JP2007080880A - Light emitting device - Google Patents

Light emitting device Download PDF

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JP2007080880A
JP2007080880A JP2005262958A JP2005262958A JP2007080880A JP 2007080880 A JP2007080880 A JP 2007080880A JP 2005262958 A JP2005262958 A JP 2005262958A JP 2005262958 A JP2005262958 A JP 2005262958A JP 2007080880 A JP2007080880 A JP 2007080880A
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light
color conversion
led chip
emitted
color
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Eiji Shiohama
英二 塩濱
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Panasonic Electric Works Co Ltd
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Matsushita Electric Works Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a light emitting device which can mix colors. <P>SOLUTION: The light emitting device is provided with a plurality of LED chips 1 and 1, a package 10 as a base member wherein the LED chips 1 and 1 are mounted, and a color conversion member 20 which is arranged on the mounting face of the LED chips 1 and 1 in the package 10. A mixed color light (white light) of a blue light emitted from the LED chip 1 and a light emitted from a yellow phosphor is emitted from a first color conversion area M1 of the color conversion member 20. In addition, a mixed color light (slightly reddish white (bulb color) light) of a blue light emitted from the LED chip 1, a red light emitted from a red phosphor, and a green light emitted from a green phosphor, is emitted from a second color conversion M2 of the color conversion member 20. Therefore, a blue light is alternatively emitted from either of the two LED chips 1 and 1, or blue lights are emitted from both LED chips 1 and 1, thereby permitting mixing of colors. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、LEDチップ(発光ダイオードチップ)を利用した発光装置に関するものである。   The present invention relates to a light emitting device using an LED chip (light emitting diode chip).

従来、LEDチップと、LEDチップが実装されたベース部材と、ベース部材におけるLEDチップの実装面側に配設されLEDチップが放射する光によって励起されてLEDチップの発光色と異なる色の光を放射する蛍光材料を透明材料とともに成形した成形品からなる色変換部材とを備えた発光装置が提案されている(例えば、特許文献1参照)。なお、この種の発光装置としては、例えば、青色光を放射するLEDチップと、黄色光を放射する蛍光体とを混色させて白色光(白色光の発光スペクトル)を得る白色発光装置(一般に白色LEDと呼ばれている。)が商品化されている。
特開2001-148514号公報
Conventionally, an LED chip, a base member on which the LED chip is mounted, and a light of a color different from the emission color of the LED chip when excited by light emitted from the LED chip disposed on the LED chip mounting surface side of the base member. There has been proposed a light-emitting device including a color conversion member made of a molded product obtained by molding a radiating fluorescent material together with a transparent material (see, for example, Patent Document 1). As this type of light-emitting device, for example, a white light-emitting device (generally white light-emitting device) that obtains white light (white light emission spectrum) by mixing an LED chip that emits blue light and a phosphor that emits yellow light. It is called LED.) Has been commercialized.
JP 2001-148514 A

しかしながら、上記従来装置においては、互いに発光色が異なる複数種類の光の混色で1種類の発光色(例えば、白色)を得ており、複数種類の色の光を切り換えて出射すること(以下、「調色」と呼ぶ。)ができなかった。   However, in the above-described conventional device, one type of light emission color (for example, white) is obtained by mixing a plurality of types of light having different emission colors, and light of a plurality of types of colors is switched and emitted (hereinafter, referred to as “color”). Called "Toning").

本発明は上記事情に鑑みて為されたものであり、その目的は、調色が可能な発光装置を提供することになる。   The present invention has been made in view of the above circumstances, and an object thereof is to provide a light-emitting device capable of toning.

請求項1の発明は、上記目的を達成するために、複数のLEDチップと、各LEDチップが実装されたベース部材と、ベース部材における各LEDチップの実装面側に配設されLEDチップが放射する光によって励起されてLEDチップの発光色と異なる色の光を放射する蛍光材料を透明材料とともに成形した成形品からなる色変換部材とを備え、色変換部材は、互いに異なる色の光を放射する複数種類の蛍光材料が複数の色変換領域に個別に分布してなり、これら複数の色変換領域が、各LEDチップの光の放射範囲とほぼ一対一に対応するように配置されたことを特徴とする。   In order to achieve the above object, the invention according to claim 1 is a plurality of LED chips, a base member on which each LED chip is mounted, and a LED chip disposed on the mounting surface side of each LED chip in the base member. And a color conversion member made of a molded product obtained by molding together with a transparent material a fluorescent material that emits light of a color different from the light emission color of the LED chip. The color conversion member emits light of different colors. A plurality of types of fluorescent materials are individually distributed in a plurality of color conversion regions, and the plurality of color conversion regions are arranged so as to substantially correspond to the light emission range of each LED chip. Features.

請求項2の発明は、請求項1の発明において、各LEDチップと色変換部材との間に集光用のレンズ部材がそれぞれ設けられたことを特徴とする。   The invention of claim 2 is characterized in that, in the invention of claim 1, a condensing lens member is provided between each LED chip and the color conversion member.

請求項3の発明は、請求項1又は2の発明において、隣り合う他の色変換領域と一対一に対応したLEDチップから放射された光を遮光する遮光壁が各LEDチップ及び色変換領域の間に設けられたことを特徴とする。   According to a third aspect of the present invention, in the first or second aspect of the present invention, a light-shielding wall that shields light emitted from an LED chip that has a one-to-one correspondence with another adjacent color conversion region is provided for each LED chip and the color conversion region. It is provided between.

請求項1の発明によれば、複数のLEDチップから択一的に光を放射することで複数種類の色の光を切り換えて出射する調色が可能となる。   According to the first aspect of the present invention, it is possible to perform color matching by switching and emitting light of a plurality of types of colors by selectively emitting light from a plurality of LED chips.

請求項2の発明によれば、各色変換領域に効率よく光が放射されるため、隣り合う色変換領域に漏れる光が減少して色むらの発生を抑えることができる。   According to the second aspect of the present invention, since light is efficiently radiated to each color conversion region, the light leaking to the adjacent color conversion region is reduced, and the occurrence of color unevenness can be suppressed.

請求項3の発明によれば、遮光壁によって隣り合う色変換領域に漏れる光が減少して色むらの発生を抑えることができる。   According to invention of Claim 3, the light which leaks to the color conversion area | region adjacent by a light-shielding wall reduces, and generation | occurrence | production of color unevenness can be suppressed.

本実施形態の発光装置は、図1(a)及び(b)に示すように複数(図示例では2つ)のLEDチップ1,1と、LEDチップ1,1が実装されたベース部材たるパッケージ10と、パッケージ10におけるLEDチップ1,1の実装面側に配設される色変換部材20とを備える。   As shown in FIGS. 1A and 1B, the light emitting device of this embodiment includes a plurality (two in the illustrated example) of LED chips 1 and 1 and a package as a base member on which the LED chips 1 and 1 are mounted. 10 and a color conversion member 20 disposed on the mounting surface side of the LED chips 1 and 1 in the package 10.

パッケージ10は、セラミック材料によって略直方体状に形成されるとともに一面には円錐台形状の凹所11が設けられ、凹所11の底面に2つのLEDチップ1,1が実装されている。また、2つのLEDチップ1,1の間には凹所11の底面から開口面に向かって立ち上がる遮光壁12が設けられている。なお、LEDチップ1,1に対向する凹所11の内周面並びに遮光壁12の側面には、反射率の高い材料(例えば、アルミナ)からなる反射面が形成されており、LEDチップ1,1から放射された光が凹所11の開口面から効率よく出射するようにしてある。   The package 10 is formed in a substantially rectangular parallelepiped shape with a ceramic material, and a conical recess 11 is provided on one surface, and two LED chips 1 and 1 are mounted on the bottom surface of the recess 11. A light shielding wall 12 that rises from the bottom surface of the recess 11 toward the opening surface is provided between the two LED chips 1 and 1. A reflective surface made of a highly reflective material (for example, alumina) is formed on the inner peripheral surface of the recess 11 facing the LED chips 1 and 1 and the side surface of the light shielding wall 12. The light emitted from 1 is efficiently emitted from the opening surface of the recess 11.

LEDチップ1,1は、青色光を放射するGaN系青色LEDチップであり、サファイア基板からなる結晶成長用基板の主表面側にGaN系化合物半導体材料により形成されて、例えばダブルへテロ構造を有する積層構造部からなる発光部がエピタキシャル成長法(例えば、MOVPE法など)により成長させてある。なお、LEDチップ1,1は、凹所11の底面に形成された金バンプ(図示せず)に、図示しないアノード電極並びにカソード電極を接合することでパッケージ10に実装されている。また、LEDチップ1,1が放射する光を集光するため、平凸レンズを構成するレンズ部材2,2がLEDチップ1,1の表面(図1(b)における上面)に配設されている。   The LED chips 1 and 1 are GaN-based blue LED chips that emit blue light, and are formed of a GaN-based compound semiconductor material on the main surface side of a crystal growth substrate made of a sapphire substrate, and have, for example, a double heterostructure. A light emitting portion made of a laminated structure is grown by an epitaxial growth method (for example, MOVPE method). The LED chips 1 and 1 are mounted on the package 10 by bonding an anode electrode and a cathode electrode (not shown) to gold bumps (not shown) formed on the bottom surface of the recess 11. Moreover, in order to condense the light which LED chip 1,1 radiates | emits, the lens members 2 and 2 which comprise a plano-convex lens are arrange | positioned at the surface (upper surface in FIG.1 (b)) of LED chip 1,1. .

色変換部材20は、シリコーン樹脂のような透明材料を矩形平板状に成形した成形品により構成され、中心線(図1(a)における破線)で区切られた2つの領域のうち、一方の領域(以下、第1の色変換領域という。)M1においては、LEDチップ1,1から放射された青色光によって励起されてブロードな黄色系の光を放射する粒子状の黄色蛍光体からなる蛍光材料が混合され、他方の領域(以下、第2の色変換領域という。)M2においては、LEDチップ1,1から放射された青色光によって励起されて赤色光を放射する粒子状の赤色蛍光体からなる蛍光材料と緑色光を放射する緑色蛍光体からなる蛍光材料とが混合されている。そして、このように構成される色変換部材20は、その中心線が前方(図1における上方)からみて遮光壁12と重なり、且つ凹所11の開口を塞ぐようにしてパッケージ10に結合されている。したがって、LEDチップ1から放射された青色光と黄色蛍光体から放射された光との混色光(白色光)が色変換部材20の第1の色変換領域M1から出射され、LEDチップ1から放射された青色光と赤色蛍光体から放射された赤色光と緑色蛍光体から放射された緑色光の混色光(やや赤みが強い白色(いわゆる電球色)の光)が色変換部材20の第2の色変換領域M2から出射されることになる。   The color conversion member 20 is composed of a molded product obtained by molding a transparent material such as a silicone resin into a rectangular flat plate shape, and one of the two regions separated by a center line (broken line in FIG. 1A). (Hereinafter, it is referred to as a first color conversion region.) In M1, a fluorescent material composed of a particulate yellow phosphor that is excited by blue light emitted from the LED chips 1 and 1 and emits broad yellow light. In the other region (hereinafter referred to as the second color conversion region) M2, a particulate red phosphor that emits red light when excited by the blue light emitted from the LED chips 1 and 1 is used. And a fluorescent material made of a green phosphor that emits green light are mixed. The color conversion member 20 configured as described above is coupled to the package 10 so that the center line thereof overlaps the light shielding wall 12 when viewed from the front (upper side in FIG. 1) and closes the opening of the recess 11. Yes. Therefore, the mixed color light (white light) of the blue light emitted from the LED chip 1 and the light emitted from the yellow phosphor is emitted from the first color conversion region M1 of the color conversion member 20 and emitted from the LED chip 1. The mixed light of the blue light emitted from the red phosphor and the green light emitted from the red phosphor and the green light emitted from the green phosphor (light with a slightly reddish white color (so-called light bulb color)) is the second light of the color conversion member 20. The light is emitted from the color conversion area M2.

而して、本実施形態の発光装置では、第1の色変換領域M1に対応するLEDチップ1のみから青色光を放射させることで第1の色変換領域M1から外部に向けて白色光を出射させ、第2の色変換領域M2に対応するLEDチップ1のみから青色光を放射させることで第2の色変換領域M2から外部に向けて電球色の光を出射させ、さらに2つのLEDチップ1,1から青色光を放射させることで第1及び第2の色変換領域M1,M2から外部に向けて白色と電球色の中間の色の光を出射させることができ、複数種類の色の光を切り換えて出射する、いわゆる調色が可能となる。なお、本実施形態では2つのLEDチップ1,1並びに色変換領域M1,M2の間に遮光壁12を設けているので、遮光壁12によって隣り合う色変換領域M1,M2に漏れる光が減少して色むらの発生を抑えることができる。   Thus, in the light emitting device according to the present embodiment, the blue light is emitted only from the LED chip 1 corresponding to the first color conversion region M1, and white light is emitted from the first color conversion region M1 to the outside. Then, by emitting blue light only from the LED chip 1 corresponding to the second color conversion region M2, light bulb color light is emitted from the second color conversion region M2 to the outside, and two LED chips 1 are further emitted. , 1 can radiate blue light from the first and second color conversion regions M1 and M2 to the outside and emit light of a plurality of types of colors. It is possible to perform so-called toning in which the light is switched. In this embodiment, since the light shielding wall 12 is provided between the two LED chips 1 and 1 and the color conversion regions M1 and M2, light leaking to the adjacent color conversion regions M1 and M2 is reduced by the light shielding wall 12. Occurrence of uneven color can be suppressed.

ところで、本実施形態では第1及び第2の色変換領域M1,M2が中心線を挟んで対象な長方形状に形成されているが、図1(c)に示すように十字に交差する2つの中心線(同図における破線)で色変換部材20を4つの領域に分割し、対角線上で隣り合う2つの領域を第1の色変換領域M1とし、対角線上で隣り合う残り2つの領域を第2の色変換領域M2とし、それぞれの領域に対向する凹所11の底面に合計4つのLEDチップ1を実装しても構わない。あるいは、図1(d)に示すように4つに分割された領域にそれぞれ異なる発光色を放射する蛍光体からなる蛍光材料を混合し、互いに異なる4種類の色の光が外部に向けて出射される色変換領域M1,M2,M3,M4を形成してもよい。   Incidentally, in the present embodiment, the first and second color conversion regions M1 and M2 are formed in a target rectangular shape with the center line in between, but as shown in FIG. The color conversion member 20 is divided into four regions along the center line (broken line in the figure), the two regions adjacent on the diagonal are defined as the first color conversion region M1, and the remaining two regions adjacent on the diagonal are defined as the first region. Two color conversion regions M2 may be provided, and a total of four LED chips 1 may be mounted on the bottom surface of the recess 11 facing each region. Alternatively, as shown in FIG. 1D, fluorescent materials made of phosphors that emit different emission colors are mixed in the four divided regions, and light of four different colors is emitted to the outside. Color conversion regions M1, M2, M3, and M4 may be formed.

(a)は本発明の実施形態を示す斜視図、(b)は断面図、(c)は他の構成の色変換部材の平面図、(d)はさらに他の構成の色変換部材の平面図である。(A) is a perspective view showing an embodiment of the present invention, (b) is a cross-sectional view, (c) is a plan view of a color conversion member of another configuration, and (d) is a plane of a color conversion member of still another configuration. FIG.

符号の説明Explanation of symbols

1 LEDチップ
10 パッケージ
11 凹所
12 遮光壁
20 色変換部材
M1 第1の色変換領域
M2 第2の色変換領域
DESCRIPTION OF SYMBOLS 1 LED chip 10 Package 11 Recess 12 Light shielding wall 20 Color conversion member M1 1st color conversion area M2 2nd color conversion area

Claims (3)

複数のLEDチップと、各LEDチップが実装されたベース部材と、ベース部材における各LEDチップの実装面側に配設されLEDチップが放射する光によって励起されてLEDチップの発光色と異なる色の光を放射する蛍光材料を透明材料とともに成形した成形品からなる色変換部材とを備え、色変換部材は、互いに異なる色の光を放射する複数種類の蛍光材料が複数の色変換領域に個別に分布してなり、これら複数の色変換領域が、各LEDチップの光の放射範囲とほぼ一対一に対応するように配置されたことを特徴とする発光装置。   A plurality of LED chips, a base member on which each LED chip is mounted, and a color different from the emission color of the LED chip excited by light emitted from the LED chip disposed on the mounting surface side of each LED chip in the base member A color conversion member made of a molded product obtained by molding a fluorescent material that emits light together with a transparent material, and the color conversion member individually includes a plurality of types of fluorescent materials that emit light of different colors in a plurality of color conversion regions. A light emitting device characterized in that the plurality of color conversion regions are arranged so as to substantially correspond to the light emission range of each LED chip. 各LEDチップと色変換部材との間に集光用のレンズ部材がそれぞれ設けられたことを特徴とする請求項1記載の発光装置。   The light-emitting device according to claim 1, wherein a condensing lens member is provided between each LED chip and the color conversion member. 隣り合う他の色変換領域と一対一に対応したLEDチップから放射された光を遮光する遮光壁が各LEDチップ及び色変換領域の間に設けられたことを特徴とする請求項1又は2記載の発光装置。   3. A light-shielding wall that shields light emitted from LED chips that are in one-to-one correspondence with other adjacent color conversion regions is provided between each LED chip and the color conversion region. Light-emitting device.
JP2005262958A 2005-09-09 2005-09-09 Light emitting device Withdrawn JP2007080880A (en)

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