JP2007098409A - Method for parting metal plate, die, printed board and electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain a method of parting a metal plate in which main body parts are separated from a wasted member without generating refuse. <P>SOLUTION: In a metal plate parting method for parting the main body parts 31 from hanging members 37: a planar base material 34 which has flexibility and is provided with hanging members 37 which are interposed between the main body parts 31 and the wasted members 36 is prepared; and, by mounting the planar base material 34 to a die 45 having an opening part 51 and driving a punch 47 to the hanging member 37, the main body parts 31 are parted from the the hanging members 37. The punch 47 has a first end part 47a corresponding to one end 37a which is connected to the main body part of the hanging member; a second end part 47b corresponding to the other end 37b which is connected to the wasted member of the hanging member and also a clearance S<SB>1</SB>smaller than the thickness t of the planer base material 34 is formed between the first end part 47a and the inner peripheral surface 51a of the opening part; and a clearance S<SB>2</SB>larger than the thickness of the planar base material 34 is formed between the second end part 47b and the inner peripheral surface 51b of the opening part. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a plate material dividing method and a mold for dividing a main body portion from a plate-like base material having a main body portion and a discard member, and a printed circuit board and an electronic apparatus including the main body portion divided from the plate-like base material.

  An electronic device such as a hard disk drive (hereinafter abbreviated as HDD) includes a printed circuit board. This printed circuit board is manufactured by various methods, and a thin printed circuit board such as a flexible circuit board is often manufactured by pressing a sheet-like metal plate.

  When manufacturing a printed circuit board, for example, a sheet-like metal plate is first punched into a desired product shape. Thereby, a metal plate has a main-body part which becomes a part of product later, and a discard member discarded later. Between the main body portion and the discarding member, a suspension member that connects the main body portion to the discarding member is left. That is, the main body is not completely separated from the discard member, and is supported by the discard member via the suspension member.

  Circuit components are mounted on the main body in a state where the main body is supported by the discard member. After the circuit component is mounted, the main body is separated from the suspension member. As a result, the main body is completely separated from the discarded member, and the printed circuit board can be mounted on the electronic device.

  The step of separating the main body from the suspension member is performed using a mold including a punch, a die having an opening corresponding to the punch, and a plate presser. In this mold, the gap between the outer peripheral surface of the punch and the inner peripheral surface of the opening is set to be equal to or less than the thickness of the workpiece.

  The metal plate is placed on the die so that the suspension member is located above the opening. With the metal plate fixed on the die, a punch is driven into the suspension member. By punching the suspension member, a shearing force is applied to the boundary between the main body part and the suspension member and the boundary between the discard member and the suspension member. Disconnect.

As a method for dividing the main body portion from the discard member, a cap manufacturing method for dividing the cap member from the discard member has been proposed (see, for example, Patent Document 1). The cap member described in Patent Document 1 has a connecting portion between the discard member and the cap member. By cutting the joint portion with blade teeth, the cap member is separated from the discard member.
Japanese Patent Laid-Open No. 11-114635

  For example, in the case of a small HDD, the printed circuit board to be mounted is very small. Therefore, the suspension member that connects the main body portion of the printed circuit board to the discarding member becomes smaller and lighter.

  The mold is treated so that the cut suspension member does not interfere with the subsequent manufacture, for example, the cut suspension member is dropped below the die as scrap. However, if the suspension member is too small and light, the cut suspension member may not fall well below the die and stick to the surface of, for example, a punch, die or plate retainer. If pressing is performed with the suspension member stuck to the surface of the punch, die, or plate retainer, there is a risk of indentation defects such as the trace of the suspension member remaining in the subsequent product.

  Therefore, it is necessary to perform a cleaning operation such as sucking the entire surface of the punch, die, and plate presser with, for example, a vacuum cleaner every time the step of cutting the suspension member is performed. This is not preferable from the viewpoint of manufacturing time and manufacturing cost of the printed circuit board. Furthermore, since the suspension member is small and light, it is difficult to completely remove debris even if cleaning work is performed.

  For example, the manufacturing method described in Patent Document 1 uses blade teeth for cutting the joint portion. For this reason, a connection part remains integrally with a discard member, and the above scraps are not generated. However, the blade teeth are effective when the portions that need to be cut are arranged in a certain direction, but are difficult to apply when, for example, the blade teeth have a plurality of suspension members extending along various directions. Furthermore, a metal plate from which a small printed board is punched is small and includes a considerable number of hanging members. Therefore, it is not practical to provide blade teeth corresponding to each suspension member, and shearing using a mold is required.

  An object of the present invention is to obtain a plate material dividing method and a mold for separating a main body portion from a discarding member without generating waste, and a printed circuit board and an electronic device including the main body portion separated from the discarding member without generating waste. is there.

In order to achieve the above object, a plate material cutting method according to one embodiment of the present invention includes:
Preparing a plate-like substrate having flexibility, a body part, a discard member, and a suspension member interposed between the body part and the discard member;
Attach the plate-like base material to the die having an opening so that the suspension member corresponds to the opening,
A plate material dividing method for driving a punch corresponding to the opening to the suspension member, and dividing the main body from the suspension member,
The punch has a first end corresponding to one end connected to the main body of the suspension member, and a second end corresponding to the other end connected to the discard member of the suspension member, and the first The end of 1 forms a gap smaller than the thickness of the plate-like substrate between the inner peripheral surface of the opening and the second end is between the inner peripheral surface of the opening. A gap larger than the thickness of the plate-like substrate is formed.

The mold according to one aspect of the present invention is:
A mold that is flexible and separates the main body portion from a plate-like base material that includes a main body portion, a discard member, and a suspension member interposed between the main body portion and the discard member. And
Punch and
A die having an opening corresponding to the punch, and a die to which the plate-like substrate is attached so that the suspension member corresponds to the opening;
The punch has a first end corresponding to one end connected to the main body of the suspension member, and a second end corresponding to the other end connected to the discard member of the suspension member, and the first The end of 1 forms a gap smaller than the thickness of the plate-like substrate between the inner peripheral surface of the opening and the second end is between the inner peripheral surface of the opening. A gap larger than the thickness of the plate-like substrate is formed.

A printed circuit board according to one aspect of the present invention is:
A printed circuit board comprising a main body and circuit components mounted on the main body,
The main body portion includes the main body portion, a discard member, and a suspension member interposed between the main body portion and the discard member, and from a flexible plate-like base material to the punch and the punch. Divided with a die having a corresponding opening,
When the plate-like base material is attached to the die, the punch has a first end corresponding to one end connected to the main body of the suspension member and the other end connected to the discard member of the suspension member. The first end portion forms a gap smaller than the thickness of the plate-like base material between the first end portion and the inner peripheral surface of the opening, and the second end portion has a corresponding second end portion. The part forms a gap larger than the thickness of the plate-like base material between the inner peripheral surface of the opening.

An electronic device according to one aspect of the present invention is:
An electronic device comprising a housing and a printed circuit board accommodated in the housing,
The printed circuit board has a main body portion and circuit components mounted on the main body portion,
The main body portion includes the main body portion, a discard member, and a suspension member interposed between the main body portion and the discard member, and from a flexible plate-like base material to the punch and the punch. Divided with a die having a corresponding opening,
When the plate-like base material is attached to the die, the punch has a first end corresponding to one end connected to the main body of the suspension member and the other end connected to the discard member of the suspension member. The first end portion forms a gap smaller than the thickness of the plate-like base material between the first end portion and the inner peripheral surface of the opening, and the second end portion has a corresponding second end portion. The part forms a gap larger than the thickness of the plate-like base material between the inner peripheral surface of the opening.

  According to these configurations, since the suspension member is not separated from the discard member and remains integrally with the discard member, no waste is generated.

Hereinafter, embodiments of the present invention will be described with reference to the drawings applied to a mobile phone.
1 to 10 disclose a mobile phone 1 as an electronic apparatus according to a first embodiment of the present invention. As shown in FIG. 1, the mobile phone 1 includes a main body 2, a display unit 3, and a hinge part 4.

  The main body 2 includes a box-shaped housing 5. A plurality of push-type operation keys 6 are arranged on the upper wall 5 a of the housing 5. The housing 5 accommodates the main board 7 and the HDD 8 inside. The display unit 3 includes a display housing 9 and a liquid crystal display module 10 accommodated in the display housing 9. The liquid crystal display module 10 has a display screen 10a. The display screen 10 a is exposed to the outside of the display housing 9 through the opening 9 a of the display housing 9. The display unit 3 is supported by a rear end portion of the main body 2 via a hinge portion 4.

  The HDD 8 accommodated in the housing 5 of the main body 2 is an example of a disk device that is an electronic device. As shown in FIG. 2, the HDD 8 includes an apparatus main body 11 and a substrate unit 12. An example of the size of the apparatus main body 11 is a length L of 32 mm and a width W of 24 mm. An example of the thickness including the apparatus main body 11 and the substrate unit 12 has a thickness T of 3 mm to 6 mm.

  As shown in FIG. 3, the substrate unit 12 is attached to the apparatus main body 11 from below. The board unit 12 includes a control circuit board 14 and an interface board 15. The control circuit board 14 is electrically connected to the apparatus main body 11 and controls the apparatus main body 11. One end of the interface board 15 is electrically connected to the control circuit board 14 and the other end is electrically connected to the main board 7 of the mobile phone 1.

  The apparatus main body 11 includes a case 17. The case 17 is formed in a box shape having an upper wall 17a, a lower wall 17b, and a side wall 17c. As shown in FIG. 3, the case 17 houses a magnetic disk 21, a spindle motor 22, a magnetic head 23, a head actuator 24, a voice coil motor 25, and a signal processing unit 26.

  The magnetic disk 21 is an example of a disk-shaped information storage medium. The magnetic disk 21 is formed with a diameter of 0.85 inches, for example. The spindle motor 22 is attached to the lower wall 17b. The spindle motor 22 has a hub 22a that is rotatably supported. The magnetic disk 21 is concentrically fitted to the hub 22a.

  As shown in FIG. 3, the head actuator 24 includes a bearing portion 24a and an arm portion 24b extending horizontally from the bearing portion 24a. The tip of the arm portion 24b supports the magnetic head 23. The magnetic head 23 writes information to and reads information from the magnetic disk 21. The bearing portion 24 a rotatably supports the arm portion 24 b so that the magnetic head 23 rotates between an operating position where the magnetic head 23 is positioned on the surface of the magnetic disk 21 and a retracted position where the magnetic disk 21 is removed. The voice coil motor 25 rotates the head actuator 24.

  As shown in FIG. 3, the signal processing unit 26 includes a printed board 28 and a connector 29. The connector 29 is attached to the lower surface of the printed circuit board 28. The connector 29 is exposed to the outside of the case 17 through a hole (not shown) opened in the lower wall 17 b of the case 17 and is electrically connected to the control circuit board 14 of the board unit 12.

  The printed circuit board 28 includes a wiring board 31 and a circuit component 32 mounted on the wiring board 31. The wiring board 31 is an example of a main body. The wiring substrate 31 includes a substrate body 31a and a connection portion 31b.

  The board body 31a is formed of a so-called flexible printed board (hereinafter abbreviated as FPC), and is fixed to the lower wall 17b in a folded state. The connection portion 31b is formed of FPC integrally with the substrate body 31a and extends along the side surface of the substrate body 31a. The distal end of the connection portion 31b is connected to the head actuator 24, and is electrically connected to the magnetic head 23 through a cable (not shown) provided in the head actuator 24. As a result, the signal processing unit 26 can transmit signals accompanying information processing to and from the magnetic head 23. An example of the circuit component 32 is a head IC, a head amplifier, or the like, for example.

  FIG. 4 shows the printed circuit board 28 in the course of manufacturing. As shown in FIG. 4, the plurality of wiring boards 31 are formed in a single metal plate 34. That is, the outer shape of the desired wiring board 31 is punched into the metal plate 34 by pressing the sheet-like metal plate 34.

  The metal plate 34 is an example of a plate-like substrate. The metal plate 34 is formed of, for example, a very thin stainless steel and has flexibility. As shown in FIG. 4, the metal plate 34 includes a wiring board 31, a discard member 36, and a suspension member 37. The discard member 36 is a member that is discarded later. The discard member 36 surrounds the wiring board 31. The metal plate 34 is punched out so that a predetermined gap g is formed between the wiring board 31 and the discard member 36.

  As shown in FIG. 4, the suspension member 37 is provided in the gap g, and is interposed between the wiring board 31 and the discard member 36. A plurality of, for example, six suspension members 37 are provided, and extend along various directions. The suspension member 37 has one end 37 a (see FIG. 6) connected to the wiring board 31 and the other end 37 b (see FIG. 6) connected to the discard member, and fastens the wiring board 31 to the discard member 36. The wiring board 31 is supported by the discard member 36 via the suspension member 37.

  The circuit component 32 is mounted on the wiring substrate 31 while being supported by the discard member 36. After mounting the circuit component 32, the wiring board 31 is separated from the metal plate 34 by separating the suspension member 37 from the wiring board 31.

  Next, the press working apparatus 40 according to the first embodiment of the present invention will be described with reference to FIGS. The press working device 40 is a working device that separates the suspension member 37 from the wiring board 31.

  FIG. 5 schematically shows the entire press working apparatus 40. The press working apparatus 40 includes a mold 41, a frame 42, a bed 43, and a slide 44. The mold 41 has a die 45, a plate holder 46, and a punch 47.

  A bed 43 is fixed to the frame 42. The die 45 is attached to the upper surface of the bed 43. The die 45 has an attachment surface 45a on which the metal plate 34 is placed. The die 45 has a plurality of openings 51 that open upward. The same number of openings 51 as the plurality of suspension members 37 are provided. The opening 51 is disposed so as to be positioned below the suspension member 37 when the metal plate 34 is attached to the die 45.

  On the other hand, the slide 44 and the plate presser 46 are respectively attached to the frame 42 so as to be movable forward and backward along the vertical direction. The slide 44 and the plate presser 46 are advanced and retracted in a direction approaching and separating from the bed 43 by a drive source (not shown).

  The plate presser 46 is disposed corresponding to the die 45 and has a plurality of through holes 52 at a portion corresponding to the opening 51 of the die 45. The punch 47 is fixed to the slide 44. The punch 47 is disposed corresponding to the opening 51 of the die 45 and is inserted into the through hole 52 of the plate presser 46. That is, the same number of punches 47 as the plurality of suspension members 37 are provided, and when the metal plate 34 is placed on the die 45, the punches 47 are positioned above the respective suspension members 37.

Next, the relationship between the die 45 and the punch 47 will be described in detail with reference to FIGS.
As shown in FIGS. 6 and 7, the punch 47 has a substantially square cross-sectional shape in the horizontal direction. The punch 47 has a first end 47a and a second end 47b. The first end portion 47 a is located above one end 37 a connected to the wiring substrate 31 of the suspension member 37 when the metal plate 34 is placed on the die 45. The second end 47 b is located above the other end 37 b connected to the discard member 36 of the suspension member 37 when the metal plate 34 is placed on the die 45.

  The opening 51 of the die 45 has a rectangular cross-sectional shape in the horizontal direction. The opening 51 is formed deeper than the longitudinal dimension of the suspension member 37 along the insertion direction of the punch 47. The opening 51 has a first inner peripheral surface 51a and a second inner peripheral surface 51b.

  The first inner peripheral surface 51a faces the first end 47a when the punch 47 is inserted into the opening 51. The second inner peripheral surface 51b faces the second end 47b when the punch 47 is inserted into the opening 51.

  As shown in FIGS. 7 and 8, when the metal plate 34 is placed on the die 45, the boundary 55 a between the wiring board 31 and the suspension member 37 is formed between the first end 47 a of the punch 47 and the opening 51. It is located between the first inner peripheral surface 51a. When the metal plate 34 is placed on the die 45, the boundary 55b between the discard member 36 and the suspension member 37 is located above the second inner peripheral surface 51b. In other words, the second inner peripheral surface 51 b is located below the boundary 55 b between the discard member 36 and the suspension member 37. That is, the opening 51 opens from the boundary 55 a between the wiring board 31 and the suspension member 37 to the boundary 55 b between the discard member 36 and the suspension member 37.

  The mounting surface 45 a of the die 45 and the first and second inner peripheral surfaces 51 a and 51 b are orthogonal to each other at the opening end 51 c of the opening 51. That is, the opening end 51c of the opening 51 is not chamfered.

A gap S ₁ is formed between the first end 47 a of the punch 47 and the first inner peripheral surface 51 a of the opening 51. The width of the gap S ₁ is set smaller than the thickness t of the metal plate 34. A gap S <b> ₂ is formed between the second end 47 b of the punch 47 and the second inner peripheral surface 51 b of the opening 51. The width of the gap S ₂ is set to be larger than the thickness t of the metal plate 34. For example, if the thickness t of the stainless steel metal plate 34 is 0.050 mm, an example of the width of the gap _{S 1} is, 0.005 mm, it is an example of the width of the gap _{S 2,} is 0.100 mm.

  As shown in FIG. 8, the size of the through hole 52 of the plate presser 46 is slightly larger than the outer shape of the punch 47.

Next, the board | plate material parting method which concerns on this embodiment is demonstrated with reference to FIG. 6 thru | or FIG.
First, as shown in FIG. 6, the metal plate 34 is placed on the mounting surface 45 a of the die 45. That is, the metal plate 34 is attached to the die 45 so that the suspension member 37 of the metal plate 34 is positioned above the opening 51 of the die 45. More specifically, as shown in FIG. 7, a boundary 55 a between the wiring substrate 31 and the suspension member 37 is formed between the first end 47 b of the punch 47 and the first inner peripheral surface 51 a of the opening 51. In addition, the boundary 55 b between the discard member 36 and the suspension member 37 is positioned above the second inner peripheral surface 51 b of the opening 51.

  As shown in FIG. 8, after the metal plate 34 is placed on the die 45, the plate presser 46 is set. That is, the plate retainer 46 is brought into contact with the metal plate 34 from above, and a downward load is applied to the metal plate 34. As a result, the metal plate 34 is sandwiched between the plate presser 46 and the die 45, and the position is fixed.

  As shown in FIG. 9, after fixing the position of the metal plate 34, the punch 47 is driven toward the die 45 by a drive mechanism (not shown). A metal plate 34 is attached between the punch 47 and the die 45. When the punch 47 comes into contact with the metal plate 34, the portion sandwiched between the first end 47 a of the punch 47 and the first inner peripheral surface 51 a of the opening 51 in the metal plate 34 is Shear force is generated. That is, a shearing force is generated at the boundary 55 a between the wiring board 31 and the suspension member 37. Thereby, the wiring board 31 and the suspension member 37 are disconnected.

On the other hand, a portion of the metal plate 34 sandwiched between the second end 47b of the punch 47 and the second inner peripheral surface 51b of the opening 51 does not have a shearing force sufficient for cutting. The shearing force is generated when the gap between the two blades is smaller than the plate thickness of the workpiece. In this embodiment, the second end 47b of the punch 47 corresponding to the two blades and the opening 51 are formed. This is because the gap S ₂ with the second inner peripheral surface 51 b is larger than the thickness t of the metal plate 34. Thereby, the boundary 55 b between the discard member 36 and the suspension member 37 of the metal plate 34 is not cut, and the suspension member 37 is not divided from the discard member 36.

The metal plate 34 has flexibility. Therefore, as shown in FIG. 9, as the punch 47 is inserted into the opening 51, the suspension member 37 bends while the end 37 b is supported by the discard member 36.
After the punch 47 is inserted into the opening 51, the punch 47 returns to the original state located above the metal plate 34 again. As shown in FIG. 10, when the punch 47 returns, the suspension member 37 is separated from the wiring board 31 and is not separated from the discard member 36.

  After the suspension member 37 is separated from the wiring substrate 31, the plate holder 46 is separated from the die 45. Thereby, the wiring board 31 fixed to the die 45 can be taken out. Further, the suspension member 37 can be taken out from the die 45 integrally with the discard member 36. The process of separating the wiring board 31 from the discard member 36 is thus completed.

According to the plate material dividing method or the mold 41 having such a configuration, the wiring substrate 31 can be separated from the discarding member 36 without generating waste. That is, the gap S ₂ between the second end 47 b of the punch 47 and the second inner peripheral surface 51 b of the opening 51 is formed to be larger than the plate thickness t of the metal plate 34, so A shear force sufficient for cutting is not generated at the boundary 55 b with the member 37.

  Thereby, even if the punch 47 enters the die 45, the suspension member 37 is not separated from the discard member 36, and the suspension member 37 is integral with the discard member 36. When removing the discard member 36 from the die 45, the suspension member 37 is also removed along with the discard member 36. Therefore, the suspension member 37 does not become waste.

  Since the suspension member 37 does not become waste, there is no possibility that the suspension member 37 sticks to the punch 47, the plate presser 46, or the die 45 to cause indentation defects. Further, the cleaning work of the mold 41 that is necessary after the cutting of the suspension member 37 can be omitted. This contributes to improving the manufacturing time and manufacturing cost of the printed circuit board 28.

  When the second inner peripheral surface 51b of the opening 51 is positioned below the boundary 55b between the discard member 36 and the suspension member 37, the suspension member 37 is bent finely. For example, even if the opening 51 is formed so that the second inner peripheral surface 51 b is positioned below the discard member 37, the suspension member 37 is bent by the punch 47 being driven.

However, since the suspension member 37 is bent while a part of the discard member 36 is wound, there is a possibility that a problem such as a crack may occur in a part of the discard member 36. If there is a problem with the discard member 36, the wiring board 31 may be damaged when the wiring board 31 is removed from the metal plate 34, or the operator may be damaged.
On the other hand, when the second inner peripheral surface 51b is positioned below the boundary 55b between the discard member 36 and the suspension member 37, the suspension member 37 is bent and the discard member 36 is not bent. Therefore, no trouble occurs in the discard member 36.

  When the boundary 55a between the wiring substrate 31 and the suspension member 37 is positioned between the first end 47a and the first inner peripheral surface 51a, the cut surface between the wiring substrate 31 and the suspension member 37 becomes the boundary 55a. It can be made to correspond. That is, when the cutting is performed, a part of the suspension member 37 does not remain on the wiring board 31.

  When the depth of the opening 51 is set to be greater than or equal to the longitudinal dimension of the suspension member 37, the suspension member 37 can be bent freely according to the punch 47.

In the mold 41, the mounting surface 45a of the die 45 and the inner peripheral surfaces 51a and 51b of the opening 51 are orthogonal to each other. That is, the opening end 51c of the opening 51 is not chamfered. By providing the clearance S ₂ between the second inner peripheral surface 51b of the second end portion 47b and the opening portion 51 of the punch 47, without providing a special contrivance to the open end 51c, prevent the occurrence of waste can do. That is, the manufacturing cost of the mold 41 can be reduced by not providing chamfering or the like at the opening end 51c.

  According to the printed circuit board 28 having such a configuration, the manufacturing time and the manufacturing cost of the printed circuit board 28 can be suppressed. Furthermore, according to the HDD 8 or the mobile phone 1 including the printed circuit board 28, the manufacturing time and manufacturing cost of the HDD 8 or the mobile phone 1 can be suppressed.

  Next, the metal mold | die 61 and the board | plate material parting method which concern on the 2nd Embodiment of this invention are demonstrated with reference to FIG. 11 and FIG. In addition, the structure which has the same function as the metal mold | die 41 which concerns on 1st Embodiment attaches | subjects the same code | symbol, and abbreviate | omits the description.

  As shown in FIGS. 11 and 12, the die 45 of the mold 61 has an opening 62. The opening 62 has an elliptical cross-sectional shape in the horizontal direction. The opening 62 opens from a boundary 55 a between the wiring board 31 and the suspension member 37 to a boundary 55 b between the discard member 36 and the suspension member 37.

The mold 61 has a punch 63. The punch 63 has a circular cross-sectional shape in the horizontal direction. Between the first inner peripheral surface 51a of the first end portion 47a and the opening portion 62 of the punch 63, a gap S ₁ is formed. The width of the gap S ₁ is set smaller than the thickness t of the metal plate 34. Between the second inner peripheral surface 51b of the second end portion 47b and the opening portion 51 of the punch 63, the clearance S ₂ is formed. The width of the gap S ₂ is set to be larger than the thickness t of the metal plate 34.

  According to the plate material dividing method or the mold 61 having such a configuration, the wiring board 31 can be separated from the discarding member 36 without generating waste. That is, when the punch 47 is driven into the suspension member 37 for the same reason as in the first embodiment, the suspension member 37 is separated from the wiring substrate 31 and remains integrally with the discard member 36. Therefore, the suspension member 37 does not become waste.

  The punch 63 according to the present embodiment has a circular cross-sectional shape. The suspension member 37 of the metal plate 34 has a very small size. For example, the length of the suspension member 37 in the longitudinal direction is several mm or less. Therefore, the outer shape of the punch 63 is very small, and the punch 63 is not easily manufactured. However, by forming the outer shape of the punch 63 in a cylindrical shape, the punch 63 can be manufactured more easily than when the outer shape is a prism.

  Furthermore, when the cross-sectional shape of the punch 63 is circular, the cut surface of the metal plate 34 can be formed in an arc shape. That is, the length that the punch 63 hits the cut surface can be sufficiently secured, and stable cutting can be performed.

  The plate material cutting method, the molds 41 and 61, the printed board 28, and the mobile phone 1 according to the first and second embodiments have been described above, but the present invention is not limited to these. For example, the opening 51 may have an opening shape other than a rectangle or an ellipse. The opening 51 does not need to be opened from the boundary 55 a between the wiring board 31 and the suspension member 37 to the boundary 55 b between the discard member 36 and the suspension member 37.

  For example, the second inner peripheral surface 51 b of the opening 51 may be disposed below any part of the suspension member 37 as long as the second inner peripheral surface 51 b is positioned below the suspension member 37. That is, the position of the second inner peripheral surface 51b is not particularly limited as long as the opening 51 corresponds to a portion where the first inner peripheral surface 51b is to be cut. However, like the openings 51 and 62 according to the first and second embodiments, the opening size of the openings 51 and 62 is increased by disposing the second inner peripheral surface 51b near the discard member 36. This improves the workability of the openings 51 and 62. As shown in FIG. 13, the opening end 51c of the opening 51 may be chamfered so that the suspension member 37 is easily bent.

  The printed circuit board to which the present invention is applied is not limited to the printed circuit board 28 for the HDD 8, and can be applied to printed circuit boards for all electronic devices. Furthermore, the range to which the present invention can be applied is not limited to the printed circuit board 28. For example, it can be used for cutting a plate-like substrate such as a resin other than a metal plate or rubber. The present invention can be applied to any plate-like substrate that does not break when bent.

1 is a perspective view of a mobile phone according to a first embodiment of the present invention. FIG. 2 is a perspective view showing the HDD shown in FIG. 1. FIG. 2 is an exploded perspective view showing the HDD shown in FIG. 1. The top view of the metal plate which concerns on the 1st Embodiment of this invention. Sectional drawing of the press work apparatus which concerns on the 1st Embodiment of this invention. The perspective view which shows the relationship between the punch shown in FIG. 5, and die | dye. The top view which shows the relationship between the punch shown by FIG. 5, and die | dye. Sectional drawing which shows the mode before stamping of the metal plate shown in FIG. Sectional drawing which shows a mode during the punching of the metal plate shown in FIG. Sectional drawing which shows the mode after punching of the metal plate shown in FIG. The perspective view which shows the relationship between the punch which concerns on the 2nd Embodiment of this invention, and die | dye. The top view which shows the relationship between the punch shown in FIG. 11, and die | dye. Sectional view of a die according to another embodiment of the present invention

Explanation of symbols

S ₁ ... Gap, S ₂ ... Gap, t ... Plate thickness, 1 ... Mobile phone, 8 ... HDD, 28 ... Printed circuit board, 31 ... Wiring board, 32 ... Circuit components, 34 ... Metal plate, 36 ... Discarding member, 37 ... Suspension member, 37a ... One end of the suspension member, 37b ... The other end of the suspension member, 41 ... Die, 45 ... Die, 46 ... Plate presser, 47 ... Punch, 47a ... First end, 47b ... Second End portion 51... Opening portion 51 a. First inner peripheral surface 51 b. Second inner peripheral surface 51 c Open end 61 61 Mold 62 Opening 63 Punch

Claims (9)

Preparing a plate-like substrate having flexibility, a body part, a discard member, and a suspension member interposed between the body part and the discard member;
Attach the plate-like base material to the die having an opening so that the suspension member corresponds to the opening,
A plate material dividing method for driving a punch corresponding to the opening to the suspension member, and dividing the main body from the suspension member,
The punch has a first end corresponding to one end connected to the main body of the suspension member, and a second end corresponding to the other end connected to the discard member of the suspension member, and the first The end of 1 forms a gap smaller than the thickness of the plate-like substrate between the inner peripheral surface of the opening and the second end is between the inner peripheral surface of the opening. A plate material dividing method, wherein a gap larger than the thickness of the plate-like substrate is formed. In the board | plate material parting method of Claim 1,
The opening of the die has a first inner peripheral surface facing the first end of the punch and a second inner peripheral surface facing the second end of the punch,
The said 2nd internal peripheral surface is located under the boundary of the said discard member and the said suspension member, when the said plate-shaped base material is mounted on the said die | dye, The board | plate material parting method characterized by the above-mentioned. In the board | plate material parting method of Claim 2,
The boundary between the main body and the suspension member is between the first end of the punch and the first inner peripheral surface of the opening when the plate-like substrate is placed on the die. The board | plate material parting method characterized by being located in. Preparing a plate-like substrate having flexibility, a body part, a discard member, and a suspension member interposed between the body part and the discard member;
Attach the plate-like base material to the die having an opening so that the suspension member corresponds to the opening,
A plate material dividing method for driving a punch corresponding to the opening to the suspension member, and dividing the main body from the suspension member,
The punch has a circular cross-sectional shape and has a first end corresponding to one end connected to the main body of the suspension member and a second end corresponding to the other end connected to the discard member of the suspension member. And end of
The opening portion of the die has an elliptical opening shape, a first inner peripheral surface facing the first end portion, and a second inner peripheral surface facing the second end portion. The first inner peripheral surface forms a gap smaller than the thickness of the plate-like substrate between the first end and the second inner peripheral surface is the second The board | plate material parting method characterized by forming a clearance gap larger than the thickness of the said plate-shaped base material between the edge parts of this. In the board | plate material parting method of Claim 4,
The plate material cutting method according to claim 1, wherein the opening of the die is formed deeper than the longitudinal dimension of the suspension member along the insertion direction of the punch. In the board | plate material parting method of Claim 4,
The die has an attachment surface to which the plate-like substrate is attached,
The mounting method and the inner peripheral surface of the opening are orthogonal to each other at the opening end of the opening. A mold that is flexible and separates the main body portion from a plate-like base material that includes a main body portion, a discard member, and a suspension member interposed between the main body portion and the discard member. And
Punch and
A die having an opening corresponding to the punch, and a die to which the plate-like substrate is attached so that the suspension member corresponds to the opening;
The punch has a first end corresponding to one end connected to the main body portion of the suspension member and a second end corresponding to the other end connected to the discard member of the suspension member. The end of 1 forms a gap smaller than the thickness of the plate-like substrate between the inner peripheral surface of the opening and the second end is between the inner peripheral surface of the opening. A mold having a gap larger than the thickness of the plate-like substrate. A printed circuit board comprising a main body and circuit components mounted on the main body,
The main body portion includes the main body portion, a discard member, and a suspension member interposed between the main body portion and the discard member, and from a flexible plate-like base material to the punch and the punch. Divided with a die having a corresponding opening,
When the plate-like base material is attached to the die, the punch has a first end corresponding to one end connected to the main body of the suspension member and the other end connected to the discard member of the suspension member. The first end portion forms a gap smaller than the thickness of the plate-like base material between the first end portion and the inner peripheral surface of the opening, and the second end portion has a corresponding second end portion. The part forms a gap larger than the thickness of the plate-like base material between the inner peripheral surface of the opening and the printed board. An electronic device comprising a housing and a printed circuit board accommodated in the housing,
The printed circuit board has a main body portion and circuit components mounted on the main body portion,
The main body portion includes the main body portion, a discard member, and a suspension member interposed between the main body portion and the discard member, and from a flexible plate-like base material to the punch and the punch. Divided with a die having a corresponding opening,
When the plate-like base material is attached to the die, the punch has a first end corresponding to one end connected to the main body of the suspension member and the other end connected to the discard member of the suspension member. The first end portion forms a gap smaller than the thickness of the plate-like base material between the first end portion and the inner peripheral surface of the opening, and the second end portion has a corresponding second end portion. The electronic device is characterized in that the portion forms a gap larger than the thickness of the plate-like base material between the opening and the inner peripheral surface of the opening.

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