can be avoided, and the quality and productivity of component mounting can be improved.

  In the present invention, the circuit board is curved and held in a predetermined shape, thereby enabling stable component mounting regardless of the amount of deformation of the circuit board. FIGS. 1A to 1F show aspects of the substrate holding apparatus and method according to the first embodiment of the present invention. In each figure, the substrate holding device 20 holding the circuit board 14 is viewed from the front.

  First, in the embodiment shown in FIG. 1A, among the plurality of support pins 28 that support the circuit board 14 from below, the height of the support pins 28d arranged at the center portion of the rail unit 21 on the left and right in the figure is The support pins 28e arranged in the vicinity of the rail unit 21 are relatively low in height, and the other support pins 28 arranged in the middle of the circuit board 14 have a substantially arc shape. It is formed at an appropriate height so as to be curved in an arcuate shape. The arrangement of five support pins 28 shown in the drawing is an example, and an appropriate number can be selected depending on the width dimension, plate thickness, arrangement of mounted components, and the like. Further, in the figure, only five support pins 28 located in the front row are shown, but usually a plurality of rows are arranged in a direction perpendicular to the drawing according to the length of the circuit board 14.

  Each support pin 28 is erected on a support table 27 formed on a flat surface by fitting, screwing, or the like. It is possible to select and attach the support pins 28 corresponding to the predetermined bending amount of the circuit board 14, and the change in the height will be described later. Further, when there are components already mounted on the back surface of the circuit board 14, the support pins 28 can be appropriately removed. This is the same as described in the prior art.

  When the substrate holding device 20 having the support pins 28 arranged as described above is operated, the circuit board 14 is first carried in a direction perpendicular to the drawing and held in the groove portions 22 provided in both rail units 21. Thereafter, the support table 27 is lifted by the cylinder 19 (see FIG. 6) to restrain the circuit board 14, and the support pins 28 come into contact with the back surface of the circuit board 14. At this time, the circuit board 14 is bent and fixed in a predetermined shape by being pushed by the support pins 28 that are high in the center and lower as they approach the rail unit 21. At this time, regardless of how much the circuit board 14 has been deformed in advance, the shape after the bending is regulated by the height of the plurality of support pins 28 and is always kept constant.

  The control unit 9 (see FIG. 5) of the component mounting apparatus 1 is input with shape data of the circuit board 14 after being bent in advance. Under the control of the control unit 9 based on this data, the suction nozzle 3 holding the component is lowered to an appropriate mounting height facing the circuit board 14 according to the position where the component is mounted, and performs a mounting operation. During mounting, the circuit board 14 is securely supported by the plurality of support pins 28, so that the circuit board 14 does not vibrate.

  After the mounting of all the components is completed and the suction nozzle 3 is retracted, the support table 27 is lowered by the operation of the cylinder 19, and the support pin 28 is released by releasing the restraint of the circuit board 14 accordingly. The circuit board 14 that has been elastically deformed returns to its original shape, and is then sent in a direction perpendicular to the drawing and carried out of the component mounting apparatus 1.

  FIG. 1B shows another aspect of the substrate holding device 20 according to the present embodiment. Here, the support table 27a is curved and a plurality of support pins 28 are erected thereon. ing. According to this embodiment, the height of the support pin 28 can be made constant as compared with the embodiment shown in FIG. The curved shape of the support table 27 a can be dealt with by replacing it according to the deformation amount of the circuit board 14. Alternatively, by combining with a mode in which the height of the support pin 28 is changed, it is possible to support a plurality of shapes of circuit boards 14 by using one curved support table 27a. The operation in component mounting is the same as that in the above-described aspect, and this is the same in the other aspects described below.

  In the embodiment shown in FIG. 1C, a support block 38 is used as an alternative to the support pin 28. The support block 38 may be a semi-cylindrical block corresponding to the entire area of the circuit board 14, or a plurality of plate-like support blocks 38 having the illustrated form may be arranged in a direction perpendicular to the drawing. it can. In the case of the former kamaboko type, it is possible to fix by providing at least two positioning pins, omitting the trouble of standing one support pin 28 one by one. Further, in the case of the latter plate shape, when components are already mounted on the back side of the circuit board 14, the support block 38 can be arranged avoiding the components.

  FIG. 1 (d) shows a mode in which an adjustable support pin 28f is used. In the figure, a screw is provided on the outer periphery of the support pin 28f, passes through a female screw provided on the support table 27b, and is coupled to an actuator such as a motor (not shown) located behind. Then, after the circuit board 14 is held, the support pins 28f are raised to a predetermined height by the operation of the actuator to support the circuit board 14 from below in a curved state. Here, the lifting mechanism using screws is used, but other lifting mechanisms using, for example, an air cylinder or a ball screw can be used. The rising amount of each support pin can be controlled by the control unit 9 (see FIG. 5) of the component mounting apparatus 1.

  Next, in the embodiment shown in FIG. 1 (e), as an alternative to the support pins 28, the circuit board 14 is pressed and curved as shown by the arrow F using the rail units 21 on both sides and curved. Holding. In this case, since the circuit board 14 can be bent in any direction up and down only by pressing from both sides, the circuit board 14 is pushed up by the push rod 35a and guided to protrude upward as shown in the drawing. It is preferable. The push rod 35a can support the circuit board 14 as a support pin as it is during mounting, or it can be lowered after guiding the circuit board 14 once. In general, the circuit board 14 has a thickness of about 0.5 to 1.5 mm. In particular, when the board thickness is large and rigidity due to the circuit board 14 is expected, an embodiment as shown in FIG. As a result, the complicated arrangement of the support pins 28 can be avoided.

  In the embodiment shown in FIG. 1 (f), the circuit board 14 is held so as to protrude downward, contrary to the conventional case. As in the case shown in FIG. 1 (e), by first pressing the rail unit 21 in the direction indicated by the arrow F from both sides while restricting the push rod 35b to extend from above and the circuit board 14 to curve downward. The circuit board 14 is held. At this time, when the circuit board 14 has sufficient rigidity, it is not necessary to support the circuit board 14 from below as shown in the figure, but the support as shown in FIGS. By using the pins 28 and the support block 38 together, even the circuit board 14 having low rigidity can be supported in the same manner. In this case, of course, the height distribution of the support pins 28 and the shape of the support block 38 should be adjusted to such a height as to receive the circuit board 14 that protrudes downward.

  FIG. 2 shows the curved shape of the circuit board 14 held by the board holding device 20 shown in the above embodiments. The significance of curving the circuit board 14 is to eliminate the deformation of the circuit board 14 caused by passing through a reflow furnace and to maintain a constant shape. However, when it is extremely curved, the component 10 to be mounted may not be correctly mounted on the circuit board 14.

で表される。ここで、部品１０の長さＬ＝10ｍｍとしてＹｍａｘを書き換え、ΔＨｍａｘをクリーム半田層の厚さに対応する0.1ｍｍとして上記式を近似計算すると、半径Ｒは約125ｍｍとなる。すなわち、長さ10ｍｍの部品を浮き上がらせることなく回路基板１４に固定するには、回路基板１４を半径125ｍｍ以上の曲率に湾曲するよう保持すればよい。 In the example shown in FIG. 2, when the length L of the component 10 is long, the body portion of the component 10 may come into contact with the curved circuit board 14 and the lead wire 11 may be lifted from the circuit board 14. Cream solder is applied to the surface of the circuit board 14 in advance, but generally the thickness of this cream solder layer is only about 0.1 mm. Now, assuming that the radius of curvature when the circuit board 14 is curved is R, and the angle (radian) of the center of curvature corresponding to the length L of the component is Ymax, both lifts ΔHmax of one end of the component 10 shown in the figure are

It is represented by When Ymax is rewritten with the length L of the component 10 being 10 mm, ΔHmax is approximately 0.1 mm corresponding to the thickness of the cream solder layer, and the above equation is approximately calculated, the radius R is about 125 mm. That is, in order to fix a component having a length of 10 mm to the circuit board 14 without being lifted, the circuit board 14 may be held so as to be curved with a radius of 125 mm or more.

  The above-mentioned deformation amount is a case where the circuit board 14 is held in a form that protrudes upward. Conversely, when the circuit board 14 protrudes downward, there is no need to worry about the above-described lifting of the component 10, so at least the curvature is achieved. The restrictions on are relaxed. That is, when mounting the long component 10 in the width direction of the circuit board 14, it may be advantageous to hold the circuit board 14 in a convex shape in this way. However, the curvature radius of the circuit board 14 to be curved is naturally limited due to the elasticity of the circuit board 14 or the control of the mounting operation accompanying the bending of the circuit board 14 described later.

で示される。ここでＨｍａｘは、Ｙ＝０からＹ＝Ｙｍａｘの間の最大そり量である。 Next, a second embodiment according to the present invention will be described with reference to the drawings. The present embodiment relates to mounting control in the case where component mounting is performed on a circuit board that is held curved as shown in the previous embodiment. 3 is a plan view of the curved circuit board 14 held and curved on both the left and right sides of the drawing as viewed from the suction nozzle 3, and the lower view is viewed from the side. In both figures, the mounting position of the component 10 to be mounted is shown. Here, assuming that the angular position at the left end in the figure is Y = 0, the angular position at the right end is Y = Ymax, and the mounting angular position of the component 10 is Y = Ya (unit is radians), the circuit board 14 is curved. The warp amount Ha of the circuit board 14 at the component mounting position is as follows:

Indicated by Here, Hmax is the maximum amount of warpage between Y = 0 and Y = Ymax.

  That is, at the time of component mounting, the component 10 can be mounted appropriately by correcting the downward movement amount of the suction nozzle 3 that moves downward toward the circuit board 14 based on the result of Equation 2. In general, the maximum width of the substrate is about 400 mm, but since the deformation of the circuit board 14 is about 1 to 2 mm in the height direction, the maximum warpage Hmax may be about 2 to 3 mm. Assuming that the substrate width Ymax is 400 mm and the maximum warpage amount Hmax is 3 mm, the radius of curvature R is approximately 6700 mm by approximation calculation from Equation 2 (in this case, Ha = 0 and Ya = 0 are calculated in Equation 2). If the curvature radius R is obtained in this way, the warpage amount Ha at an arbitrary position can be calculated from Equation 2. The warp amount Ha reaches the maximum Hmax at the center of the width of the circuit board 14 and decreases as it approaches both sides. Depending on the position of the component 10 to be mounted in the Y direction, a correction value based on the warp amount Ha is input to the control unit 9 (see FIG. 5) in advance, or by calculating each time, the suction nozzle 3 moves downward. The amount can be controlled appropriately.

  In the mounting head 4 (see FIG. 5) that holds the suction nozzle 3, since the suction nozzle 3 is attached via a spring, even if there is some variation in the amount of deformation of the circuit board 14, this is absorbed by the spring. can do. However, when considering the impact when the component 10 comes into contact with the circuit board 14 and the vibration of the circuit board 14 due to this, it is preferable to appropriately control the downward movement amount of the suction nozzle 3 as described above.

  Next, FIGS. 4A to 4C show control measures in the case where component mounting is performed such that the surface on which the component 10 is mounted is in contact with the curved surface of the curved circuit board 14. . When the suction nozzle 3 is lowered in the vertical direction in the same manner as in a flat horizontal plane with respect to the curved circuit board 14, the component 10 is mounted on the inclined surface, causing a mounting failure. obtain. In particular, the inclination becomes steeper as the position is shifted from the center in the width direction and near the rail units 21 on both sides.

As means for correcting the angle of the component 10 mounted on the inclined surface,
(A) The lowering direction of the suction nozzle is set along the normal line of the inclined surface of the circuit board.
(B) The tip surface of the suction nozzle is made substantially parallel to the inclined surface of the circuit board.
(C) The inclined surface of the circuit board is made substantially parallel to the component mounting surface.
Can be considered.

  First, FIG. 4A shows the countermeasure of the above-mentioned (A). The suction nozzle 3 is inclined so that the nozzle tip (or the mounting surface of the component 10) is parallel to the inclined surface, and the method of the inclined surface is used. The suction nozzle 3 is controlled to descend along the line. In this case, an inclination mechanism for inclining the suction nozzle 3 is added to the component mounting apparatus 1, and movement control in the Y direction (see FIG. 5) is required along with the Z direction when the suction nozzle 3 is lowered. Although it is the ideal way to mount the component 10 most securely and safely, it is inevitable that the control becomes complicated.

  Next, FIG. 4B shows the countermeasure of the above (b). Although the suction nozzle 3 is tilted, the downward direction is only the Z direction (vertical direction), and the control for the measure (a) is performed. Has the advantage of being easy. FIG. 4C shows the countermeasure of the above (c). Here, the rail unit 21 holding the circuit board 14 is inclined as shown by an arrow T according to the mounting position, and the suction nozzle 3 ( Alternatively, the circuit board 14 is held such that the mounting surface of the component 10 is always in a direction in contact with the surface of the circuit board 14 in parallel. The substrate holding device 20 needs to be added with a tilt function that enables the tilt.

  As described above, various measures for mounting the component 10 so that the mounting surface of the component 10 is in contact with the inclined surface of the circuit board 14 are preferable measures for mounting the component safely and reliably. As shown in the embodiment, the amount of warpage of the circuit board 14 is about 2 to 3 mm at the maximum, and the radius of curvature is very large. Would be good. Therefore, each mode as shown in FIGS. 4A to 4C can be considered as a remedy in case it becomes necessary. However, it is preferable to carry out the control of the descending amount of the suction nozzle 3 described using Equation 2.

  The substrate holding mechanism and the substrate holding method, the component mounting apparatus, and the component mounting method according to the present invention can be widely used in the industrial field of component mounting in which electronic components are mounted on a circuit board.

It is a side view showing each mode of a substrate holding device of an embodiment concerning the present invention. It is a side view which shows the relationship between the curvature amount of the circuit board hold | maintained curved, and the components mounted on it. It is a side view which shows the relationship between the position of the circuit board held | cured in a curve, and the curvature amount. It is a side view which shows each aspect of the mounting control in the case of mounting on the inclined surface of the circuit board hold | maintained curved. It is a perspective view which shows the outline | summary of a component mounting apparatus. It is a perspective view which shows the outline | summary of the board | substrate holding | maintenance apparatus of the component mounting apparatus shown in FIG. FIG. 7 is a perspective view of a support pin used in the substrate holding device shown in FIG. 6.

Explanation of symbols

1. 2. component mounting device; 6. suction nozzle, 8. substrate holding device; Control unit, 10. Parts, 11. Lead wires, 14. Circuit board, 19. Cylinder, 20. Substrate holding device, 21. Rail unit, 22. Groove part, 27. Support table, 28. Support pin, 35. Push rod, 38. Support block.

Claims (20)

In the board holding method of the component mounting apparatus that regulates and holds the circuit board during component mounting,
A circuit board holding method comprising: curving a circuit board in a bow shape and controlling and maintaining the circuit board in a predetermined shape by correcting deformation of the circuit board during component mounting.   The circuit board is curved and regulated and held by appropriately selecting the heights of a plurality of support pins that support both sides of the circuit board in the width direction and support the back surface of the circuit board. Substrate holding method.   The height of the support pin is selected by either selecting an appropriate support pin from support pins of various heights or expanding / contracting the height of the support pin. The substrate holding method as described in 2.   The circuit board is curved and regulated by supporting a plurality of support pins that support the back of the circuit board on a support table that supports both sides of the circuit board in the width direction and has a curved shape corresponding to the desired curved shape of the circuit board. The substrate holding method according to claim 1, wherein the substrate is held.   The circuit board is curved and regulated and held by supporting both sides in the width direction of the circuit board and bringing a support block having a curved surface corresponding to a desired curved shape of the circuit board into contact with the back surface of the circuit board. The substrate holding method according to claim 1.   The substrate holding method according to claim 1, wherein the circuit board is curved and regulated and held by supporting both sides in the width direction of the circuit board and pressing the circuit board from both sides. In the component mounting method of taking out the component supplied from the component supply unit by the suction nozzle and mounting the component at the mounting position of the regulated circuit board,
7. A component mounting method using the substrate holding method according to claim 1, wherein the circuit board is regulated and held at a predetermined position during component mounting.   When mounting a component on the inclined surface of the circuit board inclined by the curve, either the suction nozzle or the circuit board is set with respect to the other so that the mounting surface of the component to be mounted is parallel to the mounting surface of the circuit board. The component mounting method according to claim 7, wherein the component mounting method is inclined.   The component mounting method according to claim 7, wherein when the component is mounted on the inclined surface of the circuit board inclined by the curve, the suction nozzle descends in a normal direction of the inclined surface of the circuit board inclined.   When mounting a component on the inclined surface of the circuit board inclined by the curve, the lowering height of the suction nozzle at the time of mounting is controlled in accordance with the change in the height of the circuit board mounting surface due to the curve, which varies depending on the mounting position of the component. The component mounting method according to claim 7, wherein: A pair of rail units that support both ends of the circuit board in the width direction;
A plurality of support pins that contact and support the back of the circuit board;
A support table for forming a height reference surface of the support pins and mounting the support pins;
In a substrate holding device that is configured by a lifting drive unit that lifts and lowers the support table, and that regulates and holds a circuit board on which components are mounted during component mounting,
In the plurality of support pins, the height of the support pins in a position close to the pair of rail units is relatively low, and the height of the support pins is relatively high as it goes to the center of the pair of rail units. The height of the support pins that are arranged so as to be close to each other or the position close to the pair of rail units is relatively high, and the height of the support pins is relatively low as it goes to the center of the pair of rail units. The substrate holding device is characterized in that the circuit board is supported in an arcuate shape that is convex upward or convex downward.   12. The substrate holding apparatus according to claim 11, wherein the support table is formed on a curved surface corresponding to a curved shape of the circuit board.   The substrate holding method according to claim 11, wherein the support table is formed on a flat surface, and the plurality of support pins have different heights.   The substrate holding method according to claim 11, wherein the support pins are attached so as to be movable up and down relatively with respect to the support table. A pair of rail units that support both ends of the circuit board in the width direction;
A support block that contacts and supports the back of the circuit board;
A support table for forming a height reference plane of the support block and mounting the support block;
In a substrate holding device that is configured by a lifting drive unit that lifts and lowers the support table, and that regulates and holds a circuit board on which components are mounted during component mounting,
The surface of the support block that contacts the back surface of the circuit board is relatively low at a position close to the pair of rail units, and the height is relatively high as it goes to the center of the pair of rail units. Or arranged so that the height is relatively high at a position close to the pair of rail units, and the height is relatively low as it goes to the center of the pair of rail units. A substrate holding apparatus, characterized in that the substrate is supported in an arcuate shape that is convex upward or convex downward. In a board holding device that includes a pair of rail units that support both ends of the circuit board in the width direction from both sides, and that holds the circuit board to which the component is mounted during component mounting,
The pair of rail units are configured so as to be able to move closer to each other, and by pressing a circuit board held close to each other from the both sides, the circuit board is curved in an arc shape that protrudes upward or protrudes downward. A substrate holding device comprising a mechanism for holding in a form.   In order to guide the curved direction of the circuit board to be convex upward or downward, the center part in the width direction of the circuit board held in advance by the pair of rail units is directed upward or downward, respectively. The substrate holding apparatus according to claim 16, further comprising a push rod for pushing. A component supply unit that supplies components, a mounting head that includes a suction nozzle that takes out and mounts components, a robot that transports the mounting head, and a substrate holding device that carries in and holds the circuit board. In the component mounting apparatus for taking out the component from the component supply unit by the mounting head and mounting the component on the mounting position of the circuit board,
The component mounting apparatus according to any one of claims 11 to 17, wherein the substrate holding device that regulates and holds a circuit board is the substrate holding device according to any one of claims 11 to 17.   In order to mount components on the inclined surface of the circuit board inclined by the curve, the suction nozzle or the circuit board is formed so as to be inclined so that the mounting surface of the component to be mounted is parallel to the mounting surface of the circuit board. The component mounting apparatus according to claim 18, wherein: The mounting head is configured to descend in a normal direction of the inclined surface of the circuit board with the suction nozzle inclined in order to mount components on the inclined surface of the circuit board inclined by the curve. Item 19. The board mounting apparatus according to Item 18.

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