JP2006294720A - Camera module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a camera module which is reduced in size, also reduced in the number of manufacturing processes, and thereby reduced in cost. <P>SOLUTION: The camera module 100 includes: an image sensor chip 102 for converting incident light into image signals; and a lens substrate 101 having a lens 101a for condensing the incident light on the image sensor chip 102. The lens substrate 101 includes: image sensor bumps 105 electrically connected to electrodes 102b on the image sensor chip 102, and protrusions which protrude from the holding plane of the image sensor chip 102 beyond the image sensor chip 102 which is held by the lens substrate 101. The image sensor chip 102 and a mother board 200 are electrically connected by a conductive interconnection layer 103 for connecting the image sensor bumps 105 and mother board bumps 106 formed in the protruding portions. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a camera module, and more particularly to a camera module having an image sensor chip.

  With the increase in functionality of portable electronic devices such as mobile phone terminals and PDAs (Personal Digital Assistance), camera functions have been installed. Such a camera function is realized by mounting a camera module on a portable electronic device. However, in order to improve portability, further miniaturization of the camera module is desired.

  FIG. 6 is a cross-sectional view showing the structure of a conventional camera module. As shown in FIG. 6, the conventional camera module includes a lens 1, a lens barrel 2 having an opening on the optical axis of the lens 1, a lens barrel 3, an IRCF (infrared cut filter) 4, and an image sensor chip. 5, a wire 6, an interposer 7, an FPC (Flexible Printed Circuit) 8, and a socket 9. By joining the socket 9 of the camera module and the socket 9 on the mother board 10, the camera module and the mother board 10 are electrically and mechanically connected. The lens 1 has a first lens 1a and a second lens 1b, is held by a lens barrel 2, and the lens barrel 2 is provided to be movable up and down. The image sensor chip 5 includes a light receiving portion 5a and an electrode portion 5b.

  The light beam incident from the lens 1 enters the light receiving portion 5a of the image sensor chip 5 through the IRCF 4. The light receiving unit 5a generates a video signal according to the received light. The video signal is output from the electrode portion 5 b of the image sensor chip 5 to the FPC 8 via the wire 6 and the interposer 7. The FPC 8 outputs the input video signal to the motherboard 10 via the socket 9. A camera module having such a configuration is described in Patent Document 1, for example.

  In the camera module having the configuration shown in FIG. 6, since the image sensor chip 5 and the interposer 7 are connected by the wire 6, a space for arranging the wire 6 is required inside the lens barrel 3, and the size can be reduced. Hinder. In addition, the production process is complicated and the cost is increased. Furthermore, since errors may occur in the shapes of the lens 1 and the lens barrel 3 and the mounting position of the image sensor chip 5, the focus adjustment of the lens 1 is necessary, which reduces productivity.

In order to solve such a problem, Patent Document 2 proposes a configuration in which wiring is formed on a transparent substrate having a lens portion, and the image sensor chip and the wiring are connected by bumps. FIG. 7 shows the configuration disclosed in Patent Document 2. As shown in FIG. 7, the wiring part 12 is formed on one side of the transparent substrate 11 on which the lens part 11a is formed. The terminals of the wiring part 12 and the image sensor chip 5 are electrically connected via the bumps 13.
JP 2003-230028 A JP 2003-125294 A

  Patent Document 2 does not disclose anything about the connection between the wiring portion and the mother board. Assume that the image sensor chip is mounted on the interposer as in the configuration shown in FIG. In this case, since the image sensor is disposed between the interposer and the transparent substrate, the upper surface of the interposer and the wiring portion of the transparent substrate are separated from each other by at least the thickness of the image sensor chip. become. Therefore, it is difficult to connect the interposer and the wiring part that are separated from each other. In addition, connection using an interposer, FPC, or socket is not suitable for automatic mounting, and hinders improvement in productivity.

  The present invention has been made to solve such a problem, and an object of the present invention is to provide a camera module capable of reducing the number of production steps and reducing the cost while achieving miniaturization.

  A camera module according to the present invention includes an image sensor chip that converts incident light into a video signal, and a lens substrate that holds the image sensor chip and includes a lens unit that focuses the incident light on the image sensor chip. In the camera module, the lens substrate includes a holding portion that holds the image sensor chip, a protruding portion that protrudes from the holding portion, and a wiring layer that is formed across the holding portion and the protruding portion. The wiring layer formed on the holding portion and the electrode of the image sensor chip are electrically connected, and the wiring layer formed on the protruding portion and the electrode of the external substrate are electrically connected. is there. As a result, it is possible to provide a camera module in which the number of production steps and cost are reduced and the size is reduced.

  Here, it is preferable that the protrusion has a height at which the image sensor chip held by the holding unit is positioned between the lens substrate and the external substrate.

  Here, the protrusion may be formed in the vicinity of the end of the lens substrate, and the image sensor chip may be accommodated in a recess formed inside by the protrusion. Thereby, the optical system of the camera module can be arranged at an optimal position.

  Moreover, it is preferable that the wiring layer and the electrode of the image sensor chip and / or the wiring layer and the electrode of the external substrate are connected via a heat-melting bump. Thereby, since electrical and / or physical connection can be processed by heat treatment, automation of the manufacturing process can be facilitated. Further, the members to be connected can be fixed to each other.

  Furthermore, it is preferable that the wiring layer is formed over the side surface of the protruding portion of the lens substrate, and the side surface on which the wiring layer is formed is inclined with respect to the normal line of the main surface of the lens substrate. . Thereby, when forming a wiring layer, methods, such as sputtering, vapor deposition, and laser printing, can be used.

  An intermediate wiring board having an electrode connected to the wiring layer formed on the protruding portion on a surface facing the lens substrate and an electrode connected to an electrode of a mother board on the other surface may be further provided. Thereby, the position of the output terminal from the camera module can be freely arranged.

  Further, it is preferable that a light shielding portion is formed on a portion other than the lens portion on the lens substrate. Thereby, optical noise to the image sensor chip can be reduced.

  Furthermore, it is preferable that the surface opposite to the surface on which the light receiving portion of the image sensor chip is provided is light-shielded. Thereby, optical noise to the image sensor chip can be reduced.

  Furthermore, it is preferable that the protrusion and the image sensor chip are bonded with an insulating material. Thereby, the image sensor chip can be reliably fixed.

  Note that a transparent insulating material may be filled between the image sensor chip and the lens substrate. Thereby, adhesion of dust to the image sensor chip can be suppressed.

  In addition, the recess may be filled with an insulating material. Thereby, fixation of an image sensor chip | tip and adhesion of dust to a light-receiving part can be reduced.

  On the other hand, a portable electronic device according to the present invention is a portable electronic device including a camera module and a motherboard on which the camera module is mounted, and the camera module converts an incident light into a video signal. And a lens substrate having a lens unit that holds the image sensor chip and collects incident light on the image sensor chip, the lens substrate holding the image sensor chip, and the holding unit And a wiring layer formed across the holding portion and the protruding portion, and electrically connecting the wiring layer formed on the holding portion and the electrode of the image sensor chip. And the wiring layer formed on the protruding portion and the electrode of the mother board are electrically connected. According to such a configuration, downsizing of the portable electronic device can be achieved by downsizing the camera module, and the number of production steps can be reduced, thereby reducing cost. Here, it is preferable that the wiring layer and the electrode of the image sensor chip and / or the wiring layer and the electrode of the mother board are connected via a heat-meltable bump.

  According to the present invention, it is possible to provide a camera module capable of reducing the number of production steps and reducing the cost while achieving miniaturization.

Embodiment 1 of the Invention
FIG. 1 is a cross-sectional view showing the structure of a camera module 100 according to the first embodiment and a mother board 200 on which the camera module 100 is mounted. The camera module 100 according to this embodiment includes a lens substrate 101, an image sensor chip 102, a conductive wiring layer 103, a light shielding portion 104, an image sensor bump 105, and a motherboard bump 106.

  FIG. 2 is a sectional view showing the lens substrate 101 and its peripheral members. The lens substrate 101 is a transparent substrate having transparency, and is made of a light transmissive material such as glass, plastic, or ceramic. More preferably, a material with low thermal conductivity is used for the lens substrate 101. The lens substrate 101 includes a lens mold 101a, a pedestal portion 101b, a protruding portion 101c, an image sensor chip holding portion 101d, a motherboard fixing portion 101e, and a tapered portion 101f. A recess 101g is formed on the lower surface of the lens substrate 101 between the protrusions 101c.

  The lens mold 101a is a lens-shaped mold formed on the lens substrate 101, and functions as a lens portion with the shape. That is, the lens mold 101 refracts light incident from the outside according to the lens shape and focuses the light on the light receiving portion 102 a of the image sensor chip 102. The lens mold 101a is provided at a substantially central portion of the lens substrate 101 in a top view.

  A lens mold 101a shown in FIG. 1 is configured by forming a convex curved surface on the upper surface (external light incident surface) and forming a concave curved surface on the lower surface (surface on the image sensor chip 102 side). However, as shown in FIG. 7, convex curved surfaces may be formed on both the upper surface and the lower surface. Moreover, it is preferable that IRCF is coat | covered on the surface of the upper surface and / or lower surface of the lens mold 101a.

  The pedestal portion 101b is a portion provided so as to surround the periphery of the lens mold 101a.

  The protruding portion 101c is formed by protruding toward the image sensor chip 102 or the mother board 200 in the pedestal portion 101b. The protruding portion 101 c has a height for positioning the image sensor chip 102 held by the image sensor chip holding portion 101 d between the lens substrate 101 and the mother board 200. In other words, the protrusion height of the protrusion 101c is set so that the image sensor chip 102 is accommodated in the recess 101g. The protruding height of the protruding portion 101c in this example is such a height that the image sensor chip 102 and the mother board 200 are separated from each other, but may be a height that the image sensor chip 102 and the mother board 200 are in contact with each other.

  The image sensor chip holding portion 101d is a portion that holds the image sensor chip 102 via the image sensor bump 105, and is provided in the vicinity of the outer periphery of the lens mold 101a. The image sensor chip holding unit 101 d is configured by a flat surface perpendicular to the lens optical axis of the lens substrate 101.

  The motherboard fixing portion 101e is an external substrate fixing portion that fixes the motherboard 200 and the lens substrate 101 via the motherboard bump 106, and is provided on the top of the protruding portion 101c. The motherboard fixing portion 101e is configured by a flat surface perpendicular to the lens optical axis of the lens substrate 101.

  The tapered portion 101 f is an inclined surface formed on the side surface of the protruding portion 101 c and is inclined with respect to the normal line of the main surface of the lens substrate 101. The tapered portion 101f is formed between the image sensor chip holding portion 101d and the motherboard fixing portion 101e. A concave portion 101g is formed on the lower surface of the lens substrate 101 by the lower surface of the lens mold 101a, the image sensor chip holding portion 101d, and the tapered portion 101f.

  A light shielding portion 104 is formed on the outer surface of the lens substrate 101 and the upper surface excluding the lens mold 101a. The light shielding portion 104 is additionally provided on the lens substrate 101 so that light does not enter from a portion other than the lens mold 101a. By providing the light shielding portion 104, it is possible to prevent optical influence and noise on the light receiving portion 102a due to irregular reflection of light. The light shielding portion 104 can be formed by various methods such as a method of forming a light shielding film on the surface of the lens substrate 101, a method of coating a resin material on the lens substrate 101, and the like except for the lens mold 101a on the lens substrate 101. As long as this portion can be shielded from light, its formation method is not particularly limited.

  As shown in FIG. 3, the image sensor chip 102 includes a light receiving unit 102a and a plurality of electrode pads 102b, converts a light beam incident on the light receiving unit 102a into a video signal, and outputs the image signal from the electrode pad 102b. The image sensor chip 102 is subjected to a light shielding process except for the light receiving portion 102a. A CCD (charge coupled device), a CMOS (complementary metal oxide semiconductor), or the like is used for the image sensor chip 102, but any photoelectric conversion device that converts incident light into a video signal may be used.

  In addition, a microlens array is preferably provided on the surface of the light receiving unit 102a. Furthermore, the image sensor chip 102 preferably performs image processing on the optical information received by the light receiving unit 102a, and has image adjustment functions such as gamma correction, edge correction, white balance, and exposure adjustment. In FIG. 3, the light receiving unit 102 a is disposed in the center of the image sensor chip 102 and the electrode pad 102 b is disposed in the vicinity of the outer periphery of the image sensor chip 102.

  Returning to the description of each component shown in FIG. The mother board 200 is an example of an external board. In the present embodiment, the mother board 200 is a circuit board of a portable electronic device on which the camera module 100 is mounted.

  The conductive wiring layer 103 is continuously formed over each of the image sensor chip holding portion 101d, the tapered portion 101f, and the motherboard fixing portion 101e. The conductive wiring layer 103 a formed on the image sensor chip holding portion 101 d is electrically connected to the electrode of the image sensor chip 102 through the image sensor bump 105. Further, the conductive wiring layer 103b formed on the motherboard fixing portion 101e is electrically connected to the electrodes of the motherboard 200 through the motherboard bumps 106.

  The conductive wiring layer 103 mainly plays a role of transmitting a video signal converted from optical information by the image sensor chip 102 to the motherboard 200. Further, the conductive wiring layer 103 may have a light shielding effect. When a transparent electrode is used for the conductive wiring layer 103, the conductive wiring layer 103 does not need to avoid the lens mold 101a. The conductive wiring layer 103 is formed on the lens substrate 101 by a method such as sputtering, vapor deposition, etching, or laser printing.

  If the inner wall of the recess 101g is made substantially vertical without providing the taper portion 101f, it becomes difficult to form the conductive wiring layer 103 using a method such as sputtering or vapor deposition. By providing the tapered portion 101f, the conductive wiring layer 103 having a uniform film thickness can be easily formed by a method such as sputtering or vapor deposition. Accordingly, the angle of the tapered portion 101f is preferably 45 ° or less with respect to the lens main surface. Moreover, it is preferable that the corner | angular part P of the taper part 101f shown in FIG. Thereby, disconnection of the conductive wiring layer 103 at the corner portion P can be suppressed.

  The angle of the tapered portion 101 f is preferably gentle for forming the conductive wiring layer 103. However, since the depth of the concave portion 101g needs to be at least about the same as the thickness of the image sensor chip 102 and the image sensor bump 105, the lens substrate 101 spreads in the planar direction as the taper portion 101f becomes gentler. Accordingly, the angle of the tapered portion 101 f is appropriately adjusted depending on the balance between the ease of forming the conductive wiring layer 103 and the dimensions of the lens substrate 101.

  The image sensor chip 102 is accommodated in the recess 101g. The image sensor chip 102 is connected to the conductive wiring layer 103a at the electrode pad 102b. As shown in the figure, the conductive wiring layer 103 a and the electrode pad 102 b are arranged to face each other and are electrically connected by the image sensor bump 105. At this time, the image sensor chip 102 is held on the lens substrate 101 by the image sensor bump 105. For example, gold, nickel, solder, or the like can be used for the image sensor bump 105. In FIG. 1, one electrode pad 102 b and the conductive wiring layer 103 are connected by one image sensor bump 105, but the present invention is not limited to this, and a plurality of image sensor bumps 105 may be connected. The electrode pads 102b of the image sensor chip 102 having a rectangular surface are provided on the four sides thereof, and are preferably connected to the conductive wiring layer 103a via the image sensor bumps 105 on each side, thereby being connected in a balanced manner. .

  If a material having heat melting property such as solder is used for the image sensor bump 105, the conductive wiring layer 103 and the electrode pad 102b can be electrically connected by heat treatment such as reflow or laser processing. Thereby, it becomes easy to automate the electrical connection process between the electrode pad 102b and the conductive wiring layer 103, and productivity can be improved. If the image sensor bump 105 is a metal, the conductive wiring layer 103 and the electrode pad 102b can be electrically connected by such heat treatment.

  In addition, since the thickness of the image sensor bump 105 can be finely adjusted to some extent, the distance between the lens mold 101a and the light receiving portion 102a can be adjusted according to the shape and size of the image sensor bump 105. Accordingly, by adjusting the distance between the image sensor chip 102 and the lens mold 101a in advance, it is not necessary to perform focus adjustment after mounting the image sensor chip 102. Further, a part of the image sensor chip holding portion 101d protrudes downward, and the tip thereof is in direct contact with a part of the image sensor chip 102, so that the lens mold 101a due to the shape change of the image sensor bump 105 can be obtained. A change in the distance of the image sensor chip 102 can be prevented.

  Further, an insulating material such as a transparent resin material can be filled between the lens substrate 101 and the image sensor chip 102 to enhance the adhesion between the lens substrate 101 and the image sensor chip 102. The resin material used at this time is preferably a transparent material having a lower refractive index than at least the lens material. Thus, by filling the resin material between the lens mold 101a and the light receiving portion 102a, the adhesion between the lens substrate 101 and the image sensor chip 102 is strengthened, and at the same time, the adhesion of dust to the light receiving portion 102a is prevented. You can also. In addition, it is possible to improve the fixing strength of the image sensor chip 102 by filling an insulating material made of, for example, a resin material only between the end portion of the image sensor chip 102 and the conductive wiring layer 103.

  Note that the image sensor bump 105 does not need to exist clearly as a bump, and the conductive wiring layer 103a and the electrode pad 102b may be electrically connected. Therefore, the conductive wiring layer 103a and the electrode pad 102b can be directly connected. At that time, electrical connection can be made by the material used for the image sensor bump 105 described above.

  An electrode (not shown) of the mother board 200 and the conductive wiring layer 103 b are electrically connected by a mother board bump 106. Further, the motherboard 200 and the lens substrate 101 are fixed by the motherboard bump 106. As the motherboard bump 106, the same one as the image sensor bump 105 can be used. Therefore, the mounting process of the camera module 100 on the mother board 200 can be easily automated, similar to the effect provided by the image sensor bump 105 described above.

  If heat at the time of heat-treating the motherboard bump 106 is transmitted to the image sensor bump 105 and the image sensor chip 102, the image sensor bump 105 may be melted or the image sensor chip 102 may be broken. In particular, when the microlens array provided in the light receiving unit 102a is made of a thermoplastic material, there is a possibility that the optical characteristics are impaired. By using a material having low thermal conductivity for the lens substrate 101, it is possible to suppress the influence of heat generated when the motherboard bump 106 is heat-treated on the image sensor bump 105 and the image sensor chip 102. It is desirable that (the melting point T105 of the image sensor bump 105)> (the melting point T106 of the motherboard bump 106). In particular, T105-T106> 20 ° C. is desirable. This is to reliably prevent the image sensor bump 105 from being melted during the heat treatment of the motherboard bump 106. Further, by providing a heat radiating material such as a heat sink on the lens substrate 101, particularly the pedestal 101b, the influence of heat can be reduced.

  As shown in FIG. 1, in this embodiment, an image sensor chip 102 and a mother board 200 are disposed on the lower surface of the lens substrate 101. The light receiving portion 102 a on the image sensor chip 102 needs to be aligned with the lens mold 101 a on the lens substrate 101. On the other hand, in order to mount the image sensor chip 102 and the mother board 200 on the same surface while avoiding each other, an opening corresponding to the outer size of the image sensor chip 102 must be provided in the mother board 200, which is not general purpose. In this embodiment, the lens substrate 101 is provided with a recess 101g, and the image sensor chip 102 is disposed in the recess 101g as shown in FIG. In this embodiment, the recess 101g is formed, but it is not necessary to be a recess. For example, a plurality of pillars may protrude from the lower surface of the lens substrate 101, and the conductive wiring layer 103 may be provided on the pillars.

  Conventionally, when the camera module 100 is mounted on the mother board 200, it has been difficult to automate the mounting process because an FPC and a socket are used as shown in FIG. By using the camera module 100 according to the present embodiment, it becomes easy to automate the mounting process, and connection components such as an FPC and a socket are not necessary, and cost can be reduced.

  Further, in the connection using the conventional FPC and socket, there is a possibility that the position of the camera module 100 moves with respect to the motherboard 200 due to the material of the FPC. Since 100 is fixed to the mother board 200 by the mother board bump 106, the occurrence of such a problem can be reduced.

  Furthermore, since the interposer, the FPC, and the socket as shown in FIG. 6 are not necessary, the thickness in the state where the camera module 100 is mounted on the mother board 200 can be reduced, and the camera module 100 according to this embodiment is mounted. The portable electronic device to be manufactured can be downsized. Note that an insulating material such as a resin material can be filled between the image sensor chip 102 and the lens substrate 101 and the mother board 200 to enhance the adhesion.

  In the camera module 100 according to the present embodiment, the lens itself has a self-supporting structure with respect to the conventional camera module shown in FIG. 6, and the image sensor chip 102 can be positioned by the lens itself. All of these effects contribute to size reduction and cost reduction.

  Next, operations of the camera module 100 and the motherboard 200 shown in FIG. 1 will be described. The light beam incident on the camera module 100 is condensed on the light receiving unit 102a by the lens mold 101a. The optical information received by the light receiving unit 102a is converted into a video signal by the image sensor chip 102. The video signal converted by the image sensor chip 102 is output from the electrode pad 102b and input to the motherboard 200 via the image sensor bump 105, the conductive wiring layer 103, and the motherboard bump 106.

  As described above, according to the first embodiment of the present invention, it is possible to provide a camera module in which the number of production steps, cost, and size are reduced.

Embodiment 2 of the Invention
The camera module according to the present embodiment is a camera module according to the first embodiment that is further easily connected to the mother board 200. In addition, about the structure which attaches | subjects the code | symbol similar to Embodiment 1, the same or equivalent part as Embodiment 1 is shown, and description is abbreviate | omitted. FIG. 4 is a cross-sectional view showing the camera module 300 and the mother board 200 on which the camera module 300 is mounted according to the present embodiment. As shown in FIG. 4, the camera module 300 according to the present embodiment includes an interposer 108 and an output bump 109 in addition to the camera module 100 according to the first embodiment. Further, an interposer bump 107 is provided instead of the motherboard bump 106.

  As shown in FIG. 1, in the first embodiment, since the lens mold 101a is formed at the center of the lens substrate 101, it is necessary to align the image sensor chip 102 at the center of the lens substrate 101. The position where the motherboard bump 106 is formed is limited to the vicinity of the end of the lens substrate 101.

  However, depending on the circuit configuration of the mother board 200 on which the camera module 100 is mounted, it may be difficult to provide an electrical connection portion at the position of these restricted mother board bumps. Further, in the camera module 100 shown in FIG. 1, as a result of the space for providing the motherboard bump 106 being limited, the space for providing the motherboard bump 106 and the motherboard bump 106 itself may be very small. It is not preferable to electrically connect and to each other because it becomes technically difficult.

  In order to solve such a problem, the camera module 300 according to the present embodiment connects the conductive wiring layer 103 to the interposer 108. The conductive wiring layer 103 and the interposer 108 are connected by the interposer bump 107, but it is substantially the same as the connection between the conductive wiring layer 103 and the mother board 200 in the first embodiment, and the interposer bump 107 and the mother board are connected. There is no substantial difference from the bump 106.

  The interposer 108 is a rewiring board that electrically mediates between the conductive wiring layer 103 and the mother board 200. The interposer 108 is connected to the conductive wiring layer 103 by the interposer bump 107 on one side and the output bump 109 on the other side. Are connected to the electrodes of the mother board 200. Since there are few space restrictions on the surface of the interposer 108 on which the output bumps 109 are provided, the output bumps 109 can be freely arranged according to the circuit configuration of the motherboard 200.

  Similarly, the size of the output bump 109 can be made larger than that of the interposer bump 107 because there is no limitation in connection with the conductive wiring layer 103, and the electrical connection between the mother board 200 and the camera module 300 is possible. Can be made easier. Further, in the case of distribution with only the camera module 300 not mounted on the mother board 200, versatility can be further improved by providing the interposer 108.

  As described above, according to the second embodiment of the present invention, it is possible to provide a camera module in which the connection position and the size of the connection portion are not limited in electrical connection with the motherboard.

  In the first and second embodiments, the lens substrate 101 has only one layer. However, the present invention is not limited to this. As shown in FIG. 5, a lens substrate 201 may be used in addition to the lens substrate 101 to form a two-layer structure. In this case, as shown in FIG. 5, the lens substrate 201 has a lens mold 201a. The shapes of the lens mold 101a and the lens mold 201a are not particularly limited, and convex and concave lenses can be appropriately selected and used. In FIG. 5, the lens mold 201a has a role of focus adjustment. A relief-shaped lens as shown in FIG. 7 can also be used.

  The lens substrate 101 and the lens substrate 201 are bonded and fixed together. Adhesion is performed between the pedestal 101 b of the lens substrate 101 and the portion corresponding to the pedestal of the lens substrate 201. As in the first and second embodiments, the light shielding portion 104 shields light other than the lens mold 201a. At this time, the light shielding portion 104 can have a function of bonding the lens substrate 101 and the lens substrate 201 together.

It is sectional drawing which shows the camera module and motherboard concerning Embodiment 1 of this invention. It is sectional drawing which shows the lens board | substrate concerning embodiment of this invention, and its periphery. It is a top view which shows the image sensor chip concerning embodiment of this invention. It is sectional drawing which shows the camera module and motherboard concerning Embodiment 2 of this invention. It is sectional drawing which shows the camera module and motherboard concerning other embodiment of this invention. It is sectional drawing which shows the camera module and motherboard concerning a prior art. It is sectional drawing which shows the camera module concerning a prior art.

Explanation of symbols

1, 1a, 1b lens, 2 lens barrel, 3 lens barrel, 4 IRCF,
5 image sensor chip, 5a light receiving portion, 5b electrode portion, 6 wires,
7 Interposer, 8 FPC, 9 socket, 10 motherboard,
11 Lens substrate, 11a Lens part, 12 Wiring part, 13 Bump,
100 camera module, 101 lens substrate, 101a lens mold,
101b pedestal, 101c taper, 101d recess,
102 image sensor chip, 102a light receiving portion, 102b electrode pad 103 conductive wiring layer, 104 light shielding portion, 105 image sensor bump,
106 Motherboard bump, 107 Interposer bump,
108 interposer, 109 output bump, 200 motherboard,
201 lens substrate, 201a lens mold, 300 camera module, P corner

Claims (13)

An image sensor chip for converting incident light into a video signal;
A camera module including a lens substrate that holds the image sensor chip and has a lens unit that collects incident light on the image sensor chip,
The lens substrate is
A holding unit for holding the image sensor chip;
A protruding portion protruding from the holding portion;
A wiring layer formed across the holding portion and the protruding portion;
Electrically connecting the wiring layer formed in the holding portion and the electrode of the image sensor chip;
A camera module for electrically connecting the wiring layer formed on the protrusion and an electrode of an external substrate.   The camera module according to claim 1, wherein the protruding portion has a height for positioning the image sensor chip held by the holding portion between the lens substrate and the external substrate.   3. The camera module according to claim 1, wherein the protruding portion is formed in the vicinity of an end portion of the lens substrate, and the image sensor chip is accommodated in a concave portion formed inside by the protruding portion.   2. The wiring layer and an electrode of the image sensor chip and / or the wiring layer and an electrode of an external substrate are connected via a heat-meltable bump. The camera module according to any one of?   The wiring layer is formed over a side surface of the protruding portion, and a side surface on which the wiring layer is formed is inclined with respect to a normal line of a main surface of the lens substrate. 4. The camera module according to any one of 4 above.   An intermediate wiring board having an electrode connected to the wiring layer formed on the protruding portion on a surface facing the lens substrate and an electrode connected to an electrode of a mother board on the other surface is further provided. The camera module according to claim 1.   The camera module according to claim 1, wherein a light shielding portion is formed on a portion other than the lens portion on the lens substrate.   The camera module according to claim 1, wherein a surface opposite to a surface on which the light receiving portion of the image sensor chip is provided is subjected to a light shielding process.   The camera module according to claim 1, wherein the protrusion and the image sensor chip are bonded with an insulating material.   The camera module according to claim 1, wherein an insulating material having transparency is filled between the image sensor chip and the lens substrate.   The camera module according to claim 4, wherein the recess is filled with an insulating material. A portable electronic device including a camera module and a motherboard on which the camera module is mounted,
The camera module includes an image sensor chip that converts incident light into a video signal, and a lens substrate that holds the image sensor chip and has a lens unit that focuses the incident light on the image sensor chip,
The lens substrate includes a holding part that holds the image sensor chip, a protruding part that protrudes from the holding part, and a wiring layer that is formed across the holding part and the protruding part.
Electrically connecting the wiring layer formed on the holding portion and the electrode of the image sensor chip;
The portable electronic device which has electrically connected the said wiring layer formed in the said protrusion part, and the electrode of a motherboard.   13. The wiring layer and the electrode of the image sensor chip and / or the wiring layer and an electrode of the mother board are connected via bumps having heat melting property. The portable electronic device as described.

Images