JP2006515952A - Solid-state battery-powered equipment and manufacturing method - Google Patents

Abstract

The system includes a thin film battery and an activation switch. The system is placed on the substrate with an adhesive layer on the back. In some embodiments, the substrate is flexible. An electronic circuit including electronics is also formed on the substrate. The activation switch causes the thin film battery to be in electrical communication with the circuit and electronics. The battery and circuit are formed on a substrate and consist of one or more deposits.

Description

Detailed Description of the Invention

[Field of the Invention]
The present invention relates to solitary state energy storage devices and integration with switches and circuits that activate these devices. More particularly, the present invention relates to a method and system for providing various devices with a solid-state energy storage device (e.g., a battery), and in some embodiments, automatically delayed to achieve various functions. And / or an active radio frequency (RF) tag system for monitoring and punishment applications. The invention also relates to a thin film solit state energy storage device using a mask of the type that moves from reel to reel and / or a substrate web that moves at an independent controlled speed of the deposition pole.

[Background of the invention]
Electronics are embedded in many portable devices such as computers, cell phones, tracking systems, scanners and the like. One drawback to portable devices is that the device needs to include a power source. Portable devices typically use a battery as a power source. The battery must be capable of driving the device for at least the length of time the device is in use. Sufficient battery capacity using normal current batteries is generally heavy, large and cannot be incorporated into a small size. Another drawback is that most batteries must be manually switched on for use. Many applications require a battery that can be switched on automatically in response to certain events.

  Electronics are incorporated into many inexpensively shaped tags for tracking, security, finance, access, etc. Conventional methods of tagging typically include passive elements, ie devices that receive their power from an external source, eg, RF energy. This limits the functionality of the tag. One disadvantage of using a battery is that at least the battery must have the capacity to drive the device for the length of time the device is used. Having sufficient battery capacity results in a power source that is significantly heavier or larger than the rest of the device. In other words, conventional batteries are generally quite large and cannot be incorporated into small volumes such as tags. Most current batteries are quite expensive. As a result, retailers are seldom considering offering batteries as part of a package involving many items, thus preventing the widespread use of batteries for economic reasons. The battery is typically provided as part of the product being shipped, not as part of the package.

[Summary of Invention]
Some embodiments of the invention provide a thin film battery and a start-up switch. For example, the system includes a substrate, a circuit connected to the substrate, and a thin film battery connected to the substrate and the circuit. A thin film battery powers the circuit. Also, an acceleration enabled switch is connected to the substrate to move the circuit electrically. In some embodiments, the acceleration enabled switch is a MEMS device. In another embodiment, the acceleration enabled switch includes at least one cantilevered beam and electrical contact. At least one beam of the cantilever structure contacts the electrical contact in response to acceleration. In another embodiment, the acceleration enabled switches include a closed switch with a beam of a first cantilever structure and a closed switch with a beam of a second cantilever structure. A closed switch with a beam of a first cantilever structure forms an electrical contact in response to a first acceleration, and a closed switch with a beam of a second cantilever structure is responsive to a second acceleration. Make electrical contact. The first acceleration is different from the second acceleration. In another embodiment, the acceleration-enabled switch forms a first electrical contact in response to the first acceleration and forms a second electrical contact in response to the second acceleration. . The first acceleration is different from the second acceleration. The switch enabled at the first acceleration operates the circuit differently in response to either acceleration on two different planes. A closed switch with a beam of a first cantilever structure forms an electrical contact in response to a first acceleration at the first surface, and a closed switch with a beam of a second cantilever structure is a second switch An electrical contact is formed in response to the second acceleration at the surface.

  Some implementations further include a memory and / or a timer. The timer records when one of the closed switches by the beam of the first cantilever structure makes an electrical contact in response to the first acceleration, or the closed switch by the beam of the second cantilever structure The time when the electrical contact is formed in response to the second acceleration is recorded in the memory. In some embodiments, the time when the other cantilever-structured closed switch by the beam forms electrical contact in response to the first acceleration, or the second cantilever-structured beam closed switch is The time when electrical contact is made in response to the second acceleration is recorded in the memory.

  In some embodiments, the battery is sputtered on the substrate and the circuit is formed on the battery. In another embodiment, the circuit is sputtered on the substrate and the battery is sputtered on the circuit. In yet another embodiment, the system fits within a device such as a package or standard. In yet another embodiment, an adhesive layer is applied to the substrate where the system is adhesively attached to the device. The adhesive layer is attached to the substrate.

  Some embodiments include a substrate and a thin film battery placed on the substrate. The thin film battery further includes a first lead, a first electrical contact in electrical communication with the first lead, a second lead, and a second electrical contact in electrical communication with the second lead. Including. The system also includes an actuating switch connected to one of the first and second leads at the substrate for electrically connecting the thin film battery to the first electrical contact and the second electrical contact. including. The adhesive layer is attached to the substrate. In some embodiments, the activation switch is activated in response to the magnetic field. In another embodiment, the activation switch is activated in response to moisture. In yet another embodiment, the activation switch is activated in response to a radio signal. In yet another embodiment, the activation switch is activated in response to pressure. In yet another embodiment, the activation switch is activated in response to light. The system also includes electronics attached to the first lead and the second lead. Electronics are also related to substrates. In some embodiments, the electronics are attached to the substrate and a thin film battery is attached to the electronics. In another embodiment, the thin film battery is attached to the substrate, and at least a portion of the electronics is attached to the thin film battery. The activation switch is formed using microelectronic fabrication techniques.

  Some embodiments provide a method that includes activating an activation switch and directing commands using powered electronics to place a thin film battery in communication with a set of electronics. To do. Another embodiment provides a method that includes activating a start-up switch to place a thin film battery in communication with a set of electronics and recording a start time for assurance. In some embodiments, the activation action switch includes accelerating the activation action switch at a selected level. In another embodiment, the method includes performing a self-check and saving the result of the self-check in response to activating the activation action switch. In other implementations, other accelerations are stored. Also, the time accelerated by another acceleration equal to or greater than the selected threshold is recorded. The number of accelerations during that time is compared to other periods, such as when the shipper is in possession of the activation switch.

  A system that includes one or more batteries and a device for enabling or activating one or more batteries and circuits can be formed on a film and provided in a small package or product. In addition, the battery, the activation device, and the circuit are flexible sheets having an adhesive layer thereon so that the package is essentially a label that can be placed on the exterior of the package or on the product package or product or device. Can be formed. A complete system can also be incorporated into a product or device to control the aspect of the device or to record information about the product or device. Enabling or activating the device activates the switch later in response to the event. The system does not need to be moved manually. Rather, the system responds to events such as rapid acceleration (like firing from a gun), slow acceleration (like unloading from a shelf), or intermediate acceleration (like falling on the floor). Automatically activated.

  The entire system is inexpensive. As a result, these systems can be used conveniently in a wide range. As a result, manufacturers, wholesalers, and event retailers can provide such a system attached to a device or as part of a package associated with many devices or products. Furthermore, these systems are small, lightweight and provide enough energy storage to achieve at least one function. Since the system is made from non-toxic substances, no hazards are placed on the device.

  In some embodiments, the present invention provides a roll-to-roll deposition system that uses a roll-to-roll mask having a number of different mask patterns for various deposition operations. This summary is intended to provide an overview of the subject matter of this patent application. It is not intended to provide an exclusive or exhaustive description of the invention. Details are included to provide details regarding the content of this patent application. In the drawings, like numerals describe substantially similar components in several screens. Signals and connections are referred to by the same reference number, and their meaning will be clear from the context of the description.

[Detailed description]
In the following detailed description of the preferred embodiments, reference is made to the accompanying drawings that form a part hereof, and in which is shown by way of illustration specific embodiments in which the invention may be practiced. It will be understood that other embodiments may be utilized and structural changes may be made without departing from the scope of the invention.

  In different embodiments of the invention, the battery in the figure and in the description can be implemented using one or more cells, and if many cells are implemented, the cells are connected in parallel or in series. it can. Thus, if a battery or more than one cell is shown and described, other embodiments may use a single cell, and in the case of a single cell, other embodiments may use a battery. One or more cells can be used. Further, descriptions of other reference terms relating to exemplary orientations, such as those used in the top, bottom, top, bottom, and drawings, are not necessarily orientations during assembly and use.

  As used herein, the terms “wafer” and “substrate” include any structure having an exposed surface on which, for example, a film or layer is deposited to form an integrated circuit (IC) structure or energy storage device. The term “substrate” is understood to include semiconductor wafers, plastic films, metal foils, molded plastic boxes and other structures on which an energy storage device assembled in accordance with the teachings of the present invention is formed. The term substrate is also used as a substrate including other layers during processing, on top of it, or after assembly. In some embodiments, both the wafer and substrate are doped and undoped semiconductors, epitaxial semiconductor layers supported by a base semiconductor or an insulator, with other semiconductor structures well known to those skilled in the art. Including as well. "Substrate" is also used as a description of any starting material that can be used in assembly methods as described herein.

  As used herein, the term “battery” refers to an example of an energy storage device. The battery is formed of a single cell or a plurality of cells connected in series or in parallel. A cell is a direct current unit that converts chemical energy, eg, ion energy, into electrical energy. A cell typically includes electrodes of two different materials that are separated from each other by an electrolyte through which ions can move.

  As used herein, the term “task” broadly relates to software, firmware, routines, state machines, and / or binding logic that, when executed, are adapted to perform a particular function. As used herein, the term “adatom” refers to particles, molecules, or ions of material that have not yet been formed on a substrate or film.

  As used herein, the term “intercalation” refers to a property of a material that allows ions to easily enter and exit the material without the material changing its phase. Thus, the solid-state intercalation film remains solid during the release and charging of the energy storage device. As used herein, the term “radio frequency (RF)” includes not only transmitted radio signals ranging from Hz to MHz to gigahertz, but also, for example, very low frequency electromagnetic signals coupled by mutual inductance.

  FIG. 1A shows an embodiment of an energy storage device 50 according to the present invention. A substrate 55 is provided, and a contact film 57 is formed thereon. The contact film 57 functions as a current collector and is connected to the lead 58. This, in some embodiments, connects one pole of this energy storage device 50 to an external circuit. In some embodiments, when formed, an electronic circuit is attached to the battery. In other embodiments, when formed, the circuit may be separated from the battery, for example, not attached to the battery. The electrode film 59 is formed on the contact film 57. In some implementations, the electrode film 59 substantially covers the surface of the contact film 57 to minimize resistance by maximizing the interface area between the films. In some embodiments, electrode film 59 is the cathode for thin film batteries. In another embodiment, electrode film 59 is a “super capacitor” electrode. The electrolyte film 61 is formed on the electrode film 59. The electrode film 63 is formed on the electrolyte film 61. The electrolyte film 61 separates the electrode film 59 from the electrode film 63. The contact film 65 is formed on the electrode film 63. The contact film 65 functions as a current collector and is connected to the lead 67. It connects one pole of this energy storage device 50 to an external circuit. In some implementations, the contact film 65 substantially covers the surface of the electrode film 63 so as to minimize resistance by maximizing the interface area between these films. In some embodiments, electrode film 63 is an anode for a thin film battery. In this embodiment, the electrode film 63 is a “super capacitor” electrode.

  FIG. 1B shows another embodiment of the energy storage device 50. This particular embodiment is closely related to the implementation shown in FIG. 1A, and only the differences will be discussed for simplicity. The main difference is that the adhesive layer 56 is placed on the substrate 55. It should be noted that the adhesive layer 56 may be any type of adhesive layer including a removable adhesive layer or a permanent adhesive layer. In some embodiments, the adhesive layer 50 is a peelable paper or a type of adhesive layer that is covered by a plastic film layer 156 and peeled off and applied. In some embodiments, the adhesive layer 56 covers the entire surface of the substrate 55, and in other embodiments, the adhesive layer only covers a portion of the substrate surface 55. In other embodiments, the adhesive layer 56 is attached to the energy storage device 50 (eg, over the contact 65) rather than directly to the substrate 55.

  FIG. 1C shows a cross-sectional view of an embodiment of an energy storage device 50C. Having a substrate 55, some embodiments include additional layers and / or devices formed therefrom. As discussed and shown below, such other devices include an activation switch and circuitry. In some embodiments, the battery or energy storage device, or other device, is formed on or on the battery. In other embodiments, the battery is formed on the circuit or on the circuit and the activation switch. In some implementations, the substrate 55 includes a substrate as described above or described herein. According to the method described here, the contact film 57 and the electrode 59 are formed on the substrate 55. In some embodiments, contact film 57 and electrode 59 are metal films that are deposited on a substrate according to other known methods. The contact film 57 and the electrode 59 function as contacts for connecting the energy storage device 50C to other circuit elements (not shown).

  The electrode first film 59 is formed on the contact 57. The electrode first film 59 includes a metal or intercalation member in some embodiments, for example, in a thin film battery embodiment, the electrode first film 59 functions as a cathode. In some such embodiments, electrode first film 59 includes lithium metal and / or a lithium intercalation member. In other embodiments, such as “super capacitor”, electrode first film 59 is a metal oxide. It is desirable to maximize the contact interface between the electrode first film 59 and the contact film 57. Thus, in some embodiments, the electrode first film 59 substantially covers the contact film 57 other than the portion that is substantially intended for external circuitry for connection.

  The electrolyte film 61C is formed on the electrode first film 59, or at least partially formed thereof. In some embodiments, the electrolyte film 61C completely surrounds the electrode first film 59. The electrolyte film 61C is formed using the system and method described herein. In some embodiments, the first material of the electrolyte film 61C is deposited using a first source. The source is directed at the first electrode film 61C on the substrate or at the location of the electrode first film 59 as shown in FIG. 1C.

  The electrode second film 63 is formed on the electrolyte film 61C. The electrolyte film 61C completely separates the electrode first film 59 from the electrode second film 63. The electrode second film 63 includes a metal or intercalation material, and in some embodiments includes, for example, a thin film battery embodiment, in which the electrode second film is an anode. In other embodiments, such as a “super capacitor”, the electrode second film 63 is a metal oxide. The electrode second film 63 in some embodiments is deposited by the methods described herein. In another embodiment, the electrode second film 63 is formed by a known method.

  When the electrolyte film 61C is deposited, it includes an electrolyte material. In some embodiments, the first source of electrolyte material (eg, sources 311, 511, 511A, and 711 described here) is the source of physical vapor deposition. In another embodiment, the first source is a chemical vapor deposition source. The second source supplies the excited particles to that location. The excited particles collide with the electrolyte material and help form the required structure of the electrolyte film 61C. In some embodiments, the second source provides particles that are excited simultaneously with the first source that supplies the electrolyte material. The use of the excited particles causes the electrolyte film 61C to conform to the electrode first film 59, so that the electrolyte film provides the necessary insulating properties, ie, between the electrode first film 59 and the electrode second film 63. Electrodes move between them (short-circuit between electrodes), while ions (e.g. lithium ions) move between the cathode 50 and anode 63 (the direction of movement varies depending on whether the device is charged or discharged) Let In some embodiments, electrode 59 is designated as “anode” and electrode 63 is designated as “cathode” so that which direction of ion movement is charge and which direction is discharge. Switch. In some embodiments, the second source is an ion source described at this location, eg, source 313, 413, or 713. The second source supplies excited ions that supply energy from the first source to the electrolyte material. The use of energized particles in the energy range mentioned here is believed to supply the previous film surface with an electrolyte material that grows for an extended migration period. This extended transfer period allows the electrolyte material to grow in a more defect-free manner.

  In some implementations, it is desirable to make electrolyte film 61C as thin as possible (“ultra-thin”) to reduce its contribution to the internal resistance of the energy storage device. It is also desirable to maintain the electrode properties that allow the flow of ions across the electrolyte (which provides the function of the battery) while preventing the flow of electrons (which results in a short of the cathode to the anode). Using the method and system described herein, the electrolyte film 61C is formed to a thickness 61C ′ of approximately 5000 angstroms or less. In some embodiments, the electrolyte film 61C has a thickness 61C ′ of 2500 angstroms or less. In some embodiments, the electrolyte film 61C has a thickness 61C ′ of 1000 angstroms or less. In some embodiments, the electrolyte film 61C has a thickness 61C ′ of 500 angstroms or less. In some embodiments, the electrolyte fill has a thickness 61C ′ of 250 angstroms or less. In some embodiments, the electrolyte film 61C has a thickness 61C ′ of 100 angstroms or less. In some embodiments, the electrolyte film 61C has a thickness 61C ′ in the range of 10 angstroms to 200 angstroms. In some embodiments, the electrolyte film 61C has a thickness 61C ′ in the range of 10 angstroms to 100 angstroms.

  In some embodiments, the electrolyte film 61C comprises LiPON and is formed using the first source 311 with the second source 313 or 413. In general, as used herein, LiPON refers to a lithium phosphonitride material. One example is Li3PO4N. Another example incorporates a higher ratio of nitrogen to increase the mobility of lithium ions across the electrolyte. In some embodiments, the first source 311 provides Li3PO4 in a nitrogen atmosphere. In other embodiments, the first source 311 provides Li3PO4 in a vacuum environment (background pressure is lower than 1E3 Torr). The second source 313 or 413 supplies particles excited from the source gas. In some embodiments, the second source is an ion source that provides energetic ions from a source gas that includes oxygen (eg, O 2) or nitrogen (eg, N 2). In other embodiments, the source gas includes noble gases such as argon, xenon, helium, neon, and krypton. The excited particles and / or ions increase the energy of the material forming the electrolyte film 61C and, as a result, enhance layer growth. Therefore, the electrolyte film has a higher quality than the conventional electrolyte layer.

  Embodiments for forming LiPON electrolyte film 61C include a first source that provides Li3PO4 to, or near, the location where the LiPON electrolyte film is to be formed. A second source providing excited nitrogen particles is included. The excited nitrogen particles react with Li3PO4 to form an electrolyte film at that location. This increases the amount of nitrogen in the LiPON electrolyte film. Increasing the nitrogen content is desirable to increase the mobility of lithium ions across the electrolyte.

  In a further embodiment, the chamber in which the substrate 55 is placed has an atmosphere enriched with nitrogen. The LiPON electrolyte film 61C is formed by Li3PO4 supplied by a first source that reacts with nitrogen in the chamber. The second source provides excited particles that aid in the construction of the electrolyte film. In another embodiment, the second source also supplies nitrogen to Li3PO4 at that location. Thus, Li3PO4 reacts with both the nitrogen in the chamber and the excited particles containing nitrogen supplied by the second source. This increases the nitrogen content of the electrolyte film 61C. In some embodiments, it is desirable to increase the nitrogen content of electrolyte film 61C from data published from Oak Ridge, Department of Energy Lab. Tennessee shows that increasing the nitrogen content increases ionic conductivity or mobility in the electrolyte film. As will be understood by reading this invention, the system shown here for depositing a film is applicable to forming an electrolyte film 61C according to this invention. Some examples of such systems are shown in FIGS.

  FIG. 1D shows another embodiment of an energy storage device in accordance with the teachings of the present invention. The “super capacitor” 70 is formed by an energy storage device 50C having an ultra-thin layer electrolyte film 61. Prior to forming the “super capacitor” 70, the energy storage device 50C formed on the substrate may be formed on the substrate before applying the techniques described herein to form an energy storage and / or conversion device. Represents an embodiment of the layer / device formed by “Super capacitor” 70 includes an intermediate film 73 formed in physical contact with electrode films 71 and 75. In some embodiments, the intermediate film 73 is an electrolyte for storing and releasing charge from the faradic process. In some embodiments, the intermediate film 73 includes a dielectric. The contact film 65 is in physical electrical contact with the electrode 71. Therefore, in this embodiment, the contact film 65 is a contact film shared by both the energy storage device 50C and the “super capacitor” 70. In other embodiments, the energy storage device 50C and the “super-capacitor” 70 have separate contact films. In some embodiments, the intermediate film 73 includes LiPON. In some embodiments, the electrolyte film 73 includes TaO. In some embodiments, the electrode film is RuO2. Contact film 77 is formed on electrode film 75. Leads 76 extend from the contact film 77 to connect one plate of “super capacitor” to an external circuit.

  In some embodiments, contact film 65 is omitted and a single electrode film serves both electrode 71 of device 70 and electrode 63 of device 50C.

  A method 250A for making a solid state energy storage device 50 is described below with respect to FIGS. 1A and 2A. The method includes providing a substrate 55 (process operation 251) and depositing a cathode contact film 57 on the substrate 55 (process operation 253). In some embodiments, process operation 251 includes providing a substrate having an insulator layer or other layer / device formed thereon. The method further includes a process operation 255 of depositing electrode material at a location on the substrate, while supplying excited particles to the electrode material at the substrate. In some embodiments, an auxiliary source provides excited particles. In some such embodiments, the excited particle beam is directed to the same location on the substrate as the electrode material. In one embodiment, the excited particles are excited ions. In one embodiment, the excited ions include a material that is different from the electrode material. The excited particle or ion beam helps to control the growth of the electrode material structure at that location. In some embodiments, process operation 255 is used to form a cathode film or layer 59 for a solid state thin film battery. The cathode film 59 is in electrical and physical contact with the cathode contact. Electrolyte film 61 is deposited on cathode film 59 in process operation 257. The electrolyte film 61 separates the cathode and anode films 59 and 61 to prevent short circuiting of the energy storage device 50 (eg, battery). The anode contact is formed in electrical and physical contact with the anode film in process operation 261. A thin film battery according to the present invention is formed and provided for performing an assembly process operation 263 of the energy storage device.

The deposition of the cathode film directs the first material (eg, adatom) to a location on the substrate while the second material is simultaneously supplied with excited particles (eg, ions) to the location on the substrate. Including. In some implementations, the second material is different from the first material. The excited particles provide energy to the first material to help grow the desired crystal structure in the cathode film. Moreover, it controls the chemical quantification of the growing film at a location on the substrate. In some embodiments, the first material is a lithium intercalation material used as a solid state thin film battery cathode. The assist source provides ions that provide energy in the range of 5 eV to 3000 eV to the lithium intercalation material. Controlling the energy in the ions produced by the assist source provides suitable control for growing a lithium intercalation film having a crystalline structure. The energy from the ions facilitates the formation of a lithium intercalation material composition into the crystal structure during deposition. In some embodiments, the gas used to form the ions is used to control the chemical quantification of growth (quartz film). For example, ionized O ₂ assist beams are used to control the growth and chemical quantification of LiCoO ₂ intercalation materials. In some such embodiments, the O ₂ of the ion assist beam combines with LiCo at that position to form a LiCoO ₂ intercalation material.

  The thin film quartz structure formed by the teachings herein achieves higher quality than those achieved by conventional cathode film forming techniques. The prior art relies on the deposition of a high temperature main cathode to reprocess and crystallize the structure of the conventional cathode film. Unfortunately, such conventional techniques temper the entire structure to the same temperature, which means that the substrate must withstand such temperatures (this temperature excludes suitable substrate materials). Not desirable. Furthermore, different layers cannot be provided with different annealing suitable for their different requirements. In order to form the desired high quality and properly oriented crystal structure, preferably here, without imposing high temperature annealing on the substrate and the layers formed on the substrate, including the cathode contact film. According to the teachings described, a highly accurate crystallized cathode film is achieved by providing the necessary energy. In addition, using different annealing processes (such as using ion assisted beams with different energies in different layers, or depositing and annealing at different speeds or different periods) By doing so, each layer can be annealed. Furthermore, by annealing the surface layer of the previous layer, subsequent layers can be deposited on the ordered surface in a specific way (e.g. to achieve a specific crystal orientation or a specific ion bonding surface). it can.

  FIG. 2B shows one embodiment of a method 250B for making an energy storage device. Process operations 251, 253, 259, 261, and 263 are substantially similar to the process operations described above with respect to FIG. 2A. Process operation 255C is a process operation for at least partially depositing a cathode film on the cathode contact film. In one embodiment, the cathode film is deposited in the process operation 255 described above. In other embodiments, the cathode film is deposited according to other known deposition processes. The electrolyte film is formed by depositing an electrolyte material at a location that is at least partially in contact with the cathode film (process operation 257C). In a convenient embodiment, the electrolyte material is in contact with a significant portion (if not all) of the cathode film. In some embodiments, the assist source simultaneously supplies excited particles to the electrolyte material when forming the electrolyte film. In one embodiment, the assist source provides a beam of ions excited by an assist material different from the electrolyte material. In some implementations, the second material beam is directed to the same location on the substrate as the electrolyte material. The excited ion beam helps to control the growth of the electrolyte film structure. The ion beam is “out of focus” in some embodiments. In another embodiment, the ion beam is focused. Depositing the electrolyte film involves directing the electrolyte material to a location that is at least partially in contact with the cathode film, while simultaneously supplying energy to the electrolyte material. In some embodiments, the excited particles are energized. In some embodiments, the excited particle is an excited particle. In some such embodiments, the excited particles from the assist source are of a different material than the electrolyte material. The excited particles provide energy to the first electrolyte material to help the desired growth of the solid electrolyte film structure. In addition, this controls the chemical quantification of the growing electrolyte film.

In one example, the electrolyte material is lithium phosphorous oxynitride. In some embodiments, the assist source provides ions that provide energy in the range of approximately 5 eV to approximately 5000 eV to lithium phosphorous oxynitride ("LiPON"). Control of the energy in the ions created by the assist source provides control for growing a lithium phosphonitride oxide structure at that location. The energy from the ions facilitates the formation of the lithium phosphorus oxynitride material into the desired structure during deposition. In some embodiments, the gas used to form the ions is used to control the chemical quantification of the growing electrolyte film. For example, an ionization assist beam of O ₂ is used to control the growth and chemical quantification of lithium phosphonitride materials. In another embodiment, an ionization assist beam of N ₂ is used. In this embodiment, N ₂ not only controls electrolyte film growth and chemical quantification, but additionally injects nitrogen into the electrolyte film. This is desirable because the ion mobility of the LiPON electrolyte film depends on the amount of nitrogen in the film.

  FIG. 2C shows one embodiment of a method 250C for making an energy storage device. Process operations 251, 253, 257, 261, and 263 are substantially similar to the process operations described above with respect to FIG. 2A. Process operation 255C is a process operation for at least partially depositing a cathode film on the cathode contact film. In one embodiment, the cathode film is deposited as described above with respect to FIG. 2A. Process operation 259D is a process operation for depositing electrode material at least partially on the electrolyte film while simultaneously supplying excited particles to the electrolyte material. Process operation 259D is a process operation in which the electrode material is deposited at least partially on the electrolyte film while simultaneously supplying excited particles to the electrolyte material. In some embodiments, the excited particles are directed to the same location as the electrode material. In one embodiment, the excited particles are excited ions. In one embodiment, the excited ions include a second material that is different from the first material. The excited particle or ion beam helps to control the growth of the electrode material structure. In some embodiments, process operation 259D is used to form an anode film for a solid state thin film battery. The anode film is in electrical and physical contact with the anode contact and the electrolyte film.

  The deposition of the anode film includes directing the electrode material to a location that is at least partially in contact with the electrolyte film, while simultaneously supplying the excited second material. The excited particles provide energy to the electrode material to help grow the desired crystal structure in the anode film. In addition, this controls the chemical quantification of the growing film. In some embodiments, the electrode material comprises a lithium intercalation material used as a battery anode. In one embodiment, the anode comprises lithium metal or a lithium alloy. In another embodiment, the anode comprises a carbonaceous material such as carbon, such as carbon such as graphite or diamond. In another embodiment, the anode comprises a metal oxide, such as RuO or VaO. In another embodiment, the anode comprises a nitride material. The second source supplies the particles (which are ions, and in some embodiments provide energy in the range of 5 eV to approximately 3000 eV) to lithium intercalation. In some embodiments, the ions provide approximately 135 eV of energy. In some embodiments, the ions provide energy in the range of about 5 eV to about 100 eV. In some embodiments, the ions provide energy in the range of about 5 eV to about 1000 eV. In another embodiment, the ions provide energy in the range of about 50 eV to about 90 eV. In another embodiment, the ions provide energy in the range of about 55 eV to about 85 eV. In another embodiment, the ions provide energy in the range of about 60 eV to about 80 eV. In another embodiment, the ions provide energy in the range of about 65 eV to about 75 eV. In another embodiment, the ions provide energy in the range of about 10 eV to about 100 eV. In another embodiment, the ions provide energy in the range of about 10 eV to about 90 eV. In another embodiment, the ions provide energy in the range of about 30 eV to about 300 eV. In another embodiment, the ions provide energy in the range of about 60 eV to about 150 eV. In another embodiment, the ions provide energy in the range of about 60 eV to about 150 eV. In another embodiment, the energy from the second source is approximately 70 eV. In another embodiment, the ions provide energy in the range of about 45 eV to about 95 eV.

  Control of the energy in the ions created by the second source provides control for growing lithium intercalation structures at that location. The energy from the ions promotes the formation of a lithium intercalation material into the crystal structure during deposition. In some embodiments, the gas used to form the ions is used to control the chemical quantification method of the growing crystal film.

  The crystalline structure of the thin film of electrodes formed by the teachings herein achieves a higher order than those achieved by conventional film forming techniques. Conventional techniques rely on annealing the main deposit at high temperatures, which affects not only films intended to reprocess and crystallize the film structure, but also substrates and other layers. In contrast, the present invention provides a controlled energy source during or after deposition that reprocesses the surface of the deposited film without substantially heating the underlying layer or substrate. In some embodiments, energy is supplied during the deposition of each atomic layer of the film such that each atomic layer is required during crystallization into the film. Examples for such energy sources include ion beams that react with the deposited adatom and / or provide kinetic energy to assist in the deposition of the film. Other examples of energy sources are high-temperature short-term exothermic sources, short-term plasma sources, lasers, and other high-power sources that reprocess the crystalline structure approaching the surface of the film without affecting other layers or substrates. Includes intensity photo source. Highly demanding crystalline cathodes or anodes are desirably achieved in accordance with the teachings described herein.

  While the above fabrication process describes forming the cathode and anode films in a certain order, other embodiments reverse the order of the cathode and anode films. In addition, the fabrication process describes, for example, forming a cathode and anode film in a battery. In some embodiments, the cathode and anode films are battery electrodes. Other embodiments include films that form various layers of “supercapacitors”. In this embodiment, the supercapacitor works with at least one film forming at least a supercapacitor, for example, the electrode films 71,75 and the electrolyte and / or dielectric film 73 provide the following properties: Thus, having an improved crystal structure, crystal size, or fewer defects without undergoing high temperature annealing of the entire substrate. Thus, the techniques and systems for producing thin films for use in energy storage devices as described herein are applicable to both solid state batteries and solid state capacitors.

  In another embodiment, the thin film energy storage device is formed of a substrate. A contact film (which is electrically conductive and does not react with the adjacent cathode film in subsequent deposition) is formed of a substrate. The contact film acts as a barrier between the substrate and the cathode film. The contact film functions as a current collector and as a connection between the cathode film and circuitry that is external to the energy storage device. In one embodiment, the contact film has a thickness of 0.3 microns or more.

FIG. 3A shows a deposition apparatus 305, which includes a reaction chamber 307, in which a substrate 308 is located, on which an energy storage device is to be made. In some embodiments, the reaction chamber 307 is a sealed chamber that holds the gas for the reaction and provides a sub-atmospheric pressure. In some embodiments, it may be desirable to maintain the pressure in the chamber at approximately 1 × 10 ⁻³ Torr. A first material source 311 is provided in the chamber 307. The first source 311 generates an adatom beam with a first material deposited on the substrate 309. In some embodiments, the first material source 311 is a physical vapor deposition source. In one such embodiment, the material source 311 is an electron beam source. In another such implementation, the first source 311 is an arc source including, for example, a cathode arc source, an anode arc source, and a CAVAD arc source. The arc source is particularly suitable for use as a source that functions effectively in a chamber operated at low temperatures. In another embodiment, the first source 311 is a physical deposition source including, for example, a sputtering source. In another embodiment, source 311 is a chemical vapor deposition source including a direct ion source using, for example, a hydrocarbon precursor gas. Beam 312 is focused at location 319 on substrate 309, where the material of beam 312 is deposited to form the film of the energy storage device. An assist source 313 is provided in the chamber 307 that generates a beam of excited particles 314 directed at a location at least adjacent to location 319 of the substrate 309. In some embodiments, the assist source is an excited ion production source. In some implementations, the assist source 313 is offset from the first source 311 so that the beams from these sources are not synchronized. The excited particle beam 314 provides the crystal structure on the substrate 309 with the energy necessary to control the material growth and chemical quantification methods of the first beam 312 as described in detail below. Also, in some embodiments, the excited particle beam 314 provides the elements necessary for the film being deposited. In another embodiment, the beam 314 is directed at least near the location 319 so that enough energy is generated in the first beam 312 to form the required crystal structure and chemical quantification of the deposited film. Provide to the material. In some implementations, the deposition system 305 includes at least one additional assist source 313A. In some implementations, each additional source 313A provides another assist beam 314A that provides energy to the adatom that reaches the substrate. Various implementations of the assist beam 314 are described below.

  FIG. 3B shows another embodiment of the deposition apparatus 305. The assist source 313 generates an energy beam 314 that travels essentially along a normal path to the substrate 319. The energy beam supplies energy to the adatom from beam 312 as described herein.

  4 is substantially similar to FIG. 3A except that the deposition apparatus 405 includes an assist source 413 for generating an excited beam that is rotatably secured to the chamber 307 by a bracket. It is. The assist source 413 rotates to direct the excited particle beam 414 to the required collision angle with the surface of the substrate 309. In one embodiment, the collision angle 401 is in the range of approximately 15 degrees to approximately 70 degrees from the normal to the substrate. Thus, in some implementations, the collision angle 401 is variable. In some embodiments, the collision angle is approximately 45 °. In some embodiments, the deposition system 405 includes at least some additional assist source 413A. In some implementations, each source 413A provides an additional assist beam 414A at an angle 402 that provides energy to an adatom that reaches the substrate. In some implementations, the energy provided by the assist beam 414 is different from the energy provided by at least one of the assist beams 414A. In some implementations, assist beams 414 and 414A need not transmit energy to an adatom at the same time. In some implementations, the means by which beams 414 and 414A transfer energy are different. In some implementations, the materials in beams 414 and 414A are different.

  FIG. 5A is substantially similar to FIG. 3 except that the deposition apparatus 505 includes a number of first deposition sources 511. In some embodiments, each one of the first deposition sources 511 directs a respective beam 512 to a location 319 on the substrate 309. In some embodiments, each one of the first sources generates a beam 512 that includes the same material. In other implementations, at least one first source 511 generates a beam 512 of a different material than another one of the first source 511. In some implementations, material from multiple first beams 512 merges at location 319 to form the required film. In other embodiments, the material of the first beam 512 combines with the material from the assist beam 314 to form the required film. In some implementations, one of the first sources 511 directs its beam 512 to a substrate 319 that is remote from location 319. In some embodiments, two or more assist beams 313 provide energy to the beam 512 adatom.

  5B shows another embodiment of the deposition apparatus 505B. A number of assist sources 313 are positioned to supply energy to form a film on the substrate 319. A number of material sources 511A, 511B, and 511C supply material adjacent to the surfaces of chamber 307 and substrate 319. In some implementations, each material source 511A, 511B, and 511C has the ability to supply the same material and thus provide a greater amount than a single source. In some embodiments, at least one of the material sources 511A, 511B, and 511C provides a different material than another of the material sources. In some embodiments, these different materials react in chamber 309 to produce an adatom that forms a film on substrate 319. In some embodiments, at least one of the material sources 511A, 511B, and 511C supplies the precursor material to the chamber 307, and another of the material sources supplies the reactant material to the chamber. . The precursor and reactant materials react in concert to create the material that forms the film. In some embodiments, at least one of the material sources 511A, 511B, and 511C includes a chemical reactor in which the chemical reacts. This source then injects the resulting material into the chamber. This resulting material is included in the film assembly process.

  FIG. 6 is substantially similar to FIG. 5A except that the deposition apparatus 605 includes multiple first deposition sources 511 and a rotatable assist source 413. In some embodiments, this provides more material for a given deposition location. In some embodiments, this provides for deposition at multiple locations. In yet other embodiments, this allows different materials from different sources to be combined.

  FIG. 7 shows another embodiment of a deposition apparatus 705 based on the teachings of the present invention. The deposition apparatus 705 includes a reaction chamber 707 in which an elongated flexible substrate 709 is located, on which an energy storage device is to be made. The first material source 711 is a physical deposition source provided in the chamber 707. The first source 711 generates an adatom beam 712 from the material to be deposited on the substrate 709. In some implementations, the first source 711 is an arc source including, for example, a cathode arc source, an anode arc source, and a CAVAD arc source. In another embodiment, the first source 711 is a physical vapor deposition source including, for example, a sputtering source. In another embodiment, source 711 is a chemical vapor deposition source. Moreover, source 711 represents many different material sources in some embodiments. Beam 712 is focused at location 719 on substrate 709, where the beam adatom is deposited to form the film layer of the energy storage device. An assist source 713 is provided in the chamber 707 and generates a beam of excited particles 714 directed to the substrate 709. In one embodiment, assist source 713 generates a beam of excited ions 714. The excited particle beam 714 provides the energy necessary to control the growth and chemical quantification of the deposited material by the first beam 714. Accordingly, the crystal structure is formed on the substrate 709 as described in detail below. The substrate 709, in some embodiments, is an elastic, polymeric plastic web or sheet on which the energy storage device is made. The elongated substrate 709 allows many energy storage devices to be deposited at successive locations on the substrate, thereby improving the production rate of the energy device. Moreover, many deposition devices 705 or sources 711 are provided in several embodiments to simultaneously deposit many films at different locations on the substrate 709.

  The thermal control surface 715 is connected to a heat source 725 that controls the surface temperature. The substrate 7096 is in thermal contact with the surface 715, thereby controlling the temperature of the substrate as required for a particular deposition process on a particular substrate. In some embodiments, the heat source is a coolant source, for example, a cryogenic vacuum pump that releases compressed helium toward the surface 715 to cool it. The use of a thermally controlled surface 715 that is in direct contact with the substrate 709, especially when the direct contact is aligned or coincides with the position where the thin film is formed, Enables the use of substrates with lower thermal degradation temperatures than would be possible with thin film battery assembly processes.

  The above provides a description of various embodiments of the system in which the present invention may be implemented to produce an energy storage device or an energy conversion device. It is within the scope of the present invention to combine the principles of the system in a manner different from that shown and described, so long as the method described herein can be implemented in such a system. For example, in some embodiments, flexible substrate 709 and rolls 710, 713 can be coupled to any of the embodiments shown in FIGS. 3A-6. Also, in some implementations, heat source 725 can also be combined with any of the implementations of FIGS. 3A-6. In some embodiments, the pivotable assist source 413 can be combined with any of the embodiments of FIGS. 3A, 3B, 5A, 5B, and 7. In some embodiments, material sources 511A, 511B, and 511C can be combined with the embodiments of FIGS. 3A-5A and 6-7.

  In some embodiments, the second film of electrodes, eg, film 59 or 71, covers at least a portion of the first film, eg, contact film 57 or 63 (extending beyond the boundary of the first film). No) Lithium intercalation. Accordingly, the second film of intercalation remains solid during the release and charging of the energy storage device. In some embodiments, the second film is deposited using a first deposition source and simultaneously using a second source that supplies energetic ions to the growing second film. In some embodiments, the first deposition source is a physical vapor deposition source. In some embodiments, the second source is an ion source that provides energetic ions from a source gas that includes oxygen (eg, O 2) or nitrogen (eg, N 2). In another embodiment, the source gas comprises a noble gas such as argon, xenon, helium, neon, and krypton. In yet another embodiment, the source gas comprises a hydrocarbon material, such as a hydrocarbon precursor. The selection of the second source gas is based on the desired effect in the chemical quantification method of the deposited film. The second source, in some embodiments, provides a focused beam of excited ions. The second source, in some embodiments, provides an unfocused beam of excited ions. The excited ions provide energy in the range of approximately 5 eV to approximately 3,000 eV for lithium intercalation. In some embodiments, the energy range is approximately 5 eV to approximately 1000 eV. Its energy range is about 10 eV to about 500 eV in another embodiment. Its energy range is about 30 eV to about 300 eV in another embodiment. Its energy range is about 60 eV to about 150 eV in another embodiment. In another embodiment, the energy range is approximately 140 eV. In another embodiment, the ion provides an energy of approximately 135 eV. In another embodiment, the ion provides energy from about 5 eV to about 100 eV. In some embodiments, the energy range is approximately 5 eV to approximately 1000 eV. Its energy range is about 50 eV to about 90 eV in another embodiment. Its energy range is about 55 eV to about 85 eV in another embodiment. Its energy range is about 60 eV to about 80 eV in another embodiment. Its energy range is about 65 eV to about 75 eV in another embodiment. Its energy range is about 10 eV to about 100 eV in another embodiment. Its energy range is about 10 eV to about 90 eV in another embodiment. Its energy range is about 30 eV to about 300 eV in another embodiment. Its energy range is about 60 eV to about 150 eV in another embodiment. In another embodiment, the energy of the ions from the second source is approximately 70 eV. In another embodiment, the ion provides energy in the range of approximately 45 eV to approximately 95 eV. In one embodiment, the second film has a thickness of 10 microns or greater. In some embodiments, the second film has a thickness in the range of approximately 10 to 20 microns. In some embodiments, the second film has a thickness in the range of approximately 1 to 5 microns.

A third film of electrolyte, eg, film 61, 61C or 73 (electrolyte) that has ionic conductivity but is not electrically conductive, is deposited to completely cover the second deposited film. . In some embodiments, the third film is deposited using a first deposition source and a second deposition source that provide energetic ions to the growing film. In some embodiments, the first deposition source is a physical vapor deposition source.
In some embodiments, the second source is an ion source capable of supplying energetic ions having an energy of 5 eV or greater. In another embodiment, the energy range is from about 5 eV to about 3,000 eV. In another embodiment, the energy range is from about 5 eV to about 1,000 eV. Its energy range is about 10 eV to about 500 eV in another embodiment. Its energy range is about 30 eV to about 300 eV in another embodiment. In another embodiment, the energy range is approximately 60 eV to approximately 150 eV. In another embodiment, the energy of the ions from the second source is approximately 140 eV. In some embodiments, the ions provide approximately 135 eV of energy. In some embodiments, the ions provide energy in the range of about 5 eV to about 100 eV. In some embodiments, the energy range is approximately 5 eV to approximately 1000 eV. Its energy range is about 50 eV to about 90 eV in another embodiment. Its energy range is about 55 eV to about 85 eV in another embodiment. Its energy range is about 60 eV to about 80 eV in another embodiment. Its energy range is about 65 eV to about 75 eV in another embodiment. Its energy range is about 10 eV to about 100 eV in another embodiment. Its energy range is about 10 eV to about 90 eV in another embodiment. Its energy range is about 30 eV to about 300 eV in another embodiment. In another embodiment, the energy range is approximately 60 eV to approximately 150 eV. In another embodiment, the energy of the ions from the second source is approximately 70 eVV. In some embodiments, the ions provide energy in the range of about 45 eV to about 95 eV.

  In some embodiments, the second source includes oxygen (eg, O 2) or nitrogen (eg, N 2) gas. In another embodiment, the second source gas includes a noble gas such as argon, xenon, helium, neon, and krypton. The second source gas includes a hydrocarbon material such as a precursor hydrocarbon in another embodiment. The selection of the second source gas is based on the desired effect in the chemical quantification method of the deposited film. The second source provides a focused beam of excited ions in several embodiments. The second source provides an unfocused beam of excited ions in several embodiments. It is desirable to make the third layer of electrolyte as thin as possible to prevent shorting to the cathode and anode layers. In one embodiment, the third film has a thickness of less than 1 micron. In some embodiments, the third film has a thickness of 5,000 angstroms or less. In another embodiment, the third film has a thickness of 1,000 angstroms. In another embodiment, the third film has a thickness of about 10 angstroms to about 1,000 angstroms.

  In another embodiment, the third film is energetic to the first source that supplies energetic ions (5 to 3000 eV) to the material source (target) at a collision angle of 15 to 70 degrees and to the growing film. It is deposited using a second source that supplies the correct ions. The first deposition source enters a focused beam of energetic ions from a source gas. The source gas includes one of the source gases described herein.

  A fourth film that is an anode, for example film 65 or 75, is deposited on and covers the third film, but does not contact the first film (barrier) or the second film (cathode); Includes from lithium intercalation materials. In some embodiments, the fourth film is deposited using a first deposition source simultaneously with a second source that supplies energetic ions to the growing film. In some embodiments, the first deposition source is a physical vapor deposition source. In some embodiments, the second source is an ion source that provides energetic ions from a source gas that includes oxygen (eg, O 2) or nitrogen (eg, N 2). In another embodiment, the source gas includes a noble gas such as argon, xenon, helium, neon, and krypton. In another embodiment, the source gas comprises a hydrocarbon material, such as a precursor hydrocarbon. The selection of the second source gas is based on the desired effect on the chemical quantification of the deposited film. The second source, in some embodiments, provides a focused beam of excited ions. The second source, in another embodiment, provides an unfocused beam of excited ions. The excited ions provide energy in the range of approximately 5 eV to approximately 3000 eV to the lithium intercalation material. In some embodiments, the energy range is from about 5 eV to about 1000 eV. In some embodiments, the energy range is from about 10 eV to about 500 eV. In some embodiments, the energy range is approximately 30 eV to approximately 300 eV. In another embodiment, the energy range is from about 60 eV to about 150 eV. In another embodiment, the range of energy from the second source is approximately 140 eV. In one embodiment, the fourth film has a thickness of 10 microns or greater. In some embodiments, the fourth film has a thickness in the range of 10 to 40 microns.

  In another embodiment, the fourth film is deposited on the surface of the substrate with a precursor hydrocarbon plasma decomposition, thereby forming an anode of lithium intercalation. In some embodiments, the deposition is performed with a plasma enhanced chemical vapor deposition method using a hydrocarbon precursor. In some embodiments, the deposition includes a dopant such as N2. In some embodiments, the second source provides excited ions to assist in the deposition of the fourth film. The excited ions provide a range of energy as described herein. In some implementations, all of the second sources are the same as described herein.

  In another embodiment, the fourth film, the anode, is deposited by direct ion beam evaporation with a lithium intercalation material using a hydrocarbon precursor. The first deposition source provides a beam of energetic ions (5 to 3000 eV) focused from a source gas hydrocarbon precursor directed at the target material. In some embodiments, the second source provides energetic ions to assist the growing fourth film and is the second source as described herein.

  The fifth film that is a contact, for example film 65 or 77, is electrically conductive, does not react with the fourth film, and is formed in contact with at least a portion of the fourth film. The fifth film is not in contact with the second film (cathode). In one embodiment, the fifth film has a thickness of 0.5 microns or greater. The fifth film serves as the anode current collector for contact to the external circuit.

  In some embodiments, the passive sixth film 79 (electrically insulating and chemically inert) essentially covers the energy storage device as formed, ie, the first Covers all of the second, third, and fourth films, thus avoiding environmental contaminants that may be packaged and react with these films to reduce the performance of the energy storage device. With the energy storage device integrated, environmental pollutants may additionally contain additional fabrication materials for the device. In some embodiments, the first and fifth contact films are partially exposed out of the sixth film for connection to an external circuit of the energy storage device.

  The substrate 55, 309 or 709 on which the film described herein is deposited comprises any material capable of supporting a thin film and capable of withstanding the deposition process described herein. In some embodiments, formed of a material that begins to degrade due to thermal effects below 700 degrees Celsius. Further embodiments include substrates having temperature characteristics that undergo thermal degradation at temperatures below or equal to approximately 300 degrees Celsius. Substrate thermal degradation can cause loss of substrate shape, loss of rigidity to support the energy storage device, chemical breakdown of the substrate, cross-linking, melting, and burning of materials on the substrate and / or film. Including. Examples for substrates include silicon wafers and silicon on insulator structures. Other examples of substrate materials include metals where an insulator layer is formed prior to the formation of an energy storage device as described herein. In another example, the metal may function as a contact to an energy storage device having an insulating layer that is electrically isolated from the electrolyte film, an anode film, and an anode contact from a metal substrate. Examples of other materials with low thermal aging temperatures suitable for making energy storage devices as described herein include paper, textiles (natural and synthetic), polymers, plastics, glass, and ceramics.

  Substrate 55, 309, or 709 is a form applicable to the type of device used to make the energy storage device, as taught herein. One example for the shape of the substrate is a semiconductor wafer. Other forms of substrate include elongated webs, weaves, foils, and sheets. It is also within the scope of the present invention to provide a substrate of sufficient size from which many energy storage devices and / or many energy conversion devices can be made.

  Some implementations of the substrate 55, 309, or 709 include a substrate that retains the properties of supporting properties during suitable temperature processing. In a suitable temperature treatment, the substrate is positioned in intimate contact with a thermally controlled substrate, such as surface 715. In some implementations, the thermally controlled surface is a cooled surface, so that it is described here to avoid thermal degradation of the substrate or any other structural element previously formed on the substrate. The heat associated with the deposition of any film that is done is thermally balanced. Thus, in some embodiments, a substrate having a low thermal degradation temperature, such as a low melting point or a low combustion temperature, is used as the substrate in this fabrication method. For example, the substrate includes ceramic, glass, polymer, plastic, and paper-based materials. In embodiments based on this teaching, the substrate is a plastic or metal substrate on which many energy storage devices are deposited. The substrate is then divided into separate dies with at least one energy storage device thereon, which is then divided in separate states. The die is, for example, cold worked and shaped to the desired shape as indicated by the energy storage device application.

  In another embodiment, the substrate is made of a flexible material, eg, substrate 709. The flexible substrate is formed into an elongate roll by passing over the curved object, where the material is in intimate contact with the surface of the curved object. In order to control the substrate temperature and balance the effect of heat generated on the substrate and film during deposition, the curved object is a thermally controlled device (device 725 shown in FIG. 7). It is. For example, the object is hollow and sealed from the environment of the deposition container. In some embodiments, the cavity space is filled with a cryogenic gas, such as a gas obtained from liquid N2 or liquid helium, and the coolant is constantly replenished. The areas of intimate contact between the substrate and the object coincide, and the opposite side of the material location impinges from the deposition source onto the substrate. In another embodiment, the coolant is cold water that is constantly replenished. In another embodiment, an electrothermal cooling device controls a thermally curved object. In another embodiment, the curved object is a stationary or rotatable drum that has an axis in the direction of movement of the substrate.

  In another embodiment, the substrate 55 or 309 is formed of a strip of rigid material. Rigid substrates are made by cooling and passing through a thermally controlled surface. An example of a cooled surface will now be described. In one example, the surface to be cooled is cooled by the release of a cryogenic fluid such as liquid N2 or liquid helium in the body of the object having a surface sealed from the environment within the deposition chamber. Other coolant sources include cold water, cryogenic gas, and electrothermal equipment.

  FIG. 8A shows a top view of an embodiment start-up substrate 810 having an integrated battery and a device that shares a common terminal. FIG. 8F shows a front view of the activation substrate of FIG. 8A.

  FIG. 8B shows a top view of the substrate 810 of FIG. 8A after deposition of an integrated battery 820 and a device 2430 sharing a common terminal. In some implementations, integrated battery 820 and device 2430 are thin film batteries and circuits, with electrical connections 2322, 2324, and 2431, respectively. FIG. 8G shows a front view of the partially assembled device of FIG. 8B.

  FIG. 8C shows the substrate of FIG. 8B after wires 2441, 2442, and 2443 are placed and wire-attached with individually assembled chips 2440 connected to an integrated battery 2320 and device 2430 sharing a common terminal 2324. Shown in plan view. FIG. 8H shows a front view of the partially assembled device of FIG. 8C.

  FIG. 8D shows a top view of the substrate 810 of FIG. 8 after placing and connecting the loop antenna 850 used in some implementations. FIG. 8I shows a front view of the partially assembled device of FIG. 8D.

  FIG. 8E shows a top view of the final device 800 of FIG. 8D in partial assembly after the chip encapsulation layer 860 has been deposited. In some implementations, the apparatus 800 includes embossed and / or printed material 880 and / or magnetically readable toss 870.

  FIG. 8J shows a cross-sectional front view of the apparatus 800 of FIG. 8E. The front views of FIGS. 8E-8J are not the same scale. In some implementations, the device 800 is approximately equal to a typical credit card size and thickness. Also, in some embodiments, a magnetic strip 870 and embossed letters 880 are also created by the device 800.

  FIG. 8K shows a perspective view of the apparatus of FIG. 8E at the magnetizing station. In the embodiment shown, coil 890 uses a house current to generate a 60 Hz magnetic field, and together with coil 850 forms a transformer that generates a current that flows through that coil 850, which is rectified. Allows the switch to close. When the switch is closed, the attached circuit performs the task. One example application of such a system will now be described. Currently, magnetizing stations are used to disable anti-theft circuitry. The magnetic field essentially disables the anti-theft device resonant frequency antenna so that the antenna does not allow an alarm when the purchaser walks through the reader at the retail store. In this embodiment of the invention, the magnetic field used to disable the anti-theft device enables the switch and then powers the circuit. In some implementations, the circuit begins to clock mark the start of the warranty period associated with the purchased product.

  FIG. 8L shows a perspective view of the device 800 of FIG. 8E, but further includes a photovoltaic cell 2650. FIG. In some implementations, the device 800 is made as part of a shipping label. The shipping label includes an opaque package that is peeled off. Once stripped, the light strikes the photographic voltage cell and closes the switch to operate the circuit. In some implementations, the circuit begins to clock mark the start of the warranty period associated with the purchased product.

  FIG. 8M shows an overview of the apparatus of FIG. 8E at radio wave station 892. Radio waves from radio wave station 892 are collected by antenna 850 and the power of the received radio waves is used to close the switch and execute circuit 2440. In some implementations, the circuit begins to clock mark the beginning of the warranty period associated with the purchased product.

  Solid state secondary batteries, such as those described above, have a unique ability to integrate directly with the electronics they operate. RF-implemented technology such as that used in thin wire antenna / coil 850 and / or keyless entry systems to be used as a two part transformer coil as shown in FIG. 8K. Further integration allows recharging via a solid state thin film battery 820 wirelessly (via the atmosphere). Using technology well known in RF I.D.tags, the communicating energy is converted to a D.C. voltage and used to perform the functions of the car. In the case where the battery is already on the board, the DC voltage is used in the power-up recharge circuit to recharge the vehicle battery wirelessly.

  One need exists in industries that benefit from the integration of energy, storage, and electronics on a single platform.

  The present invention provides a platform that integrates electronics, solid state batteries, and event-actuated switches into a single platform. In many instances, the system or platform has a very small form factor. Figures 9A through 20 provide an overview of such a system or platform. The description of the specification follows.

  9A and 9B show circuit diagrams of a system 900 that includes a battery 908, a circuit 910, and a start-up switch 930. The battery 908 may or may be formed as discussed with respect to FIGS. The battery 908 is typically a thin film battery formed of a substrate such as the substrate 55 shown in FIGS. As an alternative, the circuit 910 may be formed on the substrate 55 and the battery 908 may be formed on the circuit 910. An activation switch 930 (such as a MEMS switch that is functionalized by acceleration, magnetism, charging, etc. as described below) is also formed on the substrate with battery 908 and circuit 910. FIG. 9A shows a system 900 or platform that integrates electronics in the form of a circuit 910, a solid state battery 908, and an event active switch 930, which is deactivated or open. FIG. 9B shows the same system 900 or switch 930 activated by placing a solid state battery in electrical communication with the circuit or electronics 910. The circuit 910 or electronics is then powered to perform a task in response to being activated by the activation switch 930.

  FIG. 9C shows a system 900 or platform that includes a battery 908, a circuit 910, and a start-up switch 930. As shown in FIG. 9C, platform 900, including battery 908, circuitry or electronics 910, and start-up action circuit 930 is in a deactivated state.

  The platform 900 shown in FIGS. 9C and 9D includes a deactivated state or switch or activation switch 930 (shown simply open for illustration purposes). It should also be noted that the platform can also be shown in the active state with the function activated switch 930 closed. Memory 912 is typically non-volatile (NV) memory, as shown. The NV memory stores information that the circuit 910 is powered or not powered. In other words, using the NV memory 912 and the timing circuit 914 allows the number of certain events to be recorded in the memory 912 during the time frame in which the battery 908 can move the circuit 910. For example, in some examples, a shock event or the time to be activated when the activation action circuit 930 is closed can be recorded in the memory 912. The timing circuit 914 includes a timer to be used to record the date and time or simply the time that the particular activity for which the switch 930 is activated occurred.

  FIG. 9D shows yet another system 900 or platform that includes a battery 908, a circuit 910, and an active activation switch 930 in an open or deactivated position. The circuit 910 includes a memory 912, a timer 914, and a microprocessor 916. In the particular embodiment of FIG. 9D, the activation switch 930 can be activated and the timer 914 can record the date and time of activation in the NV memory 912. Once enabled, the microprocessor 916 may perform specific functions. Microprocessor 916 may have very specific and limited tasks, and a microcontroller may be referred to as a microcontroller because it is entrusted to perform a specific task. It should be noted that the solid state battery 908 of FIGS. 9A, 9B, 9C, and 9D is a single use battery or is configured to be rechargeable. The battery 908 uses a photovoltaic cell and can be recharged by exposing the platform to light, or it can be recharged using a periodic burst of radio frequency, or any other similar means. May be recharged. The use of secondary batteries has been discussed in the application entitled “Battery-operated wireless communication devices and methods” filed on March 23, 2001 (Application No. 09 / 815,884). Is shared with the applicant of this application and is hereby incorporated by reference.

  FIG. 10 shows a flowchart of the method of operation for the circuit shown in FIGS. 9A to 9D. As shown in FIG. 10, a platform or system 900 that includes a battery 908, a circuit 910, and a start-up switch 930, as indicated by reference numeral 1010. Initially it is in a deactivated state. It should be noted that the generally deactivated state is when switch 930 is in the open position. However, the deactivated state may be when the activation switch is in the closed position. In addition, there are many switch mechanisms and one particular switch may be deactivated while the other switch is active. From the deactivated state 1010, an activation action 1020 occurs. The activation operation generally closes the activation activation switch 930 to set up electrical communication between the battery and the circuit and electronics 910. In other words, the activation switch is closed and the battery 908 supplies the circuit 910. After the activation operation 1020, the circuit 910 or electronics 910 is activated or placed in operation 1030. Operation 1030 may include storing an event in memory 912 at a particular time in response to timing circuit 914 (shown in FIGS. 9A-9D). In addition, operations can include specific tasks, as performed by a microprocessor or microcontroller 916 (shown in Figure 9D).

  FIG. 11 shows another embodiment of the present invention. A battery 1110 and a start-up switch 1130 are included in this particular embodiment. In other words, the battery 1110 is a thin film battery as shown in FIGS. 1-8, and the activation switch 1130 is attached to or integrated with the battery 1110. The activation switch 1130 can be formed as part of a thin film battery, or more precisely, along the battery 1110 on the substrate 55. Circuits or other electronics are not on the substrate 55 but are later connected to contacts 1141 and 1142. In other words, the electronics separated from the thin film solid state battery 1110 and the activation switch 1130, both on the substrate 55, are connected to some form of electronics not on the substrate.

  Figures 12A and 12B illustrate one type of activation switch that can be used in the apparatus of Figures 9A-9D and other suitable devices. The activation switch shown in FIGS. 12A and 12B is a MEMS device. 12A shows a plan view of the MEMS activation switch 1230, while FIG. 12B shows a front or end view of the MEMS activation switch 1230. FIG. The activation action switch 1230 includes a base 1201. Mounted on the base 1201 are a first (long) cantilever beam 1210, a second (intermediate length) cantilever beam 1212, and a third (short) cantilever beam 1214. At the end of the first cantilever beam 1210 is a weight or weight end 1211. Similarly, the end of the second cantilever beam 1212 has a weight end 1213 and the end of the third cantilever beam 1214 has a weight end 1215. Also, the end of each cantilever beam includes an electrical contact material. The cantilever beam can conduct electricity along an electrical path or trace. The first cantilever beam 1210 has an electrical trace 1240 that terminates in a contact or pad area 1241. The second cantilever beam 1212 includes an electrical trace 1242 that terminates in an electrical pad or end 1243. On the other hand, the third cantilever beam 1214 terminates at a pad or end 1245. The cantilever beams 1210, 1212 and 1214 each have a different length. As a result, the force required to bend each beam is different. In other words, a long cantilever beam with a weighted end bends and contacts the electrical pad 1220 with less force than the shock load required to bend the cantilever beam 1212 into contact with the electrical pad 1222. Third cantilever beam 1214 is shorter than either cantilever beam 1210 or 1212. As a result, in order for the cantilever beam 1214 to contact the contact 1224, a greater shock load or force is required to bend the cantilever beam 1214. The actuating switch 1230 (shown in FIGS. 12A and 12B) is basically a three-level switch that functions with different levels of shock. In another embodiment of this particular activation switch 1230, each cantilever beam is the same length and changes the weight at the end of the cantilever beam so that heavier weights are less shocked. Responsive with load, lighter weight beams respond only to higher shock levels. As further contemplated, there may be a single cantilever beam or multiple cantilever beams. In other words, the invention of the actuating switch is not necessarily limited to a three-piece cantilever beam structure.

  FIG. 13 shows another embodiment of the activation switch 1330. The activation action switch 1330 actually includes separate switches for X-axis, Y-axis and Z-axis activation. Z-axis switch 1330A is a MEMS device that includes three cantilever beams having 1311, 1313, and 1315 with substantially equal lengths and weight ends, respectively. The weight of each end 1311, 1313, and 1315 is substantially the same. However, the body or width of each cantilever beam 1310, 1312 and 1314 has changed so that the width of the first cantilever beam 1310 is slight and the width of the last cantilever beam 1314 is: The width of the cantilever beam 1312 is larger than the width of the beam 1310 and the width of the beam 1341. Thus, even the same sized weight responds to different shock loads on the arms or cantilever beams 1310, 1312 and 1314. The end of the cantilever beam makes electrical contact with pads 1320, 1322 and 1324. Each beam has an electrical tray so that the time of the event can be stored in static memory when each switch is enabled due to a shock load.

  As previously mentioned, 1330A shows a start-up switch for the Z-axis. The system, platform or activation action switch 1330 also includes a switch 1330B in the X direction and a switch 1330C in the Y direction. Each of these switches is similar, so only one of the switches 1330B will be described for simplicity. The activation switch 1330B also includes a set of cantilever arms 1310 ′, 1312 ′, and 1314 ′. On the other hand, there is a weight 1311 ′ at the end of the cantilever beam 1310, a weight 1313 ′ at the end of the cantilever beam 1312 ′, and a weight 1315 ′ at the end of the cantilever beam 1314 ′. . One set of contacts is attached to the base of the activation switch 1330B. The switch 1320 is positioned in contact with the end 1311 ′ of the first cantilever beam 1310 ′. Similarly, contact 1322 'is positioned to contact upon receipt of end 1313' of second cantilever beam 1312 '. Further, contact 1324 'is positioned to receive end 1315' of cantilever beam 1314 '. Activation switch 1330B is designed such that each of the switches is activated at or near a different shock load level. Thus, the cantilever arms 1310 ', 1312' and 1314 'can be made more substantially, the end weights can be changed, or various switch positions can be created to work with different shock loads. , Can change the length. The activation operation switch 1330B is a slightly different modification from the MEMS device 1330A in the drawing. The switch 1330B is a MEMS device. A similar switch 1330C is positioned to detect the shock load in the Y direction. It should be noted that the switches activated by the X, Y, and Z-axis shock loads are intended to prevent non-detection of shocks occurring on one axis. It should be noted that various components of the shock load are detected on the X, Y, and Z axes.

  FIG. 20 illustrates another embodiment of a system 2000 that includes a battery 2008, a circuit 2010, and a start-up switch 2030. Battery 2008, circuit 2010, and activation switch 2030 are located on substrate 2001. The substrate includes an adhesive layer 56. The backing material 156 covers the adhesive layer 56. The backing material 156, in some embodiments, is a removable strip or plastic film that can be removed to expose the adhesive 56. The activation switch 2030 includes a first cantilever bar 2031 and a second cantilever bar 2032. The first cantilever bar 2031 is located between the first contact 2033, the second contact 2034 and the third contact 2035. Contacts 2033 and 2034 are L-shaped and include a portion positioned in a plane that is substantially parallel to the substrate including a portion of arm 2031 of the cantilever. Thus, acceleration at a selected level in either the X or Y direction in the plane of the substrate causes the cantilever arm 2031 to contact either the electrical contact 2033 or the electrical contact 2034. The electrical contact 2035 is located under the cantilever arm or in a plane parallel to the end of the cantilever arm 2031. For acceleration in the Z direction, the arm 2031 is brought into contact with or connected to the contact 2035. When the beam travels in another direction after the initial acceleration, the acceleration that diverts the beam from contact 2035 further connects to contact 2035. In other words, beam 2031 snaps contact 2035 to make an electrical connection.

  A cantilever beam 2032 is placed between a contact 2036 and another contact 2037. The contacts 2036 and 2037 are L-shaped and include a portion located in a plane substantially parallel to the plane of the substrate 2001. The end of the cantilever beam 2032 is also in the same plane. In some embodiments, the cantilever arms 2031 and 2032 are equally configured such that a selected acceleration level in one plane provides electrical contact or connection with various contacts. In another embodiment, the cantilever beam 2031 and the cantilever beam 2032 are formed to have different response characteristics to acceleration, so that one of the cantilever beam contact elements 2031 and 2032 is It may be more sensitive than the other of the contact elements of the cantilever beam. When one of the contact elements 2031, 2032 of the cantilever beam contacts the contact element associated with that beam element or forms an electrical connection, the battery powers the circuit. The circuit 2010 performs one specific function or a plurality of functions.

  In operation, such a switch or switches may be used to detect shock loads and record their times. For example, one set of such switches or activation switches 1330, 1230, 2030 is useful in some shipping situations. In order to initially activate one of the more response parts of the activation switch, the shipper includes an activation switch with a very low threshold for shock load. In other words, the shipper may have a switch that activates (takes off with a very low shock load) when taking the package from the shelf. The shelf will be moved by a very low impact load). This activation can then be detected by a timer or timing circuit 914 and then placed in memory 912. If the package is dropped or subjected to severe shock loads during shipment or at another time after shipment, it will come in contact at its contact point on another of the cantilever beams. In other words, the occurrence of a large shock will be detected by one of the shorter or less sensitive beams. In other words, for large shock loads, at least two beams may come into contact with each contact, or all three of the actuating switches may come into contact. This time, it may be detected and it may be determined who will pay for the broken product being shipped. In other words, if the shipper ships the product during the time frame that the package was in, the shipper should pay. If it can be shown that it has been delivered, the consumer should pay for the damaged product, or the manufacturer or shipper should not have to compensate for the damage to the product.

  Another example use of this particular activation switch for shock loads may be to mark the start time of the warranty period. For example, if one of the switches activated by a shock load is very sensitive at the time of package and shipment, a clock or timer can be started based on the activation of the switch indicating the start of a warranty or other time frame. Later, when a consumer seeks warranty use, the requirement may be to return a package with the product. You can check the warranty time. This prevents the consumer from ordering another product and returning a new product under warranty.

  In some embodiments, a system that includes a shock load activated switch 1330, 1230, or 2030 can be attached directly to the product or included in a peel or shipping label that can be attached directly to the product package Can be. 14A and 14B (switch not shown) show two specific labels using a system that includes a switch activated by a shock load such as 1230, 1330, or 2030. Also, the switches 230, 1330, and 2030 activated by a shock load may be referred to as accelerometers. Batteries, thin film solid state batteries, accelerometers or electronics 910 (shown as 9A and 9B in the figure) can be formed as part of a label such as the shipping label shown in FIG. 14A or the product label shown in FIG. 14B. . Each label includes a platform or thin film solid state battery 908 (shown in FIGS. 9A and 9B), a circuit 910 (shown in FIGS. 9A and 9B) and a start-up switch 930 (shown in FIGS. 9A and 9B). Including 1410, 1410 ′.

  As provided in some embodiments, FIG. 15 includes a platform or system 1520. FIG. 15 shows a cannonball or other legislation that includes a battery 908, a circuit 910, and an activation switch 930 (shown in FIGS. 9A and 9B) such as switch 1230, 1330, or 2030 (not shown in FIG. 15). FIG. 15 includes a cannonball or statute 1510. Contained within the bullet or cannonball includes a battery 908, a circuit 910 (shown in FIGS. 9A and 9B), and an activation switch or accelerometer 1230, 1330, 2030 (not shown in FIG. 15). System or platform. Circuit 910 may include a microprocessor or microcontroller 916 (shown in FIGS. 9A and 9B). Bullet or cannonball 1510 includes a single fin or a plurality of fins, such as those shown having reference number 1512. The fin 1515 is controllable. When the bullet 1510 is shot or accelerated, the activation action switch brings the system 1520 from the deactivated state to the active state. One fin or multiple fins 1512 from the cannonball target can then be controlled by the microcontroller to direct to the microprocessor in the system 1520. Circuitry or electronics 910 attached to battery 908 and activation switch 930 may include additional sensor 1530. For example, sensor 1530 may be an infrared sensor for detecting heat, a photovoltaic unit for detecting light, or some other sensor for detecting another characteristic of the target. The bullet or cannonball 1510 with the system 1520 is of a very small size, including bullets fired from a rifle or hand gun, or a very large size released from a gun.

  FIG. 16A shows a plan view of an activation switch 1630 activated by magnetic force. FIG. 16B shows another embodiment of a switch activated by magnetic force. Switch 1630 or switch 1630 ′ is a MEMS device with a series of cantilever beams 1610, 1612, 1614. The MEMS device has a paramagnetic edge that is sensitive to magnetic fields. The beams 1610, 1612, 1614 have different cross-sectional widths and respond differently to a specific strength magnetic field. The magnetic switch shown in FIG. 16B includes cantilever beams 1610 ′, 1612 ′, and 1614 ′. These cantilever beams or arms also respond to different magnetic fields. Its arms 1610, 1612, 1614 contact electrical contacts 1620, 1622, and 1624. Once one of the arms 1610, 1612, 1614, 1610 ′, 1612 ′, or 1614 ′ contacts the electrical contact 1620, 1622, 1624, 1620 ′, 1622 ′, or 1624 ′ in the electric field, FIG. 9B As shown, the battery below it is connected to circuit 910. This particular activation switch 1630, 1630 ′ is useful for starting the warranty period or for recording the start of the warranty period. When a consumer buys an item at a retail store, for example, often a magnetic device is used to remove an anti-theft mechanism. The magnetic device generates a magnetic field that deactivates the anti-theft device. The same magnetic field can be used to move one or more of the arms 1610, 1612, 1614, 1610 ′, 1612 ′, or 1614 ′ shown in FIG. 16A or 16B. Thus, the same magnetic field used to deactivate the anti-theft device can be used to activate or initiate the guarantee time. Another potential use is for an item or device in a package that is purchased and the anti-theft device is deactivated by magnetic force, the magnetic detector 1630, 1630 'triggers a self-diagnosis of the purchased product or item It means that. The results and time of self-diagnosis can be recorded in static RAM or static memory 912 for later retrieval (as shown in FIG. 9). Therefore, at the point of purchase, it should be noted that the device has passed the self-diagnosis, which can be used for subsequent warranty work.

  FIG. 17 is another embodiment of the activation switch 930. FIG. 17 shows an outline of the pressure detection switch 1730. The pressure sensing switch 1730 includes a first elongate electrical contact 1710 and a second elongate electrical contact 1712. The first electrical contact 1710 is disconnected from the second electrical contact 1712. The pressure sensing switch 1730 can be placed in a label such as the label shown in FIGS. 14A or 14B. The label is provided with a stripping backing, and the mere act of stripping the backing that requires the flexibility and curvature of the main label is the first contact 1710 of the pressure sensing switch 1730 to the second contact 1712. Make contact. Also, the activation switch, which is pressure sensing, can be used for shipping applications or warranty work. Examples of these applications will be discussed with respect to activation action switches 1230 and 1330.

  FIG. 18 shows an overview of the moisture activation switch 1830 in several embodiments. The moisture activated switch 1830 includes a first inclined surface 1801 and a second inclined surface 1802. The first electrical contact 1810 is attached to and associated with the first inclined surface 1801. The second electrical contact 1812 is then attached to and associated with the second inclined surface 1802. When moisture is encountered or occurs, the ramp moves moisture to the lowest possible point (where the moisture activation switch 1830 is located), so that gravity is the lowest possible point on the ramps 1801, 1802. Move moisture to. When the moisture moves to the lowest possible point, the moisture collects in the reservoir 1820. The reservoir 1820 fills with moisture until the moisture in the reservoir 1820 bridges the gap between the first electrical contact 1810 and the second electrical contact 1812. Thus, the switch can be activated by rain received in the area, or it can be activated when the device is submerged in a damp or wet environment. When sufficient moisture closes such switch 1830 or provides electrical contact, the switch can connect battery 908 to circuitry or electronics 910 (see FIGS. 9A and 9B).

  Other applications of the activation switch are also contemplated. Thermal activation switch 930 is used in some embodiments. The structure is similar to that required for sprinkler devices in buildings. In this particular embodiment, the thermal activation action switch connects battery 908 to circuit 910 or electronics 910. An application would be an example used in a sprinkler device. Thereby, after being enabled, the sprinkler is disabled when smoke is no longer detected or when the temperature in the room drops below a certain threshold.

  Another use case for the activation switch 930 would be to use activation type switches 1230, 1330 in the exit seat of an airplane for a test pilot. The test pilots have maneuvered the aircraft many times at very high altitudes, and if the injection is required at one of these high altitudes, the pilots in the seat have enough oxygen that they can survive It is necessary that the parachute does not open until you are at a high altitude. In other words, if high altitude flight and seat injection equipment are required, it is also beneficial for life saving to descend to an altitude where there is enough oxygen for the pilot to survive. Such altitude may be 10-15,000 feet, or perhaps any other selected range. Thus, the activation switch 1230, 1330 will operate the electronics or circuit 910 that contains the altimeter. The electronics will use an altimeter that reads to determine when to deploy the parachute attached to the ejection seat. This will provide a better chance of survival for pilots who must escape at high altitudes.

  FIG. 19 shows an RF activation switch. It is contemplated that other applications can be used after the RF signal activates the activation switch 930, 1930. FIG. 20 has been described above.

  FIG. 21A shows an embodiment of a wireless tag system 2100. The system includes a radio frequency identification (RFID) device 2170 and a remote RF device 2160 for communicating with the RFID device. The RFID device 2170 is located on a battery 2120 disposed on a flexible substrate 2110, the battery 2120, and the electronic circuit 2130 coupled with the battery 2120 for the battery 2120 to supply power to the electronic circuit 2130. , 2140 is disposed on the battery 2120 and includes an RF antenna coupled to the electronic circuit 2130 and an adhesive layer 2150 disposed on the side of the flexible substrate opposite the battery 2120 and the electronic circuit 2130. In the embodiment shown, wiring 2131 connects electronic circuit 2130 to battery 2120 and antenna 2140. In another embodiment, wiring and contact layers are disposed between the battery 2120 and the electronic circuit 2130 to couple the electronic circuit 2130 to the battery 2120. In some embodiments, the electronic circuit is formed on the RFID device as a layer. In other embodiments, the electronic circuit includes a pre-formed (ie, pre-built) integrated circuit that is mounted on the deposited layer and connected to the battery by a wiring layer.

  In another implementation of the system 2100 as shown in FIG. 21B, the RF antenna 2140 is deposited on a flexible substrate 2110.

  In another embodiment of system 2100 as shown in FIG. 21C, RF antenna 2140 is deposited on flexible substrate 2110, electronic circuit 2130 is positioned adjacent to battery 2120 on flexible substrate 2110, and The adhesive layer 2150 is deposited on the side of the flexible substrate that is opposite the battery 2120 and the electronic circuit 2130.

  In another embodiment of the system 2100 as shown in FIG. 21D, the electronic circuit 2130 is placed adjacent to the battery 2120 on the flexible substrate 2110, thereby uniformly forming the substrate and forming the adhesive layer. Allows 2150 ′ to be deposited on the uniform surface formed by battery 2120 and electronic circuit 2130, or allows adhesive layer 2150 ′ to be formed on flexible substrate 2110 .

  In another embodiment of system 2100 as shown in FIG. 21E, battery 2120 is deposited on the first side of flexible substrate 2110 and adhesive layer 2150 ″ is deposited on electronic circuit 2130. In order to be able to be deposited on the battery 2120, the electronic circuit 2130 and the RF antenna 2140 are placed on the opposite side of the flexible substrate 2110.

  FIG. 21F shows one embodiment of the adhesive layer 2150 located on the flexible substrate 2110. It should be noted that the adhesive layer 2150 may be any type of adhesive layer including a releasable type adhesive layer or a permanent adhesive layer. In some embodiments, a peelable stick type of adhesive layer covered by a peelable paper (also referred to as release paper) or plastic layer 2152. In some implementations, the adhesive layer 2150 covers the entire surface of the substrate 2110, while in other implementations, the adhesive layer 2150 covers only a portion of the substrate surface 2110. In some embodiments, the adhesive layer 2150 covers all or part of the battery 2120. In some embodiments, the adhesive layer 2150 covers all or part of the electronic circuit. In some embodiments, the adhesive layer 2150 covers all or part of the uniform surface formed by depositing the electronic circuit 2130 adjacent to the battery 2120.

  FIG. 22 shows an embodiment of battery 2220. A substrate 2210 on which a contact film 2257 is formed is provided. Contact film 2257 functions as a current collector and is connected to lead 2258, which in some embodiments connects one pole of battery 2220 to an external circuit. In some implementations, the electronic circuit 2130 (shown in FIGS. 21A-21E) is attached to the battery 2220 when the electronic circuit is formed. In other implementations, the electronic circuit 2130 is separated from the battery 2220 and is not attached to the battery 2220, for example, when the electronic circuit is formed. The electrode film 2259 is formed on the contact film 2257. In some embodiments, the electrode film 2259 substantially covers the surface of the contact film 2257 in order to minimize resistance by maximizing the area of the interface between the films. In some embodiments, electrode film 2259 is the cathode for thin film battery 2220. Electrolyte film 2261 is formed on electrode film 2259. The electrode film 2263 is an anode formed on the electrolyte film 2261. The electrolyte film 2261 separates the electrode film 2259 from the electrode film 2263. Contact film 2265 is formed on electrode film 2263. Contact film 2265 functions as a current collector and is connected to lead 2267, which connects one pole of battery 2220 to an external circuit. In some embodiments, the contact film 2265 substantially covers the surface of the electrode film 2263 to maximize the area of the interface between these films and minimize resistance. In some embodiments, electrode film 2263 is an anode for a thin film battery.

  In one embodiment, the electrolyte film 2261 includes LiPON. As used in this location, LiPON generally relates to lithium phosphonitride oxide materials. One example is Li3PO4N. Another example incorporates a higher proportion of nitrogen to increase the mobility of lithium ions through the electrolyte.

  The method for making the solid state battery 2220 is described above.

  In some implementations, the solid state battery 2220 is formed of five or six stages. The first stage begins with pre-cleaning the substrate using the Mk II Ion Gun system in an argon atmosphere flowing into the ion gun at a rate of 5 sccm for 4 minutes at 70V and 2A. A 2500A cathode metal layer of nickel is then formed on the substrate 2210 by depositing nickel with an electron beam gun using 200 mA and 6500V. The second stage begins with sputter etching of the collector of the nickel cathode for 1 minute at 250 W of power under 12 mT pressure of argon. Subsequently, the target is oxidized for 5 minutes at a power of 1200 W in an atmosphere of 80% oxygen and 20% argon at 15 mT pressure. The cathode layer 2259 is formed on the cathode metal layer by depositing LiCoO2 at a power of 1200 W for 60 minutes in an atmosphere of 80% oxygen and 20% argon at a pressure of 15 mT. The third stage begins with target oxidation for 5 minutes at a power of 750 W in nitrogen at a pressure of 5 mT. The electrolyte layer 2261 is formed by depositing Li3PO4 for 57 minutes at a power of 750 W in an atmosphere of 40 sccm of nitrogen at 5 mT pressure. And in other embodiments, an anode deposition stage is performed to deposit the anode. The fourth stage begins with the pre-cleaning of the previously formed layer using the Mk II Ion Gun system in an argon atmosphere flowing through the ion gun at a rate of 5 sccm for 4 minutes at 70 V and 2A. A 2500A anode metal layer of copper is then formed on the electrolytic layer by depositing copper with an electron beam gun using 150mA and 7600V. The fifth stage begins with pre-cleaning the previously formed layer using the Mk II Ion Gun system in an argon atmosphere flowing to the ion gun at a rate of 5 sccm for 4 minutes at 70 V and 2A. The SiN 5000A passivation layer is then formed with an electron beam gun using 150 mA and 7600 V. At the same time, the Mk II Ion Gun system at 90V, 2A and 18 sccm of nitrogen flowing through it are bombarded on the growing film.

  FIG. 23A shows a circuit diagram of an RFID device 2300 that includes a battery 2320, an electronic circuit 2330, an RF antenna 2340, and an RF activation switch 2350. The battery is a typical thin film battery formed on a substrate 2110 as shown in FIGS. 21A-21F and FIG. The circuit may be incorporated and attached to the battery 2320 on the substrate 2110. Alternatively, electronic circuit 2330 may be formed on or placed on substrate 2110 and battery 2320 formed on electronic circuit 2330. Further, the RF activation action switch 2350 is formed on a substrate accompanying the battery 2320 and the electronic circuit 2330. The RF energy received by the RF antenna 2340 is detected and the amplifier circuit 2352 captures the occurrence of the event. Switch 2354 is closed to couple battery power to electronic circuit 2330 for operation. The electronic circuit 2330 includes additional devices such as a solid state memory 2334, a timing circuit 2336, and a microprocessor 2332. Typically, the memory 2334 as shown is a non-volatile memory. The non-volatile memory stores information on whether or not the electronic circuit 2330 is powered. In other words, using the non-volatile memory 2334 and the timing circuit 2336, it is possible to record the number of events in the memory 2334 during the time frame in which the battery 2320 can move the electronic circuit 2330. For example, in some cases, the time that the RF activation circuit 2350 is closed or placed in an active state can be recorded in the memory 2334. A timing circuit 2336 that includes a timer can be used to record the date and time or simply the time that an RF-related occurrence activated the switch. Once the electronic circuit 2330 becomes active, the microprocessor 2332 may perform specific functions. Microprocessor 2332 can have very specific and limited tasks and may therefore be referred to as a microcontroller that is entrusted to perform specific tasks.

  FIG. 23B shows a circuit diagram of another implementation of the RFID device 2301. RF energy is received by the RF antenna 2340 and detected by the amplifier circuit 2352. This sets the flip-flop 2356 and activates the electronic circuit 2330 from the low power mode to the active mode. Low power signal 2357 resets flip-flop 2356 to re-enter low power mode. Once activated, the device operates as discussed in FIG. 23A.

  It should be noted that the solid state battery 2320 shown in FIGS. 23A and 23B is simply a single use battery or is rechargeable. The battery 2320 uses photovoltaic cells (optionally formed or deposited on the surface of the substrate) and can be recharged while exposing the platform to light or periodic bursts of radio frequency. It may be recharged upon use, or may be any other similar means. Regarding the use of secondary batteries, US patent application (Application No. 09 / 815,884) filed on March 23, 2001, "Battery-operated wireless communication device and method" and on January 2, 2003. Disclosed in `` Solid-State Start-up Battery Device and Method '' in filed U.S. Patent Application (Application No. 10 / 336,620), which is shared with the applicant of this application and is here for reference Capture with.

  There is a need in an industry that benefits from energy, storage, and electronics integration on a single platform.

  The present invention provides an apparatus for integrating a single device with electronics (including RF electronics) and solid state batteries. In many instances, the system or platform has a very small form factor. 21A-24B show an exemplary sample of such a system or platform. Specific examples are described below.

  One use case for this particular RFID device marks the start time of a warranty period. For example, if an RFID device is attached to a product, when purchasing the product, RF energy activates the device and a clock is started to mark the compensation time or start of frame. Instead, the RF energy sends a time stamp that is permanently stored in the device. This takes into account a very close proximity or a very close approximation as to when the warranty period starts. Later, when the consumer wants to return a product that is under warranty, the warranty request may be to return a package or label with the product. The warranty time is then checked. This would prevent the consumer from ordering another product during the warranty period and returning it as a new product. In some implementations, the system including the RF activation switch can be included on a peel-off label or shipping label that is attached directly to the product or directly to the package for the product. FIGS. 24A and 24B show two implementations with labels using a system that includes an RF activation switch 2350. A system including a thin film solid state battery 2320, an RF activation switch 2350, and an electronic circuit 2330, in some implementations, may be the shipping or postal label shown in FIG. 24A, or in FIG. 24B. Formed as part of a label, such as the product label shown. Each label includes a platform or system 2410, 2410 'that includes a thin film solid state battery 2320, an electronic circuit 2330, and an RF activation switch 2350.

  Another example is the use of RFID devices when mailing or shipping labels 2410 (see FIG. 24A) to detect and register mailing times associated with shipping and events. The RF transmitter will activate the RF activation switch 2350 and the start timing circuit 2336 to detect and register the start of the shipping duration. Another example or use of this particular RFID device includes backup or supplementary use for information on the printed label. If the print information is no longer readable or available due to loss, the RFID device may communicate the stored information to the RF receiver when prompted.

  Another example is to use an RFID device in product label 2410 ′ (see FIG. 24B) to tag and track properties. Remote RF transmitter and receiver devices can be located at various stations within the warehouse, shipping and receiving area. The remote RF device then detects and registers when the package passes the station. In another example, RFID devices are also used in portable RF transmitter and receiver devices to locate characteristics. In some embodiments, the remote RF device conveys an interrogation code for a particular RFID device. The RF energy from the interrogator activates the RFID device, and the RFID device responds by parsing the interrogation code and sending an RFID identification code, thereby identifying the presence of a particular RFID device remotely. Shown in RF equipment.

  Another example is the use of an RFID device in a drug therapy system that uses a drug patch attached to a skin to provide a drug by methods such as electrophoresis. The use of a thin film solid state battery allows electronic circuitry to be used in electrophoretic devices while maintaining a low device profile so as not to interfere with the patient's clothing. In this example, the RFID device is attached to a drag patch that includes a drag reservoir. The electronic circuit 2330 moves the device to begin delivery of a large drug pill. Microprocessor 2332 stores in memory 2334 information such as when the device was activated, when a large pill with a drug was delivered, and how many large pills were delivered. Timing circuit 2336 is optionally used to adjust the circuit to prevent the patient or caregiver from managing the dose too frequently. The caregiver optionally uses a remote RF device to transmit RF energy and initiate delivery of a large drug pill, or to interrogate the RFID device and determine the history of the drug. In some implementations, the RFID device is activated when the RF device activates the RF activation switch. In other embodiments, the RFID device is activated when the RFID portion of the device is attached to the drag reservoir portion of the device.

  FIG. 25A shows one implementation of a method 2500 using an RFID device. The method 2500 provides a flexible RFID device 2100 that includes a multi-bit identifier value and a thin film battery deposited on a flexible substrate (2510) and pressure attaches the RFID device 2100 to an article ( 2520), receiving RF energy at the RFID device (2530), and coupling the battery power to the RFID device 2170 (shown in FIG. 21A) (2540) based on the reception of the RF energy to activate the circuit (2540). The activation initiates a task in RFID 2170 that includes sending an identifier (ID) value based on the multi-bit identifier of RFID device 2170 (2550).

  In another embodiment as shown in FIG. 25B, the task is to store the start time to start in RFID device 2170 (2551). In another embodiment as shown in FIG. 25C, the task is to perform a self-check with 2552 RFID device 2170 (2552) and store the result of the self-check (2553). In another embodiment, as shown in FIG. 25D, RFID device 2170 receives an interrogation code from remote RF transmitter device 2160 (2554), performs interrogation code analysis (2555), and interrogation code Based on this analysis, the ID value is transmitted to the remote RF receiver 2160. In another embodiment, receiving an interrogation code from a remote device stores the event timestamp in the RFID device 2170 (2557). In another implementation, as shown in FIG. 25E, RFID device 2170 stores a first time stamp to mark a shipping event (2557) and a second to mark a receiving event. Is stored (2558).

  Another method illustrated in FIG. 26A includes forming RFID device 2170. One embodiment of the method 2600 provides a flexible substrate (2610), deposits a battery containing an anode, a cathode and an electrolyte separating the anode and cathode (2620), deposits a wiring layer (2630), An electronic circuit connected to the battery is placed on the battery (2640), a pressure sensitive adhesive layer is deposited (2650), and the RFID device is covered (2660) to allow for stripping and application applications. Some implementations include performing these processes in the order shown in FIG. 26, and other embodiments combine one or more processes as one operation, or process the processes in a different order. Run and have different order layers. One embodiment arranges the elements of an RFID device as (i) a cover, (ii) an electronic circuit, (iii) a wiring layer, (iv) a battery, (v) a substrate, and (vi) a pressure sensitive adhesive. Including that. In another embodiment, the method 2600 includes forming a printed label on the RFID device (2670).

  In another embodiment as shown in FIG. 26B, the battery is deposited on the substrate using ion assist energy between about 50 eV and about 95 eV.

  In other embodiments, the battery is deposited on the substrate using ion assist energy between 70 eV and 90 eV. In other embodiments, the battery is deposited on the substrate using ion assist energy between 65 eV and 70 eV. In other embodiments, the battery is deposited on the substrate using ion assist energy between 70 eV and 75 eV. In other embodiments, the battery is deposited on the substrate using ion assist energy between 75 eV and 80 eV. In other embodiments, the battery is deposited on the substrate using ion assist energy between 80 eV and 85 eV. In other embodiments, the battery is deposited on the substrate using ion assist energy between 85 eV and 90 eV. In other embodiments, the battery is deposited on the substrate using ion assist energy between 90 eV and 95 eV. In other embodiments, the battery is deposited on the substrate using ion assist energy between 65 eV and 95 eV. In other embodiments, the battery is deposited on the substrate using ion assist energy between 65 eV and 85 eV. In other embodiments, the battery is deposited on the substrate using ion assist energy between 65 eV and 75 eV. Other implementations approximate values at one or both ends of the above range. In other embodiments, the battery is deposited on the substrate using ion assist energy of approximately 65 eV. In other embodiments, the battery is deposited on the substrate using ion assist energy of approximately 70 eV.

  In some embodiments, the battery deposited on the flexible substrate is a secondary battery.

  Another aspect of the present invention provides a flexible battery operated device for stripping and applying. Some embodiments, such as those shown in FIGS. 21A-21F, include a flexible substrate 2110, a thin film battery 2120 deposited on the flexible substrate 2110, a battery 2120 to be deposited and powered on the battery 2120. And a radio frequency (RF) antenna 2104 coupled to the electronic circuit 2130. In other implementations, the order of the layers is different from that shown in FIG. 26, for example, the electronic circuit is placed in the vicinity of or under the battery layer in some implementations.

  In another embodiment of the device, electronic circuit 2130 includes an RF enable switch that electrically activates electronic circuit 2130. In another embodiment, the RF enable switch includes a MEMS device. In another embodiment, the device RF antenna 2140 is integrated into the substrate 2110. In another embodiment, the device battery 2120 is a secondary battery. One embodiment of forming an RFID device as shown in FIG. 27 includes a removal layer by winding that is removably secured over a number of RFID devices.

  Another embodiment of the present invention provides a system for making an RFID device as shown in FIG. 28A. The system 2800 includes one or more supply reels 2810 that provide one or more source substrates 2809, one or more supply reels 2810 that provide one or more electronic circuits and RF antennas, and layers on one or more substrates. One or more deposition stations to deposit, a supply reel 2827 that provides an adhesive layer to be peeled off and attached for attachment to a substrate, a vacuum chamber 2807 including a supply reel 2810, a deposition station 2811 and an assist source 2817. The layers deposited in the system include a layer for forming the battery, a wiring layer for coupling the battery to the electronic circuit and for coupling the RF antenna to the electronic circuit. The layers deposited to form the battery include (a) a cathode layer, (b) an electrolyte layer, and (c) an anode layer. The substrate is fed onto an arcuate hot surface 2815 and wound up by an end roll 2813. A first material deposition station 2811 generates an adatom beam to be deposited on the substrate 2809. Beam 2812 is focused on location 2819 of substrate 2809 to form a battery layer. Assist source 2817 generates a beam of excited particles directed at substrate 2809. The excited particle beam 2814 provides the energy necessary to control the growth and chemical quantification of the deposited material of the first beam 2812. Accordingly, a crystal structure is formed on the substrate 2809, as will be described in more detail below. In various embodiments, the substrate 2809 includes an elastomer or polymer or paper from which an energy storage device is made, and / or a plastic web or sheet. The elongated substrate 2809 allows many energy storage devices to be deposited at successive locations on the substrate, thus improving the production rate of the energy device. In some implementations, multiple deposition stations 2811 are provided to allow simultaneous deposition at many different locations on the substrate 2811.

  In some embodiments, while simultaneously supplying energy to the electrolyte material, the deposition of the electrolyte film includes directing the electrolyte material to a location that is at least partially in contact with the cathode film. In one embodiment, the energy is supplied by excited particles. In some such embodiments, the excited particles are excited ions. In some such embodiments, the excited particles from the assist source are of a different material than the electrolyte material, such as an inert gas. In other embodiments, the excited ions react with other components of the deposition to become part of the deposited layer. The excited particles provide energy to the first material of the electrolyte to assist in the growth of the desired hard electrolyte film structure. In addition, this controls the chemical quantification of the growing electrolyte film.

  In some embodiments, the first material deposition station 2811 or the first source provides Li3PO4 in a nitrogen atmosphere. In other embodiments, the first source 2811 provides Li3PO4 in a vacuum environment where the background pressure is approximately less than 0.001 Torr. The assist source 2817, or second doser, provides excited particles from the source gas. In some implementations, the second source 2817 is an ion source that provides energetic ions from a source gas that includes oxygen (eg, O 2) and / or nitrogen (eg, N 2). In other embodiments, the source gas comprises a noble gas, such as argon, xenon, helium, neon, and / or krypton. The excited particles and / or ions increase the energy of the material forming the electrolyte film 2261 of the battery of FIG. 22 and, as a result, enhance layer-by-layer growth. Therefore, the electrolyte film has higher quality than the conventional electrolyte layer.

  The embodiment for forming the LiPON electrolyte film 2261 was excited at or near the first source supplying Li3PO4 at or to the position where the LiPON electrolyte film is to be formed. A second source providing nitrogen particles is included. The excited nitrogen particles react with Li3PO4 applied at the location to form an electrolyte film at the location. This increases the amount of nitrogen in the LiPON electrolyte film. Increasing the nitrogen content is desirable in some embodiments to increase the mobility of lithium ions across the electrolyte.

  In a further embodiment, the chamber in which the substrate 2809 is placed has an atmosphere enriched with nitrogen. The LiPON electrolyte film is formed by Li3PO4 supplied by a first source that reacts with nitrogen in the chamber. The second source provides excited particles that aid in the construction of the electrolyte film. In another embodiment, the second source supplies nitrogen to Li3PO4 at the location. Thus, Li3PO4 reacts with both the nitrogen in the chamber and the nitrogen-containing excited particles supplied from the second dose. This increases the nitrogen content of the electrolyte film 2261. In some embodiments, increasing the nitrogen content in the electrolyte film is desirable from published data from the Oak Ridge Department of Energy Lab. Tennessee shows that increasing nitrogen content increases ionic conductivity or mobility within the electrolyte film.

  The crystalline structure of the thin film formed by the teachings herein has a higher purity than those achieved by conventional cathode film forming techniques. The prior art performs high temperature postcard deposition annealing to re-order, and the normal cathode film structure cathodic testimony crystallizes the conventional cathode film structure. Unfortunately, such conventional techniques anneal the entire structure to the same temperature. This is undesirable because it must withstand such temperatures that eliminate suitable substrate materials. In addition, different layers are not offered, with different annealing to meet those different demands. A highly ordered crystalline cathode film desirably has a desired high purity and properly aligned crystalline structure without subjecting the substrate and other layers formed on the substrate including the cathode contact film to high temperature annealing. This is accomplished by the teachings described in this place by providing the energy required to form. In addition, different annealing processes (using ion-assisted beams with different energies in different layers, or depositing and annealing at different rates, at different speeds or for different durations). Each layer can be annealed by using). In addition, by annealing the surface of the previous layer, the subsequent layer can be made in a specific way that enhances the quality of the subsequent layer (e.g., achieving a specific crystal orientation, or a surface that adheres specific ions). , Can be deposited on the ordered surface.

  In some embodiments, the system shown here for depositing a film can be applied to form an electrolyte film 2261 according to the present invention. Some examples of these systems are shown in FIGS. 28A-29B.

  In the system of FIG. 28A, the thermal control surface 2815 is connected to a heat source 2825 that connects the temperature of the surface 2815. The substrate 2809 is in thermal contact with the surface 2815 for controlling the temperature of the substrate when required for a particular deposition process on a particular substrate. In one embodiment, the heat source is a coolant source, for example, a cryogenic vacuum pump that releases compressed helium toward the surface 2815 to cool it. The use of a thermally controlled surface 2815 that is in direct contact with the substrate 2809, especially when the direct contact aligns with or coincides with the film's formation position, reduces the normal solid-state thin film battery assembly process. Allows the use of a substrate with a lower deposition temperature than is possible with use.

  FIG. 28B shows another block diagram diagram of system 2800. In this drawing, the vacuum chamber 2807 has a supply reel 2810 that supplies a number of substrates 2809 for attachment of the adhesive layer to be peeled and applied supplied from the supply reel 2827. The substrate is fed onto an arcuate hot surface 2815 and wound up by a number of end rolls 2813.

  In one embodiment, supply reel 2810 holds strips of different materials. In another embodiment, supply reel 2810 holds one component wide strip. Having multiple supply reels not only allows multiple different component designs to be loaded and processed simultaneously, but also allows the material tension and speed of each reel substrate to be individually controlled.

  In another embodiment, a thermal control surface 2815 and a heat source 2825 are provided in the drum, which controls the movement speed of the substrate under the deposition station 2811 and the assist source 2817. One advantage of using multiple strips, each with component width, is that it alleviates the problem of uneven tension distributed across the drum that is sometimes seen using multiple strips with multiple components It is to be. In the process involving the design of several different components, all components must pass through the drum at the same speed. Thus, otherwise, multiple component designs will apply the same layer and layer thickness to them.

  In another embodiment, multiple substrates 2809 are run at different speeds in front of the deposition station 2811 and assist source 2817, thus allowing different thickness layers to be applied to different strips. . In one embodiment, different speeds are achieved by providing a plurality of drums for controlling the speed of the substrate strip.

FIG. 29A shows another system 2900 for creating an RFID device.
The system 2900 includes one or more supply reels 2910 that supply one or more source substrates 2909, one or more deposition stations 2911 that deposit layers on one or more substrates, and one or more assist sources 2917. One or more supply reels 2927 for supplying one or more masks 2933 to one or more substrates for mounting; one or more end reels for winding the mask 2933 after deposition; Vacuum chamber 2907 including one or more end reels 2913, supply reels 2910, 2927, end reels 2930, 2913, deposition reel 2911 and assist source 2917 for winding the formed device after being fed onto surface 2915 including.

  FIG. 29B shows another view of the system 2900. Multiple supply reels 2927 that hold many masks 2933 allow multiple components to be deposited on multiple substrates 2909 in one system 2900. By using a reel-to-reel mask, the mask used at each station can be easily changed. For example, if four deposition stations are provided, a first set of four masks (each determining its own deposition pattern for each corresponding station) is used at the first time. The mask reel is then moved and a second set of four masks is used. This allows the mask pattern to be changed because different devices are fabricated without opening the deposition chamber. It also allows for mask replacement when the mask is worn away (eg, by deposited material that accumulates on the mask or by ion etching away from the mask).

  Another embodiment of the system combines the system shown in FIGS. 28 and 29 into one system with supply reels 2827, 2927 to apply both adhesive and mask layers to the source substrate 2909. To do.

  One aspect of the invention provides a radio frequency identification (RFID) device having a thin film battery. A system 2100 as shown in FIGS. 21A-21F includes a RFID device 2170 in communication with a remote radio frequency (RF) transmitter and / or a receiver 2160. In one embodiment, the RFID device 2170 of the system 2100 includes a flexible substrate 2110, a thin film battery 2120 deposited on the flexible substrate 2110, an electronic circuit disposed on the battery 212045 and coupled to the battery 2120 for powering. 2130 and a radio frequency (RF) antenna 2140 connected to electronic circuit 2130. In another implementation, the battery 2120 of the RFID device 2170 is a secondary battery, and the battery 2120 is recharged when energy is transferred from the remote device 2160. In another embodiment, the RFID device includes an RF activated switch.

  An embodiment of an RFID device 2170 that includes an RF-activated switch is shown in FIG. 22A. RF energy is received at antenna 2240 and activates an RF-activated switch 2250 that places thin film battery 2220 in communication with electronic circuit 2230. In another embodiment, RF activated switch 2250 activates electronic circuit 2230 from a low power sleep mode.

  Another embodiment of the invention provides a method 2500 as shown in FIG. 25A. The method 2500 includes a flexible RFID device 2100 that includes a multi-bit identifier value and a thin film battery deposited on a flexible substrate (2510), and pressure attaches the RFID device 2100 to the article. (2520), receiving the RF energy at the RFID device (2530), and coupling the battery power to the RFID device 2170 (2540) to activate the circuit based on the reception of the RF energy, the activation includes A task is initiated (2550), including transmitting an identifier (ID) value in the RFID device 2170 based on an identifier of the multimedia bit of the RFID device 2170. In another embodiment, as shown in FIG. 25B, the task stores the start time to start on the RFID device 2170 (2551). In another embodiment, as shown in FIG. 25C, the task performs a self-check with 2552 RFID device 2170 (2170) and stores the result of the self-check (2553). In a further embodiment of the method as shown in FIG. 25D, RFID device 2170 receives an interrogation code from remote RF transmitter device 2160 (2554) and performs analysis of the interrogation code (2555), and the interrogation. Based on the analysis of the code, the ID value is transmitted to the remote RF receiver 2160 (2556). In another embodiment, receiving an interrogation code from a remote device causes the RFID device 2170 to store a time stamp for the event (2557). In another embodiment, as shown in FIG. 25E, RFID device 2170 stores a first time stamp to mark a shipping event (2557) and a second time to mark a receiving event. The time stamps are stored (2557), and the stored time stamps are compared (2559) to determine the duration of the event related to the shipment.

  Another method, as shown in FIG. 26A, includes forming RFID device 2170. One embodiment of the method 2600 includes a flexible substrate (2610), deposits an anode, a cathode, and an electrolyte that separates the anode and cathode into an electric hand, a wiring layer (2630), and places the battery on the battery. Placing (2640) the electronic circuit connected to the substrate, depositing a pressure sensitive adhesive (2650), and covering the RFID device to allow for stripping and application applications. One embodiment includes an RFID device element that includes (i) a cover, (ii) an electronic circuit, (iii) a wiring layer, (iv) a battery, (v) a substrate, and (vi) a pressure sensitive adhesive layer. Including placing. Other embodiments employ different orders or positions of layers or circuits. In another implementation, the method 2600 includes forming a printed label on an RFID device (2670). In another embodiment, as shown in FIG. 26B, the battery is deposited on the substrate using energy between approximately 50 eV and approximately 95 eV (2620). In another embodiment, the battery is deposited on the substrate using energy between approximately 70 eV and approximately 90 eV. In another embodiment, the battery is deposited on a rechargeable battery.

  Another aspect of the present invention provides a flexible battery-powered device for stripping and application. An embodiment of an apparatus 2170 as shown in FIGS. 21A-21F includes a flexible substrate 2110, a thin film battery 2120 deposited on the flexible substrate 2110, and a battery 2120 to provide power to the electronic circuit 2130. And an electronic circuit 2130 coupled to the battery 2120, a radio frequency (RF) antenna 2140 coupled to the electronic circuit 2130, and an adhesive 2150 applied to the flexible substrate 2110. In another embodiment of the device, electronic circuit 2130 includes an RF enabled switch that electrically drives. In another embodiment, the RF enabled switch is a MEMS device. In another embodiment, the device RF antenna 2140 is integrated into the substrate 2110. In another embodiment, the device battery 2120 is a secondary battery. One aspect of forming an RFID device as shown in FIG. 27 includes a roll release layer 2710 on which a number of RFID devices 2770 are releasably secured.

  Another embodiment of the present invention as shown in FIG. 28A provides a system for fabricating an RFID device. The system includes one or more supply reels 2810 that supply one or more source substrates 2809, one or more supply reels 2810 that supply one or more electronic circuits and RF antennas, and layers on one or more substrates. One or more deposition stations for depositing, a supply reel 2827 for supplying adhesive material to be peeled and affixed for attachment to a substrate with a heat source 2825, and a vacuum chamber 2807 including a supply reel 2810 and a deposition station 2811 Prepare. The layers deposited in the system include a battery forming layer and a wiring layer for coupling the electronic circuit layer and the battery and for coupling the electronic circuit and the RF antenna. The layers deposited to form the battery include (a) a cathode, (b) an electrolyte layer, and (c) an anode layer.

Some implementations are
Vacuum chamber,
A first source reel and a first take-up reel that supply a first strip of substrate material, and a second source reel and a second turn that supply a strip of a first mask having a number of different masks Multiple pairs of source and take-up reels in a vacuum chamber, including take-up reels,
Determined by a first mask strip running between the second source reel and the second take-up reel on the substrate of the first strip running between the first source reel and the first take-up reel. A first deposition station configured to deposit material, and
To drive the substrate of the first strip between the first source reel and the first take-up reel at a first independent speed and tension, and the second source reel and the second take-up reel A system is provided that includes an operably coupled controller for driving a mask strip to and from a reel.

  Some implementations further include a third source reel that supplies a second strip of substrate material and a third take-up reel. The controller is coupled to drive the substrate of the second strip between a third source reel and a third take-up reel at a second independent speed and tension.

  In some implementations, the first mask strip comprises masking both the first and second substrate strips.

Some embodiment is
A fourth source reel and a fourth take-up reel for supplying a second mask having a number of different masks;
Determined by the second mask strip running between the fourth source reel and the fourth take-up reel on the substrate of the second strip running between the third source reel and the third take-up reel And further comprising a second deposition station configured to deposit material, wherein the controller moves the substrate of the second strip at a speed and tension based on a second independent speed and tension. Operatively coupled for running.

  In some implementations, the controller is operably coupled to cause the second mask strip to travel at a speed and tension based on a second independent speed and tension.

Other embodiments are:
Supplying the substrate material of the first strip through the deposition station;
Moving the first mask strip through the deposition station;
Depositing a first layer of material from a deposition station on a first substrate material in a pattern determined in a first area of the first mask strip, and a second area of the first mask strip; And depositing a second layer of material from the deposition station on the first substrate material in a pattern determined in.

Some implementations of this method are further
Supplying a second strip of substrate material through the deposition station;
Moving the second mask strip through the deposition station,
Depositing a first layer of material from a deposition station on a second substrate material in a pattern determined in a first area of the second mask strip, and a second area of the second mask strip; Depositing a second layer of material from the deposition station on the second substrate material in a pattern determined in.

  In some embodiments, the substrate material of the first and second strips moves at different speeds.

  In some embodiments, the substrate material of the first and second strips moves with different tensions.

  Some implementations of this method further include depositing an adhesive and a release layer on the substrate.

  Some implementations of this method further include depositing a pressure sensitive adhesive layer on the substrate.

Yet another embodiment is
Give a flexible substrate,
Depositing a battery comprising depositing an anode, a cathode, and an electrolyte separating each anode and cathode, each determined by a different mask area on the mask strip;
Deposit wiring layers,
Placing electronic circuits on the deposited layer,
Depositing a pressure sensitive adhesive to allow for stripping and application, and covering the device;
The electronic circuit provides a system operatively coupled to the battery by a wiring layer.

  In some implementations, the order of the layers of the elements of the RFID device is the order of cover, electronic circuit, wiring layer, battery, substrate, and pressure sensitive adhesive layer.

  Some implementations of this method further include forming a printed label on the device.

  In some embodiments, depositing the battery on a flexible substrate includes using an energy of approximately 50 eV to approximately 95 eV.

  In some embodiments, depositing the battery on a flexible substrate includes using an energy of about 70 eV to about 90 eV.

  In some embodiments, the battery deposited on the flexible substrate is a secondary battery.

  Another aspect of the invention includes multiple layers in which a plurality of layers are held together as a single package, the layers being operatively coupled to a flexible substrate, an electronic circuit, and an electronic circuit for powering. A thin film battery and a radio frequency (RF) antenna operably coupled to the electronic circuit.

  In some embodiments, the electronic circuit includes an RF enabled switch that electrically activates the electronic circuit.

  In some embodiments, the RF enabled switch is a MEMS device.

  In some embodiments, the layer can be a layer that is peeled off and adhered by a pressure sensitive adhesive layer, a flexible substrate, a thin film battery deposited on a thin film substrate, an RF deposited on a previous layer. Stacked in the order covered by an electronic circuit including a wiring layer including an antenna and an RF enable switch deposited on the wiring layer.

  In some of these embodiments, the RF antenna is integrated into the substrate.

  In some of these embodiments, the battery is a secondary battery.

  In some embodiments, the present invention includes an open layer of rolls that are releasably mounted on any of the numerous devices described above.

  In some embodiments, the adhesive layer is a pressure sensitive adhesive layer and is covered by an open layer that can be peeled off.

  In some embodiments, the layers are stacked in order from the group consisting of an adhesive layer, a substrate layer, a battery layer, an electronic circuit layer, and an RF antenna layer.

  In some embodiments, the layers are stacked in order from a group consisting of a substrate layer, a battery layer, an electronic circuit, and an RF antenna layer.

  In some embodiments, the layers are stacked in the order of a substrate layer, a) a battery, b) a layer containing an electronic circuit and c) an RF antenna, and an adhesive layer.

Other embodiments include a system for fabricating an RFID device, the system comprising:
One or more supply reels that feed one or more source substrates;
One or more supply reels that feed one or more electronic circuits and RF antennas;
One or more deposition stations for depositing layers on one or more substrates;
Including
The layers include a layer for forming a solid state lithium-based battery, a cathode layer, an electrolyte anode layer, a wiring layer for coupling the battery to the electronic circuit layer, and a RF antenna to the electronic circuit layer; It includes a movable mask strip with a number of different masks used for different deposition operations, a supply reel that supplies an adhesive layer to be peeled and applied, and a vacuum chamber that includes a supply reel and a deposition station.

  Some embodiments of the present invention provide a thin film battery and a start-up active switch. An exemplary system includes a substrate, a circuit connected to the substrate, and a thin film battery connected to the substrate and the circuit. A thin film battery powers the circuit. An acceleration enabled switch is also connected to the substrate to electrically activate the circuit. In some implementations, the acceleration enabled switch is a MEMS device. In some embodiments, the acceleration enabled switch includes at least one cantilever beam. In one embodiment, the acceleration-enabled switch includes at least one cantilever beam and electrical contact. At least one cantilever beam contacts the electrical contact in response to acceleration. In one embodiment, the acceleration enabled switch includes a first cantilever beam closed switch and a second cantilever beam closed switch. The closed switch of the first cantilever beam forms an electrical contact in response to the first acceleration, and the closed switch of the second cantilever beam forms an electrical contact in response to the second acceleration. To do. This first acceleration is different from the second acceleration. In another embodiment, the acceleration-enabled switch forms a first electrical contact in response to the first acceleration and a value in response to the second acceleration is a second electrical value. A good contact. One cantilever beam closed switch makes electrical contact in response to the first acceleration, and the second cantilever beam closed switch makes electrical contact in response to the second acceleration. . The first acceleration is different from the second acceleration. In yet another embodiment, the switch enabled at the first acceleration activates the circuit differently in response to acceleration at two different planes. The closed switch of the first cantilever beam forms an electrical contact in response to the first acceleration at the first surface, and the closed switch of the second cantilever beam is the second switch at the second surface. An electrical contact is formed in response to the acceleration of one.

  In some implementations, the circuit further includes a memory and a timer. The timer remembers when one of the first cantilever beam closing switches makes an electrical contact in response to the first acceleration, or the second cantilever beam closing switch responds to the second acceleration. The time when the electrical contact is formed is stored in the memory. In some implementations, the time when the other one of the first cantilever beam closing switches forms a narrative contact in response to the first acceleration, or the other of the second cantilever beam closing switches is The time when the narrative contact was formed in response to the second acceleration is stored in the memory.

  In some embodiments, the battery is sputtered on the substrate and the circuit is formed on the battery. In another embodiment, the circuit is sputtered on the substrate and the battery is sputtered on the circuit. In yet another embodiment, the system is adapted in a device such as a package or a statute. In yet another embodiment, the adhesive layer was attached to the substrate where the system was adhesively attached to the device. The adhesive layer was attached to the substrate.

  Some embodiments include a system that includes a substrate, a film located on the substrate and a thin film battery. The thin film battery further includes a first lead, a first electrical contact in electrical communication with the first lead, and a second electrical contact in electrical communication with the second lead. The system also includes an actuating action connected to one of the first and second leads on the substrate to electrically connect the thin film battery to the first electrical contact and the second electrical contact. Includes switch. The adhesive layer is attached to the substrate. The activation action switch is activated in response to the acceleration. In some embodiments, the activation switch is activated in response to the magnetic field. In some embodiments, the activation switch is activated in response to moisture. In yet another embodiment, the activation switch is activated in response to the radio frequency. In yet another embodiment, the activation switch is activated in response to the pressure. In yet another embodiment, the activation switch is activated in response to light. The system also includes electronics attached to the first lead and the second lead. The electronics are also related to the substrate. In some embodiments, the electronics are attached to the substrate and a thin film battery is attached to the electronics. In another embodiment, the thin film battery is attached to the substrate and at least a portion of the electronics is attached to the thin film battery. The activation switch is formed using microelectronic fabrication techniques. Some implementations include a method for bringing a thin film battery into communication with a set of electronics and directing legislation using powered electronics. Another method is to activate the activation action switch to bring the thin film battery into communication with a set of electronics and store the start time by using powered electronics for warranty. Including that. In some embodiments, the activation switch includes accelerating the activation switch at a selected level. In another embodiment, the method includes performing a self-check and storing the result of the self-check in response to activating the activation action switch. In other implementations, other accelerations are stored. Also, the time associated with other accelerations above the selected threshold is recorded. Other acceleration times to that time are compared for other periods, such as when the shipper has an activation switch.

  A system that includes one or more batteries, a battery, or a device for enabling or starting multiple batteries and circuits, can be formed on a film and can be installed in a small package or product. In addition, the battery, activation device, and circuitry can be formed on a flexible sheet having an adhesive layer thereon so that the package is essentially external to the package or along with the product package. Or a label that can be placed on a product or device. A complete system can also be incorporated into a product or device to control aspects of the device or to record information about the product or device. Enabling or activating the device allows the switch to respond to events or later events. The system does not need to be moved manually. Rather, the system automatically moves in response to events.

  In some embodiments, the entire system is inexpensive. As a result, manufacturers, wholesalers, and event retailers can provide systems that are attached to a device or as part of a package associated with many devices or products. Furthermore, these systems are light and provide enough energy storage to achieve at least one function. Because the system is made from non-toxic substances, there is no danger in the product or equipment.

  It will be understood that the above description is intended to be illustrative and not limiting. While many features and advantages of various embodiments have been described, as well as various structures and functions of various embodiments, other implementations and modifications will occur to those skilled in the art upon reading the above description. It will be obvious if there is any. The scope of the invention is, therefore, determined with reference to the appended claims.

Cross-sectional view of an energy storage device according to the present invention Cross-sectional view of another embodiment of an energy storage device according to the present invention Cross-sectional view of an energy storage device according to the present invention Cross-sectional view of energy storage device and supercapacitor according to this invention A flowchart illustrating one embodiment of an assembly process in accordance with the teachings of the present invention. A flowchart illustrating one embodiment of an assembly process in accordance with the teachings of the present invention. A flowchart illustrating one embodiment of an assembly process in accordance with the teachings of the present invention. Apparatus diagram for assembling a thin film battery in accordance with the teachings of the present invention. Apparatus diagram for assembling a thin film battery in accordance with the teachings of the present invention. FIG. 5 is an illustration of another embodiment of an apparatus for assembling a thin film battery in accordance with the teachings of the present invention. FIG. 5 is an illustration of another embodiment of an apparatus for assembling a thin film battery in accordance with the teachings of the present invention. FIG. 5 is an illustration of another embodiment of an apparatus for assembling a thin film battery in accordance with the teachings of the present invention. FIG. 5 is an illustration of another embodiment of an apparatus for assembling a thin film battery in accordance with the teachings of the present invention. FIG. 5 is an illustration of another embodiment of an apparatus for assembling a thin film battery in accordance with the teachings of the present invention. Top view of example start-up board with integrated battery and device sharing common terminal Plan view of the substrate of FIG. 8A after deposition of a device sharing an integrated battery and common terminal. 8B is a plan view of the substrate of FIG. 8B after assembly and assembly of individually assembled chips connected to a device that shares an integrated battery and common terminal. Plan view of the substrate of FIG. 8C after the loop antenna is placed and assembled. Top view of the substrate of FIG. 8D after the top encapsulation layer has been deposited 8A is a front view of the start-up board in FIG. 8A. 8B is a front view of the partially assembled device of FIG. 8B. FIG. 8C is a front view of the partially assembled device. Front view of the partially assembled device of FIG. 8D Front view of the apparatus of FIG. 8E Perspective view of the device of FIG. 8E at the magnetic recharge pole. Perspective view of the device of FIG. 8E at the optical recharge pole Perspective view of the device of FIG. 8E at the radio wave recharge pole. 1 shows a schematic diagram of a system including a battery, a circuit, and a function activation switch, where the function activation switch is in an open position. 1 shows a schematic diagram of a system including a battery, a circuit, and a function activation switch, where the function activation switch is in a closed position. 1 shows a schematic diagram of a system including a battery, a circuit, and a function activation switch, where the function activation switch is in an open position, and the circuit includes a memory portion and a timing portion. 1 shows a schematic diagram of a system including a battery, a circuit, and a function activation switch, the function activation switch in an open position, and the circuit includes a memory portion, a timing portion, and a processor portion. 10 is a flowchart illustrating a method of operation of the system shown in FIGS. A schematic diagram of a system with a battery and a start-up switch is shown. Fig. 2 shows a plan view of a system having a switch according to one embodiment of the starting action. FIG. 12B shows a side view of the system with the switch of the activation action 1 embodiment of FIG. 12A. Fig. 5 shows a switch of another embodiment of activation action including a part for detecting X, Y and Z-axis accelerations. Fig. 4 shows an example of a label that includes a system with an activation switch. Fig. 5 illustrates another embodiment of a label that includes a system with an activation switch. Indicates a standard that includes a system with an activation switch. FIG. 2 shows a plan view of one embodiment of a start-up switch activated by a magnetic field. FIG. 16B shows a side view of one embodiment of the activation switch shown in FIG. 16A. 1 shows an embodiment of a pressure detection activation switch. 1 shows one embodiment of a moisture detection activation switch. 1 illustrates one embodiment of an RF activated switch. 3 shows another embodiment of the activation switch. It is a perspective view of a wireless tag system. FIG. 6 is a perspective view of another embodiment of a radio frequency identification device (RFID). FIG. 6 is a perspective view of another embodiment of RFID. FIG. 6 is a perspective view of another embodiment of RFID. FIG. 6 is a perspective view of another embodiment of RFID. It is a figure of the cross section of one Example of the adhesion layer in a flexible substrate. 1 is a cross-sectional view of one embodiment of a battery formed on a flexible substrate. 1 shows a schematic diagram of an RFID device. FIG. 3 shows a schematic diagram of another embodiment of an RFID device. 1 shows an example of a shipping label using an RFID device. 1 shows an example of a product label using an RFID device. 2 shows a flowchart of a method of using an RFID device. 6 shows a flowchart of another embodiment of a method of using an RFID device. 6 shows a flowchart of another embodiment of a method of using an RFID device. 6 shows a flowchart of another embodiment of a method of using an RFID device. 6 shows a flowchart of another embodiment of a method of using an RFID device. 2 shows a flowchart of a method of forming an RFID device. 6 shows a flowchart of another embodiment of a method of forming an RFID device. FIG. 2 is an illustration of one embodiment of forming an RFID device that includes a roll release layer. FIG. 2 shows a cross-sectional view of a system for forming an RFID device. FIG. 28B shows a cross-sectional view of a system for forming the RFID device of FIG. 28A. 1 shows a cross-sectional view of one embodiment of a system for forming an RFID device. FIG. 29B shows a cross-sectional view of a system for forming the RFID device of FIG. 29A.

Explanation of symbols

50: Energy storage device
55: Board
56: Adhesive layer
57: Contact film
58: Lead
59: Electrode film
61: Electrolyte film
63: Electrode film
311: First source
313: Second source

Claims (63)

A substrate,
A circuit connected to the substrate;
A thin film battery connected to the substrate and connected to the circuit and supplying power to the circuit; and an acceleration enabled connected to the substrate to electrically activate the circuit A system with a switch.   The system of claim 1, wherein the acceleration enabled switch is a MEMS device.   The system of claim 2, wherein the acceleration enabled switch is a beam of at least one cantilever.   The system of claim 2, wherein the acceleration enabled switch comprises at least one cantilever beam and an electrical contact, wherein the at least one cantilever beam contacts the electrical contact in response to acceleration.   3. The system of claim 2, wherein the acceleration enabled switches include a first cantilever beam closing switch and a second cantilever beam closing switch.   The first cantilever beam closing switch makes electrical contact in response to the first acceleration, and the second cantilever beam closing switch is in electrical contact in response to the second acceleration. 6. The system of claim 5, wherein the first acceleration and the second acceleration are different.   The acceleration-enabled switch makes a first electrical contact in response to the first acceleration and makes a second electrical contact in response to the second acceleration, the first acceleration The system of claim 2, wherein the second acceleration is different from the second acceleration.   The system of claim 2, wherein the switch enabled at the first acceleration activates the circuit differently in response to one acceleration on two different planes. The first cantilever beam closing switch forms an electrical contact in response to the first acceleration at the first surface, and the second cantilever beam closing switch is at the second surface. The system of claim 8, wherein the electrical contact is made in response to the second acceleration of.   And a memory and a timer, wherein the time when the first cantilever beam closing switch forms an electrical contact in response to the first acceleration, or the second cantilever beam closing switch is a second The system of claim 6, wherein the time when the electrical contact is formed in response to the acceleration is stored in a memory.   The time when the other of the first cantilever beam closing switch is in electrical contact in response to the first acceleration, or the second cantilever beam closing switch is responsive to the second acceleration. 11. The system according to claim 10, wherein the time when the electrical contact is formed is stored in the memory.   The system of claim 1, wherein the battery is sputtered on the substrate.   The system of claim 12, wherein the circuit is formed on a battery.   The system of claim 1, wherein the circuit is sputtered on the substrate.   The system of claim 14, wherein the battery is sputtered on the circuit.   The system of claim 14, wherein the system is applied in an apparatus.   The system of claim 16, wherein the device is a package.   The system of claim 16, wherein the device is statutory.   The system of claim 2, further comprising an adhesive layer attached to the substrate at a location where the system is adhesively attached to the apparatus.   The system of claim 2, further comprising an adhesive layer attached to the substrate. A system comprising a substrate and a thin film battery located on the substrate;
The thin film battery further includes
The first lead,
A first electrical contact in electrical communication with the first lead;
A second lead,
A second electrical contact in electrical communication with the second lead; and
A system including an activation switch connected to the first and second leads on the substrate to electrically connect the thin film battery to the first electrical contact and the second electrical contact.   The system of claim 21, further comprising an adhesive layer attached to the substrate.   The system of claim 21, wherein the activation switch is activated in response to acceleration.   The system of claim 21, wherein the activation switch is activated in response to a magnetic field.   The system of claim 21, wherein the activation switch is activated in response to moisture.   The system of claim 21, wherein the activation switch is activated in response to radio frequency.   The system of claim 21, wherein the activation switch is activated in response to pressure.   The system of claim 21, wherein the activation switch is activated in response to light.   The system of claim 21, wherein electronics are attached to the first lead and the second lead, the electronics being also associated with the substrate.   30. The system of claim 29, wherein the electronics are attached to the substrate and the thin film battery is attached to the electronics.   30. The system of claim 29, wherein the thin film battery is attached to the substrate, and at least a portion of the electronics is attached to the thin film battery.   The system of claim 21, further wherein the activation switch is formed using microelectronic assembly techniques. To activate the thin film battery to communicate with a set of electronics, activate the activation switch,
A method comprising complying with laws and regulations using powered electronics. To activate the thin film battery to communicate with a set of electronics, activate the activation switch,
A method comprising storing a start time for warranty using powered electronics.   35. The method of claim 34, wherein activating the activation action switch includes accelerating the activation action switch at a selected level. 35. The method of claim 34, wherein performing the self check and storing the result of the self check in response to activation of the activation action switch.   35. The method of claim 34, further comprising storing other accelerations.   35. The method of claim 34, further comprising storing times related to other accelerations that exceed a selected threshold.   39. The method of claim 38, further comprising comparing the time of the other acceleration to the time when the shipper owns the activation switch. A vacuum chamber;
A first source reel and a first take-up reel that supply substrate material for the first strip, and a second source reel and a second take-up reel that supply a first mask strip having a plurality of different masks A plurality of pairs of sources and take-up reels in the vacuum chamber comprising:
A first mask that runs between the second source reel and the second take-up reel with material on the substrate of the first strip that runs between the first source reel and the first take-up reel. A first independent station configured to deposit, as defined by the strip, and a first independent speed of the substrate of the first strip between the first source reel and the first take-up reel; And a controller coupled to run in tension and to run the mask strip between the second source reel and the second take-up reel. A third source reel for supplying a second strip of substrate material and a third take-up reel;
41. The system of claim 40, wherein the controller couples a second strip of substrates between a third source reel and a third take-up reel to run at a second independent speed and tension. Supplying the substrate material of the first strip through the deposition station;
Moving the first mask strip through the deposition station;
A first layer of material from a deposition station is deposited on the first substrate in a pattern determined in a first area of the first mask strip, and in a second area of the first mask strip. Depositing a second layer of material from the deposition station on the first substrate in a determined pattern. Supplying a second strip of substrate material through a deposition station;
Supplying a second strip of substrate through the deposition station;
Depositing a first layer of material from a deposition station on a second substrate material in a pattern determined by a first area of a second mask strip; and
43. The method of claim 42, further comprising depositing a second layer of material from the deposition station on the second substrate material in a pattern determined by the second area of the second mask strip. A method for forming the device,
Give a flexible substrate,
Depositing the battery with anode, cathode and electrodes separating anode and cathode by different mask areas on the strip of mask,
Deposit wiring layers,
Placing electronic circuits on the deposited layer,
To deposit a pressure-sensitive adhesive layer and cover the RFID device to allow stripping and pasting applications,
The electronic circuit is operatively connected by a wiring layer. As the layer order of the elements of RFID devices,
(i) Cover
(ii) electronic circuits,
(iii) wiring layer,
(iv) battery,
(v) the board, and
45. The method of claim 44, comprising (vi) a pressure sensitive adhesive layer. It is a flexible battery-operated device that is peeled off and pasted.
Multiple layers, held together as a single package
Flexible substrate,
Electronic circuit,
A thin film battery, operably coupled to an electronic circuit to supply power
An apparatus comprising a radio frequency (RF) antenna operably coupled to an electronic circuit 2130, and an adhesive layer.   47. The apparatus of claim 46, wherein the electronic circuit includes an RF enabled switch that electrically activates the electronic circuit. It is a system for manufacturing RFID devices,

One or more supply reels for supplying one or more source substrates;
One or more supply reels supplying one or more electronic circuits and an RF antenna;
One or more deposition stations for depositing layers on one or more substrates,
The layer is
(i) including a layer for forming a solid state lithium-based battery, the layer of the battery comprising:
a) a cathode layer;
b) an electrolyte layer;
c) an anode layer,
(ii) a wiring layer for coupling the battery to the electronic circuit layer and for coupling the RF antenna to the electronic circuit;
A movable mask strip having a plurality of different masks used for different deposition operations;
A system comprising a supply reel that supplies an adhesive layer to be peeled off and a vacuum chamber including a supply reel and a deposition station. A deposition chamber comprising a plurality of pairs of source and take-up reels, including a first source reel and a first take-up reel, and a second source reel and a second take-up reel in a vacuum chamber;
A material is deposited on the substrate of the first strip that runs between the first source reel and the first take-up reel and is run between the second source reel and the second take-up reel. A deposition station configured to deposit material on a second strip substrate, and a first independent substrate between the first source reel and the first take-up reel. Coupled to move the second strip substrate at a second independent speed and tension between the second source reel and the second take-up reel. System with a controller.   A plurality of movable mask strips, each mask strip associated with one of a plurality of source reels and take-up reels, each mask strip including a number of mask areas, 50. The system of claim 49, wherein the pattern to be deposited on the substrate of the strip is determined. Moving the plurality of substrate strips through the deposition station at independent movement speeds and depositing material in a layer over each of the substrate strips. Further comprising moving a plurality of movable mask strips through the deposition station;
52. The method of claim 51, wherein each mask strip is associated with one of a plurality of substrate strips, and each mask area determines a pattern that controls a deposition operation. A deposition chamber comprising means for moving strips of a plurality of substrates through the deposition station at independent movement speeds;
A deposition station for depositing material in layers on each substrate strip.   A plurality of movable mask strips, each mask strip associated with one of a plurality of source reels and take-up reels, each mask strip including a number of mask areas, 50. The system of claim 49, wherein the pattern to be deposited on the substrate of the strip is determined. A radio frequency identification (RFID) device for communicating with a remote radio frequency (RF) transmitter and / or receiver;
The RFID device is
A flexible substrate,
A pressure-sensitive adhesive layer for connecting the RFID device to the surface;
A thin film battery deposited on a flexible substrate;
An electronic circuit disposed on and coupled to the battery;
With a radio frequency (RF) antenna connected to an electronic circuit,
A system in which the battery is operably coupled to an electronic circuit for powering.   56. The system of claim 55, wherein the battery is a secondary battery, and the battery is charged when energy transmitted from a remote device is transmitted through an RF antenna and electronic circuitry. Supply a flexible RFID device to strip and paste, including multi-bit identifier value and thin film battery deposited on flexible substrate,
RFID devices are pressure-attached to articles,
Receiving the RF energy at the RFID device and activating the circuit and initiating a task within the RFID, including coupling battery power to the RFID device based on receiving the RF energy;
The task includes sending an identifier (ID) value based on the multi-bit identifier of the RFID.   58. The method of claim 57, wherein the task includes storing a start time for activation of the RFID device. A method of forming an RFID device 0,
Equipped with a flexible substrate,
An anode, a cathode, and an electrolyte that electrically separates the anode and the cathode;
Deposit wiring layers,
Place the electronic circuit connected to the battery on the battery,
Deposit pressure sensitive adhesive, and allow application to strip and paste, and
A method comprising covering an RFID device. The alignment of the layers of the RFID device elements is
cover,
Electronic circuit,
Wiring layer,
battery,
60. The method of claim 59, comprising a substrate and a pressure sensitive adhesive. Flexible substrate,
Electronic circuit,
A thin film battery that is operatively coupled to the electronic circuit to supply power,
A flexible, battery-powered device that includes a radio frequency (RF) antenna 2140 operably coupled to an electronic circuit 2130 and an adhesive.   62. The apparatus of claim 61, wherein the electronic circuit includes an RF enable switch that electrically activates the electronic circuit. RFID system making system
One or more supply reels providing one or more source substrates;
One or more supply reels providing one or more electronic circuits and an RF antenna;
Comprising one or more deposition stations for depositing layers on one or more substrates;
The layer is
(iii) includes a layer for forming a solid-state lithium-based battery;
The battery layer is
a) a cathode layer;
b) an electrolyte layer;
c) an anode layer;
(iv) a supply reel for coupling the battery to the layers of the electronic circuit and for coupling the RF antenna to the electronic circuit, a supply reel for supplying the adhesive layer to be peeled off, and a supply reel and And a vacuum chamber containing a deposition station.

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