JP2007080967A - Manufacturing method of chip - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve the flexibility in the design of an electrode and wiring by making easy the routing for electrodes provided in the front or rear surface of the substrate of a chip when manufacturing a tuning-fork gyroscope sensor from a mother board of the wafer and the like. <P>SOLUTION: The manufacturing method of a chip comprises a first cutting process for forming two or more pieces of a part of a predetermined shape, including two or more regions for the tuning-fork gyroscope sensors by performing cutting to a wafer; a through-hole formation process for forming a through-hole in a portion which does not affect vibration of the tuning fork to a piece of a part; a sputtering process for forming a metal film in the surface, the rear face, and the end face by performing sputtering to a piece of a part; a second cutting process for forming the outline of the tuning-fork gyroscope sensor, while forming a recess in the edge including a position which bisects the through-hole by performing the cutting to the piece of a part; and a patterning process for forming a predetermined electrode including a wiring electrode connected over the end face, the front surface, and the rear surface in the recess by performing the patterning. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a method of manufacturing a chip component such as a tuning fork type gyro sensor from a mother board such as a wafer.

  Conventionally, a gyro sensor that detects acceleration and angular velocity is used for a camera navigation system or camera shake correction. There are a beam type and a tuning fork type as a gyro sensor, and a tuning fork type gyro sensor that easily vibrates and has a high Q value is often used (Patent Documents 1 and 2).

  9 is a perspective view showing the outer shape of a conventional tuning fork type gyro sensor 80, FIG. 10 is a diagram showing an example of the structure of the front and back electrodes DK of another conventional tuning fork type gyro sensor 80B, and FIG. It is a front view of the tuning fork type gyro sensor 80C of another example.

  As shown in FIG. 9, a conventional tuning fork type gyro sensor 80 is a tuning fork (vibration) having a plurality of arm portions 81, 81... And a base portion (node portion) 82 using a piezoelectric material such as LN (lithium niobate). And a plurality of electrodes DK for driving and detection are formed on the front surface, the back surface, and the side surface of the substrate KB.

  In such a tuning fork type gyro sensor 80, it is necessary to separate the generated Coriolis signal without causing unnecessary coupling or electrical coupling to the vibration caused by the excitation signal. For this purpose, the electrodes DK are provided at positions facing the front and back surfaces of the substrate KB, respectively, and are connected to each other by a lead wiring. In particular, when performing biaxial detection, the number of necessary signal lines increases, and complicated routing wiring is required. Furthermore, when LN is used as a material, only a linear substrate KB by dicing can be realized. Therefore, wiring to the electrodes provided on the front surface, the back surface, and the side surface can be performed on one side only on the front surface or only on the back surface. It is difficult to take out only from the electrode, and the electrodes and wiring have a complicated structure.

  For example, as shown in FIGS. 10A and 10B, in a conventional tuning fork type gyro sensor 80B, a large number of electrodes DK are provided on the arm portion 81, and the electrodes DK are connected to the base portion 82 to the outside. A connection terminal ST is provided. In order to perform wiring between the front surface electrode DK and the back surface electrode DK, a so-called headband electrode DKH is provided at the tip of the arm portion 81 so as to surround the arm portion 81 across the front surface, the back surface, and the side surface. .

11, in a tuning-fork type gyro sensor 80C having a substrate structure in which four arm portions 81, 82... Are supported by the base portion 82, the base portion is used for wiring connection between the front surface and the back surface. The thing which provided the through-hole 83 in 82 is proposed.
JP-A-11-14371 JP 2004-140793 A

  Conventionally, in a tuning fork type gyro sensor using LN having high piezoelectricity, it is necessary to accurately arrange electrodes on the front surface, back surface, and left and right side surfaces of the substrate in order to obtain necessary characteristics. Since the accuracy of the electrodes affects the characteristics, easy three-dimensional routing wiring for each electrode is difficult.

  Conventionally, a plurality of electrodes are arranged on the front and back surfaces of the substrate, and it is necessary to realize electrical connection to both the front and back surfaces in mounting. Since the tip and pedestal of the tuning fork need to be cut after wiring of the electrodes due to trimming, the cut surface cannot be used for wiring.

  As described above, conventionally, it is not easy to wire the electrodes DK provided on the front and back surfaces of the substrate KB, and in particular, the routing wiring design for wiring from only one surface of the front surface or the back surface to the outside. Was not easy.

  The present invention has been made in view of the above-described problems. When manufacturing a chip component such as a tuning fork type gyro sensor from a mother board such as a wafer, the lead wiring for an electrode provided on the front surface or the back surface of the substrate of the chip component is provided. It is intended to facilitate and improve the degree of freedom in designing electrodes and wiring.

  The method according to the present invention is a method of manufacturing a chip component from a motherboard, and a through hole forming step for forming a through hole in the motherboard, and cutting at a position where the through hole is divided into two with respect to the motherboard. And a step of forming a recess in the edge, and a step of forming a wiring electrode connected across the end surface, the front surface, and the back surface of the recess.

  In addition, a first cutting step of cutting the motherboard to form a predetermined shape including regions for a plurality of chip parts, and a through hole for forming a through hole in the motherboard formed in the predetermined shape After the hole forming step, after the through hole forming step, a sputtering step of forming a metal film on the front surface, the back surface, and the end surface by sputtering, and after the sputtering step, divide the through hole into the motherboard. A second cutting process in which a recess is formed at the edge by cutting including the position, and patterning is performed to form a predetermined electrode including a wiring electrode connected across the end surface, the front surface, and the back surface in the recess. Patterning step.

  In addition, a first cutting step of cutting a wafer to form a plurality of pieces having a predetermined shape including areas for a plurality of tuning fork type gyro sensors, and affecting the vibration of the tuning fork with respect to the pieces. A through hole forming step for forming a through hole in a portion not to be given, and a sputtering step for performing sputtering on the piece after the through hole forming step, and forming a metal film on the front surface, the back surface, and the end surface, After the sputtering step, a second cutting step is performed on the piece, including a position that bisects the through hole, to form a recess at the edge and to form an outer shape of the tuning fork type gyro sensor; A patterning step of performing patterning to form a predetermined electrode including a wiring electrode connected across the end surface, front surface, and back surface in the concave portion Including the.

  According to the present invention, when manufacturing a chip component such as a tuning fork type gyro sensor from a mother board such as a wafer, it is possible to easily route the wiring to the electrodes provided on the front surface or the back surface of the chip component substrate, and to freely design the electrodes and wiring. The degree can be improved.

  FIG. 1 is a flowchart showing an example of steps of a chip component manufacturing method according to the present invention.

  In FIG. 1, first, a motherboard is prepared (# 11). As the motherboard, a wafer made of silicon, a compound semiconductor, a piezoelectric material, a dielectric material, ceramic, or the like is used. Cutting into a predetermined outer shape as necessary. On the other hand, a through hole is formed at a predetermined position (# 12). Cutting (including dicing) is performed at a position that bisects the through hole to shape the outer shape of the chip component (# 13). As a result, the through hole is divided into two, and a recess is formed at each edge of the chip parts on both sides (# 14). And about a chip component, while forming a predetermined electrode on the surface and back surface, a wiring electrode is formed in the recessed part formed in the edge, and it connects over the end surface, surface, and back surface by a wiring electrode (# 15).

  In addition, before forming a through-hole in step # 12, you may provide a 1st cutting process in order to form a motherboard in the predetermined | prescribed shape containing the area | region for several chip components. Further, before cutting in step # 13, a metal film may be formed on the front surface, back surface, and end surface of the chip component by sputtering. In that case, the electrode may be formed in step # 15 by patterning the metal film.

  2 is a flowchart showing an example of a process of the tuning fork type gyro sensor JS according to the present invention, FIG. 3 is a diagram showing a schematic shape in each process in the manufacturing method of FIG. 2, and FIG. 4 is a plurality of tuning fork types. FIG. 5 is a front view of a substrate KB having a constricted structure, FIG. 6 is a front view showing a state in which electrodes are formed on the surface of the substrate KB, and FIG. 7 is a front view of the piece BHB including the region of the gyro sensor. FIG. 8 is a cross-sectional plan view of the arm portion AM. FIG. 8 is a front view showing an example of the arrangement of upper and lower side via structures and pad electrodes.

  Here, a case where a tuning fork type gyro sensor is manufactured from a wafer made of a piezoelectric material will be described as an example.

  As shown in FIGS. 2 and 3, first, a wafer WH made of a piezoelectric material such as LN is prepared (step # 21 in FIG. 2, FIG. 3A), and first cutting is performed (# 22). In the first cutting, dicing is first performed (FIG. 3B) to obtain a plurality of rectangular pieces BHA including regions for a plurality of tuning fork type gyro sensors [FIG. 3C]. A cut is made in the piece BHA to create a plurality of pieces BHB having a predetermined shape corresponding to the substrate KB of the plurality of tuning fork type gyro sensors [FIG. 3 (D)].

  In the example shown in FIG. 3, a plurality of wafers WH, that is, three stacked sheets are prepared, and three stacked pieces BHA and BHB are obtained by the first cutting. It may be 2 or less or 4 or more.

  A through hole KA is formed in the base portion BS, which is a portion that does not affect the vibration of the tuning fork, with respect to the piece BHB [Step # 23 in FIG. 2, FIG. 3 (E), FIG. 4].

  That is, as shown in FIG. 4, the piece BHB includes a plurality of tuning fork type gyro sensor areas AR1, 2, 3,... These areas AR1, 2, 3,... Are virtually partitioned by a dicing line (divided dicing line) DL. A substrate KB having four arm portions AM and a base portion BS that supports them is formed by one region AR. A rectangular through hole KA that is line-symmetric with respect to each dicing line DL is provided at a boundary portion of each region AR in the base portion BS.

  The through hole KA can be formed by other methods by cutting using a drill or other tools, or by sandblasting. Since the size of the through hole KA is relatively large, the through hole KA is easy to form and easy to obtain accuracy. Further, the piece BHB has a larger shape than the area AR of one final tuning-fork type gyro sensor, so that it is easy to position and hold the piece BH when forming the through hole KA or performing other processing. is there. Since the through hole KA is formed at a position that does not affect the vibration of the tuning fork in the base portion BS, the function is not affected even if the accuracy during formation is slightly low.

  Next, the three pieces BHB in a stacked state are peeled off one by one, and sputtering is performed on each piece BHB provided with the through hole KA, and a metal film is applied to the front surface, back surface, and end surface. Form (# 24).

  Then, the second cutting process is performed on the piece BHB (# 25). In the second cutting process, cutting is performed on each piece BHB including the dicing line DL, which is a position that bisects the through hole KA, thereby producing a substrate KB having the outer shape of a tuning fork type gyro sensor [FIG. 3 (F), FIG. 5].

  That is, as shown in FIG. 5, the piece BHB is diced along the dicing line DL, and further, the upper and lower portions of the figure are diced along the trimming lines TL1 and TL2. The length of the substrate KB is adjusted depending on the positions of the trimming lines TL1 and TL2. The upper trimming line TL1 is a frequency trimming line for adjusting the frequency, and the lower trimming line TL2 is a size trimming line for adjusting the size of the substrate KB.

  By performing dicing on the dicing line DL, the through hole KA is cut in half, and the concave portions 11 (11a, 11b) are formed on both edges of the base portion BS of the substrate KB. Due to the presence of the recess 11, the substrate KB has a constricted structure. As a matter of course, the metal film formed by sputtering remains on the end face of the recess 11 and there is no metal film on the end face formed by dicing.

  Next, patterning is performed on the substrate KB to form necessary electrodes such as a drive electrode, a detection electrode, and a wiring electrode (# 26). In the recess 11, a wiring electrode connected across the end surface and the front and back surfaces of the substrate KB is formed.

  That is, as shown in FIG. 6, various electrodes (pad electrodes) DK1 to DK1 to DK1 to 6 are formed on the surface of the substrate KB. Wiring electrodes DKH1 and DKH2 are connected to each other. The wiring electrodes DKH1 and 2 connect between the electrode DK provided on the front surface of the substrate KB and the electrode DK provided on the back surface. Therefore, it is possible to easily carry out routing wiring for conducting the signal on the back surface to the front surface, and the degree of freedom in designing the electrode DK and wiring is improved.

  The concave portion 11 is formed at a position below the base portion BS so as not to affect the vibration of the tuning fork, and a structure in which pad electrodes for wire bonding are concentrated in a fixed portion in the vicinity thereof, that is, a portion that does not vibrate is realized. can do. Moreover, since it has a constricted structure, when the lower portion of the base portion BS is fixed, there is an effect of mitigating that the influence of strain at the time of fixing is transmitted to the arm portion AM. In this way, the degree of freedom of design at each stage is expanded, and high manufacturability can be realized.

  Thus, the tuning fork type gyro sensor JS is manufactured by providing the electrode DK on the substrate KB and performing wire bonding or the like. In the example described here, the through hole KA is provided at the boundary portions on both sides of the substrate KB, but may be provided at another position.

  That is, as shown in FIG. 7A, through holes KA are provided on the trimming lines TL1 and TL2 at the upper end portion of the arm portion AM of the substrate KB2 or the lower end portion of the base portion BS. Then, cutting is performed along the trimming lines TL1 and TL2. Then, the concave portions 11 are formed in the respective through holes KA, and the wiring electrodes DKH can be formed in the respective concave portions 11 to connect the front and back electrodes.

  For example, as shown in FIG. 7B, in the fixed region of the lower half of the base portion BS, the through hole KA is provided on the trimming line TL at the lower end thereof, and wiring is performed by cutting along the trimming line TL. Electrodes DKH3-9 are formed.

  Thus, by forming the wiring electrodes DKH3 to DKH9 using the base portion BS, the pad electrodes for wire bonding are serialized, thereby further facilitating the wiring. At the same time, by providing the through hole KA on the side surface of the substrate KB3 to form the recess 11, the wiring can be facilitated and the fixing method can be further simplified.

  As shown in FIG. 8, electrodes DK11 to DK20 are provided at symmetrical positions on the two arm portions AM provided on the substrate KB4. Although shown as a wiring diagram in the figure, the front and back surfaces of the substrate KB are connected via wiring electrodes DK provided on the substrate KB4, and wire bonding is performed using pad electrodes DK21 to 24 provided on one surface. It is possible to connect to the external drive circuit CT1 and the detection circuit CT2.

  In the embodiment described above, an example of dimensions is as follows. The length of the substrate KB is 3 to 10 mm, for example, 5 mm, the width of the substrate KB is 1 to 5 mm, for example, 2 mm, and the thickness is 0.1 to 0.5 mm, for example, 0.3 mm. Further, the through hole KA has a length of 0.1 to 0.5 mm, for example, 0.2 mm, a width of 0.4 to 2 mm, for example, 0.8 mm, and thus the recess 11 has a length of 0.1 to 0.5 mm, for example, 0.2 mm. The width is 0.2 to 1 mm, for example, 0.4 mm. Further, the height of the constricted portion of the base portion BS (the length from the root of the arm portion AM to the concave portion 11) W2 with respect to the width W1 of the arm portion AM does not affect the vibration of the arm portion AM. It is determined so that W2 ≧ 2 × W1.

  In the embodiment described above, the manufacture of the tuning fork type gyro sensor has been described as an example. However, the present invention is not limited to this. For example, the present invention can be applied to the manufacture of capacitors, ICs, printed boards, and other various chip parts. it can.

  The present invention can be used for manufacturing tuning fork type gyro sensors, capacitors, ICs, printed boards, and other various chip parts (functional parts) by cutting from a mother board.

It is a flowchart which shows the example of the process of the manufacturing method of the chip component which concerns on this invention. It is a flowchart which shows the example of the process of the manufacturing method of the tuning fork type gyro sensor which concerns on this invention. It is a figure which shows the schematic shape in each process in the manufacturing method of FIG. It is a front view of the piece containing the area | region of the some tuning fork type gyro sensor. It is a front view of the board | substrate which has a constriction structure. It is a front view which shows the state in which the electrode was formed in the surface of a board | substrate. It is a front view which shows the example of arrangement | positioning of an upper and lower side via structure and a pad electrode. It is a cross-sectional top view of an arm part. It is a perspective view which shows the external shape of the conventional tuning fork type gyro sensor. It is a figure which shows the example of the structure of the electrode of the surface of a tuning fork type gyro sensor of the other conventional example, and a back surface. It is a front view of the tuning fork type gyro sensor of the other conventional example.

Explanation of symbols

JS tuning fork type gyro sensor (chip parts)
KA Through-hole WH Wafer (motherboard)
DKH wiring electrode piece BH piece 11 recess

Claims (5)

A method of manufacturing chip components from a motherboard,
A through hole forming step for forming a through hole in the motherboard;
A cutting process for cutting the mother board at a position that bisects the through hole to form a recess at the edge;
In the recess, forming a wiring electrode connected across its end surface, front surface, and back surface;
A method for manufacturing a chip component, comprising: A method of manufacturing chip components from a motherboard,
A first cutting step of cutting the motherboard to form a predetermined shape including a region for a plurality of chip parts;
A through hole forming step of forming a through hole for the motherboard formed in the predetermined shape;
After the through hole forming step, a sputtering step of forming a metal film on the front surface, the back surface, and the end surface by sputtering,
After the sputtering step, a second cutting step for cutting the motherboard including a position that bisects the through hole to form a recess at the edge;
Patterning to form a predetermined electrode including a wiring electrode connected across its end surface, front surface, and back surface in the concave portion; and
A method for manufacturing a chip component, comprising: A method of manufacturing a tuning fork type gyro sensor from a wafer made of a piezoelectric material,
A first cutting step of performing cutting on the wafer to form a plurality of pieces of a predetermined shape including regions for a plurality of tuning fork type gyro sensors;
A through hole forming step for forming a through hole in a portion that does not affect the vibration of the tuning fork with respect to the piece;
After the through hole forming step, sputtering is performed on the part, and a sputtering step of forming a metal film on the front surface, the back surface, and the end surface;
After the sputtering step, a second cutting step is performed on the piece, including a position that bisects the through hole, to form a recess at the edge and to form an outer shape of the tuning fork type gyro sensor;
Patterning to form a predetermined electrode including a wiring electrode connected across its end surface, front surface, and back surface in the concave portion; and
A method for manufacturing a tuning fork type gyro sensor. In the through hole forming step, the through hole is formed in a boundary portion of a region corresponding to a plurality of tuning fork type gyro sensors.
A method for manufacturing a tuning fork type gyro sensor according to claim 3. In the through hole forming step, the through hole is formed at a position near the end of the base portion of the tuning fork type gyro sensor.
5. A method for manufacturing a tuning fork type gyro sensor according to claim 3.